TWI786037B - Integrated loudspeaker device having an acoustic chamber containing sound adsorber material - Google Patents
Integrated loudspeaker device having an acoustic chamber containing sound adsorber material Download PDFInfo
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本發明係關於聲學裝置之領域且特定言之本發明係關於具有吸音材料之小型揚聲器裝置,吸音材料整合於該揚聲器裝置之外殼之後置容積部分內。 The present invention relates to the field of acoustic devices and in particular the invention relates to a small loudspeaker device with sound-absorbing material integrated in the rear volume of the housing of the speaker device.
在聲學技術中,習知的係:將一吸音材料放置於一揚聲器裝置之一後置容積中以就實際而言聲學地擴大後置容積。在具有一實體上較小之後置容積之一揚聲器裝置中,一吸音材料將該揚聲器裝置之諧振頻率降低至類似於具有一實體上較大之後置容積之一揚聲器裝置之一值。 In acoustic technology, it is known to place a sound-absorbing material in a rear volume of a loudspeaker device to acoustically enlarge the rear volume in practical terms. In a speaker device with a physically smaller rear volume, a sound absorbing material lowers the resonant frequency of the speaker device to a value similar to that of a speaker device with a physically larger rear volume.
更具體而言,安置於一揚聲器裝置之後置容積中之吸音材料改良其聲音特性,例如寬頻性能及揚聲器之視在聲學容積。吸音材料之實例包含沸石材料、沸石基材料、二氧化矽(SiO2)、氧化鋁(Al2O3)、氧化鋯(ZrO3)、氧化鎂(MgO)、四氧化三鐵(Fe3O4)、分子篩、富勒烯(fullerene)、奈米碳管及活性碳或木炭。與活性碳不同,沸石材料及沸石基材料係電隔離。由於沸石材料及沸石基材料不導電,所以沸石材料及沸石基材料不會影響併入具有此一吸音材料之一揚聲器裝置之一裝置之電組 件(例如,天線、電池、內部電子產品等等)。此外,若非導電性沸石材料或沸石基材料在該裝置內變得鬆弛,則非導電性沸石材料或沸石基材料將不會引起短路。另外,沸石材料及沸石基材料之封裝比活性碳編織物之情況中容易得多。 More specifically, sound-absorbing materials placed in the rear volume of a speaker device improve its sound characteristics, such as broadband performance and the apparent acoustic volume of the speaker. Examples of sound-absorbing materials include zeolite materials, zeolite-based materials, silicon dioxide (SiO 2 ), aluminum oxide (Al 2 O 3 ), zirconia (ZrO 3 ), magnesium oxide (MgO), ferric oxide (Fe 3 O 4 ), molecular sieves, fullerenes, carbon nanotubes and activated carbon or charcoal. Unlike activated carbon, zeolite materials and zeolite-based materials are electrically insulating. Since zeolite materials and zeolite-based materials are not electrically conductive, zeolite materials and zeolite-based materials will not affect electrical components (e.g., antennas, batteries, internal electronics, etc.) incorporated into a device such as a speaker device having such a sound-absorbing material . Furthermore, the non-conductive zeolite material or zeolite-based material will not cause a short circuit if the non-conductive zeolite material or zeolite-based material becomes relaxed within the device. In addition, encapsulation of zeolite materials and zeolite-based materials is much easier than in the case of activated carbon weaves.
在將由粉末、鬆散顆粒、鬆散微粒組成或至少包括粉末、鬆散顆粒、鬆散微粒之吸音材料插入或放置於揚聲器裝置之後置容積中時會產生一問題。另外,一小型揚聲器(諸如放置於行動電話、耳機等等中之一揚聲器裝置)之後置容積通常受包圍揚聲器之直接物理區域中之其他電路組件約束,且有時後置容積之形狀較為複雜且不符合聲學需求。一習知技術使用包裝一吸音材料之管,但此等管通常不良好配合於具有一複雜形狀之一後置容積。將吸音材料直接插入後置容積中在實踐上可較困難。另外,若吸音材料未牢固封裝,則其可進入揚聲器裝置以及使用揚聲器裝置之手持裝置之不同組件中,且因此,損壞揚聲器裝置或包含揚聲器裝置作為一組件之手持裝置。 A problem arises when inserting or placing sound-absorbing materials consisting of or at least comprising powders, loose granules, loose granules in the rear volume of the loudspeaker device. In addition, the rear volume of a small speaker (such as a speaker device placed in a mobile phone, earphone, etc.) is usually constrained by other circuit components in the immediate physical area surrounding the speaker, and sometimes the shape of the rear volume is complex and Does not meet acoustic requirements. A known technique uses tubes that pack a sound-absorbing material, but these tubes usually do not fit well in a rear volume having a complex shape. Inserting sound absorbing material directly into the rear volume can be difficult in practice. In addition, if the sound absorbing material is not securely encapsulated, it can get into different components of the speaker device and the handheld device using the speaker device, and thus, damage the speaker device or the handheld device including the speaker device as a component.
美國申請案第13/818,374號(其全部內容以引用的方式併入本發明中)揭示包括一電聲學傳感器之一音訊系統或具有形成用以改良所發出之聲音之品質之一諧振容積之一外殼之揚聲器。申請案第13/818,374號中所揭示之音訊系統包括填充一揚聲器之諧振容積之一部分之一沸石顆粒材料或一實質上球狀沸石顆粒材料。沸石材料係一吸音材料,取決於材料之調配,該材料導致諧振空間之容積之一實際聲學擴大達1.5或更大之一因數。因此,包含沸石材料之揚聲器之外殼之容積可相較於填充空氣之一揚聲器之一外殼而變得較小。 U.S. Application No. 13/818,374 (the entire contents of which are incorporated herein by reference) discloses an audio system comprising an electroacoustic transducer or one of the resonance volumes having a resonance volume formed to improve the quality of the emitted sound The speaker of the shell. The audio system disclosed in application Ser. No. 13/818,374 includes a zeolite particulate material or a substantially spherical zeolite particulate material filling a portion of a resonant volume of a loudspeaker. The zeolite material is a sound-absorbing material which, depending on the formulation of the material, causes an actual acoustic expansion of the volume of the resonant space by a factor of 1.5 or more. Therefore, the volume of the enclosure of a speaker comprising zeolite material can be made smaller compared to the enclosure of an air-filled speaker.
用作為一小型揚聲器(諸如通常發現於今日之手持消費性電子裝置中 之類型)之後置容積內部之一吸音器之一沸石基材料之封裝已具挑戰性。儘管不具電損壞性,但若未適當地含於裝置內,則申請案第13/818,374號中所揭示之沸石材料可干擾一小型揚聲器及一手持消費性電子裝置內之其他組件之適當操作。此外,歸因於一小型揚聲器之後置容積內之通常受限之空間,可阻抗氣體交換且沸石基吸音器之效率可由設計限制減小。儘管該小型揚聲器之後置容積可完全填充一沸石基吸音器,但只要吸音表面積之一有限量曝露於由聲學傳感器移動引起之壓力變化,申請案第13/818,374號中所揭示之諧振頻率偏移就會受限。 Used as a small speaker such as is commonly found in today's hand-held consumer electronic devices The encapsulation of a zeolite-based material for a sound absorber inside the rear volume has been challenging. Although not electrically destructive, the zeolite materials disclosed in Application Serial No. 13/818,374 can interfere with the proper operation of a small speaker and other components within a handheld consumer electronic device if not properly contained within the device. Furthermore, due to the generally confined space within the volume behind a small speaker, gas exchange can be resisted and the efficiency of zeolite-based absorbers can be reduced by design constraints. Although the small loudspeaker rear volume can completely fill a zeolite-based absorber, as long as a limited amount of absorbing surface area is exposed to pressure changes caused by movement of the acoustic transducer, the resonant frequency shift disclosed in Application No. will be limited.
所揭示之發明係關於在接合時形成一聲學傳感器之一整合式聲學腔室之一行動裝置(諸如一揚聲器)之外殼元件。該聲學腔室具有一後置容積、一前置容積及由該聲學傳感器佔據之一容積。在該聲學腔室之後置容積部分中,大量吸音材料安置於由該聲學腔室之壁產生之一腔室內。使用具有低聲阻之一可透氣材料將包含吸音材料之該腔室自該聲學腔室之其餘部分密封。該可透氣材料將該吸音材料保持在其指定腔室中同時允許吸音材料與該聲學腔室之其餘部分之間發生氣體交換。 The disclosed invention relates to housing elements of a mobile device, such as a speaker, that when joined form an integrated acoustic chamber for an acoustic sensor. The acoustic chamber has a rear volume, a front volume and a volume occupied by the acoustic sensor. In the rear volume of the acoustic chamber, a mass of sound-absorbing material is arranged in a cavity created by the walls of the acoustic chamber. The chamber containing the sound absorbing material is sealed from the rest of the acoustic chamber using a breathable material with low acoustic resistance. The breathable material retains the sound absorbing material in its designated chamber while allowing gas exchange between the sound absorbing material and the remainder of the acoustic chamber.
根據本發明之一行動裝置之外殼之一實施例可包括:一印刷電路基板;及一護罩,其經組態以與該印刷電路基板配合以產生該行動裝置中之一聲學傳感器之外殼。在該實施例中,該護罩可包括:一腔室壁,其在與該印刷電路基板之一內表面接合時界定一實質上密封聲學腔室;一聲學傳感器(諸如一揚聲器或接收器),其安置於該聲學腔室內;一音埠,其聲學地耦合至該聲學傳感器;一內部腔室壁,其安置於該聲學腔室內且界定一後置容積;及大量吸音材料,其安置於該後置容積內。在該實施例中,一 可透氣構件機械地耦合至該腔室壁之一頂部部分及該內部腔室壁之一頂部部分,其中該可透氣構件將該吸音材料保持在該聲學腔室內之一界定容積中。此實施例之該可透氣構件具有低聲阻且可包括一羊絨材料或一網狀材料之一或多者,且該可透氣構件之材料之孔徑經調適以小於吸音顆粒之大小。該可透氣構件藉由膠黏、捲邊、衝壓、壓印、熱封或超音波焊接而機械地附接至該腔室壁之該頂部部分該內部腔室壁之該頂部部分。此實施例可進一步包括插置在該印刷電路基板與該腔室壁之該頂部部分之間之一腔室襯墊,其中該腔室襯墊之一厚度判定通過其促進氣體交換之一限制之大小。此外,此實施例可進一步包括插置在該聲學傳感器與安置於該護罩中之該音埠之間之一音埠襯墊,其中該音埠襯墊自該後置容積密封該前置容積。在此實施例中,在該聲學腔室中,該後置容積部分部分地填充具有至少300微米之一最小直徑之實質上球形吸音顆粒之沸石基材料。 An embodiment of a housing for a mobile device according to the present invention may include: a printed circuit substrate; and a shield configured to cooperate with the printed circuit substrate to create a housing for an acoustic sensor in the mobile device. In this embodiment, the shield may include: a chamber wall that, when engaged with an inner surface of the printed circuit substrate, defines a substantially sealed acoustic chamber; an acoustic sensor (such as a speaker or receiver) , which is disposed within the acoustic chamber; an acoustic port, which is acoustically coupled to the acoustic sensor; an inner chamber wall, which is disposed within the acoustic chamber and defines a rear volume; and a mass of sound-absorbing material, which is disposed within within the rear volume. In this example, a A breathable member is mechanically coupled to a top portion of the chamber wall and a top portion of the inner chamber wall, wherein the breathable member retains the sound absorbing material within a defined volume within the acoustic chamber. The breathable member of this embodiment has low acoustic resistance and may include one or more of a cashmere material or a mesh material, and the pore size of the material of the breathable member is adjusted to be smaller than the size of the sound-absorbing particles. The gas permeable member is mechanically attached to the top portion of the chamber wall to the top portion of the inner chamber wall by gluing, crimping, stamping, embossing, heat sealing or ultrasonic welding. This embodiment may further comprise a chamber liner interposed between the printed circuit substrate and the top portion of the chamber wall, wherein a thickness of the chamber liner is determined by a restriction by which it facilitates gas exchange. size. Additionally, this embodiment may further include an acoustic port gasket interposed between the acoustic sensor and the acoustic port disposed in the shroud, wherein the acoustic port gasket seals the front volume from the rearward volume . In this embodiment, in the acoustic chamber, the rear volume is partially filled with a zeolite-based material having substantially spherical sound-absorbing particles having a minimum diameter of at least 300 microns.
一行動裝置之一外殼之另一實施例可包括:一第一外殼元件,該第一外殼元件包括具有一印刷電路板,其具有電及機械地耦合至該印刷電路板之一聲學傳感器;及一第二外殼元件,其機械地耦合至該第一外殼元件以形成該行動裝置之該外殼。在此實施例中,該第二外殼元件可包括:一連續垂直元件,其在與該第一外殼元件之該印刷電路板接合時界定一實質上密封之聲學腔室;一音埠,其安置於聲學地耦合至該聲學傳感器(例如,一揚聲器或一接收器)之一傳感器空間中;一內部垂直元件,其安置於該聲學腔室中且與該連續垂直元件相交以界定一後置容積;大量吸音顆粒,其安置於該後置容積內;及一透聲材料,其機械地耦合至該連續垂直元件之一頂部部分及該內部垂直元件之一頂部部分,其中該透聲材料將該吸音顆粒保持在該聲學腔室內之一界定空間中。在此實施例中,該聲學傳 感器在該第一外殼元件及該第二外殼元件耦合在一起時佔據該傳感器空間。在此實施例中,該聲學腔室之該後置容積部分部分地填充具有含至少200微米之一最小直徑(或在另一實施例中,至少350微米之一最小直徑)之實質上球形顆粒之一沸石基吸音顆粒。此實施例可包括插置在該印刷電路板與該連續垂直元件之該頂部部分之間之一腔室襯墊,其中該腔室襯墊之一厚度判定通過其促進氣體交換之一限制之大小。在此實施例中,該透聲材料可藉由膠黏或超音波焊接而機械地附接至該連續垂直元件之該頂部部分及該內部垂直元件之該頂部部分。 Another embodiment of a housing for a mobile device may include: a first housing element comprising a printed circuit board having an acoustic sensor electrically and mechanically coupled to the printed circuit board; and A second housing element is mechanically coupled to the first housing element to form the housing of the mobile device. In this embodiment, the second housing element may include: a continuous vertical element defining a substantially sealed acoustic chamber when engaged with the printed circuit board of the first housing element; In a sensor space acoustically coupled to the acoustic sensor (e.g., a speaker or a receiver); an internal vertical element disposed in the acoustic chamber and intersecting the continuous vertical element to define a rear volume a plurality of sound-absorbing particles disposed within the rear volume; and a sound-transmitting material mechanically coupled to a top portion of the continuous vertical element and a top portion of the inner vertical element, wherein the sound-transmitting material Sound-absorbing particles are held in a defined space within the acoustic chamber. In this embodiment, the acoustic A sensor occupies the sensor space when the first housing element and the second housing element are coupled together. In this embodiment, the rear volume of the acoustic chamber is partially filled with substantially spherical particles having a minimum diameter of at least 200 microns (or in another embodiment, a minimum diameter of at least 350 microns) One of the zeolite-based sound-absorbing particles. This embodiment may include a chamber liner interposed between the printed circuit board and the top portion of the continuous vertical element, wherein a thickness of the chamber liner determines the size of a restriction by which gas exchange is facilitated . In this embodiment, the acoustically transparent material may be mechanically attached to the top portion of the continuous vertical element and the top portion of the inner vertical element by gluing or ultrasonic welding.
在此實施例之一變化形式中,該內部垂直元件可包括一開口,其經組態以促進該吸音顆粒之氣體交換,其中該開口可包括具有實質上相同於機械地耦合至該連續垂直元件之該頂部部分及該內部垂直元件之該頂部部分之該透聲材料之聲阻之一材料,且安置於該內部垂直元件之該開口中之該此材料可包括一羊絨材料或一網狀材料之一或多者。在一進一步變化形式中,該內部垂直元件可包括一開口,其經組態以促進該吸音顆粒之氣體交換,其中該開口可包括具有不同於機械地耦合至該連續垂直元件之該頂部部分及該內部垂直元件之該頂部部分之該透聲材料之一聲阻之一材料。在一些實施例中,安置於該內部垂直元件之該開口中之該材料可包括一可透氣材料,其可包括經設定大小以將該吸音顆粒保持在該後置容積中之一界定區域中之多個孔徑。在一些實施例中,該外殼可包括插置在該聲學傳感器與安置於該第二外殼元件中之該音埠之間之一音埠襯墊,其中該音埠襯墊經組態以在將該第一外殼元件與該第二外殼元件接合時自該後置容積密封該音埠。 In a variation of this embodiment, the inner vertical element may include an opening configured to facilitate gas exchange of the sound-absorbing particles, wherein the opening may include a material having substantially the same mechanical coupling to the continuous vertical element. A material of the sound resistance of the sound-transmitting material of the top portion and the top portion of the inner vertical element, and the material disposed in the opening of the inner vertical element may include a cashmere material or a mesh material one or more. In a further variation, the inner vertical element may include an opening configured to facilitate gas exchange of the sound-absorbing particles, wherein the opening may include a top portion having a different mechanical coupling to the continuous vertical element and A material of acoustic resistance of the sound-transmissive material of the top portion of the inner vertical element. In some embodiments, the material disposed in the opening of the inner vertical element may include a breathable material that may include particles sized to retain the sound absorbing particles in a defined area in the rear volume. Multiple apertures. In some embodiments, the housing can include an acoustic port liner interposed between the acoustic sensor and the acoustic port disposed in the second housing element, wherein the acoustic port liner is configured to The first housing element seals the sound port from the rear volume when engaged with the second housing element.
一行動裝置之一外殼之另一實施例可包括:一第一外殼元件,該第 一外殼元件包括一印刷電路板,其具有電及機械地耦合至該印刷電路板之一聲學傳感器(例如,揚聲器或接收器);及一第二外殼元件,其機械地耦合至該第一外殼元件以形成該行動裝置之該外殼。該第二外殼可包括:一連續垂直元件,其在與該第一外殼元件之該印刷電路板接合時界定一實質上密封之聲學腔室;一音埠,其安置於聲學地耦合至該聲學傳感器之一傳感器空間;一內部垂直元件,其安置於該聲學腔室中且與該連續垂直元件相交以界定一後置容積。在此實施例中,該內部垂直元件可包括:一開口,其經組態用於氣體交換;一低聲阻嵌件,其完全覆蓋該開口;大量吸音顆粒,其安置於該後置容積內;一透聲材料,其機械地耦合至該連續垂直元件之一頂部部分及該內部垂直元件之一頂部部分,其中該透聲材料將該吸音顆粒保持在該聲學腔室內之一界定空間中。此實施例亦可包括插置在該印刷電路板與該連續垂直元件之該頂部部分及該內部垂直元件之該頂部部分之間之一腔室襯墊。在此實施例中,該聲學傳感器在該第一外殼元件及該第二外殼元件耦合在一起時佔據該傳感器空間。在一些實施例中,該內部垂直元件中之該低聲阻嵌件及該透聲材料各包括一羊絨材料或一網狀材料之一或多者。此外,在一些實施例中,該聲學腔室之該後置容積部分部分地填充具有含至少300微米之一最小直徑及900微米之一最大直徑之實質上球形顆粒之一沸石基吸音顆粒。 Another embodiment of a casing of a mobile device may include: a first casing element, the first A housing element includes a printed circuit board having an acoustic sensor (e.g., a speaker or receiver) electrically and mechanically coupled to the printed circuit board; and a second housing element mechanically coupled to the first housing components to form the casing of the mobile device. The second housing may include: a continuous vertical element defining a substantially sealed acoustic chamber when engaged with the printed circuit board of the first housing element; A sensor space for the sensor; an internal vertical element disposed in the acoustic chamber and intersecting the continuous vertical element to define a rear volume. In this embodiment, the inner vertical element may include: an opening configured for gas exchange; a low acoustic resistance insert completely covering the opening; a mass of sound-absorbing particles disposed within the rear volume an acoustically transparent material mechanically coupled to a top portion of the continuous vertical element and a top portion of the inner vertical element, wherein the acoustically transparent material retains the sound absorbing particles in a defined space within the acoustic chamber. This embodiment may also include a cavity liner interposed between the printed circuit board and the top portion of the continuous vertical element and the top portion of the inner vertical element. In this embodiment, the acoustic sensor occupies the sensor space when the first housing element and the second housing element are coupled together. In some embodiments, the low acoustic resistance insert and the acoustically transparent material in the inner vertical member each comprise one or more of a cashmere material or a mesh material. Furthermore, in some embodiments, the rear volume of the acoustic chamber is partially filled with zeolite-based sound absorbing particles having substantially spherical particles having a minimum diameter of at least 300 microns and a maximum diameter of 900 microns.
可依以下方式製造一行動裝置之外殼之實施例。在實質上已完成護罩之後,易於在針對吸音材料指定之聲學腔室之後置容積部分中接收該材料。量測大量吸音材料且將其裝載至一配劑漏斗中。該護罩定位於該配劑漏斗下面,且當將該吸音材料澆注至該聲學腔室之該後置容積之指定部分或若干指定部分時振動。若該後置容積具有多個腔室,則吸音材料量測步 驟及配劑步驟將視需要重複多次。在填充之後,該護罩振動多次以確保該吸音材料沉降至該聲學腔室之該指定部分或若干指定部分。接著,將一可透氣構件放置於該聲學腔室上且藉由膠黏、超音波焊接或其他技術而將其機械地附接至該聲學腔室。使一腔室襯墊與該聲學腔室之壁對準,且接著,將該印刷電路基板接合於該護罩,藉此完成該行動裝置之該聲學傳感器之該外殼。 An embodiment of a housing for a mobile device can be manufactured in the following manner. After the shroud has been substantially completed, it is easy to receive the material in the rear volume of the acoustic chamber designated for the sound absorbing material. A quantity of sound-absorbing material is measured and loaded into a dispensing hopper. The shroud is positioned below the dosing funnel and vibrates when the sound absorbing material is poured into the designated portion or portions of the rear volume of the acoustic chamber. If the rear volume has multiple chambers, the sound-absorbing material measurement step The steps and dispensing steps will be repeated as many times as necessary. After filling, the shroud is vibrated several times to ensure that the sound absorbing material settles to the designated portion or portions of the acoustic chamber. A gas permeable member is then placed over the acoustic chamber and mechanically attached to the acoustic chamber by gluing, ultrasonic welding, or other techniques. A chamber liner is aligned with the wall of the acoustic chamber, and then, the printed circuit board is bonded to the shroud, thereby completing the housing of the acoustic sensor of the mobile device.
可依以下方式製造一行動裝置之外殼之其他實施例。在實質上已完成護罩之後,易於在針對吸音材料指定之聲學腔室之後置容積部分中接收該材料。將一可透氣構件放置於將接收該吸音材料之該聲學腔室上且藉由膠黏、超音波焊接或其他技術而將其機械地附接至該聲學腔室。量測大量吸音材料且將其裝載至一配劑漏斗中。該護罩定位於該配劑漏斗下面,且當透過與安置於該護罩中之一裝填埠對準之一配劑漏斗將該吸音材料澆注至該聲學腔室之該後置容積之指定部分或若干指定部分時振動。若該後置容積具有多個腔室,則吸音材料量測步驟及配劑步驟將視需要重複多次。在填充之後,該護罩振動多次以確保該吸音材料沉降至該聲學腔室之該指定部分或若干指定部分。使一腔室襯墊與該聲學腔室之壁對準,且接著,將該印刷電路基板接合於該護罩,藉此完成該行動裝置之該聲學傳感器之該外殼。 Other embodiments of a housing for a mobile device can be fabricated in the following manner. After the shroud has been substantially completed, it is easy to receive the material in the rear volume of the acoustic chamber designated for the sound absorbing material. A breathable member is placed over the acoustic chamber that will receive the sound absorbing material and is mechanically attached to the acoustic chamber by gluing, ultrasonic welding, or other techniques. A quantity of sound-absorbing material is measured and loaded into a dispensing hopper. The shroud is positioned below the dosing funnel, and the sound-absorbing material is poured into a designated portion of the rear volume of the acoustic chamber through a dosing funnel aligned with a fill port disposed in the shroud or several specified sections. If the rear volume has multiple chambers, the sound-absorbing material measuring step and the compounding step will be repeated as many times as necessary. After filling, the shroud is vibrated several times to ensure that the sound absorbing material settles to the designated portion or portions of the acoustic chamber. A chamber liner is aligned with the wall of the acoustic chamber, and then, the printed circuit board is bonded to the shroud, thereby completing the housing of the acoustic sensor of the mobile device.
將自以下說明書結合以下圖式明白所揭示之發明之其他特徵及優點。 Other features and advantages of the disclosed invention will become apparent from the following description combined with the following drawings.
10:揚聲器裝置 10:Speaker device
12:聲學傳感器 12: Acoustic sensor
13:上揚聲器外殼 13: Upper speaker housing
14:下揚聲器外殼 14: Lower speaker housing
15:虛線 15: dotted line
16:吸音袋 16: Sound-absorbing bag
17:後置容積 17: rear volume
18:可透氣壁 18: breathable wall
19:吸音材料 19: Sound-absorbing material
30:罩殼/聲學裝置 30: Enclosure/Acoustic Device
31:印刷電路板(PCB)殼體 31: Printed circuit board (PCB) housing
32:印刷電路板 32: Printed circuit board
33:護罩 33: shield
34:聲學傳感器 34: Acoustic sensor
35:後置容積 35: rear volume
36:傳感器接點 36: Sensor contact
37:腔室襯墊 37: Chamber liner
38:音埠襯墊 38: Sound port liner
39:音埠 39: sound port
40:前置容積 40: Front volume
41:腔室壁 41: chamber wall
42:可透氣構件附接點 42: Breathable member attachment point
43:可透氣構件 43: breathable components
44:內部腔室壁 44: Internal chamber wall
45:側突片 45: side tabs
46:上突片 46: Upper tab
47:下突片 47: Lower tab
48:可透氣嵌件 48: breathable insert
49:通風孔 49: ventilation hole
50:壁開口 50: Wall opening
51:限制 51: limit
52:裝填埠 52: Loading port
53:裝填埠密封件 53: Fill port seal
A-A:截面線 A-A: section line
B-B:截面線 B-B: section line
S100:步驟 S100: step
S110:步驟 S110: step
S120:步驟 S120: step
S130:步驟 S130: step
S140:步驟 S140: step
S150:步驟 S150: step
S160:步驟 S160: Steps
S170:步驟 S170: step
S180:步驟 S180: Steps
S190:步驟 S190: step
S200:步驟 S200: Steps
S210:步驟 S210: step
S300:步驟 S300: Steps
S310:步驟 S310: step
S320:步驟 S320: step
S330:步驟 S330: step
S340:步驟 S340: step
S350:步驟 S350: Steps
S360:步驟 S360: Steps
S370:步驟 S370: Steps
S380:步驟 S380: Steps
S390:步驟 S390: Steps
S400:步驟 S400: Steps
S410:步驟 S410: step
S420:步驟 S420: step
併入且構成本說明書之一部分的附圖繪示本發明的實施例,且與「實施方式」一起用以解釋本發明之目的、優點及原理。在圖式中, 圖1係一聲學裝置內之用於安裝之一揚聲器裝置之一四分之三視圖;圖2係具有包含吸音材料之一第一實施例之圖1之揚聲器裝置之一縱向橫截面圖;圖3係具有包含吸音材料之一第二實施例之圖1之揚聲器裝置之一縱向橫截面圖;圖4係一聲學裝置之一縱向橫截面圖,其中該聲學裝置之一護罩及一印刷電路板提供圍封聲學傳感器之聲學腔室;圖5係一聲學裝置之一縱向橫截面圖,其中該聲學裝置之一護罩及一印刷電路板提供圍封聲學傳感器之聲學腔室及根據本發明之一第一實施例之吸音材料;圖6係一聲學裝置之一縱向橫截面圖,其中該聲學裝置之一護罩及一印刷電路板提供圍封聲學傳感器之聲學腔室及根據本發明之一第二實施例之吸音材料;圖7係根據本發明之一內部腔室壁之一第一實施例之一橫截面圖;圖8係根據本發明之一內部腔室壁之一第二實施例之一橫截面圖;圖9係一聲學裝置之一縱向橫截面圖,其中該聲學裝置之一護罩及一印刷電路板提供圍封聲學傳感器之聲學腔室及根據本發明之一第三實施例之吸音材料;圖10A及圖10B係用於製造一聲學裝置之一程序流程圖,其中該聲學裝置之一護罩及一印刷電路板提供圍封聲學傳感器之聲學腔室及根據本發明之一實施例之吸音材料;及圖11A及圖11B係用於製造一聲學裝置之一程序流程圖,其中該聲學裝置之一護罩及一印刷電路板提供圍封聲學傳感器之聲學腔室及根據本發 明之一實施例之吸音材料。 The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the present invention, and are used together with "implementation mode" to explain the purpose, advantages and principles of the present invention. In the schema, Fig. 1 is a three-quarter view of a loudspeaker device for installation in an acoustic device; Fig. 2 is a longitudinal cross-sectional view of the loudspeaker device of Fig. 1 having a first embodiment comprising a sound-absorbing material; Fig. 3 is a longitudinal cross-sectional view of the loudspeaker device of FIG. 1 having a second embodiment comprising a sound-absorbing material; FIG. 4 is a longitudinal cross-sectional view of an acoustic device with a shield and a printed circuit Board provides the acoustic cavity that encloses acoustic sensor; Figure 5 is a longitudinal cross-sectional view of an acoustic device, wherein a shield of the acoustic device and a printed circuit board provide an acoustic cavity that encloses the acoustic sensor and according to the present invention The sound-absorbing material of a first embodiment; Fig. 6 is a longitudinal cross-sectional view of an acoustic device, wherein a shield of the acoustic device and a printed circuit board provide an acoustic chamber enclosing the acoustic sensor and the acoustic chamber according to the present invention A sound-absorbing material of a second embodiment; Fig. 7 is a cross-sectional view of a first embodiment of an inner chamber wall according to the present invention; Fig. 8 is a second embodiment of an inner chamber wall according to the present invention A cross-sectional view of an example; Fig. 9 is a longitudinal cross-sectional view of an acoustic device, wherein a shield of the acoustic device and a printed circuit board provide an acoustic chamber enclosing an acoustic sensor and a third according to the present invention The sound-absorbing material of the embodiment; Fig. 10A and Fig. 10B are a flow chart of a process for manufacturing an acoustic device, wherein a shield of the acoustic device and a printed circuit board provide an acoustic chamber enclosing an acoustic sensor and according to the present invention One embodiment of the sound-absorbing material; and Figures 11A and 11B are flow charts of a process for manufacturing an acoustic device in which a shield and a printed circuit board of the acoustic device provide an acoustic chamber enclosing an acoustic sensor and According to this The sound-absorbing material of an embodiment of the invention.
熟習技術者應瞭解圖中之元件僅為簡單及簡明而繪示。吾人應進一步瞭解可依發生之一特定順序來描述或描繪某些動作及/或步驟,同時熟習技術者應理解相對於次序之特定性實際上不是必須的。亦應理解本文所使用之術語及表達具有根據此等術語及表達相對於其各自對應調查及研究範圍之一般意義,其中本文另有闡述之特定意義除外。 Those skilled in the art should understand that the components in the figure are only shown for simplicity and clarity. It should further be appreciated that certain actions and/or steps may be described or depicted in a particular order of occurrence, while those skilled in the art will understand that specificity with respect to order is not actually necessary. It should also be understood that the terms and expressions used herein have their ordinary meanings according to such terms and expressions relative to their respective scope of investigation and research, except where the specific meanings are otherwise set forth herein.
將參考附圖來提供所揭示之實施例之一詳細描述。 A detailed description of the disclosed embodiments will be provided with reference to the accompanying drawings.
儘管本發明易受諸多不同形式之實施例影響,但圖式展示(且如將詳細描述)本發明之較佳實施例,其中應瞭解本揭示內容被視為本發明之原理之一範例,且不意欲使本發明之廣泛態樣受限於所繪示之實施例。 While the invention is susceptible to embodiments in many different forms, the drawings show (and as will be described in detail) preferred embodiments of the invention, it being understood that this disclosure is considered an example of the principles of the invention, and It is not intended that the broad aspects of the invention be limited to the illustrated embodiments.
參考圖1及圖2,圖中繪示一揚聲器裝置10。揚聲器裝置10包括一上揚聲器外殼13、一下揚聲器外殼14,及一聲學傳感器12。使用緊固件、鎖定突片或一適合黏著劑使上揚聲器外殼13接合於下揚聲器外殼14。用以接合上揚聲器外殼13及下揚聲器外殼14之黏著劑宜不具有可影響後置容積中之吸音材料及影響其效率之任何排氣特性。當吸音材料19係內部地安置於揚聲器裝置10中時,虛線15指示揚聲器裝置中之吸音材料19的內部位置。上揚聲器外殼13包括一傳感器開口11,其允許自聲學傳感器12至裝置外部之空間的聲音傳播/氣流。圖1中未展示揚聲器裝置之其他元件,諸如電接點、襯墊及內部配接線。
Referring to FIG. 1 and FIG. 2 , a
參考圖2,圖中繪示封裝吸音材料19之一方法。「吸音材料」(如本文所使用)指稱申請案第13/818,374號中所揭示之沸石材料,但可視需要使用其他吸音材料。如圖2中沿截面線A-A所展示,揚聲器裝置10之後置
容積17在聲學傳感器12周圍延伸且延伸至其中安置吸音袋16之後置容積的內部部分中。申請案第14/003,217號(其全部內容以引用的方式併入本發明中)中揭示一種使用一袋圍封吸音材料19之技術。如申請案第14/003,217號中所揭示,吸音袋16經製造以配合於後置容積之內部輪廓,且吸音袋16之一側包括具有促進後置容積與吸音袋16之內部容積之間之氣體交換之一低聲阻之一可透氣材料。該可透氣材料亦必須將吸音材料19保持在袋之內部腔室內。吸音袋16之其餘側係由相對透氣或具有一高聲阻之一材料製造。吸音袋16經定位使得氣體交換透過該可透氣材料而發生於吸音材料19與後置容積17之間。
Referring to FIG. 2 , one method of encapsulating the sound-absorbing
參考圖3,圖中繪示將吸音材料19保持在揚聲器裝置10之後置容積內的另一方法。如圖3中沿截面線A-A所展示,替代一吸音袋16,一可透氣壁18係安置於後置容積17內。可透氣壁18係由突片、凸緣或適合黏著劑保持在後置容積17內之其位置中。若使用一黏著劑,則該黏著劑宜不具有可影響後置容積中之吸音材料及影響其吸收能力的任何排氣特性。可透氣壁18可包括一打孔或蝕刻聚丙烯材料、具有低聲阻之一網狀材料、一濾波器材料,或具有一低聲阻之其他可透氣材料。如圖3中所展示,吸音材料19係保持在與聲學傳感器12之位置相對的後置容積17的一部分中。
Referring to FIG. 3 , another method of retaining the sound-absorbing
如圖2及圖3中所展示,透過放置於吸音材料19與後置容積17之間的一可透氣材料來促進吸音材料19與後置容積17之間的氣體交換。然而,如圖2及圖3中所展示,位於與後置容積之介面處(即緊鄰於該可透氣材料)之吸音材料19將在吸音材料19遠離後置容積介面之前吸收或解吸氣體。即使吸音材料19係一顆粒(而非小得多的微粒),吸音材料19將聲阻呈現至通過該可透氣材料之氣體。此聲阻引起最接近後置容積介面之吸音材料19
更多與氣體交換相互作用,而離該可透氣材料更遠之吸音器可具有較少相互作用。氣體交換中之此不均勻相互作用可引起吸音材料19之效率降低(若通過吸音材料之路徑太長/太窄)。
As shown in FIGS. 2 and 3 , gas exchange between the sound-absorbing
參考圖4,圖中描繪安置於由一音訊裝置之護罩33及印刷電路板32界定之一實質上密封之聲學腔室中之一聲學傳感器34之一實施例。在本申請案之內文中,一音訊裝置包含具有一音訊功能(諸如語音訊息、音樂或其他聲音檔案之重放)之任何類型之電子裝置,諸如一音樂播放器、行動電話等等。由於吸音材料可增強麥克風元件之頻率響應,所以亦包含具有一麥克風之音訊裝置。在圖4中,該實質上密封之聲學腔室由印刷電路板32、具有連續垂直元件(也即腔室壁41)之護罩33及插置在腔室壁41之頂部部分與印刷電路板32之頂部部分之間之腔室襯墊37界定。在一些實施例中,腔室壁41係一連續壁,且由射出模製塑膠形成或由金屬加工。替代具有其自身之上揚聲器外殼殼體及下揚聲器外殼殼體之一完整揚聲器單元,圖4中所展示之實施例依賴於提供揚聲器外殼之印刷電路板32及護罩33。通常,對於此類型之揚聲器組態,直至音訊裝置之印刷電路板32及護罩33接合才完成揚聲器。
Referring to FIG. 4, one embodiment of an
音埠39允許聲音傳播至由印刷電路板32及護罩33及腔室襯墊37形成之腔室外部之環境。聲學傳感器34經由安置於印刷電路板32與聲學傳感器34之間的傳感器接點36電及機械地耦合至印刷電路板32。焊料或其他導電材料可用以將聲學傳感器34電及機械地耦合至印刷電路板32。替代地,聲學傳感器34可具有被推進抵靠印刷電路板32以提供電連續性之彈簧接點。聲學傳感器34經由傳感器接點36自印刷電路板32接收電信號。
聲學傳感器34由音埠襯墊38自音埠39及護罩33之內表面間隔。音埠
襯墊38將實質上密封之聲學腔室分為一前置容積40及一後置容積35。前置容積40係可透過音埠39存取且由音埠襯墊38、音埠襯墊38內之護罩33之內表面之部分及面向音埠39之聲學傳感器34之部分定界之容積。實質上密封之聲學腔室之後置容積35由音埠襯墊38外部之護罩33之內表面之部分、腔室壁41之內表面、腔室襯墊37及腔室襯墊37內之印刷電路板32之內表面之部分定界。印刷電路板32之其他部分機械地耦合至護罩33以抵靠腔室壁41之頂部部分壓縮腔室襯墊37,及抵靠音埠39之區域中之聲學傳感器34及護罩33之內表面壓縮音埠襯墊38。腔室襯墊37及音埠襯墊38之壓縮實質上密封聲學傳感器34之聲學腔室。如所熟知,後置容積35改良聲學傳感器(在此例項中係一揚聲器)之操作。圖4中展示歸因於透過傳感器接點36接收之電信號之聲學傳感器34之移動期間自聲學傳感器34之後側至後置容積35中之氣流。
圖4亦描繪一罩殼30及一PCB殼體31,其中罩殼30安裝於護罩33上且PCB殼體31安裝於印刷電路板32上。罩殼30及PCB殼體31係音訊裝置之選用組件,且通常包含覆蓋護罩33及印刷電路板32之美學原因。更具體而言,護罩33可具有分模線、緊固件埠或美學上不令人愉悅之加工線,且罩殼30附接至護罩33以掩蓋該等製造人為誤差。類似地,PCB殼體31安裝在印刷電路板32上以覆蓋配接線、電跡線及其他製造人為誤差。
FIG. 4 also depicts a
參考圖5,圖中描繪安置於具有一吸音材料19之一實質上密封之聲學腔室中之一聲學傳感器34之一實施例,該實質上密封之聲學腔室由一音訊裝置之印刷電路板32及護罩33界定。圖5之實施例之大多數結構特徵相同於圖4中展示之結構特徵。在圖5中展示之實施例中,後置容積35現由大量吸音材料19、內部垂直元件(也即內部腔室壁44)及在由內部腔室壁44、腔室壁41及可透
氣構件43界定之容積內包含吸音材料19之可透氣構件43佔據。可透氣構件43機械地耦合或附接至腔室壁41之頂部部分及內部腔室壁44之頂部部分上之可透氣構件附接點42。可透氣構件43僅覆蓋將接收吸音材料19之該實質上密封之聲學腔室(即後置容積35)之該等部分。該實質上密封之聲學腔室之其他部分(諸如聲學傳感器位於其中之部分)將不覆蓋有可透氣構件43。這允許在無需移除可透氣構件43或干擾吸音材料19之情況下修復及更換聲學傳感器34。腔室襯墊37覆蓋機械地耦合或附接至腔室壁41之頂部部分之可透氣構件43之部分。
Referring to FIG. 5, there is depicted an embodiment of an
儘管圖5僅揭示將包含吸音材料19之一單一後置容積35,但可預期後置容積35可包括由腔室壁41、護罩33及印刷電路板32界定之整個實質上密封之聲學腔室內之多個腔室類型區域。吾人可進一步預期該實質上密封之聲學腔室內之此等多個腔室類型區域之各者將由可透氣構件43、較佳地由經組態以覆蓋所有腔室類型區域之一單件式可透氣構件43覆蓋。吾人亦可預期取決於由腔室壁41、護罩33及印刷電路板32界定之實質上密封之聲學腔室之總體設計,亦可獲取多個可透氣構件43。另外,覆蓋包含吸音材料19之多個腔室之一可透氣構件43將不覆蓋指定為由聲學傳感器佔據之聲學腔室中之容積以促進聲學傳感器34之修復或更換。
Although FIG. 5 only discloses a single
如圖2中所展示,包含一吸音材料19之一吸音袋16可用於此類型之揚聲器組態中,其中揚聲器外殼模製為或係一音訊裝置之外殼之一整合式部分。吸音袋16之一限制係:後置容積35之角(如圖4及圖5中所展示)將不具有安置於其中之任何聲音材料。此係歸因於吸音袋16中固有之製造限制。更具體而言,九十度角無法模製為吸音袋16且亦需要後置容積35中之適當袋放置之一些容限,且因此少量後置容積35不接收吸音材料19。由於
吸音材料19之填充埠將可見於一音訊裝置之外殼上,且美學上不令可能裝置購買者愉悅,所以圖3中所展示之其他方法將不適合於此類型之揚聲器組態,其中揚聲器外殼模製為或係該音訊裝置之外殼之一整合式部分。此外,存在一危險:音訊裝置之定期日常使用將引起填充端口上方之密封件偏移原位或破裂,藉此允許吸音材料漏出。
As shown in Figure 2, a
圖5中展示在歸因於透過傳感器接點36接收電信號而移動聲學傳感器34期間自聲學傳感器34之後側至後置容積35之氣流。在操作期間,聲學傳感器34在後置容積35中產生壓力,且此壓力引起與吸音材料19發生氣體交換。可透氣構件43促進後置容積35與吸音材料19之間的此氣體交換。較佳地,吸音材料19係如美國申請案第14/818,374號(其全部內容以引用的方式併入)所揭示之一鬆散沸石顆粒材料。更佳地,該鬆散沸石顆粒材料(用作為吸音材料19)係實質上球形且具有100微米或更大之一直徑範圍。該鬆散沸石顆粒材料因其易於在製造本文所揭示之類型之一聲學裝置中使用而係較佳的。亦可使用其他類型之吸音材料(諸如沸石粉末或活性炭),但可不太易於在製造程序中使用。
The air flow from the rear side of the
如技術中已知,聲音或氣體通過一材料之能量可與聲阻(即以MKS瑞(MKS rayl)為單位量測)一起描述。對於圖5中展示之實施例,可透氣構件43應具有低於可透氣構件43後面之一通常容積大小(在此情況中係1立方厘米)之一特定臨限值之一聲阻(通常為260 MKS瑞)。若開口較小,則選擇待用作為可透氣構件43之材料可引起開口處之聲阻超過260 MKS瑞臨限,藉此導致較差聲學效能。更具體而言,若超過260 MKS瑞臨限,則阻礙後置容積中之氣體到達吸音材料19。因此,若選擇一羊絨材料用作為可透氣構件43,則必須小心不超過260 MKS瑞臨限,尤其若限制51較小。
對於一些實施例,羊絨材料係一非均質材料,且更具體而言,係由具有一未界定圖案之尼龍纖維製成之一平層材料。羊絨材料之目的係保持吸音材料19,且允許氣體與吸音材料19相互作用。羊絨材料之結構及材料中之任何孔徑使得吸音材料19(呈粉末形式、微粒形式或顆粒形式)無法通過羊絨材料。
As is known in the art, the energy of sound or gas passing through a material can be described together with the acoustic resistance (ie, measured in MKS rayl). For the embodiment shown in FIG. 5, the air
替代地,一網狀材料可用於可透氣構件43。在一些實施例中,不同於羊絨材料,明確界定網狀材料之表面結構及材料結構。例如,適合於用作為可透氣構件43之一層網狀材料可具有115微米之一標稱厚度、130微米之一孔徑大小及每平方厘米8.5 MKS瑞之一聲阻。如同羊絨材料,網狀材料之目的係保持吸音材料19,且允許氣體與吸音材料19相互作用。網狀材料之結構及材料中之任何孔徑使得吸音材料19(呈粉末形式、微粒形式或顆粒形式)無法通過網狀材料。一聲學工程師具有相對於網狀材料之較寬設計緯度,此係由於網狀材料之聲阻較低且係一已知量。
Alternatively, a mesh material may be used for the
可透氣構件43可藉由膠黏、捲邊、衝壓、壓印、熱封或較佳地藉由超音波焊接而耦合至腔室壁41之頂部部分及內部腔室壁44之頂部部分上之可透氣構件附接點42。超音波焊接之一優點係一一致及可靠黏著劑形成於可透氣構件43與腔室壁41之頂部部分及內部腔室壁44之頂部部分之間,其中可透氣構件43係一羊絨或網狀材料。超音波焊接引起材料熔合,由此當將材料熔合在一起時形成一堅固機械接合。通常,超音波焊接軟化網狀材料中之纖維,但不使纖維熔化。超音波焊接技術確保包括可透氣構件43之材料固定地緊固於腔室壁41之頂部部分及內部腔室壁44之頂部部分,藉此防止吸音材料19之任何洩漏同時仍允許氣體與吸音材料19相互作用。
The gas
將可透氣構件43用於保持吸音材料19之另一特徵係可在不會干擾或丟失吸音材料19之情況下修復或更換聲學傳感器34。將可透氣構件43牢固附接至腔室壁41之頂部部分及內部腔室壁44之頂部部分防止吸音材料19自其指定容積漏出。
Another feature of using the
如圖5中所展示,限制51係內部腔室壁44之頂部部分與印刷電路板32之內表面之間的通路。限制51之大小基於腔室襯墊37之厚度。較佳地,腔室襯墊37之厚度係0.3毫米,但其他厚度可用以調整限制51之高度。
As shown in FIG. 5 ,
在圖5中所展示之實施例中,內部腔室壁44由一固體材料(較佳地射出模製塑膠或加工金屬)形成。在圖2及圖3中所展示之揚聲器實施例中,吸音材料19之有限量之表面積曝露可影響吸音材料19之效能。更具體而言,由於接近聲學傳感器之氣流較高且壁處之後置容積之遠端處之氣流較低,所以更遠離促進吸音材料19與後置容積之間的氣體交換之可透氣材料之吸音材料19不經歷相同於接近可透氣構件之吸音材料19之量之氣流/氣體速度。此係歸因於由接近後置容積形成之聲學彈簧及自身將一特定量之聲阻呈現至推動至由吸音材料19佔據之容積中之氣體之吸音材料19。此外,氣體交換必須流動通過內部腔室壁44之頂面與印刷電路板32之間的限制51。若聲阻變得太小,則限制51亦可呈現額外聲阻。
In the embodiment shown in FIG. 5, the
圖5中所展示之實施例僅具有PCB殼體31,而非罩殼30。在此實施例中,護罩33之外表面已經拋光,以將一美學上令人愉悅之表面呈現至裝置購買者,且因此罩殼30係外來的。歸因於印刷電路板32之電跡線而呈現PCB殼體31。
The embodiment shown in FIG. 5 has only a
參考圖6,圖中描繪經安置於具有一吸音材料19之一實質上密封之聲學腔室中之一聲學傳感器34之另一實施例,該實質上密封之聲學腔室係由
一音訊裝置之印刷電路板32及護罩33界定。圖6之實施例之大多數結構特徵相同於圖5中展示之結構特徵。在圖6中展示之實施例中,後置容積35現係由大量吸音材料19、一內部腔室壁44及在由內部腔室壁44、腔室壁41及可透氣構件43界定之容積內包含吸音材料19的可透氣構件43佔據。可透氣構件43經機械地耦合或附接至腔室壁41之頂部部分及內部腔室壁44之頂部部分上的可透氣構件附接點42。可透氣構件43僅覆蓋將接收吸音材料19之該實質上密封之聲學腔室(即後置容積35)的該等部分。該實質上密封之聲學腔室的其他部分(諸如聲學傳感器34位於其中之部分)將不覆蓋有可透氣構件43。這允許在無需移除可透氣構件43或干擾吸音材料19的情況下,修復及更換聲學傳感器34。腔室襯墊37覆蓋經機械地耦合或附接至腔室壁41之頂部部分之可透氣構件43的部分。
Referring to FIG. 6, another embodiment of an
在護罩33中,展示一裝填埠52。裝填埠52係位於護罩33之底面中,且在填充吸音材料19之後置容積35的部分與護罩33的外部之間提供一埠。裝填埠52係用以促進用於將一特定類型之吸音材料19裝載至後置容積中之一特殊技術。裝填埠52覆蓋有一裝填埠密封件53。裝填埠密封件53可係由一箔或薄膜材料製成,且可自黏。用於吸音材料19附近之任何黏著劑不應不利地影響吸音材料之效能。護罩33之外部上之裝填埠52的部分宜具有圍繞其直徑之容納裝填埠密封件53之一埋頭腔穴或環,且因此裝填埠密封件53係與護罩33之外表面齊平。裝填埠之大小宜係直徑為至少1.5毫米。圖6繪示兩個裝填埠52,一個位於護罩33之底面中,且一個位於腔室壁41中,在實際實踐中,僅將使用一個裝填埠52。裝填埠52之位置將取決於若干因數,諸如護罩33之設計、經指定以包含吸音材料19之後置容積區域之實體複雜性,及使用其他組件來填充護罩33及插置在吸音
材料19之製造次序。不同於圖5中所展示之實施例,圖6中之實施例包括一罩殼30,此係由於護罩33可具有分模線、緊固件埠或美學上不令人愉悅之加工線,且護罩33可具有含需要被覆蓋之一裝填埠密封件53之一裝填埠52。
In the
儘管圖5及圖6僅揭示將包含吸音材料19之一單一後置容積35,但可預期後置容積35可包括由腔室壁41、護罩33及印刷電路板32界定之整個實質上密封之聲學腔室內的多個腔室類型區域。吾人可進一步預期該實質上密封之聲學腔室內之此等多個腔室類型區域之各者將係由可透氣構件43、宜由經組態以覆蓋所有腔室類型區域之一單件式可透氣構件43覆蓋。吾人亦可預期取決於由腔室壁41、護罩33及印刷電路板32界定之實質上密封之聲學腔室的總體設計,亦可獲取多個可透氣構件43。另外,覆蓋包含吸音材料19之多個腔室之一可透氣構件43將不覆蓋指定為由聲學傳感器佔據之聲學腔室中的容積,以促進聲學傳感器34的修復或更換。
Although FIGS. 5 and 6 only disclose a single
圖6中所展示之實施例具有PCB殼體31及罩殼30。在此實施例中,即使護罩33之外表面可經拋光以將一美學上令人愉悅之表面呈現至裝置購買者,若裝填埠52經安置使得其穿透護罩33之外表面,則存在一危險:裝填埠密封件53可被損壞或偏移原位,吸音材料19可被污染或可自後置容積洩漏出去。因此,罩殼30保護裝填埠密封件53且將一美學上令人愉悅之表面提供至裝置購買者。歸因於印刷電路板32之電跡線而呈現PCB殼體31。
The embodiment shown in FIG. 6 has a
圖7及圖8係沿截面線B-B之聲學裝置30之視圖。參考圖7,一壁開口50設置於內部腔室壁44中。在壁開口50中,提供一上突片46、側突片45及一下突片47。此等突片可為一長件固體材料(如圖7中所展示)或可為實
質上佔據相同於圖7中所展示之該長件固體材料之空間之一系列突片。突片45、46、47可為射出模製塑膠、加工金屬或其他適合材料。一可透氣嵌件48安置於壁開口50中,且由上突片46、側突片45及下突片47保持在該位置中。可透氣嵌件48將吸音材料19保持在由腔室壁41、內部腔室壁44及可透氣構件43定界之腔室中。可透氣嵌件48亦擴展吸音材料19之曝露表面積之量。因此,氣體交換透過可透氣構件43及可透氣嵌件48發生,藉此改良吸音材料19之效率。可透氣嵌件48可相同於由上文所討論之用於可透氣構件43之材料製造,且應具有低於可透氣構件43之所建立之臨限值之以MKS瑞為單位之一聲阻。
7 and 8 are views of the
參考圖8,圖中展示可透氣嵌件48之另一實施例。在此實施例中,蝕刻、衝壓或以其他方式加工一不透氣材料以具有複數個通風孔49。通風孔49經設定大小以防止吸音材料19通過通風孔,同時允許後置容積35與吸音材料19之間的氣體交換發生。較佳地,聚丙烯箔用以產生可透氣嵌件48。存在聚丙烯箔係可透氣嵌件48之一理想材料之若干原因。聚丙烯箔在其老化時不會變得易碎,其高度抵抗具損害性之紫外光,且其抵抗來自若干類型之化學物質之損害。一般而言,聚丙烯箔具有小於1gram/cm3之一非常低密度且大多數箔抗高達攝氏140度之熱。亦可使用諸如Kapton®之相似材料。通風孔49可經形成呈多種幾何形狀及大小,只要通風孔49不超過一預定聲阻臨限值(較佳地係260 MKS瑞)。
Referring to Figure 8, another embodiment of a
參考圖9,本文所繪示之實施例基於圖7及圖8中所展示之內部腔室壁44實施例。腔室襯墊37已經擴展以包含安置於內部腔室壁44之頂部部分與印刷電路板32之間的一部分。由於壁開口50及可透氣嵌件48允許後置容積35與吸音材料19之間的氣體之交換,腔室襯墊37之額外部分閉合沿
印刷電路板32之聲學路徑,且將氣體路由至壁開口50。雖然看起來可透氣構件43現係多餘的,但若需要修復或更換聲學傳感器34仍需要將吸音材料19保持在其界定容積中。
Referring to FIG. 9 , the embodiment depicted herein is based on the
參考圖10A至圖10B,圖中揭示一種用於製造具有一揚聲器外殼作為其殼體之一整合式部分之一音訊裝置之方法。較佳地,儘管亦設想該音訊裝置之手動裝配,但使用最大效率之電腦控制製造設備來實施製造方法。更具體而言,製造程序之描述假定經歷裝配之音訊裝置已被放置在沿一裝配軌跡移動該音訊裝置穿過各種電腦控制裝配站之一裝配載體中。可存在未在該製造方法中描述之其他步驟,諸如插置在襯墊或製造電連接件。然而,此等類型之步驟通用於製造程序且不為本發明之部分。 Referring to FIGS. 10A-10B , there is disclosed a method for manufacturing an audio device having a speaker housing as an integral part of its housing. Preferably, the manufacturing method is carried out using computer-controlled manufacturing equipment with maximum efficiency, although manual assembly of the audio device is also envisaged. More specifically, the description of the manufacturing process assumes that an audio device undergoing assembly has been placed in an assembly carrier that moves the audio device along an assembly trajectory through various computer-controlled assembly stations. There may be other steps not described in this manufacturing method, such as interposing pads or making electrical connections. However, these types of steps are common to the manufacturing process and are not part of the present invention.
參考圖10A及圖10B,將描述具有一揚聲器外殼作為其殼體之一整合式部分之一音訊裝置之製造方法之一實施例。在步驟S100中,將護罩33放置於一裝配載體中,且使配劑漏斗與護罩33之後置容積35對準。在製造程序之此階段中,經裝配之音訊裝置定位於一裝配載體中,且較佳地,該裝配載體助於配劑漏斗與護罩33中之後置容積35之對準。替代地,可手動使配劑漏斗與護罩33中之後置容積35對準。配劑漏斗之目的係確保吸音材料之所有經量測之劑量進入護罩33中之後置容積35。較佳地,具有一實質上球形形狀之一沸石材料用作為吸音材料,且此沸石材料之形式較佳地用於填充一閉合護罩33之後置容積。在聲學裝置之製造程序之此階段中,假定無其他組件需要安裝在護罩33中,聲學傳感器34除外。雖然可在將吸音材料19放置在後置容積35中之後添加額外組件,但存在干擾或污染吸音材料19之一風險。
Referring to FIGS. 10A and 10B , one embodiment of a method of manufacturing an audio device having a speaker housing as an integral part of its housing will be described. In step S100 , the
在步驟S110中,將一預定數量之吸音材料裝載至配劑漏斗。基於設
計者希望達成之所要聲學效應而判定將裝載至護罩33中之後置容積35之吸音材料之量。例如,沈積至護罩33中之後置容積35中之吸音材料之量係取決於聲學設計工程師希望達成之一諧振位移之量。容積或重力地執行用於插入至護罩33中之後置容積35中之吸音材料19之量之量測。
In step S110, a predetermined amount of sound-absorbing material is loaded into the dispensing hopper. Based on
The amount of sound-absorbing material to be loaded into the
在步驟S120中,振動固持經歷配劑之聲學裝置之載體同時將來自配劑料箱之吸音材料19澆注至配劑漏斗,且隨後澆注至護罩33中之後置容積35。若吸音材料19呈粉末、微粒或顆粒形式,則在經由配劑漏斗將吸音材料19澆注至後置容積35時振動護罩33以允許材料相對快速及均勻地分散。
In step S120 , the carrier holding the acoustic device undergoing dosing is vibrated while the sound-absorbing
在步驟S130中,停止振動固持護罩33之載體達一預定時間。振動之停止允許現位於護罩33中之後置容積35內部之吸音材料19沉降。吸音材料19之沉降對於量測是否已適當填充後置容積係較為重要。
In step S130, the vibration of the carrier holding the
在步驟S140中,重新開始振動固持護罩33之載體達一預定時間。配劑步驟期間及配劑步驟之後兩者之護罩33之重複振動係確保護罩33之後置容積35內部之吸音材料19已到達後置容積35內之所有腔穴所必需。如先前所示,吸音材料19之沉降對於量測是否已適當填充後置容積35係較為重要。當護罩33之第二次振動結束時,移除配劑漏斗。
In step S140, the vibration of the carrier holding the
在步驟S150中,量測護罩33之後置容積35內部之吸音材料19之位準。可目視完成量測。更佳地,使用照明吸音材料19之一雷射來實施位準量測。
In step S150 , the level of the sound-absorbing
在步驟S160中,使後置容積35中之吸音材料19之量測位準與所製造之特殊護罩33之設計要求相比較。若吸音材料19之位準低於設計規範,則在步驟S170中,拒收護罩33。若吸音材料19之位準在設計規範內,則
製造程序移動至步驟S180。
In step S160 , the measurement level of the sound-absorbing
在步驟S180中,使可透氣構件43與腔室壁41之頂部部分及內部腔室壁44之頂部部分對準且將可透氣構件43附接至腔室壁41之頂部部分及內部腔室壁44之頂部部分。可透氣構件43將吸音材料19保持在後置容積35內之一指定容積中。如文中所示,可透氣構件43可藉由膠黏、捲邊、衝壓、壓印、熱封或較佳地藉由超音波焊接而耦合至腔室壁41之頂部部分及內部腔室壁44之頂部部分上之可透氣構件附接點42。若使用一黏著劑,則該黏著劑較佳地不具有可影響後置容積35中之吸音材料19之效能之任何排氣特性。
In step S180, the gas
在步驟S190中,使腔室襯墊37與護罩33中之腔室壁41對準。使腔室襯墊37與護罩33中之腔室壁41對準。如圖5、圖6及圖9中所展示,腔室襯墊支撐在腔室壁41之頂部部分上,且定位於現附接至可透氣構件附接點42處之腔室壁41之可透氣構件43上方。在裝配程序之此刻,可將聲學傳感器34放置於護罩33中之位置中。替代地,聲學傳感器34可機械地附接至印刷電路板32,且接著,在印刷電路板32接合至護罩33時將聲學傳感器34操縱至位置。
In step S190 , the
在步驟S200中,使印刷電路板32與護罩33對準,且將兩個組件配合在一起以產生成品聲學裝置。使用緊固件、適合黏著劑及/或模製於各自組件中之聯鎖突片來達成印刷電路板32及護罩33之機械附接。若使用一黏著劑,則該黏著劑較佳地不具有可影響後置容積35中之吸音材料19之任何排氣特性。印刷電路板32及護罩33之附接在聲學傳感器34之外殼殼體內產生一密封聲學腔室。
In step S200, the printed
在步驟S210中,自裝配載體移除完整聲學裝置,且完整聲學裝置經 測試以判定其是否滿足聲學裝置之設計要求。 In step S210, the complete acoustic device is removed from the assembly carrier, and the complete acoustic device is subjected to Test to determine whether it meets the design requirements of the acoustic device.
參考圖11A至圖11B,圖中揭示另一種用於製造具有一揚聲器外殼作為其殼體之一整合式部分之一音訊裝置之方法。較佳地,儘管亦設想該音訊裝置之手動裝配,但使用最大效率之電腦控制製造設備來實施製造方法。更具體而言,製造程序之描述假定經歷裝配之音訊裝置已被放置在沿一裝配軌跡移動該音訊裝置穿過各種電腦控制裝配站之一裝配載體中。可存在未在該製造方法中描述之其他步驟,諸如插入襯墊或製造電連接件。然而,此等類型之步驟通用於製造程序且不為本發明之部分。 Referring to FIGS. 11A-11B , another method for manufacturing an audio device having a speaker housing as an integral part of its housing is disclosed. Preferably, the manufacturing method is carried out using computer-controlled manufacturing equipment with maximum efficiency, although manual assembly of the audio device is also envisaged. More specifically, the description of the manufacturing process assumes that an audio device undergoing assembly has been placed in an assembly carrier that moves the audio device along an assembly trajectory through various computer-controlled assembly stations. There may be other steps not described in this manufacturing method, such as inserting pads or making electrical connections. However, these types of steps are common to the manufacturing process and are not part of the present invention.
參考圖11A及圖11B,將描述具有一揚聲器外殼作為其殼體之一整合式部分之一音訊裝置之製造方法之另一實施例。在步驟S300中,將護罩33放置於一裝配載體中。在製造程序之此階段中,經裝配之音訊裝置定位於一裝配載體中,且在製造程序之一些實施例中,將必須在製造程序期間對準依不同角度裝配之音訊裝置。
Referring to FIGS. 11A and 11B , another embodiment of a method of manufacturing an audio device having a speaker housing as an integral part of its housing will be described. In step S300, the
在步驟S310中,使可透氣構件43與腔室壁41之頂部部分及內部腔室壁44之頂部部分對準且將可透氣構件43附接至腔室壁41之頂部部分及內部腔室壁44之頂部部分。可透氣構件43將吸音材料19保持在後置容積35內之一指定容積中。如文中所示,可透氣構件43可藉由膠黏、捲邊、衝壓、壓印、熱封或較佳地藉由超音波焊接而耦合至腔室壁41之頂部部分及內部腔室壁44之頂部部分上之可透氣構件附接點42。若使用一黏著劑,則該黏著劑較佳地不具有可影響後置容積35中之吸音材料19之效能之任何排氣特性。
In step S310, the gas
在步驟S320中,重新對準裝配載體中之護罩以曝露裝填埠52使得配劑漏斗可與裝填埠52對準。較佳地,該裝配載體助於配劑漏斗與裝填埠
52之對準,其將允許吸音材料19進入護罩33中之後置容積35中。替代地,可手動使配劑漏斗與護罩33中之裝填埠52對準。配劑漏斗之目的係確保吸音材料19之所有經量測之劑量進入護罩33中之後置容積35。較佳地,具有一實質上球形形狀之一沸石材料用作為吸音材料19,且此沸石材料之形式較佳地用於填充一閉合護罩33之後置容積。在聲學裝置之製造程序之此階段中,假定無其他組件需要安裝在護罩33中,聲學傳感器34除外。雖然可在將吸音材料19放置在後置容積35中之後添加額外組件,但存在干擾或污染吸音材料19之一風險。
In step S320 , the shield in the assembly carrier is realigned to expose the filling
在步驟S330中,將一預定數量之吸音材料裝載至配劑漏斗。基於設計者希望達成之所要聲學效應而判定將裝載至護罩33中之後置容積35之吸音材料之量。例如,沈積至護罩33中之後置容積35中之吸音材料之量係取決於聲學設計工程師希望達成之一諧振位移之量。容積或重力地執行用於插入至護罩33中之後置容積35中之吸音材料19之量之量測。
In step S330, a predetermined amount of sound-absorbing material is loaded into the dispensing hopper. The amount of sound absorbing material to be loaded into the
在步驟S340中,振動固持經歷配劑之聲學裝置之載體同時將來自配劑料箱之吸音材料19澆注至配劑漏斗,且隨後透過裝填埠52澆注至護罩33中之後置容積35。若吸音材料19呈粉末、微粒或顆粒形式,則在經由配劑漏斗將吸音材料19澆注至後置容積35時振動護罩33且裝填埠52允許材料相對快速及均勻地分散。
In step S340 , the carrier holding the acoustic device undergoing dosing is vibrated while the sound-absorbing
在步驟S350中,停止振動固持護罩33之載體達一預定時間。振動之停止允許現位於護罩33中之後置容積35內部之吸音材料19沉降。吸音材料19之沉降對於量測是否已適當填充後置容積係較為重要。
In step S350, the vibration of the carrier holding the
在步驟S360中,重新開始振動固持護罩33之載體達一預定時間。配劑步驟期間及配劑步驟之後兩者之護罩33之重複振動係確保護罩33之後
置容積35內部之吸音材料19已到達後置容積35內之所有腔穴所必需。如先前所示,吸音材料19之沉降對於量測是否已適當填充後置容積35係較為重要。當護罩33之第二次振動結束時,移除配劑漏斗。
In step S360, the vibration of the carrier holding the
在步驟S370中,量測護罩33之後置容積35內部之吸音材料19之位準。可目視完成量測。更佳地,使用照明吸音材料19之一雷射來實施位準量測。
In step S370, the level of the sound-absorbing
在步驟S380中,使後置容積35中之吸音材料19之量測位準與所製造之特殊護罩33之設計要求相比較。若吸音材料19之位準低於設計規範,則在步驟S390中,拒收護罩33。若吸音材料19之位準在設計規範內,則製造程序移動至步驟S400。
In step S380, the measured level of the sound-absorbing
在步驟S400中,使用一裝填埠密封件53密封裝填埠52。裝填埠密封件53可為裝配至裝填埠52之一插件密封件或膠合或附接至裝填埠52之一箔或薄膜。該箔或薄膜可自黏。
In step S400 , a filling
在步驟S410中,使腔室襯墊37與護罩33中之腔室壁41對準。如圖5、圖6及圖9中所展示,腔室襯墊支撐在腔室壁41之頂部部分上,且定位於現附接至可透氣構件附接點42處之腔室壁41之可透氣構件43上方。在裝配程序之此刻,可將聲學傳感器34放置於護罩33中之位置中。替代地,聲學傳感器34可機械地附接至印刷電路板32,且接著,在印刷電路板32接合至護罩33時將聲學傳感器34操縱至位置。接著,使印刷電路板32與護罩33對準,且將兩個殼體配合在一起以產生成品聲學裝置。使用緊固件、適合黏著劑及/或模製於組件中之聯鎖突片來達成印刷電路板32及護罩33之機械附接。若使用一黏著劑,則該黏著劑較佳地不具有可影響後置容積35中之吸音材料19之任何排氣特性。印刷電路板32及護罩33之
附接在聲學傳感器34之外殼殼體內產生一密封聲學腔室。
In step S410 , the
在步驟S420中,自裝配載體移除完整聲學裝置,且完整聲學裝置經測試以判定其是否滿足聲學裝置之設計要求。 In step S420, the complete acoustic device is removed from the assembly carrier, and the complete acoustic device is tested to determine whether it meets the design requirements of the acoustic device.
已為了繪示及描述而呈現本發明之較佳實施例之前述描述。前述描述不意欲具窮舉性或使本發明受限於所揭示之精確形式,且根據以上教示修改及變化形式係可行的或可自本發明之實踐獲取。選擇及描述實施例以解釋本發明之原理及其實踐應用以使熟習技術者能夠利用依各種實施例且具有各種修改(如適合於所設想之特殊用途)之本發明。 The foregoing description of the preferred embodiment of the invention has been presented for purposes of illustration and description. The foregoing description is not intended to be exhaustive or to limit the invention to the precise forms disclosed, and modifications and variations are possible in light of the above teachings or may be acquired from practice of the invention. The embodiment was chosen and described in order to explain the principles of the invention and its practical application to enable one skilled in the art to utilize the invention in various embodiments with various modifications as are suited to the particular use contemplated.
應注意本文所揭示之任何實體(例如,揚聲器裝置等等)不受限於如在一些實施例中所描述之一專用實體。確切而言,所揭示之發明可以各種方式實施且在裝置層級上具有任意精細度同時仍提供所要功能。應注意術語「包括」不排除其他元件或步驟且「一」不排除複數。此外,可組合經描述與不同實施例相關聯之元件。亦應注意申請專利範圍中之元件符號不應被視為限制申請專利範圍之範疇。雖然已繪示及描述特定實施例,但可在不會顯著背離本發明之精神之情況下實行數種修改,且保護之範疇僅受限於隨附申請專利範圍之範疇。此外,縮寫字僅用以增強說明書及申請專利範圍之可讀性。應注意此等縮寫字不意欲減少所使用之術語之一般性且縮寫字不應被視為使申請專利之範疇受限於其中所描述之實施例。 It should be noted that any entity disclosed herein (eg, speaker device, etc.) is not limited to one dedicated entity as described in some embodiments. Rather, the disclosed invention can be implemented in various ways and with arbitrary granularity at the device level while still providing the desired functionality. It should be noted that the term "comprising" does not exclude other elements or steps and "a" does not exclude a plurality. Furthermore, elements described in association with different embodiments may be combined. It should also be noted that the element symbols in the patent application should not be regarded as limiting the scope of the patent application. While particular embodiments have been shown and described, several modifications can be made without departing significantly from the spirit of the invention and the scope of protection is limited only to that of the appended claims. Additionally, abbreviations are used only to enhance the readability of the specification and claims. It should be noted that these abbreviations are not intended to reduce the generality of the terms used and that the abbreviations should not be construed to limit the scope of the patent application to the embodiments described therein.
30‧‧‧罩殼/聲學裝置 30‧‧‧Case/acoustic device
31‧‧‧印刷電路板(PCB)殼體 31‧‧‧Printed circuit board (PCB) housing
32‧‧‧印刷電路板 32‧‧‧Printed circuit board
33‧‧‧護罩 33‧‧‧Shield
34‧‧‧聲學傳感器 34‧‧‧Acoustic sensor
35‧‧‧後置容積 35‧‧‧Rear volume
36‧‧‧傳感器接點 36‧‧‧Sensor contacts
37‧‧‧腔室襯墊 37‧‧‧Chamber liner
38‧‧‧音埠襯墊 38‧‧‧Sound Port Liner
39‧‧‧音埠 39‧‧‧sound port
40‧‧‧前腔體積 40‧‧‧Anterior chamber volume
41‧‧‧腔室壁 41‧‧‧chamber wall
Claims (16)
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN201219304Y (en) * | 2008-06-04 | 2009-04-08 | 比亚迪股份有限公司 | Mid-bass sound effect processing equipment |
CN204498347U (en) * | 2015-04-13 | 2015-07-22 | 歌尔声学股份有限公司 | Loud speaker module |
CN104811831A (en) * | 2015-04-13 | 2015-07-29 | 歌尔声学股份有限公司 | Loudspeaker module |
CN204948357U (en) * | 2015-08-08 | 2016-01-06 | 歌尔声学股份有限公司 | Loud speaker module |
CN205029855U (en) * | 2015-10-12 | 2016-02-10 | 歌尔声学股份有限公司 | Inhale sound subassembly and be equipped with this speaker module of inhaling sound subassembly |
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN201219304Y (en) * | 2008-06-04 | 2009-04-08 | 比亚迪股份有限公司 | Mid-bass sound effect processing equipment |
CN204498347U (en) * | 2015-04-13 | 2015-07-22 | 歌尔声学股份有限公司 | Loud speaker module |
CN104811831A (en) * | 2015-04-13 | 2015-07-29 | 歌尔声学股份有限公司 | Loudspeaker module |
CN204948357U (en) * | 2015-08-08 | 2016-01-06 | 歌尔声学股份有限公司 | Loud speaker module |
CN205029855U (en) * | 2015-10-12 | 2016-02-10 | 歌尔声学股份有限公司 | Inhale sound subassembly and be equipped with this speaker module of inhaling sound subassembly |
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