TWI791130B - Housing assembly for biological temperature control electronic product - Google Patents
Housing assembly for biological temperature control electronic product Download PDFInfo
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- TWI791130B TWI791130B TW108134292A TW108134292A TWI791130B TW I791130 B TWI791130 B TW I791130B TW 108134292 A TW108134292 A TW 108134292A TW 108134292 A TW108134292 A TW 108134292A TW I791130 B TWI791130 B TW I791130B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
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Abstract
Description
本發明關於一種能以生物控溫的電子產品的殼體組件,特別是關於一種具有生物控溫熱交換功能的電子產品的殼體組件。 The invention relates to a shell assembly of an electronic product capable of biological temperature control, in particular to a shell assembly of an electronic product with a heat exchange function of biological temperature control.
隨著半導體製程技術的進步,手機與平板等電子產品愈做愈薄,功能愈來愈多,且內載APP容量愈來愈大。此外,使用者對網速的要求也愈來愈高。伴隨而生之問題在於如何有效逸散半導體元件(例如CPU)運作時產生的熱量,以維繫半導體裝置之順暢作動。 With the advancement of semiconductor manufacturing technology, electronic products such as mobile phones and tablets are getting thinner and thinner, with more and more functions, and the built-in APP capacity is getting larger and larger. In addition, users have higher and higher requirements for network speed. The accompanying problem is how to effectively dissipate the heat generated during the operation of the semiconductor device (such as CPU), so as to maintain the smooth operation of the semiconductor device.
一般電子產品(例如手機、平板、筆電、桌電等)之電子基板,均會在線路板的上、下端面作塗佈封膠,藉以防止因濕氣氧化線路而影響半導體作動,但也因此讓半導體作動衍生之熱度無法有效散熱,只能靠半導體本身之承受熱度來消解。緣此,有業者在半導體之頂部接緣設置散熱膜來散熱,或有業者在半導體熱源之附近空間架設吸輻射熱片、冷凝管、熱導棒、熱導管且將冷凝管、熱導棒、熱導管延伸到機體內的低溫帶,俾讓半導體熱度傳至機體內低溫帶來勻熱。此外,高端手機更使用合金機身來加強機體內熱輻射之導熱。 The electronic substrates of general electronic products (such as mobile phones, tablets, laptops, desktops, etc.) will be coated with glue on the upper and lower end surfaces of the circuit boards to prevent the semiconductor movement from being affected by the oxidation of the circuits by moisture. Therefore, the heat generated by the operation of the semiconductor cannot be effectively dissipated, and can only be dissipated by the heat of the semiconductor itself. For this reason, some operators set up a heat dissipation film on the top edge of the semiconductor to dissipate heat, or some operators set up a heat-absorbing fin, condensation pipe, heat conduction rod, and heat pipe in the space near the semiconductor heat source and place the condensation pipe, heat conduction rod, heat sink The conduit extends to the low temperature zone inside the body, so that the heat of the semiconductor can be transferred to the low temperature inside the body to bring uniform heat. In addition, high-end mobile phones use alloy body to enhance the heat conduction of heat radiation inside the body.
然而,輕薄且體積短小是電子產品的趨勢。由於電子產品(特別是手機與平板)要求薄化,所以設在電子產品內部的散熱元件也需要縮減為超薄尺寸。但尺寸縮減之散熱元件將不能提供有效的熱傳導,導致散熱效能無法提升。 再者,手機/平板的半導體基板多為封膠處理,機體內部又為密室狀態,透氣對流極為有限,對於快速上昇的熱輻射幾無有效的解決方案。具體而言,手機與平板的內部常會產生積熱情事,負面影響作動效率且常會產生熱當的缺失,嚴重時將造成半導體晶片因過度積熱而熱衰、機體燙手、及電池過熱損壞。縱使目前高端手機配置了金屬機身與上述的熱導件,但因半導體大多處於密室狀,散熱不足,所以,仍無法使半導體作動於密室中的積熱現象得以緩解。尤其,手機已由4G時代已進入5G時代,數據顯示5G晶片耗電約為4G晶片之2.5倍,密室積熱非常快,上述現象更為嚴重。此外,有一些高端手機的半導體元件在運作時會產生較高的熱量,因而,需要在機體內部配置中殼體用以防止高熱直接透過外殼體導出而可能燙傷使用者,然而,由於中殼體沒有配置導热體,造成內部積熱幾乎無法外洩,嚴重影響作動效率。 However, it is the trend of electronic products to be thin, light and small. Since electronic products (especially mobile phones and tablets) are required to be thinner, the heat dissipation elements inside the electronic products also need to be reduced to an ultra-thin size. However, the size-reduced cooling element will not be able to provide effective heat conduction, resulting in that the cooling performance cannot be improved. Furthermore, the semiconductor substrates of mobile phones/tablets are mostly sealed with glue, and the inside of the body is in a closed room state, with extremely limited ventilation and convection, and there are few effective solutions for the rapidly rising heat radiation. To be specific, heat build-up often occurs inside mobile phones and tablets, which negatively affects operating efficiency and often produces a lack of heat. In severe cases, it will cause heat failure of semiconductor chips due to excessive heat accumulation, body heat, and battery overheating damage. Even though the current high-end mobile phones are equipped with a metal body and the above-mentioned thermal conductors, because most of the semiconductors are in the shape of a closed room, the heat dissipation is insufficient, so the heat accumulation phenomenon of the semiconductor operating in the closed room cannot be alleviated. In particular, mobile phones have entered the 5G era from the 4G era. According to data, the power consumption of 5G chips is about 2.5 times that of 4G chips. In addition, the semiconductor components of some high-end mobile phones will generate high heat during operation. Therefore, it is necessary to configure a middle casing inside the body to prevent high heat from being directly exported through the outer casing, which may scald the user. However, due to the middle casing There is no heat conductor, which makes it almost impossible for the internal heat to leak out, which seriously affects the operating efficiency.
緣此,本發明目的即在提供一種能以生物控溫的電子產品的殼體組件,其適用在符合目前各種手機、平板或穿戴裝置等電子產品的外殼體及中殼體上,讓電子產品機體內部的熱源(例如半導體元件)產生的輻射積熱可經由該殼體組件快速地導出,而達到控溫效果,以維持半導體件元件的正常運作。 For this reason, the purpose of the present invention is to provide a shell assembly of electronic products that can be controlled biologically, which is suitable for the outer shell and middle shell of various current electronic products such as mobile phones, tablets, or wearable devices, so that electronic products can Radiation accumulated heat generated by a heat source (such as a semiconductor element) inside the body can be rapidly dissipated through the casing component to achieve a temperature control effect and maintain the normal operation of the semiconductor element.
依據本發明之能以生物控溫的電子產品的殼體組件包含一外殼體及一外導熱片。該電子產品具有一機體,該機體的內部具有至少一熱源。該外殼體結合於該機體上且包含相對的內表面與外表面及貫穿該內、外表面的至少一孔洞。該外導熱片與該外殼體結合且包含相對的內端面與外端面,該外導熱片的內端面係面向該電子產品的熱源,該外導熱片更包含至少一傳熱部,該至少一傳熱部對應該外殼體的至少一孔洞,使得一使用者可以透過該孔洞接觸該至少一傳熱部。According to the present invention, the shell assembly of the electronic product capable of biological temperature control includes an outer shell and an outer heat conducting sheet. The electronic product has a body, and the inside of the body has at least one heat source. The outer casing is combined with the body and includes opposite inner and outer surfaces and at least one hole passing through the inner and outer surfaces. The outer heat conduction sheet is combined with the outer casing and includes opposite inner end surfaces and outer end surfaces, the inner end surface of the outer heat conduction sheet is facing the heat source of the electronic product, and the outer heat conduction sheet further includes at least one heat transfer portion, the at least one heat transfer portion The heat part corresponds to at least one hole of the outer casing, so that a user can touch the at least one heat transfer part through the hole.
在一實施例中,該電子產品為手機、平板、筆電、wifi中繼機、LED燈具、太陽能聯電盒、太陽能逆變器與穿戴裝置中的其一,該外殼體由塑膠材料製成,該外導熱片由金屬材料製成,該至少一傳熱部由自該外端面向外凸出的一凸部構成且嵌入在該外殼體的至少一孔洞中。In one embodiment, the electronic product is one of a mobile phone, a tablet, a laptop, a wifi repeater, an LED lamp, a solar power unit, a solar inverter, and a wearable device, and the outer casing is made of plastic material. The outer heat conducting sheet is made of metal material, and the at least one heat transfer portion is formed by a protrusion protruding outward from the outer end surface and embedded in at least one hole of the outer casing.
在一實施例中,該至少一傳熱部由自該內端面向外凸出的一凸部構成。In one embodiment, the at least one heat transfer portion is formed by a convex portion protruding outward from the inner end surface.
在一實施例中,該外導熱片上設有複數小孔,該複數小孔中被注入塑膠,使得該外導熱片的周圍被包覆在該外殼體內以形成一體結合。In one embodiment, the outer heat conduction sheet is provided with a plurality of small holes, and plastic is injected into the plurality of small holes, so that the periphery of the outer heat conduction sheet is wrapped in the housing to form an integral combination.
在一實施例中,該外導熱片的周圍設有凸緣,該外導熱片的外端面設有複數凸粒,該外導熱片的凸緣與凸粒係熔合於該外殻體使得該外導熱片係熔接在該外殼體的內表面。In one embodiment, a flange is provided around the outer heat conduction sheet, and a plurality of bumps are provided on the outer end surface of the outer heat conduction sheet, and the flanges and bumps of the outer heat conduction sheet are fused to the outer casing so that the outer heat conduction sheet The heat conducting sheet is welded on the inner surface of the outer casing.
在一實施例中,該至少一孔洞包含複數孔洞且配置在鄰近該外殼體的側邊。In one embodiment, the at least one hole includes a plurality of holes and is disposed adjacent to a side of the outer casing.
在一實施例中,該殼體組件更包含一結合於該電子產品之機體內部的中殼體及一結合於該中殼體的內導熱片,該中殼體包含相對的內表面與外表面及貫穿該內、外表面的一孔洞,該內導熱片對應該熱源且位在該外導熱片與該熱源之間,該內導熱片與該中殼體結合且包含一傳熱部,該內導熱片的傳熱部對應該中殼體的孔洞。In one embodiment, the casing assembly further includes a middle casing combined inside the body of the electronic product and an inner heat conducting sheet combined with the middle casing, the middle casing includes opposite inner and outer surfaces and a hole running through the inner and outer surfaces, the inner heat conduction sheet corresponds to the heat source and is located between the outer heat conduction sheet and the heat source, the inner heat conduction sheet is combined with the middle housing and includes a heat transfer part, the inner heat conduction sheet The heat transfer portion of the heat conduction sheet corresponds to the hole in the housing.
本發明之殼體組件在實施上,係可完全不用更改電子產品(例如手機、平板、筆電、wifi路由器、wifi室外中繼機、太陽能聯電盒、逆變器、LED燈泡、投射燈等)的內部結構,而只需將該電子產品的外殼體(或包含中殼體)更換為具有同型式或同尺寸之本發明的殼體組件,就能將該電子產品機體內的輻射熱有效導至機體外,達成高速導熱與散熱效果。具體而論,該殼體組件的導熱片可將電子產品內部之熱源所產生的輻射熱快速吸收,同時由傳熱部向殻體外輻射散熱,使得半導體作動於密室中的積熱現象得以緩解。再者,使用者可以透過皮膚(含手指)接觸傳熱部,讓熱源產生的輻射熱快速導出,達到人體生物控溫的導熱及散熱效果。此外,本發明之殼體組件更可應用於為保護電池在低溫狀態會關機的電子產品(如手機、穿戴/智能裝置),藉由導熱片與手指或皮膚之接觸,讓人體溫度可藉由導熱片導熱且輻射入機體內,形成密室升溫以避免電池在低溫狀態關機。 In the implementation of the housing assembly of the present invention, there is no need to change electronic products (such as mobile phones, tablets, laptops, wifi routers, wifi outdoor repeaters, solar power boxes, inverters, LED bulbs, projection lights, etc.) The internal structure of the electronic product, and only need to replace the outer casing (or the middle casing) of the electronic product with the casing assembly of the present invention of the same type or size, the radiant heat in the body of the electronic product can be effectively guided to Outside the body, high-speed heat conduction and heat dissipation are achieved. Specifically, the heat conduction sheet of the housing component can quickly absorb the radiant heat generated by the heat source inside the electronic product, and at the same time radiate heat from the heat transfer part to the outside of the housing, so that the heat accumulation phenomenon of the semiconductor operating in the closed chamber can be alleviated. Furthermore, the user can touch the heat transfer part through the skin (including fingers), so that the radiant heat generated by the heat source can be quickly exported to achieve the heat conduction and heat dissipation effect of human biological temperature control. In addition, the casing assembly of the present invention can be applied to electronic products (such as mobile phones, wearable/smart devices) that will shut down in order to protect the battery in a low temperature state. By contacting the heat conduction sheet with fingers or skin, the body temperature can The heat conduction sheet conducts heat and radiates into the body, forming a closed room to heat up to prevent the battery from shutting down in a low temperature state.
關於本發明之其它目的、優點及特徵,將可由以下較佳實施例的詳細說明並參照所附圖式來了解。 Other objectives, advantages and features of the present invention will be understood from the following detailed description of the preferred embodiments with reference to the accompanying drawings.
10:殼體組件 10: Housing components
12:外殼體 12: Outer shell
12a:中殼體 12a: Middle shell
14:外導熱片 14: Outer heat conduction sheet
14a:內導熱片 14a: Inner heat conduction sheet
16:基板 16: Substrate
18:熱源 18: heat source
20:內表面 20: inner surface
22:外表面 22: Outer surface
24、24a:孔洞 24, 24a: holes
26:內端面 26: inner end face
28:外端面 28: Outer end face
30:傳熱部 30:Heat transfer department
30a:傳熱部 30a: heat transfer part
32:外側 32: outside
36:小孔 36: small hole
37:周圍 37: Around
38:凸緣 38: Flange
40:凸粒 40: convex grain
42:LED燈具 42: LED lamps
44:機體 44: Body
46:中繼機 46: Repeater
48:機體 48: Body
50:聯電盒 50:Connection box
52:機體 52: Body
54:逆變器 54:Inverter
56:機體 56: body
58:手錶 58: watch
60:機體 60: Body
62:錶蓋 62: watch cover
圖1係本發明第一實施例之能以生物控溫的電子產品的殼體組件的分解圖。 FIG. 1 is an exploded view of a casing assembly of an electronic product capable of biological temperature control according to a first embodiment of the present invention.
圖2顯示圖1之殼體組件的立體圖。 FIG. 2 shows a perspective view of the housing assembly of FIG. 1 .
圖3顯示圖1之殼體組件的剖視圖。 FIG. 3 shows a cross-sectional view of the housing assembly of FIG. 1 .
圖4顯示圖1之殼體組件實施於手機的示意圖。 FIG. 4 shows a schematic diagram of implementing the housing assembly of FIG. 1 in a mobile phone.
圖5係本發明第二實施例之能以生物控溫的電子產品的殼體組件的分解圖。 FIG. 5 is an exploded view of a housing assembly of an electronic product capable of biological temperature control according to a second embodiment of the present invention.
圖6顯示圖5之殼體組件的剖視圖。 FIG. 6 shows a cross-sectional view of the housing assembly of FIG. 5 .
圖7係與圖3類似的剖視圖,顯示本發明第三實施例之殼體組件。 Fig. 7 is a cross-sectional view similar to Fig. 3, showing the housing assembly of the third embodiment of the present invention.
圖8係與圖3類似的剖視圖,顯示本發明第四實施例之殼體組件。 Fig. 8 is a cross-sectional view similar to Fig. 3, showing the housing assembly of the fourth embodiment of the present invention.
圖9至圖12係本發明第五至第八實施例之殼體組件的立體示意圖。 9 to 12 are three-dimensional schematic diagrams of the housing components of the fifth to eighth embodiments of the present invention.
圖13顯示使用者的手指接觸圖9之傳熱部的使用狀態示意圖。 FIG. 13 is a schematic view showing a user's finger touching the heat transfer part of FIG. 9 in use.
圖14顯示使用者的手指接觸圖12之傳熱部的使用狀態示意圖。 FIG. 14 is a schematic view showing a user's finger touching the heat transfer part of FIG. 12 in use.
圖15係本發明一實施例之殼體組件實施於燈具的示意圖。 Fig. 15 is a schematic diagram of a housing assembly implemented in a lamp according to an embodiment of the present invention.
圖16係本發明一實施例之殼體組件實施於中繼機的示意圖。 FIG. 16 is a schematic diagram of implementing a housing assembly in a repeater according to an embodiment of the present invention.
圖17係本發明一實施例之殼體組件實施於聯電盒的示意圖。 Fig. 17 is a schematic diagram of implementing a housing assembly in an electrical connection box according to an embodiment of the present invention.
圖18係本發明一實施例之殼體組件實施於逆變器的示意圖。 FIG. 18 is a schematic diagram of implementing a case assembly in an inverter according to an embodiment of the present invention.
圖19係本發明一實施例之殼體組件實施於穿戴裝置的示意圖。 FIG. 19 is a schematic diagram of a housing component implemented in a wearable device according to an embodiment of the present invention.
圖20顯示圖19之穿戴裝置的分解圖。 FIG. 20 shows an exploded view of the wearable device of FIG. 19 .
圖21顯示圖19之穿戴裝置的剖視圖。 FIG. 21 shows a cross-sectional view of the wearable device in FIG. 19 .
圖22係本發明一實施例之殼體組件實施於手機的示意圖。 Fig. 22 is a schematic diagram of a housing assembly implemented in a mobile phone according to an embodiment of the present invention.
圖23顯示圖22之電子產品的剖視圖。 FIG. 23 shows a cross-sectional view of the electronic product in FIG. 22 .
圖24顯示圖22之中殼體的剖視圖。 FIG. 24 shows a cross-sectional view of the housing in FIG. 22 .
圖25係與圖24類似的剖視圖,顯示中殼體的另一實施例。 Fig. 25 is a sectional view similar to Fig. 24, showing another embodiment of the middle housing.
現將僅為例子但非用以限制的具體實施例,並參照所附圖式就本發明之技術內容說明如下:本發明的能以生物控溫的電子產品的殼體組件可應用在例如手機、平板、筆電、wifi路由器、投影儀、小型攝影機、LED燈具、太陽能聯電盒、太陽能逆變器、穿戴裝置(如智能手錶、智能眼鏡)等電子產品上。圖1至圖4顯示本發明第一實施例之能以生物控溫的電子產品的殼體組件10,在本實施例中,該電子產品為一手機(或平板),該電子產品的機體(未圖示)內部具有一半導體基板16(見圖4),該基板16上具有至少一熱源18,當該電子產品作動時,該熱源18會產生輻射熱。
The specific embodiment is only an example but not limiting, and the technical content of the present invention is described as follows with reference to the attached drawings: The housing assembly of the electronic product that can control the biological temperature of the present invention can be applied to, for example, a mobile phone , tablets, laptops, wifi routers, projectors, small cameras, LED lamps, solar power boxes, solar inverters, wearable devices (such as smart watches, smart glasses) and other electronic products. 1 to 4 show a
該殼體組件10包含結合在該電子產品之機體上的一外殼體12及一外導熱片14。該外殼體12可為例如塑膠或玻璃的低導熱材料製成且包含相對
的內表面20與外表面22及貫穿內、外表面20、22的至少一孔洞24。在本實施例中,該外殼體12上設有分隔的二孔洞24,其中一孔洞24對應該熱源18。該外導熱片14可為例如金屬的高導熱材料製成,該外導熱片14與外殼體12結合且包含相對的內端面26與外端面28。該外導熱片14的內端面26面向或對應電子產品的熱源18。該外導熱片14更包含與該至少一孔洞24對應的至少一傳熱部30,在本實施例中,該外導熱片14上設有分隔的二傳熱部30,各傳熱部30係由自外端面28向外凸出的一凸部構成且嵌入在該外殼體12的一對應的孔洞24中,使得各傳熱部30外露在該外殼體12的外表面22且該傳熱部30的周緣包覆在該外殼體12的厚度中。在本實施例中,各傳熱部30的外側32與該外殼體12的外表面22平齊(見圖3),且各傳熱部30由外導熱片14的內端面26凹陷形成。在可行的實施例中,各傳熱部30的外側32係凸出該外殼體12的外表面22(未圖示)。
The
在本實施例中,該外導熱片14係嵌合包覆在該外殼體12內。具體而論,該外殼體12為塑膠製成,該外導熱片14上設有複數呈錐狀的小孔36。在製造上,係將該外導熱片14置於一製造外殼體12的模具中,再注入塑膠在該複數小孔36中,使得該外導熱片14的傳熱部30嵌入外殼體12的孔洞24中且外導熱片14的周圍37被包覆在外殼體12內以形成一體的結合。
In this embodiment, the outer
在圖5與圖6的實施例中,該外導熱片14係熔接結合在塑膠製成之外殼體12的內表面20。具體而論,該外導熱片14的周圍37設有凸緣38,且該外導熱片14的外端面28設有複數呈尖銳狀的凸粒40。在製造上,係將該外導熱片14的外端面28面向該外殼體12的內表面20,且將該外導熱片14的傳熱部30嵌入該外殼體12的孔洞24中,再藉由高週波熔合該外導熱片14的凸緣38與凸粒40,使得該外導熱片14的凸緣38與凸粒40熔合到該外殼體12以形成一體結構。在可行的實施例中,外導熱片14的周圍37可延伸到外殼體12的內表面20周緣處,以擴大吸熱與散熱面積。
In the embodiment shown in FIG. 5 and FIG. 6 , the outer
圖7與圖8顯示本發明兩個可行實施例的殼體組件10。在圖7中,與孔洞24對應的各傳熱部30係由自內端面26向外凸出的一凸部構成,使得各傳熱部30可以更靠近熱源18或者甚至接觸熱源18。在圖8中,與孔洞24對應的各傳熱部30係由沒有凸出的平坦部分構成。再者,在圖7與圖8中,該外導熱片14係嵌合包覆在該外殼體12內,使得該外導熱片14的周圍37被包覆在外殼體12內以形成一體結合。在可行的實施例中,圖7與圖8中的外導熱片14可熔接結合在外殼體12的內表面20(如圖6所示)。
7 and 8 show two possible embodiments of the
圖9至圖12顯示本發明四個可行實施例的殼體組件10,該四個殼體組件10與第一實施例之殼體組件10的主要差異在於,該孔洞24與傳熱部30二者的形狀、數量以及配置位置。圖9顯示一手機外殼體12的上側與下側分別具有一個直向孔洞24與一個橫向孔洞24,圖10顯示一手機外殼體12的上側與下側分別具有一個T型孔洞24與一個橫向孔洞24,圖11顯示一平板外殼體12的兩側分別配置有兩個橢圓狀孔洞24,圖12顯示一平板外殼體12的兩側分別具有一個直向孔洞24。當複數孔洞24配置在鄰近該外殼體12的側邊或是周圍時,有利握持手機或平板的使用者可以透過皮膚(含手指)接觸傳熱部30,讓熱源18產生的輻射熱可經人體皮膚接觸傳熱而快速導出。
9 to 12 show four possible embodiments of the
本發明之殼體組件10在實施上,由於該外導熱片14鄰近或對應熱源18且該外導熱片14的傳熱部30與所對應的孔洞24對應連通,因而,在密封狀態或半密封狀態內之半導體熱源18所產生的輻射熱可由該外導熱片14快速吸收且均熱於電子產品密封空間的其他低溫區,並藉由孔洞24向殼體組件10外之大氣空間散熱,讓熱源18產生的輻射熱可快速導出。此外,當使用者操作手機或平板時,使用者握持手機或平板的手指可經由孔洞24接觸傳熱部30(見圖13與圖14),讓傳熱部30和人體形成熱交換效應,達成高速導熱及散熱,進而阻止或延緩機體內部的輻射升溫,讓機體內部的溫度停在略高於人體體溫。具體而論,熱
源18產生的溫度(例如60~120℃)可經由傳熱部30的導熱以及人體的生物控溫而降到38~40℃,以維持半導體件元件的正常運作,並保持機體內部溫度,不讓高溫損害電池。再者,本發明之導熱片14可進行高吸輻射熱、高導熱、高散熱、防氧化、絕緣及/或防靜電處理,藉以避免一般散熱使用的銅導管、銅導熱片、鍍銅石墨棒、泠凝銅管等所帶來的氧化及干擾電磁的負面作用。
In the implementation of the
本發明之殼體組件10除了可抑制半導體元件在機體內產生高溫外,亦可利用人體生物控溫逆向導熱到機體內,使得電子產品16處於低溫狀態時,而藉由生物控溫啟動開機。具體而論,一般電子產品或穿戴裝置(例如智能手錶或智能眼鏡)處於低溫狀態(例如低於10℃時),為保護電池通常需要強制關機。而本發明之殼體組件10在實施上,使用者的皮膚(含手指)可以透過孔洞24接觸傳熱部30,使得人體生物溫度經由該傳熱部30傳遞到電子產品的機體內而升溫,而啟動開機及作動。
The
圖15顯示本發明第九實施例之能以生物控溫的電子產品的殼體組件10,在本實施例中,該電子產品係一LED燈具42,該LED燈具42包含一機體44以及結合在機體44上的殼體組件10,該機體44內具有一基板16以及設在該基板16上的複數熱源18。該殼體組件10包含結合於該LED燈具42之機體44上的一外殼體12及一外導熱片14,該外殼體12上設有一孔洞24,該孔洞24對應該熱源18。該外導熱片14包含自外端面28向外凸出的一傳熱部30。該傳熱部30嵌入在該孔洞24中且外露在該外殼體12的外表面22,該外導熱片14的周圍37係一體地包覆在該外殼體12內。
FIG. 15 shows a
圖16顯示本發明第十實施例之能以生物控溫的電子產品的殼體組件10,在本實施例中,該電子產品係一wifi中繼機46,該中繼機46包含一機體48以及結合在機體48上的殼體組件10。該機體48內具有一基板16以及設在該基板16上的複數熱源18。該殼體組件10包含結合於該機體48的一外殼體12及一外
導熱片14,該外殼體12上設有一孔洞24,該孔洞24對應該熱源18。該外導熱片14包含自外端面28向外凸出的一傳熱部30。該傳熱部30嵌入在該孔洞24中且外露在該外殼體12的外表面22。
FIG. 16 shows a
圖17顯示本發明第十一實施例之能以生物控溫的電子產品的殼體組件10,在本實施例中,該電子產品係一太陽能聯電盒50,該聯電盒50包含一機體52及結合在機體52上的殼體組件10,該機體52內具有一基板16及設在基板16上的複數熱源18。該殼體組件10包含結合於該機體52上的一外殼體12及一外導熱片14,該外殼體12上設有對應該熱源18的一孔洞24。該外導熱片14包含自外端面28向外凸出的一傳熱部30。該傳熱部30嵌入在該孔洞24中且外露在該外殼體12的外表面22。
Fig. 17 shows the
圖18顯示本發明第十二實施例之能以生物控溫的電子產品的殼體組件10,在本實施例中,該電子產品係一太陽能逆變器54,該逆變器54包含一機體56以及結合在機體56上的殼體組件10,該機體56內具有一基板16以及設在基板16上的熱源18。該殼體組件10包含結合於機體56的一外殼體12及一外導熱片14,該外殼體12上設有對應該熱源18的一孔洞24。該外導熱片14包含自外端面28向外凸出的一傳熱部30。該傳熱部30嵌入在孔洞24中且外露在該外殼體12的外表面22,該外導熱片14的周圍係一體地包覆在外殼體12內。
Fig. 18 shows the
圖19至圖21顯示本發明第十三實施例之能以生物控溫的電子產品的殼體組件10,在本實施例中,電子產品係一智能手錶(穿戴裝置)58,該手錶58包含一機體60以及結合在機體60上的一錶蓋62與一殼體組件10,該機體60內具有一基板16以及設在基板16上的熱源18。該殼體組件10包含結合於該機體60的一外殼體12及一外導熱片14,該外殼體12上設有對應該熱源18的一環狀孔洞24。該外導熱片14包含一向外凸出的傳熱部30,該傳熱部30配置在鄰近該外導熱片14的周圍。該傳熱部30嵌入在孔洞24中且外露在該外殼體12的外表面22,
該外導熱片14的周圍37係一體地包覆在該外殼體12內。當使用者配戴該手錶58時,使用者的皮膚會接觸傳熱部30,讓熱源18產生的輻射熱快速導出,達到人體生物控溫的散熱效果。
Figures 19 to 21 show the
圖22至圖23顯示本發明第十四實施例之能以生物控溫的電子產品的殼體組件10,在本實施例中,該殼體組件10包含一結合於該電子產品之機體外部的外殼體12、一結合於該外殼體的外導熱片14、一結合於該電子產品之機體內部的中殼體12a、及一結合於該中殼體12a的內導熱片14a。該電子產品的機體(未圖示)內部具有一半導體基板16,該基板16上具有至少一熱源18。本實施例之外殼體12與外導熱片14的結構分別與圖3所示的外殼體12與外導熱片14結構類似,不再說明。該中殼體12a包含相對的內表面20與外表面22及貫穿該內、外表面20、22的一孔洞24a(見圖24),孔洞24a與該熱源18以及該外導熱片14對應。該內導熱片14a與該中殼體12a結合且包含相對的內端面26與外端面28以及自內端面26向外凸出的一傳熱部30a,該傳熱部30a鄰近或對應熱源18,且傳熱部30a嵌入該中殼體12a的孔洞24a中。在本實施例中,各傳熱部30a係由內導熱片14a的外端面28凹陷所形成,且傳熱部30a的周緣包覆在該中殼體12a的厚度中(見圖24)。
Figures 22 to 23 show the
依據圖22與23的殼體組件10在實施上,該中殼體12a與該外殼體12係可直接用來更換既有手機的中殼體與外殼體,使得原機體內部的結構完全不用更改。再者,由於該內導熱片14a鄰近或對應熱源18且位在該外導熱片14與該熱源18之間,因而,在密封狀態或半密封狀態內之半導體熱源18所產生的輻射熱可由該內導熱片14a快速吸收且均熱於電子產品密封空間的其他低溫區,並藉由外導熱片14向外殼體10外側之大氣空間散熱,讓熱源18產生的輻射熱可快速導出。此外,當使用者操作手機或平板時,使用者握持手機或平板的手指可接觸外導熱片14的傳熱部30,讓傳熱部30和人體形成熱交換效應,達成高速導
熱及散熱的效果。
According to the implementation of the
在圖24的實施例中,該內導熱片14a係一體地嵌合包覆在該中殼體12a內(類似圖3所示的嵌合包覆結構)。在圖25的實施例中,該內導熱片14a係熔接結合在該中殼體12a而形成一體結構(類似圖6所示的熔合結構)。
In the embodiment of FIG. 24 , the inner
在前述說明書中,本發明僅是就特定實施例做描述,而依本發明的特徵仍可有多種變化或修改。是以,對於熟悉此項技藝人士可作之明顯替換與修改,仍將併入於本發明所主張的專利範圍之內。 In the foregoing specification, the present invention is only described in terms of specific embodiments, and there may still be various changes or modifications according to the features of the present invention. Therefore, obvious replacements and modifications that can be made by those skilled in the art will still be incorporated within the patent scope claimed by the present invention.
10:殼體組件10: Housing components
12:外殼體12: Outer shell
14:外導熱片14: Outer heat conduction sheet
20:內表面20: inner surface
22:外表面22: Outer surface
24:孔洞24: hole
26:內端面26: inner end face
28:外端面28: Outer end face
30:傳熱部30:Heat transfer department
32:外側32: outside
36:小孔36: small hole
37:周圍37: around
Claims (8)
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