TWI670507B - Production method of radiation image detecting device - Google Patents

Abstract

The present invention provides a method of manufacturing a radiation image detecting apparatus which suppresses generation of bubbles when a phosphor substrate is bonded to a photoelectric conversion panel by an adhesive layer. When the phosphor substrate 27 and the photoelectric conversion panel 21 are joined by the adhesive layer 29, the bonding roller 123 is pressed against the phosphor layer side of the support at a line pressure of 20 N/cm or more and 35 N/cm or less. The surface of the opposite surface is moved at a speed of 20 mm/s or more and 50 mm/s or less, and the phosphor substrate 27 includes a phosphor layer formed on the support 25 to convert radiation into visible light. 20. The photoelectric conversion panel 21 receives visible light and detects a radiographic image.

Description

Method for manufacturing radiation image detecting device

The present invention relates to a method of manufacturing a radiation image detecting apparatus for detecting a radiation image by converting radiation into visible light by a scintillator.

In the medical field, etc., various types of radiation image detecting apparatuses are used to detect radiation of X-rays and the like, and to detect radiation that penetrates the subject. Radiographic image of the subject. As such a radiographic image detecting apparatus, a digital radiography (DR) method in which electric charges are generated in accordance with incidence of radiation, and the generated electric charge is converted into a voltage to generate a digital image indicating a radiographic image is used. Format image data.

The radiation image detecting device of the DR system includes a direct conversion method in which a radiation is directly converted into a charge by a semiconductor layer such as selenium, and an indirect conversion method, and the indirect conversion method. Radiation is converted into light by a scintillator, and converted into electric charge by a photoelectric conversion panel including a photodiode or the like.

The scintillator used in the radiation image detecting device of the indirect conversion method is a phosphor that can convert radiation into visible light (for example, particles or iodine such as strontium sulphur oxide sulphur oxide GOS (Gd ₂ O ₂ S: Tb). It is formed by a columnar crystal of CsI: Tl or the like. The scintillator may be formed by directly coating (or vapor-depositing) a phosphor on the imaging surface of the photoelectric conversion panel, but the mainstream method is to apply a phosphor layer on the support to prepare a phosphor substrate. The phosphor substrate is bonded to the imaging surface of the photoelectric conversion panel via an adhesive layer. As the support, a resin substrate such as polyethylene terephthalate (PET) or an amorphous carbon substrate or the like is used.

As a method of bonding a phosphor substrate to a photoelectric conversion panel, for example, a method is known in which a phosphor substrate is laminated on a photoelectric conversion panel via an adhesive layer, and a bonding roller is used on the phosphor substrate. Pressing (Patent Document 1 to Patent Document 3).

[Prior Art Literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2005-062016

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2001-145109

[Patent Document 3] Japanese Patent Laid-Open Publication No. 2003-066147

However, as described in Patent Document 1 to Patent Document 3, when the phosphor substrate is bonded to the photoelectric conversion panel, the gas having a diameter of millimeters is used. The bubble is mixed into the adhesive layer between the phosphor and the photoelectric conversion panel. Since the pixel size of the photoelectric conversion panel is about 150 μm × 150 μm, bubbles of a millimeter order may cause image defects.

Further, there is a case where bubbles having a small diameter of a few tens of micrometers are generated on the adhesive layer. The bubble of such a small diameter is sufficiently smaller than the pixel size of the photoelectric conversion panel, so that when the bubble is isolated, no image defect occurs. However, it is easy to densely generate a plurality of small-diameter bubbles. The small-diameter bubbles have a millimeter-scale diameter as a whole by being dense, and at this time, as with the large-diameter bubbles, image defects are caused. Further, in a portion where bubbles having a small diameter are densely generated, there is also a problem that the adhesive force of the adhesive layer is lowered.

An object of the method for producing a radiation image detecting apparatus according to the present invention is to suppress a bubble having a large diameter when a phosphor substrate having a phosphor formed on a support is bonded to a photoelectric conversion panel via an adhesive layer. Causes image defects or the generation of dense small-diameter bubbles.

A method of manufacturing a radiation image detecting apparatus according to the present invention includes a radiation image detecting apparatus including: a phosphor substrate including a support body and a support body formed on the support body to convert radiation into visible light a phosphor layer; a photoelectric conversion panel that detects visible light to detect a radiation image; and an adhesive layer disposed on a surface of the phosphor substrate on a side of the phosphor layer for bonding with the photoelectric conversion panel, and the radiation pattern The image detecting device is manufactured by setting the bonding roller to a linear pressure of 20 N/cm or more and 35 N/cm or less. In a state where the surface of the support opposite to the surface on the phosphor layer side is pressed, the substrate is moved at a speed of 20 mm/s or more and 50 mm/s or less to bond the phosphor substrate to the photovoltaic layer via the adhesive layer. Conversion panel.

Preferably, the line pressure is 25 N/cm or more and 30 N/cm or less.

Preferably, the speed of the bonding roller is 20 mm/s or more and 40 mm/s or less.

The phosphor layer is, for example, a GOS dispersed in a binder, and is formed by being applied to a support.

Preferably, the bonding roller presses the phosphor substrate, for example, via a silk screen.

Preferably, in a state in which the photoelectric conversion panel is supported on the vertical upper side and the phosphor substrate is supported on the vertically lower side, the bonding roller pushes the phosphor substrate from the vertical lower side vertically upward, and pushes it up to Photoelectric conversion panel.

The bonding roller is formed, for example, by coating a metal shaft portion with rubber. It is preferable that the rubber has a rubber hardness of 50 or more and 80 or less.

The thickness of the adhesive layer is preferably 10 μm or more and 30 μm or less. Further, it is preferable that the adhesive layer has an adhesive force to the stainless steel material of 8.0 N/25 mm or more and an adhesive force to polyethylene terephthalate of 7.2 N/25 mm or more.

Preferably, after the photoelectric conversion panel and the phosphor substrate are bonded together, heat treatment is performed at 50 ° C for 4 hours.

According to the method of manufacturing a radiation image detecting apparatus of the present invention, a phosphor substrate on which a phosphor is formed on a support is bonded to a photoelectric conversion by an adhesive layer In the case of a panel, generation of the large-diameter bubbles or dense small-diameter bubbles can be suppressed.

10‧‧‧X-ray image detecting device

11‧‧‧FPD (flat detector)

12‧‧‧Circuit support substrate

12a‧‧‧ lower surface

13‧‧‧Control unit

14‧‧‧ frame

14a‧‧‧ illuminated surface

14b‧‧‧ side

15‧‧‧Guide line

20‧‧‧Fluorescent layer/fluorescent body (scintillator)

20a‧‧‧End

21‧‧‧ photoelectric conversion panel

21a‧‧‧Surface

21b‧‧‧External terminals

22‧‧‧Adhesive layer

25‧‧‧Support (phosphor support substrate)

26‧‧‧Light reflective film

27‧‧‧Fuel substrate

28‧‧‧ alignment mark

29‧‧‧Adhesive layer

30‧‧‧ circuit board

30a‧‧‧Signal Processing Department

30b‧‧‧ image memory

31‧‧‧Flexible printed circuit board

31a‧‧‧gate driver

31b‧‧‧Charger amplifier

100‧‧‧Fitting device

101‧‧‧ photoelectric conversion panel holding unit

101a‧‧‧Adsorption surface

101b‧‧‧ suction port

102‧‧‧Fluorescent substrate holder

102a‧‧‧Adsorption surface

102b‧‧‧ suction port

103‧‧‧1st inhalation department

104‧‧‧2nd inhalation department

105‧‧‧Control device

106‧‧‧Hinges

111‧‧‧ base

111a‧‧‧ recess

112‧‧‧Adsorption plate

112a‧‧‧through hole

115‧‧‧1st inspiratory pressure control department

116‧‧‧2nd Inspiratory Pressure Control Department

121‧‧‧ frame

122‧‧‧Screen

123‧‧‧Finishing roller

123a‧‧‧Axis

123b‧‧‧Rubber

124‧‧‧Support plate

126‧‧‧ camera

131‧‧‧ cylinder

132‧‧‧rails

133‧‧‧Mobile Station

134‧‧‧ Timing belt

136‧‧‧ timing belt pulley

141‧‧‧ cylinder

142‧‧‧Support Plate Control Department

143‧‧‧ monitor

150‧‧‧Fixed line pressure control department

151‧‧‧Fixed Speed Control Department

161‧‧‧ affixing line

162‧‧‧Bend

S10~S16‧‧‧Steps

XR‧‧‧X-ray

X, Y, Z‧‧ Direction

Fig. 1 is a partially broken perspective view of an X-ray image detecting apparatus.

2 is a cross-sectional view of an X-ray image detecting apparatus.

3 is an explanatory view showing a configuration of a bonding apparatus.

4 is a cross-sectional view showing a configuration of an adsorption portion of a photoelectric conversion panel.

FIG. 5 is an explanatory view showing a configuration of a phosphor substrate adsorption portion.

Figure 6 is a flow chart of the bonding step.

FIG. 7 is a cross-sectional view showing a state in which a phosphor substrate is bonded to a photoelectric conversion panel.

Fig. 8 is a graph showing the relationship between the line pressure and the speed of bonding and the bubbles to be mixed.

As shown in FIG. 1, an X-ray image detecting apparatus 10 as an example of a radiation image detecting apparatus includes a flat panel detector (FPD) 11, a circuit supporting substrate 12, a control unit 13, and a frame for housing the same. Body 14. The frame 14 is a monocoque structure in which a carbon fiber reinforced resin having a high X-ray XR permeability, light weight, and high durability is integrally formed. The X-ray image detecting device 10 is a movable type electronic cartridge.

An opening (not shown) is provided on one side surface of the casing 14 and A cover member (not shown) that plugs the opening. When the X-ray image detecting apparatus 10 is manufactured, the FPD 11 or the control unit 13 is inserted into the casing 14 from the opening.

The housing 14 is provided with an irradiation surface 14a that is irradiated with an X-ray XR that is a radiation that is emitted from the X-ray source and penetrates the sample (patient). On the irradiation surface 14a, a guide wire 15 indicating a photographable region of the subject and its center position is formed. The outer frame of the guide lead 15 corresponds to the photographic area, and the intersection of the guide lines 15 in a cross shape corresponds to the center position of the photographic area.

In the casing 14, the FPD 11 and the circuit supporting substrate 12 are disposed in this order from the side of the irradiation surface 14a. The circuit supporting substrate 12 supports the circuit board 30 (see FIG. 2) and is fixed to the housing 14. The control unit 13 is disposed on one end side in the short side direction in the casing 14.

The control unit 13 houses a micro computer and a battery (none of which are shown). The microcomputer communicates with a console (not shown) connected to the X-ray source 80 by wire or wirelessly to control the operation of the FPD 11.

As shown in FIG. 2, the FPD 11 includes a phosphor (scintillator) 20 that converts X-rays XR into visible light, and a photoelectric conversion panel 21 that converts the visible light into electric charges. The X-ray image detecting device 10 is of an Irradiation Side Sampling (ISS) type, and the photoelectric conversion panel 21 is disposed on the incident side of the X-ray XR of the phosphor layer 20. The phosphor layer 20 converts the X-ray XR penetrating the photoelectric conversion panel 21 into visible light and emits it. The photoelectric conversion panel 21 photoelectrically converts visible light emitted from the phosphor layer 20 into electric charges.

The photoelectric conversion panel 21 is attached to the inner surface of the frame 14 on the irradiation surface 14a side via an adhesive layer 22 containing an epoxy resin or the like. On the surface 21a of the photoelectric conversion panel 21, a photodiode (PD) (not shown) for photoelectric conversion is formed in a two-dimensional matrix. In the surface 21a, the area in which the PDs are arranged is a photographing surface.

The phosphor layer 20 is supported by the support 25, and a light reflection film 26 is formed between the phosphor layer 20 and the support 25. The phosphor layer 20 includes, for example, a binder (bonding agent) containing a resin or the like, and a plurality of phosphor particles dispersed in the binder, and is formed by being applied onto the support 25 . The binder is prepared, for example, by dissolving a mixture of a polyvinyl butyral resin, a urethane resin, and a plasticizer in a mixed solvent of toluene, 2-butanol, and xylene. Further, the phosphor particles are, for example, a granular crystal of GOS (Gd ₂ O ₂ S: Tb) having an average particle diameter of about 5 μm, and absorb X-rays XR to generate visible light. The support 25 is formed of a transparent insulating material such as PET. The light reflecting film 26 is formed of a metal thin film such as aluminum. The phosphor substrate 27 includes a support 25, a light reflecting film 26, and a phosphor layer 20.

The phosphor layer 20 is bonded to the surface 21 a of the photoelectric conversion panel 21 on the side opposite to the surface on which the light reflecting film 26 is formed via an adhesive layer 29 containing an acrylic adhesive or the like. On the surface 21a of the photoelectric conversion panel 21, an alignment mark 28 is formed at a position corresponding to the end portion 20a of the phosphor layer 20. The alignment mark 28 is formed of a metal thin film of aluminum or the like. The end portion 20a of the phosphor layer 20 and the alignment mark 28 are used to align the position of the phosphor substrate 27 and the photoelectric conversion panel 21 when the phosphor substrate 27 is bonded to the photoelectric conversion panel 21.

The circuit supporting substrate 12 is disposed on the side of the phosphor supporting substrate 25 opposite to the incident side of the X-ray XR. The circuit supporting substrate 12 is fixed to the side portion 14b of the casing 14 by screws or the like. The circuit board 30 is fixed to the lower surface 12a of the circuit support substrate 12 on the side opposite to the phosphor support substrate 25 via an adhesive layer or the like.

The circuit board 30 and the photoelectric conversion panel 21 are electrically connected via the flexible printed circuit board 31. The flexible printed circuit board 31 is connected to the external terminal 21b provided at the end of the photoelectric conversion panel 21 by a bonding method called Tape Automated Bonding (TAB).

A gate driver 31a and a charge amplifier 31b for driving the photoelectric conversion panel 21 for driving the photoelectric conversion panel 31 from the photovoltaic are mounted on the flexible printed circuit board 31. The charge output from the conversion panel 21 is converted into a voltage signal. A signal processing unit 30a and an image memory 30b are mounted on the circuit board 30, and the signal processing unit 30a generates image data based on a voltage signal converted by the charge amplifier 31b, the image memory 30b pair image Data for memory. The signal processing unit 30a includes a correlated double sampling circuit, a voltage amplifier, a multiplexer, an analog to digital (A/D) converter, and the like. Each of the gate driver 31a, the charge amplifier 31b, the signal processing unit 30a, and the image memory 30b is configured as an integrated circuit.

In order to protect the circuit board 30, the signal processing unit 30a, and the image memory 30b from the X-ray XR, the circuit support substrate 12 preferably includes an X-ray shielding material such as lead.

Next, a manufacturing step of the X-ray image detecting apparatus 10, that is, a bonding step of bonding the photoelectric conversion panel 21 and the phosphor substrate 27 by the adhesive layer 29 will be described. As shown in FIG. 3, the bonding apparatus 100 for bonding the photoelectric conversion panel 21 and the phosphor substrate 27 by the adhesive layer 29 includes a photoelectric conversion panel holding portion 101 for performing the photoelectric conversion panel 21. The phosphor substrate holding portion 102 is configured to adsorb and hold the phosphor substrate 27; the first air suction portion 103 is configured to inhale the air in the internal space of the photoelectric conversion panel holding portion 101; The air suction unit 104 is configured to inhale air in the internal space of the phosphor substrate holding unit 102, and the control device 105 is configured to apply the first air suction unit 103, the second air suction unit 104, and the phosphor substrate. Each unit included in the holding unit 102 is controlled.

The photoelectric conversion panel holding portion 101 is attached to the phosphor substrate holding portion 102 by a hinge 106. Therefore, the photoelectric conversion panel holding portion 101 is rotatable with respect to the phosphor substrate holding portion 102, and is opened and closed between an open position indicated by a two-dot chain line and a closed position indicated by a solid line. The photoelectric conversion panel 21 is placed on the adsorption surface 101a in a state where the photoelectric conversion panel holding portion 101 is in the open position, and is held by adsorption. Thereafter, when the photoelectric conversion panel holding portion 101 is rotated to the closed position, the photoelectric conversion panel 21 adsorbed and held on the adsorption surface 101a faces the phosphor substrate 27 adsorbed and held by the phosphor substrate holding portion 102. In the state where the photoelectric conversion panel holding portion 101 is rotated to the closed position, the photoelectric conversion panel 21 is not brought into contact with the phosphor substrate 27, and the predetermined distance is released with respect to the phosphor substrate 27. The photoelectric conversion panel 21 is held in parallel.

The first suction unit 103 is a vacuum pump for connecting the vacuum pump to the photoelectric conversion A pipe, a valve, or the like of the intake port 101b of the panel holding portion 101 is replaced. The first intake unit 103 inhales the air in the internal space (see the recess 111a of FIG. 4) of the photoelectric conversion panel holding unit 101 from the air intake port 101b, and the photoelectric conversion panel placed on the adsorption surface 101a. 21 adsorption.

As shown in FIG. 4, the photoelectric conversion panel holding portion 101 includes a base portion 111 and an adsorption plate 112. The base portion 111 is formed integrally with the hinge 106, and a concave portion 111a is formed on the surface on the side where the photoelectric conversion panel 21 is suction-held. The adsorption plate 112 covers the concave portion 111a and is formed integrally with the base portion 111. Therefore, the exposed surface of the adsorption plate 112 becomes the adsorption surface 101a of the photoelectric conversion panel holding portion 101.

The adsorption plate 112 is provided with a plurality of adsorption holes 112a that connect the concave portion 111a and the outside, and when the first air suction portion 103 inhales the air of the concave portion 111a from the air inlet 101b, the through hole is passed through the adsorption surface 101a side. 112a inhales air. When the first intake unit 103 inhales air in a state where the photoelectric conversion panel 21 is placed on the adsorption surface 101a, the photoelectric conversion panel 21 is adsorbed to the adsorption surface 101a.

An antistatic agent is applied on at least the exposed surface of the adsorption plate 112 as the adsorption surface 101a. Therefore, the photoelectric conversion panel 21 is not held by the adsorption plate 112 by an electrostatic force or the like, and the photoelectric conversion panel 21 can be naturally peeled off from the adsorption surface 101a as long as the first intake portion 103 stops the intake of air. . Further, since the adsorption plate 112 is formed by applying an antistatic agent to the front surface and the back surface, the adsorption hole 112a is formed. Therefore, the adsorption plate 112 is also coated with an antistatic agent on the surface on the side of the concave portion 111a.

The intake pressure of the air by the first intake unit 103 is controlled by the first intake pressure control unit 115 of the control unit 105. In other words, the first intake pressure control unit 115 controls the adsorption pressure of the photoelectric conversion panel 21 on the adsorption surface 101a. Specifically, the first intake pressure control unit 115 adsorbs and holds the photoelectric conversion panel 21 on the adsorption surface 101a at 10 kPa. This is an adsorption pressure for not holding the photoelectric conversion panel 21 and surely adsorbing and holding the photoelectric conversion panel 21 in advance.

As shown in FIG. 5, the phosphor substrate holding portion 102 includes a box-shaped housing 121 which is integrally formed with the hinge 106 and has a top surface (a surface on which the Z side of the phosphor substrate 27 is placed) is opened; The screen 122 covers the top surface of the opening of the frame 121.

The screen 122 is a mesh-like sheet provided with a plurality of ventilable holes, and the phosphor substrate 27 is placed on the screen 122. The screen 122 has a hardness such that the phosphor substrate 27 can be placed in a substantially planar shape and placed on the phosphor substrate 27. Further, the screen 122 is formed of a soft material such that when the bonding roller 123 is pushed against the screen 122 from the inside of the housing 121, it can be protruded together with the mounted phosphor substrate 27 to The side of the photoelectric conversion panel holding portion 101 at the position of the closing position pushes the phosphor substrate 27 against the photoelectric conversion panel 21.

The internal space of the phosphor substrate holding portion 102 surrounded by the screen 122 and the frame 121 is connected to the second intake unit 104 via the intake port 102b provided in the housing 121. The second intake unit 104 is a vacuum pump or a pipe or a valve for connecting the vacuum pump to the intake port 102b. The second intake unit 104 inhales the air in the internal space of the phosphor substrate holding unit 102 from the air intake port 102b, and inhales the outside air from the plurality of holes of the screen 122, thereby causing the fire. The light substrate holding portion 102 is adsorbed and held The phosphor substrate 27 placed on the screen 122. Therefore, the surface exposed to the outside of the screen 122 is the adsorption surface 102a in which the phosphor substrate holding unit 102 adsorbs and holds the phosphor substrate 27.

Further, the intake pressure of the second intake unit 104 to the air is controlled by the second intake pressure control unit 116 of the control unit 105. In other words, the second intake pressure control unit 116 controls the adsorption pressure of the phosphor substrate 27 on the screen 122 (the adsorption surface 102a). Specifically, the second intake pressure control unit 116 adsorbs and holds the phosphor substrate 27 on the adsorption surface 102a at 3 kPa to 4 kPa. This is a suction pressure for reliably holding the phosphor substrate 27 in advance without damaging the phosphor substrate 27 so as not to move on the screen 122.

In the internal space of the phosphor substrate holding portion 102 formed by the frame 121 and the mesh 122, a bonding roller 123, a plurality of support plates 124, a camera 126, and the like are provided.

The bonding roller 123 is formed by coating a rubber portion 123b having a rubber hardness of 70 on a shaft portion 123a of a metal (for example, iron). The bonding roller 123 is at least longer than the phosphor substrate 27 in the Y direction. Further, the bonding roller 123 is supported by an air cylinder 131, and is movable in the vertical direction (Z direction) by moving the piston of the air cylinder 131 up and down. By pressing the bonding roller 123 by the air cylinder 131, the phosphor substrate 27 and the screen 122 are collectively pressed from vertically below (the negative side in the Z direction), and the phosphor substrate 27 is adhered by the adhesive layer 29. It is bonded to the photoelectric conversion panel 21.

The cylinder 131 that supports the bonding roller 123 is controlled by the bonding line pressure control unit 150 of the control device 105. In other words, the bonding line pressure control unit 150 controls the pressing force of the bonding roller 123 against the screen 122 and the phosphor substrate 27 placed on the screen 122 via the air cylinder 131. Since the bonding roller 123 linearly abuts on the screen 122 in the longitudinal direction (Y direction), the pressing force controlled by the bonding line pressure control unit 150 is the line pressure (bonding line pressure). Specifically, the bonding line pressure control unit 150 presses the screen 122 to the screen 122 by the bonding roller 123 at a line pressure of 20 N/cm or more and 35 N/cm or less. By adjusting the line pressure within the above range, it is difficult to mix bubbles between the phosphor substrate 27 and the photoelectric conversion panel 21.

In the present embodiment, the bonding line pressure control unit 150 controls the line pressure of the bonding roller 123 within a range of 20 N/cm or more and 35 N/cm or less, but is 23 N/cm or more and 32 N/cm. In the following range, air bubbles can be suppressed from entering. In particular, when it is in the range of 25 N/cm or more and 30 N/cm or less, the frequency of mixing bubbles can be further suppressed.

The cylinder 131 supporting the bonding roller 123 is disposed on the moving stage 133. The moving table 133 is movable along the guide rail 132, and the guide rail 132 is linearly arranged in the X direction perpendicular to the longitudinal direction of the bonding roller 123. Further, the mobile station 133 is fixed to a predetermined portion of the timing belt 134, and the timing belt 134 is hung on two timing pulleys 136 provided near both ends of the guide rail 132. Therefore, by moving the timing belt 136 to move the timing belt 134, the moving table 133 can be freely moved along the guide rail 132. That is, by controlling the timing pulley 136, the moving speed of the bonding roller 123 in the X direction can be controlled.

The moving speed of the bonding roller 123 in the X direction is substantially equivalent to the bonding speed of the phosphor substrate 27 and the photoelectric conversion panel 21. Therefore, the fitting speed control unit 151 controls the bonding speed of the phosphor substrate 27 and the photoelectric conversion panel 21 by controlling the rotational speed of the timing pulley 136. Specifically, the bonding speed control unit 151 bonds the phosphor substrate 27 to the photoelectric conversion panel 21 at a speed of 20 mm/s or more and 50 mm/s or less. By adjusting to the bonding speed within the above range, it is difficult for air bubbles to be mixed between the phosphor substrate 27 and the photoelectric conversion panel 21.

In the present embodiment, the bonding speed control unit 151 controls the bonding speed of the phosphor substrate 27 and the photoelectric conversion panel 21 to be in the range of 20 mm/s or more and 50 mm/s or less, but if it is at 20 mm/ In the range of s or more and 45 mm/s or less, the incorporation of air bubbles can be suppressed. In particular, when it is in the range of 20 mm/s or more and 40 mm/s or less, the frequency of mixing bubbles can be further suppressed.

The support plate 124 supports the phosphor substrate 27 from the vertical lower side of the screen 122 to hold the phosphor substrate 27 in parallel. A plurality of support bodies 124 are provided inside the phosphor substrate holding portion 102, and are supported by the respective cylinders 141, and are vertically movable in the vertical direction (Z direction) by the pistons of the respective cylinders 141. The support plate control unit 142 of the control device 105 controls the respective cylinders 141 to appropriately move the support plate to a retracted position vertically below (negative side in the Z direction) so as not to hinder the movement of the bonding roller 123 in the X direction.

When the photoelectric conversion panel holding portion 101 is rotated to the closed position, the camera 126 images the alignment mark 28 of the photoelectric conversion panel 21 and the end portion 20a of the phosphor layer 20 via the screen 122 and the support 25 . Further, since the cameras 126 are respectively provided at the portions where the alignment marks 28 are provided, a plurality of the cameras 126 are provided inside the phosphor substrate holding portion 102. An image taken by each camera 126 is displayed on the control device 105. On the monitor 143, the operator who manipulates the bonding apparatus 100 slides or rotates the phosphor substrate 27 on the screen 122 based on the image displayed on the monitor 143, thereby causing the phosphor substrate 27 to be made. The position is aligned with the photoelectric conversion panel 21. The accuracy required to align the position of the phosphor substrate 27 to the photoelectric conversion panel 21 is, for example, within ±0.25 mm.

Next, a flow in which the phosphor substrate 27 is bonded to the photoelectric conversion panel 21 by using the bonding apparatus 100 will be described. As shown in FIG. 6, first, the photoelectric conversion panel 21 is placed at a predetermined position of the photoelectric conversion panel holding portion 101 at the open position, and the first intake unit 103 is controlled to adsorb and hold the photoelectric conversion panel 21 to the adsorption surface. 101a (S10). On the other hand, the phosphor substrate 27 coated with the adhesive layer 29 is placed at a predetermined position on the screen 122 of the phosphor substrate holding portion 102, and the second intake portion 104 is controlled to be fluorescent. The body substrate 27 is adsorbed and held on the screen 122 (S11). In the above state, the photoelectric conversion panel holding portion 101 is rotated and moved to the closed position (S12), and the photoelectric conversion panel 21 is disposed in parallel with the vertical direction (the positive side in the Z direction) of the phosphor substrate 27 in parallel. Further, the monitor 143 confirms the image of the alignment mark 28 of the phosphor layer 20 and the alignment mark 28 of the photoelectric conversion panel 21, so that the end portion 20a of the phosphor layer 20 and the alignment mark 28 are mutually The positional relationship is such that the adsorption holding force of the phosphor substrate 27 is lowered by a predetermined accuracy, and the phosphor substrate 27 is slid or rotated on the screen 122 to position the phosphor substrate 27. It is aligned with the photoelectric conversion panel 21 (S13).

After the alignment is completed, the cylinder line 131 is controlled by the bonding line pressure control unit 150, and the bonding roller 123 is pushed up to the end by the end portion of the phosphor substrate 27. Straight upward (positive side in the Z direction), the phosphor substrate 27 is pressed against the photoelectric conversion panel 21 via the screen 122 (S14). At this time, the line pressure is adjusted to a range of 20 N/cm or more and 35 N/cm or less by the bonding line pressure control unit 150, which is a bonding roller 123 that presses the phosphor substrate 27 to photoelectric conversion. The line pressure of the panel 21. In the state where the line pressure is maintained, the bonding speed control unit 151 moves the bonding roller 123 to the end portion 20a of the phosphor layer 20 at a speed of 20 mm/s or more and 50 mm/s or less. So far (S15). By this, the phosphor substrate 27 is bonded to the photoelectric conversion panel 21 at a bonding speed of 20 N/cm or more and 35 N/cm or less and at a bonding speed of 20 mm/s or more and 50 mm/s or less.

Thereafter, the bonded body of the photoelectric conversion panel 21 and the phosphor substrate 27 is subjected to heat treatment for 4 hours in air at 50 ° C (S16). After the bonding of the photoelectric conversion panel 21 and the phosphor substrate 27 subjected to the heat treatment to the air bubbles by the bonding, the photoelectric conversion panel 21 is connected to the respective portions via the flexible printed circuit board 31 or the like and assembled. The frame 14 is completed by the X-ray image detecting device 10.

As described above, according to the present invention, the bonding apparatus 100 is used, and the phosphor substrate 27 is attached at a bonding speed of 20 N/cm or more and 35 N/cm or less at a bonding speed of 20 mm/s or more and 50 mm/s or less. The photoelectric conversion panel 21 is incorporated. Therefore, it is possible to prevent bubbles of a large diameter from being mixed between the photoelectric conversion panel 21 and the phosphor substrate 27, and it is possible to prevent dense small-diameter bubbles from being mixed between the photoelectric conversion panel 21 and the phosphor substrate 27.

As shown in FIG. 7, when the bonding substrate 123 is to be used, the phosphor substrate 27 is pressed. A portion that is pressed to the photoelectric conversion panel 21 is a bonding line 161, and a portion where the phosphor substrate 27 and the screen 122 which are located in front of the X direction of the movement of the bonding roller 123 are slightly curved is a curved portion. At 162, when the phosphor substrate 27 is bonded to the photoelectric conversion panel 21 within the range of the bonding line pressure and the bonding speed, it is less likely to cause deflection, deformation, distortion, and the like in the curved portion 162. As a result, it is difficult for all the large bubbles to be mixed between the photoelectric conversion panel 21 and the phosphor substrate 27.

Furthermore, the bonding line pressure and the bonding speed are determined experimentally. As is understood from Fig. 8, depending on the degree of balance between the bonding line pressure and the bonding speed, a large-diameter bubble or a small-diameter bubble group (small-diameter bubble group) is likely to be generated, but by the bonding The balance between the line pressure and the bonding speed is such that the large diameter bubble and the small diameter bubble group do not mix.

In addition, even when bubbles are mixed when the photoelectric conversion panel 21 and the phosphor substrate 27 are bonded together, the size of the bubbles to be mixed can be reduced by performing heat treatment. Thereby, the manufacturing yield of the X-ray image detecting apparatus 10 is improved.

Further, the thickness of the adhesive layer 29 is as thin as possible while maintaining the bonding of the photoelectric conversion panel 21 and the phosphor substrate 27. The purpose is to improve the detection sensitivity of the X-ray image. For example, in order to improve the detection sensitivity of the X-ray image while maintaining the bonding between the photoelectric conversion panel 21 and the phosphor substrate 27, the thickness of the adhesive layer 29 is preferably in the range of 10 μm or more and 30 μm or less.

Further, it is preferable that the adhesive layer 29 has an adhesive force to the stainless steel material of 8.0 N/25 mm or more and an adhesive force to polyethylene terephthalate of 7.2 N/25 mm or more. This is to make the photoelectric conversion panel 21 and the firefly at the thickness of the range The adhesion of the light-substrate substrate 27 to good bonding. The adhesion is measured by a measurement method according to the International Standardization Organization (ISO) 29862 (for example, a method specified in Japanese Industrial Standards (JIS) Z0237).

In addition, the rubber hardness of the rubber 123b which forms the outer periphery of the bonding roll 123 is 70, but the rubber hardness of the rubber 123b is preferably 50 or more and 80 or less. The reason for this is that if a hard rubber exceeding the above range is used, even if the bonding line pressure is within the above range, the phosphor substrate 27 is crushed at the bonding line 161, and the bending portion 162 is deflected. Deformation, distortion, etc., so that bubbles are easily mixed in. On the other hand, if a soft rubber lower than the above range is used, the rubber 123b itself is crushed, and it is difficult to achieve the set bonding line pressure, so that the bubbles are easily mixed. The rubber hardness can be measured using a durometer according to ISO 7619 (for the measurement method, for example, using the method specified in JIS K 7215).

Further, GOS particles are used as the phosphor particles, but as the phosphor particles, A ₂ O ₂ S:X can be used (wherein A is Y, La, Gd, Lu, and X is Eu) Particles represented by any of Tb and Pr). Further, as the phosphor particles 24b, particles containing cerium (Ce) or cerium (Sm) as a co-activator in A ₂ O ₂ S:X may be used.

Further, X-rays are used as the radiation, but radiation other than X-rays such as γ-rays or α-rays may be used as the radiation. Further, in the above-described embodiment, the present invention is described by taking an electronic cassette as a movable type radiographic image detecting apparatus as an example. However, the present invention can also be applied to a standing type or a lying type type of radiation. A line image detecting device, or a mammography device or the like.

Claims (10)

A method of manufacturing a radiation image detecting apparatus for manufacturing a radiation image detecting apparatus, comprising: a phosphor substrate, comprising: a support body; and a support body formed on the support body to convert radiation into visible light a phosphor layer; a photoelectric conversion panel that receives the visible light to detect a radiation image; and an adhesive layer disposed on a surface of the phosphor substrate on the side of the phosphor layer for use with the photoelectric In the method of manufacturing the radiation image detecting device, the bonding roller is pressed to a surface of the support body on the side of the phosphor layer with a line pressure of 20 N/cm or more and 35 N/cm or less. In a state of the surface on the opposite side, moving at a speed of 20 mm/s or more and 50 mm/s or less, the phosphor substrate is bonded to the photoelectric conversion panel via the adhesive layer, The bonding roller is formed by coating a shaft portion made of a metal with a rubber having a rubber hardness of more than 50 and 80 or less. The method of manufacturing a radiation image detecting apparatus according to claim 1, wherein the line pressure is 25 N/cm or more and 30 N/cm or less. The method of manufacturing a radiation image detecting apparatus according to the first aspect of the invention, wherein the speed of the bonding roller is 20 mm/s or more and 40 mm/s or less. The method of manufacturing a radiation image detecting apparatus according to any one of the preceding claims, wherein the phosphor layer is cerium activated sulfur cerium oxide dispersed in a binder, and is coated. Formed on the support. The method of manufacturing a radiation image detecting apparatus according to any one of the first to third aspect, wherein the bonding roller presses the phosphor substrate via a screen. The method of manufacturing a radiation image detecting apparatus according to any one of the preceding claims, wherein the photoelectric conversion panel is supported vertically on an upper side, and the phosphor substrate is supported vertically. In the lower state, the bonding roller pushes the phosphor substrate upright vertically from the vertical lower side and pushes it against the photoelectric conversion panel. The method for producing a radiation image detecting apparatus according to any one of the first to third aspect, wherein the rubber has a rubber hardness of 70 or more and 80 or less. The method of manufacturing a radiation image detecting apparatus according to any one of the first to third aspect, wherein the thickness of the adhesive layer is 10 μm or more and 30 μm or less. The method for producing a radiation image detecting apparatus according to any one of the preceding claims, wherein the adhesive layer has an adhesion to a stainless steel material of 8.0 N/25 mm or more, and is polyparaphenylene. The adhesion of ethylene glycol dicarboxylate is 7.2 N/25 mm or more. The method of manufacturing a radiation image detecting apparatus according to any one of the first to third aspect, wherein, after the photoelectric conversion panel and the phosphor substrate are bonded, at 50 ° C Heat treatment for 4 hours.