TWI732553B - Liquid cooling system - Google Patents

Abstract

A liquid cooling system is provided. The liquid cooling system comprises a radiator having first and second built-in fluid tank reservoirs, a multi-fan unit, at least one heat exchanger pump, and a plurality of fluid conduits. The radiator comprises at least one first flow port and at least one second flow port for attachment of the plurality of fluid conduits thereto for actively moving a cooling fluid to and from the at least one heat exchanger pump. Heat generated from a heat generating device is transferred to cooling fluid flowing through the at least one heat exchanger pump, and then output to the radiator. The heated cooling fluid flows through the radiator having the built-in fluid tank, cooling along a plurality of heat exchanger fins, whereby the multi-fan unit expels heat therefrom. The cooling fluid flows to the heat exchanger pump to once again begin the cooling loop.

Description

Liquid cooling system

The present invention relates generally to the field of heat transfer, and particularly relates to a liquid cooling system.

In the operation of a computer, server, or electronic system, the heat generated by the processor must be quickly and efficiently dissipated to maintain the operating temperature within the range recommended by the manufacturer. As the functionality and applicability of the electronic system are improved, the operating speed of the processor used in it also increases. As the operating speed increases and the number of processors used increases, the power requirements of the electronic system also increase, thereby increasing the demand for heat dissipation.

Several technologies have been developed to absorb the heat of the processor in the electronic system. One of the technologies is an air cooling system, in which the heat sink thermally contacts the processor and transfers the heat from the processor, and a fan is installed on the top of the heat sink to remove the heat from the heat sink by blowing air through various parts of the heat sink . This air-cooling system should be sufficient for daily use, but it may be noisy, and as the processor speed increases, the number of processors used increases and more heat is output, the efficiency of this air-cooling system will Get lower and become more bulky. Another technique is to use a cooling fluid to cool the processor, which drives the cooling fluid to circulate in a closed system through a pump unit, where the closed system may also have a reservoir, a radiator in which the cooling fluid circulates, and One water-cooled head. The water block is usually the place where the cooling fluid is in thermal contact with the heat generating processor.

Generally speaking, a liquid heat exchange system can have lower noise and higher noise than an air-cooled system. Good efficiency. However, the traditional liquid heat exchange system is designed to be composed of many components, which increases the total installation time, the risk of leakage, and the problem of component placement. Therefore, in some applications, one or more components (such as a liquid reservoir) must be placed on the outside of the electronic device housing, and at least one hose is required to communicate from the liquid reservoir on the outside into the electronic device housing and the housing. Attachment mechanism on the body or on a separate component.

The present invention is to provide a liquid cooling system, so as to solve the problems of long total installation time, high leakage risk, and component placement of traditional liquid heat exchange systems in the prior art.

The liquid cooling system disclosed in an embodiment of the present invention includes a radiator, a multi-fan unit, at least one heat exchange pump, and a plurality of fluid ducts. The radiator has a first built-in liquid storage tank and a second built-in liquid storage tank. The multi-fan unit is arranged between the first built-in liquid storage tank and the second built-in liquid storage tank. A plurality of fluid conduits are coupled to the heat exchange pump and the radiator to jointly form a cooling circuit for circulating cooling fluid.

According to the liquid cooling system disclosed in the above embodiment, it includes a radiator with a first built-in liquid storage tank and a second built-in liquid storage tank, a multi-fan unit, at least one heat exchange pump, and a plurality of fluid ducts. The heat generated by the heating device is transferred to the cooling fluid flowing through the heat exchange pump, and then output to the radiator. The heated cooling fluid flows through a radiator with a built-in liquid storage tank and cools along a plurality of radiating fins. The cooling fluid flows to the heat exchange pump to start the cooling cycle again. In addition to solving the fluid loss caused by permeation over time, the built-in liquid storage tank also dissipates the heat generated by the side of the multi-fan unit. In addition, the built-in storage tank eliminates the need for separate storage tank components. Therefore, it is no longer necessary to allocate the location of the storage slot in the electronic component chassis or electronic system, thereby reducing the total installation time, the risk of leakage and the problem of component placement.

The above description of the content of the present invention and the description of the following embodiments are used to demonstrate and explain the principle of the present invention, and to provide a further explanation of the scope of the patent application of the present invention.

100, 400, 500: liquid cooling system

110: Heat exchange pump

120: fluid conduit

124: The first mobile port

126: Second mobile port

130a: The first built-in reservoir

130b: The second built-in reservoir

150: first cavity

153: First Flow Room

160: Multi-fan unit

170: second cavity

173: Second Flow Chamber

180: radiator

191: bottom shell

194: Longitudinal fluid channel

196: heat sink

199: top shell

Unless otherwise stated, the drawings illustrate the various points of view of the innovative subject described herein. With reference to the drawings, in several drawings, similar reference numerals represent similar parts, and examples of several radiator fins combining various viewpoints of the principles of the present invention are drawn by way of example, not for Limit the present invention.

Fig. 1A is a three-dimensional schematic diagram of a liquid cooling system according to an embodiment of the present invention.

Fig. 1B is a partially exploded schematic diagram of the liquid cooling system of Fig. 1A.

Fig. 2A illustrates the inside of the second end of the radiator of the liquid cooling system of Fig. 1A according to an embodiment of the present invention.

Fig. 2B shows the interior of the first and second ends of the radiator of the liquid cooling system of Fig. 1A.

FIG. 3A illustrates the inside of the second end of the heat sink of FIG. 1A according to an embodiment of the present invention.

Fig. 3B shows the interior of the first and second ends of the radiator of the liquid cooling system of Fig. 1A.

Fig. 4A is a schematic diagram of another liquid cooling system according to an embodiment of the present invention.

Fig. 4B is an exploded schematic diagram of the liquid cooling system of Fig. 4A.

The following describes various principles related to the heat exchange system by referring to specific examples of pump units, liquid storage tanks, radiators, water cooling heads, and liquid cooling systems, including pump units, liquid storage tanks, radiators, and radiators that embody innovative concepts. Configuration and examples of water block. More specifically, but not exclusively, the principle of the innovation is determined by the selected pump unit, reservoir, radiator, water block and The liquid cooling system is described as an example, and for the sake of brevity and clarity, well-known functions or structures are not described in detail. However, one or more of the disclosed principles can be incorporated into various other embodiments of pump units, storage tanks, radiators, water blocks, and liquid cooling systems to achieve a variety of desired results, characteristics, and/or performance. Any of the standards.

Therefore, pump units, storage tanks, radiators, water cooling heads, and liquid cooling systems with characteristics different from the specific examples described herein can embody one or more of the innovative principles of the present invention and can be used for those that are not described in detail herein. Various applications. Therefore, as understood by those with ordinary knowledge in the field after consulting the present invention, the embodiments of the pump unit, liquid storage tank, radiator, water block and liquid cooling system that are not described in detail in this article also fall within the scope of the present invention. range.

The embodiments disclosed herein are about liquid cooling systems. The liquid cooling system absorbs, for example, but not limited to, heat generated by one or more heating devices in a computer or a server system. The heating device includes, but is not limited to, one or more central processing units (CPU) installed on a motherboard and/or an expansion card, CPU chipset, and one or more graphics processing units (Graphics Processing Unit, GPU), and/or one or more physical processors (Physics Processing Unit, PPU).

The liquid cooling system is used for disposing in an electronic component chassis, or used as a part of an electronic system that contains heating devices that need to be cooled. The liquid cooling system includes at least one liquid-based cooling circuit and a multi-fan unit. The multi-fan unit is coupled to a rear end of the radiator of the liquid cooling system through a fixing member (such as bolts, screws, adhesive materials, etc.) at a structural part of a radiator to draw air out of the radiator. To an air chamber of the electronic component case or electronic system or flow to an outside of the electronic component case or electronic system. Those with ordinary knowledge in the field can easily understand that the type and size of the fan can be changed, as long as the air can be drawn through the radiator and flow to the electric An air chamber of the sub-component chassis or electronic system or flows to an outside of the electronic component chassis or electronic system.

In some embodiments, the multi-fan unit may be a high-pressure (such as high airflow) fan. In some embodiments, the multi-fan unit may have reinforced blades. In some embodiments, the design of the fan blades and/or other components (such as bearings, etc.) can minimize the noise generated during operation. In some embodiments, the fan can be constructed using fixing elements (such as anti-vibration rivets, washers, etc.), where the fixing elements can be used to minimize vibration during operation.

Each cooling circuit includes a Fluid-To-Air Heat Exchanger or a radiator with first and second built-in liquid storage tanks and at least one heat exchange pump. The built-in liquid storage tank solves the fluid loss caused by permeation over time. The components on the cooling circuit are coupled via a plurality of fluid conduits. The radiator includes at least one first flow port and at least one second flow port to which the fluid conduits are attached, so as to effectively drive a cooling fluid to flow in and out of the at least one heat exchange pump. The heat generated by the heating device is transferred to the cooling fluid flowing through at least one heat exchange pump. The heated cooling fluid is output from the heat exchange pump and input into the radiator. The heated cooling fluid flows in and passes through the radiator with first and second built-in liquid storage tanks and a plurality of heat dissipation fins. The cooling fluid flows from the radiator to the heat exchange pump to start the cooling cycle again. Although the cooling circuit includes one heat exchange pump, there may be more than one heat exchange pump coupled to the radiator. In this way, multiple heat generating devices can be cooled and/or a larger heat generating area can be cooled. Each heat exchange pump can be arranged adjacently in multiple rows or in different configurations, allowing flexible design to achieve a structure for specific applications.

Fig. 1A is a three-dimensional schematic diagram of a liquid cooling system according to an embodiment of the present invention. Fig. 1B is a partially exploded schematic diagram of the liquid cooling system of Fig. 1A. Figure 2A according to one of the present invention The embodiment shows the inside of the second end of the radiator of the liquid cooling system of FIG. 1A. Fig. 2B shows the interior of the first and second ends of the radiator of the liquid cooling system of Fig. 1A. FIG. 3A illustrates the inside of the second end of the heat sink of FIG. 1A according to an embodiment of the present invention. Fig. 3B shows the interior of the first and second ends of the radiator of the liquid cooling system of Fig. 1A. 1A to 3B, a liquid cooling system 100 includes a radiator 180 having a first built-in liquid storage tank 130a and a second built-in liquid storage tank 130b, a multi-fan unit 160, positioned to dissipate heat At least one heat exchange pump 110 on one side of the heat exchanger 180 and a plurality of fluid conduits 120 coupled to the heat exchange pump 110 and the radiator 180. The heat generated by the heating device is transferred to the cooling fluid flowing through the heat exchange pump 110 and output to the radiator 180. The heated cooling fluid flows to and passes through the radiator 180, and the multi-fan unit 160 discharges heat therefrom. The cooling fluid flows from the radiator 180 to the heat exchange pump 110 to start the cooling cycle again. The first built-in liquid storage tank 130a and the second built-in liquid storage tank 130b solve the fluid loss caused by permeation over time.

In some embodiments, the number of the at least one heat exchange pump 110 is two, but the invention is not limited thereto. In another embodiment, the number of heat exchange pumps may be one or more than two. Those with ordinary knowledge in the art can easily understand that the number of the at least one heat exchange pump 110 can be changed, as long as the heat generated by the heating device can be transferred to the cooling fluid flowing through the heat exchange pump 110 and then cooled The fluid can flow to the radiator 180, and the multi-fan unit 160 discharges heat therefrom, and then is received by the heat exchange pump 110 again to start the cooling cycle again.

In some embodiments, the heat exchange pump 110 passes from an inlet pump connector attached to it, passes through a second distal pump and a first proximal pump of a diversion groove, and passes heat from a heat generating device. The heat sink fins in the second-level indented water block area (Second-Level Indented Water Block Area) of a second surface of a water block that are in contact, pump the cooling fluid to the attachment One of its outlet pump connectors.

The heat exchange pump 110 and the fluid conduit 120, which may be made of plastic materials, may be "metalized" to minimize fluid diffusion or fluid evaporation. The metal can be a thin metal coating applied to either or both of the inside or outside of the plastic part. Generally speaking, the entire cooling circuit (for example, including a radiator) uses the same metal material, such as copper. The fluid conduit 120 may be made of flexible plastic material and/or rigid metal material.

The cooling fluid of the liquid cooling system can be any kind of cooling fluid, such as water, water containing additives such as anti-mold, water containing additives for improving heat transfer, or cooling fluids with other special components, such as non-conductive liquids. Or liquids containing lubricant additives or anti-corrosion additives.

The control of the heat exchange pump 110 driven by an alternating current or direct current electric motor is preferably performed through an operating system or a similar device of a computer or electronic system itself, wherein the computer or electronic system includes one or more processors for measuring The load and/or temperature of a device. The use of measurements performed by an operating system or similar system eliminates the need for special devices for operating the pump. The communication between the operating system or a similar system and a processor for operating the pump can be performed along an established communication line in the computer system, such as a USB connection line. Thus, instant communication between the cooling system and the liquid cooling system can be provided without any special device for establishing communication.

A further control strategy using the operating system of the computer system or a similar system may include balancing the rotation speed of the heat exchange pump 110 according to the required cooling capacity. If a lower cooling capacity is required, the rotation speed of the heat exchange pump 110 can be limited, thereby limiting the noise generated by the motor driving the heat exchange pump 110.

In some embodiments, there is a first built-in reservoir 130a and a second built-in reservoir 130a. The radiator 180 of the liquid tank 130b further includes a top shell 199, a bottom shell 191, and a plurality of longitudinal fluid channels 194 arranged in multiple rows and columns. Those skilled in the art can easily understand that the top shell 199 and the bottom shell 191 may include one or more intermediate shells located between the top shell 199, the bottom shell 191 and the longitudinal fluid channel 194, and the top shell 199 and the bottom shell The housing 191 may include a fixing device to the longitudinal fluid channel 194, but the invention is not limited to this. Those with ordinary knowledge in the art can also easily understand that the total number, number of rows and number of columns of the longitudinal fluid channels 194 can be changed, which depends on the degree of demand for heat absorption, performance characteristics and the number of heat exchange pumps 110. And the available space for installing the liquid cooling system 100 in the electronic component chassis or electronic system, as long as the heat generated by the heating device can be transferred to the cooling fluid flowing through the heat exchange pump 110, and then the cooling fluid can flow through the longitudinal fluid channel 194 , And the multi-fan unit 160 discharges heat therefrom, and then is received by the heat exchange pump 110 again to start the cooling cycle again. In some embodiments, the total number of longitudinal fluid channels 194 of the heat sink 180 is twenty-four, and these longitudinal fluid channels 194 are arranged in four rows and six columns. In some embodiments, the longitudinal fluid channels 194 are spaced apart and independent of each other. The interval between rows is greater than the interval between columns.

In some embodiments, a plurality of heat sinks 196 are provided laterally across adjacent spaces between rows of the longitudinal fluid channels 194 and across each of the three rows and columns. In some embodiments, each heat sink 196 is arranged at a certain angle with respect to each adjacent row of the longitudinal fluid channel 194, but the present invention is not limited thereto. Those skilled in the art can easily understand that each heat sink 196 may not be set at a certain angle, it may be changed, or any combination thereof, depending on the degree of heat absorption required, as long as each heat sink 196 Substantially across the adjacent spaces between the rows of longitudinal fluid channels 194 and across each of the three rows and columns, so that the air It can pass through the heat sink 180 and through the surfaces of the heat sink 196 and the longitudinal fluid channel 194 to transfer heat away from the heat sink 180 by convection.

In some embodiments, the heat sink 180 includes a first cavity 150 having a first flow chamber 153, a first built-in liquid storage tank 130a, and at least one first flow port 124, and is opposite to the first cavity 150 And a second cavity 170 having a second flow chamber 173, a second built-in liquid storage tank 130b, and at least one second flow port 126. The top housing 199, the bottom housing 191, the longitudinal fluid channel 194 and the heat sink 196 are arranged between the first flow chamber 153 and the second flow chamber 173, and each longitudinal fluid channel 194 connects the first flow chamber 153 and the second flow chamber 173 They are in fluid communication with each other. The multi-fan unit 160 is arranged between the first built-in liquid storage tank 130a and the second built-in liquid storage tank 130b, and the first flow chamber 153 and the second flow chamber 173 are connected between the first built-in liquid storage tank 130a and the second built-in liquid storage tank 130a and the second built-in liquid storage tank 130b. The grooves 130b are in fluid communication. As shown in FIG. 3B, in the direction from the first built-in reservoir 130a to the second built-in reservoir 130b, the projection of the multi-fan unit 160 on the second built-in reservoir 130b and the first built-in reservoir 130a The projections on the second built-in reservoir 130b overlap. In some embodiments, a threaded joint may be attached to the first flow port 124 and the second flow port 126 to conveniently couple the fluid conduit 120 thereon for the cooling fluid to flow in the cooling circuit. In some embodiments, the number of the first flow port 124 and the number of the second flow port 126 is one, but the invention is not limited thereto. Those with ordinary knowledge in the art can easily understand that the positions of the first cavity 150 and the second cavity 170 can be exchanged with each other, and the number of the first flow port 124 and the number of the second flow port 126 can be based on the heat exchange pump The number of 110 changes, as long as the heat generated by the heating device can be transferred to the cooling fluid flowing through the heat exchange pump 110, and then the cooling fluid can flow to the radiator 180, and the multi-fan unit 160 discharges the heat from it, and then is heated again The exchange pump 110 receives to start the cooling cycle again. In some embodiments, with the second stream Each first flow port 124 opposite to the movable port 126 is disposed along the same plane with respect to the bottom housing 191 and adjacent to the top housing 199.

In some embodiments, the first cavity 150 further includes at least one chamber partition. The chamber partition separates the cooling fluid from each first flow port 124 and communicates with the longitudinal fluid channel 194 through a waterproof seal. More efficient cooling fluid flow. Those with ordinary knowledge in the art can easily understand that when the number of heat exchange pumps 110 changes, the number of fluid flow inlets and outlets required also changes, and they are used to separate the cooling fluid from each first flow port 124. And the number of chamber partitions communicating with the longitudinal fluid channel 194 is also changed, as long as the cooling flow system flowing from each first flow port 124 is separated by a waterproof seal to achieve more efficient cooling fluid flow.

The first built-in liquid storage tank 130a and the second built-in liquid storage tank 130b provide a chamber for storing cooling fluid. During the operation of the liquid cooling system 100, the amount of cooling fluid can be maintained in the first built-in liquid storage tank 130a and the second built-in liquid storage tank 130b. In some embodiments, the visible part of the cooling fluid in the first built-in reservoir 130a and the second built-in reservoir 130b can allow the user to visually observe the amount of cooling fluid in the cooling circuit through a transparent material, and Determine when it may be necessary to add additional cooling fluid to the liquid cooling system 100. There is no need to configure additional space for the first built-in liquid storage tank 130a and the second built-in liquid storage tank 130b, the fluid loss caused by permeation over time can be reduced, and the heat generated from the side of the multi-fan unit 160 can be dissipated, The cooling cycle efficiency of the liquid cooling system 100 is increased.

In some embodiments, the liquid cooling system 100 is configured such that the radiator 180 is located in a horizontal plane. In other embodiments, the liquid cooling system 100 may be positioned in an angled plane.

In some embodiments, the flow direction of the cooling fluid through each longitudinal fluid channel 194 of the radiator 180 is the same. Generally speaking, when the rotor of the heat exchange pump 110 rotates and forces the heated cooling fluid to pass through an outlet pump joint, the heated cooling fluid flows through the fluid conduit 120 to each first flow port 124 of the first cavity 150 , And flowing through the longitudinal fluid channel 194. When the heated cooling fluid flows through each of the longitudinal fluid channels 194, the air passes through the heat sink 180 and through the surfaces of the fins 196 and the longitudinal fluid channels 194 to convectively transfer heat from the heat sink 180. The cooled cooling fluid (for example, 5 degrees, 10 degrees, 15 degrees, etc. lower than the heated cooling fluid entering the first cavity 150) flows through the second cavity 170 and the second flow port 126, passes through the fluid conduit 120, and returns to the heat Exchange a water inlet pump connector of the pump 110 to start the cooling cycle again. In some embodiments, the heat sink 180 may have a heat exchange capacity of at least 350 watts, a range of about 350 watts to about 500 watts, less than or equal to about 500 watts, and the like. The heat generated from the side of the multi-fan unit 160 is dissipated, and, in addition to solving the fluid loss caused by permeation over time, the first built-in liquid storage tank 130a and the second built-in liquid storage tank 130b also remove heat from the multi-fan unit The side of 160 is taken away.

In some embodiments, more than one liquid cooling system 100 may be used to absorb heat generated by one or more heating devices. Fig. 4A is a schematic diagram of another liquid cooling system according to an embodiment of the present invention. Fig. 4B is an exploded schematic diagram of the liquid cooling system of Fig. 4A. Referring to FIGS. 4A and 4B, and FIGS. 1A to 3B, a liquid cooling system 400 includes two liquid cooling systems 100 and 500 arranged horizontally. The elements and components of the liquid cooling systems 100 and 500 are substantially the same as those described above. Therefore, reference may be made to the foregoing, and the description will not be repeated for the sake of brevity. The liquid cooling systems 100 and 500 can be used to cool various heating devices contained in a large-area electronic component chassis or electronic system.

In some embodiments, the heat sink may be made of a single piece of conductive material such as copper, but the invention is not limited to this. Those skilled in the art can easily understand that in other embodiments, other conductive materials can be used depending on the application, size, and available space.

In some embodiments, the heat exchange pump 110 can be fixed to a heating device by any suitable fixing method (such as soldering, brazing, or thermally conductive glue combined with glue). Alternatively, other fixing methods such as removable coupling methods may be used to ensure direct thermal contact between the free surface of the heating device and the liquid cooling system.

In some embodiments, the liquid cooling system is used to cool various heating devices contained in an electronic component chassis or electronic system. In other embodiments, the liquid cooling system is only used to cool selected multiple heating devices, or only one heating device, while other heating devices are cooled by other or supplementary devices.

In various embodiments, a liquid cooling system is provided, which includes a radiator with a first built-in liquid storage tank and a second built-in liquid storage tank, a multi-fan unit, at least one heat exchange pump, and a plurality of fluid ducts. The heat generated by the heating device is transferred to the cooling fluid flowing through the heat exchange pump, and then output to the radiator. The heated cooling fluid flows through a radiator with a built-in liquid storage tank and cools along a plurality of radiating fins. The cooling fluid flows to the heat exchange pump to start the cooling cycle again. In addition to solving the fluid loss caused by permeation over time, the built-in liquid storage tank also dissipates the heat generated by the side of the multi-fan unit. In addition, the built-in storage tank eliminates the need for separate storage tank components. Therefore, it is no longer necessary to allocate the location of the storage slot in the electronic component chassis or electronic system, thereby reducing the total installation time, the risk of leakage and the problem of component placement.

The inventive concept currently disclosed is not intended to be limited to the embodiments shown in this document, but is consistent with the full scope of these embodiments, which is the same as the principle on which the concept disclosed in this document is based. To. The direction and reference of elements, such as "up", "down", "top", "bottom", "horizontal", "vertical", "left", "right", etc., do not indicate absolute relationships, positions, and/or Or direction. The terms of the elements (for example, "first" and "second") are not literal, but distinguishing terms. As used herein, the term "comprising" encompasses the concepts of "including" and "having" and indicates the existence of elements, operations and/or groups or combinations thereof, and does not mean to exclude the existence or addition of one or more Other elements, operations and/or groups or combinations thereof. Unless otherwise specified, the order of operations does not mean an absolute order. Unless specifically stated otherwise, elements mentioned in the singular (such as through the use of the articles "a" or "an") are not used to mean "one and only one", but "one or more". As used herein, "and/or" means "and" or "or" as well as "and" and "or." As used herein, ranges and subranges refer to all ranges that include the entire and/or partial values therein, and terms that define or modify ranges and subranges, such as "at least", "greater than", "less than", "not greater than" Etc., indicating sub-ranges and/or upper or lower limits As known or later known by those of ordinary knowledge in the art, all structural and functional equivalents of the elements of the various embodiments described throughout the present invention are intended to be covered by the features described and claimed herein. Moreover, the content disclosed in this article is not intended to be dedicated to the public, regardless of whether the content disclosed can be clearly stated in the scope of the patent application. Unless elements or concepts explicitly use terms such as "means for" or "steps for", the elements or concepts presented here or below shall not be interpreted in terms of functional means.

In view of the many possible embodiments to which the disclosed principles can be applied, we reserve the right to claim any and all combinations of the features and actions described herein, including all the rights that fall within the scope and spirit of the foregoing description, and The following applies for patent scope and any claims made at any time during the entire prosecution period of this application or any application claiming the benefits or priority of this application, and combinations thereof literally and equivalently stated.

100: Liquid cooling system

110: Heat exchange pump

120: fluid conduit

124: The first mobile port

126: Second mobile port

150: first cavity

160: Multi-fan unit

170: second cavity

180: radiator

191: bottom shell

194: Longitudinal fluid channel

196: heat sink

199: top shell

Claims (11)

A liquid cooling system includes: a radiator with a first built-in liquid storage tank and a second built-in liquid storage tank; a multi-fan unit arranged in the first built-in liquid storage tank and the second built-in liquid storage tank Between; at least one heat exchange pump; and a plurality of fluid conduits, coupled to the at least one heat exchange pump and the radiator, to jointly form a cooling circuit for circulating a cooling fluid; wherein, from the first A built-in liquid storage tank in the direction of the second built-in liquid storage tank, the projection of the multi-fan unit on the second built-in liquid storage tank and the first built-in liquid storage tank on the second built-in liquid storage tank The projections overlap. The liquid cooling system according to claim 1, wherein the radiator includes a first cavity and a second cavity opposite to the first cavity, the first cavity having a first flow chamber and the first cavity A built-in liquid storage tank, the second cavity has a second flow chamber and the second built-in liquid storage tank, and the first flow chamber and the second flow chamber are in the first built-in liquid storage tank and the second The built-in liquid storage tanks are in fluid communication. The liquid cooling system according to claim 2, wherein the first cavity further has at least one first flow port, the second cavity further has at least one second flow port, and the fluid conduits are attached to the at least one The first flow port and the at least one second flow port are connected to the heat sink. The liquid cooling system according to claim 2, wherein the radiator further includes a top shell, a bottom shell, and a plurality of longitudinal fluid channels, and the top shell and the bottom shell are arranged in the first flow chamber and the second flow Between the chambers, the longitudinal fluid channels are arranged in multiple rows and columns between the top shell and the bottom shell, and each of the longitudinal fluid channels makes the first flow chamber And the second flow chamber are in fluid communication with each other. The liquid cooling system according to claim 4, wherein the radiator further includes a plurality of radiating fins, the radiating fins are disposed between the first flow chamber and the second flow chamber, and the radiating fins span laterally Set at the adjacent intervals between the rows of the longitudinal fluid channels. The liquid cooling system according to claim 4, wherein the total number of the longitudinal fluid channels is twenty-four, and the longitudinal fluid channels are arranged in four rows and six columns. The liquid cooling system according to claim 4, wherein the longitudinal fluid channels are separated from each other with intervals, and the interval between the rows is greater than the interval between the columns. The liquid cooling system according to claim 4, wherein the radiator further includes at least one intermediate shell located between the top shell and the bottom shell. The liquid cooling system according to claim 1, wherein the fluid conduits are made of flexible plastic material and/or rigid metal material. The liquid cooling system according to claim 1, wherein either or both of the inner and outer sides of the fluid conduits are provided with a thin metal coating. The liquid cooling system according to claim 10, wherein the thin metal coating is made of copper.

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