TWI846348B - Cutting tool with sucker - Google Patents
Cutting tool with sucker Download PDFInfo
- Publication number
- TWI846348B TWI846348B TW112106796A TW112106796A TWI846348B TW I846348 B TWI846348 B TW I846348B TW 112106796 A TW112106796 A TW 112106796A TW 112106796 A TW112106796 A TW 112106796A TW I846348 B TWI846348 B TW I846348B
- Authority
- TW
- Taiwan
- Prior art keywords
- component
- blade
- nozzle
- receiving groove
- base
- Prior art date
Links
- 238000003032 molecular docking Methods 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 description 9
- 238000004806 packaging method and process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 101000827703 Homo sapiens Polyphosphoinositide phosphatase Proteins 0.000 description 1
- 102100023591 Polyphosphoinositide phosphatase Human genes 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000009461 vacuum packaging Methods 0.000 description 1
Images
Landscapes
- Hooks, Suction Cups, And Attachment By Adhesive Means (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
Description
本發明與割開袋子的裝置有關,尤指一種吸嘴刀。 The invention relates to a device for cutting open bags, in particular a nozzle knife.
近年半導體產業發達,晶片的需求量大,因而晶片的原料-晶圓在運輸過程中的設備及其效率也被重視。業界開發了運輸晶圓用的裝置,例如前開式通用晶圓盒(FOUP)及前開式晶圓運輸盒(FOSB),在運輸過程中為了防止雜質侵入,必須以一包裝袋將晶圓盒包起來並抽真空。而當運輸至加工廠時,就必須先拆開包裝袋,然而包裝袋已由於被抽真空的關係緊貼在晶圓盒上,直接用刀片割破將會割傷晶圓盒,故必須研發一種避免前述情形發生的設備。習知的割袋裝置可參照I774455號發明專利。 In recent years, the semiconductor industry has developed and the demand for chips is high. Therefore, the equipment and efficiency of the transportation process of wafers, the raw materials of chips, have also been paid attention to. The industry has developed devices for transporting wafers, such as front-opening universal wafer boxes (FOUP) and front-opening wafer transport boxes (FOSB). In order to prevent the intrusion of impurities during transportation, the wafer box must be wrapped in a packaging bag and evacuated. When transported to the processing plant, the packaging bag must be opened first. However, the packaging bag is tightly attached to the wafer box due to the vacuum. Cutting it directly with a blade will cut the wafer box, so a device must be developed to avoid the above situation. The known bag cutting device can refer to the invention patent No. I774455.
為解決前述問題,本發明提供一種吸嘴刀,其包括有:一氣動基座;一安裝底座,其設有一用以連接至該氣動基座之連接埠,該連接埠於該安裝底座之一頂面形成有一通道開口;一吸嘴,其可拆地固定於該安裝底座之頂面,該吸嘴包括有一工作面,該工作面上設有至少一個與該通道開口連通之氣道,以及一個不與該通道開口連 通之容置槽,其中該吸嘴係以可對合之一第一組件及一第二組件組接構成;一設於該容置槽中之刀片,其被該第一組件及該第二組件緊靠夾固,該刀片之底端抵靠在該容置槽之底部,且該刀片之刃尖伸出該工作面。 To solve the above-mentioned problems, the present invention provides a nozzle knife, which includes: a pneumatic base; a mounting base, which is provided with a connection port for connecting to the pneumatic base, and the connection port forms a channel opening on a top surface of the mounting base; a nozzle, which is detachably fixed to the top surface of the mounting base, and the nozzle includes a working surface, and the working surface is provided with at least one air channel connected to the channel opening, and a receiving groove not connected to the channel opening, wherein the nozzle is composed of a first component and a second component that can be matched; a blade arranged in the receiving groove, which is tightly clamped by the first component and the second component, and the bottom end of the blade is against the bottom of the receiving groove, and the tip of the blade extends out of the working surface.
較佳地,該容置槽係自該第一組件面對該第二組件之側面凹入一深度所形成,且該第二組件面對該容置槽之側面係為平面。 Preferably, the receiving groove is formed by being recessed to a depth from the side of the first component facing the second component, and the side of the second component facing the receiving groove is a plane.
更進一步地,該刀片之厚度係大於該容置槽之深度,進而該第二組件緊抵於該刀片,且該第一組件與該第二組件之間形成有一間隙。 Furthermore, the thickness of the blade is greater than the depth of the receiving groove, so that the second component is tightly against the blade, and a gap is formed between the first component and the second component.
較佳地,該第一組件與該第二組件係以複數個螺絲鎖固在一起。 Preferably, the first component and the second component are locked together with a plurality of screws.
較佳地,該安裝底座與該吸嘴之間設有一覆蓋於該通道開口之濾網。 Preferably, a filter covering the channel opening is provided between the mounting base and the nozzle.
較佳地,該安裝底座更設有至少一個快拆構件,該氣動基座設有至少一個可與該快拆構件相結合之對接構件。 Preferably, the mounting base is further provided with at least one quick-release component, and the pneumatic base is provided with at least one docking component that can be combined with the quick-release component.
1:安裝底座 1: Install the base
10:通道 10: Channel
11:通道開口 11: Channel opening
12:濾網 12: Filter
2:吸嘴 2: Suction nozzle
200:方形底塊 200: Square bottom block
201:立柱 201: Pillar
202:環牆 202: Ring Wall
203:工作面 203: Working surface
21:第一組件 21: First component
211:第一氣道 211: First airway
212:第一側面 212: First side
213:容置槽 213: Storage tank
214:底緣 214: Background
22:第二組件 22: Second component
221:第二氣道 221: Second airway
222:第二側面 222: Second side
23:間隙 23: Gap
3:刀片 3: Blade
31:刃尖 31: Blade tip
4:氣動基座 4: Pneumatic base
41:凹槽 41: Groove
51:快拆構件 51: Quick-release components
52:對接構件 52: Docking components
61:螺絲 61: Screws
62:螺絲 62: Screws
圖1為本發明之立體示意圖;圖2、3為本發明之立體分解示意圖;圖4為本發明之俯視示意圖;圖5為本發明之剖面示意圖。 Figure 1 is a three-dimensional schematic diagram of the present invention; Figures 2 and 3 are three-dimensional exploded schematic diagrams of the present invention; Figure 4 is a top view schematic diagram of the present invention; Figure 5 is a cross-sectional schematic diagram of the present invention.
請參閱圖1至圖3,所示者為本發明提供之吸嘴刀,其包括有一安裝底座1、一吸嘴2、一刀片3及一氣動基座4。該安裝底座1組裝在該氣動基座4上,利用該氣動基座4抽取空氣,進而產生吸力。於本實施例中,該安裝底座1設有兩個快拆構件51,另一方面,該氣動基座4設有兩個凹槽41,該凹槽41中設有兩個可與該快拆構件51相結合之對接構件52,據此該安裝底座1可結合在該氣動基座4上,也可以很便利地拆離。上述快拆構件51與對接構件52是以氣動方式實施插拔功能,此屬於習知技術,恕不詳述。
Please refer to Figures 1 to 3, which show the nozzle blade provided by the present invention, which includes a
承上,該安裝底座1是以一連接埠(圖中未示)與該氣動基座4連接,其中該安裝底座1內部設有一通道10,該通道10在該安裝底座1之頂面形成有一通道開口11。於本實施例中,該通道開口11上覆蓋有一金屬材質的濾網12,用以攔阻切屑,避免侵入該氣動基座4中。
As mentioned above, the
該吸嘴2係以數個螺絲61鎖固在該安裝底座1之頂面,可以透過卸下螺絲61以將該吸嘴2拆離。該吸嘴2整體上具有一方形底塊200,且於方形底塊200上具有一立柱201,該立柱201之頂端呈內凹狀,進而形成有一環牆202,該環牆202圍有一工作面203。於本實施例中,該吸嘴2係以一第一組件21及一第二組件22組接構成,二者分別形成L狀,而可左、右對合組接構成前述的整體結構。
The
上述該第一組件21設有一第一氣道211,其自該工作面203向下貫穿至底端,進而能與該安裝底座1之通道開口11連通。該第一組件21具有一側向面對該第二組件22之第一側面212,其中該第一側面212凹設有一用以容置該刀片3之容置槽213,該容置槽213之深度稍小於該刀片3之厚度,且該容置槽213
沒有連接至該第一組件21之底端,並形成有一底緣214,因而該容置槽213沒有連通該通道開口11。
The
上述該第二組件22設有一第二氣道221,其自該工作面203向下貫穿至底端,進而能與該安裝底座1之通道開口11連通。該第二組件22具有一側向面對該第一組件21之第二側面222,其中該第二側面222面對該容置槽213之部分係為平面。
The
該刀片3係容置在該第一組件21之容置槽213中,其以底端抵靠在該容置槽213之底緣214,且兩側也分別抵靠在該容置槽213的兩側,而該刀片3之刃尖31則伸出該工作面203。由於該刀片3之厚度稍大於該容置槽213之深度,故該刀片3佔滿了整個容置槽213,且高出該容置槽213。
The
上述該第一組件21與該第二組件22係以該第一側面212與該第二側面222相向對合,並以數個螺絲62橫向穿過而鎖固在一起。由於該刀片3稍微高出該容置槽213,該第二組件22之第二側面222係抵在該刀片3上,而非該第一側面212上,因而如圖4所示,該第一組件21與該第二組件22之間形成有一間隙23。又參照圖5,藉由螺絲62鎖固的迫緊力量,該刀片3被該第一組件21與該第二組件22牢牢夾緊而獲固定,且該刀片3因被大面積地接觸而產生極為穩固的固定效果,進而降低鬆脫的機率。
The
藉由上述結構,本發明之吸嘴2刀在氣動基座4開始抽氣時,氣流會從該吸嘴2的第一氣道211及第二氣道221進入,並通過該通道開口11進入氣動基座4,據此在該吸嘴2的工作面203處形成負壓,當將該吸嘴2抵在晶圓盒的真空包裝上時,上述負壓會吸引包裝袋靠近刀片3,使包裝袋被刀片3割破,據此可以不傷及晶圓盒的盒身。此外,在刀片3工作時,即使刃尖受到壓力,然
而刀片3的位置基於其底端抵在該容置槽213的底緣214而定位,不會再繼續向下位移,進而產生不往後退縮的功效,避免影響割袋子的工作。
With the above structure, when the
本發明之優點在於它是一個可以迅速插拔於氣動基座上的模組,要切換另一個模組非常簡便,同時也只要鬆開螺絲取下第一組件或第二組件,即可卸下刀片以更換,提升維修的效率。 The advantage of the present invention is that it is a module that can be quickly plugged in and out of the pneumatic base. It is very easy to switch to another module. At the same time, just loosen the screws and remove the first or second component to remove the blade for replacement, which improves the efficiency of maintenance.
惟以上實施例之揭示僅用以說明本發明,並非用以限制本發明,舉凡等效元件之置換仍應隸屬本發明之範疇。 However, the disclosure of the above embodiments is only used to illustrate the present invention, not to limit the present invention. Any replacement of equivalent components should still fall within the scope of the present invention.
綜上所述,可使熟知本領域技術者明瞭本發明確可達成前述目的,實已符合專利法之規定,爰依法提出申請。 In summary, those familiar with the technology in this field can understand that the present invention can achieve the aforementioned purpose and is in compliance with the provisions of the Patent Law, and therefore the application is filed in accordance with the law.
1:安裝底座 1: Install the base
10:通道 10: Channel
11:通道開口 11: Channel opening
12:濾網 12: Filter
203:工作面 203: Working surface
21:第一組件 21: First component
211:第一氣道 211: First airway
212:第一側面 212: First side
213:容置槽 213: Storage tank
214:底緣 214: Background
22:第二組件 22: Second component
221:第二氣道 221: Second airway
222:第二側面 222: Second side
3:刀片 3: Blade
31:刃尖 31: Blade tip
4:氣動基座 4: Pneumatic base
51:快拆構件 51: Quick-release components
61:螺絲 61: Screws
62:螺絲 62: Screws
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW112106796A TWI846348B (en) | 2023-02-23 | 2023-02-23 | Cutting tool with sucker |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW112106796A TWI846348B (en) | 2023-02-23 | 2023-02-23 | Cutting tool with sucker |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI846348B true TWI846348B (en) | 2024-06-21 |
TW202434503A TW202434503A (en) | 2024-09-01 |
Family
ID=92541791
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW112106796A TWI846348B (en) | 2023-02-23 | 2023-02-23 | Cutting tool with sucker |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI846348B (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20180118398A1 (en) * | 2016-10-31 | 2018-05-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and apparatus for unpacking semiconductor wafer container |
TWM624168U (en) * | 2021-11-18 | 2022-03-01 | 鴻績工業股份有限公司 | Unpacking assembly |
TWI777252B (en) * | 2020-09-24 | 2022-09-11 | 鴻績工業股份有限公司 | Bag cutting module and bag cutting mechanism |
-
2023
- 2023-02-23 TW TW112106796A patent/TWI846348B/en active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20180118398A1 (en) * | 2016-10-31 | 2018-05-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and apparatus for unpacking semiconductor wafer container |
TWI777252B (en) * | 2020-09-24 | 2022-09-11 | 鴻績工業股份有限公司 | Bag cutting module and bag cutting mechanism |
TWM624168U (en) * | 2021-11-18 | 2022-03-01 | 鴻績工業股份有限公司 | Unpacking assembly |
Also Published As
Publication number | Publication date |
---|---|
TW202434503A (en) | 2024-09-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20090042368A1 (en) | Wafer processing method | |
US6105567A (en) | Wafer sawing apparatus having washing solution spray and suction devices for debris removal and heat dissipation | |
TWI644388B (en) | Front opening unified pod | |
JP4985199B2 (en) | Semiconductor wafer separation method | |
CN104626376B (en) | Cutting apparatus | |
CN101653971B (en) | A cutting apparatus | |
KR20210033417A (en) | Etching method and substrate processing system | |
TWI846348B (en) | Cutting tool with sucker | |
JP2007005435A (en) | Processing equipment | |
US10697701B2 (en) | Method and apparatus to prevent electronic device screen damage | |
JP6818930B1 (en) | Load lock device | |
JPH0650987Y2 (en) | Wafer suction holding device | |
TWM414267U (en) | Dust collector tube structure | |
CN220277795U (en) | Wafer preparation debris clearing device | |
CN219900665U (en) | Sucking disc for laser scribing machine | |
CN221877229U (en) | Universal fixture for wafer electroplating | |
CN110936202A (en) | Tool sucker for milling gold on aluminum-silicon shell | |
CN212653177U (en) | Clamping tool for grinding corners of monocrystalline silicon wafers | |
JP2004090118A (en) | Vacuum chuck | |
CN211728429U (en) | Tool sucker for milling gold on aluminum-silicon shell | |
CN112530829A (en) | Substrate processing system, valve plate assembly and working method of substrate processing system | |
US12308254B2 (en) | Load lock device | |
CN108598034A (en) | The contactless draw frame machine of large-sized silicon wafers | |
US20240379330A1 (en) | Gas distribution ring for process chamber | |
CN118824926A (en) | A suction cup assembly |