TWI707766B - Imprinting system, glue supplying device and imprinting method - Google Patents

Abstract

An imprinting system including a imprinting mold and a glue supplying device is provided. The imprinting mold has an imprinting surface. The glue supplying device includes a glue supplying main body and a glue injection portion. The glue supplying main body is adapted to drive the glue injection portion to move toward the imprinting surface, and to supply a first glue layer onto the imprinting surface through the glue injection portion. The imprinting mold is adapted to imprint the first glue layer onto a wafer. In addition, an imprinting method is also provided.

Description

Imprinting system, glue supply device and imprinting method

The invention relates to an imprinting system, a glue supply device and an imprinting method, and more particularly to an imprinting system, a glue supplying device and an imprinting method used in a wafer imprinting process.

Nanoimprinting uses the imprinted microstructures of the mold (such as multiple concave holes) to imprint the adhesive layer on the wafer to form the required microstructure on the wafer, such as the optical microstructure of the lens of an optical device . However, when the depth of the recessed hole of the mold is large, during the imprinting process, the air in the recessed hole cannot be completely discharged as the glue enters, thereby generating bubbles and affecting the product yield. Moreover, if the pressure applied by the mold to the adhesive layer during the imprinting process is changed (increased) in order to solve the bubble problem, the imprint quality will be affected due to the change.

The invention provides an embossing system, a glue supply device and an embossing method, which can prevent the glue layer from generating bubbles after embossing.

The imprinting system of the present invention includes an imprinting mold and a glue supply device. The imprinting mold has an imprinting surface. The glue supply device includes a glue supply main body and a glue outlet part. The glue supply body is adapted to drive the glue out part to move to the imprinting surface, and the glue out part provides a first glue layer to the imprinting surface. The imprinting mold is suitable for printing the first adhesive layer onto a wafer.

The glue supply device of the present invention includes a glue supply main body, an extension arm and a glue outlet part. The extension arm extends from the glue supply main body. The glue outlet part is arranged at the end of the extension arm. The glue supply main body is adapted to drive the extension arm to extend into an imprinting mold so that the glue outlet is located on an imprinting surface of the imprinting mold, and the glue outlet provides a first adhesive layer to the imprinting surface. The imprinting mold is suitable for printing the first adhesive layer onto a wafer.

In an embodiment of the present invention, the bottom of the above-mentioned glue supply body has a plurality of rollers, and the glue supply body is adapted to move by the rollers.

In an embodiment of the present invention, the above-mentioned glue supply device includes an extension arm that extends from the glue supply body, and the glue outlet portion is disposed at the end of the extension arm, and the extension arm is adapted to extend into the imprinting mold to make The glue outlet is located on the imprinting surface.

In an embodiment of the present invention, the above-mentioned glue supply body is suitable for driving the extension arm up and down.

In an embodiment of the present invention, the aforementioned glue supply body supplies glue to the glue outlet part through the extension arm.

In an embodiment of the present invention, the above-mentioned imprinting mold includes an upper mold and a carrying table, and the carrying table is located below the upper mold and is suitable for carrying wafers.

In an embodiment of the present invention, the above-mentioned glue supply main body is suitable for driving the glue outlet part to move between the upper mold and the carrying platform.

In an embodiment of the present invention, the glue outlet part has a glue outlet surface, and the center of the glue outlet surface has a glue outlet hole.

In an embodiment of the present invention, the above-mentioned glue outlet hole is adapted to be positioned at the center of the imprinting surface by the driving of the glue supply body.

In an embodiment of the present invention, the above-mentioned glue outlet portion is adapted to have a distance from the imprinting surface by the driving of the glue supply body.

In an embodiment of the present invention, the above-mentioned embossing surface has a plurality of embossing recesses, and the glue outlet portion is adapted to allow part of the first adhesive layer to enter at least part of these embossing recesses.

In an embodiment of the present invention, the above-mentioned glue discharging part is suitable for applying a glue discharging pressure to the imprinting surface to at least partially expel the bubbles in the imprinting recesses.

In an embodiment of the present invention, the above-mentioned wafer has a second adhesive layer, and the imprinting mold is suitable for printing the first adhesive layer onto the second adhesive layer.

The imprinting method of the present invention includes the following steps. Provide an imprint mold with an imprint surface. Provide a glue supply device, including a glue supply main body and a glue outlet. The glue supply body drives the glue out part to move to the imprinting surface, and the glue out part provides a first glue layer to the imprinting surface. The imprinting mold prints the first adhesive layer onto a wafer.

In an embodiment of the present invention, the bottom of the above-mentioned glue supply body has a plurality of rollers, and the method includes the following steps. The main body of the glue is moved by these rollers.

In an embodiment of the present invention, the aforementioned glue supply device includes an extension arm, the extension arm extends from the glue supply body, and the glue outlet portion is disposed at the end of the extension arm. The method includes the following steps. The extension arm extends into the imprinting mold so that the glue out part is positioned on the imprinting surface.

In an embodiment of the present invention, the above-mentioned imprinting method includes the following steps. The main body of the glue supply drives the extension arm up and down.

In an embodiment of the present invention, the above-mentioned imprinting method includes the following steps. The glue supply body supplies glue to the glue outlet part through the extension arm.

In an embodiment of the present invention, the above-mentioned imprinting mold includes an upper mold and a bearing table, the bearing table is located below the upper mold, and the method includes the following steps. The wafer is carried by the stage.

In an embodiment of the present invention, the above-mentioned imprinting method includes the following steps. The glue supply main body drives the glue out part to move between the upper mold and the bearing platform.

In an embodiment of the present invention, the aforementioned glue outlet portion has a glue outlet surface, and the center of the glue outlet surface has a glue outlet hole. The method includes the following steps. The glue outlet hole is aligned at the center of the imprinting surface by the drive of the glue supply main body.

In an embodiment of the present invention, the above-mentioned imprinting method includes the following steps. The glue outlet part is driven by the glue supply body to have a distance from the imprinting surface.

In an embodiment of the present invention, the above-mentioned imprinting surface has a plurality of imprinting concave holes, and the method includes the following steps. The glue outlet part allows part of the first glue layer to enter at least part of these embossed recesses.

In an embodiment of the present invention, the above-mentioned imprinting method includes the following steps. The glue discharging part applies a glue discharging pressure on the imprinting surface to at least partially expel the air bubbles in the imprinting concave holes.

In an embodiment of the present invention, the above-mentioned imprinting method includes the following steps. Provide a second adhesive layer on the wafer. The imprinting mold prints the first adhesive layer to the second Glue layer.

Based on the above, the present invention uses the glue supply device to provide the first glue layer on the imprinting surface of the imprint mold before using the imprint mold to imprint the wafer, so that the glue supply device can use enough glue during the glue supply process. The pressure of the glue supply causes the bubbles of the first glue layer on the imprinting surface to be discharged, and then the imprinting mold then prints the first glue on the imprinting surface with the discharged bubbles onto the wafer. Accordingly, the pre-pressure is applied to discharge the bubbles to prevent the adhesive layer from leaving bubbles after the embossing, thereby improving the yield of the embossed product.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.

50: The first adhesive layer

60: second adhesive layer

100: Imprinting system

110: Imprint mold

110a: Imprinting surface

110b: Embossed concave hole

112: Upper mold

114: bearing platform

120: Glue supply device

122: Main body for glue

122a: scroll wheel

122b: Glue dispenser

122c: plastic bucket

122d: hose

124: Glue department

124a: Glue surface

126: Extension arm

H: Glue hole

W: Wafer

Fig. 1 is a schematic diagram of an imprinting system according to an embodiment of the present invention.

Fig. 2 is a perspective view of the glue supply device of Fig. 1.

Fig. 3 shows the glue outlet part of the glue supply device of Fig. 2 moved into the imprinting mold.

FIG. 4 illustrates that the glue outlet part of FIG. 3 rises and glue is discharged.

FIG. 5 is a partial enlarged view showing the glue layer provided by the glue outlet part of FIG. 4 to the imprinting surface of the mold.

Fig. 6 shows the glue ejection part of Fig. 4 moved away from the imprinting mold.

Fig. 1 is a schematic diagram of an imprinting system according to an embodiment of the present invention. Figure 2 is Figure 1 A perspective view of the glue supply device. Fig. 3 shows the glue outlet part of the glue supply device of Fig. 2 moved into the imprinting mold. Please refer to FIGS. 1 to 3. The imprinting system 100 of this embodiment includes an imprinting mold 110 and a glue supply device 120. The imprint mold 110 includes an upper mold 112 and a carrying table 114, and the carrying table 114 is located below the upper mold 112 and is suitable for carrying the wafer W. Before the imprinting mold 110 imprints the wafer W, the glue supply device 120 is used to provide an adhesive layer to the imprinting surface of the imprinting mold 110, as detailed below.

FIG. 4 illustrates that the glue outlet part of FIG. 3 rises and glue is discharged. FIG. 5 is a partial enlarged view showing the glue layer provided by the glue outlet part of FIG. 4 to the imprinting surface of the mold. The upper mold 112 of the imprint mold 110 has an imprint surface 110a as shown in FIG. 5, and the imprint surface 110a has a plurality of imprint concave holes 110b. In order to make the drawing clearer, FIG. 5 depicts the embossed cavities 110b as larger. In fact, the embossed cavities 110b may be nano-scale microstructures, and the present invention is not limited thereto. The glue supply device 120 includes a glue supply body 122 and a glue outlet 124 as shown in FIG. 2. The glue supply body 122 is adapted to drive the glue outlet 124 to move between the upper mold 112 and the carrier 114 as shown in FIG. 3, and rise as shown in FIG. 4 to move toward the imprint surface 110a (marked in FIG. 5) of the upper mold 112 . As shown in FIG. 5, the glue supply body 122 provides a first glue layer 50 to the embossing surface 110 a through the glue outlet 124, so that a part of the first glue layer 50 enters at least a part of the embossing recesses 110 b.

The glue supply device 120 can discharge the bubbles of the first glue layer 50 in the embossing recesses 110b of the embossing surface 110a with sufficient glue supply pressure during the above-mentioned glue supply process. Fig. 6 shows the glue ejection part of Fig. 4 moved away from the imprinting mold. After the glue supply device 120 provides the first glue layer 50 to the imprint surface 110a of the imprint mold 110, the glue supply body 122 drives the glue portion 124 to move away from the imprint mold 110 to become the state shown in FIG. 6, and then press The imprint mold 110 can impress the first adhesive layer 50 on the imprinting surface 110 a of which the bubbles have been discharged onto the second adhesive layer 60 on the wafer W. Accordingly, the pre-pressure is applied to discharge the bubbles to prevent the adhesive layer from leaving bubbles after the embossing, thereby improving the yield of the embossed product.

Furthermore, since the problem that the adhesive layer bubbles are difficult to discharge mostly occurs in the center of the imprinting surface, the first adhesive layer 50 provided by the adhesive supply body 122 can be concentrated on the center of the imprinting surface 110a. Specifically, the glue outlet portion 124 of this embodiment has a glue outlet surface 124a as shown in FIGS. 3 to 5, and the glue outlet surface 124a has a glue outlet hole H in the center. The glue outlet hole H is adapted to be positioned at the center of the imprinting surface 110a (marked in FIG. 5) by the drive of the glue supply body 122 (drawn in FIG. 2), so that the glue outlet portion 124 penetrates the glue outlet hole H to press A first adhesive layer 50 is provided at the center of the printing surface 110a. Under this embossing method, the surrounding area of the embossing surface 110a is directly embossed by the second adhesive layer 60 spreading around, instead of embossing the first adhesive layer 50 to the second as in the center.胶层60。 Glue layer 60.

In this embodiment, the glue outlet 124 is adapted to have an appropriate distance from the imprinting surface 110a of the imprint mold 110 as shown in FIG. 5 by the driving of the glue supply body 122, and provide a proper amount of glue to produce Sufficient pressure to expel the bubbles. The distance is, for example, 0.1 mm, and the amount of glue is, for example, 2 milliliters, which is not limited by the present invention.

Please refer to FIG. 2, the bottom of the glue supply body 122 of this embodiment may have a plurality of rollers 122a, and are adapted to be moved to the imprint mold 110 (shown in FIGS. 3 and 4) or moved by these rollers 122a From the imprinting mold 110. In addition, the glue supply device 120 further includes an extension arm 126 extending from the glue supply body 122, and the glue outlet 124 is configured At the end of the extension arm 126, the extension arm 126 is adapted to extend into the imprinting mold 110 so that the glue-out portion 124 is positioned on the imprinting surface 110a of the imprinting mold 110. In addition, the glue supply main body 122 can be driven by a servo motor or other suitable driving device to drive the extension arm 126 up and down between the states shown in FIGS. 3 and 4.

Furthermore, the glue supply body 122 may have a braking device at its roller 122a, and it is set to allow the roller 122a to act only when the extension arm 126 and the glue outlet 124 are in the lower position shown in FIG. 3, In order to prevent the extension arm 126 and the glue outlet 124 from being accidentally actuated and hitting the imprint mold 110 when they are at the higher position shown in FIG. 4. In addition, the glue supply body 122 of this embodiment is driven by the glue dispenser 122b to make the glue in the glue bucket 122c pass through the hose 122d and the extension arm 126 to supply glue to the glue outlet 124. In addition, the glue supply body 122 may be provided with a human-machine interface for the user to operate, so as to control the lifting of the extension arm 126 and the glue discharge amount of the glue outlet 124 as required.

In summary, in the present invention, before using the imprinting mold to imprint the wafer, the glue supply device is used to provide the first glue layer on the imprinting surface of the imprinting mold. The glue supply device can use Sufficient glue supply pressure allows the bubbles of the first glue layer on the imprinting surface to be discharged, and then the imprinting mold then prints the first glue on the imprinting surface with the discharged bubbles onto the wafer. Accordingly, the pre-pressure is applied to discharge the bubbles to prevent the adhesive layer from leaving bubbles after the embossing, thereby improving the yield of the embossed product.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be determined by the scope of the attached patent application.

50‧‧‧First adhesive layer

110‧‧‧Imprint mold

112‧‧‧Upper mold

114‧‧‧Carrier

124‧‧‧Gluing department

124a‧‧‧Gluing surface

H‧‧‧Glue hole

W‧‧‧wafer

Claims (28)

An imprinting system includes: an imprinting mold having an imprinting surface; and a glue supply device, including a glue supply main body and a glue discharge part, wherein the glue supply main body is adapted to drive the glue discharge part to the pressing The printing surface moves, and a first adhesive layer is provided to the imprinting surface through the glue ejection part, and the imprinting mold is suitable for printing the first adhesive layer on a wafer, wherein the wafer has a first adhesive layer Two adhesive layers, the embossing mold is suitable for printing the first adhesive onto the second adhesive layer. The imprinting system as described in the first item of the patent application, wherein the bottom of the glue supply body has a plurality of rollers, and the glue supply body is adapted to move by the rollers. The imprinting system according to the first item of the scope of patent application, wherein the glue supply device includes an extension arm extending from the glue supply main body, the glue outlet portion is disposed at the end of the extension arm, and the extension arm It is suitable for extending into the embossing mold so that the glue outlet part is positioned on the embossing surface. According to the imprinting system described in item 3 of the scope of patent application, the glue supply body is adapted to drive the extension arm up and down. The imprinting system as described in item 3 of the scope of patent application, wherein the glue supply body supplies glue to the glue outlet part through the extension arm. According to the imprinting system described in claim 1, wherein the imprinting mold includes an upper mold and a carrier, and the carrier is located below the upper mold and is suitable for carrying the wafer. According to the imprinting system described in item 6 of the scope of patent application, the glue supply body is adapted to drive the glue outlet part to move between the upper mold and the carrying platform. As for the imprinting system described in item 1 of the scope of patent application, the glue outlet part has a glue outlet surface, and the center of the glue outlet surface has a glue outlet hole. The imprinting system described in item 8 of the scope of patent application, wherein the glue outlet hole is adapted to be positioned at the center of the imprinting surface by the driving of the glue supply body. According to the imprinting system described in item 1 of the scope of patent application, the glue outlet is adapted to be driven by the glue supply body to have a distance from the imprinting surface. The embossing system according to the first item of the patent application, wherein the embossing surface has a plurality of embossing concave holes, and the glue outlet portion is adapted to allow part of the first adhesive layer to enter at least part of the embossing concave holes. According to the imprinting system described in item 11 of the scope of patent application, the glue discharging part is adapted to apply a glue discharging pressure to the imprinting surface to at least partially expel the bubbles in the imprinting cavities. A glue supply device, comprising: a glue supply main body; an extension arm extending from the glue supply main body; and a glue outlet part arranged at the end of the extension arm, wherein the glue supply main body is suitable for driving the extension arm to extend Into an imprinting mold so that the glue-out portion is located on an imprinting surface of the imprinting mold, and the glue-out portion provides a first adhesive layer to the imprinting surface. The imprinting mold is suitable for The first adhesive is laminated to a wafer, wherein the wafer has a second adhesive layer, and the imprinting mold is suitable for the first adhesive Laminate to the second adhesive layer. The glue supply device according to item 13 of the scope of patent application, wherein the bottom of the glue supply main body has a plurality of rollers, and the glue supply main body is adapted to move by the rollers. The glue supply device as described in item 13 of the scope of patent application, wherein the glue supply main body is adapted to drive the extension arm up and down. As for the glue supply device described in item 13 of the scope of patent application, the glue supply body supplies glue to the glue outlet part through the extension arm. As for the glue supply device described in item 13 of the scope of patent application, the glue outlet portion has a glue outlet surface, and the center of the glue outlet surface has a glue outlet hole. An imprinting method includes: providing an imprinting mold with an imprinting surface; providing a glue supply device, including a glue supply main body and a glue discharge part; the glue supply main body drives the glue discharge part to the pressing The printing surface moves, and a first adhesive layer is provided to the imprinting surface through the adhesive ejection part; the imprinting mold presses the first adhesive layer onto a wafer; and provides a second adhesive layer on the wafer On; and the embossing mold presses the first adhesive layer onto the second adhesive layer. The imprinting method according to item 18 of the scope of patent application, wherein the bottom of the glue supply body has a plurality of rollers, and the method includes: the glue supply body is moved by the rollers. The imprinting method according to item 18 of the patent application, wherein the glue supply device includes an extension arm extending from the glue supply main body, the glue outlet portion is disposed at the end of the extension arm, and the method includes : The extension arm extends into the imprinting mold so that the glue outlet part is positioned on the imprinting surface. As described in item 20 of the scope of patent application, the imprinting method includes: the glue supply body drives the extension arm up and down. The embossing method as described in item 20 of the scope of patent application includes: the glue supply body supplies glue to the glue outlet part through the extension arm. The imprinting method according to item 18 of the scope of patent application, wherein the imprinting mold includes an upper mold and a carrying table, the carrying table is located below the upper mold, and the method includes: carrying the crystal by the carrying table round. As described in item 23 of the scope of patent application, the imprinting method includes: the glue supply main body drives the glue outlet part to move between the upper mold and the carrying platform. For the imprinting method described in item 18 of the scope of patent application, wherein the glue outlet portion has a glue outlet surface, and the center of the glue outlet surface has a glue outlet hole. The method includes: the glue outlet hole is provided by the glue The drive of the main body is located in the center of the imprinting surface. The embossing method as described in item 18 of the scope of patent application includes: the glue outlet part is driven by the glue supply body to have a gap with the embossing surface distance. The embossing method according to item 18 of the scope of patent application, wherein the embossing surface has a plurality of embossing concave holes, and the method includes: the glue outlet portion makes part of the first adhesive layer enter at least part of the embossing concave holes . The embossing method as described in item 27 of the scope of the patent application includes: the glue ejecting part applies a glue pressure on the embossing surface to at least partially expel the bubbles in the embossing cavities.

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