TWI853045B - Adhesive composition and adhesive processed product - Google Patents
Adhesive composition and adhesive processed product Download PDFInfo
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- TWI853045B TWI853045B TW109121599A TW109121599A TWI853045B TW I853045 B TWI853045 B TW I853045B TW 109121599 A TW109121599 A TW 109121599A TW 109121599 A TW109121599 A TW 109121599A TW I853045 B TWI853045 B TW I853045B
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- Prior art keywords
- meth
- less
- acrylate
- molecular weight
- mass
- Prior art date
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- 230000001070 adhesive effect Effects 0.000 title claims abstract description 121
- 239000000853 adhesive Substances 0.000 title claims abstract description 120
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- 239000012790 adhesive layer Substances 0.000 claims abstract description 26
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- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 23
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 13
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- 239000002253 acid Substances 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 150000001541 aziridines Chemical class 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
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- MPMBRWOOISTHJV-UHFFFAOYSA-N but-1-enylbenzene Chemical compound CCC=CC1=CC=CC=C1 MPMBRWOOISTHJV-UHFFFAOYSA-N 0.000 description 1
- MDROOBMCAJXBTL-UHFFFAOYSA-N butane-1,1,1-triol;2,4-diisocyanato-1-methylbenzene Chemical compound CCCC(O)(O)O.CC1=CC=C(N=C=O)C=C1N=C=O MDROOBMCAJXBTL-UHFFFAOYSA-N 0.000 description 1
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- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- UHOVQNZJYSORNB-MICDWDOJSA-N deuteriobenzene Chemical compound [2H]C1=CC=CC=C1 UHOVQNZJYSORNB-MICDWDOJSA-N 0.000 description 1
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- 238000007607 die coating method Methods 0.000 description 1
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 description 1
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- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
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- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- UAIZDWNSWGTKFZ-UHFFFAOYSA-L ethylaluminum(2+);dichloride Chemical compound CC[Al](Cl)Cl UAIZDWNSWGTKFZ-UHFFFAOYSA-L 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
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- DMEGYFMYUHOHGS-UHFFFAOYSA-N heptamethylene Natural products C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
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- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
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- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
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- 125000001827 mesitylenyl group Chemical group [H]C1=C(C(*)=C(C([H])=C1C([H])([H])[H])C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- OJURWUUOVGOHJZ-UHFFFAOYSA-N methyl 2-[(2-acetyloxyphenyl)methyl-[2-[(2-acetyloxyphenyl)methyl-(2-methoxy-2-oxoethyl)amino]ethyl]amino]acetate Chemical compound C=1C=CC=C(OC(C)=O)C=1CN(CC(=O)OC)CCN(CC(=O)OC)CC1=CC=CC=C1OC(C)=O OJURWUUOVGOHJZ-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- HDBWAWNLGGMZRQ-UHFFFAOYSA-N p-Vinylbiphenyl Chemical compound C1=CC(C=C)=CC=C1C1=CC=CC=C1 HDBWAWNLGGMZRQ-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 239000003209 petroleum derivative Substances 0.000 description 1
- VENBJVSTINLYEU-UHFFFAOYSA-N phenol;trifluoroborane Chemical compound FB(F)F.OC1=CC=CC=C1 VENBJVSTINLYEU-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- PMJHHCWVYXUKFD-UHFFFAOYSA-N piperylene Natural products CC=CC=C PMJHHCWVYXUKFD-UHFFFAOYSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000223 polyglycerol Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000002407 reforming Methods 0.000 description 1
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- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000010558 suspension polymerization method Methods 0.000 description 1
- WYKYCHHWIJXDAO-UHFFFAOYSA-N tert-butyl 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOC(C)(C)C WYKYCHHWIJXDAO-UHFFFAOYSA-N 0.000 description 1
- PRIFGVOVRHAALC-UHFFFAOYSA-N tert-butyl 3,3-dimethylbutaneperoxoate Chemical compound CC(C)(C)CC(=O)OOC(C)(C)C PRIFGVOVRHAALC-UHFFFAOYSA-N 0.000 description 1
- PUGUQINMNYINPK-UHFFFAOYSA-N tert-butyl 4-(2-chloroacetyl)piperazine-1-carboxylate Chemical compound CC(C)(C)OC(=O)N1CCN(C(=O)CCl)CC1 PUGUQINMNYINPK-UHFFFAOYSA-N 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
- C09J125/02—Homopolymers or copolymers of hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
- C09J125/02—Homopolymers or copolymers of hydrocarbons
- C09J125/16—Homopolymers or copolymers of alkyl-substituted styrenes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/255—Polyesters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F3/00—Labels, tag tickets, or similar identification or indication means; Seals; Postage or like stamps
- G09F3/08—Fastening or securing by means not forming part of the material of the label itself
- G09F3/10—Fastening or securing by means not forming part of the material of the label itself by an adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
本發明的目的在於提供一種黏著性組成物,其能夠得到具有充分的黏著性、且透明性高的薄膜狀黏著層。用於達成上述目的的本發明是有關於一種黏著性組成物,其含有47~99質量份的滿足(A-1)及(A-2)的(甲基)丙烯酸樹脂(A)、0.5~50質量份的滿足(B-1)~(B-5)的全部的(共)聚合物(B)、0.5~3質量份的交聯劑(C)。 (A-1)含有源自具有C1~12以下的烷基的(甲基)丙烯酸酯、及含有羥基的(甲基)丙烯酸酯的結構單元 (A-2)Tg為-80℃~0℃ (B-1)含有20莫耳%以上的源自異丙烯基甲苯的結構單元。 (B-2)軟化點為90~130℃ (B-3)Tg為40~80℃ (B-4)分子量為400以下的化合物的含有率為10質量%以下 (B-5)Mn為750~1000,Mz為1200~2000,Mw/Mn為1.5以下The object of the present invention is to provide an adhesive composition capable of obtaining a film-like adhesive layer having sufficient adhesiveness and high transparency. The present invention for achieving the above object is related to an adhesive composition, which contains 47 to 99 parts by weight of a (meth) acrylic resin (A) satisfying (A-1) and (A-2), 0.5 to 50 parts by weight of all (co) polymers (B) satisfying (B-1) to (B-5), and 0.5 to 3 parts by weight of a crosslinking agent (C). (A-1) Contains structural units derived from (meth) acrylic esters having an alkyl group of C1 to 12 or less and (meth) acrylic esters containing hydroxyl groups (A-2) Tg is -80°C to 0°C (B-1) Contains structural units derived from isopropenyltoluene at a content of 20 mol% or more. (B-2) Softening point is 90-130°C (B-3) Tg is 40-80°C (B-4) The content of compounds with a molecular weight of 400 or less is 10% by mass or less (B-5) Mn is 750-1000, Mz is 1200-2000, and Mw/Mn is 1.5 or less
Description
本發明有關於一種黏著性組成物及黏著性加工品。The present invention relates to an adhesive composition and an adhesive processed product.
黏著劑(亦稱為感壓接著劑)能簡便地使用,且具有對塑膠、紙類、金屬、玻璃等各種對象物的接著性,因此用作膠帶、標籤、片及雙面膠帶等黏著性加工品中的黏著層。作為用作上述黏著劑的組成物(黏著性組成物),一般使用將丙烯酸樹脂或苯乙烯樹脂(苯乙烯系嵌段共聚物等)設為基底聚合物的組成物。Adhesives (also called pressure-sensitive adhesives) are easy to use and have good adhesion to various objects such as plastics, paper, metal, and glass. Therefore, they are used as adhesive layers in adhesive products such as tapes, labels, sheets, and double-sided tapes. As compositions (adhesive compositions) used as the above-mentioned adhesives, compositions using acrylic resins or styrene resins (styrene-based block copolymers, etc.) as base polymers are generally used.
尤其是,已知將丙烯酸樹脂設為基底聚合物的黏著性組成物的透明性優異,且對紙類、金屬、玻璃等具有極性的被接著體的黏著性優異。In particular, it is known that an adhesive composition using an acrylic resin as a base polymer has excellent transparency and excellent adhesion to polar adherends such as paper, metal, and glass.
另一方面,伴隨電子機器等的薄型化,對貼合內部構件的雙面膠帶亦不斷要求薄膜化。因此,對黏著性組成物期望在製成更薄的黏著層時,亦具有更充分的黏著性及密接性。On the other hand, with the thinning of electronic devices, double-sided tapes for bonding internal components are also required to be thinner. Therefore, it is expected that the adhesive composition has better adhesion and adhesion when the adhesive layer is made thinner.
對於上述要求提出了,將松香系樹脂、萜烯系樹脂、及石油系樹脂等黏著賦予樹脂添加到丙烯酸黏著性組成物,來進而提高黏著性組成物的黏著性的方法。例如,專利文獻1中記載了,藉由將松香系樹脂等與(甲基)丙烯酸系聚合物的相容性低的黏著賦予樹脂添加到丙烯酸黏著性組成物,可使常溫及高溫下的接著力均得以發揮。專利文獻1中記載了,以黏著性組成物的膜化時的霧度值成為15~95%的方式添加上述黏著賦予樹脂。 [現有技術文獻] [專利文獻]In response to the above requirements, a method has been proposed in which a tackifier resin such as a rosin resin, a terpene resin, and a petroleum resin is added to an acrylic adhesive composition to further improve the tackiness of the adhesive composition. For example, Patent Document 1 states that by adding a tackifier resin such as a rosin resin that has low compatibility with a (meth)acrylic polymer to an acrylic adhesive composition, adhesion at both room temperature and high temperature can be exerted. Patent Document 1 states that the tackifier resin is added in such a way that the haze value of the adhesive composition when it is film-formed becomes 15 to 95%. [Prior Art Document] [Patent Document]
[專利文獻1]特開昭64-16882號公報[Patent Document 1] Japanese Patent Application No. 64-16882
[發明所要解決的課題] 專利文獻1中記載了,藉由添加上述松香系樹脂等黏著賦予樹脂,可進而提高黏著性組成物的黏著性。然而,如專利文獻1中亦有所記載,若添加上述黏著賦予樹脂,則黏著性組成物的透明性會降低。[Problems to be solved by the invention] Patent document 1 states that by adding a tackifier resin such as the above-mentioned rosin-based resin, the tackiness of the adhesive composition can be further improved. However, as also stated in patent document 1, if the above-mentioned tackifier resin is added, the transparency of the adhesive composition is reduced.
本發明是鑒於上述事由而成者,其目的在於提供一種能夠得到具有充分的黏著性且透明性高的薄膜狀黏著層的黏著性組成物、及對該黏著性組成物進行加工而成的黏著性加工品。 [用於解決課題的手段]The present invention is made in view of the above circumstances, and its purpose is to provide an adhesive composition capable of obtaining a thin film adhesive layer having sufficient adhesiveness and high transparency, and an adhesive processed product obtained by processing the adhesive composition. [Means for Solving the Problem]
本發明者等人進行了銳意探討,結果發現藉由以下的構成可解決上述課題。即本發明是有關於以下的[1]~[6]。 [1] 一種黏著性組成物,含有47質量份以上且99質量份以下的(甲基)丙烯酸樹脂(A)、0.5質量份以上且50質量份以下的不同於(甲基)丙烯酸樹脂(A)的(共)聚合物(B)、及0.5質量份以上且3質量份以下的交聯劑(C)(其中,將(甲基)丙烯酸樹脂(A)、(共)聚合物(B)及交聯劑(C)的含量合計設為100質量份。), 所述(甲基)丙烯酸樹脂(A)滿足下述(A-1)及(A-2),且 所述(共)聚合物(B)滿足下述(B-1)~(B-5)的全部。 (A-1)含有源自具有碳數為1以上且12以下的烷基的(甲基)丙烯酸酯的結構單元、及源自含有羥基的(甲基)丙烯酸酯的結構單元。 (A-2)利用示差掃描熱量計(DSC)測定到的玻璃轉變溫度(Tg)位於-80℃以上且0℃以下的範圍。 (B-1)相對於其結構單元的總量,含有20莫耳%以上的源自異丙烯基甲苯的結構單元。 (B-2)依照JIS K2207測定到的軟化點位於90℃以上且130℃以下的範圍。 (B-3)利用示差掃描熱量計(DSC)測定到的玻璃轉變溫度(Tg)位於40℃以上且80℃以下的範圍。 (B-4)利用凝膠滲透層析法(GPC)測定到的聚苯乙烯換算的分子量為400以下的化合物的含有率為10質量%以下。 (B-5)利用凝膠滲透層析法(GPC)測定到的聚苯乙烯換算的數量平均分子量(Mn)位於750以上且1000以下的範圍,z平均分子量(Mz)位於1200以上且2000以下的範圍,且重量平均分子量(Mw)和數量平均分子量(Mn)的比即分散度(Mw/Mn)為1.5以下。 [2] 如[1]所述的黏著性組成物,其中所述(共)聚合物(B)滿足下述(B-6)。 (B-6)相對於其結構單元的總量,含有1莫耳%以上且80莫耳%以下的源自選自由苯乙烯、α-甲基苯乙烯、茚、乙烯基甲苯及碳數4或5的不飽和脂肪族烴化合物所組成的群組中的單體的結構單元。 [3] 一種黏著性加工品,其為膠帶、標籤、片或雙面膠帶,且是對如[1]或[2]所述的黏著性組成物進行加工而成。 [4] 如[3]所述的黏著性加工品,具有厚度為5μm以上且50μm以下的黏著層。 [5] 如[3]或[4]所述的黏著性加工品,其中依照JIS K7361測定到的總光線透射率為87%以上。 [6] 如[3]~[5]中任一項所述的黏著性加工品,其中將SUS用於被接著體,並藉由180°剝離試驗測定到的黏著力為9N/25mm以上。 [發明的效果]The inventors of the present invention have conducted intensive research and found that the above-mentioned problem can be solved by the following structure. That is, the present invention is related to the following [1] to [6]. [1] An adhesive composition comprising 47 parts by mass or more and 99 parts by mass or less of a (meth)acrylic resin (A), 0.5 parts by mass or more and 50 parts by mass or less of a (co)polymer (B) different from the (meth)acrylic resin (A), and 0.5 parts by mass or more and 3 parts by mass or less of a crosslinking agent (C) (wherein the total content of the (meth)acrylic resin (A), the (co)polymer (B) and the crosslinking agent (C) is set to 100 parts by mass), the (meth)acrylic resin (A) satisfies the following (A-1) and (A-2), and the (co)polymer (B) satisfies all of the following (B-1) to (B-5). (A-1) Contains structural units derived from (meth)acrylates having an alkyl group having 1 to 12 carbon atoms and structural units derived from (meth)acrylates containing a hydroxyl group. (A-2) The glass transition temperature (Tg) measured by a differential scanning calorimeter (DSC) is in the range of -80°C to 0°C. (B-1) Contains structural units derived from isopropenyltoluene in an amount of 20 mol% or more relative to the total amount of its structural units. (B-2) The softening point measured in accordance with JIS K2207 is in the range of 90°C to 130°C. (B-3) The glass transition temperature (Tg) measured by a differential scanning calorimeter (DSC) is in the range of 40°C to 80°C. (B-4) The content of compounds having a molecular weight of 400 or less in terms of polystyrene measured by gel permeation chromatography (GPC) is 10% by mass or less. (B-5) The number average molecular weight (Mn) in terms of polystyrene measured by gel permeation chromatography (GPC) is in the range of 750 to 1000, the z average molecular weight (Mz) is in the range of 1200 to 2000, and the ratio of the weight average molecular weight (Mw) to the number average molecular weight (Mn), i.e. the dispersion (Mw/Mn), is 1.5 or less. [2] The adhesive composition as described in [1], wherein the (co)polymer (B) satisfies the following (B-6). (B-6) Contains 1 mol% or more and 80 mol% or less of structural units derived from monomers selected from the group consisting of styrene, α-methylstyrene, indene, vinyltoluene and unsaturated aliphatic hydrocarbon compounds having 4 or 5 carbon atoms, relative to the total amount of its structural units. [3] An adhesive processed product, which is a tape, a label, a sheet or a double-sided tape, and is obtained by processing the adhesive composition described in [1] or [2]. [4] The adhesive processed product described in [3], having an adhesive layer having a thickness of 5 μm or more and 50 μm or less. [5] The adhesive processed product described in [3] or [4], wherein the total light transmittance measured in accordance with JIS K7361 is 87% or more. [6] An adhesive product as described in any one of [3] to [5], wherein SUS is used as the adherend and the adhesive force measured by a 180° peel test is 9N/25mm or more. [Effect of the invention]
根據本發明,提供一種能夠得到具有充分的黏著性且透明性高的薄膜狀黏著層的黏著性組成物、及對該黏著性組成物進行加工而成的黏著性加工品。According to the present invention, there are provided an adhesive composition capable of obtaining a film-like adhesive layer having sufficient adhesiveness and high transparency, and an adhesive processed product obtained by processing the adhesive composition.
本發明的一實施形態是有關於含有(甲基)丙烯酸樹脂(A)、(共)聚合物(B)、及交聯劑(C)的黏著性組成物。再者,本說明書中,(甲基)丙烯酸是指「丙烯酸或甲基丙烯酸」,(甲基)丙烯酸酯是指「丙烯酸酯或甲基丙烯酸酯」,(共)聚合物是指「單獨聚合物或共聚合物」。One embodiment of the present invention relates to an adhesive composition containing a (meth)acrylic acid resin (A), a (co)polymer (B), and a crosslinking agent (C). In this specification, (meth)acrylic acid refers to "acrylic acid or methacrylic acid", (meth)acrylate refers to "acrylate or methacrylate", and (co)polymer refers to "a single polymer or a copolymer".
[(甲基)丙烯酸樹脂(A)] (甲基)丙烯酸樹脂(A)為丙烯酸系單體或甲基丙烯酸系單體的(共)聚合物。[(Meth)acrylic resin (A)] (Meth)acrylic resin (A) is a (co)polymer of acrylic monomers or methacrylic monomers.
(甲基)丙烯酸樹脂(A)滿足以下的要件(A-1)及(A-2)。The (meth)acrylic resin (A) satisfies the following requirements (A-1) and (A-2).
(A-1)含有源自具有碳數為1以上且12以下的烷基的(甲基)丙烯酸酯的結構單元、及源自含有羥基的(甲基)丙烯酸酯的結構單元。 (A-2)利用示差掃描熱量計(DSC)測定到的玻璃轉變溫度(Tg)位於-80℃以上且0℃以下的範圍。(A-1) Contains a structural unit derived from a (meth)acrylate having an alkyl group having 1 or more and 12 or less carbon atoms, and a structural unit derived from a (meth)acrylate containing a hydroxyl group. (A-2) The glass transition temperature (Tg) measured by a differential scanning calorimeter (DSC) is in the range of -80°C or more and 0°C or less.
(針對要件(A-1)) 要件(A-1)為用於提高本實施形態的黏著性組成物的黏著性的要件。(Regarding requirement (A-1)) Requirement (A-1) is a requirement for improving the adhesiveness of the adhesive composition of this embodiment.
具體而言,若(甲基)丙烯酸樹脂(A)含有源自具有碳數為1以上且12以下的烷基的(甲基)丙烯酸酯的結構單元,則(甲基)丙烯酸樹脂(A)的玻璃轉變溫度(Tg)變高,黏著性組成物的黏著性進而提高。Specifically, when the (meth)acrylic resin (A) contains a structural unit derived from a (meth)acrylate having an alkyl group having 1 to 12 carbon atoms, the glass transition temperature (Tg) of the (meth)acrylic resin (A) becomes higher, and the adhesiveness of the adhesive composition is further improved.
就上述觀點而言,上述具有碳數為1以上且12以下的烷基的(甲基)丙烯酸酯較佳為具有碳數為1以上且10以下的烷基的(甲基)丙烯酸酯,更佳為具有碳數為2以上且8以下的烷基的(甲基)丙烯酸酯。再者,上述烷基可為直鏈狀,亦可具有分支。From the above viewpoint, the (meth)acrylate having an alkyl group with a carbon number of 1 to 12 is preferably a (meth)acrylate having an alkyl group with a carbon number of 1 to 10, and more preferably a (meth)acrylate having an alkyl group with a carbon number of 2 to 8. The alkyl group may be linear or branched.
上述具有碳數為1以上且12以下的烷基的(甲基)丙烯酸酯的例子包含(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸正丙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸癸酯、及(甲基)丙烯酸月桂酯等。Examples of the (meth)acrylate having an alkyl group having 1 to 12 carbon atoms include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, octyl (meth)acrylate, isooctyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, decyl (meth)acrylate, and lauryl (meth)acrylate.
(甲基)丙烯酸樹脂(A)中,相對於其結構單元的總量的上述源自具有碳數為1以上且12以下的烷基的(甲基)丙烯酸酯的結構單元的含量較佳為50莫耳%以上且99莫耳%以下,更佳為55莫耳%以上且95莫耳%以下,進而佳為60莫耳%以上且90莫耳%以下。In the (meth)acrylic resin (A), the content of the structural unit derived from the (meth)acrylate having an alkyl group having 1 to 12 carbon atoms relative to the total amount of the structural unit is preferably 50 mol % to 99 mol %, more preferably 55 mol % to 95 mol %, and even more preferably 60 mol % to 90 mol %.
另外,若(甲基)丙烯酸樹脂(A)含有源自含有羥基的(甲基)丙烯酸酯的結構單元,則交聯劑(C)所產生的交聯點增加,因此黏著性組成物的交聯密度會提高,從而容易進行高分子量化。這樣的黏著性組成物即使被壓接,亦難以追隨被接著體表面,難以產生壓接時的黏著性的降低。In addition, if the (meth)acrylic resin (A) contains a structural unit derived from a (meth)acrylate containing a hydroxyl group, the crosslinking points generated by the crosslinking agent (C) increase, so the crosslinking density of the adhesive composition increases, making it easy to increase the molecular weight. Such an adhesive composition is unlikely to follow the surface of the adherend even when it is press-bonded, and the adhesiveness is unlikely to decrease during press-bonding.
上述含有羥基的(甲基)丙烯酸酯的例子包含(甲基)丙烯酸羥基乙酯、(甲基)丙烯酸羥基丙酯及N-羥甲基(甲基)丙烯醯胺等。該些中,就上述觀點而言,上述含有羥基的(甲基)丙烯酸酯較佳為(甲基)丙烯酸羥基乙酯。Examples of the hydroxyl group-containing (meth)acrylate include hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, and N-hydroxymethyl (meth)acrylamide, etc. Among these, from the above viewpoint, the hydroxyl group-containing (meth)acrylate is preferably hydroxyethyl (meth)acrylate.
(甲基)丙烯酸樹脂(A)中,相對於其結構單元的總量的上述源自含有羥基的(甲基)丙烯酸酯的結構單元的含量較佳為0.1莫耳%以上且5莫耳%以下,更佳為0.2莫耳%以上且3莫耳%以下,進而佳為0.3莫耳%以上且2莫耳%以下。In the (meth)acrylic resin (A), the content of the structural unit derived from the hydroxyl group-containing (meth)acrylate relative to the total amount of its structural units is preferably 0.1 mol % to 5 mol %, more preferably 0.2 mol % to 3 mol %, and even more preferably 0.3 mol % to 2 mol %.
再者,(甲基)丙烯酸樹脂(A)亦可為如下共聚合物:具有源自不同於上述具有碳數為1以上且12以下的烷基的(甲基)丙烯酸酯或含有羥基的(甲基)丙烯酸酯的、具有可形成交聯的官能基的單體(或寡聚物)的結構單元。上述具有可形成交聯的官能基的單體的例子包含(甲基)丙烯酸、及(甲基)丙烯醯胺等。Furthermore, the (meth)acrylic resin (A) may be a copolymer having a structural unit derived from a monomer (or oligomer) having a functional group capable of forming a crosslink, which is different from the above-mentioned (meth)acrylic acid ester having an alkyl group having 1 to 12 carbon atoms or the above-mentioned (meth)acrylic acid ester containing a hydroxyl group. Examples of the above-mentioned monomer having a functional group capable of forming a crosslink include (meth)acrylic acid and (meth)acrylamide.
另外,(甲基)丙烯酸樹脂(A)視需要亦可設為具有源自上述以外的乙烯基系單體的結構單元的共聚合物。這種乙烯基系單體的例子包含苯乙烯、及乙酸乙烯酯等。In addition, the (meth)acrylic resin (A) may be a copolymer having a structural unit derived from a vinyl monomer other than the above, as required. Examples of such vinyl monomers include styrene and vinyl acetate.
(針對要件(A-2)) 要件(A-2)為用於在更寬廣的溫度範圍適當發揮本實施形態的黏著性組成物的黏著性的要件。(Regarding requirement (A-2)) Requirement (A-2) is a requirement for the adhesive composition of this embodiment to properly exhibit its adhesiveness in a wider temperature range.
具體而言,若(甲基)丙烯酸樹脂(A)為利用示差掃描熱量計(DSC)測定到的玻璃轉變溫度(Tg)位於-80℃以上且0℃以下的範圍的共聚合物,則能夠使製成薄膜狀黏著層的黏著性組成物在寬廣的溫度範圍顯現黏著性。就上述觀點而言,(甲基)丙烯酸樹脂(A)的玻璃轉變溫度(Tg)較佳為位於-70℃以上且-5℃以下的範圍,更佳為位於-60℃以上且-10℃以下的範圍。Specifically, if the (meth)acrylic resin (A) is a copolymer having a glass transition temperature (Tg) in the range of -80°C to 0°C as measured by a differential scanning calorimeter (DSC), the adhesive composition formed into a film-shaped adhesive layer can exhibit adhesiveness in a wide temperature range. From the above viewpoints, the glass transition temperature (Tg) of the (meth)acrylic resin (A) is preferably in the range of -70°C to -5°C, and more preferably in the range of -60°C to -10°C.
(甲基)丙烯酸樹脂(A)的玻璃轉變溫度(Tg)能夠藉由改變進行聚合的單體、其比率而調整至上述範圍。The glass transition temperature (Tg) of the (meth)acrylic resin (A) can be adjusted to the above range by changing the monomers to be polymerized and their ratios.
本發明中,(甲基)丙烯酸系樹脂(A)的玻璃轉變溫度(Tg)能夠根據藉由以下的FOX的式子求出的理論計算值而算出。 1/Tg=W1/Tg1+W2/Tg2+・・・+Wn/Tgn (式中,Tg為丙烯酸系樹脂(A)的玻璃轉變溫度(K),W1、W2、・・・、Wn為各單體的重量分率,Tg1、Tg2、・・・、Tgn為各單體的均聚合物的玻璃轉變溫度) 用於上述計算的均聚合物的玻璃轉變溫度能夠使用文獻中記載的值。In the present invention, the glass transition temperature (Tg) of the (meth) acrylic resin (A) can be calculated from the theoretically calculated value obtained by the following FOX formula. 1/Tg=W1/Tg1+W2/Tg2+・・・+Wn/Tgn (wherein, Tg is the glass transition temperature (K) of the acrylic resin (A), W1, W2, ・・・, and Wn are the weight fractions of each monomer, and Tg1, Tg2, ・・・, and Tgn are the glass transition temperatures of the homopolymers of each monomer) The glass transition temperature of the homopolymer used for the above calculation can use the value described in the literature.
(合成法) (甲基)丙烯酸樹脂(A)能夠使用成為上述各結構單元的材料的單體(或寡聚物),並藉由公知的聚合方法合成。上述聚合方法若為包含塊狀聚合法、溶液聚合法、及懸浮聚合法等的自由基聚合法,則無特別限定。該些中,由於容易控制(甲基)丙烯酸樹脂(A)的玻璃轉變溫度(Tg)和其他特性,且容易合成具有期望的特性的(甲基)丙烯酸樹脂(A),因此較佳為溶液聚合法。(Synthesis method) (Meth)acrylic resin (A) can be synthesized by a known polymerization method using a monomer (or oligomer) of a material that becomes each of the above-mentioned structural units. The above-mentioned polymerization method is not particularly limited as long as it is a free radical polymerization method including a block polymerization method, a solution polymerization method, and a suspension polymerization method. Among these, the solution polymerization method is preferred because it is easy to control the glass transition temperature (Tg) and other properties of the (meth)acrylic resin (A) and it is easy to synthesize a (meth)acrylic resin (A) having desired properties.
聚合時亦可使用聚合起始劑。上述聚合起始劑的例子包含二枯基過氧化物、苯甲醯過氧化物、第三丁基過氧-2-乙基己酸酯、1,1-雙(第三丁基過氧)環己烷、α,α’-偶氮雙異丁腈、過氧化乙醯酯、第三丁基過氧新戊酸酯、第三丁基氫過氧化物、異丙苯氫過氧化物、第三己基過氧新戊酸酯、2,2’-偶氮雙-(2,4-二甲基戊腈)、月桂醯基過氧化物、第三丁基過氧新己酸酯、過氧化-二-第三丁酯、偶氮二環己基腈酯、α,α-偶氮二異酪酸二甲酯、琥珀酸過氧化物、二異丙苯過氧化物、及二氯過氧化苯甲醯等。A polymerization initiator may also be used during the polymerization. Examples of the polymerization initiator include dicumyl peroxide, benzoyl peroxide, tert-butyl peroxy-2-ethylhexanoate, 1,1-bis(tert-butylperoxy)cyclohexane, α,α'-azobisisobutyronitrile, acetyl peroxide, tert-butyl peroxypivalate, tert-butyl hydroperoxide, isopropyl hydroperoxide, tert-hexyl peroxypivalate, 2,2'-azobis-(2,4-dimethylvaleronitrile), lauryl peroxide, tert-butyl peroxyneohexanoate, di-tert-butyl peroxide, azobiscyclohexyl nitrile, α,α-azobisisobutyric acid dimethyl ester, succinic acid peroxide, diisopropylbenzene peroxide, and dichloroperoxybenzoyl.
用於上述溶液聚合的溶媒的例子包含乙酸乙酯、乙酸丁酯、苯、甲苯、二甲苯、環己烷、及甲基乙基酮等。Examples of the solvent used for the solution polymerization include ethyl acetate, butyl acetate, benzene, toluene, xylene, cyclohexane, and methyl ethyl ketone.
[(共)聚合物(B)] (共)聚合物(B)為不同於(甲基)丙烯酸樹脂(A)的(共)聚合物,且為滿足下述(B-1)~(B-5)的全部的(共)聚合物。[(Co)polymer (B)] (Co)polymer (B) is a (co)polymer different from (meth)acrylic resin (A) and satisfies all of the following (B-1) to (B-5).
(B-1)相對於其結構單元的總量,含有20莫耳%以上的源自異丙烯基甲苯的結構單元。 (B-2)依照JIS K2207測定到的軟化點位於90℃以上且130℃以下的範圍。 (B-3)利用示差掃描熱量計(DSC)測定到的玻璃轉變溫度(Tg)位於40℃以上且80℃以下的範圍。 (B-4)利用凝膠滲透層析法(GPC)測定到的聚苯乙烯換算的分子量為400以下的化合物的含有率為10質量%以下。 (B-5)利用凝膠滲透層析法(GPC)測定到的聚苯乙烯換算的數量平均分子量(Mn)位於750以上且1000以下的範圍,z平均分子量(Mz)位於1200以上且2000以下的範圍,且重量平均分子量(Mw)和數量平均分子量(Mn)的比即分散度(Mw/Mn)為1.5以下。(B-1) Contains 20 mol% or more of structural units derived from isopropenyltoluene relative to the total amount of its structural units. (B-2) The softening point measured in accordance with JIS K2207 is within the range of 90°C or more and 130°C or less. (B-3) The glass transition temperature (Tg) measured by differential scanning calorimetry (DSC) is within the range of 40°C or more and 80°C or less. (B-4) The content of compounds having a molecular weight of 400 or less in terms of polystyrene measured by gel permeation chromatography (GPC) is 10% by mass or less. (B-5) The polystyrene-equivalent number average molecular weight (Mn) measured by gel permeation chromatography (GPC) is in the range of 750 to 1000, the z-average molecular weight (Mz) is in the range of 1200 to 2000, and the ratio of the weight average molecular weight (Mw) to the number average molecular weight (Mn), i.e., the dispersion (Mw/Mn), is 1.5 or less.
(針對要件(B-1)) 要件(B-1)為用於不使本實施形態的黏著性組成物的透明性降低,而提高黏著性的要件。(Regarding requirement (B-1)) Requirement (B-1) is a requirement for improving the adhesiveness of the adhesive composition of this embodiment without reducing the transparency.
儘管該理由並不確定,但認為其原因在於若(共)聚合物(B)相對於其結構單元的總量,含有20莫耳%以上的源自異丙烯基甲苯(包含鄰異丙烯基甲苯、間異丙烯基甲苯、對異丙烯基甲苯的同位素)的結構單元,則(甲基)丙烯酸樹脂(A)與(共)聚合物(B)容易相容,(共)聚合物(B)容易微分散於(甲基)丙烯酸樹脂(A)中。包含源自異丙烯基甲苯的結構單元的(共)聚合物(B)的溶解度參數(SP值)成為8.7~8.9,與(甲基)丙烯酸樹脂的SP值(8.6~9.1)的SP值差變小,因此推定容易和(甲基)丙烯酸樹脂(A)相容。Although the reason is not certain, it is considered that the reason is that when the (co)polymer (B) contains 20 mol% or more of structural units derived from isopropenyltoluene (including isotopes of o-isopropenyltoluene, m-isopropenyltoluene, and p-isopropenyltoluene) relative to the total amount of its structural units, the (meth)acrylic resin (A) and the (co)polymer (B) are easily compatible, and the (co)polymer (B) is easily finely dispersed in the (meth)acrylic resin (A). The solubility parameter (SP value) of the (co)polymer (B) containing structural units derived from isopropenyltoluene becomes 8.7 to 8.9, and the SP value difference with the SP value (8.6 to 9.1) of the (meth)acrylic resin becomes small, so it is estimated that it is easily compatible with the (meth)acrylic resin (A).
(共)聚合物(B)中,相對於其結構單元的總量的源自異丙烯基甲苯的結構單元的含量較佳為50莫耳%以上,更佳為70莫耳%以上,進而佳為85莫耳%以上。上述源自異丙烯基甲苯的結構單元的含量的上限無特別限定,能夠設為100莫耳%以下,較佳為98莫耳%以下,更佳為96莫耳%以下,更佳為未滿95莫耳%。In the (co)polymer (B), the content of the structural unit derived from isopropenyltoluene relative to the total amount of its structural units is preferably 50 mol% or more, more preferably 70 mol% or more, and further preferably 85 mol% or more. The upper limit of the content of the structural unit derived from isopropenyltoluene is not particularly limited, and can be set to 100 mol% or less, preferably 98 mol% or less, more preferably 96 mol% or less, and more preferably less than 95 mol%.
(針對要件(B-2)) 要件(B-2)為用於使本實施形態的黏著性組成物的黏度成為對基材的塗佈性優異的程度的要件。(Regarding requirement (B-2)) Requirement (B-2) is a requirement for making the viscosity of the adhesive composition of this embodiment to be excellent in coating properties on a substrate.
具體而言,若(共)聚合物(B)的利用示差掃描熱量計(DSC)測定到的軟化點位於90℃以上且130℃以下的範圍,則尤其是包含溶媒的黏著性組成物具有適度的黏度,因此能夠更容易進行黏著性組成物對基材的塗佈。就上述觀點而言,(共)聚合物(B)的軟化點較佳為位於95℃以上且125℃以下的範圍,更佳為位於100℃以上且120℃以下的範圍,進而佳為位於105℃以上且115℃以下的範圍。Specifically, if the softening point of the (co)polymer (B) measured by differential scanning calorimetry (DSC) is in the range of 90°C to 130°C, the adhesive composition containing the solvent has a suitable viscosity, so that the adhesive composition can be more easily applied to the substrate. From the above viewpoints, the softening point of the (co)polymer (B) is preferably in the range of 95°C to 125°C, more preferably in the range of 100°C to 120°C, and further preferably in the range of 105°C to 115°C.
上述(共)聚合物(B)的軟化點能夠藉由調整進行共聚合的單體種類、分子量、分子量分佈來調整至上述範圍。The softening point of the (co)polymer (B) can be adjusted to the above range by adjusting the type, molecular weight and molecular weight distribution of the monomers to be copolymerized.
(針對要件(B-3)) 要件(B-3)為用於一面提高本實施形態的黏著性組成物的耐熱性,一面將透明性及黏著性兩者調整到適當範圍的要件。(Regarding requirement (B-3)) Requirement (B-3) is a requirement for improving the heat resistance of the adhesive composition of this embodiment while adjusting both transparency and adhesiveness to an appropriate range.
具體而言,若(共)聚合物(B)的依照JIS K2207測定到的玻璃轉變溫度(Tg)為40℃以上,則黏著性組成物的耐熱性進而提高。另外,若(共)聚合物(B)的玻璃轉變溫度(Tg)為80℃以下,則黏著性組成物的透明性及黏著性兩者容易成為適當範圍。就上述觀點而言,(共)聚合物(B)的玻璃轉變溫度(Tg)較佳為位於45℃以上且78℃以下的範圍,更佳為位於50℃以上且75℃以下的範圍,進而佳為位於55℃以上且70℃以下的範圍。Specifically, if the glass transition temperature (Tg) of the (co)polymer (B) measured in accordance with JIS K2207 is 40°C or higher, the heat resistance of the adhesive composition is further improved. In addition, if the glass transition temperature (Tg) of the (co)polymer (B) is 80°C or lower, the transparency and adhesion of the adhesive composition are both likely to be within an appropriate range. From the above viewpoints, the glass transition temperature (Tg) of the (co)polymer (B) is preferably in the range of 45°C or higher and 78°C or lower, more preferably in the range of 50°C or higher and 75°C or lower, and further preferably in the range of 55°C or higher and 70°C or lower.
上述(共)聚合物(B)的玻璃轉變溫度(Tg)能夠藉由調整進行共聚合的單體種類、分子量、分子量分佈來調整至上述範圍。The glass transition temperature (Tg) of the (co)polymer (B) can be adjusted to the above range by adjusting the type, molecular weight, and molecular weight distribution of the monomers to be copolymerized.
本發明中,(共)聚合物(B)的玻璃轉變溫度(Tg)能夠根據藉由上述FOX的式子求出的理論計算值而算出。In the present invention, the glass transition temperature (Tg) of the (co)polymer (B) can be calculated from the theoretically calculated value obtained by the above-mentioned FOX formula.
(針對要件(B-4)) 要件(B-4)為用於進而提高本實施形態的黏著性組成物的黏著性及耐熱性的要件。(Regarding requirement (B-4)) Requirement (B-4) is a requirement for further improving the adhesiveness and heat resistance of the adhesive composition of this embodiment.
具體而言,若(共)聚合物(B)的利用凝膠滲透層析法(GPC)測定到的聚苯乙烯換算的分子量為400以下的化合物的含有率為10質量%以下,則極低分子量成分的含有率變低,因此能夠在維持黏著性組成物的黏著性的情況下,進而提高耐熱性。就上述觀點而言,(共)聚合物(B)的上述分子量為400以下的化合物的含有率較佳為8質量%以下,更佳為6質量%以下。上述分子量為400以下的化合物的含有率的下限無特別限定,能夠設為0質量%(測定極限)以上。Specifically, if the content of compounds having a molecular weight of 400 or less in terms of polystyrene measured by gel permeation chromatography (GPC) in the (co)polymer (B) is 10% by mass or less, the content of extremely low molecular weight components is reduced, thereby being able to further improve heat resistance while maintaining the adhesiveness of the adhesive composition. From the above viewpoint, the content of compounds having a molecular weight of 400 or less in the (co)polymer (B) is preferably 8% by mass or less, and more preferably 6% by mass or less. The lower limit of the content of compounds having a molecular weight of 400 or less is not particularly limited, and can be set to 0% by mass (measurement limit) or more.
分子量為400以下的化合物的含有率能夠藉由以下方式測定:在藉由將四氫呋喃設為溶媒的GPC法(凝膠滲透層析法),並利用聚苯乙烯換算測定到的積分分子量分佈曲線中,藉由積分算出分子量為400以下的曲線和基底線之間的區域的面積。The content of compounds having a molecular weight of 400 or less can be determined by calculating the area of the region between the curve for compounds having a molecular weight of 400 or less and the base line by integrating the integrated molecular weight distribution curve measured by polystyrene conversion using the GPC method (gel permeation chromatography) method using tetrahydrofuran as a solvent.
上述(共)聚合物(B)的分子量為400以下的化合物的含有率能夠藉由在加熱溫度250℃以下對(共)聚合物(B)進行減壓蒸餾,來調整至上述範圍。The content of the compound having a molecular weight of 400 or less in the (co)polymer (B) can be adjusted to the above range by distilling the (co)polymer (B) under reduced pressure at a heating temperature of 250° C. or less.
(針對要件(B-5)) 要件(B-5)為用於不使本實施形態的黏著性組成物的透明性降低,而提高黏著性的要件。(Regarding requirement (B-5)) Requirement (B-5) is a requirement for improving the adhesiveness of the adhesive composition of this embodiment without reducing the transparency.
具體而言,(共)聚合物(B)的利用凝膠滲透層析法(GPC)測定到的聚苯乙烯換算的數量平均分子量(Mn)位於750以上且1000以下的範圍,z平均分子量(Mz)位於1200以上且2000以下的範圍,且重量平均分子量(Mw)與數量平均分子量(Mn)的比即分散度(Mw/Mn)為1.5以下。滿足要件(B-5)的(共)聚合物(B)的分子量相對小,因而推定會提高黏著性組成物對基材的潤濕性,並提高黏著性組成物的黏著性。另外,滿足要件(B-5)的(共)聚合物(B)的分子量不均小,因此推定容易與(甲基)丙烯酸樹脂(A)相容,而能夠得到透明性更高的黏著性組成物。Specifically, the number average molecular weight (Mn) of the (co)polymer (B) measured by gel permeation chromatography (GPC) in terms of polystyrene is within the range of 750 to 1000, the z average molecular weight (Mz) is within the range of 1200 to 2000, and the ratio of the weight average molecular weight (Mw) to the number average molecular weight (Mn), i.e., the dispersion (Mw/Mn), is 1.5 or less. The molecular weight of the (co)polymer (B) satisfying the requirement (B-5) is relatively small, and thus it is estimated that the wettability of the adhesive composition to the substrate is improved, and the adhesiveness of the adhesive composition is improved. In addition, the molecular weight variation of the (co)polymer (B) satisfying the requirement (B-5) is small, and thus it is estimated that it is easily compatible with the (meth)acrylic resin (A), and an adhesive composition with higher transparency can be obtained.
就上述觀點而言,(共)聚合物(B)的上述數量平均分子量(Mn)較佳為770以上且980以下,更佳為790以上且950以下,進而佳為800以上且900以下。From the above viewpoints, the number average molecular weight (Mn) of the (co)polymer (B) is preferably 770 or more and 980 or less, more preferably 790 or more and 950 or less, and further preferably 800 or more and 900 or less.
另外,就上述觀點而言,(共)聚合物(B)的上述z平均分子量(Mz)較佳為1300以上且1900以下,更佳為1400以上且1800以下。From the above viewpoints, the z average molecular weight (Mz) of the (co)polymer (B) is preferably 1300 or more and 1900 or less, and more preferably 1400 or more and 1800 or less.
另外,就上述觀點而言,(共)聚合物(B)的上述重量平均分子量(Mw)與數量平均分子量(Mn)的比即分散度(Mw/Mn)較佳為1.45以下,更佳為1.4以下。上述Mw/Mn的下限值無特別限定,能夠設為1以上。In addition, from the above viewpoint, the ratio of the weight average molecular weight (Mw) to the number average molecular weight (Mn) of the (co)polymer (B), i.e., the dispersion (Mw/Mn), is preferably 1.45 or less, and more preferably 1.4 or less. The lower limit of the Mw/Mn is not particularly limited and can be set to 1 or more.
上述(共)聚合物(B)的數量平均分子量(Mn)、z平均分子量(Mz)、及重量平均分子量(Mw)與數量平均分子量(Mn)的比即分散度(Mw/Mn)能夠藉由進行共聚合的單體種類、進行減壓蒸餾來調整至上述範圍。The number average molecular weight (Mn), z average molecular weight (Mz), and the ratio of the weight average molecular weight (Mw) to the number average molecular weight (Mn), i.e., the dispersity (Mw/Mn), of the (co)polymer (B) can be adjusted to the above ranges by adjusting the type of monomers to be copolymerized and performing reduced pressure distillation.
(針對其他要件) (共)聚合物(B)較佳為進而滿足下述(B-6)的(共)聚合物。(Regarding other requirements) The (co)polymer (B) is preferably a (co)polymer further satisfying the following (B-6).
(B-6)含有1莫耳%以上且80莫耳%以下的源自選自由苯乙烯、α-甲基苯乙烯、茚、乙烯基甲苯及碳數4或5的不飽和脂肪族烴化合物所組成的群組中的單體的結構單元。(B-6) containing 1 mol% or more and 80 mol% or less of a structural unit derived from a monomer selected from the group consisting of styrene, α-methylstyrene, indene, vinyltoluene and an unsaturated aliphatic hydrocarbon compound having 4 or 5 carbon atoms.
源自該些單體的結構單元提高(共)聚合物(B)對於 (甲基)丙烯酸樹脂(A)的相容性,藉此能夠一面維持黏著性組成物的透明性,一面容易將(共)聚合物(B)的分子量分佈(Mw/Mn)調整到上述範圍。The structural units derived from these monomers improve the compatibility of the (co)polymer (B) with the (meth)acrylic resin (A), thereby making it possible to easily adjust the molecular weight distribution (Mw/Mn) of the (co)polymer (B) to the above range while maintaining the transparency of the adhesive composition.
上述碳數4或5的不飽和脂肪族烴化合物的例子包含作為主成分包含石油純化、分解時附加產生的碳數4或5的不飽和脂肪族烴化合物的C4 蒸餾成分及C5 蒸餾成分等。Examples of the unsaturated aliphatic hydrocarbon compounds having 4 or 5 carbon atoms include C4 distillate fractions and C5 distillate fractions containing, as main components, unsaturated aliphatic hydrocarbon compounds having 4 or 5 carbon atoms additionally generated during the purification and decomposition of petroleum.
上述C4 蒸餾成分及C5 蒸餾成分為常壓下的沸點範圍通常為-15~+45℃的蒸餾成分。上述C4 蒸餾成分及C5 蒸餾成分包含1-丁烯、異丁烯、2-丁烯、1,3-丁二烯、1-戊烯、2-甲基-1-丁烯、3-甲基-1-丁烯、2-戊烯、異戊二烯、1,3-戊二烯、及環戊二烯等聚合性單體。The C4 distillate and the C5 distillate are distillate components having a boiling point range of generally -15 to +45° C. at normal pressure. The C4 distillate and the C5 distillate contain polymerizable monomers such as 1-butene, isobutene, 2-butene, 1,3-butadiene, 1-pentene, 2-methyl-1-butene, 3-methyl-1-butene, 2-pentene, isoprene, 1,3-pentadiene, and cyclopentadiene.
上述C4 蒸餾成分及C5 蒸餾成分可直接使用包含製油所等中的原油等常壓蒸餾(直鎦)時附加產生的包含氣體蒸餾成分的輕質油蒸餾成分、石油的裂化或重整處理步驟中附加產生的同樣的輕質油蒸餾成分、及石油化學工廠中的石油石腦油分解等中所得的包含氣體的輕質油蒸餾成分等的石油蒸餾成分、或亦可施加蒸餾、萃取、其他處理而設為期望的蒸餾成分來使用。The C4 distillate and C5 distillate may be used directly as petroleum distillate components including light oil distillate components including gaseous distillate components generated by atmospheric distillation (direct distillation) of crude oil in oil refineries, light oil distillate components generated by cracking or reforming of petroleum, and light oil distillate components including gaseous distillate components obtained by decomposing petroleum naphtha in petrochemical plants, or may be used after distillation, extraction or other treatment to obtain desired distillate components.
就上述觀點而言,(共)聚合物(B)中,相對於其結構單元的總量的源自苯乙烯、α-甲基苯乙烯、茚、乙烯基甲苯或碳數4或5的不飽和脂肪族烴化合物的結構單元的含量較佳為2莫耳%以上且60莫耳%以下,更佳為4莫耳%以上且40莫耳%以下,進而佳為5莫耳%以上且20莫耳%以下。From the above viewpoints, in the (co)polymer (B), the content of structural units derived from styrene, α-methylstyrene, indene, vinyltoluene or unsaturated aliphatic hydrocarbon compounds having 4 or 5 carbon atoms, relative to the total amount of its structural units, is preferably from 2 mol % to 60 mol %, more preferably from 4 mol % to 40 mol %, and even more preferably from 5 mol % to 20 mol %.
(針對其他單體) (共)聚合物(B)亦可視需要設為具有源自上述異丙烯基甲苯等以外的其他單體的結構單元的共聚合物。藉由設為含有源自上述其他單體的結構單元的共聚合物,容易調整(共)聚合物(B)的軟化點及玻璃轉變溫度(Tg)等。(For other monomers) The (co)polymer (B) may also be a copolymer having structural units derived from other monomers other than the above-mentioned isopropenyltoluene, etc., as required. By using a copolymer containing structural units derived from the above-mentioned other monomers, it is easy to adjust the softening point and glass transition temperature (Tg) of the (co)polymer (B).
上述其他單體的例子包含乙烯基芳香族化合物、及碳數4或5以外的不飽和脂肪族烴化合物等。Examples of the other monomers include vinyl aromatic compounds and unsaturated aliphatic hydrocarbon compounds other than those having 4 or 5 carbon atoms.
上述乙烯基芳香族化合物的例子包含含有芳香環上具有取代基的經取代的苯乙烯、及芳香環上具有取代基的經取代的α-甲基苯乙烯等的苯乙烯系單體。上述芳香環所具有的取代基的例子包含碳數1以上且20以下的烷基、碳數1以上且20以下的烷氧基、碳數6以上且20以下的芳基、及鹵素原子等。上述乙烯基芳香族化合物可在芳香環上具有1個上述取代基,亦可在芳香環上具有2個以上的上述取代基。Examples of the vinyl aromatic compound include styrene monomers including substituted styrenes having substituents on the aromatic ring and substituted α-methylstyrene having substituents on the aromatic ring. Examples of the substituents on the aromatic ring include alkyl groups having 1 to 20 carbon atoms, alkoxy groups having 1 to 20 carbon atoms, aryl groups having 6 to 20 carbon atoms, and halogen atoms. The vinyl aromatic compound may have one substituent on the aromatic ring, or may have two or more substituents on the aromatic ring.
上述經取代的苯乙烯的具體例包含甲基苯乙烯(α-甲基苯乙烯除外)、乙基苯乙烯、2,4-二甲基苯乙烯、對正丁基苯乙烯、對第三丁基苯乙烯、對正己基苯乙烯、對正辛基苯乙烯、對正壬基苯乙烯、對正癸基苯乙烯、對正十二烷基苯乙烯、對甲氧基苯乙烯、對苯基苯乙烯、對氯苯乙烯、及3,4-二氯苯乙烯等。Specific examples of the above-mentioned substituted styrenes include methylstyrene (excluding α-methylstyrene), ethylstyrene, 2,4-dimethylstyrene, p-butylstyrene, p-tert-butylstyrene, p-hexylstyrene, p-octylstyrene, p-nonylstyrene, p-decylstyrene, p-dodecylstyrene, p-methoxystyrene, p-phenylstyrene, p-chlorostyrene, and 3,4-dichlorostyrene.
(合成法) (共)聚合物(B)能夠使用異丙烯基甲苯與任意共聚合的其他單體,並藉由公知的聚合方法來合成。上述聚合較佳為陽離子聚合,更佳為在弗里德爾工藝觸媒的存在下進行。(Synthesis method) The (co)polymer (B) can be synthesized by a known polymerization method using isopropenyltoluene and any other copolymerizable monomers. The above polymerization is preferably cationic polymerization, and more preferably carried out in the presence of a Friedel process catalyst.
上述弗里德爾工藝觸媒若為包含氯化鋁、溴化鋁、二氯單乙基鋁、四氯化鈦、四氯化錫、三氟化硼、及三氟化硼的醚錯合物或酚錯合物等各種錯合物等的公知的弗里德爾工藝觸媒,則無特別限定。該些中,較佳為三氟化硼的酚錯合物。相對於原料單體的合計100質量份,上述弗里德爾工藝觸媒的使用量能夠設為0.05質量份以上且5質量份以下,較佳為0.1質量份以上且2質量份以下。The Friedel process catalyst is not particularly limited as long as it is a known Friedel process catalyst including various complexes such as aluminum chloride, aluminum bromide, monoethylaluminum dichloride, titanium tetrachloride, tin tetrachloride, boron trifluoride, and ether complexes or phenol complexes of boron trifluoride. Among them, phenol complexes of boron trifluoride are preferred. The amount of the Friedel process catalyst used can be set to 0.05 mass parts or more and 5 mass parts or less, preferably 0.1 mass parts or more and 2 mass parts or less, relative to 100 mass parts of the total raw material monomers.
就去除聚合反應時產生的反應熱、抑制反應液黏度、調整分子量等觀點而言,聚合反應較佳為以原料單體的濃度成為10~60質量%左右的方式使用溶媒來進行。上述溶媒的例子包含含有戊烷、己烷、庚烷、及辛烷等的脂肪族烴;包含環戊烷、環己烷、及甲基環己烷等的脂環族烴;以及包含甲苯、二甲苯、乙基苯、及均三甲苯等的芳香族烴等。該些溶媒可單獨使用一種,亦可組合多種使用。From the viewpoints of removing the reaction heat generated during the polymerization reaction, suppressing the viscosity of the reaction liquid, and adjusting the molecular weight, the polymerization reaction is preferably carried out using a solvent in a manner such that the concentration of the raw material monomer is about 10 to 60 mass %. Examples of the above-mentioned solvent include aliphatic hydrocarbons such as pentane, hexane, heptane, and octane; alicyclic hydrocarbons such as cyclopentane, cyclohexane, and methylcyclohexane; and aromatic hydrocarbons such as toluene, xylene, ethylbenzene, and mesitylene. These solvents may be used alone or in combination.
上述聚合能夠在反應器內,在上述觸媒的存在下,且在上述溶媒中使原料單體進行聚合反應來進行。上述聚合亦能夠進行1段,較佳為分成多段進行。此時的聚合溫度根據原料組成、目標分子量區域等而不同,較佳為-50~+50℃。另外,此時的反應時間較佳為10分鐘~10小時。聚合結束後,使用包含鹼性水溶液、或甲醇等醇等的鹼性化合物分解觸媒,之後進行水洗,藉由剝離、蒸餾去除未反應的原料及溶媒等,而能夠得到目標(共)聚合物(B)。The above-mentioned polymerization can be carried out in a reactor, in the presence of the above-mentioned catalyst, and in the above-mentioned solvent by subjecting the raw material monomers to a polymerization reaction. The above-mentioned polymerization can also be carried out in one stage, but is preferably carried out in multiple stages. The polymerization temperature at this time varies depending on the raw material composition, the target molecular weight range, etc., and is preferably -50 to +50°C. In addition, the reaction time at this time is preferably 10 minutes to 10 hours. After the polymerization is completed, an alkaline compound including an alkaline aqueous solution or an alcohol such as methanol is used to decompose the catalyst, and then the catalyst is washed with water, and the unreacted raw materials and solvent are removed by stripping and distillation, so that the target (co)polymer (B) can be obtained.
上述未反應的原料及溶媒等的去除例如能夠藉由包含常壓蒸餾、減壓蒸餾、水蒸氣蒸餾等的利用每個物質的蒸氣壓差進行濃縮的操作;以及包含常壓柱及快速柱等的利用對於矽凝膠等填充劑的親和性、分子尺寸的差進行濃縮的方法來進行。該些中,就熱分解抑制、濃縮效率的觀點而言,較佳為減壓蒸餾。上述減壓的範圍無特別限定。另一方面,就抑制(共)聚合物(B)的熱分解的觀點而言,加熱溫度較佳為250℃以下,更佳為230℃以下,進而佳為210℃以下。The removal of the unreacted raw materials and solvents can be performed, for example, by operations including atmospheric distillation, reduced pressure distillation, water vapor distillation, etc., which utilize the vapor pressure difference of each substance for concentration; and methods including atmospheric pressure columns and rapid columns, etc., which utilize the affinity for fillers such as silica gel and the difference in molecular size for concentration. Among these, reduced pressure distillation is preferred from the perspective of thermal decomposition inhibition and concentration efficiency. The range of the above-mentioned pressure reduction is not particularly limited. On the other hand, from the perspective of inhibiting the thermal decomposition of the (co)polymer (B), the heating temperature is preferably below 250°C, more preferably below 230°C, and further preferably below 210°C.
[交聯劑(C)] 交聯劑(C)使(甲基)丙烯酸樹脂(A)交聯,進而提高本實施形態的黏著性組成物的黏著性。[Crosslinking agent (C)] The crosslinking agent (C) crosslinks the (meth)acrylic resin (A), thereby improving the adhesiveness of the adhesive composition of this embodiment.
交聯劑(C)的例子包含:包含山梨糖醇聚縮水甘油醚、聚甘油聚縮水甘油醚、季戊四醇聚縮水甘油醚、二甘油聚縮水甘油醚、甘油聚縮水甘油醚、新戊二醇二縮水甘油醚、及間苯二酚二縮水甘油醚等的環氧系化合物;包含四亞甲基二異氰酸酯、六亞甲基二異氰酸酯、三羥甲基丙烷的甲苯二異氰酸酯3加成物、及聚異氰酸酯等的異氰酸酯系化合物;包含三羥甲基丙烷-三-β-丙啶氮丙啶、四羥甲基甲烷-三-β-丙啶氮丙啶、N,N'-二苯基甲烷-4,4'-雙(1-氮丙啶羧基醯胺)、N,N'-六亞甲基-1,6-雙(1-氮丙啶羧基醯胺)、N,N'-甲苯-2,4-雙(1-氮丙啶羧基醯胺)、三羥甲基丙烷-三-β-(2-甲基氮丙啶)丙酸等的氮丙啶系化合物;以及包含六甲氧基羥甲基三聚氰胺等的三聚氰胺系化合物等。交聯劑(C)可單獨使用一種,亦可組合多種使用。Examples of the crosslinking agent (C) include: epoxy compounds including sorbitol polyglycidyl ether, polyglycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, diglycerol polyglycidyl ether, glycerol polyglycidyl ether, neopentyl glycol diglycidyl ether, and resorcinol diglycidyl ether; isocyanate compounds including tetramethylene diisocyanate, hexamethylene diisocyanate, trihydroxymethylpropane toluene diisocyanate triadduct, and polyisocyanate; trihydroxymethylpropane-tri-isocyanate ... Aziridine compounds such as β-propidium aziridine, tetrahydroxymethylmethane-tri-β-propidium aziridine, N,N'-diphenylmethane-4,4'-bis(1-aziridine carboxyamide), N,N'-hexamethylene-1,6-bis(1-aziridine carboxyamide), N,N'-toluene-2,4-bis(1-aziridine carboxyamide), trihydroxymethylpropane-tri-β-(2-methylaziridine) propionic acid; and melamine compounds including hexamethoxyhydroxymethylmelamine, etc. The crosslinking agent (C) may be used alone or in combination of two or more.
交聯劑(C)較佳為調配到交聯劑(C)中的能與(甲基)丙烯酸樹脂(A)結合的官能基數(當交聯劑(C)包含嵌段異氰酸酯時,包含因嵌段劑的解離而生成的官能基數。)不多於(甲基)丙烯酸樹脂(A)所具有的官能基數的程度,但在因交聯反應產生新的官能基時、交聯反應的進行緩慢時等,亦可調配更多量。The crosslinking agent (C) is preferably formulated such that the number of functional groups capable of bonding with the (meth)acrylic resin (A) (including the number of functional groups generated by the dissociation of the blocking agent when the crosslinking agent (C) contains blocked isocyanate) is not more than the number of functional groups possessed by the (meth)acrylic resin (A). However, a larger amount may be formulated when new functional groups are generated by the crosslinking reaction or when the crosslinking reaction proceeds slowly.
[含量比] 在將(甲基)丙烯酸樹脂(A)、(共)聚合物(B)及交聯劑(C)的含量的合計設為100質量份時,本實施形態的黏著性組成物含有47質量份以上且99質量份以下的(甲基)丙烯酸樹脂(A)、0.5質量份以上且50質量份以下的(共)聚合物(B)、及0.5質量份以上且3質量份以下的交聯劑(C)。[Content ratio] When the total content of the (meth)acrylic resin (A), the (co)polymer (B) and the crosslinking agent (C) is set to 100 parts by mass, the adhesive composition of this embodiment contains 47 parts by mass or more and 99 parts by mass or less of the (meth)acrylic resin (A), 0.5 parts by mass or more and 50 parts by mass or less of the (co)polymer (B), and 0.5 parts by mass or more and 3 parts by mass or less of the crosslinking agent (C).
若上述(甲基)丙烯酸樹脂(A)的含量為47質量份以上,則更多量的(甲基)丙烯酸樹脂(A)會含有於黏著性組成物中,黏著性組成物的交聯密度變得更高而進而進行高分子量化,因此難以產生黏著性組成物在壓接時追隨被接著體的表面而造成的黏著性的降低。若上述(甲基)丙烯酸樹脂(A)的含量為99質量份以下,則更多量的(共)聚合物(B)及交聯劑(C)會含有於黏著性組成物中,因此更能夠提高黏著性組成物的黏著性。就上述觀點而言,上述(甲基)丙烯酸樹脂(A)的含量較佳為57.2質量份以上且94質量份以下,更佳為62.5質量份以上且88.5質量份以下。If the content of the (meth)acrylic resin (A) is 47 parts by mass or more, a larger amount of the (meth)acrylic resin (A) is contained in the adhesive composition, and the crosslinking density of the adhesive composition becomes higher, and the molecular weight is further increased, so that it is difficult for the adhesive composition to follow the surface of the adherend during compression and cause a decrease in adhesiveness. If the content of the (meth)acrylic resin (A) is 99 parts by mass or less, a larger amount of the (co)polymer (B) and the crosslinking agent (C) are contained in the adhesive composition, so that the adhesiveness of the adhesive composition can be further improved. From the above viewpoints, the content of the (meth)acrylic resin (A) is preferably 57.2 parts by mass or more and 94 parts by mass or less, and more preferably 62.5 parts by mass or more and 88.5 parts by mass or less.
若上述(共)聚合物(B)的含量為0.5質量份以上,則更能夠提高黏著性組成物的黏著性。若上述(共)聚合物(B)的含量為50質量份以下,則更能夠提高黏著性組成物的透明性。就上述觀點而言,上述(共)聚合物(B)的含量較佳為5質量份以上且40質量份以下,更佳為10質量份以上且35質量份以下。If the content of the (co)polymer (B) is 0.5 parts by mass or more, the adhesiveness of the adhesive composition can be further improved. If the content of the (co)polymer (B) is 50 parts by mass or less, the transparency of the adhesive composition can be further improved. From the above viewpoints, the content of the (co)polymer (B) is preferably 5 parts by mass or more and 40 parts by mass or less, and more preferably 10 parts by mass or more and 35 parts by mass or less.
若上述交聯劑(C)的含量為0.5質量份以上,則黏著性組成物容易凝聚,而難以產生黏著性組成物在壓接後殘留於被接著體的表面、即所謂的糊殘留。若上述交聯劑(C)的含量為3質量份以下,則更多量的(甲基)丙烯酸樹脂(A)會含有於黏著性組成物中,黏著性組成物的交聯密度變得更高,進而進行高分子量化,因此難以產生黏著性組成物在壓接時追隨被接著體的表面所造成的黏著性的降低。就上述觀點而言,上述交聯劑(C)的含量較佳為1質量份以上且2.8質量份以下,更佳為1.5質量份以上且2.5質量份以下。If the content of the crosslinking agent (C) is 0.5 parts by mass or more, the adhesive composition is easy to aggregate, and it is difficult for the adhesive composition to remain on the surface of the adherend after compression, i.e., the so-called paste residue. If the content of the crosslinking agent (C) is 3 parts by mass or less, a larger amount of (meth) acrylic resin (A) will be contained in the adhesive composition, and the crosslinking density of the adhesive composition will become higher, and the molecular weight will be further increased, so it is difficult for the adhesive composition to follow the surface of the adherend during compression, resulting in a decrease in adhesion. From the above viewpoint, the content of the crosslinking agent (C) is preferably 1 part by mass or more and 2.8 parts by mass or less, and more preferably 1.5 parts by mass or more and 2.5 parts by mass or less.
再者,本實施形態的黏著性組成物較佳為實質上不含松香樹脂或萜烯樹脂。松香樹脂或萜烯樹脂會使黏著性組成物著色或變色。再者,為了抑制上述著色等,有時會將使松香樹脂或萜烯樹脂氫化而成的氫化樹脂用於黏著性組成物,但該些容易使黏著性的保持力降低。進而,松香樹脂或萜烯樹脂具有酸值,因此若使包含該些的黏著性組成物附著於金屬,則有使該金屬腐蝕之虞。Furthermore, the adhesive composition of the present embodiment preferably does not substantially contain rosin resin or terpene resin. Rosin resin or terpene resin may cause coloring or discoloration of the adhesive composition. Furthermore, in order to suppress the above-mentioned coloring, hydrogenated resins obtained by hydrogenating rosin resin or terpene resin are sometimes used in the adhesive composition, but these tend to reduce the adhesive retention. Furthermore, rosin resin or terpene resin has an acid value, so if the adhesive composition containing these is attached to metal, there is a risk of corroding the metal.
再者,「實質上不含」是指相對於黏著性組成物的總質量的松香樹脂或萜烯樹脂的含量為0.1質量%以下。Furthermore, "substantially free of" means that the content of the rosin resin or the terpene resin is 0.1 mass % or less relative to the total mass of the adhesive composition.
[製造方法] 本實施形態的黏著性組成物能夠以對應上述含量的調配量,連同任意使用的溶媒一起混合上述(甲基)丙烯酸樹脂(A)、(共)聚合物(B)及交聯劑(C)來製備。[Manufacturing method] The adhesive composition of this embodiment can be prepared by mixing the above-mentioned (meth) acrylic resin (A), (co) polymer (B) and crosslinking agent (C) in a formulation amount corresponding to the above-mentioned content together with an optional solvent.
上述溶媒的例子包含乙酸乙酯、乙酸丁酯、苯、甲苯、二甲苯、環己烷、及甲基乙基酮等。Examples of the solvent include ethyl acetate, butyl acetate, benzene, toluene, xylene, cyclohexane, and methyl ethyl ketone.
[用途] 本實施形態的黏著性組成物能夠以膠帶、標籤、片及雙面膠帶等黏著性加工品的形式用於要求黏著性的各種用途。[Application] The adhesive composition of this embodiment can be used in various applications requiring adhesive properties in the form of adhesive processed products such as tapes, labels, sheets, and double-sided tapes.
具體而言,上述黏著性加工品具有基材層與黏著層,上述黏著層包含本實施形態的黏著性組成物。Specifically, the adhesive processed product has a base layer and an adhesive layer, and the adhesive layer includes the adhesive composition of this embodiment.
上述黏著層的厚度無特別限定,但就對上述黏著性加工品賦予期望的黏著性、且降低對黏著性加工品的生產性的影響的觀點而言,較佳為5μm以上且50μm以下,更佳為5μm以上且40μm以下,進而佳為10μm以上且30μm以下。The thickness of the adhesive layer is not particularly limited, but from the perspective of imparting the desired adhesiveness to the adhesive processed product and reducing the impact on the productivity of the adhesive processed product, it is preferably greater than 5 μm and less than 50 μm, more preferably greater than 5 μm and less than 40 μm, and further preferably greater than 10 μm and less than 30 μm.
上述基材無特別限定,但在將上述黏著性加工品用於要求透明性的用途時,較佳為透明的樹脂膜。The substrate is not particularly limited, but is preferably a transparent resin film when the adhesive processed product is used for applications requiring transparency.
上述黏著性加工品具有包含上述黏著性組成物的黏著層,因此能夠具有高透明性。例如,當將基材設為透明的PET膜時,上述黏著性加工品能夠設為依照JIS K7361測定到的總光線透射率為87%以上的黏著性加工品。The adhesive product has an adhesive layer containing the adhesive composition, and thus can have high transparency. For example, when the substrate is a transparent PET film, the adhesive product can have a total light transmittance of 87% or more as measured in accordance with JIS K7361.
上述黏著性加工品具有包含上述黏著性組成物的黏著層,因此能夠具有高黏著性。例如,上述黏著性加工品能夠設為將SUS用於被接著體,並藉由180°剝離試驗測定到的黏著力為9N/25mm以上的黏著性加工品。The adhesive product has an adhesive layer containing the adhesive composition, and thus can have high adhesiveness. For example, the adhesive product can be an adhesive product in which SUS is used as a bonded body and the adhesive force measured by a 180° peel test is 9N/25mm or more.
上述黏著性加工品能夠藉由對基材的表面塗佈上述黏著性組成物,使經塗佈的上述黏著性組成物乾燥並使各成分交聯,而製作。The adhesive processed product can be produced by applying the adhesive composition to the surface of a substrate, drying the applied adhesive composition and cross-linking the components.
上述塗佈方法無特別限定,只要利用輥塗法、反向輥塗法、凹版輥法、棒塗法、缺角輪塗佈法、及模塗法等公知的方法塗佈即可。上述乾燥條件亦無特別限定,較佳為在80~200℃下乾燥10秒~10分鐘,更佳為在80~170℃下乾燥15秒~5分鐘。 [實施例]The coating method is not particularly limited, and any known method such as roller coating, reverse roller coating, gravure roller coating, rod coating, notch wheel coating, and die coating can be used. The drying conditions are also not particularly limited, and preferably, drying is performed at 80 to 200°C for 10 seconds to 10 minutes, and more preferably, drying is performed at 80 to 170°C for 15 seconds to 5 minutes. [Example]
以下使用實施例及比較例說明本發明,但本發明並不受以下實施例的任何限定。The present invention is described below using examples and comparative examples, but the present invention is not limited to the following examples.
[物性的測定] <結構單元的含有率> (共)聚合物(B1)~(共)聚合物(B3)的結構單元的含有比例(莫耳%)是藉由解析在以下的條件下測定到的13 C-NMR光譜而求出。 裝置:布魯克·道爾頓(Bruker Daltonics)公司製造的AVANCEIII cryo-500型核磁共振裝置 測定核:13 C(125MHz) 測定模式:單脈衝質子寬頻去偶譜 脈衝寬度:45°(5.00μ秒) 點數:64K 測定範圍:250ppm(-55~195ppm) 重複時間:5.5秒 累計次數:128回 測定溶媒:鄰二氯苯/苯-d6 (4/1(體積比)) 樣品濃度:60mg/0.6mL 測定溫度:120℃ 窗函數(window function):exponential(BF:1.0Hz) 化學位移基準:δδ信號29.73ppm[Measurement of Physical Properties] <Content of Structural Unit> The content ratio (mol %) of the structural unit of (co)polymer (B1) to (co)polymer (B3) was determined by analyzing the 13 C-NMR spectrum measured under the following conditions. Device: AVANCEIII cryo-500 NMR device manufactured by Bruker Daltonics Measurement nucleus: 13 C (125 MHz) Measurement mode: Single pulse proton broadband decoupling Pulse width: 45° (5.00 μsec) Point number: 64K Measurement range: 250 ppm (-55 to 195 ppm) Repeat time: 5.5 sec Accumulated times: 128 times Measurement solvent: o-dichlorobenzene/benzene-d 6 (4/1 (volume ratio)) Sample concentration: 60 mg/0.6 mL Measurement temperature: 120°C Window function: exponential (BF: 1.0 Hz) Chemical shift reference: δδ signal 29.73 ppm
<軟化點> (共)聚合物(B1)~(共)聚合物(B3)的軟化點是依照JIS K2207,並藉由環球法測定。<Softening point> The softening points of (co)polymers (B1) to (co)polymers (B3) were measured by the cyclotron method in accordance with JIS K2207.
<玻璃轉變溫度(Tg)> (甲基)丙烯酸樹脂(A)及(共)聚合物(B1)~(共)聚合物(B3)的玻璃轉變溫度(Tg)是依照JIS K7121解析DSC曲線而求出,所述DSC曲線是將該些樹脂封入簡易密閉盤,並在氮氣流下以10℃/分鐘的速度自-100℃升溫到200℃時的DSC曲線。<Glass transition temperature (Tg)> The glass transition temperature (Tg) of the (meth)acrylic resin (A) and the (co)polymers (B1) to (co)polymers (B3) was determined by analyzing the DSC curve according to JIS K7121. The DSC curve was obtained when the resins were sealed in a simple sealed dish and heated from -100°C to 200°C at a rate of 10°C/min under a nitrogen flow.
<數量平均分子量(Mn)、z平均分子量(Mz)、重量平均分子量(Mw/Mn)、及分子量為400以下的化合物的含有率> (甲基)丙烯酸樹脂(A)及(共)聚合物(B1)~(共)聚合物(B3)的數量平均分子量(Mn)、重量平均分子量(Mw)、z平均分子量(Mz)及分子量分佈(Mw/Mn)是根據GPC測定求出。測定是在以下的條件下進行。而且,根據使用市售的單分散標準聚苯乙烯而得的校準線,求出數量平均分子量(Mn)、重量平均分子量(Mw)、z平均分子量(Mz),並算出Mw/Mn 。另外,分子量為400以下的化合物的含有率是對所得的分子量分佈進行積分而算出。 裝置:GPC HLC-8320(東曹股份有限公司製造) 溶劑:四氫呋喃 管柱:TSKgel G7000×1、TSKgel G4000×2、TSKgel G2000×1(均為東曹公司製造) 流速:1.0mL/分鐘 樣品:20mg/mL 四氫呋喃溶液 溫度:40℃<Number average molecular weight (Mn), z average molecular weight (Mz), weight average molecular weight (Mw/Mn), and content of compounds with a molecular weight of 400 or less> The number average molecular weight (Mn), weight average molecular weight (Mw), z average molecular weight (Mz), and molecular weight distribution (Mw/Mn) of (meth)acrylic resin (A) and (co)polymers (B1) to (co)polymers (B3) were determined by GPC measurement. The measurement was performed under the following conditions. In addition, the number average molecular weight (Mn), weight average molecular weight (Mw), z average molecular weight (Mz), and Mw/Mn were determined based on the calibration line obtained using commercially available monodisperse standard polystyrene. In addition, the content of compounds with a molecular weight of 400 or less was calculated by integrating the obtained molecular weight distribution. Apparatus: GPC HLC-8320 (manufactured by Tosoh Corporation) Solvent: tetrahydrofuran Column: TSKgel G7000×1, TSKgel G4000×2, TSKgel G2000×1 (all manufactured by Tosoh Corporation) Flow rate: 1.0mL/min Sample: 20mg/mL tetrahydrofuran solution Temperature: 40℃
[(甲基)丙烯酸樹脂(A)的合成] 使用以下的單體,合成(甲基)丙烯酸樹脂(A)。[Synthesis of (meth)acrylic resin (A)] (Meth)acrylic resin (A) was synthesized using the following monomers.
丙烯酸2-乙基己酯(2EHA) 丙烯酸乙酯(EA) 乙酸乙烯酯(VA) 丙烯酸(AA) 丙烯酸羥基乙酯(HEA)2-Ethylhexyl acrylate (2EHA) Ethyl acrylate (EA) Vinyl acetate (VA) Acrylic acid (AA) Hydroxyethyl acrylate (HEA)
((甲基)丙烯酸樹脂(A1)的合成) 向設置有攪拌機的可調節溫度的反應器裝入作為聚合溶媒的350質量份的乙酸乙酯、及40質量份的甲苯,進行氮置換並升溫。在升溫到75℃後,向反應器連續地添加混合了316質量份的2EHA、43質量份的EA、50質量份的VA、9質量份的AA、2質量份的HEA、及作為聚合起始劑的2質量份的苯甲醯過氧化物的溶液,使其反應5小時。5小時後,使用120質量份的甲苯進行稀釋,得到固體成分45%的包含(甲基)丙烯酸樹脂(A1)的乙酸乙酯/甲苯溶液。(Synthesis of (meth)acrylic resin (A1)) Into a temperature-adjustable reactor equipped with a stirrer, 350 parts by mass of ethyl acetate and 40 parts by mass of toluene as a polymerization solvent were charged, and the temperature was raised while nitrogen substitution was performed. After the temperature was raised to 75°C, a solution in which 316 parts by mass of 2EHA, 43 parts by mass of EA, 50 parts by mass of VA, 9 parts by mass of AA, 2 parts by mass of HEA, and 2 parts by mass of benzoyl peroxide as a polymerization initiator were continuously added to the reactor and reacted for 5 hours. After 5 hours, the solution was diluted with 120 parts by mass of toluene to obtain an ethyl acetate/toluene solution containing (meth)acrylic resin (A1) with a solid content of 45%.
測定使溶媒自所得的溶液揮發而得的(甲基)丙烯酸樹脂(A1)的玻璃轉變溫度(Tg),結果為-60℃。The glass transition temperature (Tg) of the (meth)acrylic resin (A1) obtained by evaporating the solvent from the obtained solution was measured and found to be -60°C.
[(共)聚合物(B)的合成] ((共)聚合物(B1)、(共)聚合物(B4)及(共)聚合物(B6)的合成) 向具備攪拌翼的實容量1270mL的高壓釜的第1段,連續地供給藉由異丙烯基甲苯、石油石腦油的熱分解而得的C5 蒸餾成分及經脫水純化的甲苯的混合物(單體的合計/甲苯=1/1(容量比)),以及使用經脫水純化的甲苯稀釋到10倍的三氟化硼酚鹽錯合物(酚1.7倍當量),在5℃下使其聚合反應。異丙烯基甲苯與C5 蒸餾成分的質量比(異丙烯基甲苯/C5 蒸餾成分)設為90/10,單體及甲苯的混合物的供給量設為1.0升/小時,經稀釋的觸媒的供給量設為105毫升/小時。[Synthesis of (co)polymer (B)] (Synthesis of (co)polymer (B1), (co)polymer (B4) and (co)polymer (B6)) A mixture of C5 distillate obtained by thermal decomposition of isopropenyltoluene and petroleum naphtha and toluene purified by dehydration (total monomers/toluene = 1/1 (volume ratio)) and boron trifluoride phenolate complex diluted to 10 times with toluene purified by dehydration (1.7 times phenol equivalent) were continuously supplied to the first section of an autoclave having a true capacity of 1270 mL and equipped with a stirring blade, and a polymerization reaction was carried out at 5°C. The mass ratio of isopropenyltoluene to C5 distillate (isopropenyltoluene/ C5 distillate) was set to 90/10, the supply rate of the mixture of monomer and toluene was set to 1.0 L/hour, and the supply rate of the diluted catalyst was set to 105 mL/hour.
將該反應混合物移送到第2段的高壓釜,在5℃下使其繼續聚合反應。而且,於在第1段與第2段的高壓釜中的合計滯留時間成為2小時的時點,連續地將反應混合物自高壓釜排出,於成為滯留時間的3倍的時點,採取1升的反應混合物並結束聚合反應。聚合結束後,將1規定的NaOH水溶液添加到所採取的反應混合物,並使觸媒殘渣脫灰。進而,使用多量水清洗所得的反應混合物5次,之後使用蒸發器對溶媒及未反應單體進行減壓蒸餾去除,得到異丙烯基甲苯・C5 蒸餾成分的共聚合物即(共)聚合物(B4)。(共)聚合物(B4)的源自異丙烯基甲苯的結構單元的含量為93莫耳%,軟化點為100℃,玻璃轉變溫度(Tg)為50℃,數量平均分子量(Mn)為700,z平均分子量(Mz)為1500,重量平均分子量(Mw)與數量平均分子量(Mn)的比即分散度(Mw/Mn)為1.43,分子量為400以下的化合物的含有率為13%。The reaction mixture was transferred to the second stage autoclave and the polymerization reaction was continued at 5°C. When the total residence time in the first and second stage autoclaves reached 2 hours, the reaction mixture was continuously discharged from the autoclave, and when the residence time reached 3 times, 1 liter of the reaction mixture was sampled to terminate the polymerization reaction. After the polymerization was completed, a predetermined amount of NaOH aqueous solution was added to the sampled reaction mixture, and the catalyst residue was deashed. Furthermore, the obtained reaction mixture was washed 5 times with a large amount of water, and then the solvent and unreacted monomers were removed by reduced pressure distillation using an evaporator to obtain a copolymer of isopropenyltoluene and C5 distillation components, namely, a (co)polymer (B4). The (co)polymer (B4) has a content of structural units derived from isopropenyltoluene of 93 mol%, a softening point of 100°C, a glass transition temperature (Tg) of 50°C, a number average molecular weight (Mn) of 700, a z average molecular weight (Mz) of 1500, a ratio of the weight average molecular weight (Mw) to the number average molecular weight (Mn), i.e., a dispersion (Mw/Mn) of 1.43, and a content of compounds with a molecular weight of less than 400 is 13%.
將上述(共)聚合物(B4)放入安裝於薄膜蒸餾裝置(DN60型、旭製作所股份有限公司製造)的上部的玻璃製容器,之後加熱到200℃。之後,以2毫升/分鐘進行通液,以旋轉數180rpm、真空度0.02Pa進行濃縮,在安裝於下部的玻璃製茄子瓶回收異丙烯基甲苯・C5 蒸餾成分的共聚合物即(共)聚合物(B1)。(共)聚合物(B1)的源自異丙烯基甲苯的結構單元的含量為93莫耳%,軟化點為110℃,玻璃轉變溫度(Tg)為65℃,數量平均分子量(Mn)為850,z平均分子量(Mz)為1600,重量平均分子量(Mw)與數量平均分子量(Mn)的比即分散度(Mw/Mn)為1.35,分子量為400以下的化合物的含有率為3%。The (co)polymer (B4) was placed in a glass container mounted on the top of a thin film distillation apparatus (DN60 type, manufactured by Asahi Seisakusho Co., Ltd.), and then heated to 200°C. Thereafter, the liquid was passed through at 2 ml/min, and concentrated at a rotation speed of 180 rpm and a vacuum degree of 0.02 Pa, and the copolymer of isopropenyltoluene and C5 distillation components, i.e., the (co)polymer (B1), was recovered in a glass eggplant bottle mounted on the bottom. The (co)polymer (B1) has a content of structural units derived from isopropenyltoluene of 93 mol %, a softening point of 110°C, a glass transition temperature (Tg) of 65°C, a number average molecular weight (Mn) of 850, a z average molecular weight (Mz) of 1600, a ratio of the weight average molecular weight (Mw) to the number average molecular weight (Mn), i.e., a dispersion (Mw/Mn) of 1.35, and a content of compounds with a molecular weight of 400 or less of 3%.
另外,作為薄膜蒸餾裝置的後步驟,藉由所安裝的凝縮器,使低沸點成分凝聚,來回收異丙烯基甲苯・C5 蒸餾成分的共聚合物即(共)聚合物(B6)。(共)聚合物(B6)的源自異丙烯基甲苯的結構單元的含量為93莫耳%,軟化點未測定,玻璃轉變溫度(Tg)為-5℃,數量平均分子量(Mn)為380,z平均分子量(Mz)為400,重量平均分子量(Mw)與數量平均分子量(Mn)的比即分散度(Mw/Mn)為1.03,分子量為400以下的化合物的含有率為62%。In addition, as a post-step of the thin film distillation device, a condenser was installed to condense the low boiling point component to recover the copolymer of isopropenyltoluene and C5 distillation component, namely (co)polymer (B6). The content of structural units derived from isopropenyltoluene in (co)polymer (B6) was 93 mol%, the softening point was not determined, the glass transition temperature (Tg) was -5°C, the number average molecular weight (Mn) was 380, the z average molecular weight (Mz) was 400, the ratio of the weight average molecular weight (Mw) to the number average molecular weight (Mn), namely the dispersion (Mw/Mn), was 1.03, and the content of compounds with a molecular weight of 400 or less was 62%.
((共)聚合物(B2)的合成) 除了將高壓釜的第1段及第2段中的聚合溫度設為20℃,將經稀釋的觸媒的供給量設為50毫升/小時以外,以和(共)聚合物(B4)的合成相同的方法,得到異丙烯基甲苯・C5 蒸餾成分的共聚合物即(共)聚合物(B2)。(共)聚合物(B2)的源自異丙烯基甲苯的結構單元的含量為97莫耳%,軟化點為102℃,玻璃轉變溫度(Tg)為65℃,數量平均分子量(Mn)為850,z平均分子量(Mz)為1650,重量平均分子量(Mw)與數量平均分子量(Mn)的比即分散度(Mw/Mn)為1.41,分子量為400以下的化合物的含有率為6%。(Synthesis of (co)polymer (B2)) The same method as the synthesis of (co)polymer (B4) was used except that the polymerization temperature in the first and second stages of the autoclave was set to 20°C and the supply rate of the diluted catalyst was set to 50 ml/hour to obtain a copolymer of isopropenyltoluene and C5 distillate component, i.e., (co)polymer (B2). The content of structural units derived from isopropenyltoluene in (co)polymer (B2) was 97 mol %, the softening point was 102°C, the glass transition temperature (Tg) was 65°C, the number average molecular weight (Mn) was 850, the z average molecular weight (Mz) was 1650, the ratio of the weight average molecular weight (Mw) to the number average molecular weight (Mn), i.e., the dispersion (Mw/Mn), was 1.41, and the content of compounds with a molecular weight of 400 or less was 6%.
((共)聚合物(B3)的合成) 除了不供給藉由石油石腦油的熱分解而得的C5 蒸餾成分,並將高壓釜的第1段及第2段中的聚合溫度設為25℃,將經稀釋的觸媒的供給量設為30毫升/小時以外,以和(共)聚合物(B4)的合成相同的方法,得到異丙烯基甲苯的單獨聚合物即(共)聚合物(B3)。(共)聚合物(B3)的源自異丙烯基甲苯的結構單元的含量為100莫耳%,軟化點為102℃,玻璃轉變溫度(Tg)為60℃,數量平均分子量(Mn)為770,z平均分子量(Mz)為1400,重量平均分子量(Mw)與數量平均分子量(Mn)的比即分散度(Mw/Mn)為1.31,分子量為400以下的化合物的含有率為7%。(Synthesis of (co)polymer (B3)) A single polymer of isopropenyltoluene, i.e., (co)polymer (B3), was obtained by the same method as that for the synthesis of (co)polymer (B4), except that the C5 distillate component obtained by thermal decomposition of petroleum naphtha was not supplied, the polymerization temperature in the first and second stages of the autoclave was set to 25°C, and the supply amount of the diluted catalyst was set to 30 ml/hour. The (co)polymer (B3) has a content of structural units derived from isopropenyltoluene of 100 mol %, a softening point of 102°C, a glass transition temperature (Tg) of 60°C, a number average molecular weight (Mn) of 770, a z average molecular weight (Mz) of 1400, a ratio of the weight average molecular weight (Mw) to the number average molecular weight (Mn), i.e., a dispersion (Mw/Mn) of 1.31, and a content of compounds with a molecular weight of 400 or less of 7%.
((共)聚合物(B5)的合成) 除了將經稀釋的觸媒的供給量設為90毫升/小時以外,以和(共)聚合物(B4)的合成相同的方法,得到異丙烯基甲苯・C5 蒸餾成分的共聚合物即(共)聚合物(B5)。(共)聚合物(B5)的源自異丙烯基甲苯的結構單元的含量為93莫耳%,軟化點為110℃,玻璃轉變溫度(Tg)為70℃,數量平均分子量(Mn)為900,z平均分子量(Mz)為2400,重量平均分子量(Mw)與數量平均分子量(Mn)的比即分散度(Mw/Mn)為1.67,分子量為400以下的化合物的含有率為8%。(Synthesis of (co)polymer (B5)) A copolymer of isopropenyltoluene and C5 distillation component, i.e., (co)polymer (B5), was obtained by the same method as the synthesis of (co)polymer (B4), except that the supply amount of the diluted catalyst was set to 90 ml/hour. The content of structural units derived from isopropenyltoluene in (co)polymer (B5) was 93 mol %, the softening point was 110°C, the glass transition temperature (Tg) was 70°C, the number average molecular weight (Mn) was 900, the z average molecular weight (Mz) was 2400, the ratio of the weight average molecular weight (Mw) to the number average molecular weight (Mn), i.e., the dispersion (Mw/Mn), was 1.67, and the content of compounds with a molecular weight of 400 or less was 8%.
((共)聚合物(B7)的合成) 除了以質量比(α-甲基苯乙烯/苯乙烯)成為60/40的量供給α-甲基苯乙烯及苯乙烯,來代替異丙烯基甲苯及藉由石油石腦油的熱分解而得的C5 蒸餾成分,並將高壓釜的第1段及第2段中的聚合溫度設為7℃,將經稀釋的觸媒的供給量設為120毫升/小時以外,以和(共)聚合物(B4)的合成相同的方法,得到異丙烯基甲苯的單獨聚合物即(共)聚合物(B7)。(共)聚合物(B7)的源自α-甲基苯乙烯的結構單元的含量為55莫耳%,軟化點為97℃,玻璃轉變溫度(Tg)為55℃,數量平均分子量(Mn)為840,z平均分子量(Mz)為3000,重量平均分子量(Mw)與數量平均分子量(Mn)的比即分散度(Mw/Mn)為1.98,分子量為400以下的化合物的含有率為14%。(Synthesis of (co)polymer (B7)) A single polymer of isopropenyltoluene, i.e., (co)polymer (B7), was obtained by the same method as that for the synthesis of (co)polymer (B4), except that α-methylstyrene and styrene were supplied in a mass ratio (α-methylstyrene/styrene) of 60/40 instead of isopropenyltoluene and the C5 distillate component obtained by thermal decomposition of petroleum naphtha, the polymerization temperature in the first and second stages of the autoclave was set to 7°C, and the supply amount of the diluted catalyst was set to 120 ml/hour. The (co)polymer (B7) had a content of structural units derived from α-methylstyrene of 55 mol%, a softening point of 97°C, a glass transition temperature (Tg) of 55°C, a number average molecular weight (Mn) of 840, a z average molecular weight (Mz) of 3000, a ratio of the weight average molecular weight (Mw) to the number average molecular weight (Mn), i.e., a dispersion (Mw/Mn) of 1.98, and a content of compounds with a molecular weight of less than 400 was 14%.
將(共)聚合物(B1)~(共)聚合物(B7)的組成、軟化點、玻璃轉變溫度(Tg)、數量平均分子量(Mn)、z平均分子量(Mz)、重量平均分子量(Mw)與數量平均分子量(Mn)的比即分散度(Mw/Mn)、及分子量為400以下的化合物的含有率示於表1。再者,表1中,「IPT」表示異丙烯基甲苯。The compositions, softening points, glass transition temperatures (Tg), number average molecular weights (Mn), z average molecular weights (Mz), the ratio of weight average molecular weights (Mw) to number average molecular weights (Mn), i.e., the dispersion (Mw/Mn), and the content of compounds having a molecular weight of 400 or less of (co)polymers (B1) to (B7) are shown in Table 1. In Table 1, "IPT" represents isopropenyltoluene.
[表1]
[交聯劑(C)] 作為交聯劑(C1),使用三井化學股份有限公司製造的Takenate D-101E(異氰酸酯系化合物、「Takenate」為同公司的註冊商標)。[Crosslinking agent (C)] As the crosslinking agent (C1), Takenate D-101E manufactured by Mitsui Chemicals, Inc. (isocyanate compound, "Takenate" is a registered trademark of the same company) was used.
[黏著性加工品的製作及評價] 以溶液中含有的(甲基)丙烯酸樹脂(A1)、(共)聚合物(B1)~(共)聚合物(B3)的任一者及交聯劑(C)的比率成為表2中記載的質量比的方式,在室溫下混合上述包含(甲基)丙烯酸樹脂(A1)的乙酸乙酯/甲苯溶液、(共)聚合物(B1)~(共)聚合物(B7)的任一者、及交聯劑(C),而得到黏著性組成物的乙酸乙酯/甲苯溶液。[Preparation and evaluation of adhesive processed products] The ethyl acetate/toluene solution containing the (meth)acrylic resin (A1), any one of the (co)polymers (B1) to (co)polymers (B3), and the crosslinking agent (C) are mixed at room temperature so that the ratio of the (meth)acrylic resin (A1), any one of the (co)polymers (B1) to (co)polymers (B7), and the crosslinking agent (C) contained in the solution becomes the mass ratio shown in Table 2, thereby obtaining an ethyl acetate/toluene solution of an adhesive composition.
以乾燥後的膜厚成為10~50μm的方式,將所得的黏著性組成物的乙酸乙酯/甲苯溶液塗佈於剝離紙,並在100℃下乾燥10分鐘,之後使PET膜25μm壓接到塗佈面,而製作黏著片。在50℃放置3日,使黏著性組成物充分交聯。The obtained adhesive composition was coated on release paper in an ethyl acetate/toluene solution so that the film thickness after drying was 10 to 50 μm, and dried at 100°C for 10 minutes, and then a 25 μm PET film was pressed onto the coated surface to prepare an adhesive sheet. The adhesive sheet was left at 50°C for 3 days to allow the adhesive composition to fully crosslink.
<總光線透射率的測定> 剝掉黏著層的膜厚為50μm的上述黏著片的上述剝離紙而使黏著層露出,使厚度為25μm的PET膜壓接到露出的上述黏著層,而得到試驗片。試驗片的構成為PET膜/黏著層/PET膜=25/50/25μm。之後,依照JIS K7361測定上述試驗片的總光線透射率。<Measurement of total light transmittance> The peeling paper of the adhesive sheet having a film thickness of 50 μm was peeled off to expose the adhesive layer, and a PET film having a thickness of 25 μm was pressed onto the exposed adhesive layer to obtain a test piece. The structure of the test piece was PET film/adhesive layer/PET film = 25/50/25 μm. Thereafter, the total light transmittance of the test piece was measured in accordance with JIS K7361.
<黏著力的測定> 將黏著層的膜厚為15μm或30μm的上述黏著片切斷為寬度25mm、長度150mm,而製成試驗片。剝掉上述試驗片的上述剝離紙而使黏著層露出,在23℃的環境下,使露出的上述黏著層接觸不鏽鋼板(SUS),使2kg質量的橡膠輥往返2次而壓接上述試驗片。放置20分鐘後,依照JIS Z0237,以300mm/分鐘的速度測定180°剝離強度。<Measurement of Adhesive Strength> The adhesive sheet having an adhesive layer thickness of 15μm or 30μm was cut into pieces with a width of 25mm and a length of 150mm to prepare a test piece. The peeling paper of the test piece was peeled off to expose the adhesive layer, and the exposed adhesive layer was brought into contact with a stainless steel plate (SUS) in an environment of 23°C, and a 2kg rubber roller was moved back and forth twice to press the test piece. After leaving it for 20 minutes, the 180° peel strength was measured at a speed of 300mm/min in accordance with JIS Z0237.
將構成所製作的黏著性加工品的黏著性組成物的配方、以及黏著性加工品的總光線透射率及黏著力示於表2及表3。Tables 2 and 3 show the formulation of the adhesive composition constituting the produced adhesive processed products, and the total light transmittance and adhesive force of the adhesive processed products.
[表2]
[表3]
將實施例1~實施例5及比較例1~比較例9的總光線透射率與黏著層的膜厚為15μm時的黏著力的關係示於圖1。FIG. 1 shows the relationship between the total light transmittance of Examples 1 to 5 and Comparative Examples 1 to 9 and the adhesive force when the film thickness of the adhesive layer is 15 μm.
從表2、表3及圖1可明知,比起不含含有源自異丙烯基甲苯的結構單元的(共)聚合物的黏著性組成物,包含上述(共)聚合物的黏著性組成物的黏著力更高。另外,比起含有不滿足要件(B-1)~(B-5)的任一者的(共)聚合物的黏著性組成物,含有滿足要件(B-1)~(B-5)的全部的(共)聚合物的黏著性組成物的黏著力及透明性兩者變高。As is clear from Table 2, Table 3 and Figure 1, the adhesive composition containing the (co)polymer has higher adhesive force than the adhesive composition not containing the (co)polymer containing the structural unit derived from isopropenyltoluene. In addition, the adhesive composition containing the (co)polymer satisfying all the requirements (B-1) to (B-5) has higher adhesive force and transparency than the adhesive composition containing the (co)polymer not satisfying any one of the requirements (B-1) to (B-5).
本申請為主張依據2019年6月25日申請的日本申請號2019-117570號的優先權的申請,該申請的申請專利範圍、說明書及圖式中記載的內容援用到本申請。 [產業上的可利用性]This application claims priority based on Japanese application No. 2019-117570 filed on June 25, 2019, and the contents described in the patent scope, specification, and drawings of the application are incorporated into this application. [Industrial Applicability]
根據本發明,提供一種透明性及黏著性均高的黏著性組成物。本發明能夠適當在特別是要求黏著性組成物的透明性的各種用途上實施。According to the present invention, an adhesive composition having high transparency and high adhesiveness is provided. The present invention can be suitably implemented in various applications that require transparency of the adhesive composition.
無without
圖1為表示實施例1及比較例1~比較例3的總光線透射率與黏著層的膜厚為10μm時的黏著力的關係的圖表。FIG. 1 is a graph showing the relationship between the total light transmittance of Example 1 and Comparative Examples 1 to 3 and the adhesive force when the film thickness of the adhesive layer is 10 μm.
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US5428109A (en) * | 1992-12-16 | 1995-06-27 | Mitsui Petrochemical Industries, Ltd. | Hot-melt adhesive composition |
CN103842459A (en) * | 2011-09-29 | 2014-06-04 | 三井化学株式会社 | Adhesive composition and image display device using same |
TW201816041A (en) * | 2016-07-08 | 2018-05-01 | 日東電工股份有限公司 | Polarizing film with adhesive layer and method for producing said polarizing film with adhesive layer |
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CN103842459A (en) * | 2011-09-29 | 2014-06-04 | 三井化学株式会社 | Adhesive composition and image display device using same |
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