TWI853718B - Circuit board for shielding electromagnetic interference and method of manufacturing the same - Google Patents

Abstract

A circuit board for shielding electromagnetic interference and a method of manufacturing the same are provided. The circuit board includes a dielectric layer, a shielding structure, a first adhesive layer, a second adhesive layer, a first metal pattern layer and a second metal pattern layer. The shielding structure is disposed in an accommodation space of the dielectric layer. The shielding structure is made of modified silicone rubber, and adhesion strength of a surface of the shielding structure is in a range of 50 mN/m to 90 mN/m. The first adhesive layer, the second adhesive layer and the dielectric layer stack, and the dielectric layer is disposed between the first adhesive layer and the second adhesive layer. The shielding structure is attached to the first adhesive layer and the second adhesive. The first metal pattern layer is disposed over the first adhesive layer. The second metal pattern layer is disposed over the second adhesive layer. The first metal pattern layer includes an antenna. The antenna overlaps the shielding structure in a direction of a vertical projection of the dielectric layer.

Description

Circuit board with electromagnetic interference resistance and manufacturing method thereof

The present disclosure relates to a circuit board and a manufacturing method thereof, and in particular to an electromagnetic interference resistant circuit board and a manufacturing method thereof.

Generally, electronic products with communication functions are equipped with antennas, which are usually installed on circuit boards. However, when receiving or transmitting electromagnetic waves, antennas are likely to interfere with the operation of integrated circuits (chips) or electronic components on the circuit board. Currently, there is a technology for embedding anti-radiation materials into circuit boards, where the anti-radiation materials are made of non-metallic materials to achieve the effect of shielding electromagnetic waves from interfering with chips or electronic components on the circuit board. However, the current anti-radiation materials have poor adhesion to the film layer (such as the dielectric layer) of the circuit board, resulting in the problem of low yield of the above-mentioned existing circuit boards containing anti-radiation materials.

At least one embodiment of the present disclosure provides an electromagnetic interference resistant circuit board and a manufacturing method thereof, which can not interfere with the operation of internal chips and components during wireless communication and improve the finished product yield.

The anti-electromagnetic interference circuit board provided by at least one embodiment of the present disclosure includes a dielectric layer, a shielding structure, a first adhesive layer, a second adhesive layer, a first metal pattern layer and a second metal pattern layer. The dielectric layer includes a containing space. The shielding structure is arranged in the containing space, wherein the material of the shielding structure includes modified silicone rubber, and the adhesive strength of the shielding structure is in the range of 50 to 90 millinewtons/meter. The first adhesive layer, the second adhesive layer and the dielectric layer are stacked, and the dielectric layer is sandwiched between the first adhesive layer and the second adhesive layer, and the shielding structure is attached to the first adhesive layer and the second adhesive layer. The first metal pattern layer is arranged on the first adhesive layer. The second metal pattern layer is arranged on the second adhesive layer. The first metal pattern layer includes an antenna which overlaps with the shielding structure in a vertical projection direction of the dielectric layer.

In at least one embodiment of the present disclosure, the material of the shielding structure further includes modified carbon black and modified carbonyl iron.

In at least one embodiment of the present disclosure, the circuit board further includes at least one chip and at least one conductive structure. The at least one chip is mounted on the second metal pattern layer. The at least one conductive structure passes through the dielectric layer, the first adhesive layer, the second adhesive layer to the first metal pattern layer from the second metal pattern layer. The at least one chip is electrically coupled to the antenna via the at least one conductive structure.

In at least one embodiment of the present disclosure, the shielding structure includes two shielding blocks. The accommodating space includes two sub-spaces, and the two sub-spaces are spaced apart. The antenna includes a transmitting antenna unit and a receiving antenna unit. The two shielding blocks are respectively disposed in the two sub-spaces. The transmitting antenna unit and the receiving antenna unit overlap with the two shielding blocks in the vertical projection direction of the dielectric layer.

In at least one embodiment of the present disclosure, the distance from the transmitting antenna unit to the adjacent shielding block is equal to the distance from the receiving antenna unit to the adjacent shielding block.

The method for manufacturing an electromagnetic interference resistant circuit board provided by at least one embodiment of the present disclosure includes: providing a first substrate, the first substrate including a dielectric layer and a metal layer, wherein the dielectric layer and the metal layer are stacked, and the first substrate further includes a containing space, wherein the containing space penetrates the dielectric layer and the metal layer; providing a shielding structure, and performing plasma treatment on the shielding structure so that the adhesion strength of the shielding structure is in the range of 50 to 90 millinewtons/meter, wherein the material of the shielding structure includes silicone rubber; providing a first adhesive layer, wherein the shielding structure is disposed in the containing space, and the first adhesive layer and the metal layer are bonded to each other. and a shielding structure attached thereto; providing a second adhesive layer and a second substrate, the second adhesive layer being disposed on the dielectric layer, the second substrate comprising a first metal pattern layer, and the second substrate being disposed on the first adhesive layer; combining the first substrate, the first adhesive layer, the second adhesive layer, and the second substrate; providing a third substrate, the third substrate comprising a second metal pattern layer, and the third substrate being disposed on the second adhesive layer; and combining the third substrate with the first substrate and the second substrate, wherein the first metal pattern layer comprises an antenna, and the antenna overlaps with the shielding structure in a vertical projection direction of the dielectric layer.

In at least one embodiment of the present disclosure, the step of providing a first adhesive layer includes: providing the first adhesive layer, coating the first adhesive layer with adhesive and adhering it to the metal layer; and placing a plasma-treated shielding structure in the accommodating space and on the first adhesive layer, wherein the shielding structure and the dielectric layer are flat surfaces, and the shielding structure is bonded to the first adhesive layer via adhesive.

In at least one embodiment of the present disclosure, the step of providing the second adhesive layer and the second substrate further includes providing at least one flat adhesive sheet, wherein the at least one flat adhesive sheet is disposed between the first adhesive layer and the second substrate. The step of bonding the first substrate, the first adhesive layer, the second adhesive layer, and the second substrate includes: applying adhesive to the second adhesive layer and then attaching it to the dielectric layer and the shielding structure; applying at least one adhesive on the at least one flat adhesive sheet; and pressing the first substrate, the first adhesive layer, the second adhesive layer, the at least one flat adhesive sheet, and the second substrate.

In at least one embodiment of the present disclosure, the shielding structure includes two shielding blocks. The accommodating space includes two sub-spaces, and the sub-spaces are spaced. The antenna includes a transmitting antenna unit and a receiving antenna unit. The two shielding blocks are respectively arranged in the two sub-spaces. The transmitting antenna unit and the receiving antenna unit overlap with the two shielding blocks in the vertical projection direction of the dielectric layer. The distance from the transmitting antenna unit to the adjacent shielding block is equal to the distance from the receiving antenna unit to the adjacent shielding block.

In at least one embodiment of the present disclosure, the step of combining the third substrate with the first substrate and the second substrate includes: pressing the third substrate with the first substrate and the second substrate; patterning the first metal pattern layer to form an antenna; forming a conductive structure between the second substrate and the third substrate so that the antenna is electrically coupled to the second metal pattern layer via the conductive structure; and installing a chip on the second metal pattern layer so that the chip is electrically coupled to the antenna via the conductive structure.

Based on the above, in the circuit board disclosed in the above embodiments, a shielding structure with enhanced surface adhesion is provided to increase the adhesion between the shielding structure and the first adhesive layer and the second adhesive layer, thereby improving the bonding strength with the first adhesive layer and the second adhesive layer and reducing the risk of board explosion.

In the following text, in order to clearly present the technical features of the present invention, the dimensions (e.g., length, width, thickness, and depth) of the elements (e.g., layers, films, substrates, and regions, etc.) in the drawings will be enlarged in unequal proportions, and the number of some elements will be reduced. Therefore, the description and explanation of the embodiments below are not limited to the number of elements in the drawings and the dimensions and shapes presented by the elements, but should cover the dimensions, shapes, and deviations therefrom caused by actual processes and/or tolerances. For example, the flat surface shown in the drawings may have rough and/or nonlinear features, and the sharp corners shown in the drawings may be rounded. Therefore, the elements presented in the drawings of the present invention are mainly for illustration, and are not intended to accurately depict the actual shapes of the elements, nor are they intended to limit the scope of the patent application of the present invention.

Secondly, the words "approximately", "approximately" or "substantially" used in the present case not only cover the numerical values and numerical ranges clearly recorded, but also cover the permissible deviation range that can be understood by a person of ordinary skill in the art to which the invention belongs, wherein the deviation range can be determined by the error generated during measurement, and the error is caused by, for example, the limitation of the measurement system or the process conditions. In addition, "approximately" can mean within one or more standard deviations of the above numerical values, such as ±30%, ±20%, ±10% or ±5%. The words "approximately", "approximately" or "substantially" used in this text may select an acceptable deviation range or standard deviation according to the optical, etching, mechanical or other properties, and do not apply a single standard deviation to all the above optical, etching, mechanical and other properties.

The terms used in this case are only for describing specific embodiments and are not intended to limit the scope of the patent application. Unless otherwise limited, the singular forms "a", "an" or "the" can also be used to represent plural forms.

The disclosed anti-electromagnetic interference circuit board can be used in any electronic device with wireless communication function. It can make the electromagnetic waves or electromagnetic energy generated by the antenna of the circuit board when sending and receiving signals be shielded by the shielding structure without interfering with the operation of the chip and other electronic components of the circuit board.

FIG1 is a cross-sectional schematic diagram of a circuit board 100 for resisting electromagnetic interference according to at least one embodiment of the present disclosure. Referring to FIG1 , the circuit board 100 includes a first substrate 110, a second substrate 120, a third substrate 130, a shielding structure 140, a first adhesive layer 150, a second adhesive layer 160, a flat adhesive layer 170, at least one chip, and at least one conductive structure 190. In the embodiment shown in FIG1 , the circuit board 100 includes at least two chips, wherein these chips are a transmitting chip 182 and a receiving chip 183.

The first substrate 110 includes a dielectric layer 111 and a metal layer 112. The dielectric layer 111 and the metal layer 112 are stacked and bonded. The material of the dielectric layer 111 is, for example, glass fiber as a reinforcing material and epoxy resin as an adhesive, but is not limited thereto.

The second substrate 120 includes a dielectric layer 121, two metal layers 122 and 123, and a plurality of conductive structures 124. The dielectric layer 121 and the metal layers 122 and 123 are stacked and combined, and the metal layers 122 and 123 are respectively located on the upper and lower sides of the dielectric layer 121. The metal layer 122 is a first metal pattern layer, and the first metal pattern layer includes an antenna 125. The antenna 125 includes a transmitting antenna unit 126 and a receiving antenna unit 127. The transmitting antenna unit 126 is used to radiate electromagnetic waves (far field communication) or couple and transmit electromagnetic energy (near field communication). The receiving antenna unit 127 is used to receive electromagnetic waves (far field communication) or couple and receive electromagnetic energy (near field communication). The transmitting antenna unit 126 is spaced from the receiving antenna unit 127. The metal layer 123 is electrically coupled to the metal layer 122 (first metal pattern layer) via the conductive structures 124 that pass through the dielectric layer 121. The material of the dielectric layer 121 is, for example, glass fiber as a reinforcing material and epoxy resin as an adhesive, but is not limited thereto.

The third substrate 130 includes a dielectric layer 131, two metal layers 132 and 133, and a plurality of conductive structures 134. The dielectric layer 131 and the metal layers 132 and 133 are stacked and combined, and the metal layers 132 and 133 are respectively located on the upper and lower sides of the dielectric layer 131. The metal layer 132 is a second metal pattern layer, and the electronic element 181, the transmitting chip 182, and the receiving chip 183 are installed on the second metal pattern layer, wherein the transmitting chip 182 is used to control the transmitting antenna unit 126, and the receiving chip 183 is used to control the receiving antenna unit 127. The metal layer 133 is electrically coupled to the metal layer 132 (the second metal pattern layer) through the conductive structures 134 passing through the dielectric layer 131. The material of the dielectric layer 131 may be, for example, glass fiber as a reinforcing material and epoxy resin as an adhesive, but the invention is not limited thereto.

The material of the shielding structure 140 includes silicone rubber. The shielding structure 140 can be used to shield electromagnetic waves or electromagnetic energy. In other embodiments, the material of the shielding structure 140 also includes carbon black and carbonyl iron, wherein carbonyl iron is a ferrite magnetic material. For example, when the mass ratio of carbonyl iron to silicone rubber is fixed at 50 to 100, as the carbon black content increases, the conductivity, electromagnetic wave absorption, electromagnetic energy performance and shielding performance of the shielding structure 140 show an enhanced trend until the mass ratio of carbon black to silicone rubber reaches 70 to 100. After the shielding structure 140 is treated with plasma, its surface is modified, so that the silicone rubber, carbon black and carbonyl iron are modified silicone rubber, modified carbon black and modified carbonyl iron, respectively.

The first adhesive layer 150 and the second adhesive layer 160 are each made of glass fiber and epoxy resin. The flat adhesive layer 170 can be formed by stacking at least one flat adhesive sheet 171 ( FIG. 5A ), and the hardness and material of the flat adhesive sheet 171 are similar to those of the first adhesive layer 150 and the second adhesive layer 160 .

Further, the first substrate 110 includes a receiving space 114 (FIG. 4), and the receiving space 114 penetrates the dielectric layer 111 and the metal layer 112. The shielding structure 140 is disposed in the receiving space 114 and fills the receiving space 114. In this example, the receiving space 114 includes two sub-spaces 115 (FIG. 4), and these sub-spaces 115 are separated by the dielectric layer 111. The shielding structure 140 includes two shielding blocks 141, wherein these shielding blocks 141 are respectively disposed and fill these sub-spaces 115.

The first adhesive layer 150, the second adhesive layer 160, the first substrate 110 and the flat adhesive layer 170 are stacked, and the first substrate 110 is sandwiched between the first adhesive layer 150 and the second adhesive layer 160, and the first adhesive layer 150 is sandwiched between the flat adhesive layer 170 and the first substrate 110. The first adhesive layer 150 is attached to the metal layer 112 and the shielding structure 140, and the second adhesive layer 160 is attached to the dielectric layer 111 and the shielding structure 140. It should be particularly noted that the shielding structure 140 is first subjected to plasma treatment before being disposed in the accommodation space 114, so that the surface of the shielding structure 140 is modified and the adhesive strength is increased to a range of 50 to 90 millinewtons per meter, thereby greatly improving the adhesion with the first adhesive layer 150 and the second adhesive layer 160. The shielding structure 140 is sandwiched between the first adhesive layer 150 and the second adhesive layer 160, and can be disposed flatly in the accommodation space 114.

The first substrate 110, the second substrate 120 and the third substrate 130 are stacked, and the first substrate 110 is sandwiched between the second substrate 120 and the third substrate 130, wherein the first metal pattern layer (metal layer 122) is disposed on the flat adhesive layer 170, the second metal pattern layer (metal layer 132) is disposed on the second adhesive layer 160, and the antenna 125 overlaps with the shielding structure 140 in the vertical projection direction of the first substrate 110. Further, the transmitting antenna unit 126 and the receiving antenna unit 127 overlap with these shielding blocks 141 respectively, and the distance from the transmitting antenna unit 126 to the adjacent shielding block 141 is equal to the distance from the receiving antenna unit 127 to the adjacent shielding block 141. Therefore, these shielding blocks 141 have the same shielding effect on the electromagnetic wave source in the direction of the antenna 125 .

In addition, other metal layers 210, adhesive layers 220 and 230, substrate 240, etc. may be stacked between the first substrate 110 and the third substrate 130 without limitation. In this example, the metal layer 210, adhesive layer 220, substrate 240, and adhesive layer 230 are stacked from bottom to top between the second adhesive layer 160 and the third substrate 130.

In this example, at least one conductive structure 190 is a plurality of conductive structures 190. These conductive structures 190 pass through the adhesive layer 230, the substrate 240, the adhesive layer 220, the metal layer 210, the second adhesive layer 160, the first substrate 110, the first adhesive layer 150, the planar adhesive layer 170 from the second metal pattern layer (metal layer 122) of the third substrate 130 to the first metal pattern layer (metal layer 122) of the second substrate 120, so that the second metal pattern layer (metal layer 132) is electrically coupled to the first metal pattern layer (metal layer 122) through the conductive structures 190.

FIG. 2 is a schematic diagram of the antenna 125 of FIG. 1 . Referring to FIG. 1 and FIG. 2 , in this example, the antenna 125 is described using a radio-frequency identification (RFID) technology using near field communication. The transmitting antenna unit 126 forms a symmetrical coil centered on the pad 128 on the first metal pattern layer (metal layer 122). The pad 128 is electrically connected to the pad 128a, and the pad 128a is electrically coupled to the transmitting chip 182 through the conductive structure 190. Similarly, the receiving antenna unit 127 forms a symmetrical coil centered on the pad 129 on the first metal pattern layer (metal layer 122). The pad 129 is electrically connected to the pad 129 a, and the pad 129 a is electrically coupled to the receiving chip 183 through the conductive structure 190 .

Fig. 3 is a schematic diagram of wireless signal transmission between the electromagnetic interference resistant circuit board 100 and the radio frequency reader 300. Referring to Fig. 3, when the radio frequency reader 300 is close to the antenna 125 of the circuit board 100, the transmitting antenna unit 126, the receiving antenna unit 127 and the radio frequency reader 300 generate magnetic field induction, so that the transmitting antenna unit 126 and the radio frequency reader 300 are coupled to transmit electromagnetic energy, and the receiving antenna unit 127 and the radio frequency reader 300 are coupled to receive electromagnetic energy. When electromagnetic energy is generated between the antenna 125 and the RF reader 300, the shielding structure 140 can suppress the interference of the electromagnetic energy and change the magnetic flux path so that the electromagnetic energy cannot pass through the shielding structure 140 and interfere with the operation of the electronic components 181, the transmitting chip 182 and the receiving chip 183 on the second metal pattern layer (metal layer 132).

FIG4 is a cross-sectional schematic diagram of the step of providing a first substrate 110, a shielding structure 140, and a first adhesive layer 150 in a method of manufacturing an electromagnetic interference-resistant circuit board 100 according to at least one embodiment of the present disclosure. Referring to FIG4, first, a first substrate 110 is provided, wherein the first substrate 110 is stacked by a dielectric layer 111 and two metal layers 112 and 113. Then, the metal layer 113 is removed, a receiving space 114 is formed for the stacked dielectric layer 111 and the metal layer 112, and the metal layer 112 is patterned to form a plurality of holes to expose the dielectric layer 111, wherein the receiving space 114 includes two sub-spaces 115. Next, a shielding structure 140 is provided, which is two shielding blocks 141 in this example. It should be noted that the material of the shielding structure 140 at this time includes silicone rubber, carbon black and carbonyl iron. The shielding block 141 is subjected to plasma treatment to modify its surface, thereby improving the adhesive strength of the shielding block 141. At this time, the shielding structure 140 becomes modified silicone rubber, modified carbon black and modified carbonyl iron after plasma treatment.

Next, in the step of providing the first adhesive layer 150, the first adhesive layer 150 is coated with adhesive and attached to the metal layer 112. The shielding block 141 treated by plasma is disposed in the accommodation space 114 and on the first adhesive layer 150, wherein the shielding block 141 and the dielectric layer 111 are flat surfaces, and the shielding block 141 is attached to the first adhesive layer 150 by adhesive.

FIG5A is a cross-sectional schematic diagram of the step of providing a second adhesive layer 160, a flat adhesive sheet 171, and a second substrate 120 in a method of manufacturing an electromagnetic interference-resistant circuit board 100 according to at least one embodiment of the present disclosure. Referring to FIG5A , in this step, a metal layer 210, a second adhesive layer 160, a plurality of flat adhesive sheets 171, and a second substrate 120 are provided. The second adhesive layer 160 is disposed on the dielectric layer 111, the metal layer 210 is disposed on the second adhesive layer 160, the plurality of flat adhesive sheets 171 are disposed on the first adhesive layer 150, and the second substrate 120 is disposed on the plurality of flat adhesive sheets 171.

FIG5B is a cross-sectional view of the step of combining the first substrate 110, the first adhesive layer 150, the second adhesive layer 160, the flat adhesive sheet 171 and the second substrate 120 in the method of manufacturing the anti-electromagnetic interference circuit board 100 according to at least one embodiment of the present disclosure. Referring to FIG5A and FIG5B, first, the second adhesive layer 160 is coated with adhesive and then attached to the dielectric layer 111 and the shielding block 141. Then, multiple layers of adhesive are coated on multiple flat adhesive sheets 171 respectively. Next, the first substrate 110 , the first adhesive layer 150 , the second adhesive layer 160 , the metal layer 210 , the plurality of planar adhesive sheets 171 and the second substrate 120 are pressed together, wherein the plurality of planar adhesive sheets 171 form a planar adhesive layer 170 .

In this step, the shielding block 141 is stably and flatly disposed in the accommodation space 114 (FIG. 4) and fixed between the first adhesive layer 150 and the second adhesive layer 160. Therefore, when the circuit board 100 is moved, the shielding block 141 is not easily displaced, and the circuit board 100 can be prevented from being sunken or bulged. In addition, the plurality of flat adhesive sheets 171 disposed between the first adhesive layer 150 and the second substrate 120 serve as a compression buffer.

FIG6A is a cross-sectional schematic diagram of the step of providing the third substrate 130 in the method of manufacturing the circuit board 100 against electromagnetic interference according to at least one embodiment of the present disclosure. Referring to FIG6A , first, the metal layer 210 is patterned to form a plurality of holes to expose the second adhesive layer 160. Then, a plurality of adhesive sheets 221, a substrate 240, an adhesive layer 230, and a third substrate 130 are provided. These adhesive sheets 221 are disposed on the metal layer 210, the substrate 240 is disposed on these adhesive sheets 221, the adhesive layer 230 is disposed on the substrate 240, and the third substrate 130 is disposed on the adhesive layer 230. It should be noted that the substrate 240, the adhesive layer 230, and the third substrate 130 may be bonded or not bonded before this step without limitation.

FIG6B is a cross-sectional schematic diagram of the step of combining the third substrate 130 with the first substrate 110 and the second substrate 120 in the method of manufacturing the electromagnetic interference resistant circuit board 100 according to at least one embodiment of the present disclosure. Referring to FIG6A and FIG6B, first, the third substrate 130, the adhesive layer 230, the substrate 240, and the plurality of adhesive sheets 221 are pressed with the first substrate 110 and the second substrate 120, wherein the plurality of adhesive sheets 221 form the adhesive layer 220. Then, the first metal pattern layer (metal layer 122) is patterned to form the antenna 125. Further, the second metal pattern layer (metal layer 132) is patterned to form the pad and the trace.

Next, a plurality of conductive structures 190 are formed between the second substrate 120 and the third substrate 130, so that the antenna 125 is electrically coupled to the second metal pattern layer (metal layer 132) through the conductive structures 190. Afterwards, the electronic element 181, the transmitting chip 182 and the receiving chip 183 are mounted on the second metal pattern layer, so that the transmitting chip 182 and the receiving chip 183 are electrically coupled to the antenna 125 through the conductive structures 190.

In summary, in the circuit board 100 disclosed in the above embodiment, by performing plasma treatment on the shielding structure 140, the shielding structure 140 improves the adhesion with the first adhesive layer 150 and the second adhesive layer 160, thereby improving the bonding strength with the first adhesive layer 150 and the second adhesive layer 160 and reducing the risk of board explosion. In addition, before the circuit board 100 is pressed, the shielding structure 140 is first attached to the first adhesive layer 150 and the second adhesive layer 160, so that the shielding structure 140 can be stably and flatly fixed in the accommodating space 114, thereby avoiding the displacement of the shielding structure 140 made of a relatively soft material, which causes the circuit board 100 to be sunken or bulged, thereby improving the yield of the circuit board 100. Furthermore, the material of the shielding structure 140 includes modified silicone rubber, modified carbon black and modified carbonyl iron, so that the electrical conductivity, electromagnetic wave absorption, electromagnetic energy performance and shielding performance show an enhanced trend.

Although the present disclosure has been disclosed as above by way of embodiments, it is not intended to limit the present disclosure. A person having ordinary knowledge in the technical field to which the present disclosure belongs may make some changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the definition of the attached patent application scope.

100: Circuit board

110: first substrate

111: Dielectric layer

112,113:Metal layer

114: Accommodation space

115: Subspace

120: Second substrate

121: Dielectric layer

122,123:Metal layer

124: Conductive structure

125: Antenna

126: Transmitting antenna unit

127: Receiving antenna unit

128,128a,129,129a: pads

130: Third substrate

131: Dielectric layer

132,133:Metal layer

134: Conductive structure

140: Shielding structure

141: Shielding block

150: First adhesive layer

160: Second adhesive layer

170: Flat adhesive layer

171: Flat adhesive sheet

181: Electronic components

182: Transmitter chip

183: Receive chip

190: Conductive structure

210:Metal layer

220,230: Adhesive layer

221: Adhesive sheet

240: Substrate

300: RF reader

In order to more fully understand the embodiments and their advantages, reference is now made to the following description in conjunction with the attached drawings, wherein: [Figure 1] is a schematic cross-sectional view of an electromagnetic interference-resistant circuit board of at least one embodiment of the present disclosure; [Figure 2] is a schematic diagram of the antenna of Figure 1; [Figure 3] is a schematic diagram of wireless signal transmission between an electromagnetic interference-resistant circuit board and a radio frequency reader; [Figure 4] is a schematic cross-sectional view of the steps of providing a first substrate, providing a shielding structure, and providing a first adhesive layer in a method for manufacturing an electromagnetic interference-resistant circuit board of at least one embodiment of the present disclosure; [Figure 5A] is a schematic cross-sectional view of the steps of providing a second adhesive layer, a flat adhesive sheet, and a second substrate in a method for manufacturing an electromagnetic interference-resistant circuit board of at least one embodiment of the present disclosure; [FIG. 5B] is a schematic cross-sectional view of the step of combining the first substrate, the first adhesive layer, the second adhesive layer, the flat adhesive sheet and the second substrate in the method for manufacturing a circuit board against electromagnetic interference according to at least one embodiment of the present disclosure; [FIG. 6A] is a schematic cross-sectional view of the step of providing a third substrate in the method for manufacturing a circuit board against electromagnetic interference according to at least one embodiment of the present disclosure; and [FIG. 6B] is a schematic cross-sectional view of the step of combining the third substrate with the first substrate and the second substrate in the method for manufacturing a circuit board against electromagnetic interference according to at least one embodiment of the present disclosure.

Domestic storage information (please note in the order of storage institution, date, and number) None Foreign storage information (please note in the order of storage country, institution, date, and number) None

100: Circuit board

110: First substrate

111: Dielectric layer

112:Metal layer

120: Second substrate

121: Dielectric layer

122,123:Metal layer

124: Conductive structure

125: Antenna

126: Transmitting antenna unit

127: Receiving antenna unit

130: Third substrate

131: Dielectric layer

132,133:Metal layer

134: Conductive structure

140: Shielding structure

141: Shielding block

150: First adhesive layer

160: Second adhesive layer

170: Flat adhesive layer

181: Electronic components

182: Transmitter chip

183: Receive chip

190: Conductive structure

210:Metal layer

220,230: Adhesive layer

240: Substrate

Claims (10)

A circuit board for resisting electromagnetic interference comprises: A dielectric layer including a containing space; A shielding structure disposed in the containing space, wherein the material of the shielding structure comprises modified silicone rubber, and the adhesive strength of the shielding structure is in the range of 50 to 90 millinewtons/meter; A first adhesive layer; A second adhesive layer, wherein the first adhesive layer, the second adhesive layer and the dielectric layer are stacked, and the dielectric layer is sandwiched between the first adhesive layer and the second adhesive layer, and the shielding structure is attached to the first adhesive layer and the second adhesive layer; A first metal pattern layer disposed on the first adhesive layer; and A second metal pattern layer is disposed on the second adhesive layer, and the first metal pattern layer includes an antenna, which overlaps with the shielding structure in the vertical projection direction of the dielectric layer. As described in claim 1, the electromagnetic interference-resistant circuit board, wherein the material of the shielding structure also includes modified carbon black and modified carbonyl iron. The electromagnetic interference resistant circuit board as described in claim 1 further includes at least one chip and at least one conductive structure, wherein the at least one chip is mounted on the second metal pattern layer, and the at least one conductive structure passes through the dielectric layer, the first adhesive layer, the second adhesive layer to the first metal pattern layer from the second metal pattern layer, and the at least one chip is electrically coupled to the antenna via the at least one conductive structure. An electromagnetic interference resistant circuit board as described in claim 1 or 3, wherein the shielding structure includes two shielding blocks, the accommodating space includes two sub-spaces, and the two sub-spaces are separated, the antenna includes a transmitting antenna unit and a receiving antenna unit, the two shielding blocks are respectively arranged in the two sub-spaces, and the transmitting antenna unit and the receiving antenna unit overlap with the two shielding blocks in the vertical projection direction of the dielectric layer. An electromagnetic interference-resistant circuit board as described in claim 4, wherein the distance from the transmitting antenna unit to the adjacent shielding block is equal to the distance from the receiving antenna unit to the adjacent shielding block. A method for manufacturing an electromagnetic interference resistant circuit board comprises: Providing a first substrate, the first substrate comprising a dielectric layer and a metal layer, wherein the dielectric layer and the metal layer are stacked, and the first substrate further comprises a containing space, the containing space penetrates the dielectric layer and the metal layer; Providing a shielding structure, and performing plasma treatment on the shielding structure so that the adhesion strength of the shielding structure is in the range of 50 to 90 millinewtons/meter; Providing a first adhesive layer, the shielding structure is arranged in the containing space, and the first adhesive layer is attached to the metal layer and the shielding structure; A second adhesive layer and a second substrate are provided, the second adhesive layer is disposed on the dielectric layer, the second substrate includes a first metal pattern layer, and the second substrate is disposed on the first adhesive layer; The first substrate, the first adhesive layer, the second adhesive layer and the second substrate are combined; A third substrate is provided, the third substrate includes a second metal pattern layer, and the third substrate is disposed on the second adhesive layer; and The third substrate is combined with the first substrate and the second substrate, wherein the first metal pattern layer includes an antenna, and the antenna overlaps with the shielding structure in the vertical projection direction of the dielectric layer. The method for manufacturing an electromagnetic interference resistant circuit board as described in claim 6, wherein the step of providing the first adhesive layer comprises: Providing the first adhesive layer, and applying an adhesive to the first adhesive layer and then attaching it to the metal layer; and Placing the shielding structure treated with plasma in the accommodation space and on the first adhesive layer, wherein the shielding structure and the dielectric layer are flat surfaces, and the shielding structure is bonded to the first adhesive layer via the adhesive. The method for manufacturing an electromagnetic interference resistant circuit board as described in claim 6, wherein the step of providing the second adhesive layer and the second substrate further includes providing at least one flat adhesive sheet, and the at least one flat adhesive sheet is disposed between the first adhesive layer and the second substrate; The step of combining the first substrate, the first adhesive layer, the second adhesive layer, and the second substrate includes: Applying an adhesive to the second adhesive layer and then attaching it to the dielectric layer and the shielding structure; Applying at least one adhesive on the at least one flat adhesive sheet; and Pressing the first substrate, the first adhesive layer, the second adhesive layer, the at least one flat adhesive sheet, and the second substrate. A method for manufacturing a circuit board resistant to electromagnetic interference as described in claim 6, wherein the shielding structure includes two shielding blocks, the accommodating space includes two sub-spaces, and the two sub-spaces are spaced apart, the antenna includes a transmitting antenna unit and a receiving antenna unit, the two shielding blocks are respectively arranged in the two sub-spaces, the transmitting antenna unit and the receiving antenna unit are respectively overlapped with the two shielding blocks in the vertical projection direction of the dielectric layer, and the distance from the transmitting antenna unit to the adjacent shielding block is equal to the distance from the receiving antenna unit to the adjacent shielding block. The method for manufacturing an electromagnetic interference resistant circuit board as described in claim 6, wherein the step of combining the third substrate with the first substrate and the second substrate includes: Pressing the third substrate with the first substrate and the second substrate; Patterning the first metal pattern layer to form the antenna; Forming a conductive structure between the second substrate and the third substrate so that the antenna is electrically coupled to the second metal pattern layer through the conductive structure; and Installing a chip on the second metal pattern layer so that the chip is electrically coupled to the antenna through the conductive structure.

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