TWI792358B - Heat-dissipation device with detachment function - Google Patents

Abstract

A heat-dissipation device with detachment function includes a heat-dissipation structure and a detachment device. The heat-dissipation structure includes a base, a heat-dissipation element disposed on the base, and a through hole penetrating through the base. The detachment device includes a housing disposed on the base and covering the through hole, wherein the housing includes a gas chamber, and a gas hole connected to the gas chamber, the gas hole being in communication with the through hole; and an adjustment element is movably disposed in the gas chamber. A gas in the housing is pushed out through the gas hole by moving the adjustment element.

Description

Radiator with removal function

The invention relates to a radiator, in particular to a radiator with a removal function.

In order to quickly dissipate heat from the chip, a heat sink is generally provided on the chip to conduct the heat generated by the chip to the heat sink. In addition, a thermally conductive material is coated between the chip and the heat sink to increase the heat conduction efficiency between the chip and the heat sink.

However, when the heat sink needs to be removed from the chip, the paste-like thermal conductive material will cause suction between the heat sink and the chip, making it difficult to separate the heat sink from the chip. In particular, the chip used in the server can increase the processing performance of the chip by increasing the area of the chip. When the area of the chip is larger, the suction force between the heat sink and the chip caused by the thermally conductive material is greater, and it is more difficult to separate the heat sink from the chip. Therefore, there is a need to provide an improved solution for the radiator.

In view of this, in the present invention, a remover is provided on the heat sink to help the heat sink be separated from the chip with a large surface area.

An embodiment of the invention discloses a radiator with a removal function, which includes a heat dissipation structure and a remover. The heat dissipation structure includes a base and a heat dissipation element arranged on the base, and a through hole runs through the base. The remover includes a shell, which is arranged on the above-mentioned base and covers the above-mentioned through hole, wherein the above-mentioned shell has an air cavity and an air hole connected to the above-mentioned air cavity, wherein the above-mentioned air hole is connected to the above-mentioned through-hole or is located in the above-mentioned in the through hole; and an adjusting element, which is movably arranged in the air cavity. By moving the adjustment element, the gas in the casing is discharged through the air hole.

According to an embodiment of the present invention, the above-mentioned base is used for attaching to a chip through a heat conduction layer. The through hole is in contact with the heat conduction layer, and the gas in the casing is discharged to the heat conduction layer through the air hole by moving the adjusting element.

According to an embodiment of the present invention, the heat sink further includes a clamping mechanism disposed on the base and used for connecting to a circuit board. The above-mentioned clamping mechanism is used for clamping the above-mentioned chip between the above-mentioned circuit board and the above-mentioned base.

According to an embodiment of the present invention, the clamping mechanism includes a rod passing through the base and connected to the circuit board; and an elastic element on one side is sheathed on the rod and abuts against the base.

According to an embodiment of the present invention, the air hole includes a connecting section connected to the air cavity, a receiving section connected to the connecting section, and an exhaust opening connected to the receiving section. The above-mentioned remover further includes a stop element, which is movably arranged in the above-mentioned accommodating section; and an elastic element, which is arranged in the above-mentioned accommodating section, and exerts an elastic force on the above-mentioned stop element, so that the above-mentioned The stop element covers the aforementioned connection section. When the adjustment element moves toward the air hole, the gas in the air cavity pushes the stop element to move toward the exhaust opening.

According to an embodiment of the present invention, the casing further includes a main body and a cover connected to the main body, wherein the air cavity and the air hole are located in the main body, and the exhaust opening is located in the cover.

According to an embodiment of the present invention, the cover body and the exhaust opening are located in the through hole.

According to an embodiment of the present invention, a diameter of the stopper element is larger than a diameter of the exhaust opening and a diameter of the connecting section. The diameter of the above-mentioned stop element, the diameter of the above-mentioned exhaust opening and the diameter of the above-mentioned connection section are measured in the same direction.

According to an embodiment of the present invention, the air cavity includes a first section and a second section connected to the air hole. The adjusting element includes a rotating part screwed to the inner wall of the first section; and a piston part contacting the inner wall of the second section. When the rotating part is rotated, the piston part moves toward the air hole.

According to an embodiment of the present invention, the through hole is located at the center of the base, and the housing extends perpendicular to the base and is connected to an inner wall of the through hole.

In order to make it easier for those skilled in the art to understand and implement the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the present invention provides many applicable inventive concepts, which can be implemented in various specific forms. Those skilled in the art can utilize the details described in these and other embodiments and other applicable structural, logical and electrical changes to practice the invention without departing from the spirit and scope of the invention.

The description of the present invention provides different examples to illustrate the technical features of different implementations of the present invention. Wherein, the arrangement of each element in the embodiment is for illustration, not for limiting the present invention. In addition, the partial repetition of the symbols in the figures in the embodiments is for the purpose of simplifying the description, and does not imply the relationship between different embodiments. Wherein, the same reference numerals used in the illustrations and descriptions represent the same or similar components. The illustrations in this specification are in simplified form and have not been drawn to precise scale. For clarity and ease of illustration, directional terms (eg, top, bottom, up, down, and diagonal) refer to accompanying illustrations. The directional terms used in the following description are not used to limit the scope of the present invention when they are not clearly used in the scope of the attached patent application below.

FIG. 1 is a perspective view of a radiator 1 with a dismounting function according to an embodiment of the present invention. FIG. 2 is an exploded view of a radiator 1 with a dismounting function according to an embodiment of the present invention. FIG. 3 is a cross-sectional view of a heat sink 1 with a removal function according to an embodiment of the present invention. The heat sink 1 is used for disposing on the chip A1 and dissipating heat from the chip A1. In this embodiment, there is a heat conduction layer A2 between the heat sink 1 and the chip A1. The chip A1 is disposed on the circuit board A3, and the heat sink 1, the chip A1, and the circuit board A3 are disposed in the casing A4. For the purpose of brevity, in the drawings, part of the casing A4 is omitted, and only the bottom plate A41 of the casing A4 is drawn. In addition, an electronic device may include a heat sink 1 , a heat conduction layer A2 , a chip A1 , a circuit board A3 , and a case A4 . The aforementioned electronic device can be a personal computer, a server (server), a notebook computer, a smart phone, or a tablet computer, but is not limited thereto.

The heat sink 1 may include a heat dissipation structure 10 , a plurality of clamping mechanisms 20 , and a remover 30 . The heat dissipation structure 10 is disposed on the chip A1. The remover 30 and the clamping mechanism 20 are disposed on the heat dissipation structure 10 . The stripper 30 may be a vacuum breaker. When the heat dissipation structure 10 is removed from the chip A1 , the remover 30 provides gas between the chip A1 and the heat dissipation structure 10 , so as to reduce the adsorption force between the chip A1 and the heat dissipation structure 10 .

The heat dissipation structure 10 includes a base 11 and one or more heat dissipation elements 12 . The base 11 can be a plate structure. The base 11 , the heat conduction layer A2 , the chip A1 , the circuit board A3 , and the bottom plate A41 of the casing A4 can be arranged in sequence along the arrangement direction D1 and can extend perpendicular to the arrangement direction D1 . The base 11 and the heat dissipation element 12 can be made of heat-conducting material or metal. In addition, a through hole 111 runs through the base 11 and may be located at the center of the base 11 . The heat dissipation element 12 is disposed on the base 11 . In this embodiment, the heat dissipation elements 12 can be fins, and are arranged on the base 11 parallel to each other. In another embodiment, the heat dissipation element 12 can be a heat pipe or a water cooling cavity.

The clamping mechanism 20 is disposed on the base 11 and used for connecting to the circuit board A3. The clamping mechanism 20 is used for clamping the chip A1 between the circuit board A3 and the base 11 . The clamping mechanism 20 is located on the edge of the base 11 . When the clamping mechanism 20 clamps the circuit board A3 and the base 11 , the clamping mechanism 20 is separated from the chip A1 . In this embodiment, each clamping mechanism 20 includes a rod 21 and an elastic element 22 on one side. The rods 21 can extend along the arrangement direction D1. The rod 21 passes through the base 11 and is connected to the circuit board A3. The side elastic element 22 is sheathed on the rod 21 . The side elastic element 22 can be a spring, one end of the side elastic element 22 abuts against the top of the rod 21 , and the other end of the side elastic element 22 abuts against the upper surface of the base 11 .

In this embodiment, a plurality of spacing elements A5 are disposed on the bottom plate A41 of the case A4, and the circuit board A3 is disposed on the spacing elements A5. In other words, the circuit board A3 is separated from the bottom plate A41 of the case A4 by the spacer A5. The bottom end of the rod 21 can pass through the circuit board A3 and be connected with the spacing element A5. In this embodiment, the spacing element A5 is a hollow column, and the bottom end of the rod 21 is inserted into the spacing element A5.

FIG. 4 is an exploded view of a stripper 30 according to an embodiment of the present invention. FIG. 5 is an enlarged cross-sectional view of the radiator 1 with a dismounting function according to an embodiment of the present invention, wherein the adjusting element 32 is located at an initial position. The remover 30 includes a housing 31 , an adjustment element 32 , a stop element 33 , and an elastic element 34 . The housing 31 is disposed on the base 11 and covers the through hole 111 . The housing 31 extends perpendicularly to the base 11 . The casing 31 further includes a main body 311 and a cover 312 . The main body 311 extends perpendicular to the base 11 . In this embodiment, the main body 311 may have a protruding portion 311a. The outer sidewall of the protruding portion 311a and the inner sidewall of the through hole 111 have threads. The protruding portion 311 a can be screwed to the through hole 111 .

The cover 312 is connected to the protruding portion 311 a of the main body 311 and is located in the protruding portion 311 a of the main body 311 . In this embodiment, the outer wall of the cover body 312 and the inner wall of the protruding portion 311a have threads. The cover 312 can be screwed to the protruding portion 311a.

The main body 311 and the cover 312 are hollow structures. The housing 31 has an air cavity 313 and an air hole 314 . The air cavity 313 is located inside the main body 311 . The air hole 314 communicates with the air cavity 313 . In addition, part of the air holes 314 may be located in the main body 311 , and part of the air holes 314 may be located in the cover 312 . In another embodiment, all the air holes 314 can be located in the cover body 312 . The air cavity 313 and the air hole 314 are filled with gas. In this embodiment, the aforementioned gas is air.

In this embodiment, the casing 31 (or the main body 311 ) can be connected to the inner wall of the through hole 111 , and the cover 312 and the air hole 314 are located in the through hole 111 . In another embodiment, the main body 311 may not include the protruding portion 311a. The casing 31 (or the main body 311 ) can cover the upper opening of the through hole 111 , and the cover 312 and the air hole 314 are connected or communicated with the upper opening of the through hole 111 . The aforementioned upper opening is connected to the upper surface of the bottom plate A41.

The adjustment element 32 is movably disposed in the air cavity 313 . By moving the adjustment element 32 , the gas in the casing 31 is discharged through the air hole 314 . In this embodiment, the adjusting element 32 can be a T-shaped structure. The adjusting element 32 includes a rotating portion 321 and a piston portion 322 . The outer sidewall of the rotating part 321 and the inner sidewall of the first section 313a have threads. The rotating part 321 is screwed to the inner wall of the first section 313a. The piston portion 322 is in contact with the inner sidewall of the second section 313b. When the aforementioned rotating part 321 is turned, the piston part 322 moves toward the air hole 314 . At this time, the gas in the air chamber 313 is pushed by the piston portion 322 to flow toward the air hole 314 .

In this embodiment, the adjusting element 32 may further include a first sealing ring 323 . The first sealing ring 323 is disposed on the piston portion 322 and located between the piston portion 322 and the inner sidewall of the second section 313b. The first sealing ring 323 can prevent the gas in the air cavity 313 from leaking out of the housing 31 through the gap between the adjusting element 32 and the housing 31 .

The air hole 314 includes a connecting section 314a, an accommodating section 314b, and an exhaust opening 314c. The connection section 314 a is connected to the bottom of the air cavity 313 . The accommodating section 314b is connected to the bottom of the connecting section 314a. The exhaust opening 314c is connected to the bottom of the accommodating section 314b and is located in the cover 312 . The air cavity 313 , the connection section 314 a , the accommodating section 314 b , and the exhaust opening 314 c can be arranged in sequence along the arrangement direction D1 . In this embodiment, the exhaust opening 314c is located in the through hole 111 . In another embodiment, the exhaust opening 314c is connected or communicated with the upper opening of the through hole 111 .

The stop element 33 is movably disposed in the accommodating section 314b. In this embodiment, the stop element 33 can be a sphere and is adjacent to the connection section 314a. The elastic element 34 is disposed in the accommodating section 314b. One end of the elastic element 34 can abut against the bottom of the accommodating section 314 b, and the other end of the elastic element 34 abuts against the stop element 33 . The elastic element 34 can exert an elastic force on the stop element 33 so that the stop element 33 covers the connecting section 314a.

FIG. 6 is an enlarged cross-sectional view of the heat sink 1 with a dismounting function according to an embodiment of the present invention, wherein the adjusting element 32 is in a pushing position. As shown in FIG. 6 , when the adjustment element 32 moves toward the air hole 314 , the gas in the air cavity 313 pushes the elastic element 34 to move toward the exhaust opening 314 c. In other words, at this time, the gas in the air cavity 313 can flow into the accommodating section 314 b, and then the gas in the air hole 314 is discharged out of the casing 31 through the exhaust opening 314 c.

In this embodiment, the remover 30 may further include a second sealing ring 35 disposed on the casing 31 . The second sealing ring 35 can be located between the casing 31 and the through hole 111 to prevent the gas discharged from the remover 30 from leaking through the gap between the casing 31 and the base 11 . Furthermore, the diameter of the stop element 33 is greater than the diameter of the outlet opening 314c and the diameter of the connection section 314a. The diameter of the stop element 33 , the diameter of the outlet opening 314 c and the diameter of the connection section 314 a are measured in the same direction. Therefore, the stop element 33 can completely cover the lower opening of the connection section 314a. In addition, the elastic element 34 or the ball will not be detached from the housing 31 through the exhaust opening 314c.

As shown in FIG. 3 and FIG. 5 , when the heat sink 1 is installed on the chip A1 and the circuit board A3 , the base 11 is attached to the chip A1 through the heat conduction layer A2 to increase the heat dissipation efficiency of the chip A1 . In addition, the air between the base 11 and the chip A1 is exhausted as much as possible to prevent the air from reducing the heat conduction performance between the base 11 and the chip A1 . As shown in FIG. 5 , the via hole 111 is in contact with the thermally conductive layer A2. By adjusting the stopper of the component 32 , the gas in the casing 31 (or the air cavity 313 and the air hole 314 ) will not flow into the heat conduction layer A2 or between the base 11 and the chip A1 through the exhaust opening 314c. Furthermore, by covering the connecting section 314a of the air hole 314 with the stopper element 33, the gas in the casing 31 (or the air cavity 313 and the air hole 314) can be further prevented from flowing into the heat conducting layer A2 or the base 11 through the exhaust opening 314c. and between chip A1. Therefore, when the adjustment element 32 is at the initial position, air will not enter between the base 11 and the chip A1 due to the remover 30 , and the heat dissipation efficiency of the chip A1 will not be greatly reduced.

As shown in FIGS. 3 and 6 , when the heat sink 1 is removed from the chip A1 , the clamping mechanism 20 can be removed first. Then the adjusting element 32 is rotated so that the adjusting element 32 moves toward the air hole 314 . At this time, by the push of the piston part 322, the gas in the air cavity 313 pushes the stopper element 33 and flows into the air hole 314, so that the gas in the housing 31 (or the air hole 314 and/or the air cavity 313) passes through the air hole 314 The exhaust opening 314c of the exhaust gas is discharged to the thermal conduction layer A2 or between the base 11 and the chip A1. Therefore, the gas entering between the base 11 and the chip A1 can reduce the adsorption force between the base 11 and the chip A1 , so that the user can easily remove the heat dissipation structure 10 from the chip A1 .

To sum up, the heat sink with removal function of the present invention helps the heat sink to be separated from the chip by providing a remover on the heat sink. When the heat dissipation structure is removed from the chip, the remover is rotated so that the remover provides gas between the chip and the heat dissipation structure, so as to reduce the adsorption force between the chip and the heat dissipation structure. Therefore, it is easier for the user to remove the heat sink from the chip.

The present invention meets the requirements of an invention patent, and a patent application is filed according to law. However, the above are only preferred embodiments of the present invention, and the scope of the present invention is not limited to the above-mentioned embodiments, and all equivalent modifications or changes made according to the spirit of the present invention by those who are familiar with the art of this case should be Covered in the scope of the following patent applications.

1: Radiator 10: Heat dissipation structure 11: base 111: through hole 12: Cooling element 20: clamping mechanism 21: Rod 22: side elastic element 30: remover 31: shell 311: subject 311a: protrusion 312: cover body 313: air cavity 313a: first section 313b: second section 314: stomata 314a: Connecting segments 314b: storage section 314c: Exhaust opening 32: Adjustment element 321: rotating part 322: Piston 323: the first sealing ring 33: stop element 34: elastic element 35: Second sealing ring A1: chip A2: Thermal conduction layer A3: circuit board A4: Chassis A41: Bottom plate A5: spacer element D1: Arrangement direction

FIG. 1 is a perspective view of a heat sink with a removal function according to an embodiment of the present invention. FIG. 2 is an exploded view of a radiator with a removal function according to an embodiment of the present invention. FIG. 3 is a cross-sectional view of a heat sink with a removal function according to an embodiment of the present invention. Fig. 4 is an exploded view of a stripper according to an embodiment of the present invention. FIG. 5 is an enlarged cross-sectional view of a heat sink with a dismounting function according to an embodiment of the present invention, wherein the adjustment element is located at an initial position. FIG. 6 is an enlarged cross-sectional view of a heat sink with a dismounting function according to an embodiment of the present invention, wherein the adjusting element is in a pushing position.

none

1: Radiator 10: Heat dissipation structure 11: Base 111: through hole 12: Cooling element 20: clamping mechanism 21: Rod 22: side elastic element 30: remover A1: chip A2: Thermal conduction layer A3: circuit board A4: Chassis A41: Bottom plate A5: spacer element D1: Arrangement direction

Claims (10)

A heat sink with removal function, comprising: A heat dissipation structure, comprising a base, and a heat dissipation element disposed on the base, and a through hole passing through the base; and a remover, comprising: A housing, arranged on the base and covering the through hole, wherein the housing has an air cavity and an air hole connected to the air cavity, wherein the air hole communicates with the through hole or is located in the through hole; as well as an adjustment element, movably arranged in the above-mentioned air cavity; Wherein, the gas in the casing is discharged through the air hole by moving the adjustment element. The heat sink with a detachable function as described in claim 1, wherein the above-mentioned base is used for attaching to a chip via a heat-conducting layer, Wherein the through hole is in contact with the heat conduction layer, and the gas in the casing is discharged to the heat conduction layer through the air hole by moving the adjustment element. The radiator with removal function as described in claim 2 further includes: a clamping mechanism, arranged on the above-mentioned base, and used for connecting to a circuit board; Wherein the clamping mechanism is used to clamp the chip between the circuit board and the base. The radiator with a dismounting function as described in claim 3, wherein the above-mentioned clamping mechanism includes: a rod passing through the base and connected to the circuit board; and The elastic element on one side is sheathed on the above-mentioned rod and abuts against the above-mentioned base. The heat sink with removal function according to claim 1, wherein the air hole includes a connection section connected to the air cavity, an accommodating section connected to the connection section, and an accommodating section connected to the accommodating section an exhaust opening of , wherein said stripper further comprises: A stopper element is movably disposed in the accommodating section; and An elastic element is arranged in the accommodating section, and exerts an elastic force on the above-mentioned stop element, so that the above-mentioned stop element covers the above-mentioned connection section, Wherein, when the adjustment element moves toward the air hole, the gas in the air cavity pushes the stop element to move toward the exhaust opening. The radiator with a dismounting function as described in claim 5, wherein the housing further includes a main body and a cover connected to the main body, wherein the air cavity and the air hole are located in the main body, and the exhaust opening Located in the above-mentioned cover body. The radiator with a dismounting function as claimed in claim 6, wherein the cover and the exhaust opening are located in the through hole. The radiator with removal function according to claim 5, wherein the diameter of the above-mentioned stopper element is larger than the diameter of the above-mentioned exhaust opening and the diameter of the above-mentioned connection section, wherein the diameter of the above-mentioned stopper element, the diameter of the above-mentioned exhaust opening The diameter is measured in the same direction as the diameter of the aforementioned connection section. The heat sink with removal function according to claim 1, wherein the air cavity includes a first section and a second section connected to the air hole, and the adjustment element includes: a rotating part screwed to the inner wall of the first section; and a piston portion contacting the inner side wall of the second section, Wherein, when the rotating part is rotated, the piston part moves toward the air hole. The radiator with a dismounting function as claimed in claim 1, wherein the through hole is located at the center of the base, and the housing extends perpendicular to the base and is connected to the inner wall of the through hole.

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