TWI778323B - Method of manufacturing light emitting device - Google Patents

Abstract

[Problem] There are provided a method of manufacturing light emitting device having compact size and high liability. [Solution] A method for manufacturing a light-emitting device includes preparing an intermediate product; the product includes a light-emitting element provided with paired electrodes at a first surface and a first covering member covering the light-emitting element such that portions of surfaces of the paired electrodes are exposed. A metal paste layer is formed, continuously covering the exposed portion of the paired electrodes and the first covering member. Paired wirings are formed for preventing the paired electrodes from being short-circuited. The metal paste layer on the paired electrodes and the metal paste layer on the first covering member are irradiated with laser light to remove the metal paste layer between the paired electrodes and a portion of the metal paste layer on the first covering member.

Description

Manufacturing method of light-emitting device

The present invention relates to a manufacturing method of a light-emitting device.

A small light-emitting device is known, which uses a sealing member including a reflective material to cover the side surface and the lower surface of the light-emitting element, instead of disposing a case for accommodating the light-emitting element, and further has a connection with the lower surface of the bump electrode of the light-emitting element and the sealing member. A plated electrode that is in contact with the lower surface (for example, Patent Document 1). In addition, there is known a method of manufacturing a light-emitting device in which a metal layer continuously covering a pair of electrodes and a covering member is formed, and a part of the metal layer is removed by irradiating laser light (for example, Patent Document 2). [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2012-124443 [Patent Document 2] Japanese Patent Laid-Open No. 2017-118098

[Problems to be Solved by Invention]

The light-emitting device of the present invention provides a manufacturing method of a small and highly reliable light-emitting device. [Technical means to solve problems]

The method of manufacturing a light-emitting device according to an embodiment of the present invention includes the steps of preparing an intermediate including a light-emitting element having a pair of electrodes on the first surface side, and covering a portion of the surfaces of the pair of electrodes so as to be exposed. a first covering member of the light-emitting element; forming a metal paste layer continuously covering the exposed pair of electrodes and the first covering member; and covering the metal paste layer on the pair of electrodes and the first covering member The above-mentioned metal paste layer is irradiated with laser light, and a part of the above-mentioned metal paste layer between the pair of electrodes and the above-mentioned metal paste layer on the above-mentioned first covering member is removed, and the above-mentioned pair of electrodes is not short-circuited to form a pair of wiring. [Effect of invention]

According to the above, it is possible to provide a method for manufacturing a small and highly reliable light-emitting device.

Hereinafter, embodiments of the present invention will be described in detail based on the drawings. Furthermore, in the following description, terms indicating a specific direction or position (for example, "up", "down", "right", "left", and other terms including these terms) are used as necessary. These terms are used for the convenience of understanding the invention with reference to the drawings, and the technical scope of the present invention is not limited by the meanings of these terms. In addition, the parts with the same symbols shown in a plurality of drawings represent the same parts or members. In addition, regarding resin members, such as a 1st translucent member, a 2nd translucent member, and a covering member, the same name is used for description, irrespective of before and after shaping|molding, hardening, hardening, and singulation. That is, when it is liquid before molding, becomes solid after molding, and further divides the solid after molding into a solid whose shape has changed, the same name will be used to describe the member whose state changes according to the stage of the step.

The package 10 of the embodiment is shown in FIGS. 1A to 1C . FIG. 1A is a schematic perspective view of the package of the embodiment viewed from obliquely above. FIG. 1B is a schematic bottom view of the package of the embodiment. FIG. 1C is a schematic cross-sectional view of the package of the embodiment, and is taken along the IC-IC cross-section of FIG. 1B . As an example of the intermediate, the package 10 is used for the description, but various forms can be adopted as long as the light-emitting element 1 and the first covering member 2 are provided.

The package 10 includes a light-emitting element 1 , a first covering member 2 , a first translucent member 3 , a second translucent member 4 , and a pair of electrodes 5 . The package 10 is a rectangular parallelepiped, but can be set to any shape. The light-emitting element 1 is rectangular in plan view, but may also be a polygon such as a triangle, a pentagon, and a hexagon. The light-emitting element 1 includes, for example, a first semiconductor layer, an active layer, and a second semiconductor layer on a substrate, and parts of the active layer and the second semiconductor layer are removed. The light-emitting element 1 has a first surface and a second surface opposite to the first surface, and has a pair of electrodes 5 on the first surface side. The first surface side is intended to include not only the case where the electrode is directly formed on the light-emitting element 1 but also the case where the electrode is indirectly formed through other members such as a semiconductor layer or metal. The pair of electrodes 5 has a first electrode 5a and a second electrode 5b having different polarities. The first electrode 5a is electrically connected to the first semiconductor layer, and the second electrode 5b is electrically connected to the second semiconductor layer. The first translucent member 3 is arranged on the second surface side of the light-emitting element 1 . The size of the first translucent member 3 in a plan view is larger than that of the second surface of the light-emitting element 1, or the same size, or may be smaller. When the size of the first translucent member 3 is the same as or larger than the size of the second surface of the light-emitting element 1 , the second translucent member 4 may be disposed on the side surface of the light-emitting element 1 . The first translucent member 3 is rectangular in plan view, but may be polygonal such as a triangle, a pentagon, and a hexagon. Preferably, the second translucent member 4 serves to bond the light-emitting element 1 to the first translucent member 3 . The first covering member 2 is provided so as to cover the first surface and side surfaces of the light-emitting element 1 , the first translucent member 3 , and the second translucent member 4 so that the surfaces of the pair of electrodes 5 are exposed. The first covering member 2 may be formed in one step, but may be formed in two or more plural steps. When forming the first covering member 2 in two or more steps, a plurality of layers may be used, or a single layer may be used without an interface.

Using the above package, a light-emitting device can be formed by the following steps. 2A to 2E are schematic cross-sectional views illustrating a method of manufacturing the light-emitting device according to the embodiment. Although two packages are shown as an example, the package is not limited to this, and a plurality of packages can be used. 3A to 3D are schematic bottom views illustrating a method of manufacturing the light-emitting device according to the embodiment. FIG. 4A is a schematic plan view of the light-emitting device according to the embodiment. 4B is a schematic perspective view of the light-emitting device of the embodiment. FIG. 4A shows a state before the light-emitting device is singulated, and FIG. 4B shows the light-emitting device that has been singulated.

The method of manufacturing a light-emitting device according to the embodiment includes the steps of preparing an intermediate including a light-emitting element having a pair of electrodes on a first surface side, and covering the light-emitting element so that a part of the surfaces of the pair of electrodes is exposed. the first covering member; forming a metal paste layer continuously covering the exposed pair of electrodes and the first covering member; and covering the metal paste layer on the pair of electrodes and the metal on the first covering member The paste layer is irradiated with laser light to remove a part of the metal paste layer between the pair of electrodes and the metal paste layer on the first covering member to form a pair of wirings so that the pair of electrodes is not short-circuited.

By irradiating the metal paste layer with laser light, laser ablation is generated, so that a part of the metal paste layer on the intermediate is removed. Thereby, the metal paste layer is patterned, and the metal paste layer can be used as a wiring or an external connection electrode. Laser ablation is a phenomenon in which the surface of a solid is removed when the irradiation intensity of the laser light irradiated on the surface of the solid becomes a certain magnitude (threshold value) or more. By using laser ablation, the patterning of the metal paste layer can be performed without using a mask or the like.

For example, in the case of using a metal layer to form wiring, for forming the metal layer, the operation steps such as sputtering or vapor deposition are complicated, and high-level equipment is required, resulting in high cost. In addition, when the metal layer is a thin film, disconnection is likely to occur, and therefore, it is required to increase the thickness of the metal layer. On the other hand, when the metal layer is irradiated with laser light without short-circuiting to cause laser ablation to form dissimilar electrodes, if the metal layer is thick, it is necessary to increase the laser output, or to melt or melt the metal layer. It takes time to remove, and thus it is required to improve work efficiency. On the other hand, by using the metal paste layer in the embodiment, wiring can be easily and accurately formed. In addition, since the metal paste layer contains a resin in a plurality of metal powders, by irradiating the metal paste layer with laser light, the resin is likely to be spattered, and the laser output can be greatly suppressed. In addition, the laser irradiation time can be greatly shortened, and the work efficiency can be greatly improved. In addition, since the work efficiency can be greatly improved by laser ablation, the metal paste layer can be thickened, and disconnection is less likely to occur. Furthermore, by removing a part of the metal paste layer using laser ablation, a groove with a narrow line width can be formed, and a smaller light-emitting device can be realized with high reliability. A plurality of packages are arranged on the light guide plate, but the number is not particularly limited. For example, after arranging a plurality of packages on the light guide plate, a total of 16 packages in 4 columns and 4 rows are singulated into one segment. A large-scale display that can be expanded can be formed by electrically connecting each of one segment, and it can be easily replaced for each segment when it falls into a situation where a part of the segment does not light up. Hereinafter, each step will be described in detail.

(steps to prepare intermediates) An intermediate including the light-emitting element 1 having the pair of electrodes 5 on the first surface side and the first covering member 2 covering the light-emitting element 1 so that a part of the surfaces of the pair of electrodes 5 is exposed is prepared. The package 10 is placed on the light guide plate 30 . Preferably, the package 10 is disposed on the light guide plate 30 via the third translucent member 40 having adhesiveness. Preferably, the first translucent member 3 of the package 10 is arranged in contact with the light guide plate 30 . Preferably, the third translucent member 40 covers the side surface of the first translucent member 3 and the side surface of the first covering member 2 . The reason for this is that the light emitted from the light-emitting element 1 can be spread laterally. Preferably, the packages 10 arranged on the light guide plate 30 are plural and arranged in a state of being regularly arranged in the vertical and horizontal directions. Preferably, the side of the package 10 disposed on the light guide plate 30 is covered by the second covering member 50 . Preferably, the thickness of the second covering member 50 is thinner than that of the package 10, but may be the same or thicker. The reason for this is that the metal paste layer 25 or the wiring 20 is easily formed. Preferably, the pair of electrodes 5 contain Cu. The reason for this is that electrical conductivity is good.

The light guide plate 30 may be a flat plate, or a concave portion for disposing the package 10 may be provided in a part of the flat plate. The concave portion is rectangular in plan view, and preferably has a shape similar to that of the package 10, but can also be a polygon such as a triangle, a pentagon, and a hexagon. The depth of the concave portion can be the same as the height of the package 10, or it can be shallower. By making the depth of the concave portion shallower than the height of the package 10 , the package 10 can be partially protruded from the light guide plate 30 when viewed in cross section, and the side surface of the package 10 can also be covered by the second covering member 50 .

The distance between adjacent light-emitting elements 1 can be appropriately selected according to the size of the target light-emitting device 100, the size of the light-emitting element 1, and the like. However, since the covering member is cut and singulated in a subsequent step, it is also arranged in consideration of the cutting material (width of the cutting blade) and the like.

The first covering member 2 is arranged on the first surface of the light-emitting element 1 between the pair of electrodes 5 . The distance between the pair of electrodes 5 is preferably 10 μm or more, particularly preferably 20 μm or more. In addition, the distance between the pair of electrodes 5 is preferably 100 μm or less, particularly preferably 50 μm or less. Thereby, a pair of wirings can be easily formed by the irradiation of the following laser light, and the small package 10 can be used. Preferably, the distance between the electrodes 5 is set according to the spot diameter of the laser light, and if the width is such that a short circuit does not occur, the narrower one is better.

(Step of Forming Metal Paste Layer) A metal paste layer continuously covering the exposed one pair of electrodes 5 and the first covering member 2 is formed. A plurality of packages 10 are arranged on the light guide plate 30 , the packages 10 are respectively arranged through the third translucent member 40 , and the second covering members 50 are arranged on the side of the packages 10 . The metal paste layer 25 is arranged so as to continuously cover the first covering member 2 and the second covering member 50 . The step of forming the metal paste layer 25 is preferably formed by any method of printing or spraying. For printing, any method such as gravure printing, letterpress printing, offset printing, and screen printing can be used, and screen printing is preferred. For spraying, any method of ink jet, air jet and jet dispensing can be used. Thereby, the metal paste layer 25 can be easily formed, and the wiring 20 can be further formed, without requiring a high level of equipment like sputtering or vapor deposition. The thickness of the metal paste layer 25 is preferably 1 μm or more, preferably 3 μm or more and 50 μm or less, and particularly preferably 5 μm or more and 20 μm or less. By setting it as a predetermined thickness or more, conduction can be ensured and reliability can be improved. In addition, by setting the thickness of the metal paste layer 25 to a predetermined thickness, the resistance can be reduced. In this way, when the metal paste layer 25 is made to have a predetermined thickness, the formation of the wiring 20 can also be easily performed by using laser ablation. The width of the metal paste layer 25 is sufficient as long as conduction can be achieved, and for example, it is preferably 200 μm or more and 1000 μm or less, and particularly preferably 400 μm or more and 700 μm or less.

Preferably, in the step of preparing the intermediate, a plurality of light-emitting elements 1 are used, in the step of forming the metal paste layer 25, the metal paste layer 25 continuously covers the plurality of light-emitting elements 1, in the step of forming the following wiring 20 , a plurality of light-emitting elements 1 are electrically connected. Thereby, a plurality of light-emitting elements 1 can be easily wired.

The metal paste layer 25 used here is preferably a mixture of resin and metal powder, and may further contain an organic solvent. The size of the metal powder is preferably 0.01 μm or more and 10 μm or less, and particularly preferably 0.1 μm or more and 5 μm or less. The conductivity can be improved by controlling the size of the metal powder used for the metal paste layer 25 . In addition, when printing the metal paste layer 25, the viscosity can be adjusted. Before the metal paste layer 25 is hardened, the resin may be in either a powder state or a liquid state.

Preferably, the metal powder includes at least one of silver powder, copper powder, or silver powder or copper powder covered with a metal film. Thereby, electrical conductivity can be improved. The metal paste layer 25 preferably has a metal powder concentration of 60% by weight or more and 95% by weight or less. By increasing the concentration of the metal powder, the electrical conductivity can be improved and the resistance can be kept low. Moreover, by making the ratio of resin into a predetermined range, printing etc. can be easily performed.

(Step of forming a pair of wirings) The metal paste layer 25 continuously covering the pair of electrodes 5 and the first covering member 2 is irradiated with laser light, a part of the metal paste layer 25 is removed, and the pair of electrodes 5 is not short-circuited to form the first one of the pair of wirings 20 The wiring 20a and the second wiring 20b. The first wiring 20a and the second wiring 20b are formed from the metal paste layer 25 by cutting a part of the metal paste layer 25, and a material different from the metal paste layer 25 is not used. In addition, by irradiating a laser light, a part of the metal paste layer 25 is removed, and the metal paste layer 25 is in a state of being broken between a pair of electrodes 5 of one light-emitting element 1, and becomes a pair of wirings 20, that is, the first wiring 20a The second wiring 20b is in a continuous state with the metal paste layer 25 covering the electrode 5 of the other adjacent light-emitting element 1. That is, the metal paste layer 25 between the electrodes 5 of one light-emitting element 1 is kept separated, and the metal paste layer 25 between the electrodes 5 of the other light-emitting element 1 is kept continuous, and is not used as a wiring for simultaneous driving of two light-emitting elements function.

For example, the first wiring 20a and the second wiring 20b may be formed so that two light-emitting elements 1 are simultaneously driven by one wiring 20 ( FIGS. 3A to 3D ). The metal paste layer 25 is formed by hardening the resin contained in the metal paste layer 25 by printing or spraying the metal paste used as a raw material. For hardening, a hardening method such as heating or laser irradiation can be used. The hardened metal paste layer 25 is irradiated with laser light. The laser light is preferably irradiated in pulses, and the spot diameter of the laser is appropriately adjusted. Further, the number of pulse irradiations is preferably within 1 to 10 times, and particularly preferably within 2 to 5 times. By increasing the thickness of the metal paste layer 25, the electrical conductivity can be improved or the resistance can be reduced. On the other hand, since the metal paste layer 25 is cut so that the first electrode 5a and the second electrode 5b are not short-circuited, the number of pulse irradiations will be reduced. Increase. As the number of times of pulse irradiation increases, the step time for forming a pair of wirings 20 becomes longer, so the less number of times of pulse irradiation, the better. Therefore, it is preferable to set the number of pulse irradiation within 2 to 5 times. In addition, the same part may be continuously irradiated with pulses several times. However, since heat is accumulated, the laser may be moved and pulsed again after a predetermined period of time has elapsed so as not to continuously irradiate the same part. By using a laser, microfabrication can be performed, and the positional accuracy of the cutting part can be kept high. The intensity of the laser light, the diameter of the irradiation spot, and the moving speed of the irradiation spot take into account the thermal conductivity of the first covering member 2 or the metal paste layer 25 and the thermal conductivity difference between them, etc., so that the metal paste on the first covering member 2 The layer 25 is set in the manner in which the laser ablation occurs.

The wavelength of the laser light can also be used in the infrared region (such as around 1064 nm), the laser in the red region (such as around 640 nm), or the laser in the green region (such as around 532 nm), or the blue region shorter than the green region. Or a laser with an emission wavelength in the ultraviolet region (such as around 355 nm). Efficient ablation can be generated using wavelengths in the ultraviolet region, thereby improving mass productivity. Also, the pulse width of the laser can be nanoseconds, picoseconds, femtoseconds, or the like. For example, it is preferable to use a laser with a pulse width of nanoseconds in the green region around 532 nm from the viewpoint of output or operational efficiency.

Preferably, the irradiation width of the laser light is narrower than the distance between the pair of electrodes 5 . For example, when the distance between the first electrode 5a and the second electrode 5b is 30 μm, and the processing width using a laser is about 30 μm, the distance between the first wiring 20a and the second wiring 20b can be 30 μm. From the viewpoint of energy concentration, the laser light is preferably irradiated from a vertical direction at 90 degrees with respect to the surface of the metal paste layer 25, but in order to efficiently perform scattering due to ablation, it is preferably The surface of the paste layer 25 is irradiated at an oblique direction of 45 to 145 degrees, preferably 70 to 110 degrees. The resin or metal powder of the metal paste layer 25 is scattered by the laser irradiation, and thus dust is collected. The dust collection is preferably performed along a direction parallel to the surface of the light guide plate 30 or at an angle within 30 degrees given to the surface of the light guide plate 30 .

Preferably, the first covering member 2 is disposed on the first surface of the light-emitting element 1 and between the pair of electrodes 5, and in the step of forming the pair of wirings 20, the first covering member 2 is disposed on the first surface of the light-emitting element 1 and the pair of electrodes is disposed. Part of the first covering member 2 between the five is removed by laser light. That is, the first covering member 2 disposed between the pair of electrodes 5 is not completely removed by the laser light, but partially remains. Since the first covering member 2 is insulating, the short circuit between the first wiring 20a and the second wiring 20b can be prevented by remaining of the first covering member 2 . The thickness of the remaining first covering member 2 is preferably 1/5 or more of the thickness of the electrode 5 and 4/5 or less.

Here, for a laser irradiation method, a plurality of light-emitting elements 1 are arranged on the light guide plate 30 in a row direction and a row direction. A metal paste layer 25 having a predetermined width is arranged on the light-emitting element 1 . Then, laser light is irradiated between the pair of electrodes 5 of the light-emitting element 1 . By arranging the light-emitting element 1 at a predetermined position, the pair of electrodes 5 of the light-emitting element 1 cannot be directly visually recognized, but laser irradiation can be performed between the pair of electrodes 5 . At this time, considering the deviation of the laser irradiation, it is preferable to set the distance between the pair of electrodes 5 to be about 1.5 times to 5 times wider than the spot diameter of the laser.

Moreover, as a different method, it is preferable to first identify a pair of electrodes 5 of the light-emitting element 1 in the step of preparing the intermediate, and in the step of forming a pair of wirings, to identify the pair of electrodes 5 in the step of preparing the intermediate. Laser light is irradiated between the pair of electrodes 5 of the identified light-emitting element 1 . In this way, by identifying the position of the pair of electrodes 5 of the light-emitting element 1 in advance, and considering the displacement of the light-emitting element 1 in the vertical direction or the rotation of the light-emitting element 1, the laser light can be irradiated to an appropriate position, so that a pair of The gap between the electrodes 5 is set narrow, so that the small light-emitting element 1 is used. After the step of forming a pair of wirings, the step of covering the pair of electrodes 5 with at least the insulating member 60 may be further included. Since the pair of electrodes 5 may be exposed by laser ablation, the short circuit can be prevented by covering the pair of electrodes 5 with the insulating member 60 . The insulating member 60 may cover not only the pair of electrodes 5 but also the pair of wirings 20 , the second covering member 50 , and the like. Preferably, in the step of covering the pair of electrodes 5 with the insulating member 60, the insulating member 60 is colored. The insulating member 60 may be transparent, semi-transparent, or opaque, but is preferably transparent or semi-transparent in the wavelength region of the measuring device or visually in order to confirm the connection state of the wiring 20 . The measuring device is preferably a spectrophotometer. For example, the spectrophotometer preferably uses blue light with a peak wavelength of 480 nm, green light at 520 nm, red light at 600 nm, etc., but is not limited to this wavelength. In addition, the insulating member 60 is preferably colorless and transparent, but is particularly preferably colored so that the insulating member 60 can be confirmed to be disposed on the first covering member 2 or the like, or the connection state of the wiring 20 can be confirmed through the insulating member 60 . For example, it is preferable that the insulating member 60 contains a coloring material such as blue, green, and red, or a pigment, pigment, or dye. The light transmittance of the insulating member 60 can be, for example, 20% or more and 95% or less, preferably 30% or more and 80% or less. For the light transmittance of the insulating member 60, a transmittance measuring device was used. The insulating member 60 is preferably film-shaped, and the thickness of the insulating member 60 is preferably 0.5 μm to 100 μm. Preferably, the size of the insulating member 60 is a circle, an ellipse, a rectangle, etc. having a maximum diameter of 0.5 to 3 times the maximum diameter of the package 10 .

(package) The package 10 includes at least the light-emitting element 1 and the first covering member 2, and may further include the first translucent member 3, the second translucent member 4, and the like. The light-emitting element 1 includes a pair of electrodes 5 on the first surface. Since the first covering member 2 covers the side surface of the light-emitting element 1, it only needs to be insulating. The first covering member 2 is preferably reflective, but may be translucent. The reflective first covering member 2 can be formed by compression molding, transfer molding, injection molding, printing, spraying, etc., using, for example, a silicone resin containing about 60 wt% of silicon oxide and white titanium oxide. In addition, the first covering member may be formed into a plate shape, and may be formed into a rectangular parallelepiped cut into a predetermined size.

A liquid second translucent member 4 is applied on the first translucent member 3 of the plate-shaped member, and a plurality of light-emitting elements 1 are respectively attached. The liquid second translucent members 4 are formed to be separated from each other. Each of the second translucent members 4 corresponds to the shape of the light-emitting element 1, and can be any shape in plan view, for example, a square, a rectangle, a circle, and an ellipse. Furthermore, the interval between the adjacent second translucent members 4 can be appropriately set according to the outer shape of the package 10 and the number of the packages 10 to be installed. Moreover, it is preferable that the 2nd translucent member 4 is formed so that it may cover about 70% - 150% of the area of the 1st translucent member 3 of a plate-shaped member.

When the light-emitting element 1 is placed on the liquid first light-transmitting member 3 , the second light-transmitting member rises along the side surface of the light-emitting element 1 . Thereby, in the state where the light-emitting element 1 is mounted on the 1st translucent member 3, the outer surface of the 2nd translucent member 4 becomes the shape which faces obliquely upward. For example, the form in which the second translucent member 4 is combined with the light-emitting element is a truncated quadrangular pyramid. After arranging the light-emitting element 1 on the first translucent member 3 , the light-emitting element 1 may be pressed as necessary. After the light-emitting element 1 is arranged, the second translucent member 4 after curing is formed by heating the second translucent member 4 in a liquid state.

In addition, in the above, the light-emitting element 1 and the first translucent member 3 are joined with the second translucent member 4 interposed therebetween, but the second translucent member 4 may not be used directly. engage. That is, after placing the light-emitting element 1 on the first light-transmitting member 3 , the liquid first light-transmitting member 4 may be placed around the light-emitting element 1 .

Next, on the light guide plate 30 , the package 10 is arranged so as to be in contact with the first translucent member 3 through the third translucent member 40 . As in the case of the above-described second translucent member 4 , the liquid third translucent member 40 forms an outer surface obliquely upward toward the package 10 , and the third translucent member 40 is cured. The second covering member 50 is provided so as to cover the plurality of packages 10 integrally. For example, the second covering member 50 can be formed by compression molding, transfer molding, injection molding, printing, spraying, or the like using a silicone resin containing about 60 wt% of silicon oxide and white titanium oxide.

Furthermore, it is also possible to cover the entire second covering member 50 in a manner of covering the package 10 disposed on the light guide plate 30 , and to harden the second covering member 50 , and then use a known processing method to cover the pair of electrodes 5 of the light-emitting element 1 . By exposing it, the thickness of the second covering member 50 is reduced. Thereby, the light-emitting device 100 with a predetermined thickness can be obtained. In addition, the surface of the pair of electrodes 5 of each package and the surface of the second covering member 50 can be aligned on the same plane, so that the metal paste layer 25 can be easily printed.

Here, the term "plate shape" refers to a member having a large area on which one or two or more light-emitting elements can be placed.

(light emitting element) As the light-emitting element 1 , for example, a semiconductor light-emitting element such as a light-emitting diode can be used, and a light-emitting element capable of emitting visible light such as blue, green, and red can be used. The semiconductor light-emitting element includes a laminate structure including a light-emitting layer and an electrode. The laminated structure includes a first surface on the side where the electrodes are formed, and a second surface on the opposite side to be a light extraction surface.

The laminated structure includes a semiconductor layer including a light-emitting layer. Furthermore, translucent substrates, such as sapphire, may be provided. An example of a semiconductor laminate may include three semiconductor layers of a first conductivity type semiconductor layer (eg, an n-type semiconductor layer), a light-emitting layer (active layer), and a second conductivity type semiconductor layer (eg, a p-type semiconductor layer). The semiconductor layer capable of emitting visible light ranging from ultraviolet light or blue light to green light can be formed of, for example, a semiconductor material such as a group III-V compound semiconductor. Specifically, a nitride-based semiconductor material such as InXAlYGa1 _-XYN (0≦ _X , 0≦ _Y , X+Y≦1) can be used. As the semiconductor laminate capable of emitting red light, GaAs, GaAlAs, GaP, InGaAs, InGaAsP or the like can be used. The electrodes are preferably copper.

(1st covering member) The first covering member 2 is preferably a resin member mainly composed of a thermosetting resin such as a silicone resin, a silicone-modified resin, an epoxy resin, and a phenol resin, for example.

The first covering member 2 is preferably a light-reflective resin member. The so-called light-reflecting resin refers to a resin material having a reflectance of 70% or more with respect to the light from the light-emitting element. For example, white resin etc. are preferable. The light extraction efficiency of the light emitting device can be improved by the light reaching the first covering member being reflected toward the light emitting surface of the light emitting device. In addition, a light-transmitting resin member may be used as the first covering member 2 . In this case, the same material as the first translucent member described below can be used for the first covering member.

As the light-reflective resin, for example, a light-reflective material can be used in a light-transmitting resin. As a light-reflecting substance, for example, titanium oxide, silicon oxide, zirconium oxide, potassium titanate, aluminum oxide, aluminum nitride, boron nitride, mullite, etc. are preferable. As the light-reflecting material, granular, fibrous, and thin sheet shapes can be used. In particular, a fibrous material is preferable because the effect of reducing the thermal expansion coefficient of the first covering member can be expected.

In the case where the first covering member is composed of, for example, a resin member containing a filler such as a light-reflecting substance, the resin component on the surface irradiated with the laser is removed by ablation, and the filler is exposed on the surface. In addition, by continuously or successively moving the irradiation point of the laser light on the surface, stripe-shaped grooves are formed along the moving direction. The groove is formed to be about 10 to 100 μm, for example, with a width of 40 μm and a depth of 0.1 to 3 μm typically, depending on the diameter of the irradiation spot of the laser light.

(1st translucent member) The first translucent member 3 is arranged on the second surface of the light-emitting element. As the material of the first translucent member 3, resin, glass, or the like can be used. As the resin, thermosetting resins such as silicone resins, silicone-modified resins, epoxy resins, and phenolic resins, thermoplastic resins such as polycarbonate resins, acrylic resins, methylpentene resins, and polynorbornene resins can be used. . In particular, silicone resins with excellent light resistance and heat resistance are preferred.

The first translucent member 3 may contain a phosphor as a wavelength conversion material in addition to the above-described translucent material. As the phosphor, one that can utilize light emission from the light-emitting element is used. For example, as a phosphor that can be excited by a blue light-emitting element or an ultraviolet light-emitting element, yttrium aluminum garnet-based phosphor (YAG:Ce) activated with cerium; Light body (LAG:Ce); nitrogen-containing calcium aluminosilicate phosphor (CaO-Al ₂ O ₃ -SiO ₂ :Eu, Cr) activated by europium and/or chromium; silicate activated by europium Phosphors ((Sr,Ba) ₂ SiO ₄ :Eu); β-Sialon Phosphors, CASN Phosphors, SCASN Phosphors, etc. Nitride Phosphors; KSF Phosphors (KSF Phosphors) ₂ SiF ₆ : Mn); sulfide-based phosphors, quantum dot phosphors, etc. By combining these phosphors with blue light-emitting elements or ultraviolet light-emitting elements, light-emitting devices of various colors (eg, white-based light-emitting devices) can be manufactured. Moreover, various fillers etc. may be contained in the 1st translucent member 3 for the purpose of adjusting a viscosity, etc..

(2nd translucent member) The second translucent member 4 bonds the light-emitting element 1 to the first translucent member 3 . The second translucent member may contain a phosphor or a filler. The present invention is not limited to the above-described embodiment, and it goes without saying that any one can be adopted as long as it does not deviate from the gist of the present invention. (third translucent member) The third translucent member 40 is a translucent member having adhesiveness. Preferably, the third translucent member 40 is arranged so that the first translucent member 3 of the package 10 is in contact with the light guide plate 30 . Preferably, the third translucent member 40 covers the side surface of the first translucent member 3 and the side surface of the first covering member 2 . The reason for this is that the light emitted from the light-emitting element 1 can be spread laterally. The third translucent member 40 can be formed of the same material as that of the second translucent member 4 .

(light guide plate) The light guide plate 30 may not only have a flat plate shape, but may have a concave portion or a convex portion in a part. The package can be arranged in the recess. In addition, the concave portion or the convex portion may function as a lens or the like. In addition, a depression, a light shielding film, a reflection film, etc. may be formed so that the light guide plate 30 has a partition property. In addition, by providing a reflection film or a light-shielding film on the opposite side of the light guide plate where the package is arranged, the light from the package can be spread in the horizontal direction through the light guide plate.

The light-emitting device of the second embodiment will be described with reference to the drawings. FIG. 5 is a schematic perspective view of the light-emitting device according to the second embodiment, viewed from the side of the light guide plate. FIG. 6 is a schematic cross-sectional view of a light-emitting device according to a second embodiment. FIG. 7 is a schematic plan view of the light-emitting device of the second embodiment. Here, in the step of preparing the intermediate that has already been described, the package 10 will be described in a state where the package 10 is placed on the light guide plate 31 via the third light transmissive member 40 . In the drawings, the hatching for showing the cross-sectional parts is omitted from the viewpoint of the ease of observation of the package and the third translucent member in the drawings. The schematic perspective view of the light-emitting device of the second embodiment constitutes one segment of 16 cells in total including 4 vertical cells and 4 horizontal cells. By combining a plurality of the segments, a planar light source of any size can be formed. A schematic cross-sectional view ( FIG. 6 ) of the light-emitting device of the second embodiment shows one unit.

The light guide plate 31 prepared in advance is used for the light-emitting device of the second embodiment. In the light guide plate 31 , the surface side on which the package 10 is arranged is a flat surface, and the surface side opposite to the flat surface is a back surface. The light of the package 10 is mainly emitted from the back side of the light guide plate 31 . One unit of the light guide plate 31 has a first recess 31a in the region where the package 10 is arranged. In the light guide plate 31, second recesses 31b are arranged between adjacent first recesses 31a, and the second recesses 31b are formed around intersections of vertical and horizontal straight lines, and are arranged in a lattice shape. In the package 10 , the light-emitting element 1 is mounted on the first light-transmitting member 3 , the second light-transmitting member 4 is arranged on the side surface of the light-emitting element 1 , and the first covering member 2 is arranged to cover the second light-transmitting member 4 . The 1st recessed part 31a is a square truncated pyramid shape in a plan view, and is a trapezoid with a wider mouth at the top of the opening than the bottom side in a cross-sectional view. The opening area of the first concave portion 31a above the opening is larger than the bottom area. The package 10 is arranged so that the bottom of the quadrangular pyramid is in contact with the first translucent member 3 . The third translucent member 40 is arranged on the side surface of the package 10 . The reflection member 70 is arrange|positioned in the 2nd recessed part 31b of the light guide plate 31. As shown in FIG. The upper surface of the reflection member 70 and the flat surface of the light guide plate 31 are covered with the second covering member 50 . The reflecting member 70 and the second covering member 50 are made of resin mixed with a light reflective substance so as to efficiently reflect the light from the package 10 , so that the light from the package 10 is emitted from the back side of the light guide plate 31 . In addition, the second recess 31b is inclined so that light from the package 10 can be easily emitted from the back side of the light guide plate 31 , preferably an inclination angle at which light is extracted from the back side of the light guide plate 31 to the vertical direction. The wiring 21 is provided on the second covering member 50 . The first wiring 21 a is electrically connected to the first electrode 5 a of the package 10 , the second wiring 21 b is electrically connected to the second electrode 5 b of the package 10 , and the connection portions are covered by the insulating member 60 . At this time, the second concave portion 31b is between the adjacent first concave portions 31a, that is, the connection between the unit and the unit is the deepest. Since the reflection member 70 is arranged in the second recessed portion 31b, shrinkage (dent) of the resin occurs along with the curing of the resin used for the reflection member 70, and the upper surface of the reflection member 70 in the second recessed portion 31b is likely to be bent. sunken. Therefore, when the wiring 21 or the like is printed, the wiring may be easily disconnected. Therefore, in order to prevent this, the wide portion 21 c is provided in a part of the wiring 21 . Even if the wiring 21 is not disconnected, there is a possibility that blurring occurs when the wiring 21 is printed, the wiring becomes thin, or the resistance increases. Therefore, it is preferable to provide the wide-width portion 21c of the wiring 21 in the vicinity of the most concave portion of the second recessed portion 31b or at the connection between cells. In addition, the wide portion 21c of the wiring 21 is not limited to a circle or an ellipse, and may be a rectangle or a polygon. When the plurality of wide portions 21c are provided at the connection between the units, it is preferable to arrange the plurality of wide portions 21c in a substantially linear shape.

It is preferable that the back surface of the light guide plate 31 is provided with the 3rd recessed part 31c on the opposite side of the 1st recessed part 31a. Preferably, the third concave portion 31c has a conical shape or a polygonal pyramid shape, for example. The reason for this is that the light emitted from the package 10 spreads in the horizontal direction or the oblique direction through the light guide plate 31 by making the third concave portion 31 c in a conical shape or the like. The light shielding member 80 may also be provided in the third recessed portion 31c. Since the light emitted from the package 10 is most strongly emitted right above the light guide plate 31 as a whole, uneven light emission is likely to occur when the light guide plate 31 is viewed as a whole. Therefore, by providing the light shielding member 80 in the third recessed portion 31c, the light directly above the package 10 can be suppressed and the uneven light emission can be reduced. The light shielding member 80 can also cover the entire third recess 31c, but preferably only a part of the third recess 31c, for example, the depth of the third recess 31c is about 1/4 to 3/4. Preferably, when the light guide plate 31 is viewed from the rear, the light shielding member 80 is covered by the same to twice as large as the first recess 31a. The third recessed portion 31c after the light shielding member 80 is provided in the third recessed portion 31c is preferably in the shape of a truncated cone when viewed from the rear.

As a result, the light guide plate 31 includes a plurality of first recesses 31a on which the light emitting elements 1 are arranged, and second recesses 31b arranged between adjacent first recesses 31a, and the second recesses 31b are provided with the reflecting member 70 and are arranged There is a second covering member 50 covering the reflecting member 70 , and the wiring 21 is arranged on the second covering member 50 . It is preferable that the wiring 21 arrange|positioned on the 2nd recessed part 31b has the part wider than the wiring 21 arrange|positioned on the 1st recessed part 31a, and the wide width|variety part 21c.

The light-emitting device of the third embodiment will be described with reference to the drawings. FIG. 8 is a schematic plan view of a light-emitting device according to a third embodiment. The light-emitting device of the third embodiment has substantially the same configuration except for the wiring of the second embodiment. The wiring 22 is provided with a wide portion 22c between the adjacent packages 10 in the lateral direction, especially in the middle of the adjacent packages 10 . The wiring 22 is located near the center in the lateral direction, and is provided with a curved portion between the adjacent packages 10 , which is a straight line with a step difference, and is provided with a curved portion at a position deviated from the center of the adjacent packages 10 . By bending the wiring 22, blurring or disconnection during printing can be suppressed. Moreover, the wiring part 22d with a wider line width is provided in the wiring 22 on the side different from the side where the package 10 is arranged in the lateral direction. By enlarging the line width of the wiring 22, the resistance can be reduced or the disconnection can be prevented. The lateral length of the wiring portion 22d is not particularly limited, but preferably extends to the vicinity of the wide portion 22c in the vertical direction.

A light-emitting device according to a fourth embodiment will be described with reference to FIG. 9 . FIG. 9 is a schematic cross-sectional view of a light-emitting device according to a fourth embodiment. Here, in the step of preparing the intermediate that has already been described, the package 10 will be described in a state where the package 10 is arranged on the light guide plate 30 with the third light transmitting member 40 interposed therebetween. In addition, the light-emitting element 1 and the 1st translucent member 4 will abbreviate|omit the hatching which shows the cross-sectional part from the viewpoint of the ease of observation of a drawing. The light-emitting device of the fourth embodiment is different from the other embodiments in that the package 10 is arranged in the through hole 30A provided in the light guide plate 30 . Furthermore, the through hole 30A is formed in the light guide plate 30 for each package 10 provided. The package 10 includes a light-emitting element 1 , a first light-transmitting member 3 provided on the light-emitting element 1 via the second light-transmitting member 4 , a first light reflecting film 13 provided on the first light-transmitting member 3 , and an intermediate The first covering member 2 provided on the side surface side of the light-emitting element 1 with the second translucent member 4 interposed therebetween. Furthermore, the package 10 is provided on the light guide plate 30 with the third translucent member 40 interposed therebetween. Moreover, it is preferable to cover the side of the package 10 arrange|positioned on the light guide plate 30 with the 2nd covering member 50. Preferably, the thickness of the second covering member 50 is thinner than that of the package 10, but may be the same or thicker. Furthermore, in order to install the package 10 , the package 10 may be installed via a working sheet covering one of the openings of the through holes 30A formed in the light guide plate 30 .

Moreover, the 1st light reflection film 13 provided in the 1st translucent member 3 of the package 10 is formed so that it may become the same plane as the surface of the light guide plate 30 as an example. The first light reflection film 13 reflects or blocks light. The first light reflection film 13 is preferably formed of a material that blocks or reflects 80% or more of the light sent from the first translucent member 3 . As the first light-reflecting film 13, a single-layer film containing a metal, a multilayer film containing a metal, or a multilayer film containing a dielectric (dielectric multilayer film formed by a plurality of dielectric bulk layers of two or more types) can be used membrane). As an example, the first light reflection film 13 can be formed by a sputtering method. The 1st light reflection film 13 may have the same area as the 1st translucent member 3, or may be larger than the area of the 1st translucent member 3 in planar view. The reason for this is that by increasing the size of the first translucent member 3 , the light directed upward from the light-emitting element 1 can be guided to the side. When the area of the first light reflection film 13 is made larger than that of the first translucent member 3 , it is preferable to use a plate-shaped first light reflection film 13 .

In addition, when the first light reflection film 13 is formed in advance and connected by an adhesive, for example, acrylic, urethane, styrene, epoxy, polyimide, silicone BT resin (bismaleimide triazine resin, bismaleimide triazine resin) series, ester series, ether series, urea series, polyamide series, phenol series, cellulose derivative adhesives are used alone or in combination . Furthermore, when using a dielectric multilayer film, for example, a DBR (distributed Bragg reflector: distributed Bragg reflector) film can be used. As the first light-reflecting film 13, a film containing a dielectric multilayer film is preferably used. In the case of a dielectric multilayer film, compared with a reflective film formed of a metal or the like, light absorption from the light-transmitting sheet is also less, and light can be reflected efficiently. In the case of using both the metal film and the dielectric multilayer film as the first light reflection film 13, the dielectric multilayer film and the metal film may be arranged in this order from the surface on which they are provided. In addition, when a metal film is used for the first light reflection film 13, a single element or an alloy such as aluminum and silver can be used. In addition, in the light-emitting device, other structures are the same as those already described.

Moreover, in the light-emitting device demonstrated in each embodiment, the structure of the 1st translucent member 3 of the package 10 may be the form shown to FIG. 10A and FIG. 10B. FIG. 10A and FIG. 10B are schematic diagrams each schematically showing a modification of the package of each embodiment. In the drawings, the hatching used to represent the cross-sectional parts of the light-emitting element is omitted from the viewpoint of the ease of observation of the drawings. In the package 10A, the first translucent member 3A is formed so as to cover the side surface and the second surface of the light-emitting element 1 . The material and the like of the first translucent member 3A are the same as those already described. By forming the first translucent member 3A over the upper surface of the light-emitting element 1 , that is, the second surface and the side surface, it is easy to send light from the light-emitting element 1 to the far part of the light guide plate 30 . In addition, in the package 10B, the lower surface of the first translucent member 3A disposed on the side surface and the second surface of the light emitting element 1 and the lower surface of the light emitting element 1 may be arranged to expose the element electrode 5 of the light emitting element 1 . The second light reflection film 14 is formed in such a manner. The second light reflection film 14 may be formed of a white resin capable of diffuse reflection, or may be formed of the same member as the second covering member already described. In the package 10B, the extraction efficiency of the light from the light-emitting element 1 irradiated from the light-guiding plate 2 side can be further improved by including the second light-reflecting film 14 . Furthermore, when any one of the packages 10A and 10B shown in FIG. 10A and FIG. 10B is installed on the light guide plate 30 and used, the first light reflection is provided on the upper surface of the first translucent member 3A. The state of the film 13 is used.

Next, a light-emitting device according to a fifth embodiment will be described with reference to FIG. 11 . FIG. 11 is a schematic cross-sectional view of a light-emitting device according to a fifth embodiment. Here, in the step of preparing the intermediate that has already been described, the package 10 will be described in a state where the package 10 is placed on the light guide plate 31 via the third light transmissive member 40 . In the drawings, the hatching for showing the cross-sectional parts is omitted from the viewpoint of the ease of observation of the package and the third translucent member in the drawings. The light-emitting device of the fifth embodiment is different from the light-emitting device of the second embodiment shown in FIG. 6 in that the first auxiliary wiring 21a1 is formed on the first wiring 21a, and the second auxiliary wiring is formed on the second wiring 21b. 21b1. That is, in the light-emitting device according to the fifth embodiment, there is a case in which the resin material filled in one or both of the reflecting member 70 or the second covering member 50 formed in the second recess 31b of the light guide plate 31 is hardened. Shrinkage (dents), resulting in curved depressions on the upper surface. Therefore, the flatness is maintained by providing the first auxiliary wiring 21a1 on the first wiring 21a and providing the second auxiliary wiring 21b1 on the second wiring 21b. In addition, since a curved depression is generated on the upper surface of the second covering member 50, the first wiring 21a may become thinner or thinner, or the resistance may increase. Therefore, by providing the first auxiliary wiring 21a1 on the first wiring 21a and providing the second auxiliary wiring 21b1 on the second wiring 21b, resistance can be reduced or disconnection can be prevented.

The 1st auxiliary wiring 21a1 used here is formed by overlapping the material of the same width and the same thickness as the 1st wiring 21a, and makes the recess of a resin material nearly flat. Also, the second auxiliary wiring 21b1 is formed by overlapping a material having the same width and thickness as the second wiring 21b, similarly to the first auxiliary wiring 21a1, so that the depression of the resin material is made nearly flat. In addition, the 1st auxiliary wiring 21a1 and the 2nd auxiliary wiring 21b1 may be formed so that it may become a multiple layer of 2 or more layers, and flatness can be maintained.

In addition, the first auxiliary wiring 21a1 and the second auxiliary wiring 21b1 may be formed to have a wider wiring width than the first wiring 21a and the second wiring 21b. Further, the first auxiliary wiring 21a1 is formed with a length of 50% or more of the length of the first wiring 21a, and is formed in a range in which the recessed portion can be flattened. Similarly, the length of the second auxiliary wiring 21b1 is formed at a length of 50% or more of the length of the second wiring 21b. In addition, the first auxiliary wiring 21a1 and the second auxiliary wiring 21b1 may be formed to have the same length or different lengths. The first auxiliary wiring 21a1 and the second auxiliary wiring 21b1 can be formed by printing or the like in the same manner as the first wiring 21a and the second wiring 21b. Therefore, it is preferable to arrange the first auxiliary wiring 21a1 and the second auxiliary wiring 21b1 on the first wiring 21a and the second wiring 21b in the vicinity of the most recessed portion or at the connection between cells.

Next, the light-emitting device of the sixth embodiment will be described with reference to FIG. 12 . FIG. 12 is a schematic cross-sectional view of a light-emitting device according to a sixth embodiment. Here, in the step of preparing the intermediate that has already been described, the package 10 will be described in a state where the package 10 is placed on the light guide plate 31 via the third light transmissive member 40 . In the drawings, the hatching for showing the cross-sectional parts is omitted from the viewpoint of the ease of observation of the package and the third translucent member in the drawings. The light-emitting device 100D of the sixth embodiment is different from the light-emitting device of the second embodiment of FIG. 6 in that the second covering member 50 is formed in the second recess 31b of the light guide plate 31, and is formed along the light guide plate. The shape of the second recess 31b of 31 is such that the third light reflection film 15 is formed on the surface of the light guide plate 31 on the opposite side to the light emission side. The third light reflection film 15 is provided so as to cover one side surface of the light guide plate 31 excluding the first concave portion 31 a. Preferably, the third light reflection film 15 is formed of, for example, a material that blocks or reflects light by 80% or more. As the third light-reflecting film 15, a single-layer film containing a metal, a multilayer film containing a metal, or a multilayer film containing a dielectric formed by a plurality of dielectric bulk layers of two or more types (dielectric multilayer film) can be used. membrane). In addition, the third light reflection film 15 can be formed by a sputtering method as an example. For the third light reflection film 15, the same material and the same formation method as the first light reflection film described above can be used.

Furthermore, the light-emitting device 100D is formed by filling the second concave portion 31 b of the light guide plate 31 with the second covering member 50 . The light-emitting device 100D can also be electrically connected to the electrode 5 of the light-emitting element 1 via the connection substrate 90 . The wiring board 90 is provided with the wiring layer 91 on the base material, and is provided with the coating layer 92 containing an insulating material in order to protect the wiring layer 91 . The wiring board 90 includes a flat support member and a wiring layer 91 arranged on the surface and/or inside of the support member. Furthermore, the wiring board 90 is configured such that the shape and size of the electrodes are set in accordance with the number of the light-emitting elements 1 , and the structure and size of the element electrodes.

The support member of the wiring board 90 is preferably made of an insulating material, and it is preferable to use a material that does not easily transmit light emitted from the light-emitting element 1 or external light. The wiring board 90 may be a material having a certain degree of strength, or may be used as a material for a sheet or a flexible substrate. Specifically, ceramics such as alumina, aluminum nitride, and mullite, phenol resins, epoxy resins, polyimide resins, BT resins (bismaleimide triazine resins), and polyphthalamides (PPA) may be mentioned. ) and other resins.

The wiring layer 91 includes a first wiring 91 a electrically connected to the first electrode 5 a of the package 10 , and a second wiring 91 b electrically connected to the second electrode 5 b of the package 10 . The positions where the first wiring 91a and the second wiring 91b are formed are different, but the material and the like are the same as those already described. Furthermore, the wiring layer 91 is covered with the covering layer 92 except for the position of the electrode 5 . The coating layer 92 protects the wiring layer 91 . The coating layer 92 is provided so as to cover the wiring layer 91 by forming an opening 92 a at the position of the electrode 5 of the package 10 . The coating layer 92 is formed of, for example, an insulating member using polyimide as a base material. Moreover, the coating layer 92 covers the wiring layer 91 by, for example, screen printing or the like, and is formed so as to provide openings 92a at the positions of the electrodes 5 through a mask. Furthermore, the wiring layer 91 of the wiring board 90 is formed so as not to be short-circuited in the step of forming a pair of wirings described above before being electrically connected to the first electrode 5a and the second electrode 5b of the package 10 . Since the light-emitting device 100D has the above-mentioned configuration, the third light-reflecting film 15 can be used without reducing the irradiation efficiency of the light from the light guide plate 31 .

Next, the light-emitting device of the seventh embodiment will be described with reference to FIG. 13 . 13 is a schematic cross-sectional view of a light-emitting device according to a seventh embodiment. In addition, the same code|symbol is attached|subjected to the structure already demonstrated, and description is abbreviate|omitted. In addition, here, in the process of preparing an intermediate material already demonstrated, the state where the package 10 is arrange|positioned on the light guide plate 31 via the 3rd light-transmitting member 40 is demonstrated. Further, the first wiring 21a and the second wiring 21b are formed by a step of forming a pair of wirings by irradiating laser light to the wiring portion formed by the metal paste layer to remove a part of the metal paste layer. The light-emitting device 100E according to the seventh embodiment is different in that the insulating member 60 is provided in two layers in order to flatten the depression formed in the second covering member 50 . That is, the light emitting device 100E includes the light guide plate 31 , the second covering member 50 filled in the second recess 31 b of the light guide plate 31 , the package 10 having the light emitting element 1 provided in the first recess 31 a of the light guide plate 31 , and the light emitting element 1 The electrodes 5 are respectively connected to the first wiring 21a and the second wiring 21b formed on the second covering member 50, and the insulating member 60 provided so as to cover the first wiring 21a and the second wiring 21b and to open the external connection portion. The insulating film 60a and the auxiliary insulating film 60b of the insulating member 60 are provided corresponding to the concave portion of the insulating member 60 formed by shrinking the second covering member 50 when it is hardened. In this way, in the light-emitting device 100E, by covering the recessed portion of the second covering member 50 with the insulating film 60a and the auxiliary insulating film 60b in two layers, flatness can be ensured. Therefore, in the light-emitting device 100E, the coating accuracy of each member can be improved, and the efficiency of the operation speed (for example, UPH: unite power hour) can be achieved. The auxiliary insulating film 60b is not limited to one layer, and may be two or more layers. In addition, the insulating film 60a only needs to cover at least a part of the second covering member 50 and the pair of wirings 21 . For example, the insulating film 60a is formed in a state where a part of the electrical connection of the pair of wirings 21 is to be opened.

In addition, in the 1st to 7th embodiment, in the relationship of the drawings, the diagrams that clearly show the constituent parts of the second covering member 50 or the parts where the second covering member 50 and the reflecting member 70 are formed are clearly shown. The diagrams of the constituent parts are shown mixed. However, in each embodiment, it goes without saying that the second covering member 50 is formed on the light guide plates 30 and 31 , or the second covering member 50 and the reflecting member 70 may be formed on the light guide plates 30 and 31 . any composition. In addition, in each embodiment, it may be formed so as to include the wide portions 21c and 22c, or to include the insulating film 60a and/or the auxiliary insulating film 60b.

1: Light-emitting element 2: The first covering member 3: 1st translucent member 3A: 1st translucent member 4: Second translucent member 5: Electrodes 5a: 1st electrode 5b: 2nd electrode 10: Package 10A: Package 10B: Package 13: The first light reflection film 14: The second light reflection film 15: The third light reflection film 20: Wiring 20a: 1st wiring 20b: 2nd wiring 21: Wiring 21a: 1st wiring 21a1: 1st auxiliary wiring 21b: 2nd wiring 21b1: 2nd auxiliary wiring 21c: Wide section 22: Wiring 22c: Wide section 22d: Wiring Department 25: Metal paste layer 30: light guide plate 30A: Through hole 31: light guide plate 31a: 1st recess 31b: 2nd recess 31c: 3rd recess 40: Third translucent member 50: Second covering member 60: Insulation member 60a: insulating film 60b: Auxiliary insulating film 70: Reflective member 80: Shading member 90: Wiring board 91a: 1st wiring 91b: 2nd wiring 92: Coating 92a: Opening 100: Lighting device 100D: Lighting device 100E: Lighting device

FIG. 1A is a schematic perspective view of the package of the embodiment viewed from obliquely above. FIG. 1B is a schematic bottom view of the package of the embodiment. FIG. 1C is a schematic cross-sectional view of the package of the embodiment. 2A is a schematic cross-sectional view illustrating a method of manufacturing the light-emitting device according to the embodiment. 2B is a schematic cross-sectional view illustrating a method of manufacturing the light-emitting device according to the embodiment. 2C is a schematic cross-sectional view illustrating a method of manufacturing the light-emitting device according to the embodiment. 2D is a schematic cross-sectional view illustrating a method of manufacturing the light-emitting device of the embodiment. 2E is a schematic cross-sectional view illustrating a method of manufacturing the light-emitting device according to the embodiment. 3A is a schematic bottom view illustrating a method of manufacturing the light-emitting device according to the embodiment. 3B is a schematic bottom view illustrating a method of manufacturing the light-emitting device of the embodiment. 3C is a schematic bottom view illustrating a method of manufacturing the light-emitting device according to the embodiment. 3D is a schematic bottom view illustrating a method of manufacturing the light-emitting device of the embodiment. FIG. 4A is a schematic plan view of the light-emitting device according to the embodiment. 4B is a schematic perspective view of the light-emitting device of the embodiment. FIG. 5 is a schematic perspective view of the light-emitting device according to the second embodiment, viewed from the side of the light guide plate. FIG. 6 is a schematic cross-sectional view of a light-emitting device according to a second embodiment. FIG. 7 is a schematic plan view of the light-emitting device of the second embodiment. FIG. 8 is a schematic plan view of a light-emitting device according to a third embodiment. FIG. 9 is a schematic cross-sectional view of a light-emitting device according to a fourth embodiment. FIG. 10A is a schematic diagram schematically showing a modification of the package of each embodiment. FIG. 10B is a schematic diagram schematically showing a modification of the package of each embodiment. FIG. 11 is a schematic cross-sectional view of a light-emitting device according to a fifth embodiment. FIG. 12 is a schematic cross-sectional view of a light-emitting device according to a sixth embodiment. 13 is a schematic cross-sectional view of a light-emitting device according to a seventh embodiment.

10: Package

20: Wiring

20a: 1st wiring

20b: 2nd wiring

Claims (16)

A method of manufacturing a light-emitting device, comprising the steps of: preparing an intermediate including a light-emitting element having a pair of electrodes on a first surface side, and covering the light-emitting element such that a part of the surface of the pair of electrodes is exposed the first covering member; forming a metal paste layer continuously covering the exposed pair of electrodes and the first covering member; and irradiating the metal paste layer with laser light, so that the metal paste layer between the pair of electrodes and the A part of the metal paste layer on the first covering member is removed, and a pair of wirings is formed so that the pair of electrodes is not short-circuited. A first light-transmitting member is arranged on the second surface side, the first light-transmitting member is arranged on a light guide plate, and the metal paste layer used in the step of forming the metal paste layer contains a resin in a plurality of metal powders, The light guide plate includes a plurality of first recesses on which the light-emitting elements are arranged, and second recesses arranged between adjacent first recesses, a reflection member is arranged in the second recess, and a second recess that covers the reflection member is arranged. 2. A covering member, wherein the wiring is arranged on the second covering member, and the wiring arranged on the second recess has a portion wider than the wiring arranged on the first recess. A method of manufacturing a light-emitting device, comprising the following steps: Prepare an intermediate including a light-emitting element having a pair of electrodes on the first surface side, and a first covering member covering the light-emitting element such that a part of the surfaces of the pair of electrodes is exposed; forming the exposed one a metal paste layer continuously covering the electrodes and the first covering member; and irradiating the metal paste layer with laser light, and irradiating the metal paste layer between the pair of electrodes and the metal paste layer on the first covering member A part of the above-mentioned light-emitting element is removed, and a pair of wirings is formed so that the pair of electrodes is not short-circuited. In the step of preparing the above-mentioned intermediate, the light-emitting element is provided with a first light-transmitting member on the side of the second surface opposite to the first surface. The first light-transmitting member is arranged on a light guide plate, the metal paste layer used in the step of forming the metal paste layer contains resin in a plurality of metal powders, and the light guide plate is provided with a plurality of first light-emitting elements. 1. a concave portion, and a second concave portion disposed between adjacent first concave portions, a reflecting member is disposed in the second concave portion, and a second covering member that covers the reflecting member is disposed, and the wiring is disposed on the second covering On the member, the wiring arranged on the second recess is formed by overlapping a plurality of recesses of the reflecting member and/or the second covering member due to shrinkage of the member during hardening. A method of manufacturing a light-emitting device, comprising the steps of: preparing an intermediate including a light-emitting element having a pair of electrodes on a first surface side, and covering the light-emitting element such that a part of the surface of the pair of electrodes is exposed the first covering member; forming a metal paste layer that continuously covers the exposed pair of electrodes and the first covering member; and irradiating the metal paste layer with laser light to cover the metal paste layer and the first covering member between the pair of electrodes A part of the above-mentioned metal paste layer is removed, and a pair of wirings is formed so that the above-mentioned pair of electrodes is not short-circuited. The first translucent member is further provided with a light reflection film on the first translucent member, the first translucent member is disposed in the through hole of the light guide plate, and is used in the step of forming the metal paste layer. The above-mentioned metal paste layer contains resin in a plurality of metal powders. A method of manufacturing a light-emitting device, comprising the steps of: preparing an intermediate including a light-emitting element having a pair of electrodes on a first surface side, and covering the light-emitting element such that a part of the surface of the pair of electrodes is exposed the first covering member; forming a metal paste layer continuously covering the exposed pair of electrodes and the first covering member; and irradiating the metal paste layer with laser light, so that the metal paste layer between the pair of electrodes and the A part of the metal paste layer on the first covering member is removed, and a pair of wirings is formed so that the pair of electrodes is not short-circuited. The first translucent member is arranged on the second surface side, The first translucent member is arranged on a light guide plate, the metal paste layer used in the step of forming the metal paste layer contains a resin in a plurality of metal powders, and the light guide plate includes a plurality of first light emitting elements arranged The concave portion and the second concave portion arranged between the adjacent first concave portions, a light reflection film is provided on the surface of the light guide plate where the second concave portion is formed, and the wiring is formed in a device having a pair of electrodes electrically connected to the light-emitting element. The wiring substrate of the wiring layer. A method of manufacturing a light-emitting device, comprising the steps of: preparing an intermediate including a light-emitting element having a pair of electrodes on a first surface side, and covering the light-emitting element such that a part of the surface of the pair of electrodes is exposed the first covering member; forming a metal paste layer continuously covering the exposed pair of electrodes and the first covering member; and irradiating the metal paste layer with laser light, so that the metal paste layer between the pair of electrodes and the A part of the metal paste layer on the first covering member is removed, and a pair of wirings is formed so that the pair of electrodes is not short-circuited. A first light-transmitting member is arranged on the second surface side, the first light-transmitting member is arranged on a light guide plate, and the metal paste layer used in the step of forming the metal paste layer contains a resin in a plurality of metal powders, The light guide plate is provided with a plurality of first recesses on which the light-emitting elements are arranged, and second recesses arranged between the adjacent first recesses, and the second recesses are formed in the form of recesses caused by shrinkage during curing. A second covering member is arranged, the pair of wirings are arranged on the second covering member, and after the step of forming the pair of wirings, an insulating film covering the pair of wirings and at least a part of the second covering member is arranged, and an auxiliary insulating film covering the insulating film at the position corresponding to the depression. The method for manufacturing a light-emitting device according to any one of claims 1 to 5, wherein after the step of forming the pair of wirings, the step of covering at least the pair of electrodes with an insulating member is included. The method for manufacturing a light-emitting device according to any one of claims 1 to 5, wherein the step of forming the pair of wirings includes the step of irradiating the laser light having a width narrower than the distance between the pair of electrodes. The method for manufacturing a light-emitting device according to any one of claims 1 to 5, wherein the step of forming the metal paste layer includes the step of forming by any method of printing or spraying. The method for manufacturing a light-emitting device according to any one of claims 1 to 5, wherein in the step of preparing the intermediate, the first covering member is disposed on the first surface of the light-emitting element and between the pair of electrodes In the step of forming the pair of wirings, a part of the first covering member disposed on the first surface of the light-emitting element and between the pair of electrodes is removed by the laser light. The method for manufacturing a light-emitting device according to any one of claims 1 to 5, wherein in the step of preparing the intermediate, the pair of electrodes of the light-emitting element is identified, and in the step of forming the pair of wirings, the pair of electrodes is prepared The laser light is irradiated between the pair of electrodes of the light-emitting element identified in the intermediate step. The method for manufacturing a light-emitting device according to any one of claims 1 to 5, wherein in the step of preparing the intermediate, a plurality of the light-emitting elements are used, and in the step of forming the metal paste layer, the plurality of light-emitting elements are respectively continuously covered. In the light-emitting element, in the step of forming the wiring, the plurality of light-emitting elements are electrically connected. The method for manufacturing a light-emitting device according to any one of claims 1 to 5, wherein the metal powder comprises at least any one of silver powder, copper powder, or silver powder or copper powder covered by a metal film. The method for manufacturing a light-emitting device according to any one of claims 1 to 5, wherein the metal paste layer used in the step of forming the metal paste layer is the concentration of the metal powder of 60 wt % or more and 95 wt % or less. The method for manufacturing a light-emitting device according to any one of claims 1 to 5, wherein in the step of forming the metal paste layer, the thickness of the metal paste layer is formed to be 1 μm or more. The method for manufacturing a light-emitting device according to any one of claims 1 to 5, wherein the metal powder is a particle of 0.01 μm or more and 10 μm or less. The method of manufacturing a light-emitting device according to claim 6, wherein in the step of covering the pair of electrodes with an insulating member, the insulating member is colored.

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