[go: up one dir, main page]

TWI671151B - Electrochemical grinding device and conductive grinding wheel thereof - Google Patents

Electrochemical grinding device and conductive grinding wheel thereof Download PDF

Info

Publication number
TWI671151B
TWI671151B TW106142274A TW106142274A TWI671151B TW I671151 B TWI671151 B TW I671151B TW 106142274 A TW106142274 A TW 106142274A TW 106142274 A TW106142274 A TW 106142274A TW I671151 B TWI671151 B TW I671151B
Authority
TW
Taiwan
Prior art keywords
liquid
grinding wheel
circumferential surface
conductive
electrochemical
Prior art date
Application number
TW106142274A
Other languages
Chinese (zh)
Other versions
TW201924831A (en
Inventor
范智文
林大裕
張振暉
林秋豐
Original Assignee
財團法人金屬工業研究發展中心
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 財團法人金屬工業研究發展中心 filed Critical 財團法人金屬工業研究發展中心
Priority to TW106142274A priority Critical patent/TWI671151B/en
Publication of TW201924831A publication Critical patent/TW201924831A/en
Application granted granted Critical
Publication of TWI671151B publication Critical patent/TWI671151B/en

Links

Landscapes

  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)

Abstract

本發明旨在揭露一種電化學研削裝置及其導電研磨輪,電化學研削裝置包含一基座、一驅動模組與導電研磨輪,驅動模組設置於基座,導電研磨輪連接驅動模組並具有一圓周面、兩側面與複數導液結構,兩側面相連於圓周面,該些導液結構分別位於導電研磨輪之側面,以用於導引一電解液至圓周面。本發明之電化學研削裝置可進行電化學加工與機械研磨加工,此外藉由位於導電研磨輪之側面的導液結構引導電解液至導電研磨輪之圓周面,如此於導電研磨輪之圓周面進行電化學加工過程中,電解液可以持續被供應至導電研磨輪之圓周面,因此可以避免發生缺乏電解液的情形。The invention aims to disclose an electrochemical grinding device and a conductive grinding wheel thereof. The electrochemical grinding device includes a base, a driving module and a conductive grinding wheel. The driving module is arranged on the base, and the conductive grinding wheel is connected to the driving module and It has a circumferential surface, two sides and a plurality of liquid-conducting structures, and the two sides are connected to the circumferential surface. The liquid-conducting structures are respectively located on the sides of the conductive grinding wheel for guiding an electrolyte to the circumferential surface. The electrochemical grinding device of the present invention can perform electrochemical processing and mechanical grinding processing. In addition, the electrolyte is guided to the circumferential surface of the conductive grinding wheel through a liquid conducting structure located on the side of the conductive grinding wheel, and thus is performed on the circumferential surface of the conductive grinding wheel. During the electrochemical processing, the electrolyte can be continuously supplied to the circumferential surface of the conductive grinding wheel, so the situation of lack of electrolyte can be avoided.

Description

電化學研削裝置及其導電研磨輪Electrochemical grinding device and conductive grinding wheel thereof

本發明係有關於一種研削裝置,其尤指一種電化學研削裝置及其導電研磨輪。The invention relates to a grinding device, in particular to an electrochemical grinding device and its conductive grinding wheel.

電化學研削加工(electrochemical grinding , ECG)為複合電化學加工及機械力研磨切削加工之加工方式,利用電化學加工氧化工件的表面而形成氧化膜並利用機械力研磨氧化層,以去除氧化層,藉以達成除料加工,如此電化學研削加工適於加工高硬度、高強度、熱敏性、脆性等金屬材料,如高速鋼、不鏽鋼、鈦合金、鎳基合金等金屬。Electrochemical grinding (ECG) is a composite electrochemical machining and mechanical force grinding cutting process. Electrochemical machining is used to oxidize the surface of a workpiece to form an oxide film, and mechanical force is used to grind the oxide layer to remove the oxide layer. In order to achieve cutout processing, such electrochemical grinding processing is suitable for processing high hardness, high strength, heat sensitivity, brittleness and other metal materials, such as high-speed steel, stainless steel, titanium alloy, nickel-based alloy and other metals.

於進行電化學研削加工中,工件與導電研磨輪分別電性連接電源之陽極與陰極而提供電源至工件與導電研磨輪,並且傳輸電解液於導電研磨輪以及工件之間的加工區域,以進行電化學氧化反應,而氧化工件的表面以形成氧化膜,再藉由導電研磨輪之研磨粒研磨切削氧化膜,以去除氧化膜,即達成移料加工。然而,習知電化學研削裝置不易傳輸電解液至導電研磨輪與工件之間的加工區域,其表示無法讓加工區域持續保有電解液,尤其習知電化學研削裝置對工件進行深處加工時,如此即會降低電化學研削加工的效能與精度。基於上述缺點,本發明提供一種電化學研削裝置,其可改善上述習知電化學研削裝置的缺點。In the electrochemical grinding process, the workpiece and the conductive grinding wheel are electrically connected to the anode and the cathode of the power supply respectively to provide power to the workpiece and the conductive grinding wheel, and the electrolyte is transferred to the processing area between the conductive grinding wheel and the workpiece for Electrochemical oxidation reaction, and the surface of the workpiece is oxidized to form an oxide film, and then the oxide film is ground and cut by the abrasive grains of a conductive grinding wheel to remove the oxide film, thereby achieving material transfer processing. However, the conventional electrochemical grinding device is not easy to transfer the electrolyte to the processing area between the conductive grinding wheel and the workpiece, which means that the processing area cannot keep the electrolyte continuously, especially when the electrochemical grinding device is used for deep processing of the workpiece, This will reduce the efficiency and accuracy of electrochemical grinding. Based on the above disadvantages, the present invention provides an electrochemical grinding device, which can improve the disadvantages of the conventional electrochemical grinding device.

本發明之一目的,提供一種電化學研削裝置及其導電研磨輪,其可以穩定傳輸電解液於加工區域,如此進行電化學研削加工時,可以避免發生缺乏電解液的情形。An object of the present invention is to provide an electrochemical grinding device and a conductive grinding wheel thereof, which can stably transfer the electrolyte solution to the processing area, and thus avoid the lack of the electrolyte solution during the electrochemical grinding processing.

本發明揭示一種電化學研削裝置,其可包含一基座、一驅動模組與一導電研磨輪,驅動模組設置於基座,導電研磨輪連接驅動模組並具有一圓周面、兩側面與複數導液結構,此兩側面相連於圓周面,該些導液結構位於導電研磨輪之該兩側面之至少一側面,而可以持續導引電解液至圓周面,以進行電化學加工。The invention discloses an electrochemical grinding device, which may include a base, a driving module and a conductive grinding wheel. The driving module is arranged on the base. The conductive grinding wheel is connected to the driving module and has a circumferential surface, two sides and A plurality of liquid-conducting structures, the two sides of which are connected to the circumferential surface, the liquid-conducting structures are located on at least one of the two sides of the conductive grinding wheel, and can continuously guide the electrolyte to the circumferential surface for electrochemical processing.

本發明揭示一種導電研磨輪,其可包含一圓周面、兩側面與複數導液結構,兩側面相連於圓周面,該些導液結構位於兩側面之至少一側面。The invention discloses a conductive grinding wheel, which may include a circumferential surface, two sides, and a plurality of liquid conducting structures. The two sides are connected to the circumferential surface. The liquid conducting structures are located on at least one of the two sides.

為使 貴審查委員對本發明之技術特徵及所達成之功效有更進一步之瞭解與認識,僅佐以實施例及配合詳細之說明,說明如後:In order to make your reviewing members have a better understanding and understanding of the technical features and achieved effects of the present invention, only the examples and the detailed description with cooperation are described below, and the description is as follows:

請參閱第一圖、第二圖與第三圖,其分別為本發明之電化學研削裝置之一實施例的立體圖、部分分解圖以及局部立體圖。本實施例之電化學研削裝置1用於進行包含電化學加工與機械研磨加工之複合加工。如圖所示,電化學研削裝置1包含一導電研磨輪10。導電研磨輪10具有一輪體100,輪體100具有一圓周面102以及與圓周面102相連接之兩側面104,圓周面102為導電研磨輪10之加工面。於本發明之一實施例中,導電研磨輪10具有導電材料與研磨粒,研磨粒嵌於導電材料,導電材料可為鐵粉末或者銅粉末,而研磨粒可為金剛石粒,但導電材料與研磨粒不以上述材料為限。如此,導電研磨輪10除了可作為研磨工具之外,也可作為電化學加工之陰極,其表示導電研磨輪10之圓周面102可作為研磨加工面與電化學加工面。Please refer to the first diagram, the second diagram, and the third diagram, which are a perspective view, a partial exploded view, and a partial perspective view of an embodiment of an electrochemical grinding device according to the present invention, respectively. The electrochemical grinding apparatus 1 of this embodiment is used to perform composite processing including electrochemical processing and mechanical polishing processing. As shown, the electrochemical grinding apparatus 1 includes a conductive grinding wheel 10. The conductive grinding wheel 10 has a wheel body 100. The wheel body 100 has a circumferential surface 102 and two side surfaces 104 connected to the circumferential surface 102. The circumferential surface 102 is a processing surface of the conductive grinding wheel 10. In one embodiment of the present invention, the conductive grinding wheel 10 has a conductive material and abrasive particles, the abrasive particles are embedded in the conductive material, the conductive material may be iron powder or copper powder, and the abrasive particles may be diamond particles, but the conductive material and abrasive The granules are not limited to the above materials. In this way, in addition to being used as a grinding tool, the conductive grinding wheel 10 can also be used as a cathode for electrochemical processing, which means that the circumferential surface 102 of the conductive grinding wheel 10 can be used as a grinding processing surface and an electrochemical processing surface.

復參閱第二圖與第三圖,電化學研削裝置1之導電研磨輪10更包含複數導液結構11,該些導液結構11位於導電研磨輪10之兩側面104。於本發明之另一實施例,該些導液結構11可僅位於導電研磨輪10之一側面104。該些導液結構11包含複數導液溝槽111與複數間隔件113,每一個間隔件113分別位於相鄰的兩個導液溝槽111之間,其表示該些間隔件113分別用於間隔該些導液溝槽111。該些間隔件113分別為一突起部。Referring again to the second and third figures, the conductive grinding wheel 10 of the electrochemical grinding device 1 further includes a plurality of liquid conducting structures 11, which are located on both sides 104 of the conductive grinding wheel 10. In another embodiment of the present invention, the liquid conducting structures 11 may be located only on one side 104 of the conductive grinding wheel 10. The liquid-conducting structures 11 include a plurality of liquid-conducting grooves 111 and a plurality of spacers 113, and each of the spacers 113 is located between two adjacent liquid-conducting grooves 111, which indicates that the spacers 113 are respectively used for spacing. The liquid guide grooves 111. Each of the spacers 113 is a protrusion.

請一併參閱第四A圖,其為本發明之導電研磨輪之第一實施例的前視圖。如圖所示,該些導液溝槽111呈環狀排列於導電研磨輪10之側面104,且該些導液溝槽111為弧形溝槽,而呈流線型。此外,每一個導液溝槽111具有一第一端1111與一第二端1113,第一端1111位於導電研磨輪10之側面104,且大概位於側面104之中央區域而遠離導電研磨輪10之圓周面102,每一個導液溝槽111從第一端1111朝向圓周面102的方向而延伸至圓周面102,所以第二端1113位於圓周面102。其表示該些導液結構11從遠離圓周面102的位置而朝向圓周面102的方向延伸,而用於引導電解液至圓周面102。此外,該些導液溝槽111之第一端1111之寬度大於第二端1113之寬度,且該些導液溝槽111之寬度從第一端1111往第二端1113之方向逐漸縮減,亦即該些導液溝槽111之寬度大概從側面104之中央區域往圓周面102之方向遞減。Please refer to FIG. 4A together, which is a front view of the first embodiment of the conductive grinding wheel of the present invention. As shown in the figure, the liquid guiding grooves 111 are annularly arranged on the side surface 104 of the conductive grinding wheel 10, and the liquid guiding grooves 111 are arc-shaped grooves and are streamlined. In addition, each of the liquid-conducting grooves 111 has a first end 1111 and a second end 1113. The first end 1111 is located on the side surface 104 of the conductive grinding wheel 10, and is generally located in a central area of the side surface 104 and away from the conductive grinding wheel 10. On the circumferential surface 102, each of the liquid guiding grooves 111 extends from the first end 1111 toward the circumferential surface 102 to the circumferential surface 102, so the second end 1113 is located on the circumferential surface 102. It means that the liquid-conducting structures 11 extend from a position far from the circumferential surface 102 toward the circumferential surface 102 and are used to guide the electrolyte to the circumferential surface 102. In addition, the width of the first end 1111 of the liquid guiding grooves 111 is greater than the width of the second end 1113, and the width of the liquid guiding grooves 111 gradually decreases from the first end 1111 to the second end 1113. That is, the widths of the liquid guide grooves 111 decrease from the central area of the side surface 104 toward the circumferential surface 102.

於本發明之另一實施例,如第五A圖所示,導液溝槽111之第一端1111的寬度可等於第二端1113的寬度。此外,如第五B圖與第五C圖所示,該些導液溝槽111可呈現放射狀或者切線狀而排列於導電研磨輪10之側面104。惟,導液溝槽111之態樣可依據使用需求而任意變化,並不以上述實施例所揭示為限。復參閱第四A圖與第四B圖,導電研磨輪10之兩側面104分別具有一凹陷區域1041,其表示凹陷區域1041之厚度小於導電研磨輪10之其他位置的厚度。於此實施例中,側面104從鄰近圓周面102之位置往側面104之中央的方向逐漸凹陷而形成凹陷區域1041。該些導液結構11位於凹陷區域1041,所以該些導液結構11亦隨著凹陷區域1041的型貌而往側面104之中央的方向逐漸凹陷。於本發明之另一實施例中,側面104可不具有凹陷區域1041,其表示側面104可為平面。In another embodiment of the present invention, as shown in FIG. 5A, the width of the first end 1111 of the liquid guiding groove 111 may be equal to the width of the second end 1113. In addition, as shown in FIG. 5B and FIG. 5C, the liquid guiding grooves 111 may be radially or tangentially arranged on the side surface 104 of the conductive grinding wheel 10. However, the shape of the liquid guiding groove 111 can be arbitrarily changed according to the use requirements, and is not limited to the disclosure in the above embodiment. Referring back to FIG. 4A and FIG. 4B, the two side surfaces 104 of the conductive grinding wheel 10 each have a recessed area 1041, which indicates that the thickness of the recessed area 1041 is smaller than the thickness of other positions of the conductive grinding wheel 10. In this embodiment, the side surface 104 is gradually recessed from a position adjacent to the circumferential surface 102 toward the center of the side surface 104 to form a recessed area 1041. The liquid-conducting structures 11 are located in the recessed area 1041, so the liquid-conducting structures 11 are gradually recessed toward the center of the side surface 104 according to the shape of the recessed area 1041. In another embodiment of the present invention, the side surface 104 may not have a recessed area 1041, which indicates that the side surface 104 may be a flat surface.

請一併參閱第一圖、第二圖與第六圖,第六圖為本發明之電化學研削裝置之一實施例的局部分解圖。如圖所示,電化學研削裝置1更包含一基座20與一驅動模組24。驅動模組24設置於基座20,導電研磨輪10連接驅動模組24。驅動模組24包含一驅動器242以及一傳動軸244,傳動軸244設置於驅動器242,驅動器242驅動傳動軸244轉動,導電研磨輪10穿設於傳動軸244,如此傳動軸244即可帶動導電研磨輪10旋轉。Please refer to the first figure, the second figure, and the sixth figure together. The sixth figure is a partial exploded view of an embodiment of the electrochemical grinding device of the present invention. As shown in the figure, the electrochemical grinding device 1 further includes a base 20 and a driving module 24. The driving module 24 is disposed on the base 20, and the conductive grinding wheel 10 is connected to the driving module 24. The driving module 24 includes a driver 242 and a transmission shaft 244. The transmission shaft 244 is disposed on the driver 242. The driver 242 drives the transmission shaft 244 to rotate. The conductive grinding wheel 10 is threaded on the transmission shaft 244, so that the transmission shaft 244 can drive the conductive grinding. The wheel 10 rotates.

此外,傳動軸244具有一抵頂部2441,且電化學研削裝置1更包含一承載結構21、一夾持件22與一固定件23,承載結構21具有一抵頂件211與一承載件213,抵頂件211與承載件213皆呈圓盤狀,且分別具有一穿孔2111、2131,承載件213設置於抵頂件211之一側,承載件213之外徑小於抵頂件211之外徑且等於導電承載盤10之一穿孔101的內徑。於本發明之一實施例,抵頂件211與承載件213可為一體成型。傳動軸244穿過抵頂件211與承載件213的穿孔2111、2131,抵頂件211抵頂於傳動軸244之抵頂部2441,導電研磨輪10套於承載件213並抵靠於抵頂件211。夾持件22具有一穿孔221,傳動軸244亦穿過夾持件22之穿孔221,夾持件22抵靠於導電研磨輪10,如此導電研磨輪10即被夾持於抵頂件211與夾持件22之間。固定件23亦具有一穿孔231,傳動軸244穿過固定件23之穿孔231,固定件23抵靠於夾持件22並被固定於傳動軸244,例如藉由一螺栓25鎖固固定件23於傳動軸244。In addition, the transmission shaft 244 has an abutting portion 2441, and the electrochemical grinding device 1 further includes a bearing structure 21, a clamping member 22, and a fixing member 23. The bearing structure 21 has an abutting member 211 and a bearing member 213. Both the abutting member 211 and the bearing member 213 are disc-shaped and each has a perforation 2111 and 2131. The bearing member 213 is disposed on one side of the abutting member 211. The outer diameter of the bearing member 213 is smaller than the outer diameter of the abutting member 211. It is equal to the inner diameter of the through hole 101 of one of the conductive carrier plates 10. In one embodiment of the present invention, the abutting member 211 and the bearing member 213 may be integrally formed. The transmission shaft 244 passes through the perforations 2111 and 2131 of the abutting member 211 and the bearing member 213. The abutting member 211 abuts against the abutting portion 2441 of the transmission shaft 244. The conductive grinding wheel 10 is sleeved on the bearing member 213 and abuts the abutting member. 211. The clamping member 22 has a perforation 221, and the transmission shaft 244 also passes through the perforation 221 of the clamping member 22. The clamping member 22 abuts against the conductive grinding wheel 10, and thus the conductive grinding wheel 10 is clamped between the abutting member 211 and Between the holding pieces 22. The fixing member 23 also has a perforation 231. The transmission shaft 244 passes through the perforation 231 of the fixing member 23. The fixing member 23 abuts against the clamping member 22 and is fixed to the transmission shaft 244. For example, the fixing member 23 is locked by a bolt 25.于 Transmission shaft 244.

復參閱第一圖、第二圖與第三圖,電化學研削裝置1更包含兩個電解液輸送結構30,此兩個電解液輸送結構30分別相對於導電研磨輪10之兩側面104,而相對於部分導液結構11,以提供電解液至導液結構11。於本發明之一實施例,若該些導液結構11只位於導電研磨輪10之一側面104,也就只需要一個電解液輸送結構30。請一併參閱第七圖,如圖所示,電解液輸送結構30具有一輸入孔302、一流道304以及複數輸出孔306,輸入孔302位於電解液輸送結構30之一端,且輸入孔302與流道304連通。流道304位於電解液輸送結構30之內部並與該些輸出孔306連通,該些輸出孔306位於電解液輸送結構30之外側,並相對部分導液結構11之導液溝槽111,以提供電解液至導液結構11。此外,一輸入連接件308設置於輸入孔302,一電解液傳輸管(圖未示) 連接於輸入連接件308,以輸入電解液至輸入孔302,電解液流經流道304而從該些輸出口306噴射至導液結構11。Referring again to the first, second, and third figures, the electrochemical grinding device 1 further includes two electrolyte transport structures 30, which are respectively opposite to the two sides 104 of the conductive grinding wheel 10, and In contrast to a part of the liquid-conducting structure 11, an electrolyte is provided to the liquid-conducting structure 11. In one embodiment of the present invention, if the liquid-conducting structures 11 are located on only one side 104 of the conductive grinding wheel 10, only one electrolyte-conveying structure 30 is required. Please refer to the seventh figure together. As shown in the figure, the electrolyte delivery structure 30 has an input hole 302, a first channel 304, and a plurality of output holes 306. The input hole 302 is located at one end of the electrolyte delivery structure 30, and the input holes 302 and The flow passage 304 communicates. The flow channel 304 is located inside the electrolyte transport structure 30 and communicates with the output holes 306. The output holes 306 are located outside the electrolyte transport structure 30 and are opposite to the liquid guide groove 111 of the liquid guide structure 11 to provide Electrolyte to liquid conducting structure 11. In addition, an input connection piece 308 is provided in the input hole 302, and an electrolyte transfer pipe (not shown) is connected to the input connection piece 308 to input the electrolyte to the input hole 302, and the electrolyte flows through the flow passage 304 to pass from these The output port 306 is sprayed to the liquid guiding structure 11.

復參閱第一圖,電化學研削裝置1更包含一移動模組26以及一供電模組28。移動模組26設置於基座20,工件3固定於移動模組26,以帶動工件3相對導電研磨輪10位移,而使工件3對位於導電研磨輪10。供電模組28之陰極與陽極分別電性耦接導電研磨輪10與工件3,當電解液輸送結構30輸送電解液至位於導電研磨輪10之導液結構11,導液結構11引導電解液流入至導電研磨輪10之圓周面102以及工件3之間的加工區域,即得以進行電化學加工。Referring again to the first figure, the electrochemical grinding device 1 further includes a mobile module 26 and a power supply module 28. The mobile module 26 is disposed on the base 20, and the workpiece 3 is fixed to the mobile module 26 to drive the workpiece 3 to be displaced relative to the conductive grinding wheel 10, so that the workpiece 3 is positioned on the conductive grinding wheel 10. The cathode and anode of the power supply module 28 are electrically coupled to the conductive grinding wheel 10 and the workpiece 3, respectively. When the electrolyte transfer structure 30 transfers the electrolyte to the liquid guide structure 11 located on the conductive grinding wheel 10, the liquid guide structure 11 guides the electrolyte into Electrochemical machining is performed to the machining area between the circumferential surface 102 of the conductive grinding wheel 10 and the workpiece 3.

電化學研削裝置1對工件3進行電化學研削加工時,驅動模組24帶動導電研磨輪10轉動。電解液輸送結構30提供電解液至位於導電研磨輪10之導液結構11。導電研磨輪10旋轉時,位於導液結構11之導液溝槽111的電解液會受到離心力影響,而往導電研磨輪10之圓周面102的方向持續流動,如此電解液即會沿著導液溝槽111持續流動至導電研磨輪10之圓周面102,如此電解液即會持續被引導至圓周面102與工件3之間的加工區域,如此圓周面102對工件3進行電化學加工時,電解液即可以持續被供應至加工區域,而可以避免加工區域發生缺乏電解液的情形,如此導電研磨輪10可以穩定對工件3進行電化學加工,以氧化工件3之表面而形成氧化膜,再藉由導電研磨輪10之研磨粒與工件3之表面接觸,而以機械切削力移除工件3之氧化膜。此外,由於該些導液溝槽111之第一端1111之寬度大於第二端1113之寬度,且該些導液溝槽111之寬度從第一端1111往第二端1113之方向逐漸縮減,所以當電解液輸送至導液溝槽111時,位於導液溝槽111之電解液的流體壓力會隨著導液溝槽111之寬度變窄而變大,因而可以增加電解液傳輸至加工區域的流速,藉此可以提高傳輸電解液之效能。When the electrochemical grinding device 1 performs electrochemical grinding on the workpiece 3, the driving module 24 drives the conductive grinding wheel 10 to rotate. The electrolyte transport structure 30 provides an electrolyte to the liquid conducting structure 11 located on the conductive grinding wheel 10. When the conductive grinding wheel 10 rotates, the electrolyte in the liquid guide groove 111 of the liquid guide structure 11 is affected by centrifugal force, and flows continuously in the direction of the circumferential surface 102 of the conductive grinding wheel 10, so that the electrolyte will follow the liquid guide The groove 111 continuously flows to the circumferential surface 102 of the conductive grinding wheel 10, so that the electrolyte is continuously guided to the processing area between the circumferential surface 102 and the workpiece 3. In this way, when the circumferential surface 102 performs electrochemical processing on the workpiece 3, the electrolyte is electrolyzed. The liquid can be continuously supplied to the processing area, and the lack of electrolyte in the processing area can be avoided. In this way, the conductive grinding wheel 10 can stably perform electrochemical processing on the workpiece 3 to oxidize the surface of the workpiece 3 to form an oxide film. The abrasive particles of the conductive grinding wheel 10 are in contact with the surface of the workpiece 3, and the oxide film of the workpiece 3 is removed by mechanical cutting force. In addition, since the width of the first end 1111 of the liquid guide grooves 111 is larger than the width of the second end 1113, and the width of the liquid guide grooves 111 gradually decreases from the first end 1111 to the second end 1113, Therefore, when the electrolyte is transported to the liquid guide groove 111, the fluid pressure of the electrolyte located in the liquid guide groove 111 becomes larger as the width of the liquid guide groove 111 becomes narrower, thereby increasing the electrolyte transfer to the processing area. Flow rate, which can improve the efficiency of transporting the electrolyte.

請參閱第八A圖,當導電研磨輪10對工件3進行加工時,導電研磨輪10之圓周面102對工件3之表面進行電化學加工,而讓工件3之表面變為氧化膜,圓周面102再進一步研磨氧化磨,而達到除料目的。隨後,導電研磨輪10會逐漸往下移動,以形成一凹槽31於工件3。起初導電研磨輪3於工件3形成凹槽31時,靠近圓周面102之兩側面104與凹槽31之兩側面314之間具有一間距D1。如第八B圖所示,隨後導電研磨輪10持續往下,而對凹槽31深加工時,由於導電研磨輪10之兩側面104具有凹陷區域1041,因此隨後進入凹槽31之導電研磨輪10之兩側面104(較遠離圓周面102之兩側面104)與凹槽31之兩側面314之間的間距D2會大於間距D1,如此可以避免隨後進入凹槽31之導電研磨輪10之兩側面104對已加工過之凹槽31進行電化學加工,而可避免影響精度。Please refer to FIG. 8A. When the conductive grinding wheel 10 processes the workpiece 3, the circumferential surface 102 of the conductive grinding wheel 10 performs electrochemical processing on the surface of the workpiece 3, so that the surface of the workpiece 3 becomes an oxide film and a circumferential surface. 102 further grinding and oxidizing mill to achieve the purpose of material removal. Subsequently, the conductive grinding wheel 10 is gradually moved downward to form a groove 31 in the workpiece 3. At first, when the conductive grinding wheel 3 forms the groove 31 in the workpiece 3, there is a distance D1 between the two side surfaces 104 near the circumferential surface 102 and the two side surfaces 314 of the groove 31. As shown in FIG. 8B, the conductive grinding wheel 10 continues to go down, and when the groove 31 is further processed, since the two sides 104 of the conductive grinding wheel 10 have recessed areas 1041, the conductive grinding wheel 10 subsequently enters the groove 31 The distance D2 between the two sides 104 (distant from the two sides 104 of the circumferential surface 102) and the two sides 314 of the groove 31 will be greater than the distance D1, so that the two sides 104 of the conductive grinding wheel 10 that subsequently enter the groove 31 can be avoided The processed grooves 31 are electrochemically processed to avoid affecting accuracy.

茲因藉由位於導電研磨輪10之導液結構11而可持續輸送電解液至導電研磨輪10之圓周面102與工件3間之加工區域,因此當電化學研削裝置1對工件3進行深切加工時,電解液依然能夠持續被傳輸至深處加工區域,而可以維持加工區域於加工過程中持續保有電解液存在之狀態。再者,由於電解液能夠持續被傳輸至加工區域,所以導電研磨輪10可以穩定對工件3進行電化學加工而形成均勻之氧化膜,而可以提高電化學研削加工的精度。復參閱第一圖與第二圖,本發明之電化學研削裝置1更可包含一外罩4,其罩蓋於導電研磨輪10之部分表面,用以遮擋導電研磨輪10噴射出之電解液。Since the electrolyte is continuously transported to the processing area between the circumferential surface 102 of the conductive grinding wheel 10 and the workpiece 3 through the liquid-conducting structure 11 of the conductive grinding wheel 10, when the electrochemical grinding device 1 performs deep processing on the workpiece 3 At this time, the electrolyte can still be continuously transferred to the deep processing area, and the processing area can maintain the state that the electrolyte exists during the processing. Furthermore, since the electrolytic solution can be continuously transferred to the processing area, the conductive grinding wheel 10 can stably perform electrochemical processing on the workpiece 3 to form a uniform oxide film, and can improve the accuracy of the electrochemical grinding process. Referring again to the first and second figures, the electrochemical grinding device 1 of the present invention may further include an outer cover 4 covering a part of the surface of the conductive grinding wheel 10 to shield the electrolyte sprayed by the conductive grinding wheel 10.

請參閱第五D圖,其為本發明之導電研磨輪之第五實施例之前視圖。如圖所示,導液溝槽111之第二端1113位於導電研磨輪10之側面104,且第二端1113鄰近於圓周面102,第二端1113與圓周面102之間具有一間距D3。當電解液受到離心力作用碰到第二端1113時,電解液仍會因為受到離心力作用而傳送至圓周面102。由於導液溝槽111之第二端1113並未位於導電研磨輪10之圓周面102,因此圓周面102不具有凹口而為完整圓形的圓周,而具有較大之研磨面積,以可達到較佳加工效率。此外,由於圓周面102不具有凹口,所以圓周面102對工件3進行研磨加工時,可以避免工件3與凹口相互撞擊,如此可以降低圓周面102的磨耗,而可提升導電研磨輪10之使用壽命。Please refer to FIG. 5D, which is a front view of a fifth embodiment of the conductive grinding wheel of the present invention. As shown in the figure, the second end 1113 of the liquid guiding groove 111 is located on the side surface 104 of the conductive grinding wheel 10, and the second end 1113 is adjacent to the circumferential surface 102. A distance D3 is formed between the second end 1113 and the circumferential surface 102. When the electrolytic solution is impacted by the centrifugal force and hits the second end 1113, the electrolytic solution is still transmitted to the circumferential surface 102 due to the centrifugal force. Since the second end 1113 of the liquid guide groove 111 is not located on the circumferential surface 102 of the conductive grinding wheel 10, the circumferential surface 102 does not have a notch but has a complete circular circumference, but has a large grinding area so as to achieve Better processing efficiency. In addition, since the circumferential surface 102 does not have a notch, when the circumferential surface 102 grinds the workpiece 3, the workpiece 3 and the notch can be prevented from colliding with each other, so that the wear of the circumferential surface 102 can be reduced, and the conductive grinding wheel 10 can be improved. Service life.

請參閱第九圖,其為本發明之電化學研削裝置之另一實施例的示意圖。此實施例之該些導液溝槽111之第一端1111較遠離導電研磨輪10之中央區域,且電解液輸送結構30呈弧形而對應於導電研磨輪10之弧形,以使得電解液輸送結構30之該些輸出孔306分別對應於部分導液溝槽111之第一端1111,如此電解液輸送結構30可持續輸送電解液至導液溝槽111之第一端1111,而電解液從第一端1111朝第二端1113之方向持續流動於導液溝槽111,即可讓導液溝槽111盡量維持充填滿電解液,如此可以降低位於導液溝槽111之氣泡的數量,以可降低傳輸至工作區域之氣泡的數量,而提高電化學加工的精度。Please refer to FIG. 9, which is a schematic diagram of another embodiment of the electrochemical grinding device of the present invention. The first ends 1111 of the liquid-conducting grooves 111 in this embodiment are far from the central region of the conductive grinding wheel 10, and the electrolyte conveying structure 30 has an arc shape corresponding to the arc shape of the conductive grinding wheel 10, so that the electrolyte The output holes 306 of the conveying structure 30 respectively correspond to the first end 1111 of the part of the liquid guide groove 111, so that the electrolyte conveying structure 30 can continuously deliver the electrolyte to the first end 1111 of the liquid guide groove 111, and the electrolyte Continuously flowing from the first end 1111 to the second end 1113 in the liquid guide groove 111, the liquid guide groove 111 can be kept filled with the electrolyte as much as possible, so the number of bubbles in the liquid guide groove 111 can be reduced. In order to reduce the number of bubbles transmitted to the work area, and improve the accuracy of electrochemical machining.

請參閱第十圖,其為本發明之電化學研削裝置之又一實施例的示意圖。電化學研削裝置1更可包含一槽體40,其用於容置電解液41,工件3亦固定於槽體40而浸泡於電解液41,導電研磨輪10對工件3進行加工時,導電研磨輪10之下半部亦位於槽體40內而浸泡於電解液41,導電研磨輪10旋轉時,導液溝槽111會帶動電解液41朝向工作3之凹槽31(如第八B圖所示)流動,因此電解液41能夠持續被傳輸至深處加工區域,而可以維持加工區域於加工過程中持續保有電解液存在之狀態。Please refer to FIG. 10, which is a schematic diagram of another embodiment of an electrochemical grinding device according to the present invention. The electrochemical grinding device 1 may further include a tank 40 for containing the electrolyte 41, and the workpiece 3 is also fixed to the tank 40 and immersed in the electrolyte 41. When the conductive grinding wheel 10 processes the workpiece 3, the conductive grinding is performed The lower half of the wheel 10 is also located in the tank 40 and immersed in the electrolyte 41. When the conductive grinding wheel 10 rotates, the liquid guide groove 111 will drive the electrolyte 41 toward the groove 31 of the work 3 (as shown in Figure 8B). (Shown) flow, so the electrolyte 41 can be continuously transferred to the deep processing area, and the processing area can be maintained in the state where the electrolyte is continuously present during processing.

綜上所述,本發明之電化學研削裝置包含導電研磨輪,導電研磨輪具有複數導液結構,該些導液結構位於導電研磨輪之兩側面。導液結構可以持續引導電解液流動至導電研磨輪之圓周面,以讓電解液持續被供應至導電研磨輪與工件之間的加工區域,如此進行電化學加工時,可以避免加工區域發生缺乏電解液的情形。In summary, the electrochemical grinding device of the present invention includes a conductive grinding wheel. The conductive grinding wheel has a plurality of liquid conducting structures, and the liquid conducting structures are located on both sides of the conductive grinding wheel. The liquid-conducting structure can continuously guide the electrolyte flow to the circumferential surface of the conductive grinding wheel, so that the electrolyte is continuously supplied to the processing area between the conductive grinding wheel and the workpiece. In this way, the lack of electrolysis in the processing area can be avoided during electrochemical processing Liquid situation.

由上述可知,本發明確實已經達於突破性之結構,而具有改良之發明內容,同時又能夠達到產業上利用性與進步性,當符合專利法之規定,爰依法提出新型專利申請,懇請 鈞局審查委員授予合法專利權,至為感禱。As can be seen from the above, the present invention has indeed reached a breakthrough structure, with improved invention content, and at the same time, it can achieve industrial applicability and progress. When it complies with the provisions of the Patent Law, a new patent application is filed according to the law. The examiner of the Office granted the legal patent right.

1 電化學研削裝置 10 導電研磨輪 100 輪體 101 穿孔 102 圓周面 104 側面 1041 凹陷區域 11 導液結構 111 導液溝槽 1111 第一端 1113 第二端 113 間隔件 20 基座 21 承載結構 211 抵頂件 2111 穿孔 213 承載件 2131 穿孔 22 夾持件 221 穿孔 23 固定件 231 穿孔 24 驅動模組 25 螺栓 242 驅動器 244 傳動軸 2441 抵頂部 26 移動模組 28 供電模組 30 電解液輸送結構 302 輸入孔 304 流道 306 輸出孔 308 輸入連接件 40 槽體 41 電解液 3 工件 31 凹槽 314 側面 4 外罩 D1 間距 D2 間距 D3 間距1 Electrochemical grinding device 10 Conductive grinding wheel 100 Wheel body 101 Perforation 102 Circumferential surface 104 Side 1041 Recessed area 11 Liquid guide structure 111 Liquid guide groove 1111 First end 1113 Second end 113 Spacer 20 Base 21 Bearing structure 211 Top piece 2111 Perforation 213 Carrying piece 2131 Perforation 22 Clamping piece 221 Perforation 23 Fixing piece 231 Perforation 24 Drive module 25 Bolt 242 Drive 244 Drive shaft 2441 Abutment on top 26 Mobile module 28 Power supply module 30 Electrolyte delivery structure 302 Input hole 304 runner 306 output hole 308 input connector 40 tank 41 electrolyte 3 work piece 31 groove 314 side 4 cover D1 D2 pitch D3 pitch

第一圖:其為本發明之電化學研削裝置之一實施例的立體圖; 第二圖:其為本發明之電化學研削裝置之一實施例的部分分解圖; 第三圖:其為本發明之電化學研削裝置之一實施例的局部立體圖; 第四A圖:其為本發明之電化學研削裝置之導電研磨輪之第一實施例的前視圖; 第四B圖:其為第四A圖所示之A-A方向的剖視圖; 第五A圖:其為本發明之電化學研削裝置之導電研磨輪之第二實施例的前視圖; 第五B圖:其為本發明之電化學研削裝置之導電研磨輪之第三實施例的前視圖; 第五C圖:其為本發明之電化學研削裝置之導電研磨輪之第四實施例的前視圖; 第五D圖:其為本發明之電化學研削裝置之導電研磨輪之第五實施例的前視圖; 第六圖:其為本發明之電化學研削裝置之一實施例的局部分解圖; 第七圖:其為本發明之電化學研削裝置之電解液輸送結構之一實施例的分解圖; 第八A圖:其為第四B圖所示之導電研磨輪對工件進行加工的第一示意圖; 第八B圖:其為第四B圖所示之導電研磨輪對工件進行加工的第二示意圖; 第九圖:其為本發明之電化學研削裝置之另一實施例的示意圖;以及 第十圖:其為本發明之電化學研削裝置之又一實施例的示意圖。First figure: It is a perspective view of an embodiment of an electrochemical grinding device of the present invention; Second figure: It is a partial exploded view of an embodiment of an electrochemical grinding device of the present invention; Third figure: It is the present invention Partial perspective view of one embodiment of the electrochemical grinding device; FIG. 4A is a front view of the first embodiment of the conductive grinding wheel of the electrochemical grinding device of the present invention; FIG. 4B is a fourth A A cross-sectional view in the AA direction shown in the figure; FIG. 5A: It is a front view of the second embodiment of the conductive grinding wheel of the electrochemical grinding device of the present invention; FIG. 5B: It is an electrochemical grinding device of the present invention Front view of the third embodiment of the conductive grinding wheel; FIG. 5C: It is a front view of the fourth embodiment of the conductive grinding wheel of the electrochemical grinding device of the present invention; FIG. D: It is a view of the present invention A front view of the fifth embodiment of the conductive grinding wheel of the electrochemical grinding device; FIG. 6 is a partially exploded view of an embodiment of the electrochemical grinding device of the present invention; FIG. 7 is an electrochemical view of the present invention Electrolyte transportation of grinding device An exploded view of one embodiment of the structure; FIG. 8A is a first schematic view of processing a workpiece by the conductive grinding wheel shown in FIG. 4B; FIG. 8B is a conductive view shown in FIG. 4B A second schematic diagram of a workpiece processed by a grinding wheel; a ninth diagram: a schematic diagram of another embodiment of the electrochemical grinding device of the present invention; and a tenth diagram: another embodiment of the electrochemical grinding device of the present invention Schematic illustration.

Claims (10)

一種電化學研削裝置,其包含:一基座;一驅動模組,其設置於該基座;以及一導電研磨輪,其連接驅動模組並具有一圓周面、兩側面、複數導液溝槽與複數間隔件,該兩側面相連於該圓周面,該些導液溝槽與該些間隔件位於該導電研磨輪之該兩側面之至少一側面,該些間隔件分別位於該些導液溝槽之間。An electrochemical grinding device includes: a base; a driving module disposed on the base; and a conductive grinding wheel connected to the driving module and having a circumferential surface, two sides, and a plurality of liquid conducting grooves And a plurality of spacers, the two sides are connected to the circumferential surface, the liquid guide grooves and the spacers are located on at least one side of the two sides of the conductive grinding wheel, and the spacers are respectively located on the liquid guide grooves Between the slots. 如申請專利範圍第1項所述之電化學研削裝置,其中該些導液溝槽從遠離該導電研磨輪之該圓周面的位置而朝向該圓周面的方向延伸。The electrochemical grinding device according to item 1 of the patent application range, wherein the liquid conducting grooves extend from a position away from the circumferential surface of the conductive grinding wheel toward the circumferential surface. 如申請專利範圍第1項所述之電化學研削裝置,其中每一該導液溝槽具有一第一端以及一第二端,該第一端位於該導電研磨輪之該側面的中央區域,該第二端遠離該導電研磨輪之該側面的中央區域。The electrochemical grinding device according to item 1 of the scope of patent application, wherein each of the liquid-conducting grooves has a first end and a second end, and the first end is located in a central region of the side of the conductive grinding wheel, The second end is far from a central region of the side of the conductive grinding wheel. 如申請專利範圍第1項所述之電化學研削裝置,其中該些導液溝槽之該第一端的寬度大於該些導液溝槽之該第二端的寬度。The electrochemical grinding device according to item 1 of the scope of the patent application, wherein the width of the first end of the liquid-conducting grooves is greater than the width of the second end of the liquid-conducting grooves. 如申請專利範圍第1項所述之電化學研削裝置,其中該些導液溝槽之寬度自該些導液溝槽之該第一端往該些導液溝槽之該第二端的方向逐漸縮減。The electrochemical grinding device according to item 1 of the scope of patent application, wherein the width of the liquid-conducting grooves gradually increases from the first end of the liquid-conducting grooves to the second end of the liquid-conducting grooves. reduce. 如申請專利範圍第1項所述之電化學研削裝置,更包含至少一電解液輸送結構,其具有一輸入孔、一流道以及複數輸出孔,該輸入孔連通於該流道,該流道位於該電解液輸送結構之內部並連通該些輸出孔,該些輸出孔位於該電解液輸送結構之外側並分別相對部分該些導液溝槽的該些第一端。The electrochemical grinding device according to item 1 of the scope of patent application, further comprising at least one electrolyte conveying structure, which has an input hole, a first channel and a plurality of output holes. The input hole communicates with the flow channel, and the flow channel is located at The electrolyte transport structure is internally connected to the output holes. The output holes are located on the outer side of the electrolyte transport structure and are opposite to the first ends of the liquid guide grooves. 如申請專利範圍第1項所述之電化學研削裝置,其中該導電研磨輪之該側面具有一凹陷區域,該些導液溝槽與該些間隔件位於該凹陷區域,該側面從鄰近該導電研磨輪之該圓周面的位置往該側面之中央的方向逐漸凹陷。The electrochemical grinding device according to item 1 of the scope of patent application, wherein the side surface of the conductive grinding wheel has a recessed area, the liquid conducting grooves and the spacers are located in the recessed area, and the side surface is adjacent to the conductive surface. The position of the circumferential surface of the grinding wheel is gradually recessed toward the center of the side surface. 如申請專利範圍第1項所述之電化學研削裝置,更包含至少一電解液輸送結構,其相對於部分該些導液溝槽與該些間隔件,該電解液輸送結構具有一輸入孔、一流道以及複數輸出孔,該輸入孔連通於該流道,該流道位於該電解液輸送結構之內部並連通該些輸出孔,該些輸出孔位於該電解液輸送結構之外側並相對部分該些導液溝槽與該些間隔件。According to the electrochemical grinding device described in the first item of the patent application scope, it further includes at least one electrolyte transporting structure. Compared to a part of the liquid conducting grooves and the spacers, the electrolyte transporting structure has an input hole, The first channel and a plurality of output holes are connected to the flow channel. The flow channel is located inside the electrolyte transport structure and communicates with the output holes. The output holes are located on the outer side of the electrolyte transport structure and opposite to the part. The fluid guide grooves and the spacers. 一種導電研磨輪,其包含:一圓周面;兩側面,其相連於該圓周面;以及複數導液溝槽與複數間隔件,位於該兩側面之至少一側面,該些間隔件分別位於該些導液溝槽之間。A conductive grinding wheel includes: a circumferential surface; two sides connected to the circumferential surface; and a plurality of liquid guide grooves and a plurality of spacers located on at least one side of the two sides, and the spacers are respectively located on the sides. Between the drainage channels. 如申請專利範圍第9項所述之導電研磨輪,其中該些導液溝槽從遠離該圓周面的位置而朝向該圓周面的方向延伸,,每一該導液溝槽具有一第一端以及一第二端,該第一端位於該側面的中央區域,該第二端遠離該側面的中央區域,該些導液溝槽之該第一端的寬度大於該些導液溝槽之該第二端的寬度,該些導液溝槽之寬度自該些導液溝槽之該第一端往該些導液溝槽之該第二端的方向逐漸縮減,該側面具有一凹陷區域,該些導液溝槽與該些間隔件位於該凹陷區域,該側面從鄰近該圓周面的位置往該側面之中央的方向逐漸凹陷。The conductive grinding wheel according to item 9 of the scope of the patent application, wherein the liquid-conducting grooves extend from a position away from the circumferential surface toward the circumferential surface, and each of the liquid-conducting grooves has a first end And a second end, the first end is located in a central region of the side, the second end is far from the central region of the side, and the width of the first end of the liquid guiding grooves is larger than that of the liquid guiding grooves The width of the second end, the width of the liquid-conducting grooves gradually decreases from the first end of the liquid-conducting grooves toward the second end of the liquid-conducting grooves, and the side has a recessed area. The liquid guiding groove and the spacers are located in the recessed area, and the side surface is gradually recessed from a position adjacent to the circumferential surface toward a center of the side surface.
TW106142274A 2017-12-01 2017-12-01 Electrochemical grinding device and conductive grinding wheel thereof TWI671151B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW106142274A TWI671151B (en) 2017-12-01 2017-12-01 Electrochemical grinding device and conductive grinding wheel thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW106142274A TWI671151B (en) 2017-12-01 2017-12-01 Electrochemical grinding device and conductive grinding wheel thereof

Publications (2)

Publication Number Publication Date
TW201924831A TW201924831A (en) 2019-07-01
TWI671151B true TWI671151B (en) 2019-09-11

Family

ID=68048548

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106142274A TWI671151B (en) 2017-12-01 2017-12-01 Electrochemical grinding device and conductive grinding wheel thereof

Country Status (1)

Country Link
TW (1) TWI671151B (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1557606A (en) * 2004-01-16 2004-12-29 石油大学(华东) Non-conductive superhard material EDM compound grinding method and machine tool
WO2009147856A1 (en) * 2008-06-03 2009-12-10 株式会社ソディック Electric discharge machining apparatus and electric discharge machining method
CN201871834U (en) * 2010-11-11 2011-06-22 广东工业大学 Compound processing system combining electrochemistry with magnetic grinding
CN203956754U (en) * 2014-05-23 2014-11-26 安徽砥钻砂轮有限公司 A kind of heat radiating type emery wheel
CN105522487A (en) * 2016-01-25 2016-04-27 青岛理工大学 Nano-fluid minimal quantity lubrication grinding equipment with electrocaloric internal cooling grinding wheel coupled with electrostatic technology and use method thereof
CN105817726A (en) * 2015-01-08 2016-08-03 沈阳景宏数控设备有限公司 Embedded numerical control self-adaptive electrochemical cylindrical grinding machine
CN206527667U (en) * 2017-02-17 2017-09-29 神龙汽车有限公司 Electroplating CBN emery wheel is used in crankshaft journal processing

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1557606A (en) * 2004-01-16 2004-12-29 石油大学(华东) Non-conductive superhard material EDM compound grinding method and machine tool
WO2009147856A1 (en) * 2008-06-03 2009-12-10 株式会社ソディック Electric discharge machining apparatus and electric discharge machining method
CN201871834U (en) * 2010-11-11 2011-06-22 广东工业大学 Compound processing system combining electrochemistry with magnetic grinding
CN203956754U (en) * 2014-05-23 2014-11-26 安徽砥钻砂轮有限公司 A kind of heat radiating type emery wheel
CN105817726A (en) * 2015-01-08 2016-08-03 沈阳景宏数控设备有限公司 Embedded numerical control self-adaptive electrochemical cylindrical grinding machine
CN105522487A (en) * 2016-01-25 2016-04-27 青岛理工大学 Nano-fluid minimal quantity lubrication grinding equipment with electrocaloric internal cooling grinding wheel coupled with electrostatic technology and use method thereof
CN206527667U (en) * 2017-02-17 2017-09-29 神龙汽车有限公司 Electroplating CBN emery wheel is used in crankshaft journal processing

Also Published As

Publication number Publication date
TW201924831A (en) 2019-07-01

Similar Documents

Publication Publication Date Title
TWI488724B (en) Method and apparatus for multiple cutoff machining of rare earth magnet block, cutting fluid feed nozzle, and magnet block securing jig
US20150306685A1 (en) Diamond plated grinding endmill for advanced hardend ceramics machining
US20150231718A1 (en) High-frequency-vibration-assisted electrolytic grinding method and device therefor
US11253971B1 (en) Leached superabrasive elements and systems, methods and assemblies for processing superabrasive materials
TW201217130A (en) Method for multiple cutoff machining of rare earth magnet
US7779827B2 (en) Blade ring saw blade
US11333162B2 (en) Impeller manufacturing method and impeller flow path elongation jig
JP2522278B2 (en) Electroformed thin blade grindstone
TWI671151B (en) Electrochemical grinding device and conductive grinding wheel thereof
WO2015098194A1 (en) Grinding wheel tool
JP5787638B2 (en) Impeller machining method
CN110586972B (en) A turning tool self-rotating device
JP2024151300A (en) Diamond tool and manufacturing method thereof
US11535520B1 (en) Leached superabrasive elements and systems, methods and assemblies for processing superabrasive materials
CN217801076U (en) Long-acting wear-resistant diamond roller
CN109420970B (en) Hard metal electrochemical plane grinding equipment
CN109420936A (en) Hard metal electrochemical milling method
JP4661025B2 (en) Metal bond grindstone and manufacturing method thereof
JPS60180757A (en) Polishing device for spiral drill
JP2007190642A (en) Circular saw for dry-cutting soft material to be cut, and machining method
CN103952748A (en) Electroplating tank for manufacturing electroplating sawing wire with surface abrasive particles distributed in groups, joints and blocks
CN219925652U (en) Grinding tool and grinding device
JP2012143836A (en) Cutting grinding wheel, cutting machine including cutting grinding wheel, and cutting method by cutting machine
JP2010076063A (en) Chamfering device, chamfering method, and chamfering electroplated grinding wheel
KR20200071467A (en) Electrolytic Deburring Device for Development of Cage for High Endurance Constant Velocity Joint and Its Operation Method