[解決問題之技術手段] 於上述背景下,本發明之目的在於提供一種硬化性樹脂組合物,其可於基板(玻璃等)之表面極薄地進行塗佈而成膜,可藉由使之硬化而成膜硬化樹脂薄膜,於藉由圖案化等於該硬化樹脂薄膜上製作電路之製程中之焙燒中可耐受230℃之高溫,而且暴露於此種高溫後亦可自基板不費勁地輕易剝離。 本發明者發現,藉由包含具備具有特定範圍之結構特徵之側鏈之聚合物、及特定範圍之交聯劑而成的硬化性樹脂組合物可達成上述目的。即,本發明提供以下項目。 項目A1.一種硬化性樹脂組合物,其係包含具備具有醇性二級或三級羥基之側鏈之鏈狀聚合物、及交聯劑而成者,且 (a)該側鏈係包含3~30個碳原子而成者,且係包含至少1個飽和或不飽和之烴基而成、或者除此以外進而包含至少1個芳香族基而成者,且可包含將碳原子間連接之選自由-COO-、-O-、及-CO-所組成之群中之鍵; (b)該交聯劑係選自三𠯤系交聯劑或甘脲系交聯劑中者。 項目A2.如上述項目之硬化性樹脂組合物,其中該鏈狀聚合物係包含如下單體單元而成者,該單體單元係具備具有醇性二級或三級羥基之該側鏈之單體單元,且係(甲基)丙烯酸系單體、乙烯酯系單體、乙烯醚系單體、及除該等以外之乙烯系單體之任意至少1種。 項目A3.如上述項目中任一項之硬化性樹脂組合物,其中該鏈狀聚合物係包含選自由CH2
=CH-COO-R1
、CH2
=C(CH3
)-COO-R2
、CH2
=CH-O-CO-R3
、CH2
=CH-O-R4
、及CH2
=CH-R5
(此處,R1
、R2
、R3
、R4
、及R5
係相互獨立地具有於經由酯鍵而鍵結於各乙烯基之情形時包括構成該酯鍵之碳原子在內的3~30個碳原子,具有醇性二級或三級羥基,並包含至少1個飽和或不飽和之烴基而成、或者進而包含至少1個芳香族基而成,且可具有將碳原子間連接之選自由-COO-、-O-、及-CO-所組成之群中之鍵)所表示之化合物所組成之群中之單體單元而成者。 項目A4.如上述項目中任一項之硬化性樹脂組合物,其中該鏈狀聚合物係進而包含追加之單體單元而成者,該追加之單體單元係不具有羥基且側鏈之碳原子數為1~15的(甲基)丙烯酸系單體、乙烯酯系單體、乙烯醚系單體、及除該等以外之乙烯系單體之任意至少1種。 項目A5.如上述項目中任一項之硬化性樹脂組合物,其中該追加之單體單元係選自由CH2
=CH-COO-R6
、CH2
=C(CH3
)-COO-R7
、CH2
=CH-O-CO-R8
(此處,R6
、R7
及R8
係相互獨立地具有1~15個碳原子,不具有羥基,包含至少1個飽和或不飽和之烴基而成、或者進而包含至少1個芳香族基而成,可具有將碳原子間連接之選自由-COO-、-O-、及-CO-所組成之群中之鍵,該烴基或芳香族基可具有胺基)、CH2
=CH-O-R9
、CH2
=CH-R10
(此處,R9
及R10
係相互獨立地具有3~15個碳原子,不具有羥基,包含至少1個飽和或不飽和之烴基而成、或者進而包含至少1個芳香族基而成,可具有將碳原子間連接之選自由-COO-、-O-、及-CO-所組成之群中之鍵,該烴基或芳香族基可具有胺基)、C4
HO3
-R11
、及C4
H2
NO2
-R12
(此處,C4
HO3
-表示順丁烯二酸酐基,C4
H2
NO2
-表示順丁烯二醯亞胺基,R11
、及R12
係相互獨立地為氫原子或者具有1~15個碳原子數,不具有羥基,包含至少1個飽和或不飽和之烴基而成、或者進而包含至少1個芳香族基而成,可具有將碳原子間連接之選自由-COO-、-O-、及-CO-所組成之群中之鍵,該烴基或芳香族基可具有胺基)所表示之化合物所組成之群中者。 項目A6.如上述項目中任一項之硬化性樹脂組合物,其中構成該鏈狀聚合物之單體單元中之具有醇性二級或三級羥基之單體單元所占之比率為30~100莫耳%。 項目A7.如上述項目中任一項之硬化性樹脂組合物,其中該交聯劑係選自由完全或部分烷氧基甲基化三聚氰胺、完全或部分烷氧基甲基化胍胺、完全或部分烷氧基甲基化乙醯胍胺(acetoguanamine)、完全或部分烷氧基甲基化苯并胍胺、及完全或部分烷氧基甲基化甘脲所組成之群中者。 項目A8.如上述項目中任一項之硬化性樹脂組合物,其中該組合物中之該直鏈狀聚合物之質量與該交聯劑之質量之比為1:2~1:0.05。 項目A9.如上述項目中任一項之硬化性樹脂組合物,其係包含溶劑者。 項目A10.一種硬化樹脂膜,其係使如上述項目中任一項之硬化性樹脂組合物硬化而成。 項目A11.一種易剝離性硬化樹脂膜,其係使如上述項目中任一項之硬化性樹脂組合物於基板表面硬化成膜狀而成。 項目A12.一種硬化樹脂膜之製造方法,其係製造硬化樹脂膜之方法,該方法包括: 準備具備具有醇性二級或三級羥基之側鏈之鏈狀聚合物及交聯劑之步驟; 將包含該鏈狀聚合物及該交聯劑之組合物塗佈於基板上而形成硬化性樹脂組合物塗膜之步驟; 藉由使該硬化性樹脂組合物塗膜進行聚合反應使之硬化而製成硬化樹脂膜,此處, (a)該側鏈係包含3~30個碳原子而成者,且係包含至少1個飽和或不飽和之烴基而成、或者除此以外進而包含至少1個芳香族基而成者,且可包含將其等中鄰接之基之碳原子間連接之選自由-COO-、-O-、及-CO-所組成之群中之鍵; (b)該交聯劑係選自三𠯤系交聯劑或甘脲系交聯劑中者。 項目A13.如上述項目之製造方法,其中該鏈狀聚合物係包含如下單體單元而成者,該單體單元係具備具有醇性二級或三級羥基之該側鏈之單體單元,且係(甲基)丙烯酸系單體、乙烯酯系單體、乙烯醚系單體、及該等以外之乙烯系單體之任意至少1種。 項目A14.如上述項目中任一項之製造方法,其中該鏈狀聚合物係包含選自由CH2
=CH-COO-R1
、CH2
=C(CH3
)-COO-R2
、CH2
=CH-O-CO-R3
、CH2
=CH-O-R4
、及CH2
=CH-R5
(此處,R1
、R2
、R3
、R4
、及R5
係相互獨立地具有於經由酯鍵而鍵結於各乙烯基之情形時包括構成該酯鍵之碳原子在內的3~30個碳原子,具有醇性二級或三級羥基,並包含至少1個飽和或不飽和之烴基而成、或者進而包含至少1個芳香族基而成,且可具有將碳原子間連接之選自由-COO-、-O-、及-CO-所組成之群中之鍵)所表示之化合物所組成之群中之單體單元而成者。 項目A15.如上述項目中任一項之製造方法,其中該鏈狀聚合物係進而包含如下追加之單體單元而成者,該追加之單體單元係不具有羥基且側鏈之碳原子數為1~15的(甲基)丙烯酸系單體、乙烯酯系單體、乙烯醚系單體、及該等以外之乙烯系單體之任意至少1種。 項目A16.如上述項目中任一項之製造方法,其中該追加之單體單元係選自由CH2
=CH-COO-R6
、CH2
=C(CH3
)-COO-R7
、CH2
=CH-O-CO-R8
(此處,R6
、R7
、及R8
係相互獨立地具有1~15個碳原子,不具有羥基,包含至少1個飽和或不飽和之烴基而成、或者進而包含至少1個芳香族基而成,且可具有將碳原子間連接之選自由-COO-、-O-、及-CO-所組成之群中之鍵)、CH2
=CH-O-R9
、CH2
=CH-R10
(此處,R9
、及R10
係相互獨立地具有3~15個碳原子,不具有羥基,包含至少1個飽和或不飽和之烴基而成、或者進而包含至少1個芳香族基而成,且可具有將碳原子間連接之選自由-COO-、-O-、及-CO-所組成之群中之鍵)、C4
HO3
-R11
、及C4
H2
NO2
-R12
(此處,C4
HO3
-表示順丁烯二酸酐基,C4
H2
NO2
-表示順丁烯二醯亞胺基,R11
、及R12
係相互獨立地為氫原子或者具有1~15個碳原子數,不具有羥基,包含至少1個飽和或不飽和之烴基而成、或者進而包含至少1個芳香族基而成,可具有將碳原子間連接之選自由-COO-、-O-、及-CO-所組成之群中之鍵)所表示之化合物所組成之群中者。 項目A17.如上述項目中任一項之製造方法,其中構成該鏈狀聚合物之單體單元中之具有醇性二級或三級羥基之單體單元所占之比率為30~100莫耳%。 項目A18.如上述項目中任一項之製造方法,其中該交聯劑係選自由完全或部分烷氧基甲基化三聚氰胺、完全或部分烷氧基甲基化胍胺、完全或部分烷氧基甲基化乙醯胍胺、或完全或部分烷氧基甲基化苯并胍胺、及完全或部分烷氧基甲基化甘脲所組成之群中者。 項目A19.如上述項目中任一項之製造方法,其中該組合物中之該直鏈狀聚合物之質量與該交聯劑之質量之比為1:2~1:0.05。 項目A20.如上述項目中任一項之製造方法,其中該組合物係包含溶劑者。 項目A21.如上述項目中任一項之硬化樹脂膜之製造方法,其進而包括將形成於該基板上之該硬化樹脂膜自該基板剝離之步驟。 又,本發明提供以下項目。 項目B1.一種硬化性樹脂組合物,其係包含具備具有醇性二級或三級羥基之側鏈之鏈狀聚合物、及交聯劑而成者,且 (a)該側鏈係包含3~30個碳原子而成者,且係包含至少1個飽和或不飽和之烴基而成、或者除此以外進而包含至少1個芳香族基而成者,且可包含將碳原子間連接之選自由-COO-、-O-、及-CO-所組成之群中之鍵; (b)該交聯劑係選自由三𠯤系化合物及/或其縮合物、甘脲系化合物及/或其縮合物、以及咪唑啶酮系化合物及/或其縮合物 所組成之群中者。 項目B2.如上述項目之硬化性樹脂組合物,其中該鏈狀聚合物係包含如下單體單元而成者,該單體單元係具備具有醇性二級或三級羥基之該側鏈之單體單元,且係未經取代或經α位取代之(甲基)丙烯酸系單體、未經取代或經α位取代之乙烯酯系單體、未經取代或經α位取代之乙烯醚系單體、及該等以外之未經取代或經α位取代之乙烯系單體之任意至少1種。 項目B3.如上述項目中任一項之硬化性樹脂組合物,其中該鏈狀聚合物係包含選自由CH2
=C(R1a
)-COO-R1
、CH2
=C(R1a
)-O-CO-R3
、CH2
=C(R1a
)-O-R4
、及CH2
=C(R1a
)-R5
(此處,R1
、R3
、R4
、及R5
係相互獨立地具有於經由酯鍵而鍵結於各乙烯基之情形時包括構成該酯鍵之碳原子在內的3~30個碳原子,具有醇性二級或三級羥基,並包含至少1個飽和或不飽和之烴基而成、或者進而包含至少1個芳香族基而成,且可具有將碳原子間連接之選自由-COO-、-O-、及-CO-所組成之群中之鍵,R1a
係選自由氫、經取代或未經取代之烷基、及經取代或未經取代之烯基所組成之群)所表示之化合物所組成之群中之單體單元而成者。 項目B4.如上述項目中任一項之硬化性樹脂組合物,其中該鏈狀聚合物係包含式A1: [化1](此處, R1a
係選自由氫、經取代或未經取代之烷基、及經取代或未經取代之烯基所組成之群, L1
係選自由單鍵、經取代或未經取代之伸烷基、及經取代或未經取代之伸烯基所組成之群, R2a
、R3a
、及R4a
相互獨立地選自由氫、及經取代或未經取代之烴基所組成之群,惟,R2a
、R3a
、及R4a
中之至少1個為經取代或未經取代之含二級或三級OH之基) 所表示之單體單元而成者。 項目B5.如上述項目中任一項之硬化性樹脂組合物,其中該鏈狀聚合物係包含式A2: [化2](此處, R1a
係選自由氫、經取代或未經取代之烷基、及經取代或未經取代之烯基所組成之群, L1
係選自由單鍵、經取代或未經取代之伸烷基、及經取代或未經取代之伸烯基所組成之群, R5a
~R14a
相互獨立地選自由氫、羥基、及 [化3]所組成之群中或者一起形成環,惟,R5a
~R14a
或該環之取代基中之至少1個為羥基, R15a
係選自由經取代或未經取代之烷基、經取代或未經取代之烯基、經取代或未經取代之環烷基、經取代或未經取代之環烯基、經取代或未經取代之芳香族基、及經取代或未經取代之雜芳香族基所組成之群) 所表示之單體單元而成者。 項目B6.如上述項目中任一項之硬化性樹脂組合物,其中該鏈狀聚合物係包含式A3: [化4](此處, R1a
係選自由氫、經取代或未經取代之烷基、及經取代或未經取代之烯基所組成之群, L2
係選自由經取代或未經取代之伸烷基、及經取代或未經取代之伸烯基所組成之群, R16a
係選自由經取代或未經取代之烷基、經取代或未經取代之烯基、及經取代或未經取代之炔基所組成之群, R17a
係選自由氫、經取代或未經取代之烷基、經取代或未經取代之烯基、及經取代或未經取代之炔基所組成之群) 所表示之單體單元而成者。 項目B7.如上述項目中任一項之硬化性樹脂組合物,其中該鏈狀聚合物係包含式A4: [化5](此處, R1a
係選自由氫、經取代或未經取代之烷基、及經取代或未經取代之烯基所組成之群, L1
係選自由單鍵、經取代或未經取代之伸烷基、及經取代或未經取代之伸烯基所組成之群, R18a
係經至少1個羥基取代之金剛烷基) 所表示之單體單元而成者。 項目B8.如上述項目中任一項之硬化性樹脂組合物,其中該鏈狀聚合物係包含式A5: [化6](此處, R1a
係選自由氫、經取代或未經取代之烷基、及經取代或未經取代之烯基所組成之群, L1
係選自由單鍵、經取代或未經取代之伸烷基、及經取代或未經取代之伸烯基所組成之群, R19a
係選自由經取代或未經取代之烷基、經取代或未經取代之烯基、經取代或未經取代之環烷基、及經取代或未經取代之環烯基所組成之群) 所表示之單體單元而成者。 項目B9.如上述項目中任一項之硬化性樹脂組合物,其中R19a
為經取代或未經取代之金剛烷基。 項目B10.一種硬化性樹脂組合物,其係包含具備具有醇性二級或三級羥基之側鏈之鏈狀聚合物、及交聯劑而成者,且 (a)該側鏈係包含3~30個碳原子而成者,且係包含至少1個飽和或不飽和之烴基而成、或者除此以外進而包含至少1個芳香族基而成者,且可包含將碳原子間連接之選自由-COO-、-O-、及-CO-所組成之群中之鍵, (b)該交聯劑係選自三𠯤系交聯劑或甘脲系交聯劑中者。 項目B11.如上述項目中任一項之硬化性樹脂組合物,其中該鏈狀聚合物係包含如下單體單元而成者,該單體單元係具備具有醇性二級或三級羥基之該側鏈之單體單元,且係(甲基)丙烯酸系單體、乙烯酯系單體、乙烯醚系單體、及該等以外之乙烯系單體之任意至少1種。 項目B12.如上述項目中任一項之硬化性樹脂組合物,其中該鏈狀聚合物係選自由CH2
=CH-COO-R1
、CH2
=C(CH3
)-COO-R2
、CH2
=CH-O-CO-R3
、CH2
=CH-O-R4
、及CH2
=CH-R5
(此處,R1
、R2
、R3
、R4
、及R5
係相互獨立地具有於經由酯鍵而鍵結於各乙烯基之情形時包括構成該酯鍵之碳原子在內的3~30個碳原子,具有醇性二級或三級羥基,並包含至少1個飽和或不飽和之烴基而成、或者進而包含至少1個芳香族基而成,且可具有將碳原子間連接之選自由-COO-、-O-、及-CO-所組成之群中之鍵)所表示之化合物所組成之群中之單體單元而成者。 項目B13.如上述項目中任一項之硬化性樹脂組合物,其中該單體單元為(甲基)丙烯酸系單體。 項目B14.如上述項目中任一項之硬化性樹脂組合物,其中R1a
為氫、或甲基。 項目B15.如上述項目中任一項之硬化性樹脂組合物,其中該鏈狀聚合物係進而包含如下追加之單體單元而成者,該追加之單體單元係可具有羥基亦可不具有羥基且側鏈之碳原子數為1~15的未經取代或經α位取代之(甲基)丙烯酸系單體、未經取代或經α位取代之乙烯酯系單體、未經取代或經α位取代之乙烯醚系單體、及該等以外之未經取代或經α位取代之乙烯系單體之任意至少1種。 項目B16.如上述項目中任一項之硬化性樹脂組合物,其中該追加之單體單元係選自由CH2
=C(R1a
)-COO-R6
、CH2
=C(R1a
)-O-CO-R8
(此處,R6
、及R8
係相互獨立地具有1~15個碳原子,可具有羥基亦可不具有羥基,包含至少1個飽和或不飽和之烴基而成、或者進而包含至少1個芳香族基而成,可具有將碳原子間連接之選自由-COO-、-O-、及-CO-所組成之群中之鍵,該烴基或芳香族基可具有胺基,R1a
選自由氫、經取代或未經取代之烷基、及經取代或未經取代之烯基所組成之群)、CH2
=C(R1a
)-O-R9
、CH2
=C(R1a
)-R10
(此處,R9
、及R10
係相互獨立地具有3~15個碳原子,可具有羥基亦可不具有羥基,包含至少1個飽和或不飽和之烴基而成、或者進而包含至少1個芳香族基而成,且可具有將碳原子間連接之選自由-COO-、-O-、及-CO-所組成之群中之鍵,該烴基或芳香族基可具有胺基,R1a
選自由氫、經取代或未經取代之烷基、及經取代或未經取代之烯基所組成之群)、C4
(R1a
)O3
-R11
、及C4
(R1a
)HNO2
-R12
(此處,C4
(R1a
)O3
-表示未經取代或經取代之順丁烯二酸酐基,C4
(R1a
)HNO2
-表示未經取代或經取代之順丁烯二醯亞胺基,R11
、及R12
係相互獨立地為氫原子或者具有1~15個碳原子數、可具有羥基亦可不具有羥基,包含至少1個飽和或不飽和之烴基而成、或者進而包含至少1個芳香族基而成,且可具有將碳原子間連接之選自由-COO-、-O-、及-CO-所組成之群中之鍵,該烴基或芳香族基可具有胺基,R1a
選自由氫、經取代或未經取代之烷基、及經取代或未經取代之烯基所組成之群)所表示之化合物所組成之群中者。 項目B17.如上述項目中任一項之硬化性樹脂組合物,其中該鏈狀聚合物係進而包含如下追加之單體單元而成者,該追加之單體單元係不具有羥基且側鏈之碳原子數為1~15的(甲基)丙烯酸系單體、乙烯酯系單體、乙烯醚系單體、及該等以外之乙烯系單體之任意至少1種。 項目B18.如上述項目中任一項之硬化性樹脂組合物,其中該追加之單體單元係選自由CH2
=CH-COO-R6
、CH2
=C(CH3
)-COO-R7
、CH2
=CH-O-CO-R8
(此處,R6
、R7
及R8
係相互獨立地具有1~15個碳原子,不具有羥基,包含至少1個飽和或不飽和之烴基而成、或者進而包含至少1個芳香族基而成,可具有將碳原子間連接之選自由-COO-、-O-、及-CO-所組成之群中之鍵,該烴基或芳香族基可具有胺基)、CH2
=CH-O-R9
、CH2
=CH-R10
(此處,R9
、及R10
係相互獨立地具有3~15個碳原子,不具有羥基,包含至少1個飽和或不飽和之烴基而成、或者進而包含至少1個芳香族基而成,且可具有將碳原子間連接之選自由-COO-、-O-、及-CO-所組成之群中之鍵,該烴基或芳香族基可具有胺基)、C4
HO3
-R11
、及C4
H2
NO2
-R12
(此處,C4
HO3
-表示順丁烯二酸酐基,C4
H2
NO2
-表示順丁烯二醯亞胺基,R11
、及R12
係相互獨立地為氫原子或者具有1~15個碳原子數,不具有羥基,包含至少1個飽和或不飽和之烴基而成、或者進而包含至少1個芳香族基而成,且可具有將碳原子間連接之選自由-COO-、-O-、及-CO-所組成之群中之鍵,該烴基或芳香族基可具有胺基)所表示之化合物所組成之群中者。 項目B19.如上述項目中任一項之硬化性樹脂組合物,其中構成該鏈狀聚合物之單體單元中之具有醇性二級或三級羥基之單體單元所占之比率為30~100莫耳%。 項目B20.如上述項目中任一項之硬化性樹脂組合物,其中該交聯劑係選自由完全或部分烷氧基甲基化三聚氰胺及/或其縮合物、完全或部分烷氧基甲基化胍胺及/或其縮合物、完全或部分烷氧基甲基化乙醯胍胺及/或其縮合物、完全或部分烷氧基甲基化苯并胍胺及/或其縮合物、完全或部分烷氧基甲基化甘脲及/或其縮合物、以及完全或部分烷氧基甲基化咪唑啶酮及/或其縮合物所組成之群中者。 項目B21.如上述項目中任一項之硬化性樹脂組合物,其中該交聯劑係選自由式B1: [化7](此處, R1b
具有1~25個碳原子,且選自由經取代或未經取代之烷基、經取代或未經取代之烯基、經取代或未經取代之芳香族基、經取代或未經取代之雜芳香族基、及 [化8]所表示之二取代胺所組成之群, R2b
~R7b
相互獨立地具有1~10個碳原子,且選自由經取代或未經取代之烷基、及經取代或未經取代之烯基所組成之群) 所表示之化合物及/或其縮合物、 式B2: [化9](此處,R8b
~R11b
相互獨立地具有1~10個碳原子,且選自由經取代或未經取代之烷基、及經取代或未經取代之烯基所組成之群) 所表示之化合物及/或其縮合物、以及 式B3: [化10](此處, R12b
及R13b
相互獨立地具有1~10個碳原子,且選自由經取代或未經取代之烷基、及經取代或未經取代之烯基所組成之群, R14b
及R15b
相互獨立地為氫或者具有1~10個碳原子,且選自由經取代或未經取代之烷基、及經取代或未經取代之烯基所組成之群) 所表示之化合物及/或其縮合物 所組成之群中者。 項目B22.如上述項目中任一項之硬化性樹脂組合物,其中該縮合物包含式B1、式B2、或式B3所表示之該化合物之聚合物。 項目B23.如上述項目中任一項之硬化性樹脂組合物,其中該縮合物包含式B1、式B2、或式B3所表示之該化合物之二聚物、三聚物或更高次之聚合物。 項目B24.如上述項目中任一項之硬化性樹脂組合物,其中該交聯劑係對於式B1、式B2、或式B3所表示之該化合物,分別具有1.3至1.8之重量平均聚合度。 項目B25.如上述項目中任一項之硬化性樹脂組合物,其中R1b
係選自經取代或未經取代之芳香族基、及 [化11]所表示之二取代胺所組成之群,R2b
~R13b
相互獨立地為經取代或未經取代之烷基,R14b
及R15b
相互獨立地為氫。 項目B26.如上述項目中任一項之硬化性樹脂組合物,其中該組合物中之該直鏈狀聚合物之質量與該交聯劑之質量之比為1:2~1:0.03。 項目B27.如上述項目中任一項之硬化性樹脂組合物,其進而包含酸觸媒。 項目B28.如上述項目中任一項之硬化性樹脂組合物,其中該酸觸媒係選自由對甲苯磺酸(PTS)、十二烷基苯磺酸、及熱酸產生劑San-Aid SI-100L(三新化學工業股份有限公司)所組成之群中之化合物、或者其鹽或其溶劑合物。 項目B29.如上述項目中任一項之硬化性樹脂組合物,其係包含溶劑者。 項目B30.一種硬化樹脂膜,其係使如上述項目中任一項之硬化性樹脂組合物硬化而成。 項目B31.一種易剝離性硬化樹脂膜,其係使如上述項目中任一項之硬化性樹脂組合物於基板表面硬化成膜狀而成。 項目B32.如上述項目中任一項之硬化樹脂膜,其具有0.5 N/mm2
以下之於鈉玻璃製基板或無鹼玻璃製基板上之剝離力。 項目B33.如上述項目中任一項之硬化樹脂膜,其具有0.1 N/mm2
以下之於鈉玻璃製基板或無鹼玻璃製基板上之剝離力。 項目B34.一種硬化樹脂膜之製造方法,其係由如上述項目中任一項之硬化性樹脂組合物製造硬化樹脂膜之方法,該方法包括: (i)準備具備具有醇性二級或三級羥基之側鏈之鏈狀聚合物及交聯劑之步驟; (ii)將包含該鏈狀聚合物及該交聯劑之該硬化性樹脂組合物塗佈於基板上而形成硬化性樹脂組合物塗膜之步驟; (iii)藉由使該硬化性樹脂組合物塗膜進行聚合反應使之硬化而製成硬化樹脂膜之步驟。 項目B35.如上述項目之製造方法,其進而包括(iv)將形成於該基板上之該硬化樹脂膜自該基板剝離之步驟。 項目B36.一種硬化樹脂膜之製造方法,其係製造硬化樹脂膜之方法,該方法包括: (i)準備具備具有醇性二級或三級羥基之側鏈之鏈狀聚合物及交聯劑之步驟; (ii)將包含該鏈狀聚合物及該交聯劑之組合物塗佈於基板上而形成硬化性樹脂組合物塗膜之步驟; (iii)藉由使該硬化性樹脂組合物塗膜進行聚合反應而製成硬化樹脂膜之步驟;此處, (a)該側鏈係包含3~30個碳原子而成者,且係包含至少1個飽和或不飽和之烴基而成、或者除此以外進而包含至少1個芳香族基而成者,且可包含將其等中鄰接之基之碳原子間連接之選自由-COO-、-O-、及-CO-所組成之群中之鍵; (b)該交聯劑係選自三𠯤系交聯劑或甘脲系交聯劑中者。 項目B37.如上述項目中任一項之製造方法,其中該鏈狀聚合物係包含如下單體單元而成者,該單體單元係具備具有醇性二級或三級羥基之該側鏈之單體單元,且係(甲基)丙烯酸系單體、乙烯酯系單體、乙烯醚系單體、及該等以外之乙烯系單體之任意至少1種。 項目B38.如上述項目中任一項之製造方法,其中該鏈狀聚合物係包含選自由CH2
=CH-COO-R1
、CH2
=C(CH3
)-COO-R2
、CH2
=CH-O-CO-R3
、CH2
=CH-O-R4
、及CH2
=CH-R5
(此處,R1
、R2
、R3
、R4
、及R5
係相互獨立地具有於經由酯鍵而鍵結於各乙烯基之情形時包括構成該酯鍵之碳原子在內的3~30個碳原子,具有醇性二級或三級羥基,並包含至少1個飽和或不飽和之烴基而成、或者進而包含至少1個芳香族基而成,且可具有將碳原子間連接之選自由-COO-、-O-、及-CO-所組成之群中之鍵)所表示之化合物所組成之群中之單體單元而成者。 項目B39.如上述項目中任一項之製造方法,其中該鏈狀聚合物係進而包含如下追加之單體單元而成者,該追加之單體單元係不具有羥基且側鏈之碳原子數為1~15的(甲基)丙烯酸系單體、乙烯酯系單體、乙烯醚系單體、及該等以外之乙烯系單體之任意至少1種。 項目B40.如上述項目中任一項之製造方法,其中該追加之單體單元係選自由CH2
=CH-COO-R6
、CH2
=C(CH3
)-COO-R7
、CH2
=CH-O-CO-R8
(此處,R6
、R7
、及R8
係相互獨立地具有1~15個碳原子,不具有羥基,包含至少1個飽和或不飽和之烴基而成、或者進而包含至少1個芳香族基而成,可具有將碳原子間連接之選自由-COO-、-O-、及-CO-所組成之群中之鍵)、CH2
=CH-O-R9
、CH2
=CH-R10
(此處,R9
、及R10
係相互獨立地具有3~15個碳原子,不具有羥基,包含至少1個飽和或不飽和之烴基而成、或者進而包含至少1個芳香族基而成,可具有將碳原子間連接之選自由-COO-、-O-、及-CO-所組成之群中之鍵)、C4
HO3
-R11
、及C4
H2
NO2
-R12
(此處,C4
HO3
-表示順丁烯二酸酐基,C4
H2
NO2
-表示順丁烯二醯亞胺基,R11
、及R12
係相互獨立地為氫原子或者具有1~15個碳原子數,不具有羥基,包含至少1個飽和或不飽和之烴基而成、或者進而包含至少1個芳香族基而成,可具有將碳原子間連接之選自由-COO-、-O-、及-CO-所組成之群中之鍵)所表示之化合物所組成之群中者。 項目B41.如上述項目中任一項之製造方法,其中構成該鏈狀聚合物之單體單元中之具有醇性二級或三級羥基之單體單元所占之比率為30~100莫耳%。 項目B42.如上述項目中任一項之製造方法,其中該交聯劑係選自由完全或部分烷氧基甲基化三聚氰胺、完全或部分烷氧基甲基化胍胺、完全或部分烷氧基甲基化乙醯胍胺、或完全或部分烷氧基甲基化苯并胍胺、及完全或部分烷氧基甲基化甘脲所組成之群中者。 項目B43.如上述項目中任一項之製造方法,其中該組合物中之該直鏈狀聚合物之質量與該交聯劑之質量之比為1:2~1:0.03。 項目B44.如上述項目中任一項之製造方法,其中該組合物係包含溶劑者。 項目B45.如上述項目中任一項之製造方法,其中該組合物係進而包含酸觸媒者。 項目B46.如上述項目中任一項之硬化樹脂膜之製造方法,其進而包括(iv)將形成於該基板上之該硬化樹脂膜自該基板剝離之步驟。 項目B47.一種組合物,其包含如上述項目中任一項之硬化性樹脂組合物或硬化樹脂膜,且係用以藉由光微影法製作電路。 項目B48.一種組合物,其包含如上述項目中任一項之硬化性樹脂組合物或硬化樹脂膜,且係用以製作片狀之軟性之電性、電子電路零件或軟性之顯示裝置。 項目B49.一種組合物,其包含如上述項目中任一項之硬化性樹脂組合物或硬化樹脂膜,且係用於合成樹脂、丸劑、膜、平板、纖維、發泡劑、管體、橡膠、彈性體等,且用以製作二輪車(自行車、機車等)、汽車、飛機、電車、船、火箭、太空船、運送、娛樂、傢俱(例如,餐桌、椅子、書桌、架子等)、寢具(例如,床、吊床等)、衣服、防護服、體育用品、浴缸、廚具、餐具、烹飪用具、容器及包裝材(食品用容器、化妝品用容器、貨物用集裝箱、垃圾箱等)、建築(建築物、道路、建築零件等)、農業膜、工業膜、上下水道、塗料、化妝料、電機產業及電子產業領域(電化製品、電腦用零件、印刷基板、絕緣體、導電體、配線覆膜材、發電元件、揚聲器、麥克風、雜訊消除器、轉換器等)、光通信纜線、醫療用材料及器具(導管、導線、人工血管、人工肌肉、人工器官、透析膜、內視鏡等)、小型泵、致動器、機器人材料(產業用機器人等所使用之感測器)、能量產生裝置及電廠(太陽光發電、風力發電等)。 項目B50.一種組合物,其包含如上述項目中任一項之硬化性樹脂組合物或硬化樹脂膜,且係用以製作電子材料、醫療材料、保健材料、生命科學材料、或機器人材料。 項目B51.一種組合物,其包含如上述項目中任一項之硬化性樹脂組合物或硬化樹脂膜,且係用以製作導管、導線、醫藥品用容器、或管體等材料。 項目B52.一種組合物,其包含如上述項目中任一項之硬化性樹脂組合物或硬化樹脂膜,且係用以製作汽車零件(車體面板、保險桿、門下圍板(rocker panel)、側飾條、引擎零件、驅動零件、傳導零件、操縱裝置零件、穩定器零件、懸架-制動裝置零件、刹車零件、軸零件、管類、槽類、車輪、座椅、安全帶等)。 項目B53.一種組合物,其包含如上述項目中任一項之硬化性樹脂組合物或硬化樹脂膜,且係用以製作汽車用防振材、汽車用塗料、汽車用合成樹脂。 項目B54.一種如上述項目中任一項之硬化性樹脂組合物或硬化樹脂膜之用途,其係用以藉由光微影法製作電路。 項目B55.一種如上述項目中任一項之硬化性樹脂組合物或硬化樹脂膜之用途,其係用以製作片狀之軟性之電性、電子電路零件或軟性之顯示裝置。 項目B56.一種如上述項目中任一項之硬化性樹脂組合物或硬化樹脂膜之用途,其係用於合成樹脂、丸劑、膜、平板、纖維、發泡劑、管體、橡膠、彈性體等,且係用以製作二輪車(自行車、機車等)、汽車、飛機、電車、船、火箭、太空船、運送、娛樂、傢俱(例如,餐桌、椅子、書桌、架子等)、寢具(例如,床、吊床等)、衣服、防護服、體育用品、浴缸、廚具、餐具、烹飪用具、容器及包裝材(食品用容器、化妝品用容器、貨物用集裝箱、垃圾箱等)、建築(建築物、道路、建築零件等)、農業膜、工業膜、上下水道、塗料、化妝料、電機產業及電子產業領域(電化製品、電腦用零件、印刷基板、絕緣體、導電體、配線覆膜材、發電元件、揚聲器、麥克風、雜訊消除器、轉換器等)、光通信纜線、醫療用材料及器具(導管、導線、人工血管、人工肌肉、人工器官、透析膜、內視鏡等)、小型泵、致動器、機器人材料(產業用機器人等所使用之感測器)、能量產生裝置及電廠(太陽光發電、風力發電等)。 項目B57.一種如上述項目中任一項之硬化性樹脂組合物或硬化樹脂膜之用途,其係用以製作電子材料、醫療材料、保健材料、生命科學材料、或機器人材料。 項目B58.一種如上述項目中任一項之硬化性樹脂組合物或硬化樹脂膜之用途,其係用以製作導管、導線、醫藥品用容器、或管體等材料。 項目B59.一種如上述項目中任一項之硬化性樹脂組合物或硬化樹脂膜之用途,其係用以製作汽車零件(車體面板、保險桿、門下圍板、側飾條、引擎零件、驅動零件、傳導零件、操縱裝置零件、穩定器零件、懸架-制動裝置零件、刹車零件、軸零件、管類、槽類、車輪、座椅、安全帶等)。 項目B60.一種如上述項目中任一項之硬化性樹脂組合物或硬化樹脂膜之用途,其係用以製作汽車用防振材、汽車用塗料、汽車用合成樹脂。 項目B61.一種方法,其係藉由光微影法製作電路之方法,且包括藉由進行聚合反應而形成如上述項目中任一項之硬化性樹脂組合物或硬化樹脂膜之製程。 項目B62.一種方法,其係製作片狀之軟性之電性、電子電路零件或軟性之顯示裝置之方法,且包括藉由進行聚合反應而形成如上述項目中任一項之硬化性樹脂組合物或硬化樹脂膜之製程。 項目B63.一種方法,其使用於合成樹脂、丸劑、膜、平板、纖維、發泡劑、管體、橡膠、彈性體等,製作二輪車(自行車、機車等)、汽車、飛機、電車、船、火箭、太空船、運送、娛樂、傢俱(例如,餐桌、椅子、書桌、架子等)、寢具(例如,床、吊床等)、衣服、防護服、體育用品、浴缸、廚具、餐具、烹飪用具、容器及包裝材(食品用容器、化妝品用容器、貨物用集裝箱、垃圾箱等)、建築(建築物、道路、建築零件等)、農業膜、工業膜、上下水道、塗料、化妝料、電機產業及電子產業領域(電化製品、電腦用零件、印刷基板、絕緣體、導電體、配線覆膜材、發電元件、揚聲器、麥克風、雜訊消除器、轉換器等)、光通信纜線、醫療用材料及器具(導管、導線、人工血管、人工肌肉、人工器官、透析膜、內視鏡等)、小型泵、致動器、機器人材料(產業用機器人等所使用之感測器)、能量產生裝置及電廠(太陽光發電、風力發電等),且包括藉由進行聚合反應而形成如上述項目中任一項之硬化性樹脂組合物或硬化樹脂膜之製程。 項目B64.一種方法,其係製作電子材料、醫療材料、保健材料、生命科學材料、或機器人材料之方法,且包括藉由進行聚合反應而形成如上述項目中任一項之硬化性樹脂組合物或硬化樹脂膜之製程。 項目B65.一種方法,其係製作導管、導線、醫藥品用容器、或管體等材料之方法,且包括藉由聚合反應而形成如上述項目中任一項之硬化性樹脂組合物或硬化樹脂膜之製程。 項目B66.一種方法,其係製作汽車零件(車體面板、保險桿、門下圍板、側飾條、引擎零件、驅動零件、傳導零件、操縱裝置零件、穩定器零件、懸架-制動裝置零件、刹車零件、軸零件、管類、槽類、車輪、座椅、安全帶等)之方法,且包括藉由進行聚合反應而形成如上述項目中任一項之硬化性樹脂組合物或硬化樹脂膜之製程。 項目B67.一種方法,其係製作汽車用防振材、汽車用塗料、汽車用合成樹脂之方法,且包括藉由進行聚合反應而形成如上述項目中任一項之硬化性樹脂組合物或硬化樹脂膜之製程。[Technical means for solving the problem] Against the above background, the purpose of the present invention is to provide a curable resin composition that can be coated very thinly on the surface of a substrate (glass, etc.) to form a film, can be cured to form a curable resin film, can withstand a high temperature of 230°C during baking in the process of making a circuit on the curable resin film by patterning, and can be easily peeled off from the substrate without any effort after exposure to such a high temperature. The inventors of the present invention have found that the above purpose can be achieved by a curable resin composition comprising a polymer having side chains with structural characteristics within a specific range and a crosslinking agent within a specific range. That is, the present invention provides the following items. Item A1. A curable resin composition comprising a chain polymer having a side chain having an alcoholic secondary or tertiary hydroxyl group, and a crosslinking agent, wherein (a) the side chain comprises 3 to 30 carbon atoms and comprises at least one saturated or unsaturated hydrocarbon group, or further comprises at least one aromatic group, and may comprise a bond connecting carbon atoms selected from the group consisting of -COO-, -O-, and -CO-; and (b) the crosslinking agent is selected from a tri-hydrazide crosslinking agent or a glycoluril crosslinking agent. Item A2. The curable resin composition as described in the above items, wherein the chain polymer is composed of the following monomer units, which are monomer units having the side chain having an alcoholic secondary or tertiary hydroxyl group, and are at least one of (meth)acrylic monomers, vinyl ester monomers, vinyl ether monomers, and vinyl monomers other than these. Item A3. The curable resin composition as described in any of the above items, wherein the chain polymer is composed of a monomer unit selected from CH2 =CH-COO-R1, CH2=C( CH3 )-COO- R2 , CH2=CH-O-CO-R3, CH2 =CH-OR4, and CH2=CH-R5 (herein, R1 , R2, R3 , R4 , and R5 are selected from the group consisting of CH2 =CH-COO-R1, CH2 =C(CH3)-COO-R2, CH2 =CH-O-CO- R3 , CH2 =CH- OR4 , and CH2=CH-R5) . 5 is composed of monomer units selected from the group consisting of compounds represented by (a) which independently have 3 to 30 carbon atoms including the carbon atom constituting the ester bond when bonded to each vinyl group via an ester bond, have an alcoholic secondary or tertiary hydroxyl group, contain at least one saturated or unsaturated hydrocarbon group, or further contain at least one aromatic group, and may have a bond connecting carbon atoms selected from the group consisting of -COO-, -O-, and -CO-. Item A4. A curable resin composition as described in any of the above items, wherein the chain polymer further comprises an additional monomer unit, and the additional monomer unit is at least one of a (meth)acrylic monomer, a vinyl ester monomer, a vinyl ether monomer, and a vinyl monomer other than these monomers which does not have a hydroxyl group and has 1 to 15 carbon atoms in the side chain. Item A5. A curable resin composition as described in any of the above items, wherein the additional monomer unit is selected from CH2 =CH-COO- R6 , CH2 =C( CH3 )-COO- R7 , CH2 =CH-O-CO- R8 (herein, R6 , R7 and R8 independently have 1 to 15 carbon atoms, have no hydroxyl group, contain at least one saturated or unsaturated hydrocarbon group, or further contain at least one aromatic group, and may have a bond connecting carbon atoms selected from the group consisting of -COO-, -O-, and -CO-, and the hydrocarbon group or aromatic group may have an amine group), CH2=CH-OR9, CH2=CH-R10 (herein, R9 and R11 are independently selected from the group consisting of -COO-, -O-, and -CO-, and the hydrocarbon group or aromatic group may have an amino group), CH2 =CH- OR9 , CH2=CH- R10 (herein, R9 and R12 are independently selected from the group consisting of -COO-, -O-, and -CO-, and the hydrocarbon group or aromatic group may have an amino group), CH2=CH-OR9, CH2 =CH-R10 10 independently have 3 to 15 carbon atoms, have no hydroxyl group, contain at least one saturated or unsaturated alkyl group, or further contain at least one aromatic group, and may have a bond connecting carbon atoms selected from the group consisting of -COO-, -O-, and -CO-, and the alkyl group or aromatic group may have an amine group), C 4 HO 3 -R 11 , and C 4 H 2 NO 2 -R 12 (herein, C 4 HO 3 - represents a maleic anhydride group, C 4 H 2 NO 2 - represents a maleic anhydride group, R 11 , and R 12 is independently a hydrogen atom or has 1 to 15 carbon atoms, has no hydroxyl group, contains at least one saturated or unsaturated hydrocarbon group, or further contains at least one aromatic group, and may have a bond connecting carbon atoms selected from the group consisting of -COO-, -O-, and -CO-, and the hydrocarbon group or aromatic group may have an amine group). Item A6. A curable resin composition as described in any of the above items, wherein the ratio of monomer units having alcoholic secondary or tertiary hydroxyl groups in the monomer units constituting the chain polymer is 30 to 100 mol%. Item A7. A hardening resin composition as described in any of the above items, wherein the crosslinking agent is selected from the group consisting of completely or partially alkoxymethylated melamine, completely or partially alkoxymethylated guanamine, completely or partially alkoxymethylated acetoguanamine, completely or partially alkoxymethylated benzoguanamine, and completely or partially alkoxymethylated glycoluril. Item A8. A hardening resin composition as described in any of the above items, wherein the ratio of the mass of the linear polymer to the mass of the crosslinking agent in the composition is 1:2 to 1:0.05. Item A9. A hardening resin composition as described in any of the above items, which contains a solvent. Item A10. A hardening resin film, which is formed by hardening the hardening resin composition as described in any of the above items. Item A11. A peelable hardening resin film, which is formed by hardening a hardening resin composition such as any of the above items on a substrate surface into a film shape. Item A12. A method for manufacturing a hardening resin film, which is a method for manufacturing a hardening resin film, the method comprising: preparing a chain polymer having a side chain with an alcoholic secondary or tertiary hydroxyl group and a crosslinking agent; applying a composition comprising the chain polymer and the crosslinking agent on a substrate to form a hardening resin composition coating; and forming a hardening resin film by subjecting the hardening resin composition coating to a polymerization reaction to harden it, wherein, (a) The side chain is composed of 3 to 30 carbon atoms and contains at least one saturated or unsaturated hydrocarbon group, or in addition thereto contains at least one aromatic group, and may contain a bond selected from the group consisting of -COO-, -O-, and -CO- that connects the carbon atoms of adjacent groups therein; (b) The crosslinking agent is selected from tri-hydrazide crosslinking agents or glycoluril crosslinking agents. Item A13. The production method as described in the above item, wherein the chain polymer is composed of the following monomer units, which are monomer units having the side chain having an alcoholic secondary or tertiary hydroxyl group, and are at least one of any one of a (meth)acrylic acid monomer, a vinyl ester monomer, a vinyl ether monomer, and vinyl monomers other than these. Item A14. The method of any one of the above items, wherein the chain polymer comprises a group selected from CH2 =CH-COO- R1 , CH2 =C( CH3 )-COO- R2 , CH2 =CH-O-CO- R3 , CH2 =CH- OR4 , and CH2 =CH- R5 (herein, R1 , R2 , R3 , R4 , and R5 are 5 is composed of monomer units selected from the group consisting of compounds represented by (a) which independently have 3 to 30 carbon atoms including the carbon atom constituting the ester bond when bonded to each vinyl group via an ester bond, have an alcoholic secondary or tertiary hydroxyl group, contain at least one saturated or unsaturated hydrocarbon group, or further contain at least one aromatic group, and may have a bond connecting carbon atoms selected from the group consisting of -COO-, -O-, and -CO-. Item A15. A production method as described in any of the above items, wherein the chain polymer further comprises the following additional monomer units, and the additional monomer units are at least one of any (meth)acrylic acid monomers, vinyl ester monomers, vinyl ether monomers, and vinyl monomers other than these monomers, which do not have a hydroxyl group and have 1 to 15 carbon atoms in the side chain. Item A16. The production method of any of the above items, wherein the additional monomer unit is selected from CH2 =CH-COO- R6 , CH2 =C( CH3 )-COO- R7 , CH2 =CH-O-CO- R8 (herein, R6 , R7 , and R8 independently have 1 to 15 carbon atoms, have no hydroxyl group, contain at least one saturated or unsaturated hydrocarbon group, or further contain at least one aromatic group, and may have a bond connecting carbon atoms selected from the group consisting of -COO-, -O-, and -CO-), CH2=CH-OR9, CH2=CH-R10 (herein, R9, and R8 are independently selected from the group consisting of -COO-, -O-, and -CO-), CH2 =CH- OR9 , CH2 =CH- R10 (herein, R9 , and R10 are independently selected from the group consisting of -COO-, -O-, and -CO-). 10 independently have 3 to 15 carbon atoms, have no hydroxyl group, contain at least one saturated or unsaturated hydrocarbon group, or further contain at least one aromatic group, and may have a bond connecting carbon atoms selected from the group consisting of -COO-, -O-, and -CO-), C 4 HO 3 -R 11 , and C 4 H 2 NO 2 -R 12 (herein, C 4 HO 3 - represents a maleic anhydride group, C 4 H 2 NO 2 - represents a maleic anhydride group, R 11 , and R 12 is independently a hydrogen atom or has 1 to 15 carbon atoms, has no hydroxyl group, contains at least one saturated or unsaturated hydrocarbon group, or further contains at least one aromatic group, and may have a bond connecting carbon atoms selected from the group consisting of -COO-, -O-, and -CO-). Item A17. The production method of any of the above items, wherein the ratio of monomer units having alcoholic secondary or tertiary hydroxyl groups in the monomer units constituting the chain polymer is 30 to 100 mol%. Item A18. A manufacturing method as described in any of the above items, wherein the crosslinking agent is selected from the group consisting of completely or partially alkoxymethylated melamine, completely or partially alkoxymethylated guanamine, completely or partially alkoxymethylated acetylguanamine, or completely or partially alkoxymethylated benzoguanamine, and completely or partially alkoxymethylated glycoluril. Item A19. A manufacturing method as described in any of the above items, wherein the ratio of the mass of the linear polymer in the composition to the mass of the crosslinking agent is 1:2 to 1:0.05. Item A20. A manufacturing method as described in any of the above items, wherein the composition contains a solvent. Item A21. A manufacturing method for a hardened resin film as described in any of the above items, further comprising the step of peeling the hardened resin film formed on the substrate from the substrate. In addition, the present invention provides the following items. Item B1. A curable resin composition, comprising a chain polymer having a side chain with an alcoholic secondary or tertiary hydroxyl group, and a crosslinking agent, wherein (a) the side chain comprises 3 to 30 carbon atoms, and comprises at least one saturated or unsaturated hydrocarbon group, or further comprises at least one aromatic group, and may comprise a bond connecting carbon atoms selected from the group consisting of -COO-, -O-, and -CO-; (b) the crosslinking agent is selected from the group consisting of a trioxane compound and/or its condensate, a glycoluril compound and/or its condensate, and an imidazolidinone compound and/or its condensate. Item B2. A curable resin composition as described in the above item, wherein the chain polymer is composed of the following monomer units, which are monomer units having the side chain having an alcoholic secondary or tertiary hydroxyl group, and are at least one of unsubstituted or α-substituted (meth)acrylic monomers, unsubstituted or α-substituted vinyl ester monomers, unsubstituted or α-substituted vinyl ether monomers, and unsubstituted or α-substituted vinyl monomers other than these. Item B3. The hardening resin composition of any of the above items, wherein the chain polymer comprises a group selected from CH2 =C( R1a )-COO- R1 , CH2 =C( R1a )-O-CO- R3 , CH2 =C( R1a ) -OR4 , and CH2 =C( R1a ) -R5 (herein, R1 , R3 , R4 , and R 5 independently has 3 to 30 carbon atoms including the carbon atom constituting the ester bond when bonded to each vinyl group via an ester bond, has an alcoholic secondary or tertiary hydroxyl group, contains at least one saturated or unsaturated hydrocarbon group, or further contains at least one aromatic group, and may have a bond connecting carbon atoms selected from the group consisting of -COO-, -O-, and -CO-, and R 1a is a monomer unit selected from the group consisting of hydrogen, substituted or unsubstituted alkyl, and substituted or unsubstituted alkenyl). Item B4. The hardening resin composition as described in any of the above items, wherein the chain polymer comprises the formula A1: [Chemical 1] (Herein, R 1a is selected from the group consisting of hydrogen, substituted or unsubstituted alkyl, and substituted or unsubstituted alkenyl, L 1 is selected from the group consisting of a single bond, substituted or unsubstituted alkylene, and substituted or unsubstituted alkenylene, R 2a , R 3a , and R 4a are independently selected from the group consisting of hydrogen and substituted or unsubstituted alkyl, but at least one of R 2a , R 3a , and R 4a is a substituted or unsubstituted secondary or tertiary OH-containing group) The hardening resin composition of any of the above items, wherein the chain polymer comprises formula A2: [Chemical 2] (Herein, R 1a is selected from the group consisting of hydrogen, substituted or unsubstituted alkyl, and substituted or unsubstituted alkenyl, L 1 is selected from the group consisting of a single bond, substituted or unsubstituted alkylene, and substituted or unsubstituted alkenylene, R 5a to R 14a are independently selected from the group consisting of hydrogen, hydroxyl, and [Chemical 3] or together form a ring, except that at least one of R 5a to R 14a or the substituents of the ring is a hydroxyl group, and R 15a is selected from the group consisting of substituted or unsubstituted alkyl, substituted or unsubstituted alkenyl, substituted or unsubstituted cycloalkyl, substituted or unsubstituted cycloalkenyl, substituted or unsubstituted aromatic, and substituted or unsubstituted heteroaromatic). Item B6. The curable resin composition of any of the above items, wherein the chain polymer comprises formula A3: [Chemical 4] (Herein, R 1a is selected from the group consisting of hydrogen, substituted or unsubstituted alkyl, and substituted or unsubstituted alkenyl, L 2 is selected from the group consisting of substituted or unsubstituted alkylene, and substituted or unsubstituted alkenylene, R 16a is selected from the group consisting of substituted or unsubstituted alkylene, substituted or unsubstituted alkenyl, and substituted or unsubstituted alkynyl, R 17a is selected from the group consisting of hydrogen, substituted or unsubstituted alkylene, substituted or unsubstituted alkenyl, and substituted or unsubstituted alkynyl) The hardening resin composition according to any of the above items, wherein the chain polymer comprises Formula A4: [Chemical 5] (Herein, R 1a is selected from the group consisting of hydrogen, substituted or unsubstituted alkyl, and substituted or unsubstituted alkenyl, L 1 is selected from the group consisting of a single bond, substituted or unsubstituted alkylene, and substituted or unsubstituted alkenylene, and R 18a is an adamantyl group substituted with at least one hydroxyl group). Item B8. The hardening resin composition of any of the above items, wherein the chain polymer comprises Formula A5: [Chemical 6] (herein, R 1a is selected from the group consisting of hydrogen, substituted or unsubstituted alkyl, and substituted or unsubstituted alkenyl, L 1 is selected from the group consisting of a single bond, substituted or unsubstituted alkylene, and substituted or unsubstituted alkenylene, R 19a is selected from the group consisting of substituted or unsubstituted alkyl, substituted or unsubstituted alkenyl, substituted or unsubstituted cycloalkyl, and substituted or unsubstituted cycloalkenyl) The hardening resin composition according to any of the above items, wherein R 19a is a substituted or unsubstituted adamantyl. Item B10. A curable resin composition comprising a chain polymer having a side chain having an alcoholic secondary or tertiary hydroxyl group, and a crosslinking agent, wherein (a) the side chain comprises 3 to 30 carbon atoms and comprises at least one saturated or unsaturated hydrocarbon group, or further comprises at least one aromatic group, and may comprise a bond connecting carbon atoms selected from the group consisting of -COO-, -O-, and -CO-, and (b) the crosslinking agent is selected from a tri-hydrazide crosslinking agent or a glycoluril crosslinking agent. Item B11. The curable resin composition of any of the above items, wherein the chain polymer is composed of the following monomer units, which are monomer units having the side chain having an alcoholic secondary or tertiary hydroxyl group, and are at least one of a (meth)acrylic monomer, a vinyl ester monomer, a vinyl ether monomer, and vinyl monomers other than these. Item B12. The curable resin composition of any of the above items, wherein the chain polymer is selected from CH2 =CH-COO- R1 , CH2 =C( CH3 )-COO- R2 , CH2 =CH-O-CO- R3 , CH2 =CH- OR4 , and CH2 =CH- R5 (herein, R1 , R2 , R3 , R4 , and R5 are the same as those in the above items). 5 is a monomer unit selected from the group consisting of compounds represented by (a) which independently has 3 to 30 carbon atoms including the carbon atom constituting the ester bond when the monomer unit is bonded to each vinyl group via an ester bond, has an alcoholic secondary or tertiary hydroxyl group, contains at least one saturated or unsaturated hydrocarbon group, or further contains at least one aromatic group, and may have a bond connecting carbon atoms selected from the group consisting of -COO-, -O-, and -CO-. Item B13. The curable resin composition as described in any of the above items, wherein the monomer unit is a (meth)acrylic monomer. Item B14. The curable resin composition as described in any of the above items, wherein R 1a is hydrogen or methyl. Item B15. A curable resin composition as described in any of the above items, wherein the chain polymer further comprises the following additional monomer units, and the additional monomer units are at least one of unsubstituted or α-substituted (meth)acrylic monomers, unsubstituted or α-substituted vinyl ester monomers, unsubstituted or α-substituted vinyl ether monomers, and unsubstituted or α-substituted vinyl monomers other than these monomers, which may or may not have a hydroxyl group and have 1 to 15 carbon atoms in the side chain. Item B16. A curable resin composition as described in any of the above items, wherein the additional monomer unit is selected from the group consisting of CH2 =C( R1a )-COO- R6 , CH2 =C( R1a )-O-CO- R8 (wherein R6 and R8 independently have 1 to 15 carbon atoms, may or may not have a hydroxyl group, contain at least one saturated or unsaturated hydrocarbon group, or further contain at least one aromatic group, may have a bond connecting carbon atoms selected from the group consisting of -COO-, -O-, and -CO-, the hydrocarbon group or aromatic group may have an amine group, and R1a is selected from the group consisting of hydrogen, a substituted or unsubstituted alkyl group, and a substituted or unsubstituted alkenyl group), CH2 =C( R1a )-OR 9 , CH 2 =C(R 1a )-R 10 (herein, R 9 and R 10 independently have 3 to 15 carbon atoms, may or may not have a hydroxyl group, include at least one saturated or unsaturated alkyl group, or further include at least one aromatic group, and may have a bond connecting carbon atoms selected from the group consisting of -COO-, -O-, and -CO-, the alkyl group or aromatic group may have an amine group, and R 1a is selected from the group consisting of hydrogen, a substituted or unsubstituted alkyl group, and a substituted or unsubstituted alkenyl group), C 4 (R 1a )O 3 -R 11 , and C 4 (R 1a )HNO 2 -R 12 (herein, C 4 (R 1a )O 3 - represents an unsubstituted or substituted maleic anhydride group, C 4 (R 1a )HNO 2 - represents an unsubstituted or substituted maleimide group, R 11 and R 12 are independently a hydrogen atom or a group having 1 to 15 carbon atoms, which may or may not have a hydroxyl group, which contains at least one saturated or unsaturated alkyl group, or further contains at least one aromatic group, and may have a bond connecting carbon atoms selected from the group consisting of -COO-, -O-, and -CO-, the alkyl group or aromatic group may have an amine group, and R 1a is selected from the group consisting of hydrogen, a substituted or unsubstituted alkyl group, and a substituted or unsubstituted alkenyl group). Item B17. A curable resin composition as described in any of the above items, wherein the chain polymer further comprises the following additional monomer units, and the additional monomer units are at least one of (meth)acrylic acid monomers, vinyl ester monomers, vinyl ether monomers, and vinyl monomers other than these monomers, which do not have a hydroxyl group and have 1 to 15 carbon atoms in the side chain. Item B18. A curable resin composition as described in any of the above items, wherein the additional monomer unit is selected from CH2 =CH-COO- R6 , CH2 =C( CH3 )-COO- R7 , CH2 =CH-O-CO- R8 (herein, R6 , R7 and R8 independently have 1 to 15 carbon atoms, have no hydroxyl group, contain at least one saturated or unsaturated hydrocarbon group, or further contain at least one aromatic group, and may have a bond connecting carbon atoms selected from the group consisting of -COO-, -O-, and -CO-, and the hydrocarbon group or aromatic group may have an amine group), CH2=CH-OR9, CH2=CH-R10 (herein, R9, and R11 are independently selected from the group consisting of -COO-, -O-, and -CO-, and the hydrocarbon group or aromatic group may have an amino group), CH2 =CH-OR9, CH2=CH- R10 (herein, R9 , and R12 are independently selected from the group consisting of -COO-, -O-, and -CO-, and the hydrocarbon group or aromatic group may have an amino group), CH2=CH- OR9 , CH2 =CH-R10 10 independently have 3 to 15 carbon atoms, have no hydroxyl group, contain at least one saturated or unsaturated alkyl group, or further contain at least one aromatic group, and may have a bond connecting carbon atoms selected from the group consisting of -COO-, -O-, and -CO-, and the alkyl group or aromatic group may have an amine group), C 4 HO 3 -R 11 , and C 4 H 2 NO 2 -R 12 (herein, C 4 HO 3 - represents a maleic anhydride group, C 4 H 2 NO 2 - represents a maleic anhydride group, R 11 , and R 12 is independently a hydrogen atom or has 1 to 15 carbon atoms, has no hydroxyl group, contains at least one saturated or unsaturated hydrocarbon group, or further contains at least one aromatic group, and may have a bond connecting carbon atoms selected from the group consisting of -COO-, -O-, and -CO-, and the hydrocarbon group or aromatic group may have an amine group). Item B19. A curable resin composition as described in any of the above items, wherein the ratio of monomer units having alcoholic secondary or tertiary hydroxyl groups in the monomer units constituting the chain polymer is 30 to 100 mol%. Item B20. A hardening resin composition as described in any of the above items, wherein the crosslinking agent is selected from the group consisting of completely or partially alkoxymethylated melamine and/or its condensate, completely or partially alkoxymethylated guanamine and/or its condensate, completely or partially alkoxymethylated acetoguanamine and/or its condensate, completely or partially alkoxymethylated benzoguanamine and/or its condensate, completely or partially alkoxymethylated glycoluril and/or its condensate, and completely or partially alkoxymethylated imidazolidinone and/or its condensate. Item B21. A hardening resin composition as described in any of the above items, wherein the crosslinking agent is selected from the group consisting of Formula B1: [Chemical 7] (Herein, R 1b has 1 to 25 carbon atoms and is selected from substituted or unsubstituted alkyl, substituted or unsubstituted alkenyl, substituted or unsubstituted aromatic, substituted or unsubstituted heteroaromatic, and [Chemical 8] R 2b to R 7b independently have 1 to 10 carbon atoms and are selected from the group consisting of substituted or unsubstituted alkyl and substituted or unsubstituted alkenyl) a compound represented by and/or its condensate, Formula B2: [Chem. 9] (herein, R 8b to R 11b independently have 1 to 10 carbon atoms and are selected from the group consisting of substituted or unsubstituted alkyl and substituted or unsubstituted alkenyl) a compound represented by and/or a condensate thereof, and formula B3: [Chemical 10] (herein, R 12b and R 13b independently have 1 to 10 carbon atoms and are selected from the group consisting of substituted or unsubstituted alkyl and substituted or unsubstituted alkenyl, R 14b and R 15b independently are hydrogen or have 1 to 10 carbon atoms and are selected from the group consisting of substituted or unsubstituted alkyl and substituted or unsubstituted alkenyl) and/or condensates thereof. Item B22. The curable resin composition according to any of the above items, wherein the condensate comprises a polymer of the compound represented by Formula B1, Formula B2, or Formula B3. Item B23. The curable resin composition according to any of the above items, wherein the condensate comprises a dimer, trimer, or higher polymer of the compound represented by Formula B1, Formula B2, or Formula B3. Item B24. The hardening resin composition of any of the above items, wherein the crosslinking agent has a weight average degree of polymerization of 1.3 to 1.8 for the compound represented by Formula B1, Formula B2, or Formula B3, respectively. Item B25. The hardening resin composition of any of the above items, wherein R 1b is selected from a substituted or unsubstituted aromatic group, and [Chemical 11] A group of disubstituted amines represented by, R 2b to R 13b are independently substituted or unsubstituted alkyl groups, and R 14b and R 15b are independently hydrogen. Item B26. A curable resin composition as described in any of the above items, wherein the ratio of the mass of the linear polymer to the mass of the crosslinking agent in the composition is 1:2 to 1:0.03. Item B27. A curable resin composition as described in any of the above items, further comprising an acid catalyst. Item B28. A curable resin composition as described in any of the above items, wherein the acid catalyst is a compound selected from the group consisting of p-toluenesulfonic acid (PTS), dodecylbenzenesulfonic acid, and thermal acid generator San-Aid SI-100L (San-Shin Chemical Industry Co., Ltd.), or a salt thereof or a solvent thereof. Item B29. A curable resin composition as described in any of the above items, which contains a solvent. Item B30. A curable resin film, which is formed by curing the curable resin composition as described in any of the above items. Item B31. An easily peelable curable resin film, which is formed by curing the curable resin composition as described in any of the above items into a film on the surface of a substrate. Item B32. A hardened resin film as described in any of the above items, which has a peeling force of 0.5 N/mm2 or less on a sodium glass substrate or an alkali-free glass substrate. Item B33. A hardened resin film as described in any of the above items, which has a peeling force of 0.1 N/ mm2 or less on a sodium glass substrate or an alkali-free glass substrate. Item B34. A method for producing a hardened resin film, which is a method for producing a hardened resin film from a hardening resin composition as described in any of the above items, the method comprising: (i) preparing a chain polymer having a side chain with an alcoholic secondary or tertiary hydroxyl group and a crosslinking agent; (ii) coating the hardening resin composition comprising the chain polymer and the crosslinking agent on a substrate to form a hardening resin composition coating; (iii) hardening the hardening resin composition coating by subjecting it to a polymerization reaction to form a hardened resin film. Item B35. The manufacturing method as described in the above item, further comprising (iv) the step of peeling the hardened resin film formed on the substrate from the substrate. Item B36. A method for manufacturing a hardened resin film, which is a method for manufacturing a hardened resin film, the method comprising: (i) the step of preparing a chain polymer having a side chain with an alcoholic secondary or tertiary hydroxyl group and a crosslinking agent; (ii) the step of coating a composition comprising the chain polymer and the crosslinking agent on a substrate to form a hardening resin composition coating; (iii) the step of forming a hardening resin film by subjecting the hardening resin composition coating to a polymerization reaction; herein, (a) The side chain comprises 3 to 30 carbon atoms and comprises at least one saturated or unsaturated hydrocarbon group, or in addition thereto comprises at least one aromatic group, and may comprise a bond selected from the group consisting of -COO-, -O-, and -CO- that connects the carbon atoms of adjacent groups therein; (b) The crosslinking agent is selected from a tri-hydrazide crosslinking agent or a glycoluril crosslinking agent. Item B37. A production method as described in any of the above items, wherein the chain polymer comprises the following monomer units, which are monomer units having the side chain having an alcoholic secondary or tertiary hydroxyl group, and are at least one of a (meth)acrylic acid monomer, a vinyl ester monomer, a vinyl ether monomer, and vinyl monomers other than these. Item B38. A production method as described in any of the above items, wherein the chain polymer comprises a monomer unit selected from the group consisting of CH2 =CH-COO- R1 , CH2 =C( CH3 )-COO- R2 , CH2 =CH-O-CO- R3 , CH2 =CH- OR4 , and CH2 =CH- R5 (herein, R1 , R2 , R3 , R4 , and R5 are 5 is composed of monomer units selected from the group consisting of compounds represented by (a) which independently have 3 to 30 carbon atoms including the carbon atom constituting the ester bond when bonded to each vinyl group via an ester bond, have an alcoholic secondary or tertiary hydroxyl group, contain at least one saturated or unsaturated hydrocarbon group, or further contain at least one aromatic group, and may have a bond connecting carbon atoms selected from the group consisting of -COO-, -O-, and -CO-. Item B39. A production method as described in any of the above items, wherein the chain polymer further comprises the following additional monomer units, and the additional monomer units are at least one of (meth)acrylic acid monomers, vinyl ester monomers, vinyl ether monomers, and vinyl monomers other than these monomers, which do not have a hydroxyl group and have 1 to 15 carbon atoms in the side chain. Item B40. A production method as described in any of the above items, wherein the additional monomer unit is selected from CH2 =CH-COO- R6 , CH2 =C( CH3 )-COO- R7 , CH2 =CH-O-CO- R8 (herein, R6 , R7 , and R8 independently have 1 to 15 carbon atoms, do not have a hydroxyl group, contain at least one saturated or unsaturated hydrocarbon group, or further contain at least one aromatic group, and may have a bond connecting carbon atoms selected from the group consisting of -COO-, -O-, and -CO-), CH2=CH-OR9, CH2=CH - R10 (herein, R9, and R8 are independently selected from the group consisting of -COO-, -O-, and -CO-), CH2 =CH- OR9 , CH2 =CH- R10 (herein, R9 , and R10 are independently selected from the group consisting of -COO-, -O-, and -CO-). 10 independently have 3 to 15 carbon atoms, have no hydroxyl group, contain at least one saturated or unsaturated hydrocarbon group, or further contain at least one aromatic group, and may have a bond connecting carbon atoms selected from the group consisting of -COO-, -O-, and -CO-), C 4 HO 3 -R 11 , and C 4 H 2 NO 2 -R 12 (herein, C 4 HO 3 - represents a maleic anhydride group, C 4 H 2 NO 2 - represents a maleic anhydride group, R 11 , and R 12 is independently a hydrogen atom or has 1 to 15 carbon atoms, has no hydroxyl group, contains at least one saturated or unsaturated hydrocarbon group, or further contains at least one aromatic group, and may have a bond connecting carbon atoms selected from the group consisting of -COO-, -O-, and -CO-). Item B41. The production method of any of the above items, wherein the ratio of monomer units having alcoholic secondary or tertiary hydroxyl groups in the monomer units constituting the chain polymer is 30 to 100 mol%. Item B42. A production method as described in any of the above items, wherein the crosslinking agent is selected from the group consisting of completely or partially alkoxymethylated melamine, completely or partially alkoxymethylated guanamine, completely or partially alkoxymethylated acetylguanamine, or completely or partially alkoxymethylated benzoguanamine, and completely or partially alkoxymethylated glycoluril. Item B43. A production method as described in any of the above items, wherein the ratio of the mass of the linear polymer in the composition to the mass of the crosslinking agent is 1:2 to 1:0.03. Item B44. A production method as described in any of the above items, wherein the composition contains a solvent. Item B45. A production method as described in any of the above items, wherein the composition further contains an acid catalyst. Item B46. A method for producing a hardened resin film as described in any of the above items, further comprising (iv) a step of peeling the hardened resin film formed on the substrate from the substrate. Item B47. A composition comprising a hardening resin composition or a hardening resin film as described in any of the above items, and used to make a circuit by photolithography. Item B48. A composition comprising a hardening resin composition or a hardening resin film as described in any of the above items, and used to make a sheet-like flexible electrical or electronic circuit component or a flexible display device. Item B49. A composition comprising a hardening resin composition or a hardening resin film as described in any of the above items, and used for synthesizing resins, pills, films, flat sheets, fibers, foaming agents, tubes, rubbers, elastomers, etc., and used for making two-wheeled vehicles (bicycles, motorcycles, etc.), cars, airplanes, trams, ships, rockets, spacecraft, transportation, entertainment, furniture (e.g., dining tables, chairs, desks, shelves, etc.), bedding (e.g., beds, hammocks, etc.), clothing, protective clothing, sports equipment, bathtubs, kitchen utensils, tableware, cooking utensils, containers and packaging materials (food containers, cosmetic containers, cargo containers, trash cans, etc.) etc.), construction (buildings, roads, building parts, etc.), agricultural films, industrial films, water and sewage, coatings, cosmetics, electrical and electronic industries (electrical products, computer parts, printed circuit boards, insulators, conductors, wiring coating materials, power generation components, speakers, microphones, noise cancellers, converters, etc.), optical communication cables, medical materials and instruments (catheters, wires, artificial blood vessels, artificial muscles, artificial organs, dialysis membranes, endoscopes, etc.), small pumps, actuators, robotic materials (sensors used in industrial robots, etc.), energy generation devices and power plants (solar power generation, wind power generation, etc.). Item B50. A composition comprising a hardening resin composition or a hardening resin film as described in any of the above items, and used to make electronic materials, medical materials, health care materials, life science materials, or robotic materials. Item B51. A composition comprising a hardening resin composition or a hardening resin film as described in any of the above items, and used to make materials such as catheters, wires, containers for pharmaceuticals, or tubes. Item B52. A composition comprising a hardening resin composition or a hardening resin film as described in any of the above items, and used for manufacturing automotive parts (body panels, bumpers, rocker panels, side moldings, engine parts, drive parts, transmission parts, control parts, stabilizer parts, suspension-brake parts, brake parts, axle parts, pipes, grooves, wheels, seats, seat belts, etc.). Item B53. A composition comprising a hardening resin composition or a hardening resin film as described in any of the above items, and used for manufacturing automotive anti-vibration materials, automotive coatings, and automotive synthetic resins. Item B54. Use of a hardening resin composition or hardening resin film as described in any of the above items for manufacturing a circuit by photolithography. Item B55. Use of a hardening resin composition or hardening resin film as described in any of the above items for manufacturing a sheet-like flexible electrical or electronic circuit component or a flexible display device. Item B56. Use of a hardening resin composition or hardening resin film as described in any of the above items, which is used for synthetic resins, pills, films, flat sheets, fibers, foaming agents, tubes, rubbers, elastomers, etc., and is used to make two-wheeled vehicles (bicycles, motorcycles, etc.), cars, airplanes, trams, ships, rockets, spacecraft, transportation, entertainment, furniture (e.g., dining tables, chairs, desks, shelves, etc.), bedding (e.g., beds, hammocks, etc.), clothing, protective clothing, sports equipment, bathtubs, kitchen utensils, tableware, cooking utensils, containers and packaging materials (food containers, cosmetic containers, cargo containers, garbage bins, etc.) ), construction (buildings, roads, building parts, etc.), agricultural films, industrial films, water and sewage, coatings, cosmetics, electrical and electronic industries (electrochemical products, computer parts, printed circuit boards, insulators, conductors, wiring coating materials, power generation components, speakers, microphones, noise eliminators, converters, etc.), optical communication cables, medical materials and instruments (catheters, wires, artificial blood vessels, artificial muscles, artificial organs, dialysis membranes, endoscopes, etc.), small pumps, actuators, robotic materials (sensors used in industrial robots, etc.), energy generation devices and power plants (solar power generation, wind power generation, etc.). Item B57. A use of a hardening resin composition or a hardening resin film as described in any of the above items, wherein the hardening resin composition or the hardening resin film is used to produce electronic materials, medical materials, health materials, life science materials, or robotic materials. Item B58. A use of a hardening resin composition or a hardening resin film as described in any of the above items, wherein the hardening resin composition or the hardening resin film is used to produce materials such as catheters, wires, containers for pharmaceuticals, or tubes. Item B59. Use of a hardening resin composition or hardening resin film as described in any of the above items for making automotive parts (body panels, bumpers, rocker panels, side moldings, engine parts, drive parts, transmission parts, control parts, stabilizer parts, suspension-brake parts, brake parts, axle parts, pipes, grooves, wheels, seats, seat belts, etc.). Item B60. Use of a hardening resin composition or hardening resin film as described in any of the above items for making automotive anti-vibration materials, automotive coatings, and automotive synthetic resins. Item B61. A method for manufacturing a circuit by photolithography, comprising a process of forming a hardening resin composition or hardening resin film as described in any of the above items by performing a polymerization reaction. Item B62. A method for manufacturing a sheet-shaped flexible electrical or electronic circuit component or a flexible display device, comprising a process of forming a hardening resin composition or hardening resin film as described in any of the above items by performing a polymerization reaction. Item B63. A method for using synthetic resins, pellets, films, flat sheets, fibers, foaming agents, tubes, rubbers, elastomers, etc., to make two-wheeled vehicles (bicycles, motorcycles, etc.), cars, airplanes, trams, ships, rockets, spacecraft, transportation, entertainment, furniture (e.g., dining tables, chairs, desks, shelves, etc.), bedding (e.g., beds, hammocks, etc.), clothing, protective clothing, sports equipment, bathtubs, kitchen utensils, tableware, cooking utensils, containers and packaging materials (food containers, cosmetic containers, cargo containers, garbage bins, etc.), buildings (buildings, roads, building parts, etc.), agricultural films, industrial films, water pipes, paints, chemicals, etc. Cosmetics, electrical and electronic industries (electrochemical products, computer parts, printed circuit boards, insulators, conductors, wiring coating materials, power generation elements, speakers, microphones, noise cancellers, converters, etc.), optical communication cables, medical materials and instruments (catheters, wires, artificial blood vessels, artificial muscles, artificial organs, dialysis membranes, endoscopes, etc.), small pumps, actuators, robotic materials (sensors used in industrial robots, etc.), energy generating devices and power plants (solar power generation, wind power generation, etc.), and including processes for forming a curable resin composition or a curing resin film as any of the above items by performing a polymerization reaction. Item B64. A method for producing electronic materials, medical materials, health materials, life science materials, or robotic materials, and comprising a process of forming a hardening resin composition or hardening resin film as described in any of the above items by performing a polymerization reaction. Item B65. A method for producing a material such as a catheter, a wire, a container for a pharmaceutical product, or a tube, and comprising a process of forming a hardening resin composition or hardening resin film as described in any of the above items by performing a polymerization reaction. Item B66. A method for producing automobile parts (body panels, bumpers, rocker panels, side moldings, engine parts, drive parts, transmission parts, control parts, stabilizer parts, suspension-brake parts, brake parts, axle parts, pipes, grooves, wheels, seats, seat belts, etc.), and comprising a process of forming a curable resin composition or a curable resin film as described in any of the above items by polymerization. Item B67. A method for producing an anti-vibration material for automobiles, an automobile coating, or an automobile synthetic resin, and comprising a process of forming a curable resin composition or a curable resin film as described in any of the above items by polymerization.
(1)用詞之定義 於本說明書中,所謂「耐熱性」係指對使硬化性樹脂組合物硬化所獲得之膜而言,可耐受150℃以內之加熱、較佳為亦耐受230℃之加熱,而不會實質上引起分解及其他劣化。230℃之溫度係於利用光微影法之電子電路之製作中足以用作焙燒溫度之高溫。 於本說明書中,所謂「易剝離膜」係指藉由塗佈至基板、尤其是玻璃基板並硬化而形成之膜為不使膜破損地(即不費勁地)輕易自基板剝離者,所謂「易剝離性」係指此種膜之性質。作為玻璃基板,例如可列舉鈉玻璃製基板、無鹼玻璃製基板等適當之玻璃基板。鈉玻璃製基板為尤佳之一例。 於本說明書中,「硬化樹脂膜」之厚度並無限定。於作為用於電路製作之基底膜使用之情形時,較佳之厚度為200~400 nm,例如為約300 nm,其原因在於應對製作電子零件之情形時之目前對薄膜化之要求,而非在於硬化樹脂膜本身之性能被限定於該厚度範圍,硬化樹脂膜之厚度任意。於本說明書中,「硬化樹脂薄膜」係與「硬化樹脂膜」含義相同地加以使用。 於本說明書中,鏈狀聚合物中之「側鏈」之用詞係指自主鏈分支之結構部分,所謂「主鏈」係指由聚合物之結構中重複之單體單元之於一維方向進行連結之原子所構成之鏈。因此,例如於聚合物為(甲基)丙烯酸酯之聚合物之情形時,作為各單體中參與酯鍵之形成之部分之「-COO-」包含於「側鏈」之一部分。再者,「(甲基)丙烯酸酯」之表述係不區分地表示丙烯酸酯及甲基丙烯酸酯。同樣地,「(甲基)丙烯醯基」之表述係不區分地表示丙烯醯基及甲基丙烯醯基,「(甲基)丙烯酸」係不區分地表示丙烯酸及甲基丙烯酸。 於本說明書中,提及「-O-」及「-CO-」時不包含其等為「-COO-」之構成部分之情形。再者,「-COO-」為表示酯兩端之基未固定之情形之酯的記載,包含「-COO-」及「-O-CO-」兩者。但是,於酯兩端之基被固定之情形時,區分為「-COO-」及「-O-CO-」而加以使用。 本說明書中所謂「烷基」係指自如甲烷、乙烷、丙烷之脂肪族烴(烷烴)奪取一個氫原子而產生之一價基,一般以Cn
H2n+1
-表示(此處,n為正整數)。烷基可為直鏈或支鏈。作為碳原子數1~4之烷基(C1 ~ 4
烷基),例如可列舉:甲基、乙基、正丙基、異丙基、正丁基、異丁基、第三丁基、第二丁基等,但本發明並不僅限定於該例示。作為碳原子數1~6之烷基(C1 ~ 6
烷基),例如可列舉:碳原子數1~4之烷基、第三丁基、第二丁基、正戊基、異戊基、正己基、異己基、環己基等,但本發明並不僅限定於該例示。作為碳原子數1~10之烷基(C1 ~ 10
烷基),例如可列舉:碳原子數1~6之烷基、正辛基、正壬基、正癸基等,但本發明並不僅限定於該例示。 本說明書中所謂「烯基」係指自如乙烯、丙烯、丁烯之含有至少一個雙鍵之脂肪族烴(烯烴)奪取一個氫原子而產生之一價基,一般以Cm
H2m- 1
表示(此處,m為2以上之整數)。烯基可為直鏈或支鏈。作為碳原子數2~6之烯基,例如可列舉:乙烯基、1-丙烯基、2-丙烯基、丁烯基、戊烯基、己烯基等,但本發明並不僅限定於該例示。作為碳原子數2~10之烯基,例如可列舉:碳原子數2~6之烯基、庚烯基、辛烯基、壬烯基、癸烯基等,但本發明並不僅限定於該例示。 本說明書中所謂「炔基」係指自如乙炔(acetylene)、丙炔、丁炔之含有至少一個三鍵之脂肪族烴(炔烴)奪取一個氫原子而產生之一價基,一般以Cm
H2m-3
表示(此處,m為2以上之整數)。炔基可為直鏈或支鏈。作為碳原子數2~6之炔基,例如可列舉:乙炔基、1-丙炔基、2-丙炔基、丁炔基、戊炔基、己炔基等,但本發明並不僅限定於該例示。作為碳原子數2~10之炔基,例如可列舉:碳原子數2~6之炔基、庚炔基、辛炔基、壬炔基、癸炔基等,但本發明並不僅限定於該例示。 本說明書中所謂「伸烷基」係指自如甲烷、乙烷、丙烷之脂肪族烴(烷烴)奪取兩個氫原子而產生之二價基,一般以-(Cm
H2m
)-表示(此處,m為正整數)。伸烷基可為直鏈或支鏈。作為碳原子數1~10之伸烷基,例如可列舉:亞甲基、伸乙基、伸正丙基、伸異丙基、伸正丁基、伸異丁基、伸第三丁基、伸正戊基、伸正己基、伸異己基等,但本發明並不僅限定於該例示。較佳為碳原子數1~6之伸烷基,更佳為碳原子數1~4之伸烷基,進而較佳為亞甲基及伸乙基,更進一步較佳為伸乙基。 本說明書中所謂「伸烯基」係指如伸乙烯基、伸丙烯基、伸丁烯基之自含有至少一個雙鍵之脂肪族烴(烯烴)奪取兩個氫原子而產生之二價基,一般以-(Cm
H2m-2
)-表示(此處,m為2以上之整數)。伸烯基可為直鏈或支鏈。作為碳原子數2~10之伸烯基,例如可列舉:伸乙烯基、伸正丙烯基、伸異丙烯基、伸正丁烯基、伸異丁烯基、伸正戊烯基、伸正己烯基、伸異己烯基等,但本發明並不僅限定於該例示。較佳為碳原子數2~6之伸烯基,更佳為碳原子數2~4之伸烯基,進而較佳為伸乙烯基及伸正丙烯基,更進一步較佳為伸乙烯基。 本說明書中所謂「烷氧基」係指奪取醇類之羥基之氫原子而產生之一價基,一般以Cn
H2n+1
O-表示(此處,n為1以上之整數)。作為碳原子數1~6之烷氧基,例如可列舉:甲氧基、乙氧基、正丙氧基、異丙氧基、正丁氧基、異丁氧基、第三丁氧基、第二丁氧基、正戊氧基、異戊氧基、正己氧基、異己氧基等,但本發明並不僅限定於該例示。 本說明書中所謂「鹵烷基」係指上述烷基上之1個或複數個氫原子經鹵素原子取代之烷基。又,「全鹵烷基」係指上述烷基上之全部氫原子經鹵素原子取代之烷基。作為碳數1~6之鹵烷基,例如可列舉:三氟甲基、三氟乙基、全氟乙基、三氟正丙基、全氟正丙基、三氟異丙基、全氟異丙基、三氟正丁基、全氟正丁基、三氟異丁基、全氟異丁基、三氟第三丁基、全氟第三丁基、三氟正戊基、全氟正戊基、三氟正己基、全氟正己基等,但本發明並不僅限定於該例示。 本說明書中所謂「環烷基」係指單環或多環式飽和烴基,亦包含交聯而成之結構。例如,所謂「C3-12
環烷基」係指碳原子數為3~12之環狀烷基。作為具體例,於「C6-12
環烷基」之情形時,可列舉:環己基、環庚基、環辛基、金剛烷基、異𦯉基等。於「C3-12
環烷基」之情形時,可列舉:環丙基、環丁基、環戊基、C6-12
環烷基等。較佳為列舉「C6-12
環烷基」。 本說明書中所謂「環烯基」係指包含雙鍵之單環或多環式不飽和烴基,亦包含交聯而成之結構。可列舉上述「環烷基」之碳間鍵之1個以上成為雙鍵者。例如,所謂「C3-12
環烯基」係指碳原子數為3~12之環狀烯基。作為具體例,於「C6-12
環烯基」之情形時,可列舉:1-環己烯基、2-環己烯基、3-環己烯基、環庚烯基、環辛烯基、環壬烯基等。於「C3-12
環烷基」之情形時,可列舉:環丙烯基、環丁烯基、環戊烯基、C6-12
環烯基等。較佳為列舉「C6-12
環烯基」。 本說明書中所謂「烴基」係指自僅由碳及氫構成之化合物奪取一個氫原子而產生之一價基。又,烴基包含上述「烷基」、「烯基」、「伸烷基」、「伸烯基」、「環烷基」、及「環烯基」、以及下述「芳香族基」、及「脂環式基」等。烴基可為飽和或不飽和。烴基根據碳之鍵結方式分為鏈式烴基及環式烴基,環式烴基進而分為脂環式烴基及芳香族烴基。作為飽和或不飽和之烴基之例,可列舉:甲基、乙基、正丙基、異丙基、丁基、戊基、己基、環己基、二環戊二烯基、十氫萘基、金剛烷基、丁烯基、己烯基、環己烯基、癸基、以及側鏈之碳原子數之限度範圍內之各種直鏈狀、支鏈狀、單環狀、縮合環狀之基,但並不限定於該等。該等各基於不位於末端之情形時,可根據與其他基之鍵結關係而為二價以上之基。 本說明書中所謂「芳香族基」係指鍵結於芳香族烴之環之1個氫原子脫離而產生之基。例如,自苯衍生苯基(C6
H5
-),自甲苯衍生甲苯基(CH3
C6
H4
-),自二甲苯衍生二甲苯基((CH3
)2
C6
H3
-),自萘衍生萘基(C10
H8
-)。又,本說明書中所謂「雜芳香族基」係指單環式或多環式之含雜原子之芳香族基,該基包含1個以上(例如1~4個)選自氮原子、硫原子及氧原子之同種或異種之雜原子。又,上述「芳香族基」包含「雜芳香族基」。作為芳香族基之例,可列舉如苯基、聯苯基、萘基等之碳環式芳香族基(單環基及縮合環基)、及吡啶基、嘧啶基、喹啉基、三𠯤基等雜芳香族基(單環基及縮合環基),對於各芳香族基,於不位於末端之情形時,可根據與其他基之鍵結關係而為二價以上之基。再者,於本說明書中,具有芳香環部分及共同形成環之飽和或不飽和之烴鏈部分之基(例如,四氫萘基或二氫萘基)係理解為芳香族基與飽和或不飽和之烴基之鍵結。 本說明書中所謂「脂環式(基)」係指鍵結於僅由碳與氫構成之不具有芳香族性之環之1個氫原子脫離而產生之部分(或基)。又,脂環式基包含上述「環烷基」及「環烯基」。脂環式基可飽和或不飽和。作為飽和或不飽和之脂環式基之例,可列舉:環己基、二環戊二烯基、十氫萘基、金剛烷基、環己烯基、以及側鏈之碳原子數之限度範圍內之各種單環狀、縮合環狀之基,但並不限定於該等。該等各基於不位於末端之情形時,可根據與其他基之鍵結關係而為二價以上之基。 通常,用詞「(被/經)取代」係指利用特定取代基之自由基取代所提供之結構中之1個以上之氫自由基。於本說明書中,使用「(被/經)取代」定義之基中之取代基數量只要能夠進行取代,則並無特別限制,為1個或複數個。又,除特別進行指示之情形外,各基之說明亦適合該基為其他基之一部分或取代基之情形。又,於本說明書中,對於未特別明示「(被/經)取代」之用詞之取代基,表示「未經取代」之取代基。進而,於本說明書中,可理解為句子「經取代或未經取代(之)」可與句子「可經取代」互換使用。 作為包含「取代烷基」、「取代烷基」、「取代烯基」、「取代炔基」、「取代環烷基」、「取代環烯基」、「取代烴基」、「取代芳香族基」、「取代雜芳香族基」、「取代伸烷基」、「取代伸烯基」、「經取代或未經取代之含二級或三級OH之基」及「取代金剛烷基」之本說明書中記載之基上之取代基之例,可列舉:鹵素、羥基、C1 ~ 10
烷基、C1 ~ 10
烷氧基、C2 ~ 10
烯基、C6-12
環烷基、C6-12
環烯基、C1 ~ 10
鹵烷基、C2 ~ 10
鹵烯基、C6 ~ 18
烴基、C6 ~ 18
芳香族基、C6 ~ 18
雜芳香族基、經C6 ~ 12
芳香族基取代之C1 ~ 10
烷基、經C6 ~ 12
烴基取代之C1 ~ 10
烷基、經C6 ~ 12
芳香族基取代之C2 ~ 10
烯基、經C6 ~ 12
烴基取代之C2 ~ 10
烯基、-CN、側氧基(=O)、-O(CH2
)2
O-、-OC(CH3
)2
O-、-OCH2
O-、-O-、酯基(-COO-或-O-CO-)、經C6 ~ 12
烴基取代之酯基、經C6 ~ 12
芳香族基取代之酯基、經酯基取代之C6 ~ 18
烴基、經酯基取代之C1 ~ 10
烷基、C1 ~ 6
伸烷基、C2 ~ 6
伸烯基等,但本發明並不僅限定於該例示。作為上述取代基之較佳之例,可列舉:羥基、C6 ~ 18
烴基、C1 ~ 10
烷基、經C6 ~ 12
芳香族基取代之C1 ~ 10
烷基、經C6 ~ 12
烴基取代之C1 ~ 10
烷基、經酯基取代之C6 ~ 18
烴基、經酯基取代之C1 ~ 10
烷基、酯基(-COO-或-O-CO-)、經C6 ~ 12
烴基取代之酯基、經C6 ~ 12
芳香族基取代之酯基、C2 ~ 10
烯基、經C6 ~ 12
芳香族基取代之C2 ~ 10
烯基、經C6 ~ 12
烴基取代之C2 ~ 10
烯基、C1 ~ 10
烷氧基、C6-12
環烷基、C6-12
環烯基,作為更具體之例,可列舉:苯甲醯氧基、苯基、環己基、環己烯基、金剛烷基、經羥基取代之金剛烷基。 本說明書中所謂「經α位取代之(甲基)丙烯酸系單體」係指如CH2
=C(R1a
)-COO-R1
所示般形成酯基-COO-之碳之緊鄰(α位)之雙鍵之碳被取代之丙烯酸系單體。同樣,所謂「經α位取代之乙烯酯系單體」係指如CH2
=C(R1a
)-O-CO-R3
所示般形成酯基-O-CO-之氧之緊鄰(α位)之雙鍵之碳被取代之丙烯酸系單體,所謂「經α位取代之乙烯醚系單體」係指如CH2
=C(R1a
)-O-R4
所示般形成醚基-O-之氧之緊鄰(α位)之雙鍵之碳被取代之丙烯酸系單體,所謂「經α位取代之乙烯系單體」係指如CH2
=C(R1a
)-R5
所示般並非乙烯基之末端碳之內部碳被取代之丙烯酸系單體。R1
、R3
、R4
、R5
及R1a
係如下述較佳之實施形態(2-1)硬化性樹脂組合物中所定義。 於本說明書中,「含二級或三級OH之基」表示含有1個或2個以上之二級或三級羥基(OH)之基。因此,「含二級或三級OH之基」亦包含二級或三級羥基本身。「經取代或未經取代之含二級或三級OH之基」中之「經取代或未經取代」表示於含有1個或2個以上之二級或三級羥基(OH)之基中該羥基以外之基之部分被取代或未被取代,並非表示該羥基被取代或未被取代。 於本說明書中,只要未特別說明,則「溶劑合物」係指進而包含藉由非共有分子間力而鍵結之定比或不定比之量之溶劑的化合物或其鹽。於溶劑為水之情形時,該溶劑合物為水合物。 於本說明書中,「或」係於可採用文章中所列舉之事項之「至少1種以上」時使用。「或者」亦同樣。於本說明書中,明確記載為「2個值之範圍內」之情形時,該範圍亦包含2個值本身。因此,表示範圍之「X~Y」係指「X以上且Y以下」。又,只要未特別進行註釋,則「重量」與「質量」、「重量%」或「wt%」與「質量%」係分別作為同義詞處理。只要未特別說明,則「約」之表述具有10%之容許度,於為測定值之情形時係指將有效數字或所顯示之數字之1位數下之位數四捨五入所獲得之任意範圍之數值。 (2)較佳之實施形態之說明 以下,對本發明之較佳之實施形態進行說明。應理解以下所提供之實施形態係為了更好地理解本發明而提供,不應將本發明之範圍限定於以下之記載。因此,可明白業者可參考本說明書中之記載,於本發明之範圍內適當進行改變。又,應理解本發明之以下之實施形態可單獨地使用,或者將其等組合而使用。 (2-1)硬化性樹脂組合物 於一態樣中,本發明提供一種硬化性樹脂組合物, 其係包含具備具有醇性二級或三級羥基之側鏈之鏈狀聚合物、及交聯劑而成者,且 (a)該側鏈係包含3~30個碳原子而成者,且係包含至少1個飽和或不飽和之烴基而成、或者此外進而包含至少1個芳香族基而成者,且可包含將碳原子間連接之選自由-COO-、-O-、及-CO-所組成之群中之鍵; (b)該交聯劑係選自由三𠯤系化合物及/或其縮合物、甘脲系化合物及/或其縮合物、以及咪唑啶酮系化合物及/或其縮合物 所組成之群中者。 本發明之硬化性樹脂組合物係藉由加熱處理而硬化,因此亦可謂其係熱硬化性樹脂組合物。 作為本發明之硬化性樹脂組合物之一個構成要素之鏈狀聚合物具備具有醇性二級或三級羥基之側鏈。 於本發明中,鏈狀聚合物之具有醇性二級或三級羥基之側鏈所包含之碳原子數較佳為3~30個。具有醇性二級或三級羥基之側鏈中之該羥基之個數可為1個或2個以上。 上述側鏈係包含具有至少1個碳原子之飽和或不飽和之烴基而成、或者進而包含至少1個芳香族基而成。該側鏈亦可包含1個或2個以上之選自由-COO-、-O-、及-CO-所組成之群中之鍵。構成側鏈之飽和或不飽和之烴基例如可單獨1個地佔用側鏈之所有碳原子,又,亦可為複數個飽和或不飽和之碳基相互間經由選自由-COO-、-O-、及-CO-所組成之群中之鍵進行連結而成者。於側鏈除飽和或不飽和之烴基外包含芳香族基之情形時,飽和或不飽和之烴基與芳香族基可直接鍵結,又,亦可經由選自由-COO-、-O-、及-CO-所組成之群中之鍵進行連結。 於本發明中,為了將本發明之硬化性樹脂組合物塗佈於玻璃基板上並使之硬化而成膜所得之硬化樹脂薄膜於焙燒後亦可維持自基板之易剝離性,側鏈中之醇性二級及三級羥基係實質上之決定性要素。進而,側鏈中之醇性二級及三級羥基進而較佳為鍵結於側鏈之脂環式部分者,側鏈之脂環式部分亦係為了可維持硬化樹脂薄膜之易剝離性之事實上之決定性要素。具備此種側鏈之鏈狀聚合物係製成與適當之交聯劑、尤其是三𠯤系化合物及/或其縮合物、甘脲系化合物及/或其縮合物、或咪唑啶酮系化合物及/或其縮合物之任一者之樹脂組合物,以薄膜之形態使之硬化時,可提供耐熱性之易剝離膜。 於本發明中,具備具有醇性二級或三級羥基之該側鏈之鏈狀聚合物更佳為包含未經取代或經α位取代之(甲基)丙烯酸系單體、未經取代或經α位取代之乙烯酯系單體、未經取代或經α位取代之乙烯醚系單體、上述以外之未經取代或經α位取代之乙烯系單體之任意至少1種作為單體單元而成者。 於本發明中,具備具有醇性二級或三級羥基之該側鏈之鏈狀聚合物更佳為包含(甲基)丙烯酸系單體、乙烯酯系單體、乙烯醚系單體、上述以外之乙烯系單體之任意至少1種作為單體單元而成者。較佳為該單體單元為(甲基)丙烯酸系單體,更佳為該單體單元為甲基丙烯酸系單體。 較佳為,本發明中之鏈狀聚合物係包含選自由CH2
=C(R1a
)-COO-R1
CH2
=C(R1a
)-O-CO-R3
、CH2
=C(R1a
)-O-R4
、及CH2
=C(R1a
)-R5
(此處,R1
、R3
、R4
、及R5
係相互獨立地具有於經由酯鍵而鍵結於各乙烯基之情形時包括構成該酯鍵之碳原子在內的3~30個碳原子,進而較佳為3~25個,更佳為3~20個,具有醇性二級或三級羥基,並包含至少1個飽和或不飽和之烴基而成、或者進而包含至少1個芳香族基而成,且可具有將碳原子間連接之選自由-COO-、-O-、及-CO-所組成之群中之鍵,R1a
係選自由氫、經取代或未經取代之烷基、及經取代或未經取代之烯基所組成之群)所表示之化合物所組成之群中之單體單元而成。 更佳為,本發明中之鏈狀聚合物係包含選自由CH2
=CH-COO-R1
、CH2
=C(CH3
)-COO-R2
、CH2
=CH-O-CO-R3
、CH2
=CH-O-R4
、及CH2
=CH-R5
(此處,R1
、R2
、R3
、R4
、及R5
係相互獨立地具有於經由酯鍵而鍵結於各乙烯基之情形時包括構成該酯鍵之碳原子在內的3~30個碳原子,進而較佳為3~25個,更佳為3~20個,具有醇性二級或三級羥基,並包含至少1個飽和或不飽和之烴基而成、或者進而包含至少1個芳香族基而成,且可具有將碳原子間連接之選自由-COO-、-O-、及-CO-所組成之群中之鍵)所表示之化合物所組成之群中之單體單元而成。 於上文中,作為飽和或不飽和之烴基之例,可列舉:甲基、乙基、正丙基、異丙基、丁基、戊基、己基、環己基、二環戊二烯基、十氫萘基、金剛烷基、丁烯基、己烯基、環己烯基、癸基、以及側鏈之碳原子數之限度範圍內之各種直鏈狀、支鏈狀、單環狀、縮合環狀之基,但並不限定於該等。該等各基於不位於末端之情形時,可根據與其他基之鍵結關係而為二價以上之基。作為芳香族基之例,可列舉:如苯基、聯苯基、萘基等之碳環式芳香族基(單環基及縮合環基)、及吡啶基、嘧啶基、喹啉基、三𠯤基等雜芳香族基(單環基及縮合環基),對於各芳香族基,於不位於末端之情形時,亦可根據與其他基之鍵結關係而為二價以上之基。再者,於本說明書中,具有芳香環部分及共同形成環之飽和或不飽和之烴鏈部分之基(例如,四氫萘基或二氫萘基)係理解為芳香族基與飽和或不飽和之烴基之鍵結。 於本發明中,醇性二級或三級羥基係將構成上述側鏈之飽和或不飽和之烴基之任一個二級或三級碳原子上之氫原子取代而成之羥基。 鏈狀聚合物之側鏈之醇性羥基較理想為二級羥基或三級羥基,進而較佳為鍵結於構成上述側鏈之一部分或全部之脂環式基者。 更佳為,本發明中之該鏈狀聚合物係包含式A1: [化12](此處, R1a
係選自由氫、經取代或未經取代之烷基、及經取代或未經取代之烯基所組成之群, L1
係選自由單鍵、經取代或未經取代之伸烷基、及經取代或未經取代之伸烯基所組成之群, R2a
、R3a
、及R4a
相互獨立地選自由氫、及經取代或未經取代之烴基所組成之群,惟,R2a
、R3a
、及R4a
中之至少1個為經取代或未經取代之含二級或三級OH之基) 所表示之單體單元而成。 進而較佳為,本發明中之該鏈狀聚合物係包含如下單體單元而成,其中於式A1中, R1a
係選自由氫、及經取代或未經取代之烷基所組成之群, L1
係選自由單鍵、及經取代或未經取代之伸烷基所組成之群, R2a
、R3a
、及R4a
相互獨立地選自由氫、及經取代或未經取代之烴基所組成之群,惟,R2a
、R3a
、及R4a
中之至少1個選自由二級或三級羥基、及經取代或未經取代之含有二級或三級OH之烴基所組成之群中。 進而更佳為,本發明中之該鏈狀聚合物係包含如下單體單元而成,其中於式A1中, R1a
係選自由氫、及未經取代之烷基所組成之群, L1
係選自由單鍵、及未經取代之伸烷基所組成之群, R2a
、R3a
、及R4a
相互獨立地選自由氫、及經取代或未經取代之烴基所組成之群,惟,R2a
、R3a
、及R4a
中之至少1個選自由二級或三級羥基、及經取代或未經取代之含有二級或三級OH之烴基所組成之群,其他2個相互獨立地選自由氫及經取代或未經取代之烴基所組成之群中。 更佳為,本發明中之該鏈狀聚合物係包含式A2: [化13](此處, R1a
係選自由氫、經取代或未經取代之烷基、及經取代或未經取代之烯基所組成之群, L1
係選自由單鍵、經取代或未經取代之伸烷基、及經取代或未經取代之伸烯基所組成之群, R5a
~R14a
相互獨立地選自由氫、羥基、及 [化14]所組成之群,或者一起形成環,惟,R5a
~R14a
或該環之取代基中之至少1個為羥基, R15a
係選自由經取代或未經取代之烷基、經取代或未經取代之烯基、經取代或未經取代之環烷基、經取代或未經取代之環烯基、經取代或未經取代之芳香族基、及經取代或未經取代之雜芳香族基所組成之群) 所表示之單體單元而成。 進而較佳為,本發明中之該鏈狀聚合物係包含如下單體單元而成,其中於式A2中, R1a
係選自由氫、及經取代或未經取代之烷基所組成之群, L1
係選自由單鍵、及經取代或未經取代之伸烷基所組成之群, R5a
~R14a
相互獨立地選自由氫、羥基、及 [化15]所組成之群,或者一起形成環,惟,R5a
~R14a
或該環之取代基中之至少1個為羥基, R15a
係選自由經取代或未經取代之烷基、經取代或未經取代之烯基、經取代或未經取代之環烷基、經取代或未經取代之環烯基、及經取代或未經取代之芳香族基所組成之群中。 進而更佳為,本發明中之該鏈狀聚合物係包含如下單體單元而成,其中於式A2中, R1a
係選自由氫、及未經取代之烷基所組成之群, L1
係選自由單鍵、及未經取代之伸烷基所組成之群, R5a
~R14a
中,R7a
為羥基,R9a
為 [化16], 除此以外為氫,或者R5a
~R14a
一起形成經至少1個羥基取代之環, R15a
係選自由經取代或未經取代之烷基、經取代或未經取代之烯基、經取代或未經取代之環烷基、經取代或未經取代之環烯基、及經取代或未經取代之苯基所組成之群中。 再者,進而更佳為,該經至少1個羥基取代之環為經至少1個羥基取代之金剛烷。 更佳為,本發明中之該鏈狀聚合物係包含式A3: [化17](此處, R1a
係選自由氫、經取代或未經取代之烷基、及經取代或未經取代之烯基所組成之群, L2
係選自由經取代或未經取代之伸烷基、及經取代或未經取代之伸烯基所組成之群, R16a
係選自由經取代或未經取代之烷基、經取代或未經取代之烯基、及經取代或未經取代之炔基所組成之群, R17a
係選自由氫、經取代或未經取代之烷基、經取代或未經取代之烯基、及經取代或未經取代之炔基所組成之群) 所表示之單體單元而成者。 進而較佳為,本發明中之該鏈狀聚合物係包含如下單體單元而成,其中於式A3中, R1a
係選自由氫、及經取代或未經取代之烷基所組成之群, L2
係選自經取代或未經取代之伸烷基, R16a
係選自經取代或未經取代之烷基, R17a
係選自由氫、及經取代或未經取代之烷基所組成之群中。 更佳為,本發明中之該鏈狀聚合物係包含式A4: [化18](此處, R1a
係選自由氫、經取代或未經取代之烷基、及經取代或未經取代之烯基所組成之群, L1
係選自由單鍵、經取代或未經取代之伸烷基、及經取代或未經取代之伸烯基所組成之群, R18a
係經至少1個羥基取代之金剛烷基) 所表示之單體單元而成。 進而較佳為,本發明中之該鏈狀聚合物係包含如下單體單元而成,其中於式A4中, R1a
係選自由氫、及經取代或未經取代之烷基所組成之群, L1
係選自由單鍵、及經取代或未經取代之伸烷基所組成之群, R18a
係經至少1個羥基取代之金剛烷基。 該鏈狀聚合物係包含式A5: [化19](此處, R1a
係選自由氫、經取代或未經取代之烷基、及經取代或未經取代之烯基所組成之群, L1
係選自由單鍵、經取代或未經取代之伸烷基、及經取代或未經取代之伸烯基所組成之群, R19a
係選自由經取代或未經取代之烷基、經取代或未經取代之烯基、經取代或未經取代之環烷基、及經取代或未經取代之環烯基所組成之群) 所表示之單體單元而成者。 進而較佳為,本發明中之該鏈狀聚合物係包含如下單體單元而成,其中於式A5中, R1a
係選自由氫、及經取代或未經取代之烷基所組成之群, L1
係選自由單鍵、及經取代或未經取代之伸烷基所組成之群, R19a
係選自由經取代或未經取代之烷基、經取代或未經取代之烯基、經取代或未經取代之環烷基、及經取代或未經取代之環烯基所組成之群中。 進而更佳為,於式A5中,R19a
為經取代或未經取代之金剛烷基。 較佳為於該單體單元中,R1a
為氫、或甲基,更佳為於該單體單元中,R1a
為甲基。 本發明中之鏈狀聚合物之具有醇性二級或三級羥基之較佳之側鏈包含以下所示者,但只要具有此種羥基即可,故而所列舉者僅為例示,並不限定於該等。 (1a) A-O-CO-型(A表示側鏈之其餘部分,下同)側鏈:2-羥基乙氧基羰基、2-羥基丙氧基羰基、4-(羥基甲基)環己基甲氧基羰基、2-羥基-3-(環己基羰氧基)丙氧基羰基、3-苯甲醯氧基-2-羥基丙氧基羰基、4-苯甲醯氧基-3-羥基環己基甲氧基羰基、3-羥基-1-金剛烷氧基羰基、2-羥基環己氧基羰基、4-十一碳醯氧基-3-羥基環己基甲氧基羰基、4-丁醯氧基-3-羥基環己基甲氧基羰基等。 (2a) A-CO-O-型側鏈:2-羥基丙基羰氧基、2-羥基-3-(環己基羰氧基)丙基羰氧基、3-苯甲醯氧基-2-羥基丙基羰氧基、4-苯甲醯氧基-3-羥基環己基甲基羰氧基、3-羥基-1-金剛烷基羰氧基、2-羥基環己氧基羰氧基、4-十一碳醯氧基-3-羥基環己基甲基羰氧基、4-丁醯氧基-3-羥基環己基甲基羰氧基等。 (3a) A-O-型側鏈:2-羥基丙氧基、2-羥基-3-(環己基羰氧基)丙氧基、3-苯甲醯氧基-2-羥基丙氧基、4-苯甲醯氧基-3-羥基環己基甲氧基、3-羥基-1-金剛烷氧基、2-羥基環己氧基、4-十一碳醯氧基-3-羥基環己基甲氧基、4-丁醯氧基-3-羥基環己基甲氧基等。 (4a) 其他:2-羥基丙基、2-羥基-3-(環己基羰氧基)丙基、3-苯甲醯氧基-2-羥基丙基、4-苯甲醯氧基-3-羥基環己基甲基、3-羥基-1-金剛烷基、2-羥基環己基、4-十一碳醯氧基-3-羥基環己基甲基、4-丁醯氧基-3-羥基環己基甲基等。 作為對鏈狀聚合物賦予該等側鏈之單體之較佳例,可列舉以下所示者,但並不限定於其等。 (1b)(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸2-羥基-3-(環己基羰氧基)丙酯、(甲基)丙烯酸3-苯甲醯氧基- 2-羥基丙酯、(甲基)丙烯酸4-苯甲醯氧基-3-羥基環己基甲酯、1,3-金剛烷基二醇單(甲基)丙烯酸酯、及(甲基)丙烯酸2-羥基環己酯、(甲基)丙烯酸4-十一碳醯氧基-3-羥基環己基甲酯、(甲基)丙烯酸4-丁醯氧基-3-羥基環己基甲酯等(甲基)丙烯酸酯。 (2b) 2-羥基丁酸乙烯酯、2-羥基-3-(環己基羰氧基)丁酸乙烯酯、3-苯甲醯氧基-2-羥基丁酸乙烯酯、4-苯甲醯氧基-3-羥基環己基乙酸乙烯酯、3-羥基-1-金剛烷基羧酸乙烯酯、2-羥基環己氧基羧酸乙烯酯、4-十一碳醯氧基-3-羥基環己基乙酸乙烯酯、4-丁醯氧基-3-羥基環己基乙酸乙烯酯等乙烯酯。 (3b) 2-羥基丙基乙烯醚、2-羥基-3-(環己基羰氧基)丙基乙烯醚、3-苯甲醯氧基-2-羥基丙基乙烯醚、4-苯甲醯氧基-3-羥基環己基甲基乙烯醚、3-羥基-1-金剛烷基乙烯醚、2-羥基環己基乙烯醚、4-十一碳醯氧基-3-羥基環己基甲醚、4-丁醯氧基-3-羥基環己基甲醚等乙烯醚。 (4b) 1-戊烯-4-醇、4-羥基-5-(環己基羰氧基)-1-戊烯、5-苯甲醯氧基-4-羥基-1-戊烯、3-(4-苯甲醯氧基-3-羥基環己基)-1-丙烯、(3-羥基-1-金剛烷基)乙烯、(2-羥基環己基)乙烯、3-(4-十一碳醯氧基-3-羥基環己基)-1-丙烯、3-(4-丁醯氧基-3-羥基環己基)-1-丙烯等乙烯系單體。 (5b)分別具有上述(1a)~(4a)作為取代基之順丁烯二酸酐及順丁烯二醯亞胺。 本發明中之鏈狀聚合物可為除具有上述醇性二級或三級羥基之單體以外包含追加之單體單元而成者,該追加之單體單元係可具有羥基亦可不具有羥基且側鏈之碳原子數為1~15的未經取代或經α位取代之(甲基)丙烯酸系單體、未經取代或經α位取代之乙烯酯系單體、未經取代或經α位取代之乙烯醚系單體、及該等以外之未經取代或經α位取代之乙烯系單體之任意至少1種。此種追加之單體單元較佳為可選自由CH2
=C(R1a
)-COO-R6
、CH2
=C(R1a
)-O-CO-R8
(此處,R6
、及R8
係相互獨立地具有1~15個碳原子,可具有羥基亦可不具有羥基,包含至少1個飽和或不飽和之烴基而成、或者進而包含至少1個芳香族基而成,且可具有將碳原子間連接之選自由-COO-、-O-、及-CO-所組成之群中之鍵,該烴基或芳香族基可具有胺基,R1a
選自由氫、經取代或未經取代之烷基、及經取代或未經取代之烯基所組成之群)、CH2
=C(R1a
)-O-R9
、CH2
=C(R1a
)-R10
(此處,R9
、及R10
係相互獨立地具有3~15個碳原子,可具有羥基亦可不具有羥基,包含至少1個飽和或不飽和之烴基而成、或者進而包含至少1個芳香族基而成,且可具有將碳原子間連接之選自由-COO-、-O-、及-CO-所組成之群中之鍵,該烴基或芳香族基可具有胺基,R1a
選自由氫、經取代或未經取代之烷基、及經取代或未經取代之烯基所組成之群)、C4
(R1a
)O3
-R11
、及C4
(R1a
)HNO2
-R12
(此處,C4
(R1a
)O3
-表示順丁烯二酸酐基,C4
(R1a
)HNO2
-表示順丁烯二醯亞胺基,R11
、及R12
係相互獨立地為氫原子或者具有1~15個碳原子數,可具有或不具有醇性二級或三級羥基,包含至少1個飽和或不飽和之烴基而成、或者進而包含至少1個芳香族基而成,且可具有將碳原子間連接之選自由-COO-、-O-、及-CO-所組成之群中之鍵,該烴基或芳香族基可具有胺基,R1a
選自由氫、經取代或未經取代之烷基、及經取代或未經取代之烯基所組成之群)所表示之化合物所組成之群中。 本發明中之鏈狀聚合物可為除上述具有醇性二級或三級羥基之單體以外包含追加之單體單元而成者,該追加之單體單元係不具有羥基且側鏈之碳原子數為1~15的(甲基)丙烯酸系單體、乙烯酯系單體、乙烯醚系單體、及該等以外之乙烯系單體之任意至少1種。此種追加之單體單元較佳為可選自由CH2
=CH-COO-R6
、CH2
=C(CH3
)-COO-R7
、CH2
=CH-O-CO-R8
(此處,R6
、R7
及R8
係相互獨立地具有1~15個碳原子,不具有羥基,包含至少1個飽和或不飽和之烴基而成、或者進而包含至少1個芳香族基而成,可具有將碳原子間連接之選自由-COO-、-O-、及-CO-所組成之群中之鍵,該烴基或芳香族基可具有胺基)、CH2
=CH-O-R9
、CH2
=CH-R10
(此處,R9
、及R10
係相互獨立地具有3~15個碳原子,不具有羥基,包含至少1個飽和或不飽和之烴基而成、或者進而包含至少1個芳香族基而成,可具有將碳原子間連接之選自由-COO-、-O-、及-CO-所組成之群中之鍵,該烴基或芳香族基可具有胺基)、C4
HO3
-R11
、及C4
H2
NO2
-R12
(此處,C4
HO3
-表示順丁烯二酸酐基,C4
H2
NO2
-表示順丁烯二醯亞胺基,R11
、及R12
係相互獨立地為氫原子或者具有1~15個碳原子數,不具有醇性二級或三級羥基,包含至少1個飽和或不飽和之烴基而成、或者進而包含至少1個芳香族基而成,可具有將碳原子間連接之選自由-COO-、-O-、及-CO-所組成之群中之鍵,該烴基或芳香族基可具有胺基)所表示之化合物所組成之群中。 作為上述不具有羥基之單體單元之較佳例,可列舉如下所示者,但並不限定於其等。 (1)(甲基)丙烯酸甲酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸縮水甘油酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸乙氧基乙酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸四氫呋喃甲酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸苯酯、(甲基)丙烯酸二環戊二烯酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸苄酯、(甲基)丙烯酸N,N-二甲基胺基乙酯、(甲基)丙烯酸N,N-二甲基胺基丙酯、(甲基)丙烯酸3,4-環氧環己基甲酯、(甲基)丙烯酸縮水甘油酯等(甲基)丙烯酸酯。 (2)乙酸乙烯酯、丁酸乙烯酯、戊酸乙烯酯、己酸乙烯酯、環己烷羧酸乙烯酯、苯甲酸乙烯酯、環戊二烯基羧酸乙烯酯、壬酸乙烯酯等乙烯酯。 (3)丙基乙烯醚、丁基乙烯醚、乙氧基乙基乙烯醚、縮水甘油基乙烯醚、戊基乙烯醚、四氫呋喃甲基乙烯醚、環己基乙烯醚、苯基乙烯醚、環戊二烯基乙烯醚、辛基乙烯醚、苄基乙烯醚、2-(乙烯氧基)乙基二甲胺、3-(乙烯氧基)丙基二甲胺等乙烯醚。 (4)1-丁烯、4-乙氧基-1-丁烯、1-戊烯、1-己烯、乙烯基環己烷、苯乙烯、乙烯基甲苯、1-壬烯、3-苯基丙烯等乙烯系衍生物。 (5)順丁烯二酸酐、甲基順丁烯二酸酐、丁基順丁烯二酸酐、己基順丁烯二酸酐、環己基順丁烯二酸酐、苯基順丁烯二酸酐、辛基順丁烯二酸酐等順丁烯二酸酐衍生物。 (6)順丁烯二醯亞胺、甲基順丁烯二醯亞胺、乙基順丁烯二醯亞胺、丁基順丁烯二醯亞胺、己基順丁烯二醯亞胺、環己基順丁烯二醯亞胺、苯基順丁烯二醯亞胺、苄基順丁烯二醯亞胺、辛基順丁烯二醯亞胺等順丁烯二醯亞胺衍生物。 本發明中之鏈狀聚合物可為單體單元之均聚物,亦可為包含2種或3種或更多種之單體單元之共聚物,惟,共聚物之該單體單元之至少1種為具備具有醇性二級或三級羥基之側鏈之單體單元。較佳為,該共聚物包含至少1種具備具有醇性二級或三級羥基之側鏈之單體單元、及至少1種不具有羥基之追加之單體單元。 本發明中之鏈狀聚合物中,具有醇性二級或三級羥基之單體單元所占之比率較佳為30~100莫耳%,更佳為50~100莫耳%,更佳為60~100莫耳%,進而較佳為80~100莫耳%,尤佳為90~100莫耳%。 於本發明中,鏈狀聚合物可藉由使用其原料單體利用常用方法、例如使用2,2'-偶氮二異丁腈(AIBN)等慣用之自由基聚合觸媒進行聚合反應而製造。鏈狀聚合物之分子量通常較佳為10000~100000之範圍(利用凝膠滲透層析法進行之測定),但並不特別限定於該範圍。 作為本發明之硬化性樹脂組合物中之交聯劑,較佳為三𠯤系交聯劑、甘脲系交聯劑、或咪唑啶酮系交聯劑。更具體而言,交聯劑較佳為選自由三𠯤系化合物及/或其縮合物、甘脲系化合物及/或其縮合物、以及咪唑啶酮系化合物及/或其縮合物所組成之群中者。作為該等交聯劑之較佳之具體例,可列舉:完全或部分烷氧基(例如甲氧基、乙氧基)甲基化三聚氰胺及/或其縮合物、完全或部分烷氧基(例如甲氧基、乙氧基)甲基化胍胺及/或其縮合物、完全或部分烷氧基(例如甲氧基、乙氧基)甲基化乙醯胍胺及/或其縮合物、完全或部分烷氧基甲基化苯并胍胺及/或其縮合物、完全或部分烷氧基(例如甲氧基、乙氧基)甲基化甘脲及/或其縮合物、完全或部分烷氧基甲基化咪唑啶酮及/或其縮合物。此處,「烷氧基」較佳為碳原子數1~4。關於作為此種交聯劑之較佳之化合物,更具體而言,例如可列舉:六甲氧基甲基三聚氰胺、六乙氧基甲基三聚氰胺、四甲氧基甲基羥甲基三聚氰胺、四甲氧基甲基三聚氰胺、六丁氧基甲基三聚氰胺、四甲氧基甲基胍胺、四甲氧基甲基乙醯胍胺、四甲氧基甲基苯并胍胺、三甲氧基甲基苯并胍胺、四乙氧基甲基苯并胍胺、四羥甲基苯并胍胺、1,3,4,6-四(甲氧基甲基)甘脲、1,3,4,6-四(丁氧基甲基)甘脲、4,5-二羥基-1,3-二甲氧基甲基-2-咪唑啶酮、4,5-二甲氧基-1,3-二甲氧基甲基-2-咪唑啶酮等,但並不限定於該等。 於一實施形態中,較佳為該交聯劑係選自由式B1: [化20](此處, R1b
具有1~25個碳原子,且選自由經取代或未經取代之烷基、經取代或未經取代之烯基、經取代或未經取代之芳香族基、經取代或未經取代之雜芳香族基、及 [化21]所表示之二取代胺所組成之群, R2b
~R7b
相互獨立地具有1~10個碳原子,且選自由經取代或未經取代之烷基、及經取代或未經取代之烯基所組成之群) 所表示之化合物及/或其縮合物 所組成之群中者。 更佳為,本發明中之該交聯劑係如下化合物及/或其縮合物,其中於式B1中, R1b
係選自由經取代或未經取代之烷基、經取代或未經取代之芳香族基、及 [化22]所表示之二取代胺所組成之群, R2b
~R7b
相互獨立地選自經取代或未經取代之烷基。 於另一實施形態中,較佳為該交聯劑係選自由式B2: [化23](此處,R8b
~R11b
相互獨立地具有1~10個碳原子,且選自由經取代或未經取代之烷基、及經取代或未經取代之烯基所組成之群) 所表示之化合物及/或其縮合物 所組成之群中者。 更佳為,本發明中之該交聯劑係如下化合物及/或其縮合物,其中於式B2中, R8b
~R11b
相互獨立地選自經取代或未經取代之烷基。 於又一實施形態中,較佳為該交聯劑係選自由式B3: [化24](此處, R12b
及R13b
相互獨立地具有1~10個碳原子,且選自由經取代或未經取代之烷基、及經取代或未經取代之烯基所組成之群, R14b
及R15b
相互獨立地為氫或者具有1~10個碳原子,且選自由經取代或未經取代之烷基、及經取代或未經取代之烯基所組成之群) 所表示之化合物及/或其縮合物 所組成之群中者。 更佳為,本發明中之該交聯劑係如下化合物及/或其縮合物,其中於式B3中, R12b
及R13b
相互獨立地選自經取代或未經取代之烷基, R14b
及R15b
相互獨立地選自由氫、及經取代或未經取代之烷基所組成之群中。 進而較佳為,於式B3中,R14b
及R15b
相互獨立地為氫。 作為本發明之硬化性樹脂組合物中之交聯劑之進而較佳之具體例,可列舉以下之結構式所表示或以下所列舉之化合物名之化合物及/或其縮合物: [化25]三𠯤系化合物 甘脲系化合物 三𠯤系化合物 咪唑啶酮系化合物 六甲氧基甲基三聚氰胺; 六丁氧基甲基三聚氰胺; 1,3,4,6-四(甲氧基甲基)甘脲; 1,3,4,6-四(丁氧基甲基)甘脲; 四甲氧基甲基苯并胍胺; 4,5-二羥基-1,3-雙(烷氧基甲基)咪唑啶-2-酮。 作為該縮合物,較佳為列舉上文所示之化合物之聚合物,更佳為列舉上文所示之化合物之二聚物、三聚物或更高次之聚合物。本發明之硬化性樹脂組合物中之交聯劑可為上文所示之化合物及其縮合物,即,可為化合物與該化合物之聚合物(即,二聚物、三聚物、或更高次之聚合物)之混合物。就其他觀點而言,該交聯劑可為對於上文所示之該化合物具有大於1且大於3或其以上之重量平均聚合度者,較佳為可為具有大於1且小於1.8、更佳為1.3至1.8、進而較佳為1.5之重量平均聚合度者,但並不限定於該等。再者,於該化合物之該縮合物之重量平均聚合度為1之情形時,意指該縮合物為該化合物本身。該重量平均聚合度為上述範圍內之任意數值,較佳為1.1、1.2、1.3、1.4、1.5、1.6、1.7、1.8、1.9、2、3、4或更大之值,更佳為1.3、1.4、1.5、1.6、1.7、1.8,進而較佳為1.5。 本發明之硬化性樹脂組合物中之鏈狀聚合物與交聯劑之質量之比較佳為1:0.03~1:2,更佳為1:0.05~1:2、1:0.05~1:1、1:0.03~1:1,進而較佳為1:0.09~1:1、1:0.1~1:0.5,進而更佳為1:0.09~1:0.3、1:0.1~1:0.3。 於本發明中,硬化性樹脂組合物進而包含酸觸媒。該酸觸媒係作為單體單元與交聯劑之反應中之聚合觸媒而視需要包含。該酸觸媒可適當選擇使用作為聚合觸媒慣用者。該酸觸媒可為選自布忍斯特酸及/或路易斯酸中之化合物、或者其鹽或其溶劑合物。作為該酸觸媒,例如可列舉選自由二壬基萘二磺酸、二壬基萘(單)磺酸、十二烷基苯磺酸、十二烷基苯磺酸、對甲苯磺酸(PTS)、磷酸、硫酸、及乙酸等質子酸、以及San-Aid SI-100L、SI-150L、SI-110L、SI-60L、及SI-80L(三新化學工業股份有限公司)等熱酸產生劑所組成之群中之化合物、或者其鹽、或其溶劑合物,但並不限定於該等。較佳為,該酸觸媒係選自由對甲苯磺酸(PTS)、十二烷基苯磺酸、及熱酸產生劑San-Aid SI-100L(三新化學工業股份有限公司)所組成之群中之化合物、或者其鹽、或其溶劑合物。更佳為,該酸觸媒係吡啶鎓-對甲苯磺酸、對甲苯磺酸、或其水合物。 於本發明之硬化性樹脂組合物進而包含酸觸媒之情形時,該酸觸媒之量可根據硬化性樹脂組合物中之鏈狀聚合物與交聯劑之質量之比適當決定,較佳為,硬化性樹脂組合物中之鏈狀聚合物與交聯劑與酸觸媒之質量之比較佳為1:0.03:0.05~1:2:0.1,更佳為1:0.05:0.05~1:2:0.1,進而較佳為1:0.09:0.05~1:1:0.08。 於本發明中,硬化性樹脂組合物可為經溶劑稀釋成適當之濃度而成者。即,於本發明中,硬化性樹脂組合物進而包含溶劑。只要不會因沸點過低或過高等而於將硬化性樹脂組合物塗佈於玻璃製等之基板後藉由乾燥形成均勻之塗膜時出現不良情形,則可適當選擇使用慣用之非質子溶劑。例如,丙二醇單甲醚為適合之溶劑,但並不限定於此。利用溶劑進行之稀釋係用以使單體之聚合反應時、或添加了交聯劑、觸媒之硬化性樹脂組合物之塗佈時等之操作便於進行,故而稀釋程度並無特別之上限、下限。 (2-2)硬化樹脂膜 於一態樣中,本發明提供使上述(2-1)之硬化性樹脂組合物硬化而成之硬化樹脂膜。 於另一態樣中,本發明提供使上述(2-1)之硬化性樹脂組合物於基板表面硬化成膜狀而成之易剝離性硬化樹脂膜。 藉由本發明之硬化性樹脂組合物所形成之硬化樹脂膜於上述「耐熱性」之意義方面具有耐熱性,並且於耐熱性之溫度範圍內之加熱處理後亦具有易剝離性。 典型而言,本發明之硬化性樹脂組合物可藉由將使鏈狀聚合物、交聯劑、及視需要進而使用之酸觸媒溶解於溶劑而成之溶液塗佈於玻璃基板(較佳為鈉鈣玻璃)上並進行加熱處理(100℃~230℃,1分鐘以上)使之硬化,而將數百nm膜厚(較佳為約200 nm~約300 nm之膜厚)之易剝離性硬化樹脂膜成膜為透明之薄膜。雖然不期望受到理論約束,但其機制係由於鏈狀聚合物之側鏈之羥基與交聯劑因加熱而進行交聯時之硬化收縮而成為容易剝離之膜。 [化26]作為塗佈至該玻璃基板之方法,可使用公知之塗佈方法。例如可列舉:旋轉塗佈、非旋轉塗佈、模嘴塗佈、噴霧塗佈、輥式塗佈、網版塗佈、狹縫式塗佈、浸漬塗佈、及凹版塗佈等。較佳為列舉旋轉塗佈。 以此方式於基板上成膜之薄膜可耐受150℃以內之加熱,較佳為亦耐受230℃之加熱(焙燒)。進而,由於對光阻溶液所使用之溶劑具有耐性,亦耐受鹼性顯影溶液,故而可有利地用作用以藉由光微影法進行電路製作之樹脂製基底膜。此外,藉由本發明之硬化性樹脂組合物所形成之薄膜於此種溫度下之加熱後亦具有易剝離性,因此即便為薄膜亦可用於包含較先前高溫下之焙燒步驟之電路製作程序,故而有利於電路之特性保持,且於電路製作後亦可自基板不費勁地輕易剝離。因此,可作為特徵優異之基底膜廣泛用於片狀之軟性之各種電性、電子電路零件之製作,例如亦可利用於軟性之顯示裝置或觸控感測器等之製作。 本發明之硬化樹脂膜可藉由下述(3)硬化樹脂膜之製造方法所記載之方法進行製造。 本發明之硬化樹脂膜之剝離力例如可藉由以下測定方法進行測定。典型而言,以將鏈狀聚合物、交聯劑、及視需要進而使用之酸觸媒溶解於溶劑而成之溶液之形式準備本發明之硬化性樹脂組合物並塗佈於玻璃基板(較佳為鈉鈣玻璃)上,進行加熱處理(100℃~230℃,1分鐘以上)而使之硬化,藉此於玻璃基板上製作硬化樹脂膜。作為測定裝置,例如使用TENSILON RTG-1310(A&D股份有限公司),作為荷重元,使用UR-100N-D型。將米其邦膠帶(寬度24 mm)貼附於玻璃基板上之硬化樹脂膜,相對於玻璃基板以剝離角度90°於300 mm/min之固定速度下進行拉拽,並且利用上述裝置計測剝離所需之力(剝離力)之大小。 本發明之硬化樹脂膜較佳為具有0.5 N/mm2
以下之於鈉玻璃製基板或無鹼玻璃製基板上之剝離力。本發明之硬化樹脂膜更佳為具有0.1 N/mm2
以下之於鈉玻璃製基板或無鹼玻璃製基板上之剝離力。本發明之硬化樹脂膜進而較佳為具有0.09 N/mm2
以下之於鈉玻璃製基板或無鹼玻璃製基板上之剝離力。於鈉玻璃製基板上之剝離力之較佳值為0.5 N/mm2
以下、0.4 N/mm2
以下、0.3 N/mm2
以下、0.2 N/mm2
以下、0.1 N/mm2
以下、0.09 N/mm2
以下、0.08 N/mm2
以下、0.07 N/mm2
以下、0.06 N/mm2
以下、0.05 N/mm2
以下、0.04 N/mm2
以下、0.03 N/mm2
以下、0.02 N/mm2
以下、0.01 N/mm2
以下。於無鹼玻璃製基板上之剝離力之較佳值為0.5 N/mm2
以下、0.4 N/mm2
以下、0.3 N/mm2
以下、0.2 N/mm2
以下、0.1 N/mm2
以下、0.09 N/mm2
以下、0.08 N/mm2
以下、0.07 N/mm2
以下、0.06 N/mm2
以下、0.05 N/mm2
以下、0.04 N/mm2
以下、0.03 N/mm2
以下、0.02 N/mm2
以下、0.01 N/mm2
以下。於鈉玻璃製基板或無鹼玻璃製基板上之該剝離力為0.5 N/mm2
以下之情形時,該硬化樹脂膜可視為具有易剝離性。 (3)硬化樹脂膜之製造方法 於一態樣中,本發明提供一種硬化樹脂膜之製造方法,其係由上述(2-1)之硬化性樹脂組合物製造硬化樹脂膜之方法,且包括: (i)準備具備具有醇性二級或三級羥基之側鏈之鏈狀聚合物及交聯劑之步驟; (ii)將包含該鏈狀聚合物及該交聯劑之該硬化性樹脂組合物塗佈於基板上而形成硬化性樹脂組合物塗膜之步驟;及 (iii)藉由使該硬化性樹脂組合物塗膜進行聚合反應使之硬化而製成硬化樹脂膜之步驟。 上述製造方法進而包括(iv)將形成於該基板上之該硬化樹脂膜自該基板剝離之步驟。 上述製造方法係藉由下述實施例所記載之方法及/或業者所公知之相同之方法實施。 於一實施形態中,上述製造方法於步驟(i)之前,進而包括(i')使至少1種原料單體進行聚合而製造該鏈狀聚合物之步驟。 作為使單體進行聚合之方法,例如可列舉:塊狀聚合法、溶液聚合法、乳化聚合法、懸濁聚合法等,但本發明並不僅限定於該例示。該等聚合法之中,較佳為塊狀聚合法及溶液聚合法。 又,單體之聚合例如可藉由自由基聚合法、活性自由基聚合法、陰離子聚合法、陽離子聚合法、加成聚合法、縮聚法等方法進行。 於藉由溶液聚合法使單體進行聚合之情形時,例如可藉由一面攪拌使單體溶解於溶劑所獲得之溶液一面向該溶液添加聚合起始劑而使單體進行聚合,此外,可藉由一面攪拌使聚合起始劑溶解於溶劑所獲得之溶液一面向該溶液添加單體而使單體進行聚合。溶劑較佳為與單體相溶之有機溶劑。 於使單體進行聚合時,亦可為了調整分子量而使用鏈轉移劑。鏈轉移劑通常可藉由與單體混合而使用。作為鏈轉移劑,例如可列舉:2-(十二烷硫基硫代羰基硫基)-2-甲基丙酸、2-(十二烷硫基硫代羰基硫基)丙酸、2-(十二烷硫基硫代羰基硫基)-2-甲基丙酸甲酯、2-(十二烷硫基硫代羰基硫基)-2-甲基丙酸3-疊氮基-1-丙醇酯、2-(十二烷硫基硫代羰基硫基)-2-甲基丙酸五氟苯酯、月桂硫醇、十二烷基硫醇、硫甘油等含硫醇基化合物、次磷酸鈉、亞硫酸氫鈉等無機鹽等,但本發明並不僅限定於該例示。該等鏈轉移劑可分別單獨地使用,亦可併用2種以上。鏈轉移劑之量並無特別限定,通常只要相對於全部單體之100重量份為約0.01重量份~約10重量份即可。 於使單體進行聚合時,較佳為使用聚合起始劑。作為聚合起始劑,例如可列舉:熱聚合起始劑、光聚合起始劑、氧化還原聚合起始劑、ATRP(原子轉移自由基聚合)起始劑、ICAR(Initiators for Continuous Activator Regeneration,引發劑連續再生活化劑)ATRP起始劑、ARGET(Activator Regeneration By Electron Transfer,電子轉移活化再生)ATRP起始劑、RAFT(可逆性加成-裂解鏈轉移聚合)劑、NMP(經由氮氧化物之聚合)劑、高分子聚合起始劑等。該等聚合起始劑可分別單獨地使用,亦可併用2種以上。 作為熱聚合起始劑,例如可列舉:偶氮異丁腈、偶氮異丁酸甲酯、偶氮雙二甲基戊腈等偶氮系聚合起始劑、過氧化苯甲醯、過硫酸鉀、過硫酸銨等過氧化物系聚合起始劑等,但本發明並不僅限定於該例示。該等聚合起始劑可分別單獨地使用,亦可併用2種以上。 於使用熱聚合起始劑作為聚合起始劑之情形時,該熱聚合起始劑之量相對於全部單體之100重量份通常較佳為約0.01重量份~約20重量份。 作為光聚合起始劑,例如可列舉:2-氧雜戊二酸、1-羥基環己基苯酮、2-羥基-2-甲基-1-苯基丙烷-1-酮、2-甲基[4-(甲硫基)苯基]-2-嗎啉基丙烷-1-酮、2,2-二甲氧基-1,2-二苯基乙烷-1-酮、二苯甲酮、1-[4-(2-羥基乙氧基)苯基]-2-羥基-2-甲基-1-丙烷-1-酮、2-苄基-2-二甲基胺基-1-(4-嗎啉基苯基)丁烷-1-酮、雙(2,6-二甲氧基苯甲醯基)-2,4,4-三甲基戊基氧化膦等,但本發明並不僅限定於該例示。該等聚合起始劑可分別單獨地使用,亦可併用2種以上。 於使用光聚合起始劑作為聚合起始劑之情形時,該光聚合起始劑之量相對於全部單體之100重量份通常較佳為約0.01重量份~約20重量份。 於本發明中,作為能夠使用之其他聚合起始劑,例如可列舉:過氧化氫及鐵(II)鹽、過硫酸鹽及亞硫酸氫鈉等氧化還原聚合起始劑、於金屬觸媒下使用鹵化烷基之ATRP(原子轉移自由基聚合)起始劑、使用金屬及含氮配位基之ICAR ATRP起始劑或ARGET ATRP起始劑、RAFT(可逆性加成-裂解鏈轉移聚合)劑、NMP(經由氮氧化物之聚合)劑、含聚二甲基矽氧烷單元之高分子偶氮聚合起始劑、含聚乙二醇單元之高分子偶氮聚合起始劑等高分子聚合起始劑等,但本發明並不僅限定於該例示。該等聚合起始劑可分別單獨地使用,亦可併用2種以上。 於使用上述能夠使用之聚合起始劑作為聚合起始劑之情形時,該聚合起始劑之量相對於全部單體之100重量份通常較佳為約0.01重量份~約20重量份。 於一實施形態中,藉由對單體照射電子束而進行電子束聚合。 對於使單體進行聚合時之聚合反應溫度及環境並無特別限定。通常,聚合反應溫度為約50℃~約120℃。聚合反應時之環境例如較佳為氮氣等惰性氣體環境。又,單體之聚合反應時間根據聚合反應溫度等而不同,因此無法一概而論,通常為約3~20小時。 於一實施形態中,上述製造方法之步驟(ii)中之該基板較佳為玻璃基板,更佳為鈉玻璃(亦稱為鈉鈣玻璃)或無鹼玻璃(例如,EAGLE-XG,Corning公司),進而較佳為鈉玻璃。 於一實施形態中,作為上述製造方法之步驟(ii)中之將該硬化性樹脂組合物塗佈至該基板之方法,可使用公知之塗佈方法。例如可列舉:旋轉塗佈、模嘴塗佈、噴霧塗佈、輥式塗佈、網版塗佈、狹縫式塗佈、浸漬塗佈、凹版塗佈等,但並不限定於該等。較佳為可使用旋轉塗佈進行塗佈。 於另一實施形態中,上述製造方法之步驟(ii)中,較佳為該組合物進而包含酸觸媒。雖然不期望受到理論約束,其原因在於:藉由該硬化性樹脂組合物塗膜包含酸觸媒,酸觸媒可於步驟(iii)中之聚合反應中作為聚合觸媒發揮功能而促進反應。因此,於另一實施形態中,上述製造方法之步驟(i)進而包含準備酸觸媒之步驟。 於另一實施形態中,上述製造方法之步驟(iii)進而包含對該硬化性樹脂組合物塗膜進行加熱處理之步驟。作為該加熱處理之溫度,較佳為列舉100℃~230℃,更佳為列舉150℃~230℃。作為該加熱處理之時間,較佳為列舉1分鐘以上,更佳為列舉10分鐘、20分鐘、30分鐘、40分鐘、50分鐘、1小時、2小時、3小時、4小時、5小時、6小時等,但並不限定於該等。尤佳之該加熱處理之時間可列舉10分鐘至2小時。 藉由上述製造方法所製造之硬化樹脂膜具有上述(2-2)之硬化樹脂膜之特徵,可以易剝離膜之形式獲得。 (4)用途 本發明之硬化性樹脂組合物或硬化樹脂膜可使用於合成樹脂、丸劑、膜、平板、纖維、發泡劑、管體、橡膠、彈性體等,應用於二輪車(自行車、機車等)、汽車、飛機、電車、船、火箭、太空船、運送、娛樂、傢俱(例如,餐桌、椅子、書桌、架子等)、寢具(例如,床、吊床等)、衣服、防護服、體育用品、浴缸、廚具、餐具、烹飪用具、容器及包裝材(食品用容器、化妝品用容器、貨物用集裝箱、垃圾箱等)、建築(建築物、道路、建築零件等)、農業膜、工業膜、上下水道、塗料、化妝料、電機產業及電子產業領域(電化製品、電腦用零件、印刷基板、絕緣體、導電體、配線覆膜材、發電元件、揚聲器、麥克風、雜訊消除器、轉換器等)、光通信纜線、醫療用材料及器具(導管、導線、人工血管、人工肌肉、人工器官、透析膜、內視鏡等)、小型泵、致動器、機器人材料(產業用機器人等所使用之感測器)、能量產生裝置及電廠(太陽光發電、風力發電等)等廣泛之領域。 本發明之硬化性樹脂組合物或硬化樹脂膜可使用於電子材料、醫療材料、保健材料、生命科學材料、或機器人材料等。本發明之硬化性樹脂組合物或硬化樹脂膜例如可用作導管、導線、醫藥品用容器、管體等之材料。 本發明之硬化性樹脂組合物或硬化樹脂膜可使用於汽車零件(車體面板、保險桿、門下圍板、側飾條、引擎零件、驅動零件、傳導零件、操縱裝置零件、穩定器零件、懸架-制動裝置零件、刹車零件、軸零件、管類、槽類、車輪、座椅、安全帶等)。本發明之聚合物可使用於汽車用防振材、汽車用塗料、汽車用合成樹脂等。 本說明書中所引用之科學文獻、專利、專利申請等參考文獻之全部內容係作為參考被援引至本說明書中至分別與具體記載相同之程度。 以上,為了容易理解而例示較佳之實施形態對本發明進行了說明。以下,基於實施例對本發明進行說明,但上述之說明及以下之實施例係僅為了例示而提供,而並非為了限定本發明而提供。因此,本發明之範圍並不限定於本說明書中具體記載之實施形態,亦不限定於實施例,而僅由申請專利範圍所限定。 實施例 以下,參照實施例更詳細地說明本發明,但並不意圖將本發明限定於該等實施例。而且,將各實施例所揭示之技術方法適當組合所獲得之實施例亦包含於本發明之範圍內。 1.作為硬化性樹脂組合物之構成要素之聚合物之製造 以如下所述之方式製造聚合物作為硬化性樹脂組合物之構成要素。 (製造例1) 聚合物A-1之製造 將下式(1-1) [化27]之甲基丙烯酸2-羥基丙酯用作單體,並使其100質量份以成為30質量%之方式溶解於丙二醇單甲醚(PGME)中。一面向所獲得之溶液吹入氮氣一面升溫至80℃,添加相對於單體總量為5莫耳%之2,2'-偶氮二異丁腈(AIBN),其後於80℃下進行8小時反應而獲得聚合物A-1。藉由凝膠滲透層析法對該聚合物之平均分子量(MW)進行測定,結果為25,000。 (製造例2) 聚合物A-2之製造 將下式(1-2) [化28](1-2) 之甲基丙烯酸3-苯甲醯氧基-2-羥基丙酯用作單體,除此以外,以與製造例1相同之方式獲得聚合物A-2。藉由凝膠滲透層析法對該聚合物之平均分子量(MW)進行測定,結果為22000。 (製造例3) 聚合物A-3之製造 將下式(1-3) [化29]之甲基丙烯酸4-苯甲醯氧基-3-羥基環己基甲酯用作單體,除此以外,以與製造例1相同之方式獲得聚合物A-3。藉由凝膠滲透層析法對該聚合物之平均分子量(MW)進行測定,結果為32000。 (製造例4) 聚合物A-4之製造 將下式(1-4) [化30]之1,3-金剛烷基二醇單甲基丙烯酸酯用作單體,除此以外,以與製造例1相同之方式獲得聚合物A-4。藉由凝膠滲透層析法對該聚合物之平均分子量(MW)進行測定,結果為18000。 (製造例5) 聚合物A-5之製造 將下式(1-5) [化31]之甲基丙烯酸2-羥基環己酯用作單體,除此以外,以與製造例1相同之方式獲得聚合物A-5。藉由凝膠滲透層析法對該聚合物之平均分子量(MW)進行測定,結果為36000。 (製造例6) 聚合物A-6之製造 將下式(1-6) [化32]之甲基丙烯酸2-羥基乙酯用作單體,除此以外,以與製造例1相同之方式獲得聚合物A-6。藉由凝膠滲透層析法對該聚合物之平均分子量(MW)進行測定,結果為42000。 (製造例7) 聚合物A-7之製造 將下式(1-7) [化33]之甲基丙烯酸4-(羥基甲基)環己酯用作單體,除此以外,以與製造例1相同之方式獲得聚合物A-7。藉由凝膠滲透層析法對該聚合物之平均分子量(MW)進行測定,結果為18000。 (製造例8) 聚合物A-8之製造 將式(1-1)之甲基丙烯酸2-羥基丙酯及丙烯酸正丁酯用作單體,並使其等之各50質量份以合計成為30質量%之方式溶解於丙二醇單甲醚(PGME)。一面向所獲得之溶液吹入氮氣一面升溫至80℃,並添加相對於單體總量為5莫耳%之2,2'-偶氮二異丁腈(AIBN),其後於80℃下進行8小時反應而獲得聚合物A-8。藉由凝膠滲透層析法對該聚合物之平均分子量(MW)進行測定,結果為18000。 (製造例9) 聚合物A-9之製造 將式(1-1)之甲基丙烯酸2-羥基丙酯及甲基丙烯酸甲酯用作單體,除此以外,以與製造例8相同之方式獲得聚合物A-9。藉由凝膠滲透層析法對該聚合物之平均分子量(MW)進行測定,結果為25000。 (製造例10) 聚合物A-10之製造 將式(1-1)之甲基丙烯酸2-羥基丙酯及苯乙烯用作單體,除此以外,以與製造例8相同之方式獲得聚合物A-10。藉由凝膠滲透層析法對該聚合物之平均分子量(MW)進行測定,結果為22000。 (製造例11) 聚合物A-11之製造 將式(1-3)之甲基丙烯酸4-苯甲醯氧基-3-羥基環己基甲酯及甲基丙烯酸二環戊二烯酯用作單體,除此以外,以與製造例8相同之方式獲得聚合物A-11。藉由凝膠滲透層析法對該聚合物之平均分子量(MW)進行測定,結果為35000。 (製造例12) 聚合物A-12之製造 將式(1-5)之甲基丙烯酸2-羥基環己酯及甲基丙烯酸二環戊二烯酯用作單體,除此以外,以與製造例8相同之方式獲得聚合物A-12。藉由凝膠滲透層析法對該聚合物之平均分子量(MW)進行測定,結果為25000。 (製造例13) 聚合物A-13之製造 將式(1-6)之甲基丙烯酸2-羥基乙酯及丙烯酸丁酯用作單體,除此以外,以與製造例8相同之方式獲得聚合物A-13。藉由凝膠滲透層析法對該聚合物之平均分子量(MW)進行測定,結果為38000。 (製造例14) 聚合物A-14之製造 將式(1-6)之甲基丙烯酸2-羥基乙酯及甲基丙烯酸甲酯用作單體,除此以外,以與製造例8相同之方式獲得聚合物A-14。藉由凝膠滲透層析法對該聚合物之平均分子量(MW)進行測定,結果為36000。 (製造例15) 聚合物A-15之製造 將式(1-6)之甲基丙烯酸2-羥基乙酯及甲基丙烯酸二環戊二烯酯用作單體,除此以外,以與製造例8相同之方式獲得聚合物A-15。藉由凝膠滲透層析法對該聚合物之平均分子量(MW)進行測定,結果為39000。 (製造例16) 聚合物A-16之製造 將下式(1-8) [化34]之甲基丙烯酸4-(4-甲氧基苯基丙醯基)氧基-3-羥基環己基甲酯用作單體,除此以外,以與製造例1相同之方式獲得聚合物A-16。 [化35]藉由凝膠滲透層析法對該聚合物之平均分子量(MW)進行測定,結果為27,700。 (製造例17) 聚合物A-17之製造 將下式(1-9) [化36]之甲基丙烯酸4-金剛烷羧基氧基-3-羥基環己基甲酯用作單體,除此以外,以與製造例1相同之方式獲得聚合物A-17。 [化37]藉由凝膠滲透層析法對該聚合物之平均分子量(MW)進行測定,結果為31,700。 (製造例18) 聚合物A-18之製造 將式(1-5)之甲基丙烯酸2-羥基環己酯及甲基丙烯酸甲酯用作單體,除此以外,以與製造例8相同之方式獲得聚合物A-18。 [化38]藉由凝膠滲透層析法對該聚合物之平均分子量(MW)進行測定,結果為25,500。 (製造例19) 聚合物A-19之製造 將下式(1-10) [化39]之2-甲基丙烯酸-3-羥基金剛烷基甲酯用作單體,除此以外,以與製造例1相同之方式獲得聚合物A-19。 [化40]藉由凝膠滲透層析法對該聚合物之平均分子量(MW)進行測定,結果為35,700。 (製造例20) 聚合物A-20之製造 將下式(1-11) [化41]之2-羥基-4-甲基丙烯醯氧基甲基-環己基-3-環己烯-1-羧酸酯用作單體,除此以外,以與製造例1相同之方式獲得聚合物A-20。 [化42]藉由凝膠滲透層析法對該聚合物之平均分子量(MW)進行測定,結果為26,700。 (製造例21) 聚合物A-21之製造 將下式(1-12) [化43]之2-甲基丙烯酸4-(2-環己基乙醯基)氧基-3-羥基環己烷甲酯用作單體,除此以外,以與製造例1相同之方式獲得聚合物A-21。 [化44]藉由凝膠滲透層析法對該聚合物之平均分子量(MW)進行測定,結果為30,700。 (製造例22) 聚合物A-22之製造 將式(1-5)之甲基丙烯酸2-羥基環己酯及甲基丙烯酸苄酯用作單體,除此以外,以與製造例8相同之方式獲得聚合物A-22。 [化45]藉由凝膠滲透層析法對該聚合物之平均分子量(MW)進行測定,結果為32,700。 (製造例23) 聚合物A-23之製造 將式(1-8)之甲基丙烯酸4-(4-甲氧基苯基丙醯基)氧基-3-羥基環己基甲酯及式(1-13) [化46]之甲基丙烯酸3,4-環氧環己基甲酯用作單體,並使其100質量份以成為20質量%之方式溶解於丙二醇單甲醚(PGME)。一面向所獲得之溶液吹入氮氣一面升溫至80℃,並添加相對於單體總量為4莫耳%之2,2'-偶氮二異丁腈(AIBN),其後於80℃下進行8小時反應而獲得聚合物。其後,分別添加4-甲氧基桂皮酸99質量份及甲基丙烯酸1質量份,進而添加溴化四乙基銨3莫耳%,並一面吹入空氣一面升溫至100℃,進行38小時反應而獲得聚合物A-23。 [化47]所獲得之聚合物係藉由凝膠滲透層析法對該聚合物之平均分子量(MW)進行測定,結果為42,900。 (製造例24) 聚合物A-24之製造 將甲基丙烯酸甲酯、甲基丙烯酸縮水甘油酯及甲基丙烯酸二環戊二烯酯用作單體,除此以外,以與製造例8相同之方式獲得聚合物A-24。 [化48]藉由凝膠滲透層析法對該聚合物之平均分子量(MW)進行測定,結果為35,700。 2.硬化性樹脂組合物之製造 以如下所示之方式製造本發明之各種硬化性樹脂組合物,塗佈於2種玻璃基板上並使其加熱硬化而成膜。 (實施例1) 使聚合物A-1 4.4質量份、作為交聯劑之下式(B-1) [化49]之六甲氧基甲基三聚氰胺(NIKALAC MW-30,Sanwa Chemical股份有限公司)0.4質量份、及作為聚合觸媒之吡啶鎓-對甲苯磺酸0.2質量份溶解於丙二醇單甲醚(PGME)95質量份。藉由旋轉塗佈將該溶液分別塗佈於0.7 mm厚之鈉玻璃及0.5 mm厚之無鹼玻璃(EAGLE-XG,Corning公司)上,並於150℃以上進行30分鐘加熱處理而成膜約300 nm之膜厚。 (實施例2) 使聚合物A-1 3.2質量份、交聯劑六甲氧基甲基三聚氰胺(式(B-1))0.8質量份、及作為聚合觸媒之吡啶鎓-對甲苯磺酸0.2質量份溶解於丙二醇單甲醚(PGME)95質量份。使用該溶液以與實施例1相同之方式分別塗佈於鈉玻璃及無鹼玻璃上並進行熱處理而成膜約300 nm之膜厚。 (實施例3) 使聚合物A-1 2.4質量份、交聯劑六甲氧基甲基三聚氰胺(式(B-1))2.4質量份、及作為聚合觸媒之吡啶鎓-對甲苯磺酸0.2質量份溶解於丙二醇單甲醚(PGME)95質量份。使用該溶液以與實施例1相同之方式分別塗佈於鈉玻璃及無鹼玻璃上並進行熱處理而成膜約300 nm之膜厚。 (實施例4) 使聚合物A-2 4.4質量份、交聯劑六甲氧基甲基三聚氰胺(式(B-1))0.4質量份、及作為聚合觸媒之吡啶鎓-對甲苯磺酸0.2質量份溶解於丙二醇單甲醚(PGME)95質量份。使用該溶液以與實施例1相同之方式分別塗佈於鈉玻璃及無鹼玻璃上並進行熱處理而成膜約300 nm之膜厚。 (實施例5) 使聚合物A-3 4.4質量份、交聯劑六甲氧基甲基三聚氰胺(式(B-1))0.4質量份、及作為聚合觸媒之吡啶鎓-對甲苯磺酸0.2質量份溶解於丙二醇單甲醚(PGME)95質量份。使用該溶液以與實施例1相同之方式分別塗佈於鈉玻璃及無鹼玻璃上並進行熱處理而成膜約300 nm之膜厚。 (實施例6) 使聚合物A-4 4.4質量份、交聯劑六甲氧基甲基三聚氰胺(式(B-1))0.4質量份、及作為聚合觸媒之吡啶鎓-對甲苯磺酸0.2質量份溶解於丙二醇單甲醚(PGME)95質量份。使用該溶液以與實施例1相同之方式分別塗佈於鈉玻璃及無鹼玻璃上並進行熱處理而成膜約300 nm之膜厚。 (實施例7) 使聚合物A-5 4.4質量份、交聯劑六甲氧基甲基三聚氰胺(式(B-1))0.4質量份、及作為聚合觸媒之吡啶鎓-對甲苯磺酸0.2質量份溶解於丙二醇單甲醚(PGME)95質量份。使用該溶液以與實施例1相同之方式分別塗佈於鈉玻璃及無鹼玻璃上並進行熱處理而成膜約300 nm之膜厚。 (實施例8) 使聚合物A-8 4.4質量份、交聯劑六甲氧基甲基三聚氰胺(式(B-1))0.4質量份、及作為聚合觸媒之吡啶鎓-對甲苯磺酸0.2質量份溶解於丙二醇單甲醚(PGME)95質量份。使用該溶液以與實施例1相同之方式分別塗佈於鈉玻璃及無鹼玻璃上並進行熱處理而成膜約300 nm之膜厚。 (實施例9) 使聚合物A-9 4.4質量份、交聯劑六甲氧基甲基三聚氰胺(式(B-1))0.4質量份、及作為聚合觸媒之吡啶鎓-對甲苯磺酸0.2質量份溶解於丙二醇單甲醚(PGME)95質量份。使用該溶液以與實施例1相同之方式分別塗佈於鈉玻璃及無鹼玻璃上並進行熱處理而成膜約300 nm之膜厚。 (實施例10) 使聚合物A-10 4.4質量份、交聯劑六甲氧基甲基三聚氰胺(式(B-1))0.4質量份、及作為聚合觸媒之吡啶鎓-對甲苯磺酸0.2質量份溶解於丙二醇單甲醚(PGME)95質量份。使用該溶液以與實施例1相同之方式分別塗佈於鈉玻璃及無鹼玻璃上並進行熱處理而成膜約300 nm之膜厚。 (實施例11) 使聚合物A-11 4.4質量份、交聯劑六甲氧基甲基三聚氰胺(式(B-1))0.4質量份、及作為聚合觸媒之吡啶鎓-對甲苯磺酸0.2質量份溶解於丙二醇單甲醚(PGME)95質量份。使用該溶液以與實施例1相同之方式分別塗佈於鈉玻璃及無鹼玻璃上並進行熱處理而成膜約300 nm之膜厚。 (實施例12) 使聚合物A-12 4.4質量份、交聯劑六甲氧基甲基三聚氰胺(式(B-1))0.4質量份、及作為聚合觸媒之吡啶鎓-對甲苯磺酸0.2質量份溶解於丙二醇單甲醚(PGME)95質量份。使用該溶液以與實施例1相同之方式分別塗佈於鈉玻璃及無鹼玻璃上並進行熱處理而成膜約300 nm之膜厚。 (實施例13) 使聚合物A-1 4.4質量份、作為交聯劑之下式(B-2) [化50]之1,3,4,6-四(甲氧基甲基)甘脲(NIKALAC MW-270,Sanwa Chemical股份有限公司)0.4質量份、及作為聚合觸媒之吡啶鎓-對甲苯磺酸0.2質量份溶解於丙二醇單甲醚(PGME)95質量份。使用該溶液以與實施例1相同之方式分別塗佈於鈉玻璃及無鹼玻璃上並進行熱處理而成膜約300 nm之膜厚。 (實施例14) 使聚合物A-1 4.4質量份、作為交聯劑之下式(B-3) [化51]之四甲氧基甲基苯并胍胺0.4質量份、及作為聚合觸媒之吡啶鎓-對甲苯磺酸0.2質量份溶解於丙二醇單甲醚(PGME)95質量份。使用該溶液以與實施例1相同之方式分別塗佈於鈉玻璃及無鹼玻璃上並進行熱處理而成膜約300 nm之膜厚。 (實施例15) 使聚合物A-1 4.4質量份、交聯劑六甲氧基甲基三聚氰胺(式(B-1))0.4質量份、及作為聚合觸媒之十二烷基苯磺酸0.2質量份溶解於丙二醇單甲醚(PGME)95質量份。使用該溶液以與實施例1相同之方式分別塗佈於鈉玻璃及無鹼玻璃上並進行熱處理而成膜約300 nm之膜厚。 (實施例16) 使聚合物A-1 4.4質量份、交聯劑六甲氧基甲基三聚氰胺(式(B-1))0.4質量份、及作為聚合觸媒之熱酸產生劑San-Aid SI-100L(三新化學工業股份有限公司)0.2質量份溶解於丙二醇單甲醚(PGME)95質量份。使用該溶液以與實施例1相同之方式分別塗佈於鈉玻璃及無鹼玻璃上並進行熱處理而成膜約300 nm之膜厚。 (比較例1) 使聚合物A-6 4.4質量份、交聯劑六甲氧基甲基三聚氰胺(式(B-1))0.4質量份、及作為聚合觸媒之吡啶鎓-對甲苯磺酸0.2質量份溶解於丙二醇單甲醚(PGME)95質量份。使用該溶液以與實施例1相同之方式分別塗佈於鈉玻璃及無鹼玻璃上並進行熱處理而成膜約300 nm之膜厚。 (比較例2) 使聚合物A-7 4.4質量份、交聯劑六甲氧基甲基三聚氰胺(式(B-1))0.4質量份、及作為聚合觸媒之吡啶鎓-對甲苯磺酸0.2質量份溶解於丙二醇單甲醚(PGME)95質量份。使用該溶液以與實施例1相同之方式分別塗佈於鈉玻璃及無鹼玻璃上並進行熱處理而成膜約300 nm之膜厚。 (比較例3) 使聚合物A-13 4.4質量份、交聯劑六甲氧基甲基三聚氰胺(式(B-1))0.4質量份、及作為聚合觸媒之吡啶鎓-對甲苯磺酸0.2質量份溶解於丙二醇單甲醚(PGME)95質量份。使用該溶液以與實施例1相同之方式分別塗佈於鈉玻璃及無鹼玻璃上並進行熱處理而成膜約300 nm之膜厚。 (比較例4) 使聚合物A-14 4.4質量份、交聯劑六甲氧基甲基三聚氰胺(式(B-1))0.4質量份、及作為聚合觸媒之吡啶鎓-對甲苯磺酸0.2質量份溶解於丙二醇單甲醚(PGME)95質量份。使用該溶液以與實施例1相同之方式分別塗佈於鈉玻璃及無鹼玻璃上並進行熱處理而成膜約300 nm之膜厚。 (比較例5) 使聚合物A-15 4.4質量份、交聯劑六甲氧基甲基三聚氰胺(式(B-1))0.4質量份、及作為聚合觸媒之吡啶鎓-對甲苯磺酸0.2質量份溶解於丙二醇單甲醚(PGME)95質量份。使用該溶液以與實施例1相同之方式分別塗佈於鈉玻璃及無鹼玻璃上並進行熱處理而成膜約300 nm之膜厚。 (比較例6) 使聚合物A-1 4.4質量份、作為異氰尿酸酯系交聯劑之Duranate TPA-100(旭化成股份有限公司)0.4質量份、及作為聚合觸媒之吡啶鎓-對甲苯磺酸0.2質量份溶解於丙二醇單甲醚(PGME)95質量份。使用該溶液以與實施例1相同之方式分別塗佈於鈉玻璃及無鹼玻璃上並進行熱處理而成膜約300 nm之膜厚。 (實施例17) 使聚合物A-16 3.2質量份、交聯劑六甲氧基甲基三聚氰胺(式(B-1))0.8質量份、及作為聚合觸媒之吡啶鎓-對甲苯磺酸0.2質量份溶解於丙二醇單甲醚(PGME)95質量份。使用該溶液以與實施例1相同之方式分別塗佈於鈉玻璃及無鹼玻璃上並進行熱處理而成膜約300 nm之膜厚。 (實施例18) 使聚合物A-17 3.2質量份、交聯劑六甲氧基甲基三聚氰胺(式(B-1))0.8質量份、及作為聚合觸媒之吡啶鎓-對甲苯磺酸0.2質量份溶解於丙二醇單甲醚(PGME)95質量份。使用該溶液以與實施例1相同之方式分別塗佈於鈉玻璃及無鹼玻璃上並進行熱處理而成膜約300 nm之膜厚。 (實施例19) 使聚合物A-18 3.2質量份、交聯劑六甲氧基甲基三聚氰胺(式(B-1))0.8質量份、及作為聚合觸媒之吡啶鎓-對甲苯磺酸0.2質量份溶解於丙二醇單甲醚(PGME)95質量份。使用該溶液以與實施例1相同之方式分別塗佈於鈉玻璃及無鹼玻璃上並進行熱處理而成膜約300 nm之膜厚。 (實施例20) 使聚合物A-19 3.2質量份、交聯劑六甲氧基甲基三聚氰胺(式(B-1))0.8質量份、及作為聚合觸媒之吡啶鎓-對甲苯磺酸0.2質量份溶解於丙二醇單甲醚(PGME)95質量份。使用該溶液以與實施例1相同之方式分別塗佈於鈉玻璃及無鹼玻璃上並進行熱處理而成膜約300 nm之膜厚。 (實施例21) 使聚合物A-20 3.2質量份、交聯劑六甲氧基甲基三聚氰胺(式(B-1))0.8質量份、及作為聚合觸媒之吡啶鎓-對甲苯磺酸0.2質量份溶解於丙二醇單甲醚(PGME)95質量份。使用該溶液以與實施例1相同之方式分別塗佈於鈉玻璃及無鹼玻璃上並進行熱處理而成膜約300 nm之膜厚。 (實施例22) 使聚合物A-21 3.2質量份、交聯劑六甲氧基甲基三聚氰胺(式(B-1))0.8質量份、及作為聚合觸媒之吡啶鎓-對甲苯磺酸0.2質量份溶解於丙二醇單甲醚(PGME)95質量份。使用該溶液以與實施例1相同之方式分別塗佈於鈉玻璃及無鹼玻璃上並進行熱處理而成膜約300 nm之膜厚。 (實施例23) 使聚合物A-22 3.2質量份、交聯劑六甲氧基甲基三聚氰胺(式(B-1))0.8質量份、及作為聚合觸媒之吡啶鎓-對甲苯磺酸0.2質量份溶解於丙二醇單甲醚(PGME)95質量份。使用該溶液以與實施例1相同之方式分別塗佈於鈉玻璃及無鹼玻璃上並進行熱處理而成膜約300 nm之膜厚。 (實施例24) 使聚合物A-23 3.2質量份、交聯劑六甲氧基甲基三聚氰胺(式(B-1))0.8質量份、及作為聚合觸媒之吡啶鎓-對甲苯磺酸0.2質量份溶解於丙二醇單甲醚(PGME)95質量份。使用該溶液以與實施例1相同之方式分別塗佈於鈉玻璃及無鹼玻璃上並進行熱處理而成膜約300 nm之膜厚。 (比較例7) 使聚合物A-24 3.2質量份、交聯劑六甲氧基甲基三聚氰胺(式(B-1))0.8質量份、及作為聚合觸媒之吡啶鎓-對甲苯磺酸0.2質量份溶解於丙二醇單甲醚(PGME)95質量份。使用該溶液以與實施例1相同之方式分別塗佈於鈉玻璃及無鹼玻璃上並進行熱處理而成膜約300 nm之膜厚。 3.性能之評價 (1)對硬化樹脂薄膜之剝離力之評價 對於上述實施例及比較例之各者中於玻璃基板上所製作之硬化樹脂薄膜,藉由以下所示之方法對使其等自玻璃基板剝離所需之力之大小(剝離力)進行定量評價。即,使用TENSILON RTG-1310(A&D股份有限公司)作為測定裝置,使用UR-100N-D型作為荷重元,測定係藉由如下方式進行,即,將米其邦膠帶(寬度24 mm)貼附於玻璃基板上之硬化樹脂薄膜,相對於玻璃基板以剝離角度90°於300 mm/min之固定速度下進行拉拽,並且利用上述裝置對剝離所需之力(剝離力)之大小進行計測。將結果示於表1。關於表1及表2之實施例1~16之剝離力係以小數點以下3位進行顯示。除此以外之測定值及計算值原則上顯示至小數點以下2位。 [表1]
如表1所示,判明比較例1~6之硬化樹脂薄膜中之剝離力為2.2~8.7 N/mm2
(鈉玻璃基板)及3.2~9.2 N/mm2
(EAGLE-XG基板),與此相對,實施例1~16中之剝離力小兩位數,為0.013~0.078 N/mm2
(鈉玻璃基板)及0.028~0.085 N/mm2
(EAGLE-XG基板)。實際上,發現由於比較例之各硬化樹脂薄膜之剝離力之值較高,故而膜或基板遭到破壞,與此相對,實施例之各硬化樹脂薄膜均可不費勁地輕易剝離。 (2)對焙燒後之硬化樹脂薄膜之剝離力之評價 假定藉由使用光微影法或印刷法之圖案化於硬化樹脂薄膜上製作電路時之焙燒製程,並對焙燒硬化樹脂薄膜之情形時之剝離力進行計測。即,對於實施例1及7以及比較例1及2,將形成於鈉玻璃基板上之硬化樹脂薄膜於230℃下焙燒1小時或3小時,並藉由上述(1)中記載之裝置及方法計測各者之剝離力。將結果與該等實施例及比較例中之焙燒前之剝離力(初始剝離力)之值共同示於表2。 [表2]
如表2所示,實施例1及7之硬化樹脂薄膜於以230℃焙燒1小時或3小時之後,與焙燒前之比較例1及2相比仍為低兩位數之程度,可不費勁地輕易剝離。比較例1及2之硬化樹脂薄膜較焙燒前更牢固地接著於玻璃基板。 假定以與上述(2)相同之方法藉由使用光微影法或印刷法之圖案化於硬化樹脂薄膜上製作電路時之焙燒製程,並對焙燒硬化樹脂薄膜之情形時之剝離力進行計測。即,對於實施例12、16~22及比較例7,將形成於鈉玻璃基板上之硬化樹脂薄膜於230℃下焙燒20分鐘,並藉由上述(1)中記載之裝置及方法計測各者之剝離力。將結果與該等實施例及比較例中之焙燒前之剝離力(初始剝離力)之值共同示於表3。 [表3]
如表3所示,實施例12~24之硬化樹脂薄膜於以230℃焙燒20分鐘之後,亦與焙燒前同樣地為較焙燒前之比較例7低兩位數之程度,可不費勁地輕易剝離。另一方面,比較例7之硬化樹脂薄膜與焙燒前同樣地剝離力較高,無法容易地剝離。 (3)對使交聯劑及混合比率變化之情形時焙燒後之硬化樹脂薄膜之剝離力之評價 使交聯劑及聚合物/交聯劑之混合比率變化為以下之表5中記載者,並對該情形之實施例25~27及比較例8~10進行所製作之硬化樹脂薄膜之剝離力之計測。各種條件如下所示。 <評價條件> ・基板:鈉玻璃(塗佈於錫處理面) ・製膜:旋轉塗佈,於>150℃或230℃下烘烤30分鐘 ※最終膜厚50~200 nm ・剝離試驗條件:藉由米其邦膠帶(寬度24 mm)進行剝離試驗。 所使用之聚合物為聚合物A-3。 所使用之交聯劑如表4所示。表4中,MW-30為上述式(B-1)之六甲氧基甲基三聚氰胺(NIKALAC MW-30,Sanwa Chemical股份有限公司),MW-30LF為六甲氧基甲基三聚氰胺(低游離甲醛品)(NIKALAC MW-30LF,Sanwa Chemical股份有限公司),MX-270為上述式(B-2)之1,3,4,6-四(甲氧基甲基)甘脲(NIKALAC MW-270,Sanwa Chemical股份有限公司)。 [表4]<img wi="120" he="86" file="IMG-2/Draw/02_image103.jpg" img-format="jpg"><img wi="125" he="84" file="IMG-2/Draw/02_image105.jpg" img-format="jpg"><img wi="110" he="76" file="IMG-2/Draw/02_image107.jpg" img-format="jpg">
將結果示於表5。將MW-30設為參照化合物,藉由變更其他化合物之混合比率而對剝離力及剝離特性進行研究(實施例25~27及比較例8~10)。表5中,於剝離試驗一欄中,「〇」表示所形成之硬化樹脂膜可不費勁地輕易剝離,具有易剝離性,「×」表示無法輕易地剝離,不具有易剝離性。 [表5]
如表5所示,於使用MW-30之情形時,若聚合物/交聯劑之混合比率為45/50,則剝離力較低,為0.02,具有易剝離性,但於90/10之情形時,剝離力亦大兩位數,為7.5,不具有易剝離性。於使用MX-270之情形時,於混合比率為45/50及90/10之兩者中,具有較低之剝離力及易剝離性。另一方面,關於MW-30LF,於混合比率為45/50及90/10之兩者中,具有較高之剝離力,不具有易剝離性。認為該結果之原因在於MW-30LF之甲醛較少,與MW-30相比,羥甲基部分(熱交聯之反應點)減少。 (4)硬化樹脂薄膜之剝離力之閾值之研究 對使聚合物、交聯劑、及酸觸媒之重量比(wt%)變化之情形時的所製作之硬化樹脂薄膜之剝離力進行計測。即,對於實施例28~38及比較例11~15,將按以下之表6中記載之重量比使用聚合物、交聯劑、及酸觸媒製作之溶液塗佈於鈉玻璃基板上,並於230℃下焙燒20分鐘,除此以外,以與實施例1相同之方式成膜硬化樹脂膜,藉由上述(1)中記載之裝置及方法計測各者之剝離力並進行比較。將結果示於表6。 [表6]
如表6所示,對於交聯劑B-1,將聚合物、交聯劑、及酸觸媒之合計量作為基準於10重量%以上表現易剝離性(實施例28~30),對於交聯劑B-2,於3重量%以上表現易剝離性(實施例33~38)。又,於表5之比較例8中,若聚合物/交聯劑之混合比率為90/10,則不表現易剝離性,但若為使用酸觸媒之大致相同混合比率之表6之實施例29之85/10,則表現易剝離性,因此可謂藉由加入酸觸媒而容易表現易剝離性。 如上所述,使用本發明之較佳實施形態對本發明進行了例示,但應理解本發明僅根據申請專利範圍對其範圍進行解釋。應理解本說明書中所引用之專利、專利申請及其他文獻之內容本身被具體記載於本說明書中,同樣地,其內容應作為對本說明書之參考而加以援引。本案對國際專利申請PCT/JP2016/074180(2016年8月19日提出申請)及臺灣專利申請第105126494號(2016年8月19日提出申請)主張優先權,且將其等之內容整體以參照之形式援引至本說明書中。 [產業上之可利用性] 本發明係一種硬化性樹脂組合物,其可極薄地塗佈於玻璃等基板,可藉由於塗佈後使其乾燥並硬化而成膜極薄之硬化樹脂薄膜,於在該薄膜上藉由圖案化等而製作電路之製程中之焙燒中,具有對230℃之高溫之耐久性,而且即便曝露於此種高溫後亦可自基板不費勁地剝離,該硬化性樹脂組合物於膜型電性、電子電路零件之製造中有用。(1) Definitions of Terms In this specification, the term "heat resistance" means that the film obtained by curing the curable resin composition can withstand heating within 150°C, preferably 230°C, without substantially causing decomposition or other degradation. A temperature of 230°C is a high enough temperature to be used as a baking temperature in the manufacture of electronic circuits using photolithography. In this specification, the term "easily peelable film" means that a film formed by coating on a substrate, especially a glass substrate, and curing is easily peeled off from the substrate without damaging the film (i.e., without much effort), and the term "easy peelability" refers to the properties of such a film. As the glass substrate, for example, a sodium glass substrate, an alkali-free glass substrate, and the like are suitable glass substrates. A sodium glass substrate is a particularly preferred example. In this specification, the thickness of the "hardened resin film" is not limited. When used as a base film for circuit manufacturing, the preferred thickness is 200 to 400 nm, for example, about 300 nm. The reason for this is to cope with the current demand for thin film when manufacturing electronic components, rather than the performance of the hardened resin film itself being limited to this thickness range. The thickness of the hardened resin film is arbitrary. In this specification, "hardened resin film" is used with the same meaning as "hardened resin film". In this specification, the term "side chain" in a chain polymer refers to a structural part branching from the main chain, and the so-called "main chain" refers to a chain composed of atoms of repeated monomer units in the structure of the polymer linked in one dimension. Therefore, for example, in the case where the polymer is a polymer of (meth)acrylate, "-COO-" which is a part of each monomer that participates in the formation of ester bonds is included in a part of the "side chain". Furthermore, the expression "(meth)acrylate" refers to acrylate and methacrylate without distinction. Similarly, the expression "(meth)acryl" refers to acryl and methacryl without distinction, and "(meth)acrylic acid" refers to acrylic acid and methacrylic acid without distinction. In this specification, when "-O-" and "-CO-" are mentioned, it does not include the case where they are components of "-COO-". Furthermore, "-COO-" is a description of an ester in which the groups at both ends of the ester are not fixed, and includes both "-COO-" and "-O-CO-". However, when the groups at both ends of the ester are fixed, they are distinguished and used as "-COO-" and "-O-CO-". The so-called "alkyl" in this specification refers to a monovalent group generated by taking a hydrogen atom from an aliphatic hydrocarbon (alkane) such as methane, ethane, and propane, and is generally represented by C n H 2n+1 - (here, n is a positive integer). The alkyl group can be a straight chain or a branched chain. Examples of the alkyl group having 1 to 4 carbon atoms (C 1 ~ 4 alkyl) include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, tert-butyl, sec-butyl, etc., but the present invention is not limited to these examples. Examples of the alkyl group having 1 to 6 carbon atoms (C 1 ~ 6 alkyl) include alkyl group having 1 to 4 carbon atoms, tert-butyl, sec-butyl, n-pentyl, isopentyl, n-hexyl, iso-hexyl, cyclohexyl, etc., but the present invention is not limited to these examples. Examples of the alkyl group having 1 to 10 carbon atoms (C 1 ~ 10 alkyl) include alkyl group having 1 to 6 carbon atoms, n-octyl, n-nonyl, n-decyl, etc., but the present invention is not limited to these examples. The term "alkenyl" as used in this specification refers to a monovalent group generated by abstracting a hydrogen atom from an aliphatic hydrocarbon (olefin) containing at least one double bond, such as ethylene, propylene, and butene, and is generally represented by C m H 2m- 1 (here, m is an integer greater than or equal to 2). The alkenyl group may be a straight chain or a branched chain. Examples of alkenyl groups having 2 to 6 carbon atoms include vinyl, 1-propenyl, 2-propenyl, butenyl, pentenyl, hexenyl, etc., but the present invention is not limited to these examples. Examples of alkenyl groups having 2 to 10 carbon atoms include alkenyl groups having 2 to 6 carbon atoms, heptenyl, octenyl, nonenyl, decenyl, etc., but the present invention is not limited to these examples. The term "alkynyl" as used in this specification refers to a monovalent group generated by abstracting a hydrogen atom from an aliphatic hydrocarbon (alkynyl) containing at least one triple bond, such as acetylene, propyne, butyne, and is generally represented by C m H 2m-3 (where m is an integer greater than 2). The alkynyl group may be a straight chain or a branched chain. Examples of alkynyl groups having 2 to 6 carbon atoms include ethynyl, 1-propynyl, 2-propynyl, butynyl, pentynyl, hexynyl, etc., but the present invention is not limited to these examples. Examples of alkynyl groups having 2 to 10 carbon atoms include alkynyl groups having 2 to 6 carbon atoms, heptynyl, octynyl, nonynyl, decynyl, etc., but the present invention is not limited to these examples. The "alkylene group" mentioned in this specification refers to a divalent group generated by taking two hydrogen atoms from an aliphatic hydrocarbon (alkane) such as methane, ethane, and propane, and is generally represented by -(C m H 2m )- (here, m is a positive integer). The alkylene group may be a straight chain or a branched chain. Examples of the alkylene group having 1 to 10 carbon atoms include: methylene, ethylene, n-propylene, isopropylene, n-butylene, isobutylene, t-butylene, n-pentylene, n-hexylene, isohexylene, etc., but the present invention is not limited to these examples. Preferably, the alkylene group has 1 to 6 carbon atoms, more preferably, the alkylene group has 1 to 4 carbon atoms, more preferably, the methylene group and the ethylene group, and even more preferably, the ethylene group. The term "alkenyl" as used in this specification refers to a divalent radical generated by abstracting two hydrogen atoms from an aliphatic hydrocarbon (olefin) containing at least one double bond, such as ethenyl, propenyl, and butenyl, and is generally represented by -(C m H 2m-2 )- (where m is an integer greater than 2). The alkenyl group may be a straight chain or a branched chain. Examples of alkenyl groups having 2 to 10 carbon atoms include ethenyl, n-propenyl, isopropenyl, n-butenyl, isobutenyl, n-pentenyl, n-hexenyl, and isohexenyl, but the present invention is not limited to these examples. Preferred are alkenylene groups having 2 to 6 carbon atoms, more preferred are alkenylene groups having 2 to 4 carbon atoms, further preferred are ethenylene groups and n-propenylene groups, and further preferred are ethenylene groups. The term "alkoxy" as used herein refers to a monovalent group generated by abstracting a hydrogen atom of a hydroxyl group of an alcohol, and is generally represented by C n H 2n+1 O- (where n is an integer greater than 1). Examples of the alkoxy group having 1 to 6 carbon atoms include methoxy, ethoxy, n-propoxy, isopropoxy, n-butoxy, isobutoxy, tert-butoxy, sec-butoxy, n-pentoxy, isopentoxy, n-hexoxy, isohexoxy, etc., but the present invention is not limited to these examples. The "halogenoalkyl" mentioned in the present specification refers to an alkyl group in which one or more hydrogen atoms on the above alkyl group are replaced by halogen atoms. Moreover, the "perhalogenoalkyl" refers to an alkyl group in which all hydrogen atoms on the above alkyl group are replaced by halogen atoms. Examples of the halogenoalkyl group having 1 to 6 carbon atoms include trifluoromethyl, trifluoroethyl, perfluoroethyl, trifluoro-n-propyl, perfluoro-n-propyl, trifluoroisopropyl, perfluoroisopropyl, trifluoro-n-butyl, perfluoro-n-butyl, trifluoroisobutyl, perfluoroisobutyl, trifluoro-t-butyl, perfluoro-t-butyl, trifluoro-n-pentyl, perfluoro-n-pentyl, trifluoro-n-hexyl, and perfluoro-n-hexyl, but the present invention is not limited to these examples. The term "cycloalkyl" as used herein refers to a monocyclic or polycyclic saturated alkyl group, and also includes a cross-linked structure. For example, the term "C 3-12 cycloalkyl" refers to a cyclic alkyl group having 3 to 12 carbon atoms. As specific examples, in the case of "C 6-12 cycloalkyl", the following can be mentioned: cyclohexyl, cycloheptyl, cyclooctyl, adamantyl, isothioyl, etc. In the case of "C 3-12 cycloalkyl", the following can be mentioned: cyclopropyl, cyclobutyl, cyclopentyl, C 6-12 cycloalkyl, etc. It is preferred to list "C 6-12 cycloalkyl". The "cycloalkenyl" mentioned in this specification refers to a monocyclic or polycyclic unsaturated hydrocarbon group containing a double bond, and also includes a structure formed by cross-linking. Examples of the above-mentioned "cycloalkyl" include those in which one or more carbon bonds are double bonds. For example, the so-called "C 3-12 cycloalkenyl" refers to a cyclic alkenyl group having 3 to 12 carbon atoms. As a specific example, in the case of "C 6-12 cycloalkenyl", the following examples can be cited: 1-cyclohexenyl, 2-cyclohexenyl, 3-cyclohexenyl, cycloheptenyl, cyclooctenyl, cyclononenyl, etc. In the case of "C 3-12 cycloalkyl", examples include: cyclopropenyl, cyclobutenyl, cyclopentenyl, C 6-12 cycloalkenyl, etc. Preferably, "C 6-12 cycloalkenyl" is listed. "Hydrocarbon" as used in this specification refers to a monovalent group generated by taking a hydrogen atom from a compound consisting only of carbon and hydrogen. In addition, hydrogen includes the above-mentioned "alkyl", "alkenyl", "alkylene", "alkenylene", "cycloalkyl", and "cycloalkenyl", as well as the following "aromatic group" and "alicyclic group". Hydrocarbon groups may be saturated or unsaturated. Alkyl groups are classified into chain alkyl groups and cyclic alkyl groups according to the carbon bonding method, and cyclic alkyl groups are further classified into alicyclic alkyl groups and aromatic alkyl groups. Examples of saturated or unsaturated alkyl groups include: methyl, ethyl, n-propyl, isopropyl, butyl, pentyl, hexyl, cyclohexyl, dicyclopentadienyl, decahydronaphthyl, adamantyl, butenyl, hexenyl, cyclohexenyl, decyl, and various linear, branched, monocyclic, and condensed cyclic groups within the range of the carbon atom number of the side chain, but are not limited to these. When these groups are not located at the terminal, they may be divalent or higher depending on the bonding relationship with other groups. The "aromatic group" in the present specification refers to a group generated by the detachment of a hydrogen atom bonded to the ring of an aromatic hydrocarbon. For example, phenyl (C 6 H 5 -) is derived from benzene, tolyl (CH 3 C 6 H 4 -) is derived from toluene, xylyl ((CH 3 ) 2 C 6 H 3 -) is derived from xylene, and naphthyl (C 10 H 8 -) is derived from naphthalene. In addition, the "heteroaromatic group" in the present specification refers to a monocyclic or polycyclic aromatic group containing a heteroatom, which contains one or more (for example, 1 to 4) heteroatoms of the same or different types selected from nitrogen atoms, sulfur atoms and oxygen atoms. In addition, the above-mentioned "aromatic group" includes "heteroaromatic group". Examples of aromatic groups include carbocyclic aromatic groups (monocyclic groups and condensed ring groups) such as phenyl, biphenyl, naphthyl, etc., and heteroaromatic groups (monocyclic groups and condensed ring groups) such as pyridyl, pyrimidyl, quinolyl, trioxane, etc. Each aromatic group, when not at the terminal, may be a divalent or higher group depending on the bonding relationship with other groups. Furthermore, in this specification, a group having an aromatic ring portion and a saturated or unsaturated hydrocarbon chain portion that together form a ring (for example, tetrahydronaphthyl or dihydronaphthyl) is understood to be a bond between an aromatic group and a saturated or unsaturated hydrocarbon group. The "alicyclic (group)" mentioned in this specification refers to a part (or group) generated by the detachment of one hydrogen atom bonded to a non-aromatic ring composed only of carbon and hydrogen. In addition, the alicyclic group includes the above-mentioned "cycloalkyl" and "cycloalkenyl". The alicyclic group may be saturated or unsaturated. Examples of saturated or unsaturated alicyclic groups include: cyclohexyl, dicyclopentadienyl, decahydronaphthyl, adamantyl, cyclohexenyl, and various monocyclic and condensed cyclic groups within the limit of the number of carbon atoms in the side chain, but are not limited to them. When each of these bases is not located at the terminal, it can be a divalent or higher base according to the bonding relationship with other bases. Usually, the term "(being/being) substituted" refers to the substitution of one or more hydrogen radicals in the structure provided by the free radical of a specific substituent. In this specification, the number of substituents in the base defined by "(being/being) substituted" is not particularly limited as long as it can be substituted, and it can be 1 or plural. In addition, except for the cases where special instructions are given, the description of each base is also suitable for the case where the base is a part of other bases or a substituent. In addition, in this specification, for the substituent that does not specifically indicate the term "(being/being) substituted", it means an "unsubstituted" substituent. Furthermore, in this specification, it can be understood that the sentence "substituted or unsubstituted" can be used interchangeably with the sentence "can be substituted". Examples of substituents on the groups described in the present specification including "substituted alkyl", "substituted alkyl", "substituted alkenyl", "substituted alkynyl", "substituted cycloalkyl", "substituted cycloalkenyl", "substituted alkyl", "substituted aromatic", "substituted heteroaromatic", "substituted alkylene", "substituted alkenylene", "substituted or unsubstituted secondary or tertiary OH-containing group" and "substituted adamantyl" include: halogen, hydroxyl , C 1-10 alkyl, C 1-10 alkoxy , C 2-10 alkenyl , C 6-12 cycloalkyl , C 6-12 cycloalkenyl , C 1-10 halogenalkyl , C 2-10 halogenalkenyl , C 6-18 alkyl , C 6-18 C 1-18 aromatic group , C 6-18 heteroaromatic group, C 1-10 alkyl group substituted by C 6-12 aromatic group , C 1-10 alkyl group substituted by C 6-12 alkyl group, C 2-10 alkenyl group substituted by C 6-12 aromatic group, C 2-10 alkenyl group substituted by C 6-12 alkyl group , -CN , oxo group ( = O), -O(CH 2 ) 2 O- , -OC(CH 3 ) 2 O-, -OCH 2 O- , -O- , ester group (-COO- or -O-CO-), ester group substituted by C 6-12 alkyl group, ester group substituted by C 6-12 aromatic group, C 6-18 alkyl group substituted by ester group, C 1-12 aromatic group substituted by C 6-12 alkyl group However , the present invention is not limited to these examples . Preferred examples of the substituent include a hydroxyl group, a C 6 to 18 alkyl group, a C 1 to 10 alkyl group, a C 1 to 10 alkyl group substituted with a C 6 to 12 aromatic group, a C 1 to 10 alkyl group substituted with a C 6 to 12 alkyl group, a C 6 to 18 alkyl group substituted with an ester group, a C 1 to 10 alkyl group substituted with an ester group, an ester group (-COO- or -O-CO-), an ester group substituted with a C 6 to 12 alkyl group, an ester group substituted with a C 6 to 12 aromatic group, a C 2 to 10 alkenyl group, a C 2 to 10 alkenyl group substituted with a C 6 to 12 aromatic group, a C 2 to 12 alkyl group, a C 1 to 18 alkyl group substituted with an ester group, a C 1 to 10 alkyl group substituted with an ester group, an ester group (-COO- or -O-CO-), an ester group substituted with a C 6 to 12 alkyl group, an ester group substituted with a C 6 to 12 aromatic group, a C 2 to 10 alkenyl group, a C 2 to 12 aromatic group, a C 2 to 12 alkyl group, a C 1 to 10 alkoxy, C 6-12 cycloalkyl, C 6-12 cycloalkenyl, as more specific examples, there can be exemplified benzyloxy, phenyl, cyclohexyl, cyclohexenyl, adamantyl, hydroxyl-substituted adamantyl. The "α-substituted (meth) acrylic monomer" as used herein refers to an acrylic monomer in which the carbon of the double bond adjacent to (α-position) the carbon forming the ester group -COO- is substituted, as shown in CH2 =C( R1a )-COO- R1 . Similarly, the so - called "vinyl ester monomer substituted at the α-position" refers to an acrylic monomer in which the carbon of the double bond adjacent to (α-position) the oxygen of the ester group -O-CO- is substituted as shown in CH2 =C( R1a )-O-CO- R3 , the so-called "vinyl ether monomer substituted at the α-position" refers to an acrylic monomer in which the carbon of the double bond adjacent to (α-position) the oxygen of the ether group -O- is substituted as shown in CH2=C( R1a ) -OR4 , and the so-called "vinyl monomer substituted at the α-position" refers to an acrylic monomer in which the internal carbon other than the terminal carbon of the vinyl group is substituted as shown in CH2 =C( R1a ) -R5 . R 1 , R 3 , R 4 , R 5 and R 1a are defined in the following preferred embodiment (2-1) of the curable resin composition. In the present specification, "a group containing a secondary or tertiary OH" means a group containing one or more secondary or tertiary hydroxyl groups (OH). Therefore, "a group containing a secondary or tertiary OH" also includes the secondary or tertiary hydroxyl group itself. "Substituted or unsubstituted" in "a group containing a secondary or tertiary OH which is substituted or unsubstituted" means that a part of the groups other than the hydroxyl group in the group containing one or more secondary or tertiary hydroxyl groups (OH) is substituted or unsubstituted, and does not mean that the hydroxyl group is substituted or unsubstituted. In this specification, unless otherwise specified, "solvent" refers to a compound or a salt thereof that further includes a fixed or non-fixed ratio of a solvent bonded by non-shared intermolecular forces. When the solvent is water, the solvent is a hydrate. In this specification, "or" is used when "at least one or more" of the items listed in the article can be adopted. The same applies to "or". In this specification, when it is clearly stated as "within the range of 2 values", the range also includes the 2 values themselves. Therefore, "X~Y" expressing a range means "above X and below Y". In addition, unless otherwise specified, "weight" and "mass", "weight %" or "wt%" and "mass %" are treated as synonyms, respectively. Unless otherwise specified, the expression "approximately" has a tolerance of 10% and, in the case of a measured value, refers to a numerical value within an arbitrary range obtained by rounding off the digits below the 1st digit of the significant digit or the displayed digit. (2) Description of preferred embodiments The preferred embodiments of the present invention are described below. It should be understood that the embodiments provided below are provided for a better understanding of the present invention, and the scope of the present invention should not be limited to the following descriptions. Therefore, it can be understood that the industry can refer to the descriptions in this manual and make appropriate changes within the scope of the present invention. In addition, it should be understood that the following embodiments of the present invention can be used alone or in combination. (2-1) Curable resin composition In one embodiment, the present invention provides a curable resin composition, which comprises a chain polymer having a side chain having an alcoholic secondary or tertiary hydroxyl group, and a crosslinking agent, wherein (a) the side chain comprises 3 to 30 carbon atoms, and comprises at least one saturated or unsaturated hydrocarbon group, or further comprises at least one aromatic group, and may comprise a bond connecting carbon atoms selected from the group consisting of -COO-, -O-, and -CO-; (b) the crosslinking agent is selected from the group consisting of trioxane compounds and/or condensates thereof, glycoluril compounds and/or condensates thereof, and imidazolidinone compounds and/or condensates thereof. The curable resin composition of the present invention is cured by heat treatment, so it can also be said to be a thermosetting resin composition. The chain polymer as a constituent element of the curable resin composition of the present invention has a side chain having an alcoholic secondary or tertiary hydroxyl group. In the present invention, the number of carbon atoms contained in the side chain having an alcoholic secondary or tertiary hydroxyl group of the chain polymer is preferably 3 to 30. The number of hydroxyl groups in the side chain having an alcoholic secondary or tertiary hydroxyl group can be 1 or more than 2. The above-mentioned side chain is composed of a saturated or unsaturated hydrocarbon group having at least 1 carbon atom, or further contains at least 1 aromatic group. The side chain may also contain one or more bonds selected from the group consisting of -COO-, -O-, and -CO-. The saturated or unsaturated alkyl group constituting the side chain may, for example, occupy all the carbon atoms of the side chain alone, or may be formed by a plurality of saturated or unsaturated carbon groups mutually linked via bonds selected from the group consisting of -COO-, -O-, and -CO-. When the side chain contains an aromatic group in addition to the saturated or unsaturated alkyl group, the saturated or unsaturated alkyl group and the aromatic group may be directly bonded, or may be linked via a bond selected from the group consisting of -COO-, -O-, and -CO-. In the present invention, in order to maintain the easy peelability of the hardened resin film obtained by coating the hardening resin composition of the present invention on a glass substrate and hardening it to form a film, the alcoholic secondary and tertiary hydroxyl groups in the side chain are the essential determining factors. Furthermore, the alcoholic secondary and tertiary hydroxyl groups in the side chain are preferably bonded to the alicyclic part of the side chain, and the alicyclic part of the side chain is also the essential determining factor for maintaining the easy peelability of the hardened resin film. The chain polymer having such side chains is prepared into a resin composition with a suitable crosslinking agent, especially any one of a trioxane compound and/or its condensate, a glycoluril compound and/or its condensate, or an imidazolidinone compound and/or its condensate, and when cured in the form of a film, a heat-resistant and easily peelable film can be provided. In the present invention, the chain polymer having the side chain having an alcoholic secondary or tertiary hydroxyl group is preferably composed of at least one of unsubstituted or α-substituted (meth) acrylic monomers, unsubstituted or α-substituted vinyl ester monomers, unsubstituted or α-substituted vinyl ether monomers, and unsubstituted or α-substituted vinyl monomers other than the above as monomer units. In the present invention, the chain polymer having the side chain having an alcoholic secondary or tertiary hydroxyl group is preferably composed of at least one of a (meth)acrylic monomer, a vinyl ester monomer, a vinyl ether monomer, and a vinyl monomer other than the above as a monomer unit. Preferably, the monomer unit is a (meth)acrylic monomer, and more preferably, the monomer unit is a methacrylic monomer. Preferably, the chain polymer in the present invention comprises a monomer selected from CH2 =C( R1a )-COO- R1 , CH2 =C( R1a )-O-CO- R3 , CH2 =C( R1a ) -OR4 , and CH2 =C( R1a ) -R5 (herein, R1 , R3 , R4 , and R R 1a is a monomer unit selected from the group consisting of compounds represented by (i) wherein R 1a is a monomer unit selected from the group consisting of hydrogen, substituted or unsubstituted alkyl, and substituted or unsubstituted alkenyl. More preferably, the chain polymer of the present invention comprises a group selected from CH2 =CH-COO- R1 , CH2 =C( CH3 )-COO- R2 , CH2 =CH-O-CO- R3 , CH2 =CH- OR4 , and CH2 =CH- R5 (herein, R1 , R2 , R3 , R4 , and R 5 is composed of monomer units from the group consisting of compounds represented by (a) which independently have 3 to 30 carbon atoms, preferably 3 to 25, and more preferably 3 to 20 carbon atoms, including the carbon atoms constituting the ester bonds when bonded to each vinyl group via an ester bond, have an alcoholic secondary or tertiary hydroxyl group, contain at least one saturated or unsaturated hydrocarbon group, or further contain at least one aromatic group, and may have a bond connecting carbon atoms selected from the group consisting of -COO-, -O-, and -CO-. In the above, examples of saturated or unsaturated alkyl groups include: methyl, ethyl, n-propyl, isopropyl, butyl, pentyl, hexyl, cyclohexyl, dicyclopentadienyl, decahydronaphthyl, adamantyl, butenyl, hexenyl, cyclohexenyl, decyl, and various linear, branched, monocyclic, and condensed cyclic groups within the range of the carbon number of the side chain, but are not limited thereto. When each of these groups is not at the terminal, it may be a divalent or higher group depending on the bonding relationship with other groups. Examples of aromatic groups include carbocyclic aromatic groups (monocyclic groups and condensed ring groups) such as phenyl, biphenyl, naphthyl, and the like, and heteroaromatic groups (monocyclic groups and condensed ring groups) such as pyridyl, pyrimidyl, quinolyl, trioxane, and the like. Each aromatic group, when not at a terminal, may be a divalent or higher group depending on the bond relationship with other groups. In addition, in the present specification, a group having an aromatic ring portion and a saturated or unsaturated hydrocarbon chain portion that together form a ring (e.g., tetrahydronaphthyl or dihydronaphthyl) is understood to be a bond between an aromatic group and a saturated or unsaturated hydrocarbon group. In the present invention, the alcoholic secondary or tertiary hydroxyl group is a hydroxyl group formed by replacing a hydrogen atom on any secondary or tertiary carbon atom of a saturated or unsaturated alkyl group constituting the above-mentioned side chain. The alcoholic hydroxyl group of the side chain of the chain polymer is preferably a secondary hydroxyl group or a tertiary hydroxyl group, and is further preferably bonded to a part or all of the alicyclic group constituting the above-mentioned side chain. More preferably, the chain polymer in the present invention comprises formula A1: [Chemical 12] (herein, R 1a is selected from the group consisting of hydrogen, substituted or unsubstituted alkyl, and substituted or unsubstituted alkenyl, L 1 is selected from the group consisting of a single bond, substituted or unsubstituted alkylene, and substituted or unsubstituted alkenylene, R 2a , R 3a , and R 4a are independently selected from the group consisting of hydrogen and substituted or unsubstituted alkyl, but at least one of R 2a , R 3a , and R 4a is a substituted or unsubstituted secondary or tertiary OH-containing group) The monomer unit represented by Further preferably, the chain polymer of the present invention comprises the following monomer units, wherein in formula A1, R 1a is selected from the group consisting of hydrogen and substituted or unsubstituted alkyl, L 1 is selected from the group consisting of a single bond and substituted or unsubstituted alkylene, R 2a , R 3a , and R 4a are independently selected from the group consisting of hydrogen and substituted or unsubstituted alkyl, but at least one of R 2a , R 3a , and R 4a is selected from the group consisting of secondary or tertiary hydroxyl and substituted or unsubstituted alkyl containing secondary or tertiary OH. More preferably, the chain polymer of the present invention comprises the following monomer units, wherein in formula A1, R 1a is selected from the group consisting of hydrogen and unsubstituted alkyl, L 1 is selected from the group consisting of a single bond and unsubstituted alkylene, R 2a , R 3a , and R 4a are independently selected from the group consisting of hydrogen and substituted or unsubstituted alkyl, but at least one of R 2a , R 3a , and R 4a is selected from the group consisting of secondary or tertiary hydroxyl and substituted or unsubstituted alkyl containing secondary or tertiary OH, and the other two are independently selected from the group consisting of hydrogen and substituted or unsubstituted alkyl. More preferably, the chain polymer of the present invention comprises formula A2: (Herein, R 1a is selected from the group consisting of hydrogen, substituted or unsubstituted alkyl, and substituted or unsubstituted alkenyl, L 1 is selected from the group consisting of a single bond, substituted or unsubstituted alkylene, and substituted or unsubstituted alkenylene, R 5a to R 14a are independently selected from the group consisting of hydrogen, hydroxyl, and [Chem. 14] or together form a ring, except that at least one of R 5a to R 14a or the substituents of the ring is a hydroxyl group, and R 15a is selected from the group consisting of substituted or unsubstituted alkyl, substituted or unsubstituted alkenyl, substituted or unsubstituted cycloalkyl, substituted or unsubstituted cycloalkenyl, substituted or unsubstituted aromatic, and substituted or unsubstituted heteroaromatic groups). Preferably, the chain polymer of the present invention comprises the following monomer units, wherein in formula A2, R 1a is selected from the group consisting of hydrogen and substituted or unsubstituted alkyl, L 1 is selected from the group consisting of a single bond and substituted or unsubstituted alkylene, R 5a to R 14a are independently selected from the group consisting of hydrogen, hydroxyl, and [Chemical 15] or together form a ring, except that at least one of R 5a ~R 14a or the substituent of the ring is a hydroxyl group, and R 15a is selected from the group consisting of substituted or unsubstituted alkyl, substituted or unsubstituted alkenyl, substituted or unsubstituted cycloalkyl, substituted or unsubstituted cycloalkenyl, and substituted or unsubstituted aromatic groups. Further preferably, the chain polymer of the present invention comprises the following monomer units, wherein in formula A2, R 1a is selected from the group consisting of hydrogen and unsubstituted alkyl, L 1 is selected from the group consisting of a single bond and unsubstituted alkylene, and among R 5a ~R 14a , R 7a is a hydroxyl group, and R 9a is [Chemical 16] , and the rest is hydrogen, or R 5a to R 14a together form a ring substituted with at least one hydroxyl group, and R 15a is selected from the group consisting of substituted or unsubstituted alkyl, substituted or unsubstituted alkenyl, substituted or unsubstituted cycloalkyl, substituted or unsubstituted cycloalkenyl, and substituted or unsubstituted phenyl. Furthermore, it is further preferred that the ring substituted with at least one hydroxyl group is an adamantane substituted with at least one hydroxyl group. It is further preferred that the chain polymer of the present invention comprises formula A3: [Chemical 17] (herein, R 1a is selected from the group consisting of hydrogen, substituted or unsubstituted alkyl, and substituted or unsubstituted alkenyl, L 2 is selected from the group consisting of substituted or unsubstituted alkylene, and substituted or unsubstituted alkenylene, R 16a is selected from the group consisting of substituted or unsubstituted alkyl, substituted or unsubstituted alkenyl, and substituted or unsubstituted alkynyl, and R 17a is selected from the group consisting of hydrogen, substituted or unsubstituted alkyl, substituted or unsubstituted alkenyl, and substituted or unsubstituted alkynyl) a monomer unit represented by. Preferably, the chain polymer of the present invention comprises the following monomer units, wherein in formula A3, R 1a is selected from the group consisting of hydrogen and substituted or unsubstituted alkyl, L 2 is selected from substituted or unsubstituted alkylene, R 16a is selected from the group consisting of substituted or unsubstituted alkyl, and R 17a is selected from the group consisting of hydrogen and substituted or unsubstituted alkyl. More preferably, the chain polymer of the present invention comprises formula A4: [Chemical 18] (Here, R 1a is selected from the group consisting of hydrogen, substituted or unsubstituted alkyl, and substituted or unsubstituted alkenyl, L 1 is selected from the group consisting of single bond, substituted or unsubstituted alkylene, and substituted or unsubstituted alkenylene, R 18a is an adamantyl group substituted with at least one hydroxyl group). Preferably, the chain polymer of the present invention comprises the following monomer units, wherein in formula A4, R 1a is selected from the group consisting of hydrogen, and substituted or unsubstituted alkylene, L 1 is selected from the group consisting of single bond, and substituted or unsubstituted alkylene, R 18a is an adamantyl group substituted with at least one hydroxyl group. The chain polymer comprises formula A5: [Chemical 19] (herein, R 1a is selected from the group consisting of hydrogen, substituted or unsubstituted alkyl, and substituted or unsubstituted alkenyl, L 1 is selected from the group consisting of a single bond, substituted or unsubstituted alkylene, and substituted or unsubstituted alkenylene, and R 19a is selected from the group consisting of substituted or unsubstituted alkyl, substituted or unsubstituted alkenyl, substituted or unsubstituted cycloalkyl, and substituted or unsubstituted cycloalkenyl) a monomer unit represented by. It is further preferred that the chain polymer of the present invention comprises the following monomer units, wherein in formula A5, R 1a is selected from the group consisting of hydrogen and substituted or unsubstituted alkyl, L 1 is selected from the group consisting of a single bond and substituted or unsubstituted alkylene, and R 19a is selected from the group consisting of substituted or unsubstituted alkyl, substituted or unsubstituted alkenyl, substituted or unsubstituted cycloalkyl, and substituted or unsubstituted cycloalkenyl. It is further preferred that in formula A5, R 19a is a substituted or unsubstituted adamantyl. It is preferred that in the monomer unit, R 1a is hydrogen or methyl, and it is further preferred that in the monomer unit, R 1a is methyl. Preferred side chains of the chain polymer of the present invention having alcoholic secondary or tertiary hydroxyl groups include those shown below. However, any side chain having such a hydroxyl group is sufficient. Therefore, the side chains listed are merely illustrative and are not limited to the following. (1a) AO-CO-type (A represents the remaining part of the side chain, the same below) side chain: 2-hydroxyethoxycarbonyl, 2-hydroxypropoxycarbonyl, 4-(hydroxymethyl)cyclohexylmethoxycarbonyl, 2-hydroxy-3-(cyclohexylcarbonyloxy)propoxycarbonyl, 3-benzyloxy-2-hydroxypropoxycarbonyl, 4-benzyloxy-3-hydroxycyclohexylmethoxycarbonyl, 3-hydroxy-1-adamantyloxycarbonyl, 2-hydroxycyclohexyloxycarbonyl, 4-undecanoyloxy-3-hydroxycyclohexylmethoxycarbonyl, 4-butanoyloxy-3-hydroxycyclohexylmethoxycarbonyl, etc. (2a) A-CO-O-type side chain: 2-hydroxypropylcarbonyloxy, 2-hydroxy-3-(cyclohexylcarbonyloxy)propylcarbonyloxy, 3-benzyloxy-2-hydroxypropylcarbonyloxy, 4-benzyloxy-3-hydroxycyclohexylmethylcarbonyloxy, 3-hydroxy-1-adamantylcarbonyloxy, 2-hydroxycyclohexyloxycarbonyloxy, 4-undecanoyloxy-3-hydroxycyclohexylmethylcarbonyloxy, 4-butanoyloxy-3-hydroxycyclohexylmethylcarbonyloxy, and the like. (3a) AO-type side chain: 2-hydroxypropoxy, 2-hydroxy-3-(cyclohexylcarbonyloxy)propoxy, 3-benzyloxy-2-hydroxypropoxy, 4-benzyloxy-3-hydroxycyclohexylmethoxy, 3-hydroxy-1-adamantyloxy, 2-hydroxycyclohexyloxy, 4-undecanyloxy-3-hydroxycyclohexylmethoxy, 4-butanoyloxy-3-hydroxycyclohexylmethoxy, etc. (4a) Others: 2-hydroxypropyl, 2-hydroxy-3-(cyclohexylcarbonyloxy)propyl, 3-benzyloxy-2-hydroxypropyl, 4-benzyloxy-3-hydroxycyclohexylmethyl, 3-hydroxy-1-adamantyl, 2-hydroxycyclohexyl, 4-undecanoyloxy-3-hydroxycyclohexylmethyl, 4-butanoyloxy-3-hydroxycyclohexylmethyl, etc. Preferred examples of monomers for imparting such side chains to the chain polymer include, but are not limited to, the following. (1b) (meth)acrylates such as 2-hydroxypropyl (meth)acrylate, 2-hydroxy-3-(cyclohexylcarbonyloxy)propyl (meth)acrylate, 3-benzyloxy-2-hydroxypropyl (meth)acrylate, 4-benzyloxy-3-hydroxycyclohexylmethyl (meth)acrylate, 1,3-adamantanediol mono(meth)acrylate, 2-hydroxycyclohexyl (meth)acrylate, 4-undecanoyloxy-3-hydroxycyclohexylmethyl (meth)acrylate, and 4-butyryloxy-3-hydroxycyclohexylmethyl (meth)acrylate. (2b) Vinyl esters such as vinyl 2-hydroxybutyrate, vinyl 2-hydroxy-3-(cyclohexylcarbonyloxy)butyrate, vinyl 3-benzoyloxy-2-hydroxybutyrate, vinyl 4-benzoyloxy-3-hydroxycyclohexyl acetate, vinyl 3-hydroxy-1-adamantyl carboxylate, vinyl 2-hydroxycyclohexylcarboxylate, vinyl 4-undecanoyloxy-3-hydroxycyclohexyl acetate, and vinyl 4-butyryloxy-3-hydroxycyclohexyl acetate. (3b) Vinyl ethers such as 2-hydroxypropyl vinyl ether, 2-hydroxy-3-(cyclohexylcarbonyloxy)propyl vinyl ether, 3-benzyloxy-2-hydroxypropyl vinyl ether, 4-benzyloxy-3-hydroxycyclohexyl methyl vinyl ether, 3-hydroxy-1-adamantyl vinyl ether, 2-hydroxycyclohexyl vinyl ether, 4-undecanoyloxy-3-hydroxycyclohexyl methyl ether and 4-butanoyloxy-3-hydroxycyclohexyl methyl ether. (4b) Vinyl monomers such as 1-penten-4-ol, 4-hydroxy-5-(cyclohexylcarbonyloxy)-1-pentene, 5-benzoyloxy-4-hydroxy-1-pentene, 3-(4-benzoyloxy-3-hydroxycyclohexyl)-1-propene, (3-hydroxy-1-adamantyl)ethylene, (2-hydroxycyclohexyl)ethylene, 3-(4-undecanoyloxy-3-hydroxycyclohexyl)-1-propene, and 3-(4-butanoyloxy-3-hydroxycyclohexyl)-1-propene. (5b) Maleic anhydride and maleimide having any of the above (1a) to (4a) as substituents. The chain polymer of the present invention may be a monomer containing additional monomer units in addition to the monomers having the above-mentioned alcoholic secondary or tertiary hydroxyl groups, and the additional monomer units are at least one of unsubstituted or α-substituted (meth) acrylic monomers, unsubstituted or α-substituted vinyl ester monomers, unsubstituted or α-substituted vinyl ether monomers, and unsubstituted or α-substituted vinyl monomers other than these monomers, which may or may not have a hydroxyl group and have 1 to 15 carbon atoms in the side chain. Such additional monomer units are preferably selected from CH2 =C( R1a )-COO- R6 , CH2 =C( R1a )-O-CO- R8 (herein, R6 and R8 independently have 1 to 15 carbon atoms, may or may not have a hydroxyl group, contain at least one saturated or unsaturated hydrocarbon group, or further contain at least one aromatic group, and may have a bond connecting carbon atoms selected from the group consisting of -COO-, -O-, and -CO-, the hydrocarbon group or aromatic group may have an amine group, and R1a is selected from the group consisting of hydrogen, a substituted or unsubstituted alkyl group, and a substituted or unsubstituted alkenyl group), CH2 =C( R1a ) -OR9 , CH2 =C( R1a )-OR9 )-R 10 (herein, R 9 and R 10 independently have 3 to 15 carbon atoms, may or may not have a hydroxyl group, include at least one saturated or unsaturated alkyl group, or further include at least one aromatic group, and may have a bond connecting carbon atoms selected from the group consisting of -COO-, -O-, and -CO-, the alkyl group or aromatic group may have an amine group, and R 1a is selected from the group consisting of hydrogen, a substituted or unsubstituted alkyl group, and a substituted or unsubstituted alkenyl group), C 4 (R 1a )O 3 -R 11 , and C 4 (R 1a )HNO 2 -R 12 (herein, C 4 (R 1a )O 3 - represents a maleic anhydride group, C 4 (R 1a )HNO 2 - represents a cis-butenediamide group, R 11 and R 12 are independently a hydrogen atom or have 1 to 15 carbon atoms, may or may not have an alcoholic secondary or tertiary hydroxyl group, contain at least one saturated or unsaturated alkyl group, or further contain at least one aromatic group, and may have a bond connecting carbon atoms selected from the group consisting of -COO-, -O-, and -CO-, the alkyl group or aromatic group may have an amine group, and R 1a is selected from the group consisting of hydrogen, substituted or unsubstituted alkyl, and substituted or unsubstituted alkenyl). The chain polymer of the present invention may be a monomer containing additional monomer units in addition to the above-mentioned monomers having alcoholic secondary or tertiary hydroxyl groups, and the additional monomer units are at least one of (meth) acrylic monomers, vinyl ester monomers, vinyl ether monomers, and vinyl monomers other than these monomers, which do not have a hydroxyl group and have 1 to 15 carbon atoms in the side chain. Such additional monomer units are preferably selected from CH2 =CH-COO- R6 , CH2 =C( CH3 )-COO- R7 , CH2 =CH-O-CO- R8 (herein, R6 , R7 and R8 independently have 1 to 15 carbon atoms, have no hydroxyl group, contain at least one saturated or unsaturated hydrocarbon group, or further contain at least one aromatic group, and may have a bond connecting carbon atoms selected from the group consisting of -COO-, -O-, and -CO-, and the hydrocarbon group or aromatic group may have an amine group), CH2=CH-OR9, CH2=CH-R10 (herein, R9, and R8 are independently selected from the group consisting of -COO-, -O-, and -CO-, and the hydrocarbon group or aromatic group may have an amine group), CH2 =CH- OR9 , CH2 =CH- R10 (herein, R9 , and R10 are independently selected from the group consisting of -COO-, -O-, and -CO-, and the hydrocarbon group or aromatic group may have an amine group). 10 independently have 3 to 15 carbon atoms, have no hydroxyl group, contain at least one saturated or unsaturated alkyl group, or further contain at least one aromatic group, and may have a bond connecting carbon atoms selected from the group consisting of -COO-, -O-, and -CO-, and the alkyl group or aromatic group may have an amine group), C 4 HO 3 -R 11 , and C 4 H 2 NO 2 -R 12 (herein, C 4 HO 3 - represents a maleic anhydride group, C 4 H 2 NO 2 - represents a maleic anhydride group, R 11 , and R 12 are independently hydrogen atoms or have 1 to 15 carbon atoms, do not have alcoholic secondary or tertiary hydroxyl groups, contain at least one saturated or unsaturated alkyl group, or further contain at least one aromatic group, may have a bond connecting carbon atoms selected from the group consisting of -COO-, -O-, and -CO-, and the alkyl group or aromatic group may have an amine group) The group consisting of compounds represented by. As preferred examples of the above-mentioned monomer unit without a hydroxyl group, the following can be listed, but it is not limited to them. (1) (Meth)acrylate esters such as methyl (meth)acrylate, propyl (meth)acrylate, glycidyl (meth)acrylate, butyl (meth)acrylate, ethoxyethyl (meth)acrylate, pentyl (meth)acrylate, tetrahydrofuranyl (meth)acrylate, cyclohexyl (meth)acrylate, phenyl (meth)acrylate, dicyclopentadienyl (meth)acrylate, octyl (meth)acrylate, benzyl (meth)acrylate, N,N-dimethylaminoethyl (meth)acrylate, N,N-dimethylaminopropyl (meth)acrylate, 3,4-epoxycyclohexylmethyl (meth)acrylate, and glycidyl (meth)acrylate. (2) Vinyl esters such as vinyl acetate, vinyl butyrate, vinyl valerate, vinyl hexanoate, vinyl cyclohexanecarboxylate, vinyl benzoate, vinyl cyclopentadienylcarboxylate, and vinyl nonanoate. (3) Vinyl ethers such as propyl vinyl ether, butyl vinyl ether, ethoxyethyl vinyl ether, glycidyl vinyl ether, pentyl vinyl ether, tetrahydrofuranylmethyl vinyl ether, cyclohexyl vinyl ether, phenyl vinyl ether, cyclopentadienyl vinyl ether, octyl vinyl ether, benzyl vinyl ether, 2-(vinyloxy)ethyldimethylamine, 3-(vinyloxy)propyldimethylamine. (4) Ethylene derivatives such as 1-butene, 4-ethoxy-1-butene, 1-pentene, 1-hexene, vinylcyclohexane, styrene, vinyltoluene, 1-nonene, 3-phenylpropylene. (5) Maleic anhydride derivatives such as maleic anhydride, methyl maleic anhydride, butyl maleic anhydride, hexyl maleic anhydride, cyclohexyl maleic anhydride, phenyl maleic anhydride, octyl maleic anhydride. (6) Citric imide derivatives such as citric imide, methyl citric imide, ethyl citric imide, butyl citric imide, hexyl citric imide, cyclohexyl citric imide, phenyl citric imide, benzyl citric imide, octyl citric imide. The chain polymer in the present invention may be a homopolymer of monomer units or a copolymer comprising two or three or more monomer units, provided that at least one of the monomer units in the copolymer is a monomer unit having a side chain having an alcoholic secondary or tertiary hydroxyl group. Preferably, the copolymer comprises at least one monomer unit having a side chain with an alcoholic secondary or tertiary hydroxyl group, and at least one additional monomer unit without a hydroxyl group. In the chain polymer of the present invention, the ratio of the monomer unit having an alcoholic secondary or tertiary hydroxyl group is preferably 30 to 100 mol%, more preferably 50 to 100 mol, more preferably 60 to 100 mol, further preferably 80 to 100 mol, and particularly preferably 90 to 100 mol%. In the present invention, the chain polymer can be produced by using its raw material monomers using a conventional method, such as using a conventional free radical polymerization catalyst such as 2,2'-azobisisobutyronitrile (AIBN) to carry out polymerization reaction. The molecular weight of the chain polymer is usually preferably in the range of 10,000 to 100,000 (measured by gel permeation chromatography), but is not particularly limited to this range. The crosslinking agent in the curable resin composition of the present invention is preferably a triazole crosslinking agent, a glycoluril crosslinking agent, or an imidazolidinone crosslinking agent. More specifically, the crosslinking agent is preferably selected from the group consisting of triazole compounds and/or condensates thereof, glycoluril compounds and/or condensates thereof, and imidazolidinone compounds and/or condensates thereof. Preferred specific examples of such crosslinking agents include: completely or partially alkoxy (e.g., methoxy, ethoxy) methylated melamine and/or its condensate, completely or partially alkoxy (e.g., methoxy, ethoxy) methylated guanamine and/or its condensate, completely or partially alkoxy (e.g., methoxy, ethoxy) methylated acetoguanamine and/or its condensate, completely or partially alkoxymethylated benzoguanamine and/or its condensate, completely or partially alkoxy (e.g., methoxy, ethoxy) methylated glycoluril and/or its condensate, completely or partially alkoxymethylated imidazolidinone and/or its condensate. Here, "alkoxy" preferably has 1 to 4 carbon atoms. More specifically, preferred compounds as such crosslinking agents include, for example, hexamethoxymethylmelamine, hexaethoxymethylmelamine, tetramethoxymethylhydroxymethylmelamine, tetramethoxymethylmelamine, hexabutoxymethylmelamine, tetramethoxymethylguanamine, tetramethoxymethylacetoguanamine, tetramethoxymethylbenzoguanamine, trimethoxymethylbenzoguanamine, tetraethoxymethylbenzoguanamine, tetrahydroxymethylbenzoguanamine, 1,3,4,6-tetrakis(methoxymethyl)glycoluril, 1,3,4,6-tetrakis(butoxymethyl)glycoluril, 4,5-dihydroxy-1,3-dimethoxymethyl-2-imidazolidinone, and 4,5-dimethoxy-1,3-dimethoxymethyl-2-imidazolidinone, but are not limited thereto. In one embodiment, the crosslinking agent is preferably selected from the group consisting of Formula B1: [Chemical 20] (Herein, R 1b has 1 to 25 carbon atoms and is selected from substituted or unsubstituted alkyl, substituted or unsubstituted alkenyl, substituted or unsubstituted aromatic, substituted or unsubstituted heteroaromatic, and [Chemical 21] R 2b to R 7b independently have 1 to 10 carbon atoms and are selected from the group consisting of substituted or unsubstituted alkyl groups and substituted or unsubstituted alkenyl groups) and/or their condensates. More preferably, the crosslinking agent in the present invention is the following compound and/or its condensate, wherein in formula B1, R 1b is selected from the group consisting of substituted or unsubstituted alkyl groups, substituted or unsubstituted aromatic groups, and [Chemical 22] The group of disubstituted amines represented by R 2b ~R 7b are independently selected from substituted or unsubstituted alkyl groups. In another embodiment, it is preferred that the crosslinking agent is selected from the free formula B2: [Chemical 23] (herein, R 8b ~R 11b have 1 to 10 carbon atoms independently and are selected from the group consisting of substituted or unsubstituted alkyl and substituted or unsubstituted alkenyl) and/or its condensate. More preferably, the crosslinking agent in the present invention is the following compound and/or its condensate, wherein in formula B2, R 8b ~R 11b are independently selected from substituted or unsubstituted alkyl. In another embodiment, the crosslinking agent is preferably selected from formula B3: [Chemical 24] (herein, R 12b and R 13b independently have 1 to 10 carbon atoms and are selected from the group consisting of substituted or unsubstituted alkyl and substituted or unsubstituted alkenyl, R 14b and R 15b independently are hydrogen or have 1 to 10 carbon atoms and are selected from the group consisting of substituted or unsubstituted alkyl and substituted or unsubstituted alkenyl) represented by and/or its condensate. More preferably, the crosslinking agent in the present invention is the following compound and/or its condensate, wherein in formula B3, R 12b and R 13b independently have substituted or unsubstituted alkyl, R 14b and R 15b independently have hydrogen and substituted or unsubstituted alkyl. More preferably, in formula B3, R 14b and R 15b are independently hydrogen. As further preferred specific examples of the crosslinking agent in the curable resin composition of the present invention, there can be cited compounds represented by the following structural formula or compounds named below and/or their condensates: [Chemical 25] Trioxane compounds Glycoluril compounds Trioxane compounds Imidazolidinone compounds Hexamethoxymethylmelamine; Hexabutoxymethylmelamine; 1,3,4,6-Tetra(methoxymethyl)glycoluril; 1,3,4,6-Tetra(butoxymethyl)glycoluril; Tetramethoxymethylbenzoguanamine; 4,5-Dihydroxy-1,3-bis(alkoxymethyl)imidazolidin-2-one. As the condensate, it is preferably a polymer of the compounds listed above, and more preferably a dimer, trimer or higher polymer of the compounds listed above. The crosslinking agent in the hardening resin composition of the present invention can be the compounds listed above and their condensates, that is, it can be a mixture of the compound and the polymer of the compound (that is, a dimer, trimer, or higher polymer). From another perspective, the crosslinking agent may have a weight average degree of polymerization greater than 1 and greater than 3 or more for the compound shown above, preferably greater than 1 and less than 1.8, more preferably 1.3 to 1.8, and further preferably 1.5, but is not limited thereto. Furthermore, when the weight average degree of polymerization of the condensate of the compound is 1, it means that the condensate is the compound itself. The weight average degree of polymerization is any value within the above range, preferably 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, 2, 3, 4 or more, more preferably 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, and further preferably 1.5. The mass ratio of the chain polymer to the crosslinking agent in the curable resin composition of the present invention is preferably 1:0.03 to 1:2, more preferably 1:0.05 to 1:2, 1:0.05 to 1:1, 1:0.03 to 1:1, further preferably 1:0.09 to 1:1, 1:0.1 to 1:0.5, further preferably 1:0.09 to 1:0.3, 1:0.1 to 1:0.3. In the present invention, the curable resin composition further comprises an acid catalyst. The acid catalyst is included as a polymerization catalyst in the reaction between the monomer unit and the crosslinking agent as needed. The acid catalyst can be appropriately selected and used as a polymerization catalyst. The acid catalyst may be a compound selected from Brünster acid and/or Lewis acid, or a salt thereof or a solvent thereof. Examples of the acid catalyst include, but are not limited to, a compound selected from the group consisting of protonic acids such as dinonylnaphthalene disulfonic acid, dinonylnaphthalene (mono)sulfonic acid, dodecylbenzenesulfonic acid, dodecylbenzenesulfonic acid, p-toluenesulfonic acid (PTS), phosphoric acid, sulfuric acid, and acetic acid, and a thermal acid generator such as San-Aid SI-100L, SI-150L, SI-110L, SI-60L, and SI-80L (San-Aid Chemical Industry Co., Ltd.). Or a salt thereof, or a solvent thereof. Preferably, the acid catalyst is a compound selected from the group consisting of p-toluenesulfonic acid (PTS), dodecylbenzenesulfonic acid, and thermal acid generator San-Aid SI-100L (San-Shin Chemical Industry Co., Ltd.), or a salt thereof, or a solvent thereof. More preferably, the acid catalyst is pyridinium-p-toluenesulfonic acid, p-toluenesulfonic acid, or a hydrate thereof. When the curable resin composition of the present invention further comprises an acid catalyst, the amount of the acid catalyst can be appropriately determined according to the mass ratio of the chain polymer to the crosslinking agent in the curable resin composition. Preferably, the mass ratio of the chain polymer to the crosslinking agent to the acid catalyst in the curable resin composition is preferably 1:0.03:0.05 to 1:2:0.1, more preferably 1:0.05:0.05 to 1:2:0.1, and further preferably 1:0.09:0.05 to 1:1:0.08. In the present invention, the curable resin composition can be diluted with a solvent to an appropriate concentration. That is, in the present invention, the curable resin composition further comprises a solvent. As long as the boiling point is too low or too high, which does not cause problems when the curable resin composition is applied to a substrate such as glass and then dried to form a uniform coating, a conventional aprotic solvent can be appropriately selected for use. For example, propylene glycol monomethyl ether is a suitable solvent, but is not limited to this. Dilution with a solvent is used to facilitate operations such as polymerization of monomers or application of a curable resin composition to which a crosslinking agent or catalyst is added, so there is no particular upper or lower limit to the degree of dilution. (2-2) Cured resin film In one embodiment, the present invention provides a cured resin film formed by curing the curable resin composition of (2-1) above. In another aspect, the present invention provides an easily peelable hardened resin film formed by hardening the hardening resin composition of (2-1) above on a substrate surface into a film-like state. The hardened resin film formed by the hardening resin composition of the present invention has heat resistance in the sense of "heat resistance" mentioned above, and also has easy peelability after heat treatment within the temperature range of heat resistance. Typically, the curable resin composition of the present invention can be formed into a transparent film by coating a solution obtained by dissolving a chain polymer, a crosslinking agent, and an acid catalyst used as needed in a solvent on a glass substrate (preferably sodium calcium glass) and performing a heat treatment (100°C to 230°C for more than 1 minute) to cure the solution, thereby forming an easily peelable curable resin film with a thickness of several hundred nm (preferably a film thickness of about 200 nm to about 300 nm). Although it is not expected to be bound by theory, its mechanism is that the hydroxyl groups of the side chains of the chain polymer and the crosslinking agent are crosslinked by heating, and the hardening shrinkage forms an easily peelable film. [Chemistry 26] As a method for coating the glass substrate, a known coating method can be used. For example, rotary coating, non-rotating coating, die-mouth coating, spray coating, roll coating, screen coating, slit coating, dip coating, and gravure coating can be listed. Preferably, rotary coating is listed. The thin film formed on the substrate in this way can withstand heating within 150°C, and preferably also withstand heating (baking) at 230°C. Furthermore, since it is resistant to the solvent used in the photoresist solution and also tolerates the alkaline developer solution, it can be advantageously used as a resin base film for circuit manufacturing by photolithography. In addition, the thin film formed by the curable resin composition of the present invention is also easily peelable after heating at such a temperature, so even as a thin film, it can be used in a circuit manufacturing process that includes a baking step at a higher temperature than before, which is beneficial to the maintenance of the characteristics of the circuit, and after the circuit is manufactured, it can also be easily peeled off from the substrate without much effort. Therefore, it can be widely used as a base film with excellent characteristics in the manufacture of various sheet-shaped flexible electrical and electronic circuit parts, for example, it can also be used in the manufacture of flexible display devices or touch sensors. The hardened resin film of the present invention can be produced by the method described in the following (3) hardened resin film production method. The peeling force of the hardened resin film of the present invention can be measured, for example, by the following measurement method. Typically, the hardening resin composition of the present invention is prepared in the form of a solution obtained by dissolving a chain polymer, a crosslinking agent, and an acid catalyst used as needed in a solvent and applied to a glass substrate (preferably sodium calcium glass), and is hardened by heat treatment (100°C to 230°C, for more than 1 minute), thereby producing a hardened resin film on the glass substrate. As a measuring device, for example, TENSILON RTG-1310 (A&D Co., Ltd.) is used, and as a load cell, UR-100N-D type is used. A Michelin tape (width 24 mm) is attached to a hardened resin film on a glass substrate, and pulled at a constant speed of 300 mm/min at a peeling angle of 90° relative to the glass substrate, and the force required for peeling (peeling force) is measured using the above-mentioned device. The hardened resin film of the present invention preferably has a peeling force of 0.5 N/mm 2 or less on a sodium glass substrate or an alkali-free glass substrate. The hardened resin film of the present invention more preferably has a peeling force of 0.1 N/mm 2 or less on a sodium glass substrate or an alkali-free glass substrate. The hardened resin film of the present invention further preferably has a peeling force of 0.09 N/mm 2 or less on a sodium glass substrate or an alkali-free glass substrate. The preferred value of the peeling force on a sodium glass substrate is 0.5 N/mm 2 or less, 0.4 N/mm 2 or less, 0.3 N/mm 2 or less, 0.2 N/mm 2 or less, 0.1 N/mm 2 or less, 0.09 N/mm 2 or less, 0.08 N/mm 2 or less, 0.07 N/mm 2 or less, 0.06 N/mm 2 or less, 0.05 N/mm 2 or less, 0.04 N/mm 2 or less, 0.03 N/mm 2 or less, 0.02 N/mm 2 or less, or 0.01 N/mm 2 or less. The preferred value of the peeling force on the alkali-free glass substrate is 0.5 N/mm 2 or less, 0.4 N/mm 2 or less, 0.3 N/mm 2 or less, 0.2 N/mm 2 or less, 0.1 N/mm 2 or less, 0.09 N/mm 2 or less, 0.08 N/mm 2 or less, 0.07 N/mm 2 or less, 0.06 N/mm 2 or less, 0.05 N/mm 2 or less, 0.04 N/mm 2 or less, 0.03 N/mm 2 or less, 0.02 N/mm 2 or less, and 0.01 N/mm 2 or less. When the peeling force on the sodium glass substrate or the alkali-free glass substrate is 0.5 N/mm 2 or less, the cured resin film can be regarded as having easy peelability. (3) Method for producing a hardened resin film In one embodiment, the present invention provides a method for producing a hardened resin film, which is a method for producing a hardened resin film from the hardening resin composition of the above-mentioned (2-1), and includes: (i) preparing a chain polymer having a side chain with an alcoholic secondary or tertiary hydroxyl group and a crosslinking agent; (ii) coating the hardening resin composition containing the chain polymer and the crosslinking agent on a substrate to form a hardening resin composition coating; and (iii) curing the hardening resin composition coating by subjecting it to a polymerization reaction to produce a hardened resin film. The above-mentioned manufacturing method further includes (iv) the step of peeling the hardened resin film formed on the substrate from the substrate. The above-mentioned manufacturing method is implemented by the method described in the following embodiments and/or the same method known to the industry. In one embodiment, the above-mentioned manufacturing method further includes (i') the step of polymerizing at least one raw material monomer to produce the chain polymer before step (i). As methods for polymerizing monomers, for example, block polymerization, solution polymerization, emulsion polymerization, suspension polymerization, etc. can be listed, but the present invention is not limited to these examples. Among these polymerization methods, block polymerization and solution polymerization are preferred. Furthermore, the polymerization of monomers can be carried out, for example, by free radical polymerization, living free radical polymerization, anionic polymerization, cationic polymerization, addition polymerization, condensation polymerization, and the like. When the monomers are polymerized by solution polymerization, for example, the monomers can be polymerized by adding a polymerization initiator to a solution obtained by stirring the monomers to dissolve in a solvent. Alternatively, the monomers can be polymerized by adding a monomer to a solution obtained by stirring the polymerization initiator to dissolve in a solvent. The solvent is preferably an organic solvent that is compatible with the monomers. When polymerizing the monomers, a chain transfer agent can also be used to adjust the molecular weight. The chain transfer agent can usually be used by mixing with the monomers. Examples of the chain transfer agent include 2-(dodecylthiothiocarbonylthio)-2-methylpropionic acid, 2-(dodecylthiocarbonylthio) propionic acid, 2-(dodecylthiocarbonylthio)-2-methylpropionic acid methyl ester, 2-(dodecylthiocarbonylthio)-2-methylpropionic acid 3-azido-1-propanol ester, 2-(dodecylthiocarbonylthio)-2-methylpropionic acid pentafluorophenyl ester, thiol group-containing compounds such as lauryl mercaptan, dodecyl mercaptan, and thioglycerol, and inorganic salts such as sodium hypophosphite and sodium hydrogen sulfite, but the present invention is not limited to these examples. These chain transfer agents may be used alone or in combination of two or more. The amount of the chain transfer agent is not particularly limited, and generally, it can be about 0.01 to about 10 parts by weight relative to 100 parts by weight of all monomers. When polymerizing the monomers, it is preferred to use a polymerization initiator. Examples of polymerization initiators include: thermal polymerization initiators, photopolymerization initiators, redox polymerization initiators, ATRP (atom transfer radical polymerization) initiators, ICAR (Initiators for Continuous Activator Regeneration) ATRP initiators, ARGET (Activator Regeneration By Electron Transfer) ATRP initiators, RAFT (reversible addition-fragmentation chain transfer polymerization) agents, NMP (polymerization via nitrogen oxides) agents, polymer polymerization initiators, and the like. The polymerization initiators can be used individually or in combination of two or more. Examples of thermal polymerization initiators include azoisobutyronitrile, methyl azoisobutyrate, azobisdimethylvaleronitrile and other azo-based polymerization initiators, benzoyl peroxide, potassium persulfate, ammonium persulfate and other peroxide-based polymerization initiators, but the present invention is not limited to the examples. The polymerization initiators can be used individually or in combination of two or more. When a thermal polymerization initiator is used as the polymerization initiator, the amount of the thermal polymerization initiator is preferably about 0.01 to about 20 parts by weight relative to 100 parts by weight of all monomers. Examples of the photopolymerization initiator include 2-oxoglutaric acid, 1-hydroxycyclohexylphenone, 2-hydroxy-2-methyl-1-phenylpropane-1-one, 2-methyl[4-(methylthio)phenyl]-2-morpholinopropane-1-one, 2,2-dimethoxy-1,2-diphenylethane-1-one, benzophenone, 1-[4-(2-hydroxyethoxy)phenyl]-2-hydroxy-2-methyl-1-propane-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butane-1-one, and bis(2,6-dimethoxybenzoyl)-2,4,4-trimethylpentylphosphine oxide. However, the present invention is not limited to these examples. The polymerization initiators may be used alone or in combination of two or more. When a photopolymerization initiator is used as the polymerization initiator, the amount of the photopolymerization initiator is preferably about 0.01 to 20 parts by weight based on 100 parts by weight of all monomers. In the present invention, other polymerization initiators that can be used include, for example, redox polymerization initiators such as hydrogen peroxide and iron (II) salts, persulfates and sodium bisulfite, ATRP (atom transfer radical polymerization) initiators using halogenated alkyl groups under metal catalysts, ICAR ATRP initiators or ARGET ATRP initiators using metals and nitrogen-containing ligands, RAFT (reversible addition-fragmentation chain transfer polymerization) agents, NMP (polymerization via nitrogen oxides) agents, high molecular weight azo polymerization initiators containing polydimethylsiloxane units, high molecular weight azo polymerization initiators containing polyethylene glycol units, and the like, but the present invention is not limited to these examples. These polymerization initiators can be used individually or in combination of two or more. When the above-mentioned polymerization initiators are used as polymerization initiators, the amount of the polymerization initiator is generally preferably about 0.01 parts by weight to about 20 parts by weight relative to 100 parts by weight of all monomers. In one embodiment, electron beam polymerization is carried out by irradiating the monomer with an electron beam. There are no particular limitations on the polymerization reaction temperature and environment when the monomer is polymerized. Usually, the polymerization reaction temperature is about 50°C to about 120°C. The environment during the polymerization reaction is preferably an inert gas environment such as nitrogen. In addition, the polymerization reaction time of the monomer varies depending on the polymerization reaction temperature, etc., so it cannot be generalized, and is generally about 3 to 20 hours. In one embodiment, the substrate in step (ii) of the above-mentioned manufacturing method is preferably a glass substrate, more preferably sodium glass (also known as sodium calcium glass) or alkali-free glass (for example, EAGLE-XG, Corning), and more preferably sodium glass. In one embodiment, as a method of applying the curable resin composition to the substrate in step (ii) of the above-mentioned manufacturing method, a known coating method can be used. For example, rotary coating, die nozzle coating, spray coating, roller coating, screen coating, slit coating, dip coating, gravure coating, etc. can be listed, but it is not limited to these. Preferably, the coating can be performed by using a rotary coating. In another embodiment, in step (ii) of the above-mentioned manufacturing method, it is preferred that the composition further comprises an acid catalyst. Although it is not desired to be bound by theory, the reason is that by including the acid catalyst in the coating of the hardening resin composition, the acid catalyst can function as a polymerization catalyst in the polymerization reaction in step (iii) to promote the reaction. Therefore, in another embodiment, step (i) of the above-mentioned manufacturing method further comprises the step of preparing the acid catalyst. In another embodiment, step (iii) of the above-mentioned manufacturing method further comprises the step of heat-treating the coating of the hardening resin composition. The temperature of the heat treatment is preferably 100°C to 230°C, more preferably 150°C to 230°C. The time of the heat treatment is preferably 1 minute or more, more preferably 10 minutes, 20 minutes, 30 minutes, 40 minutes, 50 minutes, 1 hour, 2 hours, 3 hours, 4 hours, 5 hours, 6 hours, etc., but is not limited thereto. The particularly preferred time of the heat treatment is 10 minutes to 2 hours. The hardened resin film produced by the above-mentioned manufacturing method has the characteristics of the hardened resin film of (2-2) above, and can be obtained in the form of an easily peelable film. (4) Applications The hardening resin composition or hardening resin film of the present invention can be used in synthetic resins, pills, films, flat sheets, fibers, foaming agents, tubes, rubbers, elastomers, etc., and can be applied to two-wheeled vehicles (bicycles, motorcycles, etc.), cars, airplanes, trains, ships, rockets, spacecraft, transportation, entertainment, furniture (e.g., dining tables, chairs, desks, shelves, etc.), bedding (e.g., beds, hammocks, etc.), clothing, protective clothing, sports equipment, bathtubs, kitchen utensils, tableware, cooking utensils, containers and packaging materials (food containers, cosmetic containers, cargo containers, garbage bins, etc.), buildings (buildings, roads, etc.), and other applications. , building parts, etc.), agricultural films, industrial films, water and sewage, coatings, cosmetics, electrical and electronic industries (electrochemical products, computer parts, printed circuit boards, insulators, conductors, wiring coating materials, power generation components, speakers, microphones, noise eliminators, converters, etc.), optical communication cables, medical materials and instruments (catheters, wires, artificial blood vessels, artificial muscles, artificial organs, dialysis membranes, endoscopes, etc.), small pumps, actuators, robotic materials (sensors used in industrial robots, etc.), energy generation devices and power plants (solar power generation, wind power generation, etc.), etc. The curable resin composition or the curable resin film of the present invention can be used in electronic materials, medical materials, health materials, life science materials, or robotic materials, etc. The curable resin composition or the curable resin film of the present invention can be used as materials for conduits, wires, containers for pharmaceuticals, tubes, etc. The curable resin composition or the curable resin film of the present invention can be used in automotive parts (body panels, bumpers, lower door panels, side moldings, engine parts, drive parts, transmission parts, operating device parts, stabilizer parts, suspension-brake device parts, brake parts, shaft parts, pipes, grooves, wheels, seats, seat belts, etc.). The polymer of the present invention can be used in automotive anti-vibration materials, automotive coatings, automotive synthetic resins, etc. All contents of the scientific literature, patents, patent applications and other references cited in this specification are cited as references in this specification to the same extent as specifically described. Above, the present invention is described by citing preferred embodiments for easy understanding. Below, the present invention is described based on embodiments, but the above description and the following embodiments are provided only for illustration and are not provided to limit the present invention. Therefore, the scope of the present invention is not limited to the embodiments specifically described in this specification, nor is it limited to the embodiments, but is only limited by the scope of the patent application. Embodiments Below, the present invention is described in more detail with reference to the embodiments, but it is not intended to limit the present invention to such embodiments. Furthermore, embodiments obtained by appropriately combining the technical methods disclosed in each embodiment are also included in the scope of the present invention. 1. Production of a polymer as a constituent of a curable resin composition A polymer as a constituent of a curable resin composition is produced in the following manner. (Production Example 1) Production of polymer A-1 The following formula (1-1) [Chemical 27] 2-Hydroxypropyl methacrylate was used as a monomer, and 100 parts by mass was dissolved in propylene glycol monomethyl ether (PGME) in a 30% by mass ratio. While blowing nitrogen into the obtained solution, the temperature was raised to 80°C, and 5 mol% of 2,2'-azobisisobutyronitrile (AIBN) was added relative to the total amount of monomers, followed by reaction at 80°C for 8 hours to obtain polymer A-1. The average molecular weight (MW) of the polymer was measured by gel permeation chromatography and the result was 25,000. (Production Example 2) Production of polymer A-2: The following formula (1-2) [Chemical 28] Polymer A-2 was obtained in the same manner as in Preparation Example 1 except that 3-benzoyloxy-2-hydroxypropyl methacrylate of (1-2) was used as a monomer. The average molecular weight (MW) of the polymer was measured by gel permeation chromatography and the result was 22,000. (Preparation Example 3) Preparation of Polymer A-3 The following formula (1-3) [Chemical 29] Polymer A-3 was obtained in the same manner as in Preparation Example 1 except that 4-benzyloxy-3-hydroxycyclohexylmethyl methacrylate was used as a monomer. The average molecular weight (MW) of the polymer was measured by gel permeation chromatography and the result was 32,000. (Preparation Example 4) Preparation of Polymer A-4 The following formula (1-4) [Chemical 30] Polymer A-4 was obtained in the same manner as in Preparation Example 1 except that 1,3-adamantanediol monomethacrylate was used as a monomer. The average molecular weight (MW) of the polymer was measured by gel permeation chromatography and the result was 18,000. (Preparation Example 5) Preparation of Polymer A-5 The following formula (1-5) [Chemical 31] Polymer A-5 was obtained in the same manner as in Production Example 1 except that 2-hydroxycyclohexyl methacrylate was used as a monomer. The average molecular weight (MW) of the polymer was measured by gel permeation chromatography and the result was 36,000. (Production Example 6) Production of Polymer A-6 The following formula (1-6) [Chemical 32] Polymer A-6 was obtained in the same manner as in Production Example 1 except that 2-hydroxyethyl methacrylate was used as a monomer. The average molecular weight (MW) of the polymer was measured by gel permeation chromatography and the result was 42,000. (Production Example 7) Production of Polymer A-7 The following formula (1-7) [Chemical 33] Polymer A-7 was obtained in the same manner as in Preparation Example 1 except that 4-(hydroxymethyl)cyclohexyl methacrylate was used as a monomer. The average molecular weight (MW) of the polymer was measured by gel permeation chromatography and the result was 18,000. (Preparation Example 8) Preparation of Polymer A-8 2-Hydroxypropyl methacrylate and n-butyl acrylate of formula (1-1) were used as monomers, and 50 parts by mass of each were dissolved in propylene glycol monomethyl ether (PGME) in such a manner that the total amount was 30% by mass. While blowing nitrogen into the obtained solution, the temperature was raised to 80°C, and 5 mol% of 2,2'-azobisisobutyronitrile (AIBN) was added relative to the total amount of monomers, followed by a reaction at 80°C for 8 hours to obtain Polymer A-8. The average molecular weight (MW) of the polymer was measured by gel permeation chromatography and found to be 18,000. (Production Example 9) Production of Polymer A-9 Polymer A-9 was obtained in the same manner as in Production Example 8, except that 2-hydroxypropyl methacrylate of the formula (1-1) and methyl methacrylate were used as monomers. The average molecular weight (MW) of the polymer was measured by gel permeation chromatography and found to be 25,000. (Production Example 10) Production of Polymer A-10 Polymer A-10 was obtained in the same manner as in Production Example 8, except that 2-hydroxypropyl methacrylate of the formula (1-1) and styrene were used as monomers. The average molecular weight (MW) of the polymer was measured by gel permeation chromatography and found to be 22,000. (Production Example 11) Production of Polymer A-11 Polymer A-11 was obtained in the same manner as in Production Example 8 except that 4-benzoyloxy-3-hydroxycyclohexylmethyl methacrylate and dicyclopentadienyl methacrylate of formula (1-3) were used as monomers. The average molecular weight (MW) of the polymer was measured by gel permeation chromatography and found to be 35,000. (Production Example 12) Production of Polymer A-12 Polymer A-12 was obtained in the same manner as in Production Example 8 except that 2-hydroxycyclohexyl methacrylate and dicyclopentadienyl methacrylate of formula (1-5) were used as monomers. The average molecular weight (MW) of the polymer was measured by gel permeation chromatography and found to be 25,000. (Production Example 13) Production of Polymer A-13 Polymer A-13 was obtained in the same manner as in Production Example 8 except that 2-hydroxyethyl methacrylate of formula (1-6) and butyl acrylate were used as monomers. The average molecular weight (MW) of the polymer was measured by gel permeation chromatography and found to be 38,000. (Production Example 14) Production of Polymer A-14 Polymer A-14 was obtained in the same manner as in Production Example 8 except that 2-hydroxyethyl methacrylate of formula (1-6) and methyl methacrylate were used as monomers. The average molecular weight (MW) of the polymer was measured by gel permeation chromatography and found to be 36,000. (Production Example 15) Production of Polymer A-15 Polymer A-15 was obtained in the same manner as in Production Example 8 except that 2-hydroxyethyl methacrylate and dicyclopentadienyl methacrylate of formula (1-6) were used as monomers. The average molecular weight (MW) of the polymer was measured by gel permeation chromatography and the result was 39,000. (Production Example 16) Production of Polymer A-16 The following formula (1-8) [Chemical 34] Polymer A-16 was obtained in the same manner as in Preparation Example 1 except that 4-(4-methoxyphenylpropionyl)oxy-3-hydroxycyclohexylmethyl methacrylate was used as a monomer. The average molecular weight (MW) of the polymer was measured by gel permeation chromatography and the result was 27,700. (Preparation Example 17) Preparation of polymer A-17 The following formula (1-9) [Chemical 36] Polymer A-17 was obtained in the same manner as in Preparation Example 1 except that 4-adamantanylcarboxyloxy-3-hydroxycyclohexylmethyl methacrylate was used as a monomer. [Chemical 37] The average molecular weight (MW) of the polymer was measured by gel permeation chromatography and found to be 31,700. (Production Example 18) Production of Polymer A-18 Polymer A-18 was obtained in the same manner as in Production Example 8 except that 2-hydroxycyclohexyl methacrylate of formula (1-5) and methyl methacrylate were used as monomers. [Chemical 38] The average molecular weight (MW) of the polymer was measured by gel permeation chromatography and the result was 25,500. (Preparation Example 19) Preparation of polymer A-19 The following formula (1-10) [Chemical 39] Polymer A-19 was obtained in the same manner as in Preparation Example 1 except that 2-methacrylate-3-hydroxybenzoylmethyl ester was used as a monomer. The average molecular weight (MW) of the polymer was measured by gel permeation chromatography and the result was 35,700. (Preparation Example 20) Preparation of polymer A-20 The following formula (1-11) [Chemical 41] Polymer A-20 was obtained in the same manner as in Preparation Example 1 except that 2-hydroxy-4-methylacryloyloxymethyl-cyclohexyl-3-cyclohexene-1-carboxylate was used as a monomer. [Chemical 42] The average molecular weight (MW) of the polymer was measured by gel permeation chromatography and the result was 26,700. (Production Example 21) Production of polymer A-21 The following formula (1-12) [Chemical 43] Polymer A-21 was obtained in the same manner as in Preparation Example 1 except that 2-methacrylic acid 4-(2-cyclohexylacetyl)oxy-3-hydroxycyclohexanemethyl ester was used as a monomer. The average molecular weight (MW) of the polymer was measured by gel permeation chromatography and found to be 30,700. (Production Example 22) Production of Polymer A-22 Polymer A-22 was obtained in the same manner as in Production Example 8 except that 2-hydroxycyclohexyl methacrylate of formula (1-5) and benzyl methacrylate were used as monomers. [Chemical 45] The average molecular weight (MW) of the polymer was measured by gel permeation chromatography and was found to be 32,700. (Production Example 23) Production of Polymer A-23 4-(4-methoxyphenylpropionyl)oxy-3-hydroxycyclohexylmethyl methacrylate of formula (1-8) and [Chemical 46] of formula (1-13) were reacted with 3,4-Epoxyhexylmethyl methacrylate was used as a monomer, and 100 parts by mass of it was dissolved in propylene glycol monomethyl ether (PGME) in a manner of 20% by mass. While blowing nitrogen into the obtained solution, the temperature was raised to 80°C, and 4 mol% of 2,2'-azobisisobutyronitrile (AIBN) was added relative to the total amount of monomers, and then the reaction was carried out at 80°C for 8 hours to obtain a polymer. Thereafter, 99 parts by mass of 4-methoxycinnamic acid and 1 part by mass of methacrylic acid were added, and then 3 mol% of tetraethylammonium bromide was added, and while blowing air, the temperature was raised to 100°C, and the reaction was carried out for 38 hours to obtain a polymer A-23. [Chemical 47] The average molecular weight (MW) of the obtained polymer was measured by gel permeation chromatography and the result was 42,900. (Production Example 24) Production of Polymer A-24 Polymer A-24 was obtained in the same manner as in Production Example 8 except that methyl methacrylate, glycidyl methacrylate and dicyclopentadienyl methacrylate were used as monomers. [Chemical 48] The average molecular weight (MW) of the polymer was measured by gel permeation chromatography and the result was 35,700. 2. Preparation of curable resin composition The curable resin composition of the present invention was prepared as shown below, applied on two glass substrates and cured by heating to form a film. (Example 1) 4.4 parts by weight of polymer A-1 and the following formula (B-1) [Chemical 49] as a crosslinking agent were added. 0.4 parts by weight of hexamethoxymethylmelamine (NIKALAC MW-30, Sanwa Chemical Co., Ltd.) and 0.2 parts by weight of pyridinium-p-toluenesulfonic acid as a polymerization catalyst were dissolved in 95 parts by weight of propylene glycol monomethyl ether (PGME). The solution was applied to 0.7 mm thick sodium glass and 0.5 mm thick alkali-free glass (EAGLE-XG, Corning) by spin coating, and then heated at 150°C or above for 30 minutes to form a film with a thickness of about 300 nm. (Example 2) 3.2 parts by mass of polymer A-1, 0.8 parts by mass of hexamethoxymethylmelamine (Formula (B-1)), a crosslinking agent, and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst were dissolved in 95 parts by mass of propylene glycol monomethyl ether (PGME). The solution was applied to sodium glass and alkali-free glass in the same manner as in Example 1, and heat-treated to form a film with a thickness of about 300 nm. (Example 3) 2.4 parts by mass of polymer A-1, 2.4 parts by mass of hexamethoxymethylmelamine (Formula (B-1)), a crosslinking agent, and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst were dissolved in 95 parts by mass of propylene glycol monomethyl ether (PGME). The solution was applied to sodium glass and alkali-free glass in the same manner as in Example 1, and then heat-treated to form a film with a thickness of about 300 nm. (Example 4) 4.4 parts by mass of polymer A-2, 0.4 parts by mass of hexamethoxymethylmelamine (Formula (B-1)) as a crosslinking agent, and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst were dissolved in 95 parts by mass of propylene glycol monomethyl ether (PGME). The solution was applied to sodium glass and alkali-free glass in the same manner as in Example 1, and then heat-treated to form a film with a thickness of about 300 nm. (Example 5) 4.4 parts by mass of polymer A-3, 0.4 parts by mass of hexamethoxymethylmelamine (Formula (B-1)), a crosslinking agent, and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst are dissolved in 95 parts by mass of propylene glycol monomethyl ether (PGME). The solution is applied to sodium glass and alkali-free glass in the same manner as in Example 1, and heat-treated to form a film with a thickness of about 300 nm. (Example 6) 4.4 parts by mass of polymer A-4, 0.4 parts by mass of hexamethoxymethylmelamine (Formula (B-1)), a crosslinking agent, and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst are dissolved in 95 parts by mass of propylene glycol monomethyl ether (PGME). The solution was applied to sodium glass and alkali-free glass in the same manner as in Example 1, and then heat-treated to form a film with a thickness of about 300 nm. (Example 7) 4.4 parts by mass of polymer A-5, 0.4 parts by mass of hexamethoxymethylmelamine (Formula (B-1)) as a crosslinking agent, and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst were dissolved in 95 parts by mass of propylene glycol monomethyl ether (PGME). The solution was applied to sodium glass and alkali-free glass in the same manner as in Example 1, and then heat-treated to form a film with a thickness of about 300 nm. (Example 8) 4.4 parts by mass of polymer A-8, 0.4 parts by mass of hexamethoxymethylmelamine (Formula (B-1)), a crosslinking agent, and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst are dissolved in 95 parts by mass of propylene glycol monomethyl ether (PGME). The solution is applied to sodium glass and alkali-free glass in the same manner as in Example 1, and heat-treated to form a film with a thickness of about 300 nm. (Example 9) 4.4 parts by mass of polymer A-9, 0.4 parts by mass of hexamethoxymethylmelamine (Formula (B-1)), a crosslinking agent, and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst are dissolved in 95 parts by mass of propylene glycol monomethyl ether (PGME). The solution was applied to sodium glass and alkali-free glass in the same manner as in Example 1, and then heat-treated to form a film with a thickness of about 300 nm. (Example 10) 4.4 parts by mass of polymer A-10, 0.4 parts by mass of hexamethoxymethylmelamine (Formula (B-1)) as a crosslinking agent, and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst were dissolved in 95 parts by mass of propylene glycol monomethyl ether (PGME). The solution was applied to sodium glass and alkali-free glass in the same manner as in Example 1, and then heat-treated to form a film with a thickness of about 300 nm. (Example 11) 4.4 parts by mass of polymer A-11, 0.4 parts by mass of hexamethoxymethylmelamine (Formula (B-1)), a crosslinking agent, and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst are dissolved in 95 parts by mass of propylene glycol monomethyl ether (PGME). The solution is applied to sodium glass and alkali-free glass in the same manner as in Example 1, and heat-treated to form a film with a thickness of about 300 nm. (Example 12) 4.4 parts by mass of polymer A-12, 0.4 parts by mass of hexamethoxymethylmelamine (Formula (B-1)), a crosslinking agent, and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst are dissolved in 95 parts by mass of propylene glycol monomethyl ether (PGME). The solution was applied to sodium glass and alkali-free glass in the same manner as in Example 1 and heat treated to form a film with a thickness of about 300 nm. (Example 13) 4.4 parts by weight of polymer A-1 and as a crosslinking agent, the following formula (B-2): [Chemical 50] 0.4 parts by weight of 1,3,4,6-tetrakis(methoxymethyl)glycoluril (NIKALAC MW-270, Sanwa Chemical Co., Ltd.) and 0.2 parts by weight of pyridinium-p-toluenesulfonic acid as a polymerization catalyst were dissolved in 95 parts by weight of propylene glycol monomethyl ether (PGME). The solution was applied to sodium glass and alkali-free glass in the same manner as in Example 1 and heat-treated to form a film with a thickness of about 300 nm. (Example 14) 4.4 parts by weight of polymer A-1 and the following formula (B-3) as a crosslinking agent [Chemical 51] 0.4 parts by mass of tetramethoxymethylbenzoguanamine as a polymerization catalyst and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst are dissolved in 95 parts by mass of propylene glycol monomethyl ether (PGME). The solution is applied to sodium glass and alkali-free glass in the same manner as in Example 1, and heat-treated to form a film with a thickness of about 300 nm. (Example 15) 4.4 parts by mass of polymer A-1, 0.4 parts by mass of hexamethoxymethylmelamine (Formula (B-1)) as a crosslinking agent, and 0.2 parts by mass of dodecylbenzenesulfonic acid as a polymerization catalyst are dissolved in 95 parts by mass of propylene glycol monomethyl ether (PGME). The solution is applied to sodium glass and alkali-free glass in the same manner as in Example 1, and heat-treated to form a film with a thickness of about 300 nm. (Example 16) 4.4 parts by weight of polymer A-1, 0.4 parts by weight of crosslinking agent hexamethoxymethylmelamine (Formula (B-1)), and 0.2 parts by weight of thermal acid generator San-Aid SI-100L (San-Shin Chemical Industry Co., Ltd.) as a polymerization catalyst were dissolved in 95 parts by weight of propylene glycol monomethyl ether (PGME). The solution was applied to sodium glass and alkali-free glass in the same manner as in Example 1 and heat-treated to form a film with a thickness of about 300 nm. (Comparative Example 1) 4.4 parts by mass of polymer A-6, 0.4 parts by mass of hexamethoxymethylmelamine (Formula (B-1)) as a crosslinking agent, and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst were dissolved in 95 parts by mass of propylene glycol monomethyl ether (PGME). The solution was applied to sodium glass and alkali-free glass in the same manner as in Example 1 and heat-treated to form a film with a thickness of about 300 nm. (Comparative Example 2) 4.4 parts by mass of polymer A-7, 0.4 parts by mass of hexamethoxymethylmelamine (Formula (B-1)) as a crosslinking agent, and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst were dissolved in 95 parts by mass of propylene glycol monomethyl ether (PGME). The solution was applied to sodium glass and alkali-free glass in the same manner as in Example 1, and then heat-treated to form a film with a thickness of about 300 nm. (Comparative Example 3) 4.4 parts by mass of polymer A-13, 0.4 parts by mass of hexamethoxymethylmelamine (Formula (B-1)) as a crosslinking agent, and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst were dissolved in 95 parts by mass of propylene glycol monomethyl ether (PGME). The solution was applied to sodium glass and alkali-free glass in the same manner as in Example 1, and then heat-treated to form a film with a thickness of about 300 nm. (Comparative Example 4) 4.4 parts by mass of polymer A-14, 0.4 parts by mass of hexamethoxymethylmelamine (Formula (B-1)) as a crosslinking agent, and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst were dissolved in 95 parts by mass of propylene glycol monomethyl ether (PGME). The solution was applied to sodium glass and alkali-free glass in the same manner as in Example 1 and heat-treated to form a film with a thickness of about 300 nm. (Comparative Example 5) 4.4 parts by mass of polymer A-15, 0.4 parts by mass of hexamethoxymethylmelamine (Formula (B-1)) as a crosslinking agent, and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst were dissolved in 95 parts by mass of propylene glycol monomethyl ether (PGME). The solution was applied to sodium glass and alkali-free glass in the same manner as in Example 1, and then heat-treated to form a film with a thickness of about 300 nm. (Comparative Example 6) 4.4 parts by mass of polymer A-1, 0.4 parts by mass of Duranate TPA-100 (Asahi Kasei Corporation) as an isocyanurate crosslinking agent, and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst were dissolved in 95 parts by mass of propylene glycol monomethyl ether (PGME). The solution was applied to sodium glass and alkali-free glass in the same manner as in Example 1, and then heat-treated to form a film with a thickness of about 300 nm. (Example 17) 3.2 parts by mass of polymer A-16, 0.8 parts by mass of hexamethoxymethylmelamine (Formula (B-1)), a crosslinking agent, and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst are dissolved in 95 parts by mass of propylene glycol monomethyl ether (PGME). The solution is applied to sodium glass and alkali-free glass in the same manner as in Example 1, and heat-treated to form a film with a thickness of about 300 nm. (Example 18) 3.2 parts by mass of polymer A-17, 0.8 parts by mass of hexamethoxymethylmelamine (Formula (B-1)), a crosslinking agent, and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst are dissolved in 95 parts by mass of propylene glycol monomethyl ether (PGME). The solution was applied to sodium glass and alkali-free glass in the same manner as in Example 1, and then heat-treated to form a film with a thickness of about 300 nm. (Example 19) 3.2 parts by mass of polymer A-18, 0.8 parts by mass of hexamethoxymethylmelamine (Formula (B-1)) as a crosslinking agent, and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst were dissolved in 95 parts by mass of propylene glycol monomethyl ether (PGME). The solution was applied to sodium glass and alkali-free glass in the same manner as in Example 1, and then heat-treated to form a film with a thickness of about 300 nm. (Example 20) 3.2 parts by mass of polymer A-19, 0.8 parts by mass of hexamethoxymethylmelamine (Formula (B-1)), a crosslinking agent, and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst are dissolved in 95 parts by mass of propylene glycol monomethyl ether (PGME). The solution is applied to sodium glass and alkali-free glass in the same manner as in Example 1, and heat-treated to form a film with a thickness of about 300 nm. (Example 21) 3.2 parts by mass of polymer A-20, 0.8 parts by mass of hexamethoxymethylmelamine (Formula (B-1)), a crosslinking agent, and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst are dissolved in 95 parts by mass of propylene glycol monomethyl ether (PGME). The solution was applied to sodium glass and alkali-free glass in the same manner as in Example 1, and then heat-treated to form a film with a thickness of about 300 nm. (Example 22) 3.2 parts by mass of polymer A-21, 0.8 parts by mass of hexamethoxymethylmelamine (Formula (B-1)) as a crosslinking agent, and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst were dissolved in 95 parts by mass of propylene glycol monomethyl ether (PGME). The solution was applied to sodium glass and alkali-free glass in the same manner as in Example 1, and then heat-treated to form a film with a thickness of about 300 nm. (Example 23) 3.2 parts by mass of polymer A-22, 0.8 parts by mass of hexamethoxymethylmelamine (Formula (B-1)), a crosslinking agent, and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst are dissolved in 95 parts by mass of propylene glycol monomethyl ether (PGME). The solution is applied to sodium glass and alkali-free glass in the same manner as in Example 1, and heat-treated to form a film with a thickness of about 300 nm. (Example 24) 3.2 parts by mass of polymer A-23, 0.8 parts by mass of hexamethoxymethylmelamine (Formula (B-1)), a crosslinking agent, and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst are dissolved in 95 parts by mass of propylene glycol monomethyl ether (PGME). The solution was applied to sodium glass and alkali-free glass in the same manner as in Example 1, and then heat-treated to form a film with a thickness of about 300 nm. (Comparative Example 7) 3.2 parts by mass of polymer A-24, 0.8 parts by mass of hexamethoxymethylmelamine (Formula (B-1)) as a crosslinking agent, and 0.2 parts by mass of pyridinium-p-toluenesulfonic acid as a polymerization catalyst were dissolved in 95 parts by mass of propylene glycol monomethyl ether (PGME). The solution was applied to sodium glass and alkali-free glass in the same manner as in Example 1, and then heat-treated to form a film with a thickness of about 300 nm. 3. Performance Evaluation (1) Evaluation of the Peeling Force of Cured Resin Films For the cured resin films produced on the glass substrates in each of the above-mentioned embodiments and comparative examples, the magnitude of the force (peeling force) required to peel the cured resin films from the glass substrates was quantitatively evaluated by the method described below. That is, TENSILON RTG-1310 (A&D Co., Ltd.) was used as a measuring device, and UR-100N-D was used as a load cell. The measurement was performed in the following manner: a Michelin tape (width 24 mm) was attached to a hardened resin film on a glass substrate, and it was pulled at a fixed speed of 300 mm/min at a peeling angle of 90° relative to the glass substrate, and the force required for peeling (peeling force) was measured using the above-mentioned device. The results are shown in Table 1. The peeling forces of Examples 1 to 16 in Tables 1 and 2 are displayed to 3 decimal places. In principle, the measured values and calculated values other than these are displayed to 2 decimal places. [Table 1] As shown in Table 1, it is found that the peeling force of the hardened resin films of Comparative Examples 1 to 6 is 2.2 to 8.7 N/mm 2 (sodium glass substrate) and 3.2 to 9.2 N/mm 2 (EAGLE-XG substrate), while the peeling force of Examples 1 to 16 is less than two digits, 0.013 to 0.078 N/mm 2 (sodium glass substrate) and 0.028 to 0.085 N/mm 2 (EAGLE-XG substrate). In fact, it is found that the films or substrates are damaged due to the high peeling force values of the hardened resin films of the Comparative Examples, while the hardened resin films of the Examples can be easily peeled without much effort. (2) Evaluation of the peeling force of the cured resin film after baking It is assumed that a baking process is performed when a circuit is made on the cured resin film by patterning using a photolithography method or a printing method, and the peeling force when the cured resin film is baked is measured. That is, for Examples 1 and 7 and Comparative Examples 1 and 2, the cured resin film formed on the sodium glass substrate is baked at 230°C for 1 hour or 3 hours, and the peeling force of each is measured by the device and method described in (1) above. The results are shown in Table 2 together with the values of the peeling force (initial peeling force) before baking in these Examples and Comparative Examples. [Table 2] As shown in Table 2, the hardened resin films of Examples 1 and 7 after being baked at 230°C for 1 hour or 3 hours were still two digits lower than those of Comparative Examples 1 and 2 before baking, and could be easily peeled off without much effort. The hardened resin films of Comparative Examples 1 and 2 were more firmly attached to the glass substrate than before baking. Assuming that the baking process was performed in the same manner as in (2) above by patterning on the hardened resin film using photolithography or printing, the peeling force when the hardened resin film was baked was measured. That is, for Examples 12, 16 to 22 and Comparative Example 7, the hardened resin film formed on the sodium glass substrate was baked at 230°C for 20 minutes, and the peeling force of each was measured by the apparatus and method described in (1) above. The results are shown in Table 3 together with the values of the peeling force (initial peeling force) before baking in these Examples and Comparative Examples. [Table 3] As shown in Table 3, the hardened resin films of Examples 12 to 24 after being baked at 230°C for 20 minutes were also two digits lower than that of Comparative Example 7 before baking, and could be easily peeled off without much effort. On the other hand, the hardened resin film of Comparative Example 7 had a high peeling force as before baking, and could not be easily peeled off. (3) Evaluation of the peeling force of the cured resin film after baking when the crosslinking agent and the mixing ratio were changed The crosslinking agent and the mixing ratio of polymer/crosslinking agent were changed as shown in Table 5 below, and the peeling force of the cured resin film produced in Examples 25 to 27 and Comparative Examples 8 to 10 was measured. The various conditions are as follows. <Evaluation conditions> ・Substrate: Sodium glass (coated on the tin-treated surface) ・Film formation: Spin coating, baking at >150℃ or 230℃ for 30 minutes ※Final film thickness 50 to 200 nm ・Peeling test conditions: Peeling test was performed using Michelbon tape (width 24 mm). The polymer used is polymer A-3. The crosslinking agent used is shown in Table 4. In Table 4, MW-30 is hexamethoxymethyl melamine (NIKALAC MW-30, Sanwa Chemical Co., Ltd.) of the above formula (B-1), MW-30LF is hexamethoxymethyl melamine (low free formaldehyde product) (NIKALAC MW-30LF, Sanwa Chemical Co., Ltd.), and MX-270 is 1,3,4,6-tetrakis (methoxymethyl) glycoluril (NIKALAC MW-270, Sanwa Chemical Co., Ltd.) of the above formula (B-2). [Table 4] <img wi="120"he="86"file="IMG-2/Draw/02_image103.jpg"img-format="jpg"><imgwi="125"he="84"file="IMG-2/Draw/02_image105.jpg"img-format="jpg"><imgwi="110"he="76"file="IMG-2/Draw/02_image107.jpg"img-format="jpg"> The results are shown in Table 5. MW-30 was used as a reference compound, and the peeling force and peeling characteristics were studied by changing the mixing ratio of other compounds (Examples 25 to 27 and Comparative Examples 8 to 10). In Table 5, in the peeling test column, "0" means that the formed hardened resin film can be easily peeled off without much effort and has easy peeling properties, and "×" means that it cannot be easily peeled off and does not have easy peeling properties. [Table 5] As shown in Table 5, when MW-30 is used, if the mixing ratio of polymer/crosslinking agent is 45/50, the peeling force is low, 0.02, and it is easy to peel, but when it is 90/10, the peeling force is also double-digit, 7.5, and it is not easy to peel. When MX-270 is used, the peeling force and easy peeling are lower in the mixing ratio of 45/50 and 90/10. On the other hand, with respect to MW-30LF, the peeling force is higher in the mixing ratio of 45/50 and 90/10, and it is not easy to peel. The reason for this result is believed to be that MW-30LF contains less formaldehyde and has fewer hydroxymethyl groups (reaction points for thermal crosslinking) than MW-30. (4) Study on the threshold of peeling force of hardened resin film The peeling force of hardened resin films prepared by varying the weight ratio (wt%) of polymer, crosslinking agent, and acid catalyst was measured. That is, for Examples 28 to 38 and Comparative Examples 11 to 15, a solution prepared by using a polymer, a crosslinking agent, and an acid catalyst in the weight ratio described in Table 6 below was applied to a sodium glass substrate and baked at 230°C for 20 minutes. In addition, a hardened resin film was formed in the same manner as in Example 1, and the peeling force of each was measured and compared by the apparatus and method described in (1) above. The results are shown in Table 6. [Table 6] As shown in Table 6, for crosslinking agent B-1, easy stripping was exhibited when the total amount of polymer, crosslinking agent, and acid catalyst was 10 wt % or more (Examples 28 to 30), and for crosslinking agent B-2, easy stripping was exhibited when the total amount was 3 wt % or more (Examples 33 to 38). In addition, in Comparative Example 8 in Table 5, if the mixing ratio of polymer/crosslinking agent was 90/10, easy stripping was not exhibited, but if the mixing ratio was 85/10 in Example 29 in Table 6, which was approximately the same as the mixing ratio using an acid catalyst, easy stripping was exhibited. Therefore, it can be said that easy stripping is easily exhibited by adding an acid catalyst. As described above, the present invention is illustrated using the preferred embodiments of the present invention, but it should be understood that the scope of the present invention is interpreted only according to the scope of the patent application. It should be understood that the contents of the patents, patent applications and other documents cited in this specification are themselves specifically described in this specification, and similarly, their contents should be cited as references to this specification. This case claims priority to International Patent Application PCT/JP2016/074180 (filed on August 19, 2016) and Taiwan Patent Application No. 105126494 (filed on August 19, 2016), and the contents of the same are cited in this specification as a reference in their entirety. [Industrial Applicability] The present invention is a curable resin composition that can be applied very thinly on a substrate such as glass, and can be dried and cured after application to form an extremely thin curable resin film. During baking in the process of making a circuit on the film by patterning, etc., the film has durability against high temperatures of 230°C, and can be easily peeled off from the substrate even after exposure to such high temperatures. The curable resin composition is useful in the manufacture of film-type electrical and electronic circuit components.