TWI724656B - Radio frequency identification device and manufacturing method of the same - Google Patents

Abstract

A radio frequency identification device (RFID), includes a first component and a second component. The first component has a radiation layer and a first joint part, wherein an area enclosed by the outer frame of the radiation layer constitutes as a radiation pattern. The second component has a substrate, a loop antenna, a chip and a second joint part, wherein the loop antenna, the chip and the second joint part are disposed at the substrate, and the chip is electrically connected to the loop antenna. The first joint part and the second joint part are detachably jointed to each other, and the radiation layer and the loop antenna are electromagnetically coupled with each other.

Description

Radio frequency identification device and manufacturing method thereof

The present invention relates to a radio frequency identification device and a manufacturing method thereof, and particularly relates to a replaceable radio frequency identification device and a manufacturing method thereof.

The current radio frequency identification (RFID) technology is to store data in the chip and read the data stored in the chip with an external reader (Reader); similarly, radio frequency identification can also be used Write the data into the chip by the writer (Writer), or rewrite the data stored in the chip. The simple nature of radio frequency identification makes it widely used in various fields, such as transportation cards, identification cards, access cards, and container transportation.

Among them, the manufacture of radio frequency identification devices is mostly to print the antenna pattern and the loop antenna provided with a chip on the same substrate to achieve the purpose of mass production. However, as long as one of the antenna pattern or loop antenna is damaged or the user's needs change (for example, the user needs to use a different chip, or a different radiation pattern is required due to factors such as radiation/reading range) At this time, the user has to discard the entire radio frequency identification device, which not only causes trouble for the user to replace, but also causes unnecessary waste of resources. In addition, if customers need different types of radio frequency identification devices, the manufacturer can only abandon the original radio frequency identification devices and reproduce them according to customer needs according to the conventional technology, which will cause the problem of stockpiling for the manufacturer. .

In view of the foregoing, the present invention provides a radio frequency device and a manufacturing method thereof that meet the foregoing requirements.

A radio frequency device according to an embodiment of the present invention includes: a first member having a radiating layer and a first bonding portion, wherein the radiating layer forms a radiation pattern; and a second member having a carrier, A loop antenna, a chip, and a second bonding portion, the loop antenna, the chip, and the second bonding portion are disposed on the carrier board, and the chip is electrically connected to the loop antenna, the first bonding portion and The second coupling part is detachably coupled to each other, and the radiation layer is electromagnetically coupled with the loop antenna.

The above description of the disclosure and the following description of the implementation manners are used to demonstrate and explain the spirit and principle of the present invention, and to provide a further explanation of the patent application scope of the present invention.

The detailed features and advantages of the present invention will be described in detail in the following embodiments. The content is sufficient to enable anyone familiar with the relevant art to understand the technical content of the present invention and implement it accordingly, and in accordance with the content disclosed in this specification, the scope of patent application and the drawings. Anyone who is familiar with relevant skills can easily understand the purpose and advantages of the present invention. The following examples further illustrate the viewpoints of the present invention in detail, but do not limit the scope of the present invention by any viewpoint.

Please refer to FIGS. 1A and 1B together, in which FIG. 1A is a perspective exploded view of a radio frequency identification device according to an embodiment of the present invention; FIG. 1B is a perspective view of a radio frequency identification device according to an embodiment of the present invention sample graph. The radio frequency identification device (RFID) of this embodiment preferably includes a first member 1 and a second member 2. In detail, the first member 1 includes a radiation layer 11 and a first joining portion J1, and the radiation layer 11 constitutes a radiation pattern 110 (Radiation Pattern), which means that the outer periphery of the radiation layer 11 forms the radiation pattern 110; second The component 2 includes a carrier board 20, a loop antenna 21 (Loop Antenna), a chip 22, and a second coupling portion J2, and the loop antenna 21, the chip 22 and the second coupling portion J2 are the carrier board 20 provided on the second component 2 . In addition, the loop antenna 21 is electrically connected to the chip 22, and the second coupling portion J2 is used for detachably coupling with the first coupling portion J1. In addition, the radiating layer 11 and the loop antenna 21 are electromagnetically coupled to each other, and when the first joining portion J1 and the second joining portion J2 are combined, the transmission distance of the combined first member 1 and the second member 2 will be shorter than that of the second member 2. The transmission distance itself is longer. The radiation pattern 110 shown in the present invention is only an example, and the radiation pattern 110 can be different patterns depending on factors such as different radiation ranges/distances, manufacturing methods, etc., and the present invention is not limited thereto.

Please continue to refer to FIG. 1B. FIG. 1B is a radio frequency identification device according to an embodiment of the present invention, in which the chip 22 is electrically connected to the loop antenna 21, and the second member 2 itself has a first transmission distance, and The first member 1 and the second member 2 combined with the first joint portion J1 and the second joint portion J2 have a second transmission distance, and the second transmission distance is greater than the first transmission distance. In detail, the second transmission distance may be ten to forty times the first transmission distance. For example, if the first transmission distance is 5cm to 30cm, the second transmission distance can reach 50cm to 12m. Therefore, as long as the reader is within the second transmission distance, the reader can read the data stored in the chip 22 Data and/or write data into the chip 22, or rewrite the data stored in the chip 22, the present invention is not limited to this.

Please continue to refer to FIG. 1B. The first joining portion J1 is preferably a part of the radiation pattern 110. For example, the middle section 110c connecting the two radiating end portions 110a and 110b in the radiation pattern 110 is used as the first joining portion J1. The two joining portions J2 are preferably two clamping grooves extending inward from one side of the carrier board 20 but not intersecting the loop antenna 21. In detail, when the middle section 110c is inserted into any clamping channel, the parts located on both sides of the clamping channel will be reset in the opposite direction due to the elasticity of the carrier plate 20 to clamp the middle section 110c. This completes the assembly structure for detachably coupling the first coupling portion J1 (middle section 110c) with the second coupling portion J2 (clamping channel). However, the second coupling portion J2 can be implemented as long as it can be engaged with the first coupling portion J1, and the present invention is not limited to the number, position or shape of the second coupling portion J2 (clamping channel). In addition, according to the radio frequency identification device disclosed in this embodiment, part of the loop antenna 21 is preferably located between the chip 22 and the middle section 110c (as shown in FIG. 1B) to have a better transmission distance. The chip 22 may also be located between the middle section 110c and part of the loop antenna 21, and the present invention is not limited to this.

In addition, please refer to FIG. 1C. If the overlapping area of the carrier 20 and the radiation pattern 110 is large (for example, as shown in FIG. 1C, the overlapping area of the carrier 20 and the radiation pattern 110 includes the radiation ends 110a, 110b). Part), the first joining portion J1 can be a part of the two radiation ends 110a, 110b of the radiation pattern 110, and as the two clamping grooves of the second joining portion J2 and located at two The first coupling portion J1 of the radiating end portions 110a, 110b is aligned to be coupled with the first coupling portion J1.

1D, the second coupling portion J2 can also be two clamping grooves extending inward from two different sides of the carrier board 20, so that the first member 1 is inserted into the two clamping grooves from different directions Road, thereby improving the stability of the bonding between the first bonding portion J1 and the second bonding portion J2. In addition, as shown in Figure 1D, the two clamping grooves serving as the second joining portion J2 preferably extend inward from the two opposite sides of the carrier board 20, so that the elasticity of the first member 1 can be more utilized. The part where the carrier board 20 is clamped in two opposite directions between the two clamping grooves (that is, as shown in FIG. 1D, the part which is positioned between the two clamping grooves and is provided with the loop antenna 21).

Please refer to FIGS. 2A-2B. FIGS. 2A-2B are exemplary diagrams of a radio frequency identification device according to various embodiments of the present invention. The radio frequency identification device shown in FIGS. 2A-2B is similar to the radio frequency identification device shown in FIGS. 1B-1D, so the similarities will not be repeated here. However, the difference between the radio frequency identification device shown in FIGS. 2A-2B and that shown in FIGS. 1B-1D is: the first joint portion J1' and the second joint portion J2' of FIGS. 2A-2B are different from those shown in FIG. 1B -1D first joint portion J1 and second joint portion J2, therefore the shape/size of the carrier board 20' and the position and form of the first joint portion J1' and the second joint portion J2' shown in FIGS. 2A-2B Etc. may be different from the carrier board 20 of FIGS. 1B-1D. For example, as shown in the carrier board 20' shown in FIG. 2B, any one of the two clamping grooves forming a part of the second joining portion J2' may have a "T" shape, that is, any The clamping groove extends inward from one side of the carrier board 20', and the end of the clamping groove away from the side is bifurcated.

Please return to FIG. 2A. If the overlapping area of the carrier board 20' and the radiation pattern 110 is relatively large, the second joining portion J2' is still two clamping grooves extending inward from the two different sides of the carrier board 20' However, the width of each clamping channel is larger than the width of the middle section 110c, but smaller than the width of the radiating end portions 110a, 110b. Thereby, when the radiating layer 11 is inserted into the clamping channel, the parts of the carrier board 20' on both sides of the single clamping channel can be pressed against one side surface of the radiating layer 11 (the radiating ends 110a, 110b are adjacent to the middle The surface of the section 110c), and the position of the carrier board 20' between the two clamping channels is pressed against the other side surface of the radiation layer 11 (the surface of the middle section 110c). In other words, in this embodiment, the first joining portion J1' is the surface of the radiating end portions 110a, 110b pressing against the surface of the carrier board 20', and the middle section 110c pressing against the surface of the carrier board 20'; and the second connecting portion J2 'It is the two clamping grooves extending inward from the two different sides of the carrier board 20'.

Please refer to FIG. 2B. In this embodiment, the second coupling portion J2' is not only two clamping grooves extending inwardly from two different sides of the carrier 20', but also includes two clamping grooves respectively formed thereon. The two bifurcated slits at the end of the channel, whereby any one of the two clamping channels constituting a part of the second joining portion J2' can be in a "T" shape. The length of the bifurcated slit is preferably greater than the width of the middle section 110c but less than the width of the radiating end portions 110a, 110b, so that when the radiating layer 11 is inserted into the clamping channel, the carrier 20' is located at the edge of the single clamping channel. The parts on both sides and between the bifurcated slits and the sides can be pressed against one side surface of the radiation layer 11, and the part of the carrier board 20' located between the two bifurcated slits can be pressed against the radiation layer 11 The other side surface. In other words, in this embodiment, the first joining portion J1' is the surface of the portion where the radiation layer 11 presses against the carrier board 20' between the bifurcation slits and the sides, and the radiation layer 11 presses against the carrier board 20. 'Located on the surface of the part between the two bifurcated slits; and the second joint portion J2' is two clamping grooves extending inward from the two different sides of the carrier 20', and are respectively formed in the two clamps Hold the bifurcated slit at the end of the channel.

Please refer to FIGS. 3A, 3B, and 3C together. FIGS. 3A, 3B, and 3C are exemplary diagrams of radio frequency identification devices according to other embodiments of the present invention. The composition of the radio frequency identification device shown in FIGS. 3A, 3B, and 3C is similar to that of the radio frequency identification device of FIGS. 1B-1D and 2A-2B, and the difference lies in the first part of the radio frequency identification device of FIGS. 3A, 3B, and 3C. The component 1 ′ further has a substrate 12. Wherein, the setting substrate 12 may be a single-layer or multi-layer substrate, and the setting substrate 12 may be a flexible substrate (for example, a polyimide (PI) substrate), a plastic substrate (for example, an FR4 substrate), and a copper foil The present invention is not limited to substrates, aluminum substrates or other metal substrates.

In detail, the radiation layer 11 is disposed on the mounting substrate 12, so the first coupling portion J1" is preferably located in the clamping channel of the mounting substrate 12; the second coupling portion J2" is preferably two from the carrier board 20". Protrusions extending from the sides respectively. In the embodiment of FIG. 3A, in a reference direction perpendicular to the side where any protruding portion is provided, the first joining portion J1" and the second joining portion J2" can be It is a staggered arrangement; in the embodiment of FIG. 3B, in a reference direction perpendicular to the side where any protruding portion is arranged, the first joining portion J1" and the second joining portion J2" can be arranged in alignment. In this way, the second joining portion J2" can pass through the first joining portion J1" (clamping channel). Therefore, when the first member 1'is combined with the second member 2', the second joining portion J2" and the radiation The layers 11 will be respectively located on two different sides of the mounting substrate 12, and the second bonding portion J2" will abut the mounting substrate 12. Therefore, the embodiments of FIGS. 3A and 3B can be combined with the second bonding portion J1" The structures of the portions J2" are engaged with each other, and the first member 1'and the second member 2'can be separated by drawing the second coupling portion J2" from the first coupling portion J1".

Please refer to FIG. 3C, in the embodiment of FIG. 3C, the first coupling portion J1 ″ is a clamping piece for setting the substrate 12, and the second coupling portion J2 ″ is a clamping channel of the carrier board 20. Therefore, when the first joining portion J1" is combined with the second joining portion J2", the first joining portion J1" (fixing piece) will pass through the second joining portion J2" (clamping channel), so that the first joining The part J1" can abut against the carrier board 20.

Although FIGS. 3A and 3B show that the first joining portion J1" is a clamping channel spaced apart from the radiation layer 11, the clamping channel forming the first joining portion J1" can also be arranged to be aligned with the radiation layer 11. After the second member 2'is combined with the first member 1', the relative positional relationship between the second member 2'and the radiating layer 11 can still take the form shown in Figs. 1D, 2A and 2B.

Please refer to FIGS. 1A-1D, 2A-2B, and 3A-3B together. In the radio frequency device according to one or more embodiments of the present invention, the loop antenna 21 preferably faces the radiating layer 11 (ie, the loop The antenna 21 will be located between the carrier 20/20'/20” and the radiating layer 11), but the loop antenna 21 can also be opposite to the radiating layer 11 (that is, the carrier 20/20’/20” will be positioned in the back Between the loop antenna 21 and the radiating layer 11), the present invention is not limited to this.

Please refer to FIG. 4, where FIG. 4 is a flowchart of a method for manufacturing a radio frequency device according to an embodiment of the present invention.

Please refer to step S01 and also refer to FIG. 1B: the radiation layer 11 and the first joining portion J1 are formed on the first member 1, so that the radiation pattern 110 is formed by the radiation layer 11. In detail, the formation of the radiation layer 11 on the first member 1 in step S01 may be etching (Etch), laser engraving or stamping of aluminum or other suitable metal substrates to form the radiation layer 11, and A receiving platform is preferably provided under the aluminum or other suitable metal substrate to receive the radiation layer 11.

Please refer to FIG. 4 and FIG. 3A together. Except that the radiating layer 11 and the first bonding portion J1 are used as the first member 1 (step S01 and FIG. 1B), according to the method of manufacturing the radio frequency device of this embodiment, The formation of the first member 1'can also be performed in step S01'. In detail, according to step S01', the formation of the first member 1'can also be to provide the radiation layer 11 and the first bonding portion J1" on the mounting substrate 12, and to use the radiation layer 11, the mounting substrate 12 and the first bonding portion J1. "As the first member 1'. Wherein, the formation of the radiation layer 11 on the first member 1'can be to form one or more radiation layers 11 in a single process; in addition, the method of forming the radiation layer 11 includes printing, sputtering or vapor deposition on the radiation layer 11 The substrate 12, the present invention is not limited thereto.

In addition, there is no restriction on the order of forming the radiation layer 11 and the first joining portion J1" in step S01'. In other words, the execution of step S01' may be to form the radiation layer 11 first and then to form the first joining portion J1" Alternatively, the first joining portion J1" may be formed first, and then the radiation layer 11 may be formed.

Please continue to refer to steps S01 and S01', where the first bonding portion formed on the first member may be a part of the radiation pattern as the first bonding portion (for example, the first bonding portion shown in FIGS. 1A-1D and 2A-2B). Bonding portion J1/J1'); when the radiation layer is provided on the mounting substrate as shown in FIGS. 3A and 3B, forming the first bonding portion on the first member can be achieved by die-cutting the mounting substrate (for example, as shown in FIG. The first joint J1" shown in 3A-3B).

Please refer to step S03 and also refer to FIG. 1B or FIG. 3A. In step S03, the loop antenna 21, the chip 22, and the second bonding portion J2 are formed on the carrier 20 of the second component 2, wherein the chip 22 is electrically connected to the loop Antenna 21. The formation of the loop antenna 21 on the carrier board 20 in step S03 can be performed in a manner similar to step S01', that is, the loop antenna 21 is printed, sputtered, or vapor-deposited on the carrier board 20, or is applied to the carrier board 20. The upper aluminum or other suitable metal substrate is etched to form the loop antenna 21, and forming the loop antenna 21 on the carrier 20 can be one or more loop antennas 21 formed in a single process. After the loop antenna 21 is formed, the chip 22 is then arranged on the loop antenna 21 and the chip 22 is electrically connected to the loop antenna 21. Wherein, setting the chip 22 on the loop antenna 21 is preferably implemented by Surface-Mount Technology (SMT), but the present invention is not limited to this.

Please continue to refer to step S03, the forming of the second coupling portion on the carrier board may be die-cutting the carrier board to form a second coupling portion in the form of a clamping channel (for example, the second coupling portion shown in FIGS. 1A-1D). Part J2), or die-cut the carrier board so that the second joint part is a protruding part extending from the carrier board (for example, the second joint part J2'/J2 shown in FIGS. 2A-2B and 3A-3B) "). In addition, there is no restriction on the order of forming the loop antenna, the chip, and the second joint on the carrier of the second component in step S03. In other words, the execution of step S03 can be to form the loop antenna first And the chip and then form the second bonding portion, or the second bonding portion may be formed first and then the loop antenna and the chip are formed.

Wherein, steps S01 and S01' shown in FIG. 4 are executed before step S03, but steps S01 and S01' can also be executed after step S03 or simultaneously with step S03, and the present invention is not limited thereto.

Please continue to refer to FIG. 4 and also refer to FIG. 1B. After the first member 1 and the second member 2 are formed, step S05 is continued to combine the first joint portion J1 and the second joint portion J2 in a separable manner, wherein The radiating layer 11 and the loop antenna 21 are electromagnetically coupled to each other, and the second member 2 itself has a first transmission distance. The first member 1 and the second member 2 combined with each other have a second transmission distance, so that the first joint J1 When combined with the second joining portion J2, the second transmission distance of the combined first member 1 and the second member 2 is greater than the first transmission distance of the second member 2 itself, and when the first member 1 or the second member 2 is to be replaced At this time, it can be achieved by separating the first joining portion J1 and the second joining portion J2.

In summary, according to one or more embodiments of the radio frequency device and the manufacturing method of the present invention, the radiating layer and the loop antenna can be combined with one or more bonding parts in a separable manner. Therefore, for example, when one of the radiation layer or the loop antenna of the radio frequency device needs to be replaced, only one of them can be replaced, so as to avoid the other that does not need to be replaced from being discarded, which causes unnecessary waste. According to one or more embodiments of the radio frequency device and the manufacturing method of the present invention, the detachable/replaceable radio frequency device can also be used, so that the manufacturer does not need to reproduce a new radio frequency device due to customer demand, and then Avoid the problem of manufacturer's stockpile.

In addition, according to one or more embodiments of the radio frequency device and its manufacturing method of the present invention, the radiating layer and loop antenna in the radio frequency device can form multiple radiating layers at a time in a single manufacturing process or in a single process. In the manufacturing process, multiple loop antennas are formed at one time, and even multiple loop antennas at multiple radiation levels are formed on the same substrate at a time. Therefore, the radio frequency device and the manufacturing method thereof according to the present invention still have the advantage of mass production.

Although the present invention is disclosed in the foregoing embodiments, it is not intended to limit the present invention. All changes and modifications made without departing from the spirit and scope of the present invention fall within the scope of the patent protection of the present invention. For the scope of protection defined by the present invention, please refer to the attached scope of patent application.

1, 1’: The first component 11: Radiation layer 12: Set up the substrate 110: Radiation pattern 110a, 110b: radiating end 110c: middle section J1, J1’, J1”: the first joint 2, 2’: The second component 20, 20’, 20”: carrier board 21: Loop antenna 22: chip J2, J2’, J2”: the second joint

FIG. 1A is a three-dimensional exploded view of a radio frequency identification device according to an embodiment of the present invention. 1B, 1C, and 1D are exemplary diagrams of radio frequency identification devices according to various embodiments of the present invention. 2A and 2B are exemplary diagrams of radio frequency identification devices according to other embodiments of the present invention. 3A, 3B, and 3C are exemplary diagrams of radio frequency identification devices according to other embodiments of the present invention. FIG. 4 is a flowchart of a method of manufacturing a radio frequency device according to an embodiment of the present invention.

1: The first component

11: Radiation layer

110: Radiation pattern

110a, 110b: radiating end

110c: middle section

2: The second component

20: carrier board

21: Loop antenna

22: chip

J1: The first joint

J2: The second joint

Claims (9)

A radio frequency device includes: a first member having a radiation layer and a first bonding part, wherein the radiation layer forms a radiation pattern; and a second member having a carrier board, a loop antenna, and a chip And a second coupling portion, the loop antenna, the chip, and the second coupling portion are disposed on the carrier, and the chip is electrically connected to the loop antenna, the first coupling portion and the second coupling portion are detachable The ground is combined with each other, and the radiation layer and the loop antenna are electromagnetically coupled, wherein when the first member is combined with the second member, a part of the carrier of the second member is located on one side of the first member , The other part of the carrier board of the second member is located on the other side of the first member. The radio frequency device according to claim 1, wherein the first coupling part is a part of the radiation pattern. The radio frequency device according to claim 2, wherein the second coupling portion is a clamping groove extending inward from one side of the carrier board, and the first coupling portion is detachably inserted into the clamping slot A channel, and the two sides of the clamping channel are respectively located on two different sides of the radiation layer. The radio frequency device according to claim 2, wherein the second coupling portion is two clamping grooves extending inward from two different sides of the carrier board, and the first coupling portion is detachably inserted into The two clamping channels, and the two sides of each clamping channel are respectively located on two different sides of the radiation layer. The radio frequency device according to claim 2, wherein the radiation pattern includes two radiating end portions and a middle section, the middle section is connected to the two radiating end portions, and the second bonding portion faces from one side of the carrier board A clamping groove extends inward, and the width of the clamping groove is larger than the width of the middle section and smaller than the width of the two radiating ends. The radio frequency device according to claim 2, wherein the radiation pattern includes two radiating ends and a middle section, the middle section connects the two radiating ends and serves as the first joint, and the second joint includes A clamping groove extending inward from one side of the carrier, and a bifurcation slit formed at the end of the clamping groove, and the length of the bifurcation slit is greater than the width of the middle section and less than the width of the middle section. The width of the radiating end. The radio frequency device according to claim 1, wherein the first member further has a mounting substrate, the radiation layer is disposed on the mounting substrate, and the first bonding portion is located on the mounting substrate. The radio frequency device according to claim 7, wherein the first coupling portion is a clamping channel of the substrate; the second coupling portion extends from the carrier board When the first coupling portion is combined with the second coupling portion, the protruding portion passes through the clamping channel, and the protruding portion and the radiating layer are respectively positioned opposite to the setting substrate The two different sides make the protruding part abut the setting substrate. The wireless radio frequency device according to claim 7, wherein the first coupling part is a movable clamping piece of the set substrate; the second coupling part is a clamping channel of the carrier board, and when the first coupling part is When a coupling part is combined with the second coupling part, the fixing sheet and the radiation layer are respectively located on two different sides of the carrier board, so that the fixing sheet abuts against the carrier board.

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