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TWI684235B - 相對於第二物體來定位第一物體的裝置和方法 - Google Patents

相對於第二物體來定位第一物體的裝置和方法 Download PDF

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Publication number
TWI684235B
TWI684235B TW107123830A TW107123830A TWI684235B TW I684235 B TWI684235 B TW I684235B TW 107123830 A TW107123830 A TW 107123830A TW 107123830 A TW107123830 A TW 107123830A TW I684235 B TWI684235 B TW I684235B
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Taiwan
Prior art keywords
scale
relative
moving body
positioning
bonding
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TW107123830A
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English (en)
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TW201909327A (zh
Inventor
歌野哲弥
野口勇一郎
瀬山耕平
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日商新川股份有限公司
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    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
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Abstract

本發明提高半導體晶片15相對於基板16的定位精度。
本發明的安裝裝置10具備相對於基板16而直線移動的基座10、安裝於基座10且保持半導體晶片15的接合頭20、沿著基座10的移動方向與接合頭10隔開既定的間隔△H而安裝於基座10且指定基板16的位置的相機25、沿著移動方向具有多個刻度的直線刻度尺33、根據刻度檢測接合頭20的位置的接合頭側編碼器頭31、以及檢測與所指定的基板16的位置對應的直線刻度尺33的刻度位置的相機側編碼器頭32，且控制部50使基座10移動至接合頭側編碼器頭31檢測刻度位置的位置。

Description

相對於第二物體來定位第一物體的裝置和方法
本發明是有關於一種相對於第二物體來定位第一物體的裝置和方法。
舉例而言，於半導體裝置的製造中，一直使用將半導體晶片(die)等電子零件安裝於基板或其他半導體晶片的安裝裝置、或將引線(wire)接合於半導體晶片的電極及基板的電極的打線接合(wire-bonding)裝置等多種接合裝置。接合裝置具備搭載於XY台上的接合頭(bonding head)、安裝於接合頭且使接合工具(bonding tool)於上下方向上移動的接合臂(bonding arm)、及安裝於接合頭且檢測基板的接合位置的位置檢測用相機。接合工具的中心線與位置檢測用相機的光軸是僅遠離既定的偏位距離(offset distance)而配置。而且，大多情況下將位置檢測用相機的光軸對準接合位置後，使接合頭僅以偏位距離移動而使接合工具的中心線移動至接合位置進行接合。
另一方面，若持續進行接合動作，則偏位距離因溫度上升而變化。因此，有時即便將位置檢測用相機的光軸對準接合位置後使接合頭僅以偏位距離移動，接合工具的中心線亦未到達接 合位置。因此，提出有藉由在接合動作的中途校正偏位距離而提高了定位精度的接合裝置(例如參照專利文獻1)。
[現有技術文獻]
[專利文獻]
[專利文獻1]日本專利特開2001-203234號公報
然而，對於專利文獻1所記載的先前技術的接合裝置而言，為了校正偏位量而需要使接合頭移動至參照構件的位置。該接合裝置存在以下問題：於移動接合頭時移動頭等的溫度變化而偏位距離亦變化，因此定位精度不充分等。
因此，本發明的目的在於提高第一物體相對於第二物體的定位精度。
本發明的裝置相對於第二物體來定位第一物體，並且其特徵在於具備：移動體，相對於第二物體而直線移動；保持部，安裝於移動體且保持第一物體；位置指定機構，沿著移動體的移動方向與保持部隔開既定的間隔而安裝於移動體，且指定第二物體的位置；刻度尺，沿著移動體的移動方向而配置，且沿著移動方向具有多個刻度；第一位置檢測部，與保持部對應地安裝於移動體，且根據刻度而檢測保持部的位置；第二位置檢測部，與位置指定機構對應地與第一位置檢測部隔開既定的間隔而安裝於移 動體，且檢測與所指定的第二物體的位置對應的刻度尺的刻度位置；以及控制部，使移動體移動至第一位置檢測部檢測刻度位置的位置，相對於第二物體來定位第一物體。
於本發明的裝置中，亦可使第一物體為半導體晶片，第二物體為供安裝半導體晶片的基板或其他半導體晶片，且裝置將第一物體定位於第二物體的預定區域。
於本發明的裝置中，亦可使位置指定機構為以光學方式指定第二物體的位置的相機，且控制部使移動體移動至第一位置，所述第一位置是使位置指定機構第二物體的指定區域進入位置指定機構的視場的位置，利用第二位置檢測部檢測第一位置的刻度尺的刻度位置，根據利用位置指定機構拍攝第二物體的指定區域所得的圖像來檢測位置指定機構相對於指定區域的第一相對位置，根據第一相對位置，算出相對於第二物體來定位第一物體時的修正移動體的位置的修正量。
於本發明的裝置中，亦可更具備保持位置指定機構，該保持位置指定機構配置於保持部的保持面側，且指定第一物體相對於保持面的第二相對位置，控制部根據第二相對位置而算出相對於第二物體來定位第一物體時的修正移動體的位置的修正量。
於本發明的裝置中，控制部亦可根據修正量而算出刻度尺的目標刻度位置。
本發明的相對於第二物體來定位第一物體的方法的特徵在於包括：藉由保持部來保持第一物體的步驟；移動步驟，使 設有保持第一物體的保持部及位置指定機構的移動體移動至既定的位置；位置指定步驟，藉由沿著移動體的移動方向與保持部隔開既定的間隔而安裝於移動體的位置指定機構，來指定第二物體的位置；位置檢測步驟，藉由與位置指定機構對應地與第一位置檢測部隔開既定的間隔而安裝於移動體的第二位置檢測部，來檢測與所指定的第二物體的位置對應的刻度尺的刻度位置；以及定位步驟，藉由配置於移動體的第一位置檢測部來讀取刻度尺的刻度，使保持部移動至檢測刻度位置的位置，相對於第二物體來定位第一物體。
本發明可提高第一物體相對於第二物體的定位精度。
10‧‧‧基座
11‧‧‧導軌
12‧‧‧線性馬達
13‧‧‧接合平台
15‧‧‧半導體晶片
16‧‧‧基板
17‧‧‧對準標記
20‧‧‧接合頭
21‧‧‧接合工具
22x、22y、22z、31a、32a‧‧‧中心線
25‧‧‧相機
26x‧‧‧X方向中心線
26y‧‧‧Y方向中心線
26z‧‧‧光軸
27、41‧‧‧視場
31‧‧‧接合頭側編碼器頭
32‧‧‧相機側編碼器頭
33、33'‧‧‧直線刻度尺
34、34'‧‧‧刻度
40‧‧‧下相機
50‧‧‧控制部
100‧‧‧安裝裝置
BH、D、S‧‧‧中心位置
C‧‧‧位置
N、N'‧‧‧刻度位置
N2‧‧‧目標刻度位置
S101~S108、S110、S201~S208、S210‧‧‧步驟
△BH、△C‧‧‧位置差
△H、△H'‧‧‧間隔
△C(x,y)-△BH(x,y)‧‧‧位置差
圖1為表示實施形態的安裝裝置的系統構成的系統圖。
圖2(a)及圖2(b)為表示圖1所示的安裝裝置中直線刻度尺發生熱膨脹的情形時的基本動作的說明圖，圖2(a)表示第一位置時的狀態，圖2(b)表示以接合頭側編碼器頭的中心線對準由相機側編碼器頭所檢測出的直線刻度尺的刻度位置的方式移動基座所得的狀態。
圖3(a)及圖3(b)為表示圖1所示的安裝裝置中基座發生熱膨脹的情形時的基本動作的說明圖，圖3(a)表示第一位置時的狀態，圖3(b)表示以接合頭側編碼器頭的中心線對準由相機 側編碼器頭所檢測出的直線刻度尺的刻度位置的方式移動基座所得的狀態。
圖4為表示圖1所示的安裝裝置的動作的流程圖。
圖5(a)~圖5(c)為表示於圖4所示的安裝裝置的動作中的說明圖，圖5(a)表示基座位於第一位置的狀態的立面圖、圖5(b)表示接合工具的中心位置與吸附於接合工具的半導體晶片的相對位置的說明圖、及圖5(c)表示第一位置時的相機的視場的說明圖。
圖6(a)及圖6(b)為表示於圖4所示的安裝裝置的動作中的說明圖，圖6(a)表示以接合頭側編碼器頭的中心線對準由相機側編碼器頭所檢測出的直線刻度尺的刻度位置的方式移動基座所得的狀態的立面圖、及圖6(b)表示此時的接合工具與基板的對準標記的位置關係的說明圖。
圖7為表示圖1所示的安裝裝置的其他動作的流程圖。
圖8為表示圖1所示的安裝裝置的其他動作的流程圖。
圖9(a)及圖9(b)為於圖8所示的安裝裝置的動作中的說明圖，圖9(a)表示以接合頭側編碼器頭的中心線對準目標刻度位置的方式移動基座所得的狀態的立面圖、及圖9(b)表示此時的接合工具與基板的對準標記的位置關係的說明圖。
圖10為表示圖1所示的安裝裝置的其他動作的流程圖。
<安裝裝置的構成>
以下，作為相對於第二物體來定位第一物體的裝置，以將半導體晶片15安裝於基板16等的安裝裝置100為例進行說明。如圖1所示，本實施形態的安裝裝置100將作為第一物體的半導體晶片15定位於作為第二物體的基板16或作為未圖示的第二物體的其他半導體晶片的預定區域並進行安裝。安裝裝置100具備作為移動體的基座10、作為保持半導體晶片15的保持部的接合頭20、作為指定基板16的位置的位置指定機構的相機25、作為第一位置檢測部的接合頭側編碼器頭31、作為第二位置檢測部的相機側編碼器頭32、具有多個刻度34的直線刻度尺33、控制部50、下相機40、及吸附固定基板16的接合平台13。此處，安裝裝置100例如可為使半導體晶片15反轉後安裝於基板16的倒裝晶片接合裝置，或亦可為不使半導體晶片15反轉而安裝於基板16的晶片接合裝置。
基座10受到於左右方向即X方向上延伸的導軌11導引而於X方向上直線移動。另外，於基座10上安裝有於X方向上驅動基座10的線性馬達12。
於基座10上安裝有接合頭20及相機25。接合頭20使真空吸附半導體晶片15並接合於基板16的安裝工具即接合工具21於上下方向即Z方向上移動。圖1的符號22z表示接合頭20的Z方向的中心線。另外，接合工具21是與接合頭20的Z方向的中心線22z同軸地配置，因此中心線22z亦為通過接合工具21 的中心的線。相機25自基板16上方進行拍攝而取得其影像，以光學方式指定基板16的位置。圖1的符號26z表示相機25的光軸。關於接合頭20與相機25，使接合頭20的Z方向的中心線22z與相機25的光軸26z於基座10的移動方向即X方向上僅遠離既定的間隔△H而安裝於基座10。此處，既定的間隔△H為偏位距離。
另外，於基座10上安裝有接合頭側編碼器頭31及相機側編碼器頭32。如圖1所示，接合頭側編碼器頭31是以中心線31a與接合頭20的Z方向的中心線22z成為相同位置的方式安裝於基座10。另外，相機側編碼器頭32是以中心線32a與相機25的光軸26z的位置C成為相向位置的方式安裝於基座10。因此，接合頭側編碼器頭31與相機側編碼器頭32是於基座10的移動方向即X方向上僅遠離既定的間隔△H而安裝於基座10。
於與接合頭側編碼器頭31及相機側編碼器頭32相向的位置，配置有於基座10的移動方向即X方向上延伸的通用的直線刻度尺33。直線刻度尺33以既定的間隔而刻有刻度34。接合頭側編碼器頭31及相機側編碼器頭32以光學方式讀取該刻度34，檢測直線刻度尺33上的位置。另外，接合頭側編碼器頭31根據以光學方式讀取的刻度34而檢測接合頭20的位置，相機側編碼器頭32以光學方式檢測與所指定的基板16的位置對應的刻度34。
接合平台13真空吸附基板16。
如圖1所示，下相機40配置於稍許遠離接合平台13的 位置，自下方拍攝接合工具21及吸附於接合工具21的下表面的半導體晶片15。下相機40為指定半導體晶片15相對於接合工具21的下表面的相對位置的保持位置指定機構。
如圖1所示，線性馬達12及接合頭20連接於控制部50，根據控制部50的指令而動作。另外，接合頭側編碼器頭31、相機側編碼器頭32連接於控制部50，所檢測出的直線刻度尺33的刻度位置的資料被輸入至控制部50中。另外，相機25、下相機40亦連接於控制部50，相機25、下相機40所拍攝的影像被輸入至控制部50中。
控制部50為於內部含有進行資訊處理的中央處理單元(Central Processing Unit，CPU)及存儲有動作程式、資料的記憶體的電腦，調整基座10的X方向位置。
圖1所示的安裝裝置100的導軌11、直線刻度尺33藉由未圖示的Y方向驅動機構而可成一體地於Y方向上移動。Y方向驅動機構連接於控制部50，根據控制部50的指令而動作。再者，Y方向為與X方向正交的水平方向。
再者，本實施形態的安裝裝置100中，以如下方式進行說明，即，接合頭側編碼器頭31以中心線31a與接合頭20的Z方向的中心線22z成為相同位置的方式安裝於基座10，且相機側編碼器頭32以中心線32a與相機25的光軸26z成為相同位置的方式安裝於基座10，但不限於此。只要接合頭側編碼器頭31與相機側編碼器頭32於X方向上僅遠離既定的間隔△H而配置，則亦 可將接合頭側編碼器頭31配置於接合頭20的附近，將相機側編碼器頭32配置於相機25的附近。
<安裝裝置的基本動作>
繼而，一方面參照圖2(a)及圖2(b)、圖3(a)及圖3(b)一方面對本實施形態的安裝裝置100的基本動作進行說明。圖2(a)表示基座10位於第一位置的情形。於圖2(a)及圖2(b)、圖3(a)及圖3(b)的說明中，以如下方式進行說明，即，第一位置為相機25的光軸26z的位置C與基板16的指定區域即接合區域的中心位置S一致的位置，接合工具21的中心位置BH與半導體晶片15的中心位置D一致，吸附於接合工具21的半導體晶片15的中心位置D位於接合頭20的Z方向的中心線22z上。
如圖2(a)所示，於第一位置，相機25的光軸26z的位置C(x,y)與接合區域的中心位置S(x,y)一致。於第一位置，相機側編碼器頭32的中心線32a位於直線刻度尺33的第N號刻度的位置。於控制部50中，自相機側編碼器頭32輸入相機側編碼器頭32的中心線32a位於直線刻度尺33的第N號刻度的位置的資料。繼而，控制部50藉由圖1所示的線性馬達12於X方向上移動基座10。此時，控制部50藉由接合頭側編碼器頭31來檢測直線刻度尺33的刻度的資料。而且，控制部50於X方向上移動基座10直至藉由接合頭側編碼器頭31所檢測出的直線刻度尺33的刻度位於第N號刻度位置。如圖2(b)所示般，若藉由接合頭側編碼器頭31所檢測出的直線刻度尺33的刻度成為第N號刻 度位置，則接合頭20的中心線22z、半導體晶片15的中心位置D成為直線刻度尺33的刻度為第N號的刻度位置、即接合區域的中心位置S。本實施形態的安裝裝置100可如此般使半導體晶片15的中心位置D與接合區域的中心位置S一致。
於圖2(a)、圖2(b)中，虛線所示的直線刻度尺33'、刻度34'表示直線刻度尺33發生熱膨脹的狀態。於直線刻度尺33發生熱膨脹的情形時，於第一位置，相機側編碼器頭32所檢測的刻度位置成為N'。而且，控制部50於X方向上移動基座10直至藉由接合頭側編碼器頭31所檢測出的直線刻度尺33的刻度成為第N'號刻度位置。藉此，可使半導體晶片15的中心位置D對準直線刻度尺33的刻度為第N號的刻度位置、即接合區域的中心位置S。
如以上所說明，對於本實施形態的安裝裝置100而言，即便直線刻度尺33發生熱膨脹，亦可不進行偏位距離即既定的間隔△H的校正而使半導體晶片15的中心位置D對準接合區域的中心位置S。
圖3(a)、圖3(b)表示基座10於X方向上發生熱膨脹的情形。如圖3(a)所示，於第一位置，相機25的光軸26z的位置C(x,y)與接合區域的中心位置S(x,y)一致。於第一位置，相機側編碼器頭32的中心線32a位於直線刻度尺33的第N號刻度的位置。此時，接合頭20的中心線22z位於在X方向上自相機25的光軸26z僅遠離△H'的位置。
與參照圖2(b)所說明同樣地，控制部50於X方向上移動基座10直至藉由接合頭側編碼器頭31所檢測出的直線刻度尺33的刻度成為第N號刻度位置。於是，半導體晶片15的中心位置D成為直線刻度尺33的刻度為第N號的刻度位置、即接合區域的中心位置S。如此般，對於本實施形態的安裝裝置100而言，即便基座10發生熱膨脹，亦可不進行偏位距離即既定的間隔△H的校正而使半導體晶片15的中心位置D對準接合區域的中心位置S。
<安裝裝置的實際動作>
於圖2(a)及圖2(b)、圖3(a)及圖3(b)中，以如下方式進行說明，即，第一位置為相機25的光軸26z的位置C(x,y)與接合區域的中心位置S(x,y)一致的位置，接合工具21的中心位置BH與半導體晶片15的中心位置D一致，吸附於接合工具21的半導體晶片15的中心位置D位於接合頭20的中心線22z上，但實際上，於第一位置，相機25的光軸26z的位置C與接合區域的中心位置S有偏離，吸附於接合工具21的半導體晶片15的中心位置D與接合工具21的中心位置BH亦有偏離。因此，繼而一方面參照圖4~圖6(c)一方面對安裝裝置100的實際動作(電子零件安裝方法)進行說明。
如圖4的步驟S101所示，控制部50使接合頭20移動至未圖示的晶圓固持器或中間平台之上，使半導體晶片15吸附於接合工具21而拾取半導體晶片15，並藉由接合工具21保持半導 體晶片15(保持步驟)。
繼而，如圖4的步驟S102所示，控制部50使接合頭20移動至下相機40之上，藉由下相機40而取得接合工具21及半導體晶片15的影像。此時，於下相機40的視場41中，如圖5(b)中實線所示般拍攝接合工具21及半導體晶片15的圖像。如圖5(b)所示，於視場41中，接合工具21的中心位置BH(x,y)與半導體晶片15的中心位置D(x,y)僅偏差位置差△BH(x,y)。再者，於圖5(b)中，符號22x、符號22y表示接合頭20的X方向的中心線、Y方向的中心線。因此，中心線22x與中心線22y的交點成為接合工具21的中心位置BH(x,y)。再者，下相機40自下側拍攝接合工具21，因此於視場41中，X軸的正方向與圖5(c)所示的自上方向拍攝基板16的相機25的視場27的X軸的方向相反。
控制部50對圖5(b)所示的影像進行處理，檢測第二位置差、即接合工具21的中心位置BH(x,y)與半導體晶片15的中心位置D(x,y)之位置差△BH(x,y)。位置差△BH為半導體晶片15相對於保持面即接合工具21的下表面的第二相對位置。
繼而，如圖4的步驟S103所示，控制部50使基座10移動至第一位置，第一位置是基板16的對準標記17進入圖5(c)所示的相機25的視場27中的位置(移動步驟)。然後，如圖4的步驟S104所示，於第一位置，控制部50藉由相機側編碼器頭32而檢測直線刻度尺33的刻度位置。如圖5(a)所示，於第一位置， 相機側編碼器頭32的中心線32a位於直線刻度尺33的第N號刻度位置，因此於控制部50中，自相機側編碼器頭32輸入相機側編碼器頭32的中心線32a位於直線刻度尺33的第N號刻度的位置的資料(位置檢測步驟)。
繼而，如圖4的步驟S105所示，控制部50藉由相機25而取得包含對準標記17的接合區域的影像。於圖5(c)中，26x、26y為與光軸26z正交的視場27的中心線，X方向中心線26x與Y方向中心線26y的交點成為相機25的光軸26z的位置C(x,y)。而且，將兩個對準標記17連結的線的中央成為接合區域的中心位置S(x,y)。控制部50對圖5(c)所示的影像進行處理，檢測第一位置差、即光軸26z的位置C(x,y)與接合區域的中心位置S(x,y)之位置差△C(x,y)(位置指定步驟)。位置差△C為相機25相對於指定區域即接合區域的第一相對位置。
繼而，如圖4的步驟S106所示，控制部50藉由圖1所示的線性馬達12於X方向上移動基座10。此時，控制部50藉由接合頭側編碼器頭31而檢測直線刻度尺33的刻度的資料。而且，控制部50於X方向上移動基座10直至藉由接合頭側編碼器頭31所檢測出的直線刻度尺33的刻度成為第N號刻度位置。如圖6(a)所示，若藉由接合頭側編碼器頭31所檢測出的直線刻度尺33的刻度成為第N號刻度位置，則與接合頭20的中心線22z為相同位置的接合工具21的中心位置BH(x,y)移動至直線刻度尺33的刻度為第N號刻度位置、即此前相機25的光軸26z所處的位置C (x,y)。
圖6(b)為自上方向觀看該狀態下的接合工具21的中心位置BH(x,y)、接合區域的中心位置S(x,y)、半導體晶片15的中心位置D(x,y)的圖。再者，圖6(b)中的半導體晶片15的中心位置D(x,y)與圖5(b)成為左右反轉的位置的原因在於：圖6(b)為自上方向觀看的圖，相對於此，圖5(b)為自下方向觀看的圖。
如圖6(b)所示，接合工具21的中心位置BH(x,y)位於此前相機25的光軸26z所處的位置C(x,y)的位置，半導體晶片15的中心位置D(x,y)自接合工具21的中心位置BH(x,y)朝向左下僅遠離位置差△BH(x,y)。另外，接合區域的中心位置S(x,y)自接合工具21的中心位置BH(x,y)朝向左下僅遠離位置差△C(x,y)。另外，半導體晶片15的中心位置D(x,y)位於相對於接合區域的中心位置S(x,y)僅在右上遠離位置差(△C(x,y)-△BH(x,y))的位置。
因此，若使接合頭20的中心線22z的位置朝向X方向左側僅移動(△C(x)-△BH(x))，且朝向Y方向下側僅移動(△C(y)-△BH(y))，則半導體晶片15的中心位置D(x,y)與接合區域的中心位置S(x,y)一致。
因此，如圖4的步驟S107所示，控制部50藉由線性馬達12使基座10的位置朝向X方向左側僅移動(△C(x)-△BH(x))，且藉由未圖示的Y方向驅動機構使基座10的位置朝向Y 方向下側僅移動(△C(y)-△BH(y))。如此，控制部50使基座10僅移動如下距離，即，和接合區域的中心位置S(x,y)與光軸26z的位置C(x,y)之位置差△C(x,y)、及接合工具21的中心位置BH(x,y)與半導體晶片15的中心位置D(x,y)之位置差△BH(x,y)相應的距離(定位步驟)。
然後，控制部50進入圖4的步驟S108，藉由接合頭20使接合工具21降下而將半導體晶片15接合於基板16上。
如以上所說明，本實施形態的安裝裝置100可不進行偏位距離即既定的間隔△H的校正而使半導體晶片15的中心位置D對準接合區域的中心位置S，進行接合。
繼而，一方面參照圖7一方面對安裝裝置100的其他動作進行說明。對於與上文中參照圖4所說明的相同的步驟，標註相同符號而省略說明。
圖7所示的動作表示如下情形的動作，即，不藉由下相機40來進行接合工具21的中心位置BH(x,y)與半導體晶片15的中心位置D(x,y)之位置差△BH(x,y)的檢測。於該情形時，如圖7所示，控制部50於圖7的步驟S106中使基座10移動後，如圖7的步驟S110所示，使基座10僅移動和接合區域的中心位置S(x,y)與光軸26z的位置C(x,y)之位置差△C(x,y)相應的距離。即，控制部50藉由線性馬達12使基座10的位置朝向X方向左側僅移動(△C(x))，且藉由未圖示的Y方向驅動機構使基座10的位置朝向Y方向下側僅移動(△C(y))。
本動作亦可與上文中參照圖4所說明的動作同樣地，不進行偏位距離即既定的間隔△H的校正而使半導體晶片15的中心位置D對準接合區域的中心位置S，進行接合。
繼而，一方面參照圖8一方面對安裝裝置100的其他動作進行說明。對於與上文中參照圖4所說明的動作相同的動作，簡單進行說明。
圖8所示的步驟S201~步驟S205與圖4的步驟S101~S105相同。本動作於圖8的步驟S206中，根據接合區域的中心位置S(x,y)與光軸26z的位置C(x,y)之位置差△C(x,y)、及接合工具21的中心位置BH(x,y)與半導體晶片15的中心位置D(x,y)之位置差△BH(x,y)，對直線刻度尺33的刻度位置進行修正，算出目標刻度位置N2，如圖8的步驟S207所示，以接合頭側編碼器頭31的中心線31a到達目標刻度位置N2的方式使基座10移動。
圖9(a)及圖9(b)表示半導體晶片15的中心位置D(x,y)與接合區域的中心位置S(x,y)一致的狀態。如上文中參照圖6(b)所說明，於將接合工具21的中心位置BH(x,y)設為此前相機25的光軸26z所處的位置C(x,y)的位置的情形時，半導體晶片15的中心位置D(x,y)成為相對於接合區域的中心位置S(x,y)僅在右上遠離位置差(△C(x,y)-△BH(x,y))的位置。因此，若將接合工具21的中心位置BH(x,y)設為自此前相機25的光軸26z所處的位置C(x,y)僅在左下遠離位置差 (△C(x,y)-△BH(x,y))的位置，則半導體晶片15的中心位置D(x,y)與接合區域的中心位置S(x,y)一致。
因此，控制部50計算目標刻度位置N2，該目標刻度位置N2是對此前相機25的光軸26z所處的位置C(x,y)的直線刻度尺33的刻度位置N僅以與(△C(x)-△BH(x))對應的刻度程度進行修正所得。繼而，如圖9所示，使基座10移動至接合頭側編碼器頭31的中心線31a的位置成為目標刻度位置N2的位置、即接合頭側編碼器頭31所檢測出的直線刻度尺33的刻度位置成為目標刻度位置N2的位置(定位步驟)。藉此，可使半導體晶片15的中心位置D(x)與接合區域的中心位置S(x)一致。此處，此前相機25的光軸26z所處的位置C(x,y)的直線刻度尺33的刻度位置N與目標刻度位置N2之刻度差為基座10的位置的修正量。
另外，控制部50同時僅使基座10朝向Y方向下側移動(△C(y)-△BH(y))。藉此，可使半導體晶片15的中心位置D(x,y)與接合區域的中心位置S(x,y)一致。
參照圖8的動作可於X方向上藉由一次動作使半導體晶片15的中心位置D(x)與接合區域的中心位置S(x)一致，故而可較上文中參照圖4所說明的動作更高速地進行對位。另外，本動作中，亦可不進行偏位距離即既定的間隔△H的校正而使半導體晶片15的中心位置D對準接合區域的中心位置S，進行接合。
圖10為表示以下情形的動作：於圖8所示的動作中， 與圖7所示的動作同樣地，不藉由下相機40來進行接合工具21的中心位置BH(x,y)與半導體晶片15的中心位置D(x,y)之位置差△BH(x,y)的檢測。
如以上所說明，本實施形態的安裝裝置100可不進行偏位距離即既定的間隔△H的校正而使半導體晶片15的中心位置D對準接合區域的中心位置S，進行接合，因此可不進行偏位距離即既定的間隔△H的校正而提高接合精度。另外，由於無需進行偏位距離的校正，故而可提高接合的生產性。
以上，以安裝裝置100為例對本發明的實施形態進行了說明，但本發明不限於倒裝晶片接合裝置或晶片接合裝置，可應用於各種裝置。例如，可應用於打線接合裝置、工業用機器人、搬送裝置。可不限於搬送或安裝的對象物、對象物的大小、對象物的技術領域而應用於所有裝置。
10‧‧‧基座
11‧‧‧導軌
12‧‧‧線性馬達
13‧‧‧接合平台
15‧‧‧半導體晶片
16‧‧‧基板
20‧‧‧接合頭
21‧‧‧接合工具
22z、31a、32a‧‧‧中心線
25‧‧‧相機
26z‧‧‧光軸
31‧‧‧接合頭側編碼器頭
32‧‧‧相機側編碼器頭
33‧‧‧直線刻度尺
34‧‧‧刻度
40‧‧‧下相機
50‧‧‧控制部
100‧‧‧安裝裝置
△H‧‧‧間隔

Claims (9)

  1. 一種相對於第二物體來定位第一物體的裝置，包括：移動體，相對於所述第二物體而直線移動；保持部，安裝於所述移動體且保持所述第一物體；位置指定機構，沿著所述移動體的移動方向與所述保持部隔開既定的間隔而安裝於所述移動體，且指定所述第二物體的位置；刻度尺，沿著所述移動體的所述移動方向而配置，且沿著所述移動方向具有多個刻度；第一位置檢測部，與所述保持部對應地安裝於所述移動體，且根據所述刻度而檢測所述保持部的位置；第二位置檢測部，與所述位置指定機構對應地與所述第一位置檢測部隔開所述既定的間隔而安裝於所述移動體，且檢測與所指定的所述第二物體的位置對應的所述刻度尺的刻度位置；以及控制部，使所述移動體移動至所述第一位置檢測部檢測所述刻度位置的位置，相對於所述第二物體來定位所述第一物體。
  2. 如申請專利範圍第1項所述的相對於第二物體來定位第一物體的裝置，其中所述第一物體為半導體晶片，所述第二物體為供安裝所述半導體晶片的基板或其他半導體晶片，所述裝置為將所述第一物體定位於所述第二物體的預定的指定區域的裝置。
  3. 如申請專利範圍第2項所述的相對於第二物體來定位 第一物體的裝置，其中所述位置指定機構為以光學方式指定所述第二物體的位置的相機，所述控制部使所述移動體移動至第一位置，所述第一位置是所述第二物體的所述指定區域進入所述位置指定機構的視場的位置，利用第二位置檢測部來檢測所述第一位置的所述刻度尺的所述刻度位置，根據利用所述位置指定機構拍攝所述第二物體的所述指定區域所得的影像來檢測所述位置指定機構相對於所述指定區域的第一相對位置，根據所述第一相對位置，算出相對於所述第二物體來定位所述第一物體時的修正所述移動體的位置的修正量。
  4. 如申請專利範圍第1項或第2項所述的相對於第二物體來定位第一物體的裝置，更包含保持位置指定機構，所述保持位置指定機構配置於所述保持部的保持面側，且指定所述第一物體相對於保持面的第二相對位置，所述控制部根據所述第二相對位置而算出相對於所述第二物體來定位所述第一物體時的修正所述移動體的位置的修正量。
  5. 如申請專利範圍第3項所述的相對於第二物體來定位第一物體的裝置，其中所述控制部根據所述修正量而算出所述刻度尺的目標刻度位置。
  6. 如申請專利範圍第4項所述的相對於第二物體來定位第一物體的裝置，其中所述控制部根據所述修正量而算出所述刻 度尺的目標刻度位置。
  7. 如申請專利範圍第1項所述的相對於第二物體來定位第一物體的裝置，其中所述位置指定機構為以光學方式指定所述第二物體的位置的相機，所述控制部使所述移動體移動至第一位置，所述第一位置是所述第二物體的指定區域進入所述位置指定機構的視場的位置，利用第二位置檢測部來檢測所述第一位置的所述刻度尺的所述刻度位置，根據利用所述位置指定機構拍攝所述第二物體的所述指定區域所得的影像來檢測所述位置指定機構相對於所述指定區域的第一相對位置，根據所述第一相對位置，算出相對於所述第二物體來定位所述第一物體時的修正所述移動體的位置的修正量。
  8. 如申請專利範圍第7項所述的相對於第二物體來定位第一物體的裝置，其中所述控制部根據所述修正量而算出所述刻度尺的目標刻度位置。
  9. 一種相對於第二物體來定位第一物體的方法，包括：藉由保持部來保持所述第一物體的步驟；移動步驟，使設有保持所述第一物體的所述保持部及位置指定機構的移動體移動至既定的位置；位置指定步驟，藉由沿著所述移動體的移動方向與所述保持部隔開既定的間隔而安裝於所述移動體的所述位置指定機構，來 指定所述第二物體的位置；位置檢測步驟，藉由與所述位置指定機構對應地與第一位置檢測部隔開所述既定的間隔而安裝於所述移動體的第二位置檢測部，來檢測與所指定的所述第二物體的位置對應的刻度尺的刻度位置；以及定位步驟，藉由配置於所述移動體的第一位置檢測部來讀取所述刻度尺的刻度，使所述保持部移動至檢測所述刻度位置的位置，相對於所述第二物體來定位所述第一物體。
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