TWI847377B - Chip sorting device having debonding function and method thereof - Google Patents

Abstract

A chip sorting device having debonding function includes a wafer expending module, a debonding module and a sorting module. The wafer expending function mounts a carrier member. The carrier member includes a frame and a thin film disposed on the bottom surface of the frame in order to cover the central hole of the frame. A wafer is disposed on the thin film. The debonding module generate UV light. The wafer expending module executes a wafer expending step. The debonding module emits UV light to the thin film of the carrier member. The sorting module performs a sorting step for the wafer on the carrier member.

Description

Wafer picking device with degumming function and method thereof

The present invention relates to a chip picking device, in particular to a chip picking device with a degumming function. The present invention also relates to a chip picking method of the device.

In the existing electronic component or wafer manufacturing process, a picking mechanism (such as a suction device and a push pin) is required to perform a pick-and-place action to separate the electronic component or wafer die from the film of the carrier. In order to smoothly pick up the die from the film that fixes the wafer, it is usually necessary to first expand the film of the carrier through a film expansion step, and if necessary, heat it with hot air to make it easier to expand. However, some applications require reducing the viscosity of the film and further increasing the expansion degree of the film, and the above-mentioned existing devices cannot meet the needs of these applications.

According to one embodiment of the present invention, the present invention provides a wafer picking device with a debonding function, which includes a film expansion module, a debonding module and a picking module. The film expansion module is used to accommodate a carrier, and the carrier includes a frame and a film. The film is arranged on the bottom surface of the frame to cover the central hole of the frame, and the film is used to place a wafer. The debonding module is used to generate ultraviolet light. The film expansion module is used to perform a film expansion step for the carrier, and the debonding module generates ultraviolet light to irradiate the film of the carrier, and the picking module performs a picking step for the wafer of the carrier.

In one embodiment, the degumming module includes a first lifting mechanism, a second lifting mechanism, an ultraviolet light source and an upper mask. The ultraviolet light source is arranged on the first lifting mechanism, and the upper mask is arranged on the second lifting mechanism. The second lifting mechanism is above the first lifting mechanism, so that the first lifting mechanism and the second lifting mechanism respectively control the ultraviolet light source and the upper mask to move in the vertical direction, so that the ultraviolet light source covers the bottom of the film expansion module, and the upper mask covers the top of the film expansion module.

In one embodiment, the ultraviolet light source has a housing and a plurality of ultraviolet light emitting units, and the ultraviolet light emitting units are disposed in the housing.

In one embodiment, the expansion membrane module includes a base, an expander and a pressing ring, the expander is arranged on the base, the pressing ring is arranged on the expander, and the supporting member is arranged on the expander.

In one embodiment, the expansion module includes a driving structure, which is used to rotate the base to rotate the carrier disposed on the expander.

According to another embodiment of the present invention, a wafer picking method is provided, which comprises the following steps: placing a carrier in a film expansion module, the carrier comprising a frame and a film, the film being arranged on the bottom surface of the frame to cover the central hole of the frame, and the film being used to place a wafer; moving the film expansion module into the working range of the debonding module; performing a film expansion step for the carrier via the film expansion module; generating ultraviolet light via the debonding module to irradiate the film of the carrier; and performing a picking step for the wafer of the carrier via the picking module.

In one embodiment, the chip picking method further includes the following steps: controlling the ultraviolet light source and the upper mask of the debonding module to move in the vertical direction respectively through the first lifting mechanism and the second lifting mechanism of the debonding module, so that the ultraviolet light source covers the bottom of the expansion film module and the upper mask covers the top of the expansion film module.

In one embodiment, the ultraviolet light source has a housing and a plurality of ultraviolet light emitting units, and the ultraviolet light emitting units are disposed in the housing.

In one embodiment, the expansion membrane module includes a base, an expander and a pressing ring, the expander is arranged on the base, the pressing ring is arranged on the expander, and the supporting member is arranged on the expander.

In one embodiment, the wafer picking method further includes the following steps: the driving structure of the expansion module rotates the base to rotate the carrier disposed on the expander.

As described above, the wafer picking device and method with debonding function according to the present invention may have one or more of the following advantages:

(1) In one embodiment of the present invention, a wafer picking device with debonding function has a debonding module, which can generate ultraviolet light to irradiate the thin film of the carrier to perform a debonding step. The debonding step can change the physical properties of the thin film of the carrier to reduce the viscosity of the thin film of the carrier, and then increase the expansion degree of the thin film of the carrier when performing the film expansion step. Therefore, the wafer picking device can not only improve the yield and quality of the product, but also reduce the number of process sites and improve production efficiency to meet the needs of specific applications.

(2) In one embodiment of the present invention, the film expansion module of the chip picking device with debonding function has a driving structure, which can rotate the base of the film expansion module to rotate the support member disposed on the expander of the film expansion module. Therefore, when performing the debonding step, the ultraviolet light can be more evenly irradiated to the film of the support member to achieve a better debonding effect.

(3) In one embodiment of the present invention, the debonding module of the wafer picking device includes a first lifting mechanism, a second lifting mechanism, an ultraviolet light source and an upper mask. The ultraviolet light source is disposed on the first lifting mechanism, and the upper mask is disposed on the second lifting mechanism. The second lifting mechanism is above the first lifting mechanism. In this way, the user can control the ultraviolet light source and the upper mask to move in the vertical direction respectively through the first lifting mechanism and the second lifting mechanism, so that the ultraviolet light source and the upper mask cover the bottom and the top of the expansion film module respectively. The above mechanism can further enhance the debonding effect.

(4) In one embodiment of the present invention, the wafer picking device with debonding function has a debonding module and a film expansion module, and the execution time of the debonding step and the film expansion step can be selected. Therefore, the user can selectively determine the order of the debonding step and the film expansion step, or perform the debonding step and the film expansion step at the same time, which is more flexible in use and has a wider application.

(5) In one embodiment of the present invention, the process parameters (such as light intensity, illumination area and rotation speed) of the debonding step and the film expansion step of the chip picking device with debonding function can be appropriately adjusted to meet the differences in characteristics of different products and better meet the needs of actual applications.

The following will refer to the relevant drawings to illustrate the embodiments of the wafer picking device with debonding function and the method thereof according to the present invention. For the sake of clarity and convenience of the diagram description, the components in the drawings may be exaggerated or reduced in size and proportion. In the following description and/or patent application, when it is mentioned that an element is "connected" or "coupled" to another element, it may be directly connected or coupled to the other element or there may be an intervening element; and when it is mentioned that an element is "directly connected" or "directly coupled" to another element, there is no intervening element. Other words used to describe the relationship between elements or layers should be interpreted in the same way. For ease of understanding, the same elements in the following embodiments are illustrated with the same symbols.

Please refer to FIG. 1, which is a structural diagram of a wafer picking device with debonding function according to an embodiment of the present invention. As shown in the figure, the wafer picking device 1 includes a film expansion module 11, a debonding module 13 and a picking module 12.

The expansion module 11 is used to accommodate the carrier 2. The carrier 2 includes a frame 21 and a film 22. The film 22 is arranged on the bottom surface of the frame 21 to cover the central hole of the frame 21. The film 22 is used to place the wafer W; wherein the wafer W has been cut into a plurality of dies. The expansion module 11 includes a base 111, an expander 112, a pressing ring 113 and a driving structure 114. The expander 112 is arranged on the base 111, and the pressing ring 113 is arranged on the expander 112, so that a side opening L is formed between the pressing ring 113 and the expander 112. The carrier 2 can be moved through the side opening L manually or by a robot arm to place the carrier 2 on the expander 112 .

The degumming module 13 is used to generate ultraviolet light. The degumming module 13 includes a first lifting mechanism 131, a second lifting mechanism 132, an ultraviolet light source 133 and an upper mask 134. The ultraviolet light source 133 is disposed on the first lifting mechanism 131, and the upper mask 134 is disposed on the second lifting mechanism 132, and the second lifting mechanism 132 is above the first lifting mechanism 131. In this way, the user can control the first lifting mechanism 131 to rise or fall, so that the ultraviolet light source 133 can move up or down in the vertical direction. Similarly, the user can also control the second lifting mechanism 132 to rise or fall, so that the upper mask 134 can move up or down in the vertical direction. Therefore, the user can control the ultraviolet light source 133 and the upper mask 134 to move in the vertical direction respectively through the first lifting mechanism 131 and the second lifting mechanism 132 .

In addition, the ultraviolet light source 133 has a housing 1331 and a plurality of ultraviolet light emitting units 1332, and the ultraviolet light emitting units 1332 are disposed in the housing 1331. The ultraviolet light emitting units 1332 can be controlled to be turned on together, or only some of the ultraviolet light emitting units 1332 can be turned on to perform full-area irradiation or local irradiation. In one embodiment, the ultraviolet light emitting units 1332 can be light-emitting diodes (LEDs) or any other existing light sources that can generate ultraviolet light.

The driving structure 114 includes a motor 1141 and a belt 1142. The motor 1141 can be connected to the base 111 through the belt 1142. When the motor 1141 is started, the rotation of the belt 1142 can drive the base 111 to rotate, so that the carrier 2 disposed on the expander 112 rotates. Of course, in another embodiment, the driving structure 114 can be composed of different components.

The picking module 12 includes a push pin module 121 and a suction module 122. In one embodiment, the push pin module 121 may be, but not limited to, a push pin seat, and the suction module 122 may be, but not limited to, a suction device. The push pin module 121 can push up any grain of the film 22 and the wafer W, and then the suction module 122 descends to absorb the pushed grain and then rises, so that the grain can be separated from the film 22. The structure and operation mechanism of the picking module 12 should be well known to those with ordinary knowledge in the field, so it will not be described in detail here.

Of course, this embodiment is only used for illustration and not to limit the scope of the present invention. Equivalent modifications or changes made to the wafer picking device with degumming function according to this embodiment should still be included in the patent scope of the present invention.

Please refer to FIG. 2, which is a schematic diagram of the film expansion step of the wafer picking device with debonding function of an embodiment of the present invention. As shown in the figure, the film expansion module 11 can perform the film expansion step for the carrier 2. In the film expansion step, the pressure ring 113 above the expander 112 moves downward to press to apply pressure to the frame 21 of the carrier 2, so that the expansion ring (not shown in the figure) located below the film 22 props up the film 22, so that the distance between the grains of the wafer W can be stretched. In this way, the distance between the grains of the cut wafer W can be enlarged, and the film 22 can also be tightened. In another embodiment, the film expansion module 11 may further include a hot air generating mechanism, which can generate hot air to assist the film expansion step. Since the film expansion step should be well known to those with ordinary knowledge in the art, it will not be described in detail here.

Please refer to FIG. 3, which is a first schematic diagram of a pre-step of the debonding step of a wafer picking device with debonding function according to an embodiment of the present invention. As shown in FIG. 3, after the film expansion step is completed, the user can control the pick-and-place mechanism (such as a robot arm, etc.) to move the film expansion module 11 to the working range of the debonding module 13, so that the film expansion module 11 overlaps with the ultraviolet light source 133 and the upper mask 134 of the debonding module 13 in the vertical direction.

Please refer to FIG. 4A and FIG. 4B, which are the first schematic diagram and the second schematic diagram of the debonding step of the wafer picking device with debonding function of an embodiment of the present invention. As shown in the figure, the user can control the first lifting mechanism 131 of the debonding module 13 to rise, so that the ultraviolet light source 133 of the debonding module 13 can move upward in the vertical direction, so that the ultraviolet light source 133 of the debonding module 13 covers the bottom of the film expansion module 11, and control the second lifting mechanism 132 of the debonding module 13 to descend, so that the upper mask 134 of the debonding module 13 can move downward in the vertical direction, so that the upper mask 134 of the debonding module 13 covers the top of the film expansion module 11. Therefore, the ultraviolet light source 133, the upper mask 134 and the base 111 can form a closed space to accommodate the carrier 2. Then, the user can activate the ultraviolet light source 133 of the degumming module 13 to emit ultraviolet light to irradiate the film 22 of the carrier 2, so as to change the physical property of reducing the viscosity of the film 22, and then increase the expansion degree of the film 22 through the film expansion step; the user can selectively open the ultraviolet light emitting units 1332 of the ultraviolet light source 133 of the degumming module 13 according to needs, or only open part of them, to perform full-area irradiation or local irradiation to meet the needs of different applications. At the same time, the user can also activate the driving structure 114 to drive the base 111 to rotate and rotate the carrier 2 disposed on the expander 112. Thus, when the degumming step is performed, the ultraviolet light can be irradiated to the film 22 of the carrier 2 more evenly, so that the degumming effect of the degumming step is better.

Please refer to FIG. 5A and FIG. 5B, which are the first schematic diagram and the second schematic diagram of the picking step of the wafer picking device with debonding function of an embodiment of the present invention. As shown in the figure, after the debonding step is completed, the user can control the first lifting mechanism 131 of the debonding module 13 to descend, so that the ultraviolet light source 133 of the debonding module 13 can move downward in the vertical direction, and control the second lifting mechanism 132 of the debonding module 13 to rise, so that the upper mask 134 of the debonding module 13 can move upward in the vertical direction, so that the ultraviolet light source 133 and the upper mask 134 of the debonding module 13 are separated from the film expansion module 11. Then, the user can control the pick-and-place mechanism to move the film expansion module 11 from the working range of the degumming module 13 to the working range of the picking module 12.

Finally, the picking module 12 can perform the picking step. The picker module 121 of the picking module 12 can push the film 22 and any grain Cp of the wafer W upward, and then the suction module 122 of the picking module 12 descends to suck the grain Cp pushed out and then rises, so that the grain Cp can be separated from the film 22. Since the aforementioned film expansion step and debonding step have been passed, the picking step can be performed under the condition that all the grains Cp of the wafer W have achieved the best debonding effect.

As mentioned above, the wafer picking device 1 has a debonding module 13, which can perform a debonding step, which can change the physical properties of the film 22 of the carrier 2, so that the viscosity of the film 22 of the carrier 2 is reduced, and then the film 22 of the carrier 2 can reach a higher expansion degree by performing a film expansion step. Therefore, the wafer picking device 1 can not only improve the yield and quality of the product, but also reduce the process sites and improve the production efficiency to meet the needs of specific applications.

In addition, the chip picking device 1 can select the execution time of the debonding step and the film expansion step to meet the needs of different applications. In this embodiment, the user first performs the film expansion step, then the debonding step, and finally the picking step. In another embodiment, the user can first perform the debonding step, then the film expansion step, and finally the picking step. In yet another embodiment, the user can perform the debonding step and the film expansion step at the same time, and finally perform the picking step. In addition, the process parameters (such as light intensity, illumination area and rotation speed) of the debonding step and the film expansion step of the chip picking device 1 can be appropriately adjusted to meet the differences in characteristics of different products. Therefore, the wafer picking device 1 is not only more flexible in use, but also more widely applicable, and can meet the differences in characteristics of different products and better meet the needs of actual applications.

Of course, this embodiment is only used for illustration and not to limit the scope of the present invention. Equivalent modifications or changes made to the wafer picking device with degumming function according to this embodiment should still be included in the patent scope of the present invention.

Please refer to FIG. 6, which is a flow chart of a chip picking method of an embodiment of the present invention, and please refer to FIG. 1, FIG. 2, FIG. 3, FIG. 4A, FIG. 4B, FIG. 5A and FIG. 5B at the same time. As shown in the figure, the chip picking method of this embodiment includes the following steps:

Step S61: Place the carrier in the expansion module. The carrier includes a frame and a film. The film is placed on the bottom of the frame to cover the central hole of the frame. The film is used to place the wafer. In this step, the user can manually or mechanically move the carrier 2 through the side opening L of the expansion module to place the carrier 2 on the expander 112.

Step S62: Move the film expansion module to the working range of the degumming module. In this step, the user can control the pick-and-place mechanism to move the film expansion module 11 so that the film expansion module 11 overlaps with the ultraviolet light source 133 and the upper mask 134 of the degumming module 13 in the vertical direction.

Step S63: Performing a film expansion step for the carrier through the film expansion module. In this step, the pressure ring 113 above the expander 112 of the film expansion module 11 moves downward to press, so as to apply pressure to the frame 21 of the carrier 2. At the same time, the expansion ring below the film 22 props up the film 22 upward to pull the distance between the grains of the wafer W apart and achieve the film expansion effect.

Step S64: The first lifting mechanism and the second lifting mechanism of the degumming module can respectively control the ultraviolet light source and the upper mask of the degumming module to move in the vertical direction, so that the ultraviolet light source covers the bottom of the expansion film module, and the upper mask covers the top of the expansion film module. In this step, the user can control the first lifting mechanism 131 and the second lifting mechanism 132 of the degumming module 13 so that the ultraviolet light source 133, the upper mask 134 and the base 111 can form a closed space to accommodate the carrier 2.

Step S65: Generate ultraviolet light through the degumming module to irradiate the thin film of the carrier. In this step, the user can selectively open the ultraviolet light emitting units 1332 of the ultraviolet light source 133 of the degumming module 13 together or partially according to actual application requirements to irradiate the entire area or part of the thin film 22 of the carrier 2 with ultraviolet light, thereby appropriately changing its physical properties.

Step S66: The driving structure of the expansion module rotates the base to rotate the support member disposed on the expander. In this step, the user can activate the driving structure 114 to rotate the support member 2 disposed on the expander 112, so that the ultraviolet light can be irradiated more evenly to the film 22 of the support member 2 to enhance the debonding effect. As mentioned above, the expansion step of step S63 and the debonding step of steps S65-S66 can be performed in the opposite order or simultaneously.

Step S67: Move the film expansion module to leave the working range of the degumming module. In this step, the user can control the pick-and-place mechanism to move the film expansion module 11 from the working range of the degumming module 13 to the working range of the picking module 12.

Step S68: The picking module performs a picking step for the wafer of the carrier. In this step, the ejector module 121 and the suction module 122 of the picking module 12 cooperate with each other to separate the crystal grain Cp from the film 22.

Of course, this embodiment is only used for illustration rather than to limit the scope of the present invention, and equivalent modifications or changes made to the wafer picking method according to this embodiment should still be included in the patent scope of the present invention.

Although the steps of the methods described in the present invention are shown and described in a specific order, the order of operation of each method can be changed, and some steps can be performed in the opposite order, or some steps can be performed simultaneously with other steps. In another embodiment, different steps can be implemented in an intermittent and/or alternating manner.

In summary, according to the embodiment of the present invention, the wafer picking device with debonding function has a debonding module, which can generate ultraviolet light to irradiate the thin film of the carrier to perform the debonding step. The debonding step can change the physical properties of the thin film of the carrier, reduce the viscosity of the thin film of the carrier, and then perform the film expansion step to make the thin film of the carrier reach a higher expansion degree. Therefore, the wafer picking device can not only improve the yield and quality of the product, but also reduce the process sites and improve the production efficiency to meet the needs of specific applications.

Furthermore, according to an embodiment of the present invention, the film expansion module of the chip picking device with debonding function has a driving structure, which can rotate the base of the film expansion module to rotate the support member arranged on the expander of the film expansion module. Therefore, when performing the debonding step, the ultraviolet light can be more evenly irradiated to the film of the support member to achieve a better debonding effect.

In addition, according to an embodiment of the present invention, the debonding module of the wafer picking device includes a first lifting mechanism, a second lifting mechanism, an ultraviolet light source and an upper mask, wherein the ultraviolet light source is disposed on the first lifting mechanism, and the upper mask is disposed on the second lifting mechanism, and the second lifting mechanism is disposed above the first lifting mechanism. Thus, the user can control the ultraviolet light source and the upper mask to move in a vertical direction respectively through the first lifting mechanism and the second lifting mechanism, so that the ultraviolet light source and the upper mask cover the bottom and the top of the expansion film module respectively, and the above mechanism can further enhance the debonding effect.

In addition, according to the embodiment of the present invention, the wafer picking device with debonding function has a debonding module and a film expansion module, and the execution time of the debonding step and the film expansion step can be selected. Therefore, the user can selectively determine the order of the debonding step and the film expansion step, or perform the debonding step and the film expansion step at the same time, which is more flexible in use and has a wider application.

Furthermore, according to the embodiments of the present invention, the process parameters (such as light intensity, illumination area and rotation speed) of the debonding step and the film expansion step of the chip picking device with debonding function can be appropriately adjusted to meet the differences in characteristics of different products and better meet the needs of actual applications.

It can be seen that this invention has indeed achieved the desired improved effect by breaking through the previous technology, and it is not easy for people familiar with the technology to think of. Its progressiveness and practicality obviously meet the patent application requirements. Therefore, a patent application is filed in accordance with the law. I sincerely request that your office approve this invention patent application to encourage creativity and express my gratitude.

The above description is for illustrative purposes only and is not intended to be limiting. Any other equivalent modifications or changes made to the invention without departing from the spirit and scope of the invention should be included in the scope of the attached patent application.

1: Wafer picking device 11: Film expansion module 111: Base 112: Expander 113: Pressing ring 114: Driving structure 1141: Motor 1142: Belt 12: Picking module 121: Ejector module 122: Suction module 13: Degumming module 131: First lifting mechanism 132: Second lifting mechanism 133: UV light source 1331: Housing 1332: UV light emitting unit 134: Upper mask 2: Carrier 21: Frame 22: Film W: Wafer Cp: Grain L: Side opening S61~S66: Step flow

FIG. 1 is a structural diagram of a chip picking device with a debonding function according to an embodiment of the present invention. FIG. 2 is a schematic diagram of a film expansion step of a chip picking device with a debonding function according to an embodiment of the present invention. FIG. 3 is a first schematic diagram of a pre-step of a debonding step of a chip picking device with a debonding function according to an embodiment of the present invention. FIG. 4A is a first schematic diagram of a debonding step of a chip picking device with a debonding function according to an embodiment of the present invention. FIG. 4B is a second schematic diagram of a debonding step of a chip picking device with a debonding function according to an embodiment of the present invention. FIG. 5A is a first schematic diagram of a picking step of a chip picking device with a debonding function according to an embodiment of the present invention. FIG. 5B is a second schematic diagram of the picking step of a chip picking device with degumming function according to an embodiment of the present invention. FIG. 6 is a flow chart of a chip picking method according to an embodiment of the present invention.

1: Wafer picking device 11: Film expansion module 111: Base 112: Expander 113: Pressing ring 114: Driving structure 1141: Motor 1142: Belt 12: Picking module 121: Ejector module 122: Suction module 13: Degumming module 131: First lifting mechanism 132: Second lifting mechanism 133: UV light source 1331: Housing 1332: UV light emitting unit 134: Upper mask 2: Carrier 21: Frame 22: Film W: Wafer L: Side opening

Claims (8)

A wafer picking device with debonding function comprises: a film expansion module for accommodating a carrier, the carrier comprising a frame and a film, the film being arranged on the bottom surface of the frame to cover a central hole of the frame, the film being arranged to place a wafer; a debonding module for generating ultraviolet light; and a picking module; wherein the film expansion module is used to perform a film expansion step for the carrier, the debonding module generates the ultraviolet light to irradiate the film of the carrier, and the picking module is the film of the carrier. The wafer performs a picking step; wherein the debonding module includes a first lifting mechanism, a second lifting mechanism, an ultraviolet light source and an upper mask, wherein the ultraviolet light source is arranged on the first lifting mechanism, and the upper mask is arranged on the second lifting mechanism, and the second lifting mechanism is above the first lifting mechanism, so that the first lifting mechanism and the second lifting mechanism respectively control the ultraviolet light source and the upper mask to move in the vertical direction, so that the ultraviolet light source covers the bottom of the film expansion module, and the upper mask covers the top of the film expansion module. The chip picking device with degumming function as described in claim 1, wherein the ultraviolet light source has a housing and a plurality of ultraviolet light emitting units, and the ultraviolet light emitting units are disposed in the housing. The wafer picking device with debonding function as described in claim 1, wherein the expansion film module comprises a base, an expander and a pressure ring, the expander is arranged on the base, the pressure ring is arranged on the expander, and the carrier is arranged on the expander. The chip picking device with debonding function as described in claim 3, wherein the expansion module includes a driving structure, and the driving structure is used to rotate the base to rotate the carrier disposed on the expander. A wafer picking method includes the following steps: placing a carrier in a film expansion module, the carrier including a frame and a film, the film being arranged on the bottom surface of the frame to cover a central hole of the frame, and the film being used to arrange a wafer; moving the film expansion module into the working range of a debonding module; performing a film expansion step for the carrier via the film expansion module; A first lifting mechanism and a second lifting mechanism of the module respectively control a UV light source and an upper mask of the debonding module to move in the vertical direction, so that the UV light source covers the bottom of the film expansion module, and the upper mask covers the top of the film expansion module; the debonding module generates a UV light to irradiate the film of the carrier; and a picking module performs a picking step for the wafer of the carrier. The chip picking method as described in claim 5, wherein the ultraviolet light source has a housing and a plurality of ultraviolet light emitting units, and the ultraviolet light emitting units are disposed in the housing. The chip picking method as described in claim 5, wherein the expansion film module comprises a base, an expander and a pressing ring, the expander is arranged on the base, the pressing ring is arranged on the expander, and the carrier is arranged on the expander. The chip picking method as described in claim 7 further includes the following steps: a driving structure of the expansion module rotates the base to rotate the carrier disposed on the expander.

Images