TWI839152B - Wafer clamping jig - Google Patents

Abstract

A wafer clamping jig includes a base, a clamping member and a carrying platform. The base includes a passing hole. A vent hole is located at the base. The clamping member is movably disposed on the base. The carrying platform is movably disposed in or under the base and corresponding to the passing hole. An ingot fixing jig is further provided.

Description

Wafer clamping fixture

The present invention relates to a clamping jig and a fixing jig, and in particular to a wafer clamping jig and a crystal rod fixing jig.

During the wafer cutting process, if the conventional wafer clamping fixture fails to properly support the wafer, the water flow used to cool the cutting line will directly impact the wafer, which may cause the wafer to be easily impacted by the water flow and cause it to break. In addition, during the cutting process, the wafer and fixture will be immersed in the cooling liquid (water) used for cooling. The cooling liquid (water) between the wafer and the fixture may absorb heat and turn into water vapor/bubbles during the cutting process. The bubbles generated during the cutting process cannot dissipate, which will cause pressure on the wafer and cause wafer breakage.

In addition, the conventional crystal rod fixing jig fixes the crystal rod by gluing, and the gluing and degumming process is very time-consuming, which affects the processing efficiency of the crystal rod.

The present invention provides a wafer clamping fixture that reduces the probability of wafer breakage when cutting the wafer.

The present invention provides a crystal rod fixing fixture, which can efficiently fix the crystal rod for subsequent processing.

The wafer clamping fixture of the present invention includes a base, a clamping piece and a receiving seat. The base includes a through hole, the size of the through hole is larger than the second size of the second wafer, and an exhaust hole is located on the base. The clamping piece can be movably arranged above the base. The receiving seat can be movably arranged inside or below the base and corresponds to the through hole.

In one embodiment of the present invention, a first wafer is suitable for being clamped between the base and the clamping member to be cut into a second wafer, and the size of the through hole is between the first size of the first wafer and the second size of the second wafer. The second wafer is suitable for passing through the through hole and being received by the receiving seat, the base includes a supporting edge surrounding the through hole, and the first wafer is suitable for being clamped between the supporting edge and the clamping member.

In one embodiment of the present invention, the exhaust hole is located between the base and the first wafer, and the exhaust hole is recessed in the support edge.

In one embodiment of the present invention, when the above-mentioned receiving seat is arranged inside or below the base, the projection of the receiving seat on the plane where the base is located overlaps with the local through hole. And the receiving seat is suitable for being moved away from the bottom of the base so that the projection of the receiving seat on the plane where the base is located does not overlap with the through hole.

In one embodiment of the present invention, a first wafer is suitable for being clamped between a base and a clamping member to be cut into a second wafer, the size of the through hole is larger than the first size of the first wafer, and the exhaust hole is formed between the wall of the through hole and the first wafer.

In one embodiment of the present invention, the wafer clamping fixture further includes a size adjustment member that is movably disposed on the base. The projection of the size adjustment member on the plane where the base is located partially overlaps the through hole, the clamping member is movably disposed on the size adjustment member, and the first wafer is suitable for being clamped between the size adjustment member and the clamping member.

In one embodiment of the present invention, the above-mentioned receiving seat is rotatably arranged on the base, and the receiving seat has a through groove extending along the radial direction.

The present invention discloses a crystal rod fixing fixture, comprising a side plate, a first clamping member and a second clamping member. The first clamping member is fixed to the side plate. The second clamping member is fixed to the side plate.

In one embodiment of the present invention, one end face of a crystal rod is against the side plate, and one side of the crystal rod is clamped between a first clamp and a second clamp. The first clamp has a V-shaped bearing surface, and the opening of the V-shaped bearing surface faces the second clamp.

The present invention discloses a crystal rod fixing fixture, comprising a first base and a first vacuum suction cup. The first vacuum suction cup is disposed on the first base.

In one embodiment of the present invention, the above-mentioned crystal rod fixing fixture further includes a second base and a second vacuum suction cup. The second base is movably arranged on one side of the first base. The second vacuum suction cup is arranged on the second base and faces the first vacuum suction cup. The first vacuum suction cup is suitable for sucking a first end face of a crystal rod, and the second vacuum suction cup is suitable for sucking a second end face of the crystal rod.

Based on the above, the clamping part of the wafer clamping fixture of the present invention can be movably arranged above the base to well clamp the first wafer between the base and the clamping part, thereby reducing the probability of the first wafer or the second wafer being impacted by the water flow and causing fragments. After the first wafer clamped by the base and the clamping part is cut into the second wafer, it can pass through the through hole of the base to be well received by the receiving seat below the base. In addition, the exhaust hole of the wafer clamping fixture can allow the bubbles generated during the processing to escape, thereby preventing the bubbles from generating pressure on the first wafer or the second wafer and causing the first wafer or the second wafer to be broken. In addition, the known crystal rod fixing fixture fixes the crystal rod by gluing, and the gluing and debonding process is very time-consuming. The crystal rod fixing fixture of the present invention fixes the crystal rod by clamping or vacuum adsorption to improve efficiency.

D1: First size

D2: Second size

D3, D3a: Through hole size

10: First wafer

12: Second wafer

14: Crystal rod

16: First end face

18: Second end face

100, 100a: Wafer clamping fixture

110, 110a: base

112, 112a: through hole

114, 114a: Exhaust hole

116: Entrustment

118: Cable entry slot

120, 120a: snap-fit parts

130, 130a: receiving seat

132: Groove

140: Size adjustment piece

150: Cutting machine connection part

200, 200a, 200b, 200c, 200d: Crystal rod fixing fixture

210, 210a, 210b: Side panels

220, 220a, 220b: first clamping member

222: V-shaped bearing surface

230, 230a, 230b: second clamping member

240: First base

250: First vacuum suction cup

260: Second base

270: Second vacuum suction cup

Figure 1 is a three-dimensional schematic diagram of a wafer clamping fixture according to an embodiment of the present invention.

FIG2 is a schematic top view of the wafer clamping fixture of FIG1 clamping the first wafer and the receiving seat being moved away from under the base.

FIG3 is a schematic top view of the first wafer in FIG2 being cut into a second wafer and the receiving seat being placed under the base.

Figure 4 is a three-dimensional schematic diagram of a wafer clamping fixture according to another embodiment of the present invention.

FIG5 is a three-dimensional schematic diagram of the wafer clamping fixture of FIG4 clamping the first wafer.

Figure 6 is a schematic diagram of a top view of Figure 5.

Figure 7 is a three-dimensional schematic diagram of a crystal rod fixing fixture of an embodiment of the present invention.

Figure 8 is a three-dimensional schematic diagram of a crystal rod fixing fixture of another embodiment of the present invention.

Figure 9 is a three-dimensional schematic diagram of a crystal rod fixing fixture of another embodiment of the present invention.

Figure 10 is a three-dimensional schematic diagram of a crystal rod fixing fixture of another embodiment of the present invention.

Figure 11 is a three-dimensional schematic diagram of a crystal rod fixing fixture of another embodiment of the present invention.

FIG. 1 is a three-dimensional schematic diagram of a wafer clamping fixture according to an embodiment of the present invention. FIG. 2 is a top view schematic diagram of the wafer clamping fixture of FIG. 1 clamping a first wafer and the receiving seat being moved away from the bottom of the base. FIG. 3 is a top view schematic diagram of the first wafer of FIG. 2 being cut into a second wafer and the receiving seat being placed under the base. It should be noted that in FIG. 2 and FIG. 3, the first wafer and the second wafer are represented by dotted lines.

Please refer to Figures 1 to 3. The wafer clamping fixture 100 of this embodiment is suitable for clamping a first wafer 10 (Figure 2) well, so that the clamped first wafer 10 can be cut into a second wafer 12 (Figure 3) by a cutting line (not shown). A first size D1 of the first wafer 10 is larger than a second size D2 of the second wafer 12. For example, the first size D1 of the first wafer 10 is, for example, 6 inches, and the second size D2 of the second wafer 12 is, for example, 4 inches, but the first size D1 of the first wafer 10 and the second size D2 of the second wafer 12 are not limited to this.

As shown in FIG. 1 , the wafer clamping fixture 100 includes a base 110, a clamping member 120, and a receiving seat 130. The base 110 includes a through hole 112 and a supporting edge 116 surrounding the through hole 112. The first wafer 10 is suitable for being supported by the supporting edge 116.

As shown in FIG. 3 , in the present embodiment, the size D3 of the through hole 112 is between the first size D1 of the first wafer 10 and the second size D2 of the second wafer 12. The size D3 of the through hole 112 is smaller than the first size D1 of the first wafer 10 to form a support edge 116. In addition, since the size D3 of the through hole 112 is larger than the second size D2 of the second wafer 12, the cut second wafer 12 can pass through the through hole 112.

It is worth mentioning that since the wafer clamping fixture 100 and the first wafer 10 are immersed in the cooling liquid (water) for cooling during the cutting process, the cooling liquid (water) above the first wafer 10 will flow outward along the upper surface of the first wafer 10. However, the cooling liquid (water) between the first wafer 10 and the base 110 may absorb heat and turn into water vapor during the cutting process.

In order to prevent water vapor from accumulating between the first wafer 10 and the base 110, the first wafer 10 or the second wafer 12 is broken. In this embodiment, the exhaust hole 114 is located between the base 110 and the first wafer 10, so that the water vapor accumulated between the first wafer 10 and the base 110 can be discharged through the exhaust hole 114. In this embodiment, the exhaust hole 114 is recessed in the support edge 116, but it is not limited to this.

In addition, as shown in FIG. 1 , the engaging member 120 can be movably disposed above the base 110. In this embodiment, the number of the engaging members 120 is, for example, 4, which are equidistantly disposed on the base 110, but the number and configuration position of the engaging members 120 are not limited thereto.

The clamping member 120 can move radially relative to the base 110, and the clamping member 120 can move radially outward to make way for the first wafer 10. After the first wafer 10 is mounted on the base 110, the clamping member 120 moves radially inward to reset, so that the first wafer 10 is clamped between the supporting edge 116 of the base 110 and the clamping member 120. In this embodiment, since the first wafer 110 is well clamped between the base 110 and the clamping member 120, the probability of the first wafer 10 or the second wafer 12 being broken by water flow is reduced.

In addition, the receiving seat 130 can be movably disposed in the base 110 and corresponds to the through hole 112. As shown in FIG2, when the first wafer 10 is to be cut, in order to prevent the cutting line (not shown) from cutting the receiving seat 130, the receiving seat 130 is suitable for moving away from the bottom of the base 110 so that the projection of the receiving seat 130 on the plane where the base 110 is located does not overlap with the through hole 112.

Next, the cutting line starts from the line entry slot 118 (Figure 2) next to the exhaust hole 114 and cuts the first wafer 10 in a clockwise direction to cut out the second wafer 12 (Figure 3). When the cutting line moves to the 10 o'clock position between the first wafer 10 and the second wafer 12 and does not cut the receiving seat 130, the receiving seat 130 is moved back into the base 110 (Figure 3) so that the projection of the receiving seat 130 on the plane where the base 110 is located overlaps the local through hole 112. After the receiving seat 130 is moved into the base 110, the cutting line continues to cut out the second wafer 12 in a clockwise direction until it returns to the entry point to complete the cutting.

As shown in FIG3 , when the receiving seat 130 is located in the base 110, the projection of the receiving seat 130 on the plane where the base 110 is located overlaps the local through hole 112. When the first wafer 10 is cut into the second wafer 12 and the receiving seat 130 is located in the base 110, the second wafer 12 can pass through the through hole 112 and be received by the receiving seat 130 to prevent the second wafer 12 from being broken due to failure to be well received at this stage.

FIG. 4 is a three-dimensional schematic diagram of a wafer clamping fixture according to another embodiment of the present invention. FIG. 5 is a three-dimensional schematic diagram of the wafer clamping fixture of FIG. 4 clamping a first wafer. FIG. 6 is a schematic diagram of a top view of FIG. 5. It should be noted that in FIG. 4, in order to clearly distinguish the base 110a from the receiving seat 130a, the receiving seat 130a is indicated by dots.

Please refer to Figures 4 to 6. The main difference between the wafer clamping fixture 100a of Figure 4 and the wafer clamping fixture 100 of Figure 1 is that in the wafer clamping fixture 100 of Figure 1, the first wafer 10 is clamped between the supporting edge 116 of the base 110 and the clamping member 120. Therefore, the size D3 of the through hole 112 of Figure 3 is smaller than the first size D1 of the first wafer 10.

In this embodiment, as shown in FIG. 5 , the wafer clamping fixture 100a further includes a size adjustment member 140 movably disposed on the base 110a, and a clamping member 120a movably disposed on the size adjustment member 140. The first wafer 10 is suitable for being clamped between the size adjustment member 140 and the clamping member 120a.

Specifically, the user can move the size adjustment member 140 radially according to the first wafer 10 of different sizes to adjust the position of the size adjustment member 140 relative to the base 110a. For example, if the size of the first wafer 10 is larger, the size adjustment member 140 can move radially outward relative to the base 110a so that the size adjustment member 140 can support the edge of the first wafer 10. Then adjust the position of the clamping member 120a relative to the size adjustment member 140 so that the first wafer 10 is clamped between the size adjustment member 140 and the clamping member 120a.

On the contrary, if the size of the first wafer 10 is smaller, the size adjustment member 140 can move radially inward relative to the base 110a so that the size adjustment member 140 can support the edge of the first wafer 10. Then, the position of the clamping member 120a relative to the size adjustment member 140 is adjusted so that the first wafer 10 is clamped between the size adjustment member 140 and the clamping member 120a.

Similarly, in this embodiment, since the first wafer 110 is well clamped between the base 110 and the clamping member 120, more specifically, the first wafer 110 is well clamped between the size adjustment member 140 and the clamping member 120a, the probability of the first wafer 10 or the second wafer 12 being broken by the impact of water flow is reduced.

As shown in FIG. 6 , in this embodiment, since the first wafer 10 does not directly contact the base 110a, that is, the base 110a does not need to be used to carry the first wafer 10. The size D3a of the through hole 112a of the base 110a of the wafer clamping fixture 100a is larger than the first size D1 of the first wafer 10, so that the exhaust hole 114a ( FIG. 5 ) is formed between the wall of the base 110a next to the through hole 112a and the first wafer 10. The exhaust hole 114a of the wafer clamping fixture 100a can allow the bubbles generated during the processing to escape, thereby preventing the bubbles from exerting pressure on the wafer and causing wafer breakage.

In addition, as shown in FIG. 6 , since the first wafer 110 is clamped between the size adjusting member 140 and the engaging member 120a, the projection of the size adjusting member 140 on the plane where the base 110a is located partially overlaps the through hole 112a to support the first wafer 110.

Please go back to Figure 4. The receiving seat 130a is movably disposed below the base 110a and corresponds to the through hole 112a. In this embodiment, there is a raised small circle in the center of the receiving seat 130a, which is suitable for receiving the second wafer 12 that passes through the through hole 112 after being cut.

In this embodiment, the receiving seat 130a of the wafer clamping fixture 100a is rotatably arranged on the base 110a, and the receiving seat 130a has a through groove 132 extending along the radial direction. A cutting machine connection part 150 is arranged in the through groove 132, and the cutting machine connection part 150 is connected to the cutting line (not shown) and the cutting machine (not shown). Therefore, when the cutting machine is connected to the cutting line and rotates to cut the first wafer 10, the cutting machine connection part 150 synchronously drives the receiving seat 130a to rotate. The receiving seat 130a of the wafer clamping fixture 100a of this embodiment can rotate synchronously with the cutting machine without stopping the cutting in the cutting process to put in the receiving seat, so it has better cutting efficiency.

FIG7 is a three-dimensional schematic diagram of a crystal rod fixing fixture according to an embodiment of the present invention. Referring to FIG7, the crystal rod fixing fixture 200 of this embodiment is suitable for fixing a crystal rod (not shown) with a length greater than 20 mm, but is not limited thereto. The crystal rod fixing fixture 200 includes a side plate 210, a first clamping member 220, and a second clamping member 230.

The first clamping member 220 and the second clamping member 230 are fixed to the side plate 210. In this embodiment, the first clamping member 220 of the crystal rod fixing fixture 200 has a V-shaped bearing surface 222. The opening of the V-shaped bearing surface 222 faces the second clamping member 230.

In this embodiment, one end face (circular surface) of the crystal rod is suitable for abutting against the side plate 210, and one side (circumferential surface) of the crystal rod 14 is suitable for being clamped between the V-shaped bearing surface 222 of the first clamping member 220 and the second clamping member 230, so as to achieve three-point fixation for stable fixation. Compared with the known crystal rod fixing fixture that fixes the crystal rod by gluing, the gluing and debonding process is very time-consuming. The crystal rod fixing fixture 200 of this embodiment fixes the crystal rod by clamping, which can effectively improve the efficiency of fixing the crystal rod.

FIG8 is a three-dimensional schematic diagram of a crystal rod fixing fixture according to another embodiment of the present invention. Referring to FIG8, the crystal rod fixing fixture 200a of this embodiment is suitable for fixing a crystal rod 14 with a diameter less than 150 mm, but is not limited thereto. The first clamping member 220a and the second clamping member 230a of the crystal rod fixing fixture 200a are fixed to the side plate 210a. The first clamping member 220a and the second clamping member 230a clamp the two end surfaces of the crystal rod 14. Similarly, the crystal rod fixing fixture 200a of this embodiment fixes the crystal rod by clamping, which can effectively improve the efficiency of fixing the crystal rod.

FIG9 is a three-dimensional schematic diagram of a crystal rod fixing fixture according to another embodiment of the present invention. Referring to FIG9, the crystal rod fixing fixture 200b of this embodiment is suitable for fixing a crystal rod 14 with a diameter greater than 150 mm, but is not limited thereto. Since the diameter of the crystal rod 14 is relatively large, it is suitable for multi-point clamping. The first clamping member 220b and the second clamping member 230b of the crystal rod fixing fixture 200b are fixed to the side plate 210b, and have multiple sets of side plates 210b, first clamping members 220b and second clamping members 230b to clamp different positions of the crystal rod 14.

FIG10 is a three-dimensional schematic diagram of a crystal rod fixing fixture of another embodiment of the present invention. Referring to FIG10 , the crystal rod fixing fixture 200c of this embodiment is suitable for fixing a crystal rod with a length less than 50 mm, but is not limited thereto. The crystal rod fixing fixture 200c includes a first base 240 and a first vacuum suction cup 250. The first vacuum suction cup 250 is disposed on the first base 240 and is suitable for adsorbing a first end face 16 of the crystal rod 14.

Compared with the conventional crystal rod fixing fixture that fixes the crystal rod by gluing, the gluing and debonding process is very time-consuming. The crystal rod fixing fixture 200c of this embodiment fixes the crystal rod by vacuum adsorption, which can effectively improve the efficiency of fixing the crystal rod.

FIG11 is a three-dimensional schematic diagram of a crystal rod fixing fixture of another embodiment of the present invention. Referring to FIG11 , the crystal rod fixing fixture 200d of this embodiment is suitable for fixing a crystal rod with a thickness greater than 50 mm, but is not limited thereto. The difference between the crystal rod fixing fixture 200d of FIG11 and the crystal rod fixing fixture 200c of FIG10 is that the crystal rod fixing fixture 200d further includes a second base 260 and a second vacuum chuck 270.

The second vacuum suction cup 270 is disposed on the second base 260 and faces the first vacuum suction cup 250. The second vacuum suction cup 270 is suitable for adsorbing a second end face 18 of the crystal rod 14. The crystal rod fixing fixture 200d of this embodiment fixes the two end faces of the crystal rod by vacuum adsorption, which can effectively improve the efficiency of fixing the crystal rod 14 and can fix the crystal rod 14 quite stably.

It is worth mentioning that in the crystal rod fixing fixture 200, 200a, 200b, 200c, 200d of the present embodiment, during the EDM cutting process, it is suitable to connect the crystal rod 14 and the crystal rod fixing fixture 200, 200a, 200b, 200c, 200d with a conductor such as copper tape (not shown). In order to increase the conductivity between the crystal rod 14 and the crystal rod fixing fixture 200, 200a, 200b, 200c, 200d, the conductivity of the crystal rod 14 is increased, thereby improving the EDM processing efficiency. It should be noted that in order to maintain the best conductivity and prevent the tape from affecting the cutting path, the tape must be 20 mm away from the cutting path.

In summary, the clamping member of the wafer clamping fixture of the present invention can be movably arranged above the base to well clamp the first wafer between the base and the clamping member, thereby reducing the probability of the first wafer or the second wafer being impacted by the water flow and causing fragmentation. After the first wafer clamped by the base and the clamping member is cut into the second wafer, it can pass through the through hole of the base to be well received by the receiving seat below the base. In addition, the exhaust hole of the wafer clamping fixture can allow the bubbles generated during the processing to escape, thereby preventing the bubbles from generating pressure on the first wafer or the second wafer and causing the first wafer or the second wafer to be broken.

In addition, the conventional crystal rod fixing jig fixes the crystal rod by gluing, and the gluing and degumming process is very time-consuming. The crystal rod fixing jig of the present invention fixes the crystal rod by clamping or vacuum adsorption to improve efficiency.

100: Wafer clamping fixture

110: Base

112:Through the hole

114: Exhaust hole

116: Entrustment

120: snap-fit parts

130: Receiver

Claims (7)

A wafer clamping fixture includes: a base, including a through hole, the size of the through hole is larger than the second size of the second wafer, and an exhaust hole is located on the base; a clamping member is movably arranged above the base; and a receiving seat is movably arranged inside or below the base and corresponds to the through hole. The wafer clamping fixture as described in claim 1, wherein a first wafer is suitable for being clamped between the base and the clamping member to be cut into a second wafer, the size of the through hole is between the first size of the first wafer and the second size of the second wafer, the second wafer is suitable for passing through the through hole and being received by the receiving seat, the base includes a supporting edge surrounding the through hole, and the first wafer is suitable for being clamped between the supporting edge and the clamping member. The wafer clamping fixture as described in claim 2, wherein the exhaust hole is located between the base and the first wafer, and the exhaust hole is recessed in the support edge. The wafer clamping fixture as described in claim 1, wherein when the receiving seat is arranged inside or below the base, the projection of the receiving seat on the plane where the base is located overlaps with the local through hole, and the receiving seat is suitable for being moved away from below the base so that the projection of the receiving seat on the plane where the base is located does not overlap with the through hole. A wafer clamping fixture as described in claim 1, wherein a first wafer is suitable for being clamped between the base and the engaging member to be cut into a second wafer, the size of the through hole is larger than a first size of the first wafer, and the exhaust hole is formed between the wall of the through hole and the first wafer. The wafer clamping fixture as described in claim 1 further includes a size adjustment member movably disposed on the base, the projection of the size adjustment member on the plane where the base is located partially overlaps the through hole, the clamping member is movably disposed on the size adjustment member, and a first wafer is suitable for being clamped between the size adjustment member and the clamping member. The wafer clamping fixture as described in claim 6, wherein the receiving seat is rotatably disposed on the base, and the receiving seat has a through groove extending along the radial direction.

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