TWI848751B - Camera module and electronic device - Google Patents

Abstract

The present disclosure provides a camera module and an electronic device. The camera module includes a housing, a temperature sensor, a thermostat and an infrared detector. The temperature sensor, the thermostat and the infrared detector are arranged in the housing. The temperature sensor is used to sense a first temperature of the housing. The thermostat is used to adjust the first temperature in the housing to a target temperature when the first temperature is not equal to the target temperature. There is a preset ratio between the target temperature and a second temperature outside the housing. The infrared detector is used to detect the infrared radiation of a target object when the first temperature reaches the target temperature. This present disclosure uses a thermostat to adjust the first temperature to the target temperature.

Description

Camera modules and electronic equipment

This application relates to the field of electronic equipment technology, and in particular to a camera module and electronic equipment.

The infrared camera includes an imaging module, and an infrared detector is installed in the casing of the imaging module. Changes in the ambient temperature outside the casing of the imaging module or changes in the temperature around the infrared detector caused by the operation of the imaging module inside the casing will affect the infrared detector's reception of infrared rays from the target being measured.

In order to improve the detection accuracy of the infrared detector for the target being measured, the infrared camera stores the ratio of the temperature inside and outside the shell in a balanced state. When the inside and outside of the camera module shell reach a balanced state, the infrared camera can identify the temperature generated by the infrared rays of the target being measured obtained by the infrared detector according to the relevant algorithm. That is, the infrared camera can obtain the accurate temperature of the target being measured, so that the thermal image generated based on the accurate temperature is more accurate.

At present, the camera module mainly relies on the device's own temperature conduction or air convection to keep the temperature outside the shell in a balanced state with the temperature inside the shell. This process takes about 15 to 20 minutes, which takes a lot of time and affects the user experience.

In view of this, this application provides a camera module and electronic equipment, so that the second temperature outside the housing of the camera module and the first temperature inside the housing can reach a preset ratio in a balanced state more quickly.

The first aspect of the present application provides a camera module, which includes: a housing, a temperature sensor, a temperature adjustment device and an infrared detector. The temperature sensor, the temperature adjustment device and the infrared detector are arranged in the housing. The temperature sensor is used to sense a first temperature in the housing. The temperature adjustment device is used to adjust the first temperature in the housing to the target temperature when the first temperature is not equal to the target temperature, wherein the target temperature and the second temperature outside the housing have a preset ratio. The infrared detector is used to detect infrared radiation of the target when the first temperature reaches the target temperature.

It can be understood that the temperature sensor disposed in the housing can detect the first temperature in the housing, and the temperature adjustment device disposed in the housing adjusts the first temperature in the housing to reach the target temperature, which can accelerate the preset ratio when the first temperature in the housing of the camera module and the second temperature outside the housing reach a balanced state.

In some embodiments of the first aspect, the temperature regulating device includes a heater, which is disposed in the housing and is used to increase the first temperature when the first temperature is lower than the target temperature.

In some embodiments of the first aspect, the temperature regulating device further includes a cooling chip, which is disposed between the bottom plate of the infrared detector and the bottom wall of the housing. The cooling chip is used to lower the first temperature when the first temperature is greater than the target temperature so that the first temperature reaches the target temperature.

In some embodiments of the first aspect, the imaging module further includes a circuit board, the circuit board is located between the bottom plate of the infrared detector and the bottom wall of the shell, and the circuit board is provided with a receiving portion, which is used to receive the cooling chip.

The second aspect of the present application provides an electronic device, the electronic device includes a processor and the above-mentioned camera module, the processor is used to: control the temperature sensor in the housing to sense the first temperature in the housing; if the first temperature in the housing is not equal to the target temperature, control the temperature adjustment device to adjust the first temperature to the target temperature.

In some embodiments of the second aspect, the processor is also used to: if the first temperature in the housing is equal to the preset temperature, control the temperature regulating device to stop regulating the first temperature; after a preset time, confirm the change slope of the first temperature in the housing; if the change slope is less than the preset value, confirm that the first temperature at this time is the target temperature.

In some embodiments of the second aspect, the processor is also used to: if the change slope is greater than a preset value, control the temperature adjustment device to adjust the first temperature until the change slope is less than the preset value.

In some embodiments of the second aspect, the temperature regulating device includes a heater, and the processor is also used to: if the first temperature in the housing is lower than the target temperature, control the heater to increase the first temperature so that the first temperature reaches the target temperature.

In some embodiments of the second aspect, the temperature regulating device further includes a cooling chip, and the processor is further used to: if the first temperature in the housing is greater than the target temperature, control the cooling chip to lower the first temperature so that the first temperature reaches the target temperature.

In some embodiments of the second aspect, the processor is also used to: when the first temperature in the housing reaches the target temperature, control the infrared detector to detect the infrared radiated by the target to be measured; determine the temperature information corresponding to the infrared radiated by the target to be measured, and generate a thermal imaging image of the target to be measured based on the temperature information.

100: Electronic equipment

10: Camera module

20: Processor

1: Target to be tested

11: Shell

12: Lens

13: Infrared detector

14: Temperature sensor

15: Temperature control device

16: Circuit board

111: Top wall

112: Bottom wall

113: First side wall

114: Second side wall

131:Packaging shell

132: Optical window

133:Micro-electromechanical system components

134: Substrate

1311: Shell

1312: Shell bottom plate

1313: First side shell plate

1314: Second side shell panel

G2, G1: Containment space

151: Heater

152: Refrigeration chip

161: Containment Department

Figure 1 is a schematic diagram of the spectrum of infrared rays radiated by different objects.

Figure 2 is a schematic diagram of the structure of an electronic device in an embodiment of this application.

Figure 3 is another schematic diagram of the structure of the electronic device of the embodiment of this application.

FIG4 is a schematic diagram of a detailed structure of the electronic device shown in FIG3.

Figure 5 is a schematic diagram of the first temperature change in the housing of the camera module of the embodiment of the present application.

Figure 6 is an application scenario diagram of the electronic device shown in Figure 3.

The following is a brief description of the relevant technologies.

Absolute zero refers to -273℃. When the temperature of an object exceeds absolute zero, the molecules and atoms of the object will move randomly, and its surface will continuously radiate infrared rays. The higher the temperature, the more intense the random movement, and the higher the energy of the infrared rays radiated by the object. For example, as shown in Figure 1, the spectrum curves of infrared rays radiated by different objects, the horizontal axis represents the infrared wavelength (unit: kJ/μm), and the vertical axis represents the infrared spectrum emissivity (unit: kJ/μm). From the figure, it can be seen that the wavelength and spectrum emissivity of infrared rays radiated by the surfaces of different objects at different temperatures are different. The energy corresponding to the peak wave of the figure can be calculated by Wien's displacement law. For example, the peak wavelength and spectral emissivity of infrared wavelengths emitted by water at 0℃ and 100℃ are different. The peak wavelength of water at 0℃ is about 10μm, and the spectral emissivity corresponding to the peak wavelength is about 0.2kJ/μm, and the energy is about 0.2kJ. The peak wavelength of water at 100℃ is about 8μm, and the spectral emissivity corresponding to the peak wavelength is about 0.98kJ/μm, and the energy is about 7.8kJ.

The following is a brief description of the relevant technologies.

The infrared camera includes an imaging module and a processor. The infrared detector is installed in the casing of the imaging module. The working principle of the imaging module is that after the infrared detector receives the infrared radiation emitted by the target, its sensitive element, such as the temperature resistor, will generate an electrical signal according to the change of infrared energy. The imaging module sends the electrical signal to the processor, which collects the electrical signal and processes it in combination with relevant algorithms to generate a thermal imaging image of the target.

Ambient temperature changes or camera module operation will cause the temperature around the infrared detector to change. Temperature changes around the infrared detector will cause changes in the infrared energy around the infrared detector, affecting the infrared detector's reception of infrared rays from the target being measured. For example, after the camera module is activated, components such as the backing of the camera module work to generate energy to radiate infrared rays. After the infrared detector receives the infrared rays radiated by the components and the target being measured, it cannot identify the infrared rays of the target being measured, and the generated thermal image of the target being measured is inaccurate.

At present, in order to improve the detection accuracy of the infrared detector for the target being measured, the processor stores the temperature lookup data table and related algorithms. The temperature lookup data table includes the ratio between the two parameters of the outer shell temperature and the inner shell temperature of the camera module when they are in a balanced state. When the inside and outside of the camera module shell reach a balanced state, the processor can identify the temperature generated by the infrared rays of the target being measured obtained by the infrared detector according to the related algorithm. That is, when the inside and outside of the camera module shell reach a balanced state, the processor can obtain the accurate temperature of the target being measured, so that the thermal image generated based on the accurate temperature is more accurate.

At present, the camera module mainly relies on the device's own temperature conduction or air convection to keep the temperature outside the shell in a balanced state with the temperature inside the shell. This process takes about 15 to 20 minutes and is a long process.

In view of this, this application provides a camera module and an electronic device, so that the temperature outside the camera module shell and the temperature inside the shell can reach a ratio of equilibrium state more quickly.

Please refer to Figure 2, which is a schematic diagram of the structure of an electronic device 100 provided in an embodiment of the present application. The electronic device 100 includes a camera module 10 and a processor 20. The camera module 10 is connected to the processor 20 for communication. Please refer to Figure 3, the infrared ray radiated by the target 1 is incident on the camera module 10, and the camera module 10 is used to obtain the infrared ray radiated by the target 1, and after generating an electrical signal according to the infrared ray, the electrical signal is sent to the processor 20. The processor 20 is used to generate a thermal imaging image of the target 1 according to the electrical signal.

The electronic device 100 may be, but is not limited to, an infrared camera, a personal computer (PC), a personal digital assistant (PDA), and a mobile phone. The processor 20 may be, but is not limited to, a microcontroller unit (MCU) or a central processing unit (CPU), which is not limited here. The processor 20 may also be a cloud server, a desktop computer, a network server, a service cluster, a wireless terminal device, an embedded device, or other devices with data processing functions.

Please refer to Figure 4, which is a schematic diagram of the structure of the camera module 10 of an embodiment of the present application. The camera module 10 includes a housing 11, a lens 12, an infrared detector 13, a temperature sensor 14 and a temperature adjustment device 15. The housing 11 includes a top wall 111 and a bottom wall 112 arranged opposite to each other, and a plurality of side walls. The number of side walls is not limited, and the angles formed between the side walls can be equal or unequal.

Optionally, the top wall 111 and the bottom wall 112 may be arranged in parallel. For example, the top wall 111 and the bottom wall 112 are both arranged along the first direction (such as the X-axis direction of FIG. 4 ). In an optional implementation, the plurality of side walls include a first side wall 113, a second side wall 114, a third side wall and a fourth side wall (the third side wall and the fourth side wall are not shown). The first side wall 113 and the second side wall 114 are arranged opposite to each other, and the third side wall and the fourth side wall are arranged opposite to each other. For example, the first side wall 113, the second side wall 114, the third side wall and the fourth side wall are all arranged vertically along the second direction (such as the Z-axis direction of FIG. 4 ), and optionally, they may not be arranged vertically. One side of the third side wall and the fourth side wall are connected to the first side wall 113, and the other side is connected to the second side wall 114. One end of the first side wall 113 and the second side wall 114 are connected to the bottom wall 112, and the other end is connected to the top wall 111 to form a storage space G1. The storage space G1 is used to store various components of the camera module 10, such as the lens 12, the infrared detector 13, the temperature sensor 14 and the temperature adjustment device 15.

The lens 12 is disposed on the top wall 111. For example, the lens 12 can be disposed in the middle of the top wall 111. The lens 12 is used to transmit infrared rays of the target 1 to be measured into the housing 11.

The infrared detector 13 is arranged opposite to the lens 12. The infrared detector 13 is used to detect the infrared rays radiated by the target 1 when the first temperature reaches the target temperature, and to generate an electrical signal according to the energy change of the infrared rays of the target 1.

The infrared detector 13 includes a package 131, an optical window 132, a micro-electro-mechanical system (MEMS) component 133 and a substrate 134. The optical window 132 is disposed on the package 131 and is disposed opposite to the lens 12. The optical window 132 and the lens 12 are disposed in parallel so that the infrared rays in the housing 11 are transmitted into the package 131 of the infrared detector 13. The MEMS component 133 and the substrate 134 are contained in the package 131.

The package shell 131 includes a shell cover 1311 and a shell bottom plate 1312 arranged opposite to each other, and a plurality of side shell plates. The optical window 132 is arranged on the shell cover 1311. The number of side shell plates is not limited, and the angles formed between the side shell plates can be equal or unequal. The shell cover 1311 and the shell bottom plate 1312 are arranged in parallel. For example, the shell cover 1311 and the shell bottom plate 1312 are both arranged in a first direction (such as the X-axis direction in FIG. 4).

It can be understood that the top wall 111, the bottom wall 112, the shell cover 1311 and the shell bottom plate 1312 are arranged in parallel, and the lens 12 arranged on the top wall 111 and the optical window 132 arranged on the shell cover 1311 are arranged opposite to each other. In this way, infrared rays can be accurately transmitted from the lens 12 and the optical window 132 into the packaging shell 131 in sequence.

The cross-sectional length of the shell bottom plate 1312 may be longer than the cross-sectional length of the shell cover 1311. In one embodiment, the side shell plate includes a first side shell plate 1313, a second side shell plate 1314, a third side shell plate and a fourth side shell plate (the third side shell plate and the fourth side shell plate are not shown). The first side shell plate 1313 is arranged opposite to the second side shell plate 1314, and the third side shell plate is arranged opposite to the fourth side shell plate. For example, the first side shell plate 1313, the second side shell plate 1314, the third side shell plate and the fourth side shell plate are all arranged vertically in the second direction (such as the Z-axis direction in FIG. 4), and optionally, they may not be arranged vertically.

One side of the third and fourth side shell plates are connected to the first side shell plate 1313, and the other side is connected to the second side shell plate 1314. One end of the first and second side shell plates 1313 and 1314 is connected to the shell bottom plate 1312, and the other end is connected to the shell cover 1311 to form a receiving space G2. The receiving space G2 is used to receive the micro-electromechanical system components 133 and the substrate 134.

The substrate 134 is disposed on the housing bottom plate 1312 and is disposed opposite to the optical window 132. The micro-electromechanical system component 133 is disposed on the substrate 134 and is disposed opposite to the optical window 132, so that the infrared rays transmitted into the package housing 131 can accurately be incident on the sensitive element of the micro-electromechanical system component 133.

The MEMS components 133 include components such as sensitive elements and preamplifiers prepared based on MEMS technology. Among them, the sensitive elements generate electrical signals according to the energy changes generated by infrared rays. For example, the number of sensitive elements can be 70,000 to 2,100,000. The MEMS components 133 can be integrated onto the substrate 134 using integrated circuit (ASIC, Application Specific Integrated Circuit) chip technology to form a chip of the infrared detector 13.

The temperature sensor 14 is disposed on the inner wall of the housing 11, and the temperature sensor 14 is used to sense the first temperature in the housing 11. Specifically, the temperature sensor 14 can be disposed on one side of any one of the top wall 111, the bottom wall 112, the first side wall 113, the second side wall 114, the third side wall or the fourth side wall. As an example, as shown in FIG. 4, the temperature sensor 14 can be disposed on one side of the first side wall 113 close to the infrared detector 13. In one practicable manner, the temperature sensor 14 can be disposed on the side wall closest to the infrared detector 13 to increase the sensitivity of sensing the ambient temperature of the infrared detector 13.

The temperature regulating device 15 is used to regulate the first temperature in the housing 11 to the target temperature if the first temperature is not equal to the target temperature.

The processor 20 is also used to control the temperature sensor 14 in the housing 11 to sense the first temperature in the housing 11. If the first temperature in the housing 11 is not equal to the target temperature, the temperature regulating device 15 is controlled to adjust the first temperature to the target temperature. If the first temperature in the housing 11 is equal to the target temperature, the processor 20 controls the temperature regulating device 15 not to adjust the first temperature.

Among them, the temperature sensor 14 detects the first temperature inside the shell 11, and the second temperature outside the shell 11 can be detected by the temperature sensor 14 outside the shell 11.

It can be understood that when the first temperature in the housing 11 is adjusted to the target temperature, that is, when the target temperature and the second temperature outside the housing have a preset ratio, the first temperature in the housing 11 and the second temperature outside the housing 11 can reach a balance state. At this time, the camera module 10 can identify the temperature generated by the infrared rays of the target 1 obtained by the infrared detector 13 according to the relevant algorithm. That is, the camera module 10 can obtain the accurate temperature of the target 1 to make the thermal image generated according to the accurate temperature more accurate.

表示，於第一種應用場景下，殼體11內之第一溫度從0℃升溫至平衡狀態之目標溫度時，所需時間約為20min，目標溫度約為10℃。曲線

表示，於第二種應用場景下，殼體11內溫度之溫度從10℃升溫至平衡狀態之目標溫度時，所需時間約為20min，目標溫度約為15℃。 Specifically, the target temperature is the first temperature inside the housing 11 when the temperature reaches a preset ratio with the second temperature outside the housing 11. The target temperature can be set according to the mapping relationship between the temperature outside the housing 11 and the temperature inside the housing 11 in the temperature lookup table. The target temperature of the camera module 10 is different in different application scenarios. For example, please refer to Figure 5, where the vertical axis represents the temperature inside the housing 11 (°C), and the horizontal axis represents the sensing time of the temperature sensor 14 (min). The different curves in the figure represent the time and temperature required for the first temperature inside the housing 11 to reach the target temperature in different application scenarios. The curve area that tends to be flat is the first temperature in the equilibrium state, that is, the target temperature. For example, the curve

It indicates that in the first application scenario, when the first temperature in the housing 11 rises from 0°C to the target temperature of the equilibrium state, the time required is about 20 minutes, and the target temperature is about 10°C.

It indicates that in the second application scenario, when the temperature inside the housing 11 rises from 10°C to the target temperature of the equilibrium state, the required time is about 20 minutes, and the target temperature is about 15°C.

It can be understood that the temperature change curve diagram of FIG. 5 exemplarily shows the time and temperature required for the first temperature inside the housing 11 to reach a balanced state when the second temperature outside the housing 11 rises. Similarly, there is also a curve of the time and temperature required for the first temperature inside the housing 11 to reach a balanced state when the second temperature outside the housing 11 drops.

In some embodiments, the processor 20 is also used to control the temperature regulating device 15 to stop regulating the first temperature if the first temperature in the housing 11 is equal to the preset temperature.

The preset temperature can be obtained based on experimental data. Specifically, when the processor 20 controls the temperature regulating device 15 to regulate the first temperature in the housing 11, when the first temperature detected by the temperature sensor 14 is the preset temperature, the temperature regulating device 15 is controlled to stop regulating the first temperature in the housing 11.

The processor 20 is also used to confirm the change slope of the first temperature in the housing 11 after a preset time.

於0至20min內之斜率為10÷20=0.5。可理解，由於剛剛調節完殼體11內之第一溫度，第一溫度之變化斜率不穩定。因此，可停止時間達預設時間後，再確認殼體11內之第一溫度之變化斜率。 The preset time can be obtained based on experimental data. The change slope of the first temperature refers to the slope of the curve shown in Figure 5, that is, the change slope of the first temperature can be obtained based on the first temperature difference between a certain time period and the certain time period. For example, the curve

The slope from 0 to 20 minutes is 10÷20=0.5. It can be understood that since the first temperature in the housing 11 has just been adjusted, the change slope of the first temperature is unstable. Therefore, the change slope of the first temperature in the housing 11 can be confirmed after the stop time reaches the preset time.

Specifically, the processor 20 can control the temperature sensor 14 to detect the first temperature in the housing 11 after stopping adjusting the first temperature for a preset time. Then, the processor 20 confirms the change slope according to the time detected by the temperature sensor 14 and the detected first temperature.

The processor 20 is also used to confirm that the first temperature at this time is the target temperature if the change slope is less than a preset value.

The default value is the slope of the first temperature when the temperature inside and outside the housing 11 of the camera module 10 reaches a balanced state. After the temperature inside and outside the housing 11 of the camera module 10 reaches a balanced state, the first temperature inside the housing 11 of the camera module 10 is affected by the second temperature outside the housing 11 and the first temperature inside the housing 11 of the camera module 10 tends to be stable. Therefore, the slope in the balanced state will also be less than a certain value. As shown in Figure 5, it is in an unbalanced state 20 minutes ago and in a balanced state 20 minutes later. The slope 20 minutes ago is greater than the slope 20 minutes later.

Specifically, when the change slope is less than the preset value, the processor 20 can confirm that the first temperature at this time is the target temperature. At this time, the processor 20 can control the temperature adjustment device 15 to stop adjusting the first temperature in the housing 11.

It can be understood that the entire process of adjusting the first temperature to the target temperature is performed multiple times to avoid adjusting the temperature to a temperature far exceeding the target temperature after one adjustment.

In some embodiments, the processor 20 is also used to control the temperature adjustment device 15 to adjust the first temperature if the change slope is greater than a preset value until the change slope is less than a preset value.

It can be understood that if the change slope is greater than the preset value, it means that the first temperature in the housing 11 changes greatly and the first temperature has not yet stably reached the target temperature corresponding to the equilibrium state, so the first temperature needs to be adjusted continuously. Specifically, the processor 20 can control the temperature adjustment device 15 to continue to adjust the first temperature in the housing 11 until the processor 20 confirms that the change slope is less than the preset value based on the time detected by the temperature sensor 14 and the detected first temperature. The processor 20 can control the temperature adjustment device 15 to stop adjusting the first temperature in the housing 11.

In a specific implementation process, the temperature regulating device 15 may include a heater 151 and a cooling chip 152. The heater 151 is used to increase the first temperature when the first temperature is lower than the target temperature. The cooling chip 152 is used to lower the first temperature when the first temperature is higher than the target temperature.

The heater 151 can be disposed on the inner wall of the housing 11. Specifically, the heater 151 can be disposed on the inner wall of the top wall 111, the bottom wall 112, the first side wall 113, the second side wall 114, the third side wall or the fourth side wall. For example, the heater 151 can be disposed on the inner wall of the side wall closest to the infrared detector 13 to speed up the temperature rise of the surrounding environment of the infrared detector 13. For example, the heater 151 is disposed on one side of the second side wall 114 close to the infrared detector 13.

The cooling chip 152 can be disposed between the bottom wall 112 of the housing 11 and the bottom plate 1312 of the infrared detector 13 to accelerate the cooling speed of the surrounding environment of the infrared detector 13.

A circuit board 16 may be provided between the bottom wall 112 of the housing 11 and the bottom plate 1312 of the infrared detector 13. The circuit board 16 has a receiving portion 161 for receiving the cooling chip 152. The circuit board 16 may be a printed circuit board (PCB). The electrical signal generated by the infrared detector 13 is sent to the processor 20 via the circuit board 16.

In some embodiments, the processor 20 is also used to control the heater 151 to increase the first temperature in the housing 11 when the first temperature in the housing 11 is lower than the target temperature, so that the first temperature reaches the target temperature.

It can be understood that the temperature regulating device 15 includes a heater 151. After the processor 20 detects the first temperature in the housing 11 through the temperature sensor 14 and determines that the first temperature is less than the target temperature, the heater 151 is controlled to raise the first temperature in the housing 11 to the target temperature to achieve a balanced state.

In one example, the camera module 10 is activated, and the processor 20 controls the heater 151 to increase the first temperature in the housing 11 while receiving the first temperature detected by the temperature sensor 14. When the first temperature is the preset temperature, the processor 20 controls the heater 151 to stop increasing the first temperature in the housing 11. After the processor 20 stops increasing the temperature for a preset time, it controls the temperature sensor 14 to detect the first temperature in the housing 11. The processor 20 confirms the change slope according to the time detected by the temperature sensor 14 and the detected first temperature. When the change slope is less than the preset value, the processor 20 can confirm that the first temperature is the target temperature. When the change slope is greater than the preset value, the processor 20 controls the heater 151 to continue to increase the first temperature in the housing 11. Similarly, until the change slope is less than the preset value, the processor 20 controls the heater 151 to stop increasing the first temperature in the housing 11.

It is understandable that the components of the camera module 10 will heat up due to the startup operation, causing the first temperature in the housing 11 to also rise. However, the temperature rise is too slow to reach the first temperature in the housing 11 required when the temperature inside and outside the housing 11 reaches a balanced state when the camera module 10 works normally. Therefore, the processor 20 can control the heater 151 to raise the first temperature in the housing 11 to the target temperature to accelerate the reaching of the balanced state.

In another example, the camera module 10 works normally, and the temperature outside the housing 11 of the camera module 10 rises rapidly from 0°C to 25°C. The processor 20 repeats the action of the previous example until the slope of change is less than the preset value, and the processor 20 controls the heater 151 to stop raising the first temperature inside the housing 11.

It is understandable that when the camera module 10 works normally, the second temperature outside the housing 11 of the camera module 10 rises rapidly, which will break the balance inside and outside the housing 11 of the camera module 10. Therefore, the processor 20 needs to control the heater 151 to raise the first temperature inside the housing 11 to the target temperature, so as to accelerate the reaching of the equilibrium state.

In some embodiments, the processor 20 is also used to control the cooling crystal 152 to lower the first temperature when the first temperature in the housing 11 of the camera module 10 is greater than the target temperature, so that the first temperature reaches the target temperature.

Specifically, after the processor 20 detects the first temperature in the housing 11 through the temperature sensor 14 and determines that the first temperature is greater than the target temperature, the processor 20 controls the cooling chip 152 to lower the first temperature in the housing 11 to the target temperature to achieve a balanced state.

In one example, the camera module 10 works normally, and the second temperature outside the housing 11 of the camera module 10 is rapidly cooled from 25°C to 0°C. The processor 20 controls the cooling chip 152 to reduce the first temperature in the housing 11, while receiving the first temperature detected by the temperature sensor 14. When the first temperature is the preset temperature, the processor 20 controls the cooling chip 152 to stop reducing the first temperature in the housing 11. After the processor 20 stops reducing the temperature for a preset time, it controls the temperature sensor 14 to detect the first temperature in the housing 11. The processor 20 confirms the change slope according to the time detected by the temperature sensor 14 and the detected first temperature. When the change slope is less than the preset value, the processor 20 can confirm that the temperature is the target temperature. When the change slope is greater than the preset value, the processor 20 controls the cooling chip 152 to continue to lower the first temperature in the housing 11. Similarly, when the change slope is less than the preset value, the processor 20 controls the cooling chip 152 to stop lowering the first temperature in the housing 11.

It is understandable that when the camera module 10 works normally, the second temperature outside the housing 11 of the camera module 10 drops rapidly, which will break the balance inside and outside the housing 11 of the camera module 10. Therefore, the processor 20 needs to control the cooling chip 152 to lower the first temperature inside the housing 11 to the target temperature to accelerate the reaching of the equilibrium state.

The processor 20 is also used to control the infrared detector 13 to detect infrared rays radiated by the target 1 when the first temperature in the housing 11 reaches the target temperature.

The processor 20 is also used to determine the temperature information corresponding to the infrared rays of the target 1 to be measured, and to generate a thermal imaging image of the target 1 to be measured based on the temperature information.

It can be understood that when the first temperature in the housing 11 of the camera module 10 is not equal to the target temperature, the first temperature in the housing 11 is adjusted to the target temperature so that the temperature inside and outside the housing 11 can reach a balanced ratio. When the first temperature is the target temperature, the infrared radiation of the target can be detected to obtain accurate temperature information corresponding to the infrared radiation of the target. Based on the accurate temperature information, an accurate thermal imaging image of the target can be generated.

Specifically, after the processor 20 obtains the electrical signal generated by the infrared detector 13 according to the infrared rays, it determines the temperature information of the target object according to the electrical signal combined with the relevant algorithm, and generates a thermal imaging image of the target 1 according to the temperature information.

It can be understood that when the first temperature inside the housing 11 of the camera module 10 is equal to the target temperature, it means that the temperature inside and outside the housing 11 of the camera module 10 has reached a balanced state. At this time, the processor 20 can obtain the accurate temperature of the measured target.

It can be understood that since the processor 20 can obtain the first temperature inside the housing 11 through the temperature sensor 14 and adjust the first temperature according to the temperature adjustment device 15, the temperature inside and outside the housing 11 of the camera module 10 can quickly reach a balanced state. Therefore, the infrared detector 13 can be activated faster to detect the infrared radiation emitted by the target object 1, calculate more accurate temperature information, and generate a thermal imaging image of the target 1 according to the more accurate temperature information, and the thermal imaging image is displayed more accurately.

Understandably, in order to speed up the heat conduction of the camera module 10, larger materials such as heat conducting sheets will be added, making the camera module 10 larger. The embodiment of the present application utilizes the cooperation between the temperature sensor 14 and the temperature adjustment device 15 to quickly adjust the second temperature inside and outside the housing 11 to achieve a balanced state, which can reduce the increase of larger materials such as heat conducting sheets and reduce the overall volume of the camera module 10.

An application process of the electronic device of the present application embodiment is described through the following application scenario.

The electronic device 100 includes a camera module 10 and a processor 20. The camera module 10 works normally, and the temperature inside and outside the housing 11 reaches a balanced state. The cup is the target 1 to be measured. The cup radiates infrared rays, which are projected from the lens 12 of the camera module 10 into the housing 11 and transmitted into the micro-electromechanical system component 133 of the infrared detector 13 corresponding to the lens 12. The sensitive element of the micro-electromechanical system component 133 generates an electrical signal according to the energy change of the infrared ray, and the electrical signal is sent to the processor 20 through the circuit board 16. At this time, the temperature outside the housing 11 of the camera module 10 changes suddenly, and the temperature inside and outside the housing 11 is not in a balanced state, and the thermal image of the cup is not accurate. The processor 20 controls the infrared detector 13 to stop detecting the infrared rays emitted by the cup. The processor 20 receives the first temperature inside the shell 11 through the temperature sensor 14, and controls the temperature adjustment device 15 to adjust the first temperature to the target temperature. At this time, the temperature inside and outside the shell 11 is in a balanced state. Then, the processor 20 controls the infrared detector 13 to detect the infrared rays emitted by the cup, determines the temperature information generated by the infrared rays of the cup according to the relevant algorithm, processes the temperature information, and generates a thermal imaging image of the cup. The thermal imaging image of the cup is shown in Figure 6.

In this application scenario, the relevant parameters of the camera module 10 include: the infrared detector 13 is a non-cooled infrared focal plane detector, the preparation material of the camera module 10 is ferroelectric vanadium oxide mixture (F-VOx), the infrared band of the response is 8 to 14μm, the resolution is 320 x 240, the detection diameter is 4.8m, the pixel spacing is 12μm, the temperature sensitivity is NETD<70mK, the lens aperture is F1.2, the effective focal length is 6.8mm, and the field of view is (H*V)=(34.8°*26°).

The above is only a preferred embodiment of this application and does not limit this application in any form. In addition, people with common knowledge in the relevant field can also make other changes within the spirit of this application. Of course, these changes made based on the spirit of this application should be included in the scope of protection required by this application.

1: Target to be tested

100: Electronic equipment

10: Camera module

20: Processor

Claims (8)

A camera module, the improvement of which is that the camera module comprises: a housing; a temperature sensor disposed in the housing, the temperature sensor being used to sense a first temperature in the housing; a temperature regulating device disposed in the housing, the temperature regulating device being used to regulate the first temperature in the housing to the target temperature when the first temperature is not equal to the target temperature, wherein the target temperature and a second temperature outside the housing have a preset ratio; an infrared detector disposed in the housing, the infrared detector being used to sense a first temperature in the housing; a temperature regulating device disposed in the housing, the temperature regulating device being used to regulate the first temperature in the housing to the target temperature when the first temperature is not equal to the target temperature; and an infrared detector disposed in the housing. When a temperature reaches the target temperature, infrared radiation from the target is detected; the temperature regulating device further comprises a cooling chip, the cooling chip is arranged between the bottom plate of the infrared detector and the bottom wall of the housing, and the cooling chip is used to reduce the first temperature when the first temperature is greater than the target temperature; the camera module further comprises a circuit board, the circuit board is arranged between the bottom plate of the infrared detector and the bottom wall of the housing, and the circuit board is provided with a receiving portion, and the receiving portion is used to receive the cooling chip. The camera module as described in claim 1, wherein the temperature regulating device includes a heater, the heater is disposed in the housing, and the heater is used to increase the first temperature when the first temperature is less than the target temperature. An electronic device, the improvement of which is that the electronic device includes a processor and a camera module as described in claim 1, the processor is used to: control the temperature sensor in the housing to sense the first temperature in the housing; if the first temperature in the housing is not equal to the target temperature, control the temperature adjustment device to adjust the first temperature to the target temperature. The electronic device as described in claim 3, wherein the processor is also used to: If the first temperature in the housing is equal to the preset temperature, control the temperature adjustment device to stop adjusting the first temperature; after a preset time, confirm the change slope of the first temperature in the housing; if the change slope is less than the preset value, confirm that the first temperature at this time is the target temperature. The electronic device as described in claim 4, wherein the processor is also used to: if the change slope is greater than the preset value, control the temperature adjustment device to adjust the first temperature until the change slope is less than the preset value. The electronic device as described in claim 5, wherein the temperature regulating device includes a heater, and the processor is further used to: if the first temperature in the housing is lower than the target temperature, control the heater to increase the first temperature so that the first temperature reaches the target temperature. The electronic device as described in claim 5, wherein the temperature regulating device further includes a cooling chip, and the processor is further used to: if the first temperature in the housing is greater than the target temperature, control the cooling chip to lower the first temperature so that the first temperature reaches the target temperature. The electronic device as described in claim 5, wherein the processor is also used to: when the first temperature in the housing reaches the target temperature, control the infrared detector to detect the infrared ray radiated by the target to be measured; determine the temperature information corresponding to the infrared ray of the target to be measured, and generate a thermal imaging image of the target to be measured based on the temperature information.