TWI852676B - Method for mixing led dies - Google Patents
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- 238000000034 method Methods 0.000 title claims abstract description 33
- 238000002156 mixing Methods 0.000 title claims abstract description 19
- 239000011159 matrix material Substances 0.000 claims abstract description 52
- 238000003491 array Methods 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 13
- 238000003805 vibration mixing Methods 0.000 description 3
- 239000003086 colorant Substances 0.000 description 2
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 1
- 101000827703 Homo sapiens Polyphosphoinositide phosphatase Proteins 0.000 description 1
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 1
- 102100023591 Polyphosphoinositide phosphatase Human genes 0.000 description 1
- 101100012902 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) FIG2 gene Proteins 0.000 description 1
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 1
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Abstract
Description
本發明是有關一種LED晶粒混合方法。 The present invention relates to a method for mixing LED chips.
發光二極體顯示器(LED display)是一種使用發光二極體的顯示器,包括複數個LED燈箱。各LED燈箱包括複數片LED印刷電路板。每片LED印刷電路板由複數個分立封裝的LED晶粒所構成。 A light-emitting diode display (LED display) is a display that uses light-emitting diodes, including multiple LED light boxes. Each LED light box includes multiple LED printed circuit boards. Each LED printed circuit board is composed of multiple discretely packaged LED chips.
習知的LED晶粒混合方法是利用震動隨機組合或亂數分選不同類型的LED晶粒(紅光、藍光和綠光)。因此,複數片LED印刷電路板的平均波長會呈現一致,也就是說,複數片LED印刷電路板之間的顏色均勻。 The known LED die mixing method is to use vibration to randomly combine or randomly sort different types of LED dies (red light, blue light and green light). Therefore, the average wavelength of multiple LED printed circuit boards will be consistent, that is, the color between multiple LED printed circuit boards is uniform.
然而,單一片LED印刷電路板內部的小區域卻出現平均波長不一致的問題,導致單一片LED印刷電路板的顏色不均勻。 However, the small area inside a single LED printed circuit board has an inconsistent average wavelength, resulting in uneven color of the single LED printed circuit board.
再者,該等LED晶粒容易因為震動混合而受到碰撞並造成損壞。 Furthermore, the LED chips are easily collided and damaged due to vibration mixing.
本發明的主要目的在於提供一種LED晶粒混合方法,能夠利用幻方配合波長區段將不同類型的LED晶粒(紅光、藍光和綠光)分配位置。 The main purpose of the present invention is to provide a method for mixing LED chips, which can use magic squares and wavelength segments to allocate positions for different types of LED chips (red light, blue light and green light).
為了達成前述的目的,本發明提供一種LED晶粒混合方法,包括下列步驟:(a)建立一個具有i列和j行的矩陣,該矩陣包括i×j個元素,該矩陣內的每個元素為具有n列和n行的方陣,其中,i2,j2,n3,且i、j、n均為正整數;
(b)利用幻方在各該方陣的n 2個座標上分別標記數字1,2,...,n 2,使得各該方陣的每行、每列以及二條對角線的n個座標上標記的數字
總和均等於;
(c)將複數個LED晶粒依照波長分成n 2個波長區段,且每個波長區段包含i×j個LED晶粒;以及(d)將相同波長區段的該i×j個LED晶粒分別放置在該等方陣中標記相同數字的座標上。
In order to achieve the above-mentioned purpose, the present invention provides a method for mixing LED dies, comprising the following steps: (a) establishing a matrix with i columns and j rows, the matrix comprising i×j elements, each element in the matrix being a square matrix with n columns and n rows, wherein
在一些實施例中,所述幻方為奇數階幻方。 In some embodiments, the magic square is an odd-order magic square.
在一些實施例中,n=3。 In some embodiments, n=3.
在一些實施例中,所述幻方為偶數階幻方。 In some embodiments, the magic square is an even-order magic square.
在一些實施例中,步驟(b)進一步包括:相鄰的二個方陣的任 一對角線的連續n個座標上標記的數字總和等於。 In some embodiments, step (b) further comprises: the sum of the numbers marked on the consecutive n coordinates of any diagonal of two adjacent square matrices is equal to .
在一些實施例中,步驟(b)進一步包括:各該方陣內的任一2×2的內方陣的座標上標記的數字總和等於2(n 2+1),各該方陣內的任一對角線的距 離為座標單位的二個座標上標記的數字總和等於n 2+1,且該矩陣的邊長為4 的倍數的座標單位。 In some embodiments, step (b) further includes: the sum of the numbers marked on the coordinates of any 2×2 inner square in each of the squares is equal to 2( n2 +1), and the distance between any diagonal line in each of the squares is The sum of the numbers marked on the two coordinates of the coordinate unit is equal to n 2 +1, and the side length of the matrix is a coordinate unit that is a multiple of 4.
在一些實施例中,步驟(b)進一步包括:相鄰的二個方陣的任 一對角線的連續n個座標上標記的數字總和等於,各該方陣內的任一2×2 的內方陣的座標上標記的數字總和等於2(n 2+1),各該方陣內的二個距離為的 對角線的座標上標記的數字總和等於n 2+1,且該矩陣的邊長為4的倍數的座標單位。 In some embodiments, step (b) further comprises: the sum of the numbers marked on the consecutive n coordinates of any diagonal of two adjacent square matrices is equal to , the sum of the numbers marked on the coordinates of any 2×2 inner square in the square is equal to 2( n2 +1), and the distances between the two distances in the square are The sum of the numbers on the diagonal coordinates is equal to n 2 + 1, and the length of the sides of the matrix is a multiple of 4.
在一些實施例中,n=4。 In some embodiments, n=4.
在一些實施例中,步驟(b)進一步包括:該等方陣的該等座標所標記的數字的位置相同。 In some embodiments, step (b) further includes: the positions of the numbers marked by the coordinates of the square arrays are the same.
在一些實施例中,步驟(d)進一步包括:將相同波長區段的該i×j個LED晶粒隨機放置在該等方陣中標記相同數字的座標上。 In some embodiments, step (d) further includes: randomly placing the i×j LED chips of the same wavelength range at the coordinates marked with the same number in the square array.
本發明的功效在於,本發明的LED晶粒混合方法能夠利用幻方配合波長區段將不同類型的LED晶粒(紅光、藍光和綠光)分配位置,因而能夠達成以下功效:其一,複數片LED印刷電路板之間的平均波長呈現一致,使得複數片LED印刷電路板之間的顏色均勻;其二,單一片LED印刷電路板內部的小區域的平均波長呈現一致,使得單一片LED印刷電路板的顏色均勻;其三,該等LED晶粒20不會因為震動混合而受到碰撞並造成損壞。
The effect of the present invention is that the LED chip mixing method of the present invention can use magic squares and wavelength segments to allocate positions of different types of LED chips (red light, blue light and green light), thereby achieving the following effects: first, the average wavelengths between multiple LED printed circuit boards are consistent, so that the colors between multiple LED printed circuit boards are uniform; second, the average wavelengths of small areas inside a single LED printed circuit board are consistent, so that the color of a single LED printed circuit board is uniform; third, the
10,10A:矩陣 10,10A: Matrix
11,11A:方陣 11,11A: Square array
111:座標 111: Coordinates
112:內方陣 112: Inner Square
121,122:對角線 121,122: diagonal
20:晶粒 20: Grain
30:波長區段 30: Wavelength range
L,W:邊長 L, W: side length
S10~S40:步驟 S10~S40: Steps
圖1是本發明的方法的流程圖。 Figure 1 is a flow chart of the method of the present invention.
圖2是本發明的方法的第一實施例的步驟S10和步驟S20的示意圖。 Figure 2 is a schematic diagram of step S10 and step S20 of the first embodiment of the method of the present invention.
圖3是本發明的方法的第一實施例的步驟S30的示意圖。 Figure 3 is a schematic diagram of step S30 of the first embodiment of the method of the present invention.
圖4至圖7是本發明的方法的第一實施例的步驟S40的示意圖。 Figures 4 to 7 are schematic diagrams of step S40 of the first embodiment of the method of the present invention.
圖8是本發明的方法的第二實施例的步驟S10和步驟S20的示意圖。 FIG8 is a schematic diagram of step S10 and step S20 of the second embodiment of the method of the present invention.
圖9是本發明的方法的第二實施例的步驟S30的示意圖。 FIG9 is a schematic diagram of step S30 of the second embodiment of the method of the present invention.
圖10至圖13是本發明的方法的第二實施例的步驟S40的示意圖。 Figures 10 to 13 are schematic diagrams of step S40 of the second embodiment of the method of the present invention.
以下配合圖式及元件符號對本發明的實施方式做更詳細的說明,俾使熟習該項技藝者在研讀本說明書後能據以實施。 The following is a more detailed description of the implementation of the present invention with the help of diagrams and component symbols, so that those who are familiar with the technology can implement it accordingly after reading this manual.
圖1是本發明的方法的流程圖。圖2是本發明的方法的第一實施例的步驟S10和步驟S20的示意圖。圖3是本發明的方法的第一實施例的步驟S30的示意圖。圖4至圖7是本發明的方法的第一實施例的步驟S40的示意圖。本發明提供一種LED晶粒混合方法,包括下列步驟: FIG1 is a flow chart of the method of the present invention. FIG2 is a schematic diagram of step S10 and step S20 of the first embodiment of the method of the present invention. FIG3 is a schematic diagram of step S30 of the first embodiment of the method of the present invention. FIG4 to FIG7 are schematic diagrams of step S40 of the first embodiment of the method of the present invention. The present invention provides a method for mixing LED chips, comprising the following steps:
步驟S10,如圖1及圖2所示,建立一個具有i列和j行的矩陣10,矩陣10包括i×j個元素,矩陣10內的每個元素具有n列和n行的方陣11,其中,i2,j2,n3,且i、j、n均為正整數。
Step S10, as shown in FIG. 1 and FIG. 2, a
步驟20,如圖1及圖2所示,利用幻方在各方陣11的n 2個座標111上分別標記數字1,2,...,n 2,使得各方陣11的每行、每列以及二條對角線的n個座
標111上標記的數字總和均等於。
步驟S30,如圖1及圖3所示,將複數個LED晶粒20依照波長分成n 2個波長區段30,且每個波長區段30包含i×j個LED晶粒20。
In step S30 , as shown in FIG. 1 and FIG. 3 , the plurality of
步驟S40,如圖1、圖4至圖7所示,將相同波長區段30的i×j個LED晶粒20分別放置在該等方陣11中標記相同數字的座標111上。
Step S40, as shown in FIG. 1, FIG. 4 to FIG. 7, i×
在第一實施例中,步驟S10,如圖2所示,建立一個具有四列和三行的矩陣10,矩陣10包括十二個元素,矩陣10內的每個元素為具有三列和三行的方陣11,其中,i=4,且j=3,所述幻方為奇數階幻方且n=3;步驟S20,如圖2所示,利用幻方在各方陣11的九個座標111上分別標記數字1,2,...,9,使得各方陣11的每行、每列以及二條對角線的三個座標111上標記的數字總和均等於十五;步驟S30,如圖3所示,將複數個LED晶粒20依照波長分成九個波長區段30(圖中僅顯示四個),且每個波長區段30包含十二個LED晶粒20;步驟S40,如圖4至圖7所示,相同波長區段30的十二個晶粒20分別放置在該等方陣11中標記相同數字的座標111上。
In the first embodiment, step S10, as shown in FIG. 2 , establishes a
進一步地說,在第一實施例中,圖4及圖5顯示十二個晶粒20(英文編碼為A~L)分別放置在該等方陣11中標記數字1的座標111上,圖6顯示十二個晶粒20(英文編碼為A~L)分別放置在該等方陣11中標記數字2的座標111上,圖7顯示十二個晶粒20(英文編碼為A~L)分別放置在該等方陣11中標記數字9的座標111上,以此類推。
Further, in the first embodiment, FIG. 4 and FIG. 5 show that twelve dies 20 (coded in English as A~L) are placed at
較佳地,步驟S20進一步包括:如圖2所示,該等方陣11的該等座標111所標記的數字的位置相同。舉例來說,在該等方陣11中,第一行從左至右
的座標111所標記的數字均為2、7、6,第二行從左至右的座標111所標記的數字均為9、5、1,第三行從左至右的座標111所標記的數字均為4、3、8,以此類推。
Preferably, step S20 further includes: as shown in FIG. 2 , the positions of the numbers marked by the
較佳地,步驟S40進一步包括:如圖4及圖5所示,將相同波長區段30的十二個晶粒20隨機放置在該等方陣11中標記相同數字的座標111上。舉例來說,將相同波長區段30的十二個晶粒20(英文編碼為A~L)隨機放置在該等方陣11中標記數字1的座標111上。
Preferably, step S40 further includes: as shown in FIG. 4 and FIG. 5, the twelve
圖8是本發明的方法的第二實施例的步驟S10和步驟S20的示意圖。圖9是本發明的方法的第二實施例的步驟S30的示意圖。圖10至圖13是本發明的方法的第二實施例的步驟S40的示意圖。第二實施例與第一實施例的差異在於:步驟S10進一步包括:所述幻方為偶數階幻方;步驟S20進一步包括:相鄰的二個方陣11A的任一對角線121的連續n個座標111上標記的數字總和等於
,各方陣11A內的任一2×2的內方陣112的座標111上標記的數字總和等於
2(n 2+1),各方陣11A內的任一對角線122的距離為座標單位的二個座標111上
標記的數字總和等於n 2+1,且矩陣10A的邊長L、W為4的倍數的座標單位。
FIG8 is a schematic diagram of step S10 and step S20 of the second embodiment of the method of the present invention. FIG9 is a schematic diagram of step S30 of the second embodiment of the method of the present invention. FIG10 to FIG13 are schematic diagrams of step S40 of the second embodiment of the method of the present invention. The difference between the second embodiment and the first embodiment is that: step S10 further includes: the magic square is an even-order magic square; step S20 further includes: the sum of the numbers marked on the
在第二實施例中,步驟S10,如圖8所示,建立一個具有四列和三行的矩陣10A,矩陣10A包括十二個元素,矩陣10A內的每個元素為具有四列和四行的方陣11A,其中,其中,i=4,且j=3,所述幻方為偶數階幻方且n=4;步驟S20,如圖8所示,利用幻方在各方陣11A的十二個座標111上分別標記數字1,2,...,16,使得各方陣11A的每行、每列以及二條對角線的四個座標111上標記的數字總和均等於三十四,相鄰的二個方陣11A的任一對角線121的連續四個座標111上標記的數字總和等於三十四,各方陣11A內的任一2×2的內方陣112的座標111上標記的數字總和等於三十四,各方陣11A內的任一對角線122的距離為二座標單位的二個座標111上標記的數字總和等於十七,且矩陣10A的長邊的邊長L為十六個座標單位,矩陣10A的短邊的邊長W為十二個座標單位;步驟S30,如圖9所示,將複數個LED晶粒20依照波長分成十六個波長區段30(圖中僅顯示四個),且每個波長區段30包含十二個LED晶粒20;步驟S40,如圖10至圖13所
示,相同波長區段30的十二個晶粒20分別放置在該等方陣11A中標記相同數字的座標111上。
In the second embodiment, step S10, as shown in FIG8 , establishes a
進一步地說,在第二實施例中,圖10及圖11顯示十二個晶粒20(英文編碼為A~L)分別放置在該等方陣11A中標記數字1的座標111上,圖12顯示十二個晶粒20(英文編碼為A~L)分別放置在該等方陣11A中標記數字2的座標111上,圖13顯示十二個晶粒20(英文編碼為A~L)分別放置在該等方陣11A中標記數字16的座標111上,以此類推。
Further, in the second embodiment, FIG. 10 and FIG. 11 show that twelve dies 20 (coded in English as A~L) are placed at
較佳地,步驟S20進一步包括:如圖8所示,該等方陣11A的該等座標111所標記的數字的位置相同。舉例來說,在該等方陣11A中,第一行從左至右的座標111所標記的數字均為1、15、10、8,第二行從左至右的座標111所標記的數字均為12、6、3、13,第三行從左至右的座標111所標記的數字均為7、9、16、2,第四行從左至右的座標111所標記的數字均為14、4、5、11,以此類推。
Preferably, step S20 further includes: as shown in FIG8 , the positions of the numbers marked by the
較佳地,步驟S40進一步包括:如圖10及圖11所示,將相同波長區段30的十二個晶粒20隨機放置在該等方陣11A中標記相同數字的座標111上。舉例來說,將相同波長區段30的十二個晶粒20(英文編碼為A~L)隨機放置在該等方陣11A中標記數字1的座標111上。
Preferably, step S40 further includes: as shown in FIG. 10 and FIG. 11 , randomly placing twelve
值得一提的是,各方陣11即為單一片LED印刷電路板,矩陣10即為一個LED燈箱,複數個燈箱即為一片LED顯示螢幕。
It is worth mentioning that each
綜上所述,本發明的LED晶粒混合方法能夠利用幻方配合波長區段將不同類型的LED晶粒20(紅光、藍光和綠光)分配位置,因而能夠達成以下功效:其一,複數片LED印刷電路板之間的平均波長呈現一致,使得複數片LED印刷電路板之間的顏色均勻;其二,單一片LED印刷電路板內部的小區域的平均波長呈現一致,使得單一片LED印刷電路板的顏色均勻;其三,該等LED晶粒20不會因為震動混合而受到碰撞並造成損壞。 In summary, the LED chip mixing method of the present invention can use magic squares and wavelength segments to allocate positions of different types of LED chips 20 (red light, blue light and green light), thereby achieving the following effects: first, the average wavelengths between multiple LED printed circuit boards are consistent, so that the colors between multiple LED printed circuit boards are uniform; second, the average wavelengths of small areas inside a single LED printed circuit board are consistent, so that the color of a single LED printed circuit board is uniform; third, the LED chips 20 will not be collided and damaged due to vibration mixing.
以上所述者僅為用以解釋本發明的較佳實施例,並非企圖據以對本發明做任何形式上的限制,是以,凡有在相同的發明精神下所作有關本發明的任何修飾或變更,皆仍應包括在本發明意圖保護的範疇。 The above is only used to explain the preferred embodiment of the present invention, and is not intended to limit the present invention in any form. Therefore, any modification or change of the present invention made under the same spirit of the invention should still be included in the scope of protection intended by the present invention.
S10~S40:步驟 S10~S40: Steps
Claims (10)
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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TW202036532A (en) * | 2019-01-25 | 2020-10-01 | 荷蘭商露明控股公司 | Hybrid driving scheme for rgb color tuning |
TW202205240A (en) * | 2020-04-06 | 2022-02-01 | 美商瑞克斯姆股份有限公司 | Display assemblies |
TW202217407A (en) * | 2020-10-16 | 2022-05-01 | 大陸商業成科技(成都)有限公司 | A backlight module and a layout method of light-emitting diodes |
TW202236545A (en) * | 2021-03-05 | 2022-09-16 | 台灣積體電路製造股份有限公司 | Semiconductor package and manufacturing method thereof |
TW202304036A (en) * | 2021-06-30 | 2023-01-16 | 比利時商巴可公司 | Pixel configuration in light emitting modules |
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW202036532A (en) * | 2019-01-25 | 2020-10-01 | 荷蘭商露明控股公司 | Hybrid driving scheme for rgb color tuning |
TW202205240A (en) * | 2020-04-06 | 2022-02-01 | 美商瑞克斯姆股份有限公司 | Display assemblies |
TW202217407A (en) * | 2020-10-16 | 2022-05-01 | 大陸商業成科技(成都)有限公司 | A backlight module and a layout method of light-emitting diodes |
TW202236545A (en) * | 2021-03-05 | 2022-09-16 | 台灣積體電路製造股份有限公司 | Semiconductor package and manufacturing method thereof |
TW202304036A (en) * | 2021-06-30 | 2023-01-16 | 比利時商巴可公司 | Pixel configuration in light emitting modules |
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