TWI734238B - Classification equipment and temperature control device - Google Patents

Abstract

This creation provides a temperature control device that can be assembled in electronic component sorting equipment to compare electronic components For temperature control, the temperature control device has two jigs and a pressurizer, each of the two jigs has a temperature controller, and the pressurizer is arranged on the two jigs to apply a joining pressure to the two jigs, The two jigs are made to contact and squeeze each other, thereby increasing the temperature conductivity between the two jigs.

Description

Classification equipment and temperature control device

This creation is about a temperature control device used in electronic component testing and classification equipment, especially those who can control the temperature of electronic components during the testing and classification of electronic components.

As electronic devices continue to be applied to various devices, the quality and reliability of electronic components are also challenged. To ensure that electronic components sold on the market can operate normally in various environments, it is necessary to specify a high level after the production of electronic components is completed. , Operation test in low temperature environment to eliminate defective products.

Existing electronic component testing and classification equipment, there are already those who can control the temperature of electronic components and perform testing. For example, the TWI403732 patent uses the lower pressure head of the test classification machine to perform temperature control, and can maintain the electronic components at a predetermined test temperature. test.

Although the above-mentioned electronic component testing and classification equipment can control the temperature of electronic components, when the predetermined test temperature conditions of the electronic components are relatively strict, for example, when the test needs to be performed at -20°C or even extremely low temperature conditions of -40°C to -60°C, It will be necessary to set up two or even multiple sets of temperature controllers in the lower pressure head to achieve low-temperature targets in series for cooling or to distinguish between multiple stages and different target temperatures for control, and each set of temperature control If the temperature conduction efficiency between the devices is not good, the efficiency and accuracy of the series cooling or temperature control will be reduced, and more energy will be needed to achieve the predetermined target temperature.

Therefore, one of the purposes of this creation is to modify the crimping equipment or temperature control equipment of the electronic component testing and classification equipment, in order to improve the temperature conduction efficiency of the crimping equipment or the temperature control equipment.

In order to achieve the above and other objectives, the present invention provides a temperature control device suitable for controlling the temperature of electronic components for performing test operations. The temperature control device includes a first jig, a second jig and a pressurizer. The first jig has a first joint surface and a first temperature controller, and the first temperature controller can change the temperature of the first joint surface. The second jig has a second joint surface, a temperature control surface, and a second temperature controller, and the second temperature controller can change the temperature of the temperature control surface. The presser is driven to provide joining pressure to at least one of the first joining surface and the second joining surface, so that one of the first joining surface and the second joining surface contacts and presses toward the other. The contact surface gap is reduced, so as to increase the temperature conductivity between the first joint surface and the second joint surface.

In order to achieve the above and other objectives, the present invention also provides a crimping device suitable for performing crimping operations on electronic components and controlling the temperature of the electronic components. The crimping device includes a first jig, a second jig, and Crimping arm. The first jig has a first joint surface and a first temperature controller, and the first temperature controller can change the temperature of the first joint surface. The second jig has a second joint surface, a temperature control surface, and a second temperature controller, and the second temperature controller can change the temperature of the temperature control surface. The first jig is disposed on the crimping arm, the first jig is located between the crimping arm and the second jig, and the crimping arm can move in an operating direction to drive the first jig and the The second jig moves to make the second jig press against the electronic component; wherein when the second jig presses against the electronic component, the crimping arm drives the first jig to provide bonding to the first joint surface The pressure causes the first joint surface to contact and squeeze toward the second joint surface to reduce the contact surface gap, so as to increase the temperature conductivity between the first joint surface and the second joint surface.

In this way, the temperature control device and crimping device provided by this creation can use a pressurizer or a crimping arm to apply a joining pressure to the first jig and the second jig, thereby improving the gap between the first jig and the second jig. High temperature conductivity, and can achieve the effect of reducing energy consumption and improving the accuracy of temperature control.

This embodiment discloses a crimping device that can be assembled into a sorting device for electronic components, and further cooperates with a testing device to perform test sorting operations on the electronic components. Please refer to Figure 1. The electronic component classification equipment includes a machine 10, a feeding device 20, a receiving device 30, a conveying device 40, a crimping device 50, and a central control device 60, which can be set up and matched with a testing device 70 for common execution Testing and classification of electronic components.

The machine 10 is, for example, a platform-type rack with a working plane 11 for the feeding device 20, the receiving device 30, the conveying device 40, and the crimping device 50 to be installed on it, and the electronic components 99 are transported and performed on the working plane 11 For a predetermined test operation, the machine 10 has a test area 12 in the work plane 11 for the test equipment 70 to be installed in the test area 12 and below the test area 12.

The feeding device 20 is disposed on the working plane 11 of the machine table 10 and is provided with a tray 91 of one or several electronic components, and the tray 91 contains one to several electronic components 99 to be tested. The receiving device 30 is disposed on the working plane 11 of the machine table 10, and is used for setting one to several trays 92 that can carry the tested electronic components, and the tested electronic components 99' are contained in the tray 92. The conveying device 40 is arranged on the working plane 11 of the machine table 10 and has one to several shifters to convey electronic components. Specifically, the conveying device 40 includes pick-and-place devices 41 and 42 capable of transferring electronic components and The slide rail carrier groups 43, 44 that move the electronic components horizontally. The pick-and-place devices 41, 42 each have slide rails that can move horizontally and longitudinally. The pick-and-place device 41 can pick up the electronic components 99 from the feeding device 20, The component 99 is placed on the slide rail carrier group 43. The slide rail carrier group 43 transfers the electronic components to the side of the test area 12 to wait for testing. The electronic components that have completed the test can be removed from another slide rail carrier group 44. The side of the test area 12 is moved to the pick-and-place device 42, and the pick-and-place device 42 picks up the electronic components from the slide rail carrier group 44 and places them on the tray 92 of the receiving device 30. The crimping device 50 is arranged on the machine table 10, and the machine table 10 has a longitudinally extending drive unit 13, which can drive the crimping device 50 to move longitudinally, so that the crimping device 50 can be placed on the slide rail carrier group 43, 44 and the test area Move between 12, take the electronic components from the slide rail carrier group 43, move and crimp the test equipment 70 set in the test area 12 for testing. After the test is completed, take, move and place the electronic components on the slide. Rail carrier group 44.

In this embodiment, the crimping device 50 can be driven by the drive unit 13 to move longitudinally to move the electronic components between the slide rail carrier groups 43, 44 and the test area 12. However, if the drive unit is omitted, the slide rail is used instead. It is also feasible for the platform group to directly transport the electronic components to the test area, and use the crimping device to lift and place the electronic components.

The central control device 60 is, for example, a chip, preferably a system-on-a-chip, which is arranged on the machine 10 and is connected to the feeding device 20, the receiving device 30, the conveying device 40 and the crimping device 50, and is preloaded with control logic , And can control and integrate the actions of the feeding device 20, the receiving device 30, the conveying device 40 and the crimping device 50 to perform automated operations, and sequentially transport the electronic components contained in the feeding device 20 to the test area 12 for testing The device 70 performs the test, and then sequentially transports and accommodates the electronic components that have been tested in the receiving device 30.

Please refer to FIG. 2, the crimping device of this creation includes a crimping arm 51 and a temperature control device, and the temperature control device includes a first jig 52, a second jig 53 and a pressurizer 54.

The crimping arm 51 is a long straight rod. The temperature control device is provided at the bottom end of the crimping arm 51. A motor screw group is provided on the top of the crimping arm 51 to drive the crimping arm 51 to move up and down in the working direction, driving the temperature The control device moves up and down together, and the specific structure of the motor screw group that drives the crimping arm 51 to move up and down can refer to the patent No. TWI635551 or TWI618667, for example.

The first jig 52 in the temperature control device has its top set on the crimping arm 51 and a first joint surface 521 at the bottom. The first jig 52 includes a housing 522, a cover 523, and a first temperature controller. The cover 523 is closed on the top of the housing 522 and connected between the crimping arm 51 and the housing 522. The first joint surface 521 is located on the bottom surface of the housing 522. The first temperature controller is a cooler, including The flow channel 524 of the housing 522 is used by the user to connect the flow channel 524 to a medium supply source, such as a pump or a compressor, which can supply fluid media such as cold water or refrigerant to the flow channel 524 to reduce the first treatment. The temperature of the tool 52 is lowered, thereby changing the temperature of the first joint surface 521. In other possible embodiments of the present invention, the first temperature controller can also be changed to use hot water as the fluid medium, or the first temperature controller can be changed to other heaters or cooling chips.

It should be further explained that the change of the temperature of the first joint surface 521 means that the first joint surface 521 will be different in the case of the first temperature controller and the case without the first temperature controller. The temperature of the first thermostat is not limited to the ability of the first thermostat to actively raise or lower the temperature. If the runner 524 is omitted and a passive radiator or heat dissipating paint is used as the first thermostat, the radiator or heat dissipating paint is placed on the first thermostat. The surface of a jig can still reduce and change the temperature of the first joint surface to dissipate heat, which is a possible specific implementation of the first thermostat in this creation.

The second jig 53 is located below the first jig 52. The top of the second jig 53 has a second joining surface 531. The second joining surface 531 faces the first joining surface 521 and can contact the first joining surface 521. The bottom of the jig 53 has a temperature control surface 532. The second jig 53 includes a base 533, a second temperature controller 534 and a pressing jig 535. The second joint surface 531 is located on the top surface of the base 533. The second temperature control The second thermostat 534 and the pressing jig 535 are arranged on the base 533, and the second thermostat 534 is clamped between the base 533 and the pressing jig 535. The second thermostat 534 is, for example, a heater or a cooling device. The chip or the second temperature controller 534 can also be a cooler of the same or similar form as the first temperature controller. The temperature control surface 532 is located on the bottom surface of the pressing jig 535. The pressing jig 535 can be sucked by vacuum, for example. The electronic components are picked up and released by the method, and when the electronic components are picked up, the temperature control surface 532 touches the electronic components, so that the second thermostat 534 can heat or cool the pressing jig 535 and change the pressure of the pressing jig 535. The temperature, thereby changing the temperature of the temperature control surface 532, controls the temperature of the electronic components. In addition to the above structure, if the base 533 is changed to a ring shape and surrounds the second thermostat, or the base 533 is omitted and removed, only the second thermostat is combined with the pressing jig, and the second joint The surface is located on the top surface of the second thermostat, or the second thermostat is arranged at the bottom of the pressing jig 535, which are also feasible specific implementations of this creation.

The presser 54 is disposed on the first jig 52 and the second jig 53, to drive the second jig 53 to move to the first jig 52 to contact and press the first jig 52, so that the second joint surface 531 is in contact and Squeeze the first joining surface 521 to apply a joining pressure between the second joining surface 531 and the first joining surface 521 to reduce the contact surface gap between the second joining surface 531 and the first joining surface 521; in more detail , The pressurizer 54 includes a drive unit 541 and a connecting member 542. The drive unit 541 is, for example, a pneumatic cylinder or a motor screw group, which can receive air The connecting member 542 is driven by pressure or electric power to move. The driving unit 541 is disposed on the housing 522 of the first jig. The connecting member 542 is disposed on the base 533 of the second jig. The tool 53 moves closer to or away from the first tool 52, and the driving unit 541 can continue to apply pressure to the first tool 52 after the second bonding surface 531 contacts the first bonding surface 521, so as to contact the first bonding surface 521 and the second bonding surface 521. The bonding surface 531 applies bonding pressure. In other possible embodiments of the present invention, the driving unit may be arranged on the base and the connecting member may be arranged on the housing, and still have the same use function as this embodiment.

Please refer to Figures 3 to 5, the drive unit 541 can drive the connecting member 542 and the second jig to move, so that the second joint surface 531 and the first joint surface 521 contact, because the surface of the object is rough and undulating on a microscopic scale. Uneven surface. Although the first joint surface 521 and the second joint surface 531 are in contact, there will still be many surface gaps. As shown in Figure 4, the surface gaps are like many small air chambers, which are blocked from the first joint surface. 521 and the second joint surface 531, so that the temperature conductivity between the first joint surface 521 and the second joint surface 531 is poor, that is, the thermal conductivity is low; the driving unit 541 pairs the connecting member 542 and the second jig After the pressure continues to be applied, the bonding pressure will be applied between the first bonding surface 521 and the second bonding surface 531, and the surfaces of the first bonding surface 521 and the second bonding surface 531 will be slightly deformed at a microscopic scale. As shown in Figure 5, the contact area between the first joint surface 521 and the second joint surface 531 is increased in the microscopic scale, thereby increasing the temperature conduction between the first joint surface 521 and the second joint surface 531 Rate, that is, increase the thermal conductivity.

Thereby, when the crimping device takes the electronic components and crimps them for testing, the temperature control device can be used to control the temperature of the electronic components. The temperature control device is composed of a first temperature controller, a first joint surface, a second joint surface, a second temperature controller and a temperature control surface in series to form a heat flow path, and the second jig is driven by the pressurizer to move and contact the first jig , And provide bonding pressure to the first bonding surface and the second bonding surface, so that the temperature conductivity between the first bonding surface and the second bonding surface is improved; the first temperature controller can be a cooler with a larger power, using a refrigerant And other medium to cool the first joint surface, and through the gap between the first joint surface and the second joint surface The second thermostat can use a cooler or refrigerating chip with less power to cause the temperature difference between the connecting piece and the lower pressure jig to cause the lower pressure The fixture is further cooled, so that the temperature control surface is cooled down, and the temperature of the electronic components is controlled.

When the electronic component reaches the target temperature, if the electronic component needs to be controlled to another temperature, for example, the temperature of the low-temperature electronic component after the test is raised to avoid condensation, the second temperature controller can be a heater or a cooling chip. Use the second thermostat to heat the pressing tool, or control the temperature difference between the connector and the pressing tool, and control the temperature control surface to another predetermined target temperature. At this time, the pressurizer can be controlled to release The bonding pressure reduces the temperature conductivity of the first bonding surface and the second bonding surface, or even controls the movement of the second jig to separate the first bonding surface from the second bonding surface, returning to the state shown in Figure 3 As shown in Figure 2, the second temperature controller alone controls the temperature of the temperature control surface and the temperature of the electronic components to reduce the low temperature effect of the first fixture.

Using the above device, the temperature control device can provide a higher power cooling effect by the first temperature controller, and then the second temperature controller performs a slight temperature control, and the first joint surface and the second joint surface The temperature conductivity is increased by the bonding pressure, which can ensure that the temperature of the first thermostat is reliably and efficiently transferred to the temperature control surface through the heat flow path, and becomes a reliable, efficient and accurate temperature control device.

In the above-mentioned embodiment, the first jig and the second jig can be separated from each other by connecting with the presser, but if the second jig is arranged on the first jig, the first joint surface and the second joint If the surfaces cannot be separated, a pressurizer can still be used to apply the bonding pressure between the first bonding surface and the second bonding surface, thereby increasing the temperature conductivity between the first bonding surface and the second bonding surface. Similar use effect.

Please refer to Fig. 6, the second embodiment of this creation also discloses a crimping device whose structure is roughly the same as that of the above-mentioned first embodiment, except that the crimping arm 51 has a frame 511 at the bottom end, and the second The jig 53 is fixed to the frame body 511. The first jig 52 is located above the second jig 53, and the second jig 53 further includes one or more elastic members 536. The elastic members 536 protrude upward from the second joint surface 531. The first joint surface 521 of the first jig comes out and abuts against the first joint surface 521, the elastic member 536 provides elastic force to separate the first joint surface 521 from the second joint surface normally; Between the bodies 511, an elastic diaphragm 543 is included. The periphery of the elastic diaphragm 543 is attached to the frame body 511 or the first jig 52 to form a closed air chamber 544, which can be connected with a pneumatic drive unit to close the air chamber 544 expands and supports between the frame body 511 and the first jig 52, pushes down the first jig 52, causes the first joint surface 521 to contact and press the second joint surface 531, and the first joint The bonding pressure is provided between the surface 521 and the second bonding surface 531, which can achieve a similar use effect as the first embodiment described above.

In the above-mentioned second embodiment, the second jig includes an elastic member 536, which can provide elastic force to separate the first jig from the second jig, but if the elastic member 536 is omitted, the elastic film is bonded to the first jig. It is also feasible to use air pressure to drive the closed air chamber 544 to contract the tool 52 to move the first tool 52 upward.

Please refer to Fig. 7, the third embodiment of the present creation also discloses a crimping device whose structure is roughly the same as that of the aforementioned first embodiment, except that the pressurizer 54 is omitted, and the crimping arm 51 further includes a body and The pusher 55 is connected between the body of the crimping arm 51 and the first jig 52. Specifically, the pusher 55 is, for example, a pneumatic cylinder and its push rod, an inflatable airbag, or as described above In the elastic diaphragm described in the second embodiment, the second fixture additionally has one or more guide rods 537 and elastic members 538. The guide rods 537 extend upward from the base 533 and slidably penetrate through the first fixture 52, The second jig 53 can move relative to the first jig 52, and the elastic member 538 is clamped between the housing 522 and the base 533, so that the second jig 53 is normally separated from the first jig 52.

Please refer to Figures 7 and 8, when the crimping device takes the electronic component 99 and crimps it to the test equipment 70, the crimping arm 51 drives the first jig 52 and the second jig 53 to move down and press against Yu Electronic Yuan The component 99 and the test equipment 70 will cause the second jig 53 to be pushed by the electronic component 99 and move relative to the first jig 52, so that the second joint surface is in contact with the first joint surface, and then the pusher 55 is restarted. The bonding pressure is further provided, and the first jig 52 is pushed downward to apply the bonding pressure between the first bonding surface and the second bonding surface, and the use effect similar to the foregoing first embodiment can be obtained.

In the above third embodiment, the elastic member 538 can provide elastic force to the second jig 53 so that the second jig 53 is normally separated from the first jig 52. However, if the elastic member 538 is omitted, the second jig 53 can be used instead. It is also feasible for the weight of the tool 53 to cause the second tool 53 to move downward under the influence of gravity to separate from the first tool 52.

In the third embodiment described above, the first jig 52 can be pushed downward by the pusher 55 to provide the joining pressure. However, if the pusher 55 is omitted, and when the crimping arm 51 moves up and down, the crimping arm body Or the motor screw group of the crimping arm provides the joining pressure for pushing downwards.

It should be further explained that the bonding pressure provided by the crimping arm or the pusher will not only act on the first bonding surface and the second bonding surface, but may also be transmitted downward and act on the electronic components. In order to prevent the bonding pressure from damaging the electronic components For components, stoppers can be set around the electronic components or around the test area to block the second jig, or the bonding pressure can be controlled to be less than the compressive failure strength of the electronic components. Preferably, the bonding pressure is within the compressive failure resistance of the electronic components The strength is between 0.3 and 1 times, and preferably, the bonding pressure is between 0.5 and 1 times the compressive failure strength of the electronic component.

Please refer to Figure 9. The fourth embodiment of the present creation also discloses a crimping device whose structure can be inherited from any one of the first to third embodiments or a combination thereof, except that the first fixture 52 and the second fixture Each tool 53 includes a conductive layer 525, 539. The conductive layer 525 of the first tool is disposed on the bottom surface of the housing 522. The first joint surface 521 is located on the bottom surface of the conductive layer 525 of the first tool. The layer 539 is disposed on the top surface of the base 533, and the second bonding surface 531 is located on the top surface of the conductive layer 539 of the second jig. In other words, the conductive layers 525, 539 of the first jig and the second jig are, for example, a thermally conductive sheet, a thermally conductive glue, or a soft interface thermally conductive material. The thermally conductive sheet refers to a sheet with better temperature conductivity, such as a copper sheet or Graphite sheet, soft interface thermally conductive material refers to a thermally conductive material with better elasticity or ductility, such as an indium sheet, whereby when the first bonding surface 521 is in contact with the second bonding surface 531 and is squeezed by the bonding pressure, it can be used The conductive layers 525 and 539 further improve the temperature conductivity between the first jig and the second jig, and have similar functions as the first embodiment described above.

In the above-mentioned fourth embodiment, both the first jig and the second jig have a conductive layer, but it is OK if only one of the first jig and the second jig has a conductive layer.

In this embodiment, the conveying device 40 conveys the electronic components from the feeding device 20 to the crimping device 50. After the test is completed, the electronic components are conveyed from the crimping device to the receiving device 30. Other possible implementations in this creation In the example, it is also possible to additionally set a temporary stage on the working plane of the machine, for the conveying device to transport the electronic components to be tested from the feeding device to the temporary stage in advance, and the temporary stage will pre-heat the electronic components or Cool down, and then transport the electronic components to the crimping device.

In view of the above, the temperature control device in the foregoing embodiment is installed in the crimping device to control the temperature of the electronic components during the crimping and testing operations. However, if the temperature control device is installed in the above temporary Place the stage or the slide rail stage group, and control the temperature of the electronic components before or after the crimping and test operations, or in any two of the crimping device, the temporary stage and the slide rail stage group Or all of them are equipped with temperature control devices, which is feasible.

To sum up, the crimping device and its temperature control device of this creation can apply bonding pressure between two sets of jigs with their own thermostats, improve the temperature conductivity between the two sets of jigs, and perform accurate and precise Efficient temperature control is really what the relevant industry hopes for, but the above embodiments are only to illustrate and illustrate the technical content of this creation. The patent scope of this patent shall prevail in the scope of the patent application described later.

Machine 10 Operating plane 11 Test area 12 Drive unit 13 Feeding device 20 Receiving device 30 Conveyor 40 Pick and place 41, 42 Slide rail carrier group 43, 44 Crimping device 50 Crimping arm 51 Frame 511 The first fixture 52 First joint surface 521 Shell 522 Lid 523 Runner 524 Conductive layer 525 To The second fixture 53 Second joint surface 531 Temperature control surface 532 Base 533 Second thermostat 534 Down pressure fixture 535 Elastic 536 Guide rod 537 Elastic 538 Conductive layer 539 Pressurizer 54 Drive unit 541 Connector 542 Elastic diaphragm 543 Closed air chamber 544 Pusher 55 Central control unit 60 Test equipment 70 Reel 91 Reel 92 Electronic components 99, 99’

Figure 1 is a schematic top view of the classification device according to the first embodiment of the creation.

Figure 2 is a schematic cross-sectional view of the temperature control device of the first embodiment of the creation.

Figure 3 is a schematic diagram of the use state of the temperature control device of the first embodiment of the creation.

Figure 4 is a schematic cross-sectional view of the first joint surface and the second joint surface of the temperature control device of the first embodiment of the creation.

Figure 5 is a schematic cross-sectional view of the first joint surface and the second joint surface where the temperature control device of the first embodiment of the invention applies the joint pressure.

Figure 6 is a schematic cross-sectional view of the temperature control device of the second embodiment of the creation.

Figure 7 is a schematic cross-sectional view of the temperature control device according to the third embodiment of the creation.

Figure 8 is a schematic diagram of the use state of the temperature control device of the third embodiment of the creation.

Figure 9 is a schematic cross-sectional view of the temperature control device of the fourth embodiment of the creation.

51: crimping arm

52: The first fixture

521: first joint surface

522: Shell

523: Lid

524: Runner

53: Second Fixture

531: second joint surface

532: Temperature Control Surface

533: Pedestal

534: second thermostat

535: Down Pressure Fixture

54: Pressurizer

541: drive unit

542: link

Claims (7)

A temperature control device suitable for controlling the temperature of electronic components for performing test operations. The temperature control device includes a first jig having a first joint surface, the first jig further having a first temperature controller, and the first jig A thermostat can change the temperature of the first joint surface; the second jig has a second joint surface and a temperature control surface, and the second jig also has a second thermostat that can change the The temperature of the temperature control surface; a pressurizer, driven to provide bonding pressure to at least one of the first bonding surface and the second bonding surface, so that one of the first bonding surface and the second bonding surface faces the other One contacts and squeezes to reduce the contact surface gap, so as to increase the temperature conductivity between the first joint surface and the second joint surface; wherein one of the first jig and the second jig can be opposed to The other moves to make the first joint surface contact or separate from the second joint surface, and the presser provides the joint pressure when the first joint surface contacts the second joint surface, so that the first joint One of the surface and the second joint surface is pressed toward the other; wherein the pressurizer includes a driving unit and a connecting member, the driving unit is disposed on one of the first jig and the second jig, the The connecting piece is arranged on the other of the first jig and the second jig, and the driving unit can be driven to drive the connecting piece to move relative to the driving unit. The temperature control device according to the first item of the patent application, wherein the pressurizer includes an elastic diaphragm, the elastic diaphragm encloses a closed air chamber, and the closed air chamber is connected to a pneumatic drive unit for the first treatment Or the second jig to apply the joining pressure. As for the temperature control device described in item 1 of the scope of patent application, the driving unit is a pneumatic cylinder or a motor screw group. The temperature control device according to claim 1, wherein at least one of the first jig and the second jig includes a conductive layer, and the conductive layer is located between the first temperature controller and the second temperature controller Between the devices, the conductive layer is a thermal conductive sheet, a thermal conductive glue or a soft interface thermal conductive material. The temperature control device described in item 1 of the scope of patent application, wherein the first temperature controller is a cooler, and the second temperature controller is a heater, a cooling chip or a cooling power lower than that of the first temperature controller Device. The temperature control device described in item 1 of the scope of the patent application, wherein the electronic component has a compressive breaking strength, and the bonding pressure is between 0.3 times and 1 time of the compressive breaking strength, or 0.5 times to 1 times between. A sorting device for setting test equipment to perform test sorting operations on electronic components, the test device for accommodating the electronic components for testing, the sorting device includes: a machine, having a test area, the test area for setting the test equipment ; The feeding device is configured in the machine, the feeding device has at least one feeding holder, and the feeding holder is used to hold the electronic components to be tested; the receiving device is arranged in the machine, and the receiving The material receiving device has at least one receiving holder for accommodating the electronic components that have been tested; a crimping device arranged on the machine to perform crimping operations on the electronic components contained in the testing equipment; The device is arranged on the machine, the conveying device has at least one conveyor, and the conveyor is used in at least two of the feeding device, the receiving device, the crimping device, and the test area Electronic components are transported between; such as the temperature control device described in any one of items 1 to 6 in the scope of the patent application, the temperature control device is provided at at least one of the crimping device, the conveying device, and the machine; the center The control device is connected to control and integrate the actions of the feeding device, the receiving device and the crimping device.

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