TWI739222B - Gas-liquid cooling dual heat dissipation module - Google Patents

Abstract

The present invention is a gas-liquid cooling dual heat dissipation module, which includes a first heat sink heat pipe and a second heat sink object. The first joint end and the second joint end are combined, and the other end of the first heat sink heat pipe Socket a hot-surface heat sink fin set, with several cooling chips inserted between the first joint end and the second joint end, use a first heat sink heat pipe to dissipate the refrigeration chip, and the second heat sink object transfers the refrigeration chip The cold source, and improve the efficiency.

Description

Gas-liquid cooling dual heat dissipation module

The present invention relates to a gas-liquid cooling dual heat dissipation module. In more detail, it particularly refers to the two-phase concave and convex structure of the first heat sink heat pipe and the second heat sink object for quick and convenient fitting, and supply of data The refrigeration chip is embedded in contact with a first heat sink heat pipe to dissipate the refrigeration chip, and the second heat sink object transfers the cold source of the refrigeration chip to improve the efficiency of a gas-liquid cooling dual heat dissipation module.

According to the prior knowledge, the cooling chip can be cooled or heated only by inputting current. It is simple to operate and easy to maintain. Because there are no mechanical parts, no noise, and no refrigerant is used, it responds to the concept of environmental protection. The application market is growing very fast, mainly used in optical communication precision temperature control, biomedicine and semiconductor process equipment thermal cycle, consumer home appliances, central processing unit (CPU), electrical appliances, computers, power control, instruments, etc. The high temperature generated will affect the life of the electronic parts. The heat sink and cooling fan are traditionally used for heat dissipation. However, there is no rapid breakthrough in heat dissipation efficiency. Various heat dissipation technologies include common heat sinks, fans, and heat pipes. And water-cooling systems, etc., most of which are the heat conduction characteristics of the application material itself, or the latent heat absorbed by the phase change of the working fluid, which takes away the heat energy of the electronic components, and basically transfers the heat energy from high temperature to low temperature, or heat energy With active transmission, the heat energy is continuously transferred from the low temperature end to the high temperature end. The refrigeration chip is an active refrigeration. Compared with the compressor system, although the energy efficiency ratio is not as good as the compressor system, it requires a small volume and no Application fields such as moving parts, low noise, light weight and precise temperature control have unique advantages. In the field of people’s livelihood, such as small-sized refrigerators, or wine cabinets that pay attention to vibration-free, etc., refrigeration chips have been widely used Market, industry In terms of scientific applications, since the refrigerating chip is easy to control the temperature, it is particularly suitable for thermal cycling application scenarios that require repeated temperature changes, such as biomedical instruments, ice water machines, and low-temperature instruments. Long-term temperature cycling under heavy load is particularly suitable for the performance of refrigerated wafers. In the semiconductor industry, refrigerated wafers have also been introduced in large quantities in the process temperature control of semiconductor wafers.

The traditional heat dissipation modules used in refrigeration chips only use traditional heat pipes, or even temperature plates, or traditional single loop tubes, or loop heat pipes running through each radiator. The shortcomings are as follows:

1. At present, traditional heat pipes, or uniform temperature plates, or traditional single loop pipes, or loop heat pipes are used for energy transfer, the transfer speed is slow, the efficiency is not high, and the heat transfer amount is small.

2. The contact between the refrigerating chip and the heat conducting block is usually positioned by studs, which is slow and inconvenient for assembly.

3. The radiator is mainly based on heat dissipation fins, and the heat dissipation efficiency is limited.

4. At present, all kinds of heat pipes and heat sinks are individually assembled individually, which easily compromises the heat dissipation efficiency.

At present, the heat dissipation efficiency of heat dissipation modules used in appliance heat dissipation or cooling chips has not been improved, resulting in applications in optical communication precision temperature control, biomedical and semiconductor process equipment thermal cycles, consumer home appliances, central processing units (CPU), electrical appliances, Computers, power control, instruments, etc., high temperature affects the life of the electronic parts and work efficiency.

In view of this, the inventor of the present case is based on the above-mentioned drawbacks, actively working hard to develop, research and improve, and continue to experiment and assemble, and accumulate experience, and finally there is an invention sufficient for the above-mentioned drawbacks.

The reason is a gas-liquid cooling dual heat dissipation module, which contains: a first heat sink heat pipe, which is a heat pipe with a normal temperature working fluid inside, one end is provided with a first joint end, and the first joint end is a heat pipe Shen, the first joint end is a concave embedding groove, and the upper wall is provided with There are a plurality of grooves and a heat insulation board, and the other end is sleeved with a hot surface heat dissipation fin group; a second heat sink object, one end is provided with a second joint end, the second joint end is a heat sink, and the second joint The end is a protruding embedded block; several refrigeration chips, the refrigeration chip has a uniform cold surface and a heat dissipation surface, the refrigeration chip is inserted between the first bonding end and the second bonding end; accordingly, the first The first joint end of a heat sink heat pipe is fitted with the second joint end of the second heat sink object, and the heat dissipation surface of the refrigerating chip is attached to the wall surface of the embedding groove of the first joint end, and the refrigerating surface is attached to The wall surface of the embedded block of the second joint end.

The present invention is a gas-liquid cooling dual heat dissipation module. Its main purpose is to use the first heat sink heat pipe and the second heat sink object to be fast-fitted by concave and convex two-phase, and provide the digital refrigeration chip to touch and embed to provide fast Convenient for embedding and quick disassembly.

Another objective of the present invention is to provide a cooling chip with a first heat sink and heat pipe to dissipate heat, so that the cooling chip can efficiently and gradually and quickly dissipate heat.

The present invention is a dual heat dissipation module for gas-liquid cooling. Another object of the present invention is to provide a second heat sink object to transfer the cooling source of the cooling chip, so that the cooling chip can effectively and gradually quickly cool the room or the cooling source can be effectively transferred , Applied to all kinds of application objects, supplying the energy required by the application objects, or cooling the application objects.

〔this invention〕

10: The first heat sink heat pipe

20: The second heat sink object

11: The first binding end

111: Embedded groove

12: groove

13: Insulation board

14: Hot surface cooling fin set

21: The second binding end

211: Embedded Block

30: Refrigeration chip

31: chilled noodles

32: cooling surface

22: second heat pipe

23: Clamping parts

24: Cold surface heat-absorbing fin set

25: groove

40: The second heat sink object

400: Loop heat pipe module

41: second heat pipe

401: second binding end

42: Left fin group

43: Evaporation tube

44: right fin group

45: second heat pipe

46: bottom fin set

441: Fan Group

461: Fan Group

50: The second heat sink object

51: uniform temperature plate

52: second heat pipe

60: The second heat sink object

61: Vertical fin set

62: second heat pipe

70: The second heat sink object

71: second heat sink

72: drive shaft

721: Bearing

73: input parts

74: output parts

700: second heat sink object

701: Motherboard

80: The first heat sink heat pipe

90: The second heat sink object

81: The first binding end

82: Groove

83: Insulation board

84: Hot surface cooling fin set

841: internal thread

85: fan frame

851: Chassis

852: External thread

86: The first loop cooling water pipe

87: The first secondary circuit cooling water pipe

88: Sub-cooling fin set

881: secondary fan

89: Pump

91: second binding end

92: second heat pipe

93: Groove

94: Cold surface heat-absorbing fin set

941: Internal thread

95: Fan Frame

951: Chassis

952: external thread

96: second cooling pipe

900: The second heat sink object

901: Motherboard

The first figure is a three-dimensional exploded schematic view of the first bonding end, the second bonding end and the refrigerating chip according to the first embodiment of the present invention.

The second figure is a schematic cross-sectional view of the first embodiment of the present invention.

The third figure is a schematic plan view of the second heat sink object of the second embodiment of the present invention.

The fourth figure is a schematic top plan view of the second heat sink object of the third embodiment of the present invention.

The fifth figure is a schematic front view of the second heat sink object according to the third embodiment of the present invention.

The sixth figure is a schematic side plan view of the second heat sink object of the third embodiment of the present invention.

The seventh figure is a schematic front view of the second heat sink object according to the fourth embodiment of the present invention.

The eighth figure is a schematic side plan view of the second heat sink object of the fourth embodiment of the present invention.

Figure 9 is a schematic cross-sectional view of the fifth embodiment of the present invention.

Figure 10 is a schematic plan view of the sixth embodiment of the present invention.

Figure eleven is a schematic cross-sectional view of the seventh embodiment of the present invention.

Fig. 12 is a schematic cross-sectional view of the heat dissipation fin set of the hot surface according to the seventh embodiment of the present invention.

Figure 13 is a schematic plan view of the first auxiliary loop heat pipe and the auxiliary heat dissipation fin group of the seventh embodiment of the present invention.

Figure 14 is a schematic plan view of the eighth embodiment of the present invention.

The present invention is a gas-liquid cooling dual heat dissipation module. The first embodiment is shown in the first and second figures. It includes a two-phase combination of a first heat sink heat pipe 10 and a second heat sink object 20. The first heat sink The heat pipe 10 is a heat pipe with a working fluid at room temperature. One end is provided with a first coupling end 11, the first coupling end 11 is a heat sink, and the first coupling end 11 is a concave embedding groove 111. There are a plurality of grooves 12 and an inner top surface is embedded with a heat insulation board 13, the other end is sleeved with a thermal surface heat dissipation fin group 14, and one end of the second heat sink object 20 is provided with a second joint end 21, the second joint end 21 is a heat sink, and the second bonding end 21 is a protruding embedded block 211 with several refrigerating chips 30. The refrigerating chip 30 has a uniform cold surface 31 and a heat dissipation surface 32. The refrigerating chip 30 is inserted into the first Between the embedding groove 111 of a joining end 11 and the embedding block 211 of the second joining end 21, the heat dissipation surface 32 of the refrigerating chip 30 is attached to the wall surface of the embedding groove 111 of the first joining end 11, and the refrigerating surface 31 Sticking to the wall surface of the embedding block 211 of the second bonding end 21, the second bonding end 21 (embedding block 211) and several refrigerating chips 30 are inserted into the first bonding end 11 (embedded groove 111) to be combined, Below the two heat sink objects 20 is a second heat pipe 22, which contains a low-temperature working fluid, and the second heat There is a clamping piece 23 on the tube 22, which clamps the first heat sink heat pipe 10. The clamping piece 23 is a ceramic adsorption material, which has the functions of dehumidification and heat insulation. The connecting end 21 has a hollow extending wall surface downward, and the extending wall surface is provided with a plurality of grooves 25.

With the above-mentioned structural combination, in the first embodiment, the heat dissipation surface 32 of the cooling chip 30 is attached to the wall surface of the first bonding end 11 (embedded groove 111), and the cooling surface 31 is attached to the second bonding end 21 (embedded Block 211) On the wall surface, the second bonding end 21 and several refrigerating chips 30 are inserted into the first bonding end 11 to be combined. On the one hand, the second bonding end 21 and the cooling chip 30 are forced into the first bonding end 11, and the other On the other hand, when the cooling surface 31 generates a cold source, the second bonding terminal 21 will be condensed and positioned. If the second bonding terminal 21 is to be removed from the first bonding terminal 11, only the positive and negative currents are exchanged, and the cold and hot surfaces of the cooling chip 30 are exchanged. The cold and heat source, naturally thawing the first joint end 11 and the refrigerating chip 30, and the first joint end 11 can be removed smoothly; the heat source generated by the heat dissipation surface 32 of the refrigerating chip 30 passes through the first heat sink heat pipe 10 (capillary evaporator, working The liquid evaporates upwards, condenses the droplets, and then circulates continuously) and the hot surface heat dissipation fin set 14 dissipates heat. In this way, the heat source generated by the heat dissipation surface 32 of the cooling chip 30 is generated by the first heat sink heat pipe 10 and The hot surface radiating fin group 14 continuously dissipates heat quickly and effectively; the cooling surface 31 of the refrigerating chip 30 generates a cold source through the second heat sink object 20 to the second heat pipe 22, and the cold surface absorbs heat from the fin group 24 The surrounding air temperature absorbs heat to the second heat pipe 22 (with a low-temperature working fluid, such as methanol, ammonia, etc., a capillary evaporator, the working fluid evaporates upwards, condenses droplets and then downwards, continuously circulates). The air temperature is lowered, and the cooling surface 31 of the cooling chip 30 generates a cold source and transfers the cold source to serve as a cold room effect.

The first heat sink heat pipe 10 of the second embodiment is the same as the first embodiment. As shown in the third figure, below the second heat sink object 40 is a loop heat pipe module 400. The loop heat pipe module 400 has a frame-shaped second The heat pipe 41, the second heat pipe 41 passes through the second coupling end 401, a left fin group 42, an evaporation tube 43 and a right fin group 44. The evaporation tube 43 has a second heat pipe 45 introduced at both ends, and the second The heat pipe 45 passes through a bottom fin group 46, the right fin group 44 has a fan group 441, and the bottom fin group 46 has a fan group 461; the cooling surface of the cooling chip (not shown) generates a cold source through The second heat pipe 41, one evaporation The tube 43 and the second auxiliary heat pipe 45 conduct, and the cooling source is radiated from the fan group 441 of the right fin group 44 and the fan group 461 of the bottom fin group 46, so that the cooling surface of the cooling chip is continuously fast Dissipate the cold flow effectively.

The first heat sink heat pipe of the third embodiment is the same as that of the first embodiment, as shown in Figures 4, 5, and 6, where the second heat sink object 50 is underneath a temperature equalizing plate 51, and the equalizing plate 51 has A plurality of second heat pipes 52 pass through, and the temperature equalizing plate 51 can be connected to other objects.

The first heat sink heat pipe of the fourth embodiment is the same as that of the first embodiment, as shown in Figures 7 and 8, where the second heat sink object 60 is underneath a vertical fin group 61 with a plurality of second The heat pipe 62 passes through and is connected, and can be matched with several fan sets (not shown) to dissipate cold flow.

The first heat sink heat pipe of the fifth embodiment is the same as that of the first embodiment. As shown in the ninth figure, under the second heat sink object 70 is a second heat sink 71 with antifreeze thermal conductive agent inside, and the second heat sink A transmission shaft 72 passes through the sink 71, and the left and right sides of the transmission shaft 72 are provided with bearings 721. One outer side of the transmission shaft 72 is connected to a power member 73 (motor), and the other side is connected to a power member 74 (drill).

The first heat sink heat pipe of the sixth embodiment is the same as that of the first embodiment, as shown in Figure 10, wherein the second heat sink object 700 is an integrated circuit object embedded in the first coupling end 11 ( Figures 1 and 2), the integrated circuit object can be a central processing unit (CPU: Central Processing Unit or GPU: Graphics Processing Unit). At present, computers, mobile phones and other electronic products are all single-sided heating elements. Integrated circuits in the future The object (central processing unit GPU) has developed to generate heat sources on the 2.5D and 3D surfaces, that is, heat sources are generated on the top, left, right, front, and back sides. Below the second heat sink object 700 is the motherboard 701.

The seventh embodiment, as shown in Figures 11 and 12, includes a two-phase combination of a first heat sink heat pipe 80 and a second heat sink object 90. The first heat sink heat pipe 80 is a heat pipe with Room temperature working fluid, one end is provided with a first joint end 81, the first joint end 81 is a heat sink, the first joint end 81 is a concave embedding groove, the upper wall is provided with a plurality of grooves 82 and a heat insulation Plate 83, the other end sleeve Connected to a hot-surface heat dissipation fin group 84, the hot-surface heat dissipation fin group 84 of the first heat sink heat pipe 80 has an internal thread 841, which is screwed to a fan frame 85. The fan frame 85 has a chassis 851 and an external thread 852 assembled in the heat The surface heat dissipation fin group 84, and a first loop cooling water pipe 86 passes through the hot surface heat dissipation fin group 84, and then circulates above the fan frame 85, the first loop cooling water pipe 86 is connected to a first secondary loop cooling water pipe 87, The first secondary circuit cooling water pipe 87 is S-shaped and enters a pair of radiating fin group 88 (as shown in Figure 13). The secondary cooling fin group 88 is provided with a pair of fans 881, and the first circuit cooling water pipe 86 and A pump 89 is used as the circulating internal working fluid between the cooling water pipes 87 of the first secondary circuit. One end of the second heat sink object 90 is provided with a second joint end 91, the second joint end 91 is a heat sink, and the second joint end 91 is a protruding embedded block. Below the second heat sink object 90 is a second heat pipe 92 containing a low-temperature working fluid. The second joint end 91 has a hollow extending wall downward, and the extending wall is provided with a plurality of grooves. Slot 93, the other end of the second heat pipe 92 is sleeved with a cold-side heat-absorbing fin group 94. There is an internal thread 941 in the cold-side heat-absorbing fin group 94, which is screwed to a fan frame 95. The fan frame 95 has a chassis 951 and an external thread 952 Assembled in the cold-side heat-absorbing fin group 94, and a second cooling pipe 96 passes through the cold-side heat-absorbing fin group 94. The two ends of the second cooling pipe 96 are open to the outside world. Consistent with a cold surface 31 and a heat dissipation surface 32, the cooling chip 30 is inserted between the first bonding end 81 and the second bonding end 91, and the heat dissipation surface 32 of the cooling chip 30 is attached to the first bonding end 81 (embedded in the groove) ) Wall surface, the refrigerating surface 31 is attached to the wall surface of the second joining end 91 (embedded block), and the second joining end 91 and several refrigerating chips 30 are inserted into the first joining end 81 for joining.

The seventh embodiment is compared with the first embodiment in that the first heat sink heat pipe 80 adds the first loop heat pipe 86, the fan frame 85 and the first secondary loop cooling water pipe 87, so that the heat dissipation surface 32 of the refrigeration chip 30 can quickly dissipate heat. , A fan frame 95 and a second cooling tube 96 are added to the second heat sink object 90. The cooling surface 31 of the cooling chip 30 conducts cold flow more quickly. The second cooling tube 96 is hollow, and the two ends are not closed, allowing access to the outside world. It can have a cold room effect. If the second heat sink object 90 is applied in water, the fan frame 85 can be removed, and the second cooling pipe 96 can be used as cooling water.

The eighth embodiment is shown in Figure 14, where the second heat sink object 900 is a product The bulk circuit object is embedded in the first coupling terminal 81 (Figure 11). The integrated circuit object can be a central processing unit (CPU: Central Processing Unit or GPU: Graphics Processing Unit). Currently, computers, mobile phones and other electronics The products are all single-sided heating elements. In the future, integrated circuit objects (CPU GPUs) will develop into 2.5D and 3D heat sources, that is, the top, left, right, front, and back sides generate heat sources, and the second heat sink object Below 900 is the motherboard 901.

In summary, the novelty, practicality and advancement of a gas-liquid cooling dual heat dissipation module of the present invention is undoubtedly in full compliance with the requirements of the patent, and it is submitted in accordance with the law.

11: The first binding end

12: groove

21: The second binding end

25: groove

30: Refrigeration chip

31: chilled noodles

32: cooling surface

Claims (9)

A gas-liquid cooling dual heat dissipation module, which includes: a first heat sink heat pipe, which is a heat pipe with a normal temperature working fluid inside, one end is combined with a first joint end, and the first joint end is a heat sink. One joint end has a concave embedding groove, the inner upper wall surface is provided with a plurality of grooves and the inner top surface is embedded with a heat insulation board, and the other end is sleeved with a thermal surface heat dissipation fin group; a second heat sink object, One end is provided with a second joint end, the second joint end is a heat sink, and the second joint end is a protruding embedded block; several refrigeration chips, the refrigeration chip has a uniform cold surface and a heat dissipation surface, cooling The chip is inserted between the embedding groove of the first coupling end and the embedding block of the second coupling end; accordingly, the first coupling end of the first heat sink heat pipe and the second coupling end of the second heat sink object are embedded The heat dissipation surface of the combined refrigerating chip is attached to the wall surface of the embedding groove of the first joining end, and the refrigerating surface is attached to the wall surface of the embedding block of the second joining end. The gas-liquid cooling dual heat dissipation module according to claim 1, wherein under the second heat sink object is a second heat pipe containing a low-temperature working fluid, and there is a clamping piece on the second heat pipe to clamp the first heat sink. The other end of the heat sink is sleeved with a cold-surface heat-absorbing fin group, and the second joint end has a hollow extending wall downward, and the extending wall is provided with a plurality of grooves. The gas-liquid cooling dual heat dissipation module according to claim 1, wherein under the second heat sink object is a loop heat pipe module, the loop heat pipe module has a frame-shaped second heat pipe, and the second heat pipe passes through the second junction End, a left fin group, an evaporation tube and a right fin group. The evaporation tube has a second heat pipe leading in at both ends. The second heat pipe passes through a bottom fin group, and the right fin group has a fan group. , The bottom fin group has a fan group. The gas-liquid cooling dual heat dissipation module according to claim 1, wherein under the second heat sink object is a uniform temperature plate, and a plurality of second heat pipes pass through the uniform temperature plate. The gas-liquid cooling dual heat dissipation module according to claim 1, wherein under the second heat sink object is a vertical fin group with a plurality of second heat pipes passing through. The gas-liquid cooling dual heat dissipation module according to claim 1, wherein under the second heat sink object is a second heat sink with antifreeze thermal conductive agent inside, and the second heat sink passes through a transmission shaft, and the transmission shaft is left and right Each is provided with a bearing, one of the outer side of the drive shaft is connected with a force piece, and the other side is connected with a force piece. The gas-liquid cooling dual heat dissipation module according to claim 1, wherein the second heat sink object is an integrated circuit object embedded in the first coupling end, and the main board is below the second heat sink object. The gas-liquid cooling dual heat dissipation module according to claim 1, wherein the first heat sink heat pipe has an internal thread in the heat dissipation fin group, which is screwed to a fan frame, and the fan frame is assembled with a chassis and external threads. Hot surface cooling fin group, and a first circuit cooling water pipe passing through the hot surface cooling fin group, and then circling above the fan frame, the first circuit cooling water pipe is connected with a first secondary circuit cooling water pipe, and the first secondary circuit cooling The water pipe is S-shaped into a pair of radiating fins. The auxiliary radiating fins are equipped with a pair of fans. A pump is used to circulate the internal working fluid between the first circuit cooling water pipe and the first auxiliary circuit cooling water pipe. Below the second heat sink object is a second heat pipe with a hollow extending wall. The extending wall is provided with a plurality of grooves. The second heat pipe has a cold-side heat-absorbing fin group, and the cold-side heat-absorbing fin group has an internal thread and screw Connected to a fan frame, the fan frame has a chassis and external threads assembled on the cold surface heat absorption fin group, and a second cooling pipe passes through the cold surface heat absorption fin group. The gas-liquid cooling dual heat dissipation module according to claim 1, wherein the first heat sink heat pipe has an internal thread in the heat dissipation fin group, which is screwed to a fan frame, and the fan frame is assembled with a chassis and external threads. Hot surface cooling fin group, and a first circuit cooling water pipe passing through the hot surface cooling fin group, and then circling above the fan frame, the first circuit cooling water pipe is connected with a first secondary circuit cooling water pipe, and the first secondary circuit cooling The water pipe is S-shaped into a pair of radiating fins. The auxiliary radiating fins are equipped with a pair of fans. A pump is used to circulate the internal working fluid between the first circuit cooling water pipe and the first auxiliary circuit cooling water pipe. The second heat sink object is an integrated circuit object embedded in the first coupling end, and the second Below the heat sink is the motherboard.

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