TWI697529B - Film-forming coating liquid, manufacturing method of film-forming coating liquid and film-covered base material - Google Patents
Film-forming coating liquid, manufacturing method of film-forming coating liquid and film-covered base material Download PDFInfo
- Publication number
- TWI697529B TWI697529B TW105128237A TW105128237A TWI697529B TW I697529 B TWI697529 B TW I697529B TW 105128237 A TW105128237 A TW 105128237A TW 105128237 A TW105128237 A TW 105128237A TW I697529 B TWI697529 B TW I697529B
- Authority
- TW
- Taiwan
- Prior art keywords
- component
- film
- concentration
- coating liquid
- mass
- Prior art date
Links
- 238000000576 coating method Methods 0.000 title claims abstract description 134
- 239000011248 coating agent Substances 0.000 title claims abstract description 130
- 239000007788 liquid Substances 0.000 title claims abstract description 86
- 238000004519 manufacturing process Methods 0.000 title claims description 27
- 239000000463 material Substances 0.000 title description 9
- 229910052751 metal Inorganic materials 0.000 claims abstract description 62
- 239000002184 metal Substances 0.000 claims abstract description 62
- 238000006460 hydrolysis reaction Methods 0.000 claims abstract description 56
- 229910000077 silane Inorganic materials 0.000 claims abstract description 52
- -1 silane compound Chemical class 0.000 claims abstract description 52
- 230000007062 hydrolysis Effects 0.000 claims abstract description 44
- 150000004703 alkoxides Chemical class 0.000 claims abstract description 41
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 38
- 239000003960 organic solvent Substances 0.000 claims abstract description 22
- 150000002894 organic compounds Chemical group 0.000 claims abstract description 17
- 239000013522 chelant Substances 0.000 claims abstract description 10
- 239000012046 mixed solvent Substances 0.000 claims abstract description 10
- 238000009833 condensation Methods 0.000 claims abstract description 8
- 230000005494 condensation Effects 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims description 58
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 32
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 23
- 238000002360 preparation method Methods 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 19
- 238000002156 mixing Methods 0.000 claims description 19
- 238000003756 stirring Methods 0.000 claims description 19
- 238000006243 chemical reaction Methods 0.000 claims description 16
- 125000004432 carbon atom Chemical group C* 0.000 claims description 13
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 12
- 239000003054 catalyst Substances 0.000 claims description 11
- 150000001335 aliphatic alkanes Chemical class 0.000 claims description 10
- 125000004104 aryloxy group Chemical group 0.000 claims description 10
- 125000005843 halogen group Chemical group 0.000 claims description 10
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 10
- 229910052738 indium Inorganic materials 0.000 claims description 10
- 125000005415 substituted alkoxy group Chemical group 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 9
- 125000002947 alkylene group Chemical group 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- 125000000547 substituted alkyl group Chemical group 0.000 claims description 6
- 229910052787 antimony Inorganic materials 0.000 claims description 5
- 229910052785 arsenic Inorganic materials 0.000 claims description 5
- 229910052790 beryllium Inorganic materials 0.000 claims description 5
- 229910052804 chromium Inorganic materials 0.000 claims description 5
- 229910052733 gallium Inorganic materials 0.000 claims description 5
- 229910052732 germanium Inorganic materials 0.000 claims description 5
- 229910052745 lead Inorganic materials 0.000 claims description 5
- 229910052758 niobium Inorganic materials 0.000 claims description 5
- 229910052706 scandium Inorganic materials 0.000 claims description 5
- 229910052715 tantalum Inorganic materials 0.000 claims description 5
- 229910052718 tin Inorganic materials 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 229910052721 tungsten Inorganic materials 0.000 claims description 5
- 229910052720 vanadium Inorganic materials 0.000 claims description 5
- 229910052725 zinc Inorganic materials 0.000 claims description 5
- 229910052726 zirconium Inorganic materials 0.000 claims description 5
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims description 4
- 239000004793 Polystyrene Substances 0.000 claims description 4
- 238000009835 boiling Methods 0.000 claims description 4
- 229920002223 polystyrene Polymers 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 150000003254 radicals Chemical class 0.000 claims 1
- 239000000126 substance Substances 0.000 abstract description 43
- 239000010408 film Substances 0.000 description 183
- 239000000243 solution Substances 0.000 description 46
- 239000007787 solid Substances 0.000 description 20
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 18
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 17
- 238000010438 heat treatment Methods 0.000 description 17
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 13
- 238000001035 drying Methods 0.000 description 13
- 229910017604 nitric acid Inorganic materials 0.000 description 13
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 13
- 238000011156 evaluation Methods 0.000 description 12
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 10
- 229910010413 TiO 2 Inorganic materials 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- YGSFNCRAZOCNDJ-UHFFFAOYSA-N propan-2-one Chemical compound CC(C)=O.CC(C)=O YGSFNCRAZOCNDJ-UHFFFAOYSA-N 0.000 description 9
- IZRJPHXTEXTLHY-UHFFFAOYSA-N triethoxy(2-triethoxysilylethyl)silane Chemical compound CCO[Si](OCC)(OCC)CC[Si](OCC)(OCC)OCC IZRJPHXTEXTLHY-UHFFFAOYSA-N 0.000 description 9
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 238000004132 cross linking Methods 0.000 description 5
- 125000000962 organic group Chemical group 0.000 description 5
- 239000004925 Acrylic resin Substances 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 4
- 125000003545 alkoxy group Chemical group 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000006482 condensation reaction Methods 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000011859 microparticle Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000010955 niobium Substances 0.000 description 3
- 150000004756 silanes Chemical class 0.000 description 3
- 125000001544 thienyl group Chemical group 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 229910018540 Si C Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- AKGGYBADQZYZPD-UHFFFAOYSA-N benzylacetone Chemical compound CC(=O)CCC1=CC=CC=C1 AKGGYBADQZYZPD-UHFFFAOYSA-N 0.000 description 2
- 239000000306 component Substances 0.000 description 2
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 2
- HVQAJTFOCKOKIN-UHFFFAOYSA-N flavonol Chemical compound O1C2=CC=CC=C2C(=O)C(O)=C1C1=CC=CC=C1 HVQAJTFOCKOKIN-UHFFFAOYSA-N 0.000 description 2
- 125000002541 furyl group Chemical group 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000011344 liquid material Substances 0.000 description 2
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 2
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000013557 residual solvent Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- JWRQFDQQDBJDHD-UHFFFAOYSA-N tributoxyindigane Chemical compound CCCCO[In](OCCCC)OCCCC JWRQFDQQDBJDHD-UHFFFAOYSA-N 0.000 description 2
- TVQSAEOXFNDKAG-UHFFFAOYSA-N 1,1,1-trifluoro-4-phenylbutan-2-one Chemical compound FC(F)(F)C(=O)CCC1=CC=CC=C1 TVQSAEOXFNDKAG-UHFFFAOYSA-N 0.000 description 1
- CGNOLOFDLUCENT-UHFFFAOYSA-N 1,1,1-trifluoro-4-thiophen-2-ylbutan-2-one Chemical compound FC(F)(F)C(=O)CCC1=CC=CS1 CGNOLOFDLUCENT-UHFFFAOYSA-N 0.000 description 1
- FHUDAMLDXFJHJE-UHFFFAOYSA-N 1,1,1-trifluoropropan-2-one Chemical compound CC(=O)C(F)(F)F FHUDAMLDXFJHJE-UHFFFAOYSA-N 0.000 description 1
- WHFQWQIDXMOZBD-UHFFFAOYSA-N 1,6-naphthyridin-8-ol Chemical compound C1=CN=C2C(O)=CN=CC2=C1 WHFQWQIDXMOZBD-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- YXAOOTNFFAQIPZ-UHFFFAOYSA-N 1-nitrosonaphthalen-2-ol Chemical compound C1=CC=CC2=C(N=O)C(O)=CC=C21 YXAOOTNFFAQIPZ-UHFFFAOYSA-N 0.000 description 1
- BSZXAFXFTLXUFV-UHFFFAOYSA-N 1-phenylethylbenzene Chemical compound C=1C=CC=CC=1C(C)C1=CC=CC=C1 BSZXAFXFTLXUFV-UHFFFAOYSA-N 0.000 description 1
- NSPLFNGUPLZYHV-UHFFFAOYSA-N 1h-1,5-naphthyridin-4-one Chemical compound C1=CN=C2C(O)=CC=NC2=C1 NSPLFNGUPLZYHV-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- MIKPJAXJXDOMAQ-UHFFFAOYSA-N 2-(3-methylphenyl)-1,10-phenanthroline Chemical compound Cc1cccc(c1)-c1ccc2ccc3cccnc3c2n1 MIKPJAXJXDOMAQ-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- LQZDYPHFVGRHKD-UHFFFAOYSA-N 2-methyl-1,10-phenanthroline Chemical compound C1=CN=C2C3=NC(C)=CC=C3C=CC2=C1 LQZDYPHFVGRHKD-UHFFFAOYSA-N 0.000 description 1
- SYUYTOYKQOAVDW-UHFFFAOYSA-N 2-nitrosonaphthalen-1-ol Chemical compound C1=CC=C2C(O)=C(N=O)C=CC2=C1 SYUYTOYKQOAVDW-UHFFFAOYSA-N 0.000 description 1
- QLPKTAFPRRIFQX-UHFFFAOYSA-N 2-thiophen-2-ylpyridine Chemical compound C1=CSC(C=2N=CC=CC=2)=C1 QLPKTAFPRRIFQX-UHFFFAOYSA-N 0.000 description 1
- CPBJMKMKNCRKQB-UHFFFAOYSA-N 3,3-bis(4-hydroxy-3-methylphenyl)-2-benzofuran-1-one Chemical compound C1=C(O)C(C)=CC(C2(C3=CC=CC=C3C(=O)O2)C=2C=C(C)C(O)=CC=2)=C1 CPBJMKMKNCRKQB-UHFFFAOYSA-N 0.000 description 1
- XNDZQQSKSQTQQD-UHFFFAOYSA-N 3-methylcyclohex-2-en-1-ol Chemical compound CC1=CC(O)CCC1 XNDZQQSKSQTQQD-UHFFFAOYSA-N 0.000 description 1
- LDMRLRNXHLPZJN-UHFFFAOYSA-N 3-propoxypropan-1-ol Chemical compound CCCOCCCO LDMRLRNXHLPZJN-UHFFFAOYSA-N 0.000 description 1
- JIVLDFFWTQYGSR-UHFFFAOYSA-N 4,7-dimethyl-[1,10]phenanthroline Chemical compound C1=CC2=C(C)C=CN=C2C2=C1C(C)=CC=N2 JIVLDFFWTQYGSR-UHFFFAOYSA-N 0.000 description 1
- DHDHJYNTEFLIHY-UHFFFAOYSA-N 4,7-diphenyl-1,10-phenanthroline Chemical compound C1=CC=CC=C1C1=CC=NC2=C1C=CC1=C(C=3C=CC=CC=3)C=CN=C21 DHDHJYNTEFLIHY-UHFFFAOYSA-N 0.000 description 1
- RJNYNDHYSJRRDW-UHFFFAOYSA-N 4-(pyridin-2-yldiazenyl)benzene-1,3-diol Chemical compound OC1=CC(O)=CC=C1N=NC1=CC=CC=N1 RJNYNDHYSJRRDW-UHFFFAOYSA-N 0.000 description 1
- IYBLVRRCNVHZQJ-UHFFFAOYSA-N 5-Hydroxyflavone Chemical compound C=1C(=O)C=2C(O)=CC=CC=2OC=1C1=CC=CC=C1 IYBLVRRCNVHZQJ-UHFFFAOYSA-N 0.000 description 1
- GWKGPQCKIBRXGW-UHFFFAOYSA-N 5-bromo-1,10-phenanthroline Chemical compound C1=CC=C2C(Br)=CC3=CC=CN=C3C2=N1 GWKGPQCKIBRXGW-UHFFFAOYSA-N 0.000 description 1
- XDUUQOQFSWSZSM-UHFFFAOYSA-N 5-chloro-1,10-phenanthroline Chemical compound C1=CC=C2C(Cl)=CC3=CC=CN=C3C2=N1 XDUUQOQFSWSZSM-UHFFFAOYSA-N 0.000 description 1
- PDDBTWXLNJNICS-UHFFFAOYSA-N 5-nitro-1,10-phenanthroline Chemical compound C1=CC=C2C([N+](=O)[O-])=CC3=CC=CN=C3C2=N1 PDDBTWXLNJNICS-UHFFFAOYSA-N 0.000 description 1
- QQEQHUHZBMUJET-UHFFFAOYSA-N 5-phenyl-1,10-phenanthroline Chemical compound C1=CC=CC=C1C1=CC2=CC=CN=C2C2=NC=CC=C12 QQEQHUHZBMUJET-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical group [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- VTUQISVBYRDYAW-UHFFFAOYSA-N 7h-1,7-naphthyridin-8-one Chemical compound C1=CN=C2C(=O)NC=CC2=C1 VTUQISVBYRDYAW-UHFFFAOYSA-N 0.000 description 1
- ROFVEXUMMXZLPA-UHFFFAOYSA-N Bipyridyl Chemical compound N1=CC=CC=C1C1=CC=CC=N1 ROFVEXUMMXZLPA-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- HXAKKKPVGZOTNH-UHFFFAOYSA-N C(C)O[Si](CC(CCCC)[Si](OCC)(OCC)OCC)(OCC)OCC Chemical compound C(C)O[Si](CC(CCCC)[Si](OCC)(OCC)OCC)(OCC)OCC HXAKKKPVGZOTNH-UHFFFAOYSA-N 0.000 description 1
- OWWWZPXQZXZHBU-UHFFFAOYSA-N COC(C([O-])(OC)OC)OC.[Ti+4].COC(C([O-])(OC)OC)OC.COC(C([O-])(OC)OC)OC.COC(C([O-])(OC)OC)OC Chemical compound COC(C([O-])(OC)OC)OC.[Ti+4].COC(C([O-])(OC)OC)OC.COC(C([O-])(OC)OC)OC.COC(C([O-])(OC)OC)OC OWWWZPXQZXZHBU-UHFFFAOYSA-N 0.000 description 1
- QQLYURKXFXANGH-UHFFFAOYSA-N COC(C([O-])(OC)OC)OC.[Zr+4].COC(C([O-])(OC)OC)OC.COC(C([O-])(OC)OC)OC.COC(C([O-])(OC)OC)OC Chemical compound COC(C([O-])(OC)OC)OC.[Zr+4].COC(C([O-])(OC)OC)OC.COC(C([O-])(OC)OC)OC.COC(C([O-])(OC)OC)OC QQLYURKXFXANGH-UHFFFAOYSA-N 0.000 description 1
- YXZNGEMYVKORGL-UHFFFAOYSA-N COC(COC([O-])C)(OC)OC.[In+3].COC(COC([O-])C)(OC)OC.COC(COC([O-])C)(OC)OC Chemical compound COC(COC([O-])C)(OC)OC.[In+3].COC(COC([O-])C)(OC)OC.COC(COC([O-])C)(OC)OC YXZNGEMYVKORGL-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- ISZWRZGKEWQACU-UHFFFAOYSA-N Primuletin Natural products OC1=CC=CC(C=2OC3=CC=CC=C3C(=O)C=2)=C1 ISZWRZGKEWQACU-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- DGEZNRSVGBDHLK-UHFFFAOYSA-N [1,10]phenanthroline Chemical compound C1=CN=C2C3=NC=CC=C3C=CC2=C1 DGEZNRSVGBDHLK-UHFFFAOYSA-N 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- SMZOGRDCAXLAAR-UHFFFAOYSA-N aluminium isopropoxide Chemical compound [Al+3].CC(C)[O-].CC(C)[O-].CC(C)[O-] SMZOGRDCAXLAAR-UHFFFAOYSA-N 0.000 description 1
- JPUHCPXFQIXLMW-UHFFFAOYSA-N aluminium triethoxide Chemical compound CCO[Al](OCC)OCC JPUHCPXFQIXLMW-UHFFFAOYSA-N 0.000 description 1
- QYLPHRHGVWWOOP-UHFFFAOYSA-N aluminum 1-(2,2,2-trimethoxyethoxy)ethanolate Chemical compound COC(COC([O-])C)(OC)OC.[Al+3].COC(COC([O-])C)(OC)OC.COC(COC([O-])C)(OC)OC QYLPHRHGVWWOOP-UHFFFAOYSA-N 0.000 description 1
- LBZFVMXEFOGGDT-UHFFFAOYSA-N aluminum 3,3,3-trimethoxypropan-1-olate Chemical compound COC(CC[O-])(OC)OC.[Al+3].COC(CC[O-])(OC)OC.COC(CC[O-])(OC)OC LBZFVMXEFOGGDT-UHFFFAOYSA-N 0.000 description 1
- CQOXUSHAXLMSEN-UHFFFAOYSA-N antimony(3+);propan-1-olate Chemical compound CCCO[Sb](OCCC)OCCC CQOXUSHAXLMSEN-UHFFFAOYSA-N 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 229910052789 astatine Inorganic materials 0.000 description 1
- 238000007611 bar coating method Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 1
- BSDOQSMQCZQLDV-UHFFFAOYSA-N butan-1-olate;zirconium(4+) Chemical compound [Zr+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] BSDOQSMQCZQLDV-UHFFFAOYSA-N 0.000 description 1
- 125000004106 butoxy group Chemical group [*]OC([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 150000001728 carbonyl compounds Chemical class 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- LLYOXZQVOKALCD-UHFFFAOYSA-N chembl1400298 Chemical compound OC1=CC=C2C=CC=CC2=C1N=NC1=CC=CC=N1 LLYOXZQVOKALCD-UHFFFAOYSA-N 0.000 description 1
- DXRWYIKGBIPGAG-UHFFFAOYSA-M chembl2028375 Chemical compound [Na+].[O-][N+](=O)C1=CC=C2C(N=NC3=C4C=CC=CC4=CC=C3O)=C(O)C=C(S([O-])(=O)=O)C2=C1 DXRWYIKGBIPGAG-UHFFFAOYSA-M 0.000 description 1
- HOWITLLZNKSJOJ-UHFFFAOYSA-M chembl471028 Chemical compound [Na+].C1=CC=CC2=C(O)C(N=NC3=C4C=CC=CC4=C(C=C3O)S([O-])(=O)=O)=CC=C21 HOWITLLZNKSJOJ-UHFFFAOYSA-M 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- LMBWSYZSUOEYSN-UHFFFAOYSA-N diethyldithiocarbamic acid Chemical compound CCN(CC)C(S)=S LMBWSYZSUOEYSN-UHFFFAOYSA-N 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- MZGNSEAPZQGJRB-UHFFFAOYSA-N dimethyldithiocarbamic acid Chemical compound CN(C)C(S)=S MZGNSEAPZQGJRB-UHFFFAOYSA-N 0.000 description 1
- JGUQDUKBUKFFRO-CIIODKQPSA-N dimethylglyoxime Chemical compound O/N=C(/C)\C(\C)=N\O JGUQDUKBUKFFRO-CIIODKQPSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- ASBGGHMVAMBCOR-UHFFFAOYSA-N ethanolate;zirconium(4+) Chemical compound [Zr+4].CC[O-].CC[O-].CC[O-].CC[O-] ASBGGHMVAMBCOR-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- XPFVYQJUAUNWIW-UHFFFAOYSA-N furfuryl alcohol Chemical compound OCC1=CC=CO1 XPFVYQJUAUNWIW-UHFFFAOYSA-N 0.000 description 1
- VBZWSGALLODQNC-UHFFFAOYSA-N hexafluoroacetone Chemical compound FC(F)(F)C(=O)C(F)(F)F VBZWSGALLODQNC-UHFFFAOYSA-N 0.000 description 1
- 229940051250 hexylene glycol Drugs 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 150000001261 hydroxy acids Chemical class 0.000 description 1
- CXIAOEXVDRAYBR-UHFFFAOYSA-N indium(3+);propan-1-olate Chemical compound [In+3].CCC[O-].CCC[O-].CCC[O-] CXIAOEXVDRAYBR-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 229910052809 inorganic oxide Inorganic materials 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 125000003253 isopropoxy group Chemical group [H]C([H])([H])C([H])(O*)C([H])([H])[H] 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000003446 ligand Substances 0.000 description 1
- 238000013035 low temperature curing Methods 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- ITNVWQNWHXEMNS-UHFFFAOYSA-N methanolate;titanium(4+) Chemical compound [Ti+4].[O-]C.[O-]C.[O-]C.[O-]C ITNVWQNWHXEMNS-UHFFFAOYSA-N 0.000 description 1
- IKGXNCHYONXJSM-UHFFFAOYSA-N methanolate;zirconium(4+) Chemical compound [Zr+4].[O-]C.[O-]C.[O-]C.[O-]C IKGXNCHYONXJSM-UHFFFAOYSA-N 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- IOJNPSPGHUEJAQ-UHFFFAOYSA-N n,n-dimethyl-4-(pyridin-2-yldiazenyl)aniline Chemical compound C1=CC(N(C)C)=CC=C1N=NC1=CC=CC=N1 IOJNPSPGHUEJAQ-UHFFFAOYSA-N 0.000 description 1
- DAHPIMYBWVSMKQ-UHFFFAOYSA-N n-hydroxy-n-phenylnitrous amide Chemical compound O=NN(O)C1=CC=CC=C1 DAHPIMYBWVSMKQ-UHFFFAOYSA-N 0.000 description 1
- IYRGXJIJGHOCFS-UHFFFAOYSA-N neocuproine Chemical compound C1=C(C)N=C2C3=NC(C)=CC=C3C=CC2=C1 IYRGXJIJGHOCFS-UHFFFAOYSA-N 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- ZTILUDNICMILKJ-UHFFFAOYSA-N niobium(v) ethoxide Chemical compound CCO[Nb](OCC)(OCC)(OCC)OCC ZTILUDNICMILKJ-UHFFFAOYSA-N 0.000 description 1
- UIEQYZNDSLCTMK-UHFFFAOYSA-N octane-4-sulfonic acid Chemical compound CCCCC(S(O)(=O)=O)CCC UIEQYZNDSLCTMK-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000007530 organic bases Chemical class 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- HKJYVRJHDIPMQB-UHFFFAOYSA-N propan-1-olate;titanium(4+) Chemical compound CCCO[Ti](OCCC)(OCCC)OCCC HKJYVRJHDIPMQB-UHFFFAOYSA-N 0.000 description 1
- XPGAWFIWCWKDDL-UHFFFAOYSA-N propan-1-olate;zirconium(4+) Chemical compound [Zr+4].CCC[O-].CCC[O-].CCC[O-].CCC[O-] XPGAWFIWCWKDDL-UHFFFAOYSA-N 0.000 description 1
- ZGSOBQAJAUGRBK-UHFFFAOYSA-N propan-2-olate;zirconium(4+) Chemical compound [Zr+4].CC(C)[O-].CC(C)[O-].CC(C)[O-].CC(C)[O-] ZGSOBQAJAUGRBK-UHFFFAOYSA-N 0.000 description 1
- LOAUVZALPPNFOQ-UHFFFAOYSA-N quinaldic acid Chemical compound C1=CC=CC2=NC(C(=O)O)=CC=C21 LOAUVZALPPNFOQ-UHFFFAOYSA-N 0.000 description 1
- LNNRQIKKDKDFRV-UHFFFAOYSA-N quinazolin-8-ol Chemical compound N1=CN=C2C(O)=CC=CC2=C1 LNNRQIKKDKDFRV-UHFFFAOYSA-N 0.000 description 1
- QRDZFPUVLYEQTA-UHFFFAOYSA-N quinoline-8-carboxylic acid Chemical compound C1=CN=C2C(C(=O)O)=CC=CC2=C1 QRDZFPUVLYEQTA-UHFFFAOYSA-N 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- FDNAPBUWERUEDA-UHFFFAOYSA-N silicon tetrachloride Chemical compound Cl[Si](Cl)(Cl)Cl FDNAPBUWERUEDA-UHFFFAOYSA-N 0.000 description 1
- AMMWFYKTZVIRFN-UHFFFAOYSA-N sodium 3-hydroxy-4-[(1-hydroxynaphthalen-2-yl)diazenyl]-7-nitronaphthalene-1-sulfonic acid Chemical compound [Na+].C1=CC=CC2=C(O)C(N=NC3=C4C=CC(=CC4=C(C=C3O)S(O)(=O)=O)[N+]([O-])=O)=CC=C21 AMMWFYKTZVIRFN-UHFFFAOYSA-N 0.000 description 1
- ZQWICJYATMSSSD-UHFFFAOYSA-N sodium 3-hydroxy-4-[(2-hydroxynaphthalen-1-yl)diazenyl]naphthalene-1-sulfonic acid Chemical compound C1=CC=C2C(=C1)C=CC(=C2N=NC3=C(C=C(C4=CC=CC=C43)S(=O)(=O)O)O)O.[Na+] ZQWICJYATMSSSD-UHFFFAOYSA-N 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- UQMOLLPKNHFRAC-UHFFFAOYSA-N tetrabutyl silicate Chemical compound CCCCO[Si](OCCCC)(OCCCC)OCCCC UQMOLLPKNHFRAC-UHFFFAOYSA-N 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- ZUEKXCXHTXJYAR-UHFFFAOYSA-N tetrapropan-2-yl silicate Chemical compound CC(C)O[Si](OC(C)C)(OC(C)C)OC(C)C ZUEKXCXHTXJYAR-UHFFFAOYSA-N 0.000 description 1
- ZQZCOBSUOFHDEE-UHFFFAOYSA-N tetrapropyl silicate Chemical compound CCCO[Si](OCCC)(OCCC)OCCC ZQZCOBSUOFHDEE-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- JMXKSZRRTHPKDL-UHFFFAOYSA-N titanium ethoxide Chemical compound [Ti+4].CC[O-].CC[O-].CC[O-].CC[O-] JMXKSZRRTHPKDL-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- WOZZOSDBXABUFO-UHFFFAOYSA-N tri(butan-2-yloxy)alumane Chemical compound [Al+3].CCC(C)[O-].CCC(C)[O-].CCC(C)[O-] WOZZOSDBXABUFO-UHFFFAOYSA-N 0.000 description 1
- OVZUSPADPSOQQN-UHFFFAOYSA-N tri(propan-2-yloxy)indigane Chemical compound [In+3].CC(C)[O-].CC(C)[O-].CC(C)[O-] OVZUSPADPSOQQN-UHFFFAOYSA-N 0.000 description 1
- MYWQGROTKMBNKN-UHFFFAOYSA-N tributoxyalumane Chemical compound [Al+3].CCCC[O-].CCCC[O-].CCCC[O-] MYWQGROTKMBNKN-UHFFFAOYSA-N 0.000 description 1
- YGBFTDQFAKDXBZ-UHFFFAOYSA-N tributyl stiborite Chemical compound [Sb+3].CCCC[O-].CCCC[O-].CCCC[O-] YGBFTDQFAKDXBZ-UHFFFAOYSA-N 0.000 description 1
- JDIFXZYFJUPIMZ-UHFFFAOYSA-N triethoxy(1-triethoxysilylbutan-2-yl)silane Chemical compound C(C)C(C[Si](OCC)(OCC)OCC)[Si](OCC)(OCC)OCC JDIFXZYFJUPIMZ-UHFFFAOYSA-N 0.000 description 1
- AHCZTJQUUJBAQD-UHFFFAOYSA-N triethoxy(1-triethoxysilylpentan-2-yl)silane Chemical compound C(C)O[Si](CC(CCC)[Si](OCC)(OCC)OCC)(OCC)OCC AHCZTJQUUJBAQD-UHFFFAOYSA-N 0.000 description 1
- QDRBLVPOSAEDIZ-UHFFFAOYSA-N triethoxy(1-triethoxysilylpropan-2-yl)silane Chemical compound CCO[Si](OCC)(OCC)CC(C)[Si](OCC)(OCC)OCC QDRBLVPOSAEDIZ-UHFFFAOYSA-N 0.000 description 1
- MCXZOLDSEPCWRB-UHFFFAOYSA-N triethoxyindigane Chemical compound [In+3].CC[O-].CC[O-].CC[O-] MCXZOLDSEPCWRB-UHFFFAOYSA-N 0.000 description 1
- JGOJQVLHSPGMOC-UHFFFAOYSA-N triethyl stiborite Chemical compound [Sb+3].CC[O-].CC[O-].CC[O-] JGOJQVLHSPGMOC-UHFFFAOYSA-N 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- WZIPPVNMUYWBSB-UHFFFAOYSA-N trimethoxy(1-trimethoxysilylbutan-2-yl)silane Chemical compound CO[Si](CC(CC)[Si](OC)(OC)OC)(OC)OC WZIPPVNMUYWBSB-UHFFFAOYSA-N 0.000 description 1
- PPEDCOMMBRYYNK-UHFFFAOYSA-N trimethoxy(1-trimethoxysilylhexan-2-yl)silane Chemical compound CCCCC([Si](OC)(OC)OC)C[Si](OC)(OC)OC PPEDCOMMBRYYNK-UHFFFAOYSA-N 0.000 description 1
- XUENPBLFIMZKLJ-UHFFFAOYSA-N trimethoxy(1-trimethoxysilylpentan-2-yl)silane Chemical compound CO[Si](CC(CCC)[Si](OC)(OC)OC)(OC)OC XUENPBLFIMZKLJ-UHFFFAOYSA-N 0.000 description 1
- OKMFHWDLPIWPOX-UHFFFAOYSA-N trimethoxy(1-trimethoxysilylpropan-2-yl)silane Chemical compound CO[Si](OC)(OC)CC(C)[Si](OC)(OC)OC OKMFHWDLPIWPOX-UHFFFAOYSA-N 0.000 description 1
- JCGDCINCKDQXDX-UHFFFAOYSA-N trimethoxy(2-trimethoxysilylethyl)silane Chemical compound CO[Si](OC)(OC)CC[Si](OC)(OC)OC JCGDCINCKDQXDX-UHFFFAOYSA-N 0.000 description 1
- UAEJRRZPRZCUBE-UHFFFAOYSA-N trimethoxyalumane Chemical compound [Al+3].[O-]C.[O-]C.[O-]C UAEJRRZPRZCUBE-UHFFFAOYSA-N 0.000 description 1
- FGPUIKFYWJXRBX-UHFFFAOYSA-N trimethoxyindigane Chemical compound [In+3].[O-]C.[O-]C.[O-]C FGPUIKFYWJXRBX-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- KEUYHGXCOWNTEJ-UHFFFAOYSA-N trimethyl stiborite Chemical compound [Sb+3].[O-]C.[O-]C.[O-]C KEUYHGXCOWNTEJ-UHFFFAOYSA-N 0.000 description 1
- OPSWAWSNPREEFQ-UHFFFAOYSA-K triphenoxyalumane Chemical compound [Al+3].[O-]C1=CC=CC=C1.[O-]C1=CC=CC=C1.[O-]C1=CC=CC=C1 OPSWAWSNPREEFQ-UHFFFAOYSA-K 0.000 description 1
- HYPTXUAFIRUIRD-UHFFFAOYSA-N tripropan-2-yl stiborite Chemical compound [Sb+3].CC(C)[O-].CC(C)[O-].CC(C)[O-] HYPTXUAFIRUIRD-UHFFFAOYSA-N 0.000 description 1
- OBROYCQXICMORW-UHFFFAOYSA-N tripropoxyalumane Chemical compound [Al+3].CCC[O-].CCC[O-].CCC[O-] OBROYCQXICMORW-UHFFFAOYSA-N 0.000 description 1
- IUGZSDKTVZEUQC-UHFFFAOYSA-N tris(2,2,2-trimethoxyethoxy)alumane Chemical compound [Al+3].COC(C[O-])(OC)OC.COC(C[O-])(OC)OC.COC(C[O-])(OC)OC IUGZSDKTVZEUQC-UHFFFAOYSA-N 0.000 description 1
- FAYGNZXEDQOKET-UHFFFAOYSA-N tris(2,2,2-trimethoxyethoxy)indigane Chemical compound [In+3].COC(C[O-])(OC)OC.COC(C[O-])(OC)OC.COC(C[O-])(OC)OC FAYGNZXEDQOKET-UHFFFAOYSA-N 0.000 description 1
- DAOVYDBYKGXFOB-UHFFFAOYSA-N tris(2-methylpropoxy)alumane Chemical compound [Al+3].CC(C)C[O-].CC(C)C[O-].CC(C)C[O-] DAOVYDBYKGXFOB-UHFFFAOYSA-N 0.000 description 1
- OLQVWIBENITYPO-UHFFFAOYSA-N tris(2-methylpropoxy)indigane Chemical compound [In+3].CC(C)C[O-].CC(C)C[O-].CC(C)C[O-] OLQVWIBENITYPO-UHFFFAOYSA-N 0.000 description 1
- MOOXOWAGPRNWEG-UHFFFAOYSA-N tris(2-methylpropyl) stiborite Chemical compound CC(C)CO[Sb](OCC(C)C)OCC(C)C MOOXOWAGPRNWEG-UHFFFAOYSA-N 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/02—Emulsion paints including aerosols
- C09D5/024—Emulsion paints including aerosols characterised by the additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
- C08G77/08—Preparatory processes characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Dispersion Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Paints Or Removers (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Laminated Bodies (AREA)
Abstract
本發明之被膜形成用塗布液之特徵在於:其係將能夠與金屬烷氧化物形成螯合物之有機化合物(A成分)、下述式(2)所表示之6官能矽烷化合物及其水解縮合物中之至少一者(B成分)、及下述式(3)所表示之金屬烷氧化物及其水解縮合物中之至少一者(C成分)溶解或分散於包含有機溶劑之混合溶劑中而成,且A成分之莫耳數(M1)與C成分之莫耳數(M3)之莫耳比(M1/M3)為0.25以上且未達2之範圍,B成分之莫耳數(M2)與C成分之莫耳數(M3)之莫耳比(M2/M3)為0.5以上且8以下之範圍。 The coating liquid for film formation of the present invention is characterized in that it is an organic compound capable of forming a chelate with a metal alkoxide (component A), a hexafunctional silane compound represented by the following formula (2), and its hydrolysis condensation At least one of the substance (component B) and at least one of the metal alkoxide represented by the following formula (3) and its hydrolysis condensate (component C) are dissolved or dispersed in a mixed solvent containing an organic solvent The molar ratio (M1/M3) of the molar number of component A (M1) and the molar number of component C (M3) (M1/M3) is 0.25 or more and not within the range of 2, and the molar number of component B (M2) The molar ratio (M2/M3) between the molar number (M3) of the component C and the molar ratio is in the range of 0.5 or more and 8 or less.
(式(2)、(3)如說明書所記載) (Equations (2) and (3) are as described in the manual)
Description
本發明係關於一種用於觸控面板等顯示元件之領域之被膜形成用塗布液、被膜形成用塗布液之製造方法及附被膜之基材。 The present invention relates to a coating liquid for forming a coating film, a method for producing a coating liquid for forming a coating film, and a substrate with a coating film used in the field of display elements such as touch panels.
習知,於觸控面板等顯示元件中,存在ITO(Indium Tin Oxide)配線圖案被視認而使顯示性降低之問題。因此,提出有藉由折射率匹配(Index Matching)使配線圖案難以看清之技術。例如,已知有藉由濺鍍等導入高折射率薄膜層(IM層)之技術。另一方面,亦存在欲藉由利用相對低價且耐久性較高之無機系塗布液材料所獲得之透明性被膜而形成IM層之需求。 Conventionally, in display elements such as touch panels, there is a problem that ITO (Indium Tin Oxide) wiring patterns are recognized and displayability is reduced. Therefore, a technique has been proposed to make the wiring pattern difficult to see through index matching. For example, a technique of introducing a high refractive index thin film layer (IM layer) by sputtering or the like is known. On the other hand, there is also a need to form an IM layer by using a transparent film obtained from a relatively inexpensive and high-durability inorganic coating liquid material.
又,於觸控面板等顯示元件中,通常藉由樹脂材料之塗布而被覆金屬配線等。然而,於將無機系塗布液材料塗布於此種樹脂上之情形時,存在容易產生龜裂,視情形而成為顯示元件之不良之原因之問題。 In addition, in display elements such as touch panels, metal wiring and the like are usually coated by coating a resin material. However, when an inorganic coating liquid material is applied to such a resin, there is a problem that cracks are easily generated, which may cause defects of the display element depending on the situation.
又,用於觸控面板等顯示元件之被膜就防止搬送步驟中之損 傷之觀點而言,除要求硬度以外,亦要求對用於將金屬等之配線圖案化時之蝕刻液之耐化學品性。進而,用於觸控面板等顯示元件之被膜由於對周邊構件之影響,而亦要求於300℃以下進行燒成。 In addition, the coating used for display elements such as touch panels prevents damage during the transport step. From the point of view of injury, in addition to hardness, chemical resistance to etching solutions used to pattern wiring of metals and the like is also required. Furthermore, coatings used for display elements such as touch panels are also required to be fired at 300°C or lower due to the influence on peripheral components.
相對於此,已知:若使用含有乙醯丙酮螯合物化合物、矽烷化合物、及除矽以外之金屬烷氧化物之塗布液,則藉由於乾燥時或乾燥後進行紫外線照射,可於相對較低之溫度下硬化,形成耐久性優異之透明陶瓷被膜(參照文獻1:日本特開平2-48403號公報)。又,已知:若使用含有甲基三甲氧基矽烷(MTMS)等所例示之金屬烷氧化物、硝酸鋁九水合物等所例示之金屬鹽、及防析出劑等之塗布液,則電極之圖案醒目之情況得以抑制,具有較高之強度,即使於塗布於樹脂上之情形時,亦可形成可防止龜裂之產生之塗布膜(參照文獻2:WO2012/099253)。 In contrast to this, it is known that if a coating solution containing an acetone chelate compound, a silane compound, and a metal alkoxide other than silicon is used, it can be relatively compared by irradiating ultraviolet rays during or after drying. It is cured at a low temperature to form a transparent ceramic film with excellent durability (refer to Document 1: Japanese Patent Application Laid-Open No. 2-48403). In addition, it is known that if a coating solution containing metal alkoxides such as methyltrimethoxysilane (MTMS), etc., and metal salts such as aluminum nitrate nonahydrate, and a precipitation inhibitor, etc., is used, the electrode The eye-catching pattern is suppressed, and it has high strength. Even when it is coated on the resin, it can form a coating film that can prevent the occurrence of cracks (refer to Document 2: WO2012/099253).
另一方面,文獻1所揭示之塗布液雖然可提供於相對較低之溫度下硬化之透明被膜,但是產生如下問題:例如於底層為樹脂之情形時,較難抑制龜裂之產生。又,關於透明被膜之硬度或耐化學品性,亦未必可謂充分。又,文獻2所揭示之塗布液由於使用具有非鍵結性官能基之MTMS等所例示之金屬烷氧化物,故而於低溫下進行燒成之情形時,被膜之交聯度變得相對較低,耐化學品性不充分。 On the other hand, although the coating liquid disclosed in Document 1 can provide a transparent film that is cured at a relatively low temperature, it has the following problem: for example, when the base layer is resin, it is difficult to suppress the occurrence of cracks. In addition, the hardness or chemical resistance of the transparent film may not necessarily be sufficient. In addition, the coating solution disclosed in Document 2 uses the metal alkoxides exemplified by MTMS having non-bonding functional groups, so when firing at low temperature, the degree of crosslinking of the film becomes relatively low , Insufficient chemical resistance.
本發明之目的在於提供一種塗布於基材後具有充分之硬度且難以產生龜裂,進而耐化學品性亦優異之被膜形成用塗布液、被膜形成用塗布液之製造方法及附被膜之基材。 The object of the present invention is to provide a coating liquid for forming a film, a method for producing a coating liquid for forming a film, and a substrate with a film, which has sufficient hardness after being applied to a substrate and is difficult to generate cracks, and has excellent chemical resistance .
本發明人等為了解決上述問題而潛心研究,結果發現,若使用能夠與金屬烷氧化物形成螯合物之有機化合物、特定之6官能矽烷化合物及金屬烷氧化物(但不包括矽烷氧化物)溶解或分散於由水及有機溶劑所構成之混合溶劑中而成之塗布液,則獲得具有充分之硬度且難以產生龜裂,進而耐化學品性亦優異之被膜。本發明係基於該見解而完成者。 In order to solve the above-mentioned problems, the inventors have made painstaking research and found that if organic compounds that can form chelate with metal alkoxides, specific 6-functional silane compounds and metal alkoxides (but not silanoxides) are used A coating liquid that is dissolved or dispersed in a mixed solvent composed of water and an organic solvent can obtain a coating film that has sufficient hardness, is hard to crack, and has excellent chemical resistance. The present invention was completed based on this knowledge.
即,本發明提供如下被膜形成用塗布液、被膜形成用塗布液之製造方法及附被膜之基材。 That is, the present invention provides the following coating liquid for film formation, a method for producing a coating liquid for film formation, and a substrate with a film.
又,本發明提供如下被膜形成用塗布液,其係於不將高折射率粒子摻合於被膜形成用塗布液中之情況下可形成高折射率(折射率1.3~2.3)之被膜。 In addition, the present invention provides a coating liquid for forming a film, which can form a film with a high refractive index (refractive index 1.3 to 2.3) without mixing high refractive index particles in the coating liquid for forming a film.
〔1〕一種被膜形成用塗布液,其係將能夠與金屬烷氧化物形成螯合物之有機化合物(A成分)、下述式(2)所表示之6官能矽烷化合物及其水解縮合物中之至少一者(B成分)、及下述式(3)所表示之金屬烷氧化物及其水解縮合物中之至少一者(C成分)溶解或分散於含有水及有機溶劑之混合溶劑中而成,且A成分之莫耳數(M1)與C成分之莫耳數(M3)之莫耳比(M1/M3)為0.25以上且未達2之範圍,B成分之莫耳數(M2)與C成分之莫耳數(M3)之莫耳比(M2/M3)為0.5以上且8以下之範圍。 [1] A coating liquid for forming a film, which is an organic compound capable of forming a chelate with a metal alkoxide (component A), a 6-functional silane compound represented by the following formula (2) and its hydrolysis condensate At least one of (component B) and at least one of the metal alkoxide represented by the following formula (3) and its hydrolysis condensate (component C) is dissolved or dispersed in a mixed solvent containing water and an organic solvent The molar ratio (M1/M3) of the molar number of component A (M1) and the molar number of component C (M3) (M1/M3) is 0.25 or more and not within the range of 2, and the molar number of component B (M2) The molar ratio (M2/M3) between the molar number (M3) of the component C and the molar ratio is in the range of 0.5 or more and 8 or less.
(R3係碳數2~6之伸烷基。R4~R9係碳數1至8之未經取代或經取代之烷氧基、未經取代或經取代之芳氧基、乙烯氧基、羥基、氫原子、及鹵 素原子之任一者,既可相同,亦可不同)。 (R 3 is an alkylene group with 2 to 6 carbons. R 4 to R 9 is an unsubstituted or substituted alkoxy group with a carbon number of 1 to 8, unsubstituted or substituted aryloxy, ethylene oxide Any of the group, the hydroxyl group, the hydrogen atom, and the halogen atom may be the same or different).
M(OR10)n (3) M(OR 10 ) n (3)
(M係選自Be、Al、Sc、Ti、V、Cr、Fe、Ni、Zn、Ga、Ge、As、Se、Y、Zr、Nb、In、Sn、Sb、Te、Hf、Ta、W、Pb、Bi、Ce、及Cu之1種之元素,R10係碳數1至10之未經取代或經取代之烷基。N係與M之原子價相同之整數)。 (M is selected from Be, Al, Sc, Ti, V, Cr, Fe, Ni, Zn, Ga, Ge, As, Se, Y, Zr, Nb, In, Sn, Sb, Te, Hf, Ta, W , Pb, Bi, Ce, and Cu, R 10 is an unsubstituted or substituted alkyl group with 1 to 10 carbon atoms. N is an integer with the same valence as M).
〔2〕如上述〔1〕之被膜形成用塗布液,於該被膜形成用塗布液中,源自B成分之SiO2換算濃度(濃度C2)為0.005~12質量%之範圍,源自C成分之MOX換算濃度(濃度C3)為0.02~14質量%之範圍,濃度C2與濃度C3之合計(濃度CT)為0.1~15質量%之範圍。 [2] The coating liquid for film formation as in [1] above, in which the SiO 2 conversion concentration derived from component B (concentration C2) is in the range of 0.005 to 12% by mass, derived from component C The converted concentration of MO X (concentration C3) is in the range of 0.02-14% by mass, and the total of concentration C2 and concentration C3 (concentration CT) is in the range of 0.1-15% by mass.
〔3〕如上述〔1〕或〔2〕之被膜形成用塗布液,其進而含有下述式(4)所表示之4官能矽烷化合物及其水解縮合物中之至少一者(D成分),D成分之莫耳數(M4)相對於B成分之莫耳數(M2)之莫耳比(M4/M2)之值為0.01以上且0.5以下之範圍。 [3] The coating liquid for forming a film as described in [1] or [2], which further contains at least one of the tetrafunctional silane compound represented by the following formula (4) and its hydrolysis condensate (component D), The molar ratio (M4/M2) of the molar number (M4) of the component D to the molar ratio (M2) of the component B is in the range of 0.01 or more and 0.5 or less.
Si(R11)4 (4) Si(R 11 ) 4 (4)
(R11係碳數1至8之未經取代或經取代之烷氧基、未經取代或經取代之芳氧基、乙烯氧基、羥基、氫原子、及鹵素原子之任一者,既可相同,亦可不同)。 (R 11 is any one of an unsubstituted or substituted alkoxy group having 1 to 8 carbon atoms, an unsubstituted or substituted aryloxy group, a vinyloxy group, a hydroxyl group, a hydrogen atom, and a halogen atom, both Can be the same or different).
〔4〕如上述〔3〕之被膜形成用塗布液,於該被膜形成用塗布液中,源自B成分之SiO2換算濃度(濃度C2)為0.005~12質量%,源自C成分之MOX換算濃度(濃度C3)為0.02~14質量%,源自D成分之SiO2換算濃度(濃度C4)為12質量%以下,且濃度C2、濃度C3及濃度C4之 合計(濃度CT)為0.1~15質量%。 [4] The coating liquid for film formation as in [3] above, in which the SiO 2 conversion concentration derived from component B (concentration C2) is 0.005-12% by mass, and the MO derived from component C X conversion concentration (concentration C3) is 0.02-14% by mass, SiO 2 conversion concentration (concentration C4) derived from component D is 12% by mass or less, and the total of concentration C2, concentration C3, and concentration C4 (concentration CT) is 0.1 ~15% by mass.
〔5〕如上述〔1〕至〔4〕中任一項之被膜形成用塗布液,其有機溶劑之沸點為120℃以上,20℃之黏度為1~400mPa‧s之範圍內。 [5] The coating liquid for forming a film as in any one of [1] to [4] above, the boiling point of the organic solvent is 120°C or higher, and the viscosity at 20°C is in the range of 1 to 400 mPa·s.
〔6〕一種被膜形成用塗布液之製造方法,係上述〔1〕至〔5〕中任一項之被膜形成用塗布液之製造方法,並實施以下之預備步驟1、預備步驟2、及正式步驟。 [6] A method for manufacturing a coating liquid for film formation, which is the method for manufacturing a coating liquid for film formation in any one of [1] to [5] above, and implements the following preliminary steps 1, preliminary steps 2, and formal step.
預備步驟1:摻合有機溶劑、水、B成分(式(2)所表示之6官能矽烷化合物)、及水解觸媒,製備6官能矽烷溶液之步驟(其中,B成分之摻合量相對於預備步驟2中之C成分金屬1莫耳,為0.5莫耳以上且8莫耳以下之範圍); 預備步驟2:摻合有機溶劑、A成分、及C成分(式(3)所表示之金屬烷氧化物),製備金屬烷氧化物溶液之步驟(其中,A成分之摻合量相對於C成分金屬1莫耳,為0.25莫耳以上且未達2莫耳之範圍); 正式步驟:於藉由預備步驟1所獲得之6官能矽烷溶液中添加由預備步驟2所獲得之金屬烷氧化物溶液,繼而添加水,於5℃以上且40℃以下之溫度下進行攪拌混合之步驟 Preliminary step 1: Blending organic solvent, water, component B (hexafunctional silane compound represented by formula (2)), and hydrolysis catalyst to prepare a hexafunctional silane solution (wherein, the blending amount of component B is relative to 1 mol of C component metal in preliminary step 2 is in the range of 0.5 mol or more and 8 mol or less); Preliminary step 2: Blending organic solvent, component A, and component C (metal alkoxide represented by formula (3)) to prepare a metal alkoxide solution (wherein, the blending amount of component A is relative to component C 1 mol of metal, which is above 0.25 mol and less than the range of 2 mol); Formal step: Add the metal alkoxide solution obtained in the preliminary step 2 to the 6-functional silane solution obtained in the preliminary step 1, and then add water, stir and mix at a temperature above 5°C and below 40°C step
(R3係碳數2~6之伸烷基。R4~R9係碳數1至8之未經取代或經取代之烷氧基、未經取代或經取代之芳氧基、乙烯氧基、羥基、氫原子、及鹵素原子之任一者,既可相同,亦可不同)。 (R 3 is an alkylene group with 2 to 6 carbons. R 4 to R 9 is an unsubstituted or substituted alkoxy group with a carbon number of 1 to 8, unsubstituted or substituted aryloxy, ethylene oxide Any of the group, the hydroxyl group, the hydrogen atom, and the halogen atom may be the same or different).
M(OR10)n (3) M(OR 10 ) n (3)
(M係選自Be、Al、Sc、Ti、V、Cr、Fe、Ni、Zn、Ga、Ge、As、Se、Y、Zr、Nb、In、Sn、Sb、Te、Hf、Ta、W、Pb、Bi、Ce、及Cu之1種之元素。R10係碳數1至10之未經取代或經取代之烷基。n係與M之原子價相同之整數)。 (M is selected from Be, Al, Sc, Ti, V, Cr, Fe, Ni, Zn, Ga, Ge, As, Se, Y, Zr, Nb, In, Sn, Sb, Te, Hf, Ta, W , Pb, Bi, Ce, and Cu. R 10 is an unsubstituted or substituted alkyl with 1 to 10 carbon atoms. n is an integer with the same valence of M).
〔7〕如上述〔6〕之被膜形成用塗布液之製造方法,其中,水解及縮合後之B成分之重量平均分子量(聚苯乙烯換算)為300以上且3000以下之範圍。 [7] The method for producing a coating liquid for forming a film as described in [6] above, wherein the weight average molecular weight (in terms of polystyrene) of the component B after the hydrolysis and condensation is in the range of 300 or more and 3000 or less.
〔8〕如上述〔6〕或〔7〕之被膜形成用塗布液之製造方法,其中,於預備步驟1中,進而添加上述〔3〕中之D成分(式(4)所表示之4官能矽烷化合物),且D成分之莫耳數(M4)相對於B成分之莫耳數(M2)之莫耳比(M4/M2)為0.01以上且0.5以下之範圍。 [8] The method for producing a coating liquid for forming a film as described in [6] or [7], wherein in the preliminary step 1, the component D in the above [3] (the tetrafunctional represented by the formula (4) is added Silane compound), and the molar ratio (M4/M2) of the molar number (M4) of the component D to the molar number (M2) of the component B is in the range of 0.01 to 0.5.
〔9〕如上述〔6〕或〔7〕之被膜形成用塗布液之製造方法,其於正式步驟中,進行B成分與C成分之共水解及縮合反應。 [9] The method for producing a coating liquid for forming a film as described in [6] or [7], in which the co-hydrolysis and condensation reaction of component B and component C are carried out in the main step.
〔10〕如上述〔8〕之被膜形成用塗布液之製造方法,其於正式步驟中,進行B成分、C成分、及D成分之共水解及縮合反應。 [10] The method for producing a coating liquid for forming a film as in [8] above, in which the co-hydrolysis and condensation reactions of the B component, the C component, and the D component are carried out in the main step.
〔11〕一種附被膜之基材,其係將上述〔1〕至〔5〕中任一項之被膜形成用塗布液塗布於基材而成。 [11] A substrate with a film, which is obtained by applying the coating liquid for forming a film of any one of [1] to [5] above to a substrate.
〔12〕如上述〔11〕之附被膜之基材,其被膜之平均膜厚為20nm以上且200nm以下。 [12] The substrate with a film as in [11] above, the average thickness of the film is 20 nm or more and 200 nm or less.
〔13〕如上述〔11〕或〔12〕之附被膜之基材之製造方法,其特徵在於實施以下之成膜步驟1至成膜步驟4。 [13] The method for producing a substrate with a film as described in [11] or [12], characterized in that the following film-forming step 1 to film-forming step 4 are carried out.
成膜步驟1:將被膜形成用塗布液塗布於基材之步驟 Film formation step 1: The step of applying the coating liquid for film formation to the substrate
成膜步驟2:繼成膜步驟1後,將基材於80℃以上且150℃以下進行加熱並乾燥之步驟 Film formation step 2: Following the film formation step 1, the step of heating and drying the substrate at a temperature above 80°C and below 150°C
成膜步驟3:繼成膜步驟2後,對形成於基材上之塗布膜照射紫外線之步驟 Film-forming step 3: Following film-forming step 2, the step of irradiating the coating film formed on the substrate with ultraviolet rays
成膜步驟4:繼成膜步驟3後,將形成於基材上之塗布膜於80℃以上且300℃以下進行加熱之步驟 Film-forming step 4: Following film-forming step 3, the step of heating the coating film formed on the substrate at a temperature above 80°C and below 300°C
〔14〕如上述〔13〕之附被膜之基材之製造方法,其特徵在於:紫外線包含波長254nm之紫外線及波長365nm之紫外線中至少任一者。 [14] The method for manufacturing a substrate with a film as described in [13] above, wherein the ultraviolet rays include at least one of ultraviolet rays with a wavelength of 254 nm and ultraviolet rays with a wavelength of 365 nm.
根據本發明,可提供一種塗布於基材後具有充分之硬度,且難以產生龜裂,進而耐化學品性亦優異之被膜形成用塗布液、被膜形成用塗布液之製造方法及附被膜之基材。 According to the present invention, it is possible to provide a coating liquid for forming a film, a method for producing a coating liquid for forming a film, and a base with a film, which have sufficient hardness after being applied to a substrate, are hard to crack, and are also excellent in chemical resistance. material.
更詳細而言,本發明之被膜形成用塗布液可形成一種藉由UV處理及在80~300℃之相對較低之溫度下之加熱處理而表現充分之硬度與耐擦傷性等,且顯示高折射率(折射率1.3~2.3)之被膜。 In more detail, the coating liquid for forming a film of the present invention can form a coating solution that exhibits sufficient hardness and scratch resistance by UV treatment and heat treatment at a relatively low temperature of 80 to 300°C, and exhibits high Refractive index (refractive index 1.3~2.3) coating.
根據本發明之附被膜之基材之製造方法,可形成一種即使對於耐熱性較差之基材亦表現充分之硬度與耐擦傷性等之被膜。 According to the method for producing a substrate with a film of the present invention, a film that exhibits sufficient hardness and scratch resistance even for a substrate with poor heat resistance can be formed.
本發明之附被膜之基材可適宜地用於液晶顯示裝置之電極基板與配向膜之間所使用之絕緣膜、觸控面板之電極上之保護膜等。 The substrate with a film of the present invention can be suitably used for insulating films used between electrode substrates and alignment films of liquid crystal display devices, protective films on electrodes of touch panels, and the like.
以下,關於本發明之被膜形成用塗布液、被膜形成用塗布液之製造方法、附被膜之基材及附被膜之基材之製造方法,對一實施形態詳細地進行說明。 Hereinafter, an embodiment of the coating liquid for film formation, the method for producing the coating liquid for film formation, the base material with a film, and the method for producing the base material with a film of the present invention will be described in detail.
〔被膜形成用塗布液〕 〔Coating liquid for film formation〕
本實施形態中之被膜形成用塗布液(以下亦僅稱為「本塗布液」)係將能夠與金屬烷氧化物形成螯合物之有機化合物(A成分)、上述式(2)所表示之6官能矽烷化合物及其水解縮合物中之至少任一者(B成分)、以及上述式(3)所表示之金屬烷氧化物及其水解縮合物中之至少一者(C成分)溶解或分散於含有水及有機溶劑之混合溶劑中而成者。 The coating liquid for film formation in this embodiment (hereinafter also simply referred to as "this coating liquid") is an organic compound capable of forming a chelate with a metal alkoxide (component A), represented by the above formula (2) At least one of the hexafunctional silane compound and its hydrolysis condensate (component B), and at least one of the metal alkoxide represented by the above formula (3) and its hydrolysis condensate (component C) is dissolved or dispersed It is made in a mixed solvent containing water and organic solvent.
<A成分> <A component>
本塗布液中之A成分係能夠與金屬烷氧化物形成螯合物之有機化合物。 The A component in the coating solution is an organic compound capable of forming a chelate with metal alkoxide.
作為能夠與金屬烷氧化物形成螯合物之有機化合物,例如可列舉:乙醯丙酮、三氟乙醯丙酮、六氟乙醯丙酮、苯甲醯丙酮、苯甲醯三氟丙酮、二苯甲醯甲烷、呋喃甲醯基丙酮、三氟呋喃甲醯基丙酮、苯甲醯呋喃甲醯基甲烷、噻吩甲醯基丙酮、三氟噻吩甲醯基丙酮、呋喃甲醯基噻吩甲醯基丙酮、奧辛、2-甲基奧辛、4-甲基奧辛、5-甲基奧辛、6-甲基奧辛、7-甲基奧辛、奧辛-5-磺酸、7-碘奧辛-5-磺酸、喹啉-2-羧酸、喹啉-8-羧酸、8-羥基啉、4-羥基-1,5-萘啶、8-羥基-1,6-萘啶、8-羥基-1,7-萘啶、5-羥基喹啉、8-羥基喹唑啉、2,2'-聯吡啶、2-(2'-噻吩基)吡啶、1,10-啡啉、2-甲 基-1,10-啡啉、5-甲基-1,10-啡啉、2,9-二甲基-1,10-啡啉、4,7-二甲基-1,10-啡啉、5-氯-1,10-啡啉、6-溴-1,10-啡啉、5-硝基-1,10-啡啉、5-苯基-1,10-啡啉、4,7-二苯基-1,10-啡啉、二甲基乙二肟、二甲基乙二肟-o-甲酯、二甲基二硫代胺基甲酸、二乙基二硫代胺基甲酸、N-亞硝基苯基羥胺、1-亞硝基-2-萘酚、2-亞硝基-1-萘酚、3-羥基黃酮、5-羥基黃酮、1-(2-吡啶基偶氮)-2-萘酚、4-(2-吡啶基偶氮)間苯二酚、2-(4'-二甲胺基苯基偶氮)吡啶、鉻黑A、鉻黑T、鉻藍黑B、鉻藍黑R、鄰甲酚酞絡合劑、烷醇胺、及羥酸等。 Examples of organic compounds capable of forming a chelate with metal alkoxides include: acetone, trifluoroacetone, hexafluoroacetone, benzylacetone, benzyltrifluoroacetone, and benzhydryl Methane, furanomethanyl acetone, trifluorofuranomethanoyl acetone, benzofuranmethanoyl acetone, thienyl acetone, trifluorothenyl acetone, furanoyl thienyl acetone, Ocine, 2-methyloxycine, 4-methyloxycine, 5-methyloxycine, 6-methyloxycine, 7-methyloxycine, Ocine-5-sulfonic acid, 7-iodooxycine Octane-5-sulfonic acid, quinoline-2-carboxylic acid, quinoline-8-carboxylic acid, 8-hydroxyl Phytoline, 4-hydroxy-1,5-naphthyridine, 8-hydroxy-1,6-naphthyridine, 8-hydroxy-1,7-naphthyridine, 5-hydroxyquine Morpholine, 8-hydroxyquinazoline, 2,2'-bipyridine, 2-(2'-thienyl)pyridine, 1,10-phenanthroline, 2-methyl-1,10-phenanthroline, 5-methyl Phenyl-1,10-phenanthroline, 2,9-dimethyl-1,10-phenanthroline, 4,7-dimethyl-1,10-phenanthroline, 5-chloro-1,10-phenanthroline, 6-bromo-1,10-phenanthroline, 5-nitro-1,10-phenanthroline, 5-phenyl-1,10-phenanthroline, 4,7-diphenyl-1,10-phenanthroline, Dimethylglyoxime, dimethylglyoxime-o-methyl, dimethyldithiocarbamic acid, diethyldithiocarbamic acid, N-nitrosophenylhydroxylamine, 1- Nitroso-2-naphthol, 2-nitroso-1-naphthol, 3-hydroxyflavone, 5-hydroxyflavone, 1-(2-pyridylazo)-2-naphthol, 4-(2 -Pyridylazo) resorcinol, 2-(4'-dimethylaminophenylazo)pyridine, chrome black A, chrome black T, chrome blue black B, chrome blue black R, o-cresolphthalein complex Mixture, alkanolamine, and hydroxy acid, etc.
作為A成分,尤佳為具有2個以上之下述式(1)所表示之羰基之羰基化合物。 As the A component, a carbonyl compound having two or more carbonyl groups represented by the following formula (1) is particularly preferable.
於上述式(1)中,R1係碳數1~10之有機基。R2係碳數1~10之有機基或羥基。 In the above formula (1), R 1 is an organic group with 1 to 10 carbon atoms. R 2 is an organic group or hydroxyl group with 1 to 10 carbon atoms.
作為R1,例如可列舉:甲基、乙基、異丙基、苯基、呋喃基、噻吩基、三氟甲基、甲氧基、及乙氧基等。作為R1,尤佳為甲基、乙基、及乙氧基。 Examples of R 1 include methyl, ethyl, isopropyl, phenyl, furyl, thienyl, trifluoromethyl, methoxy, and ethoxy. As R 1 , methyl, ethyl, and ethoxy are particularly preferred.
R2中,作為有機基,例如可列舉:甲基、乙基、異丙基、苯基、呋喃基、噻吩基、三氟基、甲氧基、及乙氧基等。 In R 2 , examples of the organic group include methyl, ethyl, isopropyl, phenyl, furyl, thienyl, trifluoro, methoxy, and ethoxy.
作為A成分,可使用1種亦可將任意之2種以上混合使用,但就作為螯合劑之效果之觀點而言,尤佳為使用乙醯丙酮。 As the A component, one type may be used or two or more arbitrary types may be mixed and used, but from the viewpoint of the effect as a chelating agent, it is particularly preferable to use acetone.
<B成分> <B component>
本塗布液中之B成分係下述式(2)所表示之6官能矽烷化合物及其水 解縮合物之至少任一者。於本塗布液中,藉由摻合B成分,塗布膜之耐龜裂性得以提高,並且耐化學品性或絕緣性亦提高。 The B component in this coating liquid is the 6-functional silane compound represented by the following formula (2) and its water At least any one of decondensates. In this coating solution, by blending component B, the crack resistance of the coating film is improved, and the chemical resistance or insulation is also improved.
此處,R3係碳數2~6之伸烷基。又,R4~R9係碳數1至8之未經取代或經取代之烷氧基、未經取代或經取代之芳氧基、乙烯氧基、羥基、氫原子、及鹵素原子之任一者,既可相同,亦可不同。 Here, R 3 is an alkylene group having 2 to 6 carbon atoms. In addition, R 4 to R 9 are any of unsubstituted or substituted alkoxy groups having 1 to 8 carbon atoms, unsubstituted or substituted aryloxy groups, vinyloxy groups, hydroxyl groups, hydrogen atoms, and halogen atoms One can be the same or different.
作為此種6官能矽烷化合物,例如可適宜地列舉:1,2-雙(三乙氧基矽基)乙烷((C2H5O)3-Si-C2H4-Si(OC2H5)3)、1,2-雙(三乙氧基矽基)丙烷、1,2-雙(三乙氧基矽基)丁烷、1,2-雙(三乙氧基矽基)戊烷、1,2-雙(三乙氧基矽基)己烷、1,2-雙(三甲氧基矽基)乙烷、1,2-雙(三甲氧基矽基)丙烷、1,2-雙(三甲氧基矽基)丁烷、1,2-雙(三甲氧基矽基)戊烷、及1,2-雙(三甲氧基矽基)己烷等。該等既可使用1種,亦可將任意之2種以上混合使用。若R3為過長之長鏈則有難以獲得充分之硬度之虞,因此,作為伸烷基,較佳為碳數2以上且6以下者。又,若R4~R9互不相同,則水解速度產生差異,難以產生均一之反應。因此,作為B成分,較佳為使用(C2H5O)3-Si-C2H4-Si(OC2H5)3。 As such a hexafunctional silane compound, for example, 1,2-bis(triethoxysilyl)ethane ((C 2 H 5 O) 3 -Si-C 2 H 4 -Si(OC 2 H 5 ) 3 ), 1,2-bis(triethoxysilyl)propane, 1,2-bis(triethoxysilyl)butane, 1,2-bis(triethoxysilyl) Pentane, 1,2-bis(triethoxysilyl)hexane, 1,2-bis(trimethoxysilyl)ethane, 1,2-bis(trimethoxysilyl)propane, 1, 2-bis(trimethoxysilyl)butane, 1,2-bis(trimethoxysilyl)pentane, and 1,2-bis(trimethoxysilyl)hexane, etc. One of these may be used, or any two or more of them may be mixed and used. If R 3 is a long chain that is too long, it may be difficult to obtain sufficient hardness. Therefore, as the alkylene group, a carbon number of 2 or more and 6 or less is preferable. In addition, if R 4 to R 9 are different from each other, the hydrolysis rate will be different, making it difficult to produce a uniform reaction. Therefore, as the B component, (C 2 H 5 O) 3 -Si-C 2 H 4 -Si(OC 2 H 5 ) 3 is preferably used.
又,水解縮合後之B成分之重量平均分子量(聚苯乙烯換算)就耐龜裂性之觀點而言較佳為300以上且3000以下之範圍。此處,重量平均分子量係藉由GPC(Gel Permeation Chromatography,凝膠滲透層析法)而求得。 In addition, the weight average molecular weight (in terms of polystyrene) of the component B after the hydrolysis condensation is preferably in the range of 300 or more and 3000 or less from the viewpoint of crack resistance. Here, the weight average molecular weight is obtained by GPC (Gel Permeation Chromatography).
如上述般,於本塗布液中,藉由摻合B成分(6官能矽烷化合物),而塗布膜(被膜)之耐龜裂性得以提高。其可認為係由6官能矽烷化合物所具有之有機基(伸烷基)之存在會對被膜賦予可撓性,進而提高與供被膜形成之基材(有機材料)之潤濕性所得者。又,即使於該有機基藉由成膜步驟中之紫外線照射而一部分或全部分解之情形時,由於在緩和應力集中之指向上發揮作用,故而認為其亦有助於耐龜裂性之提高。又,由於與MTMS(甲基三甲氧基矽烷)等具有取代烷基之矽烷化合物不同,在不降低被膜之交聯度之情況下可實現緻密,故而耐化學品性提高。 As described above, by blending component B (a hexafunctional silane compound) in this coating solution, the crack resistance of the coating film (film) is improved. It can be considered that the presence of the organic group (alkylene group) possessed by the 6-functional silane compound imparts flexibility to the film, thereby improving the wettability of the substrate (organic material) for film formation. In addition, even when the organic group is partially or completely decomposed by ultraviolet irradiation in the film forming step, it plays a role in alleviating stress concentration, so it is considered that it also contributes to the improvement of crack resistance. In addition, since it is different from silane compounds having substituted alkyl groups such as MTMS (methyltrimethoxysilane), it can achieve compactness without reducing the degree of crosslinking of the film, thereby improving chemical resistance.
進而,於本發明之被膜形成用塗布液之製造方法中,較理想為使B成分(6官能矽烷化合物)低聚物化(重量平均分子量(聚苯乙烯換算)300以上且3000以下)後再與C成分(金屬烷氧化物及其水解縮合物中之至少一者)進行共水解縮合,如此所獲得之共水解縮合物緻密,耐龜裂性優異。 Furthermore, in the method for producing the coating liquid for film formation of the present invention, it is preferable to oligomerize component B (hexafunctional silane compound) (weight average molecular weight (in terms of polystyrene) 300 or more and 3000 or less) and then The component C (at least one of the metal alkoxide and its hydrolysis condensate) undergoes co-hydrolysis condensation, and the co-hydrolysis condensate thus obtained is dense and has excellent crack resistance.
<C成分> <C component>
本塗布液中之C成分係下述式(3)所表示之金屬烷氧化物及其水解縮合物之至少任一者。 The C component in this coating liquid is at least any one of the metal alkoxide represented by the following formula (3) and its hydrolysis condensate.
M(OR10)n (3) M(OR 10 ) n (3)
此處,R10係碳數1至10之未經取代或經取代之烷基。M係金屬元素。n係與M之原子價相同之整數。 Here, R 10 is an unsubstituted or substituted alkyl group having 1 to 10 carbon atoms. M series metal element. n is an integer with the same valence as M.
此處,作為金屬元素M,選擇Si以外之金屬元素。具體而言,金屬元素M可使用選自Be、Al、Sc、Ti、V、Cr、Fe、Ni、Zn、Ga、Ge、As、Se、Y、Zr、Nb、In、Sn、Sb、Te、Hf、Ta、W、Pb、Bi、Ce及 Cu之至少1種元素。 Here, as the metal element M, a metal element other than Si is selected. Specifically, the metal element M can be selected from Be, Al, Sc, Ti, V, Cr, Fe, Ni, Zn, Ga, Ge, As, Se, Y, Zr, Nb, In, Sn, Sb, Te , Hf, Ta, W, Pb, Bi, Ce and At least one element of Cu.
作為C成分之金屬烷氧化物,例如可較佳地列舉:三甲醇鋁、三乙醇鋁、三丙醇鋁、三異丙醇鋁、三正丁醇鋁、三異丁醇鋁、三第三丁醇鋁、三戊醇鋁、三己醇鋁、三辛醇鋁、三苄醇鋁、三苯氧化鋁、三甲氧基乙醇鋁、三甲氧基乙氧基乙醇鋁、三甲氧基丙醇鋁、四甲醇鈦、四乙醇鈦、四丙醇鈦、四異丙醇鈦、四甲氧基乙醇鈦、四丁醇鈦、四甲醇鋯、四乙醇鋯、四丙醇鋯、四異丙醇鋯、四甲氧基乙醇鋯、丁醇氧化鋯、五乙醇鈮、三甲醇銦、三乙醇銦、三丙醇銦、三異丙醇銦、三正丁醇銦、三異丁醇銦、三第三丁醇銦、三戊醇銦、三己醇銦、三辛醇銦、三苄醇銦、三苯氧化銦、三甲氧基乙醇銦、三甲氧基乙氧基乙醇銦、三甲氧基丙醇銦、三甲醇銻、三乙醇銻、三丙醇銻、三異丙醇銻、三正丁醇銻、及三異丁醇銻等。該等既可使用1種,亦可將任意之2種以上混合而使用,但就水解速度適當,且入手容易之觀點而言,較佳為使用四異丙醇鈦。 As the metal alkoxide of the component C, for example, aluminum trimethoxide, aluminum triethoxide, aluminum tripropoxide, aluminum triisopropoxide, aluminum tri-n-butoxide, aluminum triisobutoxide, tri-trimethoxide Aluminum butoxide, aluminum tripentoxide, aluminum trihexanoxide, aluminum trioctoxide, aluminum tribenzyloxide, aluminum triphenoxide, aluminum trimethoxyethoxide, aluminum trimethoxyethoxyethoxide, aluminum trimethoxypropoxide , Titanium tetramethoxide, titanium tetraethoxide, titanium tetrapropoxide, titanium tetraisopropoxide, titanium tetramethoxyethoxide, titanium tetrabutoxide, zirconium tetramethoxide, zirconium tetraethoxide, zirconium tetrapropoxide, zirconium tetraisopropoxide , Zirconium tetramethoxyethoxide, zirconium butoxide, niobium pentaethoxide, indium trimethoxide, indium triethoxide, indium tripropoxide, indium triisopropoxide, indium tri-n-butoxide, indium triisobutoxide, third Indium tributoxide, indium tripentoxide, indium trihexanoxide, indium trioctoxide, indium tribenzyloxide, indium triphenyl oxide, indium trimethoxyethoxide, indium trimethoxyethoxyethoxide, trimethoxypropanol Indium, antimony trimethoxide, antimony triethoxide, antimony tripropoxide, antimony triisopropoxide, antimony tri-n-butoxide, and antimony triisobutoxide, etc. These may be used alone or in combination of any two or more of them, but from the viewpoint of proper hydrolysis rate and ease of acquisition, it is preferable to use titanium tetraisopropoxide.
<混合溶劑> <Mixed solvent>
作為本塗布液中之混合溶劑,使用水及有機溶劑之混合溶劑。混合之有機溶劑中至少1種較佳為沸點為120℃以上。其中,較佳為沸點為300℃以下。又,於20℃之有機溶劑之黏度較佳為1~400mPa‧s之範圍,更佳為20~350mPa‧s之範圍。 As the mixed solvent in this coating liquid, a mixed solvent of water and organic solvent is used. At least one of the mixed organic solvents preferably has a boiling point of 120°C or higher. Among them, the boiling point is preferably 300°C or lower. Furthermore, the viscosity of the organic solvent at 20°C is preferably in the range of 1~400mPa‧s, more preferably in the range of 20~350mPa‧s.
作為有機溶劑,例如可較佳地列舉:甲醇、乙醇、異丙醇、丁醇、二丙酮醇、呋喃甲醇、乙二醇、己二醇等醇類;乙酸甲酯、乙酸乙酯等酯類;二乙醚、乙二醇單甲醚、乙二醇單乙醚、二乙二醇單甲醚、二乙二醇單乙醚、二乙二醇單丁醚、丙二醇單甲醚、丙二醇單丙醚等醚類; 丙酮、及甲基乙基酮等酮類等。該等既可使用1種,亦可將任意之2種以上混合使用。 As the organic solvent, for example, alcohols such as methanol, ethanol, isopropanol, butanol, diacetone alcohol, furanmethanol, ethylene glycol, and hexylene glycol; and esters such as methyl acetate and ethyl acetate can be mentioned. ; Diethyl ether, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monopropyl ether, etc. Ethers Acetone, methyl ethyl ketone and other ketones. One of these may be used, or any two or more of them may be mixed and used.
再者,作為本塗布液中之該有機溶劑,能夠與金屬烷氧化物形成螯合物之有機化合物(A成分)除外。 In addition, as this organic solvent in this coating liquid, the organic compound (A component) which can form a chelate compound with a metal alkoxide is excluded.
<D成分> <D component>
又,於本塗布液中,作為D成分,亦可進而摻合下述式(4)所表示之4官能矽烷化合物及其水解縮合物中之至少一者。 In addition, in this coating liquid, as the D component, at least one of the tetrafunctional silane compound represented by the following formula (4) and its hydrolysis condensate may be further blended.
Si(R11)4 (4) Si(R 11 ) 4 (4)
此處,R11係碳數1至8之未經取代或經取代之烷氧基、未經取代或經取代之芳氧基、乙烯氧基、羥基、氫原子、及鹵素原子之任一者,既可相同,亦可不同。 Here, R 11 is any one of an unsubstituted or substituted alkoxy group having 1 to 8 carbon atoms, an unsubstituted or substituted aryloxy group, a vinyloxy group, a hydroxyl group, a hydrogen atom, and a halogen atom , Can be the same or different.
作為碳數1至8之未經取代之烷氧基,可列舉:甲氧基、乙氧基、異丙氧基、及丁氧基等。同樣地,作為經取代之烷氧基,可列舉將未經取代之烷氧基之氫原子取代為甲基、乙基等而成之基。作為芳氧基,可列舉苯氧基、及萘氧基等。作為鹵素原子,可列舉氟原子、氯原子、溴原子、及碘原子等。 Examples of the unsubstituted alkoxy group having 1 to 8 carbon atoms include a methoxy group, an ethoxy group, an isopropoxy group, and a butoxy group. Similarly, as a substituted alkoxy group, the group which substituted the hydrogen atom of an unsubstituted alkoxy group with a methyl group, an ethyl group, etc. can be mentioned. As an aryloxy group, a phenoxy group, a naphthoxy group, etc. are mentioned. As a halogen atom, a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, etc. are mentioned.
藉由進而摻合D成分,可進一步提高塗布膜之硬度。 By further blending component D, the hardness of the coating film can be further increased.
作為D成分之4官能矽烷化合物,例如可列舉:四甲氧基矽烷、四乙氧基矽烷、四丙氧基矽烷、四異丙氧基矽烷、四丁氧基矽烷四氯矽烷、及三甲氧基矽烷等。作為D成分,尤佳為四乙氧基矽烷。 As the tetrafunctional silane compound of component D, for example, tetramethoxysilane, tetraethoxysilane, tetrapropoxysilane, tetraisopropoxysilane, tetrabutoxysilane, tetrachlorosilane, and trimethoxysilane can be cited Base silane and so on. As the D component, tetraethoxysilane is particularly preferred.
D成分可僅使用1種,亦可任意地將2種以上混合使用。 D component may use only 1 type, and may mix and use 2 or more types arbitrarily.
<本塗布液中之各成分之摻合比例> <The blending ratio of each component in this coating solution>
於本塗布液中,A成分之莫耳數(M1)與C成分之莫耳數(M3)之莫耳比(M1/M3)必須為0.25以上且未達2之範圍,較佳為0.5以上且1以下之範圍。此處,即使於A成分或C成分發生水解之情形時,M1或M2亦為以水解前之結構為基準之值。 In this coating liquid, the molar ratio (M1/M3) of the molar number of component A (M1) and the molar number of component C (M3) (M1/M3) must be 0.25 or more and not within the range of 2, preferably 0.5 or more And the range below 1. Here, even when the A component or the C component is hydrolyzed, M1 or M2 is a value based on the structure before hydrolysis.
若莫耳比(M1/M3)為2以上,則有A成分會配位於C成分中之OR10部之大半部分,而抑制B成分與C成分之反應之虞,因此,於膜硬化時,有變得難以形成-M-O-Si-之交聯,所獲得之被膜之硬度變得不充分之虞。又,亦有殘存於被膜中之A成分之量增加,膜之表面電阻值等電氣特性發生經時變化,可靠性降低之虞。 If the molar ratio (M1/M3) is 2 or more, the A component will be located in most of the OR 10 part of the C component, and the reaction between the B component and the C component may be inhibited. Therefore, when the film hardens, It may become difficult to form -MO-Si- crosslinks, and the hardness of the obtained film may become insufficient. In addition, the amount of the A component remaining in the film may increase, and electrical characteristics such as the surface resistance of the film may change with time, and reliability may decrease.
又,於莫耳比(M1/M3)未達0.25之情形時,由於C成分之反應之進行變得過度,故而塗布液中之水解縮合物之穩定性變差,塗布液壽命變短,因此有對所獲得之被膜之耐龜裂性產生惡劣影響之虞。 In addition, when the molar ratio (M1/M3) is less than 0.25, the reaction of component C becomes excessive, so the stability of the hydrolyzed condensate in the coating solution deteriorates and the life of the coating solution is shortened. It may have a bad influence on the crack resistance of the obtained film.
又,源自B成分之SiO2換算濃度(濃度C2)較佳為0.005~12質量%,更佳為0.01~8質量%。若濃度C2為0.005質量%以上,則水解反應更順利地進行,於形成被膜之情形時,可充分地提高耐龜裂性。又,若濃度C2為12質量%以下,則水解反應既不會過度進行,又可獲得穩定之塗布液。 In addition, the SiO 2 conversion concentration (concentration C2) derived from the B component is preferably 0.005 to 12% by mass, more preferably 0.01 to 8% by mass. If the concentration C2 is 0.005 mass% or more, the hydrolysis reaction proceeds more smoothly, and when the film is formed, the crack resistance can be sufficiently improved. In addition, if the concentration C2 is 12% by mass or less, the hydrolysis reaction does not proceed excessively, and a stable coating liquid can be obtained.
源自C成分之SiO2換算濃度(濃度C3)較佳為0.02~14質量%,更佳為0.04~9.5質量%。若濃度C3為0.02質量%以上,則水解反應更順利地進行,於形成被膜之情形時,可充分地提高耐龜裂性。又,若濃度C3為14質量%以下,則既不會發生水解反應過度進行之情況,又可獲得穩定之塗布液。 The SiO 2 conversion concentration (concentration C3) derived from the C component is preferably 0.02 to 14% by mass, more preferably 0.04 to 9.5% by mass. If the concentration C3 is 0.02% by mass or more, the hydrolysis reaction proceeds more smoothly, and when a film is formed, the crack resistance can be sufficiently improved. In addition, if the concentration C3 is 14% by mass or less, the hydrolysis reaction does not proceed excessively, and a stable coating liquid can be obtained.
源自D成分之SiO2換算濃度(濃度C4)較佳為0.0001~12質量%,更佳為0.0005~9.5質量%。若濃度C4為0.0001質量%以上,則膜之硬度提高而較佳,若為12質量%以下,則難以引起耐龜裂性之下降而較佳。 The SiO 2 conversion concentration (concentration C4) derived from the D component is preferably 0.0001 to 12% by mass, more preferably 0.0005 to 9.5% by mass. If the concentration C4 is 0.0001% by mass or more, the hardness of the film is improved, and if it is 12% by mass or less, it is less likely to cause a decrease in crack resistance, which is more preferable.
B成分之莫耳數(M2)與C成分之莫耳數(M3)之莫耳比(M2/M3)必須為0.5以上且8以下之範圍,較佳為0.6以上且7.5以下之範圍。此處,即使在B成分或C成分發生水解之情形時,(M2)或(M3)亦為以水解前之結構為基準之值。 The molar ratio (M2/M3) of the molar number of component B (M2) and the molar number of component C (M3) (M2/M3) must be in the range of 0.5 or more and 8 or less, preferably 0.6 or more and 7.5 or less. Here, even when the component B or component C is hydrolyzed, (M2) or (M3) is a value based on the structure before hydrolysis.
若莫耳比(M2/M3)未達0.5,則塗布液之穩定性下降,塗布液壽命亦縮短,故而存在所獲得之被膜之膜厚、折射率、硬度等特性無法固定地獲得之情形,進而亦有耐龜裂性下降之虞。 If the molar ratio (M2/M3) is less than 0.5, the stability of the coating liquid will decrease, and the life of the coating liquid will be shortened. Therefore, the film thickness, refractive index, and hardness of the obtained film may not be fixedly obtained. Furthermore, there is a possibility that the crack resistance may decrease.
若莫耳比(M2/M3)超過8,則有所獲得之被膜之硬度變得不充分,耐龜裂性仍會降低之虞。 If the molar ratio (M2/M3) exceeds 8, the hardness of the obtained film becomes insufficient, and the crack resistance may still decrease.
於本塗布液中,作為濃度C2與濃度C3之合計值之濃度CT(總固形物成分濃度)較佳為0.1~15質量%之範圍,更佳為0.2~10質量%之範圍。若濃度CT為0.1質量%以上,則可將於通常之塗布條件下獲得之膜厚充分地加厚,為了獲得用於表現本發明之效果之膜厚而反覆塗布之必要性亦減少。若濃度CT為15質量%以下,則可將於通常之塗布條件下獲得之膜厚控制為適當之厚度,容易抑制龜裂之發生。又,由於塗布液之穩定性亦變得充分,故而可抑制經時黏度之上升,所獲得之被膜之膜厚、折射率、硬度等特性可穩定地獲得。 In the present coating liquid, the concentration CT (total solid content concentration), which is the total value of the concentration C2 and the concentration C3, is preferably in the range of 0.1 to 15% by mass, and more preferably in the range of 0.2 to 10% by mass. If the concentration CT is 0.1% by mass or more, the film thickness obtained under normal coating conditions can be sufficiently thickened, and the need for repeated coating to obtain the film thickness for expressing the effects of the present invention is also reduced. If the concentration CT is 15% by mass or less, the film thickness obtained under normal coating conditions can be controlled to an appropriate thickness, which can easily suppress the occurrence of cracks. In addition, since the stability of the coating solution is also sufficient, the increase in viscosity over time can be suppressed, and the film thickness, refractive index, and hardness of the obtained film can be stably obtained.
D成分之莫耳數(M4)相對於B成分之莫耳數(M2)之莫 耳比(M4/M2)之值較佳為0.01以上且1以下之範圍,進而較佳為0.01以上且0.5以下之範圍。若莫耳比(M4/M2)為0.01以上,則膜之硬度提高而較佳,若為1以下,則難以引起耐龜裂性之下降而較佳。 The molar number of component D (M4) relative to the molar number of component B (M2) The value of the ear ratio (M4/M2) is preferably in the range of 0.01 or more and 1 or less, and more preferably in the range of 0.01 or more and 0.5 or less. If the molar ratio (M4/M2) is 0.01 or more, the hardness of the film is improved and it is preferable, and if it is 1 or less, it is difficult to cause a decrease in crack resistance, which is preferable.
此處,即使於B成分或D成分發生水解之情形時,(M2)或(M4)亦為以水解前之結構為基準之值。 Here, even when the component B or component D is hydrolyzed, (M2) or (M4) is a value based on the structure before hydrolysis.
於本塗布液中,B成分之一部分與C成分之一部分亦可進行共水解縮合。即,本塗布液亦可含有式(2)所表示之6官能矽烷化合物及其水解縮合物之一部分、與式(3)所表示之金屬烷氧化物及其水解縮合物之一部分的共水解縮合物。 In this coating liquid, a part of the B component and a part of the C component may also undergo co-hydrolysis and condensation. That is, the coating solution may also contain a part of the 6-functional silane compound represented by formula (2) and part of its hydrolysis condensate, and a part of the metal alkoxide represented by formula (3) and part of its hydrolysis condensate. Things.
又,於本塗布液進而含有D成分之情形時,亦可含有式(2)所表示之6官能矽烷化合物及其水解縮合物之一部分、式(3)所表示之金屬烷氧化物及其水解縮合物之一部分、以及式(4)所表示之4官能矽烷化合物及其水解縮合物之一部分的共水解縮合物。 In addition, when the coating solution further contains component D, it may also contain a part of the hexafunctional silane compound represented by formula (2) and its hydrolysis condensate, and the metal alkoxide represented by formula (3) and its hydrolysis A part of the condensate, and a co-hydrolysis condensate of a part of the 4-functional silane compound represented by the formula (4) and a part of the hydrolysis condensate thereof.
於本塗布液中,存在因下述本塗布液之製造步驟而使水解用觸媒殘留0.2質量%左右之情況。作為此種水解觸媒,代表性地可列舉硝酸等。根據本塗布液之應用用途,可視需要去除水解觸媒。作為此種操作,例如可列舉離子交換、中和、蒸餾等。 In this coating liquid, about 0.2% by mass of the hydrolysis catalyst may remain due to the following production steps of this coating liquid. As such a hydrolysis catalyst, nitric acid etc. are mentioned typically. According to the application of the coating liquid, the hydrolysis catalyst can be removed as needed. Examples of such operations include ion exchange, neutralization, and distillation.
再者,於本發明之被膜形成用塗布液中,可於不阻礙其效果之範圍內,添加任意成分。作為此種任意成分之例,可列舉無機氧化物微粒子、有機樹脂微粒子、有機聚矽氧烷樹脂微粒子、顏料、著色材料、抗靜電劑、及界面活性劑等。 Furthermore, in the coating liquid for film formation of this invention, arbitrary components can be added in the range which does not inhibit the effect. Examples of such optional components include inorganic oxide microparticles, organic resin microparticles, organopolysiloxane resin microparticles, pigments, coloring materials, antistatic agents, and surfactants.
由本發明之被膜形成用塗布液所獲得之被膜就視認性之觀 點而言較佳為透明。 The film obtained from the coating liquid for film formation of the present invention has a view of visibility In terms of point, it is preferably transparent.
〔本塗布液之製造方法〕 [Method of manufacturing this coating liquid]
本塗布液之製造方法之特徵在於包括下述預備步驟1、預備步驟2及正式步驟。 The manufacturing method of the coating liquid is characterized by including the following preliminary steps 1, preliminary steps 2, and formal steps.
預備步驟1:摻合有機溶劑、水、B成分(式(2)所表示之6官能矽烷化合物)、及水解觸媒,製備6官能矽烷溶液之步驟(其中,B成分之摻合量相對於預備步驟2中之C成分金屬1莫耳,為0.5莫耳以上且8莫耳以下之範圍) Preliminary step 1: Blending organic solvent, water, component B (hexafunctional silane compound represented by formula (2)), and hydrolysis catalyst to prepare a hexafunctional silane solution (wherein, the blending amount of component B is relative to 1 mol of C component metal in preliminary step 2 is in the range of 0.5 mol or more and 8 mol)
(本申請中,將藉由預備步驟1所製備之含有6官能矽烷化合物及其水解縮合物中之至少一者之溶液稱為「6官能矽烷溶液」) (In this application, the solution containing at least one of the 6-functional silane compound and its hydrolysis condensate prepared by the preliminary step 1 is called "6-functional silane solution")
預備步驟2:摻合有機溶劑、A成分、及C成分(式(3)所表示之金屬烷氧化物),製備金屬烷氧化物溶液之步驟(其中,A成分相對於C成分之金屬元素M 1莫耳,為0.25莫耳以上且未達2莫耳之範圍) Preliminary step 2: Blending organic solvent, component A, and component C (metal alkoxide represented by formula (3)) to prepare a metal alkoxide solution (wherein component A is relative to the metal element M of component C 1 mol, which is more than 0.25 mol and not within the range of 2 mol)
(本申請中,將藉由預備步驟2所製備之含有金屬烷氧化物及其水解縮合物中之至少一者之溶液稱為「金屬烷氧化物溶液」) (In this application, the solution containing at least one of the metal alkoxide and its hydrolysis condensate prepared by the preliminary step 2 is referred to as the "metal alkoxide solution")
正式步驟:於藉由預備步驟1所獲得之6官能矽烷溶液中添加由預備步驟2所獲得之金屬烷氧化物溶液,繼而添加水,於5℃以上且40℃以下之溫度下進行攪拌混合之步驟 Formal step: Add the metal alkoxide solution obtained in the preliminary step 2 to the 6-functional silane solution obtained in the preliminary step 1, and then add water, stir and mix at a temperature above 5°C and below 40°C step
關於上述各步驟,以下詳細地說明較佳之實施態樣。 Regarding the above steps, the preferred implementation aspects are described in detail below.
<預備步驟1> <Preliminary Step 1>
於預備步驟1中,於有機溶劑中,於水及水解用媒之存在下,對於作為B成分之6官能矽烷化合物進行水解縮合,製備6官能矽烷化合物之水 解縮合物分散於混合溶劑中而成之6官能矽烷溶液。 In preliminary step 1, in an organic solvent, in the presence of water and a hydrolysis medium, the hexafunctional silane compound as component B is hydrolyzed and condensed to prepare water of the hexafunctional silane compound The decondensate is dispersed in a mixed solvent to form a 6-functional silane solution.
作為水解觸媒,可使用習知公知之觸媒,作為該例,可例示(a)硝酸、乙酸、鹽酸、硫酸、硝酸、磷酸、氟化氫等無機酸、(b)草酸、順丁烯二酸等羧酸、(c)甲磺酸等磺酸、及(d)酸性或弱酸性之無機鹽等,但不限定於該等。又,亦可任意地將該等之觸媒之複數種混合使用。 As the hydrolysis catalyst, conventionally known catalysts can be used. Examples of this include (a) inorganic acids such as nitric acid, acetic acid, hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, and hydrogen fluoride, and (b) oxalic acid and maleic acid. Such as carboxylic acids, (c) sulfonic acids such as methanesulfonic acid, and (d) acidic or weakly acidic inorganic salts, etc., but are not limited to these. Moreover, it is also possible to arbitrarily mix and use plural kinds of these catalysts.
水解觸媒之量相對於B成分之6官能矽烷化合物(SiO2換算),以外加比例計,較佳為0.001~1莫耳%之範圍內。 The amount of the hydrolysis catalyst is preferably within the range of 0.001 to 1 mol% in terms of an additional ratio relative to the 6-functional silane compound of component B (in terms of SiO 2 ).
水之使用量相對於B成分之6官能矽烷化合物1莫耳(SiO2換算),以外加比例計,較佳為0.5~4莫耳之範圍。若為該莫耳比之範圍,則於有效地推進B成分之6官能矽烷化合物之水解之方面較有效。再者,水之使用量更佳為1~3莫耳之範圍。 The amount of water used is preferably in the range of 0.5-4 mol relative to 1 mol (calculated as SiO 2 ) of the 6-functional silane compound of component B, in addition to the ratio. If it is in the range of the molar ratio, it is more effective in effectively promoting the hydrolysis of the hexafunctional silane compound of the B component. Furthermore, the amount of water used is more preferably in the range of 1 to 3 moles.
B成分之於混合溶劑中之量只要為水解縮合可進行之程度,則並無特別限制,但較佳為0.01~8質量%(SiO2換算)之範圍。 The amount of component B in the mixed solvent is not particularly limited as long as the hydrolysis condensation can proceed, but it is preferably in the range of 0.01 to 8% by mass (in terms of SiO 2 ).
預備步驟1中,通常向有機溶劑中添加水、水解用觸媒、B成分(式(2)所表示之6官能矽烷化合物),於5~40℃下攪拌5~120分鐘,製備6官能矽烷溶液。 In preliminary step 1, usually add water, hydrolysis catalyst and component B (hexafunctional silane compound represented by formula (2)) to an organic solvent, and stir at 5-40°C for 5 to 120 minutes to prepare hexafunctional silane Solution.
再者,於進而摻合D成分之情形時,於該預備步驟1中進行摻合。較佳之摻合量係如上所述。 Furthermore, when the component D is further blended, blending is performed in this preliminary step 1. The preferred blending amount is as described above.
<預備步驟2> <Preliminary Step 2>
預備步驟2中,向有機溶劑中添加A成分與C成分(式(3)所表示之金屬烷氧化物),藉由攪拌,製備包含金屬烷氧化物或其水解縮合物之金屬烷氧化物溶液。較佳之有機溶劑係如上所述。又,作為A成分或C成分之 例,可適宜地列舉上述之各化合物。 In the preliminary step 2, the A component and the C component (metal alkoxide represented by formula (3)) are added to the organic solvent, and a metal alkoxide solution containing the metal alkoxide or its hydrolysis condensate is prepared by stirring . The preferred organic solvent is as described above. Also, as a component of A or C For example, the above-mentioned compounds can be suitably cited.
預備步驟2中之A成分之莫耳數(M1)相對於C成分之莫耳數(M3)之莫耳比(M1/M3)必須為0.25以上且未達2之範圍。於預備步驟2中,A成分配位於C成分之烷氧基,但只要莫耳比(M1/M3)為0.25以上、且未達2之範圍,則未配位於A成分所具有之螯合物配位基之金屬烷氧化物殘存,故而於控制C成分之反應性之方面而言較佳。再者,莫耳比(M1/M3)更佳為0.5以上且1以下之範圍。 The molar ratio (M1/M3) of the molar number of component A (M1) to the molar number (M3) of component C in the preliminary step 2 must be 0.25 or more and not within the range of 2. In preliminary step 2, component A is assigned to the alkoxy group of component C, but as long as the molar ratio (M1/M3) is 0.25 or more and less than the range of 2, it is not assigned to the chelate of component A Since the metal alkoxide of the ligand remains, it is preferable in terms of controlling the reactivity of the C component. Furthermore, the molar ratio (M1/M3) is more preferably in the range of 0.5 or more and 1 or less.
於莫耳比(M1/M3)為2以上之情形時,由於對於金屬烷氧化物之烷氧基之配位過度進行,故而有金屬烷氧化物之穩定化變得過高,亦對與6官能矽烷等之共水解縮合產生影響,變得不適於被膜形成用塗布液之低溫硬化(80~300℃)之虞。 When the molar ratio (M1/M3) is 2 or more, due to the excessive coordination of the alkoxy group of the metal alkoxide, the stabilization of the metal alkoxide becomes too high. Co-hydrolysis and condensation of functional silanes etc. may affect it and may become unsuitable for low-temperature curing (80-300°C) of coating liquids for film formation.
預備步驟2中之C成分之MOX換算濃度較佳為0.04~9.5質量%之範圍。 The MO X converted concentration of component C in the preliminary step 2 is preferably in the range of 0.04 to 9.5% by mass.
藉由預備步驟2所製備之金屬烷氧化物溶液包含配位有A成分之金屬烷氧化物或其水解縮合物。 The metal alkoxide solution prepared by the preliminary step 2 contains a metal alkoxide coordinated with component A or a hydrolysis condensate thereof.
〔正式步驟〕 [Official steps]
於藉由預備步驟1所製備之6官能矽烷溶液中添加由預備步驟2所製備之金屬烷氧化物溶液,繼而添加水,於5~40℃進行攪拌混合,製備本塗布液。 Add the metal alkoxide solution prepared in the preliminary step 2 to the 6-functional silane solution prepared in the preliminary step 1, and then add water, stir and mix at 5-40°C to prepare the coating solution.
此處,B成分之莫耳數(M2)與C成分之莫耳數(M3)較佳為滿足莫耳比(M2/M3)為0.5以上且8以下之範圍。其原因在於:若莫耳比(M2/M3)為該範圍,則共水解反應順利地進行。 Here, the molar number (M2) of the component B and the molar number (M3) of the component C preferably satisfy the range of the molar ratio (M2/M3) of 0.5 or more and 8 or less. The reason is that if the molar ratio (M2/M3) is in this range, the cohydrolysis reaction proceeds smoothly.
藉由上述水之添加,6官能矽烷之水解縮合物與金屬烷氧化物及/或其水解縮合物之共水解縮合反應得以促進,故而可獲得緻密之被膜,因此較佳。 By the addition of the above water, the co-hydrolysis condensation reaction of the hydrolysis condensate of the hexafunctional silane and the metal alkoxide and/or the hydrolysis condensate thereof can be promoted, so a dense film can be obtained, which is preferable.
〔附被膜之基材之製造方法〕 〔Method of manufacturing substrate with film〕
本實施形態之附被膜之基材之製造方法之特徵在於實施以下之成膜步驟1至成膜步驟4。 The method of manufacturing a substrate with a film of this embodiment is characterized in that the following film-forming step 1 to film-forming step 4 are carried out.
成膜步驟1:將本塗布液塗布於基材之步驟 Film formation step 1: The step of applying the coating liquid to the substrate
成膜步驟2:繼上述成膜步驟1後,將上述基材於80℃以上且150℃以下進行加熱並乾燥之步驟 Film-forming step 2: Following the above-mentioned film-forming step 1, the step of heating and drying the substrate at a temperature above 80°C and below 150°C
成膜步驟3:繼上述成膜步驟2後,對上述基材照射紫外線之步驟 Film forming step 3: Following the above film forming step 2, the step of irradiating the substrate with ultraviolet rays
成膜步驟4:繼上述成膜步驟3後,將上述基材於80℃以上且300℃以下進行加熱之步驟 Film-forming step 4: Following the above-mentioned film-forming step 3, the step of heating the above-mentioned substrate at a temperature above 80°C and below 300°C
關於上述各成膜步驟,以下詳細地說明較佳之實施態樣。 Regarding the above-mentioned film forming steps, preferred implementation aspects are described in detail below.
<成膜步驟1> <Film forming step 1>
成膜步驟1中,將本塗布液塗布至基材。作為塗布方法,可採用浸漬法、旋轉塗布法、棒式塗布法、噴霧法、輥式塗布法、軟版印刷法、狹縫式塗布法等習知公知之方法。作為上述基材,例如可列舉玻璃、ITO膜被處理後之基材、使用有聚碳酸酯、丙烯酸樹脂、PET、及TAC等素材之片材、膜、及面板等。 In the film formation step 1, the coating liquid is applied to the substrate. As the coating method, conventionally known methods such as a dipping method, a spin coating method, a bar coating method, a spray method, a roll coating method, a flexographic printing method, and a slit coating method can be used. Examples of the above-mentioned substrate include glass, a substrate processed with an ITO film, and a sheet, film, and panel using materials such as polycarbonate, acrylic resin, PET, and TAC.
<成膜步驟2> <Film forming step 2>
加熱及乾燥之溫度只要在不使基材變質之情況下獲得所需之強度、硬度、耐擦傷性等,則並無特別限制,較佳為80~150℃之範圍,更佳為90 ~140℃之範圍。又,加熱及乾燥較佳為歷時1~10分鐘左右。 The heating and drying temperature is not particularly limited as long as the required strength, hardness, scratch resistance, etc. are obtained without deteriorating the substrate, and it is preferably in the range of 80 to 150°C, more preferably 90 The range of ~140℃. Moreover, it is preferable that heating and drying last about 1-10 minutes.
乾燥與加熱並無明確之界限,只要可獲得具有所需之硬度、強度等之被膜,則可短時間地實施乾燥及加熱,亦可以高於乾燥後之乾燥溫度之溫度下進行加熱。 There is no clear boundary between drying and heating. As long as a film with required hardness and strength can be obtained, drying and heating can be performed in a short time, or heating can be performed at a temperature higher than the drying temperature after drying.
作為乾燥方法或加熱方法,可採用習知公知之方法。又,亦可併用電磁波照射處理。 As the drying method or heating method, a conventionally known method can be used. In addition, electromagnetic wave irradiation treatment may be used in combination.
於乾燥溫度及加熱溫度未達80℃之情形時,因溶劑之殘存或-M-O-M-或-M-O-Si-之交聯不足而無法獲得充分之膜強度,若加熱乾燥溫度超過350℃,則存在B成分之有機基分解,而無法獲得目標膜特性之情況。 When the drying temperature and heating temperature are less than 80°C, sufficient film strength cannot be obtained due to residual solvent or insufficient cross-linking of -MOM- or -MO-Si-. If the heating and drying temperature exceeds 350°C, there will be The organic base of component B is decomposed, and the target film characteristics cannot be obtained.
<成膜步驟3> <Film forming step 3>
成膜步驟3中,繼成膜步驟2後,對加熱乾燥後之被膜照射紫外線(UV)。例如,使用2kw之高壓水銀燈照射3,000mJ/cm2之紫外線。藉由UV照射,於加熱乾燥後之被膜內,產生A成分之脫附,被膜於成膜步驟4中成為容易交聯之狀態。作為紫外線,就殘留溶劑之去除或促進-M-O-M-或-M-O-Si-之交聯之觀點而言,較佳為包含波長254nm之紫外線與波長365nm之紫外線中之至少一者。尤其是,進而較佳為包含波長254nm之紫外線與波長365nm之紫外線兩者。 In the film forming step 3, following the film forming step 2, the heat-dried film is irradiated with ultraviolet (UV). For example, use a 2kw high-pressure mercury lamp to irradiate 3,000mJ/cm 2 of ultraviolet rays. By UV irradiation, the A component is desorbed in the heated and dried film, and the film becomes easily crosslinked in the film formation step 4. As ultraviolet rays, from the viewpoint of removing residual solvent or promoting cross-linking of -MOM- or -MO-Si-, it is preferable to include at least one of ultraviolet rays with a wavelength of 254 nm and ultraviolet rays with a wavelength of 365 nm. In particular, it is more preferable to include both ultraviolet rays with a wavelength of 254 nm and ultraviolet rays with a wavelength of 365 nm.
<成膜步驟4> <Film forming step 4>
繼成膜步驟3後,作為成膜步驟4,將被膜於80~300℃之範圍內進行加熱。藉由該加熱,被膜成為交聯得以充分進行之狀態。若加熱溫度為80~300℃之範圍,則於例如抑制ITO配線之電阻變化之方面較有利。再者,加熱時間較佳為設為1~10分鐘。 Following the film formation step 3, as the film formation step 4, the film is heated in the range of 80 to 300°C. By this heating, the film becomes a state in which crosslinking proceeds sufficiently. If the heating temperature is in the range of 80 to 300°C, it is advantageous, for example, in terms of suppressing the resistance change of the ITO wiring. Furthermore, the heating time is preferably set to 1 to 10 minutes.
〔附被膜之基材〕 〔Substrate with film〕
本實施形態中之附被膜之基材於觸控面板等顯示元件中,可抑制配線可見性,並且鉛筆硬度、耐化學品性及絕緣性較高。又,若使用本實施形態中之被膜形成用塗布液,則幾乎不存在塗布膜之龜裂之發生,能夠於相對較低之溫度下硬化。 The substrate with a film in this embodiment is used in display elements such as touch panels, which can suppress wiring visibility, and has high pencil hardness, chemical resistance, and insulation. In addition, if the coating liquid for forming a film in this embodiment is used, there is almost no occurrence of cracks in the coating film, and it can be cured at a relatively low temperature.
此處,藉由上述成膜步驟獲得之被膜基材中之被膜之平均膜厚(T)較佳20~200nm之範圍,更佳為40~150nm之範圍。 Here, the average film thickness (T) of the film in the film base material obtained by the above-mentioned film forming step is preferably in the range of 20 to 200 nm, more preferably in the range of 40 to 150 nm.
若被膜之平均膜厚(T)為20nm以上,則膜厚充分,因此難以產生無法成膜之部分(塗布不均),成膜後之效果亦可充分獲得。另一方面,若被膜之平均膜厚(T)為200nm以下,則可充分抑制龜裂之產生,又,膜之強度或硬度亦變得充分。 If the average film thickness (T) of the film is 20 nm or more, the film thickness is sufficient, and therefore it is difficult to produce a portion where the film cannot be formed (uneven coating), and the effect after film formation can be sufficiently obtained. On the other hand, if the average film thickness (T) of the film is 200 nm or less, the generation of cracks can be sufficiently suppressed, and the strength and hardness of the film also become sufficient.
本發明之附被膜之基材可適當地用於液晶顯示裝置之電極基板與配向膜之間所使用之絕緣膜、觸控面板之電極上之保護膜等。 The substrate with a coating film of the present invention can be suitably used for an insulating film used between an electrode substrate and an alignment film of a liquid crystal display device, a protective film on an electrode of a touch panel, and the like.
[實施例] [Example]
藉由以下之實施例,就用於形成透明之被膜之塗布液及附被膜之基材進行說明,但本發明並非受該等之實施例限定者。 The following examples are used to describe the coating liquid for forming a transparent film and the substrate with the film, but the present invention is not limited by these examples.
〔實施例1〕 [Example 1]
用於製造被膜形成用塗布液及附被膜之基材之各步驟如下所述。將摻合之各成分之種類及摻合量示於表1中。 The steps for producing the coating liquid for film formation and the substrate with the film are as follows. Table 1 shows the types and amounts of each component blended.
(預備步驟1) (Preliminary Step 1)
將己二醇(和光純藥(股份有限公司)製造)4673.08g、純水214.07g及濃度60質量%之硝酸3.57g進行混合,攪拌5分鐘。接著,一面攪拌一 面添加作為B成分之6官能矽烷化合物之1,2-雙(三乙氧基矽基)乙烷(YAMANAKA HUTECH(股份有限公司)製造:SiO2濃度33.8質量%)1055.55g,攪拌30分鐘,製備固形物成分濃度6.0質量%之預備液1-1。 4,673.08 g of hexanediol (manufactured by Wako Pure Chemical Industries, Ltd.), 214.07 g of pure water, and 3.57 g of nitric acid with a concentration of 60% by mass were mixed and stirred for 5 minutes. Next, while stirring, 1055.55 g of 1,2-bis(triethoxysilyl)ethane (manufactured by YAMANAKA HUTECH (Co., Ltd.): SiO 2 concentration 33.8% by mass), which is a hexafunctional silane compound of component B, is added, The mixture was stirred for 30 minutes to prepare a preparation solution 1-1 with a solid content concentration of 6.0% by mass.
(預備步驟2) (Preliminary Step 2)
將己二醇(和光純藥(股份有限公司)製造)2966.06g、作為A成分之含羰基有機化合物之乙醯丙酮(和光純藥(股份有限公司)製造)148.66g、作為C成分之金屬烷氧化物之ORGATIX TA-10(Matsumoto Fine Chemical(股份有限公司)製造:TiO2濃度28質量%)849.47g進行混合,攪拌5分鐘,製備固形物成分濃度6.0質量%之預備液2-1。 Hexanediol (manufactured by Wako Pure Chemical Industries, Ltd.) 2966.06 g, acetone acetone (manufactured by Wako Pure Chemical Industries, Ltd.) as component A, which is a carbonyl group-containing organic compound, and 148.66 g, as component C metal alkane 849.47 g of ORGATIX TA-10 of oxide (manufactured by Matsumoto Fine Chemical Co., Ltd.: 28% by mass TiO 2 ) was mixed and stirred for 5 minutes to prepare a preparation solution 2-1 with a solid content concentration of 6.0% by mass.
(正式步驟) (Official steps)
一面攪拌,一面於預備液1-1中混合預備液2-1,攪拌10分鐘後,加入純水49.55g,於5℃攪拌144小時。攪拌結束後,藉由0.2μm之過濾器進行過濾,去除凝聚物等,製備總固形物成分濃度6.0質量%之被膜形成用塗布液(1)。 While stirring, the preparation liquid 2-1 was mixed with the preparation liquid 1-1, and after stirring for 10 minutes, 49.55 g of pure water was added, and the mixture was stirred at 5°C for 144 hours. After the stirring was completed, filtration was performed with a 0.2 μm filter to remove aggregates and the like to prepare a coating solution (1) for film formation with a total solid content concentration of 6.0% by mass.
(附被膜之基材(1)之製造) (Manufacturing of base material (1) with film)
利用軟版印刷法將被膜形成用塗布液(1)塗布於附ITO膜之玻璃基板(AGC Fabritech(股份有限公司)製造,厚度:1.1mm)上,於90℃乾燥5分鐘,其次照射波長365nm之紫外線(3000mJ/cm2)與波長254nm之紫外線(2000mJ/cm2)後,於230℃加熱30分鐘,製備附被膜之基材(1-1)。 The coating solution for film formation (1) was coated on a glass substrate with ITO film (manufactured by AGC Fabritech (Co., Ltd.), thickness: 1.1mm) by a flexible printing method, dried at 90°C for 5 minutes, and the irradiation wavelength was 365nm. After the ultraviolet light (3000mJ/cm 2 ) and the ultraviolet light (2000mJ/cm 2 ) with a wavelength of 254nm (2000mJ/cm 2 ), heat at 230°C for 30 minutes to prepare a substrate (1-1) with a film.
針對於所獲得之附被膜之基材(1-1),藉由以下之方法測定膜厚、鉛筆硬度、表面電阻、耐化學品性。將結果示於表1中。 With respect to the obtained substrate (1-1) with a film, the film thickness, pencil hardness, surface resistance, and chemical resistance were measured by the following methods. The results are shown in Table 1.
另外,將2μm之丙烯酸樹脂層形成於附氧化矽膜之玻璃基 板(AGC Fabritech(股份有限公司)製造,厚度:1.1mm)上。丙烯酸樹脂層使用棒式塗布機(No.3)進行塗布,接著於90℃乾燥5分鐘後,於230℃加熱30分鐘。利用軟版印刷法將被膜形成用塗布液(1)塗布於該附丙烯酸樹脂層之玻璃基板上,於90℃乾燥5分鐘,接著照射3000mJ/cm2之紫外線(波長365nm)後,於230℃加熱30分鐘,製備附被膜之基材(1-2)。 In addition, a 2 μm acrylic resin layer was formed on a glass substrate with a silicon oxide film (manufactured by AGC Fabritech Co., Ltd., thickness: 1.1 mm). The acrylic resin layer was applied using a bar coater (No. 3), followed by drying at 90°C for 5 minutes, and then heating at 230°C for 30 minutes. The coating solution for film formation (1) was coated on the glass substrate with acrylic resin layer by a flexible printing method, dried at 90°C for 5 minutes, and then irradiated with 3000mJ/cm 2 of ultraviolet rays (wavelength 365nm) at 230°C Heat for 30 minutes to prepare a substrate (1-2) with a film.
關於所獲得之附被膜之基材(1-2),藉由以下之方法測定耐龜裂性。將結果示於表1中。 Regarding the obtained substrate (1-2) with a film, the crack resistance was measured by the following method. The results are shown in Table 1.
另外,利用軟版印刷法將被膜形成用塗布液(1)塗布於6英吋矽晶圓(松崎製作所(股份有限公司)製造,厚度:0.625mm)上,於90℃乾燥5分鐘,接著照射3000mJ/cm2之紫外線(波長365nm)後,於230℃加熱30分鐘,製備附被膜之基材(1-3)。 In addition, the coating solution for film formation (1) was coated on a 6-inch silicon wafer (manufactured by Matsuzaki Manufacturing Co., Ltd., thickness: 0.625 mm) by a flexible printing method, dried at 90°C for 5 minutes, and then irradiated After 3000mJ/cm 2 of ultraviolet (wavelength: 365nm), heat at 230°C for 30 minutes to prepare a substrate (1-3) with a film.
關於所獲得之附被膜之基材(1-3),藉由以下之方法測定折射率。將結果示於表1中。 Regarding the obtained substrate (1-3) with a film, the refractive index was measured by the following method. The results are shown in Table 1.
〔實施例2〕 [Example 2]
除以下之預備步驟以外,與實施例1同樣地,製備被膜形成用塗布液(2),進而製造附被膜之基材(2-1)~(2-3)。之後,與實施例1同樣地進行評價。 Except for the following preliminary steps, in the same manner as in Example 1, a coating liquid (2) for forming a film was prepared, and further substrates (2-1) to (2-3) with a film were manufactured. After that, evaluation was performed in the same manner as in Example 1.
(預備步驟1) (Preliminary Step 1)
將己二醇(和光純藥(股份有限公司)製造)5841.36g、純水267.58g及濃度60質量%之硝酸4.46g進行混合,攪拌5分鐘。接著,一面攪拌,一面添加作為B成分之6官能矽烷化合物之1,2-雙(三乙氧基矽基)乙烷(YAMANAKA HUTECH(股份有限公司)製造:SiO2濃度33.8質量%)1319.44 g,攪拌30分鐘,製備固形物成分濃度6.0質量%之預備液1-2。 5,841.36 g of hexanediol (manufactured by Wako Pure Chemical Industries, Ltd.), 267.58 g of pure water, and 4.46 g of nitric acid with a concentration of 60% by mass were mixed and stirred for 5 minutes. Next, while stirring, 1,2-bis(triethoxysilyl)ethane (manufactured by YAMANAKA HUTECH (Co., Ltd.): SiO 2 concentration 33.8% by mass), which is the 6-functional silane compound of component B, was added 1319.44 g , Stirred for 30 minutes to prepare a preparation solution 1-2 with a solid content of 6.0% by mass.
(預備步驟2) (Preliminary Step 2)
將己二醇(和光純藥(股份有限公司)製造)1853.78g、作為A成分之含羰基有機化合物之乙醯丙酮(和光純藥(股份有限公司)製造)92.91g、作為C成分之金屬烷氧化物之ORGATIX TA-10(Matsumoto Fine Chemical(股份有限公司)製造:TiO2濃度28質量%)530.92g進行混合,攪拌5分鐘,製備固形物成分濃度6.0質量%之預備液2-2。 Hexanediol (manufactured by Wako Pure Chemical Industries, Ltd.) 1853.78 g, acetone acetone (manufactured by Wako Pure Chemical Industries, Ltd.) as component A, which is a carbonyl-containing organic compound, 92.91 g, and metal alkane as component C 530.92 g of ORGATIX TA-10 (manufactured by Matsumoto Fine Chemical Co., Ltd.: 28% by mass of TiO 2 ) of oxide was mixed and stirred for 5 minutes to prepare preparation 2-2 with a solid content of 6.0% by mass.
〔實施例3〕 [Example 3]
除以下之預備步驟以外,與實施例1同樣地,製備被膜形成用塗布液(3),進而製備附被膜之基材(3-1)~(3-3)。之後,與實施例1同樣地進行評價。 Except for the following preliminary steps, in the same manner as in Example 1, a coating liquid (3) for forming a film was prepared, and further substrates (3-1) to (3-3) with a film were prepared. After that, evaluation was performed in the same manner as in Example 1.
(預備步驟1) (Preliminary Step 1)
將己二醇(和光純藥(股份有限公司)製造)6620.20g、純水303.26g及濃度60質量%之硝酸5.05g進行混合,攪拌5分鐘。接著,一面攪拌,一面添加作為B成分之6官能矽烷化合物之1,2-雙(三乙氧基矽基)乙烷(YAMANAKA HUTECH(股份有限公司)製造:SiO2濃度33.8質量%)1495.36g,攪拌30分鐘,製備固形物成分濃度6.0質量%之預備液1-3。 Hexanediol (manufactured by Wako Pure Chemical Industries, Ltd.), 6620.20 g, 303.26 g of pure water, and 5.05 g of nitric acid with a concentration of 60% by mass were mixed and stirred for 5 minutes. Next, while stirring, 1,2-bis(triethoxysilyl)ethane (manufactured by YAMANAKA HUTECH (Co., Ltd.): SiO 2 concentration 33.8% by mass), which is a 6-functional silane compound of component B, was added 1495.36 g , Stirred for 30 minutes to prepare preparations 1-3 with a solid content concentration of 6.0% by mass.
(預備步驟2) (Preliminary Step 2)
將己二醇(和光純藥(股份有限公司)製造)1112.27g、作為A成分之含羰基有機化合物之乙醯丙酮(和光純藥(股份有限公司)製造)55.75g、作為C成分之金屬烷氧化物之ORGATIX TA-10(Matsumoto Fine Chemical(股份有限公司)製造:TiO2濃度28質量%)318.55g進行混合,攪拌5分鐘, 製備固形物成分濃度6.0質量%之預備液2-3。 Hexanediol (manufactured by Wako Pure Chemical Industries, Ltd.) 1112.27 g, acetone acetone (manufactured by Wako Pure Chemical Industries, Ltd.) as component A, which is a carbonyl group-containing organic compound, 55.75 g, and metal alkane as component C 318.55 g of ORGATIX TA-10 (manufactured by Matsumoto Fine Chemical Co., Ltd.: TiO 2 concentration 28% by mass) of oxide was mixed and stirred for 5 minutes to prepare a preparation solution 2-3 with a solid content concentration of 6.0% by mass.
〔實施例4〕 [Example 4]
除以下之預備步驟以外,與實施例1同樣地,製備被膜形成用塗布液(4),進而製造附被膜之基材(4-1)~(4-3)。之後,與實施例1同樣地進行評價。 Except for the following preliminary steps, in the same manner as in Example 1, a coating liquid (4) for forming a film was prepared, and further substrates (4-1) to (4-3) with a film were manufactured. After that, evaluation was performed in the same manner as in Example 1.
(預備步驟1) (Preliminary Step 1)
將己二醇(和光純藥(股份有限公司)製造)2336.54g、純水107.03g及濃度60質量%之硝酸1.78g進行混合,攪拌5分鐘。接著,一面攪拌,一面添加作為B成分之6官能矽烷化合物之1,2-雙(三乙氧基矽基)乙烷(YAMANAKA HUTECH(股份有限公司)製造:SiO2濃度33.8質量%)527.78g,攪拌30分鐘,製備固形物成分濃度6.0質量%之預備液1-4。 Hexanediol (manufactured by Wako Pure Chemical Industries, Ltd.) 2336.54 g, pure water 107.03 g, and 1.78 g of nitric acid with a concentration of 60% by mass were mixed, and stirred for 5 minutes. Next, while stirring, 527.78 g of 1,2-bis(triethoxysilyl)ethane (manufactured by YAMANAKA HUTECH (Co., Ltd.): SiO 2 concentration 33.8% by mass), which is a hexafunctional silane compound of component B, was added , Stirred for 30 minutes to prepare preparations 1-4 with a solid content concentration of 6.0% by mass.
(預備步驟2) (Preliminary Step 2)
將己二醇(和光純藥(股份有限公司)製造)5190.60g、作為A成分之含羰基有機化合物之乙醯丙酮(和光純藥(股份有限公司)製造)260.15g、作為C成分之金屬烷氧化物之ORGATIX TA-10(Matsumoto Fine Chemical(股份有限公司)製造:TiO2濃度28質量%)1486.57g進行混合,攪拌5分鐘,製備固形物成分濃度6.0質量%之預備液2-4。 Hexanediol (manufactured by Wako Pure Chemical Industries, Ltd.) 5190.60 g, acetone acetone (manufactured by Wako Pure Chemical Industries, Ltd.) as component A, a carbonyl-containing organic compound, 260.15 g, and metal alkane as component C 1486.57 g of oxide ORGATIX TA-10 (manufactured by Matsumoto Fine Chemical Co., Ltd.: 28% by mass TiO 2 ) was mixed and stirred for 5 minutes to prepare a preparation solution 2-4 with a solid content concentration of 6.0% by mass.
〔實施例5〕 [Example 5]
除以下之預備步驟以外,與實施例1同樣地,製備被膜形成用塗布液(5),進而製造附被膜之基材(5-1)~(5-3)。之後,與實施例1同樣地進行評價。 Except for the following preliminary steps, in the same manner as in Example 1, a coating liquid (5) for forming a film was prepared, and further substrates (5-1) to (5-3) with a film were manufactured. After that, evaluation was performed in the same manner as in Example 1.
(預備步驟1) (Preliminary Step 1)
將己二醇(和光純藥(股份有限公司)製造)4612.00g、純水214.07g及濃度60質量%之硝酸3.57g進行混合,攪拌5分鐘。接著,一面攪拌,一面添加作為B成分之6官能矽烷化合物之1,2-雙(三乙氧基矽基)乙烷(YAMANAKA HUTECH(股份有限公司)製造:SiO2濃度33.8質量%)703.7g、及作為D成分之4官能矽烷化合物之矽酸乙酯(多摩化學(股份有限公司)製造:SiO2濃度28.8質量%)412.94g,攪拌30分鐘,製備固形物成分濃度6.0質量%之預備液1-5。 4612.00 g of hexanediol (manufactured by Wako Pure Chemical Industries, Ltd.), 214.07 g of pure water, and 3.57 g of nitric acid with a concentration of 60% by mass were mixed, and stirred for 5 minutes. Next, while stirring, 703.7g of 1,2-bis(triethoxysilyl)ethane (manufactured by YAMANAKA HUTECH (Co., Ltd.): SiO 2 concentration 33.8% by mass), which is a 6-functional silane compound of component B, is added , And 412.94g of ethyl silicate (manufactured by Tama Chemical Co., Ltd.: SiO 2 concentration 28.8% by mass) as a tetrafunctional silane compound of D component, stirred for 30 minutes to prepare a preparation solution with a solid content concentration of 6.0% by mass 1-5.
(預備步驟2) (Preliminary Step 2)
將己二醇(和光純藥(股份有限公司)製造)2966.06g、作為A成分之含羰基有機化合物之乙醯丙酮(和光純藥(股份有限公司)製造)148.66g、作為C成分之金屬烷氧化物之ORGATIX TA-10(Matsumoto Fine Chemical(股份有限公司)製造:TiO2濃度28質量%)849.47g進行混合,攪拌5分鐘,製備固形物成分濃度6.0質量%之預備液2-5。 Hexanediol (manufactured by Wako Pure Chemical Industries, Ltd.) 2966.06 g, acetone acetone (manufactured by Wako Pure Chemical Industries, Ltd.) as component A, which is a carbonyl group-containing organic compound, and 148.66 g, as component C metal alkane 849.47 g of ORGATIX TA-10 (manufactured by Matsumoto Fine Chemical Co., Ltd.: 28% by mass of TiO 2 ) of oxide was mixed and stirred for 5 minutes to prepare preparation 2-5 with a solid content of 6.0% by mass.
〔實施例6〕 [Example 6]
除以下之預備步驟以外,與實施例1同樣地,製備被膜形成用塗布液(6),進而製造附被膜之基材(6-1)~(6-3)。 Except for the following preliminary steps, in the same manner as in Example 1, a coating liquid (6) for forming a film was prepared, and further substrates with a film (6-1) to (6-3) were manufactured.
之後,與實施例1同樣地進行評價。 After that, evaluation was performed in the same manner as in Example 1.
(預備步驟1) (Preliminary Step 1)
將己二醇(和光純藥(股份有限公司)製造)4612.00g、純水214.07g及濃度60質量%之硝酸3.57g進行混合,攪拌5分鐘。接著,一面攪拌,一面添加作為B成分之6官能矽烷化合物之1,2-雙(三乙氧基矽基)乙烷(YAMANAKA HUTECH(股份有限公司)製造:SiO2濃度33.8質量%)703.7 g、及作為3官能矽烷化合物之甲基三甲氧基矽烷(信越化學工業(股份有限公司)製造:KBM-13、SiO2濃度33.7質量%)352.89g,攪拌30分鐘,製備固形物成分濃度6.0質量%之預備液1-6。 4612.00 g of hexanediol (manufactured by Wako Pure Chemical Industries, Ltd.), 214.07 g of pure water, and 3.57 g of nitric acid with a concentration of 60% by mass were mixed, and stirred for 5 minutes. Next, while stirring, 1,2-bis(triethoxysilyl)ethane (manufactured by YAMANAKA HUTECH (Co., Ltd.): SiO 2 concentration 33.8% by mass), which is a 6-functional silane compound of component B, was added 703.7 g And 352.89g of methyltrimethoxysilane as a trifunctional silane compound (manufactured by Shin-Etsu Chemical Co., Ltd.: KBM-13, SiO 2 concentration 33.7 mass%), stirred for 30 minutes, and prepared solid content concentration 6.0 mass % Of preparation solution 1-6.
(預備步驟2) (Preliminary Step 2)
將己二醇(和光純藥(股份有限公司)製造)2966.06g、作為A成分之含羰基有機化合物之乙醯丙酮(和光純藥(股份有限公司)製造)148.66g、作為C成分之金屬烷氧化物之ORGATIX TA-10(Matsumoto Fine Chemical(股份有限公司)製造:TiO2濃度28質量%)849.47g進行混合,攪拌5分鐘,製備固形物成分濃度6.0質量%之預備液2-6。 Hexanediol (manufactured by Wako Pure Chemical Industries, Ltd.) 2966.06 g, acetone acetone (manufactured by Wako Pure Chemical Industries, Ltd.) as component A, which is a carbonyl group-containing organic compound, and 148.66 g, as component C metal alkane 849.47 g of ORGATIX TA-10 (manufactured by Matsumoto Fine Chemical Co., Ltd.: 28% by mass of TiO 2 ) of oxide was mixed and stirred for 5 minutes to prepare preparation 2-6 with a solid content of 6.0% by mass.
〔比較例1〕 [Comparative Example 1]
除以下之預備步驟以外,與實施例1同樣地,製備被膜形成用塗布液(7),進而製造附被膜之基材(7-1)~(7-3)。之後,與實施例1同樣地進行評價。 Except for the following preliminary steps, in the same manner as in Example 1, a coating liquid (7) for forming a film was prepared, and further substrates with a film (7-1) to (7-3) were manufactured. After that, evaluation was performed in the same manner as in Example 1.
(預備步驟1) (Preliminary Step 1)
將己二醇(和光純藥(股份有限公司)製造)6737.03g、純水308.61g及濃度60質量%之硝酸5.14g進行混合,攪拌5分鐘。接著,一面攪拌,一面添加作為B成分之6官能矽烷化合物之1,2-雙(三乙氧基矽基)乙烷(YAMANAKA HUTECH(股份有限公司)製造:SiO2濃度33.8質量%)1521.75g,攪拌30分鐘,製備固形物成分濃度6.0質量%之預備液1-7。 6737.03 g of hexanediol (manufactured by Wako Pure Chemical Industries, Ltd.), 308.61 g of pure water, and 5.14 g of nitric acid with a concentration of 60% by mass were mixed, and stirred for 5 minutes. Next, while stirring, 1521.75g of 1,2-bis(triethoxysilyl)ethane (manufactured by YAMANAKA HUTECH (Co., Ltd.): SiO 2 concentration 33.8% by mass), which is a 6-functional silane compound of component B, is added , Stirred for 30 minutes to prepare preparation 1-7 with a solid content concentration of 6.0% by mass.
(預備步驟2) (Preliminary Step 2)
將己二醇(和光純藥(股份有限公司)製造)1001.04g、作為A成分之含羰基有機化合物之乙醯丙酮(和光純藥(股份有限公司)製造)50.17g、 作為C成分之金屬烷氧化物之ORGATIX TA-10(Matsumoto Fine Chemical(股份有限公司)製造:TiO2濃度28質量%)286.70g進行混合,攪拌5分鐘,製備固形物成分濃度6.0質量%之預備液2-7。 1001.04 g of hexanediol (manufactured by Wako Pure Chemical Industries, Ltd.), 50.17 g of acetone acetone (manufactured by Wako Pure Chemical Industries, Ltd.) as the carbonyl-containing organic compound as component A, and metal alkane as component C 286.70 g of ORGATIX TA-10 of oxide (manufactured by Matsumoto Fine Chemical Co., Ltd.: 28% by mass TiO 2 ) was mixed and stirred for 5 minutes to prepare preparation 2-7 with a solid content concentration of 6.0% by mass.
〔比較例2〕 [Comparative Example 2]
除以下之預備步驟以外,與實施例1同樣地,製備被膜形成用塗布液(8),進而製造附被膜之基材(8-1)~(8-3)。之後,與實施例1同樣地進行評價。 Except for the following preliminary steps, in the same manner as in Example 1, a coating liquid (8) for forming a film was prepared, and further substrates with a film (8-1) to (8-3) were manufactured. After that, evaluation was performed in the same manner as in Example 1.
(預備步驟1) (Preliminary Step 1)
將己二醇(和光純藥(股份有限公司)製造)1791.35g、純水82.06g及濃度60質量%之硝酸1.37g進行混合,攪拌5分鐘。接著,一面攪拌,一面添加作為B成分之6官能矽烷化合物之1,2-雙(三乙氧基矽基)乙烷(YAMANAKA HUTECH(股份有限公司)製造:SiO2濃度33.8質量%)404.63g,攪拌30分鐘,製備固形物成分濃度6.0質量%之預備液1-8。 Hexanediol (manufactured by Wako Pure Chemical Industries, Ltd.), 1,791.35 g, 82.06 g of pure water, and 1.37 g of nitric acid with a concentration of 60% by mass were mixed and stirred for 5 minutes. Next, while stirring, 404.63g of 1,2-bis(triethoxysilyl)ethane (manufactured by YAMANAKA HUTECH (Co., Ltd.): SiO 2 concentration 33.8% by mass), which is a 6-functional silane compound of component B, was added. , Stir for 30 minutes to prepare preparation solution 1-8 with a solid content concentration of 6.0% by mass.
(預備步驟2) (Preliminary Step 2)
將己二醇(和光純藥(股份有限公司)製造)5709.66g、作為A成分之含羰基有機化合物之乙醯丙酮(和光純藥(股份有限公司)製造)286.16g、作為C成分之金屬烷氧化物之ORGATIX TA-10(Matsumoto Fine Chemical(股份有限公司)製造:TiO2濃度28質量%)1635.22g進行混合,攪拌5分鐘,製備固形物成分濃度6.0質量%之預備液2-8。 Hexanediol (manufactured by Wako Pure Chemical Industries, Ltd.) 5709.66 g, acetone acetone (manufactured by Wako Pure Chemical Industries, Ltd.) as component A, which is a carbonyl-containing organic compound, 286.16 g, and metal alkane as component C 1635.22 g of oxide ORGATIX TA-10 (manufactured by Matsumoto Fine Chemical Co., Ltd.: 28 mass% TiO 2 concentration) was mixed and stirred for 5 minutes to prepare preparation 2-8 with a solid content concentration of 6.0 mass%.
〔比較例3〕 [Comparative Example 3]
除以下之預備步驟以外,與實施例1同樣地,製備被膜形成用塗布液(9),進而製造附被膜之基材(9-1)~(9-3)。之後,與實施例1同樣地 進行評價。 Except for the following preliminary steps, in the same manner as in Example 1, a coating liquid (9) for forming a film was prepared, and further substrates with a film (9-1) to (9-3) were manufactured. After that, the same as in Example 1 Make an evaluation.
(預備步驟1) (Preliminary Step 1)
將己二醇(和光純藥(股份有限公司)製造)4669.95g、純水214.07g及濃度60質量%之硝酸3.57g進行混合,攪拌5分鐘。接著,一面攪拌,一面添加作為矽烷化合物之矽酸乙酯(多摩化學(股份有限公司)製造:SiO2濃度28.8質量%)1055.68g,攪拌30分鐘,製備固形物成分濃度6.0質量%之預備液1-9。 Hexanediol (manufactured by Wako Pure Chemical Industries, Ltd.) 4669.95 g, 214.07 g of pure water, and 3.57 g of nitric acid with a concentration of 60% by mass were mixed and stirred for 5 minutes. Next, while stirring, 1055.68 g of ethyl silicate (manufactured by Tama Chemical Co., Ltd.: SiO 2 concentration 28.8% by mass) as a silane compound was added and stirred for 30 minutes to prepare a preparation solution with a solid content concentration of 6.0% by mass 1-9.
(預備步驟2) (Preliminary Step 2)
將己二醇(和光純藥(股份有限公司)製造)2966.06g、作為A成分之含羰基有機化合物之乙醯丙酮(和光純藥(股份有限公司)製造)148.66g、作為C成分之金屬烷氧化物之ORGATIX TA-10(Matsumoto Fine Chemical(股份有限公司)製造:TiO2濃度28質量%)849.47g進行混合,攪拌5分鐘,製備固形物成分濃度6.0質量%之預備液2-9。 Hexanediol (manufactured by Wako Pure Chemical Industries, Ltd.) 2966.06 g, acetone acetone (manufactured by Wako Pure Chemical Industries, Ltd.) as component A, which is a carbonyl group-containing organic compound, and 148.66 g, as component C metal alkane 849.47 g of ORGATIX TA-10 (manufactured by Matsumoto Fine Chemical Co., Ltd.: 28% by mass TiO 2 ) of oxide was mixed and stirred for 5 minutes to prepare preparation 2-9 with a solid content concentration of 6.0% by mass.
〔評價項目、評價方法〕 [Evaluation items, evaluation methods]
對於藉由各實施例、各比較例獲得之附被膜之基材,進行以下之評價。又,關於被膜形成用塗布液,亦以如下方式評價經時穩定性。將結果示於表1中。 The following evaluations were performed on the substrate with a film obtained in each Example and each Comparative Example. Moreover, regarding the coating liquid for film formation, the stability with time was evaluated as follows. The results are shown in Table 1.
(1)膜厚 (1) Film thickness
藉由表面粗糙度測定機(東京精密(股份有限公司)製造:SURFCOM)進行測定。 The measurement was performed with a surface roughness measuring machine (manufactured by Tokyo Seiki Co., Ltd.: SURFCOM).
(2)表面電阻值 (2) Surface resistance value
表面電阻值係藉由表面電阻測定機(三菱化學ANALYTECH(股份有 限公司)製造:Hiresta UXMCP-HT800)進行測定。 The surface resistance value is measured by a surface resistance measuring machine (Mitsubishi Chemical ANALYTECH (Stock Company) Co., Ltd.) manufactured: Hiresta UXMCP-HT800) for measurement.
(3)塗布膜之耐龜裂性 (3) Crack resistance of coating film
目視觀察塗布膜之表面,按照以下之基準評價耐龜裂性。 The surface of the coating film was visually observed, and the crack resistance was evaluated according to the following criteria.
◎:塗布面內未見龜裂 ◎: No cracks are seen in the coating surface
○:邊緣部可見少量龜裂 ○: A small amount of cracks are seen at the edge
×:塗布面內產生龜裂 ×: Cracks occur in the coated surface
(4)鉛筆硬度 (4) Pencil hardness
按照JIS-K-5600,藉由鉛筆硬度試驗器進行測定。即,將鉛筆相對於被膜表面設定於45度之角度,負荷特定之負重,按固定速度拉伸,觀察有無損傷。 It is measured with a pencil hardness tester in accordance with JIS-K-5600. That is, the pencil is set at an angle of 45 degrees with respect to the surface of the film, a specific load is applied, and it is stretched at a fixed speed to observe whether there is damage.
(5)折射率 (5) Refractive index
藉由光譜式橢圓儀(SOPRA(股份有限公司)製造:ES4G,@550nm)進行測定。 The measurement was performed by a spectroscopic ellipsometer (manufactured by SOPRA (Co., Ltd.): ES4G, @550nm).
(6)耐化學品性 (6) Chemical resistance
將各附被膜之基材於加熱至40℃後之磷酸/硝酸/乙酸/水(質量比:80/5/5/10)混合液中浸漬5分鐘,用純水洗淨。之後,將該附被膜之基材於加熱至60℃之二乙二醇單丁醚/2-胺基乙醇(質量比:70/30)混合液中浸漬5分鐘,藉由目視及光學顯微鏡觀察經純水洗淨後之塗布膜之狀態,按照以下之基準評價耐化學品性。 Dip each substrate with a film in a mixed solution of phosphoric acid/nitric acid/acetic acid/water (mass ratio: 80/5/5/10) heated to 40°C for 5 minutes, and rinse with pure water. After that, the substrate with the film was immersed in a mixture of diethylene glycol monobutyl ether/2-aminoethanol (mass ratio: 70/30) heated to 60°C for 5 minutes, and observed by visual inspection and an optical microscope The state of the coated film after washing with pure water is evaluated for chemical resistance according to the following criteria.
○:塗布膜未見變化 ○: No change in coating film
×:產生塗布膜之剝離或龜裂 ×: peeling or cracking of the coating film
(7)塗布液之經時穩定性 (7) Stability of the coating liquid over time
將塗布液於40℃加熱72小時後,藉由E型黏度計(東機產業(股份有限公司)製造:TV-25型)測定黏度,按照以下之基準進行評價。 After the coating liquid was heated at 40°C for 72 hours, the viscosity was measured with an E-type viscometer (manufactured by Toki Sangyo Co., Ltd.: TV-25 type), and evaluated according to the following criteria.
◎:黏度未見變化 ◎: No change in viscosity
○:可見少量黏度之增加(未達5mPa‧s) ○: A slight increase in viscosity is visible (less than 5mPa‧s)
×:可見明確之黏度之增加(5mPa‧s以上) ×: A clear increase in viscosity is visible (above 5mPa‧s)
〔評價結果〕 〔Evaluation results〕
如表1所示般,由實施例1~6可知,使用本發明之被膜形成用塗布液所製造之附被膜之基材之表面硬度、耐龜裂性、及耐化學品性之全部優異。 As shown in Table 1, it can be seen from Examples 1 to 6 that the substrate with a film produced using the coating liquid for film formation of the present invention has excellent surface hardness, crack resistance, and chemical resistance.
另一方面,由比較例1~3可知,若使用不具有本發明之結構之被膜形成用塗布液,則無法滿足表面硬度、耐龜裂性、及耐化學品性之全部。 On the other hand, it is known from Comparative Examples 1 to 3 that if a coating liquid for forming a film that does not have the structure of the present invention is used, all of surface hardness, crack resistance, and chemical resistance cannot be satisfied.
Claims (9)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP2015-174757 | 2015-09-04 | ||
JP2015174757A JP6647820B2 (en) | 2015-09-04 | 2015-09-04 | Coating solution for forming transparent film, method for producing coating solution for forming transparent film, substrate with transparent film, and method for manufacturing substrate with transparent film |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201723109A TW201723109A (en) | 2017-07-01 |
TWI697529B true TWI697529B (en) | 2020-07-01 |
Family
ID=58278865
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105128237A TWI697529B (en) | 2015-09-04 | 2016-09-01 | Film-forming coating liquid, manufacturing method of film-forming coating liquid and film-covered base material |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6647820B2 (en) |
KR (1) | KR102623650B1 (en) |
CN (1) | CN106497400B (en) |
TW (1) | TWI697529B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102430624B1 (en) * | 2022-05-06 | 2022-08-18 | 주식회사 에스필코리아 | Hybrid type photocatalyst coating materials and manufacturing method thereof with enhanced antibacterial function |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07331173A (en) * | 1995-02-21 | 1995-12-19 | Toray Ind Inc | Coating composition for formation of optical material and optical material |
TW201024459A (en) * | 2008-12-16 | 2010-07-01 | Nihon Parkerizing | Surface-treating agent for metallic material, surface-treating method for metallic material using the same, and surface-treated metallic material |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63258963A (en) * | 1987-04-16 | 1988-10-26 | Seiko Epson Corp | Coating composition |
JP2881847B2 (en) * | 1988-12-15 | 1999-04-12 | 日産化学工業株式会社 | Coating composition and method for producing the same |
US6045963A (en) * | 1998-03-17 | 2000-04-04 | Kodak Polychrome Graphics Llc | Negative-working dry planographic printing plate |
CN1196756C (en) * | 1998-04-20 | 2005-04-13 | 东丽精密化学株式会社 | Resin compositions for coatings |
ATE518922T1 (en) * | 2000-10-11 | 2011-08-15 | Chemetall Gmbh | METHOD FOR THE PRETREATMENT OR/AND COATING OF METAL SURFACES PRIOR TO FORMING WITH A PAINT-LIKE COATING AND USE OF THE SUCH COATED SUBSTRATES |
JP4343520B2 (en) * | 2002-12-05 | 2009-10-14 | 日揮触媒化成株式会社 | Coating liquid for forming transparent film, substrate with transparent film, and display device |
CN100410341C (en) * | 2003-06-06 | 2008-08-13 | 触媒化成工业株式会社 | Coating solution for forming transparent film, substrate with same, and liquid crystal display cell |
US7462678B2 (en) * | 2003-09-25 | 2008-12-09 | Jsr Corporation | Film forming composition, process for producing film forming composition, insulating film forming material, process for forming film, and silica-based film |
US7479514B2 (en) * | 2004-10-05 | 2009-01-20 | Basf Corporation | Adhesion promoting composition and method |
WO2006088079A1 (en) * | 2005-02-18 | 2006-08-24 | Nippon Soda Co., Ltd. | Organic-inorganic composite body |
EP1970421B1 (en) * | 2005-12-22 | 2015-04-29 | JGC Catalysts and Chemicals Ltd. | Coating liquid for forming low dielectric constant amorphous silica coating film and low dielectric constant amorphous silica coating film obtained from such coating liquid |
CN101535430B (en) * | 2006-11-14 | 2012-02-08 | 日产化学工业株式会社 | Coating liquid for forming low refractive index film, method for producing the same and antireflection member |
JP5551338B2 (en) * | 2008-02-20 | 2014-07-16 | 日揮触媒化成株式会社 | Hard coat layer forming coating composition and optical article |
WO2009123032A1 (en) * | 2008-04-02 | 2009-10-08 | Jsr株式会社 | Composition containing silicon-containing polymer and cured product thereof |
JP5152925B2 (en) * | 2009-09-24 | 2013-02-27 | 一般財団法人石油エネルギー技術センター | Hydrocarbon oil catalytic cracking catalyst, method for producing hydrocarbon oil catalytic cracking catalyst, and hydrocarbon oil catalytic cracking method |
JP6132498B2 (en) * | 2012-09-21 | 2017-05-24 | 株式会社日本触媒 | Titanium / silicon / tungsten oxide, denitration catalyst using the same, method for preparing the oxide, and denitration method |
JP6045890B2 (en) * | 2012-11-28 | 2016-12-14 | 水澤化学工業株式会社 | MCM-22 type zeolite having novel crystal structure and aromatic hydrocarbon purification catalyst comprising said zeolite |
JP6082327B2 (en) * | 2013-07-26 | 2017-02-15 | 富士フイルム株式会社 | Laminate including overcoat layer and aqueous composition for forming overcoat layer |
FR3014106B1 (en) * | 2013-12-03 | 2017-03-10 | Bluestar Silicones France | CURABLE SILICONE COMPOSITION IN THE PRESENCE OF WATER OR HUMIDITY IN THE AIR |
-
2015
- 2015-09-04 JP JP2015174757A patent/JP6647820B2/en active Active
-
2016
- 2016-08-31 CN CN201610799355.0A patent/CN106497400B/en active Active
- 2016-08-31 KR KR1020160111880A patent/KR102623650B1/en active Active
- 2016-09-01 TW TW105128237A patent/TWI697529B/en active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07331173A (en) * | 1995-02-21 | 1995-12-19 | Toray Ind Inc | Coating composition for formation of optical material and optical material |
TW201024459A (en) * | 2008-12-16 | 2010-07-01 | Nihon Parkerizing | Surface-treating agent for metallic material, surface-treating method for metallic material using the same, and surface-treated metallic material |
Also Published As
Publication number | Publication date |
---|---|
CN106497400A (en) | 2017-03-15 |
KR102623650B1 (en) | 2024-01-10 |
JP6647820B2 (en) | 2020-02-14 |
TW201723109A (en) | 2017-07-01 |
CN106497400B (en) | 2020-04-03 |
KR20170028850A (en) | 2017-03-14 |
JP2017048346A (en) | 2017-03-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4941302B2 (en) | Method for producing coating liquid for film formation | |
JP6038637B2 (en) | Composite of metal oxide nanoparticles and silsesquioxane polymer, method for producing the same, and composite material produced using the composite | |
TWI805546B (en) | Coating film forming composition and forming method thereof | |
KR101985547B1 (en) | Agent for forming electrode protective film | |
JP7266438B2 (en) | Liquid composition for forming an antifouling film | |
TWI495687B (en) | Method of forming a cured coating film of siloxane resin composition | |
JP6778007B2 (en) | Coating liquid for film formation, its manufacturing method, and coating base material manufacturing method | |
TWI697529B (en) | Film-forming coating liquid, manufacturing method of film-forming coating liquid and film-covered base material | |
JP7231422B2 (en) | antifouling membrane | |
TWI682010B (en) | Coating liquid for forming film, method for manufacturing the same, and method for manufacturing base material with coating | |
JP6480781B2 (en) | Transparent film forming coating liquid, method for producing transparent film forming coating liquid, substrate with transparent film, and method for producing substrate with transparent film | |
JP6480780B2 (en) | Coating liquid for forming transparent film, method for producing the same, and substrate with transparent film | |
KR20140119796A (en) | Coating solution for metal oxide film and metal oxide film | |
JPH0633000A (en) | Coating solution for forming insulation film with high refractive index for liquid crystal display device | |
CN104428377A (en) | Coating material, optical coating film, and optical element | |
JP6578946B2 (en) | Glass substrate with protective film | |
JP6383983B2 (en) | Composition for forming metal oxide film and metal oxide film | |
US11332382B2 (en) | Titanium compound sol solution, coating film using the same and manufacturing method thereof | |
KR101928831B1 (en) | Protected coating composition for processing wafer and protected coating material comprising the same and manufacturing method thereof | |
KR20190088876A (en) | protected coating material for dicing process |