TWI744241B - Laminated film, method of manufacturing laminated film, optical member, image display device, method of manufacturing optical member, and method of manufacturing image display device - Google Patents
Laminated film, method of manufacturing laminated film, optical member, image display device, method of manufacturing optical member, and method of manufacturing image display device Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
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- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
- C08J3/243—Two or more independent types of crosslinking for one or more polymers
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- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
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- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
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- C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
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- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
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- C08J7/0427—Coating with only one layer of a composition containing a polymer binder
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- C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
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- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/046—Forming abrasion-resistant coatings; Forming surface-hardening coatings
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
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- B32B38/00—Ancillary operations in connection with laminating processes
- B32B2038/0052—Other operations not otherwise provided for
- B32B2038/0076—Curing, vulcanising, cross-linking
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- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/02—Cellular or porous
- B32B2305/026—Porous
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- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/72—Cured, e.g. vulcanised, cross-linked
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- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
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- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
- C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08J2483/04—Polysiloxanes
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Abstract
本發明課題之目的在於提供一種具有可兼具高空隙率及膜強度之空隙層的積層薄膜。 The object of the subject of the present invention is to provide a laminated film having a void layer that can have both high void ratio and film strength.
本發明之之解決手段為一積層薄膜,其在樹脂薄膜上積層有空隙層,且其特徵在於其係藉由包含以下步驟之製造方法而製造:前驅物形成步驟,係在前述樹脂薄膜上形成空隙層之前驅物亦即空隙結構;及交聯反應步驟,係在前述前驅物形成步驟後,在前驅物內部產生交聯反應;前驅物包含藉由光或熱產生鹼性物質之物質;前述前驅物形成步驟中未產生前述鹼性物質;前述交聯反應步驟中,係藉由光照射或加熱產生前述鹼性物質,且,前述交聯反應步驟具有多數階段。 The solution of the present invention is a laminated film in which a void layer is laminated on a resin film, and is characterized in that it is manufactured by a manufacturing method including the following steps: a precursor formation step, which is formed on the aforementioned resin film The precursor of the void layer, that is, the void structure; and the cross-linking reaction step, after the precursor forming step, a cross-linking reaction is generated inside the precursor; the precursor includes a substance that generates an alkaline substance by light or heat; The basic substance is not generated in the precursor forming step; in the cross-linking reaction step, the basic substance is generated by light irradiation or heating, and the cross-linking reaction step has many stages.
Description
本發明係有關於一種積層薄膜、積層薄膜之製造方法、光學構件、影像顯示裝置、光學構件之製造方法及影像顯示裝置之製造方法。 The present invention relates to a laminated film, a method of manufacturing a laminated film, an optical member, an image display device, a method of manufacturing an optical member, and a method of manufacturing an image display device.
若分開一定間隔地配置2基板,則兩基板間之空隙成為空氣層。如此在前述基板間形成之空氣層,例如具有作為全反射光之低折射層的機能。因此,例如若為光學薄膜,藉由保持一定距離地配置稜鏡、偏光薄膜及偏光板等之構件,可在前述構件間設置成為低折射率層之空氣層。然而,為如此形成空氣層,必須具有一定距離地配置各構件,因此無法依序積層構件,使製造很費工。此外,若為維持空氣層而透過分隔物(框架)等組合光學構件,整體之厚度變大,亦與薄型輕量化之要求背道而馳。 If two substrates are arranged at a certain interval, the gap between the two substrates becomes an air layer. The air layer formed between the aforementioned substrates has a function of, for example, a low-refractive layer that totally reflects light. Therefore, for example, in the case of an optical film, by arranging members such as scallops, polarizing films, and polarizing plates at a certain distance, an air layer that becomes a low refractive index layer can be provided between the aforementioned members. However, in order to form the air layer in this way, each member must be arranged at a certain distance. Therefore, the members cannot be layered in sequence, which makes the manufacturing very labor-intensive. In addition, if combined optical members such as partitions (frames) are penetrated in order to maintain the air layer, the overall thickness becomes larger, which also runs counter to the requirements for thinness and weight reduction.
為解決如此之問題,有人嘗試開發顯示低折射性之薄膜等的構件來取代由構件間之空隙形成的空氣層。例如,有人提出在表面改質無機化合物粒子之分散液 中添加自由基聚合性單體及觸媒,並藉由光照射使其硬化而得之有機無機複合膜(專利文獻1)。此外,例如,有人提出藉由在二氧化矽氣凝膠膜(空隙層)形成後進行鹼處理,提高耐擦傷性之方法(專利文獻2)。 In order to solve this problem, some people try to develop members such as films showing low refraction to replace the air layer formed by the gaps between the members. For example, it has been proposed to modify the dispersion of inorganic compound particles on the surface An organic-inorganic composite film obtained by adding a radically polymerizable monomer and a catalyst and curing by light irradiation (Patent Document 1). In addition, for example, a method of improving scratch resistance by performing an alkali treatment after the formation of a silica aerogel film (void layer) has been proposed (Patent Document 2).
專利文獻1:日本特開2014-046518號公報 Patent Document 1: Japanese Patent Application Laid-Open No. 2014-046518
專利文獻2:日本特開2009-258711號公報 Patent Document 2: Japanese Patent Application Publication No. 2009-258711
然而,若與形成空隙層同時地藉由觸媒等提高膜強度,有因進行觸媒反應提高膜強度但空隙率降低之問題。此外,在專利文獻2中如前所述,揭示在空隙層形成後進行鹼處理,使膜強度提高。前述鹼處理包括,例如塗布鹼溶液之方法或接觸氨氣之方法。但是,在塗布鹼溶液之方法中,由於空隙層之耐溶劑性低或由於因空隙存在而有高撥水性,有容易影響鹼溶液到達空隙層內部之效果的問題。另一方面,在接觸氨氣之方法中,有膜強度提高處理花費太長時間,因此製造效率低的問題。 However, if the film strength is increased by a catalyst or the like at the same time as the formation of the void layer, there is a problem that the film strength is increased due to the progress of the catalyst reaction, but the porosity decreases. In addition, as described above, Patent Document 2 discloses that alkali treatment is performed after the formation of the void layer to improve the film strength. The aforementioned alkali treatment includes, for example, a method of applying an alkali solution or a method of contacting ammonia gas. However, in the method of coating the alkali solution, the void layer has low solvent resistance or due to the existence of voids and high water repellency, which easily affects the effect of the alkali solution reaching the interior of the void layer. On the other hand, in the method of contacting ammonia gas, there is a problem that the film strength enhancement treatment takes too long, and therefore the production efficiency is low.
因此,本發明之目的在於提供具有可兼具高空隙率及膜強度之空隙層的積層薄膜、積層薄膜之製造方法、光學構件、影像顯示裝置、光學構件之製造方法及影像顯示裝置之製造方法。 Therefore, the object of the present invention is to provide a laminated film having a void layer with both high porosity and film strength, a method of manufacturing a laminated film, an optical member, an image display device, a method of manufacturing an optical member, and a method of manufacturing an image display device .
為達成前述目的,本發明之積層薄膜在樹脂薄膜上積層有空隙層,且其特徵在於其係藉由包含以下步驟之製造方法而製造:前驅物形成步驟,係在前述樹脂薄膜上形成前述空隙層之前驅物亦即空隙結構;及交聯反應步驟,係在前述前驅物形成步驟後,在前述前驅物內部產生交聯反應;前述前驅物包含可產生用以促進前述交聯反應之交聯反應促進劑的物質;前述物質藉由光或熱產生前述交聯反應促進劑;前述前驅物形成步驟中未產生前述交聯反應促進劑,前述交聯反應步驟中,係藉由光照射或加熱產生前述交聯反應促進劑,且,前述交聯反應步驟具有多數階段。 In order to achieve the foregoing object, the laminated film of the present invention has a void layer laminated on a resin film, and is characterized in that it is manufactured by a manufacturing method including the following steps: a precursor forming step is to form the voids on the resin film The layer precursor, that is, the void structure; and the cross-linking reaction step, after the precursor forming step, a cross-linking reaction is generated inside the precursor; the precursor includes cross-linking that can be generated to promote the cross-linking reaction The substance of the reaction promoter; the aforementioned substance generates the aforementioned cross-linking reaction promoter by light or heat; the aforementioned cross-linking reaction promoter is not produced in the aforementioned precursor forming step, and the aforementioned cross-linking reaction step is performed by light irradiation or heating The aforementioned cross-linking reaction accelerator is produced, and the aforementioned cross-linking reaction step has many stages.
本發明積層薄膜之製造方法,該積層薄膜在樹脂薄膜上積層有空隙層,該製造方法之特徵在於包含以下步驟:前驅物形成步驟,係在前述樹脂薄膜上形成前述空隙層之前驅物亦即空隙結構;及交聯反應步驟,係在前述前驅物形成步驟後,在前述前驅物內部產生交聯反應;前述前驅物包含可產生用以促進前述交聯反應之交聯反應促進劑的物質:前述物質藉由光或熱產生前述交聯反應促進劑; 前述前驅物形成步驟中未產生前述交聯反應促進劑;前述交聯反應步驟中,係藉由光照射或加熱產生前述交聯反應促進劑,且,前述交聯反應步驟具有多數階段。 The manufacturing method of the laminated film of the present invention, the laminated film is laminated with a void layer on the resin film, and the manufacturing method is characterized by comprising the following steps: a precursor forming step, which is to form the precursor of the void layer on the resin film The void structure; and the cross-linking reaction step, after the precursor forming step, a cross-linking reaction is generated inside the precursor; the precursor includes a substance that can generate a cross-linking reaction accelerator for promoting the cross-linking reaction: The aforementioned substance generates the aforementioned crosslinking reaction accelerator by light or heat; The aforementioned cross-linking reaction accelerator is not generated in the aforementioned precursor forming step; in the aforementioned cross-linking reaction step, the aforementioned cross-linking reaction accelerator is generated by light irradiation or heating, and the aforementioned cross-linking reaction step has many stages.
本發明之光學構件包含前述本發明之積層薄膜。 The optical member of the present invention includes the aforementioned laminated film of the present invention.
本發明之影像顯示裝置包含前述本發明之光學構件。 The image display device of the present invention includes the aforementioned optical member of the present invention.
本發明之光學構件之製造方法,該光學構件包含積層薄膜,該製造方法之特徵在於包含利用前述本發明之積層薄膜之製造方法來製造前述積層薄膜的步驟。 The method of manufacturing an optical member of the present invention, the optical member including a laminate film, is characterized by including the step of manufacturing the foregoing laminate film by using the foregoing method of manufacturing the laminate film of the present invention.
本發明之影像顯示裝置之製造方法,該影像顯示裝置包含光學構件,該製造方法之特徵在於包含利用前述本發明之光學構件之製造方法來製造前述光學構件的步驟。 The manufacturing method of the image display device of the present invention includes an optical member, and the manufacturing method is characterized by including the step of manufacturing the optical member using the manufacturing method of the optical member of the present invention.
依據本發明,可提供可兼具高空隙率及膜強度之空隙層的積層薄膜、積層薄膜之製造方法、光學構件、影像顯示裝置、光學構件之製造方法及影像顯示裝置之製造方法。本發明之積層薄膜,例如可用於本發明之光學構件及影像顯示裝置,但不限於此,亦可用於任何用途。 According to the present invention, it is possible to provide a laminated film having a void layer with high porosity and film strength, a method of manufacturing a laminated film, an optical member, an image display device, a method of manufacturing an optical member, and a method of manufacturing an image display device. The laminated film of the present invention can be used for, for example, the optical member and image display device of the present invention, but it is not limited to this, and can also be used for any purpose.
10‧‧‧基材 10‧‧‧Substrate
20‧‧‧前驅物(經交聯處理過之前驅物) 20‧‧‧Precursor (precursor after cross-linking treatment)
20’‧‧‧塗布膜(乾燥後之塗布膜) 20’‧‧‧Coating film (coating film after drying)
20”‧‧‧溶膠粒子液 20"‧‧‧Sol particle liquid
21‧‧‧空隙層 21‧‧‧Void layer
101,201‧‧‧送出輥 101,201‧‧‧Send out roller
102‧‧‧塗布輥 102‧‧‧Coating roller
105,241‧‧‧捲取輥 105,241‧‧‧Reel roll
106‧‧‧輥 106‧‧‧roller
110,210‧‧‧烘箱區域 110,210‧‧‧Oven area
111,211‧‧‧熱風器(加熱裝置) 111,211‧‧‧Air heater (heating device)
120,220‧‧‧化學處理區域 120,220‧‧‧Chemical treatment area
121,221‧‧‧燈(光照射裝置)或熱風器(加熱裝置) 121,221‧‧‧lamp (light irradiation device) or hot air device (heating device)
130,230‧‧‧交聯反應區域(老化區域) 130,230‧‧‧Crosslinking reaction area (aging area)
131,231‧‧‧熱風器(加熱裝置) 131,231‧‧‧Air heater (heating device)
202‧‧‧貯液部 202‧‧‧Liquid Storage
203‧‧‧刮刀(刮刀片) 203‧‧‧Scraper (scraper blade)
204‧‧‧微凹版 204‧‧‧Microgravure
圖1係示意顯示本發明中,在樹脂薄膜10上形成空隙層21之方法之一例的步驟截面圖。
1 is a cross-sectional view schematically showing an example of a method of forming a
圖2係示意顯示卷狀之本發明積層薄膜(以下有時稱為「本發明之積層薄膜卷」)之製造方法的步驟之一部分、及 其中使用之裝置之一例的圖。 2 is a schematic diagram showing a part of the manufacturing method of the laminated film of the present invention (hereinafter sometimes referred to as "the laminated film roll of the present invention") in the form of a roll, and A diagram of an example of the device used.
圖3係示意顯示本發明之積層薄膜卷之製造方法中的步驟之一部分、及其中使用之裝置之另一例的圖。 Fig. 3 is a diagram schematically showing a part of the steps in the method of manufacturing the laminated film roll of the present invention and another example of the device used therein.
以下,舉例進一步具體地說明本發明。但是,本發明不受以下說明限定或限制。本發明之積層薄膜如前所述,可為卷狀之本發明之積層薄膜(本發明之積層薄膜卷)。本發明之積層薄膜卷,例如亦可切出其一部分作為本發明之積層薄膜使用。以下稱「本發明之積層薄膜」時,除非特別預先聲明,亦包含本發明之積層薄膜卷。同樣地,以下稱「本發明之積層薄膜之製造方法」時,除非特別預先聲明,亦包含本發明之積層薄膜卷之製造方法。 Hereinafter, the present invention will be explained in more detail with examples. However, the present invention is not limited or restricted by the following description. As described above, the laminated film of the present invention may be the laminated film of the present invention in a roll (the laminated film roll of the present invention). The laminated film roll of the present invention can also be used as the laminated film of the present invention by cutting a part of it, for example. Hereinafter, when referred to as "the laminated film of the present invention", unless otherwise stated in advance, it also includes the laminated film roll of the present invention. Similarly, when referred to below as "the manufacturing method of the laminated film of the present invention", unless otherwise stated in advance, it also includes the manufacturing method of the laminated film roll of the present invention.
本發明之積層薄膜之製造方法中,前述交聯促進劑,例如可含有酸性物質或鹼性物質。在此情形中,例如在前述前驅物形成步驟中未產生前述酸性物質或鹼性物質,且在前述交聯反應步驟中,藉由光照射或加熱產生前述酸性物質或鹼性物質。 In the manufacturing method of the laminated film of the present invention, the crosslinking accelerator may contain, for example, an acidic substance or a basic substance. In this case, for example, the aforementioned acidic substance or basic substance is not generated in the aforementioned precursor forming step, and the aforementioned acidic substance or basic substance is generated by light irradiation or heating in the aforementioned crosslinking reaction step.
在本發明之積層薄膜之製造方法中,例如在前述交聯反應步驟中之第2階段以後的至少一階段中,係藉由加熱前述前驅物,在前述前驅物內部產生交聯反應。此外,在本發明中,前述交聯反應步驟如前述地具有多數階段,具體而言,可為2階段,亦可為3階段以上。 In the manufacturing method of the laminated film of the present invention, for example, in at least one stage after the second stage in the crosslinking reaction step, the precursor is heated to generate a crosslinking reaction in the precursor. In addition, in the present invention, the crosslinking reaction step has many stages as described above, and specifically, it may be two stages or three or more stages.
在前述交聯反應步驟中之第2階段以後的至少一 階段中,例如可進一步提高前述前驅物之強度。此外,在前述交聯反應步驟中之第2階段以後的至少一階段中,例如亦可進一步提高前述前驅物對前述樹脂薄膜的黏著剝離強度。 At least one after the second stage in the aforementioned cross-linking reaction step In the stage, for example, the strength of the aforementioned precursor can be further improved. In addition, in at least one stage after the second stage in the crosslinking reaction step, for example, the adhesion peel strength of the precursor to the resin film can be further improved.
本發明之積層薄膜之製造方法,如前所述,前述前驅物包含藉由光或熱產生鹼性物質之物質,且在前述前驅物形成步驟中,係藉由光照射或加熱產生前述鹼性物質。 In the manufacturing method of the laminated film of the present invention, as described above, the precursor includes a substance that generates an alkaline substance by light or heat, and in the precursor forming step, the alkaline substance is generated by light irradiation or heating. substance.
在本發明之積層薄膜之製造方法中,前述空隙層,例如可包含由一種或多種形成微細空隙結構之構成單元直接或間接化學結合的部分。此外,例如在前述空隙層中,即使構成單元接觸,亦可存在未化學結合之部分。另外,在本發明中,構成單元「間接結合」係指構成單元透過構成單元量以下之少量黏結劑成分結合。構成單元「直接結合」係指構成單元不透過黏結劑成分等直接結合。前述構成單元之結合,例如可為透過觸媒作用之結合。前述構成單元之結合,例如可包含氫鍵結或共價鍵。在本發明中,形成前述空隙層之前述構成單元,例如可由具有粒子狀、纖維狀、平板狀中之至少一形狀的結構形成。前述粒子狀及平板狀之構成單元,例如可由無機物形成。此外,前述粒子狀構成單元之構成元素,例如可包含選自於由Si、Mg、Al、Ti、Zn及Zr所構成之群組的至少一元素。形成粒子狀之結構體(構成單元)可為實心粒子或中空粒子,具體而言,可舉聚矽氧粒子或具有微細孔之聚矽氧粒子、 二氧化矽中空奈米粒子或二氧化矽中空奈米球等為例。纖維狀之構成單元係例如直徑為奈米尺寸之奈米纖維,具體而言,可舉纖維素奈米纖維或氧化鋁奈米纖維等為例。平板狀之構成單元,可舉奈米黏土為例,具體而言,可舉奈米尺寸之膨土(例如Kunipia F「商品名」)等為例。前述纖維狀之構成單元沒有特別限制,但例如可為選自於由碳奈米纖維、纖維素奈米纖維、氧化鋁奈米纖維、幾丁奈米纖維、甲殼素奈米纖維、聚合物奈米纖維、玻璃奈米纖維及二氧化矽奈米纖維所構成之群組的至少一纖維狀物質。此外,前述構成單元,例如可為微細孔粒子。例如,前述空隙層係微細孔粒子化學結合之多孔體,且在前述空隙層形成步驟中,例如可使前述微細孔粒子化學結合。此外,在本發明中,「粒子」(例如前述微細孔粒子等)之形狀沒有特別限制,例如可為球狀,亦可為其他形狀。另外,在本發明中,前述微細孔粒子例如如前所述,可為溶膠凝膠念珠狀粒子、奈米粒子(中空奈米二氧化矽、奈米球粒子)、奈米纖維等。本發明之積層薄膜之製造方法中,前述微細孔粒子係例如矽化合物之微細孔粒子,且前述多孔體係聚矽氧多孔體。前述矽化合物之微細孔粒子,例如包含凝膠狀二氧化矽化合物之粉碎體。此外,前述空隙層之另一形態包括由奈米纖維等之纖維狀物質形成,且前述纖維狀物質纏結並以包含空隙之形態形成層的空隙層。如此之空隙層之製造方法沒有特別限制,但例如可與前述微細孔粒子化學結合之多孔體的空隙層相同。再者,如前所述,亦包 含使用中空奈米粒子或奈米黏土之空隙層、使用中空奈米球或氟化鎂形成之空隙層。此外,該等空隙層可為由單一構成物質形成之空隙層,亦可為由多數構成物質形成之空隙層。另外,空隙層之形態可為單一之前述形態,亦可為由多數前述形態形成的空隙層。以下,主要說明前述微細孔粒子化學結合之多孔體的空隙層。 In the manufacturing method of the laminated film of the present invention, the aforementioned void layer may include, for example, a part chemically bonded directly or indirectly by one or more constituent units forming a fine void structure. In addition, for example, in the aforementioned void layer, even if the constituent units are in contact, there may be portions that are not chemically bonded. In addition, in the present invention, the "indirect bonding" of the structural unit means that the structural unit is bonded through a small amount of binder component less than the amount of the structural unit. The "direct bonding" of the building blocks refers to the direct bonding of the building blocks without the use of adhesive ingredients. The combination of the aforementioned structural units may be, for example, a combination through the action of a catalyst. The combination of the aforementioned structural units may include, for example, hydrogen bonding or covalent bonding. In the present invention, the structural unit forming the void layer may be formed of a structure having at least one of a particle shape, a fiber shape, and a plate shape, for example. The aforementioned particle-like and flat-plate-like constituent units can be formed of, for example, inorganic substances. In addition, the constituent element of the aforementioned particulate structural unit may include, for example, at least one element selected from the group consisting of Si, Mg, Al, Ti, Zn, and Zr. The particle-like structure (constituent unit) can be solid particles or hollow particles, specifically, polysiloxane particles or polysiloxane particles with micropores, Take hollow silicon dioxide nanoparticles or hollow silicon dioxide nanospheres as examples. The fibrous constituent unit is, for example, nanofibers with a diameter of nanometers. Specifically, cellulose nanofibers or alumina nanofibers can be cited as examples. For the flat-shaped structural unit, nano-clay can be cited as an example. Specifically, nano-size bentonite (for example, Kunipia F "trade name"), etc. can be cited as an example. The aforementioned fibrous constituent unit is not particularly limited, but for example, it may be selected from carbon nanofibers, cellulose nanofibers, alumina nanofibers, chitin nanofibers, chitin nanofibers, and polymer nanofibers. At least one fibrous substance in the group consisting of rice fiber, glass nanofiber and silica nanofiber. In addition, the aforementioned structural unit may be, for example, microporous particles. For example, the void layer is a porous body in which microporous particles are chemically bonded, and in the step of forming the void layer, for example, the microporous particles may be chemically bonded. In addition, in the present invention, the shape of the "particles" (for example, the aforementioned microporous particles, etc.) is not particularly limited. For example, it may be spherical or other shapes. In addition, in the present invention, the aforementioned microporous particles may be sol-gel beads, nanoparticles (hollow nanosilica, nanosphere particles), nanofibers, etc., as described above, for example. In the manufacturing method of the laminated film of the present invention, the aforementioned microporous particles are, for example, microporous particles of a silicon compound, and the aforementioned porous system polysiloxy porous body. The aforementioned microporous particles of the silicon compound include, for example, a crushed body of a gel-like silicon dioxide compound. In addition, another form of the aforementioned void layer includes a void layer formed of a fibrous substance such as nanofibers, and the aforementioned fibrous substance is entangled to form a layer in a form containing voids. The manufacturing method of such a void layer is not particularly limited, but for example, it may be the same as the void layer of the porous body in which the microporous particles are chemically bonded. Furthermore, as mentioned earlier, it also includes Contains a void layer using hollow nanoparticle or nano clay, and a void layer formed using hollow nanospheres or magnesium fluoride. In addition, the void layers may be void layers formed of a single constituent material, or void layers formed of a plurality of constituent materials. In addition, the shape of the void layer may be a single above-mentioned shape, or may be a void layer formed of a plurality of the above-mentioned shapes. Hereinafter, the void layer of the porous body in which the aforementioned microporous particles are chemically bonded is mainly explained.
本發明之積層薄膜之製造方法中,例如前述微細孔粒子係矽化合物之微細孔粒子,且前述多孔體係聚矽氧多孔體。 In the manufacturing method of the laminated film of the present invention, for example, the aforementioned microporous particles are microporous particles of a silicon compound, and the aforementioned porous system polysiloxy porous body.
本發明之積層薄膜之製造方法中,例如前述矽化合物之微細孔粒子包含凝膠狀二氧化矽化合物之粉碎體。 In the manufacturing method of the laminated film of the present invention, for example, the microporous particles of the aforementioned silicon compound include a crushed body of a gel-like silicon dioxide compound.
本發明之積層薄膜之製造方法中,例如前述多孔體之多孔質結構係孔結構連續之連泡結構體。 In the manufacturing method of the laminated film of the present invention, for example, the porous structure of the aforementioned porous body is a continuous cell structure with continuous pore structure.
本發明之積層薄膜之製造方法,例如更包含:製作包含前述微細孔粒子之含有液的含有液製作步驟;在前述樹脂薄膜上塗布前述含有液之塗布步驟;及使塗布之前述塗布液乾燥之乾燥步驟,且前述交聯反應步驟中,使前述微細孔粒子化學結合。 The manufacturing method of the laminated film of the present invention further includes, for example, a step of preparing a liquid containing liquid containing the microporous particles; a step of applying the liquid containing liquid on the resin film; and drying the coated liquid In the drying step, and in the aforementioned crosslinking reaction step, the aforementioned microporous particles are chemically combined.
本發明之積層薄膜之製造方法,例如在前述交聯反應步驟中,藉由觸媒之作用使前述微細孔粒子化學結合。例如,在前述交聯反應步驟中,藉由光照射或加熱產生之前述交聯反應促進劑乃為前述觸媒,且可藉由前述交聯反應促進劑之作用使前述微細孔粒子化學結合。 In the manufacturing method of the laminated film of the present invention, for example, in the aforementioned crosslinking reaction step, the aforementioned microporous particles are chemically combined by the action of a catalyst. For example, in the crosslinking reaction step, the crosslinking reaction accelerator generated by light irradiation or heating is the catalyst, and the microporous particles can be chemically combined by the action of the crosslinking reaction accelerator.
本發明之積層薄膜之製造方法,例如在前述交聯反應步驟中,藉由光照射使前述微細孔粒子化學結合。 In the manufacturing method of the laminated film of the present invention, for example, in the crosslinking reaction step, the microporous particles are chemically combined by light irradiation.
本發明之積層薄膜之製造方法,例如在前述交聯反應步驟中,藉由加熱,使前述微細孔粒子化學結合。 In the manufacturing method of the laminated film of the present invention, for example, in the aforementioned crosslinking reaction step, the aforementioned microporous particles are chemically bonded by heating.
本發明之積層薄膜之製造方法,例如前述空隙層之折射率係前述前驅物之折射率加0.1後之數值以下。 In the method of manufacturing the laminated film of the present invention, for example, the refractive index of the void layer is a value equal to or less than the refractive index of the precursor plus 0.1.
本發明之積層薄膜之製造方法係例如形成前述空隙層並使折射率成為1.25以下。 The manufacturing method of the laminated film of the present invention is, for example, by forming the aforementioned void layer so that the refractive index becomes 1.25 or less.
本發明之積層薄膜之製造方法係例如形成前述空隙層並使空隙率成為40體積%以上。 The manufacturing method of the laminated film of the present invention is, for example, to form the aforementioned void layer so that the void ratio becomes 40% by volume or more.
本發明之積層薄膜之製造方法係例如形成前述空隙層並使厚度成為0.01至100μm。 The manufacturing method of the laminated film of the present invention is, for example, to form the aforementioned void layer so as to have a thickness of 0.01 to 100 μm.
本發明之積層薄膜之製造方法係例如形成前述空隙層並使霧度值小於5%。 The manufacturing method of the laminated film of the present invention is, for example, to form the aforementioned void layer and make the haze value less than 5%.
本發明之積層薄膜之製造方法係例如形成前述空隙層,並使前述空隙層對前述樹脂薄膜之黏著剝離強度成為1N/25mm以上。 The manufacturing method of the laminated film of the present invention is, for example, to form the void layer and make the adhesive peel strength of the void layer to the resin film to be 1N/25mm or more.
本發明之積層薄膜之製造方法係例如前述樹脂薄膜為長條狀樹脂薄膜,且在前述樹脂薄膜上連續形成有前述前驅物及前述空隙層。此外,本發明之積層薄膜之製造方法,例如亦可切出如前述所製成之積層薄膜卷(本發明之積層薄膜卷)之一部分而作成本發明之積層薄膜。 The manufacturing method of the laminated film of the present invention is, for example, that the resin film is a long resin film, and the precursor and the void layer are continuously formed on the resin film. In addition, the manufacturing method of the laminated film of the present invention can also cut out a part of the laminated film roll made as described above (the laminated film roll of the present invention) to form the laminated film of the present invention.
本發明之積層薄膜卷,雖然其製造方法沒有特別限制,但例如可為藉由前述本發明之積層薄膜卷之製造 方法製造的積層薄膜卷。此外,本發明之積層薄膜卷,雖然其製造方法沒有特別限制,但例如可為藉由本發明之積層薄膜之製造方法製造的積層薄膜。 Although the manufacturing method of the laminated film roll of the present invention is not particularly limited, for example, it may be produced by the aforementioned laminated film roll of the present invention Method of manufacturing laminated film rolls. In addition, although the manufacturing method of the laminated film roll of this invention is not specifically limited, it may be a laminated film manufactured by the manufacturing method of the laminated film of this invention, for example.
以下,更具體地說明本發明。 Hereinafter, the present invention will be explained more specifically.
[1.積層薄膜及其製造方法] [1. Laminated film and its manufacturing method]
本發明之積層薄膜之製造方法,如前所述包含:前驅物形成步驟,係在樹脂薄膜上形成空隙層之前驅物亦即空隙結構;及交聯反應步驟,係在前述前驅物形成步驟後,在前述前驅物內部產生交聯反應。此外,本發明之積層薄膜係如前所述,藉由前述本發明之積層薄膜之製造方法所製造的積層薄膜。本發明之積層薄膜,例如亦可為長條狀積層薄膜卷(本發明之積層薄膜卷)。 The manufacturing method of the laminated film of the present invention, as described above, includes: a precursor forming step, forming a void layer precursor, that is, a void structure, on the resin film; and a crosslinking reaction step, after the precursor forming step , A cross-linking reaction occurs inside the aforementioned precursor. In addition, the laminated film of the present invention is a laminated film produced by the aforementioned method of producing the laminated film of the present invention as described above. The laminated film of the present invention may be, for example, an elongated laminated film roll (the laminated film roll of the present invention).
[1-1.積層薄膜] [1-1. Laminated film]
在本發明之積層薄膜中,前述樹脂薄膜沒有特別限制,前述樹脂之種類可舉例如:聚對苯二甲酸乙二酯(PET)、壓克力、乙酸丙酸纖維素(CAP)、環烯烴聚合物(COP)、三乙酸酯(TAC)、聚萘二甲酸乙二酯(PEN)、聚乙烯(PE)、聚丙烯(PP)等之具優異透明性的熱可塑性樹脂等。 In the laminated film of the present invention, the aforementioned resin film is not particularly limited. Examples of the aforementioned resin include: polyethylene terephthalate (PET), acrylic, cellulose acetate propionate (CAP), cycloolefin Thermoplastic resins with excellent transparency such as polymers (COP), triacetate (TAC), polyethylene naphthalate (PEN), polyethylene (PE), polypropylene (PP), etc.
本發明之積層薄膜卷或積層薄膜中的前述空隙層(以下稱為「本發明之空隙層」),例如在前述樹脂薄膜上,可直接積層,亦可透過其他層積層。 The laminated film roll of the present invention or the aforementioned void layer in the laminated film (hereinafter referred to as "the void layer of the present invention"), for example, may be directly laminated on the aforementioned resin film, or through other laminated layers.
本發明之積層薄膜,例如亦可為特徵在於包含前述空隙層及前述樹脂薄膜,且前述空隙層積層在前述樹脂薄膜上,並具有前述特性的低折射材。 The laminated film of the present invention may be, for example, a low-refractive material characterized by including the aforementioned void layer and the aforementioned resin film, the aforementioned void layer being laminated on the aforementioned resin film, and having the aforementioned characteristics.
本發明之空隙層,例如顯示膜強度之BEMCOT(註冊商標)之耐擦傷性測試的殘存率為60至100%。若具有如此之膜強度,例如對製造時之捲取或使用時等之物理衝擊而言亦很堅固。前述耐擦傷性之下限係例如60%以上、80%以上、90%以上,且上限係例如100%以下、99%以下、98%以下,而其範圍係例如60至100%、80至99%、90至98%。 The void layer of the present invention, such as BEMCOT (registered trademark) showing film strength, has a residual rate of 60 to 100% in the scratch resistance test. If it has such a film strength, for example, it is also very strong against physical impacts such as winding during manufacturing or use. The lower limit of the aforementioned scratch resistance is, for example, 60% or more, 80% or more, or 90% or more, and the upper limit is, for example, 100% or less, 99% or less, or 98% or less, and the range is, for example, 60 to 100%, 80 to 99%. , 90 to 98%.
前述耐擦傷性,例如亦可藉由以下之方法測量。 The aforementioned scratch resistance can also be measured by the following method, for example.
(耐擦傷性之評價) (Evaluation of scratch resistance)
(1)將本發明之積層薄膜作成直徑15mm之圓形樣本,並對空隙層進行BEMCOT(註冊商標)之滑動測試(耐擦傷性測試)。滑動條件係負載100g,往復10次。 (1) The laminated film of the present invention is made into a circular sample with a diameter of 15 mm, and the gap layer is subjected to a BEMCOT (registered trademark) sliding test (scratch resistance test). The sliding condition is a load of 100g, reciprocating 10 times.
(2)對結束前述(1)之耐擦傷性測試之前述空隙層,以目視評價耐擦傷性。耐擦傷性測試後之損傷條數若為0至9條則評價為○,若為10條至29條則評價為△,若為30條以上則評價為×。 (2) Visually evaluate the scratch resistance of the aforementioned void layer after the scratch resistance test of (1) above. After the scratch resistance test, if the number of damages after the scratch resistance test is 0 to 9, it is evaluated as ○, if it is from 10 to 29, it is evaluated as △, and if it is 30 or more, it is evaluated as x.
在本發明之空隙層中,膜密度沒有特別限制,其下限係例如1g/cm3以上、10g/cm3以上、15g/cm3以上,且其上限係例如50g/cm3以下、40g/cm3以下、30g/cm3以下、2.1g/cm3以下,而其範圍係例如5至50g/cm3、10至40g/cm3、15至30g/cm3、1至2.1g/cm3。此外,在本發明之空隙層中,依據前述膜密度,空孔率之下限係例如50%以上、70%以上、85%以上,且上限係例如98%以下、95%以下,而其範圍係例如50至98%、70至95%、85至95%。 In the void layer of the present invention, the film density is not particularly limited. The lower limit is, for example, 1 g/cm 3 or more, 10 g/cm 3 or more, 15 g/cm 3 or more, and the upper limit is, for example, 50 g/cm 3 or less, 40 g/cm 3 or less, 30 g/cm 3 or less, 2.1 g/cm 3 or less, and the range is, for example, 5 to 50 g/cm 3 , 10 to 40 g/cm 3 , 15 to 30 g/cm 3 , and 1 to 2.1 g/cm 3 . In addition, in the void layer of the present invention, based on the aforementioned film density, the lower limit of the porosity is, for example, 50% or more, 70% or more, or 85% or more, and the upper limit is, for example, 98% or less, 95% or less, and the range is For example, 50 to 98%, 70 to 95%, 85 to 95%.
前述膜密度,例如可藉由以下之方法測量,且前述空孔率,例如可依據前述膜密度如下地算出。 The film density can be measured by the following method, for example, and the porosity can be calculated as follows based on the film density, for example.
(膜密度、空孔率之評價) (Evaluation of film density and porosity)
在基材(壓克力薄膜)上形成空隙層(本發明之空隙層)後,對該積層體之前述空隙層,使用X光繞射裝置(RIGAKU公司製:RINT-2000)測量全反射區域之X光反射率。接著,進行強度(Intensity)及2θ之擬合後,由前述積層體(空隙層、基材)之全反射臨界角算出膜密度(g/cm3),接著,由以下式算出空孔率(P%)。 After forming the void layer (the void layer of the present invention) on the substrate (acrylic film), the total reflection area of the foregoing void layer of the laminate was measured using an X-ray diffraction device (RINT-2000, manufactured by RIGAKU) The X-ray reflectivity. Next, after fitting intensity (Intensity) and 2θ, the film density (g/cm 3 ) is calculated from the critical angle of total reflection of the aforementioned laminate (void layer, base material), and then the porosity ( P%).
空孔率(P%)=45.48×膜密度(g/cm3)+100(%) Porosity (P%)=45.48×film density (g/cm 3 )+100(%)
本發明之空隙層,例如,具有孔結構。前述孔之空隙尺寸係指空隙(孔)之長軸直徑及短軸直徑中的前述長軸直徑。空孔尺寸沒有特別限制,但為例如2nm至500nm。前述空隙尺寸之下限係例如2nm以上、5nm以上、10nm以上、20nm以上,且上限係例如500nm以下、200nm以下、100nm以下,而其範圍係例如2nm至500nm、5nm至500nm、10nm至200nm、20nm至100nm。空隙尺寸可依使用空隙結構之用途決定理想之空隙尺寸,因此,例如必須依目的調整成所希望之空隙尺寸。空隙尺寸例如可藉由以下之方法評價。 The void layer of the present invention, for example, has a hole structure. The gap size of the aforementioned hole refers to the aforementioned major axis diameter among the major axis diameter and minor axis diameter of the gap (hole). The pore size is not particularly limited, but is, for example, 2 nm to 500 nm. The lower limit of the aforementioned void size is, for example, 2nm or more, 5nm or more, 10nm or more, or 20nm or more, and the upper limit is, for example, 500nm or less, 200nm or less, or 100nm or less, and its range is, for example, 2nm to 500nm, 5nm to 500nm, 10nm to 200nm, 20nm To 100nm. The gap size can be determined according to the purpose of using the gap structure. Therefore, for example, it must be adjusted to the desired gap size according to the purpose. The void size can be evaluated by the following method, for example.
(空隙尺寸之評價) (Evaluation of void size)
在本發明中,前述空隙尺寸可藉由BET測試法定量化。具體而言,將0.1g之樣本(本發明之空隙層)投入比表面積測量裝置(MICROMERITICS公司製:ASAP2020)之毛細管 後,在室溫下進行減壓乾燥24小時,將空隙結構內之氣體脫氣。接著,使氮氣吸附在前述樣本上,藉此畫出吸附等溫線,求得細孔分布。藉此可評價空隙尺寸。 In the present invention, the aforementioned void size can be legally quantified by the BET test. Specifically, 0.1 g of the sample (the void layer of the present invention) was put into the capillary tube of the specific surface area measuring device (manufactured by MICROMERITICS: ASAP2020) Then, dry under reduced pressure at room temperature for 24 hours to degas the gas in the void structure. Next, nitrogen is adsorbed on the aforementioned sample, thereby drawing an adsorption isotherm, and obtaining the pore distribution. From this, the void size can be evaluated.
本發明之空隙層,例如可如前所述地具有孔結構(多孔質結構),例如亦可為前述孔結構連續之連泡結構體。前述連泡結構體,例如意味在前述聚矽氧多孔體中孔結構三維地連接,亦即前述孔結構之內部空隙呈連續的狀態。多孔質體具有連泡結構時,雖然可能因此提高在整體中占有之空孔率,但使用如中空二氧化矽等獨泡粒子時,無法形成連泡結構。相對於此,本發明之空隙層,例如使用二氧化矽溶膠粒子(形成溶膠之凝膠狀矽化合物的粉碎物)時,由於前述粒子具有三維之樹狀結構,塗布膜(包含前述凝膠狀矽化合物之粉碎物的塗布膜)中,前述樹狀粒子沈降、堆積,因此可容易地形成連泡結構。此外,更佳地,本發明之空隙層宜形成連泡結構具有多數細孔分布之單塊結構。前述單塊結構係指例如存在奈米尺寸之微細空隙的結構、及形成相同奈米空隙集合之連泡結構而存在的階層結構。形成前述單塊結構時,例如以微細之空隙賦予膜強度,且以粗大之連泡空隙賦予高空孔率,因此可兼具膜強度及高空孔率。為形成該等單塊結構,例如宜首先在粉碎成前述二氧化矽溶膠粒子之前階段的凝膠(凝膠狀矽化合物)中,控制生成之空隙結構之細孔分布。此外,例如粉碎前述凝膠狀矽化合物時,將粉碎後之二氧化矽溶膠粒子的粒度分布控制成所希望之尺寸,藉此可形成前述單塊 結構。 The void layer of the present invention may have, for example, a pore structure (porous structure) as described above, or may be, for example, a continuous cell structure with continuous pore structure as described above. The aforementioned continuous cell structure means, for example, that the pore structure in the aforementioned polysilicate porous body is three-dimensionally connected, that is, the internal voids of the aforementioned pore structure are in a continuous state. When the porous body has a continuous-cell structure, although it may increase the porosity occupied in the whole, when using single-cell particles such as hollow silica, the continuous-cell structure cannot be formed. In contrast, when the void layer of the present invention uses silica sol particles (a crushed product of a gel-like silicon compound forming a sol), since the particles have a three-dimensional tree structure, the coating film (including the aforementioned gel-like In the coating film of the pulverized product of silicon compound, the aforementioned dendritic particles settle and accumulate, so that the continuous bubble structure can be easily formed. In addition, more preferably, the void layer of the present invention is suitable to form a monolithic structure with a continuous bubble structure with a large number of pores distributed. The aforementioned monolithic structure refers to, for example, a structure in which there are microscopic voids of nanometer size, and a hierarchical structure that forms a group of interconnected bubbles of the same nano-voids. When the monolithic structure is formed, for example, fine voids are used to impart strength to the film, and coarse continuous cell voids are used to impart high porosity, so that both membrane strength and high porosity can be achieved. In order to form these monolithic structures, for example, it is advisable to first control the pore distribution of the generated void structure in the gel (gel-like silicon compound) before crushing into the aforementioned silica sol particles. In addition, for example, when the aforementioned gel-like silicon compound is pulverized, the particle size distribution of the pulverized silica sol particles is controlled to a desired size, thereby forming the aforementioned monolith structure.
在本發明之空隙層中,顯示透明性之霧度沒有特別限制,其上限係例如小於5%、或小於3%。此外,其下限係例如0.1%以上、0.2%以上,且其範圍係例如0.1%以上且小於5%、0.2%以上且小於3%。 In the void layer of the present invention, the haze exhibiting transparency is not particularly limited, and the upper limit thereof is, for example, less than 5% or less than 3%. In addition, the lower limit thereof is, for example, 0.1% or more and 0.2% or more, and the range thereof is, for example, 0.1% or more and less than 5%, and 0.2% or more and less than 3%.
前述霧度係例如藉由以下方法測量。 The aforementioned haze is measured, for example, by the following method.
(霧度之評價) (Evaluation of Haze)
將空隙層(本發明之空隙層)切割成50mm×50mm之尺寸,並設置在霧度計(村上色彩技術研究所公司製:HM-150)中測量霧度。霧度值係藉由以下式算出。 The void layer (the void layer of the present invention) was cut into a size of 50 mm×50 mm, and set in a haze meter (manufactured by Murakami Color Technology Research Institute Co., Ltd.: HM-150) to measure the haze. The haze value is calculated by the following formula.
霧度(%)=[擴散透射率(%)/全光線透射率(%)]×100(%) Haze (%)=[Diffuse transmittance (%)/Total light transmittance (%)]×100(%)
前述折射率一般係將真空中之光波面之傳播速度與介質內之傳播速度的比稱為該介質之折射率。本發明之空隙層之折射率的上限係例如1.25以下、1.20以下、1.15以下,且下限係例如1.05以上、1.06以上、1.07以上,而其範圍係例如1.05以上至1.25以下、1.06以上至1.20以下、1.07以上至1.15以下。 The aforementioned refractive index generally refers to the ratio of the propagation speed of the light wavefront in vacuum to the propagation speed in the medium as the refractive index of the medium. The upper limit of the refractive index of the void layer of the present invention is, for example, 1.25 or less, 1.20 or less, and 1.15 or less, and the lower limit is, for example, 1.05 or more, 1.06 or more, or 1.07 or more, and the range is, for example, 1.05 or more to 1.25 or less, 1.06 or more to 1.20 or less , 1.07 above to 1.15 below.
在本發明中,除非特別預先聲明,前述折射率係在波長550nm下測量之折射率。此外,折射率之測量方法沒有特別限制,例如可藉由下述方法測量。 In the present invention, unless otherwise stated in advance, the aforementioned refractive index is the refractive index measured at a wavelength of 550 nm. In addition, the method of measuring the refractive index is not particularly limited, and it can be measured by the following method, for example.
(折射率之評價) (Evaluation of refractive index)
在壓克力薄膜上形成空隙層(本發明之空隙層)後,切割成50mm×50mm之尺寸,並藉黏著層將其黏貼在玻璃板(厚度:3mm)之表面上。以黑色馬克筆塗滿前述玻璃板之背面 中央部(直徑大約20mm),調製在前述玻璃板之背面不反射之樣本。將前述樣本設置在橢圓偏光計(J.A.Woollam Japan公司製:VASE)中,在波長500nm、入射角50至80度之條件下,測量折射率,並以其平均值作為折射率。 After forming the void layer (the void layer of the present invention) on the acrylic film, it was cut into a size of 50mm×50mm and pasted on the surface of the glass plate (thickness: 3mm) through the adhesive layer. Paint the back of the aforementioned glass plate with a black marker The central part (about 20mm in diameter) was prepared as a non-reflective sample on the back of the aforementioned glass plate. The aforementioned sample was set in an ellipsometer (manufactured by J.A. Woollam Japan: VASE), the refractive index was measured under the conditions of a wavelength of 500 nm and an incident angle of 50 to 80 degrees, and the average value thereof was used as the refractive index.
本發明之空隙層,例如形成在前述樹脂薄膜上時,顯示與前述樹脂薄膜之密接性的黏著剝離強度沒有特別限制,其下限係例如1N/25mm以上、2N/25mm以上、3N/25mm以上,且其上限係例如30N/25mm以下、20N/25mm以下、10N/25mm以下,而其範圍係例如1至30N/25mm、2至20N/25mm、3至10N/25mm。 When the void layer of the present invention is formed on the aforementioned resin film, for example, the adhesive peel strength showing the adhesion to the aforementioned resin film is not particularly limited. The lower limit is, for example, 1N/25mm or more, 2N/25mm or more, 3N/25mm or more, And its upper limit is, for example, 30N/25mm or less, 20N/25mm or less, 10N/25mm or less, and its range is, for example, 1 to 30N/25mm, 2 to 20N/25mm, 3 to 10N/25mm.
前述黏著剝離強度之測量方法沒有特別限制,例如可藉由下述方法測量。 The measurement method of the aforementioned adhesive peel strength is not particularly limited, and it can be measured by the following method, for example.
(黏著剝離強度之評價) (Evaluation of Adhesive Peel Strength)
將本發明之積層薄膜作成50mm×140mm之長方形樣本,並藉由雙面膠帶將前述樣本固定在不鏽鋼板上。將壓克力黏著層(厚度20μm)黏貼在PET薄膜(T100:MITSUBISHI PLASTIC FILM公司製),接著將切割成25mm×100mm之黏著膠帶片黏貼在前述本發明之積層薄膜的空隙層上,進行與前述PET薄膜之積層。接著,以夾盤間距離為100mm之方式將前述樣本夾在自動繪圖拉伸測試機(島津製作所公司製:AG-Xplus)上後,以0.3m/min之拉伸速度進行拉伸測試。以進行50mm剝離測試之平均測試力,作為黏著剝離強度。 The laminated film of the present invention was made into a rectangular sample of 50 mm×140 mm, and the sample was fixed on a stainless steel plate with a double-sided tape. The acrylic adhesive layer (thickness 20μm) was pasted on the PET film (T100: manufactured by MITSUBISHI PLASTIC FILM), and then the adhesive tape cut into 25mm×100mm was pasted on the gap layer of the laminated film of the present invention, and Laminate of the aforementioned PET film. Next, the aforementioned sample was clamped on an automatic drawing tensile tester (manufactured by Shimadzu Corporation: AG-Xplus) so that the distance between the chucks was 100 mm, and the tensile test was performed at a tensile speed of 0.3 m/min. Take the average test force of the 50mm peel test as the adhesive peel strength.
本發明之空隙層的厚度沒有特別限制,其下限係 例如0.01μm以上、0.05μm以上、0.1μm以上、0.3μm以上,且其上限係例如1000μm以下、100μm以下、80μm以下、50μm以下、10μm以下,而其範圍係例如0.01至1000μm。 The thickness of the void layer of the present invention is not particularly limited, and the lower limit is For example, 0.01 μm or more, 0.05 μm or more, 0.1 μm or more, or 0.3 μm or more, and the upper limit thereof is, for example, 1000 μm or less, 100 μm or less, 80 μm or less, 50 μm or less, or 10 μm or less, and the range thereof is, for example, 0.01 to 1000 μm.
本發明之空隙層,例如,如前所述地包含凝膠狀化合物之粉碎物,且前述粉碎物化學結合。在本發明之空隙層中,前述粉碎物之化學的結合(化學鍵)的形態沒有特別限制,前述化學鍵之具體例可舉交聯鍵等為例。此外,使前述粉碎物化學結合之方法在本發明之製造方法中說明細節。 The void layer of the present invention contains, for example, the pulverized product of the gel-like compound as described above, and the pulverized product is chemically bonded. In the void layer of the present invention, the form of the chemical bond (chemical bond) of the pulverized product is not particularly limited, and specific examples of the chemical bond include cross-linked bonds. In addition, the method of chemically bonding the aforementioned pulverized product will be described in detail in the manufacturing method of the present invention.
前述凝膠狀化合物之凝膠形態沒有特別限制。「凝膠」一般意味溶質具有因相互作用喪失獨立之運動性而集合之結構並固化的狀態。此外,凝膠中,一般濕凝膠包含分散媒且在分散媒中溶質具有一樣之結構,而乾凝膠係去除溶劑且溶質具有有空隙之網孔結構。在本發明中,前述凝膠狀化合物,例如可為濕凝膠,亦可為乾凝膠。 The gel form of the aforementioned gel-like compound is not particularly limited. "Gel" generally means that the solute has a structure that is assembled and solidified due to the loss of independent mobility due to interaction. In addition, in gels, generally wet gels contain a dispersion medium and the solute in the dispersion medium has the same structure, while dry gels remove the solvent and the solute has a mesh structure with voids. In the present invention, the aforementioned gel-like compound may be, for example, a wet gel or a dry gel.
前述凝膠狀化合物可舉使單體化合物凝膠化之凝膠化物為例。具體而言,前述凝膠狀矽化合物,可舉前述單體之矽化合物互相結合之凝膠化物為例,且具體例可舉前述矽化合物互相氫鍵結或分子間力結合之凝膠化物為例。前述結合可舉脫水縮合之結合為例。前述凝膠化之方法稍後在本發明之製造方法中說明。 The aforementioned gel-like compound can be exemplified by a gelled product obtained by gelling a monomer compound. Specifically, the aforementioned gel-like silicon compound can be an example of a gel product in which the aforementioned monomeric silicon compounds are bonded to each other, and a specific example can be a gel product in which the aforementioned silicon compounds are hydrogen-bonded or intermolecularly bonded to each other as example. The aforementioned combination can be exemplified by the combination of dehydration and condensation. The aforementioned gelation method will be described later in the manufacturing method of the present invention.
本發明之空隙層中,顯示前述粉碎物之粒度偏差的體積平均粒徑沒有特別限制,其下限係例如0.10μm以上、0.20μm以上、0.40μm以上,且其上限係例如2.00μm以 下、1.50μm以下、1.00μm以下,而其範圍係例如0.10μm至2.00μm、0.20μm至1.50μm、0.40μm至1.00μm。前述粒度分布可藉由動態光散射法、雷射繞射法等之粒度分布評價裝置、及掃描式電子顯微鏡(SEM)、穿透式電子顯微鏡(TEM)等之電子顯微鏡等來測量。 In the void layer of the present invention, the volume average particle size showing the particle size deviation of the pulverized product is not particularly limited. The lower limit is, for example, 0.10 μm or more, 0.20 μm or more, or 0.40 μm or more, and the upper limit is, for example, 2.00 μm or less. Below, 1.50 μm or less, 1.00 μm or less, and the range thereof is, for example, 0.10 μm to 2.00 μm, 0.20 μm to 1.50 μm, 0.40 μm to 1.00 μm. The aforementioned particle size distribution can be measured by a particle size distribution evaluation device such as a dynamic light scattering method and a laser diffraction method, and an electron microscope such as a scanning electron microscope (SEM) and a transmission electron microscope (TEM).
此外,顯示前述粉碎物之粒度偏差的粒度分布沒有特別限制,例如粒徑0.4μm至1μm之粒子係50至99.9重量%、80至99.8重量%、90至99.7重量%,或粒徑1μm至2μm之粒子係0.1至50重量%、0.2至20重量%、0.3至10重量%。前述粒度分布可藉由粒度分布評價裝置或電子顯微鏡來測量。 In addition, the particle size distribution showing the particle size deviation of the aforementioned pulverized product is not particularly limited. For example, particles with a particle size of 0.4 μm to 1 μm are 50 to 99.9% by weight, 80 to 99.8% by weight, 90 to 99.7% by weight, or a particle size of 1 μm to 2 μm. The particles are 0.1 to 50% by weight, 0.2 to 20% by weight, and 0.3 to 10% by weight. The aforementioned particle size distribution can be measured by a particle size distribution evaluation device or an electron microscope.
在本發明之空隙層中,前述凝膠狀化合物之種類沒有特別限制。前述凝膠狀化合物可舉凝膠狀矽化合物為例。以下,以凝膠狀化合物係凝膠狀矽化合物之情形為例來說明,但本發明不限於此。 In the void layer of the present invention, the type of the aforementioned gel-like compound is not particularly limited. The aforementioned gel-like compound can be exemplified by a gel-like silicon compound. Hereinafter, the case of the gel-like compound-based gel-like silicon compound will be described as an example, but the present invention is not limited to this.
前述交聯鍵係例如矽氧烷鍵。矽氧烷鍵可舉以下所示之T2鍵、T3鍵、T4鍵為例。本發明之空隙層具有矽氧烷鍵時,例如,可具有任一種鍵,可具有任二種,亦可具有三種全部之鍵。前述矽氧烷鍵中,T2及T3之比率越多,可撓性越高,因此可期待凝膠本來之特性,但膜強度脆弱。另一方面,若前述矽氧烷鍵中T4比率多,膜強度容易展現,但空隙尺寸變小,因此可撓性變低。因此,例如宜依據用途改變T2、T3、T4比率。 The aforementioned crosslinking bond is, for example, a siloxane bond. The siloxane bond can be exemplified by the T2 bond, T3 bond, and T4 bond shown below. When the void layer of the present invention has a siloxane bond, for example, it may have any kind of bonds, any two kinds of bonds, or all three kinds of bonds. Among the aforementioned siloxane bonds, the greater the ratio of T2 and T3, the higher the flexibility. Therefore, the original characteristics of the gel can be expected, but the film strength is weak. On the other hand, if the ratio of T4 in the siloxane bond is high, the film strength is easily developed, but the void size becomes smaller, and therefore the flexibility becomes lower. Therefore, for example, it is advisable to change the ratio of T2, T3, and T4 according to the application.
[化1]
本發明之空隙層具有前述矽氧烷鍵時,T2、T3、T4之比率係例如以T2為「1」相對地表示時,T2:T3:T4=1:[1至100]:[0至50]、1:[1至80]:[1至40]、1:[5至60]:[1至30]。 When the void layer of the present invention has the aforementioned siloxane bond, the ratio of T2, T3, and T4 is expressed relative to, for example, when T2 is "1", T2: T3: T4 = 1: [1 to 100]: [0 to 50], 1: [1 to 80]: [1 to 40], 1: [5 to 60]: [1 to 30].
此外,本發明之空隙層,例如宜所包含之矽原子進行矽氧烷鍵。具體例係在前述空隙層包含之全矽原子中,未結合之矽原子(即,殘留矽烷醇)的比率為例如小於50%、30%以下、15%以下。 In addition, in the void layer of the present invention, for example, the silicon atoms contained therein are preferably siloxane bonds. A specific example is that the ratio of unbound silicon atoms (ie, residual silanol) among all silicon atoms contained in the aforementioned void layer is, for example, less than 50%, 30% or less, or 15% or less.
前述凝膠狀化合物係前述凝膠狀矽化合物時,前述單體之矽化合物沒有特別限制。前述單體之矽化合物可舉以下述式(1)表示之化合物為例。前述凝膠化矽化合物係單體之矽化合物如前所述地互相氫鍵結或分子間力結合的凝膠化物時,式(1)之單體間,例如可透過各自之羥基氫鍵結。 When the aforementioned gel-like compound is the aforementioned gel-like silicon compound, the aforementioned monomeric silicon compound is not particularly limited. The silicon compound of the aforementioned monomer can be exemplified by the compound represented by the following formula (1). When the aforementioned gelled silicon compound is a gelled product in which the silicon compounds of the monomers are hydrogen-bonded to each other or intermolecular force-bonded as described above, the monomers of formula (1) can, for example, be hydrogen-bonded through their respective hydroxyl groups. .
前述式(1)中,例如,X係2、3或4,R1係直鏈或 分枝烷基。前述R1之碳數係例如1至6、1至4、1至2。前述直鏈烷基可舉例如:甲基、乙基、丙基、丁基、戊基、己基等;前述分枝烷基可舉異丙基、異丁基等為例。前述X係例如3或4。 In the aforementioned formula (1), for example, X is 2, 3, or 4, and R 1 is a linear or branched alkyl group. The carbon number of the aforementioned R 1 is, for example, 1 to 6, 1 to 4, or 1 to 2. Examples of the aforementioned linear alkyl group include methyl, ethyl, propyl, butyl, pentyl, hexyl, etc.; examples of the aforementioned branched alkyl group include isopropyl and isobutyl. The aforementioned X series is 3 or 4, for example.
以前述式(1)表示之矽化合物的具體例可舉X係3之以下述式(1’)表示之化合物為例。在下述式(1’)中,R1與前述式(1)相同,且係例如甲基。R1係甲基時,前述矽化合物係三(羥基)甲基矽烷。前述X係3時,前述矽化合物係例如具有3官能基之3官能矽烷。 A specific example of the silicon compound represented by the aforementioned formula (1) can be a compound represented by the following formula (1') of the X series 3 as an example. In the following formula (1′), R 1 is the same as the aforementioned formula (1), and is, for example, a methyl group. When R 1 is a methyl group, the aforementioned silicon compound is tri(hydroxy)methylsilane. In the case of the aforementioned X-based 3, the aforementioned silicon compound is, for example, a trifunctional silane having a trifunctional group.
此外,以前述式(1)表示之矽化合物的具體例可舉X係4之化合物為例。在此情形中,前述矽化合物係例如具有4官能基之4官能矽烷。 In addition, the specific example of the silicon compound represented by the aforementioned formula (1) can be a compound of X series 4 as an example. In this case, the aforementioned silicon compound is, for example, a 4-functional silane having a 4-functional group.
前述單體之矽化合物,例如可為矽化合物前驅物之水解物。前述矽化合物前驅物,例如只要可藉由水解生成前述矽化合物即可,具體例可舉以下述式(2)表示之化合物為例。 The silicon compound of the aforementioned monomer may be, for example, a hydrolyzate of a silicon compound precursor. The aforementioned silicon compound precursor may be, for example, as long as the aforementioned silicon compound can be produced by hydrolysis, and specific examples include compounds represented by the following formula (2).
[化4]
前述式(2)中,例如,X係2、3或4,R1及R2分別為直鏈或分枝烷基,R1及R2為相同或不同,在X係2時,R1為互相相同或不同,R2為互相相同或不同。 In the aforementioned formula (2), for example, X is 2, 3, or 4, R 1 and R 2 are linear or branched alkyl groups, respectively, and R 1 and R 2 are the same or different. When X is 2, R 1 To be the same or different from each other, R 2 are the same or different from each other.
前述X及R1,例如,與前述式(1)中之X及R1相同。此外,前述R2,例如可援用式(1)中之R1的例子。 The aforementioned X and R 1 are , for example, the same as X and R 1 in the aforementioned formula (1). In addition, for the aforementioned R 2 , for example, the example of R 1 in formula (1) can be cited.
以前述式(2)表示之矽化合物前驅物的具體例可舉X係3之下述式(2’)所示的化合物為例。在下述式(2’)中,R1及R2分別與前述式(2)相同。R1及R2係甲基時,前述矽化合物前驅物係三甲氧(甲基)矽烷(以下,亦稱為「MTMS」)。 As a specific example of the silicon compound precursor represented by the aforementioned formula (2), a compound represented by the following formula (2') of the X series 3 can be cited as an example. In the following formula (2'), R 1 and R 2 are the same as the aforementioned formula (2), respectively. When R 1 and R 2 are methyl groups, the aforementioned silicon compound precursor is trimethoxy(methyl)silane (hereinafter also referred to as "MTMS").
前述單體之矽化合物,例如由具優異低折射率性之觀點來看,以前述3官能矽烷為佳。此外,前述單體之矽化合物,例如由具優異強度(例如,耐擦傷性)之觀點來看,以前述4官能矽烷為佳。另外,作為前述凝膠狀矽化合物之 原料的前述單體之矽化合物,例如可只使用一種,亦可併用二種以上。具體例係前述單體之矽化合物,例如可只包含前述3官能矽烷,可只包含前述4官能矽烷,可包含前述3官能矽烷及前述4官能矽烷兩者,亦可進一步包含其他矽化合物。前述單體之矽化合物使用二種以上之矽化合物時,其比率沒有限制,可適當設定。 The aforementioned monomeric silicon compound is preferably the aforementioned trifunctional silane from the viewpoint of having excellent low refractive index. In addition, the aforementioned monomeric silicon compound is preferably the aforementioned tetrafunctional silane from the viewpoint of having excellent strength (for example, scratch resistance). In addition, as the aforementioned gel-like silicon compound For example, only one kind of the aforementioned monomeric silicon compound of the raw material may be used, or two or more kinds may be used in combination. A specific example is the silicon compound of the aforementioned monomer. For example, it can include only the aforementioned trifunctional silane, can only contain the aforementioned tetrafunctional silane, can contain both the aforementioned trifunctional silane and the aforementioned tetrafunctional silane, and can further contain other silicon compounds. When two or more types of silicon compounds are used for the aforementioned monomeric silicon compounds, the ratio is not limited and can be set appropriately.
在本發明之積層薄膜中,前述空隙層例如可包含用以使一種或多種形成前述微細空隙結構之構成單元化學結合的觸媒。前述觸媒之含有率沒有特別限制,但相對於前述構成單元之重量可為例如0.01至20重量%、0.05至10重量%、或0.1至5重量%。 In the laminated film of the present invention, the void layer may include, for example, a catalyst for chemically bonding one or more constituent units forming the fine void structure. The content of the aforementioned catalyst is not particularly limited, but can be, for example, 0.01 to 20% by weight, 0.05 to 10% by weight, or 0.1 to 5% by weight relative to the weight of the aforementioned structural unit.
此外,在本發明之積層薄膜中,前述空隙層例如可進一步包含用以使一種或多種形成前述微細空隙結構之構成單元間接結合的交聯輔助劑。前述交聯輔助劑之含有率沒有特別限制,但相對於前述構成單元之重量可為例如0.01至20重量%、0.05至15重量%、或0.1至10重量%。 In addition, in the laminated film of the present invention, the void layer may further include, for example, a crosslinking auxiliary agent for indirectly bonding one or more constituent units forming the fine void structure. The content of the aforementioned crosslinking adjuvant is not particularly limited, but can be, for example, 0.01 to 20% by weight, 0.05 to 15% by weight, or 0.1 to 10% by weight relative to the weight of the aforementioned structural unit.
本發明之空隙層的形態沒有特別限制,但通常是薄膜形狀。 The shape of the void layer of the present invention is not particularly limited, but it is usually in the shape of a film.
本發明之空隙層係例如卷體。此外,本發明之空隙層,例如如前所述地進一步包含樹脂薄膜,且可在長條之前述樹脂薄膜上形成前述空隙層。在此情形中,在本發明之積層薄膜上可積層另一長條薄膜,亦可為在包含前述樹脂薄膜及前述空隙層之本發明的積層薄膜上積層另一長條樹脂薄膜(例如,絕緣紙、脫模紙、表面保護薄膜等)後, 捲成卷體之形態。 The void layer of the present invention is, for example, a roll. In addition, the void layer of the present invention further includes a resin film as described above, and the void layer can be formed on the elongated resin film. In this case, another long film may be laminated on the laminated film of the present invention, or another long resin film (for example, insulating Paper, release paper, surface protection film, etc.), The form of rolls.
本發明之積層薄膜之製造方法沒有特別限制,但例如可藉由以下所示之本發明之製造方法來製造。 The manufacturing method of the laminated film of this invention is not specifically limited, For example, it can manufacture by the manufacturing method of this invention shown below.
[1-2.積層薄膜之製造方法] [1-2. Manufacturing method of laminated film]
本發明之積層薄膜之製造方法,如前所述,包含以下步驟:前驅物形成步驟,在樹脂薄膜上形成空隙層之前驅物亦即空隙結構;及交聯反應步驟,在前述前驅物形成步驟後,在前述前驅物內部產生交聯反應。 The manufacturing method of the laminated film of the present invention, as described above, includes the following steps: a precursor forming step, forming a void layer precursor, that is, a void structure, on the resin film; and a crosslinking reaction step, in the foregoing precursor forming step Then, a cross-linking reaction occurs inside the aforementioned precursor.
在本發明之積層薄膜之製造方法中,例如如前所述,前述空隙層係微細孔粒子化學結合之多孔體,且在前述前驅物形成步驟中,使前述微細孔粒子化學結合。本發明之積層薄膜之製造方法,例如如前所述進一步包含:製作包含前述微細孔粒子之含有液的含有液製作步驟;及使前述含有液乾燥之乾燥步驟,且前述前驅物形成步驟中,使前述乾燥體中之前述微細孔粒子化學結合而形成前述多孔體之前驅物。包含前述微細孔粒子之含有液(以下,有時稱為「微細孔粒子含有液」或只稱為「含有液」)沒有特別限制,但可為例如包含前述微細孔粒子之懸浮液。此外,以下,主要說明前述微細孔粒子係凝膠狀化合物之粉碎物,且前述空隙層係包含凝膠狀化合物之粉碎物的多孔體(最好是聚矽氧多孔體)的情形。但是,本發明之前述微細孔粒子為凝膠狀化合物之粉碎物以外時,可同樣地實施。 In the manufacturing method of the laminated film of the present invention, for example, as described above, the void layer is a porous body in which microporous particles are chemically bonded, and in the precursor forming step, the microporous particles are chemically bonded. The manufacturing method of the laminated film of the present invention, for example, as described above, further includes: a step of preparing a liquid containing liquid containing the aforementioned microporous particles; and a drying step of drying the containing liquid, and in the step of forming the precursor, The microporous particles in the dried body are chemically combined to form the porous body precursor. The containing liquid containing the aforementioned microporous particles (hereinafter, sometimes referred to as "microporous particle containing liquid" or simply "containing liquid") is not particularly limited, but may be, for example, a suspension containing the aforementioned microporous particles. In addition, the following mainly describes the case where the fine-pored particle-based gel-like compound is crushed, and the void layer is a porous body (preferably a polysilicate porous body) containing the crushed gel-like compound. However, when the aforementioned microporous particles of the present invention are other than the pulverized product of a gel-like compound, the same can be implemented.
依據本發明之製造方法,例如可形成顯示優異 低折射率之空隙層。其原因例如推測如下,但本發明不限於該推測。 According to the manufacturing method of the present invention, for example, an excellent display can be formed Low refractive index void layer. The reason is presumed as follows, for example, but the present invention is not limited to this presumption.
由於本發明之製造方法使用之前述粉碎物係粉碎前述凝膠狀矽化合物而得者,前述粉碎前之凝膠狀矽化合物的三維結構呈分散成三維基本結構的狀態。而且,在本發明之製造方法中,藉由在前述基材上塗布前述凝膠狀矽化合物之粉碎物,可依據前述三維基本結構形成多孔性結構之前驅物。即,依據本發明之製造方法,可形成與前述凝膠狀矽化合物之三維結構不同的由前述三維基本結構之前述粉碎物形成的新多孔結構。因此,最後製得之前述空隙層,例如,可具有與空氣層相同程度之機能的低折射率。此外,在本發明之製造方法中,由於進一步使前述粉碎物化學結合,可固定前述新三維結構。因此,最後製得之前述空隙層係具有空隙之結構,但可維持足夠之強度及可撓性。如此,藉由本發明之製造方法製得之空隙層,例如作為前述空氣層之代替品,在低折射性之機能方面,且就強度及可撓性而言是有用的。此外,在前述空氣層之情形中,例如必須藉由在構件與構件兩者間插入分隔物等而設置間隙來積層,在前述構件間形成空氣層。但是,藉由本發明之製造方法製得之空隙層,例如藉由只配置在目標之部位,便可發揮與前述空氣層相同程度之機能的低折射性。因此如前所述,可比形成前述空氣層更容易且簡便地賦予例如光學構件與前述空氣層相同程度之機能的低折射性。 Since the pulverized product used in the manufacturing method of the present invention is obtained by pulverizing the gel-like silicon compound, the three-dimensional structure of the gel-like silicon compound before the pulverization is in a state of being dispersed into a three-dimensional basic structure. Furthermore, in the manufacturing method of the present invention, by coating the pulverized product of the gel-like silicon compound on the substrate, a porous structure precursor can be formed based on the three-dimensional basic structure. That is, according to the manufacturing method of the present invention, a new porous structure formed by the crushed product of the three-dimensional basic structure that is different from the three-dimensional structure of the gel-like silicon compound can be formed. Therefore, the aforementioned void layer produced finally, for example, can have a low refractive index with the same function as the air layer. In addition, in the manufacturing method of the present invention, since the pulverized product is further chemically combined, the new three-dimensional structure can be fixed. Therefore, the resulting void layer has a void structure, but can maintain sufficient strength and flexibility. In this way, the void layer produced by the manufacturing method of the present invention, for example, as a substitute for the aforementioned air layer, is useful in terms of the function of low refraction, and in terms of strength and flexibility. In addition, in the case of the aforementioned air layer, for example, it is necessary to form an air layer between the aforementioned members by inserting a partition or the like between the member and the member to provide a gap. However, the void layer produced by the manufacturing method of the present invention, for example, can exhibit low refraction with the same level of function as the aforementioned air layer by arranging it only at the target location. Therefore, as described above, it is easier and simpler than forming the air layer to provide, for example, the optical member with low refraction that has the same function as the air layer.
此外,本發明進行形成前述空隙層之前驅物之空隙結構的前驅物形成步驟、及在前述前驅物形成步驟後,在前述前驅物內部產生交聯反應之交聯反應步驟作為另一步驟。另外,以多數階段進行前述交聯反應步驟。藉由以多數階段進行前述交聯反應步驟,例如相較於以1階段進行前述交聯反應步驟,可進一步提高前述前驅物之強度,因此可製得兼具高空隙率及強度之本發明的空隙層。雖然該機構不明,但例如,推測如下。即,如前所述,若與形成空隙層同時地藉由觸媒等提高膜強度,有因進行觸媒反應提高膜強度但降低空隙率之問題。吾人推測這是因為,例如,由於進行觸媒之微細孔粒子之交聯反應,前述微細孔粒子之交聯(化學結合)數增加,因此結合變強但空隙層整體凝縮而使空隙率降低。相對於此,藉由進行前述前驅物形成步驟及前述交聯反應步驟作為另一步驟,且,以多數階段進行前述交聯反應步驟,吾人推測,例如可在前述前驅物整體之形態幾乎沒有變化(例如,幾乎不產生整體之凝縮)的情形下增加交聯(化學結合)數。然而,這只是可推測機構之一例,而非限制本發明。 In addition, the present invention performs a precursor forming step of forming the void structure of the precursor of the void layer, and a crosslinking reaction step of generating a crosslinking reaction inside the precursor after the precursor forming step as another step. In addition, the aforementioned crosslinking reaction step is carried out in many stages. By carrying out the aforementioned cross-linking reaction step in multiple stages, for example, compared to carrying out the aforementioned cross-linking reaction step in one stage, the strength of the precursor can be further improved, so that the present invention with both high porosity and strength can be obtained Void layer. Although the mechanism is unknown, for example, it is estimated as follows. That is, as described above, if the film strength is increased by a catalyst or the like at the same time as the formation of the void layer, there is a problem that the film strength is increased due to the catalyst reaction, but the porosity is reduced. We speculate that this is because, for example, the number of crosslinks (chemical bonding) of the microporous particles increases due to the crosslinking reaction of the microporous particles of the catalyst, and therefore the bonding becomes stronger but the entire void layer condenses and the void ratio decreases. In contrast, by performing the aforementioned precursor formation step and the aforementioned crosslinking reaction step as another step, and performing the aforementioned crosslinking reaction step in many stages, we speculate that, for example, there is little change in the overall morphology of the aforementioned precursor. (For example, when there is almost no overall condensation), increase the number of crosslinks (chemical bonding). However, this is only an example of a presumable mechanism, and does not limit the present invention.
在前述前驅物形成步驟中,例如,雖然積層具有一定形狀之粒子並形成前述空隙層之前驅物,但此時之前述前驅物的強度非常弱。然後,例如藉由光或熱活性觸媒反應,產生可使前述微細孔粒子化學結合之交聯促進劑(例如,由光鹼產生劑產生之強鹼觸媒等)(交聯反應步驟之第一階段)。為更有效率地在短時間內反應,藉由進一步 進行加熱老化(交聯反應步驟之第二階段),吾人推測前述微細孔粒子進一步進行化學結合(交聯反應)並提高強度。具體例係前述微細孔粒子為矽化合物之微細孔粒子(例如凝膠狀二氧化矽化合物之粉碎體),且在殘留之矽烷醇基(OH基)存在前述前驅物中的情形中,吾人推測前述殘留矽烷醇基藉由交聯反應化學結合。然而,該說明亦為舉例說明,而非限制本發明。 In the aforementioned precursor forming step, for example, although particles having a certain shape are laminated to form the aforementioned void layer precursor, the strength of the aforementioned precursor is very weak at this time. Then, for example, a light or thermally active catalyst is reacted to produce a crosslinking accelerator (for example, a strong base catalyst produced by a photobase generator, etc.) that can chemically bond the aforementioned microporous particles (the first step of the crosslinking reaction step) One stage). In order to respond more efficiently in a short time, by further After heat aging (the second stage of the cross-linking reaction step), we speculate that the aforementioned microporous particles further undergo chemical bonding (cross-linking reaction) and increase the strength. A specific example is that the aforementioned microporous particles are microporous particles of a silicon compound (for example, a crushed product of a gel-like silica compound), and in the case where the remaining silanol groups (OH groups) are present in the aforementioned precursors, I guess The aforementioned residual silanol groups are chemically combined by a cross-linking reaction. However, the description is also an example, not a limitation of the present invention.
本發明之積層薄膜之製造方法,只要沒有特別記載,可援用前述本發明之空隙層及積層薄膜的說明。 As long as there is no special description for the method of manufacturing the laminated film of the present invention, the description of the void layer and the laminated film of the present invention can be cited.
在本發明之積層薄膜之製造方法中,前述凝膠狀化合物及其粉碎物、前述單體化合物及前述單體化合物之前驅物可援用前述本發明之空隙層及積層薄膜的說明。 In the manufacturing method of the laminated film of the present invention, the aforementioned gel compound and its pulverized product, the monomer compound and the precursor of the monomer compound can refer to the description of the void layer and the laminated film of the present invention.
本發明之積層薄膜之製造方法,例如雖然可如下地進行,但不限於此。 Although the manufacturing method of the laminated film of this invention can be performed as follows, for example, it is not limited to this.
本發明之積層薄膜之製造方法,例如如前所述,具有製作包含前述微細孔粒子之含有液的含有液製作步驟。前述微細孔粒子為凝膠狀化合物之粉碎物時,前述粉碎物係例如粉碎前述凝膠狀化合物而製得。藉由粉碎前述凝膠狀化合物,如前所述地,可破壞前述凝膠狀化合物之三維結構,分散成三維基本結構。 The manufacturing method of the laminated film of the present invention, for example, as described above, has a liquid-containing preparation step for preparing a liquid-containing liquid containing the aforementioned microporous particles. When the microporous particle is a pulverized product of a gel-like compound, the pulverized product is prepared, for example, by pulverizing the gel-like compound. By pulverizing the aforementioned gel-like compound, as described above, the three-dimensional structure of the aforementioned gel-like compound can be destroyed and dispersed into a three-dimensional basic structure.
以下,雖然舉例說明藉前述單體化合物之凝膠化產生前述凝膠狀化合物,及藉粉碎前述凝膠狀化合物調製粉碎物,但本發明不限於以下例子。 Hereinafter, although the gelation of the monomer compound is used to produce the gel-like compound, and the gel-like compound is pulverized to prepare a pulverized product, the present invention is not limited to the following examples.
前述單體化合物之凝膠化,例如可藉由使前述 單體化合物互相氫鍵結或分子間力結合來進行。 The gelation of the aforementioned monomer compound can be achieved, for example, by making the aforementioned The monomer compounds are hydrogen-bonded with each other or intermolecular force bonding.
前述單體化合物可舉以前述本發明之空隙層中所述之前述式(1)表示的矽化合物為例。 The aforementioned monomer compound can be exemplified by the silicon compound represented by the aforementioned formula (1) described in the aforementioned void layer of the present invention.
由於前述式(1)之矽化合物具有羥基,前述式(1)之單體間,例如可透過各自之羥基氫鍵結或分子間力結合。 Since the silicon compound of the aforementioned formula (1) has a hydroxyl group, the monomers of the aforementioned formula (1) can be bonded through hydrogen bonding of the respective hydroxyl groups or intermolecular forces, for example.
此外,前述矽化合物如前所述可為前述矽化合物前驅物之水解物,例如可水解以前述本發明之空隙層中所述之前述式(2)表示的矽化合物前驅物而生成。 In addition, the silicon compound may be a hydrolyzate of the silicon compound precursor as described above, for example, it may be produced by hydrolyzing the silicon compound precursor represented by the above formula (2) in the void layer of the present invention.
前述單體化合物前驅物之水解方法沒有特別限制,例如可藉由在觸媒存在下之化學反應進行。前述觸媒可舉草酸、乙酸等之酸等為例。前述水解反應例如可藉由使草酸之水溶液在室溫環境下慢慢地滴下混合在前述矽化合物及二甲基亞碸之混合液(例如懸浮液)中後,接著立刻攪拌大約30分鐘來進行。水解前述矽化合物前驅物時,例如藉由完全水解前述矽化合物前驅物之烷氧基,可進一步效率良好地表現後來之凝膠化、熟成、空隙結構形成後之加熱、固定化。 The hydrolysis method of the aforementioned monomer compound precursor is not particularly limited, and it can be carried out by a chemical reaction in the presence of a catalyst, for example. Examples of the aforementioned catalyst include acids such as oxalic acid and acetic acid. The aforementioned hydrolysis reaction can be carried out, for example, by slowly mixing an aqueous solution of oxalic acid in a mixed liquid (such as a suspension) of the aforementioned silicon compound and dimethyl sulfide under room temperature environment, and then stirring immediately for about 30 minutes. . When the silicon compound precursor is hydrolyzed, for example, by completely hydrolyzing the alkoxy group of the silicon compound precursor, the subsequent gelation, maturation, heating and immobilization after the formation of the void structure can be further efficiently expressed.
前述單體化合物之凝膠化,例如可藉由前述單體間之脫水縮合反應來進行。前述脫水縮合反應例如宜在觸媒存在下進行,且前述觸媒可舉例如:鹽酸、草酸、硫酸等之酸觸媒、及氨、氫氧化鉀、氫氧化鈉、氫氧化銨等之鹼觸媒(鹼性觸媒)等的脫水縮合觸媒。前述脫水縮合觸媒以鹼觸媒為特佳。在前述脫水縮合反應中,前述觸媒對前述單體化合物之添加量沒有特別限制,相對於1莫耳之前述單體化合物,觸媒可為例如0.1至10莫耳、0.05至7莫耳、0.1至5莫耳。 The gelation of the aforementioned monomer compound can be carried out, for example, by a dehydration condensation reaction between the aforementioned monomers. The aforementioned dehydration condensation reaction, for example, is preferably carried out in the presence of a catalyst, and the aforementioned catalysts include, for example, acid catalysts such as hydrochloric acid, oxalic acid, and sulfuric acid, and alkaline catalysts such as ammonia, potassium hydroxide, sodium hydroxide, and ammonium hydroxide. Catalyst (alkaline catalyst) and other dehydration condensation catalysts. The aforementioned dehydration condensation catalyst is particularly preferably an alkali catalyst. In the aforementioned dehydration condensation reaction, the amount of the aforementioned catalyst added to the aforementioned monomer compound is not particularly limited, and relative to 1 mol of the aforementioned monomer compound, the catalyst can be, for example, 0.1 to 10 mol, 0.05 to 7 mol, 0.1 to 5 mol.
前述單體化合物之凝膠化例如宜在溶劑中進行。前述溶劑中之前述單體化合物的比率沒有特別限制。前述溶劑可舉例如:二甲基亞碸(DMSO)、N-甲基吡咯啶酮(NMP)、N,N-二甲基乙醯醯胺(DMAc)、二甲基甲醯胺(DMF)、γ-丁內酯(GBL)、乙腈(MeCN)、乙二醇乙醚(EGEE)等。前述溶劑可為1種,亦可合併使用2種以上。以下,前述凝膠化使用之溶劑亦稱為「凝膠化用溶劑」。 The gelation of the aforementioned monomer compound is preferably carried out in a solvent, for example. The ratio of the aforementioned monomer compound in the aforementioned solvent is not particularly limited. The aforementioned solvents can include, for example: dimethyl sulfide (DMSO), N-methylpyrrolidone (NMP), N,N-dimethylacetamide (DMAc), dimethylformamide (DMF) , Γ-butyrolactone (GBL), acetonitrile (MeCN), ethylene glycol ether (EGEE), etc. The aforementioned solvent may be one type, or two or more types may be used in combination. Hereinafter, the solvent used for the aforementioned gelation is also referred to as "gelation solvent".
前述凝膠化之條件沒有特別限制。對包含前述單體化合物之前述溶劑的處理溫度可為例如20至30℃、22至28℃、24至26℃,且處理時間可為例如1至60分鐘、5至40分鐘、10至30分鐘。進行前述脫水縮合反應時,其處理條件沒有特別限制,可援用該等例子。藉由進行前述凝膠化例如矽氧烷鍵會成長而形成二氧化矽一次粒子,使反應進一步進行,藉此前述一次粒子連接成念珠狀而生成三維結構之凝膠。 The conditions for the aforementioned gelation are not particularly limited. The treatment temperature of the aforementioned solvent containing the aforementioned monomer compound can be, for example, 20 to 30°C, 22 to 28°C, and 24 to 26°C, and the treatment time can be, for example, 1 to 60 minutes, 5 to 40 minutes, and 10 to 30 minutes. . When the aforementioned dehydration condensation reaction is carried out, the treatment conditions are not particularly limited, and these examples can be cited. By performing the aforementioned gelation, for example, the siloxane bond will grow to form primary silicon dioxide particles, and the reaction proceeds further, whereby the aforementioned primary particles are connected into a rosary shape to generate a three-dimensional structure gel.
藉由前述凝膠化製得之前述凝膠狀化合物宜在凝膠化反應後,實施熟成處理。藉由前述熟成處理,例如,藉由使具有藉凝膠化製得之三維結構的凝膠之一次粒子進一步成長,可增大粒子本身之尺寸,結果,可使粒子接觸之網部分的接觸狀態由點接觸增大至面接觸。進行了如上所述之熟成處理的凝膠,例如,凝膠本身之強度增加,結果,可提高進行粉碎後之三維基本結構的強度。藉此,例如,可抑制在塗布前述粉碎物後之乾燥步驟中,前述三維基本結構堆積而成之空隙結構的細孔尺寸伴隨乾燥過程之溶劑揮發而收縮。 The gel-like compound obtained by the gelation is preferably subjected to an aging treatment after the gelation reaction. By the aforementioned aging treatment, for example, by further growing the primary particles of the gel having the three-dimensional structure obtained by gelation, the size of the particles themselves can be increased, and as a result, the contact state of the mesh portion that the particles contact can be made Increase from point contact to surface contact. For the gel subjected to the above-mentioned aging treatment, for example, the strength of the gel itself is increased, and as a result, the strength of the three-dimensional basic structure after pulverization can be increased. Thereby, for example, in the drying step after coating the pulverized product, the pore size of the void structure formed by the accumulation of the three-dimensional basic structure can be prevented from shrinking due to the volatilization of the solvent during the drying process.
前述熟成處理係,例如,藉由在預定溫度下保溫前述凝膠狀化合物預定時間來進行。前述預定溫度沒有特別限制,其下限係例如30℃以上、35℃以上、40℃以上,且其上限係例如80℃以下、75℃以下、70℃以下,而其範圍係例如30至80℃、35至75℃、40至70℃。前述預定時間沒有特別限制,其下限係例如5小時以上、10小時以上、15小時以上,且其上限係例如50小時以下、40小時以下、30小時以下,而其範圍係例如5至50小時、10至40小時、15至30小時。此外,熟成之最適當條件係,例如,主要目的為可增大前述二氧化矽一次粒子尺寸、及增大網部分之接觸面積的條件。另外,宜考慮使用之溶劑之沸點,例如,若熟成溫度過高,溶劑過度地揮發,可能產生因塗布液(凝膠液)濃度之濃縮而封閉三維空隙結構的細孔等之問題。另一方面,例如熟成溫度過低時,不僅無法充分地獲得前 述熟成之效果,量產製程在一段時間後之溫度偏差亦增大,有可能製成品質不佳之製品。 The aforementioned aging treatment is performed, for example, by keeping the aforementioned gel-like compound at a predetermined temperature for a predetermined time. The aforementioned predetermined temperature is not particularly limited, and its lower limit is, for example, 30°C or higher, 35°C or higher, or 40°C or higher, and its upper limit is, for example, 80°C or lower, 75°C or lower, or 70°C or lower, and its range is, for example, 30 to 80°C, 35 to 75°C, 40 to 70°C. The aforementioned predetermined time is not particularly limited. The lower limit is, for example, 5 hours or more, 10 hours or more, and 15 hours or more, and the upper limit is, for example, 50 hours or less, 40 hours or less, or 30 hours or less, and the range is, for example, 5 to 50 hours. 10 to 40 hours, 15 to 30 hours. In addition, the most appropriate conditions for maturation are, for example, the main purpose is to increase the size of the aforementioned silicon dioxide primary particles and to increase the contact area of the mesh portion. In addition, consideration should be given to the boiling point of the solvent used. For example, if the aging temperature is too high, the solvent will volatilize excessively, which may cause problems such as closing the pores of the three-dimensional void structure due to the concentration of the coating solution (gel solution). On the other hand, when the aging temperature is too low, not only the According to the effect of maturation, the temperature deviation of the mass production process will increase after a period of time, which may result in poor quality products.
前述熟成處理例如可使用與前述凝膠化處理相同之溶劑,具體而言,對前述凝膠處理後之反應物(即,包含前述凝膠狀化合物之前述溶劑),宜照原樣地實施。凝膠化後之熟成處理結束後之前述凝膠(前述凝膠狀化合物,例如前述凝膠狀矽化合物)包含之殘留矽烷醇基的莫耳數係例如添加之原材料(例如,前述單體化合物前驅物)之烷氧基莫耳數為100時之殘留矽烷醇基的比率,其下限係例如1%以上、3%以上、5%以上,且其上限係例如50%以下、40%以下、30%以下,而其範圍係例如1至50%、3至40%、5至30%。為提高凝膠之硬度,例如殘留矽烷醇基之莫耳數越低越好。若矽烷醇基之莫耳數過高,例如,可能到聚矽氧多孔體之前驅物交聯為止,均無法保持空隙結構。另一方面,若矽烷醇基之莫耳數過低,例如製作前述微細孔粒子含有液(例如懸浮液)之步驟及/或後來之步驟中,凝膠狀化合物之粉碎物無法交聯,因此可能無法賦予充分之膜強度。此外,上述係矽烷醇基之一例,但例如以各種反應性官能基修飾單體之矽化合物時,對各個官能基亦可適用同樣之現象。 The above-mentioned aging treatment can use, for example, the same solvent as the above-mentioned gelation treatment. Specifically, it is preferable to perform the reaction product after the above-mentioned gel treatment (that is, the above-mentioned solvent containing the aforementioned gel-like compound) as it is. The molar number of the residual silanol group contained in the gel (the gel-like compound, for example, the gel-like silicon compound) after the completion of the aging treatment after gelation is, for example, the added raw material (for example, the monomer compound) The ratio of residual silanol groups when the alkoxy molar number of the precursor) is 100, the lower limit is, for example, 1% or more, 3% or more, 5% or more, and the upper limit is, for example, 50% or less, 40% or less, 30% or less, and the range is, for example, 1 to 50%, 3 to 40%, 5 to 30%. In order to increase the hardness of the gel, for example, the lower the molar number of residual silanol groups, the better. If the molar number of the silanol group is too high, for example, the void structure may not be maintained until the precursor of the polysiloxane porous body is cross-linked. On the other hand, if the molar number of the silanol group is too low, for example, in the step of preparing the aforementioned microporous particle-containing liquid (such as a suspension) and/or the subsequent step, the pulverized product of the gel-like compound cannot be cross-linked, so It may not be able to impart sufficient film strength. In addition, the above is an example of the silanol group, but for example, when the silicon compound of the monomer is modified with various reactive functional groups, the same phenomenon can be applied to each functional group.
使前述單體化合物在前述凝膠化用溶劑中凝膠化後,粉碎製得之凝膠狀化合物。前述粉碎係例如可對前述凝膠化用溶劑中之凝膠狀化合物,照原樣地實施粉碎處理,亦可以其他溶劑取代前述凝膠化用溶劑後,對前述其 他溶劑中之凝膠狀化合物實施粉碎處理。此外,例如由於凝膠化反應使用之觸媒及使用之溶劑在熟成步驟後亦會殘存,產生液體經過一段時間後凝膠化(使用期限)、乾燥步驟時之乾燥效率降低時,宜以其他溶劑取代。以下,前述其他溶劑亦稱為「粉碎用溶劑」。 After the aforementioned monomer compound is gelled in the aforementioned solvent for gelation, the obtained gel-like compound is pulverized. The aforementioned pulverization system, for example, can pulverize the gel-like compound in the aforementioned gelation solvent as it is, or after replacing the aforementioned gelation solvent with another solvent, the aforementioned gel compound The gel-like compound in other solvents is crushed. In addition, for example, the catalyst and solvent used in the gelation reaction will remain after the maturation step, and the resulting liquid will gel after a period of time (use period), and when the drying efficiency during the drying step is reduced, it is advisable to use other Solvent substitution. Hereinafter, the aforementioned other solvents are also referred to as "solvents for pulverization".
粉碎用溶劑沒有特別限制,例如可使用有機溶劑。前述有機溶劑可舉沸點130℃以下、沸點100℃以下、沸點85℃以下之溶劑為例。具體例可舉例如:異丙醇(IPA)、乙醇、甲醇、丁醇、丙二醇單甲醚(PGME)、甲基賽路蘇、丙酮、二甲基甲醯胺(DMF)等。前述粉碎用溶劑例如可為1種,亦可合併使用2種以上。 The solvent for pulverization is not particularly limited, and, for example, an organic solvent can be used. Examples of the aforementioned organic solvent include solvents with a boiling point of 130°C or less, a boiling point of 100°C or less, and a boiling point of 85°C or less. Specific examples include, for example, isopropanol (IPA), ethanol, methanol, butanol, propylene glycol monomethyl ether (PGME), methyl siloxol, acetone, dimethylformamide (DMF), and the like. The aforementioned solvent for pulverization may be, for example, one type, or two or more types may be used in combination.
前述凝膠用溶劑及前述粉碎用溶劑之組合沒有特別限制,可舉例如:DMSO與IPA之組合、DMSO與乙醇、DMSO與甲醇、DMSO與丁醇之組合等。如此,藉由以前述粉碎用溶劑取代前述凝膠用溶劑,例如在後述塗膜形成時,可形成更均一之塗布膜。 The combination of the solvent for gel and the solvent for pulverization is not particularly limited, and examples include a combination of DMSO and IPA, a combination of DMSO and ethanol, DMSO and methanol, and a combination of DMSO and butanol. In this way, by replacing the solvent for gel with the solvent for pulverization, for example, a more uniform coating film can be formed when the coating film is formed as described later.
前述凝膠狀化合物之粉碎方法沒有特別限制,例如可藉由超音波均質機、高速旋轉均質機、使用其他空洞化現象之粉碎裝置或在高壓下使液斜向衝突之粉碎裝置等來進行。球磨機等之進行媒介粉碎的裝置,例如粉碎時物理地破壞凝膠之空隙結構,相對於此,均質機等之本發明的較佳空洞化方式粉碎裝置,例如由於無媒介方式,可藉由高速之剪力剝離已內含於凝膠三維結構之較弱結合的二氧化矽粒子接合面。藉此,製得之溶膠三維結構, 例如可保持具有一定範圍之粒度分布的空隙結構,且可再形成因塗布、乾燥時之堆積產生的空隙結構。前述粉碎之條件沒有特別限制,例如宜藉由瞬間地賦予高速流,可在不使溶劑揮發之情形下粉碎凝膠。例如,宜粉碎成如前所述之粒度偏差(例如,體積平均粒徑或粒度分布)之粉碎物。假設粉碎時間、強度等之工作量不足時,例如不僅殘留粗粒且無法形成緻密之細孔,外觀缺陷亦增加,可能無法獲得高品質。另一方面,工作量過多時,例如成為比所希望之粒度分布微細的溶膠粒子,且塗布、乾燥後堆積之空隙尺寸成為微細,可能無法滿足所希望之空孔率。 The method for crushing the gel compound is not particularly limited. For example, it can be performed by an ultrasonic homogenizer, a high-speed rotating homogenizer, a crushing device that uses other cavitation phenomena, or a crushing device that causes liquid to collide diagonally under high pressure. Ball mills and other devices for media crushing, for example, physically destroy the void structure of the gel during crushing. In contrast, homogenizers, etc., the preferred cavity-forming crushing device of the present invention, for example, due to the medialess method, can use high speed The shear force peeling is contained in the bonding surface of the weakly bonded silica particles in the three-dimensional structure of the gel. With this, the three-dimensional structure of the sol produced, For example, a void structure with a certain range of particle size distribution can be maintained, and the void structure generated by accumulation during coating and drying can be reformed. The conditions for the aforementioned pulverization are not particularly limited. For example, it is preferable to impart a high-speed flow instantaneously to pulverize the gel without volatilizing the solvent. For example, it is preferable to pulverize into a pulverized product of the aforementioned particle size deviation (for example, volume average particle diameter or particle size distribution). Assuming that the amount of work such as grinding time and strength is insufficient, for example, not only coarse particles remain but dense pores cannot be formed, appearance defects are also increased, and high quality may not be obtained. On the other hand, when the workload is too large, for example, sol particles having a finer particle size distribution than a desired particle size distribution will be formed, and the size of the voids deposited after coating and drying will be fine, and the desired porosity may not be satisfied.
如上所述,可製作包含前述微細孔粒子(凝膠狀化合物之粉碎物)之液(例如懸浮液)。此外,製作包含前述微細孔粒子之液後,或在製作過程中,藉由添加使前述微細孔粒子化學結合之觸媒,可製作包含前述微細孔粒子及前述觸媒之含有液。前述觸媒之添加量沒有特別限制,但相對於前述微細孔粒子(凝膠狀化合物之粉碎物)之重量,係例如0.01至20重量%、0.05至10重量%、或0.1至5重量%。前述觸媒,例如可為促進前述微細孔粒子之交聯鍵結的觸媒(交聯反應促進劑)。使前述微細孔粒子化學結合之化學反應宜利用二氧化矽溶膠分子包含之殘留矽烷醇基的脫水縮合反應。藉由以前述觸媒促進矽烷醇基之羥基的反應,可在短時間內使空隙結構硬化且連續成膜。前述觸媒可舉光活性觸媒及熱活性觸媒為例。若使用前述光活性觸媒,例如在前述前驅物形成步驟中,可在不加熱之情形下 使前述微細孔粒子化學結合(例如交聯鍵結)。藉此,例如在前述前驅物形成步驟中,由於不易產生前述前驅物整體之收縮,可維持更高之空隙率。此外,除了前述觸媒以外,可另外使用產生觸媒之物質(觸媒產生劑),或以此取代前述觸媒。例如,前述觸媒係交聯反應促進劑,而前述觸媒產生劑可為產生前述交聯反應促進劑之物質。例如,除了前述光活性觸媒以外,可另外使用藉由光產生觸媒之物質(光觸媒產生劑),或以此取代前述光活性觸媒,且除了前述熱活性觸媒以外,可另外使用藉由熱產生觸媒之物質(熱觸媒產生劑),或以此取代前述熱活性觸媒。前述光活性觸媒沒有特別限制,但可舉光鹼產生劑(藉由光照射產生鹼性觸媒之物質)、光酸產生劑(藉由光照射產生酸性觸媒之物質)等為例,且以光鹼產生劑為佳。前述光鹼產生劑可舉例如:9-蒽甲基N,N-二乙胺甲酸酯(9-anthrylmethyl N,N-diethylcarbamate,商品名WPBG-018)、(E)-1-[3-(2-羥苯基)-2-丙烯酸]哌啶((E)-1-[3-(2-hydroxyphenyl)-2-propenoyl]piperidine,商品名WPBG-027)、1-(蒽醌-2-基)乙基咪唑羧酸酯(1-(anthraquinon-2-yl)ethyl imidazolecarboxylate,商品名WPBG-140)、2-硝基苯甲基4-甲基丙烯醯基氧吡啶-1-羧酸酯(商品名WPBG-165)、1,2-二異丙基-3-[雙(甲胺基)亞甲基]胍2-(3-苯甲醯苯基)丙酸酯(商品名WPBG-266)、1,2-二環己基-4,4,5,5-四甲雙胍正丁基三苯硼酸酯(商品名WPBG-300)、及2-(9-氧基二苯并哌喃-2-基)丙酸1,5,7-三氮 雜雙環[4.4.0]癸-5-烯(東京化成工業公司(股))、含有4-哌啶甲醇之化合物(商品名HDPD-PB100:HERAEUS公司製)等。此外,包含「WPBG」之商品名均係和光純藥工業公司(股)之商品名。前述光酸產生劑可舉例如:芳香族鋶鹽(商品名SP-170:ADEKA公司)、三芳基鋶鹽(商品名CPI101A:SAN-APRO公司)、芳香族錪鹽(商品名Irgacure250:CHIBA JAPAN公司)等。此外,使前述微細孔粒子化學結合之觸媒不限於前述光活性觸媒及前述光觸媒產生劑,例如可為熱活性觸媒或如尿素等之熱觸媒產生劑。使前述微細孔粒子化學結合之觸媒可舉例如:氫氧化鉀、氫氧化鈉、氫氧化銨等之鹼觸媒、鹽酸、乙酸、草酸等之酸觸媒等。其中,以鹼觸媒較佳。使前述微細孔粒子化學結合之觸媒或觸媒產生劑,例如,可在塗布前添加至包含前述粉碎物(微細孔粒子)之溶膠粒子液(例如懸浮液)中使用,或可將前述觸媒或觸媒產生劑混合於溶劑中作成混合液使用。前述混合液可為例如:直接添加於前述溶膠粒子液中溶解而得之塗布液、將前述觸媒或觸媒產生劑溶解於溶劑中而得之溶液、或將前述觸媒或觸媒產生劑分散於溶劑中而得之分散液。前述溶劑沒有特別限制,可舉水、緩衝液等為例。 As described above, a liquid (e.g., a suspension) containing the aforementioned microporous particles (a crushed product of a gel-like compound) can be produced. In addition, after preparing the liquid containing the microporous particles, or during the production process, by adding a catalyst that chemically binds the microporous particles, a liquid containing the microporous particles and the catalyst can be prepared. The addition amount of the aforementioned catalyst is not particularly limited, but it is, for example, 0.01 to 20% by weight, 0.05 to 10% by weight, or 0.1 to 5% by weight relative to the weight of the aforementioned microporous particles (grinded product of the gel-like compound). The aforementioned catalyst may be, for example, a catalyst (cross-linking reaction accelerator) that promotes cross-linking and bonding of the aforementioned microporous particles. The chemical reaction to chemically bond the aforementioned microporous particles preferably utilizes the dehydration condensation reaction of the residual silanol group contained in the silica sol molecule. By promoting the reaction of the hydroxyl group of the silanol group with the aforementioned catalyst, the void structure can be hardened in a short time and the film can be continuously formed. The aforementioned catalysts can be photoactive catalysts and thermally active catalysts as examples. If the aforementioned photoactive catalyst is used, for example, in the aforementioned precursor formation step, it can be used without heating The aforementioned microporous particles are chemically bonded (for example, cross-linked and bonded). In this way, for example, in the precursor forming step, since shrinkage of the precursor as a whole is not easy to occur, a higher porosity can be maintained. In addition, in addition to the aforementioned catalyst, a substance that generates a catalyst (catalyst generator) may be used, or the aforementioned catalyst may be replaced with this. For example, the aforementioned catalyst is a cross-linking reaction accelerator, and the aforementioned catalyst generator may be a substance that produces the aforementioned cross-linking reaction accelerator. For example, in addition to the aforementioned photoactive catalyst, a substance that generates a catalyst by light (photocatalyst generator) can be used in addition, or it can replace the aforementioned photoactive catalyst, and in addition to the aforementioned thermally active catalyst, another can be used. Substances that generate catalysts by heat (thermal catalyst generators), or replace the aforementioned thermally active catalysts. The aforementioned photoactive catalyst is not particularly limited, but photobase generators (substances that generate alkaline catalysts by light irradiation), photoacid generators (substances that generate acidic catalysts by light irradiation), etc. can be cited as examples. And the photobase generator is preferred. Examples of the aforementioned photobase generator include: 9-anthrylmethyl N, N-diethylcarbamate (trade name WPBG-018), (E)-1-[3- (2-hydroxyphenyl)-2-acrylic acid]piperidine ((E)-1-[3-(2-hydroxyphenyl)-2-propenoyl]piperidine, trade name WPBG-027), 1-(anthraquinone-2 -Yl) ethyl imidazole carboxylate (1-(anthraquinon-2-yl)ethyl imidazolecarboxylate, trade name WPBG-140), 2-nitrobenzyl 4-methacryloyloxypyridine-1-carboxylic acid Ester (trade name WPBG-165), 1,2-diisopropyl-3-[bis(methylamino)methylene]guanidine 2-(3-benzylphenyl) propionate (trade name WPBG -266), 1,2-dicyclohexyl-4,4,5,5-tetraformin n-butyl triphenyl borate (trade name WPBG-300), and 2-(9-oxydibenzo Piperan-2-yl) propionic acid 1,5,7-triazide Heterobicyclo[4.4.0]dec-5-ene (Tokyo Chemical Industry Co., Ltd.), a compound containing 4-piperidine methanol (trade name HDPD-PB100: manufactured by HERAEUS), and the like. In addition, the trade names including "WPBG" are the trade names of Wako Pure Chemical Industries, Ltd. (stocks). Examples of the aforementioned photoacid generator include aromatic sulfonium salt (trade name SP-170: ADEKA company), triaryl sulfonium salt (trade name CPI101A: SAN-APRO company), aromatic sulfonium salt (trade name Irgacure 250: CHIBA JAPAN Company) etc. In addition, the catalyst that chemically binds the microporous particles is not limited to the photoactive catalyst and the photocatalyst generator, and may be, for example, a thermally active catalyst or a thermal catalyst generator such as urea. The catalyst for chemically bonding the aforementioned microporous particles includes, for example, alkaline catalysts such as potassium hydroxide, sodium hydroxide, and ammonium hydroxide, and acid catalysts such as hydrochloric acid, acetic acid, and oxalic acid. Among them, an alkali catalyst is preferred. The catalyst or catalyst generator that chemically binds the aforementioned microporous particles, for example, can be added to a sol particle liquid (e.g., suspension) containing the aforementioned pulverized product (microporous particles) before coating, or the aforementioned catalyst can be used. The medium or catalyst generator is mixed in the solvent to make a mixed liquid for use. The aforementioned mixed solution may be, for example, a coating solution obtained by directly adding to the aforementioned sol particle solution and dissolving, a solution obtained by dissolving the aforementioned catalyst or catalyst generator in a solvent, or the aforementioned catalyst or catalyst generator Dispersion liquid obtained by dispersing in a solvent. The aforementioned solvent is not particularly limited, and water, buffer solutions, etc. can be cited as examples.
此外,例如前述微細孔粒子係由至少包含3官能以下之飽和鍵官能基之矽化合物製得的凝膠狀矽化合物之粉碎物時,在製成包含前述微細孔粒子之液後,或可在製作過程中,進一步添加用以使前述微細孔粒子間接結合 的交聯輔助劑。該交聯輔助劑進入粒子間,藉由粒子與交聯輔助劑各自相互作用或結合,亦可使距離上稍微分開之粒子結合,因此可效率良好地提高強度。前述交聯輔助劑宜為多交聯矽烷單體。前述多交聯矽烷單體,具體而言,例如,可具有2以上且3以下之烷氧矽基,並且烷氧矽基間之鏈長為碳數1以上且10以下,亦可含有碳以外之元素。前述交聯輔助劑可舉例如:1,2-雙(三甲氧矽基)乙烷、1,2-雙(三乙氧矽基)乙烷、雙(三甲氧矽基)甲烷、雙(三乙氧矽基)甲烷、1,3-雙(三乙氧矽基)丙烷、1,3-雙(三甲氧矽基)丙烷、1,4-雙(三乙氧矽基)丁烷、1,4-雙(三甲氧矽基)丁烷、1,5-雙(三乙氧矽基)戊烷、1,5-雙(三甲氧矽基)戊烷、1,6-雙(三乙氧矽基)己烷、1,6-雙(三甲氧矽基)己烷、雙(三甲氧矽基)-正丁基-正丙基-乙烷-1,2-二胺、三-(3-三甲氧矽丙基)異氰酸酯、三-(3-三乙氧矽丙基)異氰酸酯等。其中,特佳的是1,2-雙(三甲氧矽基)乙烷或1,6-雙(三甲氧矽基)己烷。該交聯輔助劑之添加量沒有特別限制,但例如,相對前述矽化合物之微細孔粒子的重量可為0.01至20重量%、0.05至15重量%、或0.1至10重量%。 In addition, for example, when the aforementioned microporous particle is a pulverized product of a gel-like silicon compound made of a silicon compound containing at least trifunctional saturated bond functional groups, it may be prepared in a liquid containing the aforementioned microporous particles. During the production process, further add to make the aforementioned microporous particles indirectly bond The crosslinking auxiliary agent. The cross-linking auxiliary agent enters between the particles, and the particles and the cross-linking auxiliary agent interact or bond with each other, and the particles that are slightly separated in distance can also be combined, so that the strength can be improved efficiently. The aforementioned crosslinking auxiliary agent is preferably a multi-crosslinked silane monomer. The aforementioned multi-crosslinked silane monomer, specifically, for example, may have 2 or more and 3 or less alkoxysilyl groups, and the chain length between the alkoxysilyl groups is 1 or more and 10 or less carbon atoms, and may contain other than carbon. Of the element. The aforementioned crosslinking auxiliary agent may include, for example: 1,2-bis(trimethoxysilyl)ethane, 1,2-bis(triethoxysilyl)ethane, bis(trimethoxysilyl)methane, bis(trimethoxysilyl)ethane, Ethoxysilyl) methane, 1,3-bis(triethoxysilyl)propane, 1,3-bis(trimethoxysilyl)propane, 1,4-bis(triethoxysilyl)butane, 1 ,4-bis(trimethoxysilyl)butane, 1,5-bis(triethoxysilyl)pentane, 1,5-bis(trimethoxysilyl)pentane, 1,6-bis(triethyl) Oxysilyl)hexane, 1,6-bis(trimethoxysilyl)hexane, bis(trimethoxysilyl)-n-butyl-n-propyl-ethane-1,2-diamine, tri-( 3-trimethoxysilylpropyl) isocyanate, tris-(3-triethoxysilylpropyl) isocyanate, etc. Among them, particularly preferred is 1,2-bis(trimethoxysilyl)ethane or 1,6-bis(trimethoxysilyl)hexane. The addition amount of the crosslinking auxiliary agent is not particularly limited, but for example, the weight of the microporous particles of the aforementioned silicon compound can be 0.01 to 20% by weight, 0.05 to 15% by weight, or 0.1 to 10% by weight.
接著,在樹脂薄膜(以下有時稱為「基材」)上塗布包含前述微細孔粒子之含有液(例如懸浮液)(塗布步驟)。前述塗布,例如可使用後述之各種塗布方式,且不限於此。藉由在前述樹脂薄膜上直接塗布包含前述微細孔粒子(例如凝膠狀二氧化矽化合物之粉碎物)之含有液,可形成包含前述微細孔粒子及前述觸媒之塗布膜。前述塗布 膜,例如亦可稱為塗布層。藉由形成前述塗布膜,例如藉由沈降、堆積前述三維結構已破壞之前述粉碎物,可構建新的三維結構。此外,例如包含前述微細孔粒子之含有液可不包含使前述微細孔粒子化學結合之觸媒。例如,如後所述在前述塗布膜上,可噴塗使前述微細孔粒子化學結合之觸媒後,或一面噴塗一面進行前述前驅物形成步驟。然而,包含前述微細孔粒子之含有液亦可包含使前述微細孔粒子化學結合之觸媒,且藉由前述塗布膜中包含之前述觸媒的作用,使前述微細孔粒子化學結合而形成前述多孔體之前驅物。 Next, a resin film (hereinafter sometimes referred to as a "substrate") is coated with a liquid (for example, a suspension) containing the aforementioned microporous particles (coating step). For the aforementioned coating, for example, various coating methods described later can be used, and it is not limited thereto. By directly applying a liquid containing the microporous particles (for example, a pulverized product of a gel-like silica compound) on the resin film, a coating film containing the microporous particles and the catalyst can be formed. The aforementioned coating The film can also be called a coating layer, for example. By forming the coating film, for example, by sedimentation and accumulation of the crushed product whose three-dimensional structure has been destroyed, a new three-dimensional structure can be constructed. In addition, for example, the liquid containing the aforementioned microporous particles may not contain a catalyst that chemically binds the aforementioned microporous particles. For example, as described later, a catalyst that chemically bonds the microporous particles may be sprayed on the coating film, or the precursor forming step may be performed while spraying. However, the liquid containing the microporous particles may also include a catalyst that chemically binds the microporous particles, and the catalyst contained in the coating film chemically binds the microporous particles to form the porous Body precursors.
前述溶劑(以下,亦稱為「塗布用溶劑」)沒有特別限制,例如可使用有機溶劑。前述有機溶劑可舉沸點150℃以下之溶劑。具體例可舉例如:IPA、乙醇、甲醇、正丁醇、2-丁醇、異丁醇、戊醇等,且,可使用與前述粉碎用溶劑相同者。本發明包含粉碎前述凝膠狀化合物之步驟時,在前述塗布膜之形成步驟中,例如可照原樣地使用包含前述凝膠狀化合物之粉碎物的前述粉碎用溶劑。 The aforementioned solvent (hereinafter, also referred to as "coating solvent") is not particularly limited, and, for example, an organic solvent can be used. The aforementioned organic solvent may include a solvent with a boiling point of 150°C or less. Specific examples include IPA, ethanol, methanol, n-butanol, 2-butanol, isobutanol, pentanol, etc., and the same solvent as the aforementioned pulverization solvent can be used. When the present invention includes the step of pulverizing the gel-like compound, in the step of forming the coating film, for example, the solvent for pulverization containing the pulverized product of the gel-like compound can be used as it is.
前述塗布步驟中,例如宜將分散於前述溶劑中之溶膠狀的前述粉碎物(以下,亦稱為「溶膠粒子液」)塗布在前述基材上。本發明之溶膠粒子液,例如藉由塗布在基材上並乾燥後,進行前述化學交聯,可使具有一定程度以上之膜強度的空隙層連續成膜。此外,本發明中之「溶膠」係所謂藉由粉碎凝膠之三維結構,保持空隙結構之一部分之奈米三維結構的二氧化矽溶膠粒子分散於溶劑中 而顯示流動性的狀態。 In the coating step, for example, it is preferable to coat the ground material in the form of a sol dispersed in the solvent (hereinafter also referred to as "sol particle liquid") on the substrate. The sol particle liquid of the present invention, for example, is coated on a substrate and dried, and then subjected to the aforementioned chemical cross-linking, so that a void layer having a film strength above a certain level can be continuously formed into a film. In addition, the "sol" in the present invention refers to the so-called pulverization of the three-dimensional structure of the gel to maintain a part of the void structure of the nano-structured silica sol particles dispersed in a solvent And show the state of liquidity.
前述溶劑中之前述粉碎物的濃度沒有特別限制,可為例如0.3至50%(v/v)、0.5至30%(v/v)、1.0至10%(v/v)。若前述粉碎物之濃度過高,例如,前述溶膠粒子溶液之流動性顯著降低,可能產生塗布時之凝集物、塗布皺摺。另一方面,若前述粉碎物之濃度過低,例如,不僅需要相當於乾燥前述溶膠粒子溶液之溶劑的時間,而且乾燥後之殘留溶劑亦變多,因此空孔率可能降低。 The concentration of the pulverized product in the solvent is not particularly limited, and may be, for example, 0.3 to 50% (v/v), 0.5 to 30% (v/v), 1.0 to 10% (v/v). If the concentration of the aforementioned pulverized product is too high, for example, the fluidity of the aforementioned sol particle solution is significantly reduced, which may cause agglomerates during coating and coating wrinkles. On the other hand, if the concentration of the pulverized product is too low, for example, not only the time equivalent to drying the solvent of the sol particle solution, but also the residual solvent after drying will increase, so the porosity may decrease.
前述溶膠之物性沒有特別限制。前述溶膠之剪黏度,在例如10001/s之剪切速度下,可為例如黏度100cPa.s以下、黏度10cPa.s以下、黏度1cPa.s以下。若剪黏度過高,例如,產生塗布皺摺,因此可能出現凹版塗布之轉印率降低等之問題。相反地,剪黏度過低時,例如,無法增加塗布時之濕塗布(塗布)厚度,因此可能無法在乾燥後獲得所希望之厚度。 The physical properties of the aforementioned sol are not particularly limited. The shear viscosity of the aforementioned sol can be, for example, a viscosity of 100cPa at a shear rate of 10001/s. Below s, viscosity 10cPa. Below s, viscosity 1cPa. s or less. If the shear viscosity is too high, for example, coating wrinkles may occur, so the transfer rate of the gravure coating may decrease. On the contrary, when the shear viscosity is too low, for example, the wet coating (coating) thickness during coating cannot be increased, and therefore, the desired thickness may not be obtained after drying.
前述粉碎物對前述基材之塗布量沒有特別限制,例如,可依所希望之前述聚矽氧多孔體的厚度等適當設定。在形成厚度0.1至1000μm之前述聚矽氧多孔體時,前述粉碎物對前述基材之塗布量的具體例係,每1m2之前述基材面積,例如0.01至60000μg、0.1至5000μg、1至50μg。前述溶膠粒子液之較佳塗布量由於例如與液濃度或塗布方式有關,因此難以一義地定義,但若考慮生產性,宜以儘可能之薄層塗布。若塗布量(塗量)過多,例如,溶劑揮發前被乾燥爐乾燥之可能性高。因此,藉由奈米粉碎粒子在溶劑 中沈降、堆積,並在形成空隙結構前乾燥溶劑,可阻止空隙形成而大幅降低空孔率。另一方面,若塗布量過薄,因基材之凹凸、親疏水性之不均而產生表面塗布不均的風險可能變高。 The amount of the pulverized product applied to the substrate is not particularly limited. For example, it can be appropriately set according to the desired thickness of the porous polysilicate. When forming the aforementioned porous polysilicate body with a thickness of 0.1 to 1000 μm, a specific example of the amount of the pulverized product applied to the aforementioned substrate is per 1 m 2 of the aforementioned substrate area, such as 0.01 to 60000 μg, 0.1 to 5000 μg, 1 to 50μg. The preferable coating amount of the aforementioned sol particle liquid is related to, for example, the concentration of the liquid or the coating method, so it is difficult to define it unambiguously. However, in consideration of productivity, it is preferable to coat as thinly as possible. If the coating amount (coating amount) is too large, for example, the possibility of being dried in a drying oven before the solvent volatilizes is high. Therefore, by sedimentation and accumulation of the pulverized nanoparticles in the solvent, and drying the solvent before forming the void structure, the formation of voids can be prevented and the porosity can be greatly reduced. On the other hand, if the coating amount is too thin, the risk of uneven surface coating due to unevenness of the substrate and uneven hydrophilicity and hydrophobicity may increase.
此外,本發明之製造方法,例如如前所述,具有在前述樹脂薄膜上,形成前述空隙層之前驅物之空隙結構的前驅物形成步驟。前述前驅物形成步驟沒有特別限制,但例如可藉由使塗布前述微細孔粒子含有液而製成之前述塗布膜乾燥的乾燥步驟,形成前述前驅物(空隙結構)。藉由前述乾燥步驟中之乾燥處理,例如不僅可去除前述塗布膜中之前述溶劑(前述溶膠粒子液包含之溶劑),亦可在乾燥處理中,使溶膠粒子沈降、堆積,形成空隙結構。前述乾燥處理之溫度係例如50至250℃、60至150℃、70至130℃,且前述乾燥處理之時間係例如0.1至30分鐘、0.2至10分鐘、0.3至3分鐘。乾燥處理溫度及時間,例如,就連續生產性或展現高空孔率之關連而言,溫度越低且時間越短越好。若條件過嚴,例如基材係樹脂薄膜時,由於接近前述基材之玻璃轉移溫度,前述基材在乾燥爐中伸展,並在塗布後,可能在形成之空隙結構中產生裂縫等之缺陷。另一方面,條件過於寬鬆時,例如,由於離開乾燥爐時含有殘留溶劑,在下一步驟中與輥磨擦時,可能產生造成刮傷等之外觀上的問題。 In addition, the manufacturing method of the present invention, for example, as described above, has a precursor forming step of forming a void structure of the precursor of the void layer on the resin film. The precursor formation step is not particularly limited, but for example, the precursor (void structure) can be formed by a drying step of drying the coating film formed by coating the microporous particle-containing liquid. By the drying process in the drying step, for example, not only the solvent (the solvent contained in the sol particle liquid) in the coating film can be removed, but the sol particles can also be settled and accumulated during the drying process to form a void structure. The temperature of the drying treatment is, for example, 50 to 250° C., 60 to 150° C., and 70 to 130° C., and the time of the drying treatment is, for example, 0.1 to 30 minutes, 0.2 to 10 minutes, and 0.3 to 3 minutes. Drying treatment temperature and time, for example, in terms of continuous productivity or showing high porosity, the lower the temperature and the shorter the time, the better. If the conditions are too strict, such as a base resin film, since the base material is close to the glass transition temperature of the base material, the base material stretches in the drying oven, and after coating, defects such as cracks may occur in the formed void structure. On the other hand, when the conditions are too loose, for example, since it contains residual solvent when leaving the drying furnace, it may cause appearance problems such as scratches when rubbing with the roller in the next step.
前述乾燥處理,例如可為自然乾燥,可為加熱乾燥,亦可為減壓乾燥。前述乾燥方法沒有特別限制,例 如可使用一般之加熱裝置。前述加熱裝置可舉例如:熱風器、加熱輥、遠紅外線加熱器等。其中,以工業上連續生產為前提時,宜使用加熱乾燥。此外,為抑制隨著乾燥時之溶劑揮發而產生收縮應力,並因此產生空隙層(前述聚矽氧多孔體)破裂之現象,所使用之溶劑宜為表面張力低之溶劑。前述溶劑可舉以異丙醇(IPA)為代表之低級醇、己烷、全氟己烷等為例,但不限於此。此外,亦可在上述IPA等中添加少量全氟系界面活性劑或矽系界面活性劑,使表面張力降低。 The aforementioned drying treatment may be, for example, natural drying, heat drying, or reduced pressure drying. The aforementioned drying method is not particularly limited, for example If you can use a general heating device. Examples of the aforementioned heating device include hot air heaters, heating rollers, and far-infrared heaters. Among them, when the industrial continuous production is the premise, it is advisable to use heating and drying. In addition, in order to suppress the shrinkage stress caused by the volatilization of the solvent during drying, and therefore the cracking of the void layer (the aforementioned polysiloxy porous body), the solvent used should preferably be a solvent with a low surface tension. The aforementioned solvents can be exemplified by lower alcohols represented by isopropanol (IPA), hexane, perfluorohexane, etc., but are not limited thereto. In addition, a small amount of perfluorinated surfactants or silicon-based surfactants may be added to the IPA, etc., to reduce the surface tension.
此外,本發明之積層薄膜之製造方法,如前所述,包含在前述前驅物形成步驟後,在前述前驅物內部產生交聯反應之交聯反應步驟,而在前述交聯反應步驟中,藉由光照射或加熱產生前述交聯反應促進劑,且,前述交聯反應步驟具有多數階段。在前述交聯反應步驟之第1階段中,例如藉由前述交聯反應促進劑(例如,酸性物質或鹼性物質)使前述微細孔粒子化學結合。藉此,例如,可固定前述塗布膜(前驅物)中之前述粉碎物的三維結構。進行習知燒結之固定化時,例如,藉由進行200℃以上之高溫處理,誘發矽烷醇基之脫水縮合、矽氧烷鍵之形成。在本發明中,藉由使催化上述脫水縮合反應之各種添加劑反應,例如可不對前述基材(樹脂薄膜)造成破壞,且在大約100℃之比較低乾燥溫度及少於數分鐘之短處理時間內,連續地形成空隙結構並固定化。 In addition, the manufacturing method of the laminated film of the present invention, as described above, includes a cross-linking reaction step in which a cross-linking reaction is generated inside the precursor after the precursor forming step, and in the cross-linking reaction step, The aforementioned cross-linking reaction accelerator is generated by light irradiation or heating, and the aforementioned cross-linking reaction step has many stages. In the first stage of the cross-linking reaction step, for example, the cross-linking reaction promoter (for example, an acidic substance or a basic substance) is used to chemically bond the microporous particles. By this, for example, the three-dimensional structure of the crushed product in the coating film (precursor) can be fixed. When the conventional sintering is performed for immobilization, for example, by performing a high-temperature treatment above 200°C, the dehydration condensation of silanol groups and the formation of siloxane bonds are induced. In the present invention, by reacting various additives that catalyze the dehydration and condensation reaction, for example, the aforementioned substrate (resin film) can not be damaged, and the drying temperature is relatively low at about 100°C and the processing time is less than a few minutes. Inside, the void structure is continuously formed and immobilized.
前述化學結合之方法沒有特別限制,例如可依 據前述凝膠狀矽化合物之種類適當決定。前述化學結合之具體例係例如可藉由前述粉碎物之化學交聯鍵結來進行,此外,亦可考慮,例如在將氧化鈦等之無機粒子等添加於前述粉碎物中時,使前述無機粒子及前述粉碎物化學交聯鍵結。另外,有時亦在載持酵素等之活體觸媒時,使與觸媒活性點不同之部位及前述粉碎物化學交聯鍵結。因此本發明,例如不僅藉前述溶膠粒子形成之空隙層(聚矽氧多孔體),亦可考慮展開有機無機混合空隙層、主客空隙層等的應用,但不限於此。 The aforementioned chemical bonding method is not particularly limited, for example, it can be It is appropriately determined according to the type of the aforementioned gel-like silicon compound. Specific examples of the aforementioned chemical bonding can be carried out by, for example, chemical cross-linking of the aforementioned pulverized product. In addition, it is also conceivable that, for example, when inorganic particles such as titanium oxide are added to the aforementioned pulverized product, the aforementioned inorganic The particles and the aforementioned pulverized product are chemically cross-linked and bonded. In addition, sometimes when a living catalyst such as an enzyme is supported, a site different from the active site of the catalyst and the aforementioned crushed product are chemically cross-linked and bonded. Therefore, in the present invention, for example, not only the void layer (polysiloxan porous body) formed by the aforementioned sol particles, but also the application of developing an organic-inorganic hybrid void layer, a host-guest void layer, etc., can be considered, but it is not limited to this.
在前述觸媒(交聯反應促進劑)存在下之化學反應可在本發明之製造方法中的任一階段進行(發生),沒有特別限制,但例如可在前述多數階段之交聯反應步驟中的至少一階段進行。例如,在本發明之積層薄膜之製造方法中,如前所述,前述乾燥步驟亦可兼作前述前驅物形成步驟。此外,例如可在前述乾燥步驟後,進行前述多數階段之交聯反應步驟,且在其至少一階段中,藉由前述觸媒之作用使前述微細孔粒子化學結合。例如,如前所述,前述觸媒(交聯反應促進劑)係光活性觸媒,在前述交聯反應步驟中,可藉由光照射使前述微細孔粒子化學結合。另外,前述觸媒係熱活性觸媒在前述交聯反應步驟中,可藉由加熱使前述微細孔粒子化學結合。 The chemical reaction in the presence of the aforementioned catalyst (cross-linking reaction accelerator) can be carried out (occurred) at any stage of the manufacturing method of the present invention, and is not particularly limited, but for example, it can be carried out in the aforementioned multi-stage cross-linking reaction step At least one stage. For example, in the manufacturing method of the laminated film of the present invention, as described above, the drying step may also serve as the precursor forming step. In addition, for example, after the drying step, the cross-linking reaction step may be performed in multiple stages, and in at least one of the stages, the microporous particles may be chemically combined by the action of the catalyst. For example, as described above, the catalyst (crosslinking reaction accelerator) is a photoactive catalyst, and in the crosslinking reaction step, the microporous particles can be chemically combined by light irradiation. In addition, the catalyst-based thermally active catalyst can chemically bond the microporous particles by heating in the crosslinking reaction step.
前述化學反應例如可藉由以下方式進行,即:對包含事前添加於前述溶膠粒子液(例如懸浮液)之前述觸媒產生劑(產生交聯反應促進劑之物質)的前述塗布膜進行 光照射或加熱、或在前述塗布膜上噴塗前述觸媒產生劑(產生交聯反應促進劑之物質)後進行光照射或加熱、或一面噴塗前述觸媒產生劑(產生交聯反應促進劑之物質)一面進行光照射或加熱。前述光照射之累積光量沒有特別限制,但以@360nm換算可為例如200至800mJ/cm2、250至600mJ/cm2、或300至400mJ/cm2。由防止照射量不足而未進行觸媒產生劑之光吸收分解以致效果不足的觀點來看,以200mJ/cm2以上之累積光量為佳。此外,由防止對空隙層下之基材造成破壞並產生熱皺摺的觀點來看,以800mJ/cm2以下之累積光量為佳。前述加熱處理之條件沒有特別限制,前述加熱溫度可為例如50至250℃、60至150℃、70至130℃,前述加熱時間可為例如0.1至30分鐘、0.2至10分鐘、0.3至3分鐘。或者,如前所述乾燥塗布之前述溶膠粒子液(例如懸浮液)的步驟可兼作進行在前述觸媒存在下之化學反應的步驟。即,在乾燥塗布之前述溶膠粒子液(例如懸浮液)的步驟中,可藉由在前述觸媒存在下之化學反應,使前述粉碎物(微細孔粒子)化學結合。在此情形中,可藉由在前述乾燥步驟後進一步加熱前述塗布膜,使前述粉碎物(微細孔粒子)進一步強固地結合。此外,推測有在製作前述微細孔粒子含有液(例如懸浮液)之步驟及塗布前述微細孔粒子含有液之步驟中亦產生在前述觸媒存在下之化學反應的情形。然而,該推測未對本發明有任何限制。另外,為抑制隨著乾燥時之溶劑揮發而產生收縮應力,並因此產生空隙層(前述聚矽氧多孔體)破裂之現象, 所使用之溶劑宜為表面張力低之溶劑。可舉以異丙醇(IPA)為代表之低級醇、己烷、全氟己烷等為例,但不限於此。 The chemical reaction can be carried out, for example, by light irradiating the coating film containing the catalyst generator (substance that generates the crosslinking reaction promoter) added to the sol particle liquid (e.g., suspension) in advance Or heating, or spraying the aforementioned catalyst generator (substance that produces a cross-linking reaction accelerator) on the aforementioned coating film, followed by light irradiation or heating, or spraying the aforementioned catalyst generator (substance that produces a cross-linking reaction accelerator) on one side Light irradiation or heating is performed on one side. The cumulative light amount of the aforementioned light irradiation is not particularly limited, but it can be, for example, 200 to 800 mJ/cm 2 , 250 to 600 mJ/cm 2 , or 300 to 400 mJ/cm 2 in @360nm conversion. From the viewpoint of preventing insufficient irradiation without light absorption and decomposition of the catalyst generating agent and insufficient effect, a cumulative light amount of 200 mJ/cm 2 or more is preferable. In addition, from the viewpoint of preventing damage to the substrate under the void layer and generating thermal wrinkles, a cumulative light quantity of 800 mJ/cm 2 or less is preferable. The conditions of the aforementioned heating treatment are not particularly limited. The aforementioned heating temperature can be, for example, 50 to 250°C, 60 to 150°C, or 70 to 130°C, and the aforementioned heating time can be, for example, 0.1 to 30 minutes, 0.2 to 10 minutes, or 0.3 to 3 minutes. . Alternatively, the step of drying the coated sol particle liquid (e.g., suspension) as described above can also be used as a step of carrying out a chemical reaction in the presence of the aforementioned catalyst. That is, in the step of drying the applied sol particle liquid (e.g., suspension), the pulverized product (microporous particles) can be chemically combined by a chemical reaction in the presence of the catalyst. In this case, by further heating the coating film after the drying step, the pulverized product (microporous particles) can be further strongly bonded. In addition, it is estimated that a chemical reaction in the presence of the catalyst may also occur in the step of preparing the microporous particle-containing liquid (for example, a suspension) and the step of applying the microporous particle-containing liquid. However, this presumption does not impose any limitation on the present invention. In addition, in order to suppress the shrinkage stress caused by the volatilization of the solvent during drying, and thus the phenomenon of cracking of the void layer (the aforementioned polysiloxy porous body), the solvent used is preferably a solvent with low surface tension. Examples of lower alcohols represented by isopropanol (IPA), hexane, perfluorohexane, etc., are not limited thereto.
在本發明中,由於前述交聯反應步驟具有多數階段,例如相較於前述交聯反應步驟為1階段之情形,可進一步提高前述空隙層之強度。以下,前述交聯反應步驟之第2階段以後之步驟有時稱為「老化步驟」。前述老化步驟中,例如可藉由加熱前述前驅物,在前述前驅物內部進一步促進交聯反應。雖然在前述交聯反應步驟中產生之現象及機構不明,但例如可如前所述。例如,在前述老化步驟中,例如藉由使加熱溫度為低溫,一面抑制前述前驅物之收縮一面產生交聯反應,藉此提高強度,因此可同時達成高空隙率及強度。前述老化步驟中之溫度係例如40至70℃、45至65℃、50至60℃。進行前述老化步驟之時間係例如10至30小時、13至25小時、15至20小時。 In the present invention, since the aforementioned cross-linking reaction step has many stages, for example, compared to the case where the aforementioned cross-linking reaction step is one stage, the strength of the aforementioned void layer can be further improved. Hereinafter, the steps after the second step of the aforementioned crosslinking reaction step are sometimes referred to as "aging step". In the aforementioned aging step, for example, by heating the aforementioned precursor, the cross-linking reaction can be further promoted in the aforementioned precursor. Although the phenomenon and mechanism generated in the aforementioned crosslinking reaction step are unknown, for example, it can be as described above. For example, in the aforementioned aging step, for example, by setting the heating temperature to a low temperature, the shrinkage of the precursor is suppressed while the cross-linking reaction occurs, thereby increasing the strength, so that both high porosity and strength can be achieved at the same time. The temperature in the aforementioned aging step is, for example, 40 to 70°C, 45 to 65°C, and 50 to 60°C. The time for performing the aforementioned aging step is, for example, 10 to 30 hours, 13 to 25 hours, or 15 to 20 hours.
如上所述,可進行本發明之積層薄膜之製造方法。由本發明之製造方法製成之積層薄膜由於具優異強度,例如,可作成卷狀之多孔體,具有製造效率良好、處理容易等之優點。 As described above, the manufacturing method of the laminated film of the present invention can be carried out. The laminated film made by the manufacturing method of the present invention has excellent strength, for example, can be made into a roll-shaped porous body, and has the advantages of good manufacturing efficiency and easy handling.
如此製得之本發明之積層薄膜(空隙層),例如可進一步與其他薄膜(層)積層,作成包含前述多孔質結構之積層結構體。在此情形中,在前述積層結構體中,各構成元件,例如可透過黏著劑或接著劑積層。 The thus-obtained laminated film (void layer) of the present invention can be further laminated with other films (layers) to form a laminated structure including the aforementioned porous structure, for example. In this case, in the aforementioned laminated structure, each constituent element can be laminated through, for example, an adhesive or an adhesive.
前述各構成元件之積層,例如由有效率之觀點來看,可藉由使用長條薄膜之連續處理(所謂卷對卷(Roll to Roll)等)進行積層,亦可積層在基材為成形物、元件等時進行批式處理者。 For example, from the viewpoint of efficiency, the layering of the aforementioned constituent elements can be achieved by continuous processing using a long film (so-called roll-to-roll (Roll-to-roll)). to Roll) etc.). It is also possible to laminate the batch processing when the base material is a molded product, a component, or the like.
以下,關於連續處理步驟,使用圖1至3舉例說明在基材(樹脂薄膜)上形成前述本發明之空隙層的方法。雖然圖2顯示將前述聚矽氧多孔體製成膜後,黏貼保護薄膜並捲取之步驟,但在另一機能性薄膜上進行積層時,可使用上述方法,亦可塗布另一機能性薄膜,使其乾燥後,在捲取前黏貼進行上述成膜後之前述聚矽氧多孔體。此外,圖示之製膜方法只是一例,且不限於此。 Hereinafter, regarding the continuous processing steps, the method of forming the aforementioned void layer of the present invention on the substrate (resin film) will be exemplified using FIGS. 1 to 3. Although Figure 2 shows the steps of forming the aforementioned porous polysilicate into a film, sticking a protective film and winding it up, when laminating on another functional film, the above method can be used, or another functional film can be coated. After drying, the above-mentioned porous polysilicate body after the above-mentioned film formation is pasted before winding. In addition, the film forming method shown in the figure is just an example, and it is not limited to this.
此外,前述基材可為在本發明之空隙層的說明中的前述樹脂薄膜。在此情形中,藉由在前述基材上形成前述空隙層,可製得本發明之空隙層。另外,可在前述基材上形成前述空隙層後,在本發明之空隙層的說明中的前述樹脂薄膜上積層前述空隙層,藉此亦可製得本發明之空隙層。 In addition, the aforementioned substrate may be the aforementioned resin film in the description of the void layer of the present invention. In this case, by forming the aforementioned void layer on the aforementioned substrate, the void layer of the present invention can be obtained. In addition, after the void layer is formed on the substrate, the void layer can be laminated on the resin film in the description of the void layer of the present invention, whereby the void layer of the present invention can also be obtained.
圖1之截面圖示意地顯示在前述基材(樹脂薄膜)上形成前述空隙層之方法中的步驟例。在圖1中,前述空隙層之形成方法包含:塗布步驟(1),係在基材(樹脂薄膜)10上,塗布前述凝膠狀化合物之粉碎物的溶膠粒子液20”而形成塗布膜;乾燥步驟(2),係乾燥溶膠粒子液20”,形成乾燥後之塗布膜(空隙層之前驅物)20’;交聯步驟(3),係對塗布膜20’進行交聯處理,形成交聯處理後之前驅物(空隙層)20;及強度提高步驟(老化步驟)(4),係提高交聯處理後之前驅物20對基材10的黏著剝離強度而形成空隙層(強度
經提高之空隙層)21。如此,如圖所示,可在基材10上形成空隙層21。在該製造方法中,前述乾燥步驟(2)對應於本發明之積層薄膜之製造方法中的前述「前驅物形成步驟」。此外,在前述交聯步驟(3)及前述強度提高步驟(老化步驟)(4)中,在前述前驅物內部產生交聯反應。即,前述交聯步驟(3)及前述強度提高步驟(老化步驟)(4)之2階段步驟對應於本發明之積層薄膜之製造方法中的前述「交聯反應步驟」。另外,前述空隙層之形成方法可適當包含,亦可不包含前述(1)至(4)以外之步驟。
The cross-sectional view of FIG. 1 schematically shows an example of the steps in the method of forming the void layer on the substrate (resin film). In FIG. 1, the formation method of the aforementioned void layer includes: coating step (1), which is to coat the
在前述塗布步驟(1)中,溶膠粒子液20”之塗布方法沒有特別限制,可採用一般之塗布方法。前述塗布方法可舉例如:縫模法、逆凹版塗布法、微凹版法(微凹版塗布法)、浸漬法(浸塗法)、旋塗法、刷毛塗布法、輥塗法、柔版印刷法、線桿塗布法、噴塗法、擠壓塗布法、簾式塗布法、逆塗布法等。其中,由生產性、塗膜之平滑性等之觀點來看,以擠壓塗布法、簾式塗布法、輥塗法、微凹版塗布法等為佳。前述溶膠粒子液20”之塗布量沒有特別限制,例如,可適當設定,使空隙層20之厚度為適當。空隙層21之厚度沒有特別限制,例如,可如前所述。
In the aforementioned coating step (1), the coating method of the
在前述乾燥步驟(2)中,乾燥溶膠粒子液20”(即,去除溶膠粒子液20”包含之分散媒),形成乾燥後之塗布膜20’。乾燥處理之條件沒有特別限制,可如前所述。
In the aforementioned drying step (2), the
此外,在前述化學處理步驟(3)中,對包含塗布前添加之前述觸媒產生劑(產生觸媒(交聯反應促進劑)之
物質,例如,光觸媒產生劑或熱觸媒產生劑)的塗布膜20’,進行光照射或加熱,使塗布膜20’中之前述粉碎物化學結合(例如,交聯),形成交聯處理後之前驅物20。前述化學處理步驟(3)之光照射或加熱條件沒有特別限制,可如前所述。
In addition, in the aforementioned chemical treatment step (3), the catalyst containing the aforementioned catalyst generator (catalyst generation (crosslinking reaction accelerator)) added before coating
Substances, for example, a photocatalyst generator or a thermal catalyst generator) coated film 20', irradiated with light or heated to chemically combine (for example, crosslink) the aforementioned pulverized product in the coated film 20' to form a cross-linking treatment Before the
另外,藉由例如加熱交聯處理後之前驅物20等,進行前述強度提高步驟(老化步驟)(4),形成空隙層21。前述強度提高步驟(老化步驟)(4)之加熱條件沒有特別限制,可如前所述。
In addition, the aforementioned strength improvement step (aging step) (4) is performed by, for example, the
接著,圖2示意地顯示縫模法之塗布裝置及使用該塗布裝置之前述空隙層的形成方法的一例。此外,雖然圖2是截面圖,但為了容易看清楚,省略陰影線。 Next, FIG. 2 schematically shows an example of the coating device of the slot die method and the formation method of the aforementioned void layer using the coating device. In addition, although FIG. 2 is a cross-sectional view, hatching is omitted in order to make it easier to see.
如圖所示,使用該裝置之方法中的各步驟係一面藉由輥朝一方向搬送基材10一面進行。搬送速度沒有特別限制,可為例如1至100m/分鐘、3至50m/分鐘、5至30m/分鐘。
As shown in the figure, each step in the method of using the device is carried out while conveying the
首先,一面由送出輥101送出並搬送基材10,一面在塗布輥102中,進行在基材10上塗布溶膠粒子液20”之塗布步驟(1),接著,轉移至在烘箱區域110內之乾燥步驟(2)。在圖2之塗布裝置中,在塗布步驟(1)後,乾燥步驟(2)前,進行預備乾燥步驟。預備乾燥步驟可在不加熱之情形下在室溫下進行。在乾燥步驟(2)中,使用加熱裝置111。加熱裝置111,如前所述,可適當使用熱風器、加熱輥、遠紅外線加熱器等。此外,例如,可將乾燥步驟(2)分成多數
步驟,且越後面之乾燥步驟乾燥溫度越高。
First, while the
乾燥步驟(2)後,在化學處理區域120內進行化學處理步驟(3)。在化學處理步驟(3)中,例如,乾燥後之塗布膜(前驅物)20’包含光觸媒產生劑時,藉配置於基材10之上下的燈(光照射裝置)121進行光照射。或者,例如,乾燥後之塗布膜20’包含熱觸媒產生劑時,使用熱風器(加熱裝置)取代燈(光照射裝置)121,藉配置於基材10之上下的熱風器121加熱基材10。藉由該交聯處理,塗布膜20’中之前述粉碎物產生化學結合,使塗布膜20’硬化、強化,成為交聯處理後之前驅物20(以下,有時只稱為「前驅物」)。此外,在本例中,雖然在乾燥步驟(2)後進行化學處理步驟(3),但如前所述,前述粉碎物可在本發明之製造方法的任一階段產生化學結合,沒有特別限制。例如,如前所述,乾燥步驟(2)可兼作化學處理步驟(3)。此外,在乾燥步驟(2)中產生前述化學結合時,亦可進一步進行化學處理步驟(3),進一步強固前述粉碎物之化學結合。另外,可在乾燥步驟(2)前之步驟(例如,預備乾燥步驟、塗布步驟(1)、製作塗布液(例如懸浮液)之步驟等)中,前述粉碎物產生化學結合。
After the drying step (2), the chemical treatment step (3) is performed in the
化學處理步驟(3)後,在交聯反應區域(老化區域)130內進行強度提高步驟(老化步驟)(4),使空隙層之前驅物20的強度(例如,對樹脂薄膜10之黏著剝離強度)提高而形成空隙層21。強度提高步驟(老化步驟)(4),例如,可使用配置於基材10之上下的熱風器(加熱裝置)131,藉由如
前所述地加熱前驅物20來進行。加熱溫度、時間等沒有特別限制,但例如,可如前所述。
After the chemical treatment step (3), the strength improvement step (aging step) (4) is performed in the cross-linking reaction zone (aging zone) 130 to increase the strength of the
接著,強度提高步驟(老化步驟)(4)後,藉由捲取輥105捲取在基材10上形成有空隙層21之積層體。此外,在圖2中,藉由輥106送出之保護片被覆並保護前述積層體之空隙層21。在此,亦可使由長條薄膜形成之其他層積層在空隙層21上來取代前述保護片。
Next, after the strength improvement step (aging step) (4), the laminate in which the
圖3示意地顯示使用微凹版法(微凹版塗布法)之塗布裝置及使用該塗布裝置之前述空隙層形成方法的一例。此外,雖然圖3是截面圖,但為了容易看清楚,省略陰影線。 Fig. 3 schematically shows an example of a coating device using a micro-gravure method (micro-gravure coating method) and the aforementioned void layer forming method using the coating device. In addition, although FIG. 3 is a cross-sectional view, hatching is omitted in order to make it easier to see.
如圖所示,使用該裝置之方法中的各步驟係與圖2同樣地一面藉由輥朝一方向搬送基材10一面進行。搬送速度沒有特別限制,可為例如1至100m/分鐘、3至50m/分鐘、5至30m/分鐘。
As shown in the figure, each step in the method of using this apparatus is performed while conveying the
首先,一面由送出輥201送出並搬送基材10,一面進行在基材10上塗布溶膠粒子液20”之塗布步驟(1)。溶膠粒子液20”之塗布係,如圖所示,使用貯液部202、刮刀(刮刀片)203及微凹版204進行。具體而言,使貯留在貯液部202中之溶膠粒子液20”附著在微凹版204之表面,接著,一面藉刮刀203控制為預定厚度,一面藉微凹版204塗布在基材10表面上。此外,微凹版204係舉例說明,不限於此,可使用其他任意之塗布裝置。
First, while the
接著,進行乾燥步驟(2)。具體而言,如圖所示,
在烘箱區域210中,搬送塗布有溶膠粒子液20”之基材10,並藉由烘箱區域210內之加熱裝置211加熱來乾燥溶膠粒子液20”。加熱裝置211可例如與圖2相同。此外,可藉由將烘箱區域210分成多數區塊,將乾燥步驟(2)分成多數步驟,且越後面之乾燥步驟乾燥溫度越高。乾燥步驟(2)後,在化學處理區域220內,進行化學處理步驟(3)。在化學處理步驟(3)中,例如乾燥後之塗布膜20’包含光觸媒產生劑時,藉配置於基材10之上下的燈(光照射裝置)221進行光照射。或者,例如乾燥後之塗布膜(前驅物)20’包含熱觸媒產生劑時,使用熱風器(加熱裝置)取代燈(光照射裝置)221,藉配置於基材10之上下的熱風器(加熱裝置)221加熱基材10。藉由該交聯處理,塗布膜20’中之前述粉碎物產生化學結合,形成空隙層之前驅物20。
Next, the drying step (2) is performed. Specifically, as shown in the figure,
In the
化學處理步驟(3)後,在交聯反應區域(老化區域)230內進行強度提高步驟(老化步驟)(4),使空隙層之前驅物20的對樹脂薄膜10之黏著剝離強度提高而形成空隙層21。強度提高步驟(老化步驟)(4),例如可使用配置於基材10之上下的熱風器(加熱裝置)231,藉由如前所述地加熱前驅物20來進行。加熱溫度、時間等沒有特別限制,但例如,可如前所述。
After the chemical treatment step (3), the strength improvement step (aging step) (4) is performed in the crosslinking reaction zone (aging zone) 230 to increase the adhesive peel strength of the
接著,強度提高步驟(老化步驟)(4)後,藉由捲取輥241捲取在基材10上形成有空隙層21之積層薄膜。然後,可在前述積層薄膜上例如積層其他層。此外,亦可在藉由捲取輥241捲取前述積層薄膜前,在前述積層薄膜上,例
如,積層其他層。
Next, after the strength improvement step (aging step) (4), the laminated film having the
[2.光學構件] [2. Optical components]
本發明之光學構件,如前所述特徵在於包含本發明之積層薄膜。本發明之光學構件的特徵在於包含本發明之積層薄膜,而其他結構沒有任何限制。本發明之光學構件,例如除了前述本發明之積層薄膜以外,可進一步包含其他層。 The optical member of the present invention is characterized by including the laminated film of the present invention as described above. The optical member of the present invention is characterized by including the laminated film of the present invention, and other structures are not limited in any way. The optical member of the present invention may further include other layers in addition to the aforementioned laminated film of the present invention.
此外,本發明之光學構件包含前述本發明之積層薄膜作為低反射層。本發明之光學構件,例如除了前述本發明之積層薄膜以外,可進一步包含其他層。本發明之光學構件呈例如卷狀。 In addition, the optical member of the present invention includes the aforementioned laminated film of the present invention as a low reflection layer. The optical member of the present invention may further include other layers in addition to the aforementioned laminated film of the present invention. The optical member of the present invention has a roll shape, for example.
接著,說明本發明之實施例。然而,本發明不限於以下之實施例。 Next, embodiments of the present invention will be described. However, the present invention is not limited to the following examples.
(實施例1) (Example 1)
在本實施例中,如下所述地製成本發明之積層薄膜(積層薄膜卷)。 In this example, the laminated film (laminated film roll) of the present invention was produced as follows.
(1)矽化合物之凝膠化 (1) Gelation of silicon compounds
使0.95g之矽化合物之前驅物的MTMS溶解於2.2g之DMSO中。在前述混合液中,添加0.5g之0.01mol/L的草酸水溶液,並在室溫下進行攪拌30分鐘,藉此水解MTMS,生成三(羥基)甲基矽烷。 Dissolve 0.95 g of MTMS of the silicon compound precursor in 2.2 g of DMSO. In the aforementioned mixed solution, 0.5 g of 0.01 mol/L oxalic acid aqueous solution was added, and stirred at room temperature for 30 minutes, thereby hydrolyzing MTMS to generate tris (hydroxy) methyl silane.
將0.38g之28%濃度之氨水及0.2g之純水添加於5.5g之DMSO中後,進一步追加前述水解處理後之前述混合 液,並在室溫下進行攪拌15分鐘,藉此進行三三(羥基)甲基矽烷之凝膠化,製得凝膠狀矽化合物。 After adding 0.38g of 28% ammonia water and 0.2g of pure water to 5.5g of DMSO, the aforementioned mixing after hydrolysis treatment is further added And stir at room temperature for 15 minutes to gelate the tris(hydroxy)methylsilane to obtain a gel-like silicon compound.
(2)熟成處理 (2) Aging treatment
將前述進行了凝膠化處理之混合液,照原樣地在40℃下保溫20小時,進行熟成處理。 The above-mentioned gelatinized mixed liquid was kept at 40°C for 20 hours as it is, and the aging treatment was carried out.
(3)粉碎處理及添加光鹼產生觸媒 (3) Crushing treatment and addition of photoalkali production catalyst
接著,使用刮勺將前述熟成處理後之凝膠狀矽化合物粉碎成數mm至數cm尺寸之顆粒狀。將40g之IPA添加於其中,並輕輕攪拌後,在室溫下靜置6小時,傾析凝膠中之溶劑及觸媒。重複3次同樣之傾析處理,結束溶劑取代。接著,對前述混合液中之前述凝膠狀矽化合物,進行高壓無媒介粉碎。該粉碎處理係使用均質機(商品名UH-50、SMT公司製),在5cc之螺旋瓶中,秤量1.18g之凝膠及1.14g之IPA後,在50W、20kHz之條件下進行2分鐘之粉碎。 Next, use a spatula to pulverize the gel-like silicon compound after the aging treatment into granules with a size of several mm to several cm. Add 40 g of IPA to it, and after lightly stirring, let it stand at room temperature for 6 hours, and decanted the solvent and catalyst in the gel. Repeat the same decantation process 3 times to end the solvent replacement. Next, the gel-like silicon compound in the mixed solution is subjected to high-pressure, media-free pulverization. This crushing treatment is carried out using a homogenizer (trade name UH-50, manufactured by SMT Company), weighing 1.18g of gel and 1.14g of IPA in a 5cc screw bottle, and then performing it for 2 minutes under the conditions of 50W and 20kHz. Shattered.
藉由前述粉碎處理,粉碎前述混合液中之前述凝膠狀矽化合物,使前述混合液成為前述粉碎物之溶膠粒子液。藉由動態光散射式奈米軌跡粒度分析計(日機裝公司製,UPA-EX150型)確認顯示前述混合液包含之前述粉碎物之粒度偏差的體積平均粒徑,結果係0.50至0.70。此外,準備1.5重量%之光鹼產生劑(和光純藥工業公司(股):商品名WPBG266,藉由光產生觸媒(交聯反應促進劑)之物質)的IPA(異丙醇)溶液,並對0.75g之前述溶膠粒子液添加0.031g,以調製塗布液。此外,以上之(1)至(3)的步驟在本發明之積層薄膜的製造方法中相當於製作包含前述微細 孔粒子之含有液的「含有液製作步驟」。 Through the pulverization treatment, the gel-like silicon compound in the mixed solution is pulverized, so that the mixed solution becomes a sol particle liquid of the pulverized product. A dynamic light scattering nano-trajectory particle size analyzer (manufactured by Nikkiso Co., Ltd., model UPA-EX150) was used to confirm the volume average particle size showing the particle size deviation of the pulverized product contained in the mixed liquid, and the result was 0.50 to 0.70. In addition, an IPA (isopropanol) solution of 1.5% by weight of a photobase generator (Wako Pure Chemical Industries, Ltd. (stock): trade name WPBG266, a substance used as a photocatalyst (crosslinking reaction accelerator)) was prepared, To 0.75 g of the aforementioned sol particle liquid, 0.031 g was added to prepare a coating liquid. In addition, the above steps (1) to (3) are equivalent to the production of the above-mentioned fine The "contained liquid preparation step" of the liquid containing the pore particles.
(4)塗布膜之形成及聚矽氧多孔體卷之形成 (4) Formation of coating film and formation of polysiloxy porous body roll
接著,藉由桿塗布法,將前述塗布液塗布(塗覆)在聚對苯二甲酸乙二酯(PET)製基材(樹脂薄膜,100m長)之表面上,形成塗布膜(塗布步驟)。前述塗布係每1mm2之前述基材的表面塗布6μL之前述溶膠粒子液。在溫度100℃下處理1分鐘並乾燥前述塗布膜,形成厚度1μm之聚矽氧多孔體膜(乾燥步驟)。在乾燥後之前述多孔體膜上進行UV照射(前驅物形成步驟)。前述UV照射係以350mJ/cm2(@360nm)實施。此外,對前述前驅物,在60℃下進行加熱老化20hr而製得具有膜強度之低折射率膜(空隙層)。 Next, by the rod coating method, the aforementioned coating liquid is applied (coated) on the surface of a polyethylene terephthalate (PET) substrate (resin film, 100 m long) to form a coating film (coating step) . The coating system is to coat 6 μL of the sol particle liquid per 1 mm 2 of the surface of the substrate. Treated at a temperature of 100°C for 1 minute and dried the aforementioned coating film to form a polysilicate porous body film with a thickness of 1 μm (drying step). UV irradiation (precursor formation step) is performed on the aforementioned porous film after drying. The aforementioned UV irradiation was carried out at 350mJ/cm 2 (@360nm). In addition, the aforementioned precursor was heated and aged at 60° C. for 20 hr to prepare a low refractive index film (void layer) having film strength.
(比較例) (Comparative example)
除了二氧化矽多孔體膜形成後處理只進行UV處理(未進行加熱老化)以外,進行與實施例1同樣之操作,製得在樹脂薄膜上積層有低折射率膜(空隙層)之積層薄膜卷。 The same operation as in Example 1 was carried out except that the post-treatment after the formation of the porous silica film was performed only by UV treatment (without heat aging), a laminated film with a low refractive index film (void layer) laminated on the resin film was obtained. roll.
(實施例2) (Example 2)
除了在實施例1之前述「(3)粉碎處理及添加光鹼產生觸媒」的步驟中,在添加光鹼產生觸媒溶液後,進一步對0.75g之前述溶膠液添加0.018g之5重量%之雙(三甲氧矽基)乙烷以調製塗布液以外,進行與實施例1同樣之操作,製得在樹脂薄膜上積層有低折射率膜(空隙層)之積層薄膜卷。 In addition to the step of "(3) Crushing treatment and addition of photobase generating catalyst" in Example 1, after adding the photobase generating catalyst solution, 0.018g of 5 wt% was further added to 0.75g of the aforementioned sol solution. Except that the bis(trimethoxysilyl)ethane was used to prepare the coating solution, the same operation as in Example 1 was performed to prepare a laminated film roll in which a low refractive index film (void layer) was laminated on a resin film.
(實施例3) (Example 3)
除了在實施例1之前述「(3)粉碎處理及添加光鹼產生觸媒」的步驟中,光鹼產生觸媒對0.75g之前述溶膠液的添加 量為0.054g以外,進行與實施例1同樣之操作,製得在樹脂薄膜上積層有低折射率膜(空隙層)之積層薄膜卷。 Except in the step of "(3) Crushing treatment and addition of photoalkali production catalyst" in Example 1, the addition of photoalkali production catalyst to 0.75g of the aforementioned sol liquid Except that the amount was 0.054 g, the same operation as in Example 1 was performed to prepare a laminated film roll in which a low refractive index film (void layer) was laminated on a resin film.
(實施例4) (Example 4)
除了將實施例2之雙(三甲氧矽基)乙烷變更為5重量%之1,6-雙(三甲氧矽基)己烷(商品名KBM3066:信越化學工業公司(股)製)以外,進行與實施例2同樣之操作,製得在樹脂薄膜上積層有低折射率膜(空隙層)之積層薄膜卷。 Except that the bis(trimethoxysilyl)ethane of Example 2 was changed to 5 wt% 1,6-bis(trimethoxysilyl)hexane (trade name KBM3066: manufactured by Shin-Etsu Chemical Co., Ltd.), The same operation as in Example 2 was performed to prepare a laminated film roll in which a low refractive index film (void layer) was laminated on a resin film.
該等結果顯示於下述表1中。此外,折射率、黏著剝離強度及霧度、耐擦傷性係藉由前述方法測量。耐擦傷性係藉由○、△或×來評價。此外,保存安定性係在室溫下放置前述塗布液1星期,並以目視確認前述塗布液有無變化之結果。 These results are shown in Table 1 below. In addition, the refractive index, adhesive peel strength, haze, and scratch resistance were measured by the aforementioned methods. The scratch resistance is evaluated by ○, △ or ×. In addition, the storage stability is the result of leaving the coating liquid at room temperature for 1 week, and visually confirming whether the coating liquid has changed.
如前述表1所示,進行強度提高步驟(老化步驟)(即,交聯反應步驟具有多數階段)之實施例1至4,相較於未進行強度提高步驟(老化步驟)(即,交聯反應步驟為1階段)之比較例,黏著剝離強度及耐擦傷性提高。此外,實施例1至4與比較例之折射率幾乎沒有差別,維持1.14至1.17之極低折射率。即,確認實施例之積層薄膜可兼具高空隙 率及膜強度。另外,實施例1至4之積層薄膜的霧度值亦維持與比較例相同之0.4的極低數值,因此確認維持與比較例相同程度之透明性。再者,實施例1至4亦具優異之塗布液的保存安定性,因此亦確認可有效率地製造穩定品質之積層薄膜。 As shown in the foregoing Table 1, Examples 1 to 4 in which the strength increasing step (aging step) (ie, the cross-linking reaction step has many stages) are compared to those without the strength increasing step (aging step) (ie, the cross-linking step). The reaction step is a comparative example of step 1), and the adhesive peel strength and scratch resistance are improved. In addition, there is almost no difference in refractive index between Examples 1 to 4 and Comparative Example, maintaining an extremely low refractive index of 1.14 to 1.17. That is, it is confirmed that the laminated film of the example can have both high voids Rate and film strength. In addition, the haze values of the laminated films of Examples 1 to 4 also maintained an extremely low value of 0.4, which is the same as that of the Comparative Example, so it was confirmed that the same degree of transparency as the Comparative Example was maintained. Furthermore, Examples 1 to 4 also have excellent storage stability of the coating solution, and therefore it was confirmed that a laminated film of stable quality can be produced efficiently.
以上,如所說明者,依據本發明,可提供可兼具高空隙率及膜強度之積層薄膜之製造方法、積層薄膜、光學構件及影像顯示裝置。本發明之積層薄膜,由於顯示如前所述之特性,例如,可輕易地實現可作為空氣層之代替品的低折射率。因此,不需要藉由具有一定距離地配置多數構件來設置空氣層以便獲得低折射率,可藉由在所希望部位配置本發明之積層薄膜賦予低折射率。因此,本發明之積層薄膜對需要低折射率之光學構件是有用的。本發明之積層薄膜,例如,雖然可用於本發明之光學構件及影像顯示裝置,但不限於此,亦可使用於任何用途。 As described above, according to the present invention, it is possible to provide a method for manufacturing a laminated film, a laminated film, an optical member, and an image display device that can have both high porosity and film strength. Since the laminated film of the present invention exhibits the aforementioned characteristics, for example, it can easily achieve a low refractive index that can be used as a substitute for an air layer. Therefore, it is not necessary to arrange a large number of components with a certain distance to provide an air layer in order to obtain a low refractive index, and a low refractive index can be imparted by arranging the laminated film of the present invention at a desired position. Therefore, the laminated film of the present invention is useful for optical components that require a low refractive index. The laminated film of the present invention, for example, can be used for the optical member and image display device of the present invention, but it is not limited to this, and can be used for any purpose.
10‧‧‧基材 10‧‧‧Substrate
20‧‧‧前驅物(經交聯處理過之前驅物) 20‧‧‧Precursor (precursor after cross-linking treatment)
20’‧‧‧塗布膜(乾燥後之塗布膜) 20’‧‧‧Coating film (coating film after drying)
20”‧‧‧溶膠粒子液 20"‧‧‧Sol particle liquid
21‧‧‧空隙層 21‧‧‧Void layer
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