TWI741472B - Method for fabricating light-emitting cover - Google Patents

Abstract

A method for fabricating a light-emitting cover includes at least the following steps: providing a substrate; forming a patterned shielding layer on a surface of the substrate, wherein the patterned shielding layer defines a first region and a second region on the surface; placing the substrate into a plating solution for plating a first conductive layer in the first and second regions; washing away the patterned shielding layer; forming a dielectric layer on the substrate, wherein the dielectric layer insulate the first region from the second regions; forming a light emitting layer on the dielectric layer overlapping the first region; and forming a second conductive layer above the light emitting layer.

Description

Manufacturing method of luminous shell

The present invention relates to a manufacturing method, and particularly relates to a manufacturing method of a light-emitting housing.

The traditional luminous paint manufacturing process is to spray different paints, such as conductive materials, dielectric materials, and luminescent materials, on their corresponding areas uniformly in order, and finally achieve the luminous effect through electrification.

However, the use of shielding spray for the electrode area required by the luminous paint does not ensure the accuracy of the range of each spray. Because the spraying process is carried out entirely by manpower, the goal of stable quality and mass production cannot be achieved. In addition, if the modeling is more complicated and small details, for example, the flat pattern is transferred to the curved surface, it is often impossible to accurately align the position.

In addition, in order to ensure that the paint in the spraying range is sufficiently uniform, the material is usually sprayed in a larger area than the defined area, and the paint will volatilize during the spraying process, resulting in waste of paint.

The present invention provides a method for manufacturing a light-emitting shell, which can simultaneously coat more than two different areas of a substrate, reduce the manufacturing process, and increase the accuracy of modeling alignment.

The manufacturing method of a light-emitting housing of the present invention includes at least the following steps: providing a substrate; forming a patterned shielding layer on a surface of the substrate, and the patterned shielding layer protects the substrate The surface is divided into a first electrode area and a second electrode area; placing the substrate in a plating solution to plate a first conductive layer on the first electrode area and the second electrode area; washing De-patterning the shielding layer; forming a dielectric layer on the substrate to isolate the first electrode region from the second electrode region; forming a light emitting layer on the dielectric layer corresponding to the first electrode region layer); and forming a second conductive layer above the light-emitting layer.

In an embodiment of the present invention, the material forming the substrate is Acrylonitrile Butadiene Styrene (ABS).

In an embodiment of the present invention, the material of the substrate is metal. Before forming the patterned shielding layer on the surface of the substrate, an insulating layer is further formed on the surface of the substrate.

In an embodiment of the present invention, before placing the substrate in the electroplating solution, a plurality of perforations are formed on the substrate, and a plurality of copper pillars are correspondingly placed in the perforations. At least one of the through holes is located in the first electrode area, and at least another of the through holes is located in the second electrode area, and at least two of the through holes may be arranged diagonally. In addition, the perforations can be arranged symmetrically.

In an embodiment of the present invention, after the electroplating is completed, it further includes the use of copper pillars To remove the substrate from the electroplating solution.

In an embodiment of the present invention, the method of forming the patterned masking layer on the surface of the substrate is printing.

In an embodiment of the present invention, the method of forming the dielectric layer on the first conductive layer is spraying.

In an embodiment of the present invention, the method of forming the light-emitting layer on the dielectric layer is spraying.

In an embodiment of the present invention, the above-mentioned electroplating solution is a copper solution or a nickel solution.

In an embodiment of the present invention, the above-mentioned second conductive layer is a transparent conductive layer.

Based on the above, the manufacturing method of the light-emitting housing of the present invention replaces the traditional spray gun by electroplating, and can simultaneously coat more than two different areas, so that the manufacturing process can be reduced. In addition, it can also improve the accuracy of modeling, especially suitable for curved surfaces.

110: Substrate

110a: Block to be processed

110b: masked block

110c: perforation

110d: first electrode area

110e: second electrode area

120: Patterned masking layer

130: copper pillar

140: The first conductive layer

150: dielectric layer

160: luminescent layer

170: second conductive layer

200: luminous housing

A: Light emitting area

L: length direction

W: width direction

S110~S190: steps

Fig. 1 is a manufacturing flow chart of a light-emitting housing of the present invention.

2A to 2I are schematic diagrams of manufacturing the light-emitting housing according to the manufacturing process of FIG. 1.

FIG. 3 is a schematic diagram of the light-emitting housing manufactured according to the manufacturing process of FIG. 2A to FIG. 2I.

FIG. 4 is a schematic diagram of the light-emitting casing of FIG. 2I being energized after the light-emitting casing emits light.

This embodiment provides a method for manufacturing a light-emitting housing that can reduce the manufacturing process, has advantages in mass production, and can improve the accuracy of modeling and alignment.

Fig. 1 is a manufacturing flow chart of a light-emitting housing of the present invention. 2A to 2I are schematic diagrams of manufacturing the light-emitting housing according to the manufacturing process of FIG. 1. FIG. 3 is a schematic diagram of the light-emitting housing manufactured according to the manufacturing process of FIG. 2A to FIG. 2I. FIG. 4 is a schematic diagram of the light-emitting casing of FIG. 2I being energized after the light-emitting casing emits light.

The manufacturing method of the light-emitting housing of this embodiment at least includes the following steps. Please refer to Figure 1 and refer to Figures 2A to 2I in sequence.

As shown in step S110 and FIG. 2A, a substrate 110 is provided. In this embodiment, the material of the substrate 110 can be Acrylonitrile Butadiene Styrene (ABS) or metal; An insulating layer (not shown) is formed on the surface of the material 110 in advance.

Then, as shown in step S120 and FIG. 2B, a shielding area 110b and a processing area 110a are divided on the surface of the substrate 110.

As shown in step S130 and FIG. 2C, a patterned shielding layer 120 is formed on the surface of the substrate 110 corresponding to the shielding area 110b, and a first electrode area is defined on the area to be processed 110a through the patterned shielding layer 120 110d and a second electrode area 110e. In this embodiment, a printing method is used to print on the surface of the substrate 110 A patterned shielding layer 120 is formed.

Next, as shown in step S140 and FIG. 2D, a plurality of through holes 110c are formed on the substrate 110. Specifically, the substrate 110 of this embodiment is plate-shaped, in which at least one perforation 110c is located in the first electrode area 110d and at least another perforation 110c is located in the second electrode area 110e, and at least two of the perforations 110c are diagonal set up. In addition, the perforations 110c may be arranged symmetrically. The symmetric arrangement here means that the perforations 110c are arranged symmetrically along the length direction L or the width direction W of the substrate 110. In other non-illustrated embodiments, when the substrate 110 has an irregular shape, or when the substrate 110 has a curved surface, the perforations 110c may also be arranged asymmetrically, but are arranged on the substrate 110 as required. Set up where appropriate.

Then, as shown in step S150, step S160, and FIGS. 2E and 2F, a plurality of copper pillars 130 are provided, and the copper pillars 130 are correspondingly inserted into the through holes 110c. These copper pillars 130 can be used as positive or negative contacts during electroplating.

Then in step S170, the substrate 110 is placed in an electroplating solution to plate a first conductive layer 140 on the first electrode area 110d and the second electrode area 110e, as shown in FIG. 2G.

The patterned shielding layer 120 can prevent the shielding area 110b from being electroplated, so only the processed area 110a (ie, the first electrode area 110d and the second electrode area 110e) is electroplated with the first conductive layer 140. In this embodiment, the electroplating solution can be a copper solution or a nickel solution, which can be selected according to actual needs.

It can be seen from the above process steps of this embodiment that the first conductive layer 140 is formed on the surface of the substrate 110 by electroplating, and only the substrate to be processed is required. 110 is placed in the electroplating solution for electroplating. Therefore, the electroplating process can be performed on a large number of substrates 110 at the same time, which is conducive to mass production of products.

In addition, a plating film (ie, the first conductive layer 140) can be simultaneously formed on different regions on the surface of the substrate 110 by electroplating. Therefore, compared with the prior art, one region needs to correspond to one process, which can reduce the number of processes. At the same time, processing the substrate 110 by electroplating can also increase the accuracy of the alignment of the modeling pattern, especially when the flat pattern is correspondingly formed on a curved surface.

Incidentally, after the electroplating is completed, the copper pillar 130 may be used to remove the substrate 110 from the electroplating solution. Simply put, a clamping tool, such as pliers, can be used to clamp the copper pillar 130 to remove the substrate 110 from the electroplating solution.

Then, as shown in step S180 and FIG. 2H, a chemical solvent is used to wash off the patterned shielding layer 120.

Then, as shown in step S190 and FIG. 2I, a dielectric layer 150 (shown in FIG. 3) is formed on the substrate 110 by spraying. The dielectric layer 150 is used to isolate the first conductive layer 140 of the first electrode region 110d from the first conductive layer 140 of the second electrode region 110e, so as to avoid the interference between the first conductive region 140 of the first electrode region 110d and the second electrode region 110e The first conductive layers 140 contact each other to cause a short circuit. In other words, the range of the dielectric layer 150 covers both the first electrode region 110d and the second electrode region 110e.

After that, a light-emitting layer 160 is formed on the dielectric layer 150 (shown in FIG. 3) corresponding to the first electrode region 110d. The material of the light-emitting layer 160 is, for example, phosphor. 150 (shown in Figure 3) is the same way, for example, spraying.

Then, a second conductive layer 170 is formed on the uppermost layer of the processed substrate 110, wherein the range of the second conductive layer 170 is the same as the range overlapped on the dielectric layer 150), in this way, the light emitting as shown in FIG. 3 is formed.壳200。 200。 The housing 200.

Next, as shown in FIG. 4, after energizing the first conductive layer 140 of the first electrode region 110d and the second electrode region 110e of the light-emitting housing 200 of FIG. An electric field is formed to excite the light emitting layer 160 to emit light. Since the second conductive layer 170 is a transparent conductive layer, it does not affect the color of the light emitted by the light-emitting layer 160.

It should be noted that in the embodiment of the present invention, alternating current is used, so it is not specifically defined which of the first electrode region 110d and the first conductive layer 140 of the second electrode region 110e is a negative electrode or which is a positive electrode.

In particular, the copper pillars 130 used in the electroplating process can increase the conductive area of the electroplating area, and make the plating layer (ie, the first conductive layer 140) more uniform, thereby helping to improve the light-emitting brightness of the light-emitting housing 200.

In addition, the copper pillar 130 can also be used as the light-emitting housing 200 to connect to a circuit or other related contacts that require electricity, and the contacts are hidden on the back of the substrate 110, so the integrity of the surface of the substrate 110 will not be affected. And beautiful.

In summary, in the manufacturing method of the light-emitting housing of the present invention, since the first conductive layer is formed on the substrate by electroplating instead of the traditional spray gun, it has at least the following advantages:

1. Coating can be carried out on two or more different areas at the same time (ie the first conductive layer), so compared with the previous one area needs to correspond to one process, it can reduce the number of processes. Number of journeys.

2. The process of electroplating many substrates at the same time, which is conducive to the mass production of products.

3. Increase the accuracy of the alignment of the modeling pattern, especially when the flat pattern is correspondingly formed on the curved surface.

4. The copper pillars used in the electroplating process can increase the conductive area of the electroplating area and make the coating layer (ie, the first conductive layer) more uniform, thereby helping to improve the luminous brightness of the light-emitting housing.

5. The copper pillar can also be used as a light-emitting shell to connect to a circuit or other related contacts that have electrical requirements, and the contacts are hidden on the back of the substrate, so it will not affect the integrity and beauty of the surface of the substrate.

S110~S190: Procedure

Claims (13)

A method for manufacturing a light-emitting housing includes: Provide a substrate; Forming a patterned shielding layer on a surface of the substrate, and the patterned shielding layer divides the surface into a first electrode area and a second electrode area; Placing the substrate in an electroplating solution to plate a first conductive layer on the first electrode area and the second electrode area; Wash away the patterned masking layer; Forming a dielectric layer on the substrate, and the dielectric layer isolates the first electrode area and the second electrode area; Forming a light-emitting layer on the dielectric layer in a region corresponding to the first electrode region; and A second conductive layer is formed on the light-emitting layer. The method for manufacturing the light-emitting housing according to claim 1, wherein the material forming the substrate is acrylonitrile butadiene styrene. The manufacturing method of the light-emitting housing according to claim 1, wherein the material of the substrate is metal. The manufacturing method of the light-emitting housing according to claim 3, wherein before forming the patterned shielding layer on the surface of the substrate, an insulating layer is further formed on the surface of the substrate. The manufacturing method of the light-emitting housing according to claim 1, further comprising forming a plurality of perforations on the substrate before placing the substrate in the electroplating solution, and placing a plurality of copper pillars into the perforations correspondingly middle. The manufacturing method of the light-emitting housing according to claim 5, wherein at least one of the through-holes is located in the first electrode area and at least another of the through-holes is located in the second electrode area. The method for manufacturing the light-emitting housing according to claim 5, wherein at least two of the perforations are arranged diagonally, and the perforations are arranged symmetrically. The method for manufacturing the light-emitting housing according to claim 5, wherein after the electroplating is completed, it further comprises using the copper pillars to take the substrate out of the electroplating solution. The manufacturing method of the light-emitting housing according to claim 1, wherein the method of forming the patterned shielding layer on the surface of the substrate is printing. The manufacturing method of the light-emitting housing according to claim 1, wherein the method of forming the dielectric layer on the first conductive layer is spraying. The method for manufacturing the light-emitting housing according to claim 1, wherein the method of forming the light-emitting layer on the dielectric layer is spraying. The method for manufacturing the light-emitting housing according to claim 1, wherein the electroplating solution is a copper solution or a nickel solution. The manufacturing method of the light-emitting housing according to claim 1, wherein the second conductive layer is a transparent conductive layer.

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