[go: up one dir, main page]

TWI697620B - Cryopump - Google Patents

Cryopump Download PDF

Info

Publication number
TWI697620B
TWI697620B TW108105745A TW108105745A TWI697620B TW I697620 B TWI697620 B TW I697620B TW 108105745 A TW108105745 A TW 108105745A TW 108105745 A TW108105745 A TW 108105745A TW I697620 B TWI697620 B TW I697620B
Authority
TW
Taiwan
Prior art keywords
cryopump
compressor
gas
flushing gas
heat exchanger
Prior art date
Application number
TW108105745A
Other languages
Chinese (zh)
Other versions
TW201937060A (en
Inventor
中村正寿
Original Assignee
日商住友重機械工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商住友重機械工業股份有限公司 filed Critical 日商住友重機械工業股份有限公司
Publication of TW201937060A publication Critical patent/TW201937060A/en
Application granted granted Critical
Publication of TWI697620B publication Critical patent/TWI697620B/en

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04BPOSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B37/00Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00
    • F04B37/06Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for evacuating by thermal means
    • F04B37/08Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for evacuating by thermal means by condensing or freezing, e.g. cryogenic pumps
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04BPOSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B37/00Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00
    • F04B37/10Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for special use
    • F04B37/14Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for special use to obtain high vacuum
    • F04B37/16Means for nullifying unswept space

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Compressors, Vaccum Pumps And Other Relevant Systems (AREA)

Abstract

本發明提供一種低溫泵,其課題在於縮短低溫泵的再生時間。本發明的低溫泵(10)具備:低溫泵殼體(16);極低溫冷凍機(14),其具備:膨脹機(18),安裝於低溫泵殼體(16);及壓縮機(20),從膨脹機(18)回收並壓縮工作氣體,並將被壓縮之工作氣體供給至膨脹機(18);沖洗氣體管路(22),將沖洗氣體供給至低溫泵殼體(16);及第1熱交換器(26),以利用壓縮機(20)的排熱而加熱沖洗氣體之方式設置於沖洗氣體管路(22)。The present invention provides a cryopump whose problem is to shorten the regeneration time of the cryopump. The cryopump (10) of the present invention includes: a cryopump housing (16); an extremely low temperature refrigerator (14), which includes: an expander (18), which is installed in the cryopump housing (16); ), recover and compress the working gas from the expander (18), and supply the compressed working gas to the expander (18); flush the gas pipeline (22), supply the flushing gas to the cryopump housing (16); And the first heat exchanger (26) is arranged in the flushing gas pipeline (22) to heat the flushing gas by using the exhaust heat of the compressor (20).

Description

低溫泵Cryopump

本發明係有關一種低溫泵。The present invention relates to a cryopump.

低溫泵為藉由冷凝或吸附在被冷卻成極低溫之低溫板捕捉氣體分子以進行排氣之真空泵。低溫泵通常為實現半導體電路製程等所要求之潔淨的真空環境而使用。低溫泵為所謂氣體捕集式真空泵,需要進行將捕捉之氣體向外部定期排出之再生。 (先前技術文獻) (專利文獻) 專利文獻1:日本專利第5669658號公報The cryopump is a vacuum pump that captures gas molecules for exhaust by condensing or adsorbing on a cryogenic plate that is cooled to an extremely low temperature. Cryogenic pumps are usually used to achieve a clean vacuum environment required by semiconductor circuit manufacturing processes. The cryopump is a so-called gas-trapping vacuum pump, which needs to be regenerated to periodically discharge the captured gas to the outside. (Prior technical literature) (Patent Document) Patent Document 1: Japanese Patent No. 5669658

(本發明所欲解決之課題) 本發明的一態樣的例示性目的之一為縮短低溫泵的再生時間。 (用以解決課題之手段) 依本發明的一態樣,低溫泵具備:低溫泵殼體;極低溫冷凍機,其具備:膨脹機,安裝於前述低溫泵殼體;及壓縮機,從前述膨脹機回收並壓縮工作氣體,並將被壓縮之工作氣體供給至前述膨脹機;沖洗氣體管路,將沖洗氣體供給至前述低溫泵殼體;及熱交換器,以利用前述壓縮機的排熱而加熱前述沖洗氣體之方式設置於前述沖洗氣體管路。 另外,在方法、裝置、系統等之間相互置換以上構成要素的任意組合、本發明的構成要素和表現形式,作為本發明的態樣亦同樣有效。 (發明之效果) 依本發明,能夠縮短低溫泵的再生時間。(Problem to be solved by the present invention) One of the illustrative purposes of one aspect of the present invention is to shorten the regeneration time of the cryopump. (Means to solve the problem) According to one aspect of the present invention, the cryopump includes: a cryopump housing; an extremely low temperature refrigerator including: an expander installed in the cryopump housing; and a compressor for recovering and compressing working gas from the expander, The compressed working gas is supplied to the expander; the flushing gas pipeline is used to supply the flushing gas to the cryopump housing; and the heat exchanger is arranged to heat the flushing gas by using the exhaust heat of the compressor In the aforementioned flushing gas pipeline. In addition, it is equally effective as an aspect of the present invention to replace any combination of the above constituent elements, the constituent elements, and the expression form of the present invention between methods, devices, systems, and the like. (Effect of Invention) According to the present invention, the regeneration time of the cryopump can be shortened.

以下,參閱附圖對用於實施本發明的形態進行詳細說明。說明及附圖中對相同或等同的構成要素、構件、處理標註相同符號,並適當省略重複說明。所描繪之各部的比例尺和形狀為便於說明而簡易設定,除非特別指明,則為非限制性解釋。實施形態為示例,對本發明的範圍不做任何限定。實施形態中所描述之所有特徵及其組合,未必為發明的本質。 (第1實施形態) 圖1概略地表示第1實施形態之低溫泵10。低溫泵10具備至少一個低溫泵本體12及極低溫冷凍機14,低溫泵本體12具備低溫泵殼體16。極低溫冷凍機14具備膨脹機18及壓縮機20。並且,低溫泵10具備沖洗氣體管路22、冷卻系統24及第1熱交換器26。 低溫泵本體12為了提高例如安裝於離子植入裝置、濺射裝置、蒸鍍裝置或其他真空處理裝置的真空腔室且將真空腔室內部的真空度提高至所希望的真空處理所要求之級別而使用。 在低溫泵殼體16中容納有亦被稱為低溫板之極低溫面。從低溫泵本體12的進氣口進入之氣體藉由冷凝或吸附被捕捉到該極低溫面。極低溫冷凍機14的膨脹機18以對低溫板進行冷卻之方式安裝於低溫泵殼體16。低溫板的配置或形狀等低溫泵本體12的結構能夠適當採用各種公知結構,在此不贅述。 低溫泵殼體16具備用於將沖洗氣體導入至低溫泵殼體16之沖洗閥28及用於將流體從低溫泵殼體16排出至外部之通氣閥30。低溫泵殼體16可以具備粗抽閥或其他閥、壓力感測器或其他感測器。 極低溫冷凍機14的壓縮機20構成為,從膨脹機18回收極低溫冷凍機14的工作氣體,並將回收之工作氣體進行升壓再次將工作氣體供給至膨脹機18。藉由壓縮機20和膨脹機18來構成工作氣體的循環回路亦即極低溫冷凍機14的冷凍循環,藉此膨脹機18的冷卻台被冷卻。工作氣體通常係氦氣,但亦可以使用適當的其他氣體。作為一例,極低溫冷凍機14係二式的吉福德-麥克馬洪式冷凍機(Gifford-McMahon;GM)冷凍機,但亦可以係其他極低溫冷凍機。 極低溫冷凍機14的膨脹機18構成為,能夠進行所謂的逆轉升溫。該情況下,在驅動膨脹機18之馬達19進行正轉時,形成有由工作氣體的膨脹而引起之冷凍循環,另一方面在馬達19進行逆轉時,形成有由工作氣體的壓縮而引起之升溫循環。藉由切換馬達旋轉方向,膨脹機18能夠切換冷凍和升溫。膨脹機18的逆轉升溫能夠用作在進行再生時用於使低溫泵本體12進行升溫之熱源之一。 並且,極低溫冷凍機14具備高壓配管32及低壓配管34。高壓配管32將壓縮機20連接於膨脹機18,以便將藉由壓縮機20而被壓縮之高壓的工作氣體從壓縮機20供給至膨脹機18。低壓配管34將壓縮機20連接於膨脹機18,以便將藉由膨脹機18中的膨脹而減壓之低壓的工作氣體從膨脹機18回收至壓縮機20。 壓縮機20具備對工作氣體進行壓縮之壓縮機本體36、吐出氣體流路38、吸入氣體流路40、壓縮機框體42及第2熱交換器44。吐出氣體流路38將壓縮機本體36的吐出口連接於高壓配管32,吸入氣體流路40將壓縮機本體36的吸入口連接於低壓配管34。伴隨基於壓縮機本體36之工作氣體的壓縮而產生壓縮熱。因此,與流動在吸入氣體流路40之低壓的工作氣體相比,流動在吐出氣體流路38之高壓的工作氣體變成高溫。壓縮機框體42容納壓縮機本體36、吐出氣體流路38、吸入氣體流路40及第2熱交換器44。 沖洗氣體管路22構成為,將沖洗氣體供給至低溫泵殼體16。為了有效地進行低溫泵10的再生而使用沖洗氣體。沖洗氣體作為用於升溫低溫泵本體12之熱源之一來使用。並且,沖洗氣體能夠促進捕捉到低溫泵本體12內部之氣體的再氣化及排出。沖洗氣體通常係與極低溫冷凍機14的工作氣體不同之氣體,例如係氮氣。 沖洗氣體管路22具備沖洗氣體源46及沖洗氣體配管48。沖洗氣體配管48將沖洗氣體源46連接於沖洗閥28,以便從沖洗氣體源46向沖洗閥28供給沖洗氣體。藉由打開沖洗閥28,允許沖洗氣體從沖洗氣體源46朝向低溫泵殼體16之流動。藉由關閉沖洗閥28,隔斷沖洗氣體從沖洗氣體源46朝向低溫泵殼體16之流動。被供給之沖洗氣體能夠通過通氣閥30而從低溫泵殼體16被排出。 沖洗氣體管路22設置於低溫泵本體12的周圍環境,例如室溫大氣壓環境。沖洗氣體的溫度例如被調整為室溫。根據需要,沖洗氣體可以係被溫度被加熱至高於室溫之氣體,或者溫度低於室溫之氣體。在本說明書中,室溫係從10℃~30℃的範圍或15℃~25℃的範圍選擇之溫度,例如約為20℃。 冷卻系統24構成為,利用冷媒對壓縮機20進行冷卻,以便將在壓縮機20中伴隨工作氣體的壓縮而產生之壓縮熱從壓縮機20去除。冷卻系統24具備對冷媒進行溫度調節並使其循環之冷卻器50、冷媒供給流路52、冷媒回收流路54及壓縮機冷媒流路56。冷媒例如係冷卻水。冷媒藉由冷卻器50,例如被冷卻至低於室溫,且高於冷媒的凝固點(水的情況下為0℃)之溫度。 冷媒供給流路52將冷卻器50連接於壓縮機冷媒流路56,以便將溫度調節之冷媒從冷卻器50供給至壓縮機冷媒流路56。冷媒回收流路54將冷卻器50連接於壓縮機冷媒流路56,以便將冷媒從壓縮機冷媒流路56回收至冷卻器50。冷卻系統24中的冷卻器50、冷媒供給流路52及冷媒回收流路54配置於壓縮機20的外部,壓縮機冷媒流路56配置於壓縮機20內。壓縮機冷媒流路56容納於壓縮機框體42。 第2熱交換器44構成為,在吐出氣體流路38和壓縮機冷媒流路56中進行熱交換。流動在吐出氣體流路38之工作氣體被流動在壓縮機冷媒流路56之冷媒冷卻。因此,冷媒在第2熱交換器44中被加熱,被加熱之冷媒流向冷媒回收流路54。流動在冷媒回收流路54之冷媒之溫度高於室溫,例如加熱到從50℃至70℃的溫度。並且,工作氣體在第2熱交換器44中被冷卻至適當的溫度,並通過吐出氣體流路38和高壓配管32而被供給至膨脹機18。如此一來,在壓縮機本體36中產生之壓縮熱經由第2熱交換器44而從工作氣體被輸送到冷媒,並與從壓縮機20流出之冷媒一起從壓縮機20被去除。 第1熱交換器26以利用壓縮機20的排熱而加熱沖洗氣體之方式設置於沖洗氣體管路22。第1熱交換器26構成為,將藉由壓縮熱而被加熱之冷媒作為熱源而加熱沖洗氣體。 第1熱交換器26配置於壓縮機20的外部。第1熱交換器26可以與壓縮機框體42的外側相鄰而設置於壓縮機20。 第1熱交換器26構成為,在冷媒回收流路54和沖洗氣體配管48中進行熱交換。流動在沖洗氣體配管48之沖洗氣體被流動在冷媒回收流路54之冷媒加熱。從沖洗氣體源46被送出至沖洗氣體配管48之沖洗氣體在第1熱交換器26中被加熱,被加熱之沖洗氣體從沖洗閥28被供給至低溫泵殼體16。從沖洗氣體管路22被供給至低溫泵殼體16之沖洗氣體之溫度高於室溫,例如加熱到從40℃至60℃的溫度。冷媒在第1熱交換器26中被冷卻而返回到冷卻器50。如此一來,利用被輸送到冷媒之壓縮機20的排熱,沖洗氣體被加熱。 第1熱交換器26能夠適當採用可適用之任意形式的熱交換器。同樣地,第2熱交換器44能夠適當採用可適用之任意形式的熱交換器。 繼續低溫泵10的排氣運行,藉此氣體逐漸在低溫泵本體12累積。為了將累積之氣體排出至外部,而進行低溫泵本體12的再生。若再生結束,則能夠再次開始排氣運行。 若開始再生,則沖洗氣體從沖洗氣體管路22被供給至低溫泵殼體16。低溫泵本體12藉由極低溫冷凍機14的膨脹機18的逆轉升溫而被加熱。壓縮機20的運行在再生中亦繼續。藉由工作氣體的壓縮熱,冷卻系統24的冷媒在第2熱交換器44中被加熱。沖洗氣體藉由被加熱之冷媒在第1熱交換器26中被加熱。如此,能夠利用壓縮機20的排熱而加熱沖洗氣體,並將被加熱之沖洗氣體供給至低溫泵殼體16。供給有高溫的沖洗氣體,因此能夠加快再生中的低溫泵本體12的溫度上升。 假設,在第1熱交換器26未設置於沖洗氣體管路22之情況下,室溫的沖洗氣體被供給至低溫泵本體12。相對於此,依第1實施形態之低溫泵10,與沒有第1熱交換器26之情況相比,能夠將高溫的沖洗氣體供給至低溫泵本體12。因此,期待能夠使低溫泵本體12有效地進行升溫,從而縮短再生時間。 並且,依第1實施形態之低溫泵10,能夠利用以往向外部廢棄之壓縮機20的排熱。與在沖洗氣體管路22上設置電加熱器等其他的加熱手段相比,低溫泵10之節能性優異。 而且,依第1實施形態之低溫泵10,能夠直接使用已有的沖洗氣體管路22。無需沖洗氣體管路22的大幅的改造。能夠將設置空間的增大或成本上升等的負的影響抑制為最小限。 (第2實施形態) 圖2概略地表示第2實施形態之低溫泵10。所圖示之低溫泵10在關於第1熱交換器26的結構上與在圖1中示出之低溫泵10不同,關於其他方面大致相同。以下,以不同之結構為中心進行說明,但對於相同之結構進行簡單說明,或者省略說明。 低溫泵10具備:低溫泵本體12,具備低溫泵殼體16;及極低溫冷凍機14,具備膨脹機18及壓縮機20。膨脹機18安裝於低溫泵殼體16。在低溫泵殼體16上設置有沖洗閥28及通氣閥30。並且,低溫泵10具備沖洗氣體管路22、冷卻系統24及第1熱交換器26。 壓縮機20具備壓縮機本體36、吐出氣體流路38、吸入氣體流路40及壓縮機框體42。吐出氣體流路38將壓縮機本體36的吐出口連接於高壓配管32,吸入氣體流路40將壓縮機本體36的吸入口連接於低壓配管34。 在壓縮機20上設置有第1熱交換器26與第2熱交換器44這兩者。壓縮機框體42容納壓縮機本體36、吐出氣體流路38、吸入氣體流路40、第1熱交換器26及第2熱交換器44。 沖洗氣體管路22具備沖洗氣體源46及沖洗氣體配管48。沖洗氣體配管48具備配置於壓縮機20中之壓縮機沖洗氣體流路58。壓縮機沖洗氣體流路58容納於壓縮機框體42。沖洗氣體從沖洗氣體源46通過壓縮機沖洗氣體流路58及沖洗氣體配管48而被供給至沖洗閥28。沖洗氣體從沖洗閥28被供給至低溫泵殼體16。 冷卻系統24具備冷卻器50、冷媒供給流路52、冷媒回收流路54及壓縮機冷媒流路56。與第1實施形態不同,在第2實施形態中,第1熱交換器26未設置於冷卻系統24。 第1熱交換器26以利用壓縮機20的排熱而加熱沖洗氣體之方式設置於沖洗氣體管路22。第1熱交換器26構成為將藉由壓縮機20而被壓縮之工作氣體作為熱源而加熱沖洗氣體。 第1熱交換器26構成為,在吐出氣體流路38和壓縮機沖洗氣體流路58中進行熱交換。流動在壓縮機沖洗氣體流路58之沖洗氣體被流動在吐出氣體流路38之工作氣體加熱。從沖洗氣體源46被送出至沖洗氣體配管48之沖洗氣體在第1熱交換器26中被加熱,被加熱之沖洗氣體從沖洗閥28被供給至低溫泵殼體16。工作氣體在第1熱交換器26中被被冷卻而流向第2熱交換器44。 第2熱交換器44構成為,在吐出氣體流路38和壓縮機冷媒流路56中進行熱交換。流動在吐出氣體流路38之工作氣體被流動在壓縮機冷媒流路56之冷媒冷卻。因此,冷媒在第2熱交換器44中被加熱,被加熱之冷媒流向冷媒回收流路54。並且,工作氣體在第2熱交換器44中被冷卻至適當的溫度,並通過吐出氣體流路38和高壓配管32而被供給至膨脹機18。 第1熱交換器26和第2熱交換器44均設置於壓縮機20的吐出氣體流路38。第1熱交換器26配置於第2熱交換器44的上游。亦即,第1熱交換器26位於壓縮機本體36與第2熱交換器44之間。第1熱交換器26設置於壓縮機本體36的正下游,因此第1熱交換器26能夠使沖洗氣體與更高溫的工作氣體進行熱接觸。因此,第1熱交換器26能夠使沖洗氣體加熱至更高溫。 另外,受到低溫泵本體12的耐熱溫度之限制等,在期望抑制沖洗氣體的過度升溫之情況下,第1熱交換器26與第2熱交換器44的位置關係亦可以相反。亦即,第1熱交換器26可以配置於第2熱交換器44的下游。第2熱交換器44可以位於壓縮機本體36與第1熱交換器26之間。 依第2實施形態之低溫泵10,能夠利用壓縮機20的排熱而加熱沖洗氣體,並將被加熱之沖洗氣體供給至低溫泵殼體16。供給高溫的沖洗氣體,因此能夠加快再生中的低溫泵本體12的溫度上升。因此,期待能夠使低溫泵本體12有效地進行升溫,從而縮短再生時間。並且,與在沖洗氣體管路22上設置電加熱器等其他加熱手段相比,低溫泵10之節能性優異。 以上,依據實施例對本發明進行了說明。所屬技術領域中具有通常知識者當然能夠理解,本發明並不限定於上述實施形態,且能夠進行各種設計變更並存在各種變形例,並且這種變形例亦屬於本發明的範圍。 另外,在圖式中示出了一台低溫泵本體12,但低溫泵10亦可以具備複數個低溫泵本體12。該情況下,極低溫冷凍機14具備至少一個壓縮機20及複數個膨脹機18。各膨脹機18安裝於所對應之低溫泵本體12的低溫泵殼體16。複數個低溫泵本體12能夠獨立運行,例如,一邊使一台低溫泵本體12再生,一邊剩餘的低溫泵本體12能夠繼續真空排氣運行。Hereinafter, the mode for implementing the present invention will be described in detail with reference to the drawings. In the description and drawings, the same or equivalent constituent elements, members, and processing are designated with the same symbols, and repeated descriptions are appropriately omitted. The scales and shapes of the depicted parts are simply set for ease of explanation, and unless otherwise specified, they are interpreted as non-limiting. The embodiment is an example and does not limit the scope of the present invention in any way. All the features and combinations described in the embodiments are not necessarily the essence of the invention. (First Embodiment) Fig. 1 schematically shows the cryopump 10 of the first embodiment. The cryopump 10 includes at least one cryopump body 12 and a cryogenic refrigerator 14, and the cryopump body 12 includes a cryopump housing 16. The cryogenic refrigerator 14 includes an expander 18 and a compressor 20. In addition, the cryopump 10 includes a flushing gas line 22, a cooling system 24 and a first heat exchanger 26. The cryopump body 12 is to increase the vacuum chamber installed in, for example, an ion implantation device, a sputtering device, an evaporation device, or other vacuum processing devices, and to increase the vacuum inside the vacuum chamber to the level required for the desired vacuum processing. And use. The cryopump housing 16 contains an extremely low temperature surface also called a cryoplate. The gas entering from the air inlet of the cryopump body 12 is captured to the extremely low temperature surface by condensation or adsorption. The expander 18 of the cryogenic refrigerator 14 is installed in the cryopump housing 16 to cool the cryoplate. The structure of the cryopump main body 12, such as the arrangement and shape of the cryoplate, can appropriately adopt various well-known structures, which will not be repeated here. The cryopump housing 16 includes a flush valve 28 for introducing flushing gas into the cryopump housing 16 and a vent valve 30 for discharging fluid from the cryopump housing 16 to the outside. The cryopump housing 16 may be provided with a roughing valve or other valves, a pressure sensor or other sensors. The compressor 20 of the cryogenic refrigerator 14 is configured to recover the working gas of the cryogenic refrigerator 14 from the expander 18, pressurize the recovered working gas, and supply the working gas to the expander 18 again. The compressor 20 and the expander 18 constitute the circulating circuit of the working gas, that is, the refrigeration cycle of the cryogenic refrigerator 14, whereby the cooling stage of the expander 18 is cooled. The working gas is usually helium, but other suitable gases can also be used. As an example, the extremely low temperature refrigerator 14 is a type two Gifford-McMahon (GM) refrigerator, but other extremely low temperature refrigerators may also be used. The expander 18 of the cryogenic refrigerator 14 is configured to be able to perform so-called reverse temperature rise. In this case, when the motor 19 of the expander 18 is driven to rotate forward, a refrigeration cycle caused by the expansion of the working gas is formed. On the other hand, when the motor 19 is reversed, it is caused by the compression of the working gas. Heating cycle. By switching the motor rotation direction, the expander 18 can switch between freezing and heating. The reversal temperature rise of the expander 18 can be used as one of the heat sources for raising the temperature of the cryopump body 12 during regeneration. In addition, the cryogenic refrigerator 14 includes a high-pressure pipe 32 and a low-pressure pipe 34. The high-pressure pipe 32 connects the compressor 20 to the expander 18 so that the high-pressure working gas compressed by the compressor 20 is supplied from the compressor 20 to the expander 18. The low-pressure pipe 34 connects the compressor 20 to the expander 18 so that the low-pressure working gas decompressed by the expansion in the expander 18 is recovered from the expander 18 to the compressor 20. The compressor 20 includes a compressor main body 36 that compresses working gas, a discharged gas flow path 38, a suction gas flow path 40, a compressor frame 42, and a second heat exchanger 44. The discharge gas flow path 38 connects the discharge port of the compressor body 36 to the high-pressure pipe 32, and the suction gas flow path 40 connects the suction port of the compressor body 36 to the low pressure pipe 34. Compression of the working gas by the compressor body 36 generates compression heat. Therefore, compared with the low-pressure working gas flowing in the suction gas flow path 40, the high-pressure working gas flowing in the discharge gas flow path 38 becomes high temperature. The compressor housing 42 houses the compressor main body 36, the discharged gas flow path 38, the suction gas flow path 40, and the second heat exchanger 44. The flushing gas line 22 is configured to supply flushing gas to the cryopump housing 16. In order to efficiently perform regeneration of the cryopump 10, flushing gas is used. The flushing gas is used as one of the heat sources for raising the temperature of the cryopump body 12. In addition, the flushing gas can promote the regasification and discharge of the gas trapped in the cryopump body 12. The flushing gas is usually a gas different from the working gas of the cryogenic refrigerator 14, such as nitrogen. The flushing gas pipeline 22 includes a flushing gas source 46 and a flushing gas pipe 48. The flushing gas pipe 48 connects the flushing gas source 46 to the flushing valve 28 so that the flushing gas is supplied from the flushing gas source 46 to the flushing valve 28. By opening the flushing valve 28, the flushing gas is allowed to flow from the flushing gas source 46 toward the cryopump housing 16. By closing the flushing valve 28, the flow of flushing gas from the flushing gas source 46 toward the cryopump housing 16 is blocked. The supplied flushing gas can be discharged from the cryopump housing 16 through the vent valve 30. The flushing gas pipeline 22 is arranged in the surrounding environment of the cryopump body 12, such as a room temperature and atmospheric pressure environment. The temperature of the flushing gas is adjusted to room temperature, for example. According to needs, the flushing gas can be a gas heated to a temperature higher than room temperature, or a gas with a temperature lower than room temperature. In this specification, the room temperature is a temperature selected from the range of 10°C to 30°C or the range of 15°C to 25°C, for example, about 20°C. The cooling system 24 is configured to cool the compressor 20 with a refrigerant so as to remove the heat of compression generated in the compressor 20 accompanying the compression of the working gas from the compressor 20. The cooling system 24 includes a cooler 50 that adjusts the temperature of the refrigerant and circulates it, a refrigerant supply flow path 52, a refrigerant recovery flow path 54, and a compressor refrigerant flow path 56. The refrigerant is, for example, cooling water. The refrigerant is cooled by the cooler 50, for example, to a temperature lower than room temperature and higher than the freezing point of the refrigerant (in the case of water, 0°C). The refrigerant supply flow path 52 connects the cooler 50 to the compressor refrigerant flow path 56 so that the temperature-regulated refrigerant is supplied from the cooler 50 to the compressor refrigerant flow path 56. The refrigerant recovery flow path 54 connects the cooler 50 to the compressor refrigerant flow path 56 in order to recover the refrigerant from the compressor refrigerant flow path 56 to the cooler 50. The cooler 50, the refrigerant supply flow path 52 and the refrigerant recovery flow path 54 in the cooling system 24 are arranged outside the compressor 20, and the compressor refrigerant flow path 56 is arranged inside the compressor 20. The compressor refrigerant flow path 56 is housed in the compressor housing 42. The second heat exchanger 44 is configured to exchange heat between the discharged gas flow path 38 and the compressor refrigerant flow path 56. The working gas flowing in the discharge gas flow path 38 is cooled by the refrigerant flowing in the compressor refrigerant flow path 56. Therefore, the refrigerant is heated in the second heat exchanger 44 and the heated refrigerant flows to the refrigerant recovery flow path 54. The temperature of the refrigerant flowing in the refrigerant recovery flow path 54 is higher than room temperature, for example, it is heated to a temperature from 50°C to 70°C. In addition, the working gas is cooled to an appropriate temperature in the second heat exchanger 44 and is supplied to the expander 18 through the discharge gas flow path 38 and the high-pressure pipe 32. In this way, the compression heat generated in the compressor body 36 is transferred from the working gas to the refrigerant via the second heat exchanger 44, and is removed from the compressor 20 together with the refrigerant flowing out of the compressor 20. The first heat exchanger 26 is provided in the flushing gas line 22 so as to heat the flushing gas by using the exhaust heat of the compressor 20. The first heat exchanger 26 is configured to heat the flushing gas using a refrigerant heated by compression heat as a heat source. The first heat exchanger 26 is arranged outside the compressor 20. The first heat exchanger 26 may be provided in the compressor 20 adjacent to the outside of the compressor housing 42. The first heat exchanger 26 is configured to perform heat exchange in the refrigerant recovery flow path 54 and the flushing gas pipe 48. The flushing gas flowing in the flushing gas pipe 48 is heated by the refrigerant flowing in the refrigerant recovery flow path 54. The flushing gas sent from the flushing gas source 46 to the flushing gas pipe 48 is heated in the first heat exchanger 26, and the heated flushing gas is supplied to the cryopump housing 16 from the flushing valve 28. The temperature of the flushing gas supplied from the flushing gas line 22 to the cryopump housing 16 is higher than room temperature, for example, it is heated to a temperature from 40°C to 60°C. The refrigerant is cooled in the first heat exchanger 26 and returned to the cooler 50. In this way, the flushing gas is heated by the exhaust heat of the compressor 20 sent to the refrigerant. As the first heat exchanger 26, any applicable heat exchanger can be appropriately adopted. Similarly, as the second heat exchanger 44, any applicable heat exchanger can be appropriately adopted. The exhaust operation of the cryopump 10 is continued, whereby the gas gradually accumulates in the cryopump body 12. In order to discharge the accumulated gas to the outside, the cryopump body 12 is regenerated. When the regeneration ends, the exhaust operation can be restarted. When regeneration is started, the flushing gas is supplied to the cryopump housing 16 from the flushing gas line 22. The cryopump body 12 is heated by the reversal of the temperature rise of the expander 18 of the cryogenic refrigerator 14. The operation of the compressor 20 also continues during regeneration. The refrigerant of the cooling system 24 is heated in the second heat exchanger 44 by the heat of compression of the working gas. The flushing gas is heated in the first heat exchanger 26 by the heated refrigerant. In this way, it is possible to use the exhaust heat of the compressor 20 to heat the flushing gas, and to supply the heated flushing gas to the cryopump housing 16. Since high-temperature flushing gas is supplied, the temperature rise of the cryopump main body 12 during regeneration can be accelerated. It is assumed that when the first heat exchanger 26 is not provided in the flushing gas line 22, the flushing gas at room temperature is supplied to the cryopump main body 12. On the other hand, according to the cryopump 10 of the first embodiment, compared with the case where the first heat exchanger 26 is not provided, it is possible to supply high-temperature flushing gas to the cryopump main body 12. Therefore, it is expected that the temperature of the cryopump main body 12 can be increased efficiently, thereby shortening the regeneration time. Furthermore, according to the cryopump 10 of the first embodiment, the exhaust heat of the compressor 20 that has been conventionally discarded to the outside can be utilized. Compared with other heating means such as an electric heater provided on the flushing gas pipeline 22, the cryopump 10 is superior in energy saving. Furthermore, according to the cryopump 10 of the first embodiment, the existing flushing gas line 22 can be directly used. No substantial modification of the flushing gas pipeline 22 is required. It is possible to minimize negative influences such as increase in installation space and increase in cost. (Second Embodiment) Fig. 2 schematically shows the cryopump 10 of the second embodiment. The illustrated cryopump 10 is different from the cryopump 10 shown in FIG. 1 in the structure of the first heat exchanger 26, and is substantially the same in other respects. Hereinafter, the description will focus on the different structures, but the same structure will be briefly described or the description will be omitted. The cryopump 10 includes a cryopump main body 12 including a cryopump housing 16 and a cryogenic refrigerator 14 including an expander 18 and a compressor 20. The expander 18 is installed in the cryopump housing 16. The cryopump housing 16 is provided with a flushing valve 28 and a vent valve 30. In addition, the cryopump 10 includes a flushing gas line 22, a cooling system 24 and a first heat exchanger 26. The compressor 20 includes a compressor body 36, a discharge gas flow path 38, a suction gas flow path 40 and a compressor frame 42. The discharge gas flow path 38 connects the discharge port of the compressor body 36 to the high-pressure pipe 32, and the suction gas flow path 40 connects the suction port of the compressor body 36 to the low pressure pipe 34. Both the first heat exchanger 26 and the second heat exchanger 44 are provided on the compressor 20. The compressor housing 42 houses the compressor main body 36, the discharged gas flow path 38, the suction gas flow path 40, the first heat exchanger 26 and the second heat exchanger 44. The flushing gas pipeline 22 includes a flushing gas source 46 and a flushing gas pipe 48. The flushing gas pipe 48 includes a compressor flushing gas flow path 58 arranged in the compressor 20. The compressor flushing gas flow path 58 is housed in the compressor housing 42. The flushing gas is supplied to the flushing valve 28 from the flushing gas source 46 through the compressor flushing gas flow path 58 and the flushing gas pipe 48. The flushing gas is supplied to the cryopump housing 16 from the flushing valve 28. The cooling system 24 includes a cooler 50, a refrigerant supply flow path 52, a refrigerant recovery flow path 54, and a compressor refrigerant flow path 56. Unlike the first embodiment, in the second embodiment, the first heat exchanger 26 is not provided in the cooling system 24. The first heat exchanger 26 is provided in the flushing gas line 22 so as to heat the flushing gas by using the exhaust heat of the compressor 20. The first heat exchanger 26 is configured to heat the flushing gas using the working gas compressed by the compressor 20 as a heat source. The first heat exchanger 26 is configured to exchange heat in the discharge gas flow path 38 and the compressor flushing gas flow path 58. The flushing gas flowing in the compressor flushing gas flow path 58 is heated by the working gas flowing in the discharge gas flow path 38. The flushing gas sent from the flushing gas source 46 to the flushing gas pipe 48 is heated in the first heat exchanger 26, and the heated flushing gas is supplied to the cryopump housing 16 from the flushing valve 28. The working gas is cooled in the first heat exchanger 26 and flows to the second heat exchanger 44. The second heat exchanger 44 is configured to exchange heat between the discharged gas flow path 38 and the compressor refrigerant flow path 56. The working gas flowing in the discharge gas flow path 38 is cooled by the refrigerant flowing in the compressor refrigerant flow path 56. Therefore, the refrigerant is heated in the second heat exchanger 44 and the heated refrigerant flows to the refrigerant recovery flow path 54. In addition, the working gas is cooled to an appropriate temperature in the second heat exchanger 44 and is supplied to the expander 18 through the discharge gas flow path 38 and the high-pressure pipe 32. Both the first heat exchanger 26 and the second heat exchanger 44 are provided in the discharge gas flow path 38 of the compressor 20. The first heat exchanger 26 is arranged upstream of the second heat exchanger 44. That is, the first heat exchanger 26 is located between the compressor body 36 and the second heat exchanger 44. The first heat exchanger 26 is provided directly downstream of the compressor body 36. Therefore, the first heat exchanger 26 can thermally contact the flushing gas and the higher temperature working gas. Therefore, the first heat exchanger 26 can heat the flushing gas to a higher temperature. In addition, due to the limitation of the heat-resistant temperature of the cryopump main body 12, etc., when it is desired to suppress excessive temperature rise of the flushing gas, the positional relationship between the first heat exchanger 26 and the second heat exchanger 44 may be reversed. In other words, the first heat exchanger 26 may be arranged downstream of the second heat exchanger 44. The second heat exchanger 44 may be located between the compressor body 36 and the first heat exchanger 26. According to the cryopump 10 of the second embodiment, the flushing gas can be heated by the exhaust heat of the compressor 20 and the heated flushing gas can be supplied to the cryopump housing 16. The supply of high-temperature flushing gas can accelerate the temperature rise of the cryopump main body 12 during regeneration. Therefore, it is expected that the temperature of the cryopump main body 12 can be increased efficiently, thereby shortening the regeneration time. In addition, compared with other heating means such as an electric heater provided on the flushing gas pipeline 22, the cryopump 10 is superior in energy saving. Above, the present invention has been described based on the embodiments. Those having ordinary knowledge in the technical field can of course understand that the present invention is not limited to the above-mentioned embodiment, and various design changes can be made and various modifications are possible, and such modifications also belong to the scope of the present invention. In addition, one cryopump body 12 is shown in the drawing, but the cryopump 10 may include a plurality of cryopump bodies 12. In this case, the cryogenic refrigerator 14 includes at least one compressor 20 and a plurality of expanders 18. Each expander 18 is installed in the cryopump housing 16 of the corresponding cryopump body 12. A plurality of cryopump main bodies 12 can operate independently, for example, while regenerating one cryopump main body 12, the remaining cryopump main bodies 12 can continue the vacuum exhaust operation.

10‧‧‧低溫泵 14‧‧‧極低溫冷凍機 16‧‧‧低溫泵殼體 18‧‧‧膨脹機 20‧‧‧壓縮機 22‧‧‧沖洗氣體管路 24‧‧‧冷卻系統 26‧‧‧第1熱交換器10‧‧‧Cryogenic Pump 14‧‧‧Very low temperature freezer 16‧‧‧Cryogenic pump housing 18‧‧‧Expander 20‧‧‧Compressor 22‧‧‧Flushing gas pipeline 24‧‧‧Cooling system 26‧‧‧The first heat exchanger

圖1概略地表示第1實施形態之低溫泵。 圖2概略地表示第2實施形態之低溫泵。Fig. 1 schematically shows the cryopump of the first embodiment. Fig. 2 schematically shows the cryopump of the second embodiment.

10‧‧‧低溫泵 10‧‧‧Cryogenic Pump

12‧‧‧低溫泵本體 12‧‧‧Cryogenic pump body

14‧‧‧極低溫冷凍機 14‧‧‧Very low temperature freezer

16‧‧‧低溫泵殼體 16‧‧‧Cryogenic pump housing

18‧‧‧膨脹機 18‧‧‧Expander

19‧‧‧馬達 19‧‧‧Motor

20‧‧‧壓縮機 20‧‧‧Compressor

22‧‧‧沖洗氣體管路 22‧‧‧Flushing gas pipeline

24‧‧‧冷卻系統 24‧‧‧Cooling system

26‧‧‧第1熱交換器 26‧‧‧The first heat exchanger

28‧‧‧沖洗閥 28‧‧‧Flush valve

30‧‧‧通氣閥 30‧‧‧Vent valve

32‧‧‧高壓配管 32‧‧‧High pressure piping

34‧‧‧低壓配管 34‧‧‧Low pressure piping

36‧‧‧壓縮機本體 36‧‧‧Compressor body

38‧‧‧吐出氣體流路 38‧‧‧Exhaust gas flow path

40‧‧‧吸入氣體流路 40‧‧‧Inhalation gas flow path

42‧‧‧壓縮機框體 42‧‧‧Compressor frame

44‧‧‧第2熱交換器 44‧‧‧The second heat exchanger

46‧‧‧沖洗氣體源 46‧‧‧Flushing gas source

48‧‧‧沖洗氣體配管 48‧‧‧Flushing gas piping

50‧‧‧冷卻器 50‧‧‧Cooler

52‧‧‧冷媒供給流路 52‧‧‧Refrigerant supply flow path

54‧‧‧冷媒回收流路 54‧‧‧Refrigerant recovery flow path

56‧‧‧壓縮機冷媒流路 56‧‧‧Compressor refrigerant flow path

Claims (2)

一種低溫泵,其特徵為,具備:低溫泵殼體;極低溫冷凍機,其具備:膨脹機,安裝於前述低溫泵殼體;及壓縮機,從前述膨脹機回收並壓縮工作氣體,並將被壓縮之工作氣體供給至前述膨脹機;沖洗氣體管路,將沖洗氣體供給至前述低溫泵殼體;及熱交換器,以利用前述壓縮機的排熱而加熱前述沖洗氣體之方式設置於前述沖洗氣體管路,前述熱交換器構成為,將藉由前述壓縮機而被壓縮之工作氣體作為熱源而加熱前述沖洗氣體。 A cryopump is characterized by comprising: a cryopump housing; an extremely low temperature refrigerator including: an expander installed in the cryopump housing; and a compressor for recovering and compressing working gas from the expander, and The compressed working gas is supplied to the aforementioned expander; the flushing gas pipeline supplies the flushing gas to the aforementioned cryopump housing; and the heat exchanger is arranged in the aforementioned way to heat the flushing gas by using the exhaust heat of the compressor In the flushing gas line, the heat exchanger is configured to heat the flushing gas by using the working gas compressed by the compressor as a heat source. 如申請專利範圍第1項所述之低溫泵,其還具備:冷卻系統,利用冷媒對前述壓縮機進行冷卻,以便將在前述壓縮機中伴隨前述工作氣體的壓縮而產生之壓縮熱從前述壓縮機去除,前述熱交換器構成為,將藉由前述壓縮熱而被加熱之冷媒作為熱源而加熱前述沖洗氣體。The cryopump described in claim 1 further includes a cooling system that uses a refrigerant to cool the compressor, so that the compression heat generated by the compression of the working gas in the compressor can be compressed from the compressor The heat exchanger is configured to use a refrigerant heated by the heat of compression as a heat source to heat the flushing gas.
TW108105745A 2018-02-21 2019-02-21 Cryopump TWI697620B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018028382A JP6929601B2 (en) 2018-02-21 2018-02-21 Cryopump
JP2018-028382 2018-02-21

Publications (2)

Publication Number Publication Date
TW201937060A TW201937060A (en) 2019-09-16
TWI697620B true TWI697620B (en) 2020-07-01

Family

ID=67686825

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108105745A TWI697620B (en) 2018-02-21 2019-02-21 Cryopump

Country Status (3)

Country Link
JP (1) JP6929601B2 (en)
TW (1) TWI697620B (en)
WO (1) WO2019163762A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024209787A1 (en) * 2023-04-06 2024-10-10 住友重機械工業株式会社 Compressor system for cryocooler

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4324565A (en) * 1979-08-30 1982-04-13 Linde Aktiengesellschaft Removal of lubricant mists and lubricant vapors from a gaseous stream
US4693736A (en) * 1986-09-12 1987-09-15 Helix Technology Corporation Oil cooled hermetic compressor used for helium service
JP2000266416A (en) * 1999-03-15 2000-09-29 Sanyo Electric Co Ltd Very low temperature refrigerating device
TW201307682A (en) * 2011-04-11 2013-02-16 Sumitomo Heavy Industries Cryopump system, compressor, and method for regenerating cryopumps
CN104343664A (en) * 2013-07-23 2015-02-11 住友重机械工业株式会社 Compressor and cooling system
KR20150114225A (en) * 2014-04-01 2015-10-12 주식회사 조인솔루션 Cryo compressor apparatus using storage tank
TW201540950A (en) * 2014-03-18 2015-11-01 Sumitomo Heavy Industries Cyropump and method for regenerating the cryopump
TW201708705A (en) * 2015-07-17 2017-03-01 厄利孔萊博爾德真空有限責任公司 Pump system

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04330388A (en) * 1991-04-30 1992-11-18 Ebara Corp Vacuum pump device
JP2003090287A (en) * 2001-09-17 2003-03-28 Ebara Corp Dry vacuum pump and operating method thereof
JP5808691B2 (en) * 2012-02-23 2015-11-10 住友重機械工業株式会社 Cryopump and method for regenerating cryopump

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4324565A (en) * 1979-08-30 1982-04-13 Linde Aktiengesellschaft Removal of lubricant mists and lubricant vapors from a gaseous stream
US4693736A (en) * 1986-09-12 1987-09-15 Helix Technology Corporation Oil cooled hermetic compressor used for helium service
JP2000266416A (en) * 1999-03-15 2000-09-29 Sanyo Electric Co Ltd Very low temperature refrigerating device
TW201307682A (en) * 2011-04-11 2013-02-16 Sumitomo Heavy Industries Cryopump system, compressor, and method for regenerating cryopumps
CN104343664A (en) * 2013-07-23 2015-02-11 住友重机械工业株式会社 Compressor and cooling system
TW201540950A (en) * 2014-03-18 2015-11-01 Sumitomo Heavy Industries Cyropump and method for regenerating the cryopump
KR20150114225A (en) * 2014-04-01 2015-10-12 주식회사 조인솔루션 Cryo compressor apparatus using storage tank
TW201708705A (en) * 2015-07-17 2017-03-01 厄利孔萊博爾德真空有限責任公司 Pump system

Also Published As

Publication number Publication date
WO2019163762A1 (en) 2019-08-29
JP6929601B2 (en) 2021-09-01
TW201937060A (en) 2019-09-16
JP2019143534A (en) 2019-08-29

Similar Documents

Publication Publication Date Title
TWI493106B (en) Cryogenic pump system, compressor and cryogenic pump regeneration method
TWI485327B (en) Cryogenic pump system, cryogenic pump regeneration method
TWI530617B (en) Cryogenic pump system and its control method
TWI507605B (en) Cryogenic pump and its regeneration method
JP2016125773A (en) Liquefied gas cooling device
CN103250012A (en) Binary refrigeration cycle device
TWI677626B (en) Compressor unit and cryopump system for cryogenic refrigerator
KR101045488B1 (en) Vacuum processing apparatus with cryo trap and cryo trap
US20110225989A1 (en) Cold trap and vacuum evacuation apparatus
JP2012504221A (en) Increase in capacity when pulling down
TWI697620B (en) Cryopump
TWI683079B (en) Movable table cooling device and movable table cooling system
WO2018097190A1 (en) Oil-free compressor and method of operating same
TW202006251A (en) Cryopump system and method for operating cryopump system
TWI757114B (en) Cryopump system, control device and regeneration method of cryopump system
CN114320826A (en) Cryopump and method for regenerating cryopump
JP3832569B2 (en) Cooling system
JP2007255876A (en) Refrigerating device
JP2014222131A (en) Freezer
JP2015105783A (en) Turbo refrigerator
TWI846332B (en) Cryogenic pump and method for operating the same
JP2012241967A (en) Supercritical steam compressing type heat pump, and water heater
KR200382036Y1 (en) Refrigerant Compressor in Compressor of Refrigeration Cycle
CN110068183A (en) A kind of compressor coolant drying water scavenging system
KR100919610B1 (en) Forst free airconditioner