TWI850928B - Testing method for temperature detection integrated circuit and test device thereof - Google Patents

Abstract

The present invention relates to a testing method for temperature detection integrated circuit and a test device thereof. The testing method includes: setting a specific temperature on a temperature test device; transporting a golden IC and a plurality of ICs to be tested into the temperature test device; acquiring an offset value according to the setting temperature and an output temperature of the golden IC; acquiring a plurality of temperature testing value by output temperature of the IC to be tested deducting the offset value; and qualifying IC(s) which output temperature value in the qualified range.

Description

Test calibration method for integrated circuit with temperature test function and test device using the same

The present invention relates to a testing technology for integrated circuits, and in particular to a testing calibration method for integrated circuits with a temperature testing function and a testing device using the same.

For integrated circuits with temperature application functions, the current commonly used method for integrated circuit temperature testing is to define an ideal temperature, such as 25°C, and use a certain range of positive and negative temperature of this ideal temperature as the judgment standard for whether the temperature test has passed, such as 25°C+/-3°C=22°C~28°C, and install a standard sample integrated circuit (Golden Sample IC or Golden IC) as a reference standard on the integrated circuit test load board (Load Board). There is a premise here that the standard sample integrated circuit is not absolutely 100% accurate, but it has more accurate characteristics than other tested integrated circuits, so users trust it and take its test results as a reference standard. In addition, the standard sample integrated circuit and the tested integrated circuit are not necessarily the same product. For example, the tested integrated circuit is the integrated circuit of Company A, and the standard sample integrated circuit is the integrated circuit of Company B. Adjustments are made based on the test results of the standard sample integrated circuit so that the final test results of the standard sample integrated circuit itself are close to the defined ideal temperature. After the adjustment rules are determined, all tested integrated circuits will adjust the test results according to the determined adjustment rules when performing temperature tests.

For example, the tested integrated circuit of Company B needs to be tested at 25℃. At this time, the temperature test specification is 25℃+/-3℃=22℃~28℃. The integrated circuit of Company A is selected as the standard sample integrated circuit for temperature test. The test procedure is to first perform temperature test on the standard sample integrated circuit to obtain adjustment data for subsequent tests. First, the test results of the standard sample integrated circuit of Company A are adjusted to be close to the defined ideal temperature, and then the adjustment rules are applied to the temperature test of the tested integrated circuit IC of Company B. Assume that the temperature test result of the standard sample integrated circuit of company A is 24℃, then the adjustment value of the standard sample integrated circuit is 25℃-24℃=1℃. The user adds the offset value 1 to the test value (24) of the standard sample integrated circuit to get 25 as the adjustment rule. After that, all the tested integrated circuits will add 1 to their temperature test value as the final test result. As long as this final result meets the aforementioned temperature test specification of 22℃~28℃, it has passed the temperature test. Otherwise, it has failed the temperature test. The integrated circuit that has failed the temperature test will no longer undergo other functional tests and will be directly classified as a defective product and cannot be shipped. Assuming that the temperature test result of the tested integrated circuit is 21℃, then the final test result of the tested integrated circuit IC (that is, the adjusted junction) is 21℃+1℃=22℃. 22℃ meets the test specifications, and the integrated circuit passes the temperature test.

The above test method ignores an environmental variable. It should be noted that the ideal temperature defined above is a temperature target provided by the processing host (Handler), one of the test equipment. For example, the processing host sets the test environment temperature to 25℃, and the relevant components inside the processing host monitor the temperature changes at any time while providing 25℃, so that the temperature provided by it is as close as possible to a certain temperature range. Even if there is a temperature change difference, it will not be too large. The temperature change difference here is an environmental variable, which makes different time points, different tested integrated circuits, located in the same mechanical position, face different environmental temperature differences. Usually, the test equipment cannot provide absolute accuracy for the set parameter targets, but can only provide relative accuracy. For example, the processing host guarantees that the temperature error displayed by the equipment is +/-0.5℃. For example, the temperature display panel shows a temperature of 25℃, and the guaranteed temperature is 25℃+/-0.5℃=24.5℃~25.5℃. This guaranteed temperature range can only be maintained through the temperature monitoring of the equipment itself. If there is no temperature monitoring mechanism, the temperature provided by the processing host will have a very large error, which may be as large as the indoor ambient temperature outside the processing host, ranging from 22℃~28℃.

Therefore, the processing host provides a temperature target (target), and the standard sample integrated circuit (bow and arrow) provides a method to approach the temperature target (adjustment and correction). Therefore, as mentioned above, the standard sample integrated circuit is generally installed on a load board outside the processing host. Board) will cause the standard sample integrated circuit and the tested integrated circuit to be in different temperature environments. For example, the tested integrated circuit is located inside the processing host for testing, and the processing host temperature is displayed as 24.5℃; the standard sample integrated circuit is located outside the processing host for testing, and the external temperature of the processing host may be 22℃. The standard sample integrated circuit located in the 22℃ environment is used to replace the tested integrated circuit located in the 25℃ environment to adjust the temperature test results. This ignores the difference in another environmental variable and blindly pursues the beautification of the temperature number 25, ignoring the impact on the actual environmental temperature. For IC temperature testing with high accuracy requirements, it will be a quality hazard. For example: the standard sample integrated circuit on the carrier board is located in an environment of 22℃, and the temperature test value of the standard sample integrated circuit is 21℃. According to the temperature test target of 25℃, the adjustment value of the standard sample integrated circuit is 25℃-21℃=4℃, and the tested integrated circuit inside the processing host is located in an environment of 25.5C. The temperature test value of the tested integrated circuit is 26℃. The final test result is 26℃+4℃=30℃. If 22℃~28℃ is used as the test specification, it means that the temperature test has not passed, and the tested integrated circuit will be treated as a defective product. However, let's further assume that if the standard sample integrated circuit and the tested integrated circuit are both placed inside the processing host, the temperature test value of the standard sample integrated circuit should be around 25°C. In this way, the temperature test value of the tested integrated circuit plus the adjustment value will also be much lower than 30°C, so it can pass the temperature test.

The present invention provides a test calibration method for an integrated circuit with a temperature test function and a test device using the same, which is used to more accurately determine whether the tested integrated circuit meets the specifications and reduce misjudgment, thereby saving costs and increasing yield.

The embodiment of the present invention provides a test calibration method for an integrated circuit with a test temperature function, and the test calibration method for an integrated circuit with a test temperature function includes: setting a temperature test device to a specified test temperature; transporting a standard sample integrated circuit and a plurality of tested integrated circuits into a temperature test device; reading a deviation value according to the temperature tested by the standard sample integrated circuit and the set specified test temperature; deducting the deviation value from the temperature output by each tested integrated circuit to obtain a plurality of corresponding temperature test values; and treating the tested integrated circuit corresponding to the temperature test value within the qualified range specification among the temperature test values as a qualified integrated circuit.

According to the test calibration method of the integrated circuit with the test temperature function described in the preferred embodiment of the present invention, when the tested integrated circuit is transported into the temperature test device, it further includes: measuring the regional temperature corresponding to each of the tested integrated circuits through the transport equipment; transmitting the regional temperature corresponding to the tested integrated circuits to the test host; and using a preset range of the regional temperature as the qualified range specification corresponding to the above-mentioned tested integrated circuit.

According to the test calibration method of the integrated circuit with the test temperature function described in the preferred embodiment of the present invention, the transport equipment includes a plurality of integrated circuit attraction devices, wherein each of the integrated circuit attraction devices includes a temperature measuring device, which is used to measure the temperature of the area corresponding to each of the tested integrated circuits when each of the tested integrated circuits is placed.

The embodiment of the present invention further provides a test calibration method for an integrated circuit having a test temperature function, the test calibration method for an integrated circuit having a test temperature function comprising: setting a temperature test device to a specified test temperature; transporting a plurality of tested integrated circuits into a temperature test device; when transporting the tested integrated circuits into the temperature test device, measuring the corresponding location of each of the tested integrated circuits through the transport equipment. The regional temperatures corresponding to the tested integrated circuits are transmitted to the test host; a preset range of the regional temperatures is used as the qualified range specification corresponding to the tested integrated circuits; the temperature output by each tested integrated circuit is used as the corresponding plurality of temperature test values; and the tested integrated circuit corresponding to the temperature test value within the qualified range specification among the temperature test values is used as a qualified integrated circuit.

According to the test calibration method of the integrated circuit with the test temperature function described in the preferred embodiment of the present invention, the transport equipment includes a plurality of integrated circuit attraction devices, wherein each of the integrated circuit attraction devices includes a temperature measuring device, which is used to measure the temperature of the area corresponding to each of the tested integrated circuits when each of the tested integrated circuits is placed.

According to the test and calibration method of the integrated circuit with the test temperature function described in the preferred embodiment of the present invention, the test and calibration method of the integrated circuit with the test temperature function further includes: transporting a standard sample integrated circuit and the plurality of tested integrated circuits into a temperature testing device; and reading out a deviation value according to the temperature tested by the standard sample integrated circuit and the set designated test temperature.

According to the test calibration method of the integrated circuit with the test temperature function described in the preferred embodiment of the present invention, the temperature output by each tested integrated circuit is used as a corresponding plurality of temperature test values, including: deducting the deviation value from the temperature output by each tested integrated circuit to obtain the corresponding plurality of temperature test values.

An embodiment of the present invention further provides a temperature testing device, which includes a processing host and a test host. The processing host includes a test chamber and a plurality of test benches. The test chamber is used to provide and maintain a specified test temperature. The test bench is configured in the test chamber to accommodate a plurality of tested integrated circuits. The test host receives feedback information from the processing host to determine whether the tested integrated circuit meets the specifications. The standard sample integrated circuit and the above-mentioned tested integrated circuit are transported into the test chamber. Based on the temperature tested by the standard sample integrated circuit and the set specified test temperature, a deviation value is read out and sent back to the test host. The processing host returns the temperature output by each tested integrated circuit. The test host deducts the deviation value from the temperature output by each tested integrated circuit to obtain the corresponding multiple temperature test values, and takes the tested integrated circuits corresponding to the temperature test values within the qualified range among these temperature test values as the tested integrated circuits that meet the specifications.

According to the temperature testing device described in the preferred embodiment of the present invention, the processing host further includes a plurality of transport integrated circuit devices, wherein when the transport integrated circuit devices place the tested integrated circuits on the corresponding test benches, the transport integrated circuit devices measure the regional temperature corresponding to each of the tested integrated circuits. The processing host transmits the regional temperatures corresponding to the tested integrated circuits to the test host. The test host uses a preset range of the regional temperatures as the qualified range specification corresponding to the tested integrated circuits. The test host uses the temperature output by each tested integrated circuit, minus the deviation value, as the corresponding plurality of temperature test values. The test host regards the tested integrated circuit corresponding to the temperature test value within the corresponding qualified range specification among the above temperature test values as a qualified integrated circuit.

An embodiment of the present invention further provides a temperature testing device, which includes a processing host and a test host. The processing host includes a test chamber and a plurality of test benches. The test chamber is used to provide and maintain a specified test temperature. The test bench is configured in the test chamber to accommodate a plurality of tested integrated circuits. The test host receives feedback information from the processing host to determine whether the tested integrated circuits meet the specifications. The processing host transmits the regional temperatures corresponding to the tested integrated circuits to the test host. The test host uses a preset range of the regional temperatures as the qualified range specification corresponding to the above-mentioned tested integrated circuits. The test host uses the temperature output by each tested integrated circuit as the corresponding multiple temperature test values. The test host uses the tested integrated circuit corresponding to the temperature test value within the corresponding qualified range specification among these temperature test values as a qualified integrated circuit.

According to the temperature testing device described in the preferred embodiment of the present invention, the processing host further includes a plurality of transport integrated circuit devices, wherein when the transport integrated circuit devices place the tested integrated circuits on the corresponding test bench, the transport integrated circuit devices measure the temperature of the area corresponding to each of the tested integrated circuits.

According to the temperature testing device described in the preferred embodiment of the present invention, the above-mentioned standard sample integrated circuit and the tested integrated circuits are transported into the test chamber. According to the temperature tested by the standard sample integrated circuit and the set specified test temperature, a deviation value is read out and sent back to the test host. The test host deducts the deviation value from the temperature output by each tested integrated circuit to obtain a corresponding plurality of temperature test values.

In summary, one embodiment of the present invention uses a standard sample integrated circuit and a tested integrated circuit to be simultaneously sent to a temperature testing device, so that the standard sample integrated circuit and the tested integrated circuit are in the same environment, and the temperature value output by the standard sample integrated circuit is read out, thereby comparing it with the temperature to be tested to find out the offset value, and the output temperature of the tested integrated circuit is corrected by the offset value to determine whether the tested integrated circuit is qualified. In addition, in another embodiment of the present invention, the temperature testing device before measuring the tested integrated circuit, it will first measure the temperature of the area near the tested integrated circuit, thereby obtaining the qualified temperature range corresponding to each tested integrated circuit. In this way, the test error can be reduced and the test accuracy can be increased.

In order to further understand the technology, means and effects of the present invention, you can refer to the following detailed description and drawings, so that you can thoroughly and specifically understand the purpose, features and concepts of the present invention. However, the following detailed description and drawings are only used for reference and explanation of the implementation of the present invention, and are not used to limit the present invention.

10:Host processing

11: Test host

101:Testing room

102: Test bench

103: Integrated circuit suction head

104: Tested integrated circuit

105: Standard sample integrated circuit (Golden IC)

S201~S206, S301~S308, S401~S408: The steps of the test calibration method of an integrated circuit with a temperature test function according to an embodiment of the present invention

The attached figures are provided to enable a person having ordinary knowledge in the technical field to which the present invention belongs to further understand the present invention, and are incorporated into and constitute a part of the specification of the present invention. The attached figures show exemplary embodiments of the present invention, and are used together with the specification of the present invention to explain the principles of the present invention.

Figure 1 is a schematic diagram of a temperature testing device according to an embodiment of the present invention.

FIG2 is a flow chart of a test calibration method for an integrated circuit with a temperature test function according to a preferred embodiment of the present invention.

FIG3 is a flow chart of a test calibration method for an integrated circuit with a temperature test function according to a preferred embodiment of the present invention.

FIG4 is a flow chart of a test calibration method for an integrated circuit with a temperature test function according to a preferred embodiment of the present invention.

Now, we will refer to the exemplary embodiments of the present invention in detail, which will be illustrated in the attached drawings. Where possible, the same element symbols are used in the attached drawings and the specification to refer to the same or similar parts. In addition, the exemplary embodiments are only one of the ways to realize the design concept of the present invention, and the following examples are not used to limit the present invention.

Although the temperature test method in the prior art is easy to operate, it has defects in the test machine and test procedure. For example, the standard sample integrated circuit is configured outside the temperature test device, and the tested integrated circuit is set inside the temperature test device. Under different environmental conditions, many tested integrated circuits that should have been good products are mistakenly judged as defective products. Moreover, many tested integrated circuits that should have been judged as defective products are mistakenly judged as good products. In addition to causing cost increases, it is also easy to cause downstream customers to distrust the product. The following proposes a temperature test device and a test calibration method for an integrated circuit with a temperature test function to improve the shortcomings of the prior art.

FIG1 is a schematic diagram of a temperature testing device according to an embodiment of the present invention. Referring to FIG1 , the temperature testing device includes a processing host 10 and a testing host 11. The processing host 10 includes a testing chamber 101, a plurality of testing benches 102, and an integrated circuit suction head 103. The testing chamber 101 is used to provide and maintain a specified testing temperature. The testing bench 102 is disposed in the testing chamber 101 to accommodate a plurality of tested integrated circuits 104. The testing host 11 receives feedback information from the processing host 10 to determine whether the tested integrated circuit 104 meets the specifications. In this embodiment, the standard sample integrated circuit (Golden IC) 105 and the above-mentioned multiple tested integrated circuits 104 are transported into the test chamber 101 at the same time, so in this embodiment, the standard sample integrated circuit (Golden IC) 105 and the above-mentioned multiple tested integrated circuits 104 are set in the same environment.

In addition, in this embodiment, the set designated test temperature and the temperature output by the standard sample integrated circuit 105 are transmitted back to the test host 11 via a wireless transmission protocol (e.g., a radio frequency identification transmission protocol). The test host 11 records the temperature output by the standard sample integrated circuit 105, and uses the difference between the set designated test temperature and the temperature output by the standard sample integrated circuit 105 as a deviation value. In this embodiment, the processing host 10 transmits the temperature output by each tested integrated circuit 104, including the temperature output by the standard sample integrated circuit 105, back to the test host 11. The test host 11 deducts the above deviation value from the temperature output by each tested integrated circuit 104 to obtain a plurality of corresponding temperature test values, and uses them to confirm whether each tested integrated circuit 104 has passed the test.

For example, the internal temperature of the test chamber 101 is set to 25°C, and the temperature of the standard sample integrated circuit (Golden IC) 105 is tested to be 24.8°C, so in this embodiment, the deviation value is negative 0.2°C. The test specification is, for example, 22°C to 28°C. If at this time, the temperature output by one of the tested integrated circuits 104 is 27.9°C, after deducting the deviation value of negative 0.2°C from the output temperature of 27.9°C, the corrected temperature test value is 28.1°C. This temperature test value exceeds the test specification, so it will be judged as unqualified. Assume that the temperature output by another tested integrated circuit 104 is 22.1℃. After deducting the deviation value of -0.2℃ from this output temperature of 22.1℃, the corrected temperature test value is 22.3℃. This temperature test value is within the test specification and will be judged as qualified.

Although the above preferred embodiment solves the misjudgment caused by the standard sample integrated circuit (Golden IC) 105 and the tested integrated circuit 104 being configured in different environments, in addition to the above situation, there is a high possibility that the temperature set inside the test chamber 101 and the temperature near the standard sample integrated circuit 105 or the tested integrated circuit 104 will have errors. Such errors often lead to the problem of misjudgment. Therefore, the present invention proposes another preferred embodiment of the test calibration method of the integrated circuit with the test temperature function.

In the following embodiments, the test chamber 101 also provides an ideal temperature target, but the test chamber 101 is not limited to reaching the perfect ideal temperature, because the final temperature test specification is floating, and the actual test chamber 101 temperature plus or minus a certain range is used as the test specification of the current test integrated circuit 104. In this way, there is no need to worry about the temperature drift of the test chamber 101, because the test chamber 101 temperature changes, the test specification also changes, and the temperature sensed by the tested integrated circuit 104 with normal function should also change accordingly.

Among the components of the processing host 10, those related to providing temperature heating are: the heating tray, the shuttle, and the integrated circuit suction head 103 in the test area. In this case, the temperature of the integrated circuit suction head 103 in the test area of the processing host 10 is used as the basis for temperature test calculation. After the integrated circuit suction head 103 moves the standard sample integrated circuit (Golden IC) 105 and the above-mentioned multiple tested integrated circuits 104 downward so that the tested integrated circuits enter the test position (test platform 102), the temperature of each position where the integrated circuit is placed is tested. Afterwards, the above-measured regional temperature (temperature measured by the integrated circuit suction head 103) is added or subtracted by a certain range as the test specification. For example, the internal temperature of the test chamber 101 is set to 25°C, but the temperature measured by a specific integrated circuit suction head 103 is 24.5°C. Afterwards, the test host 11 receives the temperature of 24.5℃ measured by the above-mentioned specific integrated circuit suction head 103, and uses +/-1℃ as the test specification. The test specification is (24.5℃-1℃)~(24.5℃+1℃)=23.5℃~25.5℃, which means that the tested integrated circuit 104 corresponding to the specific integrated circuit suction head 103 undergoes a series of temperature test result adjustments during the temperature test process. If the output temperature finally meets this specification, it passes the temperature test.

In the above embodiment, the test temperature is transmitted between the processing host 10 and the test host 11 by wireless transmission. For example, a radio frequency identification writing/reading device (RFID Writer/Reader) or a transmission circuit such as Wi-Fi or Bluetooth is configured in the computer host of the processing host 10 and the test host 11, respectively, and the application software compatible with the computer host operating system of the processing host 10 and the test host 11 is used to capture, transmit, and receive the temperature data of the processing host 10 in real time or according to the data update frequency set by the software. Then, the reading device on the computer host side of the test host 11 reads the data or the Wi-Fi receiver receives the file, and the data is written into a file through the interface software, waiting to be called and used by the temperature test program of the test host 11.

In this embodiment, the detailed method of the modified temperature test combining the above two embodiments is as follows. First, the standard sample integrated circuit (Golden IC) 105 and the tested integrated circuit 104 are sent from the feeding area of the processing host 10 to the heating tray of the processing host 10 for preheating. After that, the standard sample integrated circuit 105 and the tested integrated circuit 104 are placed on the transfer shuttle, and the transfer shuttle transfers the standard sample integrated circuit 105 and the tested integrated circuit 104 to the test chamber 101. The integrated circuit suction head 103 of the test chamber 101 places the standard sample integrated circuit 105 and the tested integrated circuit 104 from the transfer shuttle to the test position. Taking the configuration of FIG. 1 as an example, the standard sample integrated circuit 105 is placed at the first position corresponding to Head 1 in the suction head 103, and the tested integrated circuit 104 is placed at the second position corresponding to Head 2 in the suction head 103. The processing host 10 extracts the temperature of Head 1: 26.6, and the temperature of Head 2: 26.3. The processing host 10 writes the temperature of Head 1: 26.6°C and the temperature of Head 2: 26.3°C into the RF identification tag. The RF identification reader of the test host 11 reads the RF identification tag of the computer host of the processing host 10, obtains the temperature of Head 1 of 26.6°C and the temperature of Head 2 of 26.3°C, and writes the temperature of Head 1 of 26.6°C and the temperature of Head 2 of 26.3°C into a temporary file File_Head. The processing host 10 and the test host 11 start to execute the temperature test program dedicated to the standard sample integrated circuit. In this embodiment, for example, the temperature measurement value of the standard sample integrated circuit 105 is measured to be 26.5°C, and this temperature measurement value 26.5°C is temporarily stored in the variable Golden_Temp declared in the test program. The test program opens the temporary file File_Head, reads the temperature of Head1 (26.6°C) and Head2 (26.3°C), and temporarily stores 26.6°C in the variable Head1_Temp and 26.3°C in the variable Head2_Temp declared in the test program. The test program calculates the temperature test specification applicable to the tested integrated circuit as follows: Head2_Temp+2=26.3+2=28.3°C, and this 28.3°C is temporarily stored in the variable Spec_Max declared in the test program; Head2_Temp-2=26.3-2=24.3°C, and 24.3°C is temporarily stored in the variable Spec_Min declared in the test program. The test program calculates the temperature adjustment value of the standard sample integrated circuit 105: Golden_Temp-Head1_Temp=26.5-26.6=-0.1℃. This -0.1℃ is temporarily stored in the variable Golden_Offset declared by the test program.

After that, a dedicated temperature test procedure is started for the tested integrated circuit 104. In this embodiment, for example, the output temperature value of the tested integrated circuit 104 is measured to be 27.5°C, and this 27.5°C is temporarily stored in the variable IC_Temp declared by the test procedure. The test program calculates the final temperature result of the tested integrated circuit 104 after adjustment: IC_Temp-Golden_Offset=27.5-(-0.1)=27.6, and this 27.6°C is temporarily stored in the variable IC_Temp_Final declared by the test program. The test program determines whether the tested integrated circuit 104 passes the temperature test according to the following judgment formula: Spec_Min<IC_Temp_Final<Spec_Max, 24.3°C<27.6°C<28.3°C. Therefore, the tested integrated circuit 104 passes the temperature test. Afterwards, the tested integrated circuit 104 will be classified into the discharge area.

All the tested integrated circuits 104 repeat the above steps until the test of all integrated circuits is completed. The purpose of the operation process and method of this case is to allow all integrated circuits with temperature sensing application functions to sense the actual ambient temperature during temperature testing, and use the adjustment value of the standard sample integrated circuit to correct the temperature sensing result, so as to ensure that each integrated circuit that passes the temperature test has a more accurate temperature sensing capability than the current general practice.

In the above embodiment, although a tested integrated circuit 104 is used as an example, in actual use, it can be used for multiple tested integrated circuits 104 simultaneously or in a time-division multiplexing manner. Therefore, the present invention is not limited to this. In addition, the above test procedure is for each tested integrated circuit. The temperature measured by the suction head is plus or minus 2°C as the temperature test specification range. In actual use, the temperature test specification can also be plus or minus 1°C as the temperature test specification range. Therefore, the present invention does not limit the temperature test specification range. As long as the actual temperature is measured by the suction head, the temperature test specification is adaptively adjusted, which should belong to the scope of the present invention.

According to the above-mentioned embodiments, the present invention can be summarized as a test and calibration method for an integrated circuit with a test temperature function. FIG2 is a flow chart of a test and calibration method for an integrated circuit with a test temperature function according to a preferred embodiment of the present invention. Referring to FIG2, the test and calibration method for an integrated circuit with a test temperature function includes the following steps:

Step S201: Start.

Step S202: Set a temperature testing device to a specified testing temperature.

Step S203: transport a standard sample integrated circuit and multiple tested integrated circuits into a temperature testing device. As in the above embodiment, the standard sample integrated circuit 105 and the tested integrated circuit 104 both enter the testing chamber 101.

Step S204: Read out an offset value (Offset) based on the temperature tested by the standard sample integrated circuit 105 and the set designated test temperature.

Step S205: Subtract the deviation value from the temperature output by each tested integrated circuit to obtain a plurality of corresponding temperature test values.

Step S206: The tested integrated circuit corresponding to the temperature test value within the qualified range specification among the temperature test values is regarded as a qualified integrated circuit.

The above-mentioned embodiment is an embodiment in which the standard sample integrated circuit 105 and the tested integrated circuit 104 are placed under the same conditions. The following is a temperature test embodiment of a floating specification. FIG3 is a flow chart of a test and calibration method for an integrated circuit with a test temperature function according to a preferred embodiment of the present invention. Please refer to FIG3. This test and calibration method for an integrated circuit with a test temperature function includes the following steps:

Step S301: Start.

Step S302: Set a temperature testing device to a specified testing temperature.

Step S303: transport multiple tested integrated circuits into a temperature testing device.

Step S304: When the tested integrated circuit is transported into the temperature testing device, the temperature of the area corresponding to each tested integrated circuit is measured through the transport equipment. As described in the above embodiment, in this embodiment, the standard sample integrated circuit is not necessary. Even if there is no standard sample integrated circuit.

Step S305: Transmit the regional temperature corresponding to the tested integrated circuit to the test host.

Step S306: A preset range of the temperature in the above-mentioned area is used as the qualified range specification corresponding to the above-mentioned tested integrated circuit. As described in the above-mentioned embodiment, after the test host 11 receives the temperature of 24.5℃ measured by the above-mentioned specific integrated circuit suction head 103, +/-1℃ is used as the test specification, and the test specification is (24.5℃-1℃)~(24.5℃+1℃)=23.5℃~25.5℃.

Step S307: The temperature output by each tested integrated circuit is used as the corresponding plurality of temperature test values.

Step S308: The tested integrated circuit corresponding to the temperature test value within the qualified range specification is regarded as a qualified integrated circuit.

The above-mentioned embodiment is an embodiment in which each tested integrated circuit 104 has a test area temperature and adopts a floating specification. The following is a temperature test embodiment with a mixed floating specification and placing a standard sample integrated circuit (Golden IC) in the same environment. FIG4 is a flow chart of a test and calibration method for an integrated circuit with a test temperature function in a preferred embodiment of the present invention. Please refer to FIG4. This test and calibration method for an integrated circuit with a test temperature function includes the following steps:

Step S401: Start.

Step S402: Set a temperature testing device to a specified testing temperature.

Step S403: transport a standard sample integrated circuit and a plurality of tested integrated circuits into a temperature testing device.

Step S404: Read out a deviation value based on the regional temperature of the standard sample integrated circuit and the temperature tested by the standard sample integrated circuit. For example, the temperature of Head1 in the above embodiment is 26.6°C; the temperature measurement value (Golden_Temp) of the standard sample integrated circuit 105 is 26.5°C, and a deviation value (Golden_Offset) of -0.1°C is obtained.

Step S405: Measure the temperature of the area corresponding to each tested integrated circuit.

Step S406: Use a preset range of the temperature in the above-mentioned area as the qualified range specification corresponding to the above-mentioned tested integrated circuit.

Step S407: Deduct the deviation value from the temperature output by each tested integrated circuit to obtain the corresponding multiple temperature test values. As described in the above embodiment, IC_Temp-Golden_Offset=27.5-(-0.1)=27.6, and this 27.6℃ is temporarily stored in the variable IC_Temp_Final declared by the test program.

Step S408: The tested integrated circuit corresponding to the temperature test value within the qualified range specification among the temperature test values is regarded as a qualified integrated circuit.

In summary, one embodiment of the present invention utilizes the method of simultaneously sending a standard sample integrated circuit and a tested integrated circuit into a temperature testing device, placing the standard sample integrated circuit and the tested integrated circuit in the same environment, and reading the temperature value output by the standard sample integrated circuit, thereby comparing it with the temperature to be tested to find out the offset value, and using the offset value to correct the output temperature of the tested integrated circuit to determine whether the tested integrated circuit is qualified. In addition, in another embodiment of the present invention, the temperature testing device will first measure the temperature of the area near the tested integrated circuit before measuring the tested integrated circuit, thereby obtaining the qualified temperature range corresponding to each tested integrated circuit. In this way, the test error can be reduced and the test accuracy can be increased.

It should be understood that the examples and embodiments described herein are for illustrative purposes only, and that various modifications or changes thereto will be suggested to those skilled in the art and are to be included within the spirit and scope of the present application and the scope of the appended claims.

S301~S308: Process steps of a test calibration method for an integrated circuit with a test temperature function according to a preferred embodiment of the present invention

Claims (8)

A test calibration method for an integrated circuit with a test temperature function, comprising: setting a temperature test device to a specified test temperature; transporting a standard sample integrated circuit and a plurality of tested integrated circuits into the temperature test device; obtaining a deviation value according to the temperature tested by the standard sample integrated circuit and the set specified test temperature; deducting the deviation value from the temperature output by each tested integrated circuit to obtain a plurality of corresponding temperature test values; and In the test value, the tested integrated circuit corresponding to the temperature test value within the qualified range specification is regarded as a qualified integrated circuit, wherein when the tested integrated circuit is transported into the temperature testing device, it further includes: measuring the regional temperature corresponding to each of the tested integrated circuits through the transportation equipment; transmitting the regional temperature corresponding to the tested integrated circuits to the test host; and using a preset range of the regional temperature as the qualified range specification corresponding to the above-mentioned tested integrated circuit. According to the test calibration method of the integrated circuit with the test temperature function described in claim 1, the transport equipment includes a plurality of integrated circuit attraction devices, wherein each of the integrated circuit attraction devices includes a temperature measuring device for measuring the temperature of the area corresponding to each of the tested integrated circuits when placing each of the tested integrated circuits. A test calibration method for an integrated circuit with a test temperature function includes: setting a temperature test device to a specified test temperature; transporting a plurality of tested integrated circuits into the temperature test device; when transporting the tested integrated circuits into the temperature test device, measuring the temperature of the area corresponding to each of the tested integrated circuits through the transport equipment; The regional temperatures are transmitted to the test host; a preset range of the regional temperatures is used as the qualified range specification corresponding to the above-mentioned tested integrated circuit; the temperature output by each tested integrated circuit is used as the corresponding plurality of temperature test values; and the tested integrated circuit corresponding to the temperature test value within the qualified range specification among the temperature test values is used as a qualified integrated circuit. The test calibration method for an integrated circuit with a temperature test function according to claim 3 further includes: transporting a standard sample integrated circuit and the plurality of tested integrated circuits into the temperature test device; and obtaining a deviation value according to the temperature tested by the standard sample integrated circuit and the temperature of the area corresponding to the standard sample integrated circuit. A temperature test device comprises: a processing host, including: a test chamber for providing and maintaining a specified test temperature; and a plurality of test benches, arranged in the test chamber, for accommodating a plurality of tested integrated circuits; a test host, receiving feedback information from the processing host to determine whether the tested integrated circuits meet the specifications; wherein a standard sample integrated circuit and the tested integrated circuits are transported into the test chamber; The processing host returns the temperature output by each tested integrated circuit and the temperature tested by the standard sample integrated circuit; wherein a deviation value is obtained according to the temperature tested by the standard sample integrated circuit and the set specified test temperature; wherein the test host deducts the deviation value from the temperature output by each tested integrated circuit to obtain a plurality of corresponding temperature test values, and among the temperature test values, the temperature within the qualified range is The tested integrated circuits corresponding to the test values are taken as the tested integrated circuits that meet the specifications, wherein the processing host further comprises: a plurality of transport integrated circuit devices, wherein when the transport integrated circuit devices place the tested integrated circuits on the corresponding test benches, the transport integrated circuit devices measure the temperature of the regions corresponding to each of the tested integrated circuits; wherein the processing host transmits the temperatures of the regions corresponding to the tested integrated circuits to the testing host; wherein , the test host uses a preset range of the temperature of the regions as the qualified range specification corresponding to the above-mentioned tested integrated circuit; Wherein, the test host uses the temperature output by each tested integrated circuit, minus the deviation value, as the corresponding plurality of temperature test values; and wherein, the test host uses the tested integrated circuit corresponding to the temperature test value within the corresponding qualified range specification among the temperature test values as a qualified integrated circuit. A temperature testing device comprises: a processing host, comprising: a test chamber for providing and maintaining a specified test temperature; and a plurality of test benches, arranged in the test chamber, for accommodating a plurality of tested integrated circuits; a test host, receiving feedback information from the processing host to determine whether the tested integrated circuits meet the specifications; wherein the processing host transmits the regional temperatures corresponding to the tested integrated circuits to the test host The test host uses a preset range of the temperatures of the regions as the qualified range specification corresponding to the above-mentioned tested integrated circuit; the test host uses the temperature output by each tested integrated circuit as the corresponding plurality of temperature test values; and the test host uses the tested integrated circuit corresponding to the temperature test value within the corresponding qualified range specification among the temperature test values as a qualified integrated circuit. According to the temperature test device described in claim 6, the processing host further includes: A plurality of transport integrated circuit devices, wherein when the transport integrated circuit devices place the tested integrated circuits on corresponding test platforms, the transport integrated circuit devices measure the temperature of the area corresponding to each of the tested integrated circuits. According to the temperature testing device described in claim 6, a standard sample integrated circuit and the tested integrated circuits are transported into the test chamber; the processing host returns the temperature output by each tested integrated circuit and the temperature tested by the standard sample integrated circuit; a deviation value is obtained according to the temperature tested by the standard sample integrated circuit and the temperature of the region corresponding to the standard sample integrated circuit; the test host deducts the deviation value from the temperature output by each tested integrated circuit to obtain a plurality of corresponding temperature test values.