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TWI850683B - Intermediary apparatus of handler for testing electronic component and operating method thereof - Google Patents

Intermediary apparatus of handler for testing electronic component and operating method thereof Download PDF

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Publication number
TWI850683B
TWI850683B TW111123399A TW111123399A TWI850683B TW I850683 B TWI850683 B TW I850683B TW 111123399 A TW111123399 A TW 111123399A TW 111123399 A TW111123399 A TW 111123399A TW I850683 B TWI850683 B TW I850683B
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Taiwan
Prior art keywords
electronic component
adapter
support
relay device
sorting machine
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TW111123399A
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Chinese (zh)
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TW202302227A (en
Inventor
羅閏成
趙永煥
朴承吉
金索比
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韓商泰克元股份有限公司
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Priority claimed from KR1020210083868A external-priority patent/KR20230001222A/en
Priority claimed from KR1020220059159A external-priority patent/KR20230159152A/en
Application filed by 韓商泰克元股份有限公司 filed Critical 韓商泰克元股份有限公司
Publication of TW202302227A publication Critical patent/TW202302227A/en
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Publication of TWI850683B publication Critical patent/TWI850683B/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B07SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07CPOSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/34Sorting according to other particular properties
    • B07C5/344Sorting according to other particular properties according to electric or electromagnetic properties

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  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

本發明涉及一種用於電子部件測試的分選機的中繼裝置。 根據本發明的用於電子部件測試的分選機的中繼裝置用於中繼從客戶托盤到測試器或從測試器到客戶托盤的電子部件,包括:設置架,在上表面放置電子部件;夾持器,夾持放置於設置架的上表面的適配器的後端部位的左右兩端;支撐器,支撐安置在放置於設置架的上表面的適配器的電子部件或解除支撐狀態,或者吸附器,真空吸附並固定放置於設置架的適配器的前端部位;開放器,開放通過夾持器固定的適配器。 根據本發明,在製作程序中發生加工公差或彎曲的電子部件能夠適當地安置於適配器,從而防止中繼程序中的不良操作,最終電子部件能夠準確地電連接於測試器,因而提高對分選機的可靠性。 The present invention relates to a relay device of a sorting machine for testing electronic components. The relay device of the sorting machine for testing electronic components according to the present invention is used to relay electronic components from a customer tray to a tester or from a tester to a customer tray, and includes: a setting rack, on which electronic components are placed on the upper surface; a clamp, which clamps the left and right ends of the rear end of an adapter placed on the upper surface of the setting rack; a supporter, which supports the electronic components placed on the adapter placed on the upper surface of the setting rack or releases the supporting state, or an absorber, which vacuum absorbs and fixes the front end of the adapter placed on the setting rack; an opener, which opens the adapter fixed by the clamper. According to the present invention, electronic components that have processing tolerances or bends during the manufacturing process can be properly placed in the adapter, thereby preventing improper operation in the relay process. Finally, the electronic components can be accurately electrically connected to the tester, thereby improving the reliability of the sorting machine.

Description

用於電子部件測試的分選機的中繼裝置及操作方法Relay device and operation method of sorting machine for electronic component testing

本發明涉及一種可以在用於測試電子部件的分選機中使用的中繼裝置。The present invention relates to a relay device which can be used in a sorting machine for testing electronic components.

生產的電子部件(例如,半導體元件、基板、SSD等)由測試器測試後被分為合格品和不合格品,只有合格產品才能出廠。The produced electronic components (such as semiconductor elements, substrates, SSDs, etc.) are tested by testers and classified into qualified products and unqualified products. Only qualified products can be shipped out of the factory.

電子部件只有電連接於測試器才能進行測試,此時,通過將電子部件電連接於測試器來支援測試電子部件的設備為用於測試電子部件的分選機(以下簡稱「分選機」)。Electronic components can only be tested if they are electrically connected to a tester. In this case, a device that supports testing the electronic components by electrically connecting the electronic components to the tester is a sorter for testing electronic components (hereinafter referred to as a "sorter").

分選機在伴隨著新的電子部件的開發而被提出和製造,正在進行用於穩定化的各種後續開發。Sorting machines are proposed and manufactured along with the development of new electronic components, and various subsequent developments for stabilization are being carried out.

最近以來,作為搭載有多個電子元件的大型電子部件的固態硬碟(SSD:Solid State Drive)的普及是擴大的趨勢。Recently, the popularity of solid state drives (SSDs) as large electronic components equipped with many electronic components has been increasing.

最初,由於固態硬碟的需求小而只生產了少量的時候,固態硬碟通過手動操作直接電連接到測試器並解除其連接,但是隨著對固態硬碟的需求暴增,對根據手動操作的測試支援遇到了困境。Initially, when SSDs were produced in small quantities due to low demand, they were electrically connected to and disconnected from the tester manually. However, as demand for SSDs skyrocketed, support for testing based on manual operations became difficult.

然而,固態硬碟的厚度、結構以及重量等與以往的電子部件不同,無法直接使用以往的分選機,因此開發了符合支援諸如固態硬碟的大型電子部件的測試的分選機,並申請了韓國公開專利10-2019-0050483號以及10-2019-0061291號。However, the thickness, structure, and weight of solid-state drives are different from those of conventional electronic components, and conventional sorting machines cannot be used directly. Therefore, a sorting machine that supports the testing of large electronic components such as solid-state drives was developed, and Korean patent publications No. 10-2019-0050483 and No. 10-2019-0061291 were applied for.

一般來說,固態硬碟的情況可以根據搭載的電子元件的種類或其用途等而具有多種規格,需要用於支援對這種多種規格的電子元件的測試的分選機。然而,分選機價格高,其規模較大,故在單價和安裝空間的確保等方面存在很多制約。因此,需要將具有多種規格的電子部件的測試在一個分選機來完成以降低費用和所需空間的技術。Generally speaking, solid state drives can have various specifications depending on the type of electronic components installed or their uses, and a sorting machine is required to support the testing of electronic components of various specifications. However, sorting machines are expensive and large in scale, so there are many restrictions in terms of unit price and installation space. Therefore, a technology is needed to complete the testing of electronic components with various specifications in one sorting machine to reduce costs and required space.

此外,為了測試每一個不同規格的電子部件,需要更換符合相應電子部件的規格的部件,即使不需要更換部件,也需要用於供應新的電子部件的暫停時間。據此,分選機和測試器的運行率下降,產生繁雜的人力損失,因此,需要即使在分選機的一週期運行或連續運行時也能將暫停時間最小化的分選機。Furthermore, in order to test each electronic component of different specifications, it is necessary to replace the component with one that meets the specifications of the corresponding electronic component. Even if the component does not need to be replaced, downtime is required to supply new electronic components. As a result, the operating rate of the sorter and the tester is reduced, resulting in complicated manpower losses. Therefore, a sorter that can minimize downtime even in one-cycle operation or continuous operation of the sorter is required.

另一方面,在作為以往的小品種大量生產產品的半導體元件的情況下,採用如下方式:配備可以裝載數百個以上的半導體元件的測試托盤,使用多個拾取器直接夾持半導體元件來插入到測試托盤的插入件。在這樣的系統中,由於在插入件中確保半導體元件的位置,並在與測試器的連接程序中也確保且半導體元件的位置,因此即使在將電子部件安置到測試托盤的程序中的精度稍微降低,也不會發生問題。On the other hand, in the case of semiconductor components, which are conventional small-volume mass-produced products, a test tray that can carry hundreds or more semiconductor components is equipped, and multiple pickers are used to directly hold the semiconductor components and insert them into the test tray. In such a system, the position of the semiconductor component is ensured in the insert and also in the connection process with the tester, so even if the accuracy of the process of placing the electronic component on the test tray is slightly reduced, it will not cause any problem.

然而,具有包括半導體元件的各種電子元件的諸如固態硬碟之類的電子部件,因對應應用裝置的多樣性而處於多產品少量生產的趨勢,並且還存在需要經過各種類型的測試的情況。然而,由於並非所有測試器的測試插座都存在於相同的位置,因此,在如小品種大量生產的產品一樣需要配備測試托盤的情況下,需要按照電子部件或測試器的種類來配備高價的測試托盤的製造以及與其匹配的分選機。所以,考慮了不使用另外的測試托盤而用夾具直接夾持電子部件的狀態下,將電子部件連接於測試插座,但通過以往的研究確認了這存在相當大的問題。However, electronic components such as solid-state hard disks, which have various electronic components including semiconductor components, are in a trend of multi-product mass production due to the diversity of corresponding application devices, and there are also cases where they need to undergo various types of tests. However, since the test sockets of all testers are not located in the same position, in the case where a test tray is required for products such as small-variety mass production, it is necessary to manufacture expensive test trays and matching sorting machines according to the types of electronic components or testers. Therefore, it was considered to connect the electronic components to the test sockets without using an additional test tray, but previous research confirmed that this was a considerable problem.

例如,電子部件因種類多樣而具有各種長度和寬度,並且製造的特性上即使是相同種類的電子部件,也因加工誤差等原因,也難以製作成其大小100%一致。然而,在不考慮這種情況而利用夾具夾持電子部件的情況下,由於無法正確地夾持電子部件而導致損失,或者因過強的加壓力而導致電子部件破損。當然,即使將夾具調節到能很好地夾持電子部件,根據夾持電子部件的哪個部位、該夾持的強度是多少,也發生了電子部件隨著夾持而一起扭曲或旋轉等情況。如要改善這種情況,需要能夠精確地控制驅動部,並且需要與所有電子部件相對應,因此驅動軸也需要非常長。並且,為了防止破損或扭曲、不需要的旋轉,需要使用能夠按情況控制轉矩的高價馬達。然而,這種情況要求設備的增大和高生產成本,因此降低生產率。此外,為了設定通過夾具的電子部件的準確的夾持位置等,需要進行自動示教來實現精密的接觸,這實際上是需要巨大的費用和技術力的部分。For example, electronic components have various lengths and widths due to their variety, and even the same type of electronic components are difficult to manufacture in 100% uniform size due to processing errors and other factors. However, if electronic components are clamped with a clamp without considering this, they may be damaged due to the inability to clamp them correctly, or they may be damaged due to excessive pressure. Of course, even if the clamp is adjusted to clamp the electronic components well, the electronic components may be twisted or rotated along with the clamping, depending on where the electronic components are clamped and how strongly they are clamped. To improve this situation, the drive unit needs to be controlled accurately and needs to correspond to all electronic components, so the drive shaft also needs to be very long. In addition, in order to prevent damage or distortion and unnecessary rotation, it is necessary to use an expensive motor that can control the torque according to the situation. However, this requires an increase in equipment and high production costs, thereby reducing productivity. In addition, in order to set the accurate clamping position of the electronic components through the clamp, automatic teaching is required to achieve precise contact, which actually requires huge expenses and technical capabilities.

因此,本發明的申請人在上述專利申請10-2020-0073725號中提出了在分選機上設置適配器的發明(以下稱為「在先申請技術」),以便能夠實現具有通用性的分選機。適配器被研發成用作用於將電子部件供應到測試器的載體,並且使分選機能夠適應不同尺寸的各種電子部件,從而增加了分選機的通用性。Therefore, the applicant of the present invention proposed an invention of providing an adapter on a sorting machine in the above-mentioned patent application No. 10-2020-0073725 (hereinafter referred to as "the prior application technology") so as to realize a sorting machine with versatility. The adapter is developed to be used as a carrier for supplying electronic components to a tester, and enables the sorting machine to adapt to various electronic components of different sizes, thereby increasing the versatility of the sorting machine.

但是,諸如固態硬碟之類的大型電子部件在生產程序中,基板會彎曲,或者因公差導致基板的寬度稍微不同,因此根據情況,存在電子部件被適配器不良地夾持或不良地安置在適配器的可能性。並且,在這種情況下,在電子部件和測試器的電連接中產生不良,這將成為降低分選機的可靠性的重要原因。However, in the production process of large electronic components such as solid state drives, the substrate may be bent or the width of the substrate may vary slightly due to tolerance, so there is a possibility that the electronic component may be poorly clamped by the adapter or poorly placed in the adapter. In this case, a defect occurs in the electrical connection between the electronic component and the tester, which will become a major cause of reducing the reliability of the sorting machine.

並且,當適配器由於各種原因(衝擊等)而偏離其位置或扭曲時,也會影響安置在適配器的電子部件的位置,並且在適配器的移動程序中會產生誤差,因此最終會導致電子部件與測試器的電連接不良。Furthermore, when the adapter is deviated from its position or twisted due to various reasons (shock, etc.), it will also affect the position of the electronic components placed in the adapter, and errors will be generated in the movement process of the adapter, thus eventually causing poor electrical connection between the electronic components and the tester.

本發明是為了解決如下技術問題而提出的,即,將具有多種公差的電子部件適當地安置於適配器,從而使電子部件能夠在之後準確地電連接於測試器。The present invention is proposed to solve the following technical problem, namely, to properly place electronic components with various tolerances in an adapter so that the electronic components can be accurately electrically connected to a tester later.

並且,本發明為了解決將彎曲的電子部件也能夠適當地安置於適配器的技術問題而提出的。Furthermore, the present invention is proposed to solve the technical problem of properly placing a bent electronic component in an adapter.

並且,本發明為了解決能夠將適配器適當地整齊排列以及夾持的技術問題而提出的。Furthermore, the present invention is proposed to solve the technical problem of properly arranging and clamping the adapter.

根據本發明的第一形態的一種用於電子部件測試的分選機的中繼裝置包括:設置架,在上表面放置電子部件;夾持器,用於夾持放置於所述設置架的上表面的適配器的後端部位的左右兩端;支撐器,用於支撐安置於放置在所述設置架的上表面的適配器的電子部件的後端部位或解除支撐狀態;及開放器,開放通過所述夾持器固定的適配器,其中所述夾持器、所示支撐器以及所述開放器設置於所述設置架。According to the first form of the present invention, a relay device of a sorting machine for testing electronic components includes: a setting frame, on which electronic components are placed on the upper surface; a clamp, used to clamp the left and right ends of the rear end of an adapter placed on the upper surface of the setting frame; a support, used to support the rear end of the electronic component placed on the adapter placed on the upper surface of the setting frame or release the supporting state; and an opener, which opens the adapter fixed by the clamp, wherein the clamp, the support and the opener are arranged on the setting frame.

所述夾持器包括:一對固定桿,用於夾持適配器的後端部位的左右兩端;及驅動源,通過縮小或增加所述一對固定桿之間的間隔,來使所述一對固定桿夾持適配器或解除夾持,其中所述一對固定桿在彼此面對的面上具有能夠插入到位於適配器的位置固定槽中的位置固定銷。The clamp includes: a pair of fixing rods for clamping the left and right ends of the rear end of the adapter; and a driving source, which enables the pair of fixing rods to clamp or release the adapter by reducing or increasing the interval between the pair of fixing rods, wherein the pair of fixing rods have position fixing pins on the surfaces facing each other that can be inserted into the position fixing grooves of the adapter.

所述用於電子部件測試的分選機的中繼裝置還可以包括:旋轉器,通過將所述設置架進行正反旋轉,使放置於所述設置架的適配器以及安於適配器的電子部件的姿勢從立狀轉換為臥狀或從臥狀轉換為立狀。The relay device of the sorting machine for electronic component testing may also include: a rotator, which rotates the setting frame forward and reversely to change the posture of the adapter placed on the setting frame and the electronic component installed on the adapter from a vertical state to a horizontal state or from a horizontal state to a vertical state.

所述用於電子部件測試的分選機的中繼裝置還可以包括:吸附器,用於真空吸附放置於所述設置架的上表面的適配器的前端部位來進行固定。The relay device of the sorting machine for electronic component testing may further include: an absorber for vacuum-absorbing the front end of the adapter placed on the upper surface of the mounting frame to fix it.

所述支撐器包括用於支撐電子部件的支撐部件。The support includes a supporting component for supporting the electronic component.

所述支撐部件具有至少一個支撐突起,所述至少一個支撐突起可以與適配器的至少一個貫通槽相對應地佈置而支撐電子部件。The supporting component has at least one supporting protrusion, and the at least one supporting protrusion can be arranged corresponding to at least one through slot of the adapter to support the electronic component.

所述支撐器還可以包括升降器,所述升降器可以升降所述支撐部件,使得當所述支撐部件上升時,所述支撐部件位於可以支撐電子部件的位置,而當下降時,解除電子部件的支撐狀態。The support may further include a lifter, which can lift the support component so that when the support component is lifted, the support component is located at a position that can support the electronic component, and when the support component is lowered, the support state of the electronic component is released.

根據本發明的第二形態的一種用於電子部件測試的分選機的中繼裝置包括:設置架,在上表面放置電子部件;夾持器,夾持放置於所述設置架的上表面的適配器的後端部位的左右兩端;支撐器,支撐安置於放置在所述設置架的上表面的適配器的電子部件或解除支撐狀態;及開放器,開放通過所述夾持器固定的適配器,所述支撐器具有支撐突起,在安裝固定在適配器上的電子部件或解除對電子部件的固定的程序中,防止電子部件的脫離。According to the second form of the present invention, a relay device of a sorting machine for testing electronic components includes: a setting rack, on which electronic components are placed on the upper surface; a clamp, which clamps the left and right ends of the rear end of an adapter placed on the upper surface of the setting rack; a supporter, which supports the electronic components placed on the adapter placed on the upper surface of the setting rack or releases the supporting state; and an opener, which opens the adapter fixed by the clamper, and the supporter has a supporting protrusion to prevent the electronic components from falling off during the process of installing the electronic components fixed on the adapter or releasing the fixation of the electronic components.

所述支撐器還包括支撐部件,配備為相對於所述設置架能夠升降;及彈性部件,彈性支撐所述支撐部件,其中所述支撐突起配備於所述支撐部件。The support device further includes a supporting component, which is configured to be able to rise and fall relative to the setting frame; and an elastic component, which elastically supports the supporting component, wherein the supporting protrusion is configured on the supporting component.

所述支撐突起沿前後方向配備有多個,從而可以支撐沿前後方向具有各種長度的電子部件。The supporting protrusions are provided in plurality along the front-rear direction, so as to support electronic components having various lengths along the front-rear direction.

所述支撐突起沿前後方向配備有多個,從而可以支撐沿前後方向具有各種長度的電子部件。The supporting protrusions are provided in plurality along the front-rear direction, so as to support electronic components having various lengths along the front-rear direction.

所述支撐器還可以包括:升降器,升降所述支撐突起;及移動源,通過沿前後方向移動所述升降器,來使所述支撐突起最終可以支撐沿前後方向具有各種長度的電子部件。The support may further include: a lifter for lifting the support protrusion; and a moving source for moving the lifter in the front-rear direction so that the support protrusion can ultimately support electronic components having various lengths in the front-rear direction.

所述設置架可以具有能夠支撐電子部件的特定部位的具有台的台突起,其中所述台突起是固定的。The mounting frame may have a platform protrusion having a platform capable of supporting a specific portion of the electronic component, wherein the platform protrusion is fixed.

根據本發明的第三形態的一種用於電子部件測試的分選機的中繼裝置包括:設置架,在上表面放置電子部件;夾持器,夾持放置於所述設置架的上表面的適配器的後端部位的左右兩端;吸附器,真空吸附放置於所述設置的架上表面的適配器的前端部位來進行固定;及開放器,開放通過所述夾持器和所述吸附器所固定的適配器,其中所述夾持器、所述吸附器以及所述開放器設置於所述設置架。According to the third form of the present invention, a relay device of a sorting machine for testing electronic components includes: a setting rack, on which electronic components are placed on the upper surface; a clamp, which clamps the left and right ends of the rear end of an adapter placed on the upper surface of the setting rack; an absorbent, which fixes the front end of the adapter placed on the upper surface of the setting rack by vacuum absorption; and an opener, which opens the adapter fixed by the clamp and the absorbent, wherein the clamp, the absorbent and the opener are arranged on the setting rack.

所述夾持器包括:一對固定桿,用於夾持適配器的後端部位的左右兩端;及驅動源,通過縮小或增加所述一對固定桿之間的間隔,來使所述一對固定桿夾持適配器或解除夾持,其中所述一對固定桿在彼此相面對的面上具有能夠插入到位於適配器的位置固定槽中的位置固定銷。The clamp includes: a pair of fixing rods for clamping the left and right ends of the rear end of the adapter; and a driving source, which enables the pair of fixing rods to clamp or release the adapter by reducing or increasing the interval between the pair of fixing rods, wherein the pair of fixing rods have position fixing pins on the surfaces facing each other that can be inserted into the position fixing grooves of the adapter.

所述用於電子部件測試的分選機的中繼裝置還可以包括:旋轉器,通過將所述設置架以90度的角度進行正反旋轉,來轉換放置於所述設置架的適配器以及安置於適配器的電子部件的姿勢。The relay device of the sorting machine for electronic component testing may also include: a rotator, which changes the posture of the adapter placed on the setting frame and the electronic component placed on the adapter by rotating the setting frame forward and backward at an angle of 90 degrees.

根據本發明的一種用於電子部件測試的分選機的驅動方法包括:開放步驟,開放適配器;安置步驟,通過移動手將電子部件安置於適配器;夾持步驟,所述適配器夾持電子部件;及解除步驟,解除移動手對於電子部件的吸附,其中在所述安裝步驟中,處於通過支撐部件支撐電子部件的後端部位的多個位置的狀態,之後通過移動手使電子部件下降的同時進行加壓,從而使彎曲的電子部件處於平坦地展開的狀態,之後執行所述夾持步驟。According to the present invention, a driving method of a sorting machine for electronic component testing includes: an opening step, opening an adapter; a placement step, placing the electronic component in the adapter by a moving hand; a clamping step, the adapter clamps the electronic component; and a releasing step, releasing the adsorption of the electronic component by the moving hand, wherein in the installation step, the rear end of the electronic component is supported by a supporting component at multiple positions, and then the electronic component is lowered by the moving hand and pressurized at the same time, so that the bent electronic component is in a flatly unfolded state, and then the clamping step is performed.

根據本發明,在製作程序中發生加工公差或彎曲的電子部件能夠適當地安置於適配器,並且能夠準確地形成適配器的排列,從而防止在電子部件的中繼程序中的不良操作,最終電子部件能夠準確地電連接於測試器,因而提高對分選機的可靠性。According to the present invention, electronic components that have processing tolerances or bends during the manufacturing process can be properly placed in the adapter, and the arrangement of the adapter can be accurately formed, thereby preventing improper operation in the relay process of the electronic components. Finally, the electronic components can be accurately electrically connected to the tester, thereby improving the reliability of the sorting machine.

參照圖式對根據本發明的較佳的實施例進行說明,為了說明的簡潔,儘量省略或縮減針對重複或實質上相同的構成的說明。 <針對電子部件和測試器的電連接的說明> The preferred embodiment of the present invention is described with reference to the drawings. For the sake of simplicity, the description of repeated or substantially identical structures is omitted or reduced as much as possible. <Description of the electrical connection between electronic components and testers>

應用根據本發明的用於電子部件測試的分選機的中繼裝置(以下簡稱為「中繼裝置」)的分選機更適合地應用於諸如固態硬碟之類的電子部件的接觸端子的側的部位插入於測試器的測試槽的方式的情形。A sorting machine using the relay device of the sorting machine for electronic component testing according to the present invention (hereinafter referred to as the "relay device") is more suitably used in situations where the side parts of the contact terminals of electronic components such as solid state drives are inserted into the test slots of the tester.

例如,如圖1所示,測試器TESTER具有如下結構,其配備有測試槽S,通過在該測試槽S插入電子部件ED的接觸端子T側的部位而使電子部件ED和測試器TESTER電連接。 <針對分選機的大體結構的示意性說明> For example, as shown in FIG. 1 , the tester TESTER has a structure in which a test slot S is provided, and the electronic component ED and the tester TESTER are electrically connected by inserting the contact terminal T side of the electronic component ED into the test slot S. <Schematic description of the general structure of the sorting machine>

圖2是針對能夠使用根據本發明的中繼裝置的分選機HR的示意性的平面圖,圖3是針對圖2的分選機的示意性的立體圖。FIG. 2 is a schematic plan view of a sorting machine HR capable of using the relay device according to the present invention, and FIG. 3 is a schematic three-dimensional view of the sorting machine of FIG. 2 .

根據本實施例的分選機HR包括連接部分CP、堆疊部分SP以及移送裝置TA。The sorting machine HR according to this embodiment includes a connecting part CP, a stacking part SP and a transfer device TA.

連接部分CP從客戶托盤取出待測試的電子部件ED而提供給測試器TESTER,或者從測試器TESTER回收完成測試的電子部件ED而將其裝載於客戶托盤。根據本發明的中繼裝置配備於該連接部分CP。The connection part CP takes out the electronic components ED to be tested from the customer tray and provides them to the tester TESTER, or collects the electronic components ED after the test from the tester TESTER and loads them on the customer tray. The relay device according to the present invention is equipped in the connection part CP.

堆疊部分SP為了將裝載有待測試的電子部件ED的客戶托盤提供至連接部分CP而保管搬入到分選機HR的客戶托盤,或者從連接部分CP回收裝載有完成測試的電子部件ED的客戶托盤而從分選機HR搬出之前進行保管。並且,堆疊部分SP將所保管的裝載有待測試的電子部件ED的客戶托盤提供給移送裝置TA,或者從移送裝置TA回收裝載有完成測試的電子部件ED的客戶托盤。The stacking part SP stores the customer trays carried into the sorting machine HR in order to provide the customer trays loaded with the electronic components ED to be tested to the connection part CP, or stores the customer trays loaded with the electronic components ED that have been tested before being carried out from the sorting machine HR by the connection part CP. In addition, the stacking part SP provides the stored customer trays loaded with the electronic components ED to be tested to the transfer device TA, or stores the customer trays loaded with the electronic components ED that have been tested before being carried out from the transfer device TA.

移送裝置TA在連接部分CP與堆疊部分SP之間移送客戶托盤。即,裝載有待測試電子部件ED的客戶托盤通過移送裝置從堆疊部分SP傳輸至連接部分CP,而裝載有完成測試的電子部件ED的客戶托盤通過移送裝置TA從連接部分CP傳輸至堆疊部分SP。 <針對連接部分的示意性說明> The transfer device TA transfers the customer tray between the connection part CP and the stacking part SP. That is, the customer tray loaded with the electronic components ED to be tested is transferred from the stacking part SP to the connection part CP by the transfer device, and the customer tray loaded with the electronic components ED that have been tested is transferred from the connection part CP to the stacking part SP by the transfer device TA. <Schematic description of the connection part>

如圖4的概念性平面圖所示,連接部分CP包括中繼裝置100、移動手200、往復移動器300以及測試手400。As shown in the conceptual plan view of FIG. 4 , the connection portion CP includes a relay device 100 , a moving hand 200 , a reciprocating mover 300 , and a test hand 400 .

中繼裝置100對從客戶托盤移動到測試器TESTER或者相反方向移動的電子部件ED進行中繼。與待測試電子部件對應的適配器500可以安置於中繼裝置100,並且將在單獨的目錄中對此進行詳細描述。在此,適配器500作為用於搬運電子部件ED的載體,對其一示例以後將進行詳細說明。The relay device 100 relays the electronic components ED that are moved from the customer tray to the tester TESTER or in the opposite direction. The adapter 500 corresponding to the electronic component to be tested can be placed in the relay device 100, and this will be described in detail in a separate directory. Here, the adapter 500 is used as a carrier for transporting the electronic component ED, and an example thereof will be described in detail later.

移動手200將待測試電子部件ED從藉由移送裝置TA而來自堆疊部分SP的客戶托盤CT移動並將其安置於中繼裝置100的適配器500中,或者將完成測試的電子部件ED從中繼裝置100的適配器500移動至客戶托盤CT。這樣的移動手200通過真空吸附來夾持臥狀的電子部件ED,其實現為配備多個吸附元件並由一個以上的吸附元件來選擇性地進行吸附,從而可以實現為吸附而夾持多種尺寸的所有電子部件ED(參照韓國申請號 10-2020-0019380號)。The moving hand 200 moves the electronic component ED to be tested from the customer tray CT from the stacking part SP by the transfer device TA and places it in the adapter 500 of the relay device 100, or moves the electronic component ED that has completed the test from the adapter 500 of the relay device 100 to the customer tray CT. Such a moving hand 200 clamps the lying electronic component ED by vacuum adsorption, which is realized by being equipped with multiple adsorption elements and selectively adsorbed by more than one adsorption element, so that all electronic components ED of various sizes can be clamped for adsorption (refer to Korean application No. 10-2020-0019380).

往復移動器300使中繼裝置100在作為移動手200進行操作的區域的第一操作區域W1與作為測試手400進行操作的區域的第二操作區域W2之間移動。由於中繼裝置100藉由這種往復移動器300往返於第一操作區域W1和第二操作區域W2,因此可以使第一操作區域W1和第二操作區域W2分離,進而排除移動手200和測試手400之間的干擾。The reciprocating device 300 moves the relay device 100 between the first operation area W1, which is the area where the moving hand 200 operates, and the second operation area W2, which is the area where the test hand 400 operates. Since the relay device 100 moves back and forth between the first operation area W1 and the second operation area W2 by means of the reciprocating device 300, the first operation area W1 and the second operation area W2 can be separated, thereby eliminating interference between the moving hand 200 and the test hand 400.

測試手400夾持在第二操作區域W2的在中繼裝置100的適配器500後使其移動,將安置於適配器500的電子部件的接觸端子T側的部位插入測試槽S,並且若對電子部件的測試結束,則從測試槽S取出電子部件ED並安置於適配器500後,再次將適配器500安置於中繼裝置100。The test hand 400 clamps the adapter 500 in the relay device 100 in the second operation area W2 and moves it to insert the contact terminal T side of the electronic component placed in the adapter 500 into the test slot S. When the test of the electronic component is completed, the electronic component ED is taken out from the test slot S and placed in the adapter 500, and then the adapter 500 is placed in the relay device 100 again.

即,待測試電子部件ED藉由移動手200從客戶托盤CT移動至中繼裝置100,然後藉由測試手400從中繼裝置100移動至測試器TESTER,完成測試的電子部件ED則經過相反的程序返回到客戶托盤CT。 <針對適配器的說明> That is, the electronic component ED to be tested is moved from the customer tray CT to the relay device 100 by the moving hand 200, and then moved from the relay device 100 to the tester TESTER by the test hand 400. The electronic component ED that has completed the test is returned to the customer tray CT through the reverse procedure. <Explanation for the adapter>

圖5是針對根據本發明的能夠與中繼裝置100組成一對的一形態的適配器500的結合立體圖,圖6是針對圖5的適配器的分解立體圖。FIG. 5 is a combined three-dimensional diagram of an adapter 500 of a type that can be paired with the relay device 100 according to the present invention, and FIG. 6 is an exploded three-dimensional diagram of the adapter of FIG. 5 .

適配器500包括一對夾持桿511、512、設置框架520、間距操作器530、彈性部件541至544以及加壓部件561、562。The adapter 500 includes a pair of clamping rods 511, 512, a setting frame 520, a spacing operator 530, elastic members 541 to 544, and pressurizing members 561, 562.

一對夾持桿511、512配備為彼此對向,且可以通過設置框架520的引導棒525、526所引導而向彼此之間的間隔變小或變大的左右方向進行直線移動。因此,當一對夾持桿511、512之間的間隔變小時,一對夾持桿511、512處於從兩端夾持電子部件ED的後端部位的狀態。並且,當一對夾持桿511、512之間的間隔變大時,一對夾持桿511、512處於解除電子部件ED的夾持的開放狀態。因此,如果通過移動手200而使電子部件ED安置於適配器500或從適配器500取出,則需要使一對夾持桿511、512處於解除電子部件ED的夾持的開放狀態。The pair of clamping rods 511 and 512 are arranged to face each other and can be linearly moved in the left and right directions in which the distance between them is reduced or increased by being guided by the guide rods 525 and 526 of the setting frame 520. Therefore, when the distance between the pair of clamping rods 511 and 512 is reduced, the pair of clamping rods 511 and 512 are in a state of clamping the rear end portion of the electronic component ED from both ends. And, when the distance between the pair of clamping rods 511 and 512 is increased, the pair of clamping rods 511 and 512 are in an open state of releasing the clamping of the electronic component ED. Therefore, if the electronic component ED is placed in or removed from the adapter 500 by moving the hand 200, the pair of clamping rods 511 and 512 need to be in an open state to release the clamping of the electronic component ED.

如在圖7的截取圖中明確確認,一對夾持桿511、512在彼此對向的面分別形成了兩個操作槽OG。As clearly shown in the cutaway view of FIG. 7 , a pair of clamping rods 511 , 512 form two operating grooves OG on surfaces facing each other.

操作槽OG形成於與夾持桿511、512和間距操作器530接觸的部位。分別在相同夾持桿511、512的兩個操作槽OG沿前後方向並排形成。並且,操作槽形成為具有越往後方凹陷的深度越淺的傾斜面The operation groove OG is formed at the portion in contact with the clamping rods 511, 512 and the spacing operator 530. The two operation grooves OG of the same clamping rods 511, 512 are formed side by side in the front-to-back direction. In addition, the operation groove is formed to have an inclined surface with a shallower depth as it is recessed toward the rear.

另外,在一對夾持桿511、512形成有相互相對的面且在多個操作槽OG的上側沿前後方向的長長的引導槽GG。該引導槽在電子部件ED沿前後方向移動的程序(例如,待測試的電子部件為了電連接於測試器而移動的程序,或將完成測試的電子部件從測試器取出並移動至適配器的程序)中引導電子部件ED的移動。進一步地,在一對夾持桿511、512夾持電子部件ED的後端部位的兩端的情況下,電子部件ED的兩端插入於引導槽GG而沿上下方向卡住,因而引導槽GG還具有夾持電子部件ED的功能。In addition, a pair of clamping rods 511, 512 are formed with mutually opposing surfaces and a long guide groove GG along the front-back direction on the upper side of the plurality of operation grooves OG. The guide groove guides the movement of the electronic component ED in the process of moving the electronic component ED along the front-back direction (for example, the process of moving the electronic component to be tested in order to be electrically connected to the tester, or the process of taking the electronic component that has been tested out of the tester and moving it to the adapter). Furthermore, when the pair of clamping rods 511, 512 clamp the two ends of the rear end portion of the electronic component ED, the two ends of the electronic component ED are inserted into the guide groove GG and clamped in the up-down direction, so that the guide groove GG also has the function of clamping the electronic component ED.

如圖8的虛擬的截取圖所示,引導槽GG從後方至前方的方向上依次具有水平維持區間HM、寬度增加區間WG、貫通區間TS以及開放區間OS。As shown in the virtual cutout of FIG. 8 , the guide groove GG has a horizontal maintaining section HM, a width increasing section WG, a through section TS, and an open section OS in sequence from the rear to the front.

水平維持區間HM的上下寬度窄到與電子部件ED的上下厚度幾乎相同的程度,從而在適當地夾持電子部件ED的兩端的同時,維持位於電子部件ED的後端的接觸端子T的部位的平坦性。The upper and lower widths of the horizontal holding section HM are narrowed to be almost the same as the upper and lower thicknesses of the electronic component ED, thereby appropriately clamping both ends of the electronic component ED and maintaining the flatness of the contact terminal T located at the rear end of the electronic component ED.

寬度增加區間WG形成為在水平維持區間HM的前端越往前方寬度越變寬。據此,在電子部件ED安置的程序中,即使在除了被移動手200吸附夾持的部位之外的區域中,即使發生因重力而下垂或因基板自身的彎曲而下垂的現象,也能夠通過兩個夾持桿511、512適當地夾持電子部件ED的兩端。The width increasing section WG is formed so as to become wider as it goes forward at the front end of the horizontal maintaining section HM. Accordingly, in the process of placing the electronic component ED, even in the area other than the part sucked and clamped by the moving hand 200, even if the electronic component ED sags due to gravity or due to the bending of the substrate itself, the two clamping rods 511 and 512 can properly clamp both ends of the electronic component ED.

貫通區間TS形成為在寬度增加區間WG的前端沿前後方向具有預定寬度,與在中繼裝置100的支撐部件131的後側支撐突起可以通過的貫通槽TG在前後方向上的寬度相對應。作為參考,由於支撐部件131可以升降,因此當上升時,支撐突起SM的上端通過貫通槽TG成為能後能夠支撐處於安置程序中的電子部件ED的狀態,而當下降時,電子部件ED的支撐狀態則被解除。當然,在支撐突起SM中形成有用於支撐電子部件ED的支撐台J,較佳地,以前後左右對稱的狀態配備有四個以上。如此,當支撐部件131配備於中繼裝置100時,即使適配器500細微地錯位,通過位置被固定的支撐突起SM也能夠防止電子部件ED的安置中發生不良的狀況。The through section TS is formed to have a predetermined width in the front-to-back direction at the front end of the width increase section WG, which corresponds to the width in the front-to-back direction of the through slot TG through which the rear support protrusion of the support member 131 of the relay device 100 can pass. For reference, since the support member 131 can be raised and lowered, when it is raised, the upper end of the support protrusion SM passes through the through slot TG to be able to support the electronic component ED in the placement process, and when it is lowered, the supporting state of the electronic component ED is released. Of course, a support platform J for supporting the electronic component ED is formed in the support protrusion SM, and preferably, four or more are provided in a state of front-to-back left-to-right symmetry. In this way, when the support member 131 is provided in the relay device 100, even if the adapter 500 is slightly misplaced, the support protrusion SM whose position is fixed can prevent the occurrence of a defect in the placement of the electronic component ED.

開放區間OS形成為至少具有與寬度增加區間WG的前端相同或更寬的寬度。這種開放區間OS可以進一步細分為後方的水平區間OS1和前方的下降區間OS2,在下降區間OS2中其寬度沿下方向進一步擴張,從而可以適當地收容具有相應更大彎曲的電子部件ED。The open space OS is formed to have at least the same width as or wider than the front end of the width increasing space WG. Such an open space OS can be further divided into a rear horizontal space OS1 and a front descending space OS2, in which the width is further expanded in the downward direction, so that the electronic component ED having a correspondingly larger curvature can be properly accommodated.

另外,引導槽GG沿前後方向開放。In addition, the guide groove GG is open in the front-rear direction.

如前述,具有如圖8所示的形態的引導槽GG如圖9的放大圖所示,即使電子部件ED向下方彎曲的情況下,在適配器500夾持電子部件ED方面也不會出現問題,並且後端的接觸端子T側的部位維持其平坦度,從而有助於接觸端子T側的部位正確地插入到測試槽S。As mentioned above, the guide groove GG having the shape shown in Figure 8 is shown in the enlarged view of Figure 9. Even if the electronic component ED is bent downward, there will be no problem in the adapter 500 clamping the electronic component ED, and the part on the side of the contact terminal T at the rear end maintains its flatness, which helps the part on the side of the contact terminal T to be correctly inserted into the test slot S.

為了設置以及支持夾持桿511、512、間距操作器530、彈性部件541至546以及加壓部件561、562,配備了設置框架520。In order to set up and support the clamping rods 511, 512, the distance operator 530, the elastic members 541 to 546, and the pressurizing members 561, 562, a setting frame 520 is provided.

設置框架520在其前端部位的左右兩側分別具有沿左側和右側突起的兩個位置設定突起521。The setting frame 520 has two position setting protrusions 521 protruding along the left and right sides, respectively, at the left and right sides of the front end portion thereof.

如圖10的參考圖所示,位置設定突起521與形成在測試手400的夾持面的位置設定槽SG相關聯。即,當測試手400夾持設置框架520而最終夾持適配器500時,位置設定突起521插入於位置設定槽SG。因此,以後在測試手400夾持適配器500的狀態下,即使沿前後方向向適配器500施加外力,設置框架520的位置也能被固定並保持,因而最終可以固定並保持適配器500的位置。當然,根據實施,可以在設置框架520形成有位置設定槽,在測試手400形成有位置設定突起。As shown in the reference diagram of FIG10 , the position setting protrusion 521 is associated with the position setting groove SG formed on the clamping surface of the test hand 400. That is, when the test hand 400 clamps the setting frame 520 and finally clamps the adapter 500, the position setting protrusion 521 is inserted into the position setting groove SG. Therefore, in the state where the test hand 400 clamps the adapter 500, even if an external force is applied to the adapter 500 in the front-rear direction, the position of the setting frame 520 can be fixed and maintained, so that the position of the adapter 500 can be finally fixed and maintained. Of course, according to implementation, the position setting groove can be formed on the setting frame 520, and the position setting protrusion can be formed on the test hand 400.

如本實施例所示,當位置設定突起521在左右兩側沿前後方向以預定間距配備為多個時,藉由測試手400夾持的適配器500的前端部位因重力而旋轉並下降,從而防止對電子部件ED的夾持不良的發生。在此,參照圖11可知,兩個位置設定突起521中的一個為突出程度相對短的圓柱形,而剩下的另一個為突出程度相對略長且大致的圓錐形。根據這樣的示例,在測試手400夾持適配器500的程序中,圓錐形的位置設定突起521可以有助於校正適配器500的位置和姿勢,圓柱形位置設定突起521可以有助於正確地保持設定的位置,據此,也能夠消除來自位置設定突起521的製作公差的不良。As shown in this embodiment, when the position setting protrusions 521 are provided in a plurality at predetermined intervals along the front-rear direction on both sides, the front end of the adapter 500 held by the test hand 400 rotates and descends due to gravity, thereby preventing the occurrence of poor holding of the electronic component ED. Here, referring to FIG. 11 , it can be seen that one of the two position setting protrusions 521 is a relatively short cylindrical shape, and the remaining one is a relatively slightly longer and roughly conical shape. According to such an example, in the procedure of the test hand 400 clamping the adapter 500, the conical position setting protrusion 521 can help correct the position and posture of the adapter 500, and the cylindrical position setting protrusion 521 can help correctly maintain the set position, thereby, it is also possible to eliminate defects from the manufacturing tolerance of the position setting protrusion 521.

並且,為了引導一對夾持桿511、512的沿左右方向的直線移動,設置框架520具有沿左右方向的長形態的引導棒525、526。當然,在夾持桿511、512中形成有引導棒525、526插入通過的通過孔TH。Furthermore, the setting frame 520 has guide rods 525 and 526 that are long in the left-right direction in order to guide the linear movement of the pair of clamping rods 511 and 512. Of course, through holes TH are formed in the clamping rods 511 and 512, through which the guide rods 525 and 526 are inserted.

並且,在設置框架520的前端部位形成有用於收容電子部件ED的前端部位的收容槽AG。在此,收容槽AG的左右寬度大於電子部件ED的前端部位的左右寬度,因此電子部件ED的前端部位兩側不會以被適配器500機械地加壓或夾住的形態而夾持,而是處於空中懸浮的形態。與引導槽GG一樣,這種收容槽AG沿前後方向開放。這意味著安置電子部件ED的適配器500的安置空間沿前後方向開放。即,包括引導槽GG和收容槽AG的安置空間沿前後方向開放。因此,各種長度的電子部件ED可以不受其長度限制全部跨過並安裝在引導槽GG和收容槽AG。Furthermore, a receiving groove AG for receiving the front end portion of the electronic component ED is formed at the front end portion of the setting frame 520. Here, the left-right width of the receiving groove AG is greater than the left-right width of the front end portion of the electronic component ED, so the two sides of the front end portion of the electronic component ED are not clamped in a state of being mechanically pressurized or clamped by the adapter 500, but are in a state of being suspended in the air. Like the guide groove GG, this receiving groove AG is open in the front-to-back direction. This means that the placement space of the adapter 500 for placing the electronic component ED is open in the front-to-back direction. That is, the placement space including the guide groove GG and the receiving groove AG is open in the front-to-back direction. Therefore, electronic components ED of various lengths can all cross and be installed in the guide groove GG and the receiving groove AG without being restricted by their length.

並且,在設置框架520的後端部位,左右兩側分別形成有兩個可以插入中繼裝置100的位置固定銷的位置固定槽FG。這種位置固定槽FG可以在左右兩側形成兩個以上的多個。另外,位置固定槽FG和位置固定銷用於校正及固定夾持在中繼裝置100的適配器500的位置。因此,當移動或旋轉中繼裝置100時,防止適配器500的脫離。並且,即使在與中繼裝置100結合的適配器500沿前後方向被施加外力,位置固定槽FG和位置固定銷能夠使設置框架520保持其自身位置。Furthermore, at the rear end portion of the setting frame 520, two position fixing grooves FG into which the position fixing pins of the relay device 100 can be inserted are formed on the left and right sides, respectively. Such position fixing grooves FG may be formed in two or more numbers on the left and right sides. In addition, the position fixing grooves FG and the position fixing pins are used to correct and fix the position of the adapter 500 clamped in the relay device 100. Therefore, when the relay device 100 is moved or rotated, the adapter 500 is prevented from being separated. Furthermore, even if an external force is applied to the adapter 500 coupled to the relay device 100 in the front-rear direction, the position fixing grooves FG and the position fixing pins enable the setting frame 520 to maintain its own position.

並且,設置框架520在後方部位還具有設置在一對夾持桿511、512的一對設置桿523、524之外,還具有附加部件528。Furthermore, the setting frame 520 also has an additional component 528 in addition to a pair of setting rods 523, 524 set on a pair of clamping rods 511, 512 at the rear portion.

附加部件528連接一對設置桿523、524的後端之間,防止因彈性部件541至544的加壓力導致使用而發生的設置桿523、524之間的間隔變寬。這種附件部件528具有能夠使電子部件ED的接觸端子T暴露的暴露窗W。The additional component 528 connects the rear ends of the pair of setting rods 523 and 524 to prevent the interval between the setting rods 523 and 524 from widening due to the pressure of the elastic members 541 to 544. This additional component 528 has an exposure window W that can expose the contact terminal T of the electronic component ED.

間距操作器530設置於設置框架520,並向一對夾持桿511、512施加操作力,使一對夾持桿511、512向相互間的間隔變寬的方向移動。為此,間距操作器530以能夠沿前後方向移動的方式設置在設置框架520,並且包括操作部分531、推動板532以及傳遞棒533。The distance operator 530 is disposed on the setting frame 520 and applies an operating force to the pair of clamping rods 511 and 512 to move the pair of clamping rods 511 and 512 in a direction in which the distance between them becomes wider. To this end, the distance operator 530 is disposed on the setting frame 520 in a manner that it can move in the front-rear direction, and includes an operating portion 531, a push plate 532, and a transmission rod 533.

操作部分531與操作槽OG對應地在左右兩側分別具有兩個滾動輥R,滾動輥R在左右兩側形成沿外側突出的突出部位。另外,滾動輥R以其一部分以插入到操作槽OG的狀態與構成操作槽OG的面接觸。即,間距操作器530的操作部分531的兩端通過滾動輥R與夾持桿511、512接觸。因此,當間距操作器530向後方移動時,其越移動,滾動輥R與操作槽OG的凹陷深度越淺的傾斜面接觸,因此,間距操作器530自然地沿兩個夾持桿511、512之間的間隔變寬的方向向兩個夾持桿511、512施加操作力。當然,當間距操作器530向前方移動時,其越移動,滾動輥R與操作槽OG的凹陷深度越深的傾斜面接觸,因此,施加於兩個夾持桿511、512的操作力被自然地解除。The operating portion 531 has two rolling rollers R on the left and right sides respectively corresponding to the operating groove OG, and the rolling rollers R form protruding portions protruding along the outer sides on the left and right sides. In addition, the rolling rollers R are in contact with the surface constituting the operating groove OG in a state where a part of the rolling rollers R is inserted into the operating groove OG. That is, the two ends of the operating portion 531 of the spacing operator 530 are in contact with the clamping rods 511 and 512 through the rolling rollers R. Therefore, when the distance operator 530 moves backward, the rolling roller R contacts the inclined surface of the operation groove OG with a shallower depression depth as it moves further, so the distance operator 530 naturally applies an operating force to the two clamping rods 511, 512 in the direction in which the interval between the two clamping rods 511, 512 widens. Of course, when the distance operator 530 moves forward, the rolling roller R contacts the inclined surface of the operation groove OG with a deeper depression depth as it moves further, so the operating force applied to the two clamping rods 511, 512 is naturally released.

推動板532通過中繼裝置100的開放器160(參照圖12或圖13)接收沿正向向間距操作器530施加的外力。即,開放器160通過推動板532向後方施加力,從而供應間距操作器530可以向後方移動的驅動力,通過這種開放器160的驅動力,間距操作器530向後方移動。The push plate 532 receives an external force applied to the distance operator 530 in the forward direction through the opener 160 (see FIG. 12 or FIG. 13 ) of the relay device 100. That is, the opener 160 applies a force backward through the push plate 532, thereby supplying a driving force that allows the distance operator 530 to move backward, and the distance operator 530 moves backward by the driving force of the opener 160.

傳遞棒533的前端固定結合於推動板532,後端固定結合於操作部分531側,將向後方推推動板532的開放器160的外力傳遞至操作部分531。The front end of the transmission rod 533 is fixedly coupled to the push plate 532 , and the rear end is fixedly coupled to the side of the operating portion 531 , so as to transmit the external force of the opener 160 pushing the push plate 532 backward to the operating portion 531 .

彈性部件541至544設置為其一側與設置框架520相連而另一側與夾持桿511、512相連。因此,彈性部件541至544沿一對夾持桿511、512之間的間隔變窄的方向對一對夾持桿511、512施加彈性力。據此,當去除通過間距操作器530施加於一對夾持桿511、512的操作力時,藉由彈性部件541至544的彈性力,一對夾持桿511、512沿相互之間的間隔變窄的方向移動,從而夾持電子部件ED。從這種觀點看來,彈性部件541至544起到產生並維持一對夾持桿511、512可以夾持電子部件ED的加壓力的驅動部件的功能,進一步起到封閉適配器500的功能。當然,作為驅動部件,可以考慮馬達或氣缸等,但為了沒有額外設定下對應於加工誤差範圍內的電子部件ED的所有寬度,由彈簧之類的彈性部件構成驅動部件是最佳的。The elastic members 541 to 544 are provided so that one side thereof is connected to the setting frame 520 and the other side thereof is connected to the clamping rods 511, 512. Therefore, the elastic members 541 to 544 apply elastic force to the pair of clamping rods 511, 512 in the direction in which the interval between the pair of clamping rods 511, 512 becomes narrower. Accordingly, when the operating force applied to the pair of clamping rods 511, 512 by the interval operator 530 is removed, the pair of clamping rods 511, 512 moves in the direction in which the interval between them becomes narrower by the elastic force of the elastic members 541 to 544, thereby clamping the electronic component ED. From this point of view, the elastic members 541 to 544 function as a driving member that generates and maintains the pressure that enables the pair of clamping rods 511 and 512 to clamp the electronic component ED, and further functions as a closing adapter 500. Of course, as the driving member, a motor or a cylinder can be considered, but in order to correspond to all widths of the electronic component ED within the processing error range without additional settings, it is best to constitute the driving member with an elastic member such as a spring.

彈性部件541至544根據其壓縮程度,決定一對夾持桿511、512之間的間隔。另外,這種事實意味著彈性部件541至544還起到改變一對夾持桿511、512之間的夾持寬度(一對夾持桿為了夾持電子部件而隔開的寬度)的可變元件的功能。即,根據彈性部件541至544的壓縮程度,夾持桿511、512在製作公差內可以夾持具有各種寬度的電子部件ED。The elastic members 541 to 544 determine the spacing between the pair of clamping rods 511 and 512 according to the degree of compression thereof. In addition, this fact means that the elastic members 541 to 544 also function as a variable element that changes the clamping width between the pair of clamping rods 511 and 512 (the width of the pair of clamping rods spaced apart to clamp the electronic component). That is, according to the degree of compression of the elastic members 541 to 544, the clamping rods 511 and 512 can clamp the electronic component ED having various widths within the manufacturing tolerance.

當藉由開放器160的外力被去除時,為了將間距操作器530沿前方順利地復原位置,加壓部件561、562沿前方向向間距操作器530施加彈性力。這種加壓部件561、562對間距操作器530沿前方向加壓,因此還有助於強化對一對夾持桿511、512沿彼此變窄的方向施加彈性力的彈性部件541至544的夾持力。When the external force by the opener 160 is removed, in order to smoothly restore the distance operator 530 to its position in the front direction, the pressurizing members 561 and 562 apply elastic force to the distance operator 530 in the front direction. Such pressurizing members 561 and 562 pressurize the distance operator 530 in the front direction, thereby also helping to strengthen the clamping force of the elastic members 541 to 544 that apply elastic force to the pair of clamping rods 511 and 512 in the direction in which they narrow toward each other.

作為參考,除了夾持桿511、512之外,貫通槽TG在設置框架520的左右兩側也形成有兩個。即,作為貫通槽TG中的一部分的後方的兩個貫通槽TG形成並位於夾持桿511、512,作為另一部分的前方的兩個貫通槽TG形成並位於設置框架520。 <針對中繼裝置的說明> For reference, in addition to the clamping rods 511 and 512, two through grooves TG are also formed on the left and right sides of the setting frame 520. That is, the two through grooves TG at the rear, which are part of the through grooves TG, are formed and located on the clamping rods 511 and 512, and the two through grooves TG at the front, which are the other part, are formed and located on the setting frame 520. <Explanation for the relay device>

圖12是針對根據本發明的一實施例的中繼裝置的結合立體圖,圖13是針對圖12的中繼裝置的分解立體圖。FIG12 is a combined three-dimensional diagram of a relay device according to an embodiment of the present invention, and FIG13 is an exploded three-dimensional diagram of the relay device of FIG12.

中繼裝置100包括設置架110、夾持器120、支撐器130、旋轉器140、吸附器150、開放器160以及各種辨識感測器。The relay device 100 includes a mounting frame 110, a clamp 120, a support 130, a rotator 140, a suction device 150, an opener 160, and various identification sensors.

設置架110為設置夾持器120、支撐器130、吸附器150、開放器160以及各種辨識感測器而配備。適配器500放置於設置架110的上表面。The mounting frame 110 is provided for mounting the clamp 120 , the support 130 , the suction device 150 , the opener 160 and various identification sensors. The adapter 500 is placed on the upper surface of the mounting frame 110 .

夾持器120夾持放置於設置架110上表面的適配器500的後端部位的左右兩端。為此,夾持器120包括一對固定桿121和驅動源122。The clamp 120 clamps the left and right ends of the rear end of the adapter 500 placed on the upper surface of the mounting frame 110. To this end, the clamp 120 includes a pair of fixing rods 121 and a driving source 122.

一對固定桿121夾持適配器500的後端部位的左右兩端。這樣的一對固定桿121分別位於彼此相對的面,並具有可以插入固定銷FG的位置固定銷FP。A pair of fixing rods 121 clamp the left and right ends of the rear end portion of the adapter 500. Such a pair of fixing rods 121 are respectively located on the surfaces facing each other and have position fixing pins FP that can be inserted into the fixing pins FG.

驅動源122使一對固定桿121之間的間隔變窄或變寬,從而使一對固定桿121夾持適配器500或解除夾持。The driving source 122 narrows or widens the interval between the pair of fixing rods 121, thereby causing the pair of fixing rods 121 to clamp or release the adapter 500.

支撐器130為了支撐安置於適配器500的電子部件ED的後端部位而配備,且包括圖14的支撐部件131和升降器132。The supporter 130 is provided to support the rear end portion of the electronic component ED mounted on the adapter 500, and includes a support member 131 and a lifter 132 of FIG. 14.

支撐部件131具有分為前後左右且向上方突出的四個支撐突起SM,在支撐突起SM分別形成有用於支撐適配器500的支撐台J。另外,當支撐部件131因升降器132上升時,支撐台J處於能夠支撐電子部件ED的位置,而當下降時,解除電子部件ED的支撐。此時,後側的支撐突起SM通過貫通槽TG並上升。如此,支撐部件131配備於中繼裝置100,因此即使適配器500細微地錯位,也能夠通過位置固定的支撐突起SM來防止電子部件ED安置於適配器的程序中的安裝不良。當然,支撐突起SM和貫通槽TG以至少一個的所需個數適當地佈置即可。The supporting component 131 has four supporting protrusions SM that are divided into front, rear, left, and right and protrude upward, and support platforms J for supporting the adapter 500 are formed on each of the supporting protrusions SM. In addition, when the supporting component 131 is raised by the lifter 132, the supporting platform J is in a position to support the electronic component ED, and when it is lowered, the support for the electronic component ED is released. At this time, the supporting protrusion SM on the rear side passes through the through groove TG and rises. In this way, the supporting component 131 is equipped on the relay device 100, so even if the adapter 500 is slightly misplaced, the fixed-position supporting protrusion SM can prevent the electronic component ED from being improperly installed during the process of placing it in the adapter. Of course, the supporting protrusions SM and the through grooves TG may be appropriately arranged in the required number of at least one.

作為參考,支撐突起SM的上端部位的沿左右方向相互相對的面具有越往上方其寬度越變寬的傾斜度,從而引導從上方至下方下降的電子部件ED的左右兩端,因此電子部件ED可以適當地安置於適配器500。For reference, the surfaces of the upper end of the supporting protrusion SM that are opposite to each other in the left-right direction have an inclination that becomes wider as it goes upward, thereby guiding the left and right ends of the electronic component ED descending from top to bottom, so that the electronic component ED can be properly placed in the adapter 500.

旋轉器140通過將設置架110以90度的角度進行正反旋轉,使放置於設置架110的適配器500以及安置於適配器500的電子部件從臥狀姿勢轉換到垂直狀態,或反之亦然。在此,當適配器500轉換為臥狀時,實施藉由移動手200的操作,而當適配器500轉換為垂直時,實施藉由測試手400的操作。The rotator 140 rotates the mounting frame 110 forward and backward at an angle of 90 degrees, so that the adapter 500 placed on the mounting frame 110 and the electronic components installed on the adapter 500 are converted from a horizontal position to a vertical position, or vice versa. Here, when the adapter 500 is converted to a horizontal position, the operation by the moving hand 200 is implemented, and when the adapter 500 is converted to a vertical position, the operation by the test hand 400 is implemented.

參照圖1可知,當電子部件ED處於立狀狀態(豎立的狀態)時,位於後端的接觸端子T部位插入到測試槽S。相反,參照圖15可知,裝載在安置於中繼裝置100的適配器500的電子部件ED處於臥狀的狀態(躺臥的狀態)。因此,當使電子部件ED電連接於測試器TESTER時,需要將如圖15的(a)所示的臥狀的電子部件ED轉換成如圖15的(b)所示的立狀姿勢,並且對於已完成測試的電子部件ED,只有將立狀轉換成臥狀,才能夠進行往客戶托盤CT的回收。這種姿勢變換由旋轉器T負責。因此,旋轉器140將沿前後方向經過電子部件ED的接觸端子T部位和前端部位的直線為旋轉軸RX,使電子部件ED沿逆時針方向旋轉。Referring to FIG1 , it can be seen that when the electronic component ED is in an upright state (vertical state), the contact terminal T located at the rear end is inserted into the test slot S. On the contrary, referring to FIG15 , it can be seen that the electronic component ED loaded on the adapter 500 placed in the relay device 100 is in a horizontal state (lying state). Therefore, when the electronic component ED is electrically connected to the tester TESTER, it is necessary to convert the horizontal electronic component ED shown in FIG15 (a) into an upright posture as shown in FIG15 (b), and for the electronic component ED that has completed the test, only by converting the vertical state into the horizontal state can it be recovered to the customer tray CT. The rotator T is responsible for this posture change. Therefore, the rotator 140 rotates the electronic component ED in the counterclockwise direction using a straight line passing through the contact terminal T portion and the front end portion of the electronic component ED in the front-rear direction as the rotation axis RX.

同時,在本實施例中安置於中繼裝置100的電子部件ED的接觸端子T朝著上方,但是由於生產廠家的原因等,通過電子部件ED的接觸端子T佈置於下方或測試槽S側的電子端子的佈置等,如圖15的(c)所示,旋轉器140將電子部件ED沿相反方向旋轉,從而從臥狀可以轉換成立狀。即,在本發明的一形態中,為了將電子部件ED從臥像轉換成立像,旋轉器140可以沿逆時針或順時針方向以90度角度旋轉適配器500。Meanwhile, in the present embodiment, the contact terminals T of the electronic component ED placed in the relay device 100 face upward, but due to reasons of the manufacturer, the contact terminals T of the electronic component ED are arranged at the bottom or the electronic terminals are arranged on the side of the test slot S, etc. As shown in (c) of FIG. 15 , the rotator 140 rotates the electronic component ED in the opposite direction, so that it can be converted from the horizontal state to the vertical state. That is, in one form of the present invention, in order to convert the electronic component ED from the horizontal state to the vertical state, the rotator 140 can rotate the adapter 500 at an angle of 90 degrees in the counterclockwise or clockwise direction.

當測試槽S沿左右方向長長地形成時,電子部件ED無需以垂直豎立,因此旋轉器140是選擇性的組成要素。When the test slot S is formed long in the left-right direction, the electronic component ED does not need to stand vertically, so the rotator 140 is an optional component.

吸附器150為了真空吸附而固定適配器500的前端部位而配備,由沿前後左右方向佈置的四個吸附元件151構成。如此,藉由吸附器150可以固定適配器500的前端部位,因此適配器500在姿勢變換程序等中,適配器500的位置被適當地設定,從而不會在移動手200或測試手400的操作中發生不良。The suction device 150 is provided to fix the front end of the adapter 500 by vacuum suction, and is composed of four suction elements 151 arranged in the front, rear, left and right directions. In this way, the suction device 150 can fix the front end of the adapter 500, so that the position of the adapter 500 is appropriately set in the posture change process, etc., so that no malfunction occurs in the operation of the moving hand 200 or the test hand 400.

例如,當在通過夾持器120僅固定適配器500的後端部位的情況下,因各種製作公差等操作衝擊施加到適配器500時,適配器500的前端部位可能向左側或右側方向錯位,在這種情況下,在通過移動手200夾持電子部件ED或解除夾持的安置程序中可能發生不良。For example, when only the rear end portion of the adapter 500 is fixed by the clamp 120, when operational impacts such as various manufacturing tolerances are applied to the adapter 500, the front end portion of the adapter 500 may be misplaced to the left or right. In this case, a defect may occur in the placement procedure of clamping the electronic component ED by the mobile hand 200 or releasing the clamp.

並且,例如,當在通過夾持器120僅固定適配器500的後端部位的情況下,因各種製作公差等適配器500垂直豎立時,後端部位由於施加於後端部位的重力,可能發生向下方下垂的情況,因此以後藉由測試手400的適配器500夾持操作可能發生不良。並且,在其相反程序中即使在由於重力而錯位的適配器500的姿勢轉換成臥狀時,錯位的姿勢也會維持,因此以後,藉由移動手200的電子部件ED的夾持可能發生不良。因此,吸附器150與夾持器120一起發揮著設定以及維持電子部件(適配器)的位置的作用。Furthermore, for example, when only the rear end portion of the adapter 500 is fixed by the clamp 120, the rear end portion may sag downward due to the gravity applied to the rear end portion when the adapter 500 is vertically erected due to various manufacturing tolerances, and thus the adapter 500 clamping operation by the test hand 400 may fail. Furthermore, in the reverse process, even when the posture of the adapter 500 misplaced by gravity is converted to a horizontal state, the misplaced posture is maintained, and thus the clamping of the electronic component ED by the moving hand 200 may fail. Therefore, the suction device 150 plays a role in setting and maintaining the position of the electronic component (adapter) together with the clamp 120.

由於吸附器150吸附適配器500的下表面,因而以後不會干涉藉由測試手400的適配器500的夾持或其相反的驅動。Since the suction device 150 suctions the lower surface of the adapter 500, it will not interfere with the clamping of the adapter 500 by the test hand 400 or the reverse driving thereof.

並且,當夾持適配器500時,吸附器150還用作排列元件。即,在夾持器120夾持適配器500的後端部位之前,首先通過吸附器150吸附適配器500的前端部位,從而第一次排列適配器500,然後通過夾持器120二次夾持適配器500的後端部位並進行固定,從而實現通過中繼裝置100的適配器500夾持。因此,適配器500可以在保持精緻的排列狀態下被中繼裝置100所夾持。Furthermore, when clamping the adapter 500, the suction element 150 also serves as an arranging element. That is, before the clamp 120 clamps the rear end portion of the adapter 500, the suction element 150 firstly absorbs the front end portion of the adapter 500, thereby arranging the adapter 500 for the first time, and then the clamp 120 clamps the rear end portion of the adapter 500 for the second time and fixes it, thereby achieving the clamping of the adapter 500 by the relay device 100. Therefore, the adapter 500 can be clamped by the relay device 100 while maintaining a delicate arrangement state.

並且,當測試手400從中繼裝置100夾持適配器500而帶走時,吸附器150也會起到一定的作用。Furthermore, when the tester's hand 400 takes the adapter 500 away from the relay device 100, the adsorber 150 also plays a certain role.

例如,雖然需要測試手400在正確的位置處夾持位於中繼裝置100的適配器500,但由於各種誤差,可能發生不精準的情況。在這種情況下,存在夾持器120、中繼裝置100以及適配器500中的任意一個發生破損的顧慮,並且由於錯誤的夾持在整個動作中可能會發生不良。但是,組成吸附器150的吸附元件151的吸附部位為類似橡膠的軟質材料,並且還採用真空吸附方式,因此對於適配器500將賦予某種程度的流動性。因此,即使解除藉由夾持器120的夾持,適配器500也可以存在於原位置,並且可以一定程度上抵消處於被吸附元件151吸附的狀態的適配器500的流動性因藉由測試手400的適配器500的夾持所導致的操作誤差。For example, although the test hand 400 is required to clamp the adapter 500 located in the relay device 100 at the correct position, inaccuracies may occur due to various errors. In this case, there is a concern that any one of the clamp 120, the relay device 100, and the adapter 500 may be damaged, and defects may occur in the entire action due to incorrect clamping. However, the adsorption part of the adsorption element 151 constituting the adsorber 150 is a soft material similar to rubber, and a vacuum adsorption method is also adopted, so a certain degree of fluidity will be given to the adapter 500. Therefore, even if the clamping by the clamp 120 is released, the adapter 500 can still exist in the original position, and the fluidity of the adapter 500 in the state of being adsorbed by the adsorption element 151 can offset to a certain extent the operational error caused by the clamping of the adapter 500 by the test hand 400.

如前述的吸附器150雖然僅設置一個吸附元件151即可,但較佳地,配備兩個至四個的多個。Although the adsorber 150 described above only has one adsorption element 151, it is preferred that two to four adsorption elements 151 are provided.

開放器160為了開放通過夾持器120和吸附器150固定的適配器500而配備,包括加壓桿161和加壓源162。The opener 160 is provided to open the adapter 500 fixed by the clamper 120 and the suction device 150, and includes a pressurizing rod 161 and a pressurizing source 162.

加壓桿161為了與推動板532接觸並向後方施加加壓力而配備。The pressure rod 161 is provided to contact the push plate 532 and apply pressure to the rear.

加壓源162為了將加壓桿161沿前後方向移動預定距離為配備,且當加壓桿161向後方移動時,向後方的加壓力作用於推動板532,從而開放適配器500,而當加壓桿161向前方移動時,作用於推動板532的加壓力被解除,從而成為適配器500夾持電子部件ED的狀態。The pressure source 162 is provided to move the pressure rod 161 a predetermined distance in the front-rear direction, and when the pressure rod 161 moves rearward, the pressure force acts on the push plate 532 to open the adapter 500, and when the pressure rod 161 moves forward, the pressure force acting on the push plate 532 is released, so that the adapter 500 clamps the electronic component ED.

各種辨識感測器為了辨識適配器500或各種電子部件ED而配備。Various identification sensors are provided in order to identify the adapter 500 or various electronic components ED.

例如,一個辨識感測器可以是用於感知適配器500的安裝不良的辨識感測器。For example, an identification sensor may be an identification sensor for sensing improper installation of the adapter 500.

例如,一個辨識感測器可以是用於感知適配器500的開放與否的辨識感測器。For example, an identification sensor may be an identification sensor for sensing whether the adapter 500 is open or not.

例如,一個辨識感測器可以是用於感知適配器500的姿勢變換與否的辨識感測器。For example, an identification sensor may be a recognition sensor used to sense whether the posture of the adapter 500 has changed.

例如,一個辨識感測器可以是用於感知被稱為U.2的電子部件ED是否安裝於適配器500的辨識感測器。For example, an identification sensor may be an identification sensor for sensing whether an electronic component ED called U.2 is mounted on the adapter 500.

例如,一個辨識感測器可以是用於感知被稱為M.2的電子部件ED是否安裝於適配器500的辨識感測器。For example, one identification sensor may be an identification sensor for sensing whether an electronic component ED called M.2 is mounted on the adapter 500.

接下來,對應用於如前述的中繼裝置100的相關組成的分選機HR的操作進行說明。Next, the operation of the sorting machine HR applied to the related components of the relay device 100 as described above will be explained.

隨著初期或待測試電子部件ED的更換,操作者將符合待測試電子部件ED規格的適配器500安裝於位於第一操作區域W1的中繼裝置100。之後,當移動手200將從客戶托盤CT取出的電子部件ED安裝於適配器500時,開放器160向後方推間距操作器530。此時,設置框架520通過位置固定槽FG固定於中繼裝置100,因此通過開放器160的加壓力只有間距操作器530向後方移動。在此程序中,操作部分531的輥R以與夾持桿511、512的操作槽OG的傾斜面接觸的狀態下向後方移動的同時對夾持桿511、512沿左右方向施加力,從而兩個夾持桿511、512之間的間隔變寬並開放適配器500。另外,中繼裝置100的支撐部件131上升,處於支撐突起SM可以支撐電子部件ED的狀態。因此,電子部件ED的後端部位可以搭在支撐部件131的位於四個位置的支撐台J而被支撐。With the replacement of the electronic component ED to be tested at the initial stage or to be tested, the operator installs the adapter 500 that meets the specifications of the electronic component ED to be tested on the relay device 100 located in the first operation area W1. Afterwards, when the moving hand 200 installs the electronic component ED taken out from the customer tray CT on the adapter 500, the opener 160 pushes the spacing operator 530 backward. At this time, the setting frame 520 is fixed to the relay device 100 through the position fixing groove FG, so only the spacing operator 530 moves backward by the pressure of the opener 160. In this process, the roller R of the operating portion 531 moves backward in a state of contacting the inclined surface of the operating groove OG of the clamping rods 511 and 512, and at the same time applies force to the clamping rods 511 and 512 in the left and right directions, so that the interval between the two clamping rods 511 and 512 becomes wider and the adapter 500 is opened. In addition, the support member 131 of the relay device 100 rises, and is in a state where the support protrusion SM can support the electronic component ED. Therefore, the rear end of the electronic component ED can be supported by the support bases J located at four positions of the support member 131.

當適配器500的開放完成時,吸附並夾持電子部件ED的上表面的移動手200下降至使電子部件ED的後端部位放置於支撐台J的高度。此下降程序也是具有彎曲的電子部件ED的後端部位轉換為平坦狀態的程序。即,藉由移動手200的電子部件ED下降可以實施至為了使電子部件ED的後端部位的左右兩端適當地插入到夾持部件511、512的引導槽GG而使其平坦展開的位置。即,移動手200移動手200向彎曲的電子部件ED施加加壓力,以使電子部件ED的後端部分平坦地展開。因此,即使電子部件ED以預定程度向上方凸出地彎曲,電子部件ED也能夠通過引導槽GG被夾持桿511、512適當地夾持。這裡,由於電子部件ED的後端部分分別在前後左右兩側共四處由支撐台J所支撐,因此電子部件ED的後端部分通過移動手200向下方施加的加壓力而平坦地展開,為此,通過移動手200吸附並夾持的位置需要位於四個支撐點之間(較佳地,在對角線方向上連接兩個支撐點的兩個對角線相交的點)。因此,較佳地,位於支撐部件131的支撐突起SM至少具備4個。When the opening of the adapter 500 is completed, the moving hand 200 that adsorbs and clamps the upper surface of the electronic component ED is lowered to a height that places the rear end of the electronic component ED on the support table J. This lowering procedure is also a procedure for converting the rear end of the bent electronic component ED into a flat state. That is, the electronic component ED can be lowered by the moving hand 200 to a position where the left and right ends of the rear end of the electronic component ED are properly inserted into the guide grooves GG of the clamping parts 511 and 512 so that it is flatly unfolded. That is, the moving hand 200 applies pressure to the bent electronic component ED so that the rear end of the electronic component ED is flatly unfolded. Therefore, even if the electronic component ED is bent upwardly to a predetermined degree, the electronic component ED can be properly clamped by the clamping rods 511 and 512 through the guide groove GG. Here, since the rear end of the electronic component ED is supported by the support platform J at four locations, namely, the front, rear, left, and right sides, the rear end of the electronic component ED is flatly unfolded by the pressure applied downward by the moving hand 200. For this purpose, the position where it is adsorbed and clamped by the moving hand 200 needs to be located between the four supporting points (preferably, the point where two diagonal lines connecting the two supporting points in the diagonal direction intersect). Therefore, preferably, there are at least four supporting protrusions SM located on the supporting component 131.

接著,在電子部件ED的後端部位被支撐台J支撐的狀態下,去除施加到間距操作器530的外力。此時,通過彈性部件541至544的彈性力,兩個夾持桿511、512之間的間隔變窄,間距操作器530也被推向前方。在此程序中,電子部件ED的左右兩端插入於夾持桿511、512的引導槽GG,從而完成通過適配器500的電子部件ED的夾持。此時,由於引導槽GG的形狀,電子部件ED的後端部位(更具體地,具有接觸端子的部位)可以保持平坦。此外,即使在電子部件ED的左右寬度上存在更大的公差,由於收容槽AG的寬度足夠寬,因此不會發生電子部件ED的後端部位卡在構成收容槽AG的壁上的情況。Next, with the rear end of the electronic component ED supported by the support table J, the external force applied to the spacing operator 530 is removed. At this time, the interval between the two clamping rods 511 and 512 is narrowed by the elastic force of the elastic members 541 to 544, and the spacing operator 530 is also pushed forward. In this procedure, the left and right ends of the electronic component ED are inserted into the guide grooves GG of the clamping rods 511 and 512, thereby completing the clamping of the electronic component ED by the adapter 500. At this time, due to the shape of the guide grooves GG, the rear end of the electronic component ED (more specifically, the portion having the contact terminals) can be kept flat. Furthermore, even if there is a greater tolerance in the left-right width of the electronic component ED, since the width of the accommodating groove AG is sufficiently wide, the rear end portion of the electronic component ED will not be caught on the wall constituting the accommodating groove AG.

當通過夾持桿511、512的電子部件ED的夾持完成時,移動手200解除電子部件的夾持後,移動到其它位置。When the clamping of the electronic component ED by the clamping rods 511 and 512 is completed, the moving hand 200 releases the clamping of the electronic component and moves to another position.

然後,安置於中繼裝置100的適配器500垂直豎立。此時,垂直豎立的電子部件ED的下端被形成引導槽GG和支撐台J的壁所支撐,更進一步地,通過兩個夾持桿511、512的加壓力和根據情況可能發生的彎曲復原力藉由夾在引導槽GG的狀態等適當地維持其安裝狀態。另外,移動手200解除電子部件ED的夾持之後移動到其它位置,然後中繼裝置100通過往復移動器300從第一操作區域W1移動至第二操作區域W2。安置於該移動至第二操作區域W2的中繼裝置100的適配器500在垂直狀態下被測試手400夾持,在此程序中位置設定突起521插入於位置設定槽SG。據此,適配器500被測試手400夾持而位於正確的設定位置處。同時,因之後施加於適配器500的外力而使設置框架520的位置也能被固定並保持,因此適配器500最終也能固定並保持其位置。Then, the adapter 500 placed on the relay device 100 stands vertically. At this time, the lower end of the vertically standing electronic component ED is supported by the wall forming the guide groove GG and the support platform J, and further, the installation state is properly maintained by the state of being clamped in the guide groove GG through the pressure of the two clamping rods 511 and 512 and the bending restoring force that may occur according to the situation. In addition, the moving hand 200 releases the clamping of the electronic component ED and moves to another position, and then the relay device 100 moves from the first operation area W1 to the second operation area W2 through the reciprocating mover 300. The adapter 500 placed on the relay device 100 moved to the second operation area W2 is clamped by the test hand 400 in a vertical state, and the position setting protrusion 521 is inserted into the position setting groove SG during this process. Accordingly, the adapter 500 is clamped by the test hand 400 and is located at the correct setting position. At the same time, the position of the setting frame 520 can also be fixed and maintained due to the external force applied to the adapter 500 later, so the adapter 500 can also be fixed and maintained in its position in the end.

接著,若測試手400將適配器500向測試器TESTER側移動,從而準確地設定適配器500與測試槽S之間的位置,則位於測試手400的開放要素細微地推間距操作器530來細微地擴大兩個夾持桿511、512之間的間隔,在此狀態下,位於測試手400的連接要素將電子部件ED推向測試槽S側,從而使電子部件ED的接觸端子T所在的後端部位插入於測試槽S。Next, if the test hand 400 moves the adapter 500 toward the tester TESTER side to accurately set the position between the adapter 500 and the test slot S, the opening element located at the test hand 400 slightly pushes the spacing operator 530 to slightly expand the interval between the two clamping rods 511 and 512. In this state, the connecting element located at the test hand 400 pushes the electronic component ED toward the test slot S side, so that the rear end portion of the electronic component ED where the contact terminal T is located is inserted into the test slot S.

另外,當測試結束時,操作為通過適配器500夾持電子部件ED的狀態,接著,通過測試手400電子部件ED從測試槽S取出。取出的電子部件ED經過相反程序移動,最終裝載到客戶托盤CT。 <針對支撐器的第一變形例> In addition, when the test is completed, the operation is to clamp the electronic component ED through the adapter 500, and then the electronic component ED is taken out from the test slot S through the test hand 400. The taken out electronic component ED moves through the reverse procedure and is finally loaded on the customer tray CT. <First variant example for the support>

根據第一變形例,如圖16所示,支撐器130可以彈性支撐地設置於設置架110。參照圖16,支撐器130包括支撐部件131以及四個彈簧132a至132d。According to the first modification, as shown in Fig. 16, the supporter 130 may be elastically supported and installed on the installation frame 110. Referring to Fig. 16, the supporter 130 includes a supporting member 131 and four springs 132a to 132d.

支撐部件131配備為相對於設置架110能夠升降,且具有向前方突出的六個支撐突起SM。當然,適配器500配備有使支撐突起SM可以向上方通過的通過區域,支撐突起SM通過適配器500的底面部位而支撐電子部件ED。The support member 131 is provided to be able to rise and fall relative to the mounting frame 110 and has six support protrusions SM protruding forward. Of course, the adapter 500 is provided with a passage area through which the support protrusions SM can pass upward, and the support protrusions SM pass through the bottom surface of the adapter 500 to support the electronic component ED.

例如,在電子部件ED安置並固定於適配器500或解除對電子部件ED的固定的程序中,夾持器120無法夾持電子部件ED的兩端,從而解除對電子部件ED的支撐,電子部件ED可能從預定位置脫離。在這種情況下,支撐突起SM支撐電子部件ED,從而電子部件ED能夠適當地位於預定位置。在此,「預定位置」是指夾持器120可以適當地夾持電子部件ED的位置,或者移動手200可以適當地吸附並夾持或接觸夾持電子部件ED的位置。For example, in the process of placing and fixing the electronic component ED to the adapter 500 or releasing the fixation of the electronic component ED, the clamp 120 cannot clamp the two ends of the electronic component ED, thereby releasing the support for the electronic component ED, and the electronic component ED may be separated from the predetermined position. In this case, the supporting protrusion SM supports the electronic component ED so that the electronic component ED can be properly positioned at the predetermined position. Here, the "predetermined position" refers to a position where the clamp 120 can properly clamp the electronic component ED, or a position where the moving hand 200 can properly adsorb and clamp or contact the electronic component ED.

上述支撐突起SM無需必需是6個,只要沿前後方向整齊地配備多個即可。這是因為,適配器500需要安置沿前後方向具有各種長度的電子部件ED,因此支撐突起SM也需要具備能夠支撐沿前後方向具有各種長度的電子部件ED的數量。The supporting protrusions SM do not necessarily need to be 6, as long as a plurality of them are neatly arranged in the front-to-back direction. This is because the adapter 500 needs to accommodate electronic components ED with various lengths in the front-to-back direction, so the supporting protrusions SM also need to have a number that can support electronic components ED with various lengths in the front-to-back direction.

並且,支撐突起SM可由上側的接觸部①和下側的結合部②構成。Furthermore, the supporting protrusion SM may be composed of a contact portion ① on the upper side and a coupling portion ② on the lower side.

上側的接觸部①在上側與電子部件ED接觸,結合部②的上端在接觸部①的下側與接觸部①結合。The contact portion ① on the upper side contacts the electronic component ED at the upper side, and the upper end of the bonding portion ② is bonded to the contact portion ① at the lower side of the contact portion ①.

另外,較佳地,接觸部①由硬度比結合部②弱的材質形成,以防止支撐的電子部件ED受損。例如,為了維持強度,結合部②較佳為金屬材質,接觸部①可以是硬度比金屬材質弱的矽材質、橡膠材質或合成樹脂材質等。In addition, preferably, the contact part ① is formed of a material with a lower hardness than the bonding part ② to prevent the supported electronic component ED from being damaged. For example, in order to maintain strength, the bonding part ② is preferably a metal material, and the contact part ① can be a silicone material, a rubber material, or a synthetic resin material, etc., which is lower in hardness than a metal material.

四個彈簧132a至132d設置為相對於設置架110彈性支撐支援部件131的彈性部件。The four springs 132a to 132d are provided as elastic members that elastically support the support member 131 relative to the setting frame 110.

作為參考,設置架110在其後端部位具有形成有能夠支撐電子部件ED的台J的台突起111。For reference, the mounting frame 110 has a stage protrusion 111 formed with a stage J capable of supporting the electronic component ED at its rear end portion.

台突起111的位置被選定為支撐位於電子部件ED後端的接觸端子T側部位。當然,台突起111並不一定要實現為支撐接觸端子T側部位,只要是不會對電子部件ED造成損傷的硬度較大的特定部位的位置,則可以在任何位置適當地形成。通常,諸如固態硬碟之類的電子部件ED是諸如半導體晶片之類的電子元件的集合體,並且電子元件即使受到小的衝擊或劃痕也可能容易發生損壞。因此,在本實施例中,作為對衝擊相對最穩定的部位的接觸端子T側部位被實現為被台突起111所支撐,並且還被實現為防止電子部件ED的意外地向後方脫離。與支撐突起SM不同,這種台突起111形成為固定形成,以防止升降或發生水平移動。但是,較佳地,也可以考慮台突起111配備於適配器500。The position of the platform protrusion 111 is selected to support the T-side portion of the contact terminal located at the rear end of the electronic component ED. Of course, the platform protrusion 111 does not necessarily have to be implemented to support the T-side portion of the contact terminal, and can be appropriately formed at any position as long as it is a specific position with a relatively high hardness that will not cause damage to the electronic component ED. Generally, electronic components ED such as solid state drives are collections of electronic components such as semiconductor chips, and the electronic components may be easily damaged even by small impacts or scratches. Therefore, in this embodiment, the T-side portion of the contact terminal, which is the most stable portion relative to impacts, is implemented to be supported by the platform protrusion 111, and is also implemented to prevent the electronic component ED from accidentally detaching to the rear. Unlike the support protrusion SM, this stage protrusion 111 is formed to be fixed to prevent lifting or horizontal movement. However, preferably, it is also possible to consider that the stage protrusion 111 is equipped on the adapter 500.

同樣地,在設置架110的前端部位具備能夠支撐沿前後方向最長的電子部件ED的前端部位的前端突起112。這種前端突起112也形成為固定,以防止升降或發生水平移動。在本實施例中,前端突起112配備於可支撐位於電子部件ED的前端部位的具有半圓形槽形態的機械圓墊部位M(參照圖15)的位置,但並不限定於此。Similarly, the front end of the mounting frame 110 is provided with a front end protrusion 112 capable of supporting the front end of the electronic component ED which is the longest in the front-rear direction. This front end protrusion 112 is also formed to be fixed to prevent lifting or horizontal movement. In this embodiment, the front end protrusion 112 is provided at a position that can support the mechanical pad portion M (refer to FIG. 15 ) having a semicircular groove shape located at the front end of the electronic component ED, but it is not limited to this.

即,由於上述的台突起111和前端突起112被固定,因此與電子部件ED的接觸衝擊可能較大,因此在本實施例中,將台突起111和前端突起112分別佈置於作為未佈置電子元件的部位的接觸端子T側部位和機械圓墊部位M。但是,根據實施,只要是不會對電子部件ED造成損傷的部位,就可以考慮與該部位對應地設置台突起111和前端突起112或與此類似的支撐單元。That is, since the above-mentioned platform protrusion 111 and front end protrusion 112 are fixed, the contact impact with the electronic component ED may be large, so in this embodiment, the platform protrusion 111 and front end protrusion 112 are respectively arranged at the contact terminal T side portion and the mechanical pad portion M, which are portions where electronic components are not arranged. However, according to the implementation, as long as it is a portion that does not cause damage to the electronic component ED, it can be considered to provide the platform protrusion 111 and the front end protrusion 112 or a similar supporting unit corresponding to the portion.

接著,對本變形例的操作進行說明。Next, the operation of this modified example will be described.

當移動手200將電子部件ED移動到適配器500時,電子部件ED由台突起111和支撐突起SM被支撐。圖17的(a)、(b)、(c)、(d)按照長度短的電子部件ED到長度長的電子部件ED的順序圖示了被台突起111及支撐突起SM支撐的狀態。在此,圖17的(d)圖示最長的電子部件ED的前後兩端由台突起111和前端突起112所支撐。作為參考,在圖17中省略了適配器500的圖示。When the moving hand 200 moves the electronic component ED to the adapter 500, the electronic component ED is supported by the table protrusion 111 and the support protrusion SM. (a), (b), (c), and (d) of Figure 17 illustrate the state of being supported by the table protrusion 111 and the support protrusion SM in the order of the electronic component ED with a short length to the electronic component ED with a long length. Here, (d) of Figure 17 illustrates that the front and rear ends of the longest electronic component ED are supported by the table protrusion 111 and the front end protrusion 112. For reference, the illustration of the adapter 500 is omitted in Figure 17.

同時,支撐突起SM的上端處於通過彈簧132a至132d而稍微上升的狀態,因此,如圖18的概念性參考圖所示,處於比引導槽GG的中心C稍微上升的狀態。但是,若夾持桿511、512之間的間隔變窄,則電子部件ED的兩端被引導槽GG引導而使電子部件ED下降,從而電子部件ED的兩端能夠被夾持桿511、512適當地夾持。此時,彈簧132a至132d無法從根本上禁止電子部件ED的下降,而是被彈性壓縮。At the same time, the upper end of the support protrusion SM is in a state of being slightly raised by the springs 132a to 132d, and therefore, as shown in the conceptual reference diagram of FIG18 , is in a state of being slightly raised than the center C of the guide groove GG. However, if the interval between the clamping rods 511 and 512 is narrowed, the two ends of the electronic component ED are guided by the guide groove GG to make the electronic component ED descend, so that the two ends of the electronic component ED can be properly clamped by the clamping rods 511 and 512. At this time, the springs 132a to 132d cannot fundamentally prohibit the electronic component ED from descending, but are elastically compressed.

相反,在夾持桿511、512解除夾持的情況下,通過彈簧132a至132d的彈性力電子部件ED稍微上升,此時,電子部件ED的兩端被引導槽GG引導,從而電子部件ED上升。因此,彈簧132a至132d的彈性力持續被抑制的同時電子部件ED上升,而當上升完成時,彈簧132a至132d的彈性力不再起作用。因此,即使在夾持桿511、512張開的程序中,也不會發生因彈簧132a至132d的彈力使電子部件ED彈出的情況。當完成電子部件ED的上升時,移動手200夾持電子部件ED並將電子部件ED移動到客戶托盤CT。On the contrary, when the clamping rods 511 and 512 are released from clamping, the electronic component ED is slightly raised by the elastic force of the springs 132a to 132d, and at this time, both ends of the electronic component ED are guided by the guide grooves GG, so that the electronic component ED rises. Therefore, the elastic force of the springs 132a to 132d is continuously suppressed while the electronic component ED rises, and when the rise is completed, the elastic force of the springs 132a to 132d no longer acts. Therefore, even in the process of the clamping rods 511 and 512 being opened, the electronic component ED will not be ejected by the elastic force of the springs 132a to 132d. When the ascent of the electronic component ED is completed, the moving hand 200 grips the electronic component ED and moves the electronic component ED to the customer tray CT.

根據本變形例,支撐突起SM被彈簧132a至132d彈性支撐,從而防止電子部件ED的損傷。然而,根據實施,如果存在需要電子部件ED的安裝程序非常精密地進行等的事由,則也可以充分考慮支撐突起SM不升降而被固定的情況。According to this modification, the support protrusion SM is elastically supported by the springs 132a to 132d, thereby preventing damage to the electronic component ED. However, according to the implementation, if there is a reason that the installation procedure of the electronic component ED needs to be performed very accurately, the support protrusion SM can also be fully considered to be fixed without being raised or lowered.

並且,在本變形例中,支撐部件131具有支撐突起SM並通過彈簧132a至132d彈性所支撐,但根據實施,也可以充分考慮支撐突起SM分別被彈性部件彈性支撐。 <針對支撐器的第二變形例> Furthermore, in this modification, the support member 131 has a support protrusion SM and is elastically supported by springs 132a to 132d, but depending on the implementation, it is also possible to fully consider that the support protrusion SM is elastically supported by the elastic member. <Second modification of the support>

在第二變形例中,如圖19的概念性的側視圖所示,在一個支撐器130配備有一個支撐突起SM,多個支撐器130沿前後方向並排配備於設置架110。作為參考,為了方便起見,在圖19中省略了適配器500。In the second modification, as shown in the conceptual side view of Fig. 19, one supporter 130 is provided with one support protrusion SM, and a plurality of supports 130 are arranged side by side in the front-rear direction on the mounting frame 110. For reference, the adapter 500 is omitted in Fig. 19 for convenience.

各個支撐器130設置於設置架110,在電子部件ED安置並固定於適配器500或對電子部件ED的固定解除的程序中支撐電子部件ED,從而防止電子部件ED向下方脫離。為此,支撐器130分別包括支撐突起SM和升降器132。Each supporter 130 is installed on the installation frame 110, and supports the electronic component ED when the electronic component ED is placed and fixed on the adapter 500 or when the electronic component ED is released from the fixing process, thereby preventing the electronic component ED from escaping downward. To this end, the supporter 130 includes a support protrusion SM and a lifter 132.

所有支撐突起SM配備為能夠升降,在上升時支撐電子部件ED,而在下降時解除電子部件ED的支撐。All the supporting protrusions SM are configured to be able to rise and fall, support the electronic components ED when rising, and release the support of the electronic components ED when falling.

所有升降器132分別升降對應的支撐突起SM,並固定於設置架110。All the lifters 132 lift the corresponding supporting protrusions SM respectively and are fixed to the mounting frame 110 .

配備多個支撐器130的理由是為了能夠支撐具有各種長度的電子部件ED。因此,特定升降器132與電子部件ED的長度對應地上升,使得位於電子部件ED的後端部位的接觸端子T側部位被台突起111所支撐,位於電子部件ED的前端部位的機械圓墊部位M被支撐突起SM所支撐。當然,在本實施例中,在設置架110的前端部位也配備有前端突起112。The reason for providing a plurality of supports 130 is to be able to support electronic components ED having various lengths. Therefore, a specific lifter 132 rises corresponding to the length of the electronic component ED, so that the contact terminal T side portion located at the rear end portion of the electronic component ED is supported by the stage protrusion 111, and the mechanical pad portion M located at the front end portion of the electronic component ED is supported by the support protrusion SM. Of course, in this embodiment, the front end portion of the mounting frame 110 is also provided with a front end protrusion 112.

圖20的(a)至(e)圖示本變形例中的支撐器130支撐各種長度的電子部件ED的狀態。作為參考,較佳地,在圖20中除了支撐電子部件ED的支撐突起SM之外,為了方便起見而省略的剩餘支撐突起SM處於下降的狀態。Fig. 20 (a) to (e) illustrate the state that the supporter 130 in this modification supports the electronic components ED of various lengths. For reference, preferably, in Fig. 20, in addition to the supporting protrusions SM supporting the electronic components ED, the remaining supporting protrusions SM omitted for convenience are in a lowered state.

並且,在本變形例中,實現為通過台突起111和支撐器130支撐作為沒有敏感的電子元件的部位的電子部件ED的接觸端子T側部位和機械圓墊部位M,但只要是不存在損傷發生憂慮的部位,就可以考慮與相應部位對應地設置支撐器130。Furthermore, in this variation, the contact terminal T side portion and the mechanical pad portion M of the electronic component ED, which are portions without sensitive electronic components, are supported by the platform protrusion 111 and the support 130. However, as long as there is no concern about damage, the support 130 may be considered to be set corresponding to the corresponding portion.

在此,支撐突起SM支撐機械圓墊D的理由在於,在電子部件ED的背面存在諸如半導體元件之類的電子晶片的情況下,難以以水平狀態支撐。Here, the reason why the supporting protrusion SM supports the mechanical pad D is that when an electronic chip such as a semiconductor element exists on the back side of the electronic component ED, it is difficult to support it in a horizontal state.

例如,電子部件ED具有各種寬度和長度,再加上,可在平面和背面設置高度不同的多個電子元件。因此,若支撐突起SM支撐具有電子元件的部分,則臥狀的電子部件ED向一側傾斜。在這種情況下,可能發生適配器500不能正確地夾持電子部件ED的情況,並且可能發生移動手200的拾取器不能正確地夾持電子部件ED的情況。由於這種理由,較佳地,支撐作為未設置電子元件的部位的接觸端子T側部位和機械圓墊部位M。因此,在本變形例中,接觸端子T側部位搭在台突起111的台J而被支撐,機械圓墊部位M被支撐突起SM或前端突起112支撐。 <針對支撐器的第三變形例> For example, the electronic component ED has various widths and lengths, and in addition, a plurality of electronic components of different heights can be arranged on the flat surface and the back surface. Therefore, if the supporting protrusion SM supports the portion having the electronic component, the horizontal electronic component ED tilts to one side. In this case, it may happen that the adapter 500 cannot properly clamp the electronic component ED, and it may happen that the pickup of the moving hand 200 cannot properly clamp the electronic component ED. For this reason, it is preferable to support the contact terminal T side portion and the mechanical pad portion M as the portion where the electronic component is not arranged. Therefore, in this modification, the side portion of the contact terminal T is supported by resting on the platform J of the platform protrusion 111, and the mechanical pad portion M is supported by the supporting protrusion SM or the front end protrusion 112. <Third modification of the support>

根據本變形例,如圖21的概念性的側視圖所示,支撐器130還具有用於移動升降器132的移動源133。According to the present variation, as shown in the conceptual side view of FIG. 21 , the support 130 also has a moving source 133 for moving the lifter 132.

較佳地,移動源133以應用馬達的結構實現。另外,升降器132在支撐突起SM下降的狀態下,可以通過移動源133向前後方向移動,從而可佈置於多個位置。因此,僅能夠支撐電子部件ED的一部位的支撐突起SM也能夠支撐在前後方向具有各種長度的電子部件ED的前端部位。當然,在設置架110沿前後方向形成有能夠升降支撐突起SM的多個升降孔UD。Preferably, the moving source 133 is implemented by a structure using a motor. In addition, the lifter 132 can be moved in the front-rear direction through the moving source 133 when the supporting protrusion SM is lowered, so that it can be arranged in multiple positions. Therefore, the supporting protrusion SM that can only support one part of the electronic component ED can also support the front end of the electronic component ED with various lengths in the front-rear direction. Of course, a plurality of lifting holes UD that can lift and lower the supporting protrusion SM are formed in the mounting frame 110 along the front-rear direction.

圖22的(a)和(b)例示了根據本變形例的支撐器130具有彼此不同長度的電子部件ED被支撐的情況。(a) and (b) of FIG. 22 illustrate a case where electronic components ED having lengths different from each other are supported by the support 130 according to the present modification.

同時,在上述第二變形例及第三變形例的情況下,需要確認支撐突起SM是否處於適當上升的狀態。因此,可以考慮在移動手200配備與拾取器一起移動的相機。在移動手200將電子部件ED安裝於適配器500之前,相機先進行拍攝。另外,控制單元通過由相機拍攝的圖像檢查支撐突起SM是否處於適當上升至所需位置的狀態,然後僅在支撐突起SM處於適當上升的狀態的情況下,控制執行通過移動手200將電子部件ED安置於適配器500的操作。當然,若支撐突起SM未處於適當上升的狀態,則控制單元產生堵塞(jam),並向管理人員告知該情況。當然,相機可以固定設置於支撐器130的上方。At the same time, in the case of the second and third variants described above, it is necessary to confirm whether the supporting protrusion SM is in a properly raised state. Therefore, it can be considered to equip the moving hand 200 with a camera that moves together with the pickup. Before the moving hand 200 installs the electronic component ED on the adapter 500, the camera takes a picture first. In addition, the control unit checks whether the supporting protrusion SM is in a state of properly rising to the desired position through the image taken by the camera, and then controls the execution of the operation of placing the electronic component ED on the adapter 500 through the moving hand 200 only when the supporting protrusion SM is in a properly raised state. Of course, if the supporting protrusion SM is not in a properly raised state, the control unit generates a jam and informs the administrator of the situation. Of course, the camera can be fixed on the support 130.

如前述,本發明的具體說明以參照圖式的實施例和變形例為參考進行了說明,但上述實施例僅以本發明的較佳例為例進行了說明。因此,本發明不應被理解為僅限於上述示例,並且本發明的權利範圍應被理解為申請專利範圍及其等同範圍。As mentioned above, the specific description of the present invention is described with reference to the embodiments and variations of the drawings, but the above embodiments are only described as the preferred examples of the present invention. Therefore, the present invention should not be understood as being limited to the above examples, and the scope of the present invention should be understood as the scope of the patent application and its equivalent scope.

100:用於電子部件測試的分選機的中繼裝置 110:設置架 120:夾持器 121:固定桿 FP:位置固定突起 122:驅動源 130:支撐器 131:支撐部件 SM:支撐突起 132:升降器 132a~132d:彈簧 133:移動源 140:旋轉器 150:吸附器 160:開放器 100: Relay device of sorting machine for electronic component testing 110: Setting frame 120: Clamp 121: Fixing rod FP: Position fixing protrusion 122: Driving source 130: Supporter 131: Supporting member SM: Supporting protrusion 132: Lifter 132a~132d: Spring 133: Moving source 140: Rotator 150: Suction device 160: Opener

圖1是用於說明電子部件與測試器之間的電連接結構的參考圖。FIG. 1 is a reference diagram for explaining the electrical connection structure between an electronic component and a tester.

圖2是針對能夠應用根據本發明的用於電子部件測試的分選機的中繼裝置的用於電子部件測試的分選機的概念性的結構圖。FIG. 2 is a conceptual structural diagram of a sorting machine for electronic component testing to which a relay device of the sorting machine for electronic component testing according to the present invention can be applied.

圖3是針對圖2的分選機的示意性的立體圖。FIG. 3 is a schematic three-dimensional diagram of the sorting machine of FIG. 2 .

圖4是針對應用於圖2的分選機的連接部分的概念性的平面圖。FIG. 4 is a conceptual plan view of a connection portion applied to the sorting machine of FIG. 2 .

圖5是根據本發明的用於電子部件測試的分選機的中繼裝置形成一對的適配器的結合立體圖。FIG. 5 is a three-dimensional diagram showing a pair of adapters formed by a relay device of a sorting machine for electronic component testing according to the present invention.

圖6是針對圖5的適配器的分解立體圖。FIG. 6 is an exploded perspective view of the adapter of FIG. 5 .

圖7是針對應用於圖5的適配器的夾持桿的截取圖。FIG. 7 is a cutaway view of a clamping rod used with the adapter of FIG. 5 .

圖8是針對在圖7的夾持桿的引導槽的虛擬截取圖。FIG. 8 is a virtual cutaway view of the guide groove of the clamping rod in FIG. 7 .

圖9是用於說用圖8的引導槽的作用的放大的參考圖。FIG. 9 is an enlarged reference diagram for explaining the function of the guide groove of FIG. 8 .

圖10是用於說明圖5的適配器和測試手的關係的參考圖。FIG. 10 is a reference diagram for explaining the relationship between the adapter and the test hand of FIG. 5 .

圖11是用於說明圖5的在適配器的位置設定突起的參考圖。FIG. 11 is a reference diagram for explaining the setting of the protrusion at the position of the adapter in FIG. 5 .

圖12是針對根據本發明的一實施例的電子部件測試用分選機的中繼裝置的結合立體圖。FIG. 12 is a three-dimensional diagram showing a combined relay device of a sorting machine for testing electronic components according to an embodiment of the present invention.

圖13是針對圖12的中繼裝置的分解立體圖。FIG. 13 is an exploded perspective view of the relay device of FIG. 12 .

圖14是針對應用於圖12的中繼裝置的支撐器的截取圖。FIG. 14 is a screenshot of a supporter used in the relay device of FIG. 12 .

圖15是用於說明電子部件的旋轉狀態的參考圖。FIG. 15 is a reference diagram for explaining a rotation state of an electronic component.

圖16至圖22是用於說明能夠應用於根據本發明的中繼裝置的支撐器的各種變形例的參考圖。Figures 16 to 22 are reference diagrams for illustrating various variations of the support that can be applied to the relay device according to the present invention.

國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無 Domestic storage information (please note in the order of storage institution, date, and number) None Foreign storage information (please note in the order of storage country, institution, date, and number) None

500:適配器 500:Adapter

520:設置框架 520: Setting the framework

521:位置設定突起 521: Position setting protrusion

Claims (20)

一種用於電子部件測試的分選機的中繼裝置,包括:設置架,在所述設置架的上表面放置具有安置電子部件的適配器;夾持器,夾持放置於所述設置架的上表面的所述適配器的後端部位的左右兩端;支撐器,支撐安置在放置於所述設置架的上表面的所述適配器的電子部件或解除支撐狀態;及開放器,開放通過所述夾持器固定的所述適配器,其中所述夾持器、所述支撐器以及所述開放器設置於所述設置架,其中所述支撐器包括用於支撐電子部件的支撐部件,所述支撐部件具有至少一個支撐突起,所述至少一個支撐突起與所述適配器的至少一個貫通槽相對應地佈置而支撐電子部件。 A relay device of a sorting machine for testing electronic components, comprising: a setting frame, on the upper surface of which an adapter for placing electronic components is placed; a clamp, which clamps the left and right ends of the rear end of the adapter placed on the upper surface of the setting frame; a supporter, which supports the electronic component placed on the adapter placed on the upper surface of the setting frame or releases the supporting state; and an opener, which opens the adapter fixed by the clamper, wherein the clamper, the supporter and the opener are arranged on the setting frame, wherein the supporter includes a supporting component for supporting the electronic component, the supporting component having at least one supporting protrusion, and the at least one supporting protrusion is arranged corresponding to at least one through slot of the adapter to support the electronic component. 根據請求項1所述的用於電子部件測試的分選機的中繼裝置,其中所述夾持器包括:一對固定桿,用於夾持所述適配器後端部位的左右兩端;及驅動源,通過縮小或增加所述一對固定桿之間的間隔,來使所述一對固定桿夾持所述適配器或解除夾持,其中所述一對固定桿在彼此面對的面上具有能夠插入到位於所述適配器的位置固定槽中的位置固定銷。 According to the relay device of the sorting machine for electronic component testing as described in claim 1, the clamp includes: a pair of fixing rods for clamping the left and right ends of the rear end of the adapter; and a driving source, by reducing or increasing the interval between the pair of fixing rods, so that the pair of fixing rods clamp or release the adapter, wherein the pair of fixing rods have position fixing pins on the surfaces facing each other that can be inserted into the position fixing groove of the adapter. 根據請求項1所述的用於電子部件測試的分選機的中繼裝置,還包括:旋轉器,通過將所述設置架進行正反旋轉,使放置於所述設置架的所述適配器以及安置於所述適配器的電子部件的姿勢從立狀轉換為臥狀的或從臥狀轉換為立狀。 The relay device of the sorting machine for electronic component testing according to claim 1 further includes: a rotator, which rotates the setting frame forward and reversely to change the posture of the adapter placed on the setting frame and the electronic component placed on the adapter from a vertical position to a horizontal position or from a horizontal position to a vertical position. 根據請求項1所述的用於電子部件測試的分選機的中繼裝置,還包括:吸附器,真空吸附放置於所述設置架的上表面的所述適配器的前端部位來進行固定。 The relay device of the sorting machine for electronic component testing according to claim 1 further includes: an absorber that vacuum absorbs the front end of the adapter placed on the upper surface of the mounting frame to fix it. 根據請求項1所述的用於電子部件測試的分選機的中繼裝置,其中所述支撐器還包括:升降器,升降所述支撐部件,使得當所述支撐部件上升時,所述支撐部件位於能夠支撐電子部件的位置,而當下降時,解除電子部件的支撐狀態。 According to the relay device of the sorting machine for electronic component testing described in claim 1, the support further includes: a lifter that lifts the support component so that when the support component rises, the support component is located at a position capable of supporting the electronic component, and when it falls, the support state of the electronic component is released. 根據請求項1所述的用於電子部件測試的分選機的中繼裝置,其中所述設置架具有能夠支撐電子部件的特定部位的具有台的台突起,所述台突起固定於用於電子部件測試的分選機的中繼裝置。 According to the relay device of the sorting machine for electronic component testing as described in claim 1, the mounting frame has a table protrusion with a table capable of supporting a specific part of the electronic component, and the table protrusion is fixed to the relay device of the sorting machine for electronic component testing. 一種用於電子部件測試的分選機的中繼裝置,包括:設置架,在所述設置架的上表面放置具有安置電子部 件的適配器;夾持器,夾持放置於所述設置架的上表面的所述適配器的後端部位的左右兩端;支撐器,支撐安裝在放置於所述設置架的上表面的所述適配器的電子部件或解除支撐狀態;及開放器,開放通過所述夾持器固定的所述適配器,其中所述夾持器、所述支撐器以及所述開放器設置於所述設置架,其中所述支撐器包括用於支撐電子部件的支撐部件,所述支撐部件具有至少一個支撐突起,所述至少一個支撐突起與所述適配器的至少一個貫通槽相對應地佈置而支撐電子部件,所述支撐突起在電子部件在安置並固定於所述適配器或解除對電子部件的固定的程序中防止電子部件的脫離。 A relay device of a sorting machine for testing electronic components, comprising: a mounting frame, on the upper surface of which an adapter having electronic components mounted thereon is placed; a clamp, which clamps the left and right ends of the rear end of the adapter placed on the upper surface of the mounting frame; a supporter, which supports the electronic components mounted on the adapter placed on the upper surface of the mounting frame or releases the support state; and an opener, which opens the adapter fixed by the clamper, wherein The clamp, the support and the opener are arranged on the mounting frame, wherein the support includes a support component for supporting the electronic component, the support component has at least one support protrusion, the at least one support protrusion is arranged corresponding to at least one through slot of the adapter to support the electronic component, and the support protrusion prevents the electronic component from detaching during the process of placing and fixing the electronic component to the adapter or releasing the fixing of the electronic component. 根據請求項7所述的用於電子部件測試的分選機的中繼裝置,其中所述夾持器包括:一對固定桿,用於夾持所述適配器後端部位的左右兩端;及驅動源,通過縮小或增加所述一對固定桿之間的間隔,來使所述一對固定桿夾持所述適配器或解除夾持,其中所述一對固定桿在彼此面對的面上具有能夠插入到位於所述適配器的位置固定槽中的位置固定銷。 According to claim 7, the relay device of the sorting machine for electronic component testing, wherein the clamp includes: a pair of fixing rods for clamping the left and right ends of the rear end of the adapter; and a driving source, by reducing or increasing the interval between the pair of fixing rods, so that the pair of fixing rods clamp or release the adapter, wherein the pair of fixing rods have position fixing pins on the surfaces facing each other that can be inserted into the position fixing groove of the adapter. 根據請求項7所述的用於電子部件測試的分選機的中繼裝置,還包括: 旋轉器,通過將所述設置架進行正反旋轉,使放置於所述設置架的所述適配器以及安置於所述適配器的電子部件的姿勢從立狀轉換為臥狀的或從臥狀轉換為立狀。 The relay device of the sorting machine for electronic component testing according to claim 7 further comprises: A rotator, which rotates the setting frame forward and reversely to change the posture of the adapter placed on the setting frame and the electronic component placed on the adapter from a vertical position to a horizontal position or from a horizontal position to a vertical position. 根據請求項7所述的用於電子部件測試的分選機的中繼裝置,還包括:吸附器,真空吸附放置於所述設置架的上表面的所述適配器的前端部位來進行固定。 The relay device of the sorting machine for electronic component testing according to claim 7 further includes: an absorber that vacuum absorbs the front end of the adapter placed on the upper surface of the mounting frame to fix it. 根據請求項7所述的用於電子部件測試的分選機的中繼裝置,其中所述支撐器還包括:升降器,升降所述支撐部件,使得當所述支撐部件上升時,所述支撐部件位於能夠支撐電子部件的位置,而當下降時,解除電子部件的支撐狀態。 According to the relay device of the sorting machine for electronic component testing described in claim 7, the support further includes: a lifter that lifts the support component so that when the support component rises, the support component is located at a position capable of supporting the electronic component, and when it falls, the support state of the electronic component is released. 根據請求項7所述的用於電子部件測試的分選機的中繼裝置,其中所述支撐器還可以包括:支撐部件,配備為相對於所述設置架能夠升降;及彈性部件,彈性支撐所述支撐部件,所述支撐突起配置於所述支撐部件。 According to the relay device of the sorting machine for electronic component testing described in claim 7, the support device may also include: a support component, which is configured to be able to rise and fall relative to the setting frame; and an elastic component, which elastically supports the support component, and the support protrusion is configured on the support component. 根據請求項7所述的用於電子部件測試的分選機的中繼裝置,其中所述支撐突起沿前後方向配備有多個,從而能夠支撐沿前後方向具有各種長度的電子部件。 According to claim 7, the relay device of the sorting machine for electronic component testing is provided with a plurality of support protrusions along the front-to-back direction, so as to be able to support electronic components having various lengths along the front-to-back direction. 根據請求項7所述的用於電子部件測試的分 選機的中繼裝置,其中所述支撐器還包括:升降器,升降所述支撐突起;及移動源,通過沿前後方向移動所述升降器,來使所述支撐突起最終能夠支撐沿前後方向具有各種長度的電子部件。 According to claim 7, the relay device of the sorting machine for electronic component testing, wherein the support further includes: a lifter for lifting the support protrusion; and a moving source, by moving the lifter in the front-rear direction, so that the support protrusion can eventually support electronic components having various lengths in the front-rear direction. 根據請求項7所述的用於電子部件測試的分選機的中繼裝置,其中所述設置架具有能夠支撐電子部件的特定部位的具有台的台突起,所述台突起固定於用於電子部件測試的分選機的中繼裝置。 According to claim 7, the relay device of the sorting machine for testing electronic components, wherein the mounting frame has a table protrusion with a table capable of supporting a specific part of the electronic component, and the table protrusion is fixed to the relay device of the sorting machine for testing electronic components. 一種用於電子部件測試的分選機的中繼裝置,包括:設置架,在所述設置架的上表面放置具有安置電子部件的適配器;夾持器,夾持放置於所述設置架的上表面的所述適配器的後端部位的左右兩端;吸附器,真空吸附放置於所述設置架的所述適配器的前端部位來進行固定;及開放器,開放通過所述夾持器和所述吸附器固定的所述適配器,其中所述夾持器、所述吸附器以及所述開放器設置於所述設置架。 A relay device of a sorting machine for testing electronic components, comprising: a setting frame, on the upper surface of which an adapter with electronic components is placed; a clamp, which clamps the left and right ends of the rear end of the adapter placed on the upper surface of the setting frame; an absorber, which fixes the front end of the adapter placed on the setting frame by vacuum absorption; and an opener, which opens the adapter fixed by the clamp and the absorber, wherein the clamp, the absorber and the opener are arranged on the setting frame. 根據請求項16所述的用於電子部件測試的分選機的中繼裝置,其中所述夾持器包括:一對固定桿,用於夾持所述適配器後端部位的左右兩端;及驅動源,通過縮小或增加所述一對固定桿之間的間隔,來使所述一對固定桿夾持所述適配器或解除夾持,其中所述一對固定桿在彼此面對的面上具有能夠插入到位於所述適配器的位置固定槽中的位置固定銷。 According to claim 16, the relay device of the sorting machine for electronic component testing, wherein the clamp comprises: a pair of fixing rods for clamping the left and right ends of the rear end of the adapter; and a driving source, by reducing or increasing the interval between the pair of fixing rods, to enable the pair of fixing rods to clamp or release the adapter, wherein the pair of fixing rods have position fixing pins on the surfaces facing each other that can be inserted into the position fixing groove of the adapter. 根據請求項16所述的用於電子部件測試的分選機的中繼裝置,還包括:旋轉器,通過將所述設置架進行正反旋轉,使放置於所述設置架的所述適配器以及安置於所述適配器的電子部件的姿勢從立狀轉換為臥狀的或從臥狀轉換為立狀。 The relay device of the sorting machine for electronic component testing according to claim 16 further includes: a rotator, which rotates the setting frame forward and reversely to change the posture of the adapter placed on the setting frame and the electronic component placed on the adapter from a vertical position to a horizontal position or from a horizontal position to a vertical position. 根據請求項16所述的用於電子部件測試的分選機的中繼裝置,其中所述設置架具有能夠支撐電子部件的特定部位的具有台的台突起,所述台突起固定於用於電子部件測試的分選機的中繼裝置。 According to claim 16, the relay device of the sorting machine for testing electronic components, wherein the mounting frame has a table protrusion with a table capable of supporting a specific part of the electronic component, and the table protrusion is fixed to the relay device of the sorting machine for testing electronic components. 一種用於電子部件測試的分選機的中繼裝置的操作方法,包括:開放步驟,開放適配器;安置步驟,通過移動手將電子部件安置於所述適配 器;夾持步驟,所述適配器夾持電子部件;及解除步驟,解除移動手對於電子部件的吸附,在所述安置步驟中,處於通過支撐部件支撐電子部件的後端部位的多個位置的狀態,之後通過移動手使電子部件下降的同時進行加壓,從而使彎曲的電子部件處於平坦地展開的狀態,之後執行所述夾持步驟。 An operating method of a relay device of a sorting machine for electronic component testing includes: an opening step, opening an adapter; a placement step, placing the electronic component on the adapter by a moving hand; a clamping step, the adapter clamps the electronic component; and a release step, releasing the adsorption of the electronic component by the moving hand, in which the rear end of the electronic component is supported by a supporting component at multiple positions, and then the electronic component is lowered by the moving hand while being pressurized, so that the bent electronic component is in a flatly unfolded state, and then the clamping step is performed.
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