TWI666502B - Display panel - Google Patents

Abstract

The present invention provides a display panel including a substrate, a packaging ring, a display area circuit and a protective circuit ring. The packaging ring is disposed on the substrate; the display area circuit is disposed on the substrate and is located inside the packaging ring. The protective circuit ring is formed on the substrate and is located outside the packaging ring. The protective circuit ring includes a first metal ring body and a second metal ring body. The first metal ring body is disposed around the outer side of the packaging ring, and the second metal ring body is disposed around the outer side of the first metal ring body. The first metal ring body and the second metal ring body respectively have a plurality of first tips and second tips arranged in pairs.

Description

   Display panel   

The present invention relates to a display panel; specifically, the present invention relates to a display panel with an electrostatic protection design.

Flat and curved display devices have been widely used in various electronic devices, such as mobile phones, personal wearable devices, televisions, host computers for transportation, personal computers, digital cameras, handheld video games, and the like. However, with the continuous improvement of specifications such as resolution and narrow bezels, the more precise the circuits in the display device, the more resistant to external influences such as static electricity will be tested.

In an actual situation, an electronic device needs to pass an electrostatic discharge test (ESD Test) to ensure that the electronic device has sufficient electrostatic protection. The electrostatic discharge test includes contact discharge and air discharge. The space discharge simulates the contact of a finger to discharge the product in the insulation area of the product to test the static resistance of the product. When conducting a space discharge test, the static electricity entering the product side often attacks the signal traces and presents a poor electrostatic tolerance. This phenomenon is even more affected by the current mainstream narrow frame models. In other words, conventional electronic devices have poor static resistance and cannot effectively solve the electrostatic charge attack.

An object of the present invention is to provide a display panel with better electrostatic protection capabilities.

Another object of the present invention is to provide a display panel, which can reduce the chance of static electricity attacking the circuit in the visible area.

The display panel includes a substrate, a packaging ring, a display area circuit, and a protective circuit ring. The packaging ring is directly or indirectly arranged on the substrate; the area enclosed by it is the visible area of the display panel. The display area circuit is disposed on the substrate and is located in a visible area within the packaging ring. The protective circuit ring is formed on the substrate and is located outside the packaging ring. The protective circuit ring includes a first metal ring body and a second metal ring body. The first metal ring body is disposed around the outer side of the packaging ring, and the second metal ring body is disposed around the outer side of the first metal ring body. The first metal ring body has a plurality of first tips distributed along the packaging ring, and each protrudes toward a side opposite to the packaging ring. The second metal ring body has a plurality of second tips that are respectively opposite to the first tip. With this setting, when static electricity from the outside is transmitted to the display panel, it can be intercepted by the protective circuit ring, such as in A discharge phenomenon is caused between the paired first and second tips, which makes it difficult for static electricity to enter the packaging ring.

100‧‧‧ substrate

110‧‧‧Viewable area

200‧‧‧Drive circuit

300‧‧‧Packing ring

500‧‧‧display area circuit

700‧‧‧ protective circuit ring

710‧‧‧The first metal ring body

711‧‧‧The first tip

720‧‧‧Second metal ring body

721‧‧‧ second tip

723‧‧‧Reverse tip

730‧‧‧ Third metal ring body

731‧‧‧Third Tip

810‧‧‧ Insulation

830‧‧‧protective layer

900‧‧‧Semiconductor gasket

1 is a schematic diagram of an embodiment of a display panel; FIG. 2 is a partially enlarged diagram of the embodiment shown in FIG. 1; FIG. 3 is a partially enlarged diagram of another embodiment of a display panel; FIG. 4 is a sectional view of an embodiment of a protective circuit ring; FIG. 5A is a schematic diagram of an embodiment of electrostatic discharge generated by a protective circuit ring; FIG. 5B is a schematic diagram of another embodiment of electrostatic discharge generated by a protective circuit ring; FIG. 6A is a partially enlarged schematic diagram of another embodiment of a display panel; and FIG. 6B is another display The embodiment of the panel is a partially enlarged schematic diagram.

The present invention provides a display panel, which may be a non-spontaneous panel such as a liquid crystal display panel or an electrophoretic display panel, or a self-luminous display panel such as an organic light emitting diode display panel. The display panel is preferably applicable to display devices such as computer monitors, televisions, monitors, and automotive hosts. In addition, the display device can also be applied to other electronic devices, for example, as a display screen of a mobile phone, a digital camera, a handheld game instrument, and the like.

As shown in FIG. 1, the display panel includes a substrate 100, a package ring 300, a display area circuit 500, and a protection circuit ring 700. The substrate 100 is preferably translucent, and may be a glass substrate, a plastic substrate, a rigid or flexible substrate, or the like. The encapsulation ring 300 is directly or indirectly disposed on the substrate 100; the range surrounded by the encapsulation ring 300 is preferably the visible area 110 of the display panel; and the range outside the encapsulation ring 300 is preferably a non-display area. By providing the packaging ring 300, a closed space can be formed between the substrate 100 and an opposite substrate (not shown) to accommodate a display medium, such as a liquid crystal molecule or an organic light-emitting diode and other self-luminous materials.

In this embodiment, the visible area 110 is circular, so the packaging ring 300 is also distributed in a circular shape; however, in different embodiments, the shapes of the visible area 110 and the packaging ring 300 may be other shapes. The visible area 110 is The encapsulation ring 300 is rectangular and distributed in a rectangular ring shape. The packaging ring 300 is preferably formed of a glass material, such as a frit glass (Frit) packaging material. However, in different embodiments, the encapsulation ring 300 can also be formed by using other materials.

As shown in FIG. 1, the display area circuit 500 is formed on the substrate 100 and is located in the visible area 110 in the packaging ring 300 for controlling the above-mentioned display medium to cooperate with a backlight or to self-emit to display images. The display area circuit 500 may be a gate circuit, a scan line, a signal line, a source circuit, a drain circuit, or a combination thereof. In a preferred embodiment, the display area circuit 500 includes a gate circuit, a scan line, and the like formed in the same metal layer.

The protective circuit ring 700 is formed on the substrate 100 and is located outside the packaging ring 300. The protective circuit ring 700 may be a semi-closed or closed ring, and its shape preferably corresponds to the packaging ring 300. In this embodiment, since the packaging ring 300 has a ring shape, the protective circuit ring 700 is formed as an unclosed or closed ring with a larger radius than the packaging ring 300. Preferably, the protective circuit ring 700 and the display area circuit 500 are formed in the same metal layer. As shown in FIG. 1, the protective circuit ring 700 includes a first metal ring body 710 and a second metal ring body 720. The first metal ring body 710 is disposed around the outer side of the packaging ring 300, and the second metal ring body 720 is disposed around the outer side of the first metal ring body; in other words, the radius of the second metal ring body 720 is larger than that of the first metal ring body 710. The radius is large. As shown in FIG. 1, the first metal ring body 710 and the second metal ring body 720 are preferably connected to the driving circuit 200 of the display panel, and are preferably respectively connected to the source power voltage (Vss). -3.3V; in other words, the first metal ring body 710 and the second metal ring body 720 have the same potential. However, in different embodiments, the first metal ring body 710 and the second metal ring body 720 can also be connected to the ground voltage, respectively.

FIG. 2 is a partially enlarged view of the embodiment shown in FIG. 1. As shown in FIG. 2, the first metal ring body 710 has a plurality of first tips 711 distributed along the packaging ring 300, and each protrudes toward a side opposite to the packaging ring 300. Preferably, the first tips 711 are evenly distributed on the first metal ring body 710, for example, the first tips 711 may be distributed every 1 degree center angle. The second metal ring body 720 has a plurality of second tips 721 opposite to the first tip 711 respectively, so the second tips 721 are also distributed along the packaging ring 300. In this embodiment, since the first metal ring body 710 and the second metal ring body 720 have the same potential, the opposite first and second tips 711 and 721 also have the same potential. As shown in FIG. 2, the distance between the paired first tip 711 and the second tip 721 is preferably the minimum distance between the first metal ring body 710 and the second metal ring body 720, and the distance is preferably not more than 5 μm. With this arrangement, when static electricity from the outside is transmitted to the display panel, it can be intercepted by the protective circuit ring 700, for example, a discharge phenomenon is caused between the paired first tip 711 and the second tip 721, so that It is difficult for static electricity to enter the packaging ring 300.

3 and 4 show another embodiment of the ESD protection ring. In this embodiment, the display panel further includes a plurality of semiconductor pads 900. The semiconductor pad 900 is disposed between the first tip 711 and the second tip 721 in a corresponding group and the substrate 100. As shown in FIG. 3 and FIG. 4, it is preferred that a semiconductor pad 900 is first provided on the substrate 10, and then a first metal ring body 710 and a second metal ring body 720 are provided, so that the first tip 711 and the second tip 721 fall On the semiconductor pad 900. Preferably, as shown in FIG. 4, after the semiconductor pad 900 is set, an insulating layer 810 may be added thereon, and then a first metal ring body 710 and a second metal ring body 720 may be disposed on the insulating layer 810. In addition, the first metal ring body 710 and the second metal ring body 720 are preferably further provided with a protective layer 830 to reduce the possibility of the first metal ring body 710 and the second metal ring body 720 being damaged. The semiconductor pad 900 is preferably formed of a semiconductor doped material, such as boron-doped amorphous silicon or polycrystalline silicon, but is not limited thereto. In addition, the semiconductor pad 900 can preferably be set in the same layer process as the semiconductor layer in the circuit in the visible area to further reduce the process and cost.

With this arrangement, the protective circuit ring will have multiple discharge paths to discharge static electricity. As shown in FIG. 5A, static electricity can generate a horizontal discharge between the first tip 711 and the second tip 721 to prevent it from further attacking the circuit inside the packaging ring 300. As shown in FIG. 5B, static electricity may also generate a discharge perpendicular to the substrate 100 between the first tip 711 or the second tip 721 and the semiconductor pad 900 to further improve the protection effect of the protective circuit ring against static electricity.

According to the above embodiment, the transistor structure of the display area circuit in the visible area is preferably designed in the manner of a top gate, so that the gate line and the first metal ring body 710 and the second metal ring The body 720 can be disposed in the same metal layer process, and the semiconductor pad 900 is disposed on the same layer as the semiconductor layer in the visible area. However, in different embodiments, when the transistor structure of the display area circuit in the visible area is preferably designed using a bottom gate, the semiconductor pad 900 may be disposed on the first metal ring body 710 and The second metal ring body 720 is opposite to the other side of the substrate 100.

FIG. 6A illustrates another embodiment of a display panel. In this embodiment, the protective circuit ring 700 further includes a third metal ring body 730 disposed around the outer side of the second metal ring body 720, and is preferably also distributed in a ring shape. The third metal ring body 730 has a plurality of third tips 731 distributed along the packaging ring 300 and protrudes toward the packaging ring 300. As shown in FIG. 6A, the second metal ring body 720 includes a plurality of reverse tips 723 respectively disposed between two adjacent second tips 721 and protruding in a direction opposite to the second tips 721, that is, facing The third metal ring body 730 protrudes. Specifically, the second tips 721 and the reverse tips 723 are distributed on the inner edge and the outer edge of the second metal ring body 720, respectively, and are distributed in a spaced-apart direction. As shown in FIG. 6A, the third tip 731 and the reverse tip 723 are respectively oppositely arranged, that is, the tips are arranged in pairs with the tips. With this setting, the coverage of the protective circuit ring 700 can be further increased, thereby enhancing the protection effect. In addition, since the third tip and the reverse tip 723 provided in pairs provide more electrostatic discharge paths, it will be easier to block static electricity out of the package ring 300.

FIG. 6B shows another embodiment of the electrostatic protection ring. In this embodiment, the display panel further includes a plurality of semiconductor pads 900. The semiconductor pad 900 is disposed between the corresponding group of the first tip 711 and the second tip 721 and the substrate 100, and the corresponding group of the third tip 731 and the reverse tip 723 and the substrate 100. Preferably, a semiconductor pad 900 may be provided on the substrate 10, and then a first metal ring body 710, a second metal ring body 720, and a third metal ring body 730 may be provided, so that the first tip 711 and the second tip 721, the third tip 731, and the reverse tip 723 fall on the semiconductor pad 900 in pairs according to the aforementioned combination. With this arrangement, in addition to discharging between the opposite tips, the protective circuit ring will have more discharge paths to discharge static electricity, such as the semiconductor pad 900 and the first tip 711, the second tip 721, the first Between three tips 731 or reverse tips 723.

The present invention has been described by the above related embodiments, but the above embodiments are merely examples for implementing the present invention. It must be noted that the disclosed embodiments do not limit the scope of the invention. On the contrary, modifications and equal settings included in the spirit and scope of the scope of patent application are all included in the scope of the present invention.

Claims (14)

A display panel includes: a substrate; a packaging ring disposed on the substrate; a display area circuit disposed on the substrate and located within the packaging ring; and a protective circuit ring disposed on the substrate Above, and located outside the packaging ring; the protective circuit ring includes: a first metal ring body arranged around the outer side of the packaging ring, and having a plurality of first tips distributed along the packaging ring, and respectively facing opposite to the One side of the packaging ring protrudes; and a second metal ring body is provided around the outer side of the first metal ring body, and has a plurality of second tips corresponding to the first tips, respectively; Each semiconductor pad is disposed between a corresponding set of the first tip and the second tip and the substrate, and the resistance of the semiconductor pad is greater than the resistance of the first tip and the second tip forming material. . The display panel according to claim 1, wherein the second metal ring body has a plurality of reverse tips respectively disposed between two adjacent second tips and protruding in a direction opposite to the second tips; the The protective circuit ring includes a third metal ring body disposed around the outer side of the second metal ring body, and has a plurality of third tips disposed opposite to the opposite tips, respectively. The display panel according to claim 1, wherein the corresponding first tip and the second tip are equipotential. The display panel according to claim 3, further comprising a source power supply voltage (Vss), wherein the first metal ring body and the second metal ring body are respectively connected to the source power supply voltage. The display panel according to claim 3, further comprising a ground voltage, wherein the first metal ring body and the second metal ring body are respectively connected to the ground voltage. The display panel according to claim 1, wherein the packaging ring is formed of a glass dielectric material. The display panel according to claim 1, wherein the packaging ring and the protection circuit ring are both distributed in a circular shape. A display panel includes: a substrate; a metal layer disposed on the substrate; a packaging ring disposed on the metal layer; wherein the metal layer includes: a display area circuit located within the packaging ring; And a protective circuit ring surrounding the packaging ring, wherein the protective circuit ring includes a first metal ring body disposed around the outer side of the packaging ring and having a plurality of first tips distributed along the packaging ring, and Projecting toward one side opposite to the packaging ring respectively; and a second metal ring body disposed around the outer side of the first metal ring body and having a plurality of second tips disposed opposite to the first tips, respectively; and A semiconductor layer is disposed between the substrate and the metal layer. The semiconductor layer includes a plurality of semiconductor pads, and each of the semiconductor pads is disposed at a corresponding set of the first tip and the second tip and the substrate. And the resistance of the semiconductor pad is greater than the resistance of the first tip and the second tip forming material. The display panel according to claim 8, wherein the second metal ring body has a plurality of reverse tips disposed between adjacent two of the second tips and protruding in a direction opposite to the second tip; the The protective circuit ring includes a third metal ring body disposed around the outer side of the second metal ring body, and has a plurality of third tips disposed opposite to the opposite tips, respectively. The display panel according to claim 8, wherein the corresponding first tip and the second tip are equipotential. The display panel according to claim 10, further comprising a source power voltage (Vss), wherein the first metal ring body and the second metal ring body are respectively connected to the source power voltage. The display panel according to claim 10, further comprising a ground voltage, wherein the first metal ring body and the second metal ring body are respectively connected to the ground voltage. The display panel according to claim 8, wherein the packaging ring is formed of a glass dielectric material. The display panel according to claim 8, wherein the packaging ring and the protective circuit ring are both distributed in a circular shape.