TWI691673B - Full-color light-emitting diode kit with connecting groove - Google Patents
Full-color light-emitting diode kit with connecting groove Download PDFInfo
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Abstract
一種具有連接溝槽的全彩發光二極體套件,其係包含:一載座、一基材、該基材包含複數個焊接點、至少一全彩發光件、複數條連接導線、複數個連接溝槽以及一後蓋,後蓋係組設在載座並且與基材連接,使基材及後蓋固定在該限位空間中,連接溝槽的周壁上係各別設置一金屬層,金屬層係電性連接全彩發光件及焊接點,基材透過連接溝槽的金屬層電性連接一控制電路板;藉此,本發明藉由連接溝槽的設置,以致達到快速連接該控制電路板,並且有效地減少短路情況發生。A full-color light-emitting diode kit with a connecting groove, which comprises: a carrier, a base material, the base material includes a plurality of welding points, at least one full-color light-emitting element, a plurality of connecting wires, a plurality of connections The groove and a back cover, the back cover is set on the carrier and connected with the base material, so that the base material and the back cover are fixed in the limit space, and a metal layer is separately provided on the peripheral wall of the connection groove. The layer is electrically connected to the full-color light-emitting parts and the welding points, and the base material is electrically connected to a control circuit board through the metal layer of the connection groove; thereby, the present invention achieves rapid connection to the control circuit by setting the connection groove Board, and effectively reduce the occurrence of short circuits.
Description
本發明係關於一種全彩發光二極體套件,特別是指一種具有連接溝槽的全彩發光二極體套件。The invention relates to a full-color light-emitting diode kit, in particular to a full-color light-emitting diode kit with a connecting groove.
按,發光二極體元件(Light Emitting Diode,LED)具有低耗電量、低發熱量、操作壽命長、耐撞擊、體積小、反應速度快、以及可發出穩定波長的色光等良好光電特性,因此常應用於家電、儀表之指示燈及光電產品等領域。隨著光電元件進入微封裝的時代,而發展出晶粒級封裝。此外,隨著光電科技的發展,照明設備在照明效率、操作壽命以及亮度等方面有顯著的進步,因此近年來發光二極體已經被應用於一般的照明用途上。Press, Light Emitting Diode (LED) has good photoelectric characteristics such as low power consumption, low heat generation, long operating life, impact resistance, small size, fast reaction speed, and can emit colored light with stable wavelength, etc. Therefore, it is often used in the fields of household appliances, indicator lights and photoelectric products. As optoelectronic components enter the era of micro-encapsulation, grain-level packaging has developed. In addition, with the development of optoelectronic technology, lighting equipment has made significant progress in lighting efficiency, operating life, and brightness. Therefore, in recent years, light-emitting diodes have been used in general lighting applications.
但是,在某些應用上需要不同色光的發光二極體,在現有技術領域中,其利用紅、綠、藍三種顏色的發光二極體晶片的相互搭配而組成全彩發光二極體,全彩發光二極體可通過紅、綠、藍三種的顏色光,然後再通過混光後形成全彩色光。However, in some applications, light-emitting diodes of different colors are required. In the prior art, it uses red, green, and blue light-emitting diode chips to form a full-color light-emitting diode. The color light-emitting diode can pass three colors of red, green, and blue, and then pass through the mixed light to form a full-color light.
然而,就目前的發光二極體套件的組裝皆需要將發光二極體套件的接腳穿過電路板的穿孔,再透過焊接方式固定於電路板而形成電性連接,但發光二極體套件的接腳穿過電路板的穿孔方式需以人工作業,故難以將發光二極體的組裝效率提升。However, in the assembly of current LED packages, it is necessary to pass the pins of the LED package through the perforations of the circuit board, and then fix the circuit board by soldering to form an electrical connection, but the LED package The method of piercing the pins through the circuit board requires manual work, so it is difficult to improve the assembly efficiency of the light emitting diode.
此外,當發光二極體套件的接腳與電路板焊接時,常常因為人不注意把接腳銲接在一起,其造成短路,並且使發光二極體套件燒毀。再者,組裝發光二極體套件也是以人工作業的方式,而在組裝的過程中,經常發生接腳零件互相碰觸,造成短路,導致部分零件損壞而使成本增加。In addition, when the pins of the light-emitting diode kit are soldered to the circuit board, it is often because people do not pay attention to soldering the pins together, which causes a short circuit and burns the light-emitting diode kit. Furthermore, assembling the light-emitting diode kit is also a manual operation, and during the assembly process, pin parts often touch each other, causing a short circuit, causing damage to some parts and increasing costs.
是以,本案發明人在觀察到上述缺失後,認為發光二極體套件仍有進一步改良之必要,而遂有本發明之產生。Therefore, after observing the above-mentioned deficiency, the inventor of the present case believes that there is still a need for further improvement of the light emitting diode package, and the invention has been produced.
本發明之主要目的係在提供一種具有連接溝槽的全彩發光二極體套件,其係能夠穩定的固定在控制電路板上,更可藉由本發明的連接溝槽及連接導線,以達到減少短路的情況發生,以及提升組裝效率。The main purpose of the present invention is to provide a full-color light-emitting diode kit with a connection groove, which can be stably fixed on the control circuit board, and can be reduced by the connection groove and the connection wire of the invention The occurrence of short circuit and improve assembly efficiency.
為達到上述目的,本發明所提供的具有連接溝槽的全彩發光二極體套件,其係包含:一載座,該載座的內部係具有一限位空間;一基材,該基材設置在該限位空間中,該基材包含複數個焊接點、至少一全彩發光件、複數條連接導線以及複數個連接溝槽,該等焊接點及該等連接導線係設置該基材的表面上,該等連接溝槽係凹設在該基材的外周緣,該全彩發光件係固定在該等焊接點上,該等連接導線的其中一端係各別電性連接該等焊接點,並且該等連接溝槽係各別連接該等連接導線的另一端,使該等連接溝槽各別電性連接該等焊接點;一後蓋,該後蓋係組設在該載座並且與該基材連接,使該基材及該後蓋固定在該限位空間中;其中,該等連接溝槽的周壁上係各別設置一金屬層,該等金屬層係電性連接該全彩發光件及該等焊接點,該基材透過該等連接溝槽的金屬層電性連接一控制電路板。In order to achieve the above object, the full-color light-emitting diode kit with a connecting groove provided by the present invention includes: a carrier, the interior of the carrier has a limit space; a substrate, the substrate Set in the limit space, the base material includes a plurality of welding points, at least one full-color light emitting element, a plurality of connecting wires and a plurality of connecting grooves, the welding points and the connecting wires are provided for the substrate On the surface, the connection grooves are recessed on the outer periphery of the substrate, the full-color light-emitting element is fixed on the welding points, and one end of the connecting wires is electrically connected to the welding points , And the connection grooves are respectively connected to the other ends of the connection wires, so that the connection grooves are electrically connected to the welding points; a back cover, the back cover is set on the carrier and Connected with the base material to fix the base material and the back cover in the limiting space; wherein, a metal layer is provided on each peripheral wall of the connection grooves, and the metal layers are electrically connected to the The color light-emitting parts and the solder joints, the substrate are electrically connected to a control circuit board through the metal layers of the connecting grooves.
較佳地,其中,該等金屬層包含一銅箔層及一錫膏,該銅箔層係設置在該等連接溝槽的周壁上,該控制電路板上係設置複數個對應焊點,該等銅箔層係各別以該錫膏連接該等對應焊點。Preferably, wherein the metal layers include a copper foil layer and a solder paste, the copper foil layer is disposed on the peripheral wall of the connection grooves, and the control circuit board is provided with a plurality of corresponding solder joints, the The copper foil layers are respectively connected to the corresponding solder joints with the solder paste.
較佳地,其中,該載座的底端係向下延伸有複數個固定接腳,該等固定接腳係穿設該控制電路板,使該載座固定在該控制電路板上。Preferably, a plurality of fixed pins extend downward from the bottom end of the carrier, and the fixed pins penetrate the control circuit board to fix the carrier on the control circuit board.
較佳地,其中,還包含複數個銅箔片,該等銅箔片係設置在該基材的表面,該等銅箔片的一端係各別連接該等連接導線,而該等銅箔片的另一端係各別連接該等金屬層。Preferably, it further comprises a plurality of copper foils, the copper foils are arranged on the surface of the base material, one end of the copper foils are respectively connected to the connecting wires, and the copper foils The other end of each is connected to the metal layers.
較佳地,其中,還包含一分隔件及至少一按壓件,該分隔件係設置在該基材與該後蓋之間,該分隔件係穿設至少一穿孔,該按壓件係設置在該穿孔中,而該按壓件的表面係向外凸設二連接部,該等連接部係穿設該基材,並且該等連接部係凸出於該載座,該全彩發光件係位於該等連接部之間。Preferably, it further comprises a partition member and at least one pressing member, the partition member is disposed between the base material and the back cover, the partition member is perforated with at least one perforation, and the pressing member is disposed on the During the perforation, the surface of the pressing member protrudes outwardly with two connecting parts, the connecting parts penetrate the base material, and the connecting parts protrude from the carrier, and the full-color light-emitting part is located at the Etc. between connections.
較佳地,其中,該控制電路板上設置一插槽,該插槽係供該基材插入設置。Preferably, a slot is provided on the control circuit board, and the slot is used for inserting and setting the substrate.
較佳地,其中,該分隔件的表面係各別向外凸設二凸塊,該等凸塊各別穿設該載座、該基材及該後蓋,使該載座、該基材、該分隔件及該後蓋緊密結合。Preferably, wherein the surface of the partition is respectively protruded outwards with two protrusions, the protrusions are respectively penetrated by the carrier, the substrate and the back cover, so that the carrier and the substrate , The partition and the back cover are tightly combined.
較佳地,其中,更包含至少一簧片,該簧片設置在該按壓件及該後蓋之間,該簧片係透過一膠層與該按壓件連接。Preferably, it further comprises at least one reed, which is disposed between the pressing member and the back cover, and the reed is connected to the pressing member through a glue layer.
較佳地,其中,該後蓋的表面上係設置複數條後蓋導線,該等後蓋導線選擇性的電性連接該簧片。Preferably, a plurality of back cover wires are arranged on the surface of the back cover, and the back cover wires are selectively electrically connected to the reed.
較佳地,其中,該後蓋的外周緣係凹設複數個後蓋連接溝槽,該等後蓋連接溝槽係各別連接該等後蓋導線,該等後蓋連接溝槽係透過該等金屬層與該控制電路板連接。Preferably, the outer periphery of the back cover is recessed with a plurality of back cover connection grooves, the back cover connection grooves are respectively connected to the back cover wires, and the back cover connection grooves pass through the The metal layer is connected to the control circuit board.
本發明所提供之具有連接溝槽的全彩發光二極體套件,其主要係藉由該等連接溝槽及該等連接導線的設置,該全彩發光二極體套件與該控制電路板連接時,以致避免人工銲接所造成的短路情況,更能減少製造成本。The full-color light-emitting diode kit with connection groove provided by the present invention is mainly provided by the connection grooves and the connecting wires, the full-color light-emitting diode kit is connected to the control circuit board At the same time, so as to avoid the short circuit caused by manual welding, it can reduce the manufacturing cost.
請參閱圖1至圖5,並且搭配圖6所示,圖1為本發明第一實施例之立體圖,圖2為本發明第一實施例之分解圖,圖3為圖1A-A剖面圖,圖4為本發明第一實施例基材之局部放大圖,圖5為本發明第一實施例之使用狀態立體圖,圖6為本發明第一實施例之使用狀態示意圖。本發明系揭露一種具有連接溝槽的全彩發光二極體套件100,其係包含:Please refer to FIG. 1 to FIG. 5, and with FIG. 6, FIG. 1 is a perspective view of the first embodiment of the present invention, FIG. 2 is an exploded view of the first embodiment of the present invention, and FIG. 3 is a cross-sectional view of FIGS. 1A-A, 4 is a partial enlarged view of a substrate according to a first embodiment of the present invention, FIG. 5 is a perspective view of a use state of the first embodiment of the present invention, and FIG. 6 is a schematic view of a use state of the first embodiment of the present invention. The present invention discloses a full-color light-
一載座10,該載座10的內部係具有一限位空間11。在本實施例中,為了防止該全彩發光二極體套件100運作時發生短路的情況,該載座10係為不導電材質。而該載座10係具有二側邊13,該等側邊13各係具有至少一限位部14,該等限位部14係向該限位空間11延伸,並且與該載座10共同圍構出該限位空間11。A
一基材20,該基材20設置在該限位空間11中,該基材20包含複數個焊接點21、至少一全彩發光件22、複數條連接導線23以及複數個連接溝槽24,該等焊接點21及該等連接導線23係設置該基材20的表面上,該等連接溝槽24係凹設在該基材20的外周緣,該全彩發光件22係固定在該等焊接點21上,該等連接導線23的其中一端係各別電性連接該等焊接點21,並且該等連接溝槽24係各別連接該等連接導線23的另一端,使該等連接溝槽24各別電性連接該等焊接點21。A
具體來說,如圖4所示,該基材20係為電路板,該全彩發光件22係為LED燈,而且該等焊接點21及該等連接導線23係為線路布局(Layout),該基材20經過曝光機曝光後,形成該等焊接點21及該等連接導線23,利用錫膏將該全彩發光件22焊接再該等焊接點21上。Specifically, as shown in FIG. 4, the
一後蓋30,該後蓋30係組設在該載座10並且與該基材20連接,使該基材20及該後蓋30固定在該限位空間11中。A
請繼續參閱圖4所示,該等連接溝槽24的周壁上係各別設置一金屬層40,該等金屬層40係電性連接該全彩發光件22及該等焊接點21,該基材20透過該等連接溝槽24的金屬層40電性連接一控制電路板200。Please continue to refer to FIG. 4, a
請繼續參閱圖2所示,在本實施例中,還包含一分隔件50及至少一按壓件60,該分隔件50係設置在該基材20與該後蓋30之間,該分隔件50係穿設至少一穿孔51,該按壓件60係設置在該穿孔51中,而該按壓件60的表面係向外凸設二連接部61,該等連接部61係穿設該基材20,並且該等連接部61係凸出於該載座10,該全彩發光件22係位於該等連接部61之間。Please continue to refer to FIG. 2. In this embodiment, it further includes a
另外,在本實施例中,如圖2及圖3並且搭配圖5所示,包含至少一簧片70,該簧片70設置在該按壓件60及該後蓋30之間,該簧片70係透過一膠層80與該按壓件60連接。該分隔件50的表面係各別向外凸設二凸塊52,該等凸塊52各別穿設該載座10、該基材20及該後蓋30,使該載座10、該基材20、該分隔件50及該後蓋30緊密結合。該後蓋30的表面上係設置複數條後蓋導線31,該等後蓋導線31選擇性的電性連接該簧片70。該後蓋30的外周緣係凹設複數個後蓋連接溝槽32,該等後蓋連接溝槽32係各別連接該等後蓋導線31,該等後蓋連接溝槽32係透過該等金屬層40與該控制電路板200連接。In addition, in this embodiment, as shown in FIGS. 2 and 3 and FIG. 5, at least one
為供進一步瞭解本發明構造特徵、運用技術手段及所預期達成之功效,茲將本發明使用方式加以敘述,相信當可由此而對本發明有更深入且具體瞭解,如下所述:In order to further understand the structural features of the present invention, the use of technical means and the expected effect, the way of using the present invention is described here. It is believed that this can provide a deeper and more specific understanding of the present invention, as follows:
請繼續參閱圖5所示,在本實施例中,該全彩發光件22的數量為兩個,該焊接點21的數量為八個,該連接導線23的數量為八條,該連接溝槽24的數量為八個,由此而知,一個該全彩發光件22需搭配四個該焊接點21、四條該連接導線23以及四個該連接溝槽24。而本發明不以此為限制,該全彩發光件22、該焊接點21、該連接導線23以及該連接溝槽24的數量,其係依據使用者的需求而改變,亦即本發明的該全彩發光件22、該焊接點21、該連接導線23以及該連接溝槽24有不同數量。Please continue to refer to FIG. 5. In this embodiment, the number of the full-color light-emitting
進一步的說,該後蓋30也係為電路板,該等後蓋導線31也係為線路布局(Layout)。在本實施例中,該按壓件60的數量為兩個,該膠層80的數量為兩個,該簧片70的數量為兩個,該後蓋導線31的數量為四條,該後蓋連接溝槽32的數量為四個。由此而知,一個該按壓件60係搭配一個該膠層80、一個該簧片70、二條該後蓋導線31以及二個該後蓋連接溝槽32。Further, the
另外,該等連接導線23、該等連接溝槽24、該後蓋導線31以及該後蓋連接溝槽32的連接順序跟線路布局(Layout)的走線位置,其係依據使用者的需求而調整。In addition, the connection sequence of the
請繼續參閱圖6所示。該等金屬層40包含一銅箔層41及一錫膏42,該銅箔層41係設置在該等連接溝槽24的周壁上,該控制電路板200上係設置複數個對應焊點210,該等銅箔層41係各別以該錫膏42連接該等對應焊點210。在本實施例中,使用者在該等銅箔層41塗上該錫膏42,該全彩發光二極體套件100與該控制電路板200連接,並且使用者對該等錫膏42加熱,使該等銅箔層41與該等對應焊點210連接。該載座10的底端係向下延伸有複數個固定接腳12,該等固定接腳12係穿設該控制電路板200,使該載座10固定在該控制電路板200上。Please continue to refer to Figure 6. The
在另一較佳實施例中,該等連接部61可設置一按鈕,使用者按壓該按鈕時,其係帶動該按壓件60以及該簧片70,並且該簧片70碰觸到該等後蓋導線31,以致該發光件有不同的作動方式。例如,使用者按壓該按紐時,其係改變該發光件的色光、該發光件的閃爍頻率、或是控制該發光件的啟閉。In another preferred embodiment, the connecting
藉此,由上述說明可進一步得知,本發明藉由該等連接導線23、該等連接溝槽24以及該等銅箔層41的設置,使該全彩發光二極體套件100能穩定地固定在該控制電路板200上,並且透過在該等銅箔層41上各別塗設該錫膏42,以達到減少人工焊接所造成的短路情況,進一步減少在組裝該全彩發光二極體套件100時所造成的短路情況。Thus, it can be further known from the above description that the present invention enables the full-color light-emitting
請參閱圖7及圖8所示,圖7為本發明第二實施例基材之局部放大圖,圖8為本發明第二實施例之使用狀態立體圖。第二實施例相較於第一實施例,第二實施例的主要結構差異在於,該基材20還包含複數個銅箔片25,該等銅箔片25係設置在該基材20的表面,該等銅箔片25的一端係各別連接該等連接導線23,而該等銅箔片25的另一端係各別連接該等金屬層40。另外,該控制電路板200上設置一插槽220,該插槽220係供該基材20插入使用。Please refer to FIG. 7 and FIG. 8. FIG. 7 is a partially enlarged view of the substrate of the second embodiment of the present invention. FIG. 8 is a perspective view of the second embodiment of the present invention in use. Compared with the first embodiment, the second embodiment has a main structural difference in that the
藉此,本實施例不僅能達到第一實施例之功效,亦能提供不同的結構,透過該等銅箔片25的設置,並且搭配該插槽220一起使用,使該全彩發光二極體套件100不透過塗設該錫膏42,便能穩定地設置在該控制電路板200上,其係增加使用上的便利性及實用性。In this way, this embodiment can not only achieve the effect of the first embodiment, but also provide different structures. Through the arrangement of the copper foils 25 and used with the
茲,再將本發明之特徵及其可達成之預期功效陳述如下:Hereby, the characteristics of the present invention and the achievable expected effects are stated as follows:
本發明之具有連接溝槽的全彩發光二極體套件100,主要係藉由該等連接導線23以及該等連接溝槽24的設置,並且搭配該等金屬層40,使該全彩發光二極體套件100能穩定地設置在該控制電路板200上,而在組裝的過程中,能減少人工焊接時所造成的短路情況發生。The full-color light-emitting
藉此,本發明係具有以下實施功效及技術功效:Therefore, the present invention has the following implementation and technical effects:
其一,本發明透過該等連接導線23的設置,使在組裝該全彩發光二極體套件100時,避免零件之間互相碰觸造成短路,進一步減少零件成本。First, through the arrangement of the connecting
其二,本發明透過該等連接溝槽24及該等金屬層40的設置,使該全彩發光二極體套件100與該控制電路板200連接時,減少人工焊接所造成的接腳互相連接,以致發生短路情況。Second, according to the present invention, when the
其三,本發明透過該等連接溝槽24及該等後蓋連接溝槽32的設置,其係能減少該等錫膏42溢出到其他的零件或是溢出到其他的該等連接溝槽24及該等後蓋連接溝槽32,達到安全性上的提升。Third, the present invention can reduce the overflow of the
綜上所述,本發明在同類產品中實有其極佳之進步性,同時遍查國內外關於此類結構之技術資料,文獻中亦未發現有相同的構造存在在先,是以,本發明時已具備發明專利要件,爰依法提出申請。In summary, the present invention has excellent progress in similar products. At the same time, the technical information about such structures at home and abroad has been checked, and the same structure has not been found in the literature. Therefore, this At the time of the invention, he already had the requirements for the invention patent, and he applied for it according to law.
惟,以上所述者,僅係本發明之較佳可行實施例而已,實施例之間若無明顯相斥的情況,其特徵可彼此結合替換應用。並且,舉凡應用本發明說明書及申請專利範圍所為之等效結構變化,理應包含在本發明之專利範圍內。However, the above are only the preferred and feasible embodiments of the present invention. If there is no obvious mutual exclusion between the embodiments, the features can be combined and replaced with each other. In addition, any equivalent structural changes that apply to the description of the present invention and the scope of patent application should be included in the patent scope of the present invention.
100:具有連接溝槽的全彩發光二極體套件 10:載座 11:限位空間 12:固定接腳 13:側邊 14:限位部 20:基材 21:焊接點 22:全彩發光件 23:連接導線 24:連接溝槽 25:銅箔片 30:後蓋 31:後蓋導線 32:後蓋連接溝槽 40:金屬層 41:銅箔層 42:錫膏 50:分隔件 51:穿孔 52:凸塊 60:按壓件 61:連接部 70:簧片 80:膠層 200:控制電路板 210:對應焊點 220:插槽 A-A:剖面線100: Full-color light-emitting diode kit with connection groove 10: Carrier 11: Limit space 12: fixed pin 13: Side 14: Limit part 20: substrate 21: Welding point 22: Full-color light-emitting parts 23: connecting wire 24: connection groove 25: Copper foil 30: back cover 31: Rear cover wire 32: Rear cover connection groove 40: metal layer 41: Copper foil layer 42: solder paste 50: divider 51: Piercing 52: bump 60: Pressing piece 61: Connection 70: reed 80: adhesive layer 200: control circuit board 210: corresponding solder joint 220: slot A-A: Section line
圖1為本發明第一實施例之立體圖。 圖2為本發明第一實施例之分解圖。 圖3為圖1A-A剖面圖。 圖4為本發明第一實施例基材之局部放大圖。 圖5為本發明第一實施例之使用狀態立體圖。 圖6為本發明第一實施例之使用狀態示意圖。 圖7為本發明第二實施例基材之局部放大圖。 圖8為本發明第二實施例之使用狀態立體圖。 FIG. 1 is a perspective view of a first embodiment of the invention. 2 is an exploded view of the first embodiment of the invention. FIG. 3 is a cross-sectional view of FIG. 1A-A. FIG. 4 is a partial enlarged view of the substrate of the first embodiment of the present invention. 5 is a perspective view of the first embodiment of the present invention in use. FIG. 6 is a schematic diagram of the use state of the first embodiment of the present invention. 7 is a partial enlarged view of a substrate according to a second embodiment of the invention. 8 is a perspective view of a second embodiment of the present invention in use.
100:具有連接溝槽的全彩發光二極體套件 100: Full-color light-emitting diode kit with connection groove
10:載座 10: Carrier
11:限位空間 11: Limit space
12:固定接腳 12: fixed pin
13:側邊 13: Side
20:基材 20: substrate
21:焊接點 21: Welding point
22:全彩發光件 22: Full-color light-emitting parts
24:連接溝槽 24: connection groove
30:後蓋 30: back cover
50:分隔件 50: divider
52:凸塊 52: bump
61:連接部 61: Connection
A-A:剖面線 A-A: Section line
Claims (10)
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TW108140336A TWI691673B (en) | 2019-11-06 | 2019-11-06 | Full-color light-emitting diode kit with connecting groove |
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Citations (2)
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CN1675799A (en) * | 2002-05-06 | 2005-09-28 | 普尔斯工程公司 | Connector assembly with light source sub-assemblies and method of manufacturing |
TW201330307A (en) * | 2012-01-12 | 2013-07-16 | Zhang Guang Technology Co Ltd | LED 3D curved lead frame for illuminating device |
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Patent Citations (2)
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CN1675799A (en) * | 2002-05-06 | 2005-09-28 | 普尔斯工程公司 | Connector assembly with light source sub-assemblies and method of manufacturing |
TW201330307A (en) * | 2012-01-12 | 2013-07-16 | Zhang Guang Technology Co Ltd | LED 3D curved lead frame for illuminating device |
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