TWI698044B - Antenna module and manufacturing method thereof - Google Patents

Abstract

An antenna module and a manufacturing method thereof are provided. The antenna module includes a connection member including at least one wiring layer and at least one insulating layer; an integrated circuit (IC) disposed on a first surface of the connection member and electrically connected to the at least one wiring layer; and a plurality of antenna cells each disposed on a second surface of the connection member. Each of the plurality of antenna cells includes an antenna member configured to transmit or receive a radio frequency (RF) signal, a feed via having one end electrically connected to the antenna member and the other end electrically connected to a corresponding wire of the at least one wiring layer, a dielectric layer surrounding side surfaces of the feed via and having a height greater than that of the at least one insulating layer, and a plating member surrounding side surfaces of the dielectric layer.

Description

Antenna module and manufacturing method thereof

This application claims the priority of Korean Patent Application No. 10-2017-0091120 filed in the Korean Intellectual Property Office on July 18, 2017, and the Korean patent application filed in the Korean Intellectual Property Office on November 3, 2017 The priority of patent application No. 10-2017-0146113, the disclosure content of each Korean patent application is incorporated into this case for reference.

The disclosure relates to an antenna module and a manufacturing method thereof.

Recently, millimeter wave (mmWave) communications including fifth-generation (5G) communications have been actively studied, and the commercialization of antenna modules that can smoothly implement millimeter wave communications is being actively carried out. the study.

Traditionally, antenna modules that provide a millimeter-wave communication environment use a structure in which an integrated circuit (IC) and an antenna are arranged on the board, and the integrated circuit and the antenna are connected to each other by a coaxial cable, so as Frequency satisfies high-order antenna performance (for example, transmission and reception rate, gain, directivity, etc.).

However, this structure will cause a shortage of antenna layout space and antenna shape The degree of freedom of the antenna is limited, the interference between the antenna and the integrated circuit increases, and the size and cost of the antenna module increase.

The aspect of the present disclosure can provide an antenna module that can be easily miniaturized while using multiple antenna units to provide an environment that can easily ensure antenna performance to improve the transmission and reception performance of radio frequency (RF) signals. method.

According to an aspect of the present disclosure, an antenna module may include: a connecting member including at least one wiring layer and at least one insulating layer; an integrated circuit (IC) disposed on the first surface of the connecting member and electrically connected To the at least one wiring layer; and a plurality of antenna units are respectively disposed on the second surface of the connecting member. Each of the plurality of antenna units may include an antenna member, a feed via, a dielectric layer, and a plating member, the antenna member being configured to transmit or receive radio frequency (RF) Signal, one end of the feed-through hole is electrically connected to the antenna member and the other end is electrically connected to the corresponding wiring of the at least one wiring layer, the dielectric layer surrounds the side surface of the feed-through hole and Having a height greater than that of the at least one insulating layer, the plating member surrounds the side surface of the dielectric layer.

According to another aspect of the present disclosure, a method for manufacturing an antenna module may include: manufacturing a plurality of antenna elements, the plurality of antenna elements each including an antenna member, a feedthrough hole, a dielectric layer, and a plating member, the The antenna member is configured to transmit or receive radio frequency (RF) signals, one end of the feedthrough hole is electrically connected to the antenna member, and A dielectric layer surrounds the side surface of the feed-through hole, and the plated member surrounds the side surface of the dielectric layer; inserting the plurality of antenna elements into the insertion space of the insulating member, the insulating member being the A plurality of antenna units provide the insertion space; and a connecting member is formed, the connecting member including at least one wiring layer electrically connected to the other end of the feedthrough hole and at least one wiring layer having a height shorter than that of the dielectric layer An insulating layer.

10h, 10i, 10j, 10k: base

101: U-shaped base

100: antenna package

110-1, 110-2, 110-3, 110-4, 110-5, 110-6, 110-7, 110-8, 110-9, 110a, 110b, 110c, 110d, 110e, 110f, 110g, 110h, 110i, 110j, 110k, 110l, 110m, 110n, 110o, 110p: Pointer component

115a, 115b, 115c, 115d, 115e, 115f, 115i, 115k, 115l, 115m, 115n, 115o, 115p: antenna components

120a, 120b, 120c, 120d, 120f, 120g, 120j, 120k, 120l, 120m, 120n, 120o, 120p: feedthrough hole

125d, 125f, 125g, 125h, 125k, 125l, 340n, 340o, 340p: electrical connection structure

130a, 130b, 130c, 130d, 130e, 130f, 130g, 130h, 130i, 130j, 130k, 130m, 130n, 130o, 130p, 131k, 132k, 133k, 134k: Dielectric layer

140, 140m, 140n, 140o, 140p: insulating member

150, 150m, 150n, 150o, 150p: Encapsulation member

160, 160-1, 160-2, 160-3, 160-4, 160-6, 160-7, 160-8, 160-9, 160a, 160b, 160c, 160d, 160e, 160f, 160g, 160h, 160i, 160j, 160k, 160l, 160m, 160n, 160o, 160p: plated components

170m: membrane

190-1, 190-2, 190-3, 190-4, 190-5, 190-6, 190-7, 190-8, 190-9: shielded through holes

200, 2140, 2240: connecting member

210, 210m, 210n, 210o, 210p: wiring layer

220, 220m, 220n, 220o, 220p, 2141, 2241: insulating layer

230, 230m, 230n, 230o, 230p: wiring through holes

240, 240m, 240n, 240o, 240p, 2122, 2222: connection pad

250, 250m, 250n, 250o, 250p, 2150, 2250, 2223: passivation layer

300n, 300o, 300p: integrated circuit

310n, 310o, 310p: active surface

320n, 320o, 320p: non-active side

330n, 330o, 330p: metal components

350n, 350o, 350p: passive components

360n, 360o, 360p: core through hole

1000: Electronic device

1010, 2500: motherboard

1020: Chip related components

1030: Network related components

1040: other components

1050: camera module

1060: Antenna

1070: display device

1080: battery

1090: signal line

1100: smart phone

2100: Fan-out semiconductor package

2120, 2220: semiconductor wafer

2121, 2221: body

2130: Encapsulation body

2142: rewiring layer

2143, 2243: Through hole

2160, 2260: Metal under bump

2170, 2270: solder ball

2200: Fan-in semiconductor package

2242: Wiring pattern

2243h: Through hole

2251: opening

2280: Underfill resin

2290: molding material

2301, 2302: Intermediary substrate

R: radiation

Read the following detailed description in conjunction with the accompanying drawings to understand the above and other aspects, features, and other advantages of the present disclosure more clearly. In the accompanying drawings: FIG. 1 shows an antenna module according to an exemplary embodiment of the present disclosure View.

2A to 2C are views respectively showing examples of antenna units of the antenna module.

FIG. 3A is a view showing the lower surface plating member and the electrical connection structure forming the antenna unit.

Fig. 3B is a view showing an antenna member forming an antenna unit.

Fig. 3C is a view showing a feed-through hole forming an antenna unit.

3D to 3G are views showing the manufacturing process of the antenna unit of the antenna module.

4A to 4F are views showing a method of manufacturing an antenna module according to an exemplary embodiment in the present disclosure.

5 to 7 are views showing another example of the antenna module according to the exemplary embodiment in the present disclosure.

FIG. 8 is a schematic diagram showing an upper surface of an example of an antenna module according to an exemplary embodiment in the present disclosure.

FIG. 9 is a schematic diagram showing the upper surface of another example of the antenna module according to the exemplary embodiment in the present disclosure.

FIG. 10 is a schematic block diagram showing an example of an electronic device system.

FIG. 11 is a schematic perspective view showing an example of an electronic device.

12A and 12B are schematic cross-sectional views showing the state of the fan-in semiconductor package before and after being packaged.

FIG. 13 is a schematic cross-sectional view showing the packaging process of the fan-in semiconductor package.

14 is a schematic cross-sectional view showing a situation in which a fan-in type semiconductor package is mounted on an intermediate substrate and finally mounted on a main board of an electronic device.

15 is a schematic cross-sectional view showing a situation in which a fan-in type semiconductor package is embedded in an intermediate substrate and finally mounted on a main board of an electronic device.

FIG. 16 is a schematic cross-sectional view showing a fan-out type semiconductor package.

FIG. 17 is a schematic cross-sectional view showing a situation in which a fan-out type semiconductor package is mounted on a main board of an electronic device.

Hereinafter, exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings.

FIG. 1 is a view showing an antenna module according to an exemplary embodiment in the present disclosure.

1, the antenna module according to the exemplary embodiment of the present disclosure may There is a heterostructure in which the antenna package 100 and the connection member 200 are coupled to each other. That is, by using both the characteristics of easy improvement of antenna performance of the antenna package and the characteristics of easy setting of the circuit pattern or integrated circuit (IC) of the fan-out package, the antenna module can improve antenna performance (for example, transmission and The receiving rate, gain, directivity, etc.) are miniaturized at the same time.

The connection member 200 may include at least one wiring layer 210 and at least one insulating layer 220. The connection member 200 may further include a wiring via 230 connected to the at least one wiring layer 210, a connection pad 240 connected to the wiring via 230, and a passivation layer 250, and may have a copper redistribution layer (RDL) similar structure. The insulating member 140 may be provided on the upper surface of the connecting member 200.

The antenna package 100 may include a plurality of antenna units, which respectively include: antenna members 115a, 115b, 115c, and 115d, which are configured to transmit or receive radio frequency (RF) signals; feedthrough holes 120a, 120b, 120c, and 120d, wherein one end of each feed-through hole is electrically connected to each of the antenna members 115a, 115b, 115c, and 115d, and the other end of each feed-through hole is electrically connected to the corresponding wiring of at least one wiring layer 210; The electrical layers 130a, 130b, 130c, and 130d surround the side surfaces of the feed-through holes 120a, 120b, 120c, and 120d and have a thickness greater than the thickness of the at least one insulating layer 220; and the plated member 160 surrounds the dielectric layer 130a, The side surfaces of 130b, 130c, and 130d. The multiple antenna units may have a block form, but are not limited to this.

Referring to FIG. 1, each of the plurality of antenna units may be provided on the upper surface of the connection member 200. At least a part of the plurality of antenna units may be Insert into a plurality of insertion spaces provided by the insulating member 140. For example, the antenna unit may include an electrical connection structure 125d, and the electrical connection structure 125d may be electrically connected to one end of the corresponding feed-through hole 120d and the corresponding wiring of the at least one wiring layer 210 when the antenna unit is inserted. between. For example, the electrical connection structure 125d can be implemented as electrodes, pins, solder balls, pins, etc.

That is, since the plurality of antenna units can be manufactured independently with respect to the connection member 200, the plurality of antenna units can have boundary conditions (for example, small manufacturing tolerances, short electrical properties) that are beneficial to ensure radiation patterns. Length, smooth surface, large-size dielectric layer, adjustment of dielectric constant, etc.).

For example, the dielectric layers 130a, 130b, 130c, and 130d included in the plurality of antenna units may have a larger dielectric constant than the dielectric constant Dk (for example, the dissipation factor Df) of the at least one insulating layer 220 Dk may have a larger dielectric constant than that of the insulating member 140. In general, it is difficult to apply materials with high dielectric constants to the manufacturing process of antenna modules. When the dielectric layers 130a, 130b, 130c, and 130d included in the plurality of antenna units are independently manufactured, the dielectric layers may easily have a higher dielectric constant. In addition, the high dielectric constant of the dielectric layers 130a, 130b, 130c, and 130d will reduce the overall size of the antenna module and reduce the antenna performance.

For example, the dielectric layers 130a, 130b, 130c, and 130d, the insulating member 140, and the at least one insulating layer 220 may be formed of the following materials: thermosetting resin, such as epoxy resin; thermoplastic resin, such as polyimide resin; inorganic filler And/or resin in which core materials such as glass fiber (or glass cloth or glass fabric) are immersed in thermosetting resin or thermoplastic resin, such as prepreg, Ajinomoto Film (Ajinomoto Build up Film, ABF), FR-4, Bismaleimide Triazine (BT), photo imagable dielectric (PID) resin, general copper clad laminate (copper clad) laminate, CCL) or glass or ceramic insulating materials.

In the case where the dielectric constants of the dielectric layers 130a, 130b, 130c, and 130d and the dielectric constants of the insulating member 140 are implemented as different from each other, the dielectric layers 130a, 130b, 130c, and 130d may be Dk of 5 or greater than 5. The insulating member 140 and the at least one insulating layer 220 may be formed of a copper clad laminate (CCL) or a prepreg having a relatively low Dk.

In addition, by using the plated member 160, the plurality of antenna units can improve the isolation on other antenna units while having boundary conditions that are beneficial to ensure the radiation pattern. The plating member 160 can be designed more freely and efficiently by being manufactured together when the plurality of antenna units are independently manufactured.

For example, the plating member 160 may be designed to cover at least a part of the lower surface and the side surface of the antenna unit, thereby improving isolation on the connection member or the integrated circuit.

In addition, the plurality of antenna units may include: pointer members 110a, 110b, 110c, and 110d, and the pointer members 110a, 110b, 110c, and 110d are disposed in each of the antenna members 115a, 115b, 115c, and 115d The upper surfaces are spaced apart from each other in the direction, and are configured to transmit or receive radio frequency signals together with the antenna members 115a, 115b, 115c, and 115d. The plurality of antenna units can easily provide a layout space for the pointer members 110a, 110b, 110c, and 110d.

For example, the gain or bandwidth of the antenna module can be larger as the number of the pointer members 110a, 110b, 110c, and 110d increases, but due to each of the dielectric layers 130a, 130b, 130c, and 130d The height of φ will increase as the number of the pointer members 110a, 110b, 110c, and 110d increases, so the implementation difficulty of the dielectric layers 130a, 130b, 130c, and 130d will increase. However, since the plurality of antenna units can be manufactured independently with respect to the connection member 200, the plurality of antenna units can be easily implemented as dielectric layers 130a, 130b, 130c, and 130d that are higher in height than the insulating member 140. , And can easily include the pointer members 110a, 110b, 110c, and 110d.

Depending on the design, since the multiple antenna units can be manufactured independently of each other, the multiple antenna units can be designed to have different characteristics. For example, each of the plurality of antenna units may include dielectric layers formed of different materials to have different dielectric constants. Here, the antenna unit with a relatively high dielectric constant may be disposed near the center of the antenna module, and the antenna unit with relatively high durability may be disposed near the edge of the antenna module.

After the plurality of antenna units are disposed on the upper surface of the connection member 200, an encapsulation member 150 may be disposed on the plurality of antenna units. When the encapsulation member 150 is applied in a liquid state, the encapsulation member 150 may penetrate between the plurality of antenna elements, or may penetrate between the plurality of antenna elements and the insulating member 140. After the encapsulation member 150 penetrates, the encapsulation member 150 may be cured into a solid state. Therefore, although the plurality of antenna units are inserted, the encapsulating member 150 can improve the structural stability of the antenna module. Meanwhile, the encapsulation member 150 may be formed of a photo imageable encapsulant (PIE), Ajinomoto constitution film (ABF), etc., but is not limited to this.

2A to 2C are views respectively showing examples of antenna units of the antenna module.

2A, the antenna unit may include at least part of a director member 110e, an antenna member 115e, a feed-through hole, an electrical connection structure, a dielectric layer 130e, and a plating member 160e. Here, the plating member 160e may be provided to surround only the side surface of the antenna unit. That is, the lower surface of the antenna unit may be covered by the ground pattern provided on the upper surface of the connection member.

2B, the antenna unit may include at least part of a director member 110f, an antenna member 115f, a feed-through hole 120f, an electrical connection structure 125f, a dielectric layer 130f, and a plating member 160f. Here, the plating member 160f may be provided to cover only a part of the lower surface of the antenna unit. That is, the side surface of the antenna unit may not be surrounded by the plating member on the side surface of the insulating member provided on the connection member.

2C, the antenna unit may include at least part of a director member 110g, a feed-through hole 120g, an electrical connection structure 125g, and a dielectric layer 130g. That is, the side surface of the antenna unit may not be surrounded by the plating member provided on the side surface of the insulating member on the connection member, and the lower surface of the antenna unit may be covered by the ground pattern provided on the upper surface of the connection member.

Meanwhile, the shape of each of the antenna members 115e, 115f and the pointer member 110g may be a polygonal shape or a circular shape, but is not limited to this.

3A is a view showing the lower surface plating member and the electrical connection structure forming the antenna unit, and FIG. 3B is a view showing the antenna member forming the antenna unit, and Fig. 3C is a view showing a feed-through hole forming an antenna unit.

Referring to FIG. 3A, a dielectric layer 130h, an electrical connection structure 125h, and a plating member 160h may be disposed on the substrate 10h. For example, the electrical connection structure 125h and the plated member 160h may be formed according to a negative or positive printing method, and may include metal materials (for example, copper (Cu), aluminum (Al)) , Silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti) or its alloys and other conductive materials).

3B, a dielectric layer 130i and an antenna member 115i may be provided on the substrate 10i. For example, the antenna member 115i may be formed according to a negative type or a positive type printing method. The pointer member can also be formed in the same manner as the antenna member 115i.

Referring to FIG. 3C, a dielectric layer 130j and a feed-through hole 120j may be provided on the substrate 10j. For example, the feed-through hole 120j may be formed according to a negative type or a positive type printing method, and may be repeatedly stacked.

At the same time, the antenna member 115i, the feedthrough hole 120j, the electrical connection structure 125h, and the plating member 160h can be formed by, for example, chemical vapor deposition (CVD), physical vapor deposition (PVD), or sputtering. Plating, subtractive process, additive process, semi-additive process (semi-additive process, SAP), modified semi-additive process (modified semi-additive process, MSAP) and other plating methods, but not limited to this .

3D to 3G are views showing the manufacturing process of the antenna unit of the antenna module.

3D, may be provided on the substrate 10k, including a dielectric layer 131k, electrical The first layer of the sexual connection structure 125k and the plated member 160k, and a second layer including the feed-through hole 120k and the dielectric layer 132k may be provided on the first layer.

3E, the third layer to the nth layer including the feedthrough hole and the dielectric layer 133k may be repeatedly stacked, and the (n+1)th layer including the antenna member 115k and the dielectric layer 134k may be disposed on the nth layer. )Floor.

Referring to FIG. 3F, the (n+2)th layer including the pointer member 110k may be provided on the (n+1)th layer. All the dielectric layers included in the first layer to the (n+2)th layer may be integrated into a single dielectric layer 130k.

Referring to FIG. 3G, the part where the pointer member 110 l , the part of the antenna member 115 l , the part of the feed through hole 120 l , the part of the electrical connection structure 125 l and the part of the plated member 160 l are formed can be used unit is inserted into the U-shaped base 10 l, and then the other portions may be formed of a plating member 160 l. Antenna unit may be rotated in a state of re-inserted in the U-shaped base 10 l, and then forming a plating member 160 l of the remaining portion. At the same time, the U-shaped base 101 can be a clamp, but it is not limited to this.

4A to 4F are views showing a method of manufacturing an antenna module according to an exemplary embodiment in the present disclosure.

4A, a part of the insulating member 140m may be etched to provide an insertion space into which the plurality of antenna units are inserted, and a film 170m may be provided under the insulating member 140m.

4B, the antenna unit including the director member 110m, the antenna member 115m, the feed-through hole 120m, the dielectric layer 130m, and the plating member 160m may be inserted into the insertion space of the insulating member 140m.

Referring to FIG. 4C, an encapsulating member 150m may be provided on the antenna unit and the insulating member 140m. The encapsulating member 150m may penetrate between the antenna unit and the insulating member 140m.

Referring to FIG. 4D, the film 170m may be removed after the encapsulating member 150m is cured.

Referring to FIG. 4E, a connection member including at least one wiring layer 210m, at least one insulating layer 220m, and wiring via 230m may be formed under the antenna unit. For example, after at least one wiring layer 210m is formed to correspond to the layout position of the antenna unit, the connection member may be attached to the lower end of the antenna unit.

4F, the connection pad 240m may be connected to the wiring through hole 230m, and the passivation layer 250m may cover the lower end of the connection member.

5 to 7 are views showing another example of the antenna module according to the exemplary embodiment in the present disclosure.

5, an antenna unit including a director member 110n, an antenna member 115n, a feed-through hole 120n, and a dielectric layer 130n, and an insulating member 140n may be provided at least one wiring layer 210n, at least one insulating layer 220n, and wiring vias 230n. , The connection pad 240n and the passivation layer 250n on the upper surface of the connection member. The encapsulating member 150n may be disposed on the antenna unit and the insulating member 140n. The encapsulating member 150n may penetrate between the antenna unit and the insulating member 140n.

The radio frequency signal can be transmitted to the antenna unit through at least one wiring layer 210n, and can be transmitted in the direction of the upper surface of the antenna module, and the radio frequency signal received by the antenna unit can be transmitted to the integrated circuit through at least one wiring layer 210n 300n.

The integrated circuit 300n may include an active surface 310n and an inactive surface 320n. product The body circuit 300n can be electrically connected to the connection pad 240n through the active surface 310n, and can be disposed on the lower surface of the connection member. That is, since the integrated circuit 300n can be arranged to face upward, the electrical distance to the antenna member 115n can be shortened, and the transmission loss of the radio frequency signal can be reduced.

The inactive surface 320n of the integrated circuit 300n may be connected to the metal member 330n. The metal member 330n can radiate heat generated from the integrated circuit 300n or provide a ground for the integrated circuit 300n.

The passive component 350n can be electrically connected to the connection pad 240n and can be disposed on the lower surface of the connection member, and can provide impedance for the integrated circuit 300n or the antenna unit. For example, the passive component 350n may include at least a part of a multilayer ceramic capacitor (MLCC), an inductor, or a chip resistor.

One end of the core through hole 360n may be electrically connected to the connection pad 240n and may be disposed on the lower surface of the connecting member, and the other end of the core through hole 360n may be connected to the electrical connection structure 340n.

For example, the core via 360n can receive basic signals (for example, power, low-frequency signals, etc.) from the electrical connection structure 340n, and can provide the basic signals to the integrated circuit 300n. The integrated circuit 300n can generate a millimeter wave (mmWave) radio frequency signal by performing frequency conversion, amplifying, and filtering phase control by using a basic signal, and can transmit the radio frequency signal to the antenna unit. For example, the frequency of the radio frequency signal may be 28 gigahertz (GHz) and/or 36 gigahertz, but it is not limited to this, and may vary according to the communication scheme of the antenna module.

At the same time, the integrated circuit 300n and the passive component 350n can be encapsulated by the encapsulant.

6, an antenna unit including a director member 110o, an antenna member 115o, a feed-through hole 120o, and a dielectric layer 130o, and an insulating member 140o may be provided at least one wiring layer 210o, at least one insulating layer 220o, and wiring vias 230o. , The connection pad 240o and the passivation layer 250o on the upper surface of the connection member. The encapsulating member 150o may be disposed on the antenna unit and the insulating member 140o. The encapsulating member 150o may penetrate between the antenna unit and the insulating member 140o.

The integrated circuit 300o including the active surface 310o and the inactive surface 320o can be electrically connected to the connection pad 240o, and can be disposed on the lower surface of the connection member. The inactive surface 320o may be connected to the metal member 330o.

The integrated circuit 300o may be formed of a compound semiconductor (for example, GaAs) in consideration of high frequency characteristics, or may be formed of a silicon semiconductor.

The integrated circuit 300o can be enclosed by an encapsulating body. The encapsulant can protect the integrated circuit 300o from external electrical/physical/chemical influences, and can be composed of a photosensitive imaging encapsulant (PIE), Ajinomoto film (ABF), epoxy molding compound, EMC), but not limited to this.

The electrical connection structure 340o may be disposed on the lower surface of the encapsulation body.

The passive component 350o can be connected to the electrical connection structure 340o.

One end and the other end of the core via 360o can be respectively connected to the core wiring layer, and the core wiring layer can be respectively connected to the connection pad 240o or the electrical connection structure 340o, and extends laterally to also be connected to another core via 360o .

Referring to FIG. 7, an antenna unit including a pointer member 110p, an antenna member 115p, a feed-through hole 120p, and a dielectric layer 130p, and an insulating member 140p may be disposed in the package On the upper surface of the connection member including at least one wiring layer 210p, at least one insulating layer 220p, wiring via 230p, connection pad 240p, and passivation layer 250p. The encapsulating member 150p may be disposed on the antenna unit and the insulating member 140p. The encapsulating member 150p may penetrate between the antenna unit and the insulating member 140p.

The integrated circuit 300p including the active surface 310p and the inactive surface 320p can be electrically connected to the connection pad 240p, and can be disposed on the lower surface of the connection member. The inactive surface 320p may be connected to the metal member 330p.

The integrated circuit 300p may be encapsulated by the encapsulation body and the electrical connection structure 340p may be disposed on the lower surface of the encapsulation body. The electrical connection structure 340p can be connected to the core via 360p.

Since the antenna unit is independently manufactured and then disposed on the upper surface of the connecting member, the insulating member 140p can be machined more freely and can include an accommodation space.

The passive component 350p may be disposed in the accommodating space of the insulating member 140p. Therefore, the size of the lower surface of the connecting member in the antenna module can be reduced, and the impedance provided by the passive component 350p to the antenna member 115p can be more accurately matched.

At the same time, a second antenna member (not shown in the figure) configured to transmit or receive a second radio frequency signal in the direction of the side surface of the antenna module may also be disposed in the accommodating space of the insulating member 140p. The second antenna member can be implemented as a dipole antenna or a monopole antenna.

At the same time, the components (integrated circuit, encapsulation, passive components, core vias, etc.) and fan-out semiconductors arranged on the lower surface of the connecting member shown in FIGS. 5 to 7 The bulk package can also be independently manufactured, and then can be joined to the connecting member, and can be manufactured together with the connecting member according to the design without a joining process.

FIG. 8 is a schematic diagram showing an upper surface of an example of an antenna module according to an exemplary embodiment in the present disclosure.

Referring to FIG. 8, a plurality of directional members 110a, 110b, 110c, 110d, 110e, 110f, 110g, 110h, 110i, 110j, 110k, 110 l, 110m, 110n, 110o and 110p each block may have a in the form of an antenna, and may be a plurality of plated members 160a, 160b, 160c, 160d, 160e, 160f, 160g, 160h, 160i, 160j, 160k, 160 l, 160m, 160n, 160o and 160p corresponding plating Component surround. If the antenna module does not include a pointer member, the plurality of pointer members 110a, 110b, 110c, 110d, 110e, 110f, 110g, 110h, 110i, 110j, 110k, 110 l , 110m, 110n, 110o and 110p Can be replaced with multiple antenna members.

FIG. 9 is a schematic diagram showing the upper surface of another example of the antenna module according to the exemplary embodiment in the present disclosure.

Referring to Figure 9, each of the plurality of pointer members 110-1, 110-2, 110-3, 110-4, 110-5, 110-6, 110-7, 110-8, and 110-9 may Corresponding plated members 160-1, 160-2, 160-3, 160-4, 160-6, 160-7, 160-8 and 160-9 and multiple shielding through holes 190-1, 190-2 , 190-3, 190-4, 190-5, 190-6, 190-7, 190-8, and 190-9 surround at least one. If the antenna module does not include a pointer member, the plurality of pointer members 110-1, 110-2, 110-3, 110-4, 110-5, 110-6, 110-7, 110-8 and 110-9 can be replaced with multiple antenna members.

That is, the multiple antenna units provided on the connecting member of the antenna module A part of the side surface of the element may be surrounded by the plurality of shielding through holes instead of the plating member.

Meanwhile, the number, layout and shape of the plurality of pointer members or the plurality of antenna members shown in FIGS. 8 and 9 are not particularly limited. For example, the shape of the plurality of pointer members shown in FIG. 8 may be rectangular, and the number of the plurality of pointer members shown in FIG. 9 may be nine.

At the same time, the lower end of the connecting member (corresponding to the integrated circuit, the encapsulation body, the passive component and the core through hole) disclosed in this specification can be implemented according to a fan-out semiconductor package. In order to facilitate the understanding of the fan-out semiconductor package, it will be described with reference to FIGS. 10 to 17.

FIG. 10 is a schematic block diagram showing an example of an electronic device system.

Referring to FIG. 10, a motherboard 1010 can be accommodated in the electronic device 1000. The motherboard 1010 may include chip-related components 1020, network-related components 1030, other components 1040, etc., which are physically or electrically connected to the motherboard 1010. These components can be connected to other components described below to form various signal lines 1090.

Chip related components 1020 may include: memory chips, such as volatile memory (for example, dynamic random access memory (DRAM)), non-volatile memory (for example, read only memory) memory, ROM)), flash memory, etc.; application processor chips, such as central processing units (for example, central processing unit (CPU)), graphics processors (for example, graphics processing unit, GPU)), digital signal processors, cryptographic processors, microprocessors, microcontrollers, etc.; and logic chips, such as analog-to-digital converters (analog-to- digital converter, ADC), application-specific integrated circuit (ASIC), etc. However, the chip-related components 1020 are not limited to this, but can also include other types of chip-related components. In addition, the wafer related components 1020 may be combined with each other.

The network-related components 1030 may include, for example, the following protocols: wireless fidelity (Wi-Fi) (Institute of Electrical And Electronics Engineers (IEEE) 802.11 family, etc.), worldwide interoperable microwave access (worldwide) interoperability for microwave access, WiMAX (IEEE 802.16 family, etc.), IEEE 802.20, long term evolution (long term evolution, LTE), only support for data evolution (evolution data only, Ev-DO), high speed packet access + (high speed) packet access +, HSPA+), high speed downlink packet access + (high speed downlink packet access +, HSDPA+), high speed uplink packet access + (high speed uplink packet access +, HSUPA+), enhanced data GSM environment (enhanced data GSM) environment, EDGE), global system for mobile communications (GSM), global positioning system (GPS), general packet radio service (GPRS), code division multiple access (code division multiple access (CDMA), time division multiple access (TDMA), digital enhanced cordless telecommunications (DECT), Bluetooth, 3G protocol, 4G protocol and 5G protocol and subsequent to the above Any other wireless and wired protocols specified. However, the network-related components 1030 are not limited to this. Instead, a variety of other wireless standards or protocols or wired standards or protocols can also be included. In addition, the network-related components 1030 and the aforementioned chip-related components 1020 can be combined with each other.

Other components 1040 may include high frequency inductors, ferrite inductors, power inductors, ferrite beads, low temperature co-fired ceramics (LTCC), electromagnetic interference (electromagnetic interference) , EMI) filter, multilayer ceramic capacitor (multilayer ceramic capacitor, MLCC) and so on. However, other components 1040 are not limited to this, but may also include passive components for various other purposes. In addition, other components 1040 can be combined with the aforementioned chip-related components 1020 or network-related components 1030.

Depending on the type of the electronic device 1000, the electronic device 1000 may include other components that can be physically connected or electrically connected to the main board 1010, or may be intangibly connected or not electrically connected to the main board 1010. These other components may include, for example, camera module 1050, antenna 1060, display device 1070, battery 1080, audio codec (not shown in the figure), video codec (not shown in the figure), power amplifier (not shown in the figure) Not shown), compass (not shown in the figure), accelerometer (not shown in the figure), gyroscope (not shown in the figure), speaker (not shown in the figure), mass storage unit (for example, Hard disk drive (not shown in the figure), compact disk (CD) drive (not shown in the figure), digital versatile disk (DVD) drive (not shown in the figure) Wait. However, these other components are not limited to this, but depending on the type of the electronic device 1000, etc., other components used for various purposes may also be included.

The electronic device 1000 can be a smart phone, a personal digital assistant (personal digital assistant) digital assistant, PDA), digital camera, digital still camera, network system, computer, monitor, tablet PC, laptop PC, netbook PC ), TVs, video game machines, smart watches, car components, etc. However, the electronic device 1000 is not limited to this, but can also be any other electronic device that processes data.

FIG. 11 is a schematic perspective view showing an example of an electronic device.

11, the electronic device may be, for example, a smart phone 1100. In the smart phone 1100, a radio frequency integrated circuit (RFIC) can be used in the form of a semiconductor package, and an antenna can be used in the form of a substrate or a module. The radio frequency integrated circuit and the antenna can be electrically connected to each other in the smart phone 1100, and thus the radiation R of the antenna signal in various directions can be achieved. Semiconductor packages including radio frequency integrated circuits and substrates or modules including antennas can be used in various forms in electronic devices such as smart phones.

Generally speaking, many fine circuits are integrated in a semiconductor chip. However, the semiconductor wafer itself cannot be used as a finished semiconductor product, and may be damaged due to external physical or chemical shocks. Therefore, the semiconductor chip may not be used alone, but will be packaged in a packaged state and used in electronic devices and the like.

Here, since there is a circuit width difference in electrical connection between the semiconductor chip and the motherboard of the electronic device, semiconductor packaging is required. In detail, the size of the connection pads of the semiconductor chip and the spacing between the connection pads of the semiconductor chip are very fine, but the components of the motherboard used in the electronic device are very fine. The size of the mounting pads and the spacing between the component mounting pads of the motherboard are significantly larger than the size of the connecting pads of the semiconductor chip and the spacing between the connecting pads. Therefore, it may be difficult to directly mount the semiconductor chip on the main board, and a packaging technology for buffering the difference in circuit width between the semiconductor chip and the main board is required.

Depending on the structure and purpose of the semiconductor package, semiconductor packages manufactured by packaging technology can be divided into fan-in semiconductor packages or fan-out semiconductor packages.

Hereinafter, the fan-in semiconductor package and the fan-out semiconductor package will be described in more detail with reference to the drawings.

12A and 12B are schematic cross-sectional views showing the state of the fan-in semiconductor package before and after being packaged.

FIG. 13 is a schematic cross-sectional view showing the packaging process of the fan-in semiconductor package.

12A, 12B and FIG. 13, the semiconductor chip 2220 may be, for example, an integrated circuit (IC) in a bare state. The semiconductor chip 2220 includes a body 2221 including silicon (Si), germanium (Ge), Gallium arsenide (GaAs), etc.; connection pads 2222 formed on one surface of the body 2221 and containing conductive materials such as aluminum (Al); and passivation layers 2223 such as oxide films and nitride films formed on the body 2221 On one surface and covering at least part of the connection pad 2222. In this case, since the connection pad 2222 is significantly small, it is difficult to mount the integrated circuit (IC) on the printed circuit board (PCB) of the middle level and the motherboard of the electronic device.

Therefore, the connecting member 2240 can be shaped depending on the size of the semiconductor chip 2220. It is formed on the semiconductor wafer 2220 to rewire the connection pads 2222. The connecting member 2240 can be formed by the following steps: forming an insulating layer 2241 on the semiconductor wafer 2220 using an insulating material such as a photosensitive imaging dielectric (PID) resin; forming a through hole 2243h that opens the connecting pad 2222; and then forming wiring Pattern 2242 and through hole 2243. Next, a passivation layer 2250 for protecting the connection member 2240 may be formed, an opening 2251 may be formed, and an under-bump metal layer 2260 may be formed. That is, a fan-in semiconductor package 2200 including, for example, a semiconductor chip 2220, a connection member 2240, a passivation layer 2250, and an under bump metal layer 2260 can be manufactured through a series of manufacturing processes.

As described above, the fan-in semiconductor package may have a package form in which all the connection pads of the semiconductor chip (for example, input/output (I/O) terminals, etc.) are provided inside the semiconductor chip, and may have excellent It has electrical characteristics and can be produced at low cost. Therefore, many components installed in smart phones have been manufactured in the form of fan-in semiconductor packages. In detail, many components installed in smart phones have been developed to implement fast signal transfer while having a compact size.

However, since all input/output terminals need to be provided in the semiconductor chip in the fan-in semiconductor package, the fan-in semiconductor package has a large space limitation. Therefore, it is difficult to apply this structure to a semiconductor wafer having a large number of input/output terminals or a semiconductor wafer having a compact size. In addition, due to the above shortcomings, the fan-in semiconductor package may not be directly mounted and used on the motherboard of the electronic device. The reason is that even in the case where the size of the input/output terminals of the semiconductor chip and the interval between the input/output terminals of the semiconductor chip are increased by the rewiring process, the size of the input/output terminals of the semiconductor chip and the semiconductor chip Input/output of the chip The spacing between the terminals may still be insufficient to directly mount the fan-in semiconductor package on the motherboard of the electronic device.

14 is a schematic cross-sectional view showing a situation in which a fan-in type semiconductor package is mounted on an intermediate substrate and finally mounted on a main board of an electronic device.

15 is a schematic cross-sectional view showing a situation in which a fan-in type semiconductor package is embedded in an intermediate substrate and finally mounted on a main board of an electronic device.

14 and 15, in the fan-in semiconductor package 2200, the connection pads 2222 (ie, input/output terminals) of the semiconductor chip 2220 can be rewired via the interposer substrate 2301, and the fan-in semiconductor package 2200 can The in-type semiconductor package 2200 is finally mounted on the motherboard 2500 of the electronic device in the state where the semiconductor package 2200 is mounted on the intermediate substrate 2301. In this case, the solder balls 2270 and the like can be fixed by the underfill resin 2280 and the like, and the outside of the semiconductor chip 2220 can be covered with the molding material 2290 and the like. Alternatively, the fan-in semiconductor package 2200 can be embedded in a separate intermediate substrate 2302, and the connection pads 2222 (ie, input/output terminals) of the semiconductor chip 2220 can be embedded in the intermediate semiconductor package 2200. In the state of the substrate 2302, rewiring is performed by the intermediate substrate 2302, and the fan-in semiconductor package 2200 can be finally mounted on the motherboard 2500 of the electronic device.

As described above, it may be difficult to directly mount and use a fan-in type semiconductor package on the motherboard of an electronic device. Therefore, the fan-in semiconductor package can be mounted on a separate intermediate substrate and then mounted on the main board of the electronic device by the packaging process, or can be installed in the electronic device in a state in which the fan-in semiconductor package is embedded in the intermediate substrate. Install and use on the motherboard.

FIG. 16 is a schematic cross-sectional view showing a fan-out type semiconductor package.

16, in the fan-out semiconductor package 2100, for example, the outer side of the semiconductor chip 2120 can be protected by the encapsulation body 2130, and the connection pad 2122 of the semiconductor chip 2120 can be directed toward the semiconductor chip by the connection member 2140 Rewiring outside 2120. In this case, a passivation layer 2150 may be further formed on the connection member 2140, and an under-bump metal layer 2160 may be further formed in the opening of the passivation layer 2150. Solder balls 2170 may be further formed on the under-bump metal layer 2160. The semiconductor wafer 2120 may be an integrated circuit (IC) including a body 2121, a connection pad 2122, a passivation layer (not shown in the figure), and the like. The connection member 2140 may include an insulating layer 2141, a redistribution layer 2142 formed on the insulating layer 2141, and a via 2143 that electrically connects the connection pad 2122 and the redistribution layer 2142 to each other.

As described above, the fan-out type semiconductor package may have a form in which the input/output terminals of the semiconductor chip are rewired and arranged toward the outside of the semiconductor chip by the connecting member formed on the semiconductor chip. As described above, in a fan-in semiconductor package, all input/output terminals of the semiconductor chip need to be provided in the semiconductor chip. Therefore, when the size of the semiconductor wafer is reduced, it is necessary to reduce the size of the balls and the pitch between the balls, which may make it impossible to use a standardized ball layout in a fan-in semiconductor package. On the other hand, the fan-out type semiconductor package has a form in which the input/output terminals of the semiconductor chip are rewired and arranged toward the outside of the semiconductor chip by the connecting members formed on the semiconductor chip as described above. Therefore, even in the case that the size of the semiconductor wafer is reduced, the standardized ball layout can still be used in the fan-out semiconductor package, thereby making the fan-out semi- The conductor package can be mounted on the main board of the electronic device without using a separate intermediate substrate, as explained below.

FIG. 17 is a schematic cross-sectional view showing a situation in which a fan-out type semiconductor package is mounted on a main board of an electronic device.

Referring to FIG. 17, the fan-out semiconductor package 2100 can be mounted on the motherboard 2500 of the electronic device by solder balls 2170 and the like. That is, as described above, the fan-out semiconductor package 2100 includes a connection member 2140 formed on the semiconductor wafer 2120 and capable of rewiring the connection pad 2122 to a fan-out area outside the size of the semiconductor wafer 2120, and thereby This makes it possible to use a standardized ball layout in the fan-out semiconductor package 2100. Therefore, the fan-out semiconductor package 2100 can be mounted on the main board 2500 of the electronic device without using a separate interposer substrate or the like.

As described above, since the fan-out semiconductor package can be mounted on the motherboard of an electronic device without using a separate interposer substrate, the fan-out semiconductor package can be implemented as a fan with a larger interposer substrate. The thickness of the in-type semiconductor package is small. Therefore, the fan-out semiconductor package can be miniaturized and thinned. In addition, the fan-out semiconductor package has excellent thermal and electrical characteristics, which makes the fan-out semiconductor package particularly suitable for mobile products. Therefore, the fan-out semiconductor package can be implemented in a more compact form than the general package-on-package (POP) form using a printed circuit board (PCB), and can solve the problem of warping. Problems caused by warpage phenomenon.

Meanwhile, the fan-out semiconductor package refers to the above-mentioned semiconductor chip mounting on the motherboard of an electronic device and the like and protecting the semiconductor chip from external influences. Packaging technology, and the fan-out semiconductor package is a concept different from the concept of a printed circuit board (PCB) such as an interposer substrate. The printed circuit board has a different specification and purpose from the fan-out semiconductor package. Specifications, purpose, etc., and a fan-in semiconductor package is embedded in the printed circuit board.

As described above, according to the exemplary embodiments of the present disclosure, the antenna module can be easily miniaturized while using the plurality of antenna units to provide an environment that can easily ensure antenna performance to improve the transmission and reception performance of radio frequency signals.

Although exemplary embodiments have been shown and described above, it will be obvious to those skilled in the art that, without departing from the scope of the present invention defined by the scope of the appended patent application, Modifications and modifications.

100: antenna package

110a, 110b, 110c, 110d: Pointer components

115a, 115b, 115c, 115d: antenna components

120a, 120b, 120c, 120d: feedthrough hole

125d: electrical connection structure

130a, 130b, 130c, 130d: dielectric layer

140: Insulating member

150: Encapsulation member

160: plated components

200: connecting member

210: Wiring layer

220: insulating layer

230: Wiring through hole

240: connection pad

250: passivation layer

Claims (20)

An antenna module includes: a connecting member, including at least one wiring layer and at least one insulating layer; an integrated circuit (IC), arranged on the first surface of the connecting member and electrically connected to the at least one wiring layer And a plurality of antenna units are respectively disposed on the second surface of the connecting member, wherein each of the plurality of antenna units includes an antenna member, a feed-through hole, a dielectric layer and a plating member, the The antenna member is configured to transmit or receive radio frequency (RF) signals. One end of the feed-through hole is electrically connected to the antenna member and the other end is electrically connected to the corresponding wiring of the at least one wiring layer. The electric layer surrounds the side surface of the feed-through hole and has a height greater than the height of the at least one insulating layer, and the plating member surrounds the side surface of the dielectric layer. The antenna module according to claim 1, wherein each of the plurality of antenna units further includes an electrical connection structure, and the electrical connection structure is electrically connected to all of the feedthrough holes Between the other end and the corresponding wiring of the at least one wiring layer. The antenna module according to claim 1, wherein the plated member extends from the second surface of the connecting member toward the feed-through hole. The antenna module according to the first item of the scope of patent application further includes: an insulating member disposed on the second surface of the connecting member and surrounding the side surface of each of the plurality of antenna units; And an encapsulating member is arranged on the plurality of antenna units and the insulating member. The antenna module according to claim 4, wherein the dielectric layer has a height greater than that of the insulating member. The antenna module according to claim 4, wherein the dielectric layer has a dielectric constant different from that of the insulating member. The antenna module according to claim 1, wherein the dielectric layer has a dielectric constant different from that of the at least one insulating layer. The antenna module according to claim 1, wherein the dielectric constant of the dielectric layer included in a part of the plurality of antenna elements is the same as that included in other parts of the plurality of antenna elements The dielectric constants of the dielectric layers are different from each other. The antenna module according to the first item of the scope of patent application further includes: an insulating member arranged on the second surface of the connecting member and providing an accommodation space; and a passive component arranged in the accommodation space The corresponding wiring in the middle and electrically connected to the at least one wiring layer. The antenna module described in item 1 of the scope of patent application further includes a core through hole which is provided on the first surface of the connecting member and is electrically connected to the at least one wiring layer In the corresponding wiring, the integrated circuit receives a basic signal from the core via and generates the radio frequency signal in the millimeter wave (mmWave) band based on the basic signal. The antenna module according to claim 1, wherein each of the plurality of antenna units further includes a pointer member, and the pointer member is arranged to view the antenna from the antenna member. The direction of the feedthrough hole is opposite to the other This space is separated and configured to transmit or receive the radio frequency signal together with the antenna member, and the dielectric layer further surrounds the side surface of the antenna member and the side surface of the pointer member. A method of manufacturing an antenna module includes: manufacturing a plurality of antenna units, the plurality of antenna units respectively comprising an antenna member, a feed-through hole, a dielectric layer and a plating member, the antenna member is configured to transmit or receive radio frequency (RF) signal, one end of the feedthrough hole is electrically connected to the antenna member, the dielectric layer surrounds the side surface of the feedthrough hole, and the plated member surrounds the side surface of the dielectric layer Inserting the plurality of antenna units into the insertion space provided by the insulating member, respectively; and forming a connecting member, the connecting member includes at least one wiring layer electrically connected to the other end of the feedthrough hole and the height At least one insulating layer with a short height of the dielectric layer. The manufacturing method of the antenna module as described in the scope of patent application, further includes: before inserting the plurality of antenna units into the insertion space, providing a film under the insulating member; After the antenna units are inserted into the insertion space, an encapsulating member is provided on the plurality of antenna units and the insulating member; and before the encapsulating member is provided and the connecting member is formed, the film is removed . An antenna module includes: a connecting member including a wiring layer and an insulating layer; an insulating member arranged on a first surface of the connecting member and including a plurality of accommodating spaces; a plurality of antenna units are respectively arranged on the insulating layer The accommodating space of the component; an encapsulating member that encapsulates the portion of the connecting member and the portion of the plurality of antenna units, and fills the remaining portion of the accommodation space that is not occupied by the plurality of antenna units Part; and an integrated circuit (IC) disposed on a second surface of the connecting member opposite to the first surface and electrically connected to the wiring layer. The antenna module according to claim 14, wherein each of the plurality of antenna units includes an antenna member, a feedthrough hole, a dielectric layer, and a plating member, the antenna member is configured to transmit Or to receive radio frequency (RF) signals, one end of the feed-through hole is electrically connected to the antenna member and the other end is electrically connected to the corresponding wiring of the wiring layer, and the dielectric layer surrounds the feed-through hole The side surface of the dielectric layer has a height greater than that of the insulating layer, and the plated member surrounds the side surface of the dielectric layer. The antenna module according to claim 15, wherein the dielectric layer has a height greater than that of the insulating member. The antenna module according to claim 15, wherein the dielectric layer has a higher dielectric constant than that of the insulating member. The antenna module described in item 15 of the scope of patent application, wherein the medium The electric layer has a higher dielectric constant than the dielectric constant of the insulating layer. The antenna module according to claim 15, wherein the dielectric layers of two antenna units of the plurality of antenna units have dielectric constants different from each other. The antenna module as described in item 14 of the scope of patent application further includes a passive component which is arranged in another accommodating space of the insulating member and is electrically connected to the wiring layer, wherein the package The sealing member covers the passive component and fills the remaining part of the other accommodation space that is not occupied by the passive component.

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