TWI682474B - Substrate processing device and substrate processing method - Google Patents

Abstract

The substrate processing apparatus includes: a substrate holding unit that holds at least a part of the peripheral end in a circular arc shape and supports the central portion of the substrate to hold the substrate; and a substrate rotating unit that holds the substrate held by the substrate holding unit Rotating around the rotation axis passing through the central portion of the substrate; each peripheral end height position measuring unit is used to measure each peripheral end belonging to the height position among the peripheral end positions in the circumferential direction of the substrate held by the substrate holding unit The height position; the processing liquid nozzle, which discharges the processing liquid toward the outer periphery of the substrate held by the substrate holding unit; the processing liquid supply unit, which supplies the processing liquid to the processing liquid nozzle; the nozzle driving unit, which processes the substrate The treatment liquid nozzle is driven by the movement of the liquid injection position; and the control device controls the substrate rotation unit and controls the nozzle driving unit. The control device executes: each peripheral end height position measuring step, which measures the peripheral end height position by the peripheral end height position measuring unit; the outer peripheral part processing step, which rotates the substrate around the rotation axis, While ejecting the processing liquid from the processing liquid nozzle toward the outer peripheral portion of the substrate, thereby processing the outer peripheral portion of the substrate; and the reciprocating step of the liquid injection position is parallel to the outer peripheral portion processing step, and the processing liquid is driven in the following manner Nozzle: the liquid injection position of the processing liquid from the processing liquid nozzle in the outer peripheral portion of the substrate is arranged on the side of the peripheral end of the substrate with the processing liquid spray The arrangement position of the circumferential end of the mouth belonging to the circumferential direction is kept constant, and the reciprocating movement follows the change in the height position of the circumferential end of the arrangement position.

Description

Substrate processing device and substrate processing method

The invention relates to a substrate processing device and a substrate processing method. The substrates to be processed include, for example, semiconductor wafers, liquid crystal display device substrates, plasma display substrates, FED (Field Emission Display) substrates, optical disc substrates, magnetic disc substrates, and optical magnetic disc substrates Substrates, substrates for photomasks, ceramic substrates, substrates for solar cells, etc.

In a manufacturing step such as a semiconductor device or a liquid crystal display device, the outer peripheral portion of a substrate such as a semiconductor wafer or a glass substrate for a liquid crystal display device is treated with a processing liquid. A blade-type substrate processing apparatus for processing substrates piece by piece (see Patent Document 1 below) is provided with, for example, a spin chuck that holds the substrate horizontally and rotates the substrate; and a processing liquid nozzle, which faces The processing liquid is ejected from the outer periphery of the upper surface of the substrate held by the rotation jig. The rotation jig used for such a substrate processing apparatus for processing the outer peripheral portion of the substrate is not a rotation jig for supporting the outer peripheral portion of the substrate, but a rotation for supporting the central portion of the substrate Fixture. Since the rotation jig in the form of supporting the central portion of the substrate does not support the outer peripheral portion of the substrate, there is a possibility that the substrate is inclined with respect to the horizontal posture when the substrate is held.

[Prior Technical Literature] [Patent Literature]

Patent Document 1: US Patent Publication No. 2011/281376A1.

In the treatment of the outer periphery of the substrate (hereinafter referred to as "outer periphery treatment"), since the substrate is rotated around the rotation axis, when the substrate is inclined with respect to the rotation jig, there may be a processing liquid disposed in the peripheral end of the substrate The height of the circumferential end of the nozzle in the rotation direction (hereinafter referred to as the “arrangement position circumferential end”) may change in position in each rotation direction (plane displacement). When the height of the peripheral end of the arrangement position is different, the distance between the liquid injection position of the treatment liquid from the treatment liquid nozzle and the peripheral end of the arrangement position on the upper surface of the substrate will be different. Therefore, in the case where the processing liquid nozzle is in a stationary posture with respect to the rotation jig, the distance between the liquid injection position of the processing liquid from the processing liquid nozzle and the peripheral end of the arrangement position in the upper surface of the substrate will change as the substrate rotates Variety. In this case, the uniformity of the processing width in the outer peripheral portion of the substrate cannot be kept constant during the outer peripheral processing.

Therefore, it is desired to maintain the uniformity of the processing width in the outer peripheral portion of the substrate at a high level without being affected by the change in height position at the peripheral end of the arrangement position accompanying the rotation of the substrate.

Therefore, an object of the present invention is to provide a substrate processing apparatus and substrate processing capable of highly maintaining the uniformity of the processing width in the outer peripheral portion of the substrate without being affected by the change in the height of the peripheral end of the arrangement position accompanying the rotation of the substrate method.

The present invention includes: a substrate holding unit that holds at least a part of the peripheral end in a circular arc shape and supports the central portion of the substrate to hold the substrate; and a substrate rotating unit that winds the substrate held by the substrate holding unit Rotating through the rotation axis of the central portion of the substrate; each peripheral end height position measuring unit is used to measure the height of each peripheral end belonging to the height position among the peripheral end positions in the circumferential direction of the substrate held by the substrate holding unit Position; the processing liquid nozzle, which discharges the processing liquid toward the outer periphery of the substrate held by the substrate holding unit; the processing liquid supply unit, which supplies the processing liquid to the processing liquid nozzle; the nozzle driving unit, which uses the processing liquid in the substrate The liquid injection position is driven to drive the processing liquid nozzle; and the control device controls the substrate rotation unit, the processing liquid supply unit, the peripheral end height position measurement unit, and the nozzle driving unit; the control device executes: Each peripheral end height position measuring step measures the peripheral end height position by the peripheral end height position measuring unit; the outer peripheral portion processing step is to rotate the substrate around the rotation axis while removing the processing liquid nozzle The processing liquid is ejected toward the outer peripheral portion of the substrate, thereby processing the outer peripheral portion of the substrate; and the reciprocating step of the liquid injection position is parallel to the outer peripheral portion processing step, and the processing liquid nozzle is driven in the following manner: the outer periphery of the substrate The position of the processing liquid from the processing liquid nozzle in the portion is maintained at a constant distance from the peripheral end of the peripheral end of the peripheral position of the circumferential position where the processing liquid nozzle is disposed in the peripheral end of the substrate The processing liquid nozzle is driven so as to reciprocate following the change in height position at the peripheral end of the arrangement position.

According to this configuration, the processing liquid nozzle is driven in such a manner that the liquid injection position of the processing liquid is kept reciprocally while following the change in the height position of the circumferential end of the arrangement position while maintaining a constant distance from the circumferential end of the arrangement position. Therefore, it is possible to follow the change in the height position of the peripheral end of the arrangement position accompanying the rotation of the substrate, so that the liquid injection position of the processing liquid can be followed in such a manner that the distance from the peripheral end of the arrangement position is kept constant. Thereby, the uniformity of the processing width in the outer peripheral portion of the substrate can be maintained at a high level without being affected by the change in the height position of the peripheral end of the arrangement position accompanying the rotation of the substrate.

In one embodiment of the present invention, the control device executes the reciprocating step of the liquid injection position after the step of measuring the height of each peripheral end.

According to this configuration, the step of reciprocating the liquid position can be executed based on the results of the measuring steps of the height positions of the peripheral ends.

In addition, the nozzle driving unit may include a unit that is input with a nozzle driving signal for driving the processing liquid nozzle, thereby driving the processing liquid nozzle. In this case, the control device may also perform: a nozzle driving signal preparation step, and in the reciprocating step of the liquid injection position, the control device is based on the measurement result in the step of measuring the peripheral end height position and the peripheral processing The rotation speed of the substrate in the step is to create a nozzle driving signal for driving the processing liquid nozzle in such a manner that the liquid injection position will have the same amplitude and the same periodic movement as the height position change at the peripheral end of the arrangement position; and The driving signal output step is to output the created nozzle driving signal to the nozzle driving unit at the exclusion timing, and the exclusion timing has been relative to the nozzle driving signal The phase difference between the liquid injection position and the change in the height position relative to the peripheral end of the arrangement position accompanying the delay in driving the processing liquid nozzle at the output of the number is eliminated.

According to this configuration, in the reciprocating step of the liquid injection position, the nozzle for driving the processing liquid nozzle is made in such a manner that the liquid injection position of the processing liquid will move with the same amplitude and the same periodic movement as the height position change at the peripheral end of the arrangement position Drive signal. The nozzle driving signal is output to the nozzle driving unit at the elimination timing when the phase difference accompanying the driving delay of the processing liquid nozzle has been eliminated. That is, the nozzle driving signal is output at a timing that can follow the change in the height position at the peripheral end of the arrangement position and cause the liquid position to reciprocate. Thereby, the influence of the driving delay of the processing liquid nozzle relative to the output of the nozzle driving signal can be maintained, so that the injection position of the processing liquid can follow the circumferential end of the arrangement position at a certain distance from the circumferential end of the arrangement position The height position changes.

In addition, the control device may also perform a timing acquisition step in the driving signal output step, the timing acquisition step is the most suitable chase from the processing liquid nozzle to follow the height position change of the peripheral position of the arrangement position, and the time sequence is staggered to the equivalent The time of the aforementioned phase difference, thereby obtaining the aforementioned timing of elimination.

According to this configuration, the most appropriate tracking from the position of the treatment liquid in the outer peripheral portion of the substrate to the change in height position at the peripheral end of the arrangement position is shifted to the time corresponding to the phase difference, whereby the elimination timing can be obtained. In this case, the elimination timing can be obtained simply and correctly.

In addition, the nozzle driving unit may include a nozzle moving unit that moves the processing liquid nozzle in the vertical direction. In this case, the aforementioned The control device may also perform the following step in the reciprocating step of the liquid injection position: moving the processing liquid nozzle in the vertical direction following the change in height position at the peripheral end of the arrangement position.

According to this configuration, in the reciprocating step of the liquid application position, the processing liquid nozzle is moved in the vertical direction following the change in the height position of the peripheral end of the arrangement position. With this, it is possible to maintain a constant interval between the filling position of the processing liquid and the peripheral end of the arrangement position in the outer peripheral portion of the substrate.

In addition, the nozzle driving unit may include a nozzle moving unit that moves the processing liquid nozzle along the main surface of the substrate held by the substrate holding unit. In this case, the control device may also perform the following steps in the reciprocating step of the liquid injection position: to maintain a constant interval between the liquid injection position of the processing liquid from the processing liquid nozzle and the peripheral end of the arrangement position In this manner, the processing liquid nozzle is moved in the direction of the radius of rotation of the substrate following the change in height position at the peripheral end of the arrangement position.

According to this configuration, in the reciprocating step of the liquid injection position, the processing liquid nozzle follows the height position of the peripheral end of the arrangement position in such a manner that the interval between the injection position of the treatment liquid from the treatment liquid nozzle and the peripheral end of the arrangement position is kept constant The change moves towards the radius of rotation. With this, it is possible to maintain a constant interval between the filling position of the processing liquid and the peripheral end of the arrangement position in the outer peripheral portion of the substrate.

In addition, the control device may execute a step of moving the processing liquid nozzle in the reciprocating step of the liquid injection position. The substrate processing apparatus may further include a nozzle movement amount detection unit for detecting the movement amount of the processing liquid nozzle. In these cases, the aforementioned control device It may be further executed before the reciprocating movement step of the liquid injection position: the phase difference measurement step is to output the nozzle driving signal to the nozzle moving unit and move the processing liquid nozzle, and detect the time by the nozzle movement amount detecting unit The amount of movement of the aforementioned processing liquid nozzle is used to measure the aforementioned phase difference. The control device may also perform the following steps in the timing acquisition step: acquiring the excluded timing based on the phase difference measured in the phase difference measurement step.

According to this configuration, by moving the processing liquid nozzle and detecting the moving amount of the processing liquid nozzle at this time using the nozzle moving amount detection unit, the phase difference can be actually measured. Since the processing liquid nozzle is moved according to the actually measured phase difference, the reciprocating movement of the liquid injection position of the processing liquid can better follow the change in height position at the peripheral end of the arrangement position.

In addition, the nozzle movement unit may include an electric motor, and the movement amount detection unit may include an encoder provided in the electric motor.

According to this configuration, the movement amount of the processing liquid nozzle can be accurately detected with a simple configuration such as an encoder. The reciprocating movement of the liquid injection position of the processing liquid can follow the change in height position at the peripheral end of the arrangement position with higher accuracy.

In addition, each of the peripheral end height position measuring units may also include at least one of a position sensor and a CCD (Charge Coupled Device; Charge Coupled Device) camera. The position sensor is used to detect the peripheral end of the substrate Among the height positions, a predetermined circumferential height position in the circumferential direction, the CCD camera is used to photograph at least the outer peripheral portion of the substrate.

According to this configuration, the substrate holding unit can be measured with a simple configuration The height position of each circumferential end of the held substrate in the circumferential direction.

In addition, each of the peripheral end height position measuring units may further include a position sensor for detecting a predetermined peripheral end height position in the circumferential direction among the peripheral end height positions of the substrate. In this case, the control device may also perform the following steps in each of the peripheral end height position measurement steps: while rotating the substrate held by the substrate holding unit around the rotation axis, while using the position sensor for measurement The aforementioned predetermined circumferential height position.

According to this configuration, while rotating the substrate held by the substrate holding unit, a predetermined circumferential end height position is measured using a position sensor, whereby each circumferential end height position in the circumferential direction of the substrate can be measured. That is, it is possible to measure the height position of each peripheral end in the circumferential direction of the substrate with a simple configuration such as a position sensor.

In addition, the processing liquid nozzle may discharge the processing liquid toward the outside of the substrate and diagonally downward.

According to this configuration, since the processing liquid nozzle discharges the processing liquid obliquely downward, the distance between the liquid injection position of the processing liquid and the peripheral end of the arrangement position varies depending on the height position change of the peripheral end of the arrangement position accompanying the rotation of the substrate Yu.

However, since the liquid injection position of the processing liquid is kept constant at a distance from the peripheral end of the arrangement position, the height position of the peripheral end of the arrangement position accompanying the rotation of the substrate changes, so it can be arranged without being accompanied by the rotation of the substrate The influence of the change of the height position at the peripheral end of the position keeps the distance between the filling position of the processing liquid and the peripheral end of the arrangement position constant, whereby the uniformity of the processing width in the outer peripheral portion of the substrate can be highly maintained.

In addition, the present invention provides a substrate processing method including: a substrate holding step, wherein a substrate holding unit for supporting the central portion of the substrate and holding the substrate, holding at least a part of the circumferential end of the substrate into an arc shape; Each peripheral end height position measurement step is to measure each peripheral end height position belonging to the height position among the peripheral end positions of the substrate held by the substrate holding unit in the circumferential direction; the outer peripheral portion processing step is to hold the substrate The substrate held by the unit rotates around the rotation axis passing through the central portion of the substrate, and the processing liquid is ejected from the processing liquid nozzle toward the outer peripheral portion of the substrate, thereby processing the outer peripheral portion of the substrate; In parallel with the processing steps of the outer peripheral portion, the processing liquid nozzle is driven by the nozzle driving unit in the following manner: the liquid injection position of the processing liquid from the processing liquid nozzle in the outer peripheral portion of the substrate is on one side and in the peripheral end of the substrate The interval between the circumferential positions of the circumferential ends of the circumferential positions where the processing liquid nozzles are arranged is kept constant, while reciprocatingly following the change in the height position of the circumferential ends of the arrangement positions.

According to this method, the processing liquid nozzle is driven in such a manner that the liquid injection position of the processing liquid is kept at a constant distance from the peripheral end of the arrangement position while reciprocatingly following the change in the height position of the peripheral end of the arrangement position. Therefore, it is possible to follow the change in the height position of the peripheral end of the arrangement position accompanying the rotation of the substrate, so that the liquid injection position of the processing liquid can be followed in such a manner that the distance from the peripheral end of the arrangement position is kept constant. Thereby, the uniformity of the processing width in the outer peripheral portion of the substrate can be maintained at a high level without being affected by the change in the height position of the peripheral end of the arrangement position accompanying the rotation of the substrate.

In one embodiment of the present invention, the liquid injection position reciprocates The step includes the step of moving the processing liquid nozzle in the vertical direction following the change in height position of the peripheral end of the arrangement position.

According to this method, in the reciprocating step of the liquid application position, the processing liquid nozzle is moved in the vertical direction following the change in the height position of the peripheral end of the arrangement position. With this, it is possible to maintain a constant interval between the filling position of the processing liquid and the peripheral end of the arrangement position in the outer peripheral portion of the substrate.

In addition, the reciprocating step of the liquid injection position may also include the step of causing the processing liquid to maintain a constant interval between the liquid injection position of the processing liquid from the processing liquid nozzle and the peripheral end of the arrangement position. The nozzle moves in the direction of the radius of rotation of the substrate following the change in height position at the peripheral end of the arrangement position.

According to this method, in the reciprocating step of the liquid injection position, the processing liquid nozzle follows the height position of the peripheral end of the arrangement position in such a manner that the interval between the injection position of the treatment liquid from the treatment liquid nozzle and the peripheral end of the arrangement position is kept constant The change moves towards the radius of rotation. With this, it is possible to maintain a constant interval between the filling position of the processing liquid and the peripheral end of the arrangement position in the outer peripheral portion of the substrate.

In addition, the step of reciprocating the liquid injection position may be performed after the step of measuring the height of each peripheral end.

According to this method, the step of reciprocating the liquid position can be performed according to the results of the measuring steps of the height positions of the peripheral ends.

In addition, the nozzle driving unit may also include a unit in which a nozzle driving signal for driving the processing liquid nozzle is input to thereby drive the processing liquid nozzle; and the reciprocating step of the liquid application position may also include: The nozzle driving signal preparation step is based on the measurement result in the circumferential end height position measurement step and the rotation speed of the substrate in the outer peripheral part processing step, so that the liquid injection position changes with the height position of the circumferential position of the arrangement position A nozzle driving signal for driving the processing liquid nozzle is formed with the same amplitude and the same periodic movement method; and the driving signal output step is to output the created nozzle driving signal to the nozzle driving unit at the elimination timing. The exclusion sequence has eliminated the phase difference of the liquid injection position due to the change in the height position relative to the peripheral end of the arrangement position accompanying the driving delay of the processing liquid nozzle with respect to the output of the nozzle drive signal.

According to this method, in the reciprocating step of the liquid injection position, the nozzle for driving the processing liquid nozzle is made in such a manner that the liquid injection position of the processing liquid will change with the same amplitude and the same periodic movement as the height position change at the peripheral end of the arrangement position Drive signal. The nozzle driving signal is output to the nozzle driving unit at the elimination timing when the phase difference accompanying the driving delay of the processing liquid nozzle has been eliminated. That is, the nozzle driving signal is output at a timing that can follow the change in the height position at the peripheral end of the arrangement position and cause the liquid position to reciprocate. Thereby, the influence of the driving delay of the processing liquid nozzle relative to the output of the nozzle driving signal can be maintained, so that the injection position of the processing liquid can follow the circumferential end of the arrangement position at a certain distance from the circumferential end of the arrangement position The height position changes.

In addition, the driving signal output step may also include a timing acquisition step, which is to shift the most appropriate chase from the liquid injection position to the height position change at the peripheral end of the arrangement position to a time corresponding to the phase difference, thereby Obtain the aforementioned exclusion sequence.

According to this method, the most appropriate chase from the position of the treatment liquid in the outer peripheral portion of the substrate following the height position change of the peripheral end of the arrangement position is staggered by a time equivalent to the phase difference, whereby the elimination timing can be obtained. In this case, the elimination timing can be obtained simply and correctly.

The substrate processing method may further include a phase difference measurement step, which is to output the nozzle drive signal to the nozzle drive unit and move the liquid injection position before the liquid injection position reciprocating step, thereby measuring the phase difference. In this case, the timing obtaining step may also include the following step: obtaining the excluded timing based on the phase difference.

According to this method, since the processing liquid nozzle is moved according to the actually measured phase difference, the reciprocating movement of the liquid injection position of the processing liquid can better follow the change in height position at the peripheral end of the arrangement position.

In addition, the step of measuring the circumferential end height position may further include the step of measuring the predetermined circumferential end height position using a position sensor while rotating the substrate held by the substrate holding unit about the rotation axis .

According to this method, while rotating the substrate held by the substrate holding unit, a predetermined circumferential end height position is detected using a position sensor, whereby each circumferential end height position in the circumferential direction of the substrate can be measured. That is, it is possible to measure the height position of each peripheral end in the circumferential direction of the substrate with a simple configuration such as a position sensor.

The foregoing objects, features, and effects of the present invention and other objects, features, and effects can be made clearer by referring to the accompanying drawings and by the description of the following embodiments.

1‧‧‧Substrate processing device

2‧‧‧Processing unit

3‧‧‧Control device

4‧‧‧Process chamber

5‧‧‧Rotating fixture

6‧‧‧Process liquid supply unit

8‧‧‧First inert gas supply unit

9‧‧‧Second inert gas supply unit

10‧‧‧The third inert gas supply unit

11‧‧‧heater

12‧‧‧Processing hood

12a‧‧‧Upper end

13‧‧‧ next door

14‧‧‧FFU

15‧‧‧Exhaust duct

16‧‧‧spindle

17‧‧‧rotation base

17a‧‧‧upper surface

18‧‧‧rotation motor

19‧‧‧treatment liquid nozzle

19a‧‧‧Spray outlet

20‧‧‧ nozzle arm

21‧‧‧arm support shaft

22‧‧‧arm rocking motor

22a, 122a‧‧‧ output shaft

23‧‧‧Encoder

24‧‧‧ liquid medicine piping

25‧‧‧Medicine valve

26A‧‧‧Cleaning liquid piping

26B‧‧‧Cleaning liquid valve

27‧‧‧ gas spray nozzle

28‧‧‧First gas piping

29‧‧‧ First gas valve

30‧‧‧ First nozzle moving mechanism

31‧‧‧Upper peripheral gas nozzle

32‧‧‧Second gas piping

33‧‧‧Second gas valve

34‧‧‧Second nozzle moving mechanism

36‧‧‧Lower outer gas nozzle

37‧‧‧Third gas piping

38‧‧‧The third gas valve

41‧‧‧Outer periphery

42, 43‧‧‧ Peripheral area

44‧‧‧week end

45‧‧‧Litting position

46‧‧‧ Configuration location

51‧‧‧ arithmetic unit

52‧‧‧Memory unit

53‧‧‧Output unit

54‧‧‧Recipe Memory Department

55‧‧‧Phase difference memory

56‧‧‧Move step execution flag

57‧‧‧ Nozzle drive signal

59‧‧‧Circumferential height position memory

122‧‧‧arm lift motor

147‧‧‧ Height position sensor

A‧‧‧Amplitude

A1‧‧‧Rotation axis

A2‧‧‧Shake axis

C1‧‧‧Carrier

CR, IR‧‧‧handling robot

H‧‧‧Hand

LP‧‧‧Unloading Department

P‧‧‧Phase

PD‧‧‧cycle

RD‧‧‧Diameter

SW1, SW2‧‧‧sine wave

V‧‧‧ Height direction

W‧‧‧Substrate

△P‧‧‧Phase difference

θ‧‧‧incidence angle

FIG. 1 is a schematic plan view for explaining the internal layout of a substrate processing apparatus according to an embodiment of the present invention.

2 is a schematic cross-sectional view for explaining a configuration example of a processing unit included in the substrate processing apparatus.

FIG. 3 is a cross-sectional view showing a state where the processing liquid is being discharged from the processing liquid nozzle arranged at the processing position.

FIG. 4 is a schematic diagram showing a state where the substrate is held by the rotation jig in an inclined state.

FIG. 5 is a schematic diagram showing a state where the substrate is held by the rotation jig in the inclined state.

6 is a plan view showing the processing width of the outer peripheral area of the upper surface of the substrate in the reference substrate processing example.

7 is a block diagram for explaining the electrical structure of the main part of the substrate processing apparatus.

FIG. 8 is a sine wave for showing the change in the height position at the peripheral end of the arrangement position and the sine wave for the change in the height position of the liquid injection position in the case where the nozzle driving signal has been output in time.

FIG. 9A is a diagram for explaining the height position memory portions of each peripheral end shown in FIG. 7.

9B is a diagram for explaining the phase difference memory section shown in FIG. 7.

FIG. 10 is a flowchart for explaining an example of substrate processing by the aforementioned processing unit.

FIG. 11 is used to explain the measurement steps of the height position of each peripheral end shown in FIG. 10 Step by step flow chart.

FIG. 12 is a flowchart for explaining the content of the phase difference measurement procedure shown in FIG. 10.

FIG. 13 is a flowchart for explaining the content of the outer peripheral processing procedure shown in FIG. 10.

FIG. 14 is a schematic diagram for explaining the contents of the aforementioned peripheral processing steps.

FIG. 15 is a schematic diagram for explaining the contents of the aforementioned peripheral processing steps.

FIG. 16 is a sine wave for showing the change in height position at the peripheral end of the arrangement position and the sine wave for the change in height position of the liquid injection position in the case where the nozzle driving signal is output in time sequence.

17 is a plan view showing the processing width of the outer peripheral region of the upper surface of the substrate in the aforementioned substrate processing example.

In the following, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a schematic plan view for explaining the internal layout of a substrate processing apparatus according to an embodiment of the present invention. The substrate processing apparatus 1 is a blade-type apparatus for processing a disc-shaped substrate W such as a semiconductor wafer piece by piece with a processing liquid or a processing gas. The substrate processing apparatus 1 includes: a plurality of processing units 2 for processing the substrate W with a processing liquid; and a load port LP in which a carrier C1 is mounted and the carrier C1 is used to receive Multiple substrates W processed by the processing unit 2; handling robot IR The transfer robot CR transfers the substrate W between the loading port LP and the processing unit 2; and the control device 3 controls the substrate processing device 1. The transfer robot IR transfers the substrate W between the carrier C1 and the transfer robot CR. The transfer robot CR transfers the substrate W between the transfer robot IR and the processing unit 2. The plural processing units 2 have the same configuration, for example.

FIG. 2 is a schematic cross-sectional view for explaining a configuration example of the processing unit 2.

The processing unit 2 is a unit for processing (top side processing) the outer peripheral portion 41 (refer to FIG. 3 and the like) of the substrate W using a processing liquid. More specifically, the processing unit 2 is used for processing (top side processing) using a processing liquid Units of the outer peripheral region 42 (see FIG. 3 and the like) of the upper surface (main surface) of the substrate W and the peripheral end surface 44 (see FIG. 3 and the like) of the substrate W. In the present embodiment, the outer peripheral portion 41 of the substrate W refers to an outer peripheral region 42 including the upper surface of the substrate W, an outer peripheral region 43 (see FIG. 3 etc.) of the lower surface (main surface) of the substrate W, and the substrate W Part of the circumferential end face 44. In addition, the outer peripheral regions 42 and 43 refer to, for example, a ring-shaped region having a width from a comma milli to a few millimeters from the peripheral edge of the substrate W.

The processing unit 2 includes: a box-shaped processing chamber 4 with an internal space; a spin chuck (substrate holding unit) 5 that holds a piece in a horizontal posture in the processing chamber 4 The substrate W rotates the substrate W about a vertical axis of rotation A1 passing through the center of the substrate W; the processing liquid supply unit 6 is used to supply the processing liquid (chemical liquid and rinse liquid) to the rotating jig 5 The outer peripheral area 42 of the upper surface of the substrate W held; the first inert gas supply unit 8 is used to The body is supplied to the central portion of the upper surface of the substrate W held by the rotation jig 5; the second inert gas supply unit 9 is used to supply an inert gas to the outer peripheral area 42 of the upper surface of the substrate W held by the rotation jig 5; Three inert gas supply units 10 for supplying inert gas to the outer peripheral region 43 of the lower surface of the substrate W held by the rotation jig 5; heater 11 for heating the outer periphery of the lower surface of the substrate W held by the rotation jig 5 Area 43; and a cylindrical processing cup (processing cup) 12, which surrounds the rotation jig 5.

The processing chamber 4 includes: a box-shaped partition wall 13; a fan filter unit (FFU) unit 14 as an air supply unit, which delivers clean air from the upper portion of the partition wall 13 into the partition wall 13 (equivalent to the processing chamber In the chamber 4); and an exhaust device (not shown), which exhausts the gas in the processing chamber 4 from the lower part of the partition wall 13.

The FFU 14 is arranged above the partition 13 and installed on the top of the partition 13. The FFU 14 sends clean air into the processing chamber 4 from the top of the partition 13. The exhaust device is connected to the bottom of the processing hood 12 via an exhaust duct 15 connected to the processing hood 12 for sucking the inside of the processing hood 12 from the bottom of the processing hood 12. The FFU 14 and the exhaust device form a downflow (downflow) in the processing chamber 4.

In this embodiment, the rotation jig 5 is a vacuum suction type jig. The rotation jig 5 sucks and supports the central portion of the lower surface of the substrate W. The rotation jig 5 is provided with: a spin axis 16, which extends in a vertical direction; a spin base 17, which is mounted on the upper end of the spin axis 16, and sucks and holds the substrate in a horizontal posture The lower surface of W; and a spin motor (substrate rotating unit) 18, which is coaxial with the spin shaft 16 Combined rotation axis. The rotation base 17 includes a horizontal circular upper surface 17a, and has an outer diameter smaller than the outer diameter of the substrate W. In a state where the back surface of the substrate W is sucked and held by the rotation base 17, the outer peripheral portion 41 of the substrate W extends outside the peripheral edge of the rotation base 17. The rotation motor 18 is driven, thereby rotating the substrate W about the central axis of the rotation shaft 16.

The processing liquid supply unit 6 includes a processing liquid nozzle 19. The processing liquid nozzle 19 is, for example, a straight nozzle, and discharges liquid in a state of continuous flow. The processing liquid nozzle 19 has a basic form as a scanning nozzle, and can change the supply position of the processing liquid on the upper surface of the substrate W. The treatment liquid nozzle 19 is attached to the front end of the nozzle arm 20 that extends substantially horizontally above the rotation jig 5. The nozzle arm 20 is supported by an arm support shaft 21 extending substantially vertically on the side of the rotation jig 5.

An arm swing motor 22 is coupled to the arm support shaft 21. The arm swing motor 22 is, for example, a servo motor. By the arm rocking motor 22, the nozzle arm 20 can be shaken in a horizontal plane with the vertical rocking axis A2 (that is, the central axis of the arm support shaft 21) set on the side of the rotation jig 5 as the center, thereby enabling the treatment liquid The nozzle 19 rotates about the rocking axis A2.

An arm lift motor 122 is coupled to the arm support shaft 21 via a ball screw mechanism or the like. The arm lift motor 122 is, for example, a servo motor. The arm lifting motor 122 can raise and lower the arm supporting shaft 21 and integrally raise and lower the nozzle arm 20 and the arm supporting shaft 21. With this, the processing liquid nozzle 19 can be raised and lowered (that is, moved in the height direction V (vertical direction)). An encoder 23 is coupled to the arm lifting motor 122, and the encoder 23 is used to detect the rotation angle of the output shaft 122 a of the arm lifting motor 122. When the arm lift motor 122 makes the output shaft 122a During the rotation, the processing liquid nozzle 19 rises or falls by the amount of movement in accordance with the rotation angle of the output shaft 22a. That is, when the processing liquid nozzle 19 is raised or lowered, the output shaft 22 a of the arm swing motor 22 is rotated at a rotation angle corresponding to the amount of movement of the processing liquid nozzle 19. Therefore, by detecting the rotation angle of the output shaft 22a by the encoder 23, the position of the processing liquid nozzle 19 (position in the height direction V (vertical direction)) can be detected.

A chemical liquid pipe 24 is connected to the processing liquid nozzle 19, and the chemical liquid pipe 24 is supplied with a chemical liquid from a chemical liquid supply source. A chemical liquid valve 25 for opening and closing the chemical liquid piping 24 is interposed in the middle of the chemical liquid piping 24. In addition, a cleaning liquid pipe 26A is connected to the processing liquid nozzle 19, and the cleaning liquid pipe 26A is supplied with a cleaning liquid from a cleaning liquid supply source. A cleaning liquid valve 26B for opening and closing the cleaning liquid pipe 26A is provided in the middle of the cleaning liquid pipe 26A. When the chemical liquid valve 25 is opened with the cleaning liquid valve 26B closed, a continuous supply from the chemical liquid piping 24 to the processing liquid nozzle 19 is ejected from the discharge port 19a (see FIG. 3) set at the lower end of the processing liquid nozzle 19 Flowing liquid medicine. In addition, when the cleaning liquid valve 26B is opened in a state where the chemical liquid valve 25 is closed, the cleaning liquid pipe 26A is discharged from the discharge port 19a (see FIG. 3) set at the lower end of the processing liquid nozzle 19 and supplied to the processing liquid nozzle 19. Continuously flowing cleaning fluid.

The chemical liquid is, for example, a liquid for etching the surface of the substrate W or washing the surface of the substrate W. The drug solution can also contain hydrofluoric acid, sulfuric acid, acetic acid, nitric acid, hydrochloric acid, buffered hydrofluoric acid (BHF; buffered HF), dilute hydrofluoric acid (DHF; dilute hydrofluoric acid), ammonia water, hydrogen peroxide water, organic Acid (such as citric acid, oxalic acid, etc.), organic base (such as TMAH (Tetra Methyl Ammonium Hydroxide (tetramethylammonium hydroxide), etc.), an organic solvent (such as IPA (isopropyl alcohol; isopropyl alcohol), etc.), a liquid of at least one of a surfactant and a corrosion inhibitor. The cleaning liquid system is, for example, deionized water (DIW; deionized water), but it is not limited to DIW, and may also be carbonated water, electrolytic ionized water, hydrogen water, ozone water, and hydrochloric acid water with a diluted concentration (for example, about 10 ppm to 100 ppm) Any of them.

The first inert gas supply unit 8 includes: a gas ejection nozzle 27 for supplying an inert gas to the central portion of the upper surface of the substrate W held by the rotation jig 5; and a first gas piping 28 for inert The gas is supplied to the gas ejection nozzle 27; the first gas valve 29 opens and closes the first gas piping 28; and the first nozzle movement mechanism 30 moves the gas ejection nozzle 27. When the first gas valve 29 is opened in the processing position set above the central portion of the upper surface of the substrate W, an inert gas ejected from the gas ejection nozzle 27 is formed above the substrate W from the central portion toward the outer peripheral portion 41 Flowing radial airflow.

The second inert gas supply unit 9 includes: an upper outer peripheral gas nozzle 31 for ejecting inert gas to the outer peripheral region 42 of the upper surface of the substrate W; and a second gas piping 32 for supplying inert gas to the upper The outer peripheral gas nozzle 31; the second gas valve 33 is used to open and close the second gas piping 32; and the second nozzle moving mechanism 34 is used to move the upper outer gas nozzle 31. When the second gas valve 33 is opened in the processing position opposed to the outer peripheral region 42 of the upper surface of the substrate W, the upper outer peripheral gas nozzle 31 is from the inside of the rotation radius direction of the substrate W (hereinafter referred to as the radial direction RD) The inert gas is sprayed onto the substrate W outward and diagonally downward The blowing position of the outer peripheral area 42 of the surface. With this, the processing width of the processing liquid in the outer peripheral region 42 of the upper surface of the substrate W can be suppressed.

The third inert gas supply unit 10 includes: a lower outer peripheral gas nozzle 36 that jets an inert gas to the outer peripheral region 43 of the lower surface of the substrate W; and a third gas piping 37 that supplies an inert gas to the lower outer peripheral gas The nozzle 36; and the third gas valve 38 are used to open and close the third gas piping 37. When the third gas valve 38 is opened in the processing position opposed to the outer peripheral region 43 of the lower surface of the substrate W, the lower outer peripheral gas nozzle 36 is diagonally upward from the inside in the radial direction RD to the outside (for example, 45 relative to the horizontal plane) °) The inert gas is sprayed to the blowing position of the outer peripheral region 43 of the lower surface of the substrate W.

The heater 11 is formed in an annular shape and has an outer diameter equal to the outer diameter of the substrate W. The heater 11 has an upper end surface that faces the outer peripheral region 43 of the lower surface of the substrate W held by the rotation jig 5. The heater 11 is formed using ceramic or silicon carbide (SiC), and has a heating source (not shown) embedded in it. By heating the heater 11 by the heating source, the heater 11 heats the substrate W. The outer peripheral portion 41 of the substrate W is heated by the heater 11 from the lower surface side, whereby the processing rate in the outer peripheral area 42 of the upper surface of the substrate W can be increased.

The processing cover 12 is disposed outside the substrate W held by the rotation jig 5 (direction away from the rotation axis A1). The processing cover 12 surrounds the rotation base 17. When the substrate W is supplied with the processing liquid in a state where the rotation jig 5 rotates the substrate W, the processing liquid supplied to the substrate W is thrown away around the substrate W. When supplying the processing liquid to the substrate W, the processing cover opened upward The upper end portion 12a of 12 is arranged above the rotation base 17. Therefore, the processing liquid such as the chemical liquid or water discharged to the periphery of the substrate W is received by the processing cover 12. Next, the processing liquid system received by the processing cover 12 is drained.

In addition, the processing unit 2 includes a height position sensor (position sensor) 147 for detecting the position of the height (vertical direction) V of the peripheral end of the substrate W held by the rotation jig 5 (hereinafter abbreviated as " Height position"). The height position sensor 147 detects the height position of the peripheral end surface 44 of the substrate W with respect to a predetermined measurement target position in the peripheral end surface 44 of the substrate W. In this embodiment, the height position sensor 147 and the control device 3 constitute a peripheral end height position measurement unit.

FIG. 3 is a cross-sectional view showing a state where the processing liquid is being discharged from the processing liquid nozzle 19 arranged at the processing position.

The processing liquid nozzle 19 is disposed at a processing position facing the outer peripheral region 42 of the upper surface of the substrate W. In this state, when the chemical liquid valve 25 (refer to FIG. 2) and the cleaning liquid valve 26B (refer to FIG. 2) are selectively opened, the processing liquid nozzle 19 obliquely lowers the processing liquid from the inside in the radial direction RD toward the outside ( The chemical liquid or the cleaning liquid is ejected to the liquid injection position of the outer peripheral region 42 of the upper surface of the substrate W (hereinafter referred to as "liquid injection position 45"). Since the processing liquid is ejected from the inner side in the radial direction RD toward the liquid position 45, it is possible to suppress or prevent the processing liquid from splashing toward the central portion of the upper surface of the substrate W belonging to the device formation region. At this time, the discharge direction of the processing liquid from the discharge port 19a is a direction along the radial direction RD, and is a direction to be incident on the upper surface of the substrate at a predetermined angle. The injection angle θ is, for example, about 30° to about 80°, preferably about 45°. The treatment liquid from the injection position to the injection position 45 is in the radial direction RD relative to the injection position 45 Flow outside. In the outer peripheral area 42 of the upper surface of the substrate W, only the area outside the liquid position 45 is processed by the processing liquid. That is, the processing width in the outer peripheral region 42 of the upper surface of the substrate W changes according to the distance between the liquid application position 45 and the peripheral end surface 44 of the substrate W.

FIG. 4 is a schematic diagram showing a state where the substrate W is held by the rotation jig 5 in an inclined state. FIG. 5 is a schematic diagram showing a state where the substrate W is held by the rotation jig 5 in a tilted state. FIG. 6 is a plan view showing the processing width of the outer peripheral region 42 of the upper surface of the substrate W in the reference substrate processing example.

The rotation jig 5 is a rotation jig in the form of supporting the central portion of the substrate W. This type of rotation jig does not support the outer peripheral portion 41 of the substrate W. Therefore, as shown in FIGS. 4 and 5, in the holding state of the substrate W, the substrate W may be inclined relative to the rotation jig 5.

In the processing of the outer peripheral portion 41 of the substrate W, since the substrate W is rotated about the rotation axis A1, when the substrate W is inclined with respect to the rotation jig 5, there is a processing liquid nozzle 19 disposed at the peripheral end of the substrate W The processing position corresponds to the change in the height position (surface displacement) of the circumferential end of the circumferential position (the circumferential end where the processing liquid nozzle 19 is arranged in the circumferential direction, hereinafter referred to as "arrangement position circumferential end 46"). Since the processing liquid nozzle 19 discharges the processing liquid diagonally downward, when the processing liquid nozzle 19 is in a stationary posture with respect to the rotation jig 5, the distance between the liquid injection position 45 of the processing liquid and the peripheral end 46 of the arrangement position increases The rotation angle position of the substrate W varies.

As a result, as shown in FIG. 6, the cleaning width of the outer peripheral region 42 of the upper surface of the substrate W may vary at various positions in the circumferential direction. When there is a large deviation in the washing width, it becomes necessary to detect the deviation and set the central device region to be narrow. Therefore, high accuracy is required for the washing width.

7 is a block diagram for explaining the electrical configuration of the main part of the substrate processing apparatus 1.

The control device 3 is configured using a microcomputer, for example. The control device 3 includes an arithmetic unit 51 such as a CPU (Central Processing Unit), a memory unit 52 such as a fixed memory device (not shown), a hard disk drive, an output unit 53, and an input unit (not shown). The memory unit 52 stores a program to be executed by the arithmetic unit 51.

The memory unit 52 is composed of a non-volatile memory that can electrically overwrite data. The memory unit 52 includes: a recipe memory section 54 that stores recipes that specify the contents of each process for the substrate W; each peripheral end height position memory section 59 that stores and is held by the rotation fixture 5 Position information about the position of the height direction (vertical direction) V (hereinafter referred to as the "height position of each peripheral end") of each circumferential end position of the substrate W in the circumferential direction of the substrate W; and the phase difference memory section 55, which stores the phase difference △P (refer to Figure 8).

The control device 3 is connected with a rotation motor 18, an arm swing motor 22, an arm lift motor 122, a first nozzle moving mechanism 30, a second nozzle moving mechanism 34, a heating source of the heater 11, a chemical liquid valve 25, The cleaning liquid valve 26B, the first gas valve 29, the second gas valve 33, the third gas valve 38, and the like. The control device 3 controls the rotation motor 18, the arm swing motor 22, the arm lift motor 122, the first nozzle moving mechanism 30, and the second nozzle moving machine Operation of the mechanism 34 and the heater 11. In addition, the control device 3 opens and closes the valves (25, 26B, 29, 33, 38) and the like.

During the control of these control objects, the output unit 53 sends the drive signal to each control object, and the control object is inputted with the drive signal, whereby the control object executes the drive operation in response to the drive signal. For example, in the case where the arm lift motor 122 is to be controlled to drive the nozzle arm 20, the output unit 53 sends the nozzle drive signal 57 to the arm lift motor 122. Further, by inputting the nozzle driving signal 57 to the arm lifting motor 122, the arm lifting motor 122 drives the nozzle arm 20 in response to the driving operation of the nozzle driving signal 57 (that is, performs the lifting operation).

In addition, the detection output of the encoder 23 and the detection output of the height position sensor 147 are input to the control device 3.

In the outer peripheral processing step (step S6, step S7) of this embodiment, the control device 3 drives the processing liquid nozzle 19 in the following manner: the liquid injection position in the outer peripheral area 42 (see FIG. 3) of the upper surface of the substrate W The 45 series is reciprocated in the height direction V following the change in height position of the arrangement end peripheral end 46 (hereinafter referred to as "height position change") while keeping the interval between the arrangement end peripheral end 46 constant. More specifically, the processing liquid nozzle 19 moves in the height direction V following the change in the height position of the peripheral end 46 of the arrangement position. As a result, in the outer peripheral portion 41 of the substrate W, the distance between the liquid injection position 45 and the peripheral end 46 of the arrangement position can be kept constant. In addition, in this specification, the term "reciprocating the liquid injection position 45" does not reciprocate based on the substrate W, but refers to reciprocating based on an object in a stationary state (for example, the partition wall 13 of the processing chamber 4). .

However, in order to send and receive the nozzle driving signal 57 between the control device 3 and the arm elevating motor 122, and to read in and analyze the data accompanying the sending and receiving of the nozzle driving signal 57, there is a drive in the processing liquid nozzle 19. The driving operation of the processing liquid nozzle 19 during control may be delayed relative to the output of the nozzle driving signal 57 from the control device 3.

FIG. 8 is a sine wave SW2 showing the change of the height position of the peripheral position 46 of the arrangement position and the position change of the peripheral position 46 that has followed the arrangement position of the liquid injection position 45 (that is, between the liquid injection position 45 and the circumferential end 46 of the arrangement position) The interval is kept constant). The best chase is to output the sine wave SW1 of the change of the height position of the liquid injection position 45 in the case where the nozzle driving signal 57 is output in time sequence.

In the case where the nozzle driving signal 57 is output in time sequence with the optimal position of the liquid position 45 following the change in the height position of the peripheral end 46 of the arrangement position, as shown in FIG. 8, the actual height position of the processing liquid nozzle 19 changes ( The sine wave SW1 (shown by the solid line in FIG. 8) of the liquid position 45 changes in height is delayed from the sine wave SW2 (shown by the broken line in FIG. 8) of the height position of the peripheral end 46 of the arrangement position to a predetermined time The phase difference △P. Hereinafter, the phase difference of the height position of the liquid application position 45 with respect to the arrangement position peripheral end 46 accompanying the driving delay of the processing liquid nozzle 19 will be simply referred to as “phase difference ΔP”.

Therefore, in the present embodiment, the output timing of the nozzle drive signal 57 from the control device 3 to the arm lift motor 122 is set to be earlier (staggered) from the aforementioned optimal timing to a time equivalent to the phase difference ΔP, In this way, the nozzle driving signal 57 is output to the arm lift motor 122 at the timing of excluding the phase difference ΔP. The details will be described below.

FIG. 9A is a diagram for explaining the peripheral position height memory 59 shown in FIG. 7. The peripheral end height position memory 59 stores position information about each peripheral end height position. Specifically, the amplitude A of the reciprocating movement of the liquid position 45, the period PD of the reciprocating movement of the liquid injection position 45, and the phase P of the reciprocating movement of the liquid injection position 45 (the position of the detected notch) is used as a reference Phase in the circumferential direction). The position information is based on the actual measured value measured in each circumferential end position measurement step (step S4 in FIG. 10).

FIG. 9B is a diagram for explaining the phase difference memory unit 55 shown in FIG. 7. A phase difference ΔP is stored in the peripheral end height position memory 59. The phase difference ΔP is stored in correspondence with a plurality of rotation speeds (rotation speed of the substrate W) that are different from each other.

FIG. 10 is a flowchart for explaining an example of substrate processing by the processing unit 2. FIG. 11 is a flowchart for explaining the content of each peripheral end height position measurement step (step S4) shown in FIG. 10. FIG. 12 is a flowchart for explaining the contents of the phase difference measurement step (step S5) shown in FIG. 10. FIG. 13 is a flowchart for explaining the contents of the peripheral processing steps (step S6, step S7) shown in FIG. 10. 14 and 15 are schematic diagrams for explaining the contents of the peripheral processing steps (step S6, step S7). 16 is a sine wave SW2 showing the change in the height position of the peripheral position 46 of the arrangement position and the sine wave SW1 of the change in the height position of the liquid injection position 45 in the case where the nozzle driving signal 57 is output in a time sequence. FIG. 17 is a plan view showing the processing width of the outer peripheral region 42 of the upper surface of the substrate W in the substrate processing example of FIG. 10.

Refer to Figure 1, Figure 2, Figure 3, Figure 7, Figure 9A, Figure 9B, and Figure 10 This substrate processing example will be described. Refer to FIGS. 11 to 17 as appropriate.

First, the unprocessed substrate W is carried into the processing chamber 4 (step S1 in FIG. 10). Specifically, the hand H of the transfer robot CR holding the substrate W enters the inside of the processing chamber 4, whereby the substrate W is transferred to the rotation jig 5 with the device formation surface facing upward.

After that, when the center portion of the lower surface of the support substrate W is sucked, the substrate W is held by the rotation jig 5 (step S2 in FIG. 10 ). In the present embodiment, the substrate W using the centering mechanism is not aligned with the center of the rotation jig 5.

After the substrate W is held by the rotation jig 5, the control device 3 controls the rotation motor 18 to start the rotation of the substrate W (step S3 in FIG. 10).

Next, the control device 3 executes each peripheral end height position measurement step (step S4 in FIG. 10) which measures each peripheral end height position of the substrate W held by the rotation jig 5. Referring to Fig. 11 together, the procedure for measuring the height position of each peripheral end (step S4) will be described.

In each peripheral end height position measurement step (step S4), the control device 3 increases the rotation speed of the substrate W to a predetermined measurement rotation speed (a speed slower than the liquid processing speed described below, for example, about 50 rpm) and maintains This measurement rotation speed (step S11 of FIG. 11).

When the rotation of the substrate W reaches the measurement rotation speed (Yes in step S11), the control device 3 uses the height position sensor 147 to start measuring the height position of each peripheral end (step S12 in FIG. 11). Specifically, the control device 3 controls the rotation motor 18 to rotate the substrate W about the rotation axis A1, and detects the pre-position in the peripheral end surface 44 of the substrate W by the height sensor 147 The height position of the measured object position. After the height position sensor 147 starts detection, when the substrate W finishes rotating at least one revolution (360°) (Yes in step S13 of FIG. 11), it is assumed that all the peripheral end height positions have been detected (yes ) And the measurement ends (step S14 in FIG. 11). With this, the tilt state of the substrate W with respect to the rotation jig 5 can be detected.

The control device 3 calculates the amplitude A of the reciprocating movement of the liquid position 45, the period PD of the reciprocating movement of the liquid position 45 and the phase P of the reciprocating movement of the liquid position 45 (based on the gap Phase in the circumferential direction of detection) (step S15 in FIG. 11). The calculated amplitude A, period PD, and phase P are stored in each peripheral end height position storage unit 59 (step S16 in FIG. 11 ). After that, each peripheral end height position measurement step (step S4) ends. The execution time of each peripheral end height position measurement step (step S4) is, for example, about 5 seconds.

Next, the control device 3 executes a phase difference measurement step (step S5 in FIG. 10) for measuring the phase difference ΔP (refer to FIG. 8). Referring to FIG. 12 together, the phase difference measurement procedure (step S5) will be described.

In the phase difference measurement step (step S5), the rotation of the substrate W in the following peripheral processing steps (peripheral chemical solution processing step (step S6) and peripheral cleaning solution processing step (step S7)) has been measured The phase difference △P of speed (processing rotation speed). When a plurality of processing rotation speeds are set in the outer peripheral processing steps, the phase difference ΔP (that is, the plurality of phase differences ΔP) corresponding to each processing rotation speed is measured.

Specifically, the control device 3 controls the arm lifting motor 122 to arrange the processing liquid nozzle 19 at a processing position opposed to the outer peripheral area 42 of the upper surface (Step S21 of FIG. 12). In addition, the control device 3 controls the rotation motor 18 to increase the rotation speed of the substrate W to a predetermined measurement rotation speed (that is, the rotation speed of the substrate W in the outer peripheral processing step) and to maintain the measurement rotation speed (step of FIG. 12 S22).

The control device 3 is based on the amplitude A, the period PD, and the phase P (the measurement result of each peripheral end height position measurement step (step S4)) memorized by each peripheral end height position storage unit 59, and the liquid injection position 45 will be arranged in accordance with The position of the position peripheral end 46 changes with the same amplitude A and the same period PD movement to form a nozzle drive signal 57 for driving the processing liquid nozzle 19 (nozzle drive signal creation step, step S23 in FIG. 12 ).

Next, when the rotation of the substrate W reaches the measured rotation speed (Yes in step S22), the control device 3 detects the rotation of the output shaft of the rotation motor 18 based on an encoder (not shown) The rotation angle position of the substrate W follows the position change of the placement position peripheral end 46 at the filling position 45 (that is, the interval between the filling position 45 and the placement position peripheral end 46 is kept constant). Signal 57 (step S24 in FIG. 12). As described with reference to FIG. 8, the sine wave SW1 (shown with a solid line in FIG. 8) whose height position of the actual liquid injection position 45 changes is the sine wave SW2 (FIG. 8) that changes from the height position of the peripheral end 46 of the arrangement position (Indicated by the dotted line in) The delay reaches the predetermined phase difference ΔP. The control device 3 refers to the detection output of the encoder 23 to obtain the actual height position change of the processing liquid nozzle 19 (the height position change of the liquid application position 45), and calculates the phase difference ΔP based on the actual height position change (FIG. 12 Step S25). The calculated phase difference ΔP is stored in each phase difference memory unit 55 (step S26 in FIG. 12 ). By this, end with Measurement of the phase difference ΔP corresponding to the rotation speed. When the measurement of the phase difference ΔP for other rotation speeds remains (YES in step S27), the process returns to step S21 in FIG. 12. When the measurement of the phase difference ΔP for all the rotation speeds has been completed (NO in step S27), the phase difference measurement step (step S5) is ended.

After the phase difference measurement step (step S5) ends, the control device 3 then executes a peripheral chemical processing step (peripheral processing step, step S6 in FIG. 10), which uses a chemical to process the substrate The outer periphery 41 of W. The chemical liquid processing step (step S6) of the outer peripheral portion is performed in a state where the rotation of the substrate W is at a predetermined rotation speed (a predetermined speed of about 300 rpm to about 1000 rpm). In addition, the control device 3 executes a liquid position reciprocating step in parallel with the outer peripheral portion chemical liquid processing step (step S6), which causes the chemical liquid in the outer peripheral area 42 of the upper surface of the substrate W The liquid injection position 45 is reciprocated in the height direction V following the change in the height position of the arrangement position peripheral end 46 so that the interval between the liquid injection position 45 and the arrangement position peripheral end 46 is kept constant. Referring to FIG. 13 together, the procedure for processing the chemical solution in the outer periphery (step S6) will be described.

In the peripheral chemical processing step (step S6), the control device 3 controls the rotation motor 18 to set the rotation speed of the substrate W to a predetermined processing rotational speed (that is, the substrate in the peripheral chemical processing step (step S6)) (Rotation speed of W) (step S30 in FIG. 13). In addition, in the case where the processing liquid nozzle 19 is located at the retreat position, the control device 3 controls the arm lift motor 122 to arrange the processing liquid nozzle 19 at a processing position opposed to the outer peripheral area 42 of the upper surface (step S31 in FIG. 13) .

When the rotation of the substrate W reaches the processing rotation speed, the control device 3 opens the chemical liquid valve 25 while closing the cleaning liquid valve 26B, whereby the chemical liquid is discharged from the discharge port 19a of the processing liquid nozzle 19 (step S32 in FIG. 13) ). In addition, as shown in FIGS. 14 and 15, the control device 3 starts to execute the aforementioned reciprocating step of the liquid injection position (step S33 in FIG. 13 ).

The step of reciprocating the injection position (step S33) is performed as follows.

That is, the control device 3 is based on the amplitude A, the period PD, and the phase P (the measurement result of each peripheral end height position measurement step (step S4)) memorized by the peripheral end height position memory 59, and the liquid position 45 will The nozzle driving signal 57 for driving the processing liquid nozzle 19 (the nozzle driving signal creation step, step S34 in FIG. 13) is prepared with the same amplitude A and the same period PD movement as the position change of the arrangement end 46.

Then, when the rotation of the substrate W reaches the processing rotation speed, the control device 3 is based on the rotation angle position of the substrate W detected by an encoder (not shown) for detecting the rotation amount of the output shaft of the rotation motor 18 at Output the nozzle drive signal 57 (exclude timing) from the most suitable chase sequence (that is, the interval between the filling position 45 and the peripheral end 46 of the arrangement position is kept constant) early (staggered) to a time equivalent to the phase difference △P Step S35 of FIG. 13). At this time, the control device 3 refers to the phase difference memory unit 55 to obtain the exclusion sequence with the phase difference ΔP corresponding to the processing rotation speed among the stored phase differences ΔP.

As shown in FIG. 16, in the case where the nozzle driving signal has been output at the time sequence, the sine wave SW1 (shown with a solid line in FIG. 16) whose actual height of the liquid position 45 changes is almost or completely The sine wave SW2 (shown with a dotted line in FIG. 16) whose height and position at the peripheral end 46 change has no phase difference.

In this way, the nozzle driving signal 57 is output to the arm lift motor 122 at the timing of excluding the phase difference ΔP. Thereby, the nozzle driving signal 57 can be output at a timing that allows the liquid position 45 to follow the change in the height position of the arrangement position peripheral end 46 and reciprocate. Thereby, regardless of the drive delay of the processing liquid nozzle 19 with respect to the output of the nozzle drive signal 57, the liquid position 45 can follow the change of the height position of the peripheral edge 46 of the arrangement position well. Therefore, as shown in FIG. 17 and as shown in the outer peripheral processing steps (steps S6 and S7), the uniformity of the processing width in the outer peripheral area 42 of the upper surface of the substrate W can be improved.

When a predetermined period of time has elapsed since the discharge of the chemical solution (YES in step S36 of FIG. 13), the control device 3 closes the chemical solution valve 25. This stops (ends) the discharge of the chemical liquid from the processing liquid nozzle 19 (step S37 in FIG. 13).

In addition, in the outer peripheral chemical solution processing step (step S6), the heat source of the heater 11 is turned on, and the outer peripheral region 43 of the lower surface of the substrate W is heated by the heater 11. Thereby, the processing speed of the chemical treatment in the outer peripheral portion is increased. In addition, in the outer periphery chemical solution processing step (step S6 ), by injecting an inert gas from the gas ejection nozzle 27 located at the processing position, a radial air flow is formed above the substrate W from the center to the outer periphery 41. The central portion of the upper surface of the substrate W belonging to the device formation area is protected by this radial airflow. In addition, in the outer peripheral portion chemical liquid processing step (step S6 ), the inert gas is blown from the upper outer peripheral portion gas nozzle 31 located at the processing position to the blowing position of the outer peripheral area 42 of the upper surface of the substrate W. The processing width of the chemical solution in the outer peripheral area 42 of the upper surface of the substrate W can be controlled by the blowing of the inert gas. this In addition, in the outer peripheral portion chemical solution processing step (step S6), inert gas is sprayed from the lower outer peripheral portion gas nozzle 36 located at the processing position to the blowing position of the outer peripheral region 43 of the lower surface of the substrate W. The injection of the inert gas can prevent the chemical liquid from getting into the lower surface of the substrate W.

The third inert gas supply unit 10 includes: a lower outer peripheral gas nozzle 36 for ejecting inert gas to the outer peripheral region 43 of the lower surface of the substrate W; and a third gas piping 37 for supplying inert gas to The lower outer peripheral gas nozzle 36; and the third gas valve 38 are used to open and close the third gas piping 37. When the third gas valve 38 is opened in the processing position opposed to the outer peripheral area 43 of the lower surface of the substrate W, the lower outer gas nozzle 36 ejects the inert gas to the outer peripheral area of the lower surface of the substrate W vertically upward 43's blowing position.

After the outer peripheral chemical solution processing step (step S6) ends, the control device 3 then executes an outer peripheral cleaning solution processing step (outer peripheral processing step, step S7 in FIG. 10), which uses a cleaning The outer peripheral portion 41 of the liquid processing substrate W. The outer peripheral portion cleaning solution processing step (step S7) is performed in a state where the rotation of the substrate W is at a predetermined rotation speed (a predetermined speed of about 300 rpm to about 1000 rpm). In addition, the control device 3 executes the reciprocating liquid position step in parallel with the outer peripheral cleaning liquid processing step (step S7), which causes the cleaning liquid in the outer peripheral area 42 of the upper surface of the substrate W The liquid injection position 45 is reciprocated in the height direction V following the change in the height position of the arrangement position peripheral end 46 so that the interval between the liquid injection position 45 and the arrangement position peripheral end 46 is kept constant. Referring to FIG. 13 together, the procedure for processing the cleaning liquid in the outer peripheral portion (step S7) will be described.

In the peripheral cleaning solution processing step (step S7), the control device 3 controls the rotation motor 18 to set the rotation speed of the substrate W to a predetermined processing rotation speed (that is, the substrate in the peripheral cleaning solution processing step (step S7)) W rotation speed) (step S30). In addition, when the processing liquid nozzle 19 is located at the retreat position, the control device 3 controls the arm lift motor 122 to arrange the processing liquid nozzle 19 at a processing position opposed to the outer peripheral area 42 of the upper surface (step S31).

When the rotation of the substrate W reaches the processing rotation speed, the control device 3 opens the cleaning liquid valve 26B while closing the chemical liquid valve 25, thereby starting to discharge the cleaning liquid from the discharge port 19a of the processing liquid nozzle 19 (step S32). In addition, the control device 3 starts to execute the reciprocating step of the liquid injection position (step S33). Since the step of reciprocating the liquid injection position has already been described in the chemical liquid processing step (step S6) in the outer peripheral portion, its description is omitted (step S33). When a predetermined period of time has elapsed since the discharge of the cleaning liquid (YES in step S36), the control device 3 closes the cleaning liquid valve 26B. This stops (ends) the discharge of the cleaning liquid from the processing liquid nozzle 19 (step S37).

In addition, in the outer peripheral portion cleaning liquid processing step (step S7), a radial gas flow flowing from the central portion toward the outer peripheral portion 41 is formed above the substrate W by the inert gas ejected from the gas ejection valve 27 at the processing position . In addition, in the outer peripheral portion cleaning liquid processing step (step S7 ), the inert gas is blown from the upper outer peripheral portion gas nozzle 31 located at the processing position to the blowing position of the outer peripheral area 42 of the upper surface of the substrate W. In addition, in the outer peripheral portion cleaning liquid processing step (S7), inert gas is sprayed from the lower outer peripheral portion gas nozzle 36 located at the processing position to the blowing position of the outer peripheral region 43 of the lower surface of the substrate W. In the outer peripheral portion cleaning liquid processing step (S7), the heat source of the heater 11 may be turned on and the outer peripheral region 43 of the lower surface of the substrate W may be heated by the heater 11 or the outer peripheral region 43 of the lower surface of the substrate W may not be heated.

After that, the control device 3 controls the arm lift motor 122 to return the processing liquid nozzle 19 to the retracted position on the side of the rotation jig 5.

Next, spin-drying to dry the substrate W is performed (step S8 in FIG. 10 ). Specifically, the control device 3 controls the rotation motor 18 to accelerate the substrate W to a drying rotation speed (for example, thousands of rpm) higher than the rotation speed in each processing step S2 to step S8, and rotate the substrate W with the drying Rotate at speed. With this, the liquid applied to the substrate W by a large centrifugal force, and the liquid system adhering to the outer peripheral portion 41 of the substrate W are thrown away around the substrate W. In this way, the liquid is removed from the outer peripheral portion 41 of the substrate W to dry the outer peripheral portion 41 of the substrate W.

When a predetermined period of time has elapsed since the substrate W started to rotate at a high speed, the control device 3 stops the rotation of the substrate W by the rotation jig 5 by controlling the rotation motor 18.

After that, the substrate W is carried out from the processing chamber 4 (step S9 in FIG. 10). Specifically, the control device 3 causes the hand of the transfer robot CR to enter the processing chamber 4. Next, the control device 3 causes the hand of the transfer robot CR to hold the substrate W on the rotation jig 5. After that, the control device 3 retracts the hand of the transport robot CR from the processing chamber 4. With this, the processed substrate W is carried out from the processing chamber 4.

Thus, according to the present embodiment, the processing liquid nozzle 19 is driven as follows: the distance between the liquid application position 45 side and the peripheral end 46 of the arrangement position is maintained. Keeping constant, it reciprocates while following the change of the height position of the peripheral end 46 of the arrangement position. Therefore, in response to the change in the height position of the peripheral end 46 of the arrangement position accompanying the rotation of the substrate W, the liquid application position 45 can be followed so that the interval between the liquid application position 45 and the arrangement position peripheral end 46 is kept constant. Thereby, the uniformity of the processing width in the outer peripheral portion 41 of the substrate W can be maintained at a high level without being affected by the change in the height position of the peripheral end 46 of the arrangement position accompanying the rotation of the substrate W.

In addition, while rotating the substrate W held by the rotation jig 5 about the rotation axis A1, the height position sensor 147 can be used to detect the height position of the measurement target position of the peripheral end surface 44 of the substrate W, thereby measuring the substrate W satisfactorily The position of each circumferential end in the circumferential direction. That is, a simple configuration such as a position sensor (height position sensor 147) can be used to measure the circumferential end positions of the substrate W in a good manner.

In addition, it is possible to move the processing liquid nozzle 19 and use the encoder 23 to detect the amount of movement of the processing liquid nozzle 19 at this time, thereby actually measuring the phase difference ΔP. Since the processing liquid nozzle 19 is moved according to the actually measured phase difference ΔP, the reciprocating movement of the liquid position 45 can follow the position change of the peripheral end 46 of the arrangement position better.

In addition, a plurality of phase differences ΔP are provided in the phase difference memory unit 55, and each phase difference ΔP is provided in accordance with the processing rotation speed of the substrate W. Then, the nozzle driving signal 57 is output at the timing of excluding the phase difference ΔP corresponding to the processing rotation speed. Therefore, even in the case where the processing rotation speed of the substrate W in the chemical processing step (step S6) in the outer peripheral portion of the substrate processing apparatus 1 differs according to the content of the recipe, The nozzle drive signal is output at the most appropriate timing corresponding to the rotation speed.

Although one of the embodiments of the present invention has been described above, the present invention can be implemented in other forms.

For example, as shown by the dotted line in FIG. 7, the memory unit 52 may also be provided with a moving step execution flag 56 which is used to determine whether to process the step in the outer periphery (step S6, step S7 ), the liquid position reciprocating step (step S33 in FIG. 13) is executed. The movement step execution flag 56 selectively stores a predetermined value (for example, "5A[H]") corresponding to the execution of the reciprocating movement step of the liquid injection position and a predetermined value corresponding to the non-execution of the reciprocating movement of the liquid injection position (Eg 00[H]). Moreover, when the moving step execution flag 56 stores "5A[H]", the control device 3 may perform the reciprocating liquid position moving step in parallel with the outer peripheral processing steps (step S6, step S7). And in the case where the movement step execution flag 56 stores "00[H]", the control device 3 does not perform the reciprocating movement step of the liquid position in parallel with the outer peripheral processing steps (step S6, step S7).

In addition, although it has been described that all of the plurality of phase differences ΔP memorized in the phase difference storage unit 55 are obtained in the phase difference measurement step (step S5), only the phase difference measurement step (step S5) may be obtained The phase difference ΔP corresponding to at least one processing rotation speed, and the phase difference ΔP corresponding to the other processing rotation speed is obtained by calculation based on the phase difference ΔP.

In addition, although it has been described that the actual measurement value of the phase difference ΔP is used to obtain the exclusion sequence, the phase difference ΔP stored in the phase difference storage unit 55 may not be the actual measurement value but a predetermined value set in advance. In this case, the phase difference measurement step (step S5) can also be omitted from the substrate processing example shown in FIG.

In addition, the nozzle driving signal 57 may be output to the arm lift motor 122 at the optimal timing described above in the reciprocating step of the liquid injection position (step S33). In this case, the step of measuring the height position of each peripheral end (step S4) may be executed in parallel with the reciprocating step of the liquid injection position (step S33). In this case, the reciprocating movement of the liquid position 45 can also be controlled based on the feedback of the measurement result of each peripheral end height position measurement step (step S4).

In addition, although the method for reciprocating the processing liquid nozzle 19 in the height direction V is used as the method for reciprocating the liquid injection position 45 in the height direction V in the step of reciprocating the liquid injection position (step S33), A method for reciprocating the processing liquid nozzle 19 in the radial direction RD may be used instead. In this case, the arm swing motor 22 can be used as an electric motor. In this case, when an encoder for detecting the rotation angle of the output shaft 22a of the arm rocking motor 22 is combined with the arm rocking motor 22 and the arm rocking motor 22 rotates the output shaft 22a, the processing liquid nozzle 19 has already responded The amount of movement of the rotation angle of the output shaft 22a rotates around the central axis of the arm support shaft 21. That is, when the processing liquid nozzle 19 rotates around the central axis of the arm support shaft 21, the output shaft 22a of the arm swing motor 22 is rotated at a rotation angle corresponding to the movement amount of the processing liquid nozzle 19. Therefore, by detecting the rotation angle of the output shaft 22a by the encoder, the position of the processing liquid nozzle 19 can be detected.

Further, in the outer peripheral processing steps (steps S6 and S7), the control device 3 causes the processing liquid nozzle 19 to follow the height position change of the arrangement position peripheral end 46 (hereinafter referred to as "height position change") in the radial direction RD Move back and forth. Thereby, in the outer peripheral processing steps (steps S6 and S7), the liquid injection position 45 in the outer peripheral area 42 (see FIG. 3) of the upper surface of the substrate W can be The interval between the peripheral ends 46 of the arrangement position is kept constant.

In addition, as a method for reciprocating the liquid application position 45, in addition to the above-mentioned method, it is also possible to combine the reciprocating motion in the height direction V and the reciprocating motion in the radial direction RD or change the discharge direction of the processing liquid nozzle 19 The liquid injection position 45 reciprocates in the radial direction RD.

In addition, although it has been described that the height position sensor is used to measure the height position of the outer peripheral portion 41 of the substrate W in each peripheral end height direction measurement step (step S4), and the position of the peripheral end surface 44 of the substrate W is measured using the height position sensor However, the outer peripheral area 42 of the upper surface of the substrate W may be measured using a height position sensor, or the outer peripheral area 43 of the lower surface of the substrate W may be measured using a height position sensor.

In addition, although a position sensor (height position sensor 147) is used as each peripheral end position measuring unit, a CCD camera may also be used as the peripheral end position measuring unit.

In addition, as the nozzle moving unit, although a scanning type nozzle moving unit for moving the processing liquid nozzle 19 while drawing an arc trajectory is exemplified, a linear movement for linearly moving the processing liquid nozzle 19 may be used. Nozzle moving unit.

In addition, although it has been exemplified that the processing liquid nozzle 19 is a processing liquid nozzle for ejecting both the chemical liquid and the cleaning liquid, it is also possible to separately provide a processing liquid nozzle (chemical liquid nozzle) for ejecting the chemical liquid and for ejecting Cleaning fluid nozzle (cleaning fluid nozzle).

In addition, in the foregoing embodiments, although the substrate processing apparatus has been described as an apparatus for processing the disk-shaped substrate W, as long as the substrate W At least a part of the peripheral end is formed into an arc shape, and it does not necessarily need to be a true circle.

The present invention corresponds to Japanese Patent Application No. 2017-37562 proposed by the Japan Patent Office on February 28, 2017, and all contents of Japanese Patent Application No. 2017-37562 are applied here.

2‧‧‧Processing unit

4‧‧‧Process chamber

5‧‧‧Rotating fixture

6‧‧‧Process liquid supply unit

8‧‧‧First inert gas supply unit

9‧‧‧Second inert gas supply unit

10‧‧‧The third inert gas supply unit

11‧‧‧heater

12‧‧‧Processing hood

12a‧‧‧Upper end

13‧‧‧ next door

14‧‧‧FFU

15‧‧‧Exhaust duct

16‧‧‧spindle

17‧‧‧rotation base

17a‧‧‧upper surface

18‧‧‧rotation motor

19‧‧‧treatment liquid nozzle

20‧‧‧ nozzle arm

21‧‧‧arm support shaft

22‧‧‧arm rocking motor

23‧‧‧Encoder

24‧‧‧ liquid medicine piping

25‧‧‧Medicine valve

26A‧‧‧Cleaning liquid piping

26B‧‧‧Cleaning liquid valve

27‧‧‧ gas spray nozzle

28‧‧‧First gas piping

29‧‧‧ First gas valve

30‧‧‧ First nozzle moving mechanism

31‧‧‧Upper peripheral gas nozzle

32‧‧‧Second gas piping

33‧‧‧Second gas valve

34‧‧‧Second nozzle moving mechanism

36‧‧‧Lower outer gas nozzle

37‧‧‧Third gas piping

38‧‧‧The third gas valve

122‧‧‧arm lift motor

122a‧‧‧ output shaft

147‧‧‧ Height position sensor

A1‧‧‧Rotation axis

A2‧‧‧Shake axis

V‧‧‧ Height direction

W‧‧‧Substrate

Claims (19)

A substrate processing apparatus includes: a substrate holding unit that holds a substrate having at least a part of a peripheral end in an arc shape, and supports a central portion of the substrate to hold the substrate; and a substrate rotating unit that is held by the substrate holding unit The substrate rotates around the axis of rotation passing through the central portion of the substrate; each peripheral end height position measuring unit is used to measure each of the peripheral end positions in the circumferential direction of the substrate held by the substrate holding unit in the circumferential direction Peripheral height position; processing liquid nozzle, which discharges the processing liquid toward the outer periphery of the substrate held by the substrate holding unit; processing liquid supply unit, which supplies the processing liquid to the processing liquid nozzle; nozzle drive unit, which uses the substrate The processing liquid injection position drives the processing liquid nozzle; and the control device controls the substrate rotation unit, the processing liquid supply unit, the peripheral end height position measurement unit and the nozzle driving unit; the control device It is executed: each peripheral end height position measuring step is to measure the peripheral end height position by the peripheral end height position measuring unit; the outer peripheral portion processing step is to rotate the substrate around the rotation axis while rotating the substrate The processing liquid nozzle ejects the processing liquid toward the outer peripheral portion of the substrate, thereby processing the outer peripheral portion of the substrate; and The reciprocating step of the liquid injection position is parallel to the processing step of the outer peripheral portion, and drives the processing liquid nozzle in the following manner: the liquid injection position of the processing liquid from the processing liquid nozzle in the outer peripheral portion of the substrate is on the side of the substrate The arrangement position of the circumferential ends of the circumferential ends of the processing liquid nozzles in the circumferential end of the arrangement is kept constant, while reciprocatingly following the change in the height position of the circumferential ends of the arrangement positions. The substrate processing apparatus according to claim 1, wherein the control device executes the reciprocating step of the liquid injection position after the step of measuring the height of each peripheral end. The substrate processing apparatus according to claim 2, wherein the nozzle driving unit includes the following unit: a nozzle driving signal for driving the processing liquid nozzle is input to thereby drive the processing liquid nozzle; the control device executes : A nozzle driving signal preparation step, in the reciprocating step of the liquid injection position, the control device is based on the measurement result in the measurement step of each peripheral end height position and the rotation speed of the substrate in the outer peripheral part processing step. The liquid injection position will be made with the same amplitude and the same periodic movement as the height position change at the peripheral end of the aforementioned arrangement position, and the nozzle drive signal for driving the treatment liquid nozzle; and the drive signal output step is to eliminate all The created nozzle driving signal is output to the nozzle driving unit, and the row Except for the timing sequence, the phase difference of the liquid injection position due to the change in the height position relative to the peripheral end of the arrangement position accompanying the driving delay of the treatment liquid nozzle with respect to the output of the nozzle drive signal has been eliminated. The substrate processing apparatus according to claim 3, wherein the control device executes a timing acquisition step in the drive signal output step, and the timing acquisition step is the most appropriate to follow the height position change of the arrangement position peripheral end from the processing liquid nozzle The chase of the time is staggered to the time corresponding to the aforementioned phase difference, thereby obtaining the aforementioned timing of elimination. The substrate processing apparatus according to any one of claims 1 to 4, wherein the nozzle driving unit includes: a nozzle moving unit that moves the processing liquid nozzle in a vertical direction; and the control device is at the liquid application position In the reciprocating step, the following step is performed: the processing liquid nozzle is moved in the vertical direction following the change in the height position of the peripheral end of the arrangement position. The substrate processing apparatus according to any one of claims 1 to 4, wherein the nozzle driving unit includes a nozzle moving unit that moves the processing liquid nozzle along the main surface of the substrate held by the substrate holding unit The control device performs the following steps in the reciprocating step of the liquid injection position: to maintain a constant interval between the liquid injection position of the treatment liquid from the treatment liquid nozzle and the peripheral end of the arrangement position In this manner, the processing liquid nozzle is moved in the direction of the radius of rotation of the substrate following the change in height position at the peripheral end of the arrangement position. The substrate processing apparatus according to any one of claims 1 to 4, wherein the control device executes a step of moving the processing liquid nozzle in the reciprocating step of the liquid application position; the substrate processing device further includes: The nozzle movement amount detection unit is used to detect the movement amount of the treatment liquid nozzle; the control device is further executed before the reciprocating movement step of the liquid injection position: a phase difference measurement step is to output the nozzle driving signal to the nozzle movement unit Moving the processing liquid nozzle, and detecting the moving amount of the processing liquid nozzle at this time by the nozzle moving amount detection unit, thereby measuring the phase difference; the control device performs the following steps in the timing acquisition step : Obtain the exclusion sequence based on the phase difference measured in the phase difference measurement step. The substrate processing apparatus according to claim 7, wherein the nozzle movement unit includes an electric motor; and the movement amount detection unit includes an encoder provided in the electric motor. The substrate processing apparatus according to any one of claims 1 to 4, wherein the peripheral height position measurement unit includes at least one of a position sensor and a charge-coupled element camera, and the position sensor is Used to detect the circumferential direction in the height position of the peripheral end of the aforementioned substrate At a predetermined peripheral height position, the charge-coupled element camera is used to photograph at least the outer peripheral portion of the substrate. The substrate processing apparatus according to any one of claims 1 to 4, wherein each of the peripheral end height position measuring units includes: a position sensor for detecting the circumferential direction of the peripheral end height position of the substrate The predetermined peripheral height position of the above; the control device performs the following steps in the measuring steps of each peripheral end height position: using the position sensing while rotating the substrate held by the substrate holding unit about the rotation axis The instrument measures the aforementioned predetermined circumferential height position. The substrate processing apparatus according to any one of claims 1 to 4, wherein the processing liquid nozzle discharges the processing liquid toward the outside of the substrate and diagonally downward. A substrate processing method includes: a substrate holding step, wherein a substrate holding unit for supporting the central portion of the substrate and holding the substrate, holding at least a part of the peripheral end of the substrate into an arc shape; measuring the height position of each peripheral end The step is to measure the height position of each peripheral end belonging to the height position among the peripheral end positions of the substrate held by the substrate holding unit in the circumferential direction; the outer peripheral portion processing step is to wrap the substrate held by the substrate holding unit around By rotating the rotation axis of the central portion of the substrate, the processing liquid is ejected from the processing liquid nozzle toward the outer peripheral portion of the substrate, thereby processing the outer peripheral portion of the substrate; and The reciprocating step of the liquid injection position is parallel to the processing step of the outer peripheral portion, and the processing liquid nozzle is driven by the nozzle driving unit in the following manner: the liquid injection position of the processing liquid from the processing liquid nozzle in the outer peripheral portion of the substrate The distance between the peripheral end of the peripheral end of the peripheral position of the processing liquid nozzle and the peripheral end of the peripheral end of the substrate at the peripheral end of the substrate is kept constant, while reciprocating following the change in the height position of the peripheral end of the disposed position. The substrate processing method according to claim 12, wherein the reciprocating step of the liquid application position includes a step of moving the processing liquid nozzle in a vertical direction following a change in height position of the peripheral end of the arrangement position. The substrate processing method according to claim 12, wherein the reciprocating step of the liquid injection position includes the step of: separating the liquid injection position of the processing liquid from the processing liquid nozzle and the peripheral end of the arrangement position In a fixed manner, the processing liquid nozzle is moved in the direction of the radius of rotation of the substrate following the change in height position at the peripheral end of the arrangement position. The substrate processing method according to any one of claims 12 to 14, wherein the reciprocating movement step of the liquid injection position is performed after the step of measuring the height of each peripheral end. The substrate processing method according to any one of claims 12 to 14, wherein the nozzle driving unit includes a unit in which a nozzle driving signal for driving the processing liquid nozzle is input to thereby drive the processing liquid nozzle ; The reciprocating step of the liquid injection position includes: a nozzle driving signal preparation step, which is based on the measurement result in the circumferential end height position measurement step and the rotation speed of the substrate in the outer peripheral portion processing step, with the liquid injection position The nozzle driving signal for driving the processing liquid nozzle will be made with the same amplitude and the same periodic movement as the change in height position at the peripheral end of the aforementioned arrangement position; and the output step of the driving signal is based on the above The nozzle driving signal is output to the nozzle driving unit, and the exclusion timing is the liquid injection position where the height position relative to the peripheral end of the arrangement position changes with the driving delay of the processing liquid nozzle relative to the output of the nozzle driving signal. The phase difference is eliminated. The substrate processing method as recited in claim 16, wherein the driving signal output step includes: a timing acquisition step, which is the most suitable chase from the liquid injection position to the height position change at the peripheral end of the arrangement position, and the sequence is staggered to a considerable amount At the time of the aforementioned phase difference, the aforementioned timing of elimination is thereby obtained. The substrate processing method according to claim 17, further comprising: a phase difference measurement step, which is to output the nozzle driving signal to the nozzle drive unit before the reciprocating step of the liquid injection position and move the liquid injection position by This measures the phase difference; the timing obtaining step includes the following steps: obtaining the excluded timing based on the phase difference. The substrate processing method according to any one of claims 12 to 14, wherein the step of measuring the peripheral end height position further includes the step of rotating the substrate held by the substrate holding unit about the rotation axis , While using a position sensor to measure a predetermined circumferential height position.

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