TWI842306B - Parallel connection carrier for semiconductor device - Google Patents

Abstract

A parallel connection carrier for semiconductor device comprises a base and at least a carrier component. The carrier component is arranged upright on lateral side of the base. The carrier component comprises multiple carriers, and each carrier has a base fixing surface and a semiconductor fixing surface. Each semiconductor fixing surface is used for fixing a semiconductor device and arranged upright and radially on the lateral side of the base to leave a 3D space for air circulation and therefore providing each semiconductor device with a better heat dissipation environment due to the increased surface of each carrier in contact with the air.

Description

Semiconductor device and carrier

The present invention relates to a semiconductor element parallel connection carrier, which is used to load a plurality of semiconductor elements and enable the semiconductor elements to be parallel connected to a circuit board.

In common technology, the commonly used semiconductor element MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor, abbreviated as MOS) is prone to overheating and damage under high-frequency and high-power conditions. Therefore, the semiconductor element needs to have a heat dissipation structure and is often connected in parallel to achieve the necessary heat dissipation requirements.

Please refer to Figure 8. The semiconductor components 6 are often connected in parallel by lying flat or arranging them side by side. Such a parallel connection method also causes the following problems: 1. When multiple semiconductor components 6 are laid flat or arranged side by side, a large amount of plane area is occupied, so the overall space required is larger. 2. The layout (LAYOUT) routing lengths of the semiconductor components 6 are uneven, especially when connected in parallel, and there are even staggered conditions. When the routing is staggered, signal overlap and interference will occur. 3. To avoid too long wiring, the pins 61 of the semiconductor components 6 need to be placed close together. However, such an arrangement will cause the heat source to be too concentrated. The uneven distribution of the heat source will directly lead to poor heat dissipation. Especially when the power used by the semiconductor components 6 is different, if the heat dissipation is poor, the semiconductor component 6 with higher power will be damaged first, and then due to circuit imbalance, the circuit of the originally damaged semiconductor component 6 will be transferred to other semiconductor components 6, which will cause the other semiconductor components 6 to be overloaded and damaged one by one.

Thus, the commonly used parallel connection configuration leads to various problems such as poor wiring and heat dissipation, resulting in poor electrical performance.

In order to achieve the best electrical effect, the semiconductor components to be connected in parallel are supported by a carrier. The carrier can arrange each semiconductor component in the same direction and radially to free up more space for heat dissipation, thereby improving the heat dissipation problem. The arrangement method also allows the pins of each semiconductor component to be concentrated at the same position, improving the wiring problem. This method is the solution to the semiconductor component connection carrier of the present invention.

The semiconductor component parallel carrier of the present invention comprises a base and at least one supporting assembly, wherein the base has a circuit board assembly portion, the supporting assembly is erected on the outer side of the base, and the supporting assembly comprises a plurality of supporting blocks, each of which has a base fixing surface and a semiconductor component fixing surface, the base fixing surface and the semiconductor component fixing surface are adjacent, the base fixing surface is used to be fixed to the base so that the semiconductor component fixing surface stands upright on the outer side of the base, and the supporting blocks are radially arranged with an end point close to the circuit board assembly portion as the center, and the semiconductor component fixing surfaces of the supporting blocks are all facing the same clockwise or counterclockwise direction, so that an angle is formed between each two adjacent semiconductor component fixing surfaces. The semiconductor component fixing surfaces are used to fix semiconductor components. Since the semiconductor component fixing surfaces are upright and radially arranged on the outer side of the base, three-dimensional space is freed up to provide air circulation, increasing the area of the support blocks in contact with the air, so as to provide a good heat dissipation environment for the semiconductor components. In addition, the semiconductor component fixing surfaces of the support blocks are all facing the same clockwise or counterclockwise direction, and the wiring positions of the semiconductor components can be concentrated toward the end point. Therefore, the wiring positions of the pins of the semiconductor components can be arranged in the same order. When the semiconductor components are connected in parallel, the wiring length can be shortened and the wiring can be avoided from being staggered.

In a preferred embodiment, the angle is less than 180°.

In a preferred embodiment, the base has a groove on a side close to the circuit board assembly portion.

In a preferred embodiment, a heat sink is fixedly mounted on a side of the base away from the circuit board assembly.

In a preferred embodiment, the circuit board assembly portion protrudes from the surface of the base, and the circuit board assembly portion has a groove.

In a preferred embodiment, the base and the supporting assembly are integrally formed.

In a preferred embodiment, the base has an inner body and two outer bodies, the outer bodies are respectively located at two opposite outer sides of the inner body, and the supporting assembly is erected on the outer side of each of the outer bodies.

In a preferred embodiment, the base has an inner body and two outer bodies, the outer bodies are respectively located on two opposite outer sides of the inner body, the inner body and the outer body are integrally formed, and the supporting blocks are detachably locked on the outer sides of the outer bodies.

In a preferred embodiment, the base has an inner body and two outer bodies, the outer bodies are respectively located on two opposite outer sides of the inner body, each of the outer bodies is cut into several equal parts, each of the outer bodies is provided with a set of supporting components, the supporting components are integrally formed with the corresponding outer bodies, and each of the outer bodies is detachably locked to the outer side of the inner body.

As used herein, the terms "top", "bottom", "front", "back", "left", "right", and "side" used to describe component names are used to help compare the positional relationships between the various plate-like structures. The direction of the actual product structure will change with the placement angle or the corresponding relationship of the user's position, and the scope of equal coverage of this article cannot be limited thereby.

As used herein, the term "inside" describing a structural position refers to a position close to the center of the structural body, or a position that is not exposed during use; the term "inward" refers to a position close to the center of the structural body, or a position that is not exposed during use; and the term "outside" refers to a position away from the center of the structural body, or a position that is exposed during use.

As used herein, the term "distant" to describe the location of structures refers to a location that is farther away from the two target structures; the term "close" refers to a location that is closer to the two target structures.

The term "about" as used herein substantially represents that the numerical value or range described is within 20%, preferably within 10%, and more preferably within 5%. The numerical quantities provided herein are approximate values, which means that they can be inferred even if the term "about" is not used.

As used herein, the terms "recessed", "formed" or "integrally formed" to describe the structural combination relationship generally refer to one or more structures being combined into the same body during manufacturing, or corresponding structures generated on the same body due to different positions, shapes and functions.

As used herein, the term "fixed" or "set" to describe the structural combination relationship generally refers to multiple structures that will not be easily separated or dropped after being assembled. It can be a fixed connection, a detachable connection, an integral connection, a mechanical connection, an electrical connection, or a direct physical connection. It can also be indirectly connected through an intermediate medium, for example: using any combination of threads, latches, quick release parts, fasteners, nails, adhesives, electric welding or high frequency.

Other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of the preferred embodiments with reference to the drawings.

Please refer to FIG. 1, as shown in the figure, it is the first embodiment of the present invention. This embodiment at least includes a base 1, one or more supporting components 2, a plurality of semiconductor components 3 fixed on the supporting component 2 and connected in parallel, and a heat sink 4 for cooling each of the semiconductor components 3. The base 1 is used to assemble a circuit board 5 for routing the semiconductor components 3.

Please refer to Figures 1 to 3. In the first embodiment, the base 1 has an inner body 11 and an outer body 12 located at the front and rear sides of the inner body 11, and a circuit board assembly portion 121 protrudes from the top of each outer body 12. The circuit board assembly portion 121 is used to lock the circuit board 5. The circuit board assembly portion 121 has a groove 122. The outer sides of the outer body 12 at the front and rear sides each have two sets of the supporting components. 2, each of the supporting components 2 includes two supporting blocks 21, each of the supporting blocks 21 has a base fixing surface 211 and a semiconductor element fixing surface 212, the base fixing surface 211 and the semiconductor element fixing surface 212 are adjacent, the base fixing surface 211 is fixed to the outer side of the outer body 12, so that the semiconductor element fixing surface 212 is upright on the outer side of the outer body 12, and the two supporting blocks 21 are close to the electrical The circuit board assembly 121 is evenly arranged in a radial pattern with the end point P as the center, and the semiconductor element fixing surfaces 212 of the two carrier blocks 21 are all facing the same clockwise or counterclockwise direction (counterclockwise direction in FIG. 2), so that the angle A1 between the two adjacent semiconductor element fixing surfaces 21 is about 60°, and the semiconductor element fixing surfaces 212 of the two carrier blocks 21 are respectively angularly spaced from the top surface of the inner body 11 by ... The angle A2 is about 60°, so that the two supporting blocks 21 are respectively inclined on the outer side of the outer body 12. Such an angle configuration can prevent the distance between the two supporting blocks 21 from being too narrow, and can also prevent the maximum width of the supporting assembly 2 from being too wide. When there are two sets of the supporting assemblies 2 on the same outer side of the outer body 12, the distance between them can be reduced, further reducing the volume of the outer body 12 and even the entire structure.

Referring to FIGS. 1 to 3 , in the first embodiment, each set of the carrier assembly 2 includes two carrier blocks 21, and the semiconductor element fixing surfaces 212 of the two carrier blocks 21 are used to lock one semiconductor element 3, so as to connect the semiconductor elements 3 locked on the same set of the carrier assembly 2 in parallel. The semiconductor element 3 is a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor), which has a heat-generating surface 31 and a pin 32 for connecting to the circuit board 5. The heat-generating surface 31 is in contact with the semiconductor element fixing surface 212, and allows the pins 32 of the semiconductor elements 3 to be concentrated toward the end point P. Since the semiconductor element fixing surfaces 212 are all facing the same direction, the wiring positions of the pins 32 of the semiconductor elements 3 can be arranged in the same order. When the semiconductor elements 3 are connected in parallel, the wiring length can be shortened and the wiring staggered arrangement can be avoided.

Please refer to FIG. 4 . The semiconductor component 3 is assembled on each of the supporting blocks 21 by means of locking (such as screws). When a hand tool (such as a screwdriver) is used for locking, the best force application angle of the hand tool is perpendicular to each of the semiconductor component fixing surfaces 212. The radially arranged supporting blocks 21 can make each of the semiconductor component fixing surfaces 212 face different directions. Therefore, it can be avoided that the hand tool will not be completely blocked by any of the adjacent supporting blocks 21 when applying force, and the hand tool can be operated at an angle that is conducive to force application. A notch 213 can be formed on a surface of each of the supporting blocks 21 away from each of the semiconductor component fixing surfaces 212. Each of the notches 213 can provide more space for the hand tool to operate, making the operation more flexible and improving the locking efficiency.

Referring to FIGS. 2-3 , the heat generating surface 31 of the semiconductor element 3 is attached to the semiconductor element fixing surface 212, so that the heat energy generated by the operation of the semiconductor element 3 is transferred to the base 1 through the heat generating surface 31, the semiconductor element fixing surface 212, and the support block 21 in sequence for heat dissipation. In the first embodiment, a groove 13 is provided between the top surface of the inner body 11 and the inner side surfaces of the two outer bodies 12. The bottom surface of the inner body 11 is locked with the heat dissipation element 4. The channel 13 together with the groove 122 can provide air circulation and increase the area in contact with the air. Therefore, the channel 13, the groove 122 and the heat dissipation element 4 are respectively configured on the top and bottom surfaces of the inner body 11 to form a good heat dissipation environment. In addition, the channel 13 and the groove 122 can also be used to accommodate other electronic components or wiring on the circuit board 5 (not shown).

Please refer to FIGS. 1 and 3 , the heat dissipation element 4 may be a heat sink, a temperature equalizer, a water cooling device or other heat exchange device, which is located on the bottom surface of the inner body 11 and can quickly release the heat energy generated by the semiconductor element 3 .

Please refer to FIG. 1 . In the first embodiment, the inner body 11, the outer body 12 and the supporting assembly 2 are integrally formed and made of a material that is conducive to heat conduction (such as metal, aluminum or copper, etc.). In this way, since there are no joints in the structure of each part, the overall heat conduction effect is better.

In order to cope with various possible configurations and provide more diverse requirements, the present invention can be designed in different aspects, and more embodiments are listed below.

Please refer to FIG. 5, which is a second embodiment. In this embodiment, the outer side of the outer body 12 on the same side has two groups of the support components 2. The support components 2 of the same group include four support blocks 21. The four support blocks 21 are also arranged radially with the end point P close to the circuit board assembly portion 121 as the center, and the semiconductor component fixing surfaces 212 of the four support blocks 21 are all In the same clockwise or counterclockwise direction, the angle A3 between the adjacent semiconductor element fixing surfaces 21 is about 60°, wherein the conductor fixing surfaces 21 of the two supporting blocks 21 closest to the circuit board assembly 121 are placed horizontally (equivalent to being parallel to the top surfaces of the outer body 12), while the conductor fixing surfaces 21 of the two supporting blocks 21 in the middle are tilted respectively.

Please refer to FIG. 6, which is a third embodiment. In this embodiment, the inner body 11 and the outer body 12 of the base 1 are integrally formed, and the supporting blocks 21 are detachably locked to the outer side of the outer body 12, and a plurality of guide grooves 123 are concavely provided on the outer side of the outer body 12. The number, angle and position of the guide grooves 123 are the same as those of the supporting blocks 21, and the guide grooves 123 have an opening 124, and the openings 124 are located at the outer side of the outer body 12. The edge of the outer body 12 allows the supporting blocks 21 to be inserted into the predetermined position according to the opening 124 of the guide grooves 123 and then assembled. Therefore, the guide grooves 123 can limit the supporting blocks 21 to maintain the set angle, which can facilitate positioning during assembly. In this way, the supporting blocks 21 are manufactured separately from the base 1. Since the shapes, sizes and structures of the supporting blocks 21 are the same, they can be conveniently mass-produced and then assembled one by one on the base 1, which can effectively reduce the manufacturing cost.

Please refer to Figure 7, which is the fourth embodiment. In this embodiment, the amount of the outer body 12 is allocated according to the number and position of the supporting components 2. That is, if the outer side of the outer body 12 on the same side has two groups of the supporting components 2, then the outer body 12 is cut into two equal parts, and each equal part of the outer body 12 is provided with a group of the supporting components 2. Each of the supporting components 2 is formed integrally with the corresponding outer body 12, and the outer bodies 12 are all detachably locked to the front and rear sides of the inner body 11. Since the outer bodies 12 divided into several equal parts are the same or symmetrical in shape, size and structure as the supporting components 2, they can be conveniently mass-produced and then assembled one by one in the inner body 11, which can also effectively reduce the manufacturing cost.

In each embodiment of the present invention, each structure is mainly assembled by thread locking. In fact, each structure can also be fixed and combined by any other method.

The above-mentioned embodiments are only some of the preferred embodiments of the present invention, but they are not used to limit the present invention. Any person familiar with this technical field with common knowledge, after understanding the above-mentioned technical features and embodiments of the present invention, and making equivalent changes or modifications without departing from the spirit and scope of the present invention, still falls within the scope of the present invention, and the scope of patent protection of the present invention shall be defined by the claim items attached to this specification.

1: Base 11: Inner body 12: Outer body 121: Circuit board fixing surface 122: Groove 123: Guide groove 124: Opening 13: Channel 2: Carrying component 21: Carrying block 211: Base fixing surface 212: Semiconductor component fixing surface 213: Notch 3: Semiconductor component 31: Heat generating surface 32: Lead 4: Heat dissipation component 5: Circuit board 6: Semiconductor component 61: Lead A1: Angle A2: Angle A3: Angle P: End point

[Figure 1] is a schematic diagram of a three-dimensional exploded structure of the first embodiment of the semiconductor element of the present invention, which is connected to the carrier and the circuit board. [Figure 2] is a schematic diagram of a front view of the first embodiment of the semiconductor element of the present invention, which is connected to the carrier and the circuit board. [Figure 3] is a partial schematic diagram of the right side of the first embodiment of the semiconductor element of the present invention, which is connected to the carrier and the circuit board. [Figure 4] is a partial schematic diagram of the front view of the first embodiment of the carrier assembly and the semiconductor element of the present invention. [Figure 5] is a schematic diagram of a front view of the second embodiment of the semiconductor element of the present invention, which is connected to the carrier and the circuit board. [Figure 6] is a schematic diagram of a three-dimensional exploded structure of the third embodiment of the semiconductor element of the present invention, which is connected to the carrier. [Figure 7] is a schematic diagram of a three-dimensional exploded structure of the fourth embodiment of the semiconductor element of the present invention, which is connected to the carrier. [Figure 8] is a schematic diagram of connecting semiconductor components in a flat or parallel manner.

1: Base

11: Inner Being

12: External body

121: Circuit board fixing surface

122: Groove

13: Groove

2: Carrying components

3: Semiconductor components

4: Heat dissipation element

5: Circuit board

Claims (10)

A semiconductor component parallel carrier, comprising: a base having a circuit board assembly; and at least one supporting assembly, which is erected on the outer side of the base, the supporting assembly comprising a plurality of supporting blocks, each of which has a base fixing surface and a semiconductor component fixing surface, the base fixing surface and the semiconductor component fixing surface are adjacent, the base fixing surface is used to be fixed to the base so that the semiconductor component fixing surface stands upright on the outer side of the base, and the supporting blocks are radially arranged with an end point close to the circuit board assembly as the center, and the semiconductor component fixing surfaces of the supporting blocks are all facing the same clockwise or counterclockwise direction, so that an angle is formed between each two adjacent semiconductor component fixing surfaces. A semiconductor device and carrier as claimed in claim 1, wherein the angle is less than 180°. A semiconductor component and carrier as claimed in claim 1, wherein the base has a groove on a side close to the circuit board assembly. A semiconductor component and carrier as claimed in claim 1, wherein a heat sink is fixedly provided on a side of the base away from the circuit board assembly. A semiconductor component and carrier as claimed in claim 1, wherein the circuit board assembly protrudes from the surface of the base. A semiconductor component and carrier as claimed in claim 5, wherein the circuit board assembly has a groove. A semiconductor element and carrier as claimed in claim 1, wherein the base and the supporting assembly are integrally formed. A semiconductor element and a carrier as claimed in claim 1, wherein the base has an inner body and two outer bodies, the outer bodies are respectively located on two opposite outer sides of the inner body, and the supporting assembly is erected on the outer side of each of the outer bodies. A semiconductor component and carrier as claimed in claim 8, wherein the inner body and the outer body are integrally formed, and the supporting blocks are detachably locked to the outer side of the outer body. A semiconductor element and a carrier as claimed in claim 8, wherein each outer body is cut into several equal parts, each of which is provided with a set of supporting components, the supporting components are integrally formed with the corresponding outer body, and each of which is detachably locked to the outer side of the inner body.

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