[go: up one dir, main page]

TWI726806B - 水冷散熱裝置及其製造方法 - Google Patents

水冷散熱裝置及其製造方法 Download PDF

Info

Publication number
TWI726806B
TWI726806B TW109130029A TW109130029A TWI726806B TW I726806 B TWI726806 B TW I726806B TW 109130029 A TW109130029 A TW 109130029A TW 109130029 A TW109130029 A TW 109130029A TW I726806 B TWI726806 B TW I726806B
Authority
TW
Taiwan
Prior art keywords
heat dissipation
water
shielding structure
cover
dissipation fins
Prior art date
Application number
TW109130029A
Other languages
English (en)
Other versions
TW202209045A (zh
Inventor
林魏彬
朱忠龍
陳翼正
Original Assignee
訊凱國際股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 訊凱國際股份有限公司 filed Critical 訊凱國際股份有限公司
Application granted granted Critical
Publication of TWI726806B publication Critical patent/TWI726806B/zh
Publication of TW202209045A publication Critical patent/TW202209045A/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309—Evaporators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20263—Heat dissipaters releasing heat from coolant
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/03—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits
    • F28D1/0308—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits the conduits being formed by paired plates touching each other
    • F28D1/035—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits the conduits being formed by paired plates touching each other with U-flow or serpentine-flow inside the conduits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一種水冷散熱裝置包含一導熱座體、一蓋體及一金屬隔離件。導熱座體具有一流體容置空間、多個散熱鰭片。這些散熱鰭片位於流體容置空間，並凸出於流體容置空間一側的一壁面。任二相鄰之這些散熱鰭片間形成一流道。至少部分這些散熱鰭片遠離壁面之一側形成一遮蔽結構，該遮蔽結構遮閉至少部分流道。蓋體具有一入水口及一出水口。蓋體安裝於導熱座體，以令蓋體覆蓋流體容置空間，以及入水口與出水口透過流體容置空間相連通。金屬隔離件之一側焊接於遮蔽結構，以及金屬隔離件之另一側焊接於蓋體。

Description

水冷散熱裝置及其製造方法
本發明係關於一種散熱裝置及其製造方法，特別是一種水冷散熱裝置及其製造方法。
隨著電子設備計算效能日漸增強，其內部所設置之電子元件於運作時會產生大量熱量。為了避免電子元件的運作溫度超過所能承受的溫度上限，故電子元件上一般會設置散熱鰭片，以藉由熱散鰭片來帶走電子元件所產生之熱能。不過，由於散熱鰭片在單位時間內之散熱效率有限，故目前有廠商將散熱鰭片改成散熱效果較佳的水冷系統，以增強對電子元件的散熱效能。水冷系統一般是包含一水冷頭及一水冷排。水冷頭設有泵浦。水冷頭與水冷排相連通並共同構成一冷卻循環，並透過水冷頭驅使冷卻循環內之工作流體流動。水冷頭裝設於處理器等發熱源，並將吸收到之熱量透過流體傳遞至水冷排進行散熱。
水冷頭內部目前具有一吸熱腔體及一散熱鰭片。吸熱腔體熱接觸於熱源，以將熱源所產生之熱能傳遞至吸熱腔體內部的工作流體。散熱鰭片120位於吸熱腔體內，以提升熱能傳遞至吸熱腔體的導熱速率。此外，吸熱腔體內部會額外設置橡膠製之隔流墊，透過隔流墊之鏤空處之位置設計來設計出所需之冷卻流道。
此外，一般可將工作流體改為在工作溫度區域會產生相變化的冷媒，以透過相變化的潛熱來提高水冷系統的散熱效果。不過，由於水冷頭的內部壓力在相變化的過程會增加，原本採橡膠製之隔流墊的水冷頭難以抗衡，故如何提升水冷頭的結構強度，便成為設計上的一大課題。
本發明在於提供一種水冷散熱裝置及其製造方法，藉以提升水冷頭的結構強度。
本發明之一實施例所揭露之水冷散熱裝置包含一導熱座體、一蓋體及一金屬隔離件。導熱座體具有一流體容置空間及多個散熱鰭片。這些散熱鰭片位於流體容置空間，並凸出於流體容置空間一側的一壁面。任二相鄰之這些散熱鰭片間形成一流道。至少部分這些散熱鰭片遠離壁面之一側形成一遮蔽結構，遮蔽結構遮閉至少部分流道。蓋體具有一入水口及一出水口。蓋體安裝於導熱座體，以令蓋體覆蓋流體容置空間，以及入水口與出水口透過流體容置空間相連通。金屬隔離件之一側焊接於遮蔽結構，以及金屬隔離件之另一側焊接於蓋體。
本發明之另一實施例所揭露之水冷散熱裝置的製造方法包含下列步驟。於一導熱座體形成多個散熱鰭片。於這些散熱鰭片之一側形成一板件。板件遮閉這些散熱鰭片間之多個流道。將一金屬隔離件焊接於板件。
根據上述實施例之水冷散熱裝置及其製造方法，由於金屬隔離件之一側焊接於遮蔽結構，以及金屬隔離件之另一側焊接於蓋體，故可提升水冷散熱裝置的結構強度。此外，由於遮蔽結構封閉散熱鰭片間至少部分的流道，故金屬隔離件在焊接於遮蔽結構時，焊料不會流至流道。也就是說，若金屬隔離件直接焊接於散熱鰭片，則焊接金屬隔離件與遮蔽結構之焊料就有可能流入流道而有可能變成次級品，甚或是無法使用。
以上關於本發明內容的說明及以下實施方式的說明係用以示範與解釋本發明的原理，並且提供本發明的專利申請範圍更進一步的解釋。
請參閱圖1至圖4。圖1為根據本發明第一實施例所述之水冷散熱裝置的立體示意圖。圖2為圖1的分解示意圖。圖3為圖1之剖面示意圖。圖4為圖3之局部放大示意圖。
本實施例之水冷散熱裝置10例如為水冷頭或水冷板，且水冷散熱裝置10的材質例如為金、銀、銅、鋁。並熱耦合於一熱源(未繪示)。熱源(未繪示)例如為中央處理器或影像處理器。水冷散熱裝置10例如包含一導熱座體100、一蓋體200及一金屬隔離件300。
導熱座體100的材質例如為金、銀、銅、鋁等良導熱材質，並具有一流體容置空間110及多個散熱鰭片120。這些散熱鰭片120位於流體容置空間110，並凸出於流體容置空間110一側的一壁面111。任二相鄰之這些散熱鰭片120間形成一流道G。在本實施例中，這些散熱鰭片120例如為切削式散熱鰭片，但並不以此為限。在其他實施例中，這些散熱鰭片也可以改為鋁擠式散熱鰭片。
至少部分這些散熱鰭片120遠離壁面111之一側形成一遮蔽結構130。遮蔽結構130例如呈片狀結構，並遮閉至少部分流道G。
此外，其中導熱座體100具有一熱接觸面140。熱接觸面140背對壁面111，並用以熱耦合於熱源。
蓋體200的材質例如但並不以此為限為金、銀、銅等良導熱材質，並具有一入水口210及一出水口220。入水口210與出水口220分別用以透過流管連接水冷排(未繪示)之出水口與入水口，以令水冷散熱裝置10與水冷排共同構成冷卻循環。蓋體200安裝於導熱座體100，以令蓋體200覆蓋流體容置空間110，以及入水口210與出水口220透過流體容置空間110相連通。
金屬隔離件300之一側焊接於遮蔽結構130，以及金屬隔離件300之另一側焊接於蓋體200。
在本實施例中，金屬隔離件300具有一第一開槽310。遮蔽結構130圍繞出一流通區131。第一開槽310透過流通區131與這些流道G連通。入水口210依序透過第一開槽310及流通區131而與流體容置空間110中之這些流道G相連通。此外，金屬隔離件300還可以具有二第二開槽320與一第三開槽330。流道G透過第二開槽320及第三開槽330而與出水口220相連通。
在本實施例中，由於金屬隔離件300之一側焊接於遮蔽結構130，以及金屬隔離件300之另一側焊接於蓋體200，故可提升水冷散熱裝置10的結構強度。此外，由於遮蔽結構130封閉散熱鰭片120間至少部分的流道G，故金屬隔離件300在焊接於遮蔽結構130時，焊料不會流至流道G。也就是說，若金屬隔離件300直接焊接於散熱鰭片120，則焊接金屬隔離件300與遮蔽結構130之焊料就有可能流入流道G而讓成品有可能變成次級品，甚或是無法使用。
如圖2所示，在本實施例中，工作流體(未繪示)沿方向F先自入水口210流入，再透過第一開槽310與流通區131流入散熱鰭片120間之流道G，再流至散熱鰭片120相對兩側的空間，並透過第二開槽320與第三開槽330而自出水口220流出。
請參閱圖3至圖7。圖5至圖7為圖1之水冷散熱裝置的製造流程示意圖。如圖5所示，例如透過切削式製程於一導熱座體100形成多個散熱鰭片120。不過，透過切削式製程來形成散熱鰭片120並非用以限制本發明。在其他實施例中，亦可改為透過鋁擠製程來形成散熱鰭片。接著，如圖6所示，例如透過一擠壓製程於這些散熱鰭片120之一側形成一遮蔽結構130。遮蔽結構130遮閉這些散熱鰭片120間之多個流道G。接著，如圖7所示，將一金屬隔離件300焊接於遮蔽結構130。接著，如圖3與圖4所示，將一蓋體200焊接於金屬隔離件300遠離遮蔽結構130之一側，以製作出水冷散熱裝置10。
根據上述實施例之水冷散熱裝置及其製造方法，由於金屬隔離件之一側焊接於遮蔽結構，以及金屬隔離件之另一側焊接於蓋體，故可提升水冷散熱裝置的結構強度。此外，由於遮蔽結構封閉散熱鰭片間至少部分的流道，故金屬隔離件在焊接於遮蔽結構時，焊料不會流至流道。也就是說，若金屬隔離件直接焊接於散熱鰭片，則焊接金屬隔離件與遮蔽結構之焊料就有可能流入流道而有可能變成次級品，甚或是無法使用。
雖然本發明以前述之諸項實施例揭露如上，然其並非用以限定本發明，任何熟習相像技藝者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。
10:水冷散熱裝置 100:導熱座體 110:流體容置空間 111:壁面 120:散熱鰭片 130:遮蔽結構 131:流通區 140:熱接觸面 200:蓋體 210:入水口 220:出水口 300:金屬隔離件 310:第一開槽 320:第二開槽 330:第三開槽 G:流道
圖1為根據本發明第一實施例所述之水冷散熱裝置的立體示意圖。 圖2為圖1的分解示意圖。 圖3為圖1之剖面示意圖。 圖4為圖3之局部放大示意圖。 圖5至圖7為圖1之水冷散熱裝置的製造流程示意圖。
10:水冷散熱裝置
100:導熱座體
110:流體容置空間
111:壁面
120:散熱鰭片
130:遮蔽結構
131:流通區
140:熱接觸面
200:蓋體
210:入水口
220:出水口
300:金屬隔離件
310:第一開槽
G:流道

Claims (8)

  1. 一種水冷散熱裝置，包含：一導熱座體，具有一流體容置空間及多個散熱鰭片，該些散熱鰭片位於該流體容置空間，並凸出於該流體容置空間一側的一壁面，任二相鄰之該些散熱鰭片間形成一流道，至少部分該些散熱鰭片遠離該壁面之一側形成有與至少部分該些散熱鰭片一體成形的一遮蔽結構，該遮蔽結構遮閉至少部分該流道；一蓋體，具有一入水口及一出水口，該蓋體安裝於該導熱座體，以令該蓋體覆蓋該流體容置空間，以及該入水口與該出水口透過該流體容置空間相連通；以及一金屬隔離件，該金屬隔離件之一側焊接於該遮蔽結構，以及該金屬隔離件之另一側焊接於該蓋體。
  2. 如請求項1所述之水冷散熱裝置，其中該些散熱鰭片為切削式散熱鰭片。
  3. 如請求項1所述之水冷散熱裝置，其中該金屬隔離件具有一第一開槽，該遮蔽結構圍繞出一流通區，該第一開槽透過該流通區與該些流道連通，該入水口透過該流體容置空間中之該些流道、該流通區及該第一開槽連通該出水口。
  4. 如請求項1所述之水冷散熱裝置，其中該導熱座體具有一熱接觸面，該熱接觸面背對該壁面。
  5. 一種水冷散熱裝置的製造方法，包含：於一導熱座體形成多個散熱鰭片； 於該些散熱鰭片之一側形成與該些散熱鰭片一體成形的一遮蔽結構，該遮蔽結構遮閉該些散熱鰭片間之多個流道；以及將一金屬隔離件焊接於該遮蔽結構。
  6. 如請求項5所述之水冷散熱裝置的製造方法，更包含將一蓋體焊接於該金屬隔離件遠離該遮蔽結構之一側。
  7. 如請求項5所述之水冷散熱裝置的製造方法，其中形成該些散熱鰭片的製程為切削式製程。
  8. 如請求項5所述之水冷散熱裝置的製造方法，其中形成該遮蔽結構的製程為一擠壓製程。
TW109130029A 2020-08-27 2020-09-02 水冷散熱裝置及其製造方法 TWI726806B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202010877260.2 2020-08-27
CN202010877260.2A CN114121849A (zh) 2020-08-27 2020-08-27 水冷散热装置及其制造方法

Publications (2)

Publication Number Publication Date
TWI726806B true TWI726806B (zh) 2021-05-01
TW202209045A TW202209045A (zh) 2022-03-01

Family

ID=77036720

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109130029A TWI726806B (zh) 2020-08-27 2020-09-02 水冷散熱裝置及其製造方法

Country Status (3)

Country Link
US (1) US11910564B2 (zh)
CN (1) CN114121849A (zh)
TW (1) TWI726806B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4188043B1 (en) * 2021-11-29 2025-04-02 Ovh Method for assembling a liquid cooling assembly of a family of liquid cooling assemblies
CN114485229B (zh) * 2022-03-02 2023-10-03 东莞市鸿盈电子科技有限公司 一种一体式超薄水冷散热器制造方法
US20230284414A1 (en) * 2022-03-04 2023-09-07 Aavid Thermalloy, Llc Liquid cooled heat exchanger
US20250071937A1 (en) * 2023-08-21 2025-02-27 Coolit Systems, Inc. Heat exchanger with contact sealing and related systems and methods

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM571514U (zh) * 2018-12-11 Water-cooled head buckle structure
TWI684853B (zh) * 2018-01-30 2020-02-11 訊凱國際股份有限公司 液冷式熱交換裝置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5494098A (en) * 1994-06-17 1996-02-27 Wakefield Engineering, Inc. Fan driven heat sink
US5490559A (en) * 1994-07-20 1996-02-13 Dinulescu; Horia A. Heat exchanger with finned partition walls
US20040068991A1 (en) * 1999-10-07 2004-04-15 Ben Banney Heat exchanger for an electronic heat pump
US6367543B1 (en) * 2000-12-11 2002-04-09 Thermal Corp. Liquid-cooled heat sink with thermal jacket
US20040006899A1 (en) * 2002-07-09 2004-01-15 Koch Roger D. Frame assembly for a work machine digging assembly
WO2005088714A1 (en) * 2004-03-08 2005-09-22 Remmele Engineering, Inc. Cold plate and method of making the same
JP5331475B2 (ja) * 2005-06-07 2013-10-30 ウォルベリン チューブ， インコーポレイテッド 電子部品冷却用の伝熱面
US9453691B2 (en) * 2007-08-09 2016-09-27 Coolit Systems, Inc. Fluid heat exchange systems
CN102065667B (zh) * 2009-11-12 2015-03-25 赛恩倍吉科技顾问（深圳）有限公司 电子装置及其散热装置
JP5813300B2 (ja) * 2010-08-23 2015-11-17 三桜工業株式会社 冷却装置
EP2801110A4 (en) * 2012-01-05 2016-02-17 Sapa Ab COOLING BODY AND METHOD FOR ITS MANUFACTURE
CN106034394B (zh) * 2015-03-20 2018-02-09 技嘉科技股份有限公司 散热器与散热装置
JP2016207928A (ja) * 2015-04-27 2016-12-08 ファナック株式会社 複数の発熱部品を冷却するヒートシンク
US10388589B2 (en) * 2015-11-25 2019-08-20 Mitsubishi Electric Corporation Semiconductor device, inverter device, and vehicle
JP3208546U (ja) * 2016-11-07 2017-01-26 奇▲こう▼科技股▲ふん▼有限公司 水冷ラジエーター構造
US20180228040A1 (en) * 2017-02-03 2018-08-09 Asetek Danmark A/S Liquid cooling systems for heat generating devices
US11940222B2 (en) * 2017-09-12 2024-03-26 Sumitomo Precision Products Co., Ltd. Heat sink module with through-hole
US10986756B2 (en) * 2017-12-28 2021-04-20 Hughes Network Systems Llc Cooling apparatus for an electrical component
CN110543069A (zh) * 2018-05-28 2019-12-06 中强光电股份有限公司 液冷式散热器
US20210333055A1 (en) * 2020-04-28 2021-10-28 Hamilton Sundstrand Corporation Stress relieving additively manufactured heat exchanger fin design

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM571514U (zh) * 2018-12-11 Water-cooled head buckle structure
TWI684853B (zh) * 2018-01-30 2020-02-11 訊凱國際股份有限公司 液冷式熱交換裝置

Also Published As

Publication number Publication date
US20220071056A1 (en) 2022-03-03
TW202209045A (zh) 2022-03-01
US11910564B2 (en) 2024-02-20
CN114121849A (zh) 2022-03-01

Similar Documents

Publication Publication Date Title
TWI726806B (zh) 水冷散熱裝置及其製造方法
CN107567248B (zh) 液冷散热装置
US20060021737A1 (en) Liquid cooling device
TWM512883U (zh) 散熱模組、水冷式散熱模組及散熱系統
CN111417286A (zh) 一种均热板水冷模组
CN109979901A (zh) 用于电力半导体功率器件的双面水冷散热器
TWI750636B (zh) 液冷式散熱模組及具有該液冷式散熱模組的電子裝置
CN111490448A (zh) 一种激光器模块
TWM586876U (zh) 複合水冷排結構
TWM622696U (zh) 液冷裝置
TWI635248B (zh) 蒸發器及其製作方法
CN210040184U (zh) 一种微通道水冷板
TWM609021U (zh) 液冷散熱裝置及具有該液冷散熱裝置的液冷散熱系統
TWI837610B (zh) 電子元件之熱面拉出裝置
TWI807461B (zh) 液冷裝置
CN104349648B (zh) 复合式散热组件
CN217523124U (zh) 水冷头
JP2005011928A (ja) 液冷循環システム
CN212677610U (zh) 水冷散热装置
TWI715094B (zh) 複合水冷排結構
TWM535456U (zh) 蒸發器
TWM628154U (zh) 用於記憶體模組的氣液雙冷型散熱器
CN207132762U (zh) 散热装置之热交换结构
TWI676246B (zh) 水冷散熱裝置
TWI664524B (zh) 水冷排散熱結構