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TWI800064B - Single wafer wet processing equipment - Google Patents

Single wafer wet processing equipment Download PDF

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Publication number
TWI800064B
TWI800064B TW110140472A TW110140472A TWI800064B TW I800064 B TWI800064 B TW I800064B TW 110140472 A TW110140472 A TW 110140472A TW 110140472 A TW110140472 A TW 110140472A TW I800064 B TWI800064 B TW I800064B
Authority
TW
Taiwan
Prior art keywords
processing equipment
single wafer
wet processing
wafer wet
equipment
Prior art date
Application number
TW110140472A
Other languages
Chinese (zh)
Other versions
TW202318531A (en
Inventor
陳建勝
Original Assignee
弘塑科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 弘塑科技股份有限公司 filed Critical 弘塑科技股份有限公司
Priority to TW110140472A priority Critical patent/TWI800064B/en
Application granted granted Critical
Publication of TWI800064B publication Critical patent/TWI800064B/en
Publication of TW202318531A publication Critical patent/TW202318531A/en

Links

TW110140472A 2021-10-29 2021-10-29 Single wafer wet processing equipment TWI800064B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW110140472A TWI800064B (en) 2021-10-29 2021-10-29 Single wafer wet processing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW110140472A TWI800064B (en) 2021-10-29 2021-10-29 Single wafer wet processing equipment

Publications (2)

Publication Number Publication Date
TWI800064B true TWI800064B (en) 2023-04-21
TW202318531A TW202318531A (en) 2023-05-01

Family

ID=86948800

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110140472A TWI800064B (en) 2021-10-29 2021-10-29 Single wafer wet processing equipment

Country Status (1)

Country Link
TW (1) TWI800064B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070240638A1 (en) * 2006-04-18 2007-10-18 Tokyo Electron Limited Liquid processing apparatus
US20130008872A1 (en) * 2011-07-06 2013-01-10 Tokyo Electron Limited Substrate liquid processing apparatus and substrate liquid processing method
TW201903860A (en) * 2017-04-11 2019-01-16 日商東京威力科創股份有限公司 Substrate processing device
TW202042324A (en) * 2019-05-06 2020-11-16 弘塑科技股份有限公司 Single wafer wet processing apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070240638A1 (en) * 2006-04-18 2007-10-18 Tokyo Electron Limited Liquid processing apparatus
US20130008872A1 (en) * 2011-07-06 2013-01-10 Tokyo Electron Limited Substrate liquid processing apparatus and substrate liquid processing method
TW201903860A (en) * 2017-04-11 2019-01-16 日商東京威力科創股份有限公司 Substrate processing device
TW202042324A (en) * 2019-05-06 2020-11-16 弘塑科技股份有限公司 Single wafer wet processing apparatus

Also Published As

Publication number Publication date
TW202318531A (en) 2023-05-01

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