TWI853590B - Equipment and method for processing substrate by using differential pressure method combined with exhaust fixture - Google Patents

Abstract

A device and method for processing a substrate by using a pressure difference method combined with an exhaust fixture, including a plurality of substrates and a substrate pressing device, wherein the substrate pressing device is provided with an upper and lower surface and an exhaust fixture on the upper surface, at least one air bag is provided on the lower surface, and at least one substrate is placed on the exhaust fixture corresponding to the at least one air bag on the upper surface, each substrate and each substrate pressing device is provided in a processing chamber, and is enclosed in the working temperature and working pressure of the processing chamber, and the pressure difference formed by the predetermined pressure inside the air bag and the working pressure of the processing chamber is used to effectively suppress the warping and deformation of the substrate, and the first surface of the substrate can be simulated or actually measured to obtain a geometric surface, and the contact surface on the exhaust fixture can be processed into an inverse geometric surface, so as to offset the thermal stress and make the substrate be shaped to be flat.

Description

Equipment and method for substrate processing using differential pressure method combined with exhaust fixture

The present invention provides a technical field of electronic packaging, and in particular, provides a device and method for processing a substrate by combining a pressure difference method with an exhaust fixture. The pressure difference between the airbag and the processing chamber is used to suppress the warping of the substrate. The contact surface on the exhaust fixture can be processed into an inverse geometric surface to offset thermal stress and make the substrate flat.

According to the thermal expansion coefficient of the encapsulation material used in the encapsulation process of electronic packaging is different from that of the encapsulation carrier. Therefore, during the curing process after encapsulation, the encapsulation carrier and the encapsulation material will produce different thermal expansion or thermal contraction with temperature changes, causing the encapsulation carrier to produce thermal stress and warp. The higher the temperature or the longer the curing time, the greater the warp of the encapsulation carrier, making the subsequent cutting process difficult to carry out.

On the other hand, although the known pressure difference method can counteract the warping phenomenon caused by uneven thermal expansion of the package substrate at high temperature during the process by applying force to the surface of the package substrate, the thermal stress in the package substrate is still not completely eliminated. Therefore, when the process is completed and the pressure disappears, the thermal stress will still cause the package substrate to deform, which really needs to be improved.

Therefore, in view of the above-mentioned problem of packaging structure warping due to thermal stress, how to develop a structure and method to suppress material warping that is more ideal and practical while taking into account economic benefits is the goal and direction for the relevant industry to actively research and develop breakthroughs.

In view of this, the inventor, based on his many years of experience in manufacturing, developing and designing related products, has designed and carefully evaluated the above-mentioned goals and finally obtained this invention which is truly practical.

The main purpose of the present invention is to provide a device and method for processing a substrate by using a pressure difference method combined with an exhaust fixture. The pressure difference between the airbag and the processing chamber is used to suppress the warping of the substrate during the process. The contact surface on the exhaust fixture can be processed into an inverse geometric surface to offset the thermal stress of the substrate after the process, so that the substrate is formed to be flat.

To achieve the above-mentioned purpose, the present invention provides an apparatus and method for processing a carrier plate by using a pressure difference method combined with an exhaust fixture, which includes: a plurality of carrier plates and a carrier plate pressing device, wherein the carrier plate pressing device is provided with an upper and lower surface relative to each other and an exhaust fixture on the upper surface, at least one air bag is provided on the lower surface, and at least one carrier plate is placed on the exhaust fixture corresponding to the at least one air bag on the upper surface, and each of the carrier plates and each of the carrier plate pressing devices is provided with a pressure difference method combined with an exhaust fixture, wherein the pressure difference method comprises: a plurality of carrier plates and a carrier plate pressing device, wherein the carrier plate pressing device is provided with an upper and lower surface relative to each other and an exhaust fixture on the upper surface, and at least one air bag is provided on the lower surface, and at least one carrier plate is placed on the exhaust fixture corresponding to the at least one air bag on the upper surface, and each of the carrier plates and each of the carrier plate pressing devices is provided with a pressure difference method combined with an exhaust fixture, wherein the pressure difference method comprises: a plurality of carrier plates and a carrier plate pressing device, wherein the carrier plates and the carrier plate pressing devices are provided with an upper and lower surface relative to each other and an exhaust fixture on the upper surface, and the carrier plates and the exhaust fixture are provided with a pressure difference method comprising ... exhaust fixture are provided with a pressure difference method comprising: a plurality of carrier plates and a carrier plate pressing device, wherein the plurality of carrier plates and the carrier plate pressing devices are provided with an upper and lower surface relative to each other and an exhaust fixture on the upper surface, and the plurality of carrier plates and the exhaust fixture are provided with a pressure difference method comprising: It is installed in a processing chamber and is enclosed in the working temperature and working pressure of the processing chamber. The pressure difference formed by the preset pressure inside the airbag and the working pressure of the processing chamber is used to effectively suppress the warping and deformation of the carrier. The first surface of the carrier can be simulated or actually measured to obtain a geometric surface. The contact surface on the exhaust fixture can be processed into an inverse geometric surface to offset the thermal stress and make the carrier shape tend to be flat.

Regarding the technology, means and effects adopted by the present invention, a preferred embodiment is given and described in detail with drawings. It is believed that the above-mentioned purpose, structure and features of the present invention can be understood in depth and concretely.

10: Carrier board

11: First page

12: Second side

20: Carrier board pressing device

201: Upper surface

202: Lower surface

21: Gas inlet

22: Gas outlet

23: Airbag

24: Sealing structure

25: Gas channel

26: Air pressure source

27: Vacuum generator

28: Storage board

30: Processing framework

31: Chute

40: Processing chamber

50: Exhaust fixture

51: Hole

52: Upper contact part

521: Upper contact surface

522: Supporting hole

53: Lower base

531:Threaded hole

532: Annular groove

533: Exhaust hole

54: Heat-resistant sealing layer

61: Screws

62: O-ring

70: Prepare a plurality of carrier plate pressing devices, each of which has a lower surface and an opposite upper surface, and at least one airbag is disposed on the lower surface

71: After a carrier board is deformed by heat treatment, the surface data of the first surface of the carrier board after deformation is actually measured

72: After a carrier board is deformed by simulated thermal processing, the surface data of the first surface of the carrier board after deformation is calculated

73: Prepare a plurality of exhaust fixtures with detachable upper contact parts

74: The processing machine obtains an upper contact surface of the upper contact part, and processes the upper contact surface with corresponding related data of flat to flat, concave to convex, and convex to concave according to the surface data

75: Place the exhaust fixture containing the carrier on the upper surface of each carrier pressing device in a processing chamber, with the first surface of each carrier facing the upper contact surface with a plurality of holes, and the outside of each airbag presses against the second surface of each carrier.

76: Pressurize the processing chamber with gas, fill each air bag with gas through an air pressure source, and exhaust each exhaust fixture to form a pressure difference between the first surface of each carrier and the second surface of each carrier, so as to press each carrier onto each exhaust fixture

77: After heat treatment, the thermal stress of each carrier board can be offset, making each carrier board tend to be flat.

[Figure 1] is a schematic diagram of the airbag pressing state of one of the preferred embodiments of the present invention.

[Figure 2] is a three-dimensional exploded schematic diagram of an exhaust fixture of one embodiment of the present invention.

[Figure 3] is a partial cross-sectional schematic diagram of an exhaust fixture of one embodiment of the present invention.

[Figure 4] is a schematic diagram of a partial first surface of the carrier board and a partial contact surface on the exhaust fixture of one embodiment of the present invention.

[Figure 5] is a schematic diagram of another embodiment of a partial first surface of the carrier board of the present invention and a partial contact surface on the exhaust fixture.

[Figure 6] is another schematic diagram of a partial first surface of the carrier board of the present invention and a partial contact surface on the exhaust fixture.

[Figure 7] is a schematic diagram of another embodiment of a partial first surface of the carrier board of the present invention and a partial contact surface on the exhaust fixture.

[Figure 8] is a block diagram of the method flow of one embodiment of the present invention.

The present invention provides a device and method for designing a substrate carrier processing device using a pressure difference method combined with an exhaust fixture.

In order to enable the Honorable Review Committee to have a further understanding and recognition of the purpose, features and efficacy of the present invention, the present invention is described in detail with reference to the implementation method and drawings as follows: Referring to FIGS. 1 to 3, the present invention provides a device for processing a substrate by using a pressure difference method combined with an exhaust fixture, which comprises: a processing frame 30 is disposed in a processing chamber 40; a plurality of substrate pressing devices 20, each of which is disposed parallel to each other on a slide 31 on the inner side of the processing frame 30, and the substrate pressing device 20 comprises at least one gas inlet 21, at least one gas outlet 22, at least one air bag 23 and at least one gas channel 25, at least one of the gas inlets 21 is connected to a gas pressure source 26, and the substrate pressing device 20 is connected to a gas pressure source 26. The plate pressing device 20 has a lower surface 202 and an upper surface 201 opposite thereto. The lower surface 202 is provided with at least one air bag 23. One end of at least one gas channel 25 is connected to at least one gas inlet 21 and at least one gas outlet 22, and the other end is connected to at least one air bag 23. The air bag 23 and the gas channel 25 are connected to form a closed space. A plurality of exhaust fixtures 50 are provided with a plurality of exhaust holes 533 to exhaust the outside of the processing chamber 40. The exhaust holes 533 can be connected to components such as a vacuum generator, a valve or a fan. The exhaust fixture 50 is provided on the upper surface 201 of the carrier plate pressing device 20. The exhaust fixture 50 may include an upper contact The upper contact portion 52 is composed of an upper contact surface 521 and a lower base portion 53, wherein the upper contact portion 52 has a detachable design. A first surface 11 of a carrier plate 10 previously subjected to heat treatment is simulated or actually measured to obtain surface data, wherein the upper or lower surface of the carrier plate 10 facing the upper contact surface 521 is defined as the first surface 11, and the other surface opposite to the first surface 11 is defined as the second surface 12; the surface data is processed on the upper contact surface 521 by corresponding data of flat to flat, concave to convex, and convex to concave. The upper contact surface 521 of the exhaust fixture 50 corresponds to the airbag 23 on the carrier plate pressing device 20. The carrier 10 is placed so that the first surface 11 and the upper contact surface 521 of the exhaust fixture 50 are in contact with each other. In addition, the upper surface 201 of the uppermost carrier pressing device 20 does not place the carrier 10 and the exhaust fixture 50. The processing chamber 40 is pressurized with gas, and each air bag 23 is filled with gas through the air pressure source 26, and each exhaust fixture 50 is exhausted to form a pressure difference between the first surface 11 of each carrier 10 and the second surface 12 of each carrier 10, so as to press each carrier 10 on each exhaust fixture 50, so as to offset the thermal stress of each carrier 10 during subsequent heat processing, so that each carrier 10 after heat processing tends to be flat.

The pressure difference method combined with the exhaust fixture is used to process the carrier board, wherein each gas outlet 22 is connected to a vacuum generator 27, through which the pressure in each gas channel 25 and each air bag 23 is reduced to a predetermined vacuum pressure, and each air bag 23 is adsorbed on the lower surface 202 of each carrier board pressing device 20 by vacuum suction, so as to facilitate the removal of each carrier board 10.

The pressure difference method combined with the exhaust fixture is used to process the carrier, wherein the carrier pressing device 20 is slidably mounted on the inner side of the processing frame 30, and the lower surface 202 of the carrier pressing device 20 is fixed with at least one air bag 23 through at least one sealing structure 24.

The pressure difference method combined with the exhaust fixture is used to process the substrate, wherein the airbag 23 is made of polyimide or Teflon material.

The pressure difference method combined with the exhaust fixture for processing the carrier plate is described above. In the equipment, a storage plate 28 can be arranged parallel to each other on the inner side of the processing frame 30 below the carrier plate pressing device 20 at the bottom layer. The upper surface of the storage plate 28 is corresponding to at least one of the air bags 23 on the carrier plate pressing device 20 at the bottom layer. At least one of the carrier plates 10 and at least one of the exhaust fixtures 50 are placed.

The pressure difference method is combined with an exhaust fixture to process the substrate, wherein the substrate 10 can be at least one of a printed circuit board, a substrate, a lead frame, a wafer, a silicon interposer, a package, a glass carrier, and a flat plate with circuit wiring.

Referring to Figures 2 and 3, the pressure differential method combined with the exhaust fixture for board processing, wherein the upper contact portion 52 is provided with a plurality of receiving holes 522 of a plurality of locking structures downwardly around the upper contact portion 52, and the lower base portion 53 is provided with a plurality of threaded holes 531 of the locking structure corresponding to the receiving holes 522, and the receiving holes 522 are aligned with the threaded holes 531, and then fixed by a plurality of screws 61, and the lower base portion 53 is provided with an annular groove 532 to assemble an O-ring 62.

Referring to FIGS. 4 to 7, the pressure differential method combined with the exhaust fixture is used to process the substrate, wherein the first surface 11 of the substrate 10 is simulated or actually measured as a concave surface, and the upper contact surface 521 of the upper contact portion 52 is a convex surface; the first surface 11 of the substrate 10 is simulated or actually measured as a convex surface, and the upper contact surface 521 of the upper contact portion 52 is a convex surface. The upper contact surface 521 is a concave surface; if the first surface 11 of the carrier 10 is simulated or actually measured as a wavy surface, the upper contact surface 521 of the upper contact portion 52 is an anti-wavy surface; if the first surface 11 of the carrier 10 is simulated or actually measured as an irregular surface, the upper contact surface 521 of the upper contact portion 52 is an anti-irregular surface.

Referring to Figures 1 to 3, the pressure differential method combined with the exhaust fixture for substrate processing equipment, wherein the exhaust fixture 50 has a plurality of holes 51 on the upper contact portion 52, and at least one heat-resistant sealing layer 54 is disposed between the first surface 11 of the substrate 10 and the upper contact surface 521 of the exhaust fixture 50, wherein the heat-resistant sealing layer 54 may partially cover or not cover the hole 51; the heat-resistant sealing layer 54 can withstand a processing temperature of more than 40°C to less than 1200°C.

Referring to FIG. 8, the present invention provides a method for processing a carrier plate by using a pressure difference method combined with an exhaust fixture, the steps of which include: step 1: preparing a plurality of carrier plate pressing devices, the carrier plate pressing devices having a lower surface and an opposite upper surface, the lower surface being provided with at least one air bag (70); step 2A: after a carrier plate is deformed by heat processing, actually measuring the deformation of the first surface of the carrier plate; or step 2B: after a carrier board is deformed by simulated heat processing, the surface data of the first surface of the carrier board after deformation is calculated (72); step 3: preparing a plurality of exhaust fixtures (73) with a detachable upper contact portion; step 4: a processing machine obtains an upper contact surface of the upper contact portion, and according to the surface data, a flat surface corresponds to a flat surface, a concave surface corresponds to a convex surface, and a convex surface corresponds to a concave surface. The corresponding relevant data of the concave is processed on the upper contact surface (74); Step 5: placing the exhaust fixture containing multiple carriers on the upper surfaces of each carrier pressing device in a processing chamber, with the first surface of each carrier facing the upper contact surface with multiple holes, and the outside of each airbag pressing the second surface of each carrier (75); Step 6: The gas is pressurized, and each air bag is filled with gas through an air pressure source, and each exhaust fixture is exhausted to form a pressure difference between the first surface of each carrier and the second surface of each carrier, so as to press each carrier onto each exhaust fixture (76); Step 7: After heat treatment of each carrier, the thermal stress of each carrier is offset, so that each carrier tends to be flat (77). Among them, the upper or lower surface of the carrier facing the upper contact surface is defined as the first surface, and the other surface opposite to the first surface is defined as the second surface.

From the above, it can be seen that the pressure difference method combined with the exhaust fixture for substrate processing equipment and method of the present invention is indeed the first in the industry and meets the novelty requirements of the invention patent, and its comprehensive innovative design meets the advancement requirements of the invention patent, and the pressure difference between the airbag and the processing chamber can be used to suppress the warping of the substrate during the process, and the contact surface on the exhaust fixture can be processed into an inverse geometric surface, which can offset the thermal stress of the substrate after the process, so that the substrate is shaped to be flat, which meets the better industrial applicability.

The foregoing is a specific description of the technical features of the present invention with respect to the preferred embodiments of the present invention; however, persons familiar with this technology may make changes and modifications to the present invention without departing from the spirit and principles of the present invention, and such changes and modifications shall all be covered by the scope defined in the following patent application scope.

In summary, the present invention provides a device and method for processing substrates by using a pressure differential method combined with an exhaust fixture. It has indeed achieved all the purposes of the present invention. In addition, the spatial form of its combined structure has not been seen in similar products and has not been disclosed before the application. It has complied with the provisions of the Patent Law, and therefore the application is filed in accordance with the law.

10: Carrier board

11: First page

12: Second side

20: Carrier board pressing device

201: Upper surface

202: Lower surface

21: Gas inlet

22: Gas outlet

23: Airbag

24: Sealing structure

25: Gas channel

26: Air pressure source

27: Vacuum generator

28: Storage board

30: Processing framework

31: Chute

40: Processing chamber

50: Exhaust fixture

54: Heat-resistant sealing layer

Claims (10)

A device for processing a substrate by a pressure difference method combined with an exhaust fixture, comprising: a processing frame arranged in a processing chamber; a plurality of substrate pressure devices, each of which is arranged parallel to each other on the inner side of the processing frame, the substrate pressure device comprising at least one gas inlet, at least one gas outlet, at least one air bag and at least one gas channel, at least one of the gas inlets is connected to a pressure source, the substrate pressure device has a lower surface and an opposite upper surface, at least one of the air bags is arranged on the lower surface, at least one of the gas channels is combined with at least one of the gas inlets and at least one of the gas outlets at one end, and is combined with at least one of the air bags at the other end, the air bags and the gas channels are connected to form a closed space; and a plurality of exhaust fixtures, provided with a plurality of air holes to discharge air into the substrate. Exhaust outside the processing chamber, the exhaust fixture is arranged on the upper surface of the carrier pressing device, the exhaust fixture may include an upper contact part and a lower base part, wherein the upper contact part surface is an upper contact surface, the upper contact part is a detachable design, a first surface of a carrier after previous heat processing is simulated or actually measured to obtain a surface data, the surface data can be processed on the upper contact surface with the corresponding data of flat to flat, concave to convex, convex to concave, the upper contact surface of the exhaust fixture is corresponding to the airbag on the carrier pressing device to place the carrier, so that the first surface and the upper contact surface of the exhaust fixture are in contact, and the thermal stress of each carrier can be offset during the subsequent heat processing, so that each carrier after heat processing tends to be flat. As described in claim 1, the pressure differential method combined with the exhaust fixture is used to process the carrier, wherein each gas outlet is connected to a vacuum generator, through which the pressure in each gas channel and each air bag is reduced to a predetermined vacuum pressure, and each air bag is adsorbed on the lower surface of each carrier pressing device by vacuum suction, so as to facilitate the removal of each carrier. As described in claim 1, the apparatus for processing a substrate by using a pressure differential method combined with an exhaust fixture, wherein the substrate pressing device can be slidably mounted on the inner side of the processing frame, and at least one airbag is fixed on the lower surface of the substrate pressing device through at least one sealing structure. An apparatus for processing substrates by using a pressure differential method combined with an exhaust fixture as described in claim 1, wherein the airbag is made of polyimide or Teflon material. As described in claim 1, the pressure difference method combined with the exhaust fixture for processing the carrier plate, wherein a storage plate can be arranged parallel to each other on the inner side of the processing frame below the carrier plate pressing device at the bottom layer, and at least one carrier plate and at least one exhaust fixture are placed on the upper surface of the storage plate corresponding to at least one air bag on the carrier plate pressing device at the bottom layer. The device for processing a substrate by using a pressure difference method combined with an exhaust fixture as described in claim 1, wherein the substrate can be at least one of a printed circuit board, a substrate, a conductive support, a wafer, a silicon interposer, a package, a glass substrate, and a flat plate with circuit wiring. As described in claim 1, the pressure differential method combined with the exhaust fixture is used to process the carrier, wherein the upper contact portion is provided with a plurality of supporting holes with a plurality of locking structures downwardly around the upper contact portion, and the lower base portion is provided with a plurality of threaded holes of the locking structure corresponding to the supporting holes, and the supporting holes are aligned with the threaded holes and then fixed by locking with a plurality of screws, and the lower base portion is provided with an annular groove to assemble an O-ring. The device for processing a substrate by using a pressure differential method combined with an exhaust fixture as described in claim 1, wherein the first surface of the substrate is simulated or actually measured as a concave surface, and the upper contact surface of the upper contact portion is a convex surface; the first surface of the substrate is simulated or actually measured as a convex surface, and the upper contact surface of the upper contact portion is a concave surface; the first surface of the substrate is simulated or actually measured as a wavy surface, and the upper contact surface of the upper contact portion is an anti-wavy surface; the first surface of the substrate is simulated or actually measured as an irregular surface, and the upper contact surface of the upper contact portion is an anti-irregular surface. The apparatus for processing a substrate by combining a pressure differential method with an exhaust jig as described in claim 1, wherein a plurality of holes are provided on the upper contact portion of the exhaust jig, and at least one heat-resistant sealing layer is provided between the first surface of the substrate and the upper contact surface of the exhaust jig, wherein the heat-resistant sealing layer may partially cover or not cover the holes; the heat-resistant sealing layer can withstand a processing temperature of more than 40°C and less than 1200°C. A method for processing a carrier plate by combining a pressure difference method with an exhaust fixture, comprising the following steps: preparing a plurality of carrier plate pressing devices, the carrier plate pressing devices having a lower surface and an opposite upper surface, the lower surface being provided with at least one air bag; after a carrier plate is deformed by heat processing, actually measuring the surface data of the first surface of the carrier plate after deformation; or after a carrier plate is deformed by simulated heat processing, calculating the surface data of the first surface of the carrier plate after deformation; preparing a plurality of exhaust fixtures with a detachable upper contact portion; a processing machine obtains an upper contact surface of the upper contact portion, and processes the corresponding data of flat to flat, concave to convex, convex to concave according to the surface data On the upper contact surface; placing a plurality of exhaust jigs containing a plurality of carriers on the upper surfaces of each carrier pressing device in a processing chamber, with the first surface of each carrier facing the upper contact surface with a plurality of holes, and the outside of each air bag pressing the second surface of each carrier; pressurizing the processing chamber with gas, filling each air bag with gas through a pressure source, and exhausting each exhaust jig to form a pressure difference between the first surface of each carrier and the second surface of each carrier, so as to press each carrier on each exhaust jig; after heat processing, each carrier can offset the thermal stress of each carrier, so that each carrier tends to be flat.

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