TWI782874B - Anti-electromagnetic wave heat dissipation composite film structure - Google Patents

Abstract

An anti-electromagnetic wave heat dissipation composite film structure is used for coating on the surface of an element capable of emitting electromagnetic waves, including a dielectric insulating layer and an anti-electromagnetic wave heat dissipation unit. The dielectric insulating layer is made of dielectric insulating material and covers the surface of the element. The anti-electromagnetic wave heat dissipation unit is formed on the surface of the dielectric insulating layer and has anti-electromagnetic wave characteristics, including multiple functional layers with a thickness ranging from 5nm to 1000nm, and at least one of the functional layers is made of heat-conducting and heat-dissipating materials. The present invention uses a functional layer coated on the element with anti-electromagnetic wave and heat conduction and heat dissipation properties, which can not only shield the electromagnetic wave emitted by the element to avoid electromagnetic wave interference, but also improve the overall heat conduction and heat dissipation of the element.

Description

Anti-electromagnetic wave heat dissipation composite film structure

The invention relates to a composite membrane structure for resisting electromagnetic waves, in particular to a composite membrane structure for resisting electromagnetic waves and having heat dissipation properties.

With the development of technology, the proportion of electronic equipment used in daily life or in various industrial fields is getting higher and higher, and it is gradually developing in the direction of high frequency. Therefore, the industry will use electromagnetic shielding (Electromagnetic interference, EMI) materials, Absorb or shield the electromagnetic waves emitted by these electronic devices to avoid crosstalk between these electronic devices and reduce the degree of radiation exposure of the human body. In addition, while developing in the direction of high frequency, the requirements for the heat conduction and heat dissipation of these electronic devices are also gradually increasing, so that they can maintain a certain degree of thermal stability, and can improve signal loss, energy loss and other problems. Therefore, How to improve the heat conduction and heat dissipation properties of these electronic devices, and the electromagnetic shielding properties, and at the same time reduce the complexity of the configured functional components is an important issue in related fields.

Therefore, the purpose of the present invention is to provide a heat dissipation composite film layer structure that is resistant to electromagnetic waves and has both electromagnetic shielding properties and heat conduction and heat dissipation properties.

Therefore, the anti-electromagnetic wave heat dissipation composite film structure of the present invention is used to cover the surface of a component capable of emitting electromagnetic waves, and includes a dielectric insulating layer and an anti-electromagnetic wave heat dissipation unit.

The dielectric insulating layer is made of dielectric insulating material and covers the surface of the element.

The anti-electromagnetic wave heat dissipation unit is formed on the surface of the dielectric insulating layer and has anti-electromagnetic wave characteristics, including multiple functional layers with a thickness of 5nm to 1000nm, and at least one of the functional layers is made of heat-conducting and heat-dissipating materials.

The effect of the present invention is that the electromagnetic wave emitted by the element can be shielded by using the functional layer coated on the element with anti-electromagnetic wave and heat conduction and heat dissipation properties, and at the same time, the overall heat conduction and heat dissipation performance of the element can be improved.

The relevant technical contents, features and effects of the present invention will be clearly presented in the following detailed description of the embodiments with reference to the drawings. In addition, it should be noted that the drawings of the present invention only represent the structure and/or relative positional relationship between components, and are not related to the actual size of each component.

Referring to FIG. 1 and FIG. 2 , an embodiment of the anti-electromagnetic wave heat dissipation composite film structure of the present invention is used to cover the surface of a component 1 capable of emitting electromagnetic waves, so as to reduce the energy of electromagnetic waves emitted by the component 1 . Wherein, the component 1 can be an electronic component (such as a power component), a transmission line, a circuit board, a connection point between a conductive circuit and an electronic component, or any peripheral component of an electronic test (such as a probe card, a probe, etc.) Devices for electromagnetic wave signals, but not limited to the aforementioned examples.

This embodiment of the anti-electromagnetic wave heat dissipation composite film structure of the present invention includes a dielectric insulation layer 2 and an anti-electromagnetic wave heat dissipation unit 3 .

The dielectric insulating layer 2 is made of a dielectric insulating material and covered on the surface of the element 1 to keep the element 1 electrically insulated and not affected by other electronic components. In this embodiment, the dielectric insulating material is selected from oxides, nitrides, metal compounds of other group V elements, or metal compounds of group VI elements, and has a thickness between 20 nm and 100 nm.

The anti-electromagnetic wave heat dissipation unit 3 is formed on the surface of the dielectric insulating layer 2 and has both anti-electromagnetic wave characteristics and heat conduction and heat dissipation properties.

The anti-electromagnetic wave heat dissipation unit 3 includes multiple functional layers 31 with a thickness ranging from 5 nm to 1000 nm. The functional layers 31 can be formed by vapor deposition methods such as chemical vapor deposition (CVD), atomic layer deposition (ALD) or other deposition processes, and at least one of the functional layers 31 is a heat-conducting heat-dissipating material composed of heat-dissipating materials. heat dissipation layer 311 . The heat conduction and heat dissipation material is selected from aluminum oxide, aluminum nitride, or a two-dimensional material with heat conduction and heat dissipation, and the two-dimensional material with heat conduction and heat dissipation can be selected from a carbon-containing two-dimensional material (for example: graphene), or a two-dimensional material with heat conduction and heat dissipation. Molybdenum sulfide.

Preferably, the surfaces of the functional layers 31 are flat. In some embodiments, the surface roughness (Roughness) of the functional layers 31 is not greater than one-twentieth of its thickness.

In some embodiments, the thicknesses of the functional layers 31 may be between 5 nm to 50 nm, 50 nm to 500 nm, or 500 nm to 1000 nm, and the thicknesses may be the same or different from each other.

In this embodiment, the functional layers 31 of the anti-electromagnetic wave heat dissipation unit 3 shown in FIG. The thermally conductive and heat-dissipating layers 311 with low refractive index are stacked on the surface of the dielectric insulating layer 2 to form a stacked structure similar to Bragg reflectors, so that the electromagnetic waves emitted from the element 1 can pass through the When the heat conduction and heat dissipation layers 311 with different refractive indices are stacked, internal reflection will be generated and gradually dissipated, and these heat conduction and heat dissipation layers 311 have heat conduction and heat dissipation properties based on the properties of the constituent materials. Therefore, while providing anti-electromagnetic wave characteristics, they also The heat dissipation of the element 1 can be improved. Specifically, the anti-electromagnetic wave heat dissipation unit 3 shown in FIG. 1 has a first heat conduction and heat dissipation layer 311a formed on the surface of the element 1, and a second heat conduction heat dissipation layer 311a formed on the surface of the first heat conduction and heat dissipation layer 311a. The heat dissipation layer 311b, and the first and second heat conduction and heat dissipation layers 311a, b are respectively composed of heat conduction and heat dissipation materials with different refractive indices. Preferably, the refractive index of the first heat conduction and heat dissipation layer 311a formed on the inner side (that is, the side adjacent to the element 1) is lower than the refractive index of the second heat conduction and heat dissipation layer 311b located on the periphery, so as to facilitate the emission of electromagnetic waves to the outside. produce internal reflections.

Referring to FIG. 2 , another embodiment of the heat dissipation composite film layer structure against electromagnetic waves of the present invention is illustrated. In this embodiment, the functional layers 31 include a layer formed on the surface of the dielectric insulating layer 2 and absorbed by electromagnetic waves. The electromagnetic wave absorbing layer 312 made of materials, and the heat conducting and dissipating layer 311 formed on the surface of the electromagnetic wave absorbing layer 312, and the thicknesses of the electromagnetic wave absorbing layer 312 and the heat conducting and dissipating layer 311 are respectively between 5nm and 1000nm. In addition to improving the overall thermal stability through the heat conduction and heat dissipation layer 311 , the electromagnetic wave absorption layer 312 can be used to further absorb the electromagnetic wave energy generated by the element 1 . Wherein, the electromagnetic wave absorbing material is selected from ferrite or ferrite doped with transition metal or rare earth metal. Specifically, the electromagnetic wave absorbing material can be iron oxide, cobalt oxide, iron oxide or other magnetic materials doped with transition metals or rare earth metals, and the doped metal can be selected from cobalt (Co), nickel (Ni), chromium (Cr), europium (Eu), platinum (Pt), strontium (Sr), or manganese (Mn).

Preferably, the thickness of the electromagnetic wave absorbing layer 312 is between 500nm and 1000nm, and is located inside the anti-electromagnetic wave heat dissipation unit 3, and has enough thickness to absorb electromagnetic wave energy, so that the electromagnetic wave energy emitted by the component 1 is firstly absorbed by the electromagnetic wave energy. After being partially absorbed by the electromagnetic wave absorbing layer 312 , it passes through the heat conduction and heat dissipation layer 311 located on the periphery, and gradually dissipates in the form of internal reflection, thereby improving the heat conduction and heat dissipation performance of the element 1 . It should be noted that this embodiment is described as an example in which a layer of electromagnetic wave absorbing layer 312 and a layer of heat conduction and heat dissipation layer 311 are sequentially coated on the dielectric insulating layer 2. Layer 311, as long as the electromagnetic wave absorbing layer 312 is closest to the element 1, the anti-electromagnetic wave heat dissipation unit 3 shown in Figure 3 forms a layer of electromagnetic wave absorbing layer 312, One layer of first heat conduction and heat dissipation layer 311a, and one layer of second heat conduction and heat dissipation layer 311b, and the refractive index of the first heat conduction and heat dissipation layer 311a is lower than the refractive index of the second heat conduction and heat dissipation layer 311b. 312 and the multi-layer heat conduction and heat dissipation layers 311a, 311b can further ensure the electromagnetic wave shielding effect and heat dissipation effect of the component 1 . With reference to Fig. 3 and Fig. 4, the anti-electromagnetic wave heat dissipation composite film structure of the present invention will be further explained with respect to the following experimental examples 1 and 2, and a comparative example 1, in order to test the anti-electromagnetic wave heat dissipation unit 3 of these experimental examples The anti-electromagnetic wave ability, and the test results are summarized in Table 1, but it should be understood that the experimental examples and their test data are for illustrative purposes only, and should not be construed as limitations for the implementation of the present invention.

Comparative example 1

Set a first antenna, and a second antenna with a distance of 10mm from the first antenna, and send out an electromagnetic wave with a frequency of 30GHz and a wavelength of 1mm from the second antenna (at this time, the second antenna Antenna can be equivalent to the element 1) of Fig. 2, 3, then, utilize an electromagnetic wave measuring instrument to measure respectively at this second antenna, and the electromagnetic wave power density Pa, Pb that this first antenna receives, and the measured The electromagnetic wave power density Pa and Pb are calculated according to the formula: dB=20×log(Pa/Pb) to obtain an electromagnetic wave shielding ability value (dB), which is used to indicate that the electromagnetic wave generated from the second antenna travels to the first day After the line, the relative attenuation degree of its electromagnetic wave intensity.

Experimental example 1

The installation condition of Experimental Example 1 is to install an anti-electromagnetic wave cooling unit 3 at the center of the first and second antennas of Comparative Example 1 (ie, the distance between the first and second antennas is 5 mm). Wherein, the anti-electromagnetic wave cooling unit 3 is composed of an electromagnetic wave absorbing layer 312 and a heat conduction and heat dissipation layer 311 stacked on top of each other, and the electromagnetic wave absorbing layer 312 is adjacent to the second antenna (the second antenna) that emits electromagnetic waves. The line corresponds to the arrangement of elements 1) in FIGS. 2 and 3 . Wherein, the electromagnetic wave absorbing layer 312 has a thickness of 50 nm and is selected from iron oxide, and the heat conduction and heat dissipation layer 311 has a thickness of 50 nm and is selected from aluminum oxide.

Then, the electromagnetic wave power density Pa at the second antenna and the electromagnetic wave power density Pb received at the first antenna of the experimental example 1 were respectively measured by the electromagnetic wave measuring instrument, and an electromagnetic wave shielding capability value (dB) was calculated and obtained. Wherein, the dotted line and the solid line of Fig. 3 represent respectively the comparative example 1 and the experimental example 1, after the electromagnetic wave generated from the second antenna advances to the first antenna, according to the electromagnetic wave power received by the first antenna terminal Density Pb, and the curve distribution diagram of the electromagnetic wave shielding ability value calculated from the electromagnetic wave power density Pa received by the second antenna end.

Experimental example 2

The setup and operating conditions of Experimental Example 2 are similar to those of Experimental Example 1, the difference being that the anti-electromagnetic wave cooling unit 3 of Experimental Example 2 is composed of two layers stacked on top of each other, and have first and second heat conduction and heat dissipation elements with different refractive indices. Layers 311a, b, and the first heat conduction and heat dissipation layer 311a is disposed adjacent to the second antenna that emits electromagnetic waves. Wherein, the thicknesses of the first and second heat-conducting and heat-dissipating layers 311a and b are respectively 50nm, and the first heat-conducting and heat-dissipating layer 311a is selected from aluminum oxide with a refractive index of 1.77~1.78, and the second heat-conducting and heat-dissipating layer 311b is selected from Aluminum nitride with a refractive index of 1.9~2.2.

Next, the electromagnetic wave power densities Pa and Pb of the second antenna and the first antenna of the experimental example 2 were respectively measured by the electromagnetic wave measuring instrument, and an electromagnetic wave shielding capability value (dB) was calculated and obtained. Wherein, the dotted line and the solid line in Fig. 4 represent the comparative example 1 and the experimental example 2 respectively, after the electromagnetic wave generated from the second antenna travels to the first antenna, according to the electromagnetic wave power received by the first antenna terminal Density Pb, and the curve distribution diagram of the electromagnetic wave shielding ability value calculated from the electromagnetic wave power density Pa received by the second antenna end.

Table 1 Comparative example 1 Experimental example 1 Experimental example 2 The distance between the first and second antenna 10mm 10mm 10mm Anti-electromagnetic wave cooling unit (nm) x Electromagnetic wave absorbing layer 50nm The first heat conduction and heat dissipation layer 50nm Thermal conduction layer 50nm The second heat conduction and heat dissipation layer 50nm Electromagnetic wave shielding ability value (dB) -16.6 -17.6 -20.2

From Fig. 3, Fig. 4, and the collation results of Table 1, it can be known that when no electromagnetic wave absorbing material is placed between the first and second antennas, when the electromagnetic wave travels from the second antenna to the first antenna ( Comparative example 1), the electromagnetic wave shielding ability value is about -16.6dB; and when the anti-electromagnetic wave heat dissipation unit 3 of the experimental example 1 is arranged between the first and second antennas, its electromagnetic wave shielding ability value further drops to Below -17 dB, it can be known that the anti-electromagnetic wave heat dissipation unit 3 has electromagnetic shielding ability (that is, anti-electromagnetic wave ability), wherein, compared with the electromagnetic wave absorbing material of Experimental Example 1, it is formed by stacking heat-conducting and heat-dissipating layers 311 with different refractive indices. The anti-electromagnetic wave cooling unit 3 (experiment example 2) can reduce the electromagnetic wave shielding ability value even more (to -20.2dB), and can have better anti-electromagnetic wave ability. And because there are multiple layers of heat dissipation materials at the same time, the anti-electromagnetic wave heat dissipation unit 3 of the experimental example 2 can also have a better heat dissipation effect.

To sum up, the anti-electromagnetic wave heat dissipation composite film structure of the present invention coats the heat conduction and heat dissipation layers 311 on the element 1, so that the electromagnetic wave energy emitted by the element 1 can gradually disappear through internal reflection when passing through. , and improve the overall heat conduction and heat dissipation of the element 1, so the purpose of the present invention can indeed be achieved.

But the above-mentioned ones are only embodiments of the present invention, and should not limit the scope of the present invention. All simple equivalent changes and modifications made according to the patent scope of the present invention and the content of the patent specification are still within the scope of the present invention. Within the scope covered by the patent of the present invention.

1: component

2: Dielectric insulation layer

3: Anti-electromagnetic wave cooling unit

31: Functional layer

311: heat conduction and heat dissipation layer

311a: the first heat conduction and heat dissipation layer

311b: the second heat conduction and heat dissipation layer

312: Electromagnetic wave absorbing layer

Other features and effects of the present invention will be clearly presented in the implementation manner with reference to the drawings, wherein: Fig. 1 is a schematic cross-sectional view illustrating an embodiment of the anti-electromagnetic wave heat dissipation composite film structure of the present invention; Fig. 2 It is a schematic cross-sectional view illustrating another implementation mode of this embodiment; Fig. 3 is a schematic cross-sectional view illustrating another implementation mode of this embodiment; Fig. 4 is a distribution curve diagram of an electromagnetic wave shielding ability value, used To illustrate the anti-electromagnetic ability of the anti-electromagnetic wave heat dissipation unit of this embodiment; and FIG. 5 is a distribution curve diagram of the electromagnetic wave shielding ability value, which is used to illustrate the anti-electromagnetic ability of the anti-electromagnetic wave heat dissipation unit of another embodiment.

1: component

2: Dielectric insulation layer

3: Anti-electromagnetic wave cooling unit

31: Functional layer

311a: the first heat conduction and heat dissipation layer

311b: the second heat conduction and heat dissipation layer

Claims (6)

An anti-electromagnetic wave heat dissipation composite film structure for coating on the surface of a component capable of emitting electromagnetic waves, comprising: a dielectric insulating layer made of dielectric insulating material coated on the surface of the component; and an anti-electromagnetic wave The heat dissipation unit is formed on the surface of the dielectric insulating layer and has anti-electromagnetic wave properties, including multiple functional layers with a thickness of 5nm to 1000nm, and wherein at least several functional layers are made of heat-conducting and heat-dissipating materials with different refractive indices A heat conduction and heat dissipation layer, and the heat conduction and heat dissipation layers are stacked and formed on the surface of the dielectric insulating layer. The anti-electromagnetic wave heat dissipation composite film structure according to claim 1, wherein the functional layers include an electromagnetic wave absorbing layer formed on the surface of the dielectric insulating layer and made of electromagnetic wave absorbing materials, and at least one layer formed on the electromagnetic wave The surface of the absorbing layer, and the heat conduction and heat dissipation layer made of the heat conduction and heat dissipation material. The anti-electromagnetic wave heat dissipation composite film layer structure as described in claim 2, wherein the functional layers include a layer of electromagnetic wave absorption layer, and a multi-layer heat conduction and heat dissipation layer formed on the surface of the electromagnetic wave absorption layer, and the heat conduction and heat dissipation layers are respectively It is composed of heat-conducting and heat-dissipating materials with different refractive indices. The anti-electromagnetic wave heat dissipation composite film layer structure as described in claim 2, wherein the dielectric insulating material is selected from oxides, nitrides, metal compounds of other V group elements, or metal compounds of VI group elements, and the heat conduction and heat dissipation The material is selected from aluminum oxide, aluminum nitride, or a two-dimensional material with thermal conductivity and heat dissipation. The two-dimensional material with thermal conductivity and heat dissipation can be selected from a carbon-containing two-dimensional material, or molybdenum disulfide. The electromagnetic wave absorption material is selected from ferrite or metal-doped ferrite, And the metal is selected from transition metals or rare earth metals. The anti-electromagnetic wave heat dissipation composite film layer structure according to claim 2, wherein the thickness of the electromagnetic wave absorbing layer is between 500nm and 1000nm. The electromagnetic wave resistant heat dissipation composite film layer structure according to claim 3, wherein the refractive index of the heat conduction and heat dissipation layer located on the inner side and adjacent to the element is lower than the refractive index of the heat conduction and heat dissipation layer located on the periphery.

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