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TWI759595B - Substrate processing system and substrate processing method - Google Patents

Substrate processing system and substrate processing method Download PDF

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Publication number
TWI759595B
TWI759595B TW108115489A TW108115489A TWI759595B TW I759595 B TWI759595 B TW I759595B TW 108115489 A TW108115489 A TW 108115489A TW 108115489 A TW108115489 A TW 108115489A TW I759595 B TWI759595 B TW I759595B
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substrate
holding
processing
cleaning
holding portion
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TW108115489A
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Chinese (zh)
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TW201947653A (en
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坂元直人
中野征二
原田浩樹
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日商東京威力科創股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Jigs For Machine Tools (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

An object of the invention is to appropriately clean a substrate in a substrate processing system that processes a processing surface of a substrate.
The invention provides a substrate processing system that processes a substrate, the system having a holding section for processing which, when processing the processing surface of the substrate, holds a non-processing surface located on the opposite side from the processing surface of the substrate, a liquid supply section which supplies a liquid to the holding surface of the holding section for processing, a holding section for transportation which, when transporting the substrate, holds the processing surface of the substrate, a movement mechanism which moves the holding section for transportation in the horizontal direction and the vertical direction, and a control section which controls the holding section for processing, the liquid supply section, the holding section for transportation, and the movement mechanism.

Description

基板處理系統及基板處理方法 Substrate processing system and substrate processing method

本發明所揭露之內容係關於一種基板處理裝置及基板處理方法。 The content disclosed in the present invention relates to a substrate processing apparatus and a substrate processing method.

專利文獻1，揭露搬運研磨後的脆性被加工物之搬運方法。搬運方法，包含附著釋放步驟與搬出步驟。在附著釋放步驟，從吸盤台的固持面噴出流體並使被抽吸固持在搬運手段之脆性被加工物以第1速度從該吸盤台脫離。在搬出步驟，接續於附著釋放步驟的實施之後，以較第1速度更快之第2速度使搬運手段從吸盤台脫離，將脆性被加工物從吸盤台上搬出。 Patent Document 1 discloses a conveying method for conveying a brittle workpiece after grinding. The conveying method includes a step of attaching and releasing and a step of carrying out. In the adhesion release step, the fluid is ejected from the holding surface of the chuck table, and the brittle workpiece sucked and held by the conveying means is detached from the chuck table at the first speed. In the carrying-out step, following the implementation of the adhesion-releasing step, the conveying means is detached from the chuck table at a second speed faster than the first speed, and the brittle workpiece is carried out from the chuck table.

[習知技術文獻] [Previously known technical literature] [專利文獻] [Patent Literature]

專利文獻1：日本特開第2013-145776號公報 Patent Document 1: Japanese Patent Laid-Open No. 2013-145776

本發明所揭露之技術，於將基板的加工面加工之基板處理系統中，適當地清洗基板。 The technology disclosed in the present invention properly cleans the substrate in the substrate processing system for processing the processed surface of the substrate.

本發明所揭露之一態樣，係將基板的加工面加工之基板處理系統，其具備：加工用固持部，於對該基板的加工面進行加工時，將與該基板的加工面為相反側之非加工面予以固持；搬運用固持部，在搬運該基板時，固持該基板的加工面；移動機構，使該搬運用固持部往水平方向及鉛直方向移動；以及控制部，控制該加工用固持部、該液體供給部、該搬運用固持部及該移動機構；該搬運用固持部，包含：傾動機構，使該搬運用固持部在側視時可任意傾動；彈性構件，設置於該搬運用固持部；以及清洗具，用來清洗清洗面，該清洗面係該基板的非加工面或該搬運用固持部的固持面；該控制部，在使該清洗具抵接於該清洗面的狀態下，藉由該移動機構使該搬運用固持部往水平方向移動，以實行清洗該清洗面之清洗步驟；於該清洗步驟中，在使該清洗具抵接於該清洗面的外周部時和使該清洗具抵接於該清洗面的中心部時，改變該清洗面的高度位置。 One aspect disclosed by the present invention is a substrate processing system for processing a processed surface of a substrate, comprising: a processing holding portion that is disposed on the opposite side of the processed surface of the substrate when the processed surface of the substrate is processed The non-processed surface is held; the holding part for conveying holds the processed surface of the substrate when the substrate is conveyed; the moving mechanism makes the holding part for conveying move in the horizontal direction and the vertical direction; and the control part controls the processing surface. The holding part, the liquid supply part, the holding part for conveying and the moving mechanism; the holding part for conveying includes: a tilting mechanism, which enables the holding part for conveying to be tilted arbitrarily when viewed from the side; an elastic member is arranged on the holding part for conveying A holding part is used; and a cleaning tool is used to clean the cleaning surface, the cleaning surface is the non-processed surface of the substrate or the holding surface of the holding part for conveying; the control part is used to make the cleaning tool abut on the cleaning surface. In the state, the conveying holding portion is moved horizontally by the moving mechanism to perform the cleaning step of cleaning the cleaning surface; in the cleaning step, when the cleaning tool is brought into contact with the outer peripheral portion of the cleaning surface When the cleaning tool is brought into contact with the center of the cleaning surface, the height position of the cleaning surface is changed.

依本發明所揭露之內容，在將基板的加工面加工之基板處理系統中，可適當地清洗基板。 According to the disclosure of the present invention, in the substrate processing system for processing the processing surface of the substrate, the substrate can be properly cleaned.

1:基板處理系統 1: Substrate processing system

2:搬入站 2: Move in station

3:搬出站 3: Move out of the station

4:加工裝置 4: Processing device

5:後處理裝置 5: Post-processing device

6:搬運站 6: Handling station

10、20:晶圓匣盒載置台 10, 20: Wafer cassette stage

30:基板搬運區域 30: Substrate handling area

31:搬運路 31: Transportation Road

32:基板搬運裝置 32: Substrate conveying device

33:搬運叉架 33: Handling Fork

34:搬運墊 34: Carrying Mat

40:控制部 40: Control Department

100:旋轉台 100: Rotary table

100a:貫通孔 100a: Through hole

101:加工用固持部 101: Holding part for processing

101a:固持面 101a: Retaining surface

102:固持部基台 102: Holder abutment

103:旋轉機構 103: Rotary Mechanism

104:供給管 104: Supply pipe

104a:閥 104a: Valve

104b:液體供給管 104b: Liquid supply pipe

104c:氣體供給管 104c: Gas supply pipe

105:液體供給部 105: Liquid supply part

106:氣體供給部 106: Gas Supply Department

107:抽吸管 107: Suction tube

107a:閥 107a: Valve

108:抽吸裝置 108: Suction device

110:搬運單元 110: Handling unit

111~113:臂部 111~113: Arm

111a:旋轉機構 111a: Rotary Mechanism

114:移動機構 114: Moving Mechanisms

115:搬運用固持部 115: Holding part for transportation

115a:固持面 115a: Retaining surface

116:傾動機構 116: Tilting mechanism

117:彈性構件 117: Elastic member

118:支持板 118: Support board

120:對準單元 120: Alignment unit

130:第1清洗單元 130: 1st cleaning unit

140:第2清洗單元 140: 2nd cleaning unit

141:處理容器 141: Handling Containers

142:海綿清洗具 142: Sponge cleaning tool

143:空氣噴嘴 143: Air Nozzle

144:石材清洗具 144: Stone cleaning tools

145:刷子清洗具 145: Brush cleaner

150:粗研磨單元 150: Coarse grinding unit

151:粗研磨部 151: Rough grinding section

152:支柱 152: Pillar

160:中研磨單元 160: Medium grinding unit

161:中研磨部 161: Middle grinding department

162:支柱 162: Pillar

170:精研磨單元 170: Fine grinding unit

171:精研磨部 171: Fine grinding department

172:支柱 172: Pillar

A0:傳遞位置 A0: Transfer position

A1~A3:加工位置 A1~A3: Processing position

C:晶圓匣盒 C: Wafer cassette

H:記錄媒體 H: recording medium

L:液體 L: liquid

W:基板 W: substrate

Wg:加工面 Wg: machined surface

Wn:非加工面 Wn: non-machined surface

圖1係示意本實施形態之基板處理系統的構成之概略的俯視圖。 FIG. 1 is a plan view showing the outline of the configuration of the substrate processing system of the present embodiment.

圖2係顯示加工用固持部的構成之概略的縱剖面圖。 FIG. 2 is a longitudinal cross-sectional view showing a schematic configuration of a processing holding portion.

圖3係顯示搬運用固持部的構成之概略的側視圖。 FIG. 3 is a side view showing the outline of the structure of the holding portion for conveyance.

圖4係顯示第2清洗單元的構成之概略的俯視圖。 FIG. 4 is a plan view showing a schematic configuration of the second cleaning unit.

圖5係顯示基板處理之主要步驟的流程圖。 FIG. 5 is a flow chart showing the main steps of substrate processing.

圖6(a)~(e)係顯示搬運單元從傳遞位置接收基板之樣子的說明圖。 FIGS. 6( a ) to ( e ) are explanatory diagrams showing how the transfer unit receives the substrate from the transfer position.

圖7係顯示以第2清洗單元清洗基板的非加工面之樣子的說明圖。 FIG. 7 is an explanatory diagram showing a state in which the unprocessed surface of the substrate is cleaned by the second cleaning unit.

圖8(a)~(d)係顯示在另一實施形態中調整基板之高度而清洗該基板的非加工面之樣子的說明圖。 FIGS. 8( a ) to ( d ) are explanatory diagrams showing a state in which the height of the substrate is adjusted and the unprocessed surface of the substrate is cleaned in another embodiment.

圖9係顯示在另一實施形態中以第2清洗單元清洗基板的非加工面之樣子的說明圖。 FIG. 9 is an explanatory view showing a state in which the unprocessed surface of the substrate is cleaned by the second cleaning unit in another embodiment.

圖10(a)~(d)係顯示在另一實施形態中調整基板之高度而清洗該基板的非加工面之樣子的說明圖。 FIGS. 10( a ) to ( d ) are explanatory diagrams showing a state in which the height of the substrate is adjusted and the unprocessed surface of the substrate is cleaned in another embodiment.

於半導體裝置之製程中，對表面形成有複數電子電路等裝置的半導體基板(下稱基板)，研磨該基板之背面，施行基板的薄型化。 In the manufacturing process of a semiconductor device, a semiconductor substrate (hereinafter referred to as a substrate) on which a plurality of electronic circuits and other devices are formed on the surface, the back surface of the substrate is ground, and the thickness of the substrate is reduced.

上述專利文獻1，揭露研磨後的脆性被加工物(基板)之搬運方法。具體而言，首先，將固持於吸盤台之脆性被加工物的第1面以研磨砂輪研磨，使脆性被加工物減薄至既定厚度。此處，減薄之脆性被加工物易碎，故在從吸盤台搬出時有破損的疑慮。因而，在專利文獻1所揭露之方法，施行上述附著釋放步驟與搬出步驟。亦即，從吸盤台的固持面噴出流體、純水與空氣之混合流體，並以2 階段的速度使脆性被加工物從吸盤台脫離。藉此，可追求抑制搬出時之脆性被加工物的損傷。 The above-mentioned Patent Document 1 discloses a method of conveying a brittle workpiece (substrate) after grinding. Specifically, first, the first surface of the brittle workpiece held on the chuck table is ground with a grinding wheel, and the brittle workpiece is thinned to a predetermined thickness. Here, since the thinned brittle workpiece is fragile, there is a possibility of breakage when it is carried out from the suction table. Therefore, in the method disclosed in Patent Document 1, the above-mentioned adhesion release step and removal step are performed. That is, the fluid, the mixed fluid of pure water and air is ejected from the holding surface of the suction cup table, and 2 The speed of the stage disengages the brittle workpiece from the chuck table. In this way, it is possible to seek to suppress the damage of the brittle workpiece at the time of carrying out.

然而，在專利文獻1所揭露之方法，往吸盤台的固持面供給純水與空氣之混合流體，故於吸盤台與脆性被加工物之間形成純水的膜。如此一來，張力作用在該水膜與脆性被加工物之界面，故從吸盤台搬出時，仍有脆性被加工物遭受損傷的疑慮。此外，亦有脆性被加工物從搬運手段脫落的疑慮。 However, in the method disclosed in Patent Document 1, a mixed fluid of pure water and air is supplied to the holding surface of the chuck table, so that a film of pure water is formed between the chuck table and the brittle workpiece. In this way, tension acts on the interface between the water film and the brittle workpiece, so there is still a possibility that the brittle workpiece will be damaged when it is taken out from the chuck table. In addition, there is also a possibility that the brittle workpiece may fall off from the conveying means.

因而，本發明所揭露之技術，抑制基板遭受損傷並適當地搬運基板。以下，參考附圖，並對本實施形態之基板處理系統及基板處理方法予以說明。另，本說明書及附圖中，在實質上具有相同功能構成之要素中給予相同符號，藉以省略重複的說明。 Therefore, the technology disclosed in the present invention suppresses damage to the substrate and appropriately transports the substrate. Hereinafter, the substrate processing system and the substrate processing method of the present embodiment will be described with reference to the accompanying drawings. In addition, in this specification and drawings, the same code|symbol is attached|subjected to the element which has substantially the same functional structure, and a repeated description is abbreviate|omitted.

首先，茲就本實施形態之基板處理系統的構成予以說明。圖1為，示意基板處理系統1的構成之概略的俯視圖。 First, the configuration of the substrate processing system of the present embodiment will be described. FIG. 1 is a plan view showing a schematic configuration of a substrate processing system 1 .

本實施形態之基板處理系統1中，將基板W減薄。基板W，例如為矽晶圓或化合物半導體晶圓等半導體晶圓。於基板W的表面(下稱非加工面Wn)形成裝置(未圖示)，進一步，於該表面貼附用於保護裝置之保護材，例如保護膠帶(未圖示)。而後，對基板W的背面(下稱加工面Wg)施行研磨等既定加工處理，將該基板減薄。 In the substrate processing system 1 of the present embodiment, the substrate W is thinned. The substrate W is, for example, a semiconductor wafer such as a silicon wafer or a compound semiconductor wafer. A device (not shown) is formed on the surface of the substrate W (hereinafter referred to as a non-processed surface Wn), and further, a protective material for protecting the device, such as a protective tape (not shown), is attached to the surface. Then, predetermined processing such as grinding is performed on the back surface of the substrate W (hereinafter referred to as the processed surface Wg), and the substrate is thinned.

基板處理系統1，具備將搬入站2、搬出站3、加工裝置4、後處理裝置5、及搬運站6連接之構成。搬入站2，將處理前之基板W收納於晶圓匣盒C內，將複數 基板W以晶圓匣盒為單位，從外部往基板處理系統1搬入。搬出站3，將處理後之基板W收納於晶圓匣盒C內，將複數基板W以晶圓匣盒為單位，從基板處理系統1往外部搬出。加工裝置4，對基板W施行加工處理而將減薄。後處理裝置5，施行加工處理後之基板W的後處理。搬運站6，在搬入站2、加工裝置4及後處理裝置5之間搬運基板W。於X軸負方向側中，往Y軸方向依序排列配置搬入站2、搬運站6、及加工裝置4。於X軸正方向側中，往Y軸方向依序排列配置搬出站3與後處理裝置5。 The substrate processing system 1 includes a configuration in which an incoming station 2 , an outgoing station 3 , a processing device 4 , a post-processing device 5 , and a transfer station 6 are connected. The carrying-in station 2 accommodates the substrates W before processing in the cassette C, and puts a plurality of The substrates W are loaded into the substrate processing system 1 from the outside in units of cassettes. The unloading station 3 accommodates the processed substrates W in the cassettes C, and unloads the plurality of substrates W from the substrate processing system 1 to the outside in units of the cassettes. The processing apparatus 4 performs processing on the substrate W to reduce the thickness. The post-processing device 5 performs post-processing of the substrate W after the processing. The transfer station 6 transfers the substrate W between the transfer station 2 , the processing device 4 , and the post-processing device 5 . On the X-axis negative direction side, the carry-in station 2 , the transfer station 6 , and the processing device 4 are arranged in this order in the Y-axis direction. On the X-axis positive direction side, the unloading station 3 and the post-processing device 5 are arranged in order in the Y-axis direction.

於搬入站2，設置晶圓匣盒載置台10。圖示之例子中，於晶圓匣盒載置台10，將複數個，例如2個晶圓匣盒C，於X軸方向呈一列地任意載置。 In the carry-in station 2, a cassette mounting table 10 is installed. In the example shown in the figure, on the cassette mounting table 10, a plurality of, for example, two cassettes C are arbitrarily placed in a row in the X-axis direction.

搬出站3，亦與搬入站2具有同樣的構成。於搬出站3設置晶圓匣盒載置台20，於晶圓匣盒載置台20，例如將2個晶圓匣盒C，於X軸方向呈一列地任意載置自在。另，搬入站2與搬出站3亦可整合為1個搬出入站，此一情況，於搬出入站設置共通的晶圓匣盒載置台。 The carry-out station 3 also has the same structure as the carry-in station 2 . A cassette mounting table 20 is provided in the unloading station 3 , and on the cassette mounting table 20 , for example, two cassettes C can be arbitrarily mounted in a row in the X-axis direction. In addition, the carry-in station 2 and the carry-out station 3 may be integrated into one carry-in and carry-out station. In this case, a common cassette mounting table is provided in the carry-in and carry-out stations.

在加工裝置4，對基板W施行研磨或清洗等加工處理。此加工裝置4的構成將於之後詳述。 In the processing apparatus 4, the substrate W is subjected to processing such as polishing or cleaning. The configuration of this processing apparatus 4 will be described in detail later.

在後處理裝置5，對以加工裝置4加工處理之基板W施行後處理。作為後處理，例如施行將基板W經由切割膠帶固持於切割架的貼裝處理、將貼附於基板W之保護膠帶剝離的剝離處理等。而後，後處理裝置5，將施行後處理並固持於切割架之基板W，往搬出站3的晶圓匣盒C搬運。以後處理裝置5施行的貼裝處理與剝離處理，分別利用已知之裝置。 In the post-processing device 5 , post-processing is performed on the substrate W processed by the processing device 4 . As post-processing, for example, a mounting process of holding the substrate W to a dicing frame via a dicing tape, a peeling process of peeling off the protective tape attached to the substrate W, and the like are performed. Then, the post-processing device 5 carries the substrate W that has been post-processed and held on the dicing frame to the cassette C of the unloading station 3 . For the mounting process and the peeling process performed by the post-processing device 5, known devices are used, respectively.

於搬運站6，設置基板搬運區域30。於基板搬運區域30，設置在往X軸方向延伸之搬運路31上任一移動的基板搬運裝置32。基板搬運裝置32，作為固持基板W之基板固持部，具備搬運叉架33與搬運墊34。搬運叉架33，其前端分支為2根，將基板W吸附固持。搬運叉架33，搬運研磨處理前之基板W。搬運墊34具有圓形形狀，該圓形具備俯視時較基板W之徑更長的徑，將基板W吸附固持。搬運墊34，搬運研磨處理後之基板W。而此等搬運叉架33與搬運墊34，分別構成為往水平方向、鉛直方向，繞水平軸及繞鉛直軸任意移動。 In the transfer station 6, a substrate transfer area 30 is provided. In the board|substrate conveyance area 30, the board|substrate conveyance apparatus 32 which moves arbitrarily on the conveyance path 31 extended in the X-axis direction is installed. The substrate conveyance device 32 includes a conveyance fork 33 and a conveyance pad 34 as a substrate holding portion for holding the substrate W. The transport fork 33 is branched into two at the front end, and the substrate W is adsorbed and held. The fork 33 is conveyed, and the substrate W before the polishing process is conveyed. The conveyance pad 34 has a circular shape having a diameter longer than the diameter of the substrate W in plan view, and holds the substrate W by suction. The conveying pad 34 conveys the substrate W after the polishing process. The transport forks 33 and the transport pads 34 are configured to move freely around the horizontal axis and around the vertical axis in the horizontal direction and the vertical direction, respectively.

於基板處理系統1，設置控制部40。控制部40，例如為電腦，具備程式收納部(未圖示)。於程式收納部，收納控制基板處理系統1中的基板W之處理的程式。此外，於程式收納部，亦收納有用於控制上述各種處理裝置或搬運裝置等之驅動系統的運作，實現基板處理系統1中之後述基板處理的程式。另，上述程式，記錄於電腦可讀取之記錄媒體H，亦可為從該記錄媒體H安裝至控制部40者。 The substrate processing system 1 is provided with a control unit 40 . The control unit 40 is, for example, a computer, and includes a program storage unit (not shown). In the program storage section, a program for controlling the processing of the substrate W in the substrate processing system 1 is stored. In addition, the program storage section also stores programs for controlling the operation of the drive systems of the various processing apparatuses and conveying apparatuses described above, and realizing the substrate processing described later in the substrate processing system 1 . In addition, the above-mentioned program may be recorded on a computer-readable recording medium H, and may be installed from the recording medium H to the control unit 40 .

接著，對上述加工裝置4之構成予以說明。加工裝置4，具備旋轉台100、搬運單元110、對準單元120、第1清洗單元130、第2清洗單元140、粗研磨單元150、中研磨單元160、及精研磨單元170。 Next, the structure of the above-mentioned processing apparatus 4 is demonstrated. The processing apparatus 4 includes a rotary table 100 , a conveyance unit 110 , an alignment unit 120 , a first cleaning unit 130 , a second cleaning unit 140 , a rough polishing unit 150 , an intermediate polishing unit 160 , and a finish polishing unit 170 .

旋轉台100，構成為藉由旋轉機構(未圖示)而可任意旋轉。於旋轉台100上設置4個加工用固持部101，將基板W的非加工面Wn吸附固持。加工用固持部101，在與旋轉台100相同之圓周上均等地，亦即隔著90度地配置。藉由使旋轉台100旋轉，而可使4個加工用固持部101，往傳遞位置A0及加工位置A1~A3移動。 The turntable 100 is configured to be freely rotatable by a rotation mechanism (not shown). Four processing holding parts 101 are provided on the turntable 100, and the non-processing surface Wn of the substrate W is adsorbed and held. The processing holding parts 101 are equally arranged on the same circumference as the turntable 100 , that is, at 90 degrees. By rotating the turntable 100, the four holding parts 101 for processing can be moved to the transmission position A0 and the processing positions A1 to A3.

本實施形態，傳遞位置A0為旋轉台100之X軸正方向側且Y軸負方向側的位置，於該傳遞位置A0之Y軸負方向側，排列配置第2清洗單元140、對準單元120、及第1清洗單元130。從上方依序疊層配置對準單元120與第1清洗單元130。第1加工位置A1為旋轉台100之X軸正方向側且Y軸正方向側的位置，配置粗研磨單元150。第2加工位置A2為旋轉台100之X軸負方向側且Y軸正方向側之位置，配置中研磨單元160。第3加工位置A3為旋轉台100之X軸負方向側且Y軸負方向側的位置，配置精研磨單元170。 In this embodiment, the transfer position A0 is the position on the positive side of the X-axis and the negative side of the Y-axis of the turntable 100, and the second cleaning unit 140 and the alignment unit 120 are arranged on the negative side of the Y-axis of the transfer position A0. , and the first cleaning unit 130 . The alignment unit 120 and the first cleaning unit 130 are sequentially stacked and arranged from above. The first machining position A1 is a position on the positive side of the X-axis and the positive side of the Y-axis of the turntable 100, and the rough grinding unit 150 is arranged. The second processing position A2 is the position on the negative side of the X-axis and the positive side of the Y-axis of the turntable 100, and the grinding unit 160 is disposed. The third machining position A3 is a position on the negative direction side of the X axis and the negative direction side of the Y axis of the turntable 100, and the finishing unit 170 is arranged.

如圖2所示，加工用固持部101固持於固持部基台102。加工用固持部101及固持部基台102，構成為藉由旋轉機構103而可旋轉。旋轉機構103，例如貫穿形成在旋轉台100之貫通孔100a而設置。 As shown in FIG. 2 , the processing holding portion 101 is held by the holding portion base 102 . The holding part 101 for processing and the holding part base 102 are configured to be rotatable by a rotation mechanism 103 . The rotation mechanism 103 is provided through, for example, a through hole 100 a formed in the turntable 100 .

將加工用固持部101與供給管104連接，供給管104往該加工用固持部101之基板W的固持面101a至少供給液體或氣體。供給管104，通過旋轉機構103之內部而與加工用固持部101相連接。此外，供給管104，與4個加工用固持部101分別連接。於各供給管104設置閥104a，控制往各加工用固持部101之液體或氣體的供給。此外，供給管104，於下游側中分支為液體供給管104b與氣體供給管104c。將液體供給管104b，與液體供給部105連接。液體供給部105，儲存液體，例如純水，將該液體往固持面101a供給。將氣體供給管104c，與氣體供給部106連接。氣體供給部106，儲存氣體，例如空氣或惰性氣體，將該氣體往固持面101a供給。 The processing holding portion 101 is connected to a supply pipe 104 , and the supply pipe 104 supplies at least liquid or gas to the holding surface 101 a of the substrate W of the processing holding portion 101 . The supply pipe 104 is connected to the processing holding portion 101 through the interior of the rotating mechanism 103 . In addition, the supply pipe 104 is connected to each of the four processing holding parts 101 . A valve 104a is provided in each supply pipe 104, and the supply of liquid or gas to each processing holding part 101 is controlled. In addition, the supply pipe 104 is branched into a liquid supply pipe 104b and a gas supply pipe 104c on the downstream side. The liquid supply pipe 104b is connected to the liquid supply part 105 . The liquid supply unit 105 stores a liquid such as pure water, and supplies the liquid to the holding surface 101a. The gas supply pipe 104c is connected to the gas supply part 106 . The gas supply unit 106 stores a gas such as air or an inert gas, and supplies the gas to the holding surface 101a.

加工用固持部101，例如使用多孔質吸盤。為了將基板W吸附固持在固持面101a，而將加工用固持部101，與抽吸該基板W之抽吸管107連接。抽吸管107， 通過旋轉機構103之內部而與加工用固持部101相連接。此外，抽吸管107，與4個加工用固持部101分別連接。於各抽吸管107設置閥107a，控制各加工用固持部101的抽吸。此外，將抽吸管107，與抽吸基板W之抽吸裝置108連接。另，為了使此多孔質吸盤不阻塞，在未以加工用固持部101固持基板W之狀態，從液體供給部105供給液體。 As the processing holding portion 101, for example, a porous chuck is used. In order to suck and hold the substrate W on the holding surface 101a, the holding portion 101 for processing is connected to a suction pipe 107 for sucking the substrate W. suction tube 107, It is connected to the holding part 101 for processing through the inside of the rotating mechanism 103 . In addition, the suction pipe 107 is connected to each of the four processing holding parts 101 . A valve 107 a is provided in each suction pipe 107 to control the suction of each processing holding part 101 . In addition, the suction pipe 107 is connected to the suction device 108 for suctioning the substrate W. In addition, in order not to block the porous chuck, the liquid is supplied from the liquid supply part 105 in a state where the substrate W is not held by the processing holding part 101 .

另，本實施形態中，雖在液體供給部105與氣體供給部106使用共通之供給管104，但亦可將液體供給管104b與氣體供給管104c，各自直接與加工用固持部101連接。此一形況，於液體供給管104b與氣體供給管104c，分別設置閥(未圖示)。此外，本實施形態，雖於4個加工用固持部101設置共通之液體供給部105與氣體供給部106，但亦可在每個加工用固持部101分別單獨設置液體供給部105與氣體供給部106。 In this embodiment, the liquid supply part 105 and the gas supply part 106 use a common supply pipe 104, but the liquid supply pipe 104b and the gas supply pipe 104c may be directly connected to the processing holding part 101, respectively. In this case, valves (not shown) are provided in the liquid supply pipe 104b and the gas supply pipe 104c, respectively. In addition, in this embodiment, although the common liquid supply part 105 and the gas supply part 106 are provided in the four processing holding parts 101, the liquid supply part 105 and the gas supply part may be provided separately in each processing holding part 101. 106.

如圖1所示，搬運單元110，為具備複數條，例如3條臂部111~113之多關節型的機械臂。3條臂部111~113，藉由關節部(未圖示)連接。藉由此等關節部，構成為使3條臂部111~113中之前端的第1臂部111與中間的第2臂部112，分別以基端部為中心而任意迴旋。此外，基端的第3臂部113，安裝在使臂部111~113往鉛直方向移動之移動機構114。藉由此一構成，吸附固持後述基板W之搬運用固持部115，成為可往水平方向及鉛直方向任意移動。 As shown in FIG. 1 , the transfer unit 110 is a multi-joint type robot arm including a plurality of, for example, three arm portions 111 to 113 . The three arm parts 111 to 113 are connected by joint parts (not shown). By these joint parts, the first arm part 111 at the front end and the second arm part 112 at the middle of the three arm parts 111 to 113 are configured to rotate arbitrarily around the base end part, respectively. In addition, the third arm portion 113 at the base end is attached to a moving mechanism 114 that moves the arm portions 111 to 113 in the vertical direction. With this configuration, the holding portion 115 for conveyance that holds the substrate W to be described later is adsorbed and held, and can be moved arbitrarily in the horizontal direction and the vertical direction.

於第1臂部111，安裝將基板W吸附固持的搬運用固持部115。搬運用固持部115，例如使用多孔質吸盤。如圖3所示，搬運用固持部115具有圓形形狀，該圓形具備俯視時較基板W之徑更長的徑。而搬運用固持部115，於其固持面115a中， 吸附固持基板W的加工面Wg全表面。此外，搬運用固持部115，構成為藉由設置在第1臂部111之旋轉機構111a，而可任意旋轉。 On the 1st arm part 111, the holding part 115 for conveyance which suction-holds the board|substrate W is attached. As the holding portion 115 for conveyance, for example, a porous suction cup is used. As shown in FIG. 3 , the conveyance holding portion 115 has a circular shape having a diameter longer than the diameter of the substrate W in plan view. On the other hand, the holding portion 115 for conveyance has a holding surface 115a in its holding surface 115a. The entire surface of the processed surface Wg of the substrate W is adsorbed and held. Moreover, the holding|maintenance part 115 for conveyance is comprised so that it can rotate arbitrarily by the rotation mechanism 111a provided in the 1st arm part 111.

於第1臂部111與搬運用固持部115之間，隔著支持板118而設置傾動機構116與彈性構件117。傾動機構116，設置於第1臂部111與支持板118之間。彈性構件117，設置於搬運用固持部115與支持板118之間。 Between the 1st arm part 111 and the holding|maintenance part 115 for conveyance, the tilting mechanism 116 and the elastic member 117 are provided with the support plate 118 interposed therebetween. The tilting mechanism 116 is provided between the first arm portion 111 and the support plate 118 . The elastic member 117 is provided between the conveyance holding portion 115 and the support plate 118 .

傾動機構116，使搬運用固持部115在側視時可任意傾動。傾動機構116之構成為任意構成，但例如具備對第1臂部111將支持板118(搬運用固持部115)往分離方向偏壓之偏壓構件(未圖示)。藉由此一傾動機構116，例如在搬運用固持部115接收基板W時，即便該基板W並未呈平坦(水平)，仍可沿著其傾斜而使搬運用固持部115傾動。此外，例如在搬運用固持部115傳遞基板W時，即便傳遞對象並未呈平坦(水平)，仍可沿著其傾斜而使搬運用固持部115傾動。如此地，藉由使搬運用固持部115傾動，而可適當地接收(傳遞)基板W。另，傾動機構116，亦可進一步具備固定搬運用固持部115之機構。此一形況，於基板W的搬運中，可固定搬運用固持部115。其結果，可適當地施行基板W的接收(傳遞)與搬運。 The tilting mechanism 116 enables the holding portion 115 for conveyance to be tilted arbitrarily when viewed from the side. The tilting mechanism 116 has an arbitrary configuration, but includes, for example, a biasing member (not shown) that biases the support plate 118 (holding portion 115 for conveyance) in the separation direction with respect to the first arm portion 111 . With this tilting mechanism 116 , for example, when the transport holding portion 115 receives the substrate W, even if the substrate W is not flat (horizontal), the transport holding portion 115 can be tilted along the inclination. In addition, for example, when the conveyance holding portion 115 transfers the substrate W, even if the transfer object is not flat (horizontal), the conveyance holding portion 115 can be tilted along the inclination thereof. In this way, the substrate W can be appropriately received (transferred) by tilting the conveyance holding portion 115 . In addition, the tilting mechanism 116 may further include a mechanism for fixing the holding portion 115 for conveyance. In this case, during the conveyance of the substrate W, the holding portion 115 for conveyance can be fixed. As a result, reception (transfer) and conveyance of the board|substrate W can be performed suitably.

彈性構件117，例如於搬運用固持部115的外周部中，在該搬運用固持部115的同心圓上設置複數個。彈性構件117為具有彈性者即可，並無特別限定，例如使用彈簧。此外，藉由此一彈性構件117，例如在搬運用固持部115接收或傳遞基板W時，可吸收其衝撃。其結果，可避免強大的推壓力作用在固持於搬運用固持部115之基板W。 A plurality of elastic members 117 are provided on the concentric circles of the conveyance holding portion 115 , for example, in the outer peripheral portion of the conveyance holding portion 115 . The elastic member 117 may be any elastic member and is not particularly limited. For example, a spring is used. In addition, with this elastic member 117, for example, when the holding portion 115 for conveyance receives or transfers the substrate W, the shock thereof can be absorbed. As a result, a strong pressing force can be prevented from acting on the substrate W held by the holding portion 115 for conveyance.

具備上述構成之搬運單元110，可對傳遞位置A0、對準單元120、第1清洗單元130、及第2清洗單元140，搬運基板W。 The conveyance unit 110 having the above-described configuration can convey the substrate W to the transfer position A0 , the alignment unit 120 , the first cleaning unit 130 , and the second cleaning unit 140 .

如圖1所示，在對準單元120，調節研磨處理前之基板W的水平方向之朝向。例如使固持於旋轉吸盤(未圖示)之基板W旋轉，並以檢測部(未圖示)檢測基板W的缺口部之位置，藉以調節該缺口部之位置，調節基板W的水平方向之朝向。 As shown in FIG. 1 , in the alignment unit 120, the orientation of the horizontal direction of the substrate W before the polishing process is adjusted. For example, the substrate W held by the spin chuck (not shown) is rotated, and the detection unit (not shown) detects the position of the notch of the substrate W, thereby adjusting the position of the notch and adjusting the orientation of the substrate W in the horizontal direction .

在第1清洗單元130，清洗研磨處理後之基板W的加工面Wg，更具體而言，將其旋轉清洗。例如使固持於旋轉吸盤(未圖示)之基板W旋轉，並從清洗液噴嘴(未圖示)往基板W的加工面Wg供給清洗液。如此一來，供給之清洗液在加工面Wg上擴散，清洗該加工面Wg。 In the first cleaning unit 130, the processed surface Wg of the substrate W after the polishing process is cleaned, and more specifically, it is rotated and cleaned. For example, the substrate W held by the spin chuck (not shown) is rotated, and the cleaning liquid is supplied to the processing surface Wg of the substrate W from a cleaning liquid nozzle (not shown). In this way, the supplied cleaning liquid spreads on the machined surface Wg, and cleans the machined surface Wg.

在第2清洗單元140，將研磨處理後之基板W，且係固持於搬運單元110的搬運用固持部115之基板W的非加工面Wn清洗，並將搬運用固持部115的固持面115a清洗。此等非加工面Wn與固持面115a，為以第2清洗單元140清洗的清洗面。如圖4所示，第2清洗單元140，具備處理容器141。於處理容器141之內部，設置具備清洗液噴嘴之海綿清洗具142、空氣噴嘴143、石材清洗具144(砂輪)、及刷子清洗具145。海綿清洗具142、空氣噴嘴143、石材清洗具144、及刷子清洗具145，分別構成為藉由升降機構(未圖示)而可往鉛直方向任意移動。 In the second cleaning unit 140 , the non-processed surface Wn of the substrate W, which has been polished and held by the conveyance holding portion 115 of the conveyance unit 110 , is cleaned, and the holding surface 115 a of the conveyance holding portion 115 is cleaned. . These unprocessed surfaces Wn and the holding surface 115 a are cleaning surfaces cleaned by the second cleaning unit 140 . As shown in FIG. 4 , the second cleaning unit 140 includes a processing container 141 . Inside the processing container 141, a sponge cleaning tool 142 having a cleaning liquid nozzle, an air nozzle 143, a stone cleaning tool 144 (grinding wheel), and a brush cleaning tool 145 are installed. The sponge cleaning tool 142 , the air nozzle 143 , the stone cleaning tool 144 , and the brush cleaning tool 145 are respectively configured to move freely in the vertical direction by means of a lifting mechanism (not shown).

海綿清洗具142，例如具備較基板W之徑延伸為更長的海綿，可往海綿供給清洗液，例如純水，清洗該非加工面Wn。空氣噴嘴143，對基板W的非加工面Wn噴射空氣，使該非加工面Wn乾燥。此等海綿及清洗液所進行之非加工面Wn 的清洗、及空氣所進行之非加工面Wn的乾燥，係分別在以搬運用固持部115固持基板W的狀態下，且藉由旋轉機構111a使搬運用固持部115(基板W)旋轉並施行。藉此，清洗基板W的非加工面Wn全表面。 The sponge cleaning tool 142 includes, for example, a sponge extending longer than the diameter of the substrate W, and can supply a cleaning liquid, such as pure water, to the sponge to clean the non-processed surface Wn. The air nozzle 143 sprays air on the unprocessed surface Wn of the substrate W to dry the unprocessed surface Wn. The non-processed surface Wn performed by these sponges and cleaning solutions The cleaning and the drying of the non-processed surface Wn by air are carried out by rotating the conveying holding portion 115 (substrate W) by the rotating mechanism 111a while the substrate W is being held by the conveying holding portion 115, respectively. . Thereby, the entire surface of the unprocessed surface Wn of the substrate W is cleaned.

石材清洗具144與刷子清洗具145，例如分別較搬運單元110之搬運用固持部115的固持面115a之徑延伸為更長，抵接於該固持面115a而予以清洗。而石材清洗具144與刷子清洗具145所進行之搬運用固持部115的清洗，係藉由旋轉機構111a使搬運用固持部115旋轉並施行。藉此，清洗搬運用固持部115的固持面115a全表面。 For example, the stone cleaning tool 144 and the brush cleaning tool 145 extend longer than the diameter of the holding surface 115a of the holding portion 115 for conveyance of the conveying unit 110, respectively, and contact the holding surface 115a for cleaning. The cleaning of the holding portion 115 for conveyance performed by the stone cleaning tool 144 and the brush cleaning tool 145 is performed by rotating the holding portion 115 for conveyance by the rotating mechanism 111a. Thereby, the whole surface of the holding surface 115a of the holding|maintenance part 115 for conveyance is cleaned.

如圖1所示，在粗研磨單元150，將基板W的加工面Wg粗研磨。粗研磨單元150具備粗研磨部151，粗研磨部151具有呈環狀形狀且可任意旋轉之粗研磨砂輪(未圖示)。此外，粗研磨部151，構成為可沿著支柱152往鉛直方向及水平方向移動。此外，在使固持於加工用固持部101之基板W的加工面Wg抵接於粗研磨砂輪之狀態下，使加工用固持部101與粗研磨砂輪分別旋轉，藉以將基板W的加工面Wg粗研磨。 As shown in FIG. 1 , in the rough grinding unit 150, the processed surface Wg of the substrate W is rough ground. The rough grinding unit 150 includes a rough grinding part 151 having a ring-shaped rough grinding wheel (not shown) that can be rotated arbitrarily. Moreover, the rough grinding|polishing part 151 is comprised so that it may move in a vertical direction and a horizontal direction along the support|pillar 152. In addition, in a state where the processed surface Wg of the substrate W held by the processing holding portion 101 is in contact with the rough grinding wheel, the processing holding portion 101 and the rough grinding wheel are rotated respectively, whereby the processed surface Wg of the substrate W is roughened. Grind.

在中研磨單元160，將基板W的加工面Wg中研磨。中研磨單元160具備中研磨部161，中研磨部161具有呈環狀形狀且可任意旋轉之中研磨砂輪(未圖示)。此外，中研磨部161，構成為可沿著支柱162往鉛直方向及水平方向移動。另，中研磨砂輪的磨粒之粒度，較粗研磨砂輪的磨粒之粒度更小。此外，在使固持於加工用固持部101之基板W的加工面Wg抵接於中研磨砂輪之狀態下，使加工用固持部101與中研磨砂輪分別旋轉，藉以將加工面Wg中研磨。 In the middle polishing unit 160, the processed surface Wg of the substrate W is middle polished. The middle grinding unit 160 includes a middle grinding part 161, and the middle grinding part 161 has an annular shape and can be rotated arbitrarily with a middle grinding wheel (not shown). Moreover, the middle grinding|polishing part 161 is comprised so that it may move in a vertical direction and a horizontal direction along the support|pillar 162. In addition, the particle size of the abrasive grains of the medium grinding wheel is smaller than that of the coarse grinding wheel. In addition, in a state where the processing surface Wg of the substrate W held by the processing holding portion 101 is in contact with the intermediate grinding wheel, the processing holding portion 101 and the intermediate grinding grinding wheel are respectively rotated, thereby grinding the processing surface Wg.

在精研磨單元170，將基板W的加工面Wg精研磨。精研磨單元170具備精研磨部171，精研磨部171具有呈環狀形狀且可任意旋轉之精研磨砂輪(未圖示)。此外，精研磨部171，構成為可沿著支柱172往鉛直方向及水平方向移動。另，精研磨砂輪的磨粒之粒度，較中研磨砂輪的磨粒之粒度更小。此外，在使固持於加工用固持部101之基板W的加工面Wg抵接於精研磨砂輪之狀態下，使加工用固持部101與精研磨砂輪分別旋轉，藉以將加工面Wg精研磨。 In the finish polishing unit 170, the processed surface Wg of the substrate W is finish-polished. The finishing unit 170 includes a finishing portion 171 having a ring-shaped finish grinding wheel (not shown) that can be rotated arbitrarily. Moreover, the finishing part 171 is comprised so that it may move in a vertical direction and a horizontal direction along the support|pillar 172. In addition, the particle size of the abrasive grains of the fine grinding wheel is smaller than that of the medium grinding wheel. Further, in a state where the processing surface Wg of the substrate W held by the processing holding portion 101 is brought into contact with the finishing grinding wheel, the processing holding portion 101 and the finishing grinding wheel are respectively rotated to finish grinding the processing surface Wg.

接著，對於利用如同上述地構成之基板處理系統1而施行的基板處理予以說明。 Next, the substrate processing performed using the substrate processing system 1 configured as described above will be described.

首先，將收納有複數基板W之晶圓匣盒C，載置於搬入站2的晶圓匣盒載置台10。於晶圓匣盒C內，為了抑制保護膠帶之變形，而以使貼附有該保護膠帶之基板W的非加工面Wn朝向上側之方式收納基板W。 First, the cassette C in which the plurality of substrates W are accommodated is placed on the cassette mounting table 10 of the transfer station 2 . In the wafer cassette C, in order to suppress the deformation|transformation of a protective tape, the board|substrate W is accommodated so that the non-processed surface Wn of the board|substrate W to which this protective tape was attached faces an upper side.

接著，藉由基板搬運裝置32的搬運叉架33，取出晶圓匣盒C內之基板W，往加工裝置4搬運。此時，藉由搬運叉架33，以使基板W的加工面Wg朝向上側之方式，將表背面反轉。 Next, the substrates W in the cassette C are taken out by the transfer forks 33 of the substrate transfer device 32 and transferred to the processing device 4 . At this time, by carrying the fork 33, the front and back surfaces are reversed so that the processed surface Wg of the substrate W faces upward.

將搬運至加工裝置4之基板W，往對準單元120傳遞。而後，於對準單元120中，調節基板W的水平方向之朝向(圖5的步驟S1)。 The substrate W conveyed to the processing apparatus 4 is transferred to the alignment unit 120 . Then, in the alignment unit 120, the orientation of the horizontal direction of the substrate W is adjusted (step S1 in FIG. 5).

接著，藉由搬運單元110，將基板W從對準單元120往傳遞位置A0搬運，往該傳遞位置A0之加工用固持部101傳遞。在加工用固持部101，固持基板W的非加工面Wn。此外，在搬運用固持部115從對準單元120接收基板W時、及往加工 用固持部101傳遞基板W時，藉由傾動機構116使搬運用固持部115可任意傾動。此外，在基板W的接收及傳遞時，藉由彈性構件117吸收衝撃。藉此，可適當地施行基板W的接收及傳遞。 Next, the substrate W is transferred from the alignment unit 120 to the transfer position A0 by the transfer unit 110, and transferred to the processing holding portion 101 of the transfer position A0. The unprocessed surface Wn of the substrate W is held by the holding portion 101 for processing. In addition, when the holding part 115 for conveyance receives the board|substrate W from the alignment unit 120, and after processing When the substrate W is transferred by the holding part 101 , the holding part 115 for conveyance can be tilted arbitrarily by the tilting mechanism 116 . In addition, when the substrate W is received and transferred, the shock is absorbed by the elastic member 117 . Thereby, the reception and transfer of the substrate W can be performed appropriately.

接著，使加工用固持部101往第1加工位置A1移動。而後，藉由粗研磨單元150，將基板W的加工面Wg粗研磨(圖5的步驟S2)。 Next, the holding part 101 for processing is moved to the 1st processing position A1. Then, the processed surface Wg of the substrate W is roughly ground by the rough grinding unit 150 (step S2 in FIG. 5 ).

接著，使加工用固持部101往第2加工位置A2移動。而後，藉由中研磨單元160，將基板W的加工面Wg中研磨(圖5的步驟S3)。 Next, the holding part 101 for processing is moved to the 2nd processing position A2. Then, the processing surface Wg of the substrate W is middle-polished by the middle-grinding unit 160 (step S3 in FIG. 5 ).

接著，使加工用固持部101往第3加工位置A3移動。而後，藉由精研磨單元170，將基板W的加工面Wg精研磨(圖5的步驟S4)。 Next, the holding part 101 for processing is moved to the 3rd processing position A3. Then, the processed surface Wg of the substrate W is finish-polished by the finish-polishing unit 170 (step S4 in FIG. 5 ).

接著，使加工用固持部101往傳遞位置A0移動。此處，利用清洗液噴嘴(未圖示)，藉由清洗液將基板W的加工面Wg初步清洗(圖5的步驟S5)。在此一步驟S5，施行將加工面Wg之髒汙去除至某程度的清洗。 Next, the holding part 101 for processing is moved to the transmission position A0. Here, the processing surface Wg of the substrate W is preliminarily cleaned with the cleaning liquid using a cleaning liquid nozzle (not shown) (step S5 in FIG. 5 ). In this step S5, cleaning for removing the contamination of the processing surface Wg to a certain degree is performed.

接著，藉由搬運單元110，將基板W從傳遞位置A0往第2清洗單元140搬運(圖5的步驟S6)。此處，於步驟S6中，針對搬運單元110從傳遞位置A0接收基板W之方法予以說明。 Next, the substrate W is transferred from the transfer position A0 to the second cleaning unit 140 by the transfer unit 110 (step S6 in FIG. 5 ). Here, in step S6, the method of receiving the board|substrate W from the transfer position A0 of the conveyance unit 110 is demonstrated.

首先，如圖6(a)所示，使搬運單元110的搬運用固持部115，往吸附固持在加工用固持部101之基板W的上方移動，與該基板W對向配置。 First, as shown in FIG. 6( a ), the conveyance holding portion 115 of the conveyance unit 110 is moved to the upper side of the substrate W that is sucked and held by the processing holding portion 101 , and is arranged to face the substrate W.

而後，如圖6(b)所示，使搬運用固持部115下降，以該搬運用固持部115將基板W的加工面Wg以全表面吸附固持。此時，藉由傾動機構116使搬運用固持部115可任意傾動。此外，進一步，藉由彈性構件117吸收基板W之吸附固持時的衝撃。藉此，可適當地施行基板W的吸附固持。另，有將此圖6(b)所示之步驟，稱作固持步驟的情況。此外，於此固持步驟中，若以搬運用固持部115將基板W吸附固持，則在後述從氣體供給部106供給氣體之前的任意時序，解除加工用固持部101所進行之基板W的吸附固持。 Then, as shown in FIG.6(b), the holding|maintenance part 115 for conveyance is lowered|hung, and the processed surface Wg of the board|substrate W is adsorbed and hold|maintained by this holding part 115 for conveyance. At this time, the holding portion 115 for conveyance can be tilted arbitrarily by the tilting mechanism 116 . Furthermore, the shock when the substrate W is adsorbed and held is absorbed by the elastic member 117 . Thereby, the adsorption|suction holding|maintenance of the board|substrate W can be performed suitably. In addition, the step shown in FIG. 6(b) may be referred to as a holding step. In addition, in this holding step, if the substrate W is sucked and held by the transport holding portion 115 , the suction holding of the substrate W by the processing holding portion 101 is released at any timing before the gas is supplied from the gas supply portion 106 to be described later. .

而後，如圖6(c)所示，從氣體供給部106，往加工用固持部101的固持面101a與基板W的非加工面Wn之間供給氣體。藉由此一氣體，將基板W從加工用固持部101剝離。此處，如同上述，在未以加工用固持部101固持基板W的狀態，從液體供給部105供給液體。如此一來，成為液體殘存於供給管104之狀態，隨著氣體的供給亦一同供給液體。此外，於加工用固持部101的固持面101a與基板W的非加工面Wn之間，形成液體L的膜。另，有將此圖6(c)所示之步驟，稱作液體供給步驟的情況。此外，本實施形態，藉由從氣體供給部106供給氣體，而往加工用固持部101的固持面101a與基板W的非加工面Wn之間供給液體L，但亦可從液體供給部105供給液體。 Then, as shown in FIG.6(c), from the gas supply part 106, gas is supplied between the holding surface 101a of the holding part 101 for processing and the non-processing surface Wn of the board|substrate W. With this gas, the substrate W is peeled off from the processing holding portion 101 . Here, as described above, the liquid is supplied from the liquid supply portion 105 in a state in which the substrate W is not held by the processing holding portion 101 . In this way, the liquid remains in the supply pipe 104, and the liquid is supplied along with the supply of the gas. In addition, a film of the liquid L is formed between the holding surface 101a of the holding portion 101 for processing and the non-processing surface Wn of the substrate W. As shown in FIG. In addition, the step shown in FIG. 6(c) may be called a liquid supply step. In addition, in the present embodiment, the liquid L is supplied between the holding surface 101 a of the processing holding portion 101 and the non-processing surface Wn of the substrate W by supplying the gas from the gas supply portion 106 , but the liquid L may be supplied from the liquid supply portion 105 . liquid.

而後，如圖6(c)所示，使固持於搬運用固持部115之基板W，上升至液體L未與基板W分離的高度。另，有將此圖6(c)所示之步驟，稱作上升步驟的情況。 Then, as shown in FIG.6(c), the board|substrate W hold|maintained by the holding|maintenance part 115 for conveyance is raised to the height at which the liquid L is not separated from the board|substrate W. In addition, the step shown in FIG. 6(c) may be referred to as a rising step.

而後，如圖6(d)所示，在液體L與基板W接觸的狀態下，使固持於搬運用固持部115之基板W，往水平方向移動。如此一來，基板W與液體L的接觸面積 變小。此外，亦有由於基板W的水平移動，而在基板W與液體L之間形成微小的空氣空間之情況。進一步，在俯視時基板W的外周部位於加工用固持部101之外側時，亦有液體L從加工用固持部101之外側排出的情況。藉由此等各種因素，可使產生在基板W與液體L之界面產生的張力減小。另，有將此圖6(d)所示之步驟，稱作移動步驟的情況。 Then, as shown in FIG.6(d), in the state which the liquid L and the board|substrate W were contacting, the board|substrate W hold|maintained by the holding|maintenance part 115 for conveyance is moved to a horizontal direction. In this way, the contact area between the substrate W and the liquid L become smaller. In addition, there are cases where a minute air space is formed between the substrate W and the liquid L due to the horizontal movement of the substrate W. Furthermore, when the outer peripheral portion of the substrate W is positioned outside the processing holding portion 101 in plan view, the liquid L may be discharged from the outside of the processing holding portion 101 . Due to various factors such as these, the tension generated at the interface between the substrate W and the liquid L can be reduced. In addition, the step shown in FIG. 6(d) may be referred to as a moving step.

而後，如圖6(e)所示，在俯視時基板W的外周部位於加工用固持部101之外側時，使固持於搬運用固持部115之基板W上升。如此一來，則基板W與液體L分離。此時，如同上述，界面的張力變小，故可抑制如同習知地基板W遭受損傷之情形。此外，亦可抑制如同習知地基板W從搬運用固持部115脫落之情形。 Then, as shown in FIG. 6( e ), when the outer peripheral portion of the substrate W is positioned outside the processing holding portion 101 in plan view, the substrate W held by the conveying holding portion 115 is raised. In this way, the substrate W and the liquid L are separated. At this time, as described above, the tension of the interface is reduced, so that damage to the substrate W as in the conventional case can be suppressed. In addition, it is also possible to prevent the substrate W from falling off from the conveyance holding portion 115 as in the conventional case.

另，使基板W上升的時序，並未限定為本實施形態。例如亦可使基板W往水平方向移動，在俯視時該基板W整體於位於加工用固持部101之外側時，使基板W上升。 In addition, the timing of raising the substrate W is not limited to this embodiment. For example, the substrate W may be moved in the horizontal direction, and the substrate W may be raised when the entire substrate W is positioned outside the processing holding portion 101 in plan view.

此外，在本實施形態，使基板W往水平方向移動後，使其上升，但亦可使基板W往斜上方移動。亦即，亦可同時施行圖6(d)所示之移動步驟與圖6(e)所示之上升步驟。 In addition, in this embodiment, after moving the board|substrate W in a horizontal direction, it raises, but you may move the board|substrate W diagonally upward. That is, the moving step shown in FIG. 6(d) and the raising step shown in FIG. 6(e) may be performed simultaneously.

進一步，例如在水平方向具有足夠空間的情況，亦可不使基板W上升，而僅藉由水平方向的移動將基板W與液體L分離。 Furthermore, for example, when there is sufficient space in the horizontal direction, the substrate W and the liquid L may be separated only by the movement in the horizontal direction without raising the substrate W.

如同上述，於步驟S6中，搬運單元110從傳遞位置A0接收基板W，將該基板從傳遞位置A0往第2清洗單元140搬運。 As described above, in step S6 , the transfer unit 110 receives the substrate W from the transfer position A0 , and transfers the substrate from the transfer position A0 to the second cleaning unit 140 .

而後，在第2清洗單元140，如圖7所示，在藉由旋轉機構111a將基板W於搬運用固持部115旋轉固持之狀態下，藉由海綿清洗具142清洗基板W的非加工面Wn(圖5的步驟S7)。其後，進一步，在將基板W於搬運用固持部115旋轉固持之狀態下，從空氣噴嘴143對非加工面Wn噴射空氣，使該非加工面Wn乾燥。 Then, in the second cleaning unit 140, as shown in FIG. 7, the non-processed surface Wn of the substrate W is cleaned by the sponge cleaning tool 142 in a state where the substrate W is rotated and held by the holding portion 115 for conveyance by the rotating mechanism 111a. (Step S7 in FIG. 5 ). Then, in the state in which the board|substrate W is rotationally held by the holding|maintenance part 115 for conveyance, air is sprayed to the unprocessed surface Wn from the air nozzle 143, and this unprocessed surface Wn is dried.

於此等步驟S6、S7中，在將基板W固持於搬運用固持部115前，利用第2清洗單元140之石材清洗具144與刷子清洗具145，清洗搬運用固持部115。(圖5的步驟T1)。石材清洗具144與刷子清洗具145所進行之搬運用固持部115的清洗，係藉由旋轉機構111a使搬運用固持部115旋轉並施行。另，搬運用固持部115的清洗，可藉由石材清洗具144與刷子清洗具145之任一方施行，或由雙方施行亦可。此外，搬運用固持部115的清洗，可在至步驟S6前之任意時序施行。 In these steps S6 and S7 , before the substrate W is held in the holding portion 115 for carrying, the holding portion 115 for carrying is cleaned by using the stone cleaning tool 144 and the cleaning tool 145 of the brush of the second cleaning unit 140 . (Step T1 in FIG. 5 ). The cleaning of the holding portion 115 for conveyance by the stone cleaning tool 144 and the brush cleaning tool 145 is performed by rotating the holding portion 115 for conveyance by the rotating mechanism 111a. In addition, the cleaning of the holding portion 115 for conveyance may be performed by either the stone cleaning tool 144 or the brush cleaning tool 145, or both may be performed. In addition, the washing|cleaning of the holding|maintenance part 115 for conveyance can be performed at arbitrary timing until step S6.

接著，藉由搬運單元110，將基板W從第2清洗單元140往第1清洗單元130搬運。在將基板W從搬運用固持部115往第1清洗單元130之旋轉吸盤(未圖示)傳遞時，藉由傾動機構116使搬運用固持部115可任意傾動。此外，藉由彈性構件117吸收基板W之傳遞時的衝撃。藉此，可適當地施行基板W的傳遞。而後，在第1清洗單元130，利用清洗液噴嘴(未圖示)，藉由清洗液將基板W的加工面Wg完工清洗(圖5的步驟S8)。在此步驟S8，將加工面Wg清洗至期望的潔淨度並使其乾燥。 Next, the substrate W is transported from the second cleaning unit 140 to the first cleaning unit 130 by the transport unit 110 . When the substrate W is transferred from the transfer holding portion 115 to the spin chuck (not shown) of the first cleaning unit 130 , the transfer holding portion 115 can be tilted arbitrarily by the tilting mechanism 116 . In addition, the shock when the substrate W is transferred is absorbed by the elastic member 117 . Thereby, the transfer of the substrate W can be performed appropriately. Then, in the first cleaning unit 130, using a cleaning liquid nozzle (not shown), the processing surface Wg of the substrate W is completely cleaned with the cleaning liquid (step S8 in FIG. 5). In this step S8, the processing surface Wg is washed to a desired cleanliness and dried.

其後，藉由基板搬運裝置32，將基板W從第1清洗單元130往後處理裝置5搬運。而後，在後處理裝置5，施行將基板W固持於切割架的貼裝處理、將貼附於基板W之保護膠帶剝離的剝離處理等後處理(圖5的步驟S9)。 After that, the substrate W is transported from the first cleaning unit 130 to the post-processing device 5 by the substrate transport device 32 . Then, in the post-processing device 5, post-processing such as a mounting process for holding the substrate W to a dicing frame and a peeling process for peeling off the protective tape attached to the substrate W are performed (step S9 in FIG. 5 ).

其後，將施行過全部處理之基板W，往搬出站3之晶圓匣盒載置台20的晶圓匣盒C搬運。如此地，結束基板處理系統1的一連串之基板處理。 After that, the substrate W on which all the processes have been performed is conveyed to the cassette C of the cassette mounting table 20 of the unloading station 3 . In this way, a series of substrate processing by the substrate processing system 1 is completed.

以上，依本實施形態，處理基板W之基板處理系統1，具備：加工用固持部101，在將基板W的加工面Wg加工時，固持與該基板W的加工面Wg為相反側之非加工面Wn；液體供給部105，往加工用固持部101的固持面101a供給液體；搬運用固持部115，在搬運基板W時，固持該基板W的加工面Wg；移動機構114(111~113)，使搬運用固持部115往水平方向及鉛直方向移動；以及控制部40，控制加工用固持部101、液體供給部105、搬運用固持部115及移動機構114(111~113)。此外，基板處理系統1之基板處理方法，包含如下步驟：固持步驟，對以加工用固持部101固持非加工面Wn之基板W，以搬運用固持部115固持加工面Wg(圖6(b))；液體供給步驟，其後，從液體供給部105，往加工用固持部101的固持面101a與基板W的非加工面Wn之間供給液體L(圖6(c))；上升步驟，其後，藉由移動機構114，使固持於搬運用固持部115之基板W，上升至液體L未與基板W分離的高度(圖6(c))；以及移動步驟，其後，在液體L與基板W接觸的狀態下，藉由移動機構，使固持於搬運用固持部115之基板W往水平方向移動(圖6(d))。藉此，可減小在基板W與液體L之界面產生的張力，可抑制基板W遭受損傷。且在本實施形態，無須設置特殊構造或機構，僅藉由改變運作路徑，即可達到上述效果。 As described above, according to the present embodiment, the substrate processing system 1 for processing the substrate W includes the processing holding portion 101 for holding the non-processing side opposite to the processing surface Wg of the substrate W when the processing surface Wg of the substrate W is processed. surface Wn; liquid supply part 105, which supplies liquid to the holding surface 101a of the holding part 101 for processing; holding part 115 for conveyance, when the substrate W is conveyed, holds the processing surface Wg of the substrate W; moving mechanism 114 (111~113) , to move the holding part 115 for conveyance in the horizontal and vertical directions; and the control part 40 to control the holding part 101 for processing, the liquid supply part 105 , the holding part 115 for conveyance and the moving mechanism 114 ( 111 to 113 ). Further, the substrate processing method of the substrate processing system 1 includes the following steps: a holding step of holding the substrate W with the non-processed surface Wn by the processing holding portion 101 and holding the processing surface Wg by the conveying holding portion 115 ( FIG. 6( b ) ); the liquid supply step, after that, from the liquid supply part 105, the liquid L is supplied between the holding surface 101a of the processing holding part 101 and the non-processing surface Wn of the substrate W (FIG. 6(c)); the rising step, which Then, by the moving mechanism 114, the substrate W held by the holding portion 115 for conveyance is raised to a height at which the liquid L is not separated from the substrate W (FIG. 6(c)); In a state in which the substrates W are in contact, the substrates W held by the holding portion 115 for conveyance are moved in the horizontal direction by the moving mechanism ( FIG. 6( d )). As a result, the tension generated at the interface between the substrate W and the liquid L can be reduced, and damage to the substrate W can be suppressed. Moreover, in this embodiment, the above-mentioned effects can be achieved only by changing the operation path without setting up a special structure or mechanism.

此外，依本實施形態，於圖6(d)所示之移動步驟中，在俯視時基板W的外周部位於加工用固持部101之外側時，如圖6(e)所示地，藉由移動機構114，使固持於搬運用固持部115之基板W上升。抑或，於圖6(d)所示之移動步驟中， 在俯視時基板W整體位於加工用固持部101之外側時，如圖6(e)所示地，藉由移動機構114，使固持於搬運用固持部115之基板W上升。在任一情況中，皆可減小在基板W與液體L之界面產生的張力。 In addition, according to the present embodiment, in the moving step shown in FIG. 6( d ), when the outer peripheral portion of the substrate W is positioned outside the processing holding portion 101 in plan view, as shown in FIG. 6( e ), by The moving mechanism 114 raises the board|substrate W hold|maintained by the holding|maintenance part 115 for conveyance. Or, in the moving step shown in Figure 6(d), When the entire substrate W is positioned outside the processing holding portion 101 in plan view, as shown in FIG. In either case, the tension generated at the interface between the substrate W and the liquid L can be reduced.

此外，依本實施形態，於圖6(d)所示之移動步驟中，在俯視時基板W的外周部位於加工用固持部101之外側時，從加工用固持部101之外側排出液體L。藉此，可進一步減小在基板W與液體L之界面產生的張力。 In addition, according to this embodiment, in the moving step shown in FIG. 6( d ), when the outer peripheral portion of the substrate W is positioned outside the processing holding portion 101 in plan view, the liquid L is discharged from the outside of the processing holding portion 101 . Thereby, the tension generated at the interface between the substrate W and the liquid L can be further reduced.

此外，依本實施形態，基板處理系統1，具備往加工用固持部101的固持面101a供給氣體之氣體供給部106。而於圖6(c)所示之液體供給步驟中，從氣體供給部106，往加工用固持部101的固持面101a與基板W的非加工面Wn之間供給氣體。藉此，可將基板W從加工用固持部101適當地剝離。 Further, according to the present embodiment, the substrate processing system 1 includes the gas supply unit 106 that supplies the gas to the holding surface 101 a of the processing holding unit 101 . In the liquid supply step shown in FIG. 6( c ), gas is supplied from the gas supply unit 106 between the holding surface 101 a of the processing holding unit 101 and the non-processing surface Wn of the substrate W. Thereby, the board|substrate W can be peeled off from the holding|maintenance part 101 for processing suitably.

此外，依本實施形態，基板處理系統1，具備：傾動機構116，使搬運用固持部115在側視時可任意傾動；以及彈性構件117，設置於搬運用固持部115。藉由傾動機構116，在搬運用固持部115接收或傳遞基板W時，可使搬運用固持部115傾動。此外，藉由彈性構件117，在搬運用固持部115接收或傳遞基板W時，可吸收其衝撃。其結果，可適當地接收(傳遞)基板W。 In addition, according to the present embodiment, the substrate processing system 1 includes a tilting mechanism 116 that allows the conveyance holding portion 115 to be tilted arbitrarily in a side view, and an elastic member 117 provided in the conveyance holding portion 115 . By the tilting mechanism 116 , when the transport holding portion 115 receives or transfers the substrate W, the transport holding portion 115 can be tilted. In addition, the elastic member 117 can absorb the shock when the holding portion 115 for conveyance receives or transfers the substrate W. As a result, the substrate W can be appropriately received (transferred).

另，於本實施形態之步驟S6的，圖6(d)所示之移動步驟中，亦可藉由旋轉機構(未圖示)使加工用固持部101旋轉，且藉由旋轉機構111a使搬運用固持部115旋轉，並藉由移動機構使固持於搬運用固持部115之基板W往水平方向移動。如此地，藉由使加工用固持部101與搬運用固持部115旋轉，而可進一步減小在基板W與液體L之界面產生的張力。另，加工用固持部101與搬運用固持部 115，使其任一方旋轉即可，亦即，使加工用固持部101與搬運用固持部115相對旋轉即可。 In addition, in step S6 of the present embodiment, in the moving step shown in FIG. 6( d ), the processing holding portion 101 may be rotated by a rotating mechanism (not shown), and the conveying may be rotated by the rotating mechanism 111a The holding portion 115 is rotated, and the substrate W held by the holding portion 115 for conveyance is moved horizontally by the moving mechanism. In this way, by rotating the processing holding portion 101 and the conveying holding portion 115 , the tension generated at the interface between the substrate W and the liquid L can be further reduced. In addition, the processing holding portion 101 and the conveying holding portion 115, either one of them may be rotated, that is, the processing holding portion 101 and the conveying holding portion 115 may be relatively rotated.

在上述實施形態之第2清洗單元140，於步驟S7中，亦可在使海綿清洗具142抵接於基板W的非加工面Wn之狀態下，藉由移動機構使搬運用固持部115往水平方向來回移動，清洗非加工面Wn。此外，於步驟T1中亦同樣地，亦可在使石材清洗具144或刷子清洗具145抵接於固持面115a之狀態下，藉由移動機構使搬運用固持部115往水平方向來回移動，清洗固持面115a。 In the second cleaning unit 140 of the above-described embodiment, in step S7, the holding portion 115 for conveyance may be moved horizontally by the moving mechanism in a state where the sponge cleaning tool 142 is in contact with the unprocessed surface Wn of the substrate W The direction moves back and forth to clean the non-machined surface Wn. In addition, in the same way in step T1, in the state where the stone cleaning tool 144 or the brush cleaning tool 145 is in contact with the holding surface 115a, the holding portion 115 for conveyance can be moved back and forth in the horizontal direction by the moving mechanism to clean Holding surface 115a.

此處，例如日本特開第2003-45841號公報揭露一種清洗裝置，清洗用於吸附搬運被加工物之吸附墊的吸附面。清洗裝置，具備：研磨板，具有用於研磨吸附面之研磨面；以及擺動驅動手段，使研磨板往研磨面延伸之方向擺動。此外，使吸附面抵接於藉由擺動驅動手段擺動之研磨板的研磨面，並使其往與研磨板之延伸方向略垂直的方向移動，藉以清洗該吸附面。 Here, for example, Japanese Patent Laid-Open No. 2003-45841 discloses a cleaning device that cleans the suction surface of a suction pad for suction and conveyance of a workpiece. The cleaning device is provided with: a polishing plate having a polishing surface for polishing the adsorption surface; and a swing driving means for swinging the polishing plate in a direction in which the polishing surface extends. In addition, the adsorption surface is cleaned by contacting the adsorption surface with the polishing surface of the polishing plate oscillated by the swing driving means, and moving it in a direction slightly perpendicular to the extending direction of the polishing plate.

然而，在日本特開第2003-45841號公報所揭露之清洗裝置，於研磨板擺動時，若其擺動並未呈一定，則有由研磨板對吸附墊施加的壓力在吸附面內變得不均之情況。尤其是，為了吸收吸附被加工物時的衝撃，而有在吸附墊設置彈性構件之情況。由於此一彈性構件的配置，而使施加在吸附墊的壓力更為不均。 However, in the cleaning device disclosed in Japanese Patent Laid-Open No. 2003-45841, when the polishing plate swings, if the swing is not constant, the pressure exerted by the polishing plate on the adsorption pad becomes ineffective in the adsorption surface. average situation. In particular, in order to absorb shock when the workpiece is adsorbed, an elastic member may be provided in the adsorption pad. Due to the configuration of the elastic member, the pressure applied to the adsorption pad is more uneven.

而在本實施形態，於步驟S7或步驟T1中，在使搬運用固持部115來回移動而清洗非加工面Wn或固持面115a時，施加於該非加工面Wn或固持面115a的壓力呈一定。 On the other hand, in the present embodiment, in step S7 or step T1, when the conveyance holding portion 115 is moved back and forth to clean the unprocessed surface Wn or the holding surface 115a, the pressure applied to the unprocessed surface Wn or the holding surface 115a is constant.

在步驟S7，於第2清洗單元140中，如圖8所示，在使海綿清洗具142抵接於基板W的非加工面Wn之狀態下，藉由移動機構使搬運用固持部115往水平方向來回移動，清洗非加工面Wn。圖8(a)中顯示海綿清洗具142抵接於基板W的中心部之樣子。將此時之基板W的中心部之位置稱作中心位置A。圖8(b)、(c)中，分別顯示海綿清洗具142抵接於基板W的外周部之樣子。將此時之基板W的中心部之位置稱作中心位置B、C。圖8(d)中，將基板W之非加工面Wn的中心部之移動，與其高度位置一同示意。 In step S7 , in the second cleaning unit 140 , as shown in FIG. 8 , in a state where the sponge cleaning tool 142 is in contact with the non-processed surface Wn of the substrate W, the conveying holding portion 115 is moved horizontally by the moving mechanism. The direction moves back and forth to clean the non-machined surface Wn. FIG. 8( a ) shows a state where the sponge cleaning tool 142 is in contact with the center portion of the substrate W. As shown in FIG. The position of the center part of the board|substrate W at this time is called the center position A. In FIG.8(b), (c), the state which the sponge cleaning tool 142 contact|abutted the outer peripheral part of the board|substrate W is shown, respectively. The position of the center part of the board|substrate W at this time is called center position B, C. In FIG.8(d), the movement of the center part of the non-processed surface Wn of the board|substrate W is shown together with the height position.

如同本實施形態地將彈性構件117設置於搬運用固持部115的外周部之情況，在海綿清洗具142抵接於基板W的外周部時對基板W施加之壓力，相較於對基板W的中央部施加之壓力變得更大。因而，如圖8所示，使中心位置B、C之基板W的非加工面Wn之高度位置，較中心位置A之基板W的非加工面Wn之高度位置更高。此高度位置的調整，例如係藉由移動機構114使搬運用固持部115往鉛直方向移動而施行。 As in the case where the elastic member 117 is provided on the outer peripheral portion of the conveying holding portion 115 in the present embodiment, the pressure applied to the substrate W when the sponge cleaning tool 142 abuts against the outer peripheral portion of the substrate W is higher than the pressure applied to the substrate W. The pressure exerted by the center becomes greater. Therefore, as shown in FIG. 8 , the height positions of the unprocessed surfaces Wn of the substrate W at the center positions B and C are set higher than the height position of the unprocessed surface Wn of the substrate W at the center position A. The adjustment of this height position is performed by moving the holding|maintenance part 115 for conveyance to a vertical direction by the moving mechanism 114, for example.

此一形況，可使在海綿清洗具142抵接於基板W的外周部時對基板W的非加工面Wn施加之壓力減小。其結果，可使對非加工面Wn施加之壓力在面內呈一定，可抑制起因於壓力不均的基板W之損傷。此外，藉由如此地減小對基板W的外周部施加之壓力，亦可進一步抑制該基板W的外周部遭受損傷。且在本實施形態，無須設置特殊構造或機構，僅藉由改變運作路徑，即可達到上述效果。 In this case, the pressure applied to the non-processed surface Wn of the substrate W when the sponge cleaning tool 142 is in contact with the outer peripheral portion of the substrate W can be reduced. As a result, the pressure applied to the unprocessed surface Wn can be made constant within the surface, and damage to the substrate W caused by uneven pressure can be suppressed. In addition, by reducing the pressure applied to the outer peripheral portion of the substrate W in this way, the outer peripheral portion of the substrate W can be further suppressed from being damaged. Moreover, in this embodiment, the above-mentioned effects can be achieved only by changing the operation path without setting up a special structure or mechanism.

於步驟T1中，在以第2清洗單元140清洗搬運用固持部115的固持面115a時亦相同。在步驟T1，在使石材清洗具144或刷子清洗具145抵接於固持面115a之狀態下，藉由移動機構使搬運用固持部115往水平方向來回移動，清洗固持面 115a。此外，如圖8所示，使中心位置B、C的固持面115a之高度位置，較中心位置A的固持面115a之高度位置更高。如此一來，可使對固持面115a施加之壓力在面內呈一定，可適當地清洗該固持面115a。 In step T1, it is the same when the holding surface 115a of the holding|maintenance part 115 for conveyance is cleaned by the 2nd cleaning unit 140. In step T1, in a state where the stone cleaning tool 144 or the brush cleaning tool 145 is in contact with the holding surface 115a, the holding portion 115 for conveyance is moved back and forth in the horizontal direction by the moving mechanism to clean the holding surface 115a. In addition, as shown in FIG. 8, the height positions of the holding surfaces 115a at the center positions B and C are made higher than the height position of the holding surfaces 115a at the center position A. As shown in FIG. In this way, the pressure applied to the holding surface 115a can be made constant within the surface, and the holding surface 115a can be properly cleaned.

上述實施形態，雖將彈性構件117設置於搬運用固持部115的外周部，但該彈性構件117之配置可為任意配置。例如如圖9所示，彈性構件117，亦可設置於搬運用固持部115的中央部。而在步驟S7，亦可如圖10所示，在使海綿清洗具142抵接於基板W的非加工面Wn之狀態下，藉由移動機構使搬運用固持部115往水平方向來回移動，清洗非加工面Wn。圖10(a)中，顯示海綿清洗具142抵接於基板W的中心部之樣子。將此時之基板W的中心部之位置稱作中心位置A。圖10(b)、(c)中，分別顯示海綿清洗具142抵接於基板W的外周部之樣子。將此時之基板W的中心部之位置稱作中心位置B、C。圖10(d)中，將基板W的非加工面Wn的中心部之移動，與其高度位置一同示意。 Although the elastic member 117 is provided in the outer peripheral part of the holding|maintenance part 115 for conveyance in the said embodiment, the arrangement|positioning of this elastic member 117 may be arbitrary. For example, as shown in FIG. 9, the elastic member 117 may be provided in the center part of the holding|maintenance part 115 for conveyance. In step S7 , as shown in FIG. 10 , in a state where the sponge cleaning tool 142 is in contact with the unprocessed surface Wn of the substrate W, the conveying holding portion 115 can be moved back and forth in the horizontal direction by the moving mechanism to clean Non-working surface Wn. In FIG. 10( a ), the state where the sponge cleaning tool 142 is in contact with the center portion of the substrate W is shown. The position of the center part of the board|substrate W at this time is called the center position A. In FIGS. 10( b ) and ( c ), the state where the sponge cleaning tool 142 is in contact with the outer peripheral portion of the substrate W is shown, respectively. The position of the center part of the board|substrate W at this time is called center position B, C. In FIG.10(d), the movement of the center part of the unprocessed surface Wn of the board|substrate W is shown together with the height position.

如同本實施形態，將彈性構件117設置於搬運用固持部115的中央部之情況，在海綿清洗具142抵接於基板W的外周部時對基板W施加之壓力，相較於對基板W的中央部施加之壓力變得更小。因而，如圖10所示，使中心位置A之基板W的非加工面Wn之高度位置，較中心位置B、C之基板W的非加工面Wn之高度位置更高。 As in the present embodiment, when the elastic member 117 is provided in the central portion of the holding portion 115 for conveyance, the pressure applied to the substrate W when the sponge cleaning tool 142 abuts on the outer peripheral portion of the substrate W is greater than the pressure applied to the substrate W. The pressure exerted by the central part becomes smaller. Therefore, as shown in FIG. 10 , the height position of the unprocessed surface Wn of the substrate W at the center position A is made higher than the height position of the unprocessed surface Wn of the substrate W at the center positions B and C.

此一形況，可使在海綿清洗具142抵接於基板W的外周部時對基板W的非加工面Wn施加之壓力增大。其結果，可使對非加工面Wn施加之壓力在面內呈一定，可抑制起因於壓力不均的基板W之損傷。此外，藉由如此地增大對基板W的 外周部施加之壓力，相較於未調整基板W的高度之情況，亦可縮短清洗所耗費的時間。 In this case, the pressure applied to the non-processed surface Wn of the substrate W when the sponge cleaning tool 142 is in contact with the outer peripheral portion of the substrate W can be increased. As a result, the pressure applied to the unprocessed surface Wn can be made constant within the surface, and damage to the substrate W caused by uneven pressure can be suppressed. Furthermore, by thus increasing the resistance to the substrate W Compared with the case where the height of the substrate W is not adjusted, the pressure applied to the outer peripheral portion can also shorten the time taken for cleaning.

於步驟T1中，在以第2清洗單元140清洗搬運用固持部115的固持面115a時亦相同。在步驟T1，在使石材清洗具144或刷子清洗具145抵接於固持面115a之狀態下，藉由移動機構使搬運用固持部115往水平方向來回移動，清洗固持面115a。而如圖10所示，使中心位置A的固持面115a之高度位置，較中心位置B、C的固持面115a之高度位置更高。如此一來，可使對固持面115a施加之壓力在面內呈一定，亦可進一步縮短清洗時間。 In step T1, it is the same when the holding surface 115a of the holding|maintenance part 115 for conveyance is cleaned by the 2nd cleaning unit 140. In step T1, in the state where the stone cleaning tool 144 or the brush cleaning tool 145 is in contact with the holding surface 115a, the conveying holding portion 115 is moved back and forth in the horizontal direction by the moving mechanism to clean the holding surface 115a. And as shown in FIG. 10, the height position of the holding surface 115a of the center position A is made higher than the height position of the holding surface 115a of the center position B, C. In this way, the pressure applied to the holding surface 115a can be made constant within the surface, and the cleaning time can be further shortened.

上述實施形態，雖於基板W的非加工面Wn貼附用於保護裝置之保護膠帶，但裝置的保護材並未限定為此一形態。例如亦可於基板W的非加工面Wn，貼合支持晶圓或玻璃基板等支持基板，此一形況亦可應用本實施形態。 In the above-described embodiment, the protective tape for protecting the device is attached to the unprocessed surface Wn of the substrate W, but the protective material of the device is not limited to this form. For example, a support substrate such as a support wafer or a glass substrate may be bonded to the unprocessed surface Wn of the substrate W, and the present embodiment may also be applied to this case.

應知本次揭露之實施形態全部的點僅為例示，並非用於限制本發明。上述實施形態，亦可不脫離添附之發明申請專利範圍及其主旨地，以各式各樣的形態省略、置換、變更。 It should be understood that all the points of the embodiments disclosed this time are merely examples and are not intended to limit the present invention. The above-described embodiments may be omitted, replaced, and changed in various forms without departing from the scope and gist of the appended invention claims.

1:基板處理系統 1: Substrate processing system

2:搬入站 2: Move in station

3:搬出站 3: Move out of the station

4:加工裝置 4: Processing device

5:後處理裝置 5: Post-processing device

6:搬運站 6: Handling station

10、20:晶圓匣盒載置台 10, 20: Wafer cassette stage

30:基板搬運區域 30: Substrate handling area

31:搬運路 31: Transportation Road

32:基板搬運裝置 32: Substrate conveying device

33:搬運叉架 33: Handling Fork

34:搬運墊 34: Carrying Mat

40:控制部 40: Control Department

100:旋轉台 100: Rotary table

101:加工用固持部 101: Holding part for processing

102:固持部基台 102: Holder abutment

110:搬運單元 110: Handling unit

111~113:臂部 111~113: Arm

114:移動機構 114: Moving Mechanisms

115:搬運用固持部 115: Holding part for transportation

120:對準單元 120: Alignment unit

130:第1清洗單元 130: 1st cleaning unit

140:第2清洗單元 140: 2nd cleaning unit

150:粗研磨單元 150: Coarse grinding unit

151:粗研磨部 151: Rough grinding section

152:支柱 152: Pillar

160:中研磨單元 160: Medium grinding unit

161:中研磨部 161: Middle grinding department

162:支柱 162: Pillar

170:精研磨單元 170: Fine grinding unit

171:精研磨部 171: Fine grinding department

172:支柱 172: Pillar

A0:傳遞位置 A0: Transfer position

A1~A3:加工位置 A1~A3: Processing position

C:晶圓匣盒 C: Wafer cassette

W:基板 W: substrate

Claims (15)

一種基板處理系統，將基板的加工面加工，包含：加工用固持部，於對該基板的加工面進行加工時，將與該基板的加工面為相反側之非加工面予以固持；搬運用固持部，在搬運該基板時，固持該基板的加工面；移動機構，使該搬運用固持部往水平方向及鉛直方向移動；以及控制部，控制該加工用固持部、該液體供給部、該搬運用固持部及該移動機構；該搬運用固持部，包含：傾動機構，使該搬運用固持部在側視時可任意傾動；彈性構件，設置於該搬運用固持部；以及清洗具，用來清洗清洗面，該清洗面係該基板的非加工面或該搬運用固持部的固持面；該控制部，在使該清洗具抵接於該清洗面的狀態下，藉由該移動機構使該搬運用固持部往水平方向移動，以實行清洗該清洗面之清洗步驟；於該清洗步驟中，在使該清洗具抵接於該清洗面的外周部時和使該清洗具抵接於該清洗面的中心部時，改變該清洗面的高度位置。 A substrate processing system for processing a processing surface of a substrate, comprising: a processing holding portion for holding a non-processing surface on the opposite side of the processing surface of the substrate when the processing surface of the substrate is processed; A part for holding the processing surface of the substrate when the substrate is conveyed; a moving mechanism for moving the holding part for conveying in the horizontal direction and the vertical direction; and a control part for controlling the holding part for processing, the liquid supply part, the conveying part The holding part and the moving mechanism are used; the holding part for conveying includes: a tilting mechanism, so that the holding part for conveying can be tilted arbitrarily when viewed from the side; an elastic member is arranged on the holding part for conveying; and a cleaning tool is used for cleaning the cleaning surface, the cleaning surface is the unprocessed surface of the substrate or the holding surface of the holding part for conveyance; the control part causes the cleaning tool to abut the cleaning surface through the moving mechanism The holding part for conveyance is moved in the horizontal direction to carry out the cleaning step of cleaning the cleaning surface; in the cleaning step, when the cleaning tool is brought into contact with the outer peripheral portion of the cleaning surface and the cleaning tool is brought into contact with the cleaning surface When washing the center of the face, change the height position of the washing face. 如申請專利範圍第1項之基板處理系統，更包含：液體供給部，往該加工用固持部的固持面供給液體；該控制部，實行如下步驟： 固持步驟，對於以該加工用固持部固持著非加工面之該基板，以該搬運用固持部固持其加工面；液體供給步驟，於該固持步驟之後，從該液體供給部，往該加工用固持部的固持面與該基板的非加工面之間供給液體；上升步驟，於該液體供給步驟之後，藉由該移動機構，使固持於該搬運用固持部之該基板上升；以及移動步驟，於該上升步驟之後，藉由該移動機構，使固持於該搬運用固持部之該基板往水平方向移動；於該移動步驟中，在俯視時該基板整體位於該加工用固持部之外側時，藉由該移動機構，使固持於該搬運用固持部之該基板上升，將該基板與該液體分離。 The substrate processing system of claim 1 further comprises: a liquid supply unit for supplying liquid to the holding surface of the processing holding unit; the control unit for performing the following steps: In a holding step, for the substrate holding the non-processed surface by the processing holding portion, the processing surface is held by the conveying holding portion; in a liquid supplying step, after the holding step, from the liquid supplying portion to the processing surface supplying a liquid between the holding surface of the holding portion and the unprocessed surface of the substrate; an ascending step, after the liquid supplying step, the substrate held on the conveying holding portion is ascended by the moving mechanism; and a moving step, After the ascending step, the moving mechanism is used to move the substrate held on the conveying holding portion in a horizontal direction; in the moving step, when the substrate as a whole is located outside the processing holding portion in a plan view, The substrate held by the conveyance holding portion is lifted by the moving mechanism, and the substrate is separated from the liquid. 如申請專利範圍第2項之基板處理系統，其中，該控制部，於該移動步驟中，在俯視時該基板的外周部位於該加工用固持部之外側時，從該加工用固持部之外側排出該液體。 The substrate processing system according to claim 2, wherein, in the moving step, when the outer peripheral portion of the substrate is located outside the processing holding portion in a plan view, the controller moves from the outside of the processing holding portion from the outer side of the processing holding portion. Drain the liquid. 如申請專利範圍第2項之基板處理系統，其中，更包含氣體供給部，用以對該加工用固持部的固持面供給氣體；該控制部，於該液體供給步驟中，從該氣體供給部，往該加工用固持部的固持面與該基板的非加工面之間供給氣體。 The substrate processing system according to claim 2, further comprising a gas supply part for supplying gas to the holding surface of the processing holding part; the control part, in the liquid supply step, from the gas supply part , and supply gas between the holding surface of the processing holding portion and the non-processing surface of the substrate. 如申請專利範圍第2項之基板處理系統，其中，更包含旋轉機構，使該加工用固持部與該搬運用固持部相對旋轉； 該控制部，於該移動步驟中，一面藉由該旋轉機構使該加工用固持部與該搬運用固持部相對旋轉，一面藉由該移動機構使固持於該搬運用固持部之該基板往水平方向移動。 The substrate processing system according to item 2 of the scope of the application, further comprising a rotation mechanism to relatively rotate the holding portion for processing and the holding portion for conveying; The control unit, in the moving step, relatively rotates the processing holding portion and the conveying holding portion by the rotating mechanism, and horizontally moves the substrate held by the conveying holding portion by the moving mechanism. direction move. 如申請專利範圍第1項之基板處理系統，其中，該彈性構件，設置於該搬運用固持部的外周部；該控制部，於該清洗步驟中，使該清洗具抵接於該清洗面的外周部時之該清洗面的高度位置，較該清洗具抵接於該清洗面的中心部時之該清洗面的高度位置更高。 The substrate processing system according to claim 1, wherein the elastic member is disposed on the outer peripheral portion of the holding portion for conveyance; and the control portion causes the cleaning tool to abut against the surface of the cleaning surface during the cleaning step. The height position of the cleaning surface when the outer peripheral portion is higher than the height position of the cleaning surface when the cleaning tool is in contact with the center portion of the cleaning surface. 如申請專利範圍第1項之基板處理系統，其中，該彈性構件，設置於該搬運用固持部的中央部；該控制部，於該清洗步驟中，使該清洗具抵接於該清洗面的中心部時之該清洗面的高度位置，較該清洗具抵接於該清洗面的外周部時之該清洗面的高度位置更高。 The substrate processing system of claim 1, wherein the elastic member is disposed at the center portion of the holding portion for conveyance; and the control portion makes the cleaning tool abut against the cleaning surface during the cleaning step. The height position of the cleaning surface when the center portion is higher than the height position of the cleaning surface when the cleaning tool is in contact with the outer peripheral portion of the cleaning surface. 一種基板處理方法，利用基板處理系統將基板的加工面加工；該基板處理系統，包含：加工用固持部，於對該基板的加工面進行加工時，將與該基板的加工面為相反側之非加工面予以固持；搬運用固持部，在搬運該基板時，固持該基板的加工面；以及移動機構，使該搬運用固持部往水平方向及鉛直方向移動；該搬運用固持部，包含：傾動機構，使該搬運用固持部在側視時可任意傾動； 彈性構件，設置於該搬運用固持部；以及清洗具，用來清洗清洗面，該清洗面係該基板的非加工面或該搬運用固持部的固持面；該基板處理方法，包含：清洗步驟，在使該清洗具抵接於該清洗面的狀態下，藉由該移動機構使該搬運用固持部往水平方向移動，以清洗該清洗面；於該清洗步驟中，在使該清洗具抵接於該清洗面的外周部時和使該清洗具抵接於該清洗面的中心部時，改變該清洗面的高度位置。 A substrate processing method, using a substrate processing system to process a processing surface of a substrate; the substrate processing system comprising: a processing holding part, when processing the processing surface of the substrate, the processing surface of the substrate is on the opposite side. The non-processed surface is held; the holding part for conveying is used to hold the processed surface of the substrate when the substrate is conveyed; and the moving mechanism makes the holding part for conveying move in the horizontal direction and the vertical direction; the holding part for conveying includes: Tilting mechanism, so that the holding part for transportation can be tilted arbitrarily when viewed from the side; an elastic member arranged on the holding portion for conveyance; and a cleaning tool for cleaning a cleaning surface, the cleaning surface being the unprocessed surface of the substrate or the holding surface of the holding portion for conveying; the substrate processing method, comprising: a cleaning step , in the state that the cleaning tool is in contact with the cleaning surface, the holding portion for conveying is moved horizontally by the moving mechanism to clean the cleaning surface; in the cleaning step, the cleaning tool is pressed against the cleaning surface. The height position of the cleaning surface is changed when the cleaning tool is brought into contact with the outer peripheral portion of the cleaning surface and when the cleaning tool is brought into contact with the center portion of the cleaning surface. 如申請專利範圍第8項之基板處理方法，其中，該基板處理系統，更包含：液體供給部，往該加工用固持部的固持面供給液體；該基板處理方法，包含如下步驟：固持步驟，對於以該加工用固持部固持著其非加工面之該基板，以該搬運用固持部固持其加工面；液體供給步驟，於該固持步驟之後，從該液體供給部，往該加工用固持部的固持面與該基板的非加工面之間供給液體；上升步驟，於該液體供給步驟之後，藉由該移動機構，使固持於該搬運用固持部之該基板上升；以及移動步驟，於該上升步驟之後，藉由該移動機構，使固持於該搬運用固持部之該基板往水平方向移動；於該移動步驟中，在俯視時該基板整體位於該加工用固持部之外側時，藉由該移動機構使固持於該搬運用固持部之該基板上升，將該基板與該液體分離。 According to the substrate processing method of claim 8, the substrate processing system further comprises: a liquid supply part for supplying liquid to the holding surface of the processing holding part; the substrate processing method comprises the following steps: a holding step, For the substrate whose unprocessed surface is held by the processing holding portion, the processing surface is held by the conveying holding portion; in the liquid supply step, after the holding step, from the liquid supply portion to the processing holding portion liquid is supplied between the holding surface of the substrate and the non-processed surface of the substrate; an ascending step, after the liquid supplying step, by the moving mechanism, the substrate held on the conveying holding portion is lifted; and a moving step is performed in the After the ascending step, the moving mechanism is used to move the substrate held on the conveying holding portion in a horizontal direction; in the moving step, when the entire substrate is located outside the processing holding portion in a plan view, the The moving mechanism lifts the substrate held by the conveyance holding portion to separate the substrate from the liquid. 如申請專利範圍第9項之基板處理方法，其中，於該移動步驟中，在俯視時該基板的外周部位於該加工用固持部之外側時，從該加工用固持部之外側排出該液體。 The substrate processing method of claim 9, wherein, in the moving step, when the outer peripheral portion of the substrate is positioned outside the processing holding portion in plan view, the liquid is discharged from the outside of the processing holding portion. 如申請專利範圍第9項之基板處理方法，其中，於該液體供給步驟中，從氣體供給部，往該加工用固持部的固持面與該基板的非加工面之間供給氣體。 The substrate processing method of claim 9, wherein, in the liquid supply step, a gas is supplied from a gas supply portion between the holding surface of the processing holding portion and the non-processing surface of the substrate. 如申請專利範圍第9項之基板處理方法，其中，於該移動步驟中，藉由旋轉機構使該加工用固持部與該搬運用固持部相對旋轉，並藉由該移動機構使固持於該搬運用固持部之該基板往水平方向移動。 The substrate processing method of claim 9, wherein, in the moving step, the processing holding portion and the conveying holding portion are relatively rotated by a rotating mechanism, and the moving mechanism is used to hold the holding portion on the conveying The substrate using the holding portion is moved horizontally. 如申請專利範圍第9項之基板處理方法，其中，於該固持步驟中，在以該搬運用固持部固持加工面時，藉由該傾動機構使該搬運用固持部在側視時可任意傾動，並藉由該彈性構件吸收衝撃。 The substrate processing method of claim 9, wherein, in the holding step, when holding the processing surface by the holding portion for conveying, the holding portion for conveying can be tilted arbitrarily when viewed from the side by the tilting mechanism , and the shock is absorbed by the elastic member. 如申請專利範圍第8項之基板處理方法，其中，於該基板處理系統中，該彈性構件，設置於該搬運用固持部的外周部；於該清洗步驟中，使該清洗具抵接於該清洗面的外周部時之該清洗面的高度位置，較該清洗具抵接於該清洗面的中心部時之該清洗面的高度位置更高。 The substrate processing method of claim 8, wherein, in the substrate processing system, the elastic member is disposed on the outer peripheral portion of the holding portion for conveyance; in the cleaning step, the cleaning tool is abutted against the The height position of the cleaning surface when the outer peripheral portion of the cleaning surface is cleaned is higher than the height position of the cleaning surface when the cleaning tool is in contact with the central portion of the cleaning surface. 如申請專利範圍第8項之基板處理方法，其中，於該基板處理系統中， 該彈性構件，設置於該搬運用固持部的中央部；於該清洗步驟中，使該清洗具抵接於該清洗面的中心部時之該清洗面的高度位置，較該清洗具抵接於該清洗面的外周部時之該清洗面的高度位置更高。 The substrate processing method of claim 8 of the scope of the application, wherein, in the substrate processing system, The elastic member is arranged at the central portion of the holding portion for conveyance; in the cleaning step, the height position of the cleaning surface when the cleaning tool is brought into contact with the central portion of the cleaning surface is higher than the cleaning tool abutting on the central portion of the cleaning surface. The height position of the cleaning surface is higher when the outer peripheral portion of the cleaning surface is located.
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