TWI713751B - Transport unit - Google Patents

Abstract

[Problem] In the conveying unit, when the suction pad has been brought into contact with the plate-shaped workpiece, the weight of the suction pad is not applied to the plate-shaped workpiece to prevent the plate-shaped workpiece from being damaged. [Solution] A conveying unit is a conveying unit for conveying plate-shaped workpieces. It is equipped with a device for sucking and holding the workpiece and a device for moving the suction and holding device. The suction and holding device has a suction pad that sucks and holds the workpiece and can approach and move away. The guide shaft that supports the suction pad while moving in the direction of the workpiece, a plate that has a through hole through which the guide shaft can be inserted to support the guide shaft, and maintains the guide shaft supporting the suction pad to impart potential energy to the suction pad When the suction pad holds the workpiece, the force of the suction pad pressing the workpiece can be weakened by the spring.

Description

Transport unit

FIELD OF THE INVENTION The present invention relates to a conveying unit for conveying plate-shaped workpieces.

BACKGROUND OF THE INVENTION Among the conveying units that are provided in processing equipment and the like and that can suck and hold and convey plate-shaped workpieces such as semiconductor wafers by suction pads, there are, for example, a type of unit in which a suction pad is brought into contact with the plate-shaped workpieces to be sucked and held, and A unit that uses a suction pad to attract and hold a plate-shaped workpiece in a non-contact manner. In the contact-type conveying unit (see, for example, Patent Document 1), the suction pad is composed of a porous plate or the like as a porous material, and the suction source can be connected to the porous plate to cause the suction source to suck. The generated attraction force is transmitted to the suction surface of the perforated plate in contact with the plate-shaped workpiece, thereby attracting and holding the plate-shaped workpiece. On the other hand, the non-contact transport unit (see, for example, Patent Document 2) uses Bernoulli's principle to supply high-pressure gas to the suction generation part of the suction pad. That is, the high-pressure gas is supplied along the inner surface of the suction pad, and is discharged to the atmosphere by passing between the suction generating portion and the plate-shaped workpiece. Since the discharged high-pressure gas jet will gradually decelerate due to its diameter expansion and become atmospheric pressure, the gap between the suction generating part and the plate-shaped workpiece will have a Bernoulli effect, and the suction generating part will be centered on its surroundings. A pressure drop occurs. By generating negative pressure like this, the suction pad attracts the plate-shaped workpiece in a non-contact manner. Prior art documents Patent documents

Patent Document 1: Japanese Patent Laid-Open No. 2006-344778 Patent Document 2: Japanese Patent Laid-Open No. 2015-070002

SUMMARY OF THE INVENTION The problem to be solved by the invention is to make the suction pad contact the plate-shaped workpiece to attract and hold the type of conveying unit. When the plate-shaped workpiece is sucked and held, in order to avoid the positional deviation of the plate-shaped workpiece and the suction pad, the After the entire suction surface of the suction pad is in contact with the suction surface of the plate-shaped workpiece, the suction source is actuated to perform suction holding. In addition, in the type of conveying unit that sucks and holds the plate-shaped workpiece in a non-contact manner by a suction pad, the plate-shaped workpiece and the suction pad are aligned, and for example, the suction pad is equipped to restrict the plate-shaped workpiece to the horizontal After the moving contact part contacts the outer peripheral area of the plate-shaped workpiece, the suction pad is supplied with high-pressure gas and the negative pressure generated around the suction generating part is used to suction and hold the plate-shaped workpiece. Therefore, in either the contact type or the non-contact type conveying unit, the weight of the suction pad is applied to the plate-shaped workpiece when the plate-shaped workpiece is sucked and held.

In addition, there may be situations where the inclination of the holding surface of the holding table that is equipped in the processing device and holds the plate-shaped workpiece and the inclination of the suction surface of the suction pad of the conveying unit are different, that is, the holding of the holding table The surface and the attraction surface of the attraction pad do not become parallel. There are also cases where the inclination of the holding surface of the washing table of the washing unit provided in the processing device and the inclination of the suction surface of the suction pad of the conveying unit are different. In the case of these forms, especially when the suction pad is brought into contact with the plate-shaped workpiece in order to attract and hold the plate-shaped workpiece, the weight of the suction pad will be more applied to the plate-shaped workpiece, so there will be a plate-shaped workpiece. A situation where the workpiece is damaged by the pressing force from the suction pad.

Therefore, there will be the following problem: in the case of conveying the plate-shaped workpiece by the conveying unit, when the suction pad is brought into contact with the plate-shaped workpiece, it is necessary to suppress the amount of weight of the suction pad applied to the plate-shaped workpiece to prevent A situation where the plate-shaped workpiece is damaged. Means to solve the problem

The present invention for solving the above-mentioned problems is a conveying unit for conveying a plate-shaped workpiece. The conveying unit is characterized by having a suction and holding device for sucking and holding the plate-shaped workpiece, and a moving device for moving the suction and holding device. The holding device has a suction pad that sucks and holds a plate-shaped workpiece, a guide shaft that supports the suction pad so as to move toward and away from the plate-shaped workpiece, and has a through hole through which the guide shaft is inserted and supports the guide The support plate of the shaft and the spring that maintains the state that the guide shaft supports the suction pad and imparts potential energy to the suction pad in the direction approaching the support plate. When the suction pad holds a plate-shaped workpiece, the The spring weakens the force of the suction pad pressing the plate-shaped workpiece.

Preferably, the guide shaft is provided with a head that extends radially outward on the upper end side, and the spring is arranged between the lower surface of the head and the support plate so that the head faces the When the support plate moves away from each other, it expands.

Furthermore, it is desirable that a head extending outward in the radial direction of the guide shaft is provided on the upper end side of the guide shaft, and the spring is arranged between the support plate and the suction pad, and The suction pad shrinks when it moves away from the support plate.

The aforementioned suction pad may also be a so-called Bernoulli-type suction pad provided with a suction generating part and a contact part, wherein the suction generating part generates a negative pressure by ejecting gas from a gas ejection port to suck the plate in a non-contact manner The workpiece, the contact portion is in contact with the outer peripheral area of the plate-shaped workpiece attracted by the suction generating portion and restricts the plate-shaped workpiece from moving in the horizontal direction. Invention effect

The conveying unit for conveying plate-shaped workpieces of the present invention is equipped with a suction pad that sucks and holds the plate-shaped workpiece, a guide shaft that supports the suction pad to move toward and away from the plate-shaped workpiece, and has a guide The through hole through which the lead shaft is inserted and the support plate that supports the guide shaft, and the spring that maintains the state of the guide shaft supporting the suction pad and imparts potential energy to the suction pad in the direction approaching the support plate, so when the suction pad maintains a plate shape When working with a workpiece, the force of the suction pad pressing the plate-shaped workpiece can be weakened by the spring, so that the plate-shaped workpiece can be sucked, held and transported without being damaged.

In addition, the suction pad is provided as a so-called Bernoulli type suction pad provided with a suction generating portion and a contact portion, wherein the suction generating portion generates a negative pressure by ejecting gas from a gas ejection port to attract the plate in a non-contact manner The contact portion is in contact with the outer peripheral area of the plate-shaped workpiece attracted by the suction generating portion and restricts the plate-shaped workpiece from moving in the horizontal direction. Therefore, even if the object of attraction is a warped plate-shaped workpiece, for example, When the suction pad is holding the plate-shaped workpiece, the force of the suction pad pressing the plate-shaped workpiece can be weakened by the spring, so that the plate-shaped workpiece can be transported without breaking it.

Mode for Carrying Out the Invention (Embodiment 1) The conveying unit 1 for conveying the plate-shaped workpiece W shown in Fig. 1 is provided with at least a suction and holding device 2 for sucking and holding the plate-shaped workpiece W, and a moving device for moving the suction and holding device 2 4. The conveying unit 1 is mainly used as a cutting device that cuts a plate-shaped workpiece W, a grinding device that grinds a plate-shaped workpiece W, or a cluster type device having the functions of all these devices. For example, in FIG. 1, the suction holding device 2 is positioned above the holding table 3 provided in a processing device such as a grinding device.

The holding table 3 is provided with, for example, a holding surface 3a that has a circular outer shape and is formed of a porous member or the like to suck the plate-shaped workpiece W. The holding surface 3a is connected to a suction source not shown, for example. The suction force generated by the suction by the suction source is transmitted to the holding surface 3a, whereby the holding table 3 can suck and hold the plate-shaped workpiece W on the holding surface 3a. The plate-shaped workpiece W is, for example, a semiconductor wafer with a circular outer shape, and in the example shown in FIG. 1, it is attracted and held on the holding surface 3 a of the holding table 3 in a state where the rear surface Wb of the workpiece faces upward. In FIG. 1, for example, a plurality of components are formed on the front surface Wa of the workpiece W in the state facing downward, and a protective tape (not shown) is attached for protection.

The suction and holding device 2 of the conveying unit 1 is provided with a suction pad 20 that sucks and holds a plate-shaped workpiece W, a guide shaft 21 that supports the suction pad 20 to move in a direction (Z-axis direction) approaching and away from the plate-shaped workpiece W, and The support plate 23 has a through hole 230 through which the guide shaft 21 can be inserted and supports the guide shaft 21. The suction pad 20 has, for example, a circular outer shape, and is provided with a suction part 200 that is formed of a porous member and suctions a plate-shaped workpiece W, and a frame 201 that supports the suction part 200. One end of a communication path 290 is communicated with the adsorption part 200, and the other end of the communication path 290 is connected to a suction source 29 formed by a vacuum generator, a compressor, and the like. In addition, the suction force generated by the suction by the suction source 29 is transmitted through the communication path 290 to the holding surface 200a that is the exposed surface of the suction portion 200 and is formed flush with the lower surface of the frame 201, thereby the suction pad At 20, the plate-shaped workpiece W can be attracted and held on the holding surface 200a.

The suction pad 20 is fixed to the lower end 210b of the guide shaft 21 shown in FIGS. 1 and 2 and is supported by the guide shaft 21. For example, the guide shaft 21 includes a base shaft portion 210 having an axial direction in the vertical direction (Z-axis direction), and the upper end 210a side of the base shaft portion 210 faces the radial direction of the guide shaft 21 (in the direction of the axis of the base shaft portion 210). The direction orthogonal to the horizontal direction) the head 211 extending outward. That is, the guide shaft 21 has a longitudinal cross section formed in a substantially T-shape.

The support plate 23 shown in FIG. 1 is formed, for example, in the shape of a flat plate with a circular outer shape, and is provided with a through hole 230 at its outer periphery. The through hole 230 is formed to penetrate in the thickness direction (Z axis direction) and can be formed. The guide shaft 21 is inserted through. For example, the through holes 230 are formed in plural (for example, 4 positions at 90-degree intervals, and only 2 positions are shown in FIG. 1) at regular intervals in the circumferential direction on the outer periphery of the support plate 23. . The base shaft portions 210 of each guide shaft 21 (four in this embodiment, only two are shown in FIG. 1) are fitted into each through hole 230 with a gap, so that the guide shaft 21 becomes It can move in the Z-axis direction relative to the support plate 23. The head 211 of the guide shaft 21 is in a form that does not penetrate through the through hole 230 already formed in the support plate 23 and has a diameter larger than the through hole 230. As shown in FIG. 1, the base shaft portion 210 of the guide shaft 21 has a length that is at least the thickness of the support plate 23, and when the suction pad 20 is not in contact with the plate-shaped workpiece W, one of the guide shafts 21 is inserted A gap of a predetermined width is formed between the lower surface 23b of the support plate 23 in a state and the upper surface 201b of the suction pad 20 in a state fixed to the lower end 210b of the guide shaft 21.

The suction and holding device 2 is provided with a spring 27 that maintains the guide shaft 21 in a state in which the suction pad 20 is supported and causes the suction pad 20 to apply potential energy in a direction approaching the support plate 23. The spring 27 is, for example, a helical torsion spring that is stretched longer than the natural length and will be restored, and is arranged between the lower surface 211b of the head 211 and the support plate 23, and is positioned in the direction in which the suction pad 20 approaches the support plate 21 Give potential energy. For example, as shown in FIG. 2, the inner diameter of the spring 27 is larger than the outer diameter of the base shaft portion 210 of the guide shaft 21, and the outer diameter of the spring 27 is formed to be approximately equal to the outer diameter of the head portion 211 of the guide shaft 21. In the same way, the base shaft portion 210 of the guide shaft 21 is inserted into the central opening of the spring 27, whereby the upper end of the spring 27 is in a state of abutting against the lower surface 211b of the head 211.

As shown in FIG. 2, a spring receiving hole 230a is formed. The spring receiving hole 230a is located coaxially with the through hole 230 formed on the outer periphery of the support plate 23 and has a hole diameter such that the spring 27 can be inserted. That is, the spring receiving hole 230a is formed by expanding the outer diameter of the through hole 230 from the middle portion in the thickness direction (Z-axis direction) of the support plate 23 to the upper surface 23a of the support plate 23. The depth of the spring housing hole 230a from the upper surface 23a of the support plate 23 is, for example, approximately the same depth as the natural length of the spring 27. As shown in FIG. 2, after the spring 27 is submerged in the spring accommodating hole 230 a, the guide shaft 21 is inserted into the central opening of the spring 27 and the through hole 230 from above the support plate 23. In addition, use appropriate adhesives to fix the lower end of the spring 27 to the annular bottom surface of the spring receiving hole 230a, and fix the upper end of the spring 27 to the lower surface 211b of the head 211, and fix the guide shaft The lower end 210b of the guide shaft 21 is fixed to the upper surface 201b of the suction pad 20, whereby the spring 27 can be arranged as shown in FIG. 1 to be placed between the lower surface 211b of the head 211 of the guide shaft 21 and the support plate 23 Meanwhile, when the head 211 moves in a direction away from the support plate 23 in the Z-axis direction, it expands.

The arrangement of the spring 27 is not limited to the above. For example, the spring 27 may be arranged under the head 211 of the guide shaft 21 as shown in Figs. 3(A) and (B). Between the surface 211b and the support plate 23. That is, as shown in FIG. 3(A), the opening in the center of the spring 27 is provided so as to overlap the through hole 230 of the support plate 23, and the spring 27 is fixed to the upper surface 23a of the support plate 23 with an appropriate adhesive or the like. The guide shaft 21 is inserted into the central opening of the spring 27 and the through hole 230 from above the support plate 23. Then, use a suitable adhesive or the like to fix the upper end side of the spring 27 on the lower surface 211b of the head 211, and fix the lower end 210b of the guide shaft 21 to the upper surface 201b of the suction pad 20, thereby as shown in FIG. As shown in (B), the spring 27 is arranged in a state where it does not sink into the inside of the support plate 23.

As shown in FIG. 1, for example, a connecting member 250 is fixed to the central area of the upper surface 23a of the support plate 23, and the support plate 23 is fixed under one end of the arm 25 of the suction and holding device 2 through the connecting member 250. Surface side. The mobile device 4 is connected to the arm 25, and is formed so that the arm 25 can move in parallel or spirally on a horizontal plane and can move up and down in the Z-axis direction. The moving device 4 is composed of, for example, an air cylinder that moves the arm portion 25 up and down in the Z-axis direction by air pressure, and a ball screw mechanism that moves the arm portion 25 in parallel by rotating a ball screw by a motor.

Hereinafter, the operation of the transport unit 1 when the plate-shaped workpiece W is carried out from the holding table 3 by the transport unit 1 will be described with reference to FIGS. 1 and 4 to 5. As shown in FIG. 1, the plate-shaped workpiece W is sucked and held on the holding surface 3a of the holding table 3 with the back surface Wb facing the upper side. First, by moving the device 4, the suction and holding device 2 is moved on a horizontal plane so that the center of the suction pad 20 is substantially coincident with the center of the plate-shaped workpiece W, and the suction pad 20 is positioned above the plate-shaped workpiece W. Furthermore, as shown in FIG. 4, the arm 25 is lowered in the -Z direction, and the holding surface 200a of the suction pad 20 is brought into contact with the back surface Wb of the plate-shaped workpiece W.

When the holding surface 200a of the suction pad 20 is in contact with the back surface Wb of the plate-shaped workpiece W, the plate-shaped workpiece W is pressed by the suction pad 20 in the −Z direction. At the same time, the guide shaft 21 fitted into the support plate 23 with a gap moves in the +Z direction due to the +Z direction vertical resistance acting from the plate-shaped workpiece W through the suction pad 20. Therefore, the lower surface 211b of the head 211 supporting the guide shaft 21 of the suction pad 20 is moved in the +Z direction away from the upper surface 23a of the support plate 23. As the guide shaft 21 moves in the +Z direction, the upper end side of the spring 27 of natural length will be stretched by the head 211 of the guide shaft 21 to expand the spring 27 in the +Z direction. The upper accumulates elastic energy that restores the spring 27 to its natural length.

With the action of the spring 27 as described above, when the suction pad 20 holds the plate-shaped workpiece W, the force of the suction pad 20 pressing the plate-shaped workpiece W by the spring 27 is weakened, and the plate can be surely held by the suction pad 20状 Workpiece W. That is, in order to perform suction holding in a state where the center of the suction pad 20 and the center of the plate-shaped workpiece W are substantially coincident, it is necessary to prevent the plate-shaped workpiece W from moving in the horizontal direction and cause positional deviation, and to make the suction pad 20 contact Plate-shaped workpiece W. Therefore, a predetermined magnitude of friction must be generated between the holding surface 200a of the suction pad 20 and the back surface Wb of the plate-shaped workpiece W. Although the holding surface 200a of the suction pad 20 is pressed against the back surface Wb of the plate-shaped workpiece W with more force, the frictional force will increase, but the possibility of damage of the plate-shaped workpiece W will also increase. Here, in the conveying unit 1 of the present invention, the pressing force is applied to the plate-shaped workpiece W from the suction pad 20 by the spring 27 in a balanced manner, so that it can be sucked. Between the holding surface 200a of the pad 20 and the back surface Wb of the plate-shaped workpiece W, a friction force equivalent to that of preventing the positional deviation of the plate-shaped workpiece W is generated, and is formed to prevent the plate-shaped workpiece W from being damaged. The pressing force is applied from the suction pad 20 to the plate-shaped workpiece W. That is, by expanding the spring 27, the pressing force excessively applied from the suction pad 20 to the plate-shaped workpiece W can be offset and weakened, so that an appropriate pressing force can be applied from the suction pad 20 to the plate-shaped workpiece W. Furthermore, for example, in the case where the spring 27 is not provided in the suction and holding device 2, a pressing force of the following degree cannot be generated: between the holding surface 200a of the suction pad 20 and the back surface Wb of the plate-shaped workpiece W It generates frictional force equivalent to preventing the positional deviation of the plate-shaped workpiece W; therefore, the plate-shaped workpiece W becomes easy to move in the horizontal direction to cause positional deviation.

After the suction pad 20 contacts the plate-shaped workpiece W, the suction force generated by the suction source 29 can be transmitted to the holding surface 200a, thereby causing the suction pad 20 to attract and hold the plate-shaped workpiece W. At the same time, the suction holding of the plate-shaped workpiece W by the holding table 3 is released. In addition, as shown in FIG. 5, by raising the arm 25 in the +Z direction, the plate-shaped workpiece W can be carried out from the holding table 3 by the conveying unit 1. When the plate-shaped workpiece W moves away from the holding surface 3a of the holding table 3, the elastic energy stored in the spring 27 restores the expanded spring 27 to its natural length, and with this, it is brought into contact with the plate-shaped workpiece. The suction pad 20 that is sucked and held in the state of the work W moves in the +Z direction as it approaches the support plate 23.

(Embodiment 2) The conveying unit 1A of the present invention shown in FIG. 6 is a suction pad 20 having a part of the structure of the suction and holding device 2 of the conveying unit shown in FIG. It is a device of the suction and holding device 2A of the U-type suction pad 26. Regarding the parts other than the difference in the configuration of the suction pad 20 of the suction and holding device 2 and the suction pad 26 of the suction and holding device 2A, the conveying unit 1 and the conveying unit 1A are configured in the same manner.

The suction pad 26 is fixed to the lower end 210 b of the guide shaft 21 and is supported by the guide shaft 21. The suction pad 26 includes, for example, a suction generating portion 260 that sucks the plate-shaped workpiece W in a non-contact manner by ejecting gas from the gas ejection port 260c to generate a negative pressure, and a suction pad that contacts the plate-shaped workpiece W attracted by the suction generating portion 260. The contact portion 261 that restricts the movement of the plate-shaped workpiece W in the horizontal direction in the outer peripheral area, and the substrate portion 264 on which the suction generating portion 260 and the contact portion 261 are arranged.

The plate-shaped substrate portion 264 having a circular outer shape is gradually curved in the +Z direction from the center toward the outer peripheral portion, and is curved slightly in a bowl shape. That is, when the plate-shaped workpiece W is sucked and held, the suction surface 264a of the substrate portion 264 with respect to the plate-shaped workpiece W in a non-contact manner is curved concavely in the center. In addition, the shape and configuration of the substrate portion 264 are not limited to those in this embodiment. For example, the substrate portion 264 may be formed to have a circular flat plate shape or an annular shape, or may be constituted by a plurality of members such as an annular member or a linear member.

The suction generating unit 260 that sucks the plate-shaped workpiece W in a non-contact manner is, for example, one disposed in the center area of the suction surface 264 a of the substrate portion 264. For example, a gas supply path 260b is formed in the suction generating part 260 having a disc-shaped outer shape, and the gas supply path 260b is connected to an annular gas ejection port 260c formed on the bottom surface of the suction generating part 260. In addition, one end of a communication path 280 communicating with a gas supply source 28 formed by a compressor or the like is connected to the gas supply path 260b. In addition, for example, an annular orifice or the like that accelerates the gas supplied from the gas supply source 28 to the suction generating unit 260 may be formed in the gas supply path 260b.

The contact portion 261 that restricts the movement of the plate-shaped workpiece W in the horizontal direction is formed of, for example, rubber, sponge, etc., in a cylindrical shape, and is located on the outer peripheral portion of the suction surface 264a of the base portion 264 in the circumferential direction. A plurality of pieces are fixed at a certain interval (for example, four pieces at a 90-degree interval, and only two pieces are shown in FIG. 6). The lower end surface of each contact portion 261 is located at a height position below the suction generating portion 260.

Hereinafter, the operation of the transport unit 1A when the plate-shaped workpiece W is carried out from the holding table 3 by the transport unit 1A will be described with reference to FIGS. 6 to 8.

As shown in FIG. 6, the plate-shaped workpiece W is sucked and held on the holding surface 3a of the holding table 3 with the back surface Wb facing the upper side. First, by the moving device 4, the suction and holding device 2A is moved on a horizontal plane so that the center of the suction pad 26 is substantially coincident with the center of the plate-shaped workpiece W, and the suction pad 26 is positioned above the plate-shaped workpiece W. In addition, as shown in FIG. 7, the arm portion 25 is lowered in the -Z direction, and the suction pad 26 is lowered in the -Z direction until the contact portion 261 contacts the outer peripheral area of the plate-shaped workpiece W and attracts the generating portion 260 and the plate-shaped workpiece The back side Wb of W is the position of the degree of non-contact.

When the contact portion 261 of the suction pad 26 is in contact with the back surface Wb of the plate-shaped workpiece W, the plate-shaped workpiece W is pressed by the suction pad 26 in the −Z direction. At the same time, the guide shaft 21 fitted with the support plate 23 with a gap moves in the +Z direction by the vertical resistance acting from the plate-shaped workpiece W through the suction pad 26. Therefore, the lower surface 211b of the head 211 of the guide shaft 21 supporting the suction pad 26 is moved in the +Z direction away from the upper surface 23a of the support plate 23. As the guide shaft 21 moves in the +Z direction, the upper end side of the spring 27 of natural length is stretched by the head 211 of the guide shaft 21 and expands in the +Z direction, thereby accumulating on the spring 27. The spring 27 returns to its natural length of elastic energy.

With the action of the spring 27 as described above, when the suction pad 26 holds the plate-shaped workpiece W, the force of the contact portion 261 of the suction pad 26 against the plate-shaped workpiece W can be weakened by the spring 27, and the suction pad 26 The plate-shaped workpiece W is surely held. That is, in order to perform suction holding in a state where the center of the suction pad 26 and the center of the plate-shaped workpiece W are substantially aligned, it is necessary to prevent the plate-shaped workpiece W from moving in the horizontal direction to cause positional deviation, and to make the suction pad 26 contact The portion 261 is in contact with the back surface Wb of the plate-shaped workpiece W. Therefore, a predetermined magnitude of friction must be generated between the contact portion 261 of the suction pad 26 and the back surface Wb of the plate-shaped workpiece W. Although the more powerful the contact portion 261 of the suction pad 26 is pressed against the back surface Wb of the plate-shaped workpiece W, the greater the frictional force becomes, but the possibility of damage to the plate-shaped workpiece W also increases. Herein, the conveying unit 1A of the present invention is formed to apply a pressing force to the plate-shaped workpiece W from the contact portion 261 of the suction pad 26 by the spring 27 in a fairly balanced manner, so that it can be sucked The contact portion 261 of the pad 26 and the back surface Wb of the plate-shaped workpiece W generate frictional force equivalent to preventing the positional deviation of the plate-shaped workpiece W, and is formed to prevent the plate-shaped workpiece W from being damaged. The pressing force is applied from the suction pad 26 to the plate-shaped workpiece W. That is, by expanding the spring 27, the pressing force excessively applied from the suction pad 26 to the plate-shaped workpiece W can be offset and weakened, so that an appropriate pressing force can be applied from the suction pad 26 to the plate-shaped workpiece W. Furthermore, for example, in the case where the spring 27 is not provided in the suction holding device 2A, a pressing force of the following degree cannot be generated: between the contact portion 261 of the suction pad 26 and the back surface Wb of the plate-shaped workpiece W It generates frictional force equivalent to preventing the positional deviation of the plate-shaped workpiece W; therefore, the plate-shaped workpiece W becomes easy to move in the horizontal direction to cause positional deviation.

After the suction pad 26 descends to a predetermined position in the Z-axis direction, the gas supply source 28 supplies high-pressure gas to the gas supply path 260 b inside the suction pad 26 through the communication path 280. The gas supplied to the suction pad 26 is accelerated in the gas supply path 260b through, for example, an annular orifice not shown in the figure, and is ejected from the gas ejection port 260c onto the back surface Wb of the plate-shaped workpiece W. The high-pressure gas ejected from the gas ejection port 260c flows between the suction pad 26 and the plate-shaped workpiece W in the radial direction from the center of the plate-shaped workpiece W and is discharged into the atmosphere. Therefore, by causing the high-pressure gas to flow in the radial direction at a high speed due to the gap between the suction surface 264a of the suction pad 26 and the back surface Wb of the plate-shaped workpiece W, the Bernoulli effect can be generated with the suction generating portion 260 as the center. The negative pressure causes the suction pad 26 to attract and hold the plate-shaped workpiece W in a non-contact state. In addition, in the second embodiment, although one suction generating part 260 is arranged in the central area of the suction surface 264a of the substrate portion 264, for example, it may be provided on the suction surface 264a of the substrate portion 264. The outer peripheral part is arrange|positioned at a fixed interval in the circumferential direction, and plural pieces are arrange|positioned. In this case, the respective contact portions 261 and the suction generating portion 260 are formed to be alternately arranged in the circumferential direction on the outer peripheral portion of the suction surface 264a. In addition, the suction generating unit 260 may be configured to generate a negative pressure for sucking the plate-shaped workpiece W by forming a swirling flow of high-pressure gas supplied from the gas supply source 28 to the plate-shaped workpiece W. .

After the suction pad 26 sucks and holds the plate-shaped workpiece W in a non-contact manner, the suction and holding of the plate-shaped workpiece W by the holding table 3 is released. In addition, as shown in FIG. 8, by raising the arm portion 25 in the +Z direction, the plate-shaped workpiece W can be carried out from the holding table 3 by the transport unit 1A. When the plate-shaped workpiece W moves away from the holding surface 3a of the holding table 3, the elastic energy stored in the spring 27 restores the expanded spring 27 to its natural length, and consequently attracts the holding plate in a non-contact manner. The suction pad 26 of the workpiece W moves in the +Z direction as it approaches the support plate 23.

In addition, the transport unit of the present invention is not limited to the units of the above-mentioned Embodiment 1 and Embodiment 2, and the size and shape of the respective components of the transport unit of each embodiment illustrated in the drawings are not limited. It is limited by this, and can be suitably changed within the range which can exhibit the effect of this invention.

For example, the conveying unit 1B of the present invention shown in FIG. 9 is a device provided with a suction and holding device 2B, and the suction and holding device 2B is a spring 27 that is a part of the structure of the suction and holding device 2A of the conveying unit 1A shown in FIG. The suction and holding device is changed to the spring 24 and the arrangement position of the spring is changed. Regarding the configuration other than the point of changing the spring 27 to the spring 24 and the arrangement position of the spring, the conveying unit 1A and the conveying unit 1B are configured in the same manner. The spring 24 is, for example, a spring that, when contracted more than its natural length, will give potential energy in the direction to be restored, that is, in the direction in which the suction pad 26 is close to the support plate 21, and is arranged so that the upper end side of the spring 24 Then and fix it on the lower surface 23b of the support plate 23, and further connect and fix the lower end side of the spring 24 on the upper surface 264b of the base plate portion 264. Between the support plate 23 and the suction pad 26, the head 21 is facing and When the supporting plate 23 moves away from each other, it contracts.

When the contact portion 261 of the suction pad 26 shown in FIG. 9 is in contact with the back surface Wb of the plate-shaped workpiece W, the plate-shaped workpiece W will be pressed by the suction pad 26 in the -Z direction. At the same time, the guide shaft 21 fitted with the support plate 23 with a gap moves in the +Z direction by the vertical resistance acting from the plate-shaped workpiece W through the suction pad 26. Therefore, the head 211 of the guide shaft 21 supporting the suction pad 26 is moved in the +Z direction away from the upper surface 23 a of the support plate 23. As the guide shaft 21 moves in the +Z direction, the spring 24 having a natural length contracts. In the conveying unit 1B of the present invention, the spring 24 performs the operation as described above, and the pressing force is applied to the plate-shaped workpiece W from the contact portion 261 of the suction pad 26 in a fairly balanced manner. It is possible to generate friction between the contact portion 261 of the suction pad 26 and the back surface Wb of the plate-shaped workpiece W to prevent the positional deviation of the plate-shaped workpiece W, and to prevent the occurrence of plate-shaped The pressing force of the degree of damage of the work W is applied to the plate-shaped work W from the suction pad 26.

1, 1A, 1B‧‧‧Conveying unit 2, 2A, 2B‧‧‧Suction and holding device 20,26‧‧‧Suction pad 200‧‧‧Suction part 200a, 3a‧‧‧Holding surface 201‧‧‧Frame 201b , 23a, 264b‧‧‧Upper surface 21‧‧‧Guide shaft 210‧‧‧Base shaft 210a‧‧‧Upper end 210b‧‧Lower end 211‧‧‧Head 211b, 23b‧‧‧Lower surface 23‧‧‧ Support plate 230‧‧‧through hole 230a‧‧‧spring receiving hole 24,27‧‧‧spring 25‧‧‧arm 250‧‧‧connection member 260‧‧‧suction generating part 260b‧‧‧gas supply path 260c‧ ‧‧Gas spout 261‧‧‧Contact part 264‧‧‧Substrate part 264a‧‧‧Suction surface 28‧‧‧Gas supply source 29‧‧‧Suction source 280,290‧‧‧Communication path 3‧‧‧Holding stand 4‧‧‧Mobile equipment W‧‧‧Plate workpiece Wa‧‧‧Front Wb‧‧‧Back +X, -X, Y, +Z, -Z‧‧‧Direction

Fig. 1 is a cross-sectional view showing an example of the structure of the transport unit of the first embodiment provided with a contact-type suction pad. Fig. 2 is an explanatory diagram showing an example of a state in which a spring is arranged between the lower surface of the head of the guide shaft and the support plate. Fig. 3(A) is an exploded cross-sectional view showing an example of a state in which a spring is arranged between the lower surface of the head of the guide shaft and the support plate so as not to sink into the support plate. Fig. 3(B) is a cross-sectional view showing an example of a state where the spring is arranged between the lower surface of the head of the guide shaft and the support plate so as not to sink into the support plate. Fig. 4 is a cross-sectional view showing a state where the suction pad is in contact with the plate-shaped workpiece in the conveying unit of the first embodiment. Fig. 5 is a cross-sectional view showing a state in which a suction pad that has sucked and held a plate-shaped workpiece is raised in the conveying unit of the first embodiment. Fig. 6 is a cross-sectional view showing an example of the structure of the transport unit of the second embodiment provided with a non-contact suction pad. Fig. 7 is a cross-sectional view showing a state in which the contact portion of the suction pad is brought into contact with the plate-shaped work and sucked and held in the conveying unit of the second embodiment. Fig. 8 is a cross-sectional view showing a state in which a suction pad that has sucked and held a plate-shaped workpiece is raised in the conveying unit of the second embodiment. Fig. 9 is a cross-sectional view showing an example of a structure of a conveying unit including a non-contact suction pad and a spring arranged between the support plate and the suction pad.

1‧‧‧Transfer unit

2‧‧‧Attraction and retention equipment

20‧‧‧Suction pad

200‧‧‧Adsorption part

200a、3a‧‧‧Keep the surface

201‧‧‧Frame

201b, 23a‧‧‧Upper surface

21‧‧‧Guide axis

210‧‧‧Base shaft

210a‧‧‧Upper

210b‧‧‧Bottom

211‧‧‧Head

211b、23b‧‧‧Lower surface

23‧‧‧Support plate

230‧‧‧Through hole

25‧‧‧Arm

250‧‧‧Connecting member

27‧‧‧Spring

29‧‧‧Attraction source

290‧‧‧Connecting Road

3‧‧‧Holding station

4‧‧‧Mobile device

W‧‧‧Plate workpiece

Wa‧‧‧Front

Wb‧‧‧Back

+X, -X, Y, +Z, -Z‧‧‧direction

Claims (4)

A conveying unit is a conveying unit for conveying a plate-shaped workpiece, and is characterized by having a suction and holding device for sucking and holding the plate-shaped workpiece, and a moving device for moving the suction and holding device, and the suction and holding device has a suction and holding device for holding the plate-shaped workpiece. A suction pad, a guide shaft that supports the suction pad so as to move toward and away from the plate-shaped workpiece, a support plate that has a through hole through which the guide shaft is inserted and supports the guide shaft, and maintains the guide A spring that supports the suction pad on the lead shaft and applies potential energy to the suction pad in the direction approaching the support plate. When the suction pad holds a plate-shaped workpiece, the suction pad can be pressed against the plate-shaped workpiece by the spring The power is weakened. The conveying unit of claim 1, wherein the guide shaft has a head that extends radially outward on the upper end side, and the spring is arranged between the lower surface of the head and the support plate, and the head The part expands when it moves in a direction away from the support plate. The conveying unit of claim 1, wherein the spring is arranged between the support plate and the suction pad, and contracts when the suction pad moves in a direction approaching the support plate. The conveying unit according to any one of claims 1 to 3, wherein the suction pad includes a suction generating portion that sucks the plate-shaped workpiece in a non-contact manner by ejecting gas from a gas ejection port to generate a negative pressure, and is in contact with the Attract the outer peripheral area of the plate-shaped workpiece attracted by the generating part and limit the plate-shaped work When the contact portion of the workpiece moves in the horizontal direction, when the plate-shaped workpiece is held by the suction pad, the force of the contact portion of the suction pad against the plate-shaped workpiece can be weakened by the aforementioned spring.

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