TWI773543B - Powder atomic layer deposition machine for reducing powder adhesion - Google Patents

Abstract

The present invention provides a powder atomic layer deposition machine capable of reducing powder adhesion, which includes a vacuum chamber, a shaft sealing device and a driving unit. The driving unit is connected to the vacuum chamber via the shaft sealing device and drives the vacuum chamber to rotate. The vacuum chamber includes a cavity and a cover, wherein the cover includes an inner surface, a bottom surface and a first annular inclined surface. The bottom surface is connected to the inner surface through the first annular inclined surface to form a groove on the inner surface of the cover. When the cover is connected to the cavity, the groove on the cover and the space of the cavity form a special-shaped reaction space, which can prevent the powder from adhering on the inner surface of the cavity or the cover during the atomic layer deposition process.

Description

Powder Atomic Layer Deposition Machine for Reduced Powder Sticking

The present invention relates to a powder atomic layer deposition machine capable of reducing powder sticking, which can avoid powder sticking to the inner surface of a cavity or a cover during the process of atomic layer deposition.

Nanoparticles are generally defined as particles smaller than 100 nanometers in at least one dimension that are physically and chemically distinct from macroscopic substances. In general, the physical properties of macroscopic substances are independent of their size, but this is not the case for nanoparticles, which have potential applications in fields such as biomedicine, optics, and electronics.

Quantum Dot (Quantum Dot) is a nanoparticle of semiconductor material. The currently studied semiconductor materials are II-VI materials, such as ZnS, CdS, CdSe, etc. Among them, CdSe has attracted the most attention. The size of quantum dots is usually between 2 and 50 nanometers. When the quantum dots are irradiated with ultraviolet light, the electrons in the quantum dots absorb energy and transition from the valence band to the conduction band. Excited electrons release energy by emitting light as they travel from the conduction band back to the valence band.

The energy gap of quantum dots is related to the size. The larger the size of the quantum dot, the smaller the energy gap, and it will emit light with a longer wavelength after irradiation. The smaller the size of the quantum dot, the larger the energy gap, and the wavelength will be emitted after irradiation. shorter light. For example, quantum dots of 5 to 6 nanometers will emit orange or red light, while quantum dots of 2 to 3 nanometers will emit blue or green light. Of course, the light color depends on the material composition of the quantum dots.

Light emitting diodes (LEDs) using quantum dots produce light close to a continuous spectrum, and at the same time have high color rendering properties, which are beneficial to improve the luminous quality of light emitting diodes. In addition, the wavelength of the emitted light can be adjusted by changing the size of the quantum dots, making the quantum dots become the focus of the development of the new generation of light-emitting devices and displays.

Although quantum dots have the above-mentioned advantages and characteristics, they are prone to agglomeration in the process of application or manufacture. In addition, quantum dots have high surface activity and easily react with air and water vapor, thereby shortening the life of quantum dots.

Specifically, when quantum dots are used as sealants for light-emitting diodes, agglomeration effects may occur, reducing the optical properties of quantum dots. In addition, after the quantum dots are made into the sealant of the light-emitting diodes, the external oxygen or moisture may still pass through the sealant and contact the surface of the quantum dots, resulting in oxidation of the quantum dots and affecting the quantum dots and light-emitting diodes. performance or service life. Defects and dangling bonds on the surface of quantum dots may also cause non-radiative recombination, which also affects the luminous efficiency of quantum dots.

At present, the industry mainly uses atomic layer deposition (ALD) to form a nanometer-thick film on the surface of the quantum dot, or to form a multi-layer film on the surface of the quantum dot to form a quantum well structure.

Atomic layer deposition can form a thin film with uniform thickness on the substrate, and can effectively control the thickness of the thin film. It is also suitable for three-dimensional quantum dots in theory. When the quantum dots are placed on the carrier plate, there will be contact points between adjacent quantum dots, so that the precursor gas of atomic layer deposition cannot contact these contact points, and it is impossible to form uniform thickness on the surface of all nanoparticles. film.

In order to solve the above-mentioned problems of the prior art, the present invention proposes a powder atomic layer deposition machine that can reduce powder sticking, and can fully stir powder during the atomic layer deposition process, so that the powder can be diffused into each area of the reaction space of the vacuum chamber , in order to facilitate the formation of a thin film of uniform thickness on the surface of each powder.

An object of the present invention is to provide a powder atomic layer deposition machine that can reduce powder adhesion, which mainly includes a driving unit, a shaft sealing device and a vacuum chamber, wherein the driving unit is connected through the shaft sealing device and drives the vacuum chamber. turn. The vacuum cavity includes a cavity and a cover, wherein at least one groove is arranged on the inner surface of the cover, and the cavity has a space. When the cover is connected to the cavity, the groove on the inner surface of the cover forms a reaction space with the space of the cavity.

The groove on the inner surface of the cover includes a bottom surface and a first annular inclined surface, wherein the bottom surface is connected to the inner surface through the first annular inclined surface, so that the shape of the groove on the inner surface approximates a truncated cone. The special shaped reaction space is formed through the cover and the cavity, which can effectively avoid the situation that the powder sticks to the cover and/or the cavity during the process of atomic layer deposition.

The cavity includes a bottom, a second annular inclined surface and an inner surface, wherein the bottom is connected to the inner surface through the second annular inclined surface. The bottom of the cavity and the second annular inclined surface can form a space similar to a truncated cone, and the inner surface of the cavity can form a space similar to a cylinder, which can further prevent powder from sticking to the cover and/or the cavity superior.

An object of the present invention is to provide a powder atomic layer deposition machine capable of reducing powder adhesion, wherein the shaft sealing device includes an inner tube body and an outer tube body. The inner pipe body is arranged in the accommodating space of the outer pipe body, and the inner pipe body has a connection space for at least one air extraction pipeline, at least one intake pipeline and at least one non-reactive gas transmission pipeline. The non-reactive gas delivery line and/or the gas inlet line can be connected to an extension tube, and the precursor gas and/or the non-reaction gas are delivered to the reaction space of the vacuum chamber through the extension tube.

The extension tube body of the present invention can pass through the space of the cavity and extend into the groove of the cover body. In addition, at least one air outlet can be provided on the end of the extending pipe body and/or the pipe wall, and the precursor gas and/or the non-reactive gas can be delivered to the reaction space through the air outlet. Through the arrangement of the extension tube, the precursor gas can be uniformly diffused into the reaction space, and the non-reactive gas can evenly blow the powder in the reaction space, so that the powder can be diffused to various regions of the reaction space.

In order to achieve the above object, the present invention provides a powder atomic layer deposition machine capable of reducing powder adhesion, comprising: a vacuum chamber, including: a chamber including a bottom and an inner surface, wherein the bottom and the inner surface are formed a space; a cover body, including an inner surface, a bottom surface and a first annular inclined surface, wherein the bottom surface is connected to the inner surface through the first annular inclined surface, and a groove is formed on the inner surface of the cover body, wherein the The inner surface covers the space of the cavity, so that the groove of the cover faces the space, and a reaction space is formed between the cover and the cavity; a shaft sealing device includes an outer tube body and an inner tube body, wherein the outer tube body The body has an accommodating space for accommodating the inner tube body, wherein the outer tube body is connected to the vacuum chamber body; a driving unit is connected to the outer tube body, and drives the vacuum chamber body to rotate through the outer tube body; It is located in the inner tube body of the shaft sealing device and is fluidly connected to the reaction space of the vacuum chamber, and is used to extract a gas in the reaction space; and at least one intake line is located in the inner tube body of the shaft sealing device and is fluidly connected to the vacuum chamber. The reaction space is used for delivering a precursor gas or a non-reaction gas to the reaction space.

The present invention provides another powder atomic layer deposition machine that can reduce powder sticking, including: a vacuum chamber, including: a chamber, including a bottom, an annular inclined surface and an inner surface, wherein the bottom is connected to the inner surface through the annular inclined surface surface, and a space is formed between the bottom, the annular inclined surface and the inner surface; a cover body, including an inner surface, the inner surface of the cover body covers the space of the cavity, and forms a reaction space between the cover body and the cavity ; a shaft sealing device, including an outer tube body and an inner tube body, wherein the outer tube body has an accommodating space for accommodating the inner tube body, wherein the outer tube body is connected to the vacuum chamber; a drive unit is connected to the outer tube body, and drives the vacuum chamber to rotate through the outer tube body; at least one air extraction line is located in the inner tube body of the shaft sealing device, fluidly connected to the reaction space of the vacuum chamber body, and used to extract a gas in the reaction space; and at least one The air inlet line is located in the inner tube body of the shaft sealing device, is fluidly connected to the reaction space of the vacuum chamber, and is used for delivering a precursor gas or a non-reaction gas to the reaction space.

In the powder atomic layer deposition machine capable of reducing powder adhesion, the cavity includes a second annular inclined surface, and the bottom is connected to the inner surface through the second annular inclined surface.

The powder atomic layer deposition machine for reducing powder adhesion, wherein a first included angle is formed between the bottom surface of the cover body and the first annular inclined surface, and a first annular inclined surface and the inner surface of the cavity have a first angle. The second included angle, the first included angle is between 100 degrees and 170 degrees, and the second included angle is between 170 degrees and 100 degrees. There is a third included angle between the bottom of the cavity and the second annular inclined surface. A fourth included angle is formed between the two annular inclined surfaces and the inner surface of the cavity, the third included angle is between 100 degrees and 170 degrees, and the fourth included angle is between 170 degrees and 100 degrees.

The powder atomic layer deposition machine that can reduce powder adhesion, wherein the bottom of the cavity faces the bottom surface of the cover body, the inner surface of the cavity is a cylindrical body, and the perimeter of the cylindrical body is equal to the third of the cover body. The maximum perimeter of an annular bevel.

The powder atomic layer deposition machine for reducing powder adhesion, wherein a first included angle is formed between the bottom surface of the cover body and the first annular inclined surface, and a first annular inclined surface and the inner surface of the cavity have a first angle. The second included angle, the first included angle is between 100 degrees and 170 degrees, and the second included angle is between 170 degrees and 100 degrees.

The powder atomic layer deposition machine, which can reduce powder adhesion, includes an extension pipe body connected to the air inlet line, the extension pipe body is located in the reaction space, and extends into the groove of the cover body.

The powder atomic layer deposition machine for reducing powder adhesion, wherein a first included angle is formed between the bottom of the cavity and the annular inclined surface, and a second included angle is formed between the annular inclined surface and the inner surface of the cavity, and the first included angle is The included angle is between 100 degrees and 170 degrees, and the second included angle is between 170 degrees and 100 degrees.

The powder atomic layer deposition machine that can reduce powder adhesion, wherein the inner surface of the cover body includes a groove, and the inner surface of the cover body covers the space of the cavity, so that the groove of the cover and the space of the cavity are formed reaction space.

Please refer to FIG. 1 , FIG. 2 , FIG. 3 and FIG. 4 , which are respectively a three-dimensional schematic view, a partially exploded cross-sectional schematic view, a cross-sectional schematic view, and a powder-sticking-reducing powder atomic layer deposition machine according to an embodiment of the present invention. Cross-sectional schematic diagram of the shaft sealing device of the powder atomic layer deposition machine. As shown in the figure, the powder atomic layer deposition machine 10 capable of reducing powder adhesion mainly includes a vacuum chamber 11 , a shaft sealing device 13 and a driving unit 15 , wherein the driving unit 15 is connected through the shaft sealing device 13 and drives the vacuum chamber The body 11 rotates.

The vacuum chamber 11 includes a cover 111 and a cavity 113 , wherein an inner surface 1111 of the cover 111 is used to cover the cavity 113 and form a reaction space 12 therebetween. Specifically, the cavity 113 includes a bottom 1131 and an inner surface 1133 , wherein the bottom 1131 is connected to the inner surface 1133 and a space 122 is formed therebetween.

The inner surface 1111 of the cover 111 is used to connect the cavity 113 and cover the space 122 of the cavity 113 to form a closed reaction space 12 between the cover 111 and the cavity 113 for accommodating a plurality of powders 121 . When the vacuum chamber 11 is standing still, the powder 121 will be deposited on the lower half of the reaction space 12 under the action of gravity. The powder 121 may be a quantum dot (Quantum Dot), such as II-VI semiconductor materials such as ZnS, CdS, CdSe, and the thin film formed on the quantum dot may be aluminum oxide (Al2O3).

The shaft sealing device 13 includes an outer tube body 131 and an inner tube body 133, wherein the outer tube body 131 has an accommodating space 132, and the inner tube body 133 has a connecting space 134, such as the outer tube body 131 and the inner tube body 133 can be a hollow cylinder. The accommodating space 132 of the outer tube body 131 is used for accommodating the inner tube body 133 , wherein the outer tube body 131 and the inner tube body 133 are coaxially arranged. The shaft seal device 13 may be a common shaft seal or a magnetic fluid shaft seal, and is mainly used to isolate the reaction space 12 of the vacuum chamber 11 from the external space, so as to maintain the vacuum of the reaction space 12 .

The driving unit 15 is connected to one end of the shaft sealing device 13 , and drives the vacuum chamber 11 to rotate through the shaft sealing device 13 .

The driving unit 15 can be connected to and drive the outer tube body 131 and the vacuum chamber 11 to continuously rotate in the same direction, for example, clockwise or counterclockwise. In an embodiment of the present invention, the driving unit 15 can be a motor, connected to the outer tube body 131 through at least one gear 14 , and drives the outer tube body 131 and the vacuum chamber 11 to rotate relative to the inner tube body 133 through the gear 14 .

At least one non-reactive gas delivery line 171 , at least one intake line 173 , a heater 175 , an exhaust line 177 and/or a temperature sensing unit 179 can be arranged in the connection space 134 of the inner pipe body 133 , as shown in FIG. 2 , Figure 3 and Figure 4.

The pumping line 177 is fluidly connected to the reaction space 12 of the vacuum chamber 11, and is used for pumping out the gas in the reaction space 12, so that the reaction space 12 is in a vacuum state, so that the atomic layer deposition process can be performed. Specifically, the pumping line 177 can be connected to a pump, and the gas in the reaction space 12 can be pumped out through the pump.

The gas inlet line 173 is fluidly connected to the reaction space 12 of the vacuum chamber 11, and is used for delivering a precursor gas or a non-reactive gas to the reaction space 12, wherein the non-reactive gas can be an inert gas such as nitrogen or argon. For example, the inlet line 173 can be connected to a precursor gas storage tank and a non-reactive gas storage tank through the valve assembly, and the precursor gas can be transported into the reaction space 12 through the valve assembly, so that the precursor gas is deposited on the surface of the powder 121 . In practical applications, the gas inlet line 173 may transport a carrier gas and the precursor gas into the reaction space 12 together. Then, the non-reactive gas is transported into the reaction space 12 through the valve assembly, and evacuated through the exhaust line 177 to remove the precursor gas in the reaction space 12 . In an embodiment of the present invention, the inlet line 173 can be connected to a plurality of branch lines, and different precursor gases are sequentially transported into the reaction space 12 through each branch line.

In addition, the inlet line 173 can increase the flow rate of the non-reactive gas delivered to the reaction space 12, and blow the powder 121 in the reaction space 12 through the non-reactive gas, so that the powder 121 is driven by the non-reactive gas and diffuses into the reaction space 12 of the various areas.

In an embodiment of the present invention, both the gas inlet line 173 and the non-reactive gas delivery line 171 can be used to deliver the non-reactive gas to the reaction space 12 , wherein the flow rate of the non-reactive gas delivered by the gas inlet line 173 is small, mainly used for In order to remove the precursor gas in the reaction space 12 , the flow rate of the non-reactive gas conveyed by the non-reactive gas transmission line 171 is relatively large, and is mainly used to blow the powder 121 in the reaction space 12 .

When the driving unit 15 of the present invention drives the outer tube body 131 and the vacuum chamber 11 to rotate, the inner tube body 133 and the non-reactive gas delivery line 171 , the air extraction line 177 and the air intake line 173 in the inner tube body 133 will not rotate along with it, which is advantageous. In order to improve the stability of the non-reactive gas and/or the precursor gas delivered to the reaction space 12 by the gas inlet line 173 and/or the non-reactive gas delivery line 171 .

The heater 175 is used for heating the connecting space 134 and the inner pipe body 133 , and heating the exhaust line 177 , the gas inlet line 173 and/or the non-reactive gas transmission line 171 in the inner pipe body 133 through the heater 175 . The temperature sensing unit 179 is used to measure the temperature of the heater 175 or the connection space 134 to know the working state of the heater 175 . Of course, another heating device is usually disposed inside, outside or around the vacuum chamber 11 , wherein the heating device is adjacent to or in contact with the vacuum chamber 11 and used to heat the vacuum chamber 11 and the reaction space 12 .

In the embodiment of the present invention, the inner surface 1111 of the cover body 111 may be provided with a bottom surface 1113 and a first annular inclined surface 1115 , wherein the first annular inclined surface 1115 is disposed around the bottom surface 1113 . The bottom surface 1113 is connected to the inner surface 1111 of the cover body 111 via the first annular inclined surface 1115 , and a groove 1112 is formed on the inner surface 1111 of the cover body 111 .

When the inner surface 1111 of the cover body 111 covers the space 122 of the cavity 113 , the inner surface 1111 and/or the bottom surface 1113 of the cover body 111 faces the bottom 1131 of the cavity 113 . The groove 1112 of the cover 111 and the space 122 of the cavity 113 form the reaction space 12 , wherein the bottom surface 1113 of the cover 111 is approximately parallel to the bottom 1131 of the cavity 113 . In addition, there is a rounded corner 1135 between the bottom 1131 of the cavity 113 and the inner surface 1133 , wherein the rounded corner 1135 surrounds the bottom 1131 of the cavity 113 .

Specifically, the area of the bottom surface 1113 of the cover 111 and/or the bottom 1131 of the cavity 113 according to the embodiment of the present invention is smaller than the cross-sectional area of the inner surface 1133 of the cavity 113 , and the maximum perimeter of the first annular inclined surface 1115 is It is approximately similar to the perimeter of the inner surface 1133 of the cavity 113 .

When the cover 111 is connected to the cavity 113 , the outer edge of the first annular inclined surface 1115 of the cover 111 is aligned with the inner surface 1133 of the cavity 113 , wherein the bottom surface 1113 of the cover 111 is connected to the cavity through the first annular inclined surface 1115 The inner surface 1133 of the 113 forms an integral space in the reaction space 12 between the cover 111 and the cavity 113 .

Specifically, there is a first angle a1 between the bottom surface 1113 of the cover body 111 and the first annular inclined surface 1115 , and a second included angle a2 between the first annular inclined surface 1115 and the inner surface 1133 of the cavity 113 . , wherein the first included angle a1 is between 100 degrees and 170 degrees, and the second included angle a2 is between 170 degrees and 100 degrees. Of course, the angle ranges of the first included angle a1 and the second included angle a2 are only an embodiment of the present invention, and are not intended to limit the scope of the right of the present invention.

In an embodiment of the present invention, the first annular inclined surface 1115 can be projected on a virtual plane parallel to the bottom surface 1113 to form a virtual ring, wherein the distance between the inner circle and the outer circle of the virtual ring is the same as the distance between the bottom surface 1113 The ratio of the radii is between 6:1 and 1:6. Of course, the range of the projected length between the first annular inclined surface 1115 and the bottom surface 1113 is only an embodiment of the present invention, and is not a limitation of the scope of the rights of the present invention.

The reaction space 12 formed by the cover 111 and the cavity 113 in the embodiment of the present invention can be divided into a first space 123 and a second space 125 , wherein the first space 123 is a truncated cone, and the second space 125 is approximately cylindrical body. The special shape design of the reaction space 12 in the embodiment of the present invention can effectively prevent the powder 121 from sticking to the surface of the cover 111 and/or the cavity 113 during the atomic layer deposition process.

The reaction space 12 of the vacuum chamber 11 according to the present invention has an extension pipe 172, as shown in FIG. 3, wherein the extension pipe 172 is connected to the inlet line 173 and/or the non-reactive gas delivery line 171, and extends to The groove 1112 of the cover body 111 or the first space 123 of the vacuum chamber 11 . At least one air outlet 1721 may be disposed on the end and/or the tube wall of the extending tube body 172 , and the precursor gas or the non-reactive gas can be delivered to the reaction space 12 through the air outlet 1721 .

Specifically, the present invention mainly forms the reaction space 12 with a special shape through the cover 111 and the cavity 113 , so as to reduce the powder 121 from sticking to the surface of the vacuum cavity 11 . As shown in FIG. 5 , when the cover 111 and/or the cavity 113 do not have the special shape of the present invention, for example, the reaction space 12 formed by the cover 111 and the cavity 113 is cylindrical, the powder 121 tends to stick to At the corners 115 of the cover 111 and/or the cavity 113 , and cause the loss of the powder 121 . In contrast, as shown in FIG. 6 , when the cover body 111 and/or the cavity 113 have the special shape of the present invention, the sticking of the powder 121 can be greatly reduced, and the unnecessary powder 121 can be effectively reduced. consume.

In another embodiment of the present invention, as shown in FIGS. 7 and 8 , the cavity 113 may include a bottom 1131 , an inner surface 1133 and a second annular inclined surface 1137 , wherein the bottom 1131 is connected to the inner side through the second annular inclined surface 1137 Surface 1133. There is a third included angle a3 between the bottom 1131 of the cavity 113 and the second annular inclined surface 1137 , and a fourth included angle a4 between the inner surface 1133 of the cavity 113 and the second annular inclined surface 1137 , wherein the third included angle a3 is between 100 degrees and 170 degrees, and the fourth included angle a4 is between 170 degrees and 100 degrees.

The cover 111 of the embodiment of the present invention is the same as that in FIG. 2 , wherein the reaction space 12 formed by the cover 111 and the cavity 113 can be divided into a first space 123 , a second space 125 and a third space 127 . The first space 123 and the third space 127 are approximately truncated cones, and the second space 125 is approximately cylindrical. The first space 123 is connected to the third space 127 through the second space 125 . The special shape design of the reaction space 12 according to the embodiment of the present invention can effectively prevent the powder 121 from sticking to the surface of the cover 111 and/or the cavity 113 .

In addition, the extension tube 172 can pass through the third space 127 and the second space 125 of the reaction space 12 and extend to a part of the first space 123 , wherein the first space 123 is the groove 1112 provided on the cover body 111 .

In another embodiment of the present invention, as shown in FIG. 9 , the cavity 113 includes a bottom 1131 , an inner surface 1133 and an annular inclined surface 1139 , wherein the annular inclined surface 1139 is arranged around the bottom 1131 , so that the cavity 113 is The bottom 1131 is connected to the inner surface 1133 via the annular inclined surface 1139 , and a space 122 is formed between the bottom 1131 , the annular inclined surface 1139 and the inner surface 1133 .

The inner surface 1111 of the cover body 111 is used to cover the space 122 of the cavity body 113 , and a reaction space 12 is formed between the cover body 111 and the cavity body 113 . In addition, a bottom surface 1113 can also be provided on the inner surface 1111 of the cover body 111 , wherein a rounded corner 1117 is arranged around the bottom surface 1113 , and the bottom surface 1113 is connected to the inner surface 1133 of the cavity 113 through the rounded corners 1117 , and is on the inner surface of the cover body 111 . A groove 1114 is formed on the 1111 , wherein the groove 1114 of the cover 111 and the space 122 of the cavity 113 form the reaction space 12 . In the embodiment of the present invention, the space formed by the bottom 1131 of the cavity 113 and the annular inclined surface 1139 is approximately truncated cone shape, and the space formed by the inner surface 1133 of the cavity 113 and the bottom surface 1113 and/or the rounded corners 1117 of the cover 111 is approximately cylindrical.

In an embodiment of the present invention, there is a first included angle a1 between the bottom 1131 of the cavity 113 and the annular inclined surface 1139 , and a second included angle a2 between the annular inclined surface 1139 and the inner surface 1133 of the cavity 113 , wherein the first included angle a2 The included angle a1 is between 100 degrees and 170 degrees, and the second included angle a2 is between 170 degrees and 100 degrees.

In practical application, it can be further provided on the inner surface 1111 , the bottom surface 1113 , the first annular inclined surface 1115 , the bottom 1131 , the inner surface 1133 , the second annular inclined surface 1137 and/or the annular inclined surface 1139 of the cover body 111 . An anti-stick layer, for example, the anti-stick layer can be polytetrafluoroethylene (Teflon), fused alkyl n-ketene dimer or a hydrophobic material with a contact angle greater than 130°, which can further prevent the powder 121 from sticking on the surface of the vacuum chamber 11 . In different embodiments, the cover body 111 and the cavity 113 can also be electropolished, so that the inner surface 1111 , the bottom surface 1113 , the first annular slope 1115 , the bottom 1131 , the inner surface 1133 , the first annular slope 1115 of the cover body 111 , the bottom 1131 of the cavity 113 , the inner surface 1133 , the second The two annular inclined surfaces 1137 and/or the annular inclined surfaces 1139 form a smooth surface, which can also reduce the adhesion of the powder 121 .

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Modifications should be included within the scope of the patent application of the present invention.

10: Powder atomic layer deposition machine that can reduce powder sticking 11: Vacuum chamber 111: Cover 1111: inner surface 1112: Groove 1113: Bottom 1114: Groove 1115: First annular bevel 1117: rounded corners 113: Cavity 1131: Bottom 1133: Inside Surface 1135: rounded corners 1137: Second annular bevel 1139: Ring Bevel 115: Corner 12: Reaction Space 121: Powder 122: Space 123: First Space 125: Second space 127: Third space 13: Shaft seal device 131: outer tube body 132: accommodating space 133: inner tube body 134: Connect Space 14: Gear 15: Drive unit 171: Non-reactive gas delivery line 172: Extension tube body 1721: Air vent 173: Intake line 175: Heater 177: Exhaust line 179: Temperature Sensing Unit a1: the first included angle a2: Second included angle a3: the third angle a4: Fourth included angle

FIG. 1 is a three-dimensional schematic diagram of an embodiment of a powder atomic layer deposition machine capable of reducing powder adhesion according to the present invention.

FIG. 2 is a partially exploded cross-sectional schematic diagram of an embodiment of the powder atomic layer deposition machine capable of reducing powder sticking according to the present invention.

3 is a schematic cross-sectional view of an embodiment of a powder atomic layer deposition machine capable of reducing powder adhesion according to the present invention.

4 is a schematic cross-sectional view of an embodiment of a shaft sealing device of a powder atomic layer deposition machine capable of reducing powder adhesion according to the present invention.

[Fig. 5] is an actual photo of powder adhesion on the cover surface of a general powder atomic layer deposition machine.

FIG. 6 is an actual photo of the powder sticking condition on the surface of the cover body of the powder atomic layer deposition machine capable of reducing powder sticking according to the present invention.

7 is a schematic cross-sectional view of another embodiment of a powder atomic layer deposition machine capable of reducing powder adhesion according to the present invention.

8 is a perspective view of an embodiment of a cavity and a cover of a powder atomic layer deposition machine capable of reducing powder adhesion according to the present invention.

9 is a schematic cross-sectional view of another embodiment of a powder atomic layer deposition machine capable of reducing powder adhesion according to the present invention.

10: Powder atomic layer deposition machine that can reduce powder sticking

11: Vacuum chamber

111: Cover

1113: Bottom

1115: First annular bevel

113: Cavity

1131: Bottom

1133: Inside Surface

12: Reaction Space

121: Powder

123: First Space

125: Second space

13: Shaft seal device

131: outer tube body

132: accommodating space

133: inner tube body

134: Connect Space

171: Non-reactive gas delivery line

172: Extension tube body

1721: Air vent

173: Intake line

175: Heater

a1: the first included angle

a2: Second included angle

Claims (10)

A powder atomic layer deposition machine for reducing powder sticking, comprising: A vacuum chamber, including: a cavity including a bottom and an inner surface, wherein the bottom and the inner surface form a space; A cover body includes an inner surface, a bottom surface and a first annular inclined surface, wherein the bottom surface is connected to the inner surface through the first annular inclined surface, and a groove is formed on the inner surface of the cover body, wherein the The inner surface of the cover covers the space of the cavity, so that the groove of the cover faces the space, and a reaction space is formed between the cover and the cavity; a shaft sealing device, comprising an outer tube body and an inner tube body, wherein the outer tube body has an accommodating space for accommodating the inner tube body, wherein the outer tube body is connected to the vacuum chamber; a driving unit, connected to the outer tube, and driving the vacuum chamber to rotate through the outer tube; at least one air extraction line, located in the inner tube of the shaft sealing device, fluidly connected to the reaction space of the vacuum chamber, and used for extracting a gas in the reaction space; and At least one intake line is located in the inner tube of the shaft sealing device, is fluidly connected to the reaction space of the vacuum chamber, and is used for delivering a precursor gas or a non-reactive gas to the reaction space. The powder atomic layer deposition machine capable of reducing powder adhesion as claimed in claim 1, wherein the cavity includes a second annular inclined surface, and the bottom is connected to the inner surface via the second annular inclined surface. The powder atomic layer deposition machine capable of reducing powder sticking as claimed in claim 2, wherein a first included angle is formed between the bottom surface of the cover and the first annular inclined surface, and the first annular inclined surface and the There is a second included angle between the inner surfaces of the cavity, the first included angle is between 100 degrees and 170 degrees, and the second included angle is between 170 degrees and 100 degrees. There is a third included angle with the second annular inclined surface, a fourth included angle is formed between the second annular inclined surface and the inner surface of the cavity, the third included angle is between 100 degrees and 170 degrees, and The fourth included angle is between 170 degrees and 100 degrees. The powder atomic layer deposition machine capable of reducing powder sticking according to claim 1, wherein the bottom of the cavity faces the bottom surface of the cover body, the inner surface of the cavity is a cylindrical body, and the The circumference of the cylindrical body is equal to the maximum circumference of the first annular inclined surface of the cover body. The powder atomic layer deposition machine capable of reducing powder adhesion as claimed in claim 1, wherein a first included angle is formed between the bottom surface of the cover body and the first annular inclined surface, and the first annular inclined surface and the A second included angle is formed between the inner surfaces of the cavity, the first included angle is between 100 degrees and 170 degrees, and the second included angle is between 170 degrees and 100 degrees. The powder atomic layer deposition machine capable of reducing powder sticking as claimed in claim 1, comprising an extension pipe connected to the air inlet line, the extension pipe located in the reaction space and extending to the recess of the cover in the slot. A powder atomic layer deposition machine for reducing powder sticking, comprising: A vacuum chamber, including: a cavity, comprising a bottom, an annular inclined surface and an inner surface, wherein the bottom is connected to the inner surface through the annular inclined surface, and a space is formed between the bottom, the annular inclined surface and the inner surface; a cover including an inner surface, the inner surface of the cover covers the space of the cavity, and a reaction space is formed between the cover and the cavity; a shaft sealing device, comprising an outer tube body and an inner tube body, wherein the outer tube body has an accommodating space for accommodating the inner tube body, wherein the outer tube body is connected to the vacuum chamber; a driving unit, connected to the outer tube, and driving the vacuum chamber to rotate through the outer tube; at least one air extraction line, located in the inner tube of the shaft sealing device, fluidly connected to the reaction space of the vacuum chamber, and used for extracting a gas in the reaction space; and At least one intake line is located in the inner tube of the shaft sealing device, is fluidly connected to the reaction space of the vacuum chamber, and is used for delivering a precursor gas or a non-reactive gas to the reaction space. The powder atomic layer deposition machine capable of reducing powder adhesion as claimed in claim 7, wherein a first included angle is formed between the bottom of the cavity and the annular inclined surface, and the annular inclined surface and the inner surface of the cavity There is a second included angle therebetween, the first included angle is between 100 degrees and 170 degrees, and the second included angle is between 170 degrees and 100 degrees. The powder atomic layer deposition machine capable of reducing powder sticking as claimed in claim 7, wherein the inner surface of the cover body includes a groove, and the inner surface of the cover body covers the space of the cavity, so that the The groove of the cover and the space of the cavity form the reaction space. The powder atomic layer deposition machine capable of reducing powder sticking as claimed in claim 9, comprising an extension pipe body connected to the air inlet line, the extension pipe body being located in the reaction space and extending to the recess of the cover body in the slot.

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