TWI856577B - Air pressure assisted laser welding device and semiconductor component welding method - Google Patents

Abstract

A pneumatically assisted laser welding device and a semiconductor component welding method, wherein the semiconductor component welding method is performed using a pneumatically assisted laser welding device controlled by a computer, wherein a circuit substrate is moved onto an adsorption carrier of the pneumatically assisted laser welding device, and the adsorbent moves the welding object, and the welding object is aligned and attached to the circuit substrate in combination with visual image judgment. Under a certain working stroke, pressurized gas is input into the chamber in the adsorber to exert the following pressure on the welding object. With the assistance of gas pressure, the height difference of multiple semiconductor components on the bottom surface of the welding object's carrier is overcome to ensure that each semiconductor component is attached to the circuit substrate. The laser source is used to perform laser welding of the semiconductor components of the welding object and the circuit substrate, and then the carrier of the welding object is removed to complete the welding operation.

Description

Air pressure assisted laser welding device and semiconductor component welding method

The present invention relates to a semiconductor component welding device and welding method, and in particular to a pneumatically assisted laser welding device and semiconductor component welding method suitable for welding semiconductor components to substrates or printed circuit boards.

At present, the welding operation of transferring multiple semiconductor components synchronously to a circuit substrate such as a substrate or a printed circuit board usually uses a carrier to attach multiple semiconductor components to form a welding object, and uses a laser welding device controlled by a computer to perform the operation of synchronously welding multiple semiconductor components of the welding object on the circuit substrate.

In the aforementioned semiconductor component welding operation, a circuit substrate is fixed by adsorption using the carrier on the carrier of the laser welding device, and the moving mechanism controlled by the computer drives the picker to absorb the welding object and move it to the top of the circuit substrate. In combination with the visual image judgment means, the welding object is aligned and attached to the circuit substrate, so that the component contacts of each semiconductor component of the welding object are aligned and attached to the circuit contacts corresponding to the position of the circuit substrate. Then, the laser source emits laser light, so that the component contacts of each semiconductor component of the welding object are aligned and welded to the circuit contacts corresponding to the position of the circuit substrate. Afterwards, the picker drives the carrier of the welding object to separate from each semiconductor component welded on the circuit substrate, and the welding operation of the semiconductor component is completed.

Although the aforementioned semiconductor component welding method and the laser welding device used therein can achieve the predetermined technical purpose, there is a slight height difference between the component contacts of the multiple semiconductor components attached to the bottom surface of the carrier in the welding object. Since the working stroke of the laser welding device to drive the welding object is fixed, it is difficult to correctly weld each semiconductor component on the circuit board.

The purpose of the present invention is to provide a pneumatically assisted laser welding device and a semiconductor component welding method to solve the problem that the current welding method and laser welding device for synchronously transferring and welding multiple semiconductor components on a circuit board is difficult to correctly weld each semiconductor component on the circuit board due to the height difference of the multiple semiconductor components under the bottom surface of the carrier of the welding object.

In order to achieve the above-mentioned purpose, the air pressure-assisted laser welding device proposed in the present invention includes: a carrier, which includes an adsorption carrier; an absorber, which can move relative to the adsorption carrier, the absorber has a chamber inside and a light-transmitting window plate located at the top of the chamber, the chamber extends to the bottom of the absorber to form an opening, the bottom of the absorber has a contact frame surrounding the opening, and is provided with an adsorption channel passing through the interior of the absorber and extending to the bottom surface of the contact frame, the absorber can be closed by a welding object adsorbed by the contact frame The opening at the bottom of the chamber forms a closed space, the area of the light-transmitting window plate and the area of the opening are matched with an effective welding area of the welding object, and the pressurized gas is input into the chamber to apply the following pressure to the effective welding area of the welding object; a camera lens set is arranged above the carrier, and can be combined with a computer to make the absorber align with the absorption carrier through visual image judgment; and a laser source is arranged on the outside of the carrier, and the laser light emitted by the laser source can be projected downward on the welding object through the light-transmitting window plate and the chamber to transmit heat energy.

In order to achieve the above-mentioned purpose, the semiconductor component welding method proposed by the present invention is performed by using the above-mentioned air pressure-assisted laser welding device controlled by a computer, and can synchronously align and weld a plurality of semiconductor components attached to the bottom surface of a carrier of a welding object on a circuit substrate. The steps of the semiconductor component welding method include: the step of moving the circuit substrate to the air pressure-assisted laser welding device, which is to move the circuit substrate to the air pressure-assisted laser welding device by a conveying mechanism controlled by the computer. Positioning on the adsorption carrier of the laser welding device; the step of moving the welding object to align with the circuit substrate is to drive the adsorbent to absorb the welding object and move it above the circuit substrate by a moving mechanism controlled by the computer, and align the circuit substrate by visual image judgment through multiple cameras combined with the computer, so that the component contacts of each semiconductor component of the welding object are aligned with the corresponding circuit contacts in the circuit substrate below, and the chamber is closed by the carrier of the welded object. The bottom opening of the chamber forms a closed space; the step of attaching the welding object to the circuit substrate, using the suction device driven by the moving mechanism to drive each of the semiconductor components of the welding object to attach to the circuit substrate, inputting pressurized gas into the closed chamber of the suction device, and applying the following pressure to the distribution range of the semiconductor components of the welding object by the pressurized gas, so that the component contacts of each semiconductor component of the welding object are aligned and attached to the circuit contacts corresponding to the position of the circuit substrate; the step of laser welding, by The laser source controlled by the computer emits laser light, and the laser light energy is projected downward through the transparent window plate and chamber of the absorber onto the distribution range of the semiconductor components of the welding object to transmit heat energy, so that the component contacts of each semiconductor component of the welding object are respectively aligned and welded on the circuit contacts corresponding to the position of the circuit substrate; and the step of removing the carrier is to use the absorber driven by the moving mechanism to drive the carrier of the welding object to move, so that each of the semiconductor components welded on the circuit substrate is separated from the carrier.

The invention of the aforementioned air pressure-assisted laser welding device and the semiconductor component welding method using the air pressure-assisted laser device utilizes a chamber with an opening facing downwards in the absorber, and the top of the chamber has a light-transmitting window plate. After the absorber absorbs the welding object, a carrier board with multiple semiconductor components is attached to the bottom of the welding object to close the opening of the chamber of the absorber, and then pressurized gas is input into the chamber to apply the following pressure to the welding object, so that under the condition that the working stroke of the absorber driving the welding object to descend is certain, the height difference of multiple semiconductor components on the bottom of the carrier board of the welding object is overcome with the assistance of air pressure, ensuring that each semiconductor component is attached to the circuit substrate, so as to facilitate the laser welding operation of the semiconductor component of the welding object and the circuit substrate by the laser source.

10: Carrier

11: Adsorption carrier

12: Driving mechanism

20: Adsorber

21: Chamber

211: Open mouth

212: Gas transmission channel

22: Translucent window panel

23: Contact frame

24: Adsorption channel

30:Photographic lens set

31: Camera lens

40: Laser source

50: Circuit board

51: Circuit contact

60: Welding objects

61: Carrier board

61A: Carrier board

62: Semiconductor components

63: Component contact

Figure 1 is a schematic plan view of a preferred embodiment of the air pressure-assisted laser welding device of the present invention.

Figure 2 is a schematic diagram of the execution steps of the semiconductor component welding method of the present invention (I).

Figure 3 is a schematic diagram of the execution steps of the semiconductor component welding method of the present invention (II).

Figure 4 is a schematic diagram of the execution steps of the semiconductor component welding method of the present invention (III).

Figure 5 is a schematic diagram of the execution steps of the semiconductor component welding method of the present invention (IV).

Figure 6 is a schematic diagram of the execution steps of the semiconductor component welding method of the present invention (V).

FIG7 is a reference diagram of the semiconductor component welding method of the present invention used to perform welding of welding objects with a soft carrier.

The present invention includes a gas pressure-assisted laser welding device and a semiconductor component welding method. The following is a detailed description of the specific technical contents of the gas pressure-assisted laser welding device and the semiconductor component welding method of the present invention with reference to the drawings.

As shown in FIG. 1 , an embodiment of the air pressure-assisted laser welding device of the present invention is disclosed. The air pressure-assisted laser welding device can be controlled by a computer to perform laser welding operations and includes a carrier 10, a suction device 20, a camera lens set 30 and a laser source 40.

As shown in FIG1 , the carrier 10 includes an adsorption carrier 11, which is a vacuum adsorption carrier that can be externally connected to an exhaust unit, as shown in FIG2 , for adsorbing and fixing a circuit substrate 50. In this embodiment, the carrier 10 includes a driving mechanism 12, which is connected to the adsorption carrier 11 and can drive the adsorption carrier 11 to move in three-dimensional space. The driving mechanism 12 has an X-axis and a Y-axis displacement for driving the adsorption carrier 11 in a horizontal reference plane, and can rotate the adsorption carrier 11. The driving mechanism 12 can use an existing driving component, and its specific structure will not be repeated.

As shown in FIG. 1 , the absorbent 20 is movable relative to the carrier 10 and can take and place a welding object 60. The absorbent 20 has a chamber 21 and a light-transmitting window plate 22 located at the top of the chamber 21. The chamber 21 extends to the bottom of the absorbent 20 to form an opening 211. The absorbent 20 is provided with a gas supply channel 212 connected to the chamber 21. The area of the light-transmitting window plate 22 and the area of the opening 211 are both matched with the effective welding area of the welding object 60. The effective welding area is the distribution range of multiple semiconductor components of a welding object. The range outside the effective welding area is the adsorption area. The bottom of the absorbent 20 has a contact area surrounding the opening 211. The contact frame 23 is provided with an adsorption channel 24 that passes through the interior of the adsorbent 20 and extends to the bottom surface of the contact frame 23. The contact frame 23 can abut against the adsorption area of the welding object, and can be evacuated to the adsorption channel 24, as shown in FIG2, so that the adsorbent 20 can vacuum adsorb the welding object 60, and the welding object 60 is closed by the opening 211 at the bottom of the chamber 21, so that the chamber 21 forms a closed space. The adsorbent 20 can be connected to an external pressurized gas source to input pressurized gas into the chamber 21 through the gas supply channel 212, and the pressurized gas is applied to the effective welding area (i.e., the distribution range of multiple semiconductor components) of the welding object adsorbed by the adsorbent 20.

As shown in FIG1 , the photographic lens set 30 is disposed above the carrier 10 and can be combined with the computer to align the absorber 20 with the absorbent carrier 11 by visual image judgment. The photographic lens set 30 includes a plurality of photographic lenses 31, which are distributed above the absorbent carrier 11.

As shown in FIG. 1 , the laser source 40 is disposed on the outer side of the carrier 10 and can be driven to move, and the laser light emitted by the laser source 40 can be projected downward through the transparent window plate 22 and the chamber 21 of the absorber 20 located below to the distribution range of the semiconductor components of the welding object to transfer heat energy.

As shown in FIG. 2 and FIG. 7 , the semiconductor component welding method proposed in the present invention is used to align and weld a plurality of semiconductor components 62 in a welding object 60 on a circuit substrate 50. The welding object 60 includes a carrier 61 and a plurality of semiconductor components 62 attached to the bottom surface of the carrier 61. As shown in FIG. 2 and FIG. 7 , the carrier 61, 61A can be a hard board or a soft board. The semiconductor components 62 can be separated from the carrier 61. 1. 61A, each semiconductor element 62 has a plurality of element contacts 63 on its bottom surface. The circuit substrate 50 is a substrate or printed circuit board with electronic circuits. The circuit substrate 50 has a plurality of element welding areas on its top surface. The plurality of element welding areas match the spatial configuration of the plurality of semiconductor elements 62 disposed at the bottom of the carrier 61 in the welding object 60. Each of the element welding areas has a plurality of circuit contacts 51.

As shown in FIG. 2 to FIG. 6, the semiconductor component welding method is performed using the air pressure-assisted laser welding device controlled by a computer, and includes the following steps: the step of moving the circuit substrate 50 to the air pressure-assisted laser welding device is to move the circuit substrate 50 to the suction carrier 11 of the air pressure-assisted laser welding device for positioning by a conveying mechanism controlled by the computer; the step of moving the welding object 60 to align with the circuit substrate 50 is to drive the suction device 20 to absorb the welding object 60 and move it by a moving mechanism controlled by the computer; To the top of the circuit substrate 50, and through multiple cameras 31 combined with computers to judge the alignment of the circuit substrate 50 with visual images, the component contacts 63 of each of the semiconductor components 62 of the welding object 60 are aligned with the corresponding circuit contacts 51 in the circuit substrate 50 below, and the opening 211 at the bottom of the chamber 21 is closed by the carrier 61 of the welding object 60 to form a closed space in the chamber 21; The step of attaching the welding object 60 to the circuit substrate 50 is driven by the suction device 20 driven by the moving mechanism to drive the welding Each of the semiconductor components 62 of the object 60 is attached to the circuit substrate 50, and pressurized gas is input into the closed chamber 21 of the absorber 20. The pressurized gas applies the following pressure to the distribution range of the semiconductor components 62 of the welding object 60, so that the component contacts 63 of each semiconductor component 62 of the welding object 60 are aligned and attached to the circuit contacts 51 corresponding to the position of the circuit substrate 50; the laser welding step is to input pressurized gas pressure into the chamber 21 to pressurize the welding object 60, and then the laser source 40 controlled by the computer emits a laser. The laser light is projected downward through the transparent window plate 22 and the chamber 21 of the absorber 20 onto the distribution range of the semiconductor components 62 of the welding object 60 to transmit heat energy, so that the component contacts 63 of each semiconductor component 62 of the welding object 60 are respectively aligned and welded on the circuit contacts 51 corresponding to the position of the circuit substrate 50; and the step of removing the carrier 61 is to use the absorber 20 driven by the moving mechanism to drive the carrier 61 of the welding object 60 to move, so that the carrier 61 is separated from each semiconductor component 62 welded on the circuit substrate 50.

As can be seen from the above description, the air pressure-assisted laser welding device and the semiconductor element welding method using the air pressure-assisted laser welding device provided by the present invention are to use a suction device 20 of the air pressure-assisted laser welding device to set a chamber 21 with an opening 211 facing downward, and to set a light-transmitting window plate 22 on the top of the chamber 21 for the laser light to pass through. After the suction device 20 absorbs the welding object 60, the carrier plate 61 of the welding object 60 closes the opening 211 of the chamber 21 of the suction device 20. , and then input pressurized gas into the chamber 21, so that under the condition that the suction device 20 drives the welding object 60 to descend, the auxiliary gas pressure is used to apply the following pressure to the welding object 60, so as to overcome the height difference of the multiple semiconductor components 62 on the bottom surface of the carrier 61 of the welding object 60, and ensure that each semiconductor component 62 is attached to the circuit substrate 50, so as to facilitate the laser welding operation of the semiconductor component 62 of the welding object 60 and the circuit substrate 50 by the laser source 40.

10: Carrier

11: Adsorption carrier

12: Driving mechanism

20: Adsorber

21: Chamber

22: Translucent window panel

23: Contact frame

24: Adsorption channel

30:Photographic lens set

40: Laser source

50: Circuit board

51: Circuit contact

60: Welding objects

61: Carrier board

62: Semiconductor components

63: Component contact

Claims (7)

A pressure-assisted laser welding device comprises: a carrier, which comprises an adsorption carrier; an absorber, which can move relative to the adsorption carrier, the absorber has a chamber inside and a light-transmitting window plate located at the top of the chamber, the chamber extends to the bottom of the absorber to form an opening, the bottom of the absorber has a contact frame surrounding the opening, and a suction channel is provided through the inside of the absorber and extends to the bottom surface of the contact frame, the absorber can close the opening at the bottom of the chamber by a welding object adsorbed by the contact frame , so that the chamber forms a closed space, the area of the light-transmitting window plate and the area of the opening are matched with an effective welding area of the welding object, and the pressurized gas is input into the chamber to apply the following pressure to the effective welding area of the welding object; a camera lens set is arranged above the carrier, and can be combined with a computer to make the absorber align with the absorption carrier through visual image judgment; and a laser source is arranged on the outside of the carrier, and the laser light emitted by the laser source can be projected downward through the light-transmitting window plate and the chamber to transmit heat energy to the welding object. The pneumatically assisted laser welding device as described in claim 1, wherein the carrier includes a driving mechanism, the driving mechanism is connected to the adsorption carrier and can drive the adsorption carrier to move in three-dimensional space, the driving mechanism has an X-axis and a Y-axis displacement to drive the adsorption carrier in a horizontal reference plane, and can rotate the adsorption carrier. The air pressure-assisted laser welding device as described in claim 1 or 2, wherein the effective welding area is the distribution range of multiple semiconductor components of the welding object. A pressure-assisted laser welding device as described in claim 1 or 2, wherein the camera lens set includes a plurality of camera lenses, and the plurality of lenses are distributed above the absorber. As described in claim 3, the air pressure-assisted laser welding device, wherein the camera lens set includes a plurality of camera lenses, and the plurality of lenses are distributed above the absorber. A semiconductor component welding method is performed using a pneumatically assisted laser welding device as described in any one of claims 1 to 5 and controlled by a computer, and can synchronously align and weld a plurality of semiconductor components attached to the bottom surface of a carrier of a welding object on a circuit substrate. The steps of the semiconductor component welding method include: a step of moving the circuit substrate to the pneumatically assisted laser welding device, wherein the circuit substrate is moved to the suction of the pneumatically assisted laser welding device by a conveying mechanism controlled by the computer; Positioning on the carrier; the step of moving the welding object to align with the circuit substrate is to drive the suction device to absorb the welding object and move it to the top of the circuit substrate by the moving mechanism controlled by the computer, and to align the circuit substrate by visual image judgment through a plurality of cameras combined with the computer, so that the component contacts of each semiconductor component of the welding object are aligned with the corresponding circuit contacts in the circuit substrate below, and the chamber is formed into a closed chamber by closing the opening of the bottom of the chamber with the carrier of the welding object being absorbed space; the step of attaching the welding object to the circuit substrate, using the suction device driven by the moving mechanism to drive each of the semiconductor components of the welding object to attach to the circuit substrate, inputting pressurized gas into the closed chamber of the suction device, and applying the following pressure to the distribution range of the semiconductor components of the welding object by the pressurized gas, so that the component contacts of each semiconductor component of the welding object are aligned and attached to the circuit contacts corresponding to the position of the circuit substrate; the step of laser welding is to input pressurized gas pressure into the chamber to pressurize the welding object In the state, a laser source controlled by a computer emits laser light, and the laser light energy is projected downward through the transparent window plate and chamber of the absorber onto the distribution range of the semiconductor components of the welding object to transmit heat energy, so that the component contacts of each semiconductor component of the welding object are respectively aligned and welded on the circuit contacts corresponding to the position of the circuit substrate; and the step of removing the carrier is to use the absorber driven by the moving mechanism to drive the carrier of the welding object to move, so that each of the semiconductor components welded on the circuit substrate is separated from the carrier. A semiconductor component welding method as described in claim 6, wherein the carrier of the welding object is a hard board or a soft board.

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