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TWI806246B - Radiation focusing module and processing system having the same - Google Patents

Radiation focusing module and processing system having the same Download PDF

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TWI806246B
TWI806246B TW110142976A TW110142976A TWI806246B TW I806246 B TWI806246 B TW I806246B TW 110142976 A TW110142976 A TW 110142976A TW 110142976 A TW110142976 A TW 110142976A TW I806246 B TWI806246 B TW I806246B
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radiation
focusing
lens
light
heat source
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TW202321776A (en
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曾耀興
丁仁峰
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台達電子工業股份有限公司
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Abstract

A radiation focusing module includes an optical fiber, a first focusing lens, a second focusing lens, and a light convergence element. The optical fiber has an optical axis. The first focusing lens is located between the optical fiber and the second focusing lens. The light convergence element is located between the first focusing lens and the second focusing lens, and the first focusing lens, the second focusing lens, and the light convergence element are arranged along a direction of the optical axis. The light convergence element has an opening.

Description

輻射聚焦模組與具有輻射聚焦模組的加工系統Radiation focusing module and processing system with radiation focusing module

本揭露是有關於一種輻射聚焦模組以及具有輻射聚焦模組的加工系統。The disclosure relates to a radiation focusing module and a processing system with the radiation focusing module.

雷射加工是目前高精度電路板加工的常用技術。非同軸光路的雷射加工設備因為機械體積龐大以及重量難以縮減,造成加工精度低以及透鏡因震動而偏移等問題。因此,目前的雷射加工技術加工效率仍有待提升。Laser processing is a common technology for high-precision circuit board processing. The laser processing equipment with non-coaxial optical path has problems such as low processing accuracy and lens deviation due to vibration due to the large size of the machine and the difficulty in reducing the weight. Therefore, the processing efficiency of the current laser processing technology still needs to be improved.

在同軸光路的雷射加工設備中,將加工元件被雷射加熱後所產生的熱源紅外光回收以偵測溫度。然而,來自不同熱源且具有不同波長的紅外光束難以有效地聚焦並耦合。因此,目前的同軸光路雷射加工設備的溫度偵測準確度低,使得加工效率難以提升。In the laser processing equipment with coaxial optical path, the heat source infrared light generated after the processing element is heated by the laser is recovered to detect the temperature. However, it is difficult to effectively focus and couple infrared beams from different heat sources and with different wavelengths. Therefore, the temperature detection accuracy of the current coaxial laser processing equipment is low, which makes it difficult to improve the processing efficiency.

有鑑於此,如何提供一種可改善上述問題的加工設備仍是目前業界亟需研究的目標之一。In view of this, how to provide a processing equipment that can improve the above problems is still one of the goals that the industry needs to study urgently.

本揭露之一技術態樣為一種輻射聚焦模組。One technical aspect of the present disclosure is a radiation focusing module.

在本揭露一實施例中,輻射聚焦模組包括光纖、第一聚焦鏡、第二聚焦鏡以及縮束器。光纖具有光軸方向。第一聚焦鏡位在光纖與第二聚焦鏡之間。縮束器位在第一聚焦鏡與第二聚焦鏡之間,且第一聚焦鏡、第二聚焦鏡、以及縮束器排列於光軸方向上,其中縮束器具有開孔。In an embodiment of the present disclosure, the radiation focusing module includes an optical fiber, a first focusing mirror, a second focusing mirror, and a beam reducer. An optical fiber has an optical axis direction. The first focusing mirror is located between the optical fiber and the second focusing mirror. The beam reducer is located between the first focusing mirror and the second focusing mirror, and the first focusing mirror, the second focusing mirror, and the beam reducer are arranged in the direction of the optical axis, wherein the beam reducer has an opening.

在本揭露一實施例中,開孔對準光軸方向。In an embodiment of the present disclosure, the opening is aligned with the direction of the optical axis.

在本揭露一實施例中,縮束器的折射率小於第一聚焦鏡或第二聚焦鏡的折射率。In an embodiment of the present disclosure, the refractive index of the beam reducer is smaller than the refractive index of the first focusing mirror or the second focusing mirror.

在本揭露一實施例中,縮束器包括平凹透鏡與透鏡陣列,且透鏡陣列位在平凹透鏡與第二聚焦鏡之間。In an embodiment of the present disclosure, the beam reducer includes a plano-concave lens and a lens array, and the lens array is located between the plano-concave lens and the second focusing mirror.

在本揭露一實施例中,透鏡陣列包括複數個透鏡,且透鏡的光軸方向與光纖的光軸方向具有夾角。In an embodiment of the present disclosure, the lens array includes a plurality of lenses, and the optical axis direction of the lens has an included angle with the optical axis direction of the optical fiber.

在本揭露一實施例中,縮束器包括平凸透鏡與平凹透鏡,且平凸透鏡位在平凹透鏡與第二聚焦鏡之間。In an embodiment of the present disclosure, the beam reducer includes a plano-convex lens and a plano-concave lens, and the plano-convex lens is located between the plano-convex lens and the second focusing lens.

本揭露另一技術態樣為一種加工系統。Another technical aspect of the present disclosure is a processing system.

在本揭露一實施例中,加工系統包括紅外線偵測器、輻射光源、以及輻射聚焦模組。輻射光源電性連接紅外線偵測器,其中輻射光源配置以發出加工輻射光。輻射聚焦模組配置以傳輸熱源輻射光。輻射聚焦模組包括光纖、第一聚焦鏡、第二聚焦鏡以及縮束器。光纖具有光軸方向。第一聚焦鏡位在光纖與第二聚焦鏡之間。縮束器位在第一聚焦鏡與第二聚焦鏡之間,且第一聚焦鏡、第二聚焦鏡、以及縮束器排列於光軸方向上,其中縮束器具有開孔。In an embodiment of the present disclosure, the processing system includes an infrared detector, a radiation light source, and a radiation focusing module. The radiation source is electrically connected to the infrared detector, wherein the radiation source is configured to emit processing radiation. The radiation focusing module is configured to transmit light radiated from the heat source. The radiation focusing module includes an optical fiber, a first focusing mirror, a second focusing mirror and a beam reducer. An optical fiber has an optical axis direction. The first focusing mirror is located between the optical fiber and the second focusing mirror. The beam reducer is located between the first focusing mirror and the second focusing mirror, and the first focusing mirror, the second focusing mirror, and the beam reducer are arranged in the direction of the optical axis, wherein the beam reducer has an opening.

在本揭露一實施例中,開孔的孔徑大於加工輻射光的直徑。In an embodiment of the present disclosure, the diameter of the opening is larger than the diameter of the processing radiation.

在本揭露一實施例中,開孔的孔徑為加工輻射光的直徑的1.1倍~1.3倍。In an embodiment of the present disclosure, the diameter of the opening is 1.1 times to 1.3 times the diameter of the processing radiation.

在本揭露一實施例中,開孔的孔徑小於熱源輻射光的直徑。In an embodiment of the present disclosure, the diameter of the opening is smaller than the diameter of the heat source radiating light.

在本揭露一實施例中,加工輻射光包括雷射光、X光、紫外光、兆赫波、微波。In an embodiment of the present disclosure, the processing radiation includes laser light, X-ray, ultraviolet light, megahertz wave, microwave.

在本揭露一實施例中,熱源輻射光包括紅外光與近紅外光。In an embodiment of the present disclosure, the radiated light from the heat source includes infrared light and near-infrared light.

在上述實施例中,本揭露的輻射聚焦模組藉由縮束器使熱源輻射光的直徑得以縮小至接近加工輻射光的直徑大小,以提升熱源輻射光進入光纖的比例,可提升溫度偵測準確性。此外,由於縮束器具有開孔,加工輻射光可在不損失功率的狀況下進入第二聚焦鏡。因此,本揭露的輻射聚焦模組可在相同光路中,同時維持加工輻射光的輻射強度並增加熱源輻射光進入光纖的比例。如此一來,可無須設置額外光路以提升熱源輻射光的偵測強度,因此本揭露的加工模組具有體積較小且重量較輕等優點。此外,本揭露的輻射聚焦模組可偵測多個波長的熱源輻射光,藉此提升系統控制器對於加工的控制效果。In the above-mentioned embodiments, the radiation focusing module of the present disclosure reduces the diameter of the heat source radiation light to be close to the diameter of the processing radiation light by using a beam reducer, so as to increase the ratio of the heat source radiation light entering the optical fiber and improve temperature detection. accuracy. Furthermore, due to the aperture of the beam reducer, the processing radiation can enter the second focusing mirror without loss of power. Therefore, the radiation focusing module of the present disclosure can maintain the radiation intensity of the processing radiation and increase the ratio of the heat source radiation entering the optical fiber in the same optical path. In this way, there is no need to set up an additional optical path to increase the detection intensity of the radiated light from the heat source, so the processing module of the present disclosure has the advantages of smaller size and lighter weight. In addition, the radiation focusing module of the present disclosure can detect multiple wavelengths of heat source radiation, thereby improving the control effect of the system controller on processing.

以下將以圖式揭露本發明之複數個實施方式,為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本發明。也就是說,在本發明部分實施方式中,這些實務上的細節是非必要的。此外,為簡化圖式,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。且為了清楚起見,圖式中之層和區域的厚度可能被誇大,並且在圖式的描述中相同的元件符號表示相同的元件。Several embodiments of the present invention will be disclosed in the following figures. For the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is, in some embodiments of the present invention, these practical details are unnecessary. In addition, in order to simplify the drawings, some commonly used structures and components are shown in a simple and schematic manner in the drawings. Also, the thicknesses of layers and regions in the drawings may be exaggerated for clarity, and the same reference numerals denote the same elements in the description of the drawings.

第1圖為根據本揭露一實施例之加工系統10的輻射聚焦模組100的示意圖。加工系統10包括輻射聚焦模組100與系統控制器200。輻射聚焦模組100包括光纖110、第一聚焦鏡120、第二聚焦鏡130與縮束器140。光纖110具有光軸方向A1。第一聚焦鏡120位在光纖110與第二聚焦鏡130之間。縮束器140位在第一聚焦鏡120與第二聚焦鏡130之間。第二聚焦鏡130、縮束器140與第一聚焦鏡120依序排列於光軸方向A1上。FIG. 1 is a schematic diagram of a radiation focusing module 100 of a processing system 10 according to an embodiment of the present disclosure. The processing system 10 includes a radiation focusing module 100 and a system controller 200 . The radiation focusing module 100 includes an optical fiber 110 , a first focusing lens 120 , a second focusing lens 130 and a beam reducer 140 . The optical fiber 110 has an optical axis direction A1. The first focusing lens 120 is located between the optical fiber 110 and the second focusing lens 130 . The beam reducer 140 is located between the first focusing lens 120 and the second focusing lens 130 . The second focusing lens 130 , the beam reducer 140 and the first focusing lens 120 are arranged in sequence along the optical axis direction A1 .

縮束器140包括平凹透鏡142與透鏡陣列144,且透鏡陣列144位在平凹透鏡142與第二聚焦鏡130之間。在本實施例中,透鏡陣列144包括多個環繞的凸透鏡,第1圖中示例性地繪示出兩個凸透鏡1442、1444,但本揭露不以此為限。平凹透鏡142具有開孔142H。透鏡陣列144可以是由兩個以上的凸透鏡組成的球體矩陣。透鏡陣列144包括開孔144H,也就是透鏡陣列144的多個凸透鏡1442、1444圍繞出開孔144H。凸透鏡1442、1444的光軸方向與光纖110的光軸方向A1具有夾角,藉此使得通過透鏡陣列144朝向平凹透鏡142匯聚。The beam reducer 140 includes a plano-concave lens 142 and a lens array 144 , and the lens array 144 is located between the plano-concave lens 142 and the second focusing mirror 130 . In this embodiment, the lens array 144 includes a plurality of surrounding convex lenses, two convex lenses 1442 and 1444 are exemplarily shown in FIG. 1 , but the disclosure is not limited thereto. The plano-concave lens 142 has an opening 142H. The lens array 144 may be a spherical matrix composed of more than two convex lenses. The lens array 144 includes a hole 144H, that is, a plurality of convex lenses 1442 and 1444 of the lens array 144 surround the hole 144H. The optical axis directions of the convex lenses 1442 , 1444 have an included angle with the optical axis direction A1 of the optical fiber 110 , so as to converge toward the plano-concave lens 142 through the lens array 144 .

在本實施例中,系統控制器200的輻射光源210(見第2圖)發出加工輻射光102,且加工輻射光102依序通過光纖110、第一聚焦鏡120、平凹透鏡142的開孔142H、透鏡陣列144的開孔144H以及第二聚焦鏡130後照射至加工元件300上。加工輻射光102在通過第一聚焦鏡120後聚焦為具有直徑D1的平行光。開孔142H與開孔144H的孔徑大於加工輻射光102的直徑D1,開孔142H與開孔144H沿著光軸方向A1對齊。因此,加工輻射光102可通過開孔142H與開孔144H,且加工輻射光102的功率不會因為通過額外介質而衰減。在一些實施例中,開孔142H與開孔144H的孔徑為加工輻射光102的直徑D1的1.1倍~1.3倍。In this embodiment, the radiation source 210 (see FIG. 2 ) of the system controller 200 emits the processing radiation 102, and the processing radiation 102 passes through the optical fiber 110, the first focusing mirror 120, and the opening 142H of the plano-concave lens 142 in sequence. , the opening 144H of the lens array 144 and the second focusing mirror 130 irradiate onto the processing element 300 . The processing radiation light 102 is focused into a parallel light having a diameter D1 after passing through the first focusing lens 120 . The apertures of the openings 142H and 144H are larger than the diameter D1 of the processing radiation 102 , and the openings 142H and 144H are aligned along the optical axis direction A1 . Therefore, the processing radiation 102 can pass through the opening 142H and the opening 144H, and the power of the processing radiation 102 will not be attenuated by passing through an additional medium. In some embodiments, the diameters of the openings 142H and 144H are 1.1 to 1.3 times the diameter D1 of the processing radiation 102 .

加工元件300包括設置在電路板340上的引腳310與焊盤320。焊料330藉由加工輻射光102加熱以進行焊接。加工元件300被加熱後發出熱源輻射光104。熱源輻射光104由多個熱源發出的輻射光組合而成,且熱源輻射光104可具有多個波長。熱源輻射光104依序通過第二聚焦鏡130、透鏡陣列144、平凹透鏡142以及第一聚焦鏡120後進入光纖110,熱源輻射光104接著被系統控制器200回收以提供溫度偵測及回授控制所需的資料。The processing element 300 includes pins 310 and pads 320 disposed on a circuit board 340 . Solder 330 is heated by process radiation 102 to perform soldering. The processing element 300 emits heat source radiation 104 after being heated. The heat source radiant light 104 is composed of radiation light emitted by multiple heat sources, and the heat source radiant light 104 may have multiple wavelengths. The radiation light 104 from the heat source passes through the second focusing mirror 130, the lens array 144, the plano-concave lens 142 and the first focusing mirror 120 in sequence and then enters the optical fiber 110. The radiation light 104 from the heat source is then recovered by the system controller 200 to provide temperature detection and feedback. Control required data.

熱源輻射光104在通過第二聚焦鏡130後聚焦為具有直徑D2的平行光。直徑D2大於加工輻射光102的直徑D1,且直徑D2接近於第二聚焦鏡130的直徑。一部分的熱源輻射光1042可直接通過平凹透鏡142的開孔142H與透鏡陣列144的開孔144H。具體來說,如圖所示,直接通過開孔142H與開孔144H的熱源輻射光1042是與加工輻射光102重疊的部分。另一部份的熱源輻射光1044則在穿透過透鏡陣列144後而縮小直徑。具體來說,此處所述的另一部分的熱源輻射光1044是位在加工輻射光102外圍的部份。The radiation light 104 from the heat source is focused into parallel light with a diameter D2 after passing through the second focusing lens 130 . The diameter D2 is larger than the diameter D1 of the processing radiation 102 , and the diameter D2 is close to the diameter of the second focusing mirror 130 . A part of the radiant light 1042 of the heat source can directly pass through the opening 142H of the plano-concave lens 142 and the opening 144H of the lens array 144 . Specifically, as shown in the figure, the heat source radiation 1042 directly passing through the opening 142H and the opening 144H is a portion overlapping with the processing radiation 102 . Another part of the heat source radiant light 1044 is reduced in diameter after passing through the lens array 144 . Specifically, another part of the heat source radiant light 1044 described here is a part located at the periphery of the processing radiant light 102 .

縮束器140的平凹透鏡142與透鏡陣列144的折射率小於第一聚焦鏡120或第二聚焦鏡130的折射率。藉此,可避免熱源輻射光1044在進入平凹透鏡142前聚焦。換句話說,透鏡陣列144中多個凸透鏡1442,1444構成的焦點是落在平凹透鏡142後方,因此熱源輻射光1044在尚未聚焦前即穿透過平凹透鏡142。穿透過平凹透鏡142的熱源輻射光1044與熱源輻射光1042共同具有直徑D3,且直徑D3小於直徑D2。通過縮束器140後的熱源輻射光104透過第一聚焦鏡120聚焦,且熱源輻射光104的直徑接近於光纖110的孔徑而得以進入光纖110。換句話說,開孔142H與開孔144H的孔徑小於熱源輻射光104的直徑D2。熱源輻射光104的直徑D2藉由縮束器140縮小至直徑D3,因此有利於提高熱源輻射光104進入光纖110的比例。The refractive index of the plano-concave lens 142 and the lens array 144 of the beam reducer 140 is smaller than that of the first focusing lens 120 or the second focusing lens 130 . In this way, the heat source radiant light 1044 can be prevented from being focused before entering the plano-concave lens 142 . In other words, the focal point formed by the plurality of convex lenses 1442 and 1444 in the lens array 144 falls behind the plano-concave lens 142 , so the heat source radiant light 1044 passes through the plano-concave lens 142 before being focused. The heat source radiation light 1044 and the heat source radiation light 1042 passing through the plano-concave lens 142 share a diameter D3, and the diameter D3 is smaller than the diameter D2. The heat source radiation 104 passing through the beam reducer 140 is focused by the first focusing lens 120 , and the diameter of the heat source radiation 104 is close to the aperture of the optical fiber 110 to enter the optical fiber 110 . In other words, the diameters of the openings 142H and 144H are smaller than the diameter D2 of the heat source radiating light 104 . The diameter D2 of the heat source radiant light 104 is reduced to the diameter D3 by the beam reducer 140 , so it is beneficial to increase the ratio of the heat source radiant light 104 entering the optical fiber 110 .

舉例來說,本實施例中的第一聚焦鏡120、縮束器140與第二聚焦鏡130共同構成的結構長度約為10公分,有利於微型化輻射聚焦模組100。第一聚焦鏡120與第二聚焦鏡130由光學玻璃(例如N-BK7玻璃)製成,折射率1.52。第一聚焦鏡120的焦距為32毫米,第二聚焦鏡130的焦距為100毫米。平凹透鏡142與透鏡陣列144由氟化鈣(CaF2)製成,折射率1.43。平凹透鏡142的焦距為60毫米。For example, the structural length of the first focusing lens 120 , the beam reducer 140 and the second focusing lens 130 in this embodiment is about 10 cm, which is beneficial to the miniaturization of the radiation focusing module 100 . The first focusing lens 120 and the second focusing lens 130 are made of optical glass (such as N-BK7 glass) with a refractive index of 1.52. The focal length of the first focusing lens 120 is 32 millimeters, and the focal length of the second focusing lens 130 is 100 millimeters. The plano-concave lens 142 and the lens array 144 are made of calcium fluoride (CaF2) with a refractive index of 1.43. The focal length of the plano-concave lens 142 is 60 millimeters.

加工輻射光102通過第一聚焦鏡120後的直徑D1為14毫米。縮束器140的平凹透鏡142的開孔142H與透鏡陣列144的開孔144H大約為16毫米。如此一來,加工輻射光102可在無損失功率的狀況下通過開孔142H與開孔144H並進入第二聚焦鏡130。The diameter D1 of the processed radiation 102 after passing through the first focusing lens 120 is 14 mm. The aperture 142H of the plano-concave lens 142 and the aperture 144H of the lens array 144 of the beam reducer 140 are about 16 mm. In this way, the processing radiation 102 can pass through the opening 142H and the opening 144H and enter the second focusing lens 130 without loss of power.

加工輻射光102可包括雷射光、X光、紫外光、兆赫波、微波。熱源輻射光104可包括紅外光與近紅外光。縮束器140的平凹透鏡142與透鏡陣列144可對應熱源輻射光104的波段設置紅外線鍍膜,以降低光線衰減率。在其他實施例中,縮束器140可以是凸透鏡、凹凸透鏡、軸稜鏡、二次反射稜鏡、金屬鏡或上述之組合。透鏡陣列144可以是由多面反射鏡或是光柵構成具有開孔144H的光學元件。只要加工輻射光102可通過此光學元件,且熱源輻射光104的直徑可縮小即可。Processing radiation 102 may include laser light, X-rays, ultraviolet light, megahertz waves, microwaves. The heat source radiated light 104 may include infrared light and near infrared light. The plano-concave lens 142 and the lens array 144 of the beam reducer 140 can be provided with an infrared coating corresponding to the wavelength band of the heat source radiated light 104 to reduce light attenuation rate. In other embodiments, the beam reducer 140 may be a convex lens, a meniscus lens, an axial lens, a secondary reflection lens, a metal mirror, or a combination thereof. The lens array 144 can be an optical element formed by a polygonal mirror or a grating with an opening 144H. As long as the processing radiation 102 can pass through the optical element, and the diameter of the heat source radiation 104 can be reduced.

第2圖為根據本揭露一實施例之加工系統10的系統控制器200示意圖。系統控制器200包括輻射光源210、準直器212、光源耦合器214、紅外線偵測器220、紅外線耦合器222、回授控制器230以及分色鏡240。輻射光源210發出的輻射光202經過準直器212後,經由分色鏡240反射朝向光源耦合器214並形成如第1圖所示的加工輻射光102。第1圖中所示的熱源輻射光104通過分色鏡240後經由紅外線耦合器222耦合進入紅外線偵測器220。回授控制器230電性連接紅外線偵測器220與輻射光源210。回授控制器230根據紅外線偵測器220的偵測結果取得加工溫度,藉此調整輻射光源210的設定以維持加工效率。FIG. 2 is a schematic diagram of the system controller 200 of the processing system 10 according to an embodiment of the present disclosure. The system controller 200 includes a radiation source 210 , a collimator 212 , a light source coupler 214 , an infrared detector 220 , an infrared coupler 222 , a feedback controller 230 and a dichroic mirror 240 . The radiation light 202 emitted by the radiation source 210 passes through the collimator 212 , and is reflected by the dichroic mirror 240 toward the light source coupler 214 to form the processed radiation light 102 as shown in FIG. 1 . The heat source radiant light 104 shown in FIG. 1 passes through the dichroic mirror 240 and then is coupled into the infrared detector 220 through the infrared coupler 222 . The feedback controller 230 is electrically connected to the infrared detector 220 and the radiation source 210 . The feedback controller 230 obtains the processing temperature according to the detection result of the infrared detector 220 , so as to adjust the setting of the radiation light source 210 to maintain the processing efficiency.

根據上述,輻射聚焦模組100藉由縮束器140使熱源輻射光104的直徑得以縮小至接近加工輻射光102的直徑大小,以提升熱源輻射光104進入光纖110的比例,可提升溫度偵測準確性。此外,由於縮束器140的平凹透鏡142與透鏡陣列144分別具有開孔142H與開孔144H,加工輻射光102可在不損失功率的狀況下進入第二聚焦鏡130。因此,本揭露的輻射聚焦模組100可在相同光路中,同時維持加工輻射光102的輻射強度並增加熱源輻射光104進入光纖110的比例。如此一來,可無須設置額外光路以提升熱源輻射光的偵測強度,因此本揭露的加工模組具有體積較小且重量較輕等優點,可進一步提升加工精度。According to the above, the radiation focusing module 100 reduces the diameter of the heat source radiation light 104 to be close to the diameter of the processing radiation light 102 through the beam reducer 140, so as to increase the ratio of the heat source radiation light 104 entering the optical fiber 110, which can improve temperature detection. accuracy. In addition, since the plano-concave lens 142 and the lens array 144 of the beam reducer 140 have openings 142H and 144H respectively, the processed radiation 102 can enter the second focusing lens 130 without power loss. Therefore, the radiation focusing module 100 of the present disclosure can maintain the radiation intensity of the processing radiation 102 and increase the ratio of the heat source radiation 104 entering the optical fiber 110 in the same optical path. In this way, there is no need to set up an additional optical path to increase the detection intensity of the heat source radiated light. Therefore, the processing module of the present disclosure has the advantages of smaller size and lighter weight, which can further improve the processing accuracy.

第3圖為根據本揭露另一實施例之加工系統10a的輻射聚焦模組100a的示意圖。輻射聚焦模組100a與輻射聚焦模組100大致相同,其差異在於輻射聚焦模組100的縮束器140a包括平凹透鏡142與平凸透鏡144a。舉例來說,平凸透鏡144a的焦距為100毫米。輻射聚焦模組100a具有與輻射聚焦模組100相同的技術功效,於此不再贅述。FIG. 3 is a schematic diagram of a radiation focusing module 100a of a processing system 10a according to another embodiment of the present disclosure. The radiation focusing module 100 a is substantially the same as the radiation focusing module 100 , the difference being that the beam reducer 140 a of the radiation focusing module 100 includes a plano-concave lens 142 and a plano-convex lens 144 a. For example, the focal length of the plano-convex lens 144a is 100 mm. The radiation focusing module 100 a has the same technical functions as the radiation focusing module 100 , which will not be repeated here.

第4圖為根據本揭露一實施例之輻射聚焦模組的熱源輻射光傳輸效率模擬數據。在本實施例中,以第3圖的輻射聚焦模組100做為模擬時的配置。模擬光源功率為1瓦特,波長分別為1600奈米與2300奈米為兩模擬熱源紅外光。第4圖中以光軸方向A1對應的位置定義為橫向位置座標的原點。FIG. 4 is simulation data of heat source radiation light transmission efficiency of a radiation focusing module according to an embodiment of the present disclosure. In this embodiment, the radiation focusing module 100 shown in FIG. 3 is used as the simulation configuration. The power of the simulated light source is 1 watt, and the wavelengths of 1600 nm and 2300 nm are two simulated heat sources of infrared light. In Fig. 4, the position corresponding to the optical axis direction A1 is defined as the origin of the horizontal position coordinate.

表一為上述兩模擬熱源紅外光皆來自熱源S1時,模擬偵測器I與模擬偵測器II接收到的紅外線功率及傳輸效率。第4圖中的紅外線偵測器400分別用以模擬不同尺寸的偵測器。如表一所示,模擬偵測器I為50.8毫米乘以50.8毫米,且模擬偵測器II為0.8毫米乘以0.8毫米。如表一所示,第2列至第4列的資料分別列出習知的輻射聚焦模組的模擬結果,第5列至第7列的資料分別列出第3圖所示的輻射聚焦模組100a的模擬結果。Table 1 shows the infrared power and transmission efficiency received by the analog detector I and the analog detector II when the infrared light of the above two simulated heat sources comes from the heat source S1. The infrared detectors 400 in FIG. 4 are respectively used to simulate detectors of different sizes. As shown in Table 1, the analog detector I is 50.8 mm by 50.8 mm, and the analog detector II is 0.8 mm by 0.8 mm. As shown in Table 1, the data in columns 2 to 4 respectively list the simulation results of conventional radiation focusing modules, and the data in columns 5 to 7 respectively list the radiation focusing models shown in Figure 3 Simulation results for group 100a.

傳輸效率可根據模擬偵測器I的接收功率與模擬偵測器II的接收功率得出。從表一的第3列與第6列的資料可知,本發明的輻射聚焦模組100對於波長1600奈米的熱源紅外光的傳輸效率可從26.980%提升至77.132%。從表一的第4列與第7列的資料可知,本發明的輻射聚焦模組100對於波長2300奈米的熱源紅外光的傳輸效率可從32.158%提升至67.377%。   波長 (奈米) 位置 (釐米) 波長 (奈米) 位置 (釐米) 模擬偵測器I 接收功率 模擬偵測器II 接收功率 傳輸效率(%) 習知 1600 0 2300 0 1.84 0.5442   1600 0     0.9177 0.2476 26.980     2300 0 0.9223 0.2966 32.158 本發明 1600 0 2300 0 1.903 1.375   1600 0     0.95139 0.73383 77.132     2300 0 0.75161 0.64117 67.377 表一、輻射聚焦模組的傳輸效率模擬數據 The transmission efficiency can be obtained from the received power of the analog detector I and the received power of the analog detector II. It can be seen from the information in the third column and the sixth column of Table 1 that the transmission efficiency of the radiation focusing module 100 of the present invention for the heat source infrared light with a wavelength of 1600 nm can be increased from 26.980% to 77.132%. It can be seen from the information in the fourth column and the seventh column of Table 1 that the transmission efficiency of the radiation focusing module 100 of the present invention for the heat source infrared light with a wavelength of 2300 nm can be increased from 32.158% to 67.377%. Wavelength (nm) position (cm) Wavelength (nm) position (cm) Analog detector I received power Analog Detector II Received Power Transmission efficiency (%) Accustomed to know 1600 0 2300 0 1.84 0.5442 1600 0 0.9177 0.2476 26.980 2300 0 0.9223 0.2966 32.158 this invention 1600 0 2300 0 1.903 1.375 1600 0 0.95139 0.73383 77.132 2300 0 0.75161 0.64117 67.377 Table 1. Simulation data of transmission efficiency of radiation focusing module

表二為上述兩模擬熱源紅外光分別來自熱源S1與熱源S2時,模擬偵測器I與模擬偵測器II接收到的紅外線功率及傳輸效率。從表二的第3列與第6列的資料可知,本發明的輻射聚焦模組100對於波長1600奈米的熱源紅外光的傳輸效率可從26.980%提升至77.132%。從表一的第4列與第7列的資料可知,本發明的輻射聚焦模組100對於波長2300奈米的熱源紅外光的傳輸效率可從33.509%提升至54.081%。換句話說,即使熱源S2相較於圖中光軸方向A1有0.5釐米的橫向偏移,其對應的傳輸效率仍明顯高於習知的輻射聚焦模組。   波長 (奈米) 位置 (釐米) 波長 (奈米) 位置 (釐米) 模擬偵測器I 接收功率 模擬偵測器II 接收功率 傳輸效率(%) 習知 1600 0 2300 0.5 1.839 0.5437   1600 0     0.9177 0.2476 26.980     2300 0.5 0.9213 0.2903 31.509 本發明 1600 0 2300 0.5 1.9025 1.2482   1600 0     0.95139    0.73383 77.132     2300 0.5 0.75111 0.51437 54.081 表二、輻射聚焦模組的傳輸效率模擬數據 Table 2 shows the infrared power and transmission efficiency received by the analog detector I and the analog detector II when the infrared light from the above two simulated heat sources comes from the heat source S1 and the heat source S2 respectively. It can be seen from the information in the third column and the sixth column of Table 2 that the transmission efficiency of the radiation focusing module 100 of the present invention for the heat source infrared light with a wavelength of 1600 nm can be increased from 26.980% to 77.132%. It can be seen from the data in the fourth column and the seventh column of Table 1 that the transmission efficiency of the radiation focusing module 100 of the present invention for the heat source infrared light with a wavelength of 2300 nm can be increased from 33.509% to 54.081%. In other words, even if the heat source S2 has a lateral offset of 0.5 cm compared to the optical axis direction A1 in the figure, its corresponding transmission efficiency is still significantly higher than that of conventional radiation focusing modules. Wavelength (nm) position (cm) Wavelength (nm) position (cm) Analog detector I receive power Analog Detector II Received Power Transmission efficiency (%) Accustomed to know 1600 0 2300 0.5 1.839 0.5437 1600 0 0.9177 0.2476 26.980 2300 0.5 0.9213 0.2903 31.509 this invention 1600 0 2300 0.5 1.9025 1.2482 1600 0 0.95139 0.73383 77.132 2300 0.5 0.75111 0.51437 54.081 Table 2. Simulation data of transmission efficiency of radiation focusing module

第5圖為根據本揭露一實施例之輻射聚焦模組的紅外線傳輸效率模擬數據。第5圖的輻射聚焦模組與第4圖中所述的配置相同,其差異在於,本實施例中的熱源S3與熱源S4的位置分別位在橫向座標-.25釐米與0.25釐米。表三為上述兩模擬熱源紅外光分別來自熱源S3時與熱源S4時,模擬偵測器I與模擬偵測器II接收到的紅外線功率及傳輸效率。從表三的第3、4列與第6、7列的資料可知,本發明的輻射聚焦模組100相較於習知的輻射聚焦模組皆有明顯提升。換句話說,即使熱源S3時與熱源S4皆相較於光軸方向A1有橫向偏移,其對應的傳輸效率仍明顯高於習知的輻射聚焦模組。   波長 (奈米) 位置 (釐米) 波長 (奈米) 位置 (釐米) 模擬偵測器I 接收功率 模擬偵測器II 接收功率 傳輸效率(%) 習知 1600 -0.25 2300 0.25 1.84 0.5442   1600 -0.25     0.9178 0.2460 26.803     2300 0.25 0.9222 0.2962 32.118 本發明 1600 -0.25 2300 0.25 1.9017 1.3182   1600 -0.25     0.95168 0.7285 76.522     2300 0.25 0.95112 0.58995 62.027 表三、輻射聚焦模組的傳輸效率模擬數據 FIG. 5 is simulation data of infrared transmission efficiency of a radiation focusing module according to an embodiment of the present disclosure. The configuration of the radiation focusing module in Fig. 5 is the same as that described in Fig. 4, the difference is that the positions of the heat source S3 and the heat source S4 in this embodiment are located at the horizontal coordinates -.25 cm and 0.25 cm, respectively. Table 3 shows the infrared power and transmission efficiency received by the analog detector I and the analog detector II when the infrared light from the above two simulated heat sources comes from the heat source S3 and the heat source S4 respectively. From the data in columns 3, 4 and 6, 7 of Table 3, it can be seen that the radiation focusing module 100 of the present invention has obvious improvements compared with the conventional radiation focusing modules. In other words, even though both the heat source S3 and the heat source S4 are laterally shifted relative to the optical axis direction A1, their corresponding transmission efficiency is still significantly higher than that of conventional radiation focusing modules. Wavelength (nm) position (cm) Wavelength (nm) position (cm) Analog detector I received power Analog Detector II Received Power Transmission efficiency (%) Accustomed to know 1600 -0.25 2300 0.25 1.84 0.5442 1600 -0.25 0.9178 0.2460 26.803 2300 0.25 0.9222 0.2962 32.118 this invention 1600 -0.25 2300 0.25 1.9017 1.3182 1600 -0.25 0.95168 0.7285 76.522 2300 0.25 0.95112 0.58995 62.027 Table 3. Simulation data of transmission efficiency of radiation focusing module

第6圖為根據本揭露一實施例之輻射聚焦模組的紅外線傳輸效率模擬數據。第6圖的輻射聚焦模組與第4圖中所述的配置相同,其差異在於,本實施例中的熱源S5與熱源S6的位置分別位在橫向座標原點與0.5釐米。表四為上述兩模擬熱源紅外光分別來自熱源S5時與熱源S6時,模擬偵測器I與模擬偵測器II接收到的紅外線功率及傳輸效率。從表四的第3、4列與第6、7列的資料可知,本發明的輻射聚焦模組100相較於習知的輻射聚焦模組皆有明顯提升。換句話說,即使熱源S5相較於光軸方向A1有-0.5釐米的橫向偏移,其對應的傳輸效率仍明顯高於習知的輻射聚焦模組。   波長 (奈米) 位置 (釐米) 波長 (奈米) 位置 (釐米) 模擬偵測器I 接收功率 模擬偵測器II 接收功率 傳輸效率(%) 習知 1600 0.5 2300 0 1.8400 0.5383   1600 0.5     0.9182 0.2405 26.1926     2300 0 0.9218 0.2978 32.3064 本發明 1600 0.5 2300 0 1.9028 1.3530   1600 0.5     0.9514 0.7108 74.7152     2300 0 0.9514 0.6421 67.4963. 表四、輻射聚焦模組的傳輸效率模擬數據 FIG. 6 is simulation data of infrared transmission efficiency of a radiation focusing module according to an embodiment of the present disclosure. The configuration of the radiation focusing module in Fig. 6 is the same as that described in Fig. 4, the difference is that the positions of the heat source S5 and the heat source S6 in this embodiment are located at the origin of the horizontal coordinates and 0.5 cm respectively. Table 4 shows the infrared power and transmission efficiency received by the analog detector I and the analog detector II when the infrared light from the above two simulated heat sources comes from the heat source S5 and the heat source S6 respectively. From the data in columns 3, 4 and 6, 7 of Table 4, it can be known that the radiation focusing module 100 of the present invention has obvious improvements compared with the conventional radiation focusing modules. In other words, even if the heat source S5 has a lateral offset of −0.5 cm relative to the optical axis direction A1, its corresponding transmission efficiency is still significantly higher than that of conventional radiation focusing modules. Wavelength (nm) position (cm) Wavelength (nm) position (cm) Analog detector I received power Analog Detector II Received Power Transmission efficiency (%) Accustomed to know 1600 0.5 2300 0 1.8400 0.5383 1600 0.5 0.9182 0.2405 26.1926 2300 0 0.9218 0.2978 32.3064 this invention 1600 0.5 2300 0 1.9028 1.3530 1600 0.5 0.9514 0.7108 74.7152 2300 0 0.9514 0.6421 67.4963. Table 4. Simulation data of transmission efficiency of radiation focusing module

如同前述,由於實際的加工元件被加熱而發出熱源輻射光時,熱源輻射光是由多個熱源發出的輻射光組合而成,因此實際的熱源輻射光可具有多個波長。如表一至表四所示,當波長1600奈米的熱源紅外光與波長2300奈米的熱源紅外光同時被偵測時(第2列與第5列)的接收功率與波長1600奈米的熱源紅外光與波長2300奈米的熱源紅外光分別被偵測時(第3列、第4列與第6列、第7列)的接收功率相近。由此結果可推測,偵測實際的加工元件時的結果可根據單一波長的熱源紅外光的模擬數據而得出。As mentioned above, when the actual processing element is heated to emit heat source radiant light, the heat source radiant light is composed of radiation light emitted by multiple heat sources, so the actual heat source radiant light may have multiple wavelengths. As shown in Table 1 to Table 4, when the heat source infrared light with a wavelength of 1600 nm and the heat source infrared light with a wavelength of 2300 nm are detected simultaneously (columns 2 and 5), the received power and the heat source with a wavelength of 1600 nm The received powers of the infrared light and the heat source infrared light with a wavelength of 2300 nm are similar when they are respectively detected (column 3, column 4 and column 6, column 7). From the results, it can be inferred that the detection results of the actual processing components can be obtained based on the simulated data of the heat source infrared light with a single wavelength.

參閱第2圖。一般而言,紅外線偵測器220的偵測效果會受到所在環境影響。當回收的熱源輻射光104的強度太小時,回授控制器230恐無法根據紅外線偵測器220的偵測結果執行有效的回授控制。本揭露的輻射聚焦模組可偵測多個波長,因此可利用拍頻計算的方式估算加工溫度,提升系統控制器200對於加工的控制效果。See Figure 2. Generally speaking, the detection effect of the infrared detector 220 will be affected by the surrounding environment. When the intensity of the recovered heat source radiant light 104 is too small, the feedback controller 230 may not be able to perform effective feedback control according to the detection result of the infrared detector 220 . The radiation focusing module of the present disclosure can detect multiple wavelengths, so the processing temperature can be estimated by means of beat frequency calculation, and the control effect of the system controller 200 on processing can be improved.

綜上所述,本揭露的輻射聚焦模組藉由縮束器使熱源輻射光的直徑得以縮小至接近加工輻射光的直徑大小,以提升熱源輻射光進入光纖的比例,可提升溫度偵測準確性。此外,由於縮束器具有開孔,加工輻射光可在不損失功率的狀況下進入第二聚焦鏡。因此,本揭露的輻射聚焦模組可在相同光路中,同時維持加工輻射光的輻射強度並增加熱源輻射光進入光纖的比例。如此一來,可無須設置額外光路以提升熱源輻射光的偵測強度,因此本揭露的加工模組具有體積較小且重量較輕等優點,可進一步提升加工精度。此外,本揭露的輻射聚焦模組可偵測多個波長的熱源輻射光,藉此提升系統控制器對於加工的控制效果。To sum up, the radiation focusing module of this disclosure reduces the diameter of the heat source radiation light to be close to the diameter of the processing radiation light by using a beam reducer, so as to increase the proportion of the heat source radiation light entering the optical fiber and improve the accuracy of temperature detection. sex. Furthermore, due to the aperture of the beam reducer, the processing radiation can enter the second focusing mirror without loss of power. Therefore, the radiation focusing module of the present disclosure can maintain the radiation intensity of the processing radiation and increase the ratio of the heat source radiation entering the optical fiber in the same optical path. In this way, there is no need to set up an additional optical path to increase the detection intensity of the heat source radiated light. Therefore, the processing module of the present disclosure has the advantages of smaller size and lighter weight, which can further improve the processing accuracy. In addition, the radiation focusing module of the present disclosure can detect multiple wavelengths of heat source radiation, thereby improving the control effect of the system controller on processing.

10,10a:加工系統 100,100a:輻射聚焦模組 102:加工輻射光 104,1042,1044:熱源輻射光 110:光纖 120:第一聚焦鏡 130:第二聚焦鏡 140,140a:縮束器 142:平凹透鏡 142H:開孔 144:透鏡陣列 1442,1444:凸透鏡 144H:開孔 144a:平凸透鏡 200:系統控制器 202:輻射光 210:輻射光源 212:準直器 214:光源耦合器 220:紅外線偵測器 222:紅外線耦合器 230:回授控制器 240:分色鏡 300:加工元件 310:引腳 320:焊盤 330:焊料 340:電路板 400:紅外線偵測器 A1:光軸方向 D1,D2,D3:直徑 S1,S2,S3,S4,S5,S6:熱源 10,10a: Processing system 100,100a: Radiation Focus Module 102: Processing radiant light 104, 1042, 1044: Heat source radiates light 110: optical fiber 120: The first focusing mirror 130: second focusing mirror 140,140a: beam reducer 142: plano-concave lens 142H: opening 144: Lens array 1442,1444: convex lens 144H: opening 144a: plano-convex lens 200: System Controller 202: Radiant light 210: Radiation light source 212: Collimator 214: Light source coupler 220: infrared detector 222: Infrared coupler 230: Feedback controller 240: dichroic mirror 300: processing components 310: pin 320: Pad 330: Solder 340: circuit board 400: infrared detector A1: Optical axis direction D1, D2, D3: Diameter S1, S2, S3, S4, S5, S6: heat source

第1圖為根據本揭露一實施例之加工系統的輻射聚焦模組的示意圖。 第2圖為根據本揭露一實施例之加工系統的系統控制器示意圖。 第3圖為根據本揭露另一實施例之加工系統的輻射聚焦模組的示意圖。 第4圖為根據本揭露一實施例之輻射聚焦模組的紅外線傳輸效率模擬數據。 第5圖為根據本揭露一實施例之輻射聚焦模組的紅外線傳輸效率模擬數據。 第6圖為根據本揭露一實施例之輻射聚焦模組的紅外線傳輸效率模擬數據。 FIG. 1 is a schematic diagram of a radiation focusing module of a processing system according to an embodiment of the present disclosure. FIG. 2 is a schematic diagram of a system controller of a processing system according to an embodiment of the present disclosure. FIG. 3 is a schematic diagram of a radiation focusing module of a processing system according to another embodiment of the present disclosure. FIG. 4 is the simulation data of the infrared transmission efficiency of the radiation focusing module according to an embodiment of the present disclosure. FIG. 5 is simulation data of infrared transmission efficiency of a radiation focusing module according to an embodiment of the present disclosure. FIG. 6 is simulation data of infrared transmission efficiency of a radiation focusing module according to an embodiment of the present disclosure.

10:加工系統 100:輻射聚焦模組 102:加工輻射光 104,1042,1044:熱源輻射光 110:光纖 120:第一聚焦鏡 130:第二聚焦鏡 140:縮束器 142:平凹透鏡 142H:開孔 144:透鏡陣列 1442,1444:凸透鏡 144H:開孔 200:系統控制器 300:加工元件 310:引腳 320:焊盤 330:焊料 340:電路板 A1:光軸方向 D1,D2,D3:直徑 10: Processing system 100: Radiation Focus Module 102: Processing radiant light 104, 1042, 1044: Heat source radiates light 110: optical fiber 120: The first focusing mirror 130: second focusing mirror 140: beam reducer 142: plano-concave lens 142H: opening 144: Lens array 1442,1444: convex lens 144H: opening 200: System Controller 300: processing components 310: pin 320: Pad 330: Solder 340: circuit board A1: Optical axis direction D1, D2, D3: Diameter

Claims (12)

一種輻射聚焦模組,包括:一光纖,具有一光軸方向;一第一聚焦鏡與一第二聚焦鏡,其中該第一聚焦鏡位在該光纖與該第二聚焦鏡之間;以及一縮束器,位在該第一聚焦鏡與該第二聚焦鏡之間,且該第一聚焦鏡、該第二聚焦鏡、以及該縮束器排列於該光軸方向上,其中該縮束器具有一開孔及一平凹透鏡,一熱源輻射光的直徑藉由該縮束器縮小,以提高該熱源輻射光進入該光纖的比例。 A radiation focusing module, comprising: an optical fiber with an optical axis direction; a first focusing mirror and a second focusing mirror, wherein the first focusing mirror is located between the optical fiber and the second focusing mirror; and a A beam reducer is located between the first focusing lens and the second focusing lens, and the first focusing lens, the second focusing lens, and the beam reducer are arranged in the direction of the optical axis, wherein the beam reducer The device has an opening and a plano-concave lens, and the diameter of the radiant light of a heat source is reduced by the beam reducer, so as to increase the ratio of the radiant light of the heat source entering the optical fiber. 如請求項1所述之輻射聚焦模組,其中該開孔對準該光軸方向。 The radiation focusing module as claimed in claim 1, wherein the opening is aligned with the optical axis direction. 如請求項1所述之輻射聚焦模組,其中該縮束器的一折射率小於該第一聚焦鏡或第二聚焦鏡的一折射率。 The radiation focusing module as claimed in claim 1, wherein a refractive index of the beam reducer is smaller than a refractive index of the first focusing mirror or the second focusing mirror. 如請求項1所述之輻射聚焦模組,其中該縮束器包括一透鏡陣列,且該透鏡陣列位在該平凹透鏡與該第二聚焦鏡之間。 The radiation focusing module as claimed in claim 1, wherein the beam reducer includes a lens array, and the lens array is located between the plano-concave lens and the second focusing mirror. 如請求項4所述之輻射聚焦模組,其中該透鏡陣列包括複數個透鏡,且該些透鏡的光軸方向與該光纖 的光軸方向具有一夾角。 The radiation focusing module as claimed in item 4, wherein the lens array includes a plurality of lenses, and the optical axes of the lenses are in the same direction as the optical fiber The direction of the optical axis has an included angle. 如請求項1所述之輻射聚焦模組,其中該縮束器包括一平凸透鏡,且該平凸透鏡位在該平凹透鏡與該第二聚焦鏡之間。 The radiation focusing module as claimed in claim 1, wherein the beam reducer includes a plano-convex lens, and the plano-convex lens is located between the plano-concave lens and the second focusing lens. 一加工系統,包括:一紅外線偵測器;一輻射光源,電性連接該紅外線偵測器,其中該輻射光源配置以發出一加工輻射光;以及一輻射聚焦模組,配置以傳輸一熱源輻射光,其中該輻射聚焦模組包括:一光纖,具有一光軸方向;一第一聚焦鏡與一第二聚焦鏡,其中該第一聚焦鏡位在該光纖與該第二聚焦鏡之間;以及一縮束器,位在該第一聚焦鏡與該第二聚焦鏡之間,且該第一聚焦鏡、該第二聚焦鏡、以及該縮束器排列於該光軸方向上,其中該縮束器具有一開孔及一平凹透鏡,該熱源輻射光的直徑藉由該縮束器縮小,以提高該熱源輻射光進入該光纖的比例。 A processing system comprising: an infrared detector; a radiation source electrically connected to the infrared detector, wherein the radiation source is configured to emit a processing radiation; and a radiation focusing module configured to transmit a heat source radiation Light, wherein the radiation focusing module includes: an optical fiber with an optical axis direction; a first focusing lens and a second focusing lens, wherein the first focusing lens is located between the optical fiber and the second focusing lens; and a beam reducer, located between the first focusing lens and the second focusing lens, and the first focusing lens, the second focusing lens, and the beam reducer are arranged in the direction of the optical axis, wherein the The beam reducer has an opening and a plano-concave lens. The diameter of the heat source radiated light is reduced by the beam reducer to increase the ratio of the heat source radiated light entering the optical fiber. 如請求項7所述之加工系統,其中該開孔的一孔徑大於該加工輻射光的直徑。 The processing system as claimed in claim 7, wherein an aperture of the opening is larger than a diameter of the processing radiation. 如請求項7所述之加工系統,其中該開孔的一孔徑為該加工輻射光的直徑的1.1倍~1.3倍。 The processing system according to claim 7, wherein an aperture of the opening is 1.1 to 1.3 times the diameter of the processing radiation. 如請求項7所述之加工系統,其中該開孔的一孔徑小於該熱源輻射光的直徑。 The processing system as claimed in claim 7, wherein a diameter of the opening is smaller than a diameter of the heat source radiating light. 如請求項7所述之加工系統,其中該加工輻射光包括雷射光、X光、紫外光、兆赫波、微波。 The processing system according to claim 7, wherein the processing radiation includes laser light, X-ray, ultraviolet light, megahertz wave, microwave. 如請求項7所述之加工系統,其中該熱源輻射光包括紅外光與近紅外光。 The processing system according to claim 7, wherein the heat source radiates light including infrared light and near-infrared light.
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