TWI832350B - Substrate processing apparatus and method of driving door assembly - Google Patents

Abstract

The present invention provides an apparatus for processing a substrate. The equipment for processing a substrate may include: a chamber having a processing space for processing the substrate and forming a loading port for the substrate to enter and exit; a gas supply unit that supplies process gas to the processing space; and a plasma unit that generates electricity from the process gas. slurry; and a door assembly that opens and closes the loading port; and, the door assembly may include: a door that opens and closes the loading port; and a door actuator that moves the door between an open position and a closed position; the door may include: a housing , which is formed with a passage for air flow to flow into on one side and has an internal space; a valve that opens or closes the passage; and a valve driver that moves the valve between an open position or a closed position.

Description

Substrate processing equipment and method of driving door assembly

The present invention relates to a substrate processing apparatus, and more specifically, to a substrate processing apparatus that utilizes plasma to process a substrate.

Generally speaking, in the manufacturing process of semiconductor devices, various processes using plasma to treat substrates are used. Plasma refers to an ionized gas state composed of ions, free radicals, electrons, etc. Plasma is generated by extremely high temperatures or strong electric fields or high-frequency electromagnetic fields (RF Electromagnetic Fields). This process uses etching, deposition and cleaning processes.

FIG. 1 is a diagram showing a state in which the door is opened on one side wall of a common process chamber. FIG. 2 is an enlarged view of part A of FIG. 1 . Referring to FIGS. 1 and 2 , a loading port for loading or unloading a substrate is formed in the chamber 9000 . In addition, in order to isolate the chamber 9000 from the external environment, a door assembly 9200 is provided that opens or closes the loading port. The pressure inside the chamber is different from the pressure outside the chamber. Therefore, when the door assembly moves to open and close the loading port, the airflow outside the chamber flows into the interior of the chamber through the space between the door assembly and the loading port. The airflow outside the chamber contains various particles. As a result, the particles flow into the interior of the chamber. Particles flowing into the chamber have an impact on the internal environment of the chamber, resulting in poor substrate processing processes.

[Technical Issue]

An object of the present invention is to provide a substrate processing apparatus and a method of driving the door assembly that can minimize the difference between the internal pressure of the chamber and the external pressure of the chamber before opening the chamber door.

In addition, it is an object of the present invention to provide a method for a substrate processing equipment and a drive door assembly that can minimize the inflow of particles into a chamber.

The problems to be solved by the present invention are not limited to the above-mentioned problems. Those skilled in the art to which the present invention belongs can clearly understand the problems not mentioned above from the description and drawings. [Technical solution]

The present invention provides an apparatus for processing a substrate. The equipment for processing the substrate may include: a chamber, the aforementioned chamber having a processing space for processing the substrate, and forming a loading port for the substrate to enter and exit; a gas supply unit, the aforementioned gas supply unit supplies process gas to the aforementioned processing space; a plasma unit, The aforementioned plasma unit generates plasma from the aforementioned process gas; and a door assembly, the aforementioned door assembly opens and closes the aforementioned loading inlet; and the aforementioned door assembly may include: a door, the aforementioned door opens and closes the aforementioned loading inlet; and a door driver, The aforementioned door actuator moves the aforementioned door between an open position and a closed position; the aforementioned door may include: a housing, the aforementioned housing is formed with a passage for air flow to flow into on one side and has an internal space; a valve, the aforementioned valve opens or closes the aforementioned passage; and A valve driver moves the valve between an open position or a closed position.

According to an embodiment, the aforementioned apparatus may further include a controller that controls the aforementioned gate driver and the aforementioned valve driver, wherein the aforementioned controller may control the aforementioned valve driver to move the aforementioned valve to an open position when the substrate is unloaded from the aforementioned processing space. , and then control the aforementioned door driver to move the aforementioned door to the open position.

According to one embodiment, the internal space may be provided with a punching member, and the punching member may be formed with punching holes for the airflow to flow.

According to an embodiment, the aforementioned punching member may include a filter.

According to one embodiment, the punching member may include a plate disposed on the other side facing one side of the door and having a plurality of punching holes formed therein.

According to one embodiment, the punching member may include: a plate disposed on the other side opposite to one side of the door and formed with a plurality of punching holes; and a filter disposed between the passage and the door. between the boards.

According to an embodiment, the area of the punching hole may be smaller than the area of the passage.

In addition, the present invention provides an apparatus for processing a substrate. The apparatus for processing a substrate may include: a chamber formed with a loading port for the substrate to enter and exit; and a door assembly that opens and closes the loading port; and the door assembly may include: a door, the aforementioned door assembly opening and closing the loading port. The door is located outside the aforementioned chamber and opens and closes the aforementioned loading inlet; and a door driver, the aforementioned door driver moves the aforementioned door between an open position and a closed position; the aforementioned door may include: a shell, and the aforementioned shell is formed with an air flow inlet on one side. The passage has an internal space; a valve, the aforementioned valve opens or closes the aforementioned passage; and a valve driver, the aforementioned valve driver moves the aforementioned valve between an open position or a closed position.

According to an embodiment, the aforementioned device may further include a controller that controls the aforementioned door driver and the aforementioned valve driver, wherein the aforementioned controller may control the aforementioned valve driver to move the aforementioned valve to an open position when the substrate is unloaded from the aforementioned chamber. , after the aforementioned valve moves to the open position, the aforementioned door driver can be controlled to move the aforementioned door to the open position.

According to one embodiment, the internal space may include a punching member, and the punching member may be formed with punching holes for the airflow to flow.

According to an embodiment, the aforementioned punching member may include a filter.

According to one embodiment, the punching member may include: a plate disposed on the other side opposite to one side of the door and formed with a plurality of punching holes; and a filter disposed between the passage and the door. between the boards.

According to an embodiment, the area of the punching hole may be smaller than the area of the passage.

Additionally, the present invention provides a method of driving a door assembly in an apparatus for processing substrates. The method of driving the door assembly may include: a valve opening step in which the valve is moved to an open position to open the passage; and a door opening step in which the door is moved to an open position after the valve opening step.

According to an embodiment, the aforementioned substrate processing equipment may be equipment that processes the substrate under vacuum pressure. [Effects of the invention]

According to an embodiment of the present invention, the difference between the internal pressure of the chamber and the external pressure of the chamber can be minimized before opening the chamber door.

In addition, according to an embodiment of the present invention, the flow of particles into the interior of the chamber can be minimized.

The effects of the present invention are not limited to the above-mentioned effects. Those skilled in the art can clearly understand the effects not mentioned above from this description and the drawings.

Embodiments of the invention are described in more detail below with reference to the accompanying drawings. The embodiments of the present invention can be modified into various forms, and the scope of the present invention should not be construed as being limited to the embodiments described below. The present examples are provided to more fully describe the present invention to those of ordinary skill in the art. Therefore, the shapes of components in the drawings are exaggerated to emphasize clearer descriptions.

Embodiments of the present invention are described in detail below with reference to FIGS. 3 to 15 .

FIG. 3 is a diagram schematically showing the substrate processing apparatus of the present invention. Referring to FIG. 3 , the substrate processing equipment 1 has an Equipment Front End Module (EFEM) 20 and a processing module 30 . The device front-end module 20 and the processing module 30 are arranged in one direction.

The device front-end module 20 has a load port 200 and a transfer framework 220 . The load port 200 is arranged in front of the device front-end module 20 along the first direction 2 . The load port 200 has a plurality of supports 202 . Each support part 202 is arranged in a row along the second direction 4 , and is provided with a carrier C (such as a cassette, FOUP, etc.) that accommodates the substrate W to be provided for the process and the substrate W that has been processed by the process. The substrate W to be supplied to the process and the substrate W that has been processed in the process are stored on the carrier C. The transfer frame 220 is disposed between the load port 200 and the processing module 30 . The transfer frame 220 includes a first transfer robot 222 disposed inside the transfer frame 220 and transferring the substrate W between the load port 200 and the processing module 30 . The first transfer robot 222 moves along the transfer rail 224 provided in the second direction 4 to transfer the substrate W between the carrier C and the processing module 30 .

The processing module 30 includes a load gate chamber 300 , a transfer chamber 400 and a process chamber 500 . In one embodiment of the present invention, the chamber has a processing space for processing substrates and is formed with a loading port for the substrates to enter and exit, including a loading gate chamber 300 , a transfer chamber 400 or a process chamber 500 .

The load lock chamber 300 is disposed adjacent to the transfer frame 220 . As an example, the load gate chamber 300 may be configured between the transfer chamber 400 and the equipment front-end module 20 . The loading gate chamber 300 provides a space for waiting for substrates W to be supplied to the process before being transferred to the process chamber 500 or for substrates W that have been processed before being transferred to the equipment front-end module 20 .

The transfer chamber 400 is disposed adjacent to the load gate chamber 300 . The transfer chamber 400 has a polygonal body when viewed from above. For example, the transfer chamber 400 may have a pentagonal body when viewed from above. On the outside of the main body, a load lock chamber 300 and a plurality of process chambers 500 are arranged along the outer periphery of the main body. A passage (not shown) for the substrate W to enter and exit is formed on each side wall of the main body, and the passage connects the transfer chamber 400 and the loading lock chamber 300 or the process chamber 500 . Each passage is equipped with a door (not shown) that opens and closes the passage to seal the interior. In the inner space of the transfer chamber 400, a second transfer robot 420 that transfers the substrate W between the load lock chamber 300 and the process chamber 500 is disposed. The second transfer robot 420 transfers the unprocessed substrate W waiting in the load lock chamber 300 to the process chamber 500 , or transfers the process-processed substrate W to the load lock chamber 300 . Furthermore, in order to sequentially supply the substrates W to the plurality of process chambers 500 , the substrates W are transferred between the process chambers 500 . For example, as shown in FIG. 1 , when the transfer chamber 400 has a pentagonal body, the loading gate chambers 300 are respectively arranged on the side walls adjacent to the equipment front-end module 20 , and the process chambers 500 are continuously arranged on the remaining side walls. . The shape of the transfer chamber 400 is not limited to this, and can be transformed into various configurations according to the required process modules.

The process chamber 500 is arranged along the periphery of the transfer chamber 400 . The process chamber 500 may be equipped with multiple processes. Processing of the substrate W may be performed within each process chamber 500 . The process chamber 500 receives the transferred substrate W from the second transfer robot 420 and performs process processing, and provides the processed substrate W to the second transfer robot 420 . The process processes performed in each process chamber 500 may differ from each other.

4 is a diagram schematically illustrating a process chamber that performs a plasma processing process among the process chambers of the substrate processing apparatus of FIG. 1 . Referring to FIG. 4 , the process chamber 500 uses plasma to perform a predetermined process on the substrate W. As an example, the film on the substrate W may be etched or polished (Ashing). The thin film can be a variety of films such as polycrystalline silicon film, oxide film, silicon nitride film, etc. Depending on the situation, the film may be a natural oxide film or a chemically produced oxide film.

The process chamber 500 includes a processing chamber 520, a plasma generation chamber 540, a diffusion chamber 560, and an exhaust chamber 580.

The processing chamber 520 provides a processing space 5200 in which the substrate W is placed and processing is performed on the substrate W. The process gas is discharged in a plasma generation chamber 540 to be described later to generate plasma, which is supplied to the processing space 5200 of the processing chamber 520 . The process gas accumulated inside the processing chamber 520 and/or reaction by-products generated during processing of the substrate W are discharged to the outside through the exhaust chamber 580 described below. Thereby, the pressure in the processing chamber 520 can be maintained at the set pressure. The processing chamber 520 may include a housing 5220, a support unit 5240, and an exhaust baffle 5260.

There may be a processing space 5200 inside the housing 5220 for performing substrate processing processes. The upper part of the housing 5220 can be opened. The outer walls of the housing 5220 can be equipped with conductors. As an example, the outer wall of the housing 5220 may be made of aluminum. An exhaust hole 5222 is formed on the bottom surface of the housing 5220. The process gas and/or by-products in the processing space 5200 can be discharged to the outside of the processing space 5200 through the exhaust hole 5222 . The exhaust hole 5222 may be connected to components included in the exhaust chamber 580 described below.

A loading port 5201 may be formed on the side wall of the housing 5220. The loading port 5201 can function as a space for loading or unloading the substrate W. The substrate W is loaded into the inside of the housing 5220 through the loading port 5201, and optionally, the substrate W is loaded out of the housing 5220 through the loading port 5201. The loading port 5201 can be opened and closed by the door assembly 600.

FIG. 5 is a diagram schematically showing the door assembly of the embodiment shown in FIG. 4 . Referring to Figure 5, door assembly 600 may open or close loading port 5201. Door assembly 600 may include door 620 and door actuator 640.

Door 620 may open or close loading port 5201. The door 620 can be moved between an open position and a closed position by means of a door driver 640 described below. Door 620 may include housing 622, valve 624, valve driver 626, and punch member 630.

The housing 622 may be generally configured in a rectangular parallelepiped shape. When viewed from the front, the housing 622 may be approximately larger than the area of the loading port 5201 . The housing 622 can cover the loading port 5201 when viewed from the front. Therefore, after the door 620 is moved to the closed position by the door driver 640 described below, the loading port 5201 can be closed by the door 620 .

Housing 622 has an interior space. A filter 634 described later can be disposed in the inner space of the housing 622 . A passage 621 into which air flow flows is formed on one side of the housing 622 . A passage 621 is formed on one side of the housing 622 facing the other side of the housing 622 adjacent to the processing space 5200, through which the air flow from outside the process chamber 500 flows. A plate 632 described later may be disposed on the other side of the housing 622 .

Valve 624 may be located on the exterior of door 620. Valve 624 may be located on a side of housing 622. The valve 624 may be located on the outside of the housing 622 in which the passage 621 is formed. When viewed from the front, the area of the valve 624 may be provided larger than the area of the passage 621 . Valve 624 may open or close passage 621. The valve 624 is movable between an open position and a closed position via a valve actuator 626 described below.

The so-called open position can be defined as the position where the valve 624 opens the passage 621. For example, if valve 624 is in the open position, valve 624 may be located in an outer region of passage 621 . According to an embodiment, if the valve driver 626 moves the valve 624 downward so that the valve 624 is in the open position, the upper end of the valve 624 may be located lower than the lower end of the passage 621 . That is, in the open position, the valve 624 and the passage 621 may not overlap each other. The valve 624 allows the airflow outside the process chamber 500 to flow into the internal space of the housing 622 by opening the passage 621 .

The so-called closed position can be defined as the position where the valve 624 closes the passage 621. For example, valve 624 may overlap passage 621 if valve 624 is in the closed position. If the valve 624 is in the closed position, the valve 624 can completely cover the entire area of the passage 621. That is, if the valve 624 is in the closed position, the passage 621 can be sealed by the valve 624 . According to an embodiment, if the valve driver 626 moves the valve 624 upward so that the valve 624 is in the closed position, the upper end of the valve 624 may be located above the upper end of the passage 621 . The valve 624 can block the flow of external airflow from the process chamber 500 into the internal space of the housing 622 by closing the passage 621 .

Valve driver 626 may be mounted externally to housing 622 . As one example, valve actuator 626 may be mounted on the outside of housing 622 . Valve driver 626 may move valve 624 in a vertical direction relative to the side of housing 622 . Valve driver 626 may move valve 624 to an open position opening passage 621 . Valve driver 626 may move valve 624 to a closed position closing passage 621 .

As an example, when the valve actuator 626 moves the valve 624 to the open position, the valve 624 may be moved vertically downward. As one example, the valve driver 626 may move the valve 624 vertically upward when moving the valve 624 to the closed position. The valve driver 626 can be modified and equipped with various known devices that can provide driving force.

Punching member 630 may be provided within housing 622. The punching member 630 may be provided in the inner space of the housing 622. A plurality of punching holes are formed in the punching member 630 . The punched holes formed in the punched member 630 may be used as a passage for airflow outside the process chamber 500 to flow when the valve 624 is opened and flows through the passage 621 . The area of the punch hole formed on the punch member 630 may be configured to be smaller than the area of the passage 621 . Punching member 630 may include plate 632 and filter 634.

The plate 632 may be disposed on the other side of the door 620 facing the one side of the door 620 in which the passage 621 is formed. The plate 632 may be disposed on the other side of the housing 622 facing the one side of the housing 622 in which the passage 621 is formed. The plate 632 may be formed in a shape corresponding to the internal space of the housing 622 when viewed from the front.

Plate 632 is formed with a plurality of punched holes. A plurality of punch holes may be formed spaced apart along the outer circumferential direction of the plate 632 . For example, multiple punched holes may be formed spaced throughout the entire area of plate 632. The area of each of the plurality of punch holes may be configured to be smaller than the area of the passage 621 . A plurality of punched holes may be formed through the plate 632 up and down. As an example, the diameters of multiple punch holes may be the same as each other. Unlike this, the diameters of the plurality of punched holes may be different from each other. The penetration direction of the plurality of punch holes may be formed parallel to the direction of air flow outside the process chamber 500 . As an example, the penetration direction of the plurality of punched holes in the plate 632 may be parallel to the length direction of the passage 621 . Plate 632 may be integrally formed with housing 622. But it is not limited thereto. The plate 632 can be distinguished from the housing 622 and arranged on the other side of the housing 622 .

The filter 634 can filter impurities such as particles contained in the airflow flowing in from outside the housing 622 . Fine punch holes for filtering impurities may be formed on the filter 634 . Airflow flowing in from the outside of the housing 622 can pass through the punched holes formed in the filter 634 and flow toward the plate 632 . Impurities contained in the airflow flowing in from the outside of the housing 622 cannot pass through the punched holes formed in the filter 634 . Impurities contained in the air flow can thus be removed by the filter 634. The filter 634 of an embodiment may be a well-known filter capable of filtering impurities.

The filter 634 may be disposed in the interior space of the housing 622. The filter 634 can be disposed between one side of the housing 622 and the other side of the housing 622 in the internal space. As an example, the filter 634 can be disposed in the inner space between the passage 621 and the plate 632 . When the filter 634 is viewed from the side, its length direction may be perpendicular to the penetration direction of the plurality of punched holes provided on the plate 632 . According to an embodiment, the height of the filter 634 may correspond to the height of the interior space of the housing 622 , and the width of the filter 634 may correspond to the width of the interior space of the housing 622 . That is, the filter 634 may be formed so as to overlap the internal space of the housing 622 when viewed from the front.

Door actuator 640 may move door 620 to an open position that opens loading port 5201. Door actuator 640 may move door 620 to a closed position that closes loading port 5201. The door actuator 640 can move the door 620 in a vertical or horizontal direction relative to the housing 5220 side wall.

As an example, when the door driver 640 moves the door 620 to the open position, the door driver 640 may move the door 620 horizontally in a direction away from the side wall of the housing 5220 and then move the door 620 vertically in a downward direction. As an example, when the door driver 640 moves the door 620 to the closed position, it may move the door 620 vertically in an upward direction and then move the door 620 horizontally in a direction closer to the side wall of the housing 5220.

The door driver 640 may be composed of a motor 642 and a connection member 644 connecting the motor 642 and the door 620 . With the driving of the motor 642, the connecting member 644 moves in the vertical or horizontal direction, so that the door 620 can move in the vertical or horizontal direction relative to the side wall of the housing 5220. Motor 642 may be configured to provide a variety of well-known means of driving force.

In the above example, description is made taking the vertical or horizontal movement of the door driver 640 as an example, but it is not limited thereto. As one example, door actuator 640 may move horizontally, vertically, or/and tilt relative to the ground. As one example, door actuator 640 may be driven to move door 620 in a generally "Z" shape.

Controller 700 may control valve driver 626 and door driver 640. Controller 700 may control valve actuator 626 to move valve actuator 626 between an open position and a closed position. The controller 700 may control the door actuator 640 to move the door actuator 640 between the open position and the closed position.

The controller 700 may control the valve driver 626 to move the valve 624 to the open position when the substrate W is unloaded from the processing space 5200. As an example, the controller 700 may control the valve driver 626 to vertically move the valve 624 downward after completing the plasma treatment of the substrate W and before unloading the substrate W from the processing space 5200 . The controller 700 may control the valve driver 626 to cause the valve 624 to open a portion of the passage 621 after completing the plasma treatment of the substrate W and before unloading the substrate W from the processing space 5200 . The controller 700 may control the valve driver 626 so that the valve 624 fully opens the passage 621 after the valve 624 is partially opened and a set time has elapsed. That is, the controller 700 may control the valve driver 626 to increase the opening of the passage 621 from the time when the plasma treatment of the substrate W is completed until the time when the valve 624 completely opens the passage 621 .

The controller 700 may control the door driver 640 to move the door 620 to the open position after the valve 624 fully opens the passage 621. The controller 700 may control the door driver 640 to horizontally move the door 620 away from the loading port 5201 after the valve 624 fully opens the passage 621 . After completing the horizontal movement of the door 620, the controller 700 may control the door driver 640 to move the door 620 vertically downward. After the door 620 moves downward, the substrate W can be transported through the loading port 5201.

When opening the loading port of a chamber that is isolated from the external environment, external particles can flow into the processing space due to the difference in environmental conditions between the inside and outside of the chamber. In particular, a chamber that performs a plasma process maintains a vacuum pressure, so the external airflow of a chamber that does not maintain a vacuum pressure can flow into the interior of the chamber at a high flow rate. This phenomenon persists even when the chamber loading door is opened at low speed. In the case of low-speed opening, due to the difference between the external pressure and the internal pressure of the chamber, the external airflow also quickly flows into the space formed between the door and the loading port, and the inside of the processing space is contaminated by particles.

According to an embodiment of the present invention described above, before opening the loading port 5201 formed in the process chamber 500, the valve 624 formed on the door 620 is first opened, so that before the loading port 5201 is opened, the valve 624 can be minimized. The pressure difference between the inside and outside of the small process chamber 500. The flow of external airflow containing particles into the process chamber 500 is thereby minimized. Therefore, substrate handling process defects can be minimized.

FIG. 6 is a diagram schematically showing the flow of air when the valve of FIG. 5 is moved to the open position. Referring to FIG. 6 , by arranging the punching member 630 in the inner space of the door 620 , the flow of external airflow and the particles contained therein caused by the opening of the valve 624 into the processing space 5200 can be minimized. Specifically, through the filter 634, particles contained in the external air flow can be filtered for the first time, preventing the particles from flowing into the processing space 5200. Furthermore, the flow rate of the external airflow flowing in through the passage 621 can be reduced through the filter 634 . Through plate 632, particles contained in the external air flow can be filtered a second time. In addition, the external air flow decelerated by the filter 634 collides with the portion of the plate 632 where no punch holes are formed, so that the flow rate of the external air flow can be further reduced.

Referring again to FIG. 4 , the support unit 5240 supports the substrate W in the processing space 5200 . The support unit 5240 may include a support plate 5242 and a support shaft 5244.

Support plate 5242 may support substrate W in processing space 5200. The support plate 5242 may be supported by a support shaft 5244. The support plate 5242 can be connected to an external power source and generate static electricity through the connected power. The generated static electricity has an electrostatic force that can fix the substrate W to the supporting unit 5240 .

The support shaft 5244 can move the object. For example, the support shaft 5244 can move the substrate W in the up and down direction. As an example, the support shaft 5244 can be combined with the support plate 5242 to raise and lower the support plate 5242 to move the substrate W.

The exhaust baffle 5260 uniformly discharges plasma by area in the processing space 5200 . The exhaust baffle 5260 has an annular shape when viewed from above. The exhaust baffle 5260 is located in the processing space 5200 between the inner side wall of the housing 5220 and the support unit 5240. A plurality of exhaust holes 5262 are formed on the exhaust baffle 5260. The exhaust hole 5262 is provided in the up and down direction. The exhaust hole 5262 is provided with a hole extending from the upper end to the lower end of the exhaust baffle 5260 . The exhaust holes 5262 may be spaced apart from each other along the circumferential direction of the exhaust baffle 5260 .

The plasma generation chamber 540 discharges process gas supplied from a gas supply unit 5440 to be described later to generate plasma, and supplies the generated plasma to the processing space 5200 .

The plasma generation chamber 540 may be located above the processing chamber 520. The plasma generation chamber 540 may be located above the housing 5220 and the diffusion chamber 560 described below. The processing chamber 520 , the diffusion chamber 560 and the plasma generation chamber 540 may be arranged in sequence from the ground along the third direction 6 that is perpendicular to both the first direction 2 and the second direction 4 .

The plasma generation chamber 540 may include a plasma chamber 5420, a gas supply unit 5440, and a power access unit 5460.

Plasma chamber 5420 may have a shape that is open above and below. The plasma chamber 5420 may have a cylindrical shape with upper and lower faces open. The plasma chamber 5420 may have a cylindrical shape with upper and lower faces open. Openings having a diameter D1 may be formed at upper and lower ends of the plasma chamber 5420. Plasma chamber 5420 may have a plasma generation space 5422. The plasma chamber 5420 may be made of aluminum oxide Al2O3.

The upper side of plasma chamber 5420 may be sealed by gas supply port 5424. The gas supply port 5424 can be connected to a gas supply unit 5440 described below. Process gas can be supplied to the plasma generation space 5422 through the gas supply port 5424. The process gas supplied to the plasma generation space 5422 can be uniformly distributed to the processing space 5200 through the distribution plate 5640 described below.

The gas supply unit 5440 may supply process gas. The gas supply unit 5440 may be connected to the gas supply port 5424. The process gas supplied by the gas supply unit 5440 may include fluorine (Fluorine) and/or hydrogen (Hydrogen).

The power access unit 5460 can access high-frequency power to the plasma generation space 5422. The power access unit 5460 may be a plasma source that excites process gas in the plasma generation space 5422 to generate plasma. Power access unit 5460 may include an antenna 5462 and a power source 5464.

Antenna 5462 may be an inductively coupled plasma (ICP) antenna. The antenna 5462 may be provided in a coil shape. The antenna 5462 may wrap multiple turns around the plasma chamber 5420 outside the plasma chamber 5420 . Antenna 5462 may be helically wound around plasma chamber 5420 multiple times outside of plasma chamber 5420 .

Antenna 5462 may be wrapped around plasma chamber 5420 in an area corresponding to plasma generation space 5422. One end of the antenna 5462 may be disposed at a height corresponding to the upper region of the plasma chamber 5420 when viewed from the front of the plasma chamber 5420 . The other end of the antenna 5462 may be disposed at a height corresponding to the lower region of the plasma chamber 5420 when viewed from the front of the plasma chamber 5420 .

Power supply 5464 can provide power to antenna 5462. The power supply 5464 can connect high-frequency AC power to the antenna 5462. The high-frequency AC power connected to the antenna 5462 can form an induced electric field in the plasma generation space 5422. The process gas supplied into the plasma generation space 5422 can obtain the energy required for ionization from the induced electric field to transform into a plasma state.

Power supply 5464 may be connected to one end of antenna 5462. The power supply 5464 may be connected to one end of the antenna 5462 disposed at a height corresponding to the upper region of the plasma chamber 5420. Additionally, the other end of antenna 5462 may be grounded. The other end of the antenna 5462 disposed at a height corresponding to the lower region of the plasma chamber 5420 may be grounded. But it is not limited to this. One end of the antenna 5462 may be grounded, and the other end of the antenna 5462 may be connected to the power supply 5464.

The diffusion chamber 560 can diffuse the plasma generated by the plasma generation chamber 540 into the processing space 5200 . Diffusion chamber 560 may include diffusion chamber 5620 and baffle 5640.

The diffusion chamber 5620 provides a plasma diffusion space 5622 in which the plasma generated by the plasma chamber 5420 is diffused. The diffusion chamber 5620 may have an inverted funnel shape as a whole. The diffusion chamber 5620 may have an upper and lower open shape. Plasma generated by the plasma generation chamber 540 may be diffused while passing through the plasma diffusion space 5622. The plasma flowing into the plasma diffusion space 5622 can be uniformly distributed to the processing space 5200 through the baffle 5640 described below.

Diffusion chamber 5620 may be located at a lower portion of plasma chamber 5420. Diffusion chamber 5620 may be located between housing 5220 and plasma chamber 5420. The housing 5220, the diffusion chamber 5620 and the plasma chamber 5420 may be arranged in sequence from the ground along the third direction 6. The inner peripheral surface of the diffusion chamber 5620 may be configured to be non-conductive. As an example, the inner peripheral surface of the diffusion chamber 5620 may be made of quartz.

The baffle 5640 allows the plasma flowing into the processing space 5200 to be uniformly supplied to the substrate W. A plurality of baffle holes 5642 may be formed on the baffle 5640. The plurality of baffle holes 5642 may be provided as through-holes arranged from the upper surface to the lower surface of the baffle 5640. The plurality of baffle holes 5642 may be uniformly formed in various areas of the baffle 5640. The baffle 5640 may be located at an upper portion of the support unit 5240 opposite to the support unit 5240 . The baffle 5640 may be located between the support unit 5240 and the plasma generation chamber 540. The plasma generated in the plasma generation chamber 540 can pass through a plurality of baffle holes 5642 formed on the baffle 5640.

The exhaust chamber 580 can exhaust the process gas and impurities inside the processing chamber 520 to the outside. The exhaust chamber 580 may exhaust impurities generated during processing of the substrate W to the outside of the process chamber 500 . The exhaust chamber 580 may exhaust the process gas supplied into the processing space 5200 to the outside. The exhaust chamber 580 may include an exhaust line 5820 and a pressure relief member 5840. The exhaust line 5820 may be connected to an exhaust hole 5222 formed on the bottom surface of the housing 5220. The exhaust line 5820 may be connected to a pressure relief member 5840 that provides pressure relief.

Pressure relief member 5840 may provide pressure relief to processing space 5200. The pressure relief member 5840 may discharge residual plasma and impurities in the processing space 5200 to the outside of the housing 5220. Additionally, the pressure relief member 5840 may provide pressure relief to maintain the pressure of the processing space 5200 at a preset pressure. Pressure relief member 5840 may be a pump. Without limitation, the pressure relief member 5840 may be configured as a well-known device for providing pressure relief.

In the above-described embodiment of the present invention, the process chamber 500 is provided with the door assembly 600 and the door assembly 600 is driven. But not limited thereto, the door assembly 600 may be disposed in the locking chamber 300, the transfer chamber 400 and similarly driven.

7 and 8 are diagrams schematically showing the door assembly of another embodiment shown in FIG. 4 . The following description of the substrate processing equipment according to another embodiment of the present invention is similar to the description of the substrate processing equipment according to one embodiment of the present invention, except for additional descriptions. Therefore, to avoid duplication, the details are not repeated.

Referring to Figure 7, door 620 may open or close loading port 5201. Door 620 is moveable between an open position or a closed position by means of door actuator 640. Door 620 may include housing 622, valve 624, valve driver 626, and punch member 630.

The housing 622 may be generally configured in a rectangular parallelepiped shape. The housing 622 is approximately larger than the area of the loading port 5201 when viewed from the front. The housing 622 can cover the loading port 5201 when viewed from the front. Therefore, if the door 620 is moved to the closed position by the door driver 640 described later, the loading port 5201 can be closed by the door 620 . Housing 622 has an interior space. The internal space of the housing 622 may be provided with a filter 634 described later. A passage 621 into which air flow flows is formed on one side of the housing 622 . On one side of the housing 622 facing the other side of the housing 622 adjacent to the processing space 5200, a passage 621 for allowing the external airflow of the process chamber 500 to flow in is formed.

Valve 624 may be located on the exterior of door 620. Valve 624 may be located on a side of housing 622. The valve 624 may be located on the outside of the housing 622 in which the passage 621 is formed. When viewed from the front, the area of the valve 624 may be configured to be larger than the area of the passage 621 . Valve 624 may open or close passage 621. Valve 624 is moveable between an open position or a closed position by means of valve actuator 626. The valve 624 allows the external airflow of the process chamber 500 to flow into the internal space of the housing 622 by opening the passage 621 . The valve 624 can cut off the external airflow of the process chamber 500 from flowing into the internal space of the housing 622 by closing the passage 621 .

Valve driver 626 may be mounted externally to housing 622 . As an example, the valve driver 626 may be disposed on the outside of the housing 622 . Valve driver 626 may move valve 624 to an open position opening passage 621 . Valve driver 626 may move valve 624 to a closed position closing passage 621 . Valve actuator 626 may move valve 624 in a vertical direction relative to the sides of housing 622 .

As an example, when the valve actuator 626 moves the valve 624 to the open position, the valve 624 may be moved vertically downward. As an example, when the valve actuator 626 moves the valve 624 to the closed position, the valve 624 may be moved vertically downward. The valve actuator 626 can be modified and equipped with a variety of well-known devices that can provide driving force.

Punching member 630 may be disposed within housing 622. The punching member 630 may be disposed in the inner space of the housing 622 . Punching holes are formed in the punching member 630 . The punched holes formed on the punched member 630 may be used as a space for the external airflow of the process chamber 500 that is opened by the valve 624 and flows in through the passage 621 to flow. The area of the punch hole formed on the punch member 630 may be configured to be smaller than the area of the passage 621 . Punching member 630 may include a filter 634 .

The filter 634 may be disposed in the interior space of the housing 622. The filter 634 can be disposed between one side of the housing 622 and the other side of the housing 622 in the internal space. As an example, the filter 634 may be disposed between the passage 621 and the plate 632 in the interior space. Therefore, the air flow outside the process chamber 500 and the particles it contains due to the opening of the valve 624 can be minimized to be removed by the filter 634 and flow into the processing space 5200 . In addition, the flow rate of the external airflow flowing into the interior of the process chamber 500 due to the opening of the valve 624 can be reduced. Therefore, sudden pressure changes in the process chamber 500 can be minimized.

Referring to Figure 8, door 620 may open or close loading port 5201. Door 620 is moveable between an open position or a closed position by means of door actuator 640. Door 620 may include housing 622, valve 624, valve driver 626, and punch member 630.

The housing 622 may be generally configured in a rectangular parallelepiped shape. The housing 622 may be configured to have an area larger than the loading port 5201 when viewed from the front. The housing 622 can cover the loading port 5201 when viewed from the front. Therefore, if the door 620 is moved to the closed position by the door driver 640 described later, the loading port 5201 can be closed by the door 620 . Housing 622 has an interior space. A passage 621 into which air flow flows is formed on one side of the housing 622 . A passage 621 is formed on one side of the housing 622 facing the other side of the housing 622 adjacent to the processing space 5200, into which the air flow from outside the process chamber 500 flows. A plate 632 described later may be disposed on the other side of the housing 622 .

Valve 624 may be located on the exterior of door 620. Valve 624 may be located on a side of housing 622. The valve 624 may be located on the outside of the housing 622 in which the passage 621 is formed. When viewed from the front, the area of the valve 624 may be configured to be larger than the area of the passage 621 . Valve 624 may open or close passage 621. Valve 624 is moveable between an open position or a closed position by means of valve actuator 626. The valve 624 allows the external airflow of the process chamber 500 to flow into the internal space of the housing 622 by opening the passage 621 . The valve 624 can cut off the external airflow of the process chamber 500 from flowing into the internal space of the housing 622 by closing the passage 621 .

Valve driver 626 may be mounted externally to housing 622 . As one example, valve actuator 626 may be mounted on the outside of housing 622 . Valve driver 626 may move valve 624 to an open position opening passage 621 . Valve driver 626 may move valve 624 to a closed position closing passage 621 . Valve driver 626 may move valve 624 in a vertical direction relative to the side of housing 622 .

As an example, when the valve actuator 626 moves the valve 624 to the open position, the valve 624 may be moved vertically downward. As an example, when the valve driver 626 moves the valve 624 to the closed position, the valve 624 may be moved vertically upward. The valve driver 626 can be modified and equipped with various known devices that can provide driving force.

Punching member 630 may be provided within housing 622. The punching member 630 may be provided in the inner space of the housing 622. A plurality of punching holes are formed in the punching member 630 . The punched holes formed on the punched member 630 may be used as a space for the external airflow of the process chamber 500 that is opened by the valve 624 and flows in through the passage 621 to flow. The area of the punch hole formed on the punch member 630 may be configured to be smaller than the area of the passage 621 . Punching member 630 may include plate 632 .

The plate 632 may be disposed on the other side of the door 620 facing the one side of the door 620 in which the passage 621 is formed. The plate 632 may be disposed on the other side of the housing 622 facing the one side of the housing 622 in which the passage 621 is formed. Plate 632 is formed with a plurality of punched holes. The area of the plurality of punch holes may be configured to be smaller than the area of the passage 621 . A plurality of punched holes may be formed through the plate 632 up and down. As an example, the diameters of multiple punch holes may be the same as each other. Unlike this, the diameters of the plurality of punched holes may be different from each other. The penetration direction of the plurality of punch holes may be parallel to the direction of the external air flow of the process chamber 500 . As an example, the penetration direction of the plurality of punched holes in the plate 632 may be parallel to the length direction of the passage 621 . Plate 632 may be integrally formed with housing 622. But it is not limited thereto. The plate 632 can be distinguished from the housing 622 and arranged on the other side of the housing 622 .

Since a plurality of punch holes are formed on the plate 632, the air flow outside the process chamber 500 and the particles contained therein collide with the portion of the plate 632 where the punch holes are not formed due to the opening of the valve 624. Therefore, it is possible to minimize the direct flow of external airflow and the particles contained therein into the interior of the process chamber 500 due to the opening of the valve 624 . In addition, the flow rate of the external airflow flowing into the interior of the process chamber 500 due to the opening of the valve 624 can be reduced. Therefore, sudden pressure changes in the process chamber 500 can be minimized.

FIG. 9 is a diagram schematically showing the door assembly of another embodiment shown in FIG. 4 . FIG. 10 is a diagram schematically showing the air flow when the valve of FIG. 9 is moved to the open position. The door assembly of another embodiment of the invention described below is configured similarly to the door assembly of the one embodiment of the invention described in FIGS. 5 and 6 except for the panels. Therefore, to avoid duplication, similar components will not be described again.

Referring to FIGS. 9 and 10 , the plate 632 may be disposed on the other side of the door 620 facing the one side of the door 620 on which the passage 621 is formed. The plate 632 may be disposed on the other side of the housing 622 facing the one side of the housing 622 in which the passage 621 is formed. Plate 632 may be integrally formed with housing 622. But it is not limited thereto. The plate 632 can be distinguished from the housing 622 and arranged on the other side of the housing 622 .

When door 620 is viewed from the front, panel 632 may have a first area and a second area. The first area may include the center of plate 632 . When the door 620 is viewed from the front with the valve 624 in the closed position, the first area may be an area overlapping the passage 621 . The second area may be an area surrounding the first area.

Plate 632 is formed with a plurality of punched holes. The area of the plurality of punch holes may be configured to be smaller than the area of the passage 621 . A plurality of punched holes may be formed through the plate 632 up and down. As an example, the diameters of multiple punch holes may be the same as each other. Unlike this, the diameters of the plurality of punched holes may be different from each other. The penetration direction of the plurality of punch holes may be parallel to the direction of air flow outside the process chamber 500 . As an example, the penetration direction of the plurality of punched holes in the plate 632 may be parallel to the length direction of the passage 621 . A plurality of punch holes may be formed in a second of the first and second areas. As an example, the plurality of punch holes may be formed only in the second area.

According to the above embodiments of the present invention, by arranging the punching member 630 in the inner space of the door 620, the flow of external airflow and the particles contained therein into the processing space 5200 due to the opening of the valve 624 can be minimized. In particular, particles contained in the external air flow may be filtered for the first time by means of the filter 634 to prevent the particles from flowing into the processing space 5200 . Furthermore, the filter 634 can reduce the flow rate of the external airflow flowing in through the passage 621 .

Particles contained in the external air flow can be filtered a second time by means of plate 632 . The external airflow passes through the passage 621 and flows into the internal space of the housing 622. Therefore, by not forming punch holes in the first area of the plate 632, the external air flow passing through the passage 621 collides with the first area where the punch holes are not formed, so that the flow rate of the external air flow can be effectively decelerated.

In the above embodiment of the present invention, the case where the valve 624 moves between the open position and the closed position to open and close the passage 621 is described as an example. But it is not limited thereto, and the valve 624 may be equipped with an aperture with an adjustable aperture ratio. When valve 624 is moved to the open position, the aperture of valve 624 can be fully opened. When valve 624 is moved to the closed position, the aperture of valve 624 can be completely closed. When the valve 624 is to adjust the flow of air flowing in from outside the process chamber 500, the valve 624 can adjust the opening rate of the aperture to adjust the flow of incoming external air.

In addition, in the above embodiment of the present invention, the valve 624 moves up and down and moves between the closed position and the open position by the valve driver 626 as an example, but is not limited thereto.

According to one embodiment, the valve actuator 626 can move the valve 624 left and right between an open position and a closed position. For example, valve driver 626 may move valve 624 left or right in a horizontal plane. Valve actuator 626 may move valve 624 forward and backward in the horizontal plane, as appropriate. That is, when viewed from the front, the valve driver 626 can move the valve 624 in one direction on the horizontal plane so as to cover the entire area of the passage 621 . In addition, when viewed from the front, the valve driver 626 can move the valve 624 in one direction on the horizontal plane so that the valve 624 does not overlap with the passage 621 .

In addition, the valve driver 626 can not only move the valve 624 up and down or left and right, but also move the valve 624 in a diagonal direction. Additionally, the valve actuator 626 may move the valve 624 in a curvature based on an axis. For example, valve 624 may be moved in an arc by means of valve driver 626 .

FIG. 11 is a sequence diagram of a method of driving a door assembly according to an embodiment of the present invention. FIG. 12 is a diagram schematically showing the plasma processing steps of FIG. 11 . FIG. 13 is a diagram schematically showing the valve opening step of FIG. 11 . FIG. 14 is a diagram schematically showing the door opening step of FIG. 11 . FIG. 15 is a diagram schematically showing the substrate unloading step of FIG. 11 . The following describes in detail a method of driving a door assembly according to an embodiment of the present invention with reference to FIGS. 11 to 15 .

Referring to FIG. 11 , a method for driving a door assembly according to an embodiment of the present invention can sequentially perform the plasma processing step S10 , the valve opening step S20 , the door opening step S30 , the substrate unloading step S40 , the substrate loading step S50 , and the valve closing step. and door closing step S60.

Referring to FIG. 12 , the plasma treatment step S10 performs plasma treatment on the substrate W in the process chamber 500 . In plasma processing step S10, door 620 and valve 624 are each in a closed position. Therefore, the plasma processing step S10 can be performed while maintaining a vacuum pressure within the processing space 5200 .

Referring to Figure 13, valve opening step S20 is to move valve 624 to the open position. Valve opening step S20 is the movement of valve 624 from a closed position to an open position. Valve 624 can be moved vertically downward by means of valve actuator 626 . Valve 624 is slidably movable downward by means of valve actuator 626 . Valve 624 may move to the open position when substrate W is unloaded from processing space 5200.

As one example, after plasma processing is completed on substrate W and before substrate W is unloaded from processing space 5200, valve 624 may move downward. As an example, after the plasma treatment of the substrate W is completed and before the substrate W is unloaded from the processing space 5200, the valve 624 may move downward a predetermined distance to open a portion of the passage 621. If the set time passes after the valve 624 opens a part of the passage 621, the valve 624 may move downward again to open the entire passage 621. That is, the valve 624 may be moved downward to gradually increase the opening rate of the passage 621 from the time when the plasma treatment of the substrate W is completed to the time when the valve 624 completely opens the passage 621 . Therefore, the sudden flow of external airflow from the process chamber 500 into the processing space 5200 in a vacuum pressure state can be minimized. In addition, in the valve opening step S20, the valve 624 can be placed in a fully open position until the external pressure of the process chamber 500 and the internal pressure of the process chamber 500 reach the same level. Therefore, even if the load port 5201 is opened in the door opening step S30 described below, the sudden inflow of the external airflow into the processing space 5200 due to the pressure difference can be minimized.

Referring to FIG. 14 , the door opening step S30 is to move the door 620 to the open position. In the door opening step S30, after the valve 624 completely opens the passage 621 in the valve opening step S20, the door 620 moves from the closed position to the open position. After the valve 624 completely opens the passage, the door 620 moves horizontally away from the loading port 5201 . After the horizontal movement of the door 620 is completed, the door 620 moves vertically downward. Different from this, after the door 620 moves horizontally, the door 620 may further perform an inclined movement relative to the ground. After the door 620 performs tilting movement, the door 620 can also move vertically downward. After the vertical movement of the door 620 downward is completed, the door opening step S30 is completed.

Referring to FIG. 15 , the substrate unloading step S40 unloads the processed substrate W from the process chamber 500 . In the substrate unloading step S40 , the second transfer robot 420 is used to transport the processed substrate W from the process chamber 500 to the transfer chamber 400 . The substrate loading step S50 loads the substrate W into the process chamber 500 . The substrate loading step S50 is to load the substrate W from the transfer chamber 400 to the process chamber 500 by means of the second transfer robot 420 .

The valve closing and door closing step S60 is that the valve 624 moves to the closed position and the door 620 moves to the closed position. The valve closing and door closing step S60 moves the valve 624 and the door 620 to the closed position after the substrate W is transported into the process chamber 500 . The processes of moving to the closed positions of the valve 624 and the door 620 are performed in the reverse order of the valve opening step S20 and the door opening step S30, respectively. After the valve closing and door closing steps S60 are completed, the plasma processing step S10 is performed again.

In the various embodiments of the present invention described above, the process chamber 500 is equipped with the door assembly 600 and the method of driving the door assembly 600 in the process chamber 500 has been described. But it is not limited thereto. The door assembly 600 can be equipped in various chambers such as the loading gate chamber 300 and the transfer chamber 400 . As an example, the door assembly 600 can be applied to any chamber formed with a loading port for substrates to enter and exit.

The above detailed description exemplifies the invention. In addition, the foregoing content shows and describes the preferred embodiments of the present invention, and the present invention can be used in various other combinations, changes, and environments. That is, changes or revisions may be made within the conceptual scope of the invention disclosed in this specification, the scope equivalent to the foregoing disclosure, and/or the technical or knowledge scope of the industry. The foregoing embodiments describe the best state required to embody the technical idea of the present invention, and various changes required by the specific application fields and uses of the present invention can also be made. Therefore, the above summary of the invention is not intended to limit the present invention to the disclosed embodiments. In addition, the accompanying patent claims should be construed to include other embodiments.

1:Substrate processing equipment 2: First direction 4:Second direction 20:Device front-end module 30: Processing module 200:Loading port 202:Support part 220:Transfer frame 222:The first transfer robot 224: Transfer track 300:Loading lock chamber 400:Transmission chamber 420: Second transfer robot 500: Process chamber 520:Processing room 540:Plasma generation chamber 560: Diffusion chamber 580:Exhaust chamber 600: Door assembly 620:door 621:Pathway 622: Shell 624: valve 626: Valve driver 632: Board 634:Filter 700:Controller 5200: processing space 5201:Loading port 5220: Shell 5222:Exhaust hole 5240:Support unit 5242:Support plate 5244:Support shaft 5260:Exhaust baffle 5262:Exhaust hole 5420: Plasma chamber 5422: Plasma generation space 5424:Gas supply port 5440:Gas supply unit 5460:Power access unit 5462:antenna 5464:Power supply 5620: Diffusion chamber 5622: Plasma diffusion space 5640:Baffle 5642:Baffle hole 5820:Exhaust line 5840: Pressure relief component 9000: Chamber 9200: Door assembly S10-S60: Steps C: Bearing frame D1: diameter W: substrate

FIG. 1 is a diagram showing a state in which the door is opened on one side wall of a common process chamber. FIG. 2 is an enlarged view of part A of FIG. 1 . FIG. 3 is a diagram schematically showing the substrate processing apparatus of the present invention. 4 is a diagram schematically illustrating an embodiment of a process chamber for performing a plasma processing process in the process chamber of the substrate processing apparatus of FIG. 3 . FIG. 5 is a diagram schematically showing the door assembly of the embodiment shown in FIG. 4 . FIG. 6 is a diagram schematically showing the flow of air when the valve of FIG. 5 is moved to the open position. 7 and 8 are diagrams schematically showing the door assembly of another embodiment shown in FIG. 4 . FIG. 9 is a diagram schematically showing the door assembly of another embodiment shown in FIG. 4 . FIG. 10 is a diagram schematically showing the air flow when the valve of FIG. 9 is moved to the open position. FIG. 11 is a sequence diagram of a method of driving a door assembly according to an embodiment of the present invention. FIG. 12 is a diagram schematically showing the plasma processing steps of FIG. 11 . FIG. 13 is a diagram schematically showing the valve opening step of FIG. 11 . FIG. 14 is a diagram schematically showing the door opening step of FIG. 11 . FIG. 15 is a diagram schematically showing the substrate unloading step of FIG. 11 .

500: Process chamber

520:Processing room

540:Plasma generation chamber

560: Diffusion chamber

580:Exhaust chamber

600: Door assembly

700:Controller

5200: processing space

5201:Loading port

5222:Exhaust hole

5240:Support unit

5242:Support plate

5244:Support shaft

5260:Exhaust baffle

5262:Exhaust hole

5420: Plasma chamber

5422: Plasma generation space

5424:Gas supply port

5440:Gas supply unit

5460:Power access unit

5462:antenna

5464:Power supply

5620: Diffusion chamber

5622: Plasma diffusion space

5640:Baffle

5642:Baffle hole

5820:Exhaust line

5840: Pressure relief component

D1: diameter

W: substrate

Claims (13)

A kind of substrate processing equipment, the aforementioned substrate processing equipment is used for processing substrates, the aforementioned substrate processing equipment includes: a chamber, the aforementioned chamber has a processing space for processing the substrate, and is formed with a loading port for the substrate to enter and exit; a gas supply unit, the aforementioned gas supply The unit supplies process gas to the aforementioned processing space; a plasma unit, the aforementioned plasma unit generates plasma from the aforementioned process gas; and a door assembly, the aforementioned door assembly opens and closes the aforementioned loading inlet, the aforementioned door assembly includes: a door, the aforementioned door Opening and closing the loading port; and a door actuator that moves the door between an open position and a closed position, the door including: a shell, the shell having a passage for air flow to flow in on one side and having an internal space; a valve, The aforementioned valve opens or closes the aforementioned passage; and a valve driver, the aforementioned valve driver moves the aforementioned valve between an open position or a closed position, wherein a punching member is provided in the aforementioned internal space, and the aforementioned punching member is formed with a punch for the flow of the airflow. hole. The substrate processing equipment of claim 1, wherein the substrate processing equipment further includes a controller that controls the gate driver and the valve driver, wherein the controller controls the valve driver when loading the substrate from the processing space. So that the aforementioned valve moves to the aforementioned open position, and then the aforementioned door driver is controlled to move the aforementioned door to the aforementioned open position. The substrate processing equipment of claim 1, wherein the punching member includes a filter. The substrate processing equipment according to claim 1, wherein the punching member includes a plate, and the plate is disposed on the other side facing one side of the door and has a plurality of punching holes formed therein. The substrate processing equipment according to claim 1, wherein the punching member includes: a plate disposed on the other side facing one side of the door and formed with a plurality of punching holes; and a filter, the filter The device is arranged between the aforementioned passage and the aforementioned plate. The substrate processing equipment according to claim 1, wherein the area of the punching hole is smaller than the area of the passage. A substrate processing equipment. The substrate processing equipment is used to process substrates. The substrate processing equipment includes: a chamber. The chamber is formed with a loading port for the substrate to enter and exit; and a door assembly. The door assembly opens and closes the loading port. , the aforementioned door assembly includes: a door, the aforementioned door is located outside the aforementioned chamber and opens and closes the aforementioned loading port; and a door driver, the aforementioned door driver moves the aforementioned door between an open position and a closed position, the aforementioned door includes: a shell, the aforementioned door The housing forms a passage for air flow to flow in on one side and has an internal space; a valve, the aforementioned valve opens or closes the aforementioned passage; and a valve driver, the aforementioned valve driver moves the aforementioned valve between an open position or a closed position, wherein, in the aforementioned internal space It includes a punching member, and the punching member is formed with punching holes for the airflow to flow. The substrate processing equipment of claim 7, wherein the substrate processing equipment further includes a controller that controls the gate driver and the valve driver, wherein the controller controls the valve driver when unloading the substrate from the chamber. So that the aforementioned valve moves to the aforementioned open position, and after the aforementioned valve moves to the aforementioned open position, the aforementioned door driver is controlled to move the aforementioned door to the aforementioned open position. The substrate processing equipment of claim 7, wherein the punching member includes a filter device. The substrate processing equipment according to claim 7, wherein the punching member includes: a plate disposed on the other side facing one side of the door and formed with a plurality of punching holes; and a filter, the filter The device is arranged between the aforementioned passage and the aforementioned plate. The substrate processing equipment according to claim 7, wherein the area of the punching hole is smaller than the area of the passage. A method of driving a door assembly. The method drives the door assembly in the substrate processing equipment as claimed in claim 7. The method includes the following steps: a valve opening step, in which the valve moves to the opening position to open the passage; and a door opening step in which, after the aforementioned valve opening step, the aforementioned door moves to the aforementioned open position. The method of driving a door assembly according to claim 12, wherein the substrate processing equipment is equipment for processing substrates under vacuum pressure.

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