TWI720884B - Anti-electromagnetic interference antenna - Google Patents
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Abstract
本發明揭露一種反電磁干擾天線,包含第一基板層、接地層、第一電路層、第二基板層、第二電路層、第三基板層、第三電路層、第四基板層以及第四電路層。接地層安裝於第一基板層的底面上且包含一接地迴路。接地迴路完全地覆蓋第一基板層底面,且由於接地迴路完全地覆蓋第一基板層底面,因此,天線輻射電路可避免電磁波從反電磁干擾天線的底面產生干擾。據此,電磁波可大部分地被隔離,以避免電磁干擾產生的雜訊影響安裝在電子裝置內的天線。The present invention discloses an anti-electromagnetic interference antenna, including a first substrate layer, a ground layer, a first circuit layer, a second substrate layer, a second circuit layer, a third substrate layer, a third circuit layer, a fourth substrate layer, and a fourth substrate layer. Circuit layer. The ground layer is installed on the bottom surface of the first substrate layer and includes a ground loop. The ground loop completely covers the bottom surface of the first substrate layer, and because the ground loop completely covers the bottom surface of the first substrate layer, the antenna radiation circuit can prevent electromagnetic waves from generating interference from the bottom surface of the anti-electromagnetic interference antenna. Accordingly, electromagnetic waves can be largely isolated to prevent noise generated by electromagnetic interference from affecting the antenna installed in the electronic device.
Description
本發明係有關於一種天線,特別是關於一種反電磁干擾(anti-EMI)天線。The present invention relates to an antenna, in particular to an anti-EMI (anti-EMI) antenna.
電子裝置通常包含無線通訊功能,因此,電子裝置係配備有天線或無線傳輸器,以支援無線通訊功能。Electronic devices usually include wireless communication functions. Therefore, electronic devices are equipped with antennas or wireless transmitters to support wireless communication functions.
然而,電子裝置更包含複數個積體電路(ICs),當操作電子裝置時,積體電路可能會產生電磁波。由積體電路產生的電磁波可能產生雜訊,進一步干擾安裝在電子裝置內的天線。因此,安裝在電子裝置內的天線仍有需要改進的地方。However, electronic devices further include a plurality of integrated circuits (ICs). When the electronic devices are operated, the integrated circuits may generate electromagnetic waves. The electromagnetic waves generated by the integrated circuit may generate noise, which further interferes with the antenna installed in the electronic device. Therefore, the antenna installed in the electronic device still needs improvement.
鑑於上述問題,本發明之目的在於提供一種反電磁干擾(anti-EMI)天線。本發明揭露之反電磁干擾天線可避免受到電磁干擾。反電磁干擾天線包含第一基板層、接地層、第一電路層、第二基板層、第二電路層、第三基板層、第三電路層、第四基板層以及第四電路層。In view of the above problems, the object of the present invention is to provide an anti-EMI (anti-EMI) antenna. The anti-electromagnetic interference antenna disclosed in the present invention can avoid electromagnetic interference. The anti-electromagnetic interference antenna includes a first substrate layer, a ground layer, a first circuit layer, a second substrate layer, a second circuit layer, a third substrate layer, a third circuit layer, a fourth substrate layer, and a fourth circuit layer.
接地層安裝於第一基板層之底面上,且包含一接地迴路;其中接地迴路完全地覆蓋第一基板層之底面。第一電路層包含一天線訊號電路以及複數個第一接地迴路,第一接地迴路安裝於天線訊號電路周圍。第一電路層安裝於第一基板層頂面以及第二基板層底面之間。The ground layer is installed on the bottom surface of the first substrate layer and includes a ground loop; wherein the ground loop completely covers the bottom surface of the first substrate layer. The first circuit layer includes an antenna signal circuit and a plurality of first ground loops. The first ground loops are installed around the antenna signal circuit. The first circuit layer is installed between the top surface of the first substrate layer and the bottom surface of the second substrate layer.
第二電路層包含第一天線電路、第二天線電路以及複數個第二接地迴路,第二接地迴路安裝於第一天線電路及第二天線電路周圍。The second circuit layer includes a first antenna circuit, a second antenna circuit, and a plurality of second ground loops. The second ground loops are installed around the first antenna circuit and the second antenna circuit.
第三基板層包含第一天線穿孔、第二天線穿孔以及複數個接地穿孔。第二電路層安裝於第二基板層之頂面以及第三基板層之底面之間。接地穿孔安裝於第一天線穿孔以及第二天線穿孔周圍。第一天線電路以及第二天線電路透過第二基板層電性連接天線訊號電路。第二接地迴路透過第二基板層電性連接第一接地迴路。The third substrate layer includes a first antenna through hole, a second antenna through hole, and a plurality of ground through holes. The second circuit layer is installed between the top surface of the second substrate layer and the bottom surface of the third substrate layer. The ground hole is installed around the first antenna hole and the second antenna hole. The first antenna circuit and the second antenna circuit are electrically connected to the antenna signal circuit through the second substrate layer. The second ground loop is electrically connected to the first ground loop through the second substrate layer.
第三電路層包含第三天線電路、第四天線電路以及複數個第三接地迴路。第三電路層安裝於第三基板層之頂面以及第四基板層之底面之間。The third circuit layer includes a third antenna circuit, a fourth antenna circuit, and a plurality of third ground loops. The third circuit layer is installed between the top surface of the third substrate layer and the bottom surface of the fourth substrate layer.
第一天線穿孔的兩端分別電性連接第一天線電路以及第三天線電路。第二天線穿孔兩端分別電性連接第二天線電路以及第四天線電路。Two ends of the first antenna hole are electrically connected to the first antenna circuit and the third antenna circuit, respectively. Both ends of the second antenna hole are electrically connected to the second antenna circuit and the fourth antenna circuit.
第四電路層安裝於第四基板層之頂面上,且包含一天線輻射電路以及複數個第四接地迴路。第四接地迴路安裝於該天線輻射電路周圍。天線輻射電路透過第四基板層電性連接第三天線電路以及第四天線電路。第四接地迴路透過第四基板層電性連接第三接地迴路。The fourth circuit layer is installed on the top surface of the fourth substrate layer and includes an antenna radiation circuit and a plurality of fourth ground loops. The fourth ground loop is installed around the antenna radiation circuit. The antenna radiation circuit is electrically connected to the third antenna circuit and the fourth antenna circuit through the fourth substrate layer. The fourth ground loop is electrically connected to the third ground loop through the fourth substrate layer.
由於接地迴路完全地覆蓋第一基板層底面,因此,天線輻射電路可避免電磁波從反電磁干擾天線的底面產生干擾。再者,由於第一接地迴路、第二接地迴路、接地穿孔以及第四接地迴路分別安裝於天線訊號電路、二第二天線電路、第一天線穿孔、第二天線穿孔以及天線輻射電路周圍,因此可避免電磁干擾。Since the ground loop completely covers the bottom surface of the first substrate layer, the antenna radiation circuit can prevent electromagnetic waves from generating interference from the bottom surface of the anti-electromagnetic interference antenna. Furthermore, since the first ground loop, the second ground loop, the ground through hole, and the fourth ground loop are installed in the antenna signal circuit, the two second antenna circuits, the first antenna through hole, the second antenna through hole, and the antenna radiation circuit, respectively Around, so electromagnetic interference can be avoided.
亦即,接地迴路、第一接地迴路、第二接地迴路、接地穿孔以及第四接地迴路形成一隔離牆。隔離牆包含一空腔,用於容置天線訊號電路、第一天線電路、第二天線電路、第一天線穿孔、第二天線穿孔以及天線輻射電路,因此,電磁波可大部分地被隔絕,以避免電磁干擾產生的雜訊影響。That is, the ground loop, the first ground loop, the second ground loop, the ground perforation, and the fourth ground loop form an isolation wall. The isolation wall contains a cavity for accommodating the antenna signal circuit, the first antenna circuit, the second antenna circuit, the first antenna perforation, the second antenna perforation, and the antenna radiation circuit. Therefore, electromagnetic waves can be mostly Isolation to avoid the influence of noise caused by electromagnetic interference.
請參考圖1至圖3,其係為本發明反電磁干擾天線的示意圖。反電磁干擾天線包含接地層10、第一基板層11、第一電路層12、第二基板層21、第二電路層22、第三基板層31、第三電路層32、第四基板層41以及第四電路層42。Please refer to FIGS. 1 to 3, which are schematic diagrams of the anti-electromagnetic interference antenna of the present invention. The anti-electromagnetic interference antenna includes a
接地層10安裝於第一基板層11的底面上,且包含接地迴路101。接地迴路101完全地覆蓋第一基板層11的底面。第一電路層12安裝於第一基板層11頂面以及第二基板層21底面之間。第一電路層12包含天線訊號電路121以及複數個第一接地迴路122。第一接地迴路122安裝於天線訊號電路121周圍。The
第二電路層22安裝於第二基板層21頂面以及第三基板層31底面之間。第二電路層22包含第一天線電路221、第二天線電路222以及複數個第二接地迴路223。第二接地迴路223安裝於第一天線電路221以及第二天線電路222周圍。The
第三基板層31包含第一天線穿孔311、第二天線穿孔312以及複數個接地穿孔313。接地穿孔313安裝於第一天線穿孔311以及第二天線穿孔312周圍。第一天線電路221以及第二天線電路222透過第二基板層21電性連接天線訊號電路121。第二接地迴路223透過第二基板層21電性連接第一接地迴路122。The
第三電路層32安裝於第三基板層31頂面以及第四基板層41底面之間。第三電路層32包含第三天線電路321、第四天線電路322以及複數個第三接地迴路323。The
第一天線穿孔311兩端分別電性連接第一天線電路221以及第三天線電路321。第二天線穿孔312兩端分別電性連接第二天線電路222以及第四天線電路322。Two ends of the first antenna through
第四電路層42安裝於第四基板層41的頂面上,並包含天線輻射電路421以及複數個第四接地迴路422。第四接地迴路422安裝於天線輻射電路421周圍。天線輻射電路421透過第四基板層41電性連接第三天線電路321以及第四天線電路322。第四接地迴路422透過第四基板層41電性連接第三接地迴路323。The
接地迴路101、第一接地迴路122、第二接地迴路223、接地穿孔313以及第四接地迴路422形成一隔離牆。隔離牆包含一空腔,以容置天線訊號電路121、第一天線電路211、第二天線電路212、第一天線穿孔311、第二天線穿孔312以及天線輻射電路421。當反電磁干擾天線安裝於電子裝置內,由電子裝置的積體電路(ICs)產生的電磁波可大部分被隔絕,以避免由電磁干擾產生的雜訊。The
再者,反電磁干擾天線更包含第五基板層51以及第五電路層52。第四電路層42安裝於第四基板層41頂面以及第五基板層51底面之間。第五電路層52安裝於第五基板層51的頂面上,並包含複數個第五接地迴路521。第五接地迴路521透過第五基板層51電性連接第四接地迴路422。Furthermore, the anti-electromagnetic interference antenna further includes a
由於反電磁干擾天線更包含第五基板層51以及第五電路層52,因此第五接地迴路521可高於天線輻射電路421。因此,隔離牆的邊線可高於天線輻射電路421,以提升反電磁干擾天線的效能。Since the anti-electromagnetic interference antenna further includes the
此外,貫穿孔60藉由貫穿第五基板層51以及第五電路層52形成,且天線輻射電路421可經由貫穿孔60暴露出。In addition, the through
第二基板層21包含二第一連接穿孔211以及二第二連接穿孔222。第一天線電路221透過第二基板層21的二第一連接穿孔211電性連接天線訊號電路121。第二天線電路222透過第二基板層21的二第二連接穿孔212電性連接天線訊號電路121。The
第四基板層41包含二第三連接穿孔411以及二第四連接穿孔412。第三天線電路321透過第四基板層41的二第三連接穿孔411電性連接天線輻射電路421。第四天線電路322透過第四基板層41的二第四連接穿孔412電性連接天線輻射電路421。The
請參閱圖2,第四電路層42的天線輻射電路421係為矩形微帶天線,且矩形微帶天線包含二連接部4211。二連接部4211分別從矩形微帶天線的兩長邊向外延伸。Please refer to FIG. 2, the
其中一連接部4211透過第四基板層41的二第三連接穿孔411電性連接第三天線電路321,另一連接部4211透過第四基板層41的二第四連接穿孔412電性連接第四天線電路322。One of the
再者,二連接部4211分別從矩形微帶天線的兩長邊中間位置向外延伸。Furthermore, the two connecting
天線輻射電路421係為矩形微帶天線,其具有二連接部4211,分別從矩形微帶天線的兩長邊中間位置向外延伸,因此,反電磁干擾天線具有電感電容平衡饋入設計(LC-balanced feeding design),以增強天線效率及頻寬。The
綜上所述,由於隔離牆包含空腔,以便於容置天線訊號電路121、第一天線電路211、第二天線電路212、第一天線穿孔311、第二天線穿孔312以及天線輻射電路421,因此,反電磁干擾天線係為背腔天線(cavity backed antenna),亦即,反電磁干擾天線具有背腔設計,以加強其天線增益。In summary, since the isolation wall contains a cavity, it is convenient to accommodate the
此外,接地迴路101包含複數個連接孔。天線訊號電路121安裝於靠近反電磁干擾天線的底部,且天線訊號電路121可透過連接孔電性連接外部印刷電路板(printed circuit board;PCB),以便於傳輸訊號。因此,天線訊號電路121可電性連接印刷電路板,並與接地迴路101隔離,亦即反電磁干擾天線係為具有縮小尺寸的底部饋入(bottom-fed)設計。In addition, the
以上所述僅是本發明的較佳實施例而已,並非對本發明做任何形式上的限制,雖然本發明已以較佳實施例揭露如上,然而並非用以限定本發明,任何熟悉本專業的技術人員,在不脫離本發明技術方案的範圍內,當可利用上述揭示的技術內容做出些許更動或修飾為等同變化的等效實施例,但凡是未脫離本發明技術方案的內容,依據本發明的技術實質對以上實施例所作的任何簡單修改、等同變化與修飾,均仍屬於本發明技術方案的範圍內。The above are only preferred embodiments of the present invention, and do not limit the present invention in any form. Although the present invention has been disclosed as above in preferred embodiments, it is not intended to limit the present invention. Anyone familiar with the professional technology Personnel, without departing from the scope of the technical solution of the present invention, when the technical content disclosed above can be used to make slight changes or modification into equivalent embodiments with equivalent changes, but any content that does not deviate from the technical solution of the present invention, according to the present invention Any simple modifications, equivalent changes and modifications made to the above embodiments are still within the scope of the technical solutions of the present invention.
10:接地層 101:接地迴路 11:第一基板層 12:第一電路層 121:天線訊號電路 122:第一接地迴路 21:第二基板層 211:第一天線電路 212:第二天線電路 22:第二電路層 221:第一天線電路 222:第二天線電路 223:第二接地迴路 31:第三基板層 311:第一天線穿孔 312:第二天線穿孔 313:接地穿孔 32:第三電路層 321:第三天線電路 322:第四天線電路 323:第三接地迴路 41:第四基板層 411:第三連接穿孔 412:第四連接穿孔 42:第四電路層 421:天線輻射電路 4211:連接部 422:第四接地迴路 51:第五基板層 52:第五電路層 521:第五接地迴路 60:貫穿孔10: Ground plane 101: Ground loop 11: The first substrate layer 12: The first circuit layer 121: Antenna signal circuit 122: first ground loop 21: The second substrate layer 211: The first antenna circuit 212: second antenna circuit 22: The second circuit layer 221: first antenna circuit 222: second antenna circuit 223: second ground loop 31: The third substrate layer 311: First antenna perforation 312: second antenna perforation 313: Ground Piercing 32: third circuit layer 321: third antenna circuit 322: fourth antenna circuit 323: third ground loop 41: The fourth substrate layer 411: third connection perforation 412: fourth connection perforation 42: fourth circuit layer 421: Antenna Radiation Circuit 4211: connecting part 422: The fourth ground loop 51: fifth substrate layer 52: Fifth circuit layer 521: Fifth Ground Loop 60: Through hole
圖1係為本發明反電磁干擾天線的示意圖; 圖2係為本發明反電磁干擾天線的上視圖;以及 圖3係為本發明反電磁干擾天線的剖面圖。 Figure 1 is a schematic diagram of the anti-electromagnetic interference antenna of the present invention; Figure 2 is a top view of the anti-electromagnetic interference antenna of the present invention; and Figure 3 is a cross-sectional view of the anti-electromagnetic interference antenna of the present invention.
223:第二接地迴路 223: second ground loop
311:第一天線穿孔 311: First antenna perforation
312:第二天線穿孔 312: second antenna perforation
313:接地穿孔 313: Ground Piercing
321:第三天線電路 321: third antenna circuit
322:第四天線電路 322: fourth antenna circuit
323:第三接地迴路 323: third ground loop
421:天線輻射電路 421: Antenna Radiation Circuit
4211:連接部 4211: connecting part
521:第五接地迴路 521: Fifth Ground Loop
60:貫穿孔 60: Through hole
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TW201943147A (en) * | 2018-03-29 | 2019-11-01 | 聯發科技股份有限公司 | Antenna structure and antenna-in-package |
TW202006916A (en) * | 2018-07-17 | 2020-02-01 | 南韓商三星電子股份有限公司 | Antenna module |
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TW202143551A (en) | 2021-11-16 |
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