TWI843874B - Soldered product manufacturing apparatus and method for manufacturing soldered product - Google Patents

Abstract

The soldered product manufacturing apparatus 1 includes a stage 13 on which a substrate W having solder pieces arranged thereon is to be placed, a cover 16 for covering at least the upper portion of the substrate W placed on the stage 13 with a predetermined distance, a chamber 11 accommodating the stage 13 and cover 16, a heating unit 15 for heating the substrate W on the stage 13, and a reducing gas supply device 19 for supplying a reducing gas F. The method for manufacturing a soldered product uses the soldered product manufacturing apparatus 1, and is, providing a substrate W on a stage 13, covering the substrate W placed on the stage 13 with a cover 16, heating the substrate W, and supplying a reducing gas F into the chamber 11.

Description

Welding product manufacturing device and welding product manufacturing method

The present invention relates to a welding product manufacturing device and a welding product manufacturing method, and in particular to a welding product manufacturing device and a welding product manufacturing method that suppress the adhesion of unnecessary substances to the substrate and increase the reduction rate of oxides.

The substrate formed with solder bumps is used for the reflow step of mounting electronic components on the substrate. The mixture of solder paste and flux is placed on the substrate and heated to melt and form solder bumps. Finally, the entire substrate is cleaned, the flux residue is removed, and then dried to manufacture the substrate formed with solder bumps (for example, refer to Japanese Patent No. 6274341).

When forming solder bumps, if solder paste mixed with flux is used, cleaning to remove flux residue is labor-intensive. When using formic acid instead of flux to form solder bumps, if the oxide film is reduced and removed, post-cleaning is not required, and the steps can be simplified. However, when forming solder bumps by reflow using formic acid, when heating the solder and substrate, there are cases where components of the solder and/or substrate and/or formic acid vaporize, and the vaporized components (substances) diffuse and accumulate on the inner wall of the chamber, etc., and the accumulation sometimes scatters and adheres to the substrate. In addition, when using formic acid to reduce and remove the oxide film formed on the solder, processing time is required until the formic acid reacts with the oxide, but the shorter the processing time, the better.

In view of the above-mentioned problems, this disclosure provides a welding product manufacturing device and a welding product manufacturing method that inhibits the adhesion of unnecessary substances to the substrate and increases the reduction rate of oxides.

In order to achieve the above-mentioned purpose, the first embodiment of the present invention discloses a solder product manufacturing device, as shown in FIG. 1, which comprises: a carrier 13 for mounting a substrate W with solder; a cover 16 for covering at least the upper portion of the substrate W mounted on the carrier 13 at a specific distance; a chamber 11 for accommodating the carrier 13 and the cover 16; a heating unit 15 for heating the substrate W mounted on the carrier 13; and a reducing gas supply device 19 for supplying a reducing gas F for reducing oxides into the chamber 11. Here, the solder arranged on the substrate is typically a raw material solder of a finished solder bump or a raw material of a solder bump.

With the above structure, the cover body can be provided to prevent the vaporized substances generated by the substances on the substrate from condensing and adhering to the substrate, and can also prevent the heat from being dissipated to the surroundings by the heated substrate, thereby increasing the reduction speed when the oxide reacts with the reducing gas.

In addition, the second aspect of the present disclosure is shown in FIG. 1 , for example, in the first aspect of the present disclosure, the specific distance is defined by the shortest distance between the solder disposed on the substrate W and the cover 16.

The above structure can prevent the solder from contacting the cover, thus preventing adverse effects on the solder.

Furthermore, the welding product manufacturing device of the third aspect of the present disclosure is a welding product manufacturing device of the second aspect of the present disclosure, wherein the shortest distance is 0.1 mm to 20 mm.

The above structure can increase the reduction rate of the oxides generated in the substrate and solder and the reducing gas, shorten the processing time and improve productivity.

In addition, the welding product manufacturing device of the fourth aspect of the present disclosure is, for example, as shown in FIG. 1 , in the welding product manufacturing device 1 of the first aspect of the present disclosure, the specific distance is defined by the shortest distance between the aforementioned substrate and the aforementioned cover above the aforementioned substrate.

The above structure can prevent the chamber from becoming larger.

In addition, the welding product manufacturing device of the fifth aspect of the present disclosure is, for example, as shown in FIG. 1 , in the welding product manufacturing device 1 of any aspect of the first to fourth aspects of the present disclosure, the heating part 15 is configured to heat the substrate W by heating the carrier 13 on which the substrate W is mounted; and the cover 16 is configured to contact and be configured to generate heat transfer from the carrier 13.

Through the above structure, the cover body contacts the heated carrier, so the temperature of the cover body is raised to above the condensation temperature of the substance, which can inhibit the condensation of the substance on the cover body.

In addition, the welding product manufacturing device of the sixth aspect of the present disclosure is, for example, as shown in FIG. 1 , in the welding product manufacturing device 1 of the fifth aspect of the present disclosure, the cover 16 is constructed in a manner to surround the space around the substrate W placed on the stage 13.

The above structure can suppress the heat dissipation in the space surrounded by the cover, and can increase the reduction rate when the oxide reacts with the reducing gas.

In addition, the welding product manufacturing device of the seventh aspect of the present disclosure is, for example, as shown in FIG. 4, in the welding product manufacturing device of any aspect of the first to sixth aspects of the present disclosure, the cover 16B has a mesh portion 16h, and the mesh portion 16h allows the vaporized substance generated by the substance on the substrate to pass through, but prevents the liquefied or solidified substance from passing through.

With the above structure, the vaporized substance is released to the outside of the cover through the mesh, but the liquefied or solidified substance will not invade the inner side of the cover, which can inhibit the condensed substance from adhering to the substrate.

In addition, the manufacturing method of the soldering product of the eighth aspect of the present disclosure is, for example, as shown in FIG. 1 and FIG. 2, a method for manufacturing a soldering product using the soldering product manufacturing device 1 of any of the first to seventh aspects of the present disclosure, and has the following steps: a loading step (S1), which is to load the substrate W with solder on the stage 13; a covering step (S2), which is to cover at least the upper part of the substrate W loaded on the stage 13 with a cover 16 at a distance from the solder; a heating step (S3), which is to heat the substrate W after the covering step (S2); and a reducing gas supply step (S4), which is to supply reducing gas F in the chamber 11.

The above structure can be used to manufacture welding products, in which substances generated from substances on the substrate will not adhere to the substrate, and the reduction speed and productivity during manufacturing can be improved.

In addition, the manufacturing method of the welding product of the 9th aspect of the present disclosure is, for example, as shown in FIG. 1 and FIG. 2, in the manufacturing method of the welding product of the 8th aspect of the present disclosure, the covering step (S2) is to make the distance from the solder to the shortest part of the cover 16 to be 0.1mm to 20mm.

The above structure can prevent the substrate from dissipating heat to the surrounding area, and can increase the reduction rate when the oxide reacts with the reducing gas.

According to the present invention, the vaporized substances generated by the substances on the substrate can be inhibited from condensing and adhering to the substrate, and the reduction rate of the oxide when reacting with the reducing gas can be increased.

1: Welding product manufacturing equipment

1A: Welding product manufacturing equipment

11: Chamber

11f: Formic acid inlet

13: Carrier

13A: Carrier

13e: High Margin

13t: Loading surface

15: Heating section

16: Cover

16A: Cover

16B: Cover

16h: Web Department

16s: Side panels

16t: Top plate

19: Reducing gas supply device

19p: Piping

19v: control valve

50: Control device

F: Reducing gas

P:Products

S: Solder bump

W: Substrate

Figure 1 is a schematic diagram of a welding product manufacturing device of an implementation type.

Figure 2 is a flow chart illustrating the manufacturing sequence of welded products.

FIG3 is a schematic diagram of a welding product manufacturing device of a modified example of an implementation form.

FIG4 is a vertical cross-sectional view showing a schematic structure of a modified example of a cover body, which constitutes a welding product manufacturing device of an implementation type.

This application is based on Japanese Patent Application No. 2019-138130 filed in Japan on July 26, 2019 and Japanese Patent Application No. 2020-097848 filed in Japan on June 4, 2020, and the contents of these applications are used in this application.

In addition, the present invention can be fully understood through the following detailed description. The further application scope of the present invention can also be self-evident from the following detailed description. However, the detailed description and specific examples are the preferred implementation forms of the present invention, and the purpose of recording them is for explanation. A person with ordinary knowledge in the relevant technical field can make various changes and modifications within the spirit and scope of the present invention based on the detailed description. The applicant wants to claim that the recorded implementation forms are not intended to be disclosed to the public. The disclosed changes and replacements may have parts that are not included in the scope of the patent application in terms of words, but they are all part of the invention under the theory of equivalents. The following refers to the drawings to explain each implementation form. In addition, the same or similar components in each figure are attached with the same or similar symbols and repeated descriptions are omitted.

First, a welding product manufacturing device 1 of an embodiment will be described with reference to FIG1. FIG1 is a schematic diagram of the welding product manufacturing device 1. The welding product manufacturing device 1 is configured in a manner that can be used as a solder bump forming device and can be used as a co-welding device. The solder bump forming device forms the raw material solder arranged on the substrate W into a finished solder bump S (hereinafter referred to as "solder bump S") having a hemispherical surface, and the finished solder bump is suitable for the reflow step when the electronic component is mounted on the substrate W. In this specification, the raw material solder refers to the non-hemispherical solder before it becomes the finished solder bump S, typically with an appropriate amount of solder paste distributed therein. The solder used as the raw material solder is typically a compound of lead and zinc or tin. In the present embodiment, the solder bump forming device can form solder bumps S on the substrate W without using flux. On the other hand, the welding device arranges the completed solder bumps S arranged on the substrate W on the electronic component, and melts the solder bumps S in the reflow step to weld the electronic component to the substrate W. The substrate W with solder bumps S manufactured by the solder bump forming device (substrate W with solder bumps S formed thereon) and the substrate W with mounted electronic components manufactured by the welding device (substrate W with solder bumps S on substrate W joined to electronic components) are respectively in the form of welding products. The welding product manufacturing device 1 can be regarded as a general term for a solder bump forming device and a welding device. The following describes the use of the welding product manufacturing device 1 as a solder bump forming device. The welding product manufacturing device 1 has a chamber 11, a stage 13 on which a substrate W is placed, a heater 15 for heating the substrate W, a cover 16 for covering the substrate W, and a formic acid supply unit 19 for supplying formic acid gas F in the chamber 11.

The chamber 11 is formed with a space for processing the raw material solder arranged on the substrate W into the solder bump S. The chamber 11 is configured to withstand the pressure difference between the inside and the outside. From the perspective of ease of manufacturing, the chamber 11 is typically formed in a rectangular parallelepiped shape, and from the perspective of pressure resistance, the outer peripheral wall can be formed as a curved surface. A formic acid inlet 11f for introducing formic acid gas F is formed in the chamber 11. In this embodiment, the formic acid inlet 11f is formed in the upper part of the chamber 11. In addition, a shutter (not shown in the figure) is provided in the chamber 11, and the shutter is used to open and close an opening (not shown in the figure), and the opening allows the substrate W with solder to enter and exit.

In the present embodiment, the carrier 13 is formed in a plate shape and is arranged in the chamber 11. In the carrier 13, from the viewpoint of mounting stability, the mounting surface 13t on which the substrate W is mounted is formed as a flat surface. Typically, the inner surface of the mounting surface 13t is also formed as a flat surface. Typically, the carrier 13 is arranged in the chamber 11 in such a manner that the mounting surface 13t becomes horizontal. However, the carrier 13 can be tilted relative to the horizontal (the expansion direction of the mounting surface 13t has a horizontal component and a vertical component) within the mounting range of the mounted substrate W (within the range in which the mounted substrate W does not slip). The carrier 13 is formed of a material that can transfer the heat generated by the heater 15 to the substrate W, and is typically formed of graphite, but can be formed of a metal with high thermal conductivity. Here, the heat transmitted from the heater 15 to the substrate W through the stage 13 can raise the temperature to a temperature that melts the raw material solder disposed on the substrate W. The stage 13 is typically configured to raise the temperature to a temperature higher than the melting point of the raw material solder disposed on the substrate W. The mounting surface 13t of the stage 13 is formed to be larger than the substrate W.

In this embodiment, the heater 15 is disposed in the chamber 11 below the stage 13 and close to the stage 13. In this embodiment, the heater 15 is composed of a plurality of infrared lamps (hereinafter referred to as "IR lamps") disposed at appropriate intervals along the inner surface of the stage 13. The heater 15 heats the substrate W mounted on the stage 13 through the stage 13, and is equivalent to a heating unit. In addition, a comb-shaped cooling part can be provided in the gap between the plurality of IR lamps constituting the heater 15. The comb-shaped cooling part is in contact with the inner surface of the carrier 13, thereby cooling the carrier 13 (or more specifically, the substrate W). The cooling part is configured to move back and forth relative to the carrier 13, approaching (when cooling) and separating (when not cooling).

In order to prevent unwanted substances from being attached to the substrate W, the cover 16 covers the substrate W when the substrate W with the raw material solder is placed on the stage 13. In addition, the cover 16 covers the substrate W appropriately, thereby increasing the reduction rate of the oxide by the formic acid gas F. In this embodiment, the cover 16 is formed to include the substrate W in a plan view in such a way that the entire substrate W can be covered as a whole. In other words, the cover 16 can cover a plurality of raw material solders arranged on the substrate W. In this embodiment, the cover 16 has a top plate 16t formed in a rectangular plate shape, and side plates 16s extending from the four sides of the top plate 16t at right angles to the top plate 16t. The four side plates 16s extend in the same direction with the same length relative to the top plate 16t. The length of the side plate 16s is formed as short as possible within the range that the top plate 16t does not contact the substrate W and the raw material solder when the side plate 16s contacts the carrier 13. At this time, the shortest distance between the raw material solder and the top plate 16t in the substrate W having the raw material solder (typically, the distance between the solder and the cover 16 becomes the shortest part within the range of exerting the desired function) is equivalent to a specific distance. As mentioned above, in this embodiment, the cover 16 is constructed in a manner that cooperates with the carrier 13 and completely covers the substrate W, thereby enhancing the protection of the substrate W. Even if the substrate W is completely covered by the cover 16 and the stage 13, when the formic acid gas F is supplied into the chamber 11, the formic acid gas F may enter the inside of the cover 16 from the boundary between the cover 16 and the stage 13 due to the characteristics of the formic acid gas F. However, when the substrate W can be protected from the influence of unnecessary substances by covering only the upper part of the substrate W, the side plate 16s may be removed from the cover 16 to make it easier for the formic acid gas F to reach the substrate W. On the other hand, from the viewpoint of increasing the reduction rate of the oxide by the formic acid gas F, in order to suppress the temperature drop around the substrate W, it is preferable to surround the space around the substrate W using the cover 16 having the side plate 16s. The shortest distance between the raw material solder in the substrate W and the top plate 16t is preferably 0.1mm to 20mm. From the perspective of increasing the reduction rate of the oxide by the formic acid gas F, it is preferably less than 2.0mm, and more preferably less than 1.5mm. On the other hand, from the perspective of suppressing the difficulty of device manufacturing, it is preferably more than 0.5mm, and more preferably 1.0mm. The shortest distance between the raw material solder in the substrate W and the top plate 16t may vary depending on the raw material solders arranged in multiple substrates W. It is preferred that the respective shortest distances are in the range of 0.1mm to 20mm. The cover 16 is preferably formed of a material with high thermal conductivity, typically formed of metal.

The formic acid supply unit 19 includes a formic acid source (not shown in the figure), a pipe 19p for introducing formic acid gas F from the formic acid source into the chamber 11, and a control valve 19v disposed on the pipe 19p. The formic acid source (not shown in the figure) includes a vaporization unit for vaporizing formic acid, and is configured to supply vaporized formic acid F into the chamber 11. The pipe 19p is connected to the formic acid inlet 11f. The formic acid supply unit 19 is configured to supply vaporized formic acid F into the chamber when the control valve 19v is opened, and to stop supplying formic acid gas F into the chamber 11 when the control valve 19v is closed. The formic acid gas F is supplied to the substrate W or solder at a reducing temperature, thereby reducing oxides of the substrate W or solder, and is equivalent to a reducing gas. In addition, the formic acid supply unit 19 supplies formic acid gas F as a reducing gas, which is equivalent to a reducing gas supply device. In the soldering product manufacturing device 1, by supplying formic acid gas F to the substrate W or solder at the reducing temperature, the oxides of the substrate W or the solder can be reduced without using flux.

The welding product manufacturing device 1 is further provided with a control device 50 capable of controlling the operation of the welding product manufacturing device 1. The control device 50 is connected to the heater 15 by wire or wireless, and is configured to heat the carrier 13 by changing the ON-OFF and output of the heater 15. In addition, the control device 50 is connected to the formic acid supply unit 19 by wire or wireless, and is configured to supply formic acid gas F to the chamber 11 by controlling the opening and closing of the valve 19v.

Next, the manufacturing method of a solder product (here, the manufacturing method of a solder bump forming substrate) using the solder product manufacturing device 1 is described with reference to FIG2. FIG2 is a flow chart showing the manufacturing sequence of the solder bump forming substrate (solder product). When the structure of the solder product manufacturing device 1 is mentioned in the description of the manufacturing method of the solder bump forming substrate, FIG1 is appropriately referred to. The following description of the manufacturing method of the solder bump forming substrate using the solder product manufacturing device 1 is also a description of the function of the solder product manufacturing device 1.

When manufacturing a solder bump forming substrate, first, a substrate W with raw material solder is placed into a chamber 11 and placed on the placement surface 13t of a stage 13 (S1: placement step). After the substrate W with raw material solder is placed on the stage 13 in the chamber 11, a cover 16 is placed on the stage 13 in a manner to cover the substrate W with raw material solder (S2: covering step). At this time, the cover 16 is placed on the stage 13 in a manner that the raw material solder and the substrate W do not contact the cover 16. In addition, the shortest distance between each raw material solder placed on the substrate W and the cover 16 is a specific distance. Here, the specific distance is 0.1 mm to 20 mm. After the cover 16 is arranged, the control device 50 turns on the heater 15 to heat the carrier 13 and the substrate W with the raw material solder to the reduction temperature (S3). The reduction temperature is lower than the melting point of the raw material solder arranged on the substrate W, and is suitable for reducing the raw material solder and the oxide film of the substrate W with formic acid F. If the carrier 13 is heated by the heater 15, the heat will also be transmitted to the cover 16 in contact with the carrier 13, and the cover 16 will also be heated. Then, the internal space surrounded by the cover 16 and the carrier 13 will become high temperature.

Next, the control device 50 raises the temperature of the stage 13 to the reduction temperature, opens the control valve 19v and supplies formic acid gas F in the chamber 11 (S4: reduction gas supply step). By supplying formic acid gas F in the chamber 11, a reduction process is performed, and the reduction process is to reduce the oxide film formed on the raw material solder or the surface of the substrate W by formic acid F. At this time, the shortest distance between each raw material solder arranged on the substrate W and the cover 16 becomes a specific distance, so the speed of reducing the oxide film by formic acid gas F can be increased. The reason for the increase in the reduction speed is speculated to be: because the shortest distance between the raw material solder and the cover 16 becomes a specific distance, the space around the substrate W becomes smaller and heat dissipation is suppressed; and/or the number of conflicts between formic acid molecules and the oxide film increases. By using formic acid F to remove the oxide film, it is possible to not use flux, and the step of cleaning the flux can be omitted. In addition, when formic acid gas F is supplied to the chamber 11 before the temperature of the carrier 13 is raised to the reduction temperature to remove the oxide film, the reduction gas supply step (S4) can be performed before the step of heating to the reduction temperature (S3), or in parallel with the step of heating to the reduction temperature (S3).

After the reduction treatment of formic acid F is completed, the control device 50 increases the output of the heater 15 to a melting temperature that exceeds a specific temperature of the melting point of the raw material solder, and heats the carrier 13 and the raw material soldering substrate W (S5). Thereby, the raw material solder on the substrate W melts and forms a hemispherical shape. After the raw material solder forms a hemispherical shape, the control device 50 stops the heating of the heater 15, and discharges the formic acid gas F from the chamber 11, and cools the substrate W with the hemispherical solder (S6). In addition, after the step of heating to the reduction temperature (S3), it continues to heat to the melting temperature before the heater 15 stops heating, which is equivalent to the heating step. Then, after the heater 15 stops heating, the hemispherical solder on the substrate W is solidified by cooling, and a completed solder bump S is formed. Thereafter, the substrate W (a form of soldering product, hereinafter referred to as "product P") formed with solder bump S is taken out from the chamber 11 (S7). Thus, the substrate W having solder bump S is obtained, and for safety reasons, it is judged whether the solder bump S is properly formed (S8). When the solder bump S is not formed, the process returns to the loading step (S1) and the solder bump S is formed again, and the above process is repeated. On the other hand, when the solder bump S is formed, the manufacture of the solder bump forming substrate (product P) is terminated. Thus, the solder bump forming substrate (product P) is manufactured in a series of steps, and the solder bump forming substrate (product P) is sent to the next step. Then, when another solder bump forming substrate (product P) is to be manufactured, the above process is repeated.

In the above process, when the raw material solder and substrate W are heated to the reduction temperature (S3), formic acid gas F is supplied (S4), and heated to the melting temperature as needed (S5), part of the components of the raw material solder and/or substrate W will produce vaporized substances and/or substances combined with formic acid (hereinafter referred to as "vaporized substances"). The vaporized substances will diffuse in the chamber 11. Then, the raw material solder melts to form a hemispherical shape, and the heating of the heater 15 is stopped to reduce the temperature in the chamber 11, and the vaporized substances will liquefy or solidify (hereinafter referred to as "condensation"). The condensed vaporized substances (referred to as unnecessary substances in the above description, hereinafter referred to as "condensed substances") will adhere to and accumulate on the inner wall of the chamber 11, etc. In the manufacturing process of the solder bump forming substrate, for example, when formic acid gas F is supplied in the chamber 11, the condensed material accumulated on the inner wall of the chamber 11 will be scattered. In the present embodiment, when the solder bump S is formed from the raw material solder, the substrate W with the raw material solder is covered with the cover 16, so even if the condensed material is scattered in the chamber 11, it can be prevented from adhering to the substrate W. In addition, before the product P is taken out of the chamber 11, the temperature in the chamber 11 will decrease and condensed material will be generated. Although the temperature inside the heating stage 13 and the cover 16 is reduced to the solder solidification temperature, it is still in a high temperature state, which can inhibit the condensation of vaporized material.

The solder bump forming substrate (product P) manufactured by the manufacturing method of the above-mentioned solder bump forming substrate can be used as an object for soldering electronic components. By soldering electronic components on the solder bump forming substrate (product P), an electronic component mounting substrate (joined substrate) in the form of a soldering product can be manufactured. Then, as mentioned above, the soldering product manufacturing device 1 can be used as a soldering device, so an electronic component mounting substrate can be manufactured. Even when the soldering product manufacturing device 1 is used as a soldering device, the structure is the same as when it is used as the above-mentioned solder bump forming device, so most of the description of the above-mentioned solder bump forming device can be shared. When the soldering product manufacturing device 1 is used as a soldering device, the differences from the description of the above-mentioned solder bump forming device are as follows. In the welding device, the chamber 11 forms a space in which the solder bumps S arranged on the substrate W are melted and the electronic components are welded on the substrate W. The heat transmitted from the heater 15 to the substrate W through the carrier 13 can increase the temperature to a temperature that can melt the solder bumps S arranged on the substrate W. In the cover 16, the shortest distance between the solder bumps S arranged with the electronic components and the cover 16 becomes the aforementioned specific distance. In addition, the manufacturing method of the electronic component mounted substrate (welding product) can basically apply the process shown in Figure 2, but the following are the differences. In the loading step (S1), the electronic components are arranged (supplied) on the substrate W equipped with the solder bumps S, and are placed on the carrier 13 in the chamber 11. In step (S7), the soldered product taken out from the chamber 11 is an electronic component (electronic component mounted substrate) with solder tightly attached to the substrate W. In step (S8), it is determined whether the electronic component is properly soldered to the substrate W. If not, the process returns to the loading step (S1). If soldered, the manufacturing of the electronic component mounted substrate (soldered product) is terminated. In the manufacturing method of the electronic component mounted substrate (soldered product) using a soldering device, the substrate W is covered with a cover 16 and the oxide film is reduced (S3-S4), thereby increasing the reduction speed.

As described above, the soldering product manufacturing apparatus 1 according to the present embodiment is provided with the cover 16, so even when the condensed material is scattered in the chamber 11, the condensed material can be prevented from being attached to the substrate W, etc. In addition, the cover 16 is in contact with the carrier 13 and heat transfer from the carrier 13 to the cover 16 occurs, so the space surrounded by the carrier 13 and the cover 16 can be kept at a high temperature, and the condensed material can be suppressed from condensing around the cover 16, and the condensed material can be suppressed from accumulating on the cover 16. In addition, the shortest distance between the solder on the substrate W and the cover 16 covering the substrate W is set to a specific distance, thereby increasing the reduction speed during the reduction treatment of the oxide film using the formic acid gas F. Furthermore, according to the manufacturing method of the solder bump forming substrate of this embodiment, it is possible to manufacture a product P in which condensed materials do not adhere to the substrate W, etc., and post-cleaning can be omitted. Furthermore, according to the manufacturing method of the soldering product of this embodiment, the reduction speed of the oxide film during the reduction treatment using formic acid gas F can be increased.

Next, a welding product manufacturing device 1A of a modified example of an embodiment will be described with reference to FIG3. FIG3 is a schematic diagram of the welding product manufacturing device 1A. The welding product manufacturing device 1A mainly differs from the welding product manufacturing device 1 (see FIG1) in that the carrier 13A formed at a portion lower than the mounting surface 13t and the cover 16A formed of a plate-like member are used instead of the carrier 13 (see FIG1) and the cover 16 (see FIG1). The carrier 13A is surrounded by a high edge 13e on the outer periphery of the mounting surface 13t that is higher than the mounting surface 13t. The height of the periphery 13e around the mounting surface 13t is preferably as low as possible within a range where the highest part of the substrate W with solder does not reach the top of the periphery 13e when the substrate W with solder (raw material solder or solder bump S) is mounted on the mounting surface 13t. The cover 16A is configured to have only a top plate 16t (see FIG. 1) but no side plate 16s (see FIG. 1) in the cover 16 (see FIG. 1). The above-mentioned structure of the welding product manufacturing device 1A is the same as that of the welding product manufacturing device 1 (see FIG. 1). In the welding product manufacturing device 1A having the above-mentioned structure, the cover 16A is a simpler structure, so the opening and closing of the cover 16A is simpler.

In the above description, although the heater 15 is disposed in the chamber 11, it can be disposed outside the chamber 11 (for example, at the bottom of the chamber 11), and the portion of the chamber 11 between the heater 15 and the stage 13 can be made transparent, so that the stage 13 can be heated by the radiant heat from the heater 15.

In the above description, although formic acid is used to reduce the oxide film of the substrate W and the solder, a carboxylic acid gas other than formic acid can be used as a reducing gas to reduce the oxide film of the substrate W and the solder.

In the above description, when the cover 16 is composed of the top plate 16t and the side plate 16s, the formic acid gas F supplied to the chamber 11 or the vaporized substances generated by the heating of the substrate W etc. can pass through the boundary between the cover 16 and the stage 13 to enter and exit between the inside and the outside of the cover 16. However, as shown in FIG. 4 , the cover 16B of the modified example can be provided with a mesh portion 16h, through which the vaporized substances are discharged from the inside of the cover 16B to the outside. The mesh portion 16h is constructed in a manner that the vaporized substances can pass through but the condensed substances cannot pass through. Here, the condensed substances cannot pass through does not strictly mean that the condensed substances cannot pass through, but that the condensed substances cannot pass through to a degree that does not have a negligible impact on the quality of the product P, that is, the condensed substances cannot pass through. The mesh portion 16h is typically provided on the top plate 16t, but can be provided on the side plate 16s instead of the top plate 16t, or on the top plate 16t and the side plate 16s. The formic acid gas F can also pass through the mesh portion 16h. Therefore, when the cover 16B is used, it can effectively prevent the condensed material from contacting the substrate W, etc., and at the same time, the formic acid gas F can be easily supplied around the substrate W. In addition, the structure of the mesh portion 16h of the cover 16B can also be applied to the cover 16A shown in FIG. 3.

In the above description, Figures 1 to 4 are mainly used as an example to illustrate the welding product manufacturing device and welding product manufacturing method of this embodiment, but the composition, structure, number, configuration, shape, material, etc. of each part are not limited to the above specific examples. Those that can be appropriately selectively adopted by those with general knowledge in the relevant technical field within the scope of the present invention are also included in the scope of the present invention.

All documents cited in this specification, including publications, patent applications and patents, can be referred to as indicated in each document and incorporated into this case as a reference. In addition, all their contents are incorporated into this case as a reference to the same extent as above.

The terms and equivalents used in the description of the present invention (especially in the following claims) shall be interpreted as both singular and plural in this specification unless otherwise specified or there is no obvious contradiction in the context. The phrases "having", "having", "containing" and "including" shall be interpreted as open-ended (i.e., "including but not limited to") unless otherwise specified. In this specification, the statement of numerical ranges is only a shorthand method for describing each value within the range unless otherwise specified, and each value is incorporated as listed in this specification. All methods described in this specification can be performed in various appropriate orders unless otherwise specified in this specification or there is no obvious contradiction in the context. The various examples or illustrative expressions (such as "etc.") used in this specification are only used to clearly explain the present invention unless otherwise specified, and are not used to limit the scope of the present invention. Any expression in the specification should not be interpreted as a requirement not stated in the claim or as indispensable for the implementation of the present invention.

This specification includes the best form known to the inventors for implementing the present invention, and describes the preferred implementation form of the present invention. A person with ordinary knowledge in the relevant technical field should be able to understand the variations of the preferred implementation form after reading the above description. The inventors can expect that those skilled in the relevant technology can appropriately apply the variation and implement the present invention in a method other than the specific description in this specification. Therefore, according to the Patent Law, the present invention includes the modification and equivalents of the contents described in the claims attached to this specification. In addition, in this specification, all combinations of the above elements in all variations are included in the present invention unless otherwise specifically limited or there is no obvious contradiction in the context.

Claims (11)

A solder product manufacturing device comprises: a carrier for placing a substrate with solder; a cover for covering at least the entire upper portion of the substrate placed on the carrier at a specific distance; a chamber for accommodating the carrier and the cover; a heating unit for heating the substrate placed on the carrier; and a reducing gas supply device for supplying reducing gas for reducing oxides into the chamber. The welding product manufacturing device as described in claim 1, wherein the aforementioned specific distance is specified by the shortest distance between the solder disposed on the aforementioned substrate and the aforementioned cover. The welding product manufacturing device as described in claim 2, wherein the aforementioned shortest distance is configured to be 0.1mm to 20mm. The welding product manufacturing device as described in claim 1, wherein the aforementioned specific distance is specified by the shortest distance between the aforementioned substrate and the aforementioned cover above the aforementioned substrate. The welding product manufacturing device as described in any one of claims 1 to 4, wherein the heating part is configured to heat the substrate by heating the carrier on which the substrate is mounted; and the cover is configured to contact the carrier in a manner that generates heat transfer from the carrier. The welding product manufacturing device as described in claim 5, wherein the aforementioned cover is constructed in a manner to surround the space around the aforementioned substrate placed on the aforementioned carrier. A welding product manufacturing device as described in any one of claims 1 to 4, wherein the aforementioned cover has a mesh portion, which allows the vaporized substance generated by the substance on the aforementioned substrate to pass through, but prevents the liquefied or solidified aforementioned substance from passing through. The welding product manufacturing device as described in claim 5, wherein the aforementioned cover has a mesh portion, which allows the vaporized substance generated by the substance on the aforementioned substrate to pass through, but prevents the liquefied or solidified aforementioned substance from passing through. The welding product manufacturing device as described in claim 6, wherein the aforementioned cover has a mesh portion, which allows the vaporized substance generated by the substance on the aforementioned substrate to pass through, but prevents the liquefied or solidified aforementioned substance from passing through. A method for manufacturing a soldered product is a method for manufacturing a soldered product using a soldered product manufacturing device as described in any one of claims 1 to 9, and comprises the following steps: a loading step of loading the substrate provided with the solder on the carrier; a covering step of covering at least the entire upper portion of the substrate mounted on the carrier with the cover at a distance from the solder; a heating step of heating the substrate after the covering step; and a reducing gas supplying step of supplying the reducing gas in the chamber. A method for manufacturing a welding product as described in claim 10, wherein in the aforementioned covering step, the distance from the aforementioned solder to the shortest portion of the aforementioned cover body is configured to be 0.1mm to 20mm.

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