TWI674389B - Middle member of heat dissipation device and the heat dissipation device - Google Patents

Abstract

A middleware of a heat dissipation device and a heat dissipation device thereof. The middleware comprises: a middleware body having a first side and a second side, a plurality of perforations and a groove structure group, and the groove structure group is arranged on the first Either one of the first and second sides, the perforations communicate with the first and second sides through the middleware body, and the groove structure is arranged in an alternating or non-interlaced manner with the perforations, and is matched with a first plate And a second plate body are superimposed on each other to form the heat dissipation device, and achieve the effect of stable vapor-liquid circulation through the composite structure provided on the first and second sides of the middleware body.

Description

Middleware of heat radiation device and heat radiation device

A middleware of a heat dissipation device and a heat dissipation device thereof, particularly a middleware of a heat dissipation device through which the same or different surface structures are arranged on at least one side or both sides of a single piece of middleware body, thereby increasing capillary force And its heat sink.

Among the current heat sinks, the heat sinks that use the vapor-liquid circulation method to conduct heat conduction mainly include heat pipes, temperature equalizing plates, etc., and as the space where the application is narrow, such as mobile devices or smart watches, heat pipes and temperature equalizing plates have to The overall structure is changed to a thin design to fit the installation space of the application.

The temperature equalizing plate and the heat pipe mainly pass the capillary structure and the working liquid in the internal vacuum chamber, and conduct heat conduction through the working liquid in the internal vacuum chamber to generate two phases of evaporation and condensation, so it is provided as evaporation and vaporization. The vapor channel used for diffusion and the capillary structure used for condensate and return water have become a focus of improvement with the thin design, but the thin design will inevitably reduce the space of the vacuum chamber, and the thickness of the capillary structure and the outer plate will be reduced. Structural strength, etc. have become the most important points to be resolved.

Copper is most commonly used as the manufacturing material for temperature equalizing plates and heat pipes. Copper has the characteristics of fast heat conduction and high ductility. Therefore, the thinned copper plate or copper tube is easy to deform. The deformed temperature equalizing plate and heat pipe vacuum The chamber is compressed or shrunk or collapsed, so that the working fluid filled inside cannot perform the work of vapor-liquid circulation heat conduction.

In addition, because the space of the vacuum chamber is reduced after the thin design, the selection of the capillary structure provided in the vacuum chamber has become another problem to be improved. Because the sintered powder is more difficult to install in a narrow space, Some people choose thin meshes as a substitute for sintered powder as a capillary structure. However, the thin meshes must still be sintered with the outer plate or the tube wall of the tube, so that the mesh is not in the cavity. The phenomenon of warping or sliding occurs, but the sintering and fixing work between the capillary structure and the chamber becomes more difficult due to the narrowing of the vacuum chamber. After sintering, the steam channel disappears.

In addition, the conventional capillary structures such as sintering or mesh weaving can not effectively control the flow distribution of the liquid in the three-dimensional direction (axial and radial) of the capillary structure after being squeezed and deformed in a narrow space. Failure to disengage the gas in the capillary structure, and thus to reduce the resistance between the gas or the liquid, will interrupt the vapor-liquid circulation work and cause the heat source contacted for heat conduction or heat dissipation to be unsmoothly generated to generate heat or chip burnout. In addition, the conventional capillary structures such as sintering or mesh weaving cannot construct a heat flow structure for liquid-gas separation. However, in the isothermal plate, the vapor and liquid flow are opposite, so it is easy to cause liquid-gas splashing. , Increase the resistance between liquid and gas.

The above-mentioned shortcomings are the ones that need to be improved most in the current heat sink after thinning.

Therefore, in order to solve the disadvantages of the above-mentioned conventional technology, the main object of the present invention is to provide a thin capillary structure with better capillary force.

In order to achieve the above object, the present invention provides a middleware of a heat dissipation device, which includes: a middleware body having a first side and a second side, a plurality of perforations, and a groove structure group, the groove structure group is provided In any of the first and second sides, the perforations communicate with the first and second sides through the middleware body, and the groove structure and the perforations are staggered or non-staggered.

Therefore, in order to solve the shortcomings of the above-mentioned conventional technology, the main object of the present invention is to provide a heat dissipation device, which includes: a middleware body, a first plate body, and a second plate body; The middleware body includes: a middleware body having a first side surface, a second side surface, a plurality of perforations, and a groove structure group, and the groove structure group is disposed on any of the first and second sides, the The equal perforations penetrate the middleware body to communicate with the first and second sides, and the groove structure and the perforations are arranged alternately or non-interlacedly; the first plate body has a first surface and a second surface; The second plate has a third surface and a fourth surface. The first and third surfaces correspond to the cover and merge to define a closed chamber. The middleware body is disposed in the closed chamber and filled in the closed chamber. There is working fluid.

The invention mainly provides a single sheet-shaped middleware body which is arranged on either or both sides of the upper and lower sides through a perforated or groove structure, which is staggered or non-staggered, so that the middleware body can simultaneously provide vapor and The composite capillary structure of the liquid working fluid vapor-liquid circulation, and provides a heat dissipation device which integrates the capillary structure and the supporting structure.

1‧‧‧ middleware body

11‧‧‧ the first side

12‧‧‧ second side

13‧‧‧ perforation

14‧‧‧Slot Structure Group

141‧‧‧groove

141a‧‧‧ Link

142‧‧‧ convex

143‧‧‧Slot

144‧‧‧connection channel

145‧‧‧Net

15‧‧‧ support structure

151‧‧‧Groove

152‧‧‧ porous structure layer

16‧‧‧ Mesh

161‧‧‧Net

1a‧‧‧First Zone

1b‧‧‧Second Zone

1c‧‧‧third zone

2‧‧‧ the first plate

21‧‧‧first surface

21a‧‧‧Condensation zone

211‧‧‧ convex

22‧‧‧ second surface

23‧‧‧ evaporation zone

24‧‧‧Condensing end

25‧‧‧Condensing end

3‧‧‧Second plate

31‧‧‧ third surface

31a‧‧‧Evaporation area

32‧‧‧ fourth surface

33‧‧‧closed chamber

4‧‧‧working fluid

5‧‧‧ middleware body

51‧‧‧ substrate

511‧‧‧first side

512‧‧‧ second side

513‧‧‧perforation

52‧‧‧Slot Structure Group

521‧‧‧Net

Figure 1 is a perspective view of the first embodiment of the middleware of the heat sink of the present invention; Figure 2 is a plan view of the first embodiment of the middleware of the heat sink of the present invention; and Figure 3 is a view of the heat sink of the present invention. A perspective view of the second embodiment of the middleware; FIG. 4 is a perspective view of the second embodiment of the middleware of the heat sink of the present invention; and FIG. 5 is a perspective view of the third embodiment of the middleware of the heat sink of the present invention; FIG. 6 is a perspective view of a third embodiment of the middleware of the heat sink of the present invention; FIG. 7 is a perspective view of a fourth embodiment of the middleware of the heat sink of the present invention; and FIG. 8 is a view of the heat sink of the present invention. A perspective view of the fourth embodiment of the middleware; FIG. 8a is a perspective view of the fourth embodiment of the middleware of the heat sink of the present invention; and FIG. 9a is a perspective view of the fifth embodiment of the middleware of the heat sink of the present invention Figure 9b is a perspective exploded view of the fifth embodiment of the middleware of the heat sink of the present invention; Figure 9c is a perspective view of the groove structure group of the middleware of the heat sink of the present invention; Fig. 9d is a perspective view of the groove structure of the middleware of the heat sink of the present invention; Fig. 9e is a perspective view of the groove structure of the middleware of the heat sink of the present invention; Fig. 9f is a groove of the middleware of the heat sink of the present invention Structural group diagram; Figure 9g is a schematic diagram of the groove structure of the middleware of the heat sink of the invention; Figure 9h is a schematic diagram of the groove structure of the middleware of the heat sink of the invention; Figure 10a is a diagram of the heat sink of the invention A schematic diagram of the sixth embodiment of the middleware; FIG. 10b is a schematic diagram of the sixth embodiment of the middleware of the heat sink of the present invention; and FIG. 11 is a cross-sectional view of the seventh embodiment of the middleware of the heat sink of the present invention; Figure 12a is a schematic diagram of the support structure of the middleware of the heat sink of the present invention; Figure 12b is a schematic diagram of the support structure of the middleware of the heat sink of the present invention; Figure 13 is a schematic diagram of the support structure of the middleware of the heat sink of the present invention Figure 14 is a sectional view of the eighth embodiment of the middleware of the heat sink of the present invention; Figure 15 is a perspective view of the ninth embodiment of the middleware of the heat sink of the present invention; Figure 15a FIG. 15b is a bottom view of the ninth embodiment of the middleware of the heat sink of the present invention; FIG. 15b is a cross-sectional view of the ninth embodiment of the middleware of the heat sink of the present invention; FIG. 16 is a first embodiment of the heat sink of the present invention Fig. 17a is a cross-sectional view of a second embodiment of a heat sink of the present invention; Fig. 17b is another cross-sectional view of a second embodiment of a heat sink of the present invention; Fig. 18a is a heat sink of the present invention Schematic diagram of the second plate microstructure; Figure 18b is a schematic diagram of the second plate microstructure of the heat sink of the present invention; Figure 18c is a schematic diagram of the second plate microstructure of the heat sink of the present invention; Figure 18d is this Schematic diagram of the second plate microstructure of the heat sink of the invention; Figure 19 is a cross-sectional view of the third embodiment of the heat sink of the invention; Figure 20 is a cross-sectional view of the fourth embodiment of the heat sink of the invention; FIG. 21 is a cross-sectional view of a fifth embodiment of a heat sink of the present invention; FIG. 22 is a cross-sectional view of a sixth embodiment of a heat sink of the present invention.

The above-mentioned object of the present invention and its structural and functional characteristics will be explained according to the preferred embodiments of the drawings. The proportions of the parts of the drawings of the present invention are complete and clearly present the technical characteristics of each part, and do not limit each part. The actual proportion of technical characteristics.

Please refer to FIGS. 1 and 2, which are perspective views of the two sides of the first embodiment of the middleware of the heat sink of the present invention. As shown in the figure, the middleware of the heat sink of the present invention includes: a middleware body 1; The middleware body 1 in this embodiment is selected as a one-piece or one-piece structure, which has a first side 11 and a second side 12, a plurality of perforations 13 and a groove structure group 14, wherein the groove structure The group 14 can be disposed on either or both of the first side 11 and the second side 12. In this embodiment, the groove structure group 14 is disposed on the first side 11, and the perforations 13 pass through The middleware body 1 communicates with the first and second sides 11 and 12. The groove structure group 14 and the perforations 13 are arranged in a staggered or non-staggered manner. This embodiment is described as staggered with each other. Don't be bound.

The groove structure group 14 has a plurality of grooves 141. The grooves 141 are spaced from each other by the first side surface 11 toward the second side surface 12. The perforations 13 and the grooves 141 may be horizontally staggered. It can be arranged in any way of arrangement or vertical overlapping arrangement. In this embodiment, the horizontal staggered arrangement is used as an illustration and is not limited. The aforementioned perforations 13 are opened in the area between the two grooves 141. It has at least one connecting channel 141a. The two ends of the connecting channels 141a are connected in series with the grooves 141, and the grooves 141 communicate with each other horizontally and vertically.

Please refer to FIGS. 3 and 4, which are perspective views of the two sides of the second embodiment of the middleware of the heat sink of the present invention. As shown in the figure, the difference between this embodiment and the first embodiment lies in the groove structure 14 There are a plurality of convex bodies 142, and the convex bodies 142 are arranged at an interval from each other, and a plurality of channels 143 are formed between the convex bodies 142. The perforations 13 and the convex bodies 142 are arranged horizontally staggered or non-staggered. (Also can be vertical Straight overlapping arrangement), this embodiment is implemented by staggering as an illustration but is not limited. The channels 143 are arranged along the middleware body 1 longitudinally or horizontally or longitudinally and horizontally at the same time. One side 11.

Please refer to FIGS. 5 and 6, which are perspective views of both sides of the third embodiment of the middleware of the heat sink of the present invention. As shown in the figure, this embodiment differs from the aforementioned second embodiment in the middleware body 1. A first region 1a, a second region 1b, and a third region 1c are defined. The two ends of the first region 1a are connected to the second and third regions 1b, 1c, and the convex bodies 142 of the first region 1a. The distance between the channels 143 (showing a closer arrangement) is smaller than the distance between the channels 143 (showing a looser arrangement) between the convex bodies 142 of the second and third regions 1b, 1c. The apertures of the perforations 13 provided in one area 1a are smaller than the apertures of the perforations 13 provided in the second and third areas 1b, 1c. The first area 1a is an evaporation area, and the second and third areas 1b. And 1c are condensation areas. The volume of the convex bodies 142 provided in the first area 1a is smaller than the volume of the convex bodies 142 provided in the second and third areas 1b, 1c. It is assumed that the width and distance of the channel 143 (closer arrangement) are smaller than those provided in the second and third regions 1b and 1c. The spacing of the channels 143 (relatively loosely arranged), the apertures of the perforations 13 provided in the first region 1a are smaller than the apertures of the perforations 13 provided in the second and third regions 1b, 1c.

Please refer to Figs. 7, 8, and 8a, which are perspective views of both sides of the fourth embodiment of the middleware of the heat sink of the present invention. As shown in the figure, this embodiment differs from the first embodiment described above in that the middleware The first and second sides 11 and 12 of the body 1 are provided with a groove structure group 14. The groove structure group 14 may be any one of a plurality of grooves 141 or a plurality of convex bodies 142, or a groove 141 and a convex body 142. For the combination of mashups, this embodiment uses the convex bodies 142 as an illustrative embodiment but is not limited thereto. Another variation is that the convex bodies 142 and the perforations 13 are mixed and matched, and are irregular. According to the combination of the random arrangement, the shapes and sizes of the convex bodies 142 and the perforations 13 and the convex bodies 142 are not particularly limited (as shown in FIG. 8a).

The cross sections of the grooves 141 or convex bodies 142 in the foregoing embodiments are all circular, elliptical, square, rhombic, triangular and other geometric figures, and are not limited thereto. The cross sections are Means along the middleware A cross-sectional shape of the first or second side surfaces 11 and 12 of the body 1 extending in the horizontal direction. The middleware body 1 is any one of pure titanium or titanium alloy, copper, aluminum, stainless steel, or ceramic.

Please refer to FIGS. 9a, 9b, 9c, 9d, and 9e, which are three-dimensional exploded and groove structure group schematic diagrams of the fifth embodiment of the middleware of the heat sink of the present invention. As shown in the figure, this embodiment and the foregoing first implementation The example differs in that the middleware body 5 of this embodiment is selected as a multi-piece unit combination structure. The middleware body 5 has a base 51 and a groove structure group 52, and is assembled by overlapping each other.

The base 51 has a first side surface 511 and a second side surface 512 and a plurality of perforations 513. The perforations 513 communicate with the first and second sides 511 and 512 through the base 51.

The groove structure group 52 described in this embodiment is a single-layer mesh body (as shown in FIG. 9a) or a multi-layer mesh body (as shown in FIG. 9b) and the mesh bodies have a plurality of meshes 521. Of course, the grooves The structure group 52 may also select other structures capable of providing capillary force, such as (a basket with grooves or channels or channels, as shown in FIG. 9c) or (a wave plate with a configuration in which multiple pieces are staggered up and down, such as (Figure 9d) or (a woven net made of multiple threads interactively woven as shown in Figure 9e) or (a porous structure with capillary forces formed by electrolytic or electroforming or chemical or physical meteorological deposition such as Figures 9f, 9g, (Figure 9h) Any one of them may also be the integrated structure of the above 9a, 9c, 9d, 9e, 9f, 9g, 9h.

The size of the meshes 521 of the plurality of layers of meshes used in Fig. 9b can be selected from the same or different sizes, and the meshes can be stacked and combined with each other before being first with the base 51. Any one of the two sides 511 and 512 is combined with the base 51 through buckle, welding, fitting, tight fitting, gluing, laser welding, etc.

The above-mentioned illustration and description of the tank structure group 52 provides the capillary force and the water absorption force of the liquid working liquid to return, thereby improving the vapor-liquid circulation efficiency and the water content in the evaporation area to avoid dry burning.

Please refer to Figs. 10a and 10b, which are schematic diagrams of the sixth embodiment of the middleware of the heat sink of the present invention. As shown in the figure, this embodiment differs from the first embodiment in that the perforations 13 have a horizontal direction. Number of connecting channels 131, and these connecting channels 131 are straight or curved or irregularly extending horizontally to connect two adjacent perforations 13. These connecting channels 131 are selected to be arranged on the first and second sides 11 described above. Any one of the first and second sides 11 and 12 is provided at the same time. This embodiment is described on the second side 12 but is not limited thereto (as shown in FIG. 10a). Between the first and second sides 11 and 12 of the middleware body 1 (as shown in FIG. 10b), the connection channel 131 allows the perforations 13 to communicate with each other horizontally, that is, the working fluid 4 is converted In the vapor state, not only the diffusion is performed in the vertical direction, but also the horizontal direction.

Please refer to FIG. 11, which is a cross-sectional view of the seventh embodiment of the middleware of the heat sink of the present invention. As shown in the figure, the difference between this embodiment and the first embodiment is that the groove structure group 14 is attached on one side. At least one mesh body 16 having a plurality of meshes 161. The mesh body 16 can be stacked on top of each other on the side of the groove structure group 14 and integrated with the middleware body 1 and The meshes 161 of the mesh bodies 16 are either the same size or different sizes.

Please refer to Figures 12a and 12b. As shown in the figure, a support structure 15 is disclosed, and the material of the support structure 15 is copper or aluminum or iron or stainless steel or ceramic or commercial pure titanium or titanium alloy or copper alloy or aluminum. In any one of the alloys, the supporting structure 15 is any one of a solid cylinder or a hollow ring body. The outer surface of the supporting structure 15 has a plurality of grooves 151, and the grooves 151 are selected to be parallel to the supporting structure 15 The axial extension or non-parallel or the configuration of the axial extension of the support structure 15 is either staggered or non-staggered. The grooves 151 are formed by embossing or rolling teeth or pulling grooves. Structure, in this embodiment, the axial extension parallel to the supporting structure 15 is taken as an illustration of the embodiment and is not limited thereto.

The widths of both ends of the grooves 151 on the outer edge surface of the supporting structure 15 are either equal width or unequal width, and the shape is either trapezoidal or tapered.

Please refer to FIG. 13. As shown in the figure, the support structure 15 is a solid cylinder or a hollow ring body. A porous structure layer 152 made of sintered powder may be provided outside the support structure 15.

The supporting structure 15 disclosed in Figs. 11a to 13 is also applicable to the foregoing first to seventh embodiments, and can be used in combination with the middleware body 1 of each embodiment.

Please refer to FIG. 14, which is a cross-sectional view of the eighth embodiment of the middleware of the heat sink of the present invention. As shown in the figure, this embodiment discloses the use of the aforementioned support structure 15 and the middleware body 1 in combination. 15 is a solid cylinder, the solid cylinder penetrates the first and second sides 11, 12 of the middleware body 1, and both ends of the solid cylinder penetrate the middleware body 1 and respectively protrude beyond the middle First and second sides 11,12.

Please refer to Figs. 15, 15a, and 15b, which are three-dimensional and bottom and sectional views of the ninth embodiment of the middleware of the heat sink of the present invention. As shown in the figure, this embodiment differs from the aforementioned eighth embodiment in that The supporting structure 15 can be provided on any one or any of the first and second sides 11, 12, and this embodiment is provided with the supporting structure 15 on both the first, second sides 11, 12. This embodiment is based on solid Cylinders are used for illustration and are not limited.

Please refer to FIG. 16, which is a cross-sectional view of a first embodiment of a heat dissipation device according to the present invention. As shown in the figure, the heat dissipation device includes: a middleware body 1, a first plate body 2, and a second plate. The body 3; the middleware body 1 has a first side surface 11 and a second side surface 12, a plurality of perforations 13, and a groove structure group 14, the groove structure group 14 is disposed in the first and second sides 11, 12 Either, the perforations 13 penetrate the middleware body 1 to communicate with the first and second sides 11, 12; the groove structure group 14 and the perforations 13 are arranged in a staggered or non-staggered manner or are arranged to overlap vertically. Settings.

The first plate 2 has a first surface 21 and a second surface 22; the second plate 3 has a third surface 31 and a fourth surface 32, and the first and third surfaces 21 and 31 correspond to each other. The cover and the cover collectively define a closed chamber 33. The middleware body 1 is disposed in the closed chamber 33, and the closed chamber 33 is filled with a working fluid 4.

In this embodiment, the slot structure group 14 of the middleware body 1 is selected to be composed of any one of a plurality of grooves 141 or a plurality of convex bodies 142, and the slot structure group 14 is optionally provided in the aforementioned first, Two sides Any one of the surfaces 11 and 12 or the first and second sides 11 and 12 is provided with the groove structure group 14 at the same time. This embodiment is provided with the groove structure group 14 only on the second side 12 and the groove structure group 14 is composed of a plurality of convex bodies 142 as an explanation and is not limited. The first surface 21 of the first plate 2 has a plurality of convex portions 211, and the convex portions 211 are opposite to the second surface 22 It is recessed. The convex portions 211 are correspondingly attached to the second side surface 12 of the middleware body 1, and the third surface 31 of the second plate body 3 corresponds to the first side surface 11 of the middleware body 1. Attach.

Please refer to FIGS. 17a and 17b, which are cross-sectional views of a second embodiment of the heat sink of the present invention. As shown in the figure, the difference between this embodiment and the first embodiment is the first plate body having a plurality of convex portions 211. The convex portions 211 of 2 are attached correspondingly to the first side surface 11 of the middleware body 1, and the third surface 31 of the second plate body 3 is correspondingly attached to the second side surface 12 of the middleware body 1.

In the first and second embodiments of the aforementioned heat dissipation device, the second surface 22 of the first plate 2 is defined as a condensing surface capable of providing a condensation effect, and at least one area of the first surface 21 is defined as a condensing area. 21a, the fourth surface 32 of the second plate 3 is defined as a heat absorbing surface 32a capable of providing heat absorption, and at least one area of the third surface 31 is defined as an evaporation area 31a, and the condensation area in this embodiment 21a and the evaporation area 31a are arranged up and down corresponding to each other, the middleware body 1 and the first and second plate bodies 2 and 3 are any one of pure titanium or titanium alloy or copper or aluminum or stainless steel or ceramic or the foregoing Any combination of more than two.

Please refer to FIG. 17b. Another embodiment in this embodiment is a groove structure group 14 formed by a plurality of convex bodies 142 on the first side 11 of the middleware body 1. The groove structure group 14 has a surface on the surface. Nano structure layer 144, which is a nano whisker layer, a nano carbonized layer, or a nano oxide layer, and the nano oxide layer is any one of copper oxide, titanium oxide, or aluminum oxide. The groove structure group 14 is correspondingly attached to the third surface 31 of the second plate body 3, and the nanocapsule layer 144 is used to improve the overall capillary water return or water absorption.

Please refer to FIGS. 18a, 18b, 18c, and 18d. The third surface 31 of the second plate 3 in the first and second embodiments of the heat sink is provided with a microstructure 34. The microstructure 34 may By plural grooves Composition (e.g., Fig. 18a) or a plurality of pits and convex surfaces or rough surface (e.g., Fig. 18b) or a sintered powder layer (e.g., Fig. 18c) or a plating layer (e.g., Fig. 18d) The combination of the above composite structures is not limited. The microstructure 34 can increase the water content, thereby improving the efficiency of the vapor-liquid cycle. The coating is either hydrophobic or hydrophilic, of course. The first surface 21 of the first plate body 2 may be provided with a microstructure as described in the aforementioned second plate body 3.

The microstructure 34 in this embodiment uses micro-grooves as an illustrative embodiment, and this embodiment defines the middle of the third surface 31 of the second plate 3 as the evaporation area 23, and the third surface 31 of the second plate 3 Either the left and right ends of the evaporation area 23 are defined as a condensing end 24, 25. Of course, the left end can also be defined as the evaporation area 23 and the right end of the other end as the condensing end 24. Limited.

In this embodiment, the micro-grooves (microstructures 34) are arranged in the evaporation area 23 with a small pitch and present a denser arrangement, and the micro-grooves (microstructures 34) provided at the condensation ends 24 and 25 appear. More loose arrangement.

For example, when the second plate body 3 is provided with a plating layer, the evaporation region 23 is provided with a hydrophilic coating layer, and the condensation ends 24 and 25 are selected to be provided with a hydrophobic coating layer.

The above-mentioned microstructures 34 (plating or micro-grooves) can mainly increase the water absorption and help the moisture content in the evaporation zone 23 to avoid dry burning. These micro-grooves 341 are extended when the two condensation ends of the micro-grooves extend in the directions of 24 and 25. The (microstructure 34) has a large distance, that is, it is relatively loose, thereby reducing the pressure resistance of the condensation ends 24 and 25 and increasing the condensation diffusion efficiency.

Please refer to FIG. 19, which is a cross-sectional view of a third embodiment of a heat dissipation device according to the present invention. As shown in the figure, the difference between this embodiment and the first embodiment is that the aforementioned 15th, 15a, 15b and corresponding The supporting structure 15 of the ninth embodiment is applied to the heat dissipating device of this embodiment. Please refer to the foregoing description and illustrations together, the repeated content will not be repeated, and the supporting structures 15 are respectively against the first plate. The body 2 and the second plate body 3 are used as a support, and further provide the support effect of the steam passage to prevent collapse and the like.

Please refer to FIG. 20, which is a cross-sectional view of a fourth embodiment of the heat sink of the present invention. As shown in the figure, this embodiment adds the middleware structure of the eighth embodiment of the middleware to this embodiment, and repeats Please refer to FIG. 14 and the eighth embodiment of the middleware to explain the embodiment, which will not be repeated here. This embodiment is to support the first and second plates 2 through the two ends of the support structure 15 respectively. 3 and 3 are used as support to increase the degree of support and prevent the collapse of the steam passage.

Please refer to FIG. 21, which is a cross-sectional view of a fifth embodiment of the heat sink of the present invention. As shown in the figure, this embodiment incorporates the middleware structure of the fifth embodiment of the aforementioned middleware into the heat sink and applies it, and Please refer to the description of the fifth embodiment of the aforementioned middleware and the figures 9a, 9b, 9c, 9d, and 9e. The structure of the non-integrated middleware body 1 disclosed in the fifth embodiment of the aforementioned middleware is set first. The two plates 2 and 3 correspond to the cover, and the grid body provides the vapor or liquid working liquid with horizontal and vertical diffusion channels, thereby improving the efficiency of vapor-liquid circulation.

Please refer to FIG. 22, which is a cross-sectional view of a sixth embodiment of a heat sink of the present invention. As shown in the figure, the difference between this embodiment and the first embodiment is that the seventh embodiment of the foregoing middleware is different from this embodiment. The structure of the middleware body 1 is incorporated in this embodiment and please refer to FIG. 11 and the corresponding implementation description. The details of the middleware body 1 are not provided here. The middleware body 1 is disposed on the first and second plates 2 and 3. In addition, the capillary force and the water absorption force of the liquid working liquid and the vapor channel of the vaporous working liquid are provided, thereby improving the vapor-liquid circulation efficiency and the moisture content in the evaporation area to avoid dry burning.

The present invention mainly provides a groove structure group 14 and a perforation 13 penetrating through the middleware body 1 on one or both sides of the plate-shaped middleware body 1. The groove structure provides the working liquid 4 for reflow, and the perforations 13 It can be used as a vapor channel for the evaporation and vaporization of the working liquid 4. The plate-shaped middleware body 1 can not only solve the problem that when the heat sink is thinned, the internal sealed chamber space is not easy to set, and the middleware body 1 is plate-shaped. It is crimped, so the middleware body 1 can be used without sintering and fixing. The composite structure of the middleware body 1 realizes the function of a capillary suction structure with gas circulation channels and liquid return on a single layer of substrate, which can not only overcome When using materials that are not easy to process, such as titanium, it cannot be made into special The special capillary structure, such as the lack of woven mesh, can be quickly made into the required capillary structure, which not only solves the problem of material selection, but also saves man-hours, and greatly saves manufacturing costs.

In addition, the middleware body 1 can also be used as a support, so that the sealed chamber after the thinning can still maintain the integrity, and it will not lose the working effect of the vapor-liquid circulation after being deformed by compression.

In addition, through the capillary structure of the present invention, a single plate-shaped body can simultaneously provide axial and radial three-dimensional vapor-liquid circulation channels, which is not limited to a narrow space, and can maintain a three-dimensional flow space of the working liquid to ensure vapor. Fluid circulation work can be performed smoothly and uninterruptedly. Moreover, with the capillary structure of the present invention, liquid can be transmitted through the channel 143, and vapor is generated in the meniscus on the surface of the perforation 13, and vapor is diffused through the closed chamber 33 to form a heat transfer structure for liquid-vapor separation.

Claims (41)

A middleware of a heat dissipation device includes: a middleware body, which is an integrated structure, the middleware body has a first side and a second side, a plurality of perforations, and a groove structure group, and the groove structure group The perforations are arranged on any of the first and second sides, the perforations communicate with the first and second sides through the middleware body, and the groove structure group and the perforations are arranged alternately or non-interlacedly. The middleware of the heat dissipation device according to item 1 of the scope of the patent application, wherein the groove structure group has a plurality of grooves, and the grooves are arranged at intervals from the first side to the second side. The perforations and the grooves are arranged horizontally and staggered. There is at least one connecting channel between the grooves, and the grooves are connected in series at both ends of the connecting channels. According to the middleware of the heat dissipation device according to item 1 of the scope of the patent application, wherein the groove structure group has a plurality of convex bodies, the convex bodies are arranged at an interval from each other, and a plurality of channels are formed between the convex bodies, and the perforations The convex bodies are arranged horizontally staggered or vertically correspondingly. The middleware of the heat dissipation device according to item 3 of the scope of the patent application, wherein the grooves are arranged on the first side in either the longitudinal or lateral direction or the longitudinal and lateral direction of the middleware body and are staggered simultaneously. The middleware of the heat dissipation device according to item 3 of the scope of the patent application, wherein the channels are arranged on the first side in any one of a vertical or horizontal direction or a vertical and horizontal direction. For example, the middleware of the heat dissipation device described in item 2 of the patent application scope, wherein the cross sections of the grooves are any one of circular, oval, square, diamond, triangle and other geometric figures, and the cross sections refer to A cross-section extending horizontally along the first or second side of the middleware body. For example, the middleware of the heat dissipation device described in item 3 of the scope of patent application, wherein the cross sections of the convex bodies are any one of circular, oval, square, rhombic, triangular and other geometric figures. The cross section refers to A cross-section extending horizontally along the first or second side of the middleware body. The middleware of the heat dissipation device according to item 1 of the scope of patent application, wherein the middleware system is any one of pure titanium or titanium alloy or copper or aluminum or stainless steel or ceramic or aluminum alloy or copper alloy. The middleware of the heat sink according to item 1 of the scope of the patent application, wherein the groove structure group has a plurality of convex bodies, the convex bodies are arranged in an array spaced from each other, and a plurality of grooves are formed between the convex bodies, and the middle The body defines a first region, a second region, and a third region. The two ends of the first region are connected to the second and third regions. The distance between the convex bodies in the first region is less than The spacing distance between the convex bodies in the second and third areas, and the perforation holes provided in the first area are smaller than the perforations provided in the second and third areas. The area is an evaporation area, and the second and third areas are condensation areas. According to the middleware of the heat dissipating device according to item 9 of the scope of the patent application, the volume of the convex bodies provided in the first area is smaller than the volume of the convex bodies provided in the second and third areas. The middleware of the heat sink according to item 1 of the scope of patent application, wherein the first and second sides of the middleware body are provided with a groove structure. According to the middleware of the heat dissipating device according to item 11 of the scope of the patent application, the groove structure group is composed of a plurality of grooves or a plurality of convex bodies or a mixture of a plurality of grooves and a plurality of convex bodies arranged at intervals. For example, the middleware of the heat dissipation device described in item 1 of the scope of the patent application, wherein the perforations have a plurality of connection channels in the horizontal direction, and the connection channels connect two adjacent perforations in the horizontal direction. Any one of the first and second sides or the aforementioned first and second sides are simultaneously provided or disposed between the first and second sides of the middleware body. According to the middleware of the heat dissipating device according to item 1 of the scope of patent application, wherein the middleware body has a supporting structure, the supporting structure can be disposed on any one or any of the first and second sides. According to the middleware of the heat dissipation device according to item 14 of the scope of the patent application, wherein the supporting structure is any one of a solid cylinder or a hollow ring, and the material of the supporting structure is copper or aluminum or iron Or stainless steel or ceramic or commercial pure titanium or titanium alloy or copper alloy or aluminum alloy. The middleware of the heat dissipation device according to item 14 of the scope of the patent application, wherein the outer surface of the support structure has a plurality of grooves, and the grooves are selected to extend parallel to the axial direction of the support structure or not parallel to the axis of the support structure. Extend or cross each other or non-staggered. According to the middleware of the heat dissipating device according to item 14 of the scope of the patent application, wherein the outer surface of the supporting structure has a plurality of grooves, and the widths of the two ends of the grooves are either equal width or unequal width. According to the middleware of the heat dissipation device according to item 15 of the scope of the patent application, the solid pillar or the hollow ring body may be provided with a porous structure layer made of sintered powder outside. According to the middleware of the heat dissipating device according to item 14 of the scope of the patent application, wherein the supporting structure is a solid pillar, the solid pillar penetrates the first and second sides of the middleware body. According to the middleware of the heat dissipating device described in item 17 of the scope of patent application, the shape of the groove is either trapezoidal or tapered. The middleware of the heat dissipation device according to item 1 of the scope of the patent application, wherein the surface of the groove structure group has a nano structure layer, and the structure layer is a nano whisker or a nano-carbonized layer or a nano-oxide. Layer, the nano-oxide layer is any one of copper oxide, titanium oxide, or aluminum oxide. According to the middleware of the heat sink according to item 1 of the patent application scope, at least one grid body is attached to one side of the groove structure group, the grid body has a plurality of meshes, and the grid system may be a plurality of stacks and One side of the groove structure group is set as a whole, and the mesh sizes of the mesh bodies are either the same or different sizes. A middleware of a heat sink includes: a middleware body, which is a multi-piece unit combination structure. The middleware body has a base and a groove structure group, and is stacked on each other. The base has a A first side and a second side and a plurality of perforations, the The equal perforations communicate with the first and second sides through the base; the groove structure group is selected to be arranged on any of the first and second sides of the base. For example, the middleware of the heat sink according to item 23 of the scope of the patent application, wherein the groove structure group is a multilayer composite mesh body, the mesh bodies have a plurality of meshes, and the mesh sizes of the mesh bodies are Either the same or different. A heat dissipating device includes: a middleware body having a first side surface, a second side surface, a plurality of perforations, and a groove structure group, the groove structure group is disposed on any of the first and second sides, and the like A perforation communicates with the first and second sides through the middleware body, and the groove structure is arranged in a staggered or non-staggered manner with the perforations; a first plate body having a first surface and a second surface; a first A two-plate body having a third surface and a fourth surface. The first and third surfaces correspond to the cover and jointly define a closed chamber. The middleware body is disposed in the closed chamber, and the closed chamber is filled with Working fluid. The heat dissipation device according to item 25 of the scope of patent application, wherein the first surface of the first plate body has a plurality of convex portions, and the convex portions are formed in a concave shape on a second surface opposite to the convex portions. A first side of the middleware body is correspondingly attached, and a third surface of the second plate body is correspondingly attached to a second side of the middleware body. The heat dissipation device according to item 25 of the scope of patent application, wherein the first surface of the first plate body has a plurality of convex portions, and the convex portions are formed in a concave shape on a second surface opposite to the convex portions. The second side of the middleware body is attached correspondingly, and the third surface of the second plate body is correspondingly attached corresponding to the first side of the middleware body. The heat dissipation device according to item 25 of the scope of patent application, wherein the second surface of the first plate is defined as a condensation surface, the first surface defines at least one condensation area, and the second surface of the second plate is The four surfaces are defined as a heat-absorbing surface, and the third surface defines at least one evaporation area, and the condensation area and the evaporation area are arranged up and down corresponding to each other. The heat dissipation device according to item 25 of the scope of patent application, wherein the middleware body and the first and second plate systems are either pure titanium or titanium alloy or copper or aluminum or stainless steel or ceramic or copper alloy or aluminum alloy . The heat dissipation device according to item 25 of the scope of patent application, wherein the third surface of the second plate is provided with a microstructure, and the microstructure is a rough surface composed of a plurality of grooves or a plurality of depressions and a plurality of convex surfaces. Either a surface, a sintered powder layer, or a plating layer, which is either hydrophobic or hydrophilic. The heat dissipation device according to item 25 of the scope of patent application, wherein the first and second sides of the middleware body are provided with a groove structure. The heat dissipation device according to item 25 of the scope of patent application, wherein at least one area of the third surface of the second plate is defined as an evaporation area, which is opposite to either one of the left and right sides of the evaporation area, or two of the left and right sides. The side also defines a condensing end. The heat dissipation device according to item 25 of the scope of patent application, wherein the surface of the groove structure group has a nano structure layer, and the nano structure layer is a nano whisker layer or a nano-carbonized layer or nano-oxidation. Layer, the nano-oxide layer is any one of copper oxide, titanium oxide, or aluminum oxide. The heat dissipation device according to item 33 of the scope of the patent application, wherein the groove structure group is correspondingly mounted on the third surface of the second plate. The heat dissipation device according to item 25 of the scope of patent application, wherein the middleware body has a supporting structure, and the supporting structure can be disposed on either or both of the first and second sides. The heat dissipation device according to item 35 of the patent application scope, wherein the supporting structure is any one of a solid cylinder or a hollow ring body, and the material of the supporting structure is copper or aluminum or iron or stainless steel or Either ceramic or commercial pure titanium or titanium alloy or copper alloy or aluminum alloy. The heat dissipation device according to item 35 of the scope of the patent application, wherein the supporting structure is a solid pillar, and the solid pillar penetrates the first and second sides of the middleware body. The heat dissipation device according to item 25 of the scope of patent application, wherein the groove structure of the middleware body is a mesh body, and the mesh body is closely attached to the middleware body. The heat dissipation device according to item 25 of the scope of patent application, wherein at least one grid body is attached to one side of the groove structure group of the middleware body, and the grid body is closely attached to the middleware body, and the net The grid can also be a stack of multiple layers. The heat dissipation device according to item 39 of the scope of patent application, wherein the mesh bodies have a plurality of meshes, and the mesh sizes of the mesh bodies are the same or different. A heat dissipation device includes: a middleware body, which is a multi-piece unit combination structure. The middleware body has a base and a groove structure group, and is stacked on each other. The base has a first side surface. And a second side and a plurality of perforations, the perforations passing through the base to communicate the first and second sides; the groove structure group is selected to be arranged on any of the first and second sides of the base; a first plate body having A first surface and a second surface; a second plate body having a third surface and a fourth surface, the first and third surfaces corresponding to the cover merge and collectively define a closed chamber, and the middleware body is disposed on the The closed chamber is filled with a working fluid.