TWI823696B - Two-phase immersion-cooling heat-dissipation structure having skived fins - Google Patents

Abstract

A two-phase immersion-cooling heat-dissipation structure having skived fins is provided. The structure includes an immersion-cooling substrate and a plurality of immersion-cooling fins. The immersion-cooling substrate has opposite top and bottom surfaces. The bottom surface is used for contacting the heat-generating element immersed in the two-phase coolant, and the top surface is connected with the immersion-cooling fins. The immersion-cooling fins include at least one skived fin which is integrally formed on the top surface of the immersion-cooling substrate, and the immersion-cooling fins are non-linearly arranged. The thickness of any one of the immersion-cooling fins ranges from 0.1 mm to 0.35 mm. The height of any one of the immersion-cooling fins ranges from 5 mm to 10 mm. The distance between any two of the immersion-cooling fins ranges from 0.1 mm to 0.35 mm.

Description

Two-phase immersed cooling structure with shaved fins

The present invention relates to a heat dissipation structure, specifically to a two-phase immersed heat dissipation structure with scraped fins.

Two-phase immersion-cooling technology directly immerses heating components (such as server motherboards, disk arrays, etc.) in non-conductive two-phase coolant. The two-phase coolant absorbs heat and vaporizes to take away the heat energy generated by the operation of the heating element. However, how to dissipate heat more effectively through two-phase immersion cooling technology has always been a problem that the industry needs to solve.

In view of this, the inventor has been engaged in the development and design of related products for many years. He felt that the above deficiencies could be improved, so he devoted himself to research and applied academic theories, and finally proposed an invention that is reasonably designed and effectively improves the above deficiencies.

The technical problem to be solved by the present invention is to provide a two-phase immersed heat dissipation structure with scraped fins in view of the shortcomings of the existing technology.

An embodiment of the present invention discloses a two-phase immersed heat dissipation structure with scraped fins, which has an immersed base and a plurality of immersed fins. The immersed base has an upper surface and a lower surface opposite to each other. surface, the lower surface of the immersed base is used to form contact with the heating element immersed in the two-phase cooling liquid, the upper surface of the immersed base is connected with a plurality of the immersed fins, and a plurality of the immersed fins are connected to the upper surface of the immersed base. The fins include at least one scraped fin integrally formed on the upper surface of the immersed base in a scraping molding manner, and a plurality of the immersed fins are arranged in a non-linear manner, and any one of the immersed fins is The thickness of the immersed fins is between 0.1~0.35mm, the height of any one of the immersed fins is between 5~10mm, and the distance between any two of the immersed fins is between 0.1~0.35mm.

In a preferred embodiment, the angle between the tangent line at any point on the outline of any one of the immersed fins and the direction perpendicular to the arrangement direction of the immersed fins is less than 45 degrees.

In a preferred embodiment, the distance between at least two of the immersed fins is different from the distance between the other two of the immersed fins.

In a preferred embodiment, the immersed fins are made of copper or copper alloy.

In a preferred embodiment, the two-phase immersed heat dissipation structure with scraped fins further includes: a reinforced outer frame, which is coupled to the immersed base and surrounds a plurality of the immersed fins. at least part of.

In a preferred embodiment, at least one of the immersed base and the reinforced outer frame is formed with a plurality of through holes, and a plurality of spring screws pass through the plurality of through holes.

In a preferred embodiment, the two-phase immersed heat dissipation structure with scraped fins further includes: a high thermal conductivity structure, which is bonded to the lower surface of the immersed base, so that the immersed base is Through the indirect contact between the high thermal conductivity structure and the heating element, a vacuum sealed cavity is formed inside the high thermal conductive structure, and the vacuum sealed cavity contains liquid.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and illustration and are not used to limit the present invention.

The following is a description of the relevant implementation modes disclosed in the present invention through specific specific examples. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depictions based on actual dimensions, as is stated in advance. In addition, the same or similar parts in the drawings are labeled with the same reference numerals. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of the present invention. In addition, the term "or" used in this article shall include any one or combination of more of the associated listed items depending on the actual situation.

[First Embodiment]

Please refer to FIGS. 1 to 5 , which are the first embodiment of the present invention. The embodiment of the present invention provides a two-phase immersed heat dissipation structure with scraped fins for contact and immersion in two-phase coolant. heating element. As shown in the figure, a two-phase immersed heat dissipation structure with scraped fins provided according to an embodiment of the present invention includes an immersed base 10 and a plurality of immersed fins 20 .

In this embodiment, the immersed substrate 10 can be made of a material with high thermal conductivity, such as aluminum, copper or alloys thereof. The immersed substrate 10 may be a non-porous heat dissipation material or a porous heat dissipation material. Preferably, the immersed substrate 10 can be a porous metal heat dissipation plate immersed in a two-phase cooling liquid (such as a non-conductive electronic fluoride liquid) with a porosity greater than 8% to increase the generation of bubbles to enhance the Immersion cooling effect.

In this embodiment, the immersed substrate 10 has an upper surface 101 and a lower surface 102 opposite to each other. The lower surface 102 of the immersed substrate 10 is used to make contact with the heating element 800 immersed in the two-phase cooling liquid. This contact may be direct contact or indirect contact through an intermediary layer. The upper surface 101 of the immersed base 10 is connected to a plurality of immersed fins 20, and the plurality of immersed fins 20 include at least one scraper integrally formed on the upper surface 101 of the immersed base 10 in a scraping molding manner. Type fin 20a (skived-fin).

Furthermore, the plurality of immersed fins 20 are arranged in a non-linear manner. The non-linear arrangement here means that the projections of the plurality of immersed fins 20 on the upper surface 101 of the immersed base 10 are not linearly arranged in parallel. Furthermore, the outline of the immersed fins 20 in this embodiment is wavy, and may be irregularly wavy, and at least half or all of the plurality of fins 20 may be scraped fins 20a. Therefore, in this embodiment, the outline of the immersed fins 20 is wavy, and at least half or all of the plurality of immersed fins 20 are scraped fins 20a to increase the arrangement density, thereby achieving greater efficiency. The surface area allows bubbles to nucleate and boil to enhance the immersion heat dissipation effect.

The surface roughness Ra of the immersed fin 20 in this embodiment is >1.5 μm. The thickness T of the immersed fin 20 is between 0.1 mm and 0.35 mm. The thickness T here refers to the center thickness of a single fin. The distance G between any two immersed fins 20 is between 0.1mm~0.35mm. The distance G here refers to the shortest distance between the side of the immersed fin 20 and the side of the adjacent immersed fin 20, and there is at least The distance G between two immersed fins 20 is different from the distance G between the other two immersed fins 20 . The height H of any immersed fin 20 is between 5 mm and 10 mm. The height H here refers to the vertical distance from the upper surface 101 to the highest point of the immersed fin 20 .

It should be noted that although similar fins currently exist, whether they are linear or nonlinear fins, they must be able to be used in two-phase immersion cooling. The smaller the spacing, the better (the smaller the spacing, the theoretically larger surface area). The higher the height, the better the heat dissipation should be), and it is not that the higher the height, the better (the higher the height, the theoretically larger surface area, the better the heat dissipation should be), because the heat transfer mechanism of two-phase immersion cooling is different from the traditional heat transfer mechanism. For example, the heat transfer mechanism of water cooling or air cooling is different, involving the convection of two-phase coolant and the generation of bubbles. There is still no very accurate software that can simulate the heat transfer mechanism of two-phase immersion cooling, which requires an extra large database. This means that the heat transfer mechanism of two-phase immersion cooling cannot be simulated by the general traditional heat transfer mechanism. Derived. Please cooperate with the instructions shown in Figure 6 and Figure 7. Figure 6 shows the measured thermal resistance (Rth) in the same fin area with different fin heights and different powers (W) of the heating element. Figure 7 shows the measured thermal resistance (Rth) in the same fin area with different fin spacing at different powers (W) of the heating element. The lower the measured thermal resistance, the better the heat dissipation effect. Generally speaking, the smaller the spacing, the greater the number of fins in the fin area and the larger the surface area. However, actual measurements can show that the larger the surface area, the better the heat dissipation effect.

In addition, after actual testing, if the immersed fin 20 of this embodiment is too curved, it will affect the bubble discharge, thereby affecting the immersed heat dissipation effect. Therefore, the tangent line TA at any point on the outline of the immersed fin 20 (as shown in Figure 5 ) and the angle θ in the direction (Y-axis direction) perpendicular to the arrangement direction (X-axis direction) of the immersed fins 20 needs to be less than 45 degrees to truly enhance the immersed heat dissipation effect.

[Second Embodiment]

Please refer to FIG. 8 , which is a second embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are explained as follows.

In this embodiment, at least half or all of the immersed fins 20 are scraper fins 20a, and at least half of the immersed fins 20 are curved and at least one of the immersed fins 20 is linear. , and the distance between at least two immersed fins 20 is different from the distance between the other two immersed fins 20 .

[Third Embodiment]

Please refer to Figure 9, which is a third embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are explained as follows.

In this embodiment, the immersed base 10 is also combined with a reinforced outer frame 30 that surrounds at least part of the plurality of immersed fins 20 to enhance the overall structural strength and avoid problems and damage caused by warping. The reinforced outer frame 30 may be made of aluminum alloy or stainless steel. Furthermore, the reinforced outer frame 30 may be bonded to the immersed base 10 by means of press fit, welding, friction stir welding (FSW), gluing, or diffusion bonding.

[Fourth Embodiment]

Please refer to Figure 10, which is a fourth embodiment of the present invention. This embodiment is substantially the same as the first and third embodiments, and the differences are explained as follows.

In this embodiment, a plurality of through holes 15 can be formed on both sides of the immersed base 10 or both sides of the reinforced outer frame 30, and a plurality of spring screws 25 can pass through the plurality of through holes 15 to better fix it. A motherboard with a heating element 800.

[Fifth Embodiment]

Please refer to Figure 11, which is a fifth embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are explained as follows.

In this embodiment, a high thermal conductivity structure 40 is further included. Furthermore, the high thermal conductivity structure 40 is coupled to the lower surface 102 of the immersed substrate 10 so that the immersed substrate 10 forms indirect contact with the heating element 800 immersed in the two-phase cooling liquid through the high thermal conductivity structure 50 . In detail, the high thermal conductivity structure 40 may be bonded to the lower surface 102 of the immersed substrate 10 through welding, friction stir welding, gluing, or diffusion bonding. In other embodiments, the immersed substrate 10 may be integrally formed with the high thermal conductivity structure 40 .

Furthermore, a vacuum sealed cavity 401 is formed inside the high thermal conductivity structure 40, and the top wall and bottom wall of the vacuum sealed cavity 401 can also be formed with sintered bodies, and the vacuum sealed cavity 401 contains an appropriate amount of liquid, and the liquid Can be water or acetone. In addition, the bottom surface of the high thermal conductivity structure 40 can be used to contact the heating element 800 immersed in the two-phase cooling liquid, so that the heating element 800 immersed in the two-phase cooling liquid can absorb heat and vaporize and take away the heat through the two-phase cooling liquid. The heat energy generated by the element 800 can also contact and absorb the heat energy generated by the heating element 800 through the high thermal conductivity structure 40, causing the liquid in the vacuum sealed chamber 401 to vaporize and evaporate into steam, which is then distributed to the immersed substrate 10 and rapidly transfers the heat energy. The immersed substrate 10 is provided with scooped fins that are integrally formed and arranged at extremely high density, and the two-phase coolant is used to absorb heat and vaporize to take away the heat energy absorbed by the scooped fins, while the steam in the vacuum sealed chamber 401 The heat energy is handed over and condensed on the top wall of the cavity before flowing back to the bottom wall of the cavity. Such a high-speed loop can quickly dissipate the heat energy generated by the heating element 800, thereby enhancing the immersion heat dissipation effect.

Based on the above, the two-phase immersed heat dissipation structure with non-vertical fins provided by the present invention can at least be achieved by "the immersed base has an upper surface and a lower surface that are opposite to each other, and the lower surface of the immersed base is used to In contact with the heating element immersed in the two-phase coolant, a plurality of immersed fins are connected to the upper surface of the immersed base. There are scraped fins on the upper surface of the base, and the plurality of immersed fins are arranged in a non-linear manner" and "The thickness of any immersed fin is between 0.1~0.35mm, and the thickness of any immersed fin is The height is between 5~10mm, and the distance between any two immersed fins is between 0.1~0.35mm." The overall technical solution can effectively enhance the overall immersed heat dissipation effect.

The contents disclosed above are only preferred and feasible embodiments of the present invention, and do not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

10: Immersed base 101: Upper surface 102: Lower surface 15: Perforation 20: Immersed fins 20a: Skived fins 25: Spring screws 30: Reinforced outer frame 40: High thermal conductivity structure 401: Vacuum sealed chamber H: Height T: Thickness G: Spacing θ : Angle TA: Tangent 800: Heating element

Figure 1 is a schematic top view of the first embodiment of the present invention.

FIG. 2 is a schematic cross-sectional view along line II-II in FIG. 1 .

Figure 3 is an enlarged schematic diagram of part III in Figure 1.

Figure 4 is an enlarged schematic diagram of part IV in Figure 1.

Figure 5 is a schematic diagram of a tangent line in the first embodiment of the present invention.

Figure 6 shows the thermal resistance measurement results at different fin heights.

Figure 7 shows the thermal resistance measurement results under different fin spacing.

Figure 8 is a schematic top view of the second embodiment of the present invention.

Figure 9 is a schematic cross-sectional view of the third embodiment of the present invention.

Figure 10 is a schematic cross-sectional view of the fourth embodiment of the present invention.

Figure 11 is a schematic cross-sectional view of the fifth embodiment of the present invention.

10:Immersed base

101: Upper surface

20: Submersible fins

20a: Shoved fins

Claims (7)

A two-phase immersed heat dissipation structure with scraped fins, which has an immersed base and a plurality of immersed fins. The immersed base has an upper surface and a lower surface that are opposite to each other. The lower surface of the base is used to make contact with the heating element immersed in the two-phase cooling liquid. The upper surface of the immersed base is connected with a plurality of immersed fins, and the plurality of immersed fins include at least A scraping fin is integrally formed on the upper surface of the immersed base by scraping molding, and a plurality of the immersed fins are arranged in a non-linear manner. The thickness of any one of the immersed fins is Between 0.1~0.35mm, the height of any one of the immersed fins is between 5~10mm, and the distance between any two of the immersed fins is between 0.1~0.35mm; wherein, any one of the The angle between the tangent line at any point on the outline of the immersed fins and the direction perpendicular to the arrangement direction of the immersed fins is less than 45 degrees. The two-phase immersed heat dissipation structure with scraped fins as described in claim 1, wherein the distance between at least two of the immersed fins is different from the distance between the other two of the immersed fins. The two-phase immersed heat dissipation structure with scraped fins as described in claim 1, wherein the immersed fins are made of one of copper or copper alloy. The two-phase immersed heat dissipation structure with scraped fins as described in claim 1, wherein the surface roughness of the immersed fins is Ra>1.5 μm. The two-phase immersed heat dissipation structure with scraped fins as claimed in claim 1, further comprising: a reinforced outer frame coupled to the immersed base and surrounding at least one of the plurality of immersed fins. part. The two-phase immersed heat dissipation structure with scraped fins as claimed in claim 5, wherein at least one of the immersed base and the reinforced outer frame is formed with a plurality of through holes and has a plurality of spring screws Correspondingly pass through a plurality of the perforations. The two-phase immersed heat dissipation structure with scraped fins as described in claim 1 further includes: a high thermal conductivity structure, which is coupled to the lower surface of the immersed base, so that the immersed base can pass through the The high thermal conductivity structure is in indirect contact with the heating element, a vacuum sealed cavity is formed inside the high thermal conductive structure, and the vacuum sealed cavity contains liquid.

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