TWI713449B - Shielding device for rotatable cathode and rotatable target and method for shielding a dark space region in a deposition apparatus - Google Patents

Abstract

According to the present disclosure, a shielding device (20) for a rotatable cathode having a rotatable target (10) for sputtering material onto a substrate and a method for shielding a dark space region in a deposition apparatus are provided. The shielding device (20) includes a shield (21) configured for covering a portion of the rotatable target (10) and a fixture (80) for connecting the shield (21) to the rotatable target (10). The fixture (80) is configured for engaging with the shield (21) to allow the shield to expand essentially away from the centre of the rotatable target (10) in an axial direction of the rotatable target.

Description

Shading device for rotatable cathode, rotatable target and method for shading dark area in deposition equipment

The present disclosure relates to a device for shielding a rotatable cathode, especially a shielding device with a shield and a fixed object, and a method for shielding a dark area in a deposition device, The fixture is used to connect the shield to a rotatable cathode.

In many applications, it is necessary to deposit thin layers on substrates. Known techniques for depositing thin films are in particular evaporation, chemical vapor deposition and sputtering deposition. For example, sputtering can be used to deposit a thin layer, such as a thin layer of metal or ceramic, and the metal is aluminum, for example. During the sputtering process, by bombarding the surface of the target with ions, typically an inert process gas at low pressure, the coating material is transported from the sputtering target on which the coated material is to be applied. Ions are generated by electron impact ionization of the process gas and are accelerated by the voltage difference between the target and the anode as the sputtering cathode. The bombardment of the target causes the atoms or molecules of the coating material to be ejected and aggregated into a deposited film on the substrate. The substrate is arranged opposite to the sputtering cathode, for example, under the sputtering cathode.

The rotating cathode is generally supported by the cathode drive unit of the sputtering device. Due to the geometry and design of the cathode, rotatable targets generally have higher utilization and increased operating time than flat targets. Therefore, the use of rotatable targets generally extends the service life and reduces costs. During sputtering, the cathode driving unit rotatably transmits movement to the rotating cathode. In the case where the longitudinal extension of the rotating cathode is provided, for example, up to about 4 m and the number of consecutive operations of several days of a representative sputtering device, the bearing of the cathode drive unit generally needs to reliably support the heavy mechanical load for a long time. segment.

In order to protect the cathode body from gas discharge and ion bombardment, darkroom shields can be provided at the driving end and the free end of the cathode. The shield around the driving end of the cathode body should prevent the process gas from discharging and contacting the driving end. The darkroom cover can be fixed on the wall of the chamber or on the drive unit, and can be electrically insulated from the fixed surface.

Material sputtered from the edge of the target may cause uneven deposition. In order to promote uniform deposition, it is usually preferred to place the dark area mask at the edge of the adjacent target. By shielding the edge of the target to avoid the plasma, the dark area mask reduces the sputtering on the edge of the target.

During sputtering, a film of deposition material is formed on the surface of the darkroom mask, on the area of the surface of the darkroom mask facing the substrate. Eventually, the film usually formed in areas where the film is thicker begins to break into chips or fragments. If the fragments of the generated material fall on the substrate, the fragments block the deposition on the area of the substrate where the fragments fell, resulting in defective products. Therefore, the darkroom cover must be replaced frequently, which increases the maintenance cost of the sputtering unit.

Furthermore, during repeated thermal cycles, darkrooms or dark area masks often experience thermal expansion. Therefore, for example, by providing a gap or empty space between the dark area cover and other features of the deposition equipment, the dark room or dark area cover is often configured to provide tolerances for thermal expansion in the longitudinal and lateral directions.

Due to the change in the size of the dark area mask during thermal expansion, gaps or empty spaces may be formed in unneeded positions, which may, for example, reduce the available space of a target used to sputter material from the target to the substrate on.

Therefore, there is a continuing need for devices and methods for improving the dark areas of the deposition equipment.

In view of the above, according to one aspect, a shielding device for a rotatable cathode is provided. The rotatable cathode has a rotatable target for sputtering material on a substrate. The shielding device includes: a shielding object configured to cover a part of the rotatable target; and a fixing object for connecting the shielding object to the rotatable target. The fixing object is configured to be clamped to the mask, so that the mask is substantially expanded away from the center of the rotatable target in the axial direction of the rotatable target.

Furthermore, according to another aspect, a shielding device for a rotatable cathode is provided. The rotatable cathode has a rotatable target for sputtering material on a substrate. The shielding device includes: a shielding object configured to cover a part of the rotatable target; and a fixing object for connecting the shielding object to the rotatable target. The fixed object is configured to hang the mask, so that the mask substantially expands away from the center of the rotatable target in the axial direction of the rotatable target.

Furthermore, a method is provided for masking a dark area in a deposition device during operation of a deposition device. This method provides a fixed object for connecting a rotatable target of the deposition equipment to a mask, and assembling several parts together, wherein the mask is formed to cover a part of the rotatable target to cover the deposition The dark area in the device. The mask is assembled to be clamped to the rotatable target, so that during the operation of the deposition device, the mask substantially expands away from the center of the rotatable target in the axial direction of the rotatable target.

Furthermore, a method is provided for masking a dark area in a deposition device during operation of a deposition device. This method provides a fixed object for connecting a rotatable target of the deposition equipment to a mask, and assembling several parts together, wherein the mask is formed to cover a part of the rotatable target to cover the deposition The dark area in the device. The mask is arranged to be suspended by the rotatable target, so that during the operation of the deposition device, the mask substantially expands away from the center of the rotatable target in the axial direction of the rotatable target.

The other aspects, advantages and characteristics of this disclosure are made clearer by the scope of the attached patent application, description and accompanying drawings. In order to have a better understanding of the above and other aspects of the present invention, the following is a detailed description of preferred embodiments in conjunction with the accompanying drawings:

Detailed reference will be achieved with various embodiments, and one or more examples of the embodiments are shown in the drawings. Each example is provided by way of explanation and is not meant to be a limitation. For example, the features illustrated or described as part of one embodiment can be used in other embodiments or combined with other embodiments to obtain still other embodiments. This means that this disclosure includes these adjustments and changes.

The embodiments of this disclosure are related to representative examples of nanomanufacturing technology solutions. Nanomanufacturing technology solutions include equipment, processes, and materials for film deposition and coating. Representative examples include (but not This is limited to several applications, including: semiconductor and dielectric materials and devices, silicon-based wafers, flat panel displays (such as thin film transistors (TFTs)), masks and filters, energy conversion and storage (such as optoelectronics) Batteries, fuel cells, and batteries), solid-state lighting (e.g. light-emitting diodes (LEDs)), magnetic and optical storage, micro-electromechanical systems (MEMS) and nano-electromechanical systems (NEMS), micro-optics and optoelectronic devices , Architectural and automotive glass, metallization systems and packaging for metal and polymer foils, and micron and nano molds.

Sputtering is a process in which energetic particles bombard the target and atoms are ejected from a solid target material. The process of coating a substrate generally refers to film application. The name "coating" and the name "depositing" are used interchangeably here. "Sputtering installation" and "deposition apparatus" are used interchangeably here and should mean the use of sputtering to deposit target material on a substrate. The target material deposited on the substrate is generally For the film.

Generally speaking, target materials include (but are not limited to) pure metals, metal alloys, semiconductor materials, and dielectric materials, such as aluminum (Al), copper (Cu), silver (Ag), and gold, and metal alloys. For example, aluminum niobium (AlNb) alloy or aluminum nickel (AlNi) alloy, semiconductor material such as silicon (Si), dielectric material such as nitride, carbide, titanate, silicate, aluminate and oxide The oxide is exemplified by transparent conducting oxides (transparent conducting oxides, TCO), and the transparent conducting oxide is, for example, ZnO doped with impurities, such as ZnO:Al, AlZnO, In ₂ O ₃ , SnO ₂ and CdO, and tin (Sn ) Doped In ₂ O ₃ (ITO) and fluorine (F) doped SnO ₂ . Oxides, nitrides, oxynitrides, and the like can also be deposited by reactive sputtering, where the target material reacts with the reactive gas in the process gas.

The name "substrate" used here shall mean an inflexible substrate and a flexible substrate. The inflexible substrate is for example a wafer or a glass plate, and the flexible substrate is for example a soft substrate (web) or foil. .

The name "dark space shield" used here should mean a shield that generally avoids sputtering of unnecessary parts of the cathode. The names "dark space shield" and "dark room shield" can be used interchangeably here.

Figure 1 is a schematic diagram showing a representative cross-section of the area 100 of the deposition equipment for sputtering materials on the substrate. The representative cross-section is along a direction parallel to the rotation axis 50, which is formed by a rotatable target. 10 definitions. The area 100 includes a driving unit 30 and a shielding device 20. The driving unit 30 is used to rotate the rotatable target 10. The shielding device 20 is connected to the rotatable target 10 to cover at least a part of the rotatable target 10. During the operation of the deposition device, the rotatable target can rotate around the rotation axis 50.

According to several embodiments herein, the cover 21 of the shielding device 20 can cover a part of the rotatable target 10, for example, the bottom end 15 of the rotatable target 10, for example. The bottom end 15 of the rotatable target 10 can be defined as the end of the rotatable target 10 connected to the driving unit 30. During operation of the sputtering equipment, the middle section 16 of the rotatable target 10 can be used to deposit material on the substrate. The name "middle section" and the name "uncovered section" are used interchangeably here. The top 17 of the rotatable target 10 may be covered by a shielding device (not shown in the drawings), for example, to avoid gas discharge caused by the accumulation of electric fields.

In this regard, for example, "top", "bottom", "upper", "lower", "above", "below", Directional terms such as "on" are used with reference to the direction of the rotation axis 50. The name "axial direction" used here is intended to describe the direction parallel to the rotation axis 50. Similarly, the name "radial direction" used here is intended to describe a direction orthogonal to and away from the rotation axis 50. Similarly, the name "axial distance" used here is intended to describe the distance in the direction of the rotation axis 50. The name “axial extension” used here is intended to describe the extension in the direction of the rotation axis 50.

FIG. 2 shows a schematic diagram of a part 60 of the area 100 of the deposition apparatus for depositing material on the substrate shown in FIG. 1. FIG. In particular, the shielding device 20 according to the embodiment herein is shown as being assembled around the driving end of the rotatable target 10.

The shield 21 of the shielding device 20 includes a first section 26 and a second section 27. The first section can be described as a section above the attachment point of the rotatable target pair driver, covering a part of the mask of the rotatable target in the axis direction of the target. The second section can be described as the attachment point of the rotatable target to the driver, the section of the mask covering a part of the rotatable target in the axis direction of the target, and the attachment point of the rotatable target to the driver Below, the second section can selectively extend in the axial direction.

According to the embodiment herein, the diameter of the first section 26 of the mask 21 may be smaller than the diameter of the second section 27 of the mask 21. The diameter of the first section 26 of the mask 21 may be substantially the same as the diameter of the rotatable target 10. According to the embodiment herein, the diameter of the rotatable target 10 can be defined as the diameter of the portion of the rotatable target 10 directly above the shield 21 of the shielding device 20. During the operation of the deposition apparatus, in the axial direction, this part of the rotatable target 10 parallel to the rotation axis 50 directly above the mask 21 can be used to deposit material on the substrate.

As shown in Figure 2, according to the embodiment here, the fixture 80 for connecting the mask 21 to the rotatable target 10 can be connected to the mask 21 in the first section 26 of the mask 21 . In particular, the fixing object 80 used for engaging with the mask object 21 can be connected to the mask object 21 at the inner periphery of the mask object 21. According to some embodiments that can be combined with other embodiments described herein, the fixture can be snapped to the cover by the fixing element, and/or the fixture can be configured to hang the cover on the fixture described here , The fixing element is like one or more screws or the like.

According to the embodiment herein, the guiding device 90 for stabilizing and/or guiding the mask can be attached to the driver of the deposition equipment. The guiding device 90 can be covered by the second section 27 of the cover 21. The guiding device can radially concentrate the mask.

FIG. 3 shows an exploded view of a part 60 of the area 100 of the deposition device for depositing material on the substrate shown in FIG. 1. FIG. According to several embodiments that can be combined with other embodiments described herein, the mask may include one or more notches, trenches, channels, or hollows, It is formed along the radial inner periphery of the shield 21 of the darkroom. The notch 22 may be located at an axial position of the mask object, and the axial position is in 50% or less of the top end of the mask object 21, especially 20% or less. According to the embodiment herein, the notch 22 may include an overhang or protrusion 23 to firmly connect the fixing object 80 and the shielding object 21 to each other.

According to the embodiment herein, the size of the notch 22 can be adjusted to accommodate at least a part of the fixing object 80 so that the mask 21 can be connected to the rotatable target 10 by the fixing object 80. In the embodiment herein, a fixed object 80 such as a polyetheretherketone (PEEK) ring can hold the rotatable target 10.

According to the embodiment herein, the rotatable target 10 may include one or more notches, grooves, channels, or recesses formed along the outer periphery of the rotatable target 10, which is suitable for accommodating the fixture 80. The notch may refer to the first notch 11 in the following. The first notch 11 may be located at the driving end of the rotatable target 10 to be covered by the shield 21 of the shielding device 20 during the operation of the deposition equipment.

According to the embodiment herein, the rotatable target 10 may include a recessed portion or a recess. It also means below that the recess or notch of the second recess 12 can be adapted to accommodate the shielding device 20, so that when the shielding device 20 is fixed to the rotatable target 10, it is applied to the outer surface of the rotatable target 10 in the deposition process It is in the same plane as the outer surface of the top end of the mask 21 (see the plane 70 shown in Figure 2).

According to the embodiment described here, the first recess 11 suitable for accommodating a fixed object can be located in the second recess 12, and the fixed object is connected to the rotatable target. During the operation of the deposition equipment, the fixture itself can be covered by a shield.

According to the embodiment herein, a shielding device that can cover a part of the target is provided, and a part of the target is, for example, a part of a rotatable target. The shielding device may include a shield and a fixture, and the fixture is used to connect the shield to the target. The fixture can be configured to allow the mask to substantially expand away from the center of the target in the axial direction of the target (see arrow 25 in Figure 2). The "essentially" used here is to explain that the axial expansion of the mask is understood to mean that most of the mask can expand in the axial direction of the target away from the center of the target (see reference number 13 in Figure 1 )the meaning of. For example, 50% or more of the mask can be expanded away from the center of the target in the axial direction of the target within 70% or more.

The mask can be connected to the fixed object at the shaft position of the mask, and the shaft position is 50% or less of the top of the mask, especially 20% or less. The top of the mask can be defined as the end of the mask closest to the center of the rotatable target. Alternatively, the top end of the mask can be defined as the end of the mask opposite to the end of the mask facing the drive unit in the axial direction of the mask. According to the embodiment herein, the center of gravity of the mask can be below the attachment point of the mask to the rotatable target. For example, when the mask is arranged around a part of the target, the center of gravity of the mask can be below the fixed object, and the fixed object is used to connect the mask to the target.

In order to connect the fixture and the mask to each other, the mask can include a specific attachment position, which is located in 50% or less of the top of the mask, especially 20% or less . For example, the mask may include notches. The notch may be located on the inner periphery of the mask so that when the mask is installed around the target, the notch faces the target. According to the embodiment herein, the notch may partially or completely extend along the inner periphery of the mask.

The name "notch" and the name "channel" can be used interchangeably in this system. The recess or at least part of the recess of the mask may include a bottom area, which is surrounded by side walls on each side. In the embodiment herein, at least one of the side walls may include a protrusion structure or a protrusion extending along at least part of the side wall to maintain the fixed object at a predetermined position.

According to the embodiment herein, the fixing object of the shielding device may be suitable for suspending or suspending the shielding object from a target, such as a rotating target. The name "hanging" or "suspending" can be used interchangeably in this system. Hanging or hanging the mask as described here generally means that when the mask is connected to a rotatable target to cover a part of the rotatable target, the mask is essentially not from below the fixed object support. During the thermal cycle, this allows the mask to expand downward from the attachment point towards the fixture (see Figure 2 for example). The mask can expand from the center of the target in the axial direction away from and toward the driving end of the target. The expansion of the mask can thus be controlled and directed in a predetermined direction. Due to the influence of gravity, in the embodiment described here, the mask can essentially expand towards the surface of the earth in a single direction. According to some embodiments that can be combined with other embodiments described herein, the fixture and/or the guiding device may include an insulating material. The insulating material can optionally include thermal resistance plastic. Thermal resistance plastic can improve its use in sputtering deposition chambers.

The shielding device according to the embodiment may further include a guiding device for guiding and stabilizing the shielding object in a direction perpendicular or radial to the axial direction of the shielding object. The guiding device can stabilize the mask and avoid moving in the direction away from the rotation axis of the mask. According to the embodiment herein, the guiding device can be suitable for connecting the driver of the deposition equipment.

The guiding device may include one or more friction reducing parts located at the point of contact with the mask. The one or more friction reducing parts may be movable together with the mask. According to the embodiment herein, the friction reducing part can be movable independently of the remaining part of the guiding device. For example, the friction reducing part may be one or more rollers. According to the embodiment herein, the mask may optionally or additionally include a friction reducing part located at the contact point to the guiding device.

The mask is generally electrically insulated from the rotatable target. For example, at least the contact surface between the fixing object and the guiding device and the shield can be made of insulating material. The insulating material can be, for example, a thermally resistant plastic, such as polyether ether ketone (PEEK).

According to the embodiment herein, the rotatable target may include a specific attachment position for connecting the mask to the rotatable target via a fixed object. For example, the attachment position may be a first notch extending along the outer periphery of the target. The first notch may extend partially or completely along the outer periphery of the target. The fixture can be attached to the rotatable target in form-fit or snap-fit, and includes positioning and locking characteristics (restriction characteristics).

The rotatable target may include a recess or a second recess. The recess or the second recess of the rotatable target can be adapted to provide a space or gap for accommodating the shielding device. This space or gap is used so that the surface of the mask and the rotatable target are essentially coplanar, and the rotatable target is used to deposit materials on the substrate.

According to the embodiments herein, the junction between the mask and the rotatable target can form an essentially flat or flush transition region. The section of the rotatable target directly above the top of the shield of the shielding device and the top of the shield of the shielding device may be on the same plane. During the operation of the deposition equipment, this system ensures that the material is uniformly deposited on the substrate.

According to the embodiment herein, the first notch of the rotatable target may be located in the second notch or recess of the rotatable target, and the first notch of the rotatable target is used to connect the fixing object of the shielding device to it.

The shielding device 20 shown in the figure may include a segmented dark area shield 21 suitable for rotating with the rotatable target 10. For example, the mask of the segmented dark area can be divided into two sections (herein also referred to as "parts"). The name "segmented" used here is intended to describe a dark area mask composed of many parts grouped together. The names "segment", "multi-part", and "in several parts" are used at the same time. Generally speaking, the mask has an uneven surface, which is typically the roughness between RZ 25 and RZ 70.

The dark area mask can be segmented into several segments that can be grouped together. When the mask is fixed to the target by, for example, using a securing device, the at least two components can be fixed together, such as a fastener. These segments can be separate segments, or these segments can be joined together by, for example, hinges or joints. In particular, the hinge or joint may be located on the inner side of these sections relative to the radial direction.

In the case where the dark area mask includes several components, the dark area mask can be easily arranged above at least a part of the rotatable target and can be fixed to it. A one-piece mask must be placed above the target so as to be arranged above at least a part of the target. Since the target can have a length substantially up to several meters, and since the target material can be easily affected by contact with the mask, maintenance work can essentially be performed by using the mask of several components described here cut back. According to several embodiments, the mask or at least several parts thereof may be arranged in a concentric manner with the rotatable target.

The name "rotatable target" used here shall mean any cathode assembly suitable for rotatably fixed to the sputtering device. Generally speaking, the rotatable target includes a target structure suitable for sputtering. The name "rotatable target" used here should especially mean a magnetically enhanced cathode assembly. In the magnetically enhanced cathode assembly, the assembly is reinforced with an additional internal magnetic unit to improve sputtering. The internal magnetic unit is, for example, a permanent magnet.

The rotatable target can be made of a target material into a hollow cylindrical body, and the rotatable target also means a rotatable sputtering cathode or a rotating cathode hereinafter. These rotating targets also mean monolithic targets, and can be manufactured by casting or sintering the target material.

A non-integral rotatable target generally includes a cylindrical rotatable tube with a target material layer coated on its outer surface. The cylindrical rotatable tube is, for example, a backing tube. In manufacturing such a rotatable sputtering cathode, the target material can be provided on the outer surface of the backing tube, for example, by spraying, casting, or isostatic pressing. Alternatively, the hollow cylinder of the target material may be disposed on the backing tube and bonded to the backing tube with, for example, indium to form a rotating cathode. The hollow cylinder of the target material may also refer to the target tube. According to still other options, the non-bonded target cylinder may be arranged radially outward from the backing tube.

In order to achieve an increased deposition rate, the use of magnetically enhanced cathodes has been proposed. This may also mean magnetron sputtering. The magnetic unit, which can include a magnet array, can be arranged inside the sputtering cathode, for example, inside the backing tube or inside the integral target, and can provide a magnetic field for magnetically enhanced sputtering. The cathode is generally rotatable around its longitudinal axis, so that the cathode can rotate relative to the magnetic unit. The name "end" or "edge" of the rotatable target or cathode used here in the text shall mean the end or edge in the axial direction of the cathode or target. Generally speaking, the outer cross section of the target or cathode is circular, with a diameter between 8 cm and 30 cm, for example, and the length of the target or cathode can be several meters, for example, as long as 0.3 m or even as long as 4 m.

During operation, due to the accumulation of electric fields, the electrically non-screened cathode may face a gas discharge (arc) at the edge of the cathode. This discharge is not needed. The area where the gas discharges adjacent to the cathode end is called the "dark room". According to the embodiment described here, the darkroom cover can be configured to cover one end or both ends of the cathode.

According to the embodiment herein, in order to avoid gas discharge on the driving end of the cathode, a mask is provided for shielding the dark room area of the target. The mask is generally made of an insulator. During the sputtering process, a target shielded by a non-rotating mask may only experience material deposition on one side of the darkroom mask. The film formed on the surface of the darkroom cover may form fragments after several deposition cycles and the material particles may be released and may be deposited on the surface of the substrate. Therefore, the deposition of sputtered material on the substrate is masked and results in product defects. The aforementioned material particles may generally accumulate and contaminate the deposition equipment.

With the darkroom cover that rotates with the target as described herein, the surface of the darkroom cover is exposed to material deposition. The material layer is deposited in a uniform manner to form a film on the entire darkroom cover. This means that the film can be deposited for a longer period of time before it becomes a fragment, which reduces the possibility of the fragment of the film falling onto the substrate. Compared with the provision of a non-rotating darkroom cover, the risk of contamination of the substrate and deposition equipment, maintenance time and cost can be reduced.

According to several embodiments, the several sections may be several cylindrical sections, and when these cylindrical sections are grouped together form a cylindrical mask. Generally, two sections are provided and each covers 180° of the circumference of the cylinder. According to other embodiments, as shown for example in Figure 6, the mask 21 can be assembled from three sections 24, where each section covers 120° of the cylinder.

The mask can be rotationally symmetric in a piecewise manner. The at least two parts of the mask are cylindrical section parts, covering, for example, 180° or 120° of the circumference. These parts assembled together form a cylinder, and the cylinder separated from the junction between these parts may be rotationally symmetrical. According to this disclosure, if a component is called "rotational symmetry", the surface is the same after the component is rotated. The rotation is relative to the center of rotation. In the case of a cylindrical section, the center of rotation is the center of the cylinder. The cylindrical section covering 360°/n (for example, n=2 or n=3) can therefore be rotated at any angle up to 360°/n, and the surface is the same. The name surface especially includes the surface on the radially outer circumference. Not limited to any specific embodiment herein, the mask may include more than three parts, such as four, six or more parts, and these parts are grouped together to cover 360° of the cylinder.

The cross-sectional view of the rotationally symmetrical cylindrical section is shown in Figure 7. The mask part or section 24 covering 180° of the cylinder has a center 28. The arrow 25 shown should indicate that the part can be rotated by 180° and especially the radial outer surface is the same.

In particular, according to the embodiments described herein, the cover section may not have holes, for example to accommodate screws or bolts or the like. The hole allows the mask part to rotate asymmetrically. In the known mask, holes are provided to assemble the mask to other elements. However, any rotatable asymmetric shape in the mask interferes with the electric field during sputtering. This instead reduces the uniformity of the layer on the coated substrate.

In addition, holes are provided to allow screws or the like to be inserted. Therefore, in order to release the assembly and fixation of the mask, for example, to perform maintenance, it is necessary to loosen the screws. This is time consuming, especially because the screw head is coated during sputtering, and in order to release the assembly and fixation of the mask, the coating must first be removed from the screw head and then the screw is loosened.

Therefore, providing a rotatable asymmetric mask without any rotatable asymmetric element not only improves the coating quality, but also reduces maintenance work and cost. The rotatable asymmetric element is, for example, a hole.

According to specific embodiments that can be combined with other embodiments described herein, the rotatable target may include a top mask. The top mask is located on the top of the rotatable target. The name "top end" should be understood as in the axial direction of the target, the end of the target is opposite to the end connected to the driver (herein referred to as the "drive end" of the rotatable target). The top mask is suitable for rotation with the rotatable target. Similar to the driving end shield, the top shield or at least several parts thereof can be arranged concentrically with the rotatable target.

During the repeated thermal cycles of the deposition chamber, the dark room or dark area cover often experiences thermal expansion. Therefore, a fixed object or element connected to the mask and the rotating target can be used to facilitate this repeated thermal expansion without repairing the rotating target.

In this field, a mask can be attached to the cathode driver to cover the driving end of the rotatable target. The driver supports the mask and the rotating target. In this case, the mask is expanded away from the supporting driver in the axial direction of the target and expanded toward the center of the rotating target. Therefore, a large space or gap can be provided between the cover at the driving end and the rotating target to allow the cover to undergo thermal expansion. These spaces can reduce the surface area of the target used to deposit material on the substrate.

FIG. 4 is a schematic diagram of a part of a shielding device for connecting a dark area shield to a rotatable target according to an embodiment. In particular, FIG. 4 is an enlarged view of a part 61 of the embodiment shown in FIG. 2. The fixed object 80 can be connected to the first recess 11 of the rotatable target 10. According to the embodiment herein, the first notch 11 may be milled into the rotatable target, for example.

According to the embodiment herein, the fixing object 80 may include a hook-shaped part, and the hook-shaped part is inserted into the recess 22 of the mask 21. The mask 21 can be hung or hung on the hook-shaped part.

In the embodiment herein, the protrusion structure or protrusion 23 can block the fixing object 80 located inside the recess 22. For example, the protrusion structure or protrusion 23 may extend toward the bottom end of the mask 21 in the axial direction of the mask 21. According to the embodiment herein, the protrusion structure or protrusion 23 may be located at the edge of the recess 22, especially the edge of the recess 22 closest to the top end of the mask 21.

According to the embodiment herein, the fixed object 80 can be configured such that the distance between the mask object and the rotatable target is from 1.5 mm to 4.5 mm, for example, about 3 mm ± 0.5 mm. Since the mask 21 can be hung or suspended from the fixed object 80, the gap or distance 40, 41 between the mask and the rotatable target can be essentially fixed during the thermal cycle. In particular, during the thermal cycle, the gap or distance 40 between the top of the mask 21 and the rotatable target 10 in the axial direction can be essentially due to the specific fixture 80 suitable for hanging the mask 21 The upper part remains fixed, and this particular fixture 80 allows the mask 21 to expand substantially downward from the center of the rotatable target during thermal cycling. Advantageously, during the operation of the deposition apparatus for depositing material on the substrate, the extension of the surface of the rotatable target used is essentially kept fixed to ensure the uniformity of the material layer deposited on the substrate.

FIG. 5 is a schematic diagram of other parts of the shielding device according to the embodiment. The other parts of the shielding device are used to connect the dark area shield to the rotatable target. Fig. 5 shows an enlarged view of a part 62 of the embodiment shown in Fig. 2. In particular, FIG. 5 shows the bottom part of the shielding device 20. According to the embodiment herein, during the operation of the deposition equipment, the bottom portion of the shield 21 of the shielding device 20 can be adapted to cover the bottom end of the rotatable target 10. The bottom end of the rotatable target 10 may include a part of the rotatable target that is connected to the driver of the deposition device.

In the embodiment here, the shielding object 21 of the shielding device 20 can be separated from the rotatable target by a distance 41 in one direction, which is perpendicular to the axis of the rotatable target, and this distance 41 can essentially be in the deposition equipment The thermal cycle remains fixed during operation. According to several embodiments, the gap or distance 41 between the rotatable target and the mask 21 can be from 1.5 mm to 4.5 mm, for example about 3 mm ± 0.5 mm.

According to the embodiment herein, the shielding device 20 may include a guiding device 90 for stabilizing the bottom end of the shield 21 of the shielding device 20. The guiding device can stabilize the mask 21 in a direction that is perpendicular to the axis of the mask or in the radial direction of the self-rotating target.

The guiding device can be adapted to the driver connected to the deposition equipment. In the embodiment herein, the guiding device may include a friction reducing part located at the contact point with the shield 21 of the shielding device 20. For example, the friction reducing part may be a movable part. During the operation of the deposition device, the movable part of the friction reducing part may be adapted to be movable together with the mask 21.

The guiding device 90 and the shielding object 21 of the shielding device 20 can be configured so that the space or gap 42 is formed in the axial direction between the guiding device 90 and the shielding object 21. During the thermal cycle operation of the deposition equipment, the gap 42 can be adapted to allow the mask to freely expand downward from the center of the rotatable target. According to the embodiment herein, compared to the non-expanded state of the mask, when the mask 21 is in the expanded state, the gap 42 can be smaller.

FIG. 8 is a cross-sectional view of the sputtering device 200 along the rotation axis 50 according to the embodiment. The sputtering device 200 generally includes a processing chamber 220, and the processing chamber 220 is formed by walls 231 and 232. According to a typical embodiment, the axis of rotation 50 of the cathode, target, or backing tube is essentially parallel to the wall 231, wherein the drop-in configuration of the cathode is achieved.

According to several embodiments, at least one end block 101 is fixed in the processing chamber 220, and the end block 101 may include a driver for rotating the rotatable target. The bottom body 110 is generally fixed to a flap or door 230 of the processing chamber 220 via an insulating plate 116. During sputtering, the lid or door 230 is closed. Therefore, the bottom body 110 is generally stationary during sputtering, at least not rotatable. Alternatively, the housing 125 can be directly fastened to the wall 231 of the processing chamber 220.

According to several embodiments, the rotary driver 150 is disposed on the outside of the processing chamber 220 by the fixed support 152, and the rotary driver 150 is generally an electrical driver. However, the rotary driver 150 can also be placed in the housing 125. Generally, during sputtering, the rotary driver 150 drives the rotatable target 10, chain or tooth via its motor shaft 154, a pinion 153 connected to it, and a chain or toothed belt (not shown). The belt is surrounded by a pinion 153 and a gear-wheel 151, and the gear 151 is attached to the bearing shell 123 of the rotor 122.

Generally, the coolant supply pipe 134 and/or the electrical supply line are provided from the coolant supply and discharge unit 130 and/or the electrical supply unit to the outside of the processing chamber 220 through the housing 125.

The rotatable target 10 is generally supported by the end block 101. In addition, the rotatable target 10 can be further supported at its top end. According to the embodiment herein, the shielding device 20 in the related drawings in more detail can cover at least a part of the rotatable target 10. The shielding device may extend in the axial direction of the rotating shaft 50 of the rotatable target 10 and cover at least a part of the joint between the rotatable target 10 and the end block 101.

According to the embodiment herein, the rotatable target 10 can be fixed to the target flange 121 of the end block along the rotation axis 50. According to several embodiments, the target flange 121 and the rotatable target 10 are coaxial with each other. The shielding device 20 can extend to the rotation axis 50 of the target along the axial direction to cover at least a part of the target flange 121.

The rotatable target 10 can be installed on the upper part of the target flange 121 by using a ring clamp, and the ring clamp presses the rotatable target 10 on the target flange 121. O-ring seals can be respectively arranged between the target flange 121 and the junction between the backing tube and the rotatable target 10. Therefore, the rotatable target 10 can be tightly fixed to the target flange 121 under vacuum.

According to several embodiments, the rotatable target 10 can be tightly fixed to the upper portion of the target flange 121 in a vacuum, for example, to prevent fluid leakage into the low pressure processing chamber. This part is generally achieved by a ring seal (not shown).

During sputtering, in order to allow the rotatable target 10 to serve as a cathode, at least one electric supply (not shown) for the rotatable target 10 may also be provided by the target flange 121.

According to several embodiments that can be combined with other embodiments described herein, the target flange and the bearing shell can be made of conductive material, such as steel. In these embodiments, current can flow from the current collecting plate to the rotatable target via the bearing housing and the target flange.

According to several embodiments that can be combined with other embodiments described herein, the target flange can be adapted to mechanically support a rotatable target. In addition, the coolant and power supply for the target tube can be provided by the target flange.

FIG. 9 is a schematic diagram of the sputtering device 200 shown in FIG. 8. The cross-sectional view of Figure 9 is orthogonal to the cross-sectional view of Figure 8. According to an embodiment, the sputtering device 200 has a vacuum processing chamber 220, and the vacuum processing chamber 220 includes a gas inlet 201 for supplying a processing gas such as argon to the vacuum processing chamber 220. The vacuum processing chamber 220 further includes a substrate support 202 and a substrate 203 disposed on the substrate support 202. Furthermore, the vacuum processing chamber 220 includes a rotatable target 10.

A high voltage difference can be provided between the rotatable target 10 as a cathode and the substrate support 202 as an anode. Plasma is generally formed by impact ionization of accelerated electrons such as argon atoms. The formed argon ions are accelerated in the direction of the rotatable target 10, so that the particles, which are usually the rotatable target 10, are sputtered and successively deposited on the substrate 203, and the particles are usually atoms.

In several embodiments, other suitable gases can be used to generate plasma. Examples of other suitable gases are other inert gases or reactive gases, such as krypton, and reactive gases such as oxygen or nitrogen. According to typical embodiments that can be combined with other embodiments described herein, the pressure in the plasma region may be about 10 ^-4 mbar to about 10 ^-2 mbar, typically about 10 ^-3 mbar. In other embodiments, the vacuum processing chamber 220 may include one or more holes and/or valves for guiding or retracting the substrate 203 into or out of the vacuum processing chamber 220.

Magnetron sputtering is particularly advantageous in the part where its deposition rate is quite high. By arranging one or more magnets 14 inside the rotatable target 10, free electrons in the generated magnetic field directly below the target surface can be captured. This usually increases the probability of ionizing gas molecules by several orders of magnitude. The deposition rate can then increase significantly. Depending on the application and the material to be sputtered, a fixed or time-varying magnetic field can be used. Furthermore, a cooling fluid may circulate in the rotatable target 10 to cool the magnet 14 and/or the rotatable target 10.

The rotatable target 10 can be supported by an end block 101, which is not seen in the cross-sectional view shown and is therefore shown in a dashed circle. The end block 101 can be non-rotatably fixed to the wall 231 or the door 230 or cover of the processing chamber 220. The wall 231 or the door 230 or cover of the processing chamber 220 is not shown in the cross-sectional view shown, and is therefore rectangular with a dotted line Illustrated.

According to the embodiment herein, during the operation of the deposition device, a method for shielding the dark area in the deposition device is provided. The method includes providing a fixture for connecting the mask to the rotatable target of the deposition device, wherein providing the fixture may include connecting the fixture to the rotatable target. This method may further include assembling several parts together, wherein a mask is formed to cover a part of the rotatable target to shield the dark area in the deposition equipment, wherein the mask is assembled to hang on the rotatable target And/or snapped to the rotatable target, so that during the operation of the deposition device, the mask is essentially expanded away from the center of the rotatable target in the axial direction of the rotatable target. Assembling a plurality of parts may include assembling two or more mask parts to form a mask.

According to the embodiment herein, during the operation of the deposition device, the method for shielding the dark area in the deposition device may further include assembling a mask such that the mask is hung on the rotatable target at the attachment point, and The center of gravity of the mask is below the attachment point. The method may also include stabilizing the mask in a direction that is perpendicular to the axis of the mask.

Although the specific features of the various embodiments of the present disclosure may be shown in some drawings but not in other drawings, this is only for convenience. Any feature in a drawing can be combined with any feature in any other drawing in a reference and/or claimed manner.

The description uses several examples to disclose the present disclosure including the best mode, and also allows those with ordinary knowledge in the field to realize the target, including manufacturing and using any device or system and executing any incorporated method . When various specific embodiments have been disclosed in the foregoing, those with ordinary knowledge in this technical field will understand that the spirit and scope of the patent application allow equivalent adjustments. In particular, the features of the above embodiments that are not mutually exclusive can be combined with each other. The scope of patentability is defined by the scope of patent application, and may include these adjustments and other examples that people with ordinary knowledge in the technical field think of. If there is no difference between the structural elements of these examples and the literal language of the patent scope of this application, or if these examples include equivalent structural elements, and the equivalent structural elements are the literal language of the patent scope of this application When the language is an insubstantial difference, these other examples are intended to be included in the scope of the patent of this application.

10‧‧‧Rotating target 11‧‧‧First notch 12‧‧‧Second notch 13, 28‧‧‧Center 14‧‧‧Magnet 15‧‧‧Bottom 16‧‧‧Middle section 17‧‧‧Top 20‧‧‧Shielding device 21‧‧‧Mask 22‧‧‧Notch 23‧‧‧Protrusions Section 24‧‧‧ 25‧‧‧Arrow 26‧‧‧Section 1 27‧‧‧Second section 30‧‧‧Drive unit 40、41‧‧‧Distance 42‧‧‧Gap 50‧‧‧Rotating axis 60, 61, 62‧‧‧partial 70‧‧‧Plane 80‧‧‧Fixture 90‧‧‧Guiding device 100‧‧‧area 101‧‧‧end block 110‧‧‧Bottom body 116‧‧‧Insulation board 121‧‧‧Target flange 122‧‧‧Rotor 123‧‧‧Bearing shell 125‧‧‧Shell 130‧‧‧Coolant supply and discharge unit 134‧‧‧Coolant Supply Pipe 150‧‧‧Rotary Drive 151‧‧‧Gear 152‧‧‧Fixed support 153‧‧‧pinion gear 154‧‧‧Motor shaft 200‧‧‧Sputtering device 201‧‧‧Gas inlet 202‧‧‧Substrate support 203‧‧‧Substrate 220‧‧‧Processing chamber 230‧‧‧door 231, 232‧‧‧Wall

Part of the above-mentioned embodiments will be described in more detail in the following representative embodiments with reference to the following drawings. The following drawings include: Figure 1 shows a deposition device for sputtering materials on a substrate according to an embodiment The side view of the shielding device, the rotatable target and the cathode driver; Figure 2 shows an enlarged view of a part 60 of the embodiment shown in Figure 1 of the embodiment; Figure 3 shows the shielding device according to the embodiment An exploded view of the shield; Figure 4 shows a schematic diagram of a part of a shielding device for connecting a dark area shield to a rotatable target according to an embodiment; Figure 5 shows a part of a shielding device for connecting a dark area according to an embodiment A schematic diagram of the mask on other parts of the shielding device of the rotatable target; Figure 6 shows a top view of the darkroom mask according to the embodiment; Figure 7 shows a schematic diagram of the mask component according to the embodiment; 8 is a cross-sectional view of the sputtering device according to the embodiment; and FIG. 9 is a cross-sectional view of the sputtering device according to the embodiment.

10‧‧‧Rotating target

13‧‧‧Center

15‧‧‧Bottom

16‧‧‧Middle section

17‧‧‧Top

20‧‧‧Shielding device

21‧‧‧Mask

30‧‧‧Drive unit

50‧‧‧Rotating axis

60‧‧‧Part

100‧‧‧area

Claims (20)

A shielding device (20) is used for a rotatable cathode. The rotatable cathode has a rotatable target (10) for sputtering materials on a substrate. The shielding device includes: a shield (21), Is configured to cover a part of the rotatable target (10); and a fixture (80) for connecting the shield (21) to the rotatable target (10); wherein the fixture (80) is It is configured to be clamped to the mask (21) so that the mask substantially expands away from the center (13) of the rotatable target (10) in the axial direction of the rotatable target. The shielding device (20) described in item 1 of the scope of patent application, wherein the shielding object (21) is connected to the fixing object (80) at a position of one axis of the shielding object (21), and the shielding object The axis position is in 50% or less of the top of the mask. The shielding device (20) described in item 1 of the scope of patent application, wherein the shielding object (21) is connected to the fixing object (80) at a position of one axis of the shielding object (21), and the shielding object The axis position is in 20% or less of the top of the mask. The shielding device (20) according to any one of items 1 to 3 in the scope of the patent application, wherein the fixing object (80) is configured to maintain the shielding object (21) in a direction with the rotatable target ( 10) A fixed distance apart, the direction perpendicular to the axis direction of the rotatable target. The shielding device (20) described in item 4 of the scope of patent application, wherein the fixed object (80) is configured to maintain the shielding object in the direction with the rotatable target (10) The fixed distance (41) is separated, and the direction is perpendicular to the axial direction of the rotatable target, and the fixed distance is from 1.5 mm to 4.5 mm. For example, the shielding device (20) described in any one of items 1 to 3 in the scope of the patent application, wherein the center of gravity of the shielding object (21) is below the fixing object (80), and the fixing object is used for Connect the shield to the rotatable target. For example, the shielding device (20) described in any one of items 1 to 3 in the scope of the patent application further includes a guiding device (90) for stabilizing the shielding object (21) in a direction which is The direction perpendicular to one axis of the mask. The shielding device (20) described in item 7 of the scope of patent application, wherein the guiding device (90) includes a friction reducing portion located at a contact point with the shielding object (21). The shielding device (20) described in item 8 of the scope of patent application, wherein the friction reducing part and the shielding object (21) are movable together. The shielding device (20) described in item 7 of the scope of patent application, wherein the fixing object (80) and the guiding device (90) comprise an insulating material. In the shielding device (20) described in item 10 of the scope of the patent application, the insulating material includes a thermal resistance plastic. The shielding device (20) described in the first item of the scope of patent application, wherein the fixing object (80) includes an insulating material. The shielding device (20) described in the first item of the scope of patent application, wherein the shielding device further includes a guiding device (90) for stabilizing the shielding object (21) in a direction that is perpendicular to One axis direction of the shield, and the guiding device (90) Includes an insulating material. The shielding device (20) according to any one of items 12 to 13 in the scope of the patent application, wherein the insulating material includes a thermal resistance plastic. The shielding device (20) according to any one of items 1 to 3 in the scope of patent application, wherein the fixing object (80) includes a polyether ether copper (PEEK) ring for hanging the shielding object (21) . A rotatable target (10) having a material for sputtering on a substrate in a deposition device, the rotatable target including a first notch (11) along the periphery of the rotatable target , The first notch is used to connect the shielding device as described in any one of items 1 to 3 in the scope of the patent application. The rotatable target (10) described in item 16 of the scope of patent application, wherein the rotatable target includes a second notch (12) along the periphery of the rotatable target, the second notch is used to accommodate the At least a part of the mask (21) makes the mask and the rotatable target substantially flush with respect to each other. The rotatable target (10) described in item 17 of the scope of patent application, wherein the first recess (11) is located in the second recess (12). A method for shielding a dark area in a deposition device during operation of the deposition device, the method comprising: providing a fixture (80) for connecting a rotatable target (10) of the deposition device In a mask (21); and assemble a plurality of components together, wherein the mask (21) is formed to cover a part of the rotatable target to shield the dark area in the deposition equipment; The shield (21) is assembled to be engaged with the rotatable target, so that during the operation of the deposition device, the shield substantially expands away from the rotatable target in the axial direction of the rotatable target (10) Center. A shielding device (20) for a rotatable cathode. The rotatable cathode has a rotatable target (10) for sputtering material on a substrate. The device includes: a shield (21) configured to To cover a part of the rotatable target (10); and a fixed object (80) for connecting the shielding object (21) to the rotatable target (10), wherein the fixed object (80) is arranged It is used to engage the shield (21) so that the shield essentially expands away from the center (13) of the rotatable target (10) in the axial direction of the rotatable target, wherein the fixed object (80) is configured to maintain the shield (21) at a fixed distance from the rotatable target (10) in a direction perpendicular to the axial direction of the rotatable target, and wherein the shielding device further includes: . A guiding device (90) for stabilizing the mask (21) in a direction perpendicular to the axis of the mask; and wherein the rotatable target (10) includes a first notch (11) ), along its periphery, to connect the shielding device (20).

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