TWI734002B - Carrier for electronic component testing device - Google Patents

Abstract

[ Problem ] To provide a carrier for an electronic component testing device, which can sufficiently apply tension to the sheet on which the electronic component to be tested is placed, and can ensure the position accuracy of the electronic component to be tested on the sheet. [ Solution ] is a component carrier 710 holding IC components with a plurality of terminals HB protruding from the bottom surface on the IC socket 50 provided in the electronic component testing device. The IC component is placed such that the plurality of terminals HB protrude toward the IC socket 50 side; and the core body 740 is set on the test tray TST carried in the electronic component testing device, and the film 750 is fixed by a plurality of shim 749 The outer peripheral portion 750A; the shim 749 includes: the trunk portion 7491 protruding from the core body 740; and the head 7492, which is set at the front end of the trunk portion 7491 and has a larger diameter than the trunk portion 7491; the film 750 includes : The opening 751 into which the trunk portion 7491 fits; and the slit 7513 is formed in the area of the edge of the opening 751 that is closer to the inner periphery of the film 750 than the center of the opening 751, and at the edge of the opening 751 The region closer to the outer peripheral side of the film 750 than the center of the opening 751 is not formed.

Description

Carrier for electronic component testing device

The invention relates to a carrier for an electronic component testing device.

As a carrier for electronic component testing equipment that transports electronic components under test such as BGA (Ball Grid Array) type IC packages to electronic component sockets for quality inspection, etc., it is known that the electronic component under test is seated The seat part of the tester is formed with a through hole for exposing the contact part (terminal) of the electronic component under test in the direction of the contact terminal of the socket for the electronic component. The outer peripheral part is fixed to the carrier body (for example, refer to Patent Document 1). In the carrier for an electronic component testing device described in Patent Document 1, a film-like sheet of polyimide or the like constitutes a seating portion, and the film-like sheet is laid on the lower part of the carrier body. [Prior Patent Document] [Patent Document]

[Patent Document 1] JP 2010-156546 A

[The problem to be solved by the invention]

The carrier for the electronic component testing device described in Patent Document 1 needs to apply sufficient tension to the film-like sheet to ensure the flatness of the film-like sheet or the positional accuracy of the through-holes, and to ensure the film-like shape The position accuracy of the tested electronic components on the sheet,

The problem to be solved by the present invention is to provide a carrier for an electronic component testing device, which can sufficiently apply tension to the sheet on which the electronic component to be tested is placed, and can ensure the position of the electronic component to be tested on the sheet Accuracy. [Means to solve the problem]

[1] The carrier for the electronic component testing device of the present invention holds a plurality of terminals protruding from the bottom surface of the electronic component under test on the socket provided in the electronic component testing device, and includes: a sheet, which constitutes the carrier The bottom part, and the electronic component under test is placed such that the plurality of terminals protrude toward the socket side; and the body part is set on the tray carried in the electronic component testing device, and the plurality of shim pieces are used to fix the The outer periphery of the thin sheet; the shim includes: a trunk protruding from the main body; and a head, which is arranged at the front end of the trunk and has a larger diameter than the trunk; the thin sheet includes: the The opening into which the trunk part is fitted; and the slit is formed in the area of the edge of the opening that is closer to the inner periphery of the sheet than the center of the opening, and the edge of the opening is larger than the edge of the opening The region whose center is closer to the outer peripheral side of the sheet is not formed.

[2] In this invention, the trunk may be configured to include: a semicircular trunk outer peripheral portion formed in an area of the trunk that is closer to the outer periphery of the sheet than the center; and a semicircular shape The inner peripheral side portion of the trunk is formed in the area of the trunk that is closer to the inner peripheral side of the sheet than the center, and the diameter is smaller than the outer peripheral portion of the trunk; the opening includes: the outer peripheral portion of the opening, The opening is formed in a semicircular shape in an area closer to the outer peripheral side of the sheet than the center, and the outer peripheral part of the trunk is fitted; and the inner peripheral part of the opening is formed in a semicircular shape in the opening The area closer to the inner peripheral side of the sheet than the center, and the inner peripheral part of the trunk is fitted; the slit is formed at the edge of the inner peripheral part of the opening, and at the edge of the outer peripheral part of the opening Department is not formed.

[3] In this invention, the trunk may be configured such that the trunk includes: a semicircular trunk outer peripheral portion formed in an area of the trunk that is closer to the outer periphery of the thin sheet than the center; and a semicircular The inner peripheral part of the trunk is formed in the area of the trunk closer to the inner peripheral side of the sheet than the center, and has a larger diameter than the outer peripheral part of the trunk; the opening includes: an opening outer peripheral part, The opening is formed in a semicircular shape in an area closer to the outer peripheral side of the sheet than the center, and the outer peripheral part of the trunk is fitted; and the inner peripheral part of the opening is formed in a semicircular shape in the The area of the opening that is closer to the inner circumference of the sheet than the center of the opening, and the inner circumference of the trunk is fitted; the slit is formed at the edge of the inner circumference of the opening and the outer circumference of the opening The boundary portion of the edge portion and the edge portion of the inner peripheral portion of the opening are not formed at the edge portion of the outer peripheral portion of the opening.

[4] In this invention, the sheet may be in a state in which tension is applied, and the outer peripheral portion may be fixed to the main body by the plurality of shimming sheets.

[5] In this invention, the bottom surface of the main body may also be configured to form an inclined surface so as to be inclined from the inner peripheral side to the outer peripheral side of the bottom surface to the high side; the plurality of shim pieces are formed on the inclined surface. [Effects of the invention]

According to the present invention, since the edge of the opening outer peripheral portion of the sheet can be reliably suspended on the trunk of the shim, sufficient tension can be applied to the sheet, and the electronic components to be tested on the sheet can be ensured The location accuracy.

Hereinafter, an embodiment of the present invention will be described based on the drawings. Fig. 1 is a schematic cross-sectional view showing an electronic component testing device using a component carrier according to an embodiment of the present invention. Fig. 2 is a perspective view showing the electronic component testing device of Fig. 1. Fig. 3 is a schematic diagram for explaining the transfer of the tray of the electronic component testing device in Fig. 1 and Fig. 2.

The electronic component testing device shown in Figure 1 and Figure 2 applies high temperature or Low temperature thermal stress, and use the test head 5 and the tester 6 to test (check) whether the IC component operates properly in this state. Moreover, this electronic component testing device classifies IC components based on the test results.

In the electronic component testing device, a plurality of IC components to be tested are mounted on the customized tray KST (refer to Fig. 5). In addition, in the processor 1 of the electronic component testing device, a pallet KST cycle is ordered (refer to Fig. 6). IC components are transferred from the customized tray KST to the test tray TST and then tested. In addition, the IC element is represented by the symbol IC in the figure.

As shown in Fig. 1, a space 8 is provided in the lower part of the processor 1, and a test head 5 is arranged in this space 8. An IC socket 50 is provided on the test head 5, and the IC socket 50 is connected to the tester 6 via a cable 7.

In this electronic component testing device, the IC component mounted on the test tray TST is in contact with the IC socket 50 on the test head 5 to be electrically connected, the IC component in this state is supplied with an electrical signal, and then according to the output from the tester 6 The signal, test (inspect) IC components. In addition, when the type of IC component is changed, the IC socket 50 and the core 730 described later are replaced with those suitable for the shape or the number of pins of the IC component.

As shown in FIGS. 2 and 3, the processor 1 includes a storage unit 200, a loading unit 300, a testing unit 100, and an unloading unit 400. The storage unit 200 stores IC components before or after the test. The loading unit 300 transfers the IC components transferred from the storage unit 200 to the testing unit 100. The test unit 100 is configured such that the IC socket 50 of the test head 5 faces the inside. The unloading unit 400 classifies the tested IC components that have been tested in the testing unit 100.

Fig. 4 is an exploded perspective view showing the IC storage used in the above-mentioned electronic component testing device. Fig. 5 is a perspective view showing a customized tray used in the above-mentioned electronic component testing device. As shown in FIG. 4, the storage unit 200 includes a pre-test storage 201 and a test-complete storage 202. The pre-test storage 201 is a customized tray KST for storing IC components before the test. After the test, the storage 202 stores a customized tray KST for storing IC components classified according to the test results. The pre-test storage 201 and the completed storage 202 include a frame-shaped tray support frame 203 and an elevator 204 that enters from the lower part of the tray support frame 203 and lifts upward. In the tray support frame 203, a plurality of customized trays KST are stacked. The stacked customized pallets KST are moved up and down by the elevator 204. In addition, as shown in Fig. 5, the customized tray KST includes a plurality of recessed receiving portions for accommodating IC components. The plurality of accommodating parts are arranged in a plurality of rows and rows (for example, 14 rows and 13 rows). In addition, the pre-test storage 201 and the completed storage 202 have the same structure.

As shown in Figures 2 and 3, in the pre-test storage warehouse 201, two storage warehouses STK-B and two empty tray storage warehouses STK-E are set up. The two storage warehouses STK-B are adjacent to each other. Beside the two storage warehouses STK-B, the two empty tray storage warehouses STK-E are adjacent to each other. The empty tray storage STK-E is an empty customized tray KST which is stacked and transferred to the unloading part 400.

Next to the pre-test storage 201, a tested storage 202 is set. After testing the storage 202 here, 8 storages STK-1, STK-2,..., STK-8 are set up. After the test, the storage 202 is configured to classify and store the tested IC components into 8 types at most in response to the test results. For example, the tested IC components are in the storage 202 after the test. In addition to being classified into good and defective products, they can also be classified into good products with high-speed operation, good products with medium-speed operation speed, and low-speed operation speed. Good products may be classified into defective products that need to be re-tested and defective products that do not need to be re-tested.

As shown in FIG. 2, a tray transfer arm 205 is provided between the storage unit 200 and the device base 101, and this tray transfer arm 205 transfers the customized tray KST from the lower side of the device base 101 to the loading unit 300. Here, in the device base 101, a pair of window portions 370 are formed. The pair of window portions 370 arranges the customized tray KST transferred from the lower side of the device base 101 to the loading portion 300 by the tray transfer arm 205 so as to face the upper surface of the device base 101.

The loading unit 300 includes a component transport device 310. The component handling device 310 includes two rails 311, a movable arm 312, and a movable head 320. The two rails 311 are erected on the device base 101. The movable arm 312 reciprocates between the test tray TST and the customized tray KST along the two rails 311. In addition, the moving direction of the movable arm 312 is referred to as the Y direction. The movable head 320 is supported by the movable arm 312 and moves in the X direction. On the movable head 320, a plurality of suction pads (not shown) are mounted downward.

The component conveying device 310 moves the movable head 320, which has adsorbed a plurality of IC components by a plurality of suction pads, from the order tray KST to a position corrector 360. Thereby, the IC components are transferred from the order tray KST to the position corrector 360. Next, the component transport device 310 is attached to the position corrector 360, and the positional relationship between the IC components is corrected by the movable arm 312 and the movable head 320. Then, the component transport device 310 transfers the IC components to the test tray TST stopped in the loading unit 300. Thereby, the IC components are transferred from the customized tray KST to the test tray TST.

As shown in FIG. 2 and FIG. 3, the test unit 100 includes a temperature environment chamber 110, a test chamber 120, and a normal temperature recovery chamber 130. The temperature environment chamber 110 applies high temperature or low temperature thermal stress for the purpose of IC components mounted on the test tray TST. The test chamber 120 presses the IC component that is thermally stressed in the temperature environment chamber 110 against the test head 5. The room temperature recovery chamber 130 removes thermal stress from the IC components that have been tested in the test chamber 120.

When a high temperature is applied to the IC element in the temperature environment chamber 110, the IC element is cooled to room temperature by blowing air in the normal temperature recovery chamber 130. On the other hand, when a low temperature is applied to the IC element in the temperature environment chamber 110, the IC element is heated in the normal temperature recovery chamber 130 by warm air or a heater to a temperature at which condensation does not occur.

As shown in FIG. 2, the temperature environment chamber 110 and the normal temperature recovery chamber 130 protrude upwardly than the test chamber 120. Also, as shown schematically in Figure 3, a vertical conveying device is installed in the temperature environment room 110, the first test tray TST exists between the test chambers 120, and the subsequent test trays TST are vertically conveyed by the device. Stand by in a supported state. The IC components mounted on the subsequent test trays TST are subjected to high temperature or low temperature thermal stress during standby.

In the center of the test chamber 120, a test head 5 is arranged. The test tray TST is transferred onto the test head 5. In the center of the test chamber 120, the terminal HB of the IC component mounted on the test tray TST (refer to Figs. 16 and 17) and the terminal 51 of the IC socket 50 on the test head 5 (refer to Figs. 16 and 17) Figure) Contact and test IC components. The test tray TST mounted on the tested IC component is transferred to the room temperature recovery room 130. In the room temperature recovery room 130, the IC components after the test are deheated to room temperature. The test tray TST mounted on the IC component that has been deheated is carried out to the unloading unit 400.

In the upper part of the temperature environment chamber 110, an entrance for carrying the test tray TST from the device base 101 into the temperature environment chamber 110 is formed. On the other hand, in the upper part of the normal temperature recovery chamber 130, an outlet for carrying out the test tray TST from the normal temperature recovery chamber 130 to the device base 101 is formed.

As shown in FIG. 2, the pallet conveying device 102 is installed on the device base 101. The tray transfer device 102 transfers the test tray TST from the device base 101 into the temperature environment chamber 110 and unloads the test tray TST from the normal temperature recovery room 130 to the device base 101. This pallet conveying device 102 is constituted by, for example, a rotating roller or the like.

After the test tray TST is transferred from the normal temperature recovery room 130 to the device base 101 by the tray transfer device 102, all the IC components mounted on the test tray TST are transferred by the component transfer device 410 (described later) to correspond to the test result The customized pallet KST. Then, the test tray TST is transferred to the temperature environment chamber 110 via the unloading unit 400 and the loading unit 300.

As shown in FIG. 2, two component transport devices 410 are installed in the unloading unit 400. The component transport device 410 has the same structure as the component transport device 310 installed in the loading section 300. The two component transport devices 410 transfer the tested IC components from the test tray TST existing in the device base 101 to the customized tray KST corresponding to the test result.

Two pairs of window parts 470 are formed on the device base 101. The two pairs of window parts 470 are arranged so that the ordered tray KST transferred to the unloading part 400 faces the upper surface of the device base 101. An unshown elevating workbench is installed under the two pairs of windows 470 and the above-mentioned window 370. This lifting table lowers the customized tray KST mounted on the tested IC components and transfers it to the tray transfer arm 205.

Fig. 6 is a perspective view showing the test tray TST. As shown in FIG. 6, the test tray TST includes a rack 700 and a plurality of component carriers 710. The rack 700 includes a rectangular outer frame 701 and an inner frame 702 arranged in a lattice shape within the outer frame 701. The frame 700 includes a rectangular opening 703 that is divided into a plurality of columns and rows by an outer frame 701 and an inner frame 702.

The plural component carriers 710 are arranged in plural columns and plural rows. Each component carrier 710 is arranged to correspond to each opening 703 of the rack 700. The component carrier 710 includes a main body 720 and a plurality of cores 730 (for example, 4 as shown in FIG. 6). The main body 720 is a rectangular plate-shaped resin molded body, and a plurality of rows (two rows and two rows in this embodiment) form rectangular openings 721 having the same number (four in this embodiment) as the core 730.

The plural bodies 720 are arranged on the lower side of the rack 700 in plural rows and plural rows. The main body 720 located on the outermost ring is arranged such that its outer periphery overlaps with the outer frame 701 or the inner frame 702, and the plurality of openings 721 overlap with the openings 703 of the frame 700. On the other hand, the other main body 720 is arranged so that its outer periphery overlaps with the inner frame 702, and a plurality of openings 721 overlap with the openings 703 of the frame 700. These plural bodies 720 are fixed to the intersection of the outer frame 701 and the inner frame 702 and the intersection of the inner frame 702 in the frame 700.

Fig. 7 is an enlarged perspective view showing a part of the test tray TST. As shown in FIG. 7, the core 730 is detachably attached to the main body 720. The core 730 is configured to correspond to each opening 721. In addition, the main body 720 is installed so as to be capable of fine movement (swimming) in a plane (in the XY plane in FIG. 7). The core 730 includes a core body 740 and a film 750. The core body 740 is a resin molded body in which a rectangular opening (through hole) 741 is formed. A plurality of claw portions 742 and a plurality of guide portions 743 are formed on the outer peripheral portion of the core body 740. The main body 720 is formed with an engagement portion (not shown) to which the claw portion 742 is engaged, and a guide groove 722 into which the guide portion 743 is inserted. The core body 740 is supported by the body 720 through the engagement of the claw portion 742 with the engaging portion. When the core body 740 is mounted on the body 720, the guide portion 743 is inserted into the guide groove 722, and the core body 740 is pressed into the opening 721, whereby the claw portion 742 can be engaged with the engaging portion. On the other hand, by releasing the engagement between the claw portion 742 and the engaging portion, the core body 740 can be detached from the body 720.

Here, the engagement between the claw portion 742 and the engagement portion, and the engagement between the guide portion 743 and the guide groove 722 do not fix the core body 740 and the body 720, but allow the core body 740 and the body 720 to be relatively different. Fretting (swimming) in the plane. Thereby, as described later, the relative positioning of the core 730 and the IC socket 50 can be performed.

The film 750 is a rectangular film-shaped resin molded body. By fixing the outer peripheral portion of the film 750 to the bottom of the core body 740, the film 750 constitutes the bottom of the core 730. IC components are placed on this film 750.

Fig. 8 is a perspective view showing the core 730 from the bottom side. Fig. 9 shows a bottom view of the core 730. FIG. 10 is a plan view showing the core 730. As shown in FIG. FIG. 11 is a front view of the core 730. As shown in FIG. FIG. 12 shows a side view of the core 730. As shown in FIG. Figure 13 is the section 13-13 of Figure 9. Fig. 14 is an enlarged cross-sectional view showing a part of Fig. 13. As shown in these figures, the core body 740 includes a rectangular ring-shaped frame portion 744 forming the aforementioned opening 741, a pair of positioning plates 745 and 746, and a pair of rod receiving portions 747 and 748.

A plurality of shimming pieces 749 are provided on the bottom surface (lower end surface) of the frame portion 744. The shim 749 is provided at the four corners of the bottom surface of the frame 744 and each side of the bottom surface of the frame 744. A plurality of pieces (for example, two pieces as shown in the figure) shimming pieces 749 are provided on each side of the bottom surface of the frame portion 744. In contrast, in the outer peripheral portion 750A of the film 750, a plurality of openings 751 are formed so as to correspond to the positions of the shim 749. Each shim 749 includes a trunk portion 7491 (refer to FIG. 14) having a circular cross-sectional shape, and a head 7492 having a circular cross-sectional shape. The torso portion 7491 protrudes downward from the bottom surface of the frame portion 744 and is inserted through the opening 751 of the film 750. The head 7492 is larger in diameter than the trunk 7491 and the opening 751, and widens in the radial direction from the front end (lower end) of the trunk 7491. Thereby, the bottom surface of the head 7492 and the frame 744 sandwich the outer peripheral portion 750A of the film 750. In addition, the details of the structure of the outer peripheral portion 750A of the film 750, the bottom surface of the frame portion 744, and the shim 749 will be described later.

The positioning plate 745 is arranged on the upper end of the first side wall 7441 of the frame 744. The other positioning plate 746 is provided on the upper end of the second side wall 7442 of the frame 744. The first side wall 7441 and the second side wall 7442 face each other. The positioning plate 745 protrudes from the upper end of the first side wall 7441 to the opposite side of the opening 741, and the other positioning plate 746 protrudes from the upper end of the second side wall 7442 to the opposite side of the opening 741. A pair of guide parts 743 are provided on the upper surfaces of the positioning plates 745 and 746, respectively.

Claws 742 are provided at one end and the other end of the positioning plates 745 and 746 in the longitudinal direction, respectively. That is, the four claws 742 are arranged on the diagonal of the opening 741. A pair of claw portions 742 arranged at the diagonal corners are arranged to be opposite to each other. On the other hand, the claw portions 742 adjacent to each other are arranged such that the directions differ by only 90°.

The positioning plates 745 and 746 are rectangular plate bodies. The direction along the first side wall 7441 and the second side wall 7442 is defined as the longitudinal direction, and the direction orthogonal to the first side wall 7441 and the second side wall 7442 is defined as the width direction. At the center of the positioning plate 745 in the longitudinal direction, a positioning hole 7451 is formed, and at the center of the positioning plate 746 in the longitudinal direction, a positioning hole 7461 is formed. The positioning hole 7451 is a circular through hole. On the other hand, the positioning hole 7461 is an elliptical through hole. The length direction of the positioning hole 7461 is consistent with the width direction of the positioning plate 746. The core 730 is positioned in the IC socket 50 by inserting the positioning pin 55 described later into the positioning hole 7451 and inserting the positioning pin 56 described later into the positioning hole 7461.

The rod accommodating portion 747 is provided on the third side wall 7443 of the frame portion 744. The other rod receiving portion 748 is provided on the fourth side wall 7444 of the frame portion 744. The third side wall 7443 and the fourth side wall 7444 are opposed to each other. The lower part of the rod accommodating part 747 is provided so as to protrude from the third side wall 7443 to the opposite side of the opening 741. The rod accommodating part 747 is formed in a rectangular box shape, and the rod 760 is accommodated inside. The lower part of the other rod accommodating part 748 is provided so as to protrude from the fourth side wall 7444 to the opposite side of the opening 741. The rod accommodating part 748 is formed in a rectangular box shape, and the rod 761 is accommodated inside. The rod 760 has the same structure as the rod 761, and is arranged symmetrically.

At the center of the third side wall in the width direction, an opening 7443A is formed. In addition, an opening 747A is formed in the central part of the lower part of the rod accommodating part 747 in the horizontal direction. On the other hand, an opening 7444A is formed in the center portion of the fourth side wall in the width direction. In addition, an opening 748A is formed in the center part of the lower part of the rod accommodating part 748 in the horizontal direction. The rod 760 accommodated in the rod accommodating portion 747 is configured to be able to advance and retreat to the opening 741 through the opening 7443A. The rod 760 receives an external force through the opening 747A, thereby retreating from the opening 741 into the rod receiving portion 747, and by removing the external force, advances into the opening 741 through the opening 7443A. On the other hand, the rod 761 accommodated in the rod accommodating portion 748 is configured to be able to advance and retreat to the opening 741 through the opening 7444A. The rod 761 receives an external force through the opening 748A, thereby retreating from the opening 741 into the rod receiving portion 748, and by removing the external force, advances into the opening 741 through the opening 7444A. A pair of rods 760 and 761 that advance into the opening 741 are pressed against the outer periphery of the IC device on the film 750 by the biasing force of the spring. Thereby, the IC device on the film 750 is pressed by a pair of rods 760 and 761.

At the center of the film 750, a rectangular opening 752 is formed. Here, a light sensor (not shown) is set at a predetermined position of the electronic component testing device, and the core 730 stops at the position of the light from the light sensor or the position of the light passing through the light sensor. The photo sensor includes a light-emitting part and a light-receiving part facing upward and downward, and emits light at a timing when the opening 752 is located between the light-emitting part and the light-receiving part. In the case where the IC element is present on the film 750, since the light is blocked by the IC element, the IC element is detected. On the other hand, when the IC element does not exist on the film 750, the light emitted from the light-emitting part passes through the opening 752 and is received by the light-receiving element, so the IC element is not detected.

Between the opening 752 of the film 750 and the outer peripheral portion 750A, a plurality of small holes 753 are formed. The plurality of small holes 753 are provided to correspond to the plurality of spherical terminals HB provided on the bottom surface of the IC element. The diameter of the small hole 753 is set to be larger than the diameter of the terminal HB. Thereby, the terminal HB protrudes from the film 750 to the IC socket 50 side through the small hole 753. In addition, in this embodiment, since the plurality of spherical terminals HB of the IC element are arranged in a plurality of rows in a rectangular ring shape, the plurality of small holes 753 are arranged in a plurality of rows in a rectangular ring shape. However, the arrangement of the terminal HB and the small hole 753 of the IC element is not limited to the arrangement of this embodiment, and can be changed as appropriate.

As shown in FIG. 14, on the bottom surface of the frame portion 744, a flat surface portion 7445 on the inner peripheral side and a slope portion 7446 on the outer peripheral side are formed. The part between the opening 751 of the film 750 and the small hole 753 abuts against the flat surface 7445. The inclined surface portion 7446 is inclined upward from the outer peripheral side of the flat surface portion 7445 to the frame portion 744. A shim 749 is formed on this inclined surface 7446. Specifically, not only the trunk portion 7491 of the shim 749 protrudes downward from the inclined surface portion 7446, but also the head 7492 of the shim 749 does not enter the flat portion 7445 and is formed in the inclined surface 7446.

Here, at the head 7492 of the shim 749, a horizontal plane 7492A is formed. The height position of this horizontal plane 7492A is set higher than the plane portion 7445. In addition, the film 750 includes an outer peripheral portion 750A that is inclined by abutting against the inclined surface portion 7446, and a flat surface portion 750B inside the outer peripheral portion 750A. The outer peripheral portion of the upper surface of this flat portion 750B abuts on the flat portion 7445. Therefore, the height of the lower surface of the flat portion 750B is set to a position where the thickness of the thin film 750 is added to the flat portion 7445 to be low. Therefore, the height of the lowest part (lowest point) of the shim 749 is set to a higher position than the height of the lowest part (lowest point) of the film 750.

Here, at the position of the opening 751 closer to the outer periphery of the film 750 than the center, the edge of the opening 751 is suspended from the trunk portion 7491, thereby applying tension to the film 750. The relative position of the trunk portion 7491 and the opening 751 and the shape or size of the trunk portion 7491 and the opening 751 are set to form this state.

Figure 15 is the 15-15 section view of Figure 14. As shown in Fig. 15, the trunk 7491 includes: a trunk outer peripheral portion 7491A formed in an area closer to the outer periphery of the film 750 than the center (axial center); and a trunk inner peripheral portion 7491B formed at A region closer to the inner peripheral side of the film 750 than the center. The cross-sectional shape of the trunk outer peripheral side portion 7491A is a semicircular shape with a radius R1, and the cross-sectional shape of the trunk inner peripheral side portion 7491B is a semicircular shape with a radius R2 (<R1). The trunk outer peripheral portion 7491A and the trunk inner peripheral portion 7491B share the center of the circle, and a step is formed at the boundary portion of these.

The opening 751 includes an opening outer peripheral side portion 7511 formed in a region closer to the outer peripheral side of the film 750 than the center, and an opening inner peripheral side portion 7512 formed in a region closer to the inner peripheral side of the film 750 than the center. The opening outer peripheral side portion 7511 has a semicircular radius r1, and the opening inner peripheral side portion 7512 has a semicircular radius r2 (<r1). The opening outer peripheral side portion 7511 and the opening inner peripheral side portion 7512 share the center of the circle, and a step portion is formed at the boundary of these.

The radius R1 of the trunk outer peripheral portion 7491A is slightly larger than the radius r1 of the opening outer peripheral portion 7511, and the radius R2 of the trunk inner peripheral portion 7491B is slightly greater than the radius r2 of the opening inner peripheral portion 7512. Therefore, the edge of the opening outer peripheral portion 7511 and the circumference of the trunk outer peripheral portion 7491A The surface abuts, and the edge of the opening inner peripheral portion 7512 abuts the peripheral surface of the trunk inner peripheral portion 7491B.

Here, a plurality of slits 7513 are formed at the edge of the inner peripheral side portion 7512 of the opening. A plurality of slits 7513 are arranged at predetermined intervals (for example, at an interval of 45° as shown in FIG. 15) in the circumferential direction of the opening 751. The length of the slit 7513 is not particularly limited, but the difference (r1-r2) between the radius r1 of the opening outer peripheral portion 7511 and the radius r2 of the opening inner peripheral portion 7512 is preferable.

By forming a plurality of slits 7513 on the edge of the opening inner peripheral portion 7512, the rigidity of the edge of the opening inner peripheral portion 7512 becomes lower than the rigidity of the edge of the opening outer peripheral portion 7511. Therefore, the edge of the inner peripheral portion 7512 of the opening is more curved than the edge of the outer peripheral portion 7511 of the opening. The contact pressure between the edge of the side portion 7512 and the peripheral surface of the inner peripheral portion 7491B of the trunk portion is greater. Therefore, the trunk portion 7491 is closer to the outer peripheral side of the film 750 than the center, and since the edge of the opening 751 is suspended from the trunk portion 7491, tension is applied to the film 750.

Fig. 16 is a cross-sectional view showing a modification of the configuration of the trunk portion 7491 and the opening 751 shown in Fig. 15. As shown in Figure 16, the trunk 7491 includes a trunk outer peripheral portion 7491A formed in an area closer to the outer periphery of the film 750 than the center, and a trunk formed in an area closer to the inner periphery of the film 750 than the center. The inner peripheral side part 7491B. The cross-sectional shape of the outer peripheral portion 7491A of the trunk is a semicircular shape with a radius R1, and the cross-sectional shape of the trunk inner peripheral portion 7491B is a semicircular shape with a radius R2 (>R1). The trunk outer peripheral portion 7491A and the trunk inner peripheral portion 7491B share the center of the circle, and a step is formed at the boundary portion of these.

The opening 751 is a perfect circle and includes an opening outer peripheral side portion 7511 formed in a region closer to the outer peripheral side of the film 750 than the center, and an opening inner peripheral side portion 7512 formed in a region closer to the inner peripheral side of the film 750 than the center . The opening outer circumferential side portion 7511 and the opening inner circumferential side portion 7512 are semicircular with a radius r1 (=r2), and are divided into the inner circumferential side and the outer circumferential side of the film 750 with a pair of slits 7513 as a boundary.

The radius R1 of the outer peripheral portion 7491A of the trunk is greater than the radius R1 of the outer peripheral portion 7511 of the opening. The radius r1 is slightly larger, and the radius R2 of the trunk inner peripheral portion 7491B is slightly larger than the radius r2 of the opening inner peripheral portion 7512. Therefore, the edge of the opening outer peripheral portion 7511 abuts on the peripheral surface of the trunk outer peripheral portion 7491A, and the edge of the opening inner peripheral portion 7512 abuts on the peripheral surface of the trunk inner peripheral portion 7491B.

Here, not only the above-mentioned slit 7513 is formed at both ends of the edge of the inner peripheral side portion 7512 of the opening, but also the slit 7513 is formed at the center of the edge of the inner peripheral portion 7512 of the opening. These plural slits 7513 are arranged at predetermined intervals (for example, at an interval of 90° as shown in FIG. 16) in the circumferential direction of the opening 751. In addition, the length of the slit 7513 is not particularly limited, but the length is preferably equal to the difference (r1-r2) between the radius r1 of the opening outer peripheral portion 7511 and the radius r2 of the opening inner peripheral portion 7512.

By forming a plurality of slits 7513 at the center and both ends of the edge of the inner peripheral portion 7512 of the opening, the rigidity of the edge of the inner peripheral portion 7512 of the opening becomes lower than the rigidity of the edge of the outer peripheral portion 7511 of the opening. . Therefore, the edge of the inner peripheral portion 7512 of the opening is more curved than the edge of the outer peripheral portion 7511 of the opening. The contact pressure between the edge of the side portion 7512 and the peripheral surface of the inner peripheral portion 7491B of the trunk portion is greater. Therefore, the trunk portion 7491 is closer to the outer peripheral side of the film 750 than the center, and since the edge of the opening 751 is suspended from the trunk portion 7491, tension is applied to the film 750.

FIG. 17 is an enlarged plan view showing the four corners of the bottom of the component carrier 710. As shown in Fig. 17, slits 754 are formed at the four corners of the film 750, respectively. At the four corners of the outer periphery of the film 750, there is a pair of extension lines of the boundary between the outer periphery 750A of the film 750 and the flat portion 750B. The four corners of the outer periphery of the film 750 are divided by a pair of the extension lines. When forming a rectangle, the extension line of one side overlaps the opening 751, and the extension line of the other side does not overlap the opening 751. A slit 754 is formed on an extension line that does not overlap with this opening 751.

Here, when the outer peripheral portion 750A of the film 750 to which the tension is applied is inclined, the slits 754 are not formed at the four corners of the outer peripheral portion 750A of the film 750, and the slits 754 are formed at the four corners of the outer peripheral portion 750A of the film 750. wrinkle. In contrast, in the present embodiment, by forming slits 754 at the four corners of the outer peripheral portion 750A of the film 750, respectively, it is possible to prevent the occurrence of wrinkles at the four corners of the outer peripheral portion 750A of the film 750.

Figures 18 and 19 are cross-sectional views showing the state of testing (inspecting) IC components. As shown in FIG. 18, a pair of positioning pins 55 and 56 are provided on the test head 5 in such a manner as to clamp a set of opposite sides of the rectangular IC socket 50. As shown in FIG. The positioning pin 55 on one side is fitted with the positioning hole 7451 of the core body 740, and the positioning pin 56 on the other side is fitted with the positioning hole 7461 of the other side. Thereby, the relative position of the core body 740 and the IC socket 50 is determined so that the terminal HB of the IC element is in contact with the terminal 51 of the IC socket 50.

As shown in FIG. 19, the pair of rods 760 and 761 that have advanced into the opening 741 are pressed against the outer periphery of the IC device on the film 750 by the biasing force of a spring (not shown). Thereby, the IC component on the IC socket 50 is pressed by the pair of rods 760 and 761.

As shown in FIGS. 18 and 19, the push rod 121 is installed above the IC socket 50 so as to be capable of being raised and lowered. The push rod 121 is installed in a Z-axis driving device (for example, a fluid cylinder) not shown. When testing an IC component, the Z-axis driving device uses the push rod 121 to press the IC component onto the IC socket 50.

The IC socket 50 has a structure in which a plurality of terminals 51 are buried in an insulating sheet-shaped base material. The terminal 51 is composed of a conductive elastic member. The conductive elastic member constituting the terminal 51 can be exemplified by adding a conductive filler to synthetic rubber, or adding a conductive filler to synthetic resin such as polyester. The number and arrangement of the plurality of terminals 51 are set to correspond to the number and arrangement of the plurality of terminals HB of the IC component.

The test of the IC component is performed by the tester 6 in a state where the terminal HB of the IC component and the terminal 51 of the IC socket 50 are in electrical contact. The test result of the IC component is memorized at an address determined, for example, based on the identification number attached to the test tray TST and the number of the IC component allocated in the test tray TST.

Here, by setting the lowest part (lowest point) of the shim 749 at a higher position than the lowest part (lowest point) of the film 750, the lowest part of the shim 749 is located higher than that of the IC device. The front end (lower end) of the terminal HB is at a higher position. Thereby, regardless of the protruding height of the terminal HB from the bottom surface of the IC element, the gap between the gap filler 749 and the upper surface of the IC socket 50 can be ensured.

FIG. 20 is a perspective view for explaining the method of mounting the film 750 on the core body 740. FIG. 21 is a cross-sectional view for explaining the method of mounting the film 750 to the core body 740. FIG. 22 is a perspective view for explaining the method of mounting the film 750 on the core body 740. As shown in these figures, the outer peripheral portion 750A of the film 750 is fixed to the inclined surface portion 7446 of the core body 740 by thermal caulking.

First, as shown in FIGS. 20 and 22, the film 750 and the core body 740 are prepared. A plurality of openings 751 are formed in the outer periphery of the film 750. In each opening 751, an opening outer peripheral side portion 7511 and an opening inner peripheral side portion 7512 are formed. In addition, a plurality of slits 7513 are formed on the edge of the inner peripheral side portion 7512 of the opening. On the other hand, on the inclined surface portion 7446 of the core body 740, a plurality of protrusions 749B are formed. The positions of the plurality of protrusions 749B correspond to the positions of the plurality of openings 751. At the axis of each protrusion 749B, an opening 749H is formed. In addition, in each protrusion 749B, a trunk outer peripheral portion 7491A and a trunk inner peripheral portion 7491B are formed.

Next, the film 750 is placed on the bottom of the core body 740. At this time, after aligning the positions of the plurality of protrusions 749B with the plurality of openings 751, all the protrusions 749B are inserted into the openings 751.

Then, as shown in FIG. 21, a shim 749 having a trunk portion 7491 and a head 7492 with a larger diameter than the trunk portion 7491 is formed, whereby the shim 749 and the inclined surface portion 7446 of the core body 740 sandwich the film 750 As a result, the outer peripheral portion 750A of the film 750 is fixed to the inclined surface portion 7446 of the core body 740. In this step, a resin thermal caulking device not shown is used to pressurize the protrusion 749B from the front end side to the base end side to generate thermal deformation, thereby forming the caulking piece 749. At this time, by forming an opening 749H in the axial center of the protrusion 749B, thermal deformation of the protrusion 749B that expands in the outer diameter direction is promoted compared with a solid protrusion.

Here, the relative position of the opening 751 and the trunk portion 7491, the diameter of the opening 751 and the trunk portion 7491, or the conditions of thermal caulking, etc., are set to a position closer to the outer peripheral side of the film 750 than the center of the opening 751. The edge of the 751 is suspended from the torso 7491 to apply tension to the film 750.

In addition, the size of the protrusion 749B and the conditions for thermal caulking are set so that the core 730 becomes the state where the film 750 faces upward, and the height of the horizontal plane 7492A of the shim 749 is higher than the upper surface of the flat portion 750B of the film 750 The height is higher.

FIG. 23 is a perspective view for explaining the method of attaching the film 750 including the opening 751 of the structure shown in FIG. 16 to the core body 740 including the trunk portion 7491 of the structure shown in FIG. 16. As shown in FIG. 23, when the opening 751 is formed on the outer periphery of the film 750, a plurality of slits 7513 are formed at the edge of the opening 751. A pair of slits 7513 are formed on the extension line that bisects the center line of the opening 751 on the inner and outer sides of the film 750, and on the edge of the opening 751 on the inner peripheral side than the center, a pair of slits The slit 7513 forms the remaining slit 7513 at an interval of 90˚. On the other hand, when a plurality of protrusions 749B are formed on the inclined surface portion 7446 of the core body 740, each protrusion 749B forms a trunk outer peripheral portion 7491A and a trunk inner peripheral portion 7491B.

After aligning the positions of the plurality of protrusions 749B with the plurality of openings 751, insert all the protrusions 749B into the openings 751, and then use a resin thermal caulking device not shown to press the protrusions 749B from the tip side to the base side. Thermal deformation is generated, thereby forming a shim 749. Here, the relative position of the opening 751 and the trunk portion 7491, the diameter of the opening 751 and the trunk portion 7491, or the conditions of thermal caulking, etc., are set to a position closer to the outer peripheral side of the film 750 than the center of the opening 751. The edge of the 751 is suspended from the torso 7491 to apply tension to the film 750.

As shown in the above description, in the component carrier 710 of this embodiment, a slit 7513 is formed at the edge of the opening 751 of the film 750 into which the trunk portion 7491 of the shim 749 is fitted. Here, the slit 7513 is formed in a region (opening inner peripheral side portion 7512) of the edge of the opening 751 that is closer to the inner peripheral side of the film 750 than the center of the opening 751, and in the ratio of the edge of the opening 751 The area where the center of the opening 751 is closer to the outer peripheral side of the film 750 (opening outer peripheral side portion 7511) is not formed. As a result, the rigidity of the edge of the inner peripheral portion 7512 of the opening becomes lower than the rigidity of the edge of the outer peripheral portion 7511 of the opening, so the edge of the inner peripheral portion 7512 of the opening is greater than the edge of the outer peripheral portion 7511 of the opening. In order to bend, the trunk portion 7491 is closer to the outer peripheral side of the film 750 than the center, and the opening 751 is suspended from the trunk portion 7491. Therefore, sufficient tension is applied to the film 750, and the position accuracy of the IC element on the film 750 can be ensured.

In addition, in the component carrier 710 of this embodiment, the trunk portion 7491 of the shim 749 includes: a semicircular trunk portion outer peripheral side portion 7491A formed on the trunk portion 7491 closer to the outer peripheral side of the film 750 than the center And the semicircular inner peripheral side portion of the trunk 7491B, which is formed in the area of the trunk 7491 that is closer to the inner peripheral side of the film 750 than the center. The inner peripheral portion 7491B of the trunk has a smaller diameter than the outer peripheral portion 7491A of the trunk. On the other hand, the opening 751 of the film 750 includes an opening outer peripheral portion 7511 formed in a semicircular shape in the area of the opening 751 closer to the outer peripheral side of the film 750 than the center, and the trunk outer peripheral portion 7491A is embedded Together; and the opening inner peripheral portion 7512 is formed in a semicircular shape in the area of the opening 751 closer to the inner peripheral side of the film 750 than the center, and the trunk inner peripheral portion 7491B is fitted. The diameter of the portion 7512 on the inner circumference of the opening is smaller than that of the portion 7511 on the outer circumference of the opening. On the other hand, the slit 7513 is formed at the edge of the opening inner circumferential side portion 7512, and is not formed at the edge of the opening outer circumferential side portion 7511. According to this structure, since the edge of the opening inner peripheral portion 7512 is more curved than the edge of the opening outer peripheral portion 7511, the contact pressure between the edge of the opening outer peripheral portion 7511 and the peripheral surface of the trunk outer peripheral portion 7491A It becomes larger than the contact pressure between the edge of the opening inner peripheral portion 7512 and the peripheral surface of the trunk inner peripheral portion 7491B. Therefore, on the outer peripheral side of the film 750 closer to the center of the trunk portion 7491 than the center, the opening 751 is set to be suspended from the trunk portion 7491, and sufficient tension can be applied to the film 750.

In addition, in the modification shown in Fig. 16, the main body of the shim 749 includes a semicircular trunk outer peripheral side portion 7491A, which is formed on the trunk 7491 closer to the outer peripheral side of the film 750 than the center Area; and the semicircular trunk inner peripheral side portion 7491B, which is formed in the trunk portion 7491, which is closer to the inner peripheral side of the film 750 than the center. The portion 7512 on the inner circumference of the opening has a larger diameter than the portion 7511 on the outer circumference of the opening. On the other hand, the opening 751 of the film 750 includes: an opening outer peripheral side portion 7511, It is formed in a semicircular shape in the area of the opening 751 that is closer to the outer periphery of the film 750 than the center, and is fitted with the outer peripheral portion 7491A of the trunk; and the inner peripheral portion of the opening 7512 is formed in a semicircular shape. The area of the opening 751 is closer to the inner peripheral side of the film 750 than the center, and the inner peripheral side portion 7491B of the trunk is fitted. The slit 7513 is formed at the boundary between the edge of the inner peripheral portion 7512 of the opening and the edge of the outer peripheral portion 7511 of the opening, and the edge of the inner peripheral portion 7512 of the opening. Department is not formed. According to this structure, since the edge of the opening inner peripheral portion 7512 is more curved than the edge of the opening outer peripheral portion 7511, the contact pressure between the edge of the opening outer peripheral portion 7511 and the peripheral surface of the trunk outer peripheral portion 7491A It becomes larger than the contact pressure between the edge of the opening inner peripheral portion 7512 and the peripheral surface of the trunk inner peripheral portion 7491B. Therefore, on the outer peripheral side of the film 750 closer to the center of the trunk portion 7491 than the center, the opening 751 is set to be suspended from the trunk portion 7491, and sufficient tension can be applied to the film 750.

In addition, in the component carrier 710 of this embodiment, in a state where tension is applied to the film 750, the outer peripheral portion 750A of the film 750 is fixed to the bottom surface of the frame portion 744 by the shim 749. In this way, the positioning accuracy of the small holes 753 of the film 750 in the plane and in the height direction can be ensured. In particular, in the component carrier 710 of the present embodiment, on the bottom surface of the frame portion 744, the inclined surface portion 7446 is formed so as to be inclined from the inner peripheral side to the outer peripheral side of the bottom surface to the high side, and a plurality of inclined surface portions 7446 are formed on this inclined surface portion 7446. Sheet shim 749. Therefore, by tilting the outer peripheral portion 750A of the film 750 to the flat portion 750B at an angle of less than 90°, and suspending the opening 751 of the outer peripheral portion 750A from the trunk portion 7491 of the shim 749, it is possible to realize the alignment of the film 750. The outer peripheral portion 750A of the film 750 is fixed to the bottom surface of the frame portion 744 by the shim 749 in the state where the tension is applied. Therefore, compared with the case where the inclination angle of the outer peripheral portion 750A of the film 750 to the flat surface portion 750B is set to 90° or more, or the step portion is formed between the outer peripheral portion 750A of the film 750 and the flat surface portion 750B, the alignment can be easily achieved. The film 750 imparts tension and ensures the position accuracy of the film 750.

In addition, the above-described embodiments are described in order to facilitate the understanding of the present invention, and are not intended to limit the description of the present invention. Therefore, the elements disclosed in the above-mentioned embodiments also include all design changes or equivalents belonging to the technical scope of the present invention.

For example, in the above-mentioned embodiment, the inclined surface portion 7446 is formed at the bottom of the core body 740, and the shim 749 is formed on the inclined surface portion 7446, thereby setting the lowest point of the shim 749 to be higher than that of the film 750. The lowest point is higher, but this is not required. The bottom of the core body 740 can also be formed horizontally, and the lowest point of the shim 749 can also be set at a position lower than the lowest point of the film 750.

In addition, the thin film 750 constitutes a thin sheet constituting the bottom of the core 730, but a thin metal can also be used to constitute the thin sheet. Furthermore, the core 730 is mounted on the test tray TST via the main body 720, but the core 730 may be directly mounted on the test tray TST. In this case, it is only necessary to mount the core 730 to the test tray TST so as to be able to move (swim) slightly in the plane.

1‧‧‧Processor 5‧‧‧Test head 6‧‧‧Tester 7‧‧‧Cable 50‧‧‧IC socket 51‧‧‧Terminal 55‧‧‧Locating pin 100‧‧‧Test part 101‧‧‧ Device base 102‧‧‧Tray handling device 110‧‧‧Temperature environment room 120‧‧‧Test room 121‧‧‧Push rod 130‧‧‧Normal temperature recovery room 200‧‧‧Storage part 201‧‧‧Pre-test storage 202‧‧‧After testing storage warehouse 203‧‧‧pallet support frame 204‧‧‧lift 205‧‧‧pallet transfer arm 300‧‧‧loading part 310‧‧‧component handling device 311‧‧‧rail 312‧‧movable Arm 320‧‧‧Movable head 360‧‧‧Position corrector 370‧‧‧Window 400‧‧‧Unloading part 410‧‧‧Component handling device 470‧‧‧Window TST‧‧‧Test tray 700‧‧‧machine Frame 701‧‧‧Outer frame 702‧‧‧Inner frame 703‧‧‧Opening 710‧‧‧Component carrier 720‧‧‧Main body 721‧‧‧Opening 722‧‧‧Guide groove 730‧‧‧Core 740‧‧‧ Core body 741‧‧‧ Opening 742‧‧‧ Claw 743‧‧‧Guiding part 744‧‧ ‧Aperture 7444‧‧‧Fourth side wall 7444A‧‧‧Aperture 7445‧‧‧Plane part 7446‧‧‧Slope part 7447‧‧Plane part 7448‧‧ ‧‧Positioning holes 747, 748‧‧‧Pole accommodating parts 747A, 748A‧‧‧Opening 749‧‧‧Shim 749B‧‧‧Protrusion 7491‧‧‧Trunk 7491A ‧Inner peripheral side part of torso 7492‧‧Head 7492A‧‧Horizontal plane 750‧‧ Film 751‧‧‧Opening 7511‧‧‧Outer peripheral part of opening 7512‧‧‧Inner peripheral part of opening 7513 ‧‧‧Opening 753‧‧‧Small hole 754

Fig. 1 is a schematic cross-sectional view showing an electronic component testing device using a component carrier according to an embodiment of the present invention. Fig. 2 is a perspective view showing the electronic component testing device of Fig. 1. Fig. 3 is a schematic diagram for explaining the transfer of the tray of the electronic component testing device in Fig. 1 and Fig. 2. Fig. 4 is an exploded perspective view showing the IC storage used in the above-mentioned electronic component testing device. Fig. 5 is a perspective view showing a customized tray used in the above-mentioned electronic component testing device. Figure 6 is a perspective view of the test tray. Fig. 7 is an enlarged exploded perspective view showing a part of the test tray.

Fig. 8 is a perspective view showing the core from the bottom side.

Figure 9 shows a bottom view of the core.

Figure 10 is a plan view showing the core.

Figure 11 shows a front view of the core.

Figure 12 shows a side view of the core.

Figure 13 is a sectional view of section 13-13 of Figure 9.

Fig. 14 is an enlarged cross-sectional view showing a part of Fig. 13.

Figure 15 is the 15-15 section view of Figure 14.

Fig. 16 is a cross-sectional view showing a modified example of the configuration of the main body and the opening shown in Fig. 15.

Figure 17 is an enlarged plan view showing the four corners of the bottom of the component carrier.

Figure 18 is a cross-sectional view showing the state of testing (inspecting) IC components.

Figure 19 is a cross-sectional view showing the state of testing (inspecting) IC components.

Figure 20 is a perspective view for explaining the method of mounting the film on the core body.

Figure 21 is a cross-sectional view for explaining the method of mounting the film on the core body.

Figure 22 is a perspective view for explaining the method of mounting the film on the core body.

FIG. 23 is a perspective view for explaining a method of attaching the film including the opening of the structure shown in FIG. 16 to the core body including the body portion of the structure shown in FIG. 16.

7491‧‧‧Torso

7491A‧‧‧The outer peripheral part of the trunk

7491B‧‧‧Inner peripheral part of torso

750‧‧‧film

751‧‧‧Open

7511‧‧‧Outer peripheral part of opening

7512‧‧‧Inner peripheral part of opening

7513‧‧‧Slit

R1‧‧‧The radius of the outer circumference of the trunk

R2‧‧‧The radius of the inner circumference of the trunk

r1‧‧‧The radius of the outer peripheral side of the opening

r2‧‧‧The radius of the inner peripheral side of the opening

Claims (5)

A carrier for an electronic component testing device, which holds a plurality of electronic components under test with terminals protruding from the bottom surface on a socket set in the electronic component testing device, and includes: a sheet forming the bottom of the carrier and attaching the The electronic component to be tested is placed such that the plurality of terminals protrude toward the socket side; and the body part is set on the tray carried in the electronic component testing device, and the outer peripheral part of the sheet is fixed by a plurality of shims; The shim includes: a torso protruding from the main body; and a head, which is arranged at the front end of the torso and has a larger diameter than the torso; the sheet includes: the torso is fitted into The opening; and the slit is formed in the area at the edge of the opening that is closer to the inner periphery of the sheet than the center of the opening, and the edge of the opening is closer to the sheet than the center of the opening The area on the outer peripheral side is not formed. For example, the carrier for the electronic component testing device of the first item of the scope of patent application, wherein the torso includes: a semicircular outer peripheral part of the torso, which is formed on the outer peripheral side of the torso closer to the sheet than the center And the semicircular inner peripheral side portion of the trunk is formed in the area of the trunk that is closer to the inner peripheral side of the sheet than the center, and the diameter is smaller than the outer peripheral portion of the trunk; the opening includes : The outer peripheral part of the opening is formed in a semicircular shape in the area closer to the outer peripheral side of the sheet than the center of the opening, and the outer peripheral part of the trunk is fitted; and the inner peripheral part of the opening is tied in half It is circularly formed in the area of the opening closer to the inner circumference of the sheet than the center, and the inner circumference of the trunk is fitted; the slit is formed at the edge of the inner circumference of the opening, and The edge part of the outer peripheral side part of this opening is not formed. For example, the carrier for the electronic component testing device of the first item of the scope of patent application, wherein the torso includes: a semicircular outer peripheral part of the torso, which is formed on the outer peripheral side of the torso closer to the sheet than the center And the semicircular inner peripheral part of the trunk, which is formed in the area of the trunk closer to the inner peripheral side of the sheet than the center, and has a larger diameter than the outer peripheral part of the trunk; the opening includes : The outer peripheral part of the opening is formed in a semicircular shape in the area closer to the outer peripheral side of the sheet than the center of the opening, and the outer peripheral part of the trunk is fitted; and the inner peripheral part of the opening is tied in half Circularly formed in the area of the opening closer to the inner circumference of the sheet than the center of the opening, and the inner circumference of the trunk is fitted; the slit is formed at the edge of the inner circumference of the opening The boundary portion between the edge portion and the edge portion of the opening outer circumferential side portion and the edge portion of the inner circumferential side portion of the opening are not formed at the edge portion of the opening outer circumferential side portion. For example, the carrier for the electronic component testing device of any one of the scope of the patent application 1 to 3, wherein the sheet is in a state of being given tension, and the outer peripheral part is fixed to the by the plurality of shims The main body. For example, the carrier for the electronic component test device of any one of the scope of the patent application 1 to 3, wherein the bottom surface of the main body portion is inclined from the inner peripheral side to the outer peripheral side of the bottom surface to the high side. ; The plural shim pieces are formed on the inclined surface.

Images