TWI676100B - Multi-outlet-inlet laminated liquid-cooling heat dissipation structure - Google Patents

Abstract

A multi-entry and interlayer liquid-cooled heat dissipation structure includes a top plate, a bottom plate, and the top plate. Relatively closed; a base plate disposed between the top plate and the bottom plate, the base plate having an upper side and a lower side and at least one communication unit, the top plate and the upper side jointly defining an upper liquid chamber, the bottom plate and the lower side The sides collectively define a liquid chamber, and the at least one communication unit penetrates the upper and lower sides to communicate the upper and lower liquid chambers for a working liquid to circulate; and a plurality of connecting channels, each of which has a communication port to communicate with the upper The lower liquid chamber forms the inlet or outlet of the working liquid.

Description

Multiple entrance and exit interlayer liquid cooling heat dissipation structure

The invention relates to the field of heat dissipation, in particular to a multi-inlet and interlayer liquid-cooled heat dissipation structure with a built-in pump.

At present, liquid-cooled heat sinks are widely used in communications, electrical appliances, automobiles, construction and other industries to manufacture various parts and finished products. When a computer is operating, many internal components generate a large amount of thermal energy. Therefore, a good cooling system is a key factor that determines the performance and reliability of the computer. Among all the heat-generating components, the heat dissipation problem of the central processing unit (CPU) and graphics chip processor (GPU) with the highest workload is generally the most difficult. In particular, the screens of various types of computer games are becoming more and more delicate, and the functions of computer-aided graphics software are becoming more and more powerful. Such software often puts the central processing unit and graphics chip processor in a high-load state during operation, and it also causes a large number If the heat energy is not effectively dissipated, it will cause the performance of the central processing unit or graphics chip processor to decline. In severe cases, the central processing unit or graphics chip processor may be damaged or its service life may be greatly reduced.

Please refer to Fig. 1. In order to reduce the operating temperature of the heating electronic components, a water-cooled device on the market is generally connected to a water-cooling device connected to a heating component (such as a central processing unit) through a water cooling pipe 51 through a water pipe 51. The first 5 and a water pump (Pump) 6, drive water cooling liquid (or working liquid) through the water pump (Pump) 6 Flow to the water-cooled row 1 to dissipate heat and continuously perform cyclic cooling to quickly dissipate heat. The conventional water-cooling row 1 is composed of a plurality of heat-dissipating fins 11, a plurality of flat tubes 12, and two-side water tanks 13. The heat-radiating fins 11 are disposed between the straight flat tubes 12 and the two-side water tanks 13 described above. The two sides of the cooling fins 11 and the straight flat tubes 12 are welded by soldering, so that the two-side water tank 13 is connected to the cooling fins 11 and the straight flat tubes 12. The water cooling row 1 is provided with a water inlet 131 and a water outlet 132 on one side of the water tank 13. The water inlet 131 and the water outlet 132 are respectively used to connect the opposite two water pipes 51.

Because the working fluid flowing in from the water inlet 131 is in the water tank 13 on one side, it flows straight through from the straight flat tubes 12 to the water tank 13 on the other side, and then passes through the straight flat tubes. The pipe 12 flows directly through the water tank 13 on the side of the road, and then is discharged from the water outlet 132, so the flow time of the working fluid with heat entering the water cooling row 1 is too short, which relatively makes the working fluid with heat relatively The heat exchange time with the water-cooled row is not long, so that the conventional water-cooled row has a poor heat-dissipating effect on the working liquid with heat, which causes a problem of poor heat dissipation efficiency. In addition, because the overall structure of the conventional water cooling radiator cannot be adjusted according to the space in an electronic device, when it is placed in an electronic device (such as a computer or a server), an independent space is required in the electronic device to provide knowledge. The problem of water-cooled drain placement.

Therefore, how to solve the above-mentioned problems and shortcomings of the custom, that is, where the inventor of this case and the relevant manufacturers engaged in this industry are eager to study and improve.

An object of the present invention is to provide a liquid cooling and heat dissipation structure with multiple inlets and outlets with excellent heat removal efficiency.

Another object of the present invention is to provide a structural design that is arranged through intervals and is provided with a flow channel in a liquid chamber, so as to effectively increase (or prolong) the flow time of a working liquid in a multi-entry liquid-cooled heat dissipation structure. A multi-entry sandwich liquid-cooled heat dissipation structure to effectively improve heat dissipation efficiency.

In order to achieve the above object, the present invention provides a multi-inlet and interlayer liquid-cooled heat dissipation structure, including: a top plate; a bottom plate which is oppositely covered with the top plate; a substrate disposed between the top plate and the bottom plate, and the substrate has a The upper side and the lower side and at least one communication unit, the top plate and the upper side together define an upper liquid chamber, the bottom plate and the lower side jointly define a lower liquid chamber, and the at least one communication unit runs through the upper and lower sides to communicate with the The upper and lower liquid chambers are used for a working fluid to circulate; and a plurality of connecting channels, each of which has a communication port to communicate with the upper and lower liquid chambers to form an inlet or an outlet of the working liquid.

In one implementation, the lower liquid chamber is provided with a lower flow channel, and the lower flow channel is formed on the lower side of the substrate opposite to the lower liquid chamber to guide the working liquid flow path, and the upper liquid chamber is provided with an upper flow The upper flow channel is formed on the upper side of the substrate opposite to the upper liquid chamber, and guides the working liquid flow path.

In an implementation, the connecting channels have a first connecting channel and a second connecting channel, and a first and second communication port of the first and second connecting channels communicate with the lower liquid chamber and a third connecting channel, respectively. A third communication port of the channel communicates with the upper liquid chamber.

In one implementation, a pumping system is further selected to be disposed in any one of the upper liquid chamber, the lower liquid chamber, or the connecting channels.

In one implementation, the lower liquid chamber is provided with a first partition to partition the lower liquid chamber to form a first liquid chamber and a second liquid chamber, and the upper liquid chamber is provided with a second partition to separate the The upper liquid chamber forms a third liquid chamber and a fourth liquid chamber.

In an implementation, the at least one communication unit has a first communication unit and a second communication unit, the first communication unit communicates the first liquid chamber and the third liquid chamber, and the second communication unit Connect the second liquid chamber and the fourth liquid chamber.

In an implementation, the connecting channels have a first connecting channel, a second connecting channel, a third connecting channel, and a fourth connecting channel. A first communication port of the first connecting channel communicates with the first channel. A liquid chamber, a second communication port of the second communication channel communicates with the second liquid chamber, a third communication port of the third communication channel communicates with the third liquid chamber, and a The fourth communication port communicates with the fourth liquid chamber.

In an implementation, the first, second, third, and fourth liquid chambers are respectively provided with first, second, third, and fourth flow channels, and the first and second flow channels are formed by bending the substrate opposite to the lower liquid chamber. On the lower side, the three or four flow passages are bent and formed on the upper side of the substrate opposite to the upper liquid chamber to guide the working liquid flow path.

In one implementation, a first pumping system is disposed in any of the first and third liquid chambers, and a second pumping system is disposed in any of the second and fourth liquid chambers.

In one implementation, the lower liquid chamber is further provided with a third partition to separate the first and second liquid chambers to form a fifth and sixth liquid chamber, respectively.

In one implementation, the at least one communication unit has a first communication unit, a second communication unit, a third communication unit, and a fourth communication unit. The first communication unit communicates with the first liquid chamber and The third liquid chamber, the second communication unit communicates with the second liquid chamber and the third liquid chamber, the third communication unit communicates with the fifth liquid chamber and the fourth liquid chamber, and the fourth The communication unit communicates the sixth liquid chamber and the fourth liquid chamber.

In one implementation, the connecting channels have a first connecting channel, a second connecting channel, a third connecting channel, and a fourth connecting channel. The first connecting channel communicates with the first liquid chamber and the second connecting channel. The connecting channel communicates with the second liquid chamber, the third connecting channel communicates with the fifth liquid chamber, and the fourth connecting channel communicates with the sixth liquid chamber.

In an implementation, the first, second, third, fourth, fifth, and sixth liquid chambers are respectively provided with first, second, third, fourth, fifth, and sixth flow channels, and the first, second, fifth, and sixth flow channels are respectively provided. The winding is formed on the side of the substrate opposite to the lower liquid chamber, and the three or four flow channels are formed on the side of the substrate opposite to the upper liquid chamber to guide the working liquid flow path.

In one implementation, a first pumping system is disposed in any of the first, second, and third liquid chambers, and a second pumping system is disposed in any of the fourth, fifth, and sixth liquid chambers. One.

In one implementation, the upper liquid chamber is further provided with a fourth partition to separate the third and fourth liquid chambers to form a seventh and eight liquid chambers, respectively.

In one implementation, the at least one communication unit has a first communication unit, a second communication unit, a third communication unit, and a fourth communication unit. The first communication unit communicates with the first liquid chamber and The third liquid chamber, the second communication unit communicates the second liquid chamber and the seventh liquid chamber, the third communication unit communicates the sixth liquid chamber and the eighth liquid chamber, the fourth The communication unit communicates the fifth liquid chamber and the fourth liquid chamber.

In an implementation, the connecting channels include a first connecting channel, a second connecting channel, a third connecting channel, a fourth connecting channel, a fifth connecting channel, a sixth connecting channel, and a seventh connecting channel. Channel and an eighth connecting channel, the first connecting channel communicating with the first liquid chamber, the second connecting channel communicating with the second liquid chamber, the third connecting channel communicating with the fourth liquid chamber, and the fourth The connecting channel communicates with the eighth liquid chamber, the fifth connecting channel communicates with the fifth liquid chamber, the sixth connecting channel communicates with the sixth liquid chamber, the seventh connecting channel communicates with the third liquid chamber, and The eighth connecting passage communicates with the seventh liquid chamber.

In an implementation, the first, second, third, fourth, fifth, sixth, seventh, and eight liquid chambers are respectively provided with first, second, third, fourth, fifth, sixth, seventh, and eighth flow channels, and the first , Two, five, six lanes The winding is formed on the side of the substrate opposite to the lower liquid chamber, and the three, four, seven, and eight channels are formed on the side of the substrate opposite the upper liquid chamber to guide the working liquid flow path.

In an implementation, it further includes a first pumping system disposed in any of the first and third liquid chambers, a second pumping system disposed in any of the second and seventh liquid chambers, and a third A pumping system is disposed in any of the fifth and fourth liquid chambers, and a fourth pumping system is disposed in any of the six and eight liquid chambers.

2‧‧‧ Multiple inlet and outlet interlayer liquid cooling heat dissipation structure

21‧‧‧Top plate

22‧‧‧ Upper liquid chamber

22a‧‧‧Third liquid chamber

22b‧‧‧Fourth liquid chamber

22c‧‧‧Seventh liquid chamber

22d‧‧‧Eighth liquid chamber

221‧‧‧ Upstream

222‧‧‧Second divider

223‧‧‧Third runner

224‧‧‧Fourth runner

225‧‧‧Fourth divider

226‧‧‧Seventh runner

227‧‧‧Eighth runner

23‧‧‧ floor

24‧‧‧ lower liquid chamber

24a‧‧‧first liquid chamber

24b‧‧‧Second liquid chamber

24c‧‧‧Fifth liquid chamber

24d‧‧‧Sixth liquid chamber

241‧‧‧ Downstream

242‧‧‧First divider

243‧‧‧First runner

244‧‧‧Second runner

245‧‧‧ Third divider

246‧‧‧Fifth runner

247‧‧‧Sixth runner

25‧‧‧ substrate

251‧‧‧upside

252‧‧‧ underside

253‧‧‧ Connected Unit

2531‧‧‧First Connected Unit

2532‧‧‧Second Connected Unit

2533‧‧‧Third Connected Unit

2534‧‧‧Fourth Connected Unit

26‧‧‧Pump

26a‧‧‧Receiving slot

26b‧‧‧Another receiving slot

261‧‧‧The first pump

262‧‧‧Second Pump

27‧‧‧ with access

271‧‧‧First Link

271a‧‧‧First communication port

272‧‧‧Second Link

272a‧‧‧Second communication port

273‧‧‧Third Link

273a‧‧‧Third connection port

274‧‧‧Fourth Link

274a‧‧‧Fourth communication port

275‧‧‧Fifth Link

275a‧‧‧Fifth communication port

276‧‧‧Sixth Link

276a‧‧‧ sixth communication port

277‧‧‧Seventh Link

277a‧‧‧Seventh communication port

278‧‧‧ Eighth Link

278a‧‧‧eighth connection port

291‧‧‧First cooling space

2911‧‧‧The first cooling fin group

2912‧‧‧First protective shell

292‧‧‧Second cooling space

2921‧‧‧Second cooling fin group

2922‧‧‧Second protective case

30‧‧‧ side

31‧‧‧fan

5‧‧‧Water cooling module

51‧‧‧ connecting pipe

The purpose of the following drawings is to make the present invention easier to understand. These drawings will be described in detail herein and make it a part of the specific embodiment. Through the specific embodiments in this document and referring to the corresponding drawings, the specific embodiments of the present invention will be explained in detail and used to explain the working principle of the invention. Figure 1 is a schematic diagram of the conventional technology; Figure 2A is a three-dimensional exploded view of the first embodiment of the liquid-cooled heat dissipation structure with multiple inlets and outlets of the present invention; Figure 2B is the first An exploded perspective view of an embodiment from another perspective; FIG. 2C is a three-dimensional combined view of the first embodiment of the liquid-cooled heat dissipation structure with multiple inlets and outlets of the present invention; and FIG. 2D is a view of the liquid-cooled heat dissipation structure with multiple inlets and sandwiches of the present invention. Partial cross-sectional view of the first embodiment; FIG. 3A is a three-dimensional exploded view of an alternative embodiment of the first embodiment of the multiple-entry sandwich liquid-cooled heat dissipation structure of the present invention; and FIG. 3B is a multiple-entry sandwich liquid-cooled heat dissipation structure of the present invention The third embodiment is an exploded perspective view of another alternative embodiment of the first embodiment; FIG. 3C is a partial cross-sectional view of another alternative embodiment of the first embodiment of the liquid-cooled heat dissipation structure of the multi-entry interlayer; FIG. 3D is a partial cross-sectional view of another alternative embodiment of the first embodiment of the multiple-entry sandwich liquid-cooled heat dissipation structure of the present invention; FIG. 3E is another view of the first embodiment of the multiple-entry sandwich liquid-cooled heat dissipation structure of the present invention An exploded perspective view of an alternative embodiment; FIG. 3F is an exploded perspective view of another alternative embodiment of the first embodiment of the multiple-entry sandwich liquid-cooled heat dissipation structure of the present invention; and a 3G view is an exemplary multiple-entry sandwich liquid-cooled heat dissipation structure of the present invention A top sectional view of another alternative embodiment of the first embodiment; FIG. 4A is a three-dimensional exploded view of another alternative embodiment of the first embodiment of the liquid-cooled heat dissipation structure of the multiple-entry sandwich of the present invention; and FIG. 4B is this Three-dimensional exploded view of another alternative embodiment of the first embodiment of the liquid-cooled heat dissipation structure of the multiple-entry sandwich of the invention; FIG. 4C is a three-dimensional exploded view of another alternative embodiment of the first embodiment of the liquid-cooled heat-dissipation structure of the multiple-entry sandwich of the invention Figure 4D is a three-dimensional assembled view of the first alternative embodiment of the liquid-cooled heat dissipation structure of the multiple-entry sandwich of the present invention; Figure 5A is a multiple-entry liquid-cooled interlayer of the present invention 3D exploded view of the second embodiment of the thermal structure; FIG. 5B is another perspective view of the second embodiment of the liquid-cooled heat dissipation structure of the multi-entry interlayer in the present invention; FIG. 5C is a multi-ported interlayer liquid of the present invention. A three-dimensional assembled view of the second embodiment of the cold heat dissipation structure; FIG. 5D is a three-dimensional exploded view of an alternative embodiment of the second embodiment of the liquid-cooled heat dissipation structure of the multi-entry sandwich interlayer; Fig. 5E is an exploded perspective view of another alternative embodiment of the second embodiment of the liquid-cooled heat dissipation structure with multiple entrances and exits of the present invention; Fig. 5F is a drawing of the second embodiment of the liquid-cooled heat dissipation structure with multiple entrances and exits of the present invention; An exploded perspective view of an alternative embodiment; FIG. 5G is an exploded perspective view of another alternative embodiment of the second embodiment of the liquid-cooled heat dissipation structure with multiple inlets and outlets of the present invention; and FIG. 3D exploded view of the third embodiment of the structure; FIG. 6B is another perspective view of the third embodiment of the liquid-cooled heat dissipation structure of the multi-entry interlayer of the present invention; FIG. A three-dimensional assembled view of the third embodiment of the heat dissipation structure; FIG. 6D is an exploded perspective view of an alternative embodiment of the third embodiment of the liquid-cooled heat dissipation structure of the multi-entry sandwich of the present invention; and FIG. 6E is a multi-entry sandwich of the present invention 3D exploded view of another alternative embodiment of the third embodiment of the liquid-cooled heat dissipation structure; FIG. 6F is another alternative embodiment of the third embodiment of the liquid-cooled heat dissipation structure of the multiple-entry sandwich of the present invention Figure 6G is a partial cross-sectional view of another alternative embodiment of the third embodiment of the multiple-entry sandwich liquid-cooled heat dissipation structure of the present invention; Figure 7A is a fourth of the multiple-entry sandwich liquid-cooled heat dissipation structure of the present invention An exploded perspective view of the embodiment; FIG. 7B is another perspective view of the fourth embodiment of the liquid-cooled heat dissipation structure of the multi-entry sandwich of the present invention; FIG. 7C is a perspective view of the liquid-cooled heat dissipation structure of the multi-entry sandwich of the present invention. The three-dimensional combination diagram of the four embodiments; FIG. 7D is an exploded perspective view of an alternative embodiment of the fourth embodiment of the multiple-entry liquid-cooled heat dissipation structure of the present invention; FIG. 7E illustrates another of the fourth embodiment of the multi-entry liquid-cooled heat dissipation structure of the present invention An exploded perspective view of an alternative embodiment; FIG. 7F is a partial cross-sectional view of another alternative embodiment of the fourth embodiment of the multi-entry sandwich liquid-cooled heat dissipation structure of the present invention; FIG. 7G is a multi-entry sandwich liquid-cooled heat dissipation structure of the present invention A partial cross-sectional view of another alternative embodiment of the fourth embodiment.

The above-mentioned object of the present invention and its structural and functional characteristics will be described based on the preferred embodiments of the drawings.

Please refer to FIG. 2A which is a perspective exploded view of the first embodiment of the liquid-cooled heat dissipation structure with multiple inlets and interlayers of the present invention; FIG. 2B is a perspective exploded view of the first embodiment of the liquid-cooled heat dissipation structure with multiple inlets and interlayers of the present invention. A perspective; FIG. 2C is a three-dimensional assembled view of the first embodiment of the liquid-cooled heat dissipation structure with multiple inlets and outlets of the present invention; and FIG. 2D is a partial cross-sectional view of the first embodiment of the liquid-cooled heat dissipation structure with multiple inlets and outlets of the present invention. As shown in FIGS. 2A and 2B, the multi-entry sandwich liquid-cooled heat dissipation structure 2 of the present invention includes a top plate 21, a bottom plate 23, a base plate 25, and a plurality of connecting channels 27.

In this embodiment, the bottom plate 23 is opposed to the top plate 21, the substrate 25 is disposed between the top plate 21 and the bottom plate 23, and the substrate 25 has an upper side 251 and a lower side 252 and at least one communication unit 253, the top plate 21 and the upper side 251 together define an upper liquid chamber 22, and the bottom plate 23 and the lower side 252 together define a lower liquid chamber 24. The at least one communication unit 253 runs through the upper and lower sides 251, 252 communicates with the upper and lower liquid chambers 22, 24 for the circulation of a working liquid. Each of the connecting channels 27 has a communication port to communicate with the upper and lower liquid chambers 22 and 24, respectively.

In this embodiment, it is shown that a communication unit 253 is used to connect the upper and lower liquid chambers 22 and 24, and the connection channels 27 are represented as a first communication port 271a of a first connection channel 271 and A second communication port 272a of a second communication channel 272 communicates with the lower liquid chamber 24, and the first and second communication ports 271a and 272a are the inlets of the working liquid, and the equal communication channel 27 is represented as A third communication port 273a of a third communication passage 273 communicates with the upper liquid chamber 22, and the third communication port 273a is an outlet of the working liquid. Conversely, the first and second communication ports 271a and 272a may be indicated as the outlet of the working liquid, and the third communication port 273a may be indicated as the working liquid inlet.

As shown in FIG. 2D, the working fluid system with heat flows from the first and second communication ports 271a and 272a into the lower liquid chamber 24. After the lower liquid chamber 24 is filled with the working fluid, the working fluid passes through The communication unit 253 flows into the upper liquid chamber 22, and the heat carried by the working liquid is conducted to the top plate 21 and the bottom plate 23 and then radiated and radiated.

In an alternative embodiment, as shown in FIG. 3A and referring to FIG. 2B, the lower liquid chamber 24 is provided with a lower flow channel 241, and the lower flow channel 241 is formed by bending the substrate 25 relative to the lower liquid chamber 24. The lower side 252 of 24 is used to guide the flow path of the working liquid, which is a liquid with a high specific heat coefficient, such as water or pure water. In another alternative embodiment, as shown in FIG. 3B and referring to FIG. 2A simultaneously, in addition to the lower liquid chamber 24 is provided with the lower flow channel 241, and at the same time the upper liquid chamber 22 is also provided with an upper flow channel 221, the upper flow passage 221 is formed around the upper side 251 of the substrate 25 opposite to the upper liquid chamber 22 to guide the working liquid flow path. As shown in Figs. 3C and 3D, the upper and lower flow channels 221 and 241 are provided to extend the time during which the working liquid flows in the upper and lower liquid chambers 22 and 24, thereby extending the working liquid and the top plate 21. And the heat exchange time of the bottom plate 23, so that the heat carried by the working fluid can be sufficiently conducted to the top plate 21 and the bottom plate 23 for heat dissipation.

In addition, in another alternative embodiment, as shown in FIGS. 3E and 3F, a pump 26 is disposed in an accommodation groove 26a in the lower liquid chamber 24, but is not limited to this. In the embodiment, the pump 26 may also be optionally disposed in the upper liquid chamber 22. And in another alternative embodiment, as shown in FIG. 3G, The pump 26 is disposed near the second communication port 272a of the second connection channel 272, but is not limited thereto. In other embodiments, the pump 26 may also be provided in the first connection channel 271. The first communication port 271a or the third communication port 273a of the third communication channel 273, the pump 26 of the present invention may be selectively disposed in any chamber or flow channel. The pump 26 includes, for example, a fan wheel and a driving motor (such as a submersible motor or a waterproof motor) to rotate the fan wheel to drive the working fluid to flow.

In another alternative embodiment, as shown in FIG. 4A and referring to FIGS. 2A to 2C, the open position of the bottom plate 23 opposite to the top plate 21 has a first heat dissipation space 291, and the top plate 21 is opposite to the bottom plate. An open position on one side of 23 has a second heat dissipation space 292. The first heat dissipation space 291 on the side of the bottom plate 23 opposite to the top plate 21 is provided with a first heat dissipation fin group 2911, and the second heat dissipation space 292 on the side of the top plate 21 opposite to the bottom plate 23 is provided with a second heat dissipation fin group 2921, the first and second heat dissipation fin groups 2911 and 2921 are respectively composed of a plurality of heat dissipation fins to increase the area of heat exchange and improve heat dissipation efficiency.

In another alternative embodiment, as shown in FIG. 4B, the first heat dissipation fin group 2911 provided in the first heat dissipation space 291 is provided with a first protective shell 2912, and is disposed in the second heat dissipation space 292. The second heat dissipation fin group 2921 is provided with a second protective shell 2922. By this, the first and second protective shells 2911 and 2912 protect the first and second heat radiating fin groups 2911 and 2921 to prevent the first and second heat radiating fin groups 2911 and 2921 from being deformed by an external force, which affects the overall heat dissipation efficiency . And in another alternative embodiment, as shown in FIGS. 4C and 4D and referring to FIG. 2C simultaneously, the top plate 21, the bottom plate 23, the substrate 25, the first heat dissipation fin group 2911, and the second heat dissipation fin The sheet group 2921 collectively defines a side surface 30, which is provided with at least one fan 31 and is shown as three fans 31 in this alternative embodiment. As shown in FIGS. 4A to 4D, the heat carried by the working fluid is transmitted to the top plate 21 and the bottom plate 22, and then is dissipated through the first heat dissipation fin group 2911 and the second heat dissipation fin group 2921. The at least one fan 31 can enhance the heat radiation effect of the first and second heat radiation fin groups 2911 and 2921. In another alternative embodiment, any one of the connecting channels 27 is butted and connected to the liquid-cooled heat dissipation structure 2 of the multiple inlets and outlets. An external water cooling module is used to contact a heating source (not shown). In this embodiment, the connecting channels 27 and the water cooling module are connected through a plurality of communication pipes, so that The working fluid absorbs the heat of the heat source from the water-cooled module and flows into the multi-inlet and inter-layer liquid-cooled heat dissipation structure 2, and performs heat exchange and heat dissipation.

And in the first embodiment, the top plate 21, the bottom plate 23, the base plate 25, and the connecting channels 27 are shown as being made of titanium, but are not limited to this. The top plate 21, the bottom plate 23, and the base plate 25 and these connecting channels 27 can also be represented by a gold material, a silver material, a copper material, an iron material, an aluminum material, an aluminum alloy, or a copper alloy material.

Therefore, through the design that the top plate 21 and the bottom plate 23 are covered with each other and the substrate 25 is sandwiched by the present invention, the inside of the top plate 21 and the bottom plate 23 has a large absorption area that directly contacts the heat on the working fluid in the conductive flow. Then, the top plate 21 and the bottom plate 23 have a large heat dissipation area on the outside to rapidly radiate heat outward, so as to effectively achieve the effect of good heat removal efficiency and increase the heat dissipation area; further, the upper and lower liquid chambers 22 The upper and lower flow passages 221 and 241 are provided in the and 24 to more effectively increase (or extend) the working liquid flow time, thereby effectively increasing the time for the working liquid to exchange heat with the top plate 21 and the bottom plate 23 itself; The first and second heat dissipation fin groups 2911, 2921 and the at least one fan 31 enhance the heat dissipation effect; in addition, the first and second heat dissipation fins 2912, 2922 can also protect the first and second heat dissipation fin groups 2911. , 2921 will not deform when impacted.

Please continue to refer to FIG. 5A, which is an exploded perspective view of the second embodiment of the liquid-cooled heat dissipation structure of the multiple-entry sandwich of the present invention; FIG. 5B is a exploded view of the second embodiment of the liquid-cooled heat dissipation structure of the multiple-entry sandwich of the present invention. Perspective; Figure 5C is a three-dimensional assembled view of the second embodiment of the liquid-cooled heat dissipation structure with multiple inlets and interlayers of the present invention; Figure 5D is a partial sectional view of the second embodiment of the liquid-cooled heat dissipation structure with multiple inlets and interlayers of the present invention; Figure 5E Figure is a partial cross-section of a second embodiment of the liquid-cooled heat dissipation structure with multiple inlets and outlets of the present invention FIG. 5F is an exploded perspective view of another alternative embodiment of the second embodiment of the liquid-cooled heat dissipation structure with multiple inlets and outlets of the present invention; FIG. 5G is a drawing of the second embodiment of the liquid-cooled heat dissipation structure with multiple inlets and interlayers according to the present invention; An exploded perspective view of an alternative embodiment. As shown in Figs. 5A and 5B, and supplemented with reference to Figs. 2A to 2D, the structure, connection relationship, and effect in this embodiment are the same as those in the first embodiment described above, so no further description is provided, but this embodiment The difference from the first embodiment is that the lower liquid chamber 24 is provided with a first partition member 242 to partition the lower liquid chamber 24 to form a first liquid chamber 24a and a second liquid which are independent from each other. Chamber 24b. The upper liquid chamber 22 is provided with a second partition 222 to partition the upper liquid chamber 22 to form a third liquid chamber 22a and a fourth liquid chamber 22b which are independent from each other. In this embodiment, the at least one communication unit 253 that communicates with the upper and lower liquid chambers 22 and 24 is shown as having a first communication unit 2531 and a second communication unit 2532. The first communication unit 2531 The first liquid chamber 24a and the third liquid chamber 22a are communicated, and the second communication unit 2532 communicates with the second liquid chamber 24b and the fourth liquid chamber 22b. And in this embodiment, the connecting channels 27 represent a first connecting channel 271, a second connecting channel 271, a third connecting channel 273, and a fourth connecting channel 274. A first communication port 271a communicates with the first liquid chamber 24a, a second communication port 272a of the second communication passage 272 communicates with the second liquid chamber 24b, and a third communication port of the third communication passage 273 273a communicates with the third liquid chamber 22a, and a fourth communication port 274a of the fourth communication passage 274 communicates with the fourth liquid chamber 22b.

The working fluid flows into the first and second liquid chambers 24a and 24b through the first and second communication ports 271a and 272a of the first and second connecting channels 271 and 272, respectively. The two liquid chambers 24a and 24b are separated, so that the working liquid flowing into the first and second liquid chambers 24a and 24b passes through the first and second communication units 2531 and 2532 and flows into the third and fourth liquid chambers 22a and 22b, respectively. Finally, the working liquid flows out of the third and fourth liquid chambers 22a and 22b from the third and fourth communication ports 273a and 274a of the third and fourth connecting channels 273 and 274, respectively. Therefore, in this embodiment, the heat carried by the working liquid can also be transmitted to the top plate 21 and the bottom plate 23, and then radiated and radiated.

In an alternative embodiment, as shown in FIGS. 5D and 5E, the first, second, third, and fourth liquid chambers 24a, 24b, 22a, and 22b are respectively provided with first, second, third, and fourth flow channels 243, 244, 223, 224, the first and second flow channels 243, 244 are bent and formed on the lower side of the substrate 25 relative to the lower liquid chamber 24, and the third and fourth flow channels 223, 224 are bent and formed on the substrate 25 opposite The upper side of the upper liquid chamber 22 guides the working liquid flow path.

With the arrangement of the first, second, third, and fourth flow channels 243, 244, 223, and 224, the flow of the working liquid in the first, second, third, and fourth liquid chambers 24a, 24b, 22a, and 22b is extended. Time can also extend the heat exchange time of the working liquid with the top plate 21 and the bottom plate 23.

In another alternative embodiment, as shown in FIGS. 5F and 5G, a first pump 261 is disposed in an accommodation groove 26a in the first liquid chamber 24a (as shown in FIG. 5B), but Not limited to this, in other embodiments, the first pump 261 may also be disposed in the third liquid chamber 22a, and a second pump 262 is disposed in the second liquid chamber 24b (such as the first (Figure 5B), but it is not limited to this. In other embodiments, the second pump 262 may be disposed in the fourth liquid chamber 22a, thereby driving the Working fluid flows.

Please refer to FIG. 6A which is a three-dimensional exploded view of the third embodiment of the liquid-cooled heat dissipation structure with multiple entrances and exits of the present invention; FIG. 6B which is a three-dimensional exploded view of the third embodiment of the liquid-cooled heat dissipation structure with multiple entrances and exits of the present invention from another perspective Figure 6C is a three-dimensional combined view of the third embodiment of the liquid-cooled heat dissipation structure with multiple inlets and interlayers of the present invention; Figure 6D is a three-dimensional exploded view of an alternative embodiment of the third embodiment of the liquid-cooled heat dissipation structure with multiple inlets and interlayers of the present invention FIG. 6E is an exploded perspective view of another alternative embodiment of the third embodiment of the multiple-entry sandwich liquid-cooled heat dissipation structure of the present invention; FIG. 6F is another illustration of the third embodiment of the multiple-entry sandwich liquid-cooled heat dissipation structure of the present invention An exploded perspective view of an alternative embodiment; FIG. 6G is an exploded perspective view of another alternate embodiment of the third embodiment of the liquid-cooled heat dissipation structure of the multiple-entry interlayer in the present invention. As shown in Figs. 6A and 6B, and supplemented with reference to Figs. 5A to 5G, the structure, connection relationship, and effect in this embodiment are the same as those in the second embodiment described above, so they are not repeated here, but this embodiment The difference from the second embodiment is that the liquid The body cavity 24 is further provided with a third partition 245 to partition the first and second liquid chambers 24a and 24b to form a fifth and sixth liquid chamber 24c and 24d, respectively. In this embodiment, the at least one communication unit 253 connecting the upper and lower liquid chambers 22 and 24 is shown as having a third communication unit 2533 and a fourth communication unit 2534, so that the first communication unit 2531 communicates with the first liquid chamber 24a and the third liquid chamber 22a, the second communication unit 2532 communicates with the second liquid chamber 24b and the third liquid chamber 22a, and the third communication unit 2533 communicates with the first The five liquid chamber 24c and the fourth liquid chamber 22b, and the fourth communication unit 2534 communicates the sixth liquid chamber 24d and the fourth liquid chamber 22b.

And in this embodiment, the first communication port 271a of the first communication passage 271 communicates with the first liquid chamber 24a, and the first communication port 271a is shown as the inlet of the working liquid, and the second communication port 271a A second communication port 272a of the channel 272 communicates with the second liquid chamber 24b, and the second communication port 272a is shown as an outlet of the working liquid, and a third communication port 273a of the third communication channel 273 communicates with the fifth liquid The chamber 24c and the third communication port 273a are shown as the inlet of the working liquid, and the fourth communication port 274a of the fourth communication channel 274 communicates with the sixth liquid chamber 24d, and the fourth communication port 274a is Expressed as the outlet of the working fluid.

The working liquid flows into the first liquid chamber 22a through the first communication port 271a of the first communication passage 271. Since the first partition member 242 separates the first and second liquid chambers 24a and 24b, the liquid flows into the first liquid chamber 22a. The working liquid of the first liquid chamber 24a flows into the third liquid chamber 22a through the first communication unit 2531, and the working fluid flowing into the third liquid chamber 22a then flows into the first liquid unit through the second communication unit 2532. The two liquid chambers 24b flow out from the second communication port 272a of the second communication channel 272, while another working liquid flows into the fifth liquid chamber 24c through the third communication port 273a of the third communication channel 273. The first partition 242 partitions the fifth and sixth liquid chambers 24c and 24d, so that the working liquid flowing into the fifth liquid chamber 24c passes through the third communication unit 2533 into the fourth liquid chamber 22b, and flows into The working fluid of the fourth liquid chamber 22b then passes through the fourth communication unit 2534 into the sixth liquid chamber 24d, and from the fourth The fourth communication port 274a connected to the passage 274 flows out. Therefore, in this embodiment, the heat carried by the working liquid can also be transmitted to the top plate 21 and the bottom plate 23, and then radiated and radiated.

As shown in FIGS. 6D and 6E, in an alternative embodiment, the first, second, third, fourth, fifth, and sixth liquid chambers 24a, 24b, 22a, 22b, 24c, and 24d are respectively provided with first and second liquid chambers. , Three, four, five, six flow channels 243, 244, 223, 224, 246, 247, the first, two, five, six flow channels 243, 244, 246, 247 are bent and formed on the substrate 25 opposite to the bottom On the lower side of the liquid chamber 24, the three or four flow channels 223, 224 are formed around the upper side of the substrate 25 opposite to the upper liquid chamber 22 to guide the working liquid flow path.

As shown in Figures 6F and 6G, with the settings of the first, second, third, fourth, fifth, and sixth runners 243, 244, 223, 224, 246, and 247 (as shown in Figures 6D and 6E) to extend The time during which the working fluid flows in the first, second, third, fourth, fifth, and sixth liquid chambers 24a, 24b, 22a, 22b, 24c, and 24d (as shown in FIGS. 6D and 6E) can also extend the working fluid and the The heat exchange time of the top plate 21 and the bottom plate 23.

As in the second embodiment, the first pump 261 may be disposed in an accommodation tank of the first, second, and third liquid chambers 24a, 24b, and 22a, and the second pump 262 may be disposed in the fourth The other five, six, and six liquid chambers 22b, 24c, 24 are contained in the other receiving grooves, so that the working liquid can be driven to flow.

Please continue to refer to FIG. 7A, which is a three-dimensional exploded view of the fourth embodiment of the liquid-cooled heat-dissipating structure of the multi-entry sandwich of the present invention; FIG. 7B, which is a three-dimensional exploded view of the fourth embodiment of the liquid-cooled heat-dissipation structure of the multiple-entry interlayer of the present invention Angle of view; FIG. 7C is a three-dimensional combined view of the fourth embodiment of the liquid-cooled heat dissipation structure with multiple inlets and interlayers of the present invention; FIG. 7D is a three-dimensional disassembly of an alternative embodiment of the fourth embodiment of the liquid-cooled heat dissipation structure with multiple inlets and interlayers FIG. 7E is an exploded perspective view of another alternative embodiment of the fourth embodiment of the multiple-entry sandwich liquid-cooled heat dissipation structure of the present invention; FIG. 7F is another illustration of the fourth embodiment of the multiple-entry sandwich liquid-cooled heat dissipation structure of the present invention A partial cross-sectional view of an alternative embodiment; FIG. 7G is a partial cross-sectional view of another alternative embodiment of the fourth embodiment of the liquid-cooled heat dissipation structure of the multiple-entry sandwich of the present invention. As shown in Figures 7A and 7B, and With reference to Figures 6A to 6E, the structure, connection relationship, and effect in this embodiment are the same as those in the third embodiment described above, so they are not repeated here, but the differences between this embodiment and the third embodiment described above are different. That is, the upper liquid chamber 22 is further provided with a fourth partition 225 to separate the third and fourth liquid chambers 22a and 22b to form a seventh and eight liquid chambers 22c and 22d, respectively. And the at least one communication unit 253 is shown as having one first, two, three, and four communication units 2531, 2532, 2533, and 2534 at the same time, so that the first communication unit 2531 communicates with the first liquid chamber 24a and the first Three liquid chambers 22a, the second communication unit 2532 communicates with the second liquid chamber 24b and the seventh liquid chamber 22c, and the third communication unit 2533 communicates with the sixth liquid chamber 24d and the eighth liquid chamber 22d, the fourth communication unit 2534 communicates the fifth liquid chamber 24c and the fourth liquid chamber 22b.

And in this embodiment, the first communication port 271a of the first communication passage 271 communicates with the first liquid chamber 24a, and the first communication port 271a is shown as the inlet of the working liquid, and the second communication port 271a A second communication port 272a of the channel 272 communicates with the second liquid chamber 24b, and the second communication port 272a is represented as an inlet of the working liquid, and a third communication port 273a of the third communication channel 273 communicates with the fourth liquid The chamber 22b and the third communication port 273a are shown as the outlet of the working liquid, and the fourth communication port 274a of the fourth communication channel 274 communicates with the eighth liquid chamber 22d, and the fourth communication port 274a is Expressed as the outlet of the working fluid.

A fifth communication port 275a of the fifth communication channel 275 communicates with the fifth liquid chamber 24c, and the fifth communication port 271a is shown as an inlet of the working liquid, and a sixth communication port 276a of the sixth communication channel 276 communicates The sixth liquid chamber 24d and the sixth communication port 276a are shown as the inlet of the working liquid, the seventh communication port 277a of the seventh communication channel 277 communicates with the third liquid chamber 22a, and the seventh communication The port 277a is shown as an outlet of the working liquid, and the eighth communication port 278a of the eighth communication passage 278 communicates with the seventh liquid chamber 22c, and the eighth communication port 278a is shown as an outlet of the working liquid.

The working liquid flows into the first liquid chamber 24a through the first communication port 271a of the first connecting passage 271, and the working liquid flowing into the first liquid chamber 24a flows into the third through the first communication unit 2531. liquid In the body chamber 22a, the working fluid flowing into the third liquid chamber 22a then flows out from the seventh communication port 277a of the seventh connection passage 277, while another working fluid flows in through the second communication port 272a of the second connection passage 272 In the second liquid chamber 24b, the working liquid flowing into the second liquid chamber 24b passes through the second communication unit 2532 into the seventh liquid chamber 22c, and the working fluid flowing into the seventh liquid chamber 22c then passes through The eighth communication port 278a of the eighth connection passage 278 flows out.

And another working liquid flows into the fifth liquid chamber 24c through the fifth communication port 275a of the fifth connecting passage 275, and the working liquid flowing into the fifth liquid chamber 24c flows into the fourth liquid through the fourth communication unit 2534. Chamber 22b, the working fluid flowing into the fourth liquid chamber 22b then flows out from the third communication port 273a of the third communication channel 273, while another working liquid flows in through the sixth communication port 276a of the sixth communication channel 276 The sixth liquid chamber 24d, the working liquid flowing into the sixth liquid chamber 24d passes through the third communication unit 2533 into the eighth liquid chamber 22d, and the working fluid flowing into the eighth liquid chamber 22d then passes through The fourth communication port 274a of the fourth connection passage 274 flows out. Therefore, in this embodiment, the heat carried by the working liquid can also be transmitted to the top plate 21 and the bottom plate 23, and then radiated and radiated.

As shown in FIGS. 7D and 7E, in an alternative embodiment, the first, second, third, fourth, fifth, sixth, seventh, eight liquid chambers 24a, 24b, 22a, 22b, 24c, 24d, 22c, 22d is provided with a first, second, third, fourth, fifth, sixth, seventh and eighth flow path 243, 244, 223, 224, 246, 247, 226, 227 respectively, and the first, second, fifth and sixth flow path 243 , 244, 246, 247 are bent and formed on the lower side of the substrate 25 relative to the lower liquid chamber 24, and the three, four, seven, and eight flow channels 223, 224, 226, 227 are bent and formed on the substrate 25 opposite to the The upper side of the upper liquid chamber 22 guides the working liquid flow path.

As shown in Figures 7F and 7G, with the first, second, third, fourth, fifth, sixth, seventh, and eighth runners 243, 244, 223, 224, 246, 247, 226, 227 (such as 7D, (Figure 7E) to extend the working fluid in the first, second, third, fourth, fifth, sixth, seventh, eighth liquid chambers 24a, 24b, 22a, The flow time of 22b, 24c, 24d, 22c, 22d (as shown in Figs. 7D and 7E) can also extend the heat exchange time of the working liquid with the top plate 21 and the bottom plate 23.

In an alternative embodiment, this embodiment further includes a third pump (not shown) and a fourth pump (not shown). The first pump 261 may be disposed in the first and third liquid chambers. In a receiving groove of the chambers 24a, 22a, the second pump 262 may be disposed in the second and seventh liquid chambers 24b, 22c, and the third pump may be disposed in the fifth and fourth liquid chambers 24c. In 22b, the fourth pump can be disposed in the sixth and eighth liquid chambers 24d, 22d, whereby the working liquid can be driven to flow.

The present invention has been described in detail above, but the above are only preferred embodiments of the present invention, and the scope of implementation of the present invention cannot be limited. That is, all equivalent changes and modifications made in accordance with the scope of the application of the present invention shall still fall within the scope of patent of the present invention.

Claims (20)

A multi-entry sandwich liquid-cooled heat dissipation structure includes: a top plate; a bottom plate that is opposed to the top plate; a substrate disposed between the top plate and the bottom plate, the substrate having an upper side and a lower side and at least one communication unit The top plate and the upper side jointly define an upper liquid chamber, the bottom plate and the lower side jointly define a lower liquid chamber, and the at least one communication unit penetrates the upper and lower sides to communicate with the upper and lower liquid chambers for a job Liquid circulation; and a plurality of connecting channels, each of which has a communication port connecting the upper and lower liquid chambers to form an inlet or an outlet of the working liquid, of which at least two connecting channels for the working liquid to flow in the same direction are connected to the Either the upper liquid chamber or the lower liquid chamber. The multiple-inlet and interlayer liquid-cooled heat dissipation structure according to item 1 of the scope of the patent application, wherein the lower liquid chamber is provided with a lower flow channel, and the lower flow channel is formed by bending the lower side of the substrate opposite to the lower liquid chamber to guide In the working liquid flow path, the upper liquid chamber is provided with an upper flow path, and the upper flow path is bent and formed on the upper side of the substrate opposite to the upper liquid chamber to guide the working liquid flow path. The multiple-inlet and interlayer liquid-cooled heat-dissipation structure described in item 1 or 2 of the scope of the patent application, wherein the connecting channels have a first connecting channel and a second connecting channel, and a first, Two communication ports communicate with the lower liquid chamber, and a third communication port with a third communication channel communicates with the upper liquid chamber. The multiple-portion interlayer liquid-cooled heat dissipation structure described in item 1 or 2 of the scope of the patent application, further includes a pump system selected to be disposed in any one of the upper liquid chamber, the lower liquid chamber, or the connecting channels. The multiple-inlet and interlayer liquid-cooled heat dissipation structure described in item 3 of the scope of the patent application, further includes a pump system selected to be disposed in any one of the upper liquid chamber, the lower liquid chamber, or the connecting channels. The multiple-inlet and interlayer liquid-cooled heat dissipation structure according to item 1 of the scope of the patent application, wherein the lower liquid chamber is provided with a first partition to partition the lower liquid chamber to form a first liquid chamber and a second liquid chamber. The upper liquid chamber is provided with a second partition to partition the upper liquid chamber to form a third liquid chamber and a fourth liquid chamber. The multiple-inlet and interlayer liquid-cooled heat dissipation structure according to item 6 of the scope of patent application, wherein the at least one communication unit has a first communication unit and a second communication unit, and the first communication unit communicates with the first liquid cavity. And the third liquid chamber, and the second communication unit communicates with the second liquid chamber and the fourth liquid chamber. According to the multiple entry and exit sandwich liquid-cooled heat dissipation structure described in item 7 of the scope of patent application, wherein the connecting channels have a first connecting channel, a second connecting channel, a third connecting channel, and a fourth connecting channel, the first A first communication port of a continuous channel communicates with the first liquid chamber, a second communication port of a second communication channel communicates with the second liquid chamber, and a third communication port of the third communication channel communicates with the The third liquid chamber and a fourth communication port of the fourth communication channel communicate with the fourth liquid chamber. The multiple-inlet and interlayer liquid-cooled heat dissipation structure described in item 7 of the scope of patent application, wherein the first, second, third, and fourth liquid chambers are respectively provided with first, second, third, and fourth flow channels, and the first and second flows Channels are formed on the lower side of the substrate opposite the lower liquid chamber, and the three or four flow channels are formed on the upper side of the substrate relative to the upper liquid chamber to guide the working liquid flow path. The multiple inlet and outlet sandwich liquid-cooled heat dissipation structure described in item 7 of the scope of the patent application, further includes a first pumping system disposed in any one of the first and three liquid chambers, and a second pumping system disposed in the first and third liquid chambers. Any of the second and fourth liquid chambers. The multiple-inlet and interlayer liquid-cooled heat-dissipating structure according to item 6 of the patent application scope, wherein the lower liquid chamber is further provided with a third partition to separate the first and second liquid chambers to form a fifth and sixth liquid chamber, respectively. . The multiple-inlet and interlayer liquid-cooled heat dissipation structure according to item 11 of the scope of patent application, wherein the at least one communication unit has a first communication unit, a second communication unit, a third communication unit, and a fourth communication unit, The first communication unit communicates with the first liquid chamber and the third liquid chamber, the second communication unit communicates with the second liquid chamber and the third liquid chamber, and the third communication unit communicates with the fifth The liquid chamber and the fourth liquid chamber, and the fourth communication unit communicates with the sixth liquid chamber and the fourth liquid chamber. According to the multiple-entry interlayer liquid-cooled heat dissipation structure described in item 12 of the patent application scope, wherein the connecting channels have a first connecting channel, a second connecting channel, a third connecting channel, and a fourth connecting channel, the first A connecting passage communicates with the first liquid chamber, a second connecting passage communicates with the second liquid chamber, a third connecting passage communicates with the fifth liquid chamber, and a fourth connecting passage communicates with the sixth liquid chamber . The multiple-portion interlayer liquid-cooled heat dissipation structure according to item 12 of the scope of application for patent, wherein the first, second, third, fourth, fifth, and sixth liquid chambers are respectively provided with first, second, third, fourth, fifth, and sixth liquid chambers. The flow path, the first, second, fifth, and sixth flow paths are formed on one side of the substrate opposite to the lower liquid chamber, and the three or four flow paths are formed on one side of the substrate relative to the upper liquid chamber. Side, guide the working fluid flow path. The multiple inlet and outlet sandwich liquid-cooled heat dissipation structure as described in item 12 of the scope of the patent application, further comprising a first pump system disposed in any of the first, second, and third liquid chambers, and a second pump system disposed In any of the fourth, fifth, and sixth liquid chambers. The multiple-inlet and interlayer liquid-cooled heat dissipation structure according to item 11 of the scope of the patent application, wherein the upper liquid chamber is further provided with a fourth partition to separate the third and fourth liquid chambers to form a seventh and eight liquid chamber, respectively. . The multiple-inlet and interlayer liquid-cooled heat dissipation structure according to item 16 of the scope of the patent application, wherein the at least one communication unit has a first communication unit, a second communication unit, a third communication unit, and a fourth communication unit, The first communication unit communicates with the first liquid chamber and the third liquid chamber, the second communication unit communicates with the second liquid chamber and the seventh liquid chamber, and the third communication unit communicates with the sixth The liquid chamber and the eighth liquid chamber, and the fourth communication unit communicates with the fifth liquid chamber and the fourth liquid chamber. The multiple-inlet and interlayer liquid-cooled heat dissipation structure described in item 17 of the scope of patent application, wherein the connecting channels have a first connecting channel, a second connecting channel, a third connecting channel, a fourth connecting channel, a first connecting channel Five connecting channels, a sixth connecting channel, a seventh connecting channel, and an eighth connecting channel. The first connecting channel communicates with the first liquid chamber, and the second connecting channel communicates with the second liquid chamber. Three connecting channels communicate with the fourth liquid chamber, the fourth connecting channel communicates with the eighth liquid chamber, the fifth connecting channel communicates with the fifth liquid chamber, and the sixth connecting channel communicates with the sixth liquid chamber, The seventh connecting passage communicates with the third liquid chamber, and the eighth connecting passage communicates with the seventh liquid chamber. The multiple-inlet and interlayer liquid-cooled heat dissipation structure as described in item 17 of the scope of patent application, wherein the first, second, third, fourth, fifth, sixth, seventh, and eight liquid chambers are respectively provided with first, second, third, and fourth liquid chambers. , Five, six, seven, and eight flow paths, the first, two, five, and six flow paths are formed on the side of the substrate opposite to the lower liquid chamber, and the three, four, seven, and eight flow paths are curved It is formed on the side of the substrate opposite to the upper liquid chamber to guide the working liquid flow path. The multiple inlet and outlet sandwich liquid-cooled heat dissipation structure as described in item 17 of the scope of the patent application, further comprising a first pump system disposed in any of the first and three liquid chambers, and a second pump system disposed in the first Any of the second and seventh liquid chambers, a third pumping system is provided in any of the fifth and fourth liquid chambers, and a fourth pumping system is provided in any of the sixth and eight liquid chambers.