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TWI653155B - Microcontact printing method with high relief stamps in a roll-to-roll process and system using the same - Google Patents

Microcontact printing method with high relief stamps in a roll-to-roll process and system using the same Download PDF

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Publication number
TWI653155B
TWI653155B TW102149132A TW102149132A TWI653155B TW I653155 B TWI653155 B TW I653155B TW 102149132 A TW102149132 A TW 102149132A TW 102149132 A TW102149132 A TW 102149132A TW I653155 B TWI653155 B TW I653155B
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Taiwan
Prior art keywords
web
stamp
roll
pattern elements
embossed
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TW102149132A
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Chinese (zh)
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TW201501952A (en
Inventor
米克漢爾 里歐尼多維奇 皮庫羅維斯奇
呂蜜拉 安娜托維納 皮庫羅維斯奇
馬修 亨利 佛雷
丹尼爾 菲力普 曼和
強納森 詹姆士 歐漢爾
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3M新設資產公司
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Publication of TWI653155B publication Critical patent/TWI653155B/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41KSTAMPS; STAMPING OR NUMBERING APPARATUS OR DEVICES
    • B41K3/00Apparatus for stamping articles having integral means for supporting the articles to be stamped
    • B41K3/54Inking devices
    • B41K3/60Inking devices using rollers, e.g. rollers with integral ink-supply devices
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F5/00Rotary letterpress machines
    • B41F5/24Rotary letterpress machines for flexographic printing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00Printing processes to produce particular kinds of printed work, e.g. patterns
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00Manufacture or treatment of nanostructures
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061Etching masks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00Inking and printing with a printer's forme
    • B41M1/02Letterpress printing, e.g. book printing
    • B41M1/04Flexographic printing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Printing Methods (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

本發明提供一種方法,該方法包括:自支撐物上退繞幅材及提供彈性體印章,其中該印章包括底部表面及遠離該底部表面延伸之圖案元件排列,且其中各圖案元件具有橫向尺寸小於約5微米之壓印表面及相對於該底部表面之高度,且其中該高度與該橫向尺寸之縱橫比為至少1.5。用包括官能化分子之油墨組合物將該等圖案元件之壓印表面上墨,其中該官能化分子包括經選擇以結合於該基板材料之官能基。使該等圖案元件之壓印表面與該幅材之主表面接觸,持續足以使該官能基與該幅材結合以便在該幅材之該主表面上形成該官能化材料之自組裝單層(SAM)的印刷時間,該自組裝單層對應於該壓印表面上之該圖案元件排列。 The present invention provides a method comprising: unwinding a web from a support and providing an elastomeric stamp, wherein the stamp comprises a bottom surface and a pattern element arrangement extending away from the bottom surface, and wherein each pattern element has a lateral dimension less than An embossed surface of about 5 microns and a height relative to the bottom surface, and wherein the aspect ratio of the height to the lateral dimension is at least 1.5. The embossed surfaces of the patterned elements are inked with an ink composition comprising functionalized molecules, wherein the functionalized molecules comprise functional groups selected to bind to the substrate material. Contacting the embossed surface of the pattern elements with the major surface of the web for a sufficient amount to bond the functional group to the web to form a self-assembled monolayer of the functionalized material on the major surface of the web ( The printing time of the SAM) corresponds to the arrangement of the pattern elements on the embossed surface.

Description

卷對卷製程中具有高浮雕印章之微接觸印刷方法及使用彼之系統 Microcontact printing method with high relief stamp in roll-to-roll process and system using same

本發明係關於一種印刷方法,尤其是利用具有高縱橫比印刷特徵之微接觸印章的卷對卷微接觸印刷方法,及使用彼之系統。 This invention relates to a printing method, and more particularly to a roll-to-roll microcontact printing method using a microcontact stamp having high aspect ratio printing features, and a system using the same.

微接觸印刷為可用於例如在基板表面上產生官能化分子之圖案的印刷技術。該等官能化分子包括經由化學鍵連接於基板表面或經塗佈基板表面以形成圖案化自組裝單層(SAM)的官能基。該SAM為由化學鍵連接於表面並且相對於該表面且甚至相對於彼此採用較佳取向的分子的單層。 Microcontact printing is a printing technique that can be used, for example, to create a pattern of functionalized molecules on the surface of a substrate. The functionalized molecules include functional groups that are attached to the surface of the substrate or to the surface of the coated substrate via chemical bonds to form a patterned self-assembled monolayer (SAM). The SAM is a single layer of molecules that are chemically bonded to the surface and that are preferably oriented relative to the surface and even relative to each other.

用於微接觸印刷SAM的基本方法涉及將含有該等官能化分子之油墨塗覆於浮雕圖案化彈性體印章(例如聚(二甲基矽氧烷)(PDMS)印章),且隨後使經上墨之印章與基板表面(通常為金屬或金屬氧化物表面)接觸,以便在該印章與該基板之間的接觸區域中形成SAM。或者,該彈性體印章可為平坦的(不含浮雕圖案)且該基板表面可經浮雕圖案化。使用微接觸印刷法印刷之微圖案化有機及無機材料可能向基板(諸如金屬化聚合物膜)提供獨特電學、光學及/或生物學性質。 A basic method for microcontact printing of SAM involves applying an ink containing the functionalized molecules to an embossed patterned elastomeric seal (eg, a poly(dimethyl methoxide) (PDMS) stamp) and subsequently The ink stamp contacts the substrate surface (typically a metal or metal oxide surface) to form a SAM in the contact area between the stamp and the substrate. Alternatively, the elastomeric stamp can be flat (without embossed pattern) and the substrate surface can be embossed. Micropatterned organic and inorganic materials printed using microcontact printing may provide unique electrical, optical, and/or biological properties to substrates such as metallized polymeric films.

在製造製程中,該等官能化分子應在具有最小數目之缺陷的情況下以所要高解析度圖案化SAM形式自該印章可再現地轉移至該基板表面。在增加卷對卷製造製程中移動材料幅上之微接觸印刷速度時,應將圖案缺陷(諸如線模糊化及空隙)減至最少以確保準確SAM圖案解析及可再現性。 In a manufacturing process, the functionalized molecules should be reproducibly transferred from the stamp to the surface of the substrate in the form of the desired high resolution patterned SAM with a minimum number of defects. Pattern defects such as line blurring and voids should be minimized to ensure accurate SAM pattern resolution and reproducibility when increasing the microcontact printing speed on the moving material web in the roll-to-roll manufacturing process.

一般而言,本發明係針對利用具有高縱橫比印刷特徵之微接觸印章的卷對卷微接觸印刷方法。在此等卷對卷製造製程中,高縱橫比印章藉由減少製程相關之線加寬來改良基板上之印刷SAM圖案的保真度。高縱橫比印章允許在較高線速度下印刷而不會造成與空氣夾雜相關之SAM缺陷,並且減輕印刷SAM中之粒子相關之缺陷。 In general, the present invention is directed to a roll-to-roll microcontact printing method that utilizes a microcontact stamp having high aspect ratio printing features. In such a roll-to-roll manufacturing process, the high aspect ratio seal improves the fidelity of the printed SAM pattern on the substrate by reducing process-dependent line broadening. High aspect ratio stamps allow printing at higher line speeds without causing SAM defects associated with air inclusions and alleviating particle related defects in printed SAM.

在一個實施例中,本發明係針對一種方法,其包括自支撐物上退繞幅材及提供彈性體印章,其中該印章包括底部表面及遠離該底部表面延伸之圖案元件排列,其中各圖案元件具有橫向尺寸小於約5微米之壓印表面及相對於該底部表面之高度,且其中該高度與該橫向尺寸之縱橫比為至少1.5。用包括官能化分子之油墨組合物將該等圖案元件之壓印表面上墨,其中該官能化分子包括經選擇以結合於該基板材料之官能基。使該等圖案元件之壓印表面與該幅材之主表面接觸,持續足以使該官能基與該幅材結合以便在該幅材之該主表面上形成該官能化材料之自組裝單層(SAM)的印刷時間,該自組裝單層對應於該壓印表面上之該圖案元件排列。 In one embodiment, the present invention is directed to a method comprising unwinding a web from a support and providing an elastomeric stamp, wherein the stamp comprises a bottom surface and a pattern element arrangement extending away from the bottom surface, wherein each pattern element An embossed surface having a transverse dimension of less than about 5 microns and a height relative to the bottom surface, and wherein the aspect ratio of the height to the lateral dimension is at least 1.5. The embossed surfaces of the patterned elements are inked with an ink composition comprising functionalized molecules, wherein the functionalized molecules comprise functional groups selected to bind to the substrate material. Contacting the embossed surface of the pattern elements with the major surface of the web for a sufficient amount to bond the functional group to the web to form a self-assembled monolayer of the functionalized material on the major surface of the web ( The printing time of the SAM) corresponds to the arrangement of the pattern elements on the embossed surface.

在另一實施例中,本發明係針對一種方法,其包括:在第一輥與第二輥之間用至少約0.1磅/直線吋之張力拉伸幅材,其中該幅材以大於約10呎/分鐘之速度移動;將彈性體聚合物印章安裝在印刷輥上,其中該印章包括底部表面及具有梯形橫截面形狀且在該底部表面以上延伸之圖案元件排列,其中該等圖案元件各自包括實質上平坦之橫向尺寸為約0.25微米至約5微米之壓印表面及相對於該底部表面之高度,且其中該高度與該橫向尺寸之縱橫比為約1.5至約5.0;用包括有機硫化合物之油墨組合物將該壓印表面上墨;使該壓印表面與介於該第一輥與該第二輥之間的該幅材之主表面接觸約0.1秒至約30秒之印刷時間,以使得該有機硫化合物上之官能基結合於該幅材之該主表面,以便在該主表面上提供該有機硫化合物之自組裝單層(SAM),該 自組裝單層對應於該壓印表面上之圖案元件之陣列;及自該幅材之該主表面上移除該壓印表面。 In another embodiment, the present invention is directed to a method comprising: stretching a web between a first roll and a second roll with a tension of at least about 0.1 pounds per linear nip, wherein the web is greater than about 10 Moving at a speed of 呎/min; mounting an elastomeric polymer stamp on a printing roll, wherein the stamp comprises a bottom surface and a pattern element arrangement having a trapezoidal cross-sectional shape and extending above the bottom surface, wherein the pattern elements each comprise a substantially flat transverse dimension of from about 0.25 microns to about 5 microns and an elevation relative to the bottom surface, and wherein the aspect ratio of the height to the transverse dimension is from about 1.5 to about 5.0; including organic sulfur compounds The ink composition inks the embossed surface; contacting the embossed surface with a major surface of the web between the first roll and the second roll for a printing time of from about 0.1 second to about 30 seconds, So that a functional group on the organosulfur compound is bonded to the major surface of the web to provide a self-assembled monolayer (SAM) of the organosulfur compound on the major surface, A self-assembled monolayer corresponds to an array of pattern elements on the embossed surface; and the embossed surface is removed from the major surface of the web.

在另一實施例中,本發明係針對一種方法,其包括:自支撐輥上退繞幅材,其中該幅材以大於約10呎/分鐘之速度移動;將聚(二甲基矽氧烷)印章安裝在印刷輥上,其中該印章包括實質上平坦之底部表面及具有梯形橫截面形狀且在該底部表面以上延伸之圖案元件的連續規則陣列,其中該等圖案元件各自具有實質上平坦之橫向尺寸為約0.25微米至約5微米之壓印表面及相對於該底部表面之高度,且其中該高度與該橫向尺寸之縱橫比為約1.5至約5.0;用包括有機硫化合物及有機溶劑之油墨組合物將該壓印表面上墨;使該壓印表面與該幅材之主表面接觸約0.1秒至約30秒之印刷時間,以使得該有機硫化合物上之硫醇官能基結合於該幅材之該主表面,以便在該主表面上提供該有機硫化合物之自組裝單層(SAM),該自組裝單層對應於該壓印表面上之圖案元件之陣列。與由包括具有梯形橫截面形狀及小於約1.5之縱橫比的圖案元件的聚(二甲基矽氧烷)印章產生的SAM相比,該SAM包括以下各項中之至少一者之經降低之發生率:(1)重複缺陷;及(2)空氣夾雜缺陷。隨後自該幅材之該主表面移除該壓印表面。 In another embodiment, the present invention is directed to a method comprising: unwinding a web from a self-supporting roll, wherein the web moves at a speed greater than about 10 Torr/min; and poly(dimethyl methoxy oxane) a stamp mounted on the printing roll, wherein the stamp comprises a substantially flat bottom surface and a continuous regular array of pattern elements having a trapezoidal cross-sectional shape and extending above the bottom surface, wherein the pattern elements each have a substantially flat shape An embossed surface having a transverse dimension of from about 0.25 microns to about 5 microns and a height relative to the bottom surface, and wherein the aspect ratio of the height to the transverse dimension is from about 1.5 to about 5.0; comprising an organic sulfur compound and an organic solvent The ink composition is inked onto the embossed surface; the embossed surface is contacted with the major surface of the web for a printing time of from about 0.1 second to about 30 seconds such that the thiol functional group on the organosulfur compound is incorporated The major surface of the web provides a self-assembled monolayer (SAM) of the organosulfur compound on the major surface, the self-assembled monolayer corresponding to an array of patterned elements on the embossed surface. The SAM includes a reduced one of at least one of the following, as compared to a SAM produced by a poly(dimethyloxane) seal comprising a pattern element having a trapezoidal cross-sectional shape and an aspect ratio of less than about 1.5 Incidence: (1) repeated defects; and (2) air inclusion defects. The embossed surface is then removed from the major surface of the web.

在另一實施例中,本發明係針對一種系統,其包括第一輥及第二輥,以及在該第一輥與該第二輥之間拉伸的移動材料幅。將彈性體印章安裝在輥上且與介於該第一輥與該第二輥之間的該幅材接觸,其中該印章包括底部表面及具有梯形橫截面形狀且在該底部表面以上延伸之圖案元件排列,其中該等圖案元件各自包括實質上平坦之橫向尺寸為約0.25微米至約5微米之壓印表面及相對於該底部表面之高度,且其中該高度與該橫向尺寸之縱橫比為約1.5至約5.0。該系統進一步包括設備,該設備係用於利用具有經選擇以結合該幅材之主表面之硫醇官能基的有機硫化合物將該壓印表面上墨,以便在該主表面上形成 自組裝單層(SAM),該自組裝單層對應於該壓印表面上之圖案元件之陣列。 In another embodiment, the invention is directed to a system comprising a first roll and a second roll, and a web of moving material stretched between the first roll and the second roll. An elastomeric stamp is mounted on the roll and in contact with the web between the first roll and the second roll, wherein the stamp comprises a bottom surface and a pattern having a trapezoidal cross-sectional shape and extending above the bottom surface An arrangement of elements, wherein each of the pattern elements comprises a substantially flat embossed surface having a lateral dimension of from about 0.25 microns to about 5 microns and a height relative to the bottom surface, and wherein the aspect ratio of the height to the lateral dimension is about 1.5 to about 5.0. The system further includes apparatus for inking the embossed surface with an organosulfur compound having a thiol functional group selected to bind to a major surface of the web to form on the major surface Self-assembled monolayer (SAM), the self-assembled monolayer corresponding to an array of patterned elements on the embossed surface.

所附圖式及以下描述中闡述本發明之一或多個實施例的細節。本發明之其他特徵、目標及優勢將由描述及圖式以及申請專利範圍中顯而易見。 The details of one or more embodiments of the invention are set forth in the description Other features, objects, and advantages of the invention will be apparent from the description and drawings.

10‧‧‧微接觸印刷印章/印章 10‧‧‧Microcontact printing seal/seal

11‧‧‧強化背襯層/印章支撐物 11‧‧‧Enhanced backing/seal support

12‧‧‧底部表面/平坦表面 12‧‧‧Bottom surface/flat surface

14‧‧‧圖案元件/彈性體圖案元件/小圖案元件/微圖案圖案元件/壓印元件/印章元件 14‧‧‧Pattern Components / Elastomer Pattern Components / Small Pattern Components / Micro Pattern Pattern Components / Imprint Components / Stamp Components

16‧‧‧壓印表面/印刷表面 16‧‧‧imprinted surface/printed surface

18‧‧‧通道 18‧‧‧ channel

20‧‧‧油墨/油墨溶液 20‧‧‧Ink/ink solution

21‧‧‧污化油墨圖案 21‧‧‧Stained ink pattern

22‧‧‧表面材料/材料/基板材料/無機材料塗層/金屬表面/金 屬塗層 22‧‧‧Surface Materials/Materials/Substrate Materials/Inorganic Coatings/Metal Surfaces/Gold Coating

24‧‧‧支撐層/物理支撐層/矽晶圓基板/聚合物膜/玻璃/矽晶圓 24‧‧‧Support layer/physical support layer/矽wafer substrate/polymer film/glass/矽 wafer

25‧‧‧材料表面之第一部分 25‧‧‧The first part of the surface of the material

26‧‧‧材料表面/表面/基板表面 26‧‧‧Material Surface/Surface/Substrate Surface

27‧‧‧與材料表面之第一部分連續之部分 27‧‧‧Continuous part of the first part of the surface of the material

30‧‧‧自組裝單層/SAM 30‧‧‧Self-assembled single layer / SAM

35‧‧‧基板 35‧‧‧Substrate

100‧‧‧微接觸印刷製程線/製程線 100‧‧‧Microcontact printing process line/process line

102‧‧‧幅材/基板 102‧‧‧Web/Substrate

104‧‧‧第一支撐物 104‧‧‧First support

106‧‧‧彈性體印章/印章 106‧‧‧ Elastomeric seal/seal

107‧‧‧圖案化表面/上墨表面 107‧‧‧patterned surface/inking surface

108‧‧‧印刷輥 108‧‧‧Printing roller

110‧‧‧第二夾輥 110‧‧‧Second nip rollers

111‧‧‧彈性體層 111‧‧‧ Elastomeric layer

120‧‧‧幅材表面/基板表面/表面/第二浮雕圖案之表面 120‧‧‧Surface surface/substrate surface/surface/second embossed surface

200‧‧‧微接觸印刷製程線/製程線 200‧‧‧Microcontact printing process line/process line

202‧‧‧幅材 202‧‧‧Web

204‧‧‧第一拉伸輥/輥 204‧‧‧First Stretch Roller/Roller

206‧‧‧彈性體印章/印章 206‧‧‧ Elastomeric seal/seal

208‧‧‧印刷輥 208‧‧‧Printing roller

210‧‧‧第二拉伸輥/輥 210‧‧‧Second stretching roller/roller

211‧‧‧彈性體層 211‧‧‧ Elastomeric layer

300‧‧‧微接觸印刷製程線/製程線 300‧‧‧Microcontact printing process line/process line

302‧‧‧幅材 302‧‧‧Web

304‧‧‧單一夾輥 304‧‧‧Single nip roller

306‧‧‧彈性體印章/印章 306‧‧‧ Elastomeric seal/seal

308‧‧‧印刷輥 308‧‧‧Printing roller

311‧‧‧彈性體層 311‧‧‧ Elastomeric layer

400‧‧‧微接觸印刷製程線/製程線 400‧‧‧Microcontact printing process line/process line

402‧‧‧幅材 402‧‧‧Web

404‧‧‧夾輥 404‧‧‧ pinch roller

406‧‧‧彈性體印章/印章 406‧‧‧ Elastomeric seal/seal

408‧‧‧印刷輥 408‧‧‧Printing roller

410‧‧‧拉伸輥 410‧‧‧ stretching rolls

411‧‧‧彈性體層 411‧‧‧ Elastomeric layer

506‧‧‧印章 506‧‧‧ Seal

508‧‧‧印刷輥/輥 508‧‧‧Printing roller/roller

509‧‧‧流體聯結器 509‧‧‧Fluid coupling

509A‧‧‧中空內部區域 509A‧‧‧ hollow interior area

511‧‧‧彈性體層 511‧‧‧ Elastomeric layer

結合所附圖式考慮本發明之各種實施例之以下詳細描述可更完整地理解本發明,其中一般熟習此項技術者應理解,該等圖式僅說明某些例示性實施例,而不欲限制本發明之更廣泛態樣。 The invention will be more fully understood from the following detailed description of the embodiments of the invention. Limiting the broader aspects of the invention.

圖1為用於微接觸印刷之高縱橫比印章之一個實施例的示意性橫截面圖。 1 is a schematic cross-sectional view of one embodiment of a high aspect ratio seal for microcontact printing.

圖2為用於微接觸印刷之高縱橫比印章之另一實施例的示意性橫截面圖。 2 is a schematic cross-sectional view of another embodiment of a high aspect ratio seal for microcontact printing.

圖3為在微接觸印刷製程中使用高縱橫比印章在基板上形成自組裝單層(SAM)的製程的示意性橫截面圖。 3 is a schematic cross-sectional view of a process for forming a self-assembled monolayer (SAM) on a substrate using a high aspect ratio stamp in a microcontact printing process.

圖4A及4B為基板相對於印章運動之製程中所利用之用於微接觸印刷之印章的示意性橫截面圖。 4A and 4B are schematic cross-sectional views of a stamp for microcontact printing utilized in a process for moving a substrate relative to a stamp.

圖5為卷對卷製程中之微接觸印刷中所使用之具有雙夾輥及延伸製程區之設備之一部分的示意性視圖。 Figure 5 is a schematic illustration of a portion of an apparatus having dual nip rolls and an extended process zone for use in microcontact printing in a roll-to-roll process.

圖6為卷對卷製程中之微接觸印刷中所使用之具有雙輥之拉伸幅材設備之一部分的示意性視圖。 Figure 6 is a schematic illustration of a portion of a stretch web apparatus having twin rolls used in microcontact printing in a roll-to-roll process.

圖7為卷對卷製程中之微接觸印刷中所使用之具有單夾輥之設備之一部分的示意性視圖。 Figure 7 is a schematic illustration of a portion of a device having a single nip roll used in microcontact printing in a roll-to-roll process.

圖8為卷對卷製程中之微接觸印刷中所使用之具有單夾輥及延伸製程區之設備之一部分的示意性視圖。 Figure 8 is a schematic illustration of a portion of an apparatus having a single nip roll and an extended process zone for use in microcontact printing in a roll-to-roll process.

圖9為微接觸印刷設備中之印刷輥及印章之流體聯結器之示意性 橫截面圖。 Figure 9 is a schematic illustration of a printing roller and a fluid coupling of a stamp in a microcontact printing apparatus Cross-sectional view.

圖10為實例2中所利用之微接觸印刷印章之模製表面之示意圖。 Figure 10 is a schematic illustration of the molded surface of the microcontact printing stamp utilized in Example 2.

圖11為實例2之模製微接觸印刷印章之每吋印章寬度之力相對於基板位移的圖。 Figure 11 is a graph of the force of each stamp width of the molded microcontact printing stamp of Example 2 versus the substrate displacement.

儘管以上鑑別之未必按比例繪製之圖式闡述本發明之各種實施例,但亦涵蓋如【實施方式】中所述之其他實施例。圖中之相同符號指示相同元件。 While the above-described embodiments are not necessarily to scale, the various embodiments of the invention are described, The same symbols in the figures indicate the same elements.

除非另外說明,否則說明書及申請專利範圍中所使用之表述特徵大小、量及物理性質的所有數字均應理解為在所有情形下由術語「約」修飾。因此,除非有相反指示,否則前述說明書及所附申請專利範圍中所陳述之數值參數為可視由熟習此項技術者利用本文中所揭示之教示設法獲得之所要性質而變化的近似值。絲毫不打算限制均等論對於所主張實施例之範疇的應用,各數值參數至少應根據所報導之有效數位的數目且藉由應用一般捨入技術來解釋。另外,使用具有端點之數值範圍包括該範圍內之所有數字(例如,1至5包括1、1.5、2、2.75、3、3.80、4及5)及該範圍內之任何較窄範圍或單一值。 All numbers expressing the size, quantity, and physical properties of the features used in the specification and claims are to be understood as being modified by the term "about" in all instances. Accordingly, the numerical parameters set forth in the foregoing specification and the appended claims are intended to be an approximation that can be varied by the skilled person in the <RTIgt; In no way is meant to limit the application of the theory of equalization to the scope of the claimed embodiments, the numerical parameters being interpreted at least in accordance with the number of significant digits reported and by applying the general rounding technique. In addition, use of a range of values with endpoints includes all numbers within the range (eg, 1 to 5 includes 1, 1.5, 2, 2.75, 3, 3.80, 4, and 5) and any narrower range or single within the range value.

詞彙表:Glossary:

在描述及申請專利範圍中使用的某些術語儘管大部分為熟知的,但可能需要一定說明。應瞭解,如本文所使用:術語「約(about)」、「大約(approximate)」或「大致(approximately)」在提及數值或幾何形狀時意謂該數值或具有通常認可之邊數之幾何形狀之鄰邊內角值的+/- 5%,明確包括該數值或角值+/- 5%內的任何較窄範圍以及準確數值或角值。舉例而言,「約」100℃之溫度係指95℃至105℃之溫度,但亦明確包括該範圍內之任何較窄溫度範圍或甚至單一溫度,包括例如恰好100℃之溫度。同樣, 「大致正方形」幾何形狀包括鄰邊內角為85-95度的所有四邊幾何形狀,因為90度鄰邊內角對應於完美正方形幾何形狀。 Certain terms used in the description and claims are mostly well known and may require some explanation. It should be understood that as used herein, the terms "about", "approximate", or "approximately" mean a value or a geometry having a generally recognized number of sides when referring to a numerical value or geometric shape. +/- 5% of the value of the inner edge of the shape, including any narrower range and exact value or angular value within the value or angle value +/- 5%. For example, "about" a temperature of 100 ° C means a temperature of from 95 ° C to 105 ° C, but also includes any narrower temperature range or even a single temperature within the range, including, for example, a temperature of exactly 100 ° C. same, The "roughly square" geometry includes all four-sided geometries with an inner corner of 85-95 degrees, since the 90-degree inner corner corresponds to a perfect square geometry.

術語「實質上」在提及性質或特性時意謂所展現之性質或特性在該性質或特性之98%以內,但亦明確包括在該性質或特性之2%以內的任何較窄範圍以及該性質或特性之準確值。舉例而言,「實質上」透明之基板係指傳輸98%至100%入射光之基板。 The term "substantially" when referring to a property or property means that the property or property exhibited is within 98% of the property or property, but also explicitly includes any narrower range within 2% of the property or property and The exact value of the property or characteristic. For example, a "substantially" transparent substrate refers to a substrate that transmits 98% to 100% of incident light.

除非上下文另外明確指出,否則術語「一(a/an)」及「該」包括複數指示物。因此,例如,提及含有「一種化合物」之材料包括兩種或兩種以上化合物之混合物。 Unless the context clearly dictates otherwise, the terms "a/an" and "the" include plural referents. Thus, for example, reference to a material containing "a compound" includes a mixture of two or more compounds.

除非上下文另外明確指出,否則術語「或」一般以其包括「及/或」之意義使用。 The term "or" is generally used in its meaning including "and/or" unless the context clearly dictates otherwise.

現將特定參考圖式來描述本發明之各種例示性實施例。可在不背離本發明之精神及範疇的情況下對本發明之例示性實施例進行各種修改及變更。因此,應理解本發明之實施例不限於以下所描述之例示性實施例,而是受申請專利範圍及其任何等效物中所闡述之限制控制。 Various illustrative embodiments of the invention are now described with reference to the specific drawings. Various modifications and changes may be made to the exemplary embodiments of the present invention without departing from the spirit and scope of the invention. Therefore, it is to be understood that the embodiments of the invention are not limited to the exemplified embodiments described below, but are limited by the scope of the claims and any equivalents thereof.

圖1展示微接觸印刷印章10之示意性說明,該微接觸印刷印章包括實質上平坦之底部表面12。圖案元件14之陣列遠離底部表面12而延伸。在一些實施例中,印章10為整體彈性體材料塊,而在其他實施例中可包括由視情況存在之強化背襯層11支撐的彈性體圖案元件14。印章10之底部表面12上之圖案元件14之陣列可視預定微接觸印刷應用而廣泛變化,且可包括例如規則或不規則元件圖案,諸如線、點及多邊形。 1 shows a schematic illustration of a microcontact printed stamp 10 that includes a substantially flat bottom surface 12. The array of pattern elements 14 extends away from the bottom surface 12. In some embodiments, the stamp 10 is a monolithic block of elastomeric material, while in other embodiments an elastomeric pattern element 14 supported by the reinforcing backing layer 11 as the case may be included. The array of pattern elements 14 on the bottom surface 12 of the stamp 10 can vary widely depending on the intended microcontact printing application, and can include, for example, regular or irregular element patterns such as lines, dots, and polygons.

底部表面12上之陣列中的圖案元件14可在其形狀、取向及大小方面加以描述。圖案元件14在底部表面12處具有底部寬度x,且包括壓印表面16。壓印表面16處於底部表面12以上之高度h處,且具有橫 向尺寸w,該橫向尺寸可與底部寬度x相同或不同。圖案元件14之縱橫比h/w為至少約1.5。在各種實施例中,圖案元件14之高度h與圖案元件14之壓印表面16之寬度w的縱橫比為約1.5至約5.0、約1.5至約3.0或約1.5至約2.0。 The pattern elements 14 in the array on the bottom surface 12 can be described in terms of their shape, orientation and size. The pattern element 14 has a bottom width x at the bottom surface 12 and includes an embossed surface 16. The embossed surface 16 is at a height h above the bottom surface 12 and has a lateral dimension w which may be the same or different than the bottom width x . The aspect ratio h / w of the pattern element 14 is at least about 1.5. In various embodiments, the aspect ratio of the height h of the pattern element 14 to the width w of the stamping surface 16 of the pattern element 14 is from about 1.5 to about 5.0, from about 1.5 to about 3.0, or from about 1.5 to about 2.0.

本文所述之方法及設備尤其有利於具有最小橫向尺寸w小於約10μm或小於約5μm或小於約1μm之壓印表面16的小圖案元件14。在圖1中所示之實施例中,壓印表面16為實質上平坦的且實質上平行於底部表面12,但不需要此種平行排列。本文中所報導之方法及設備亦尤其有利於利用高度h為約50μm或50μm以下、或約10μm或10μm以下、或約5μm或5μm以下、或約1μm或1μm以下或約0.25μm或0.25μm以下之圖案元件14進行微接觸印刷。 The methods and apparatus described herein are particularly advantageous for small pattern elements 14 having an embossed surface 16 having a minimum lateral dimension w of less than about 10 μm or less than about 5 μm or less than about 1 μm. In the embodiment shown in Figure 1, the embossed surface 16 is substantially flat and substantially parallel to the bottom surface 12, but such parallel alignment is not required. The methods and apparatus reported herein are also particularly advantageous for utilizing a height h of about 50 μm or less, or about 10 μm or less, or about 5 μm or less, or about 1 μm or less, or about 0.25 μm or less. The pattern element 14 is microcontact printed.

圖案元件14可佔據整個底部表面12或僅佔據一部分(底部表面12之一些區域可不含圖案元件)。舉例而言,在各種實施例中,相鄰圖案元件之間的間隔l可大於約50μm或大於約100μm或大於約200μm或大於約300μm或大於約400μm或甚至大於約500μm。用於微接觸印刷之圖案元件14之市面可用陣列在印章10之底部表面12上之覆蓋例如大於100cm2、大於200cm2或甚至大於1000cm2之區域。 The pattern element 14 can occupy the entire bottom surface 12 or occupy only a portion (some areas of the bottom surface 12 can be free of pattern elements). For example, in various embodiments, the spacing 1 between adjacent pattern elements can be greater than about 50 [mu]m or greater than about 100 [mu]m or greater than about 200 [mu]m or greater than about 300 [mu]m or greater than about 400 [mu]m or even greater than about 500 [mu]m. The commercially available array of pattern elements 14 for microcontact printing covers an area of the bottom surface 12 of the stamp 10, for example, greater than 100 cm 2 , greater than 200 cm 2 or even greater than 1000 cm 2 .

在一些實施例中,圖案元件14可形成「微圖案」,微圖案在本申請案中係指尺寸(例如線寬)不大於1mm之點、線、填充形狀或其組合之排列。在一些實施例中,點、線、填充形狀或其組合之排列之尺寸(例如線寬)為至少0.5μm且通常不大於20μm。微圖案圖案元件14之尺寸可視微圖案選擇而變化,且在一些實施例中,微圖案圖案元件之尺寸(例如線寬)小於10、9、8、7、6或5μm(例如0.5-5μm或0.75-4μm)。 In some embodiments, pattern element 14 may form a "micropattern," which in the present application refers to an arrangement of dots, lines, fill shapes, or combinations thereof, having a dimension (eg, line width) of no more than 1 mm. In some embodiments, the size (eg, line width) of the arrangement of dots, lines, fill shapes, or a combination thereof is at least 0.5 [mu]m and typically no greater than 20 [mu]m. The size of the micropattern pattern element 14 may vary depending on the micropattern selection, and in some embodiments, the size of the micropattern pattern element (eg, line width) is less than 10, 9, 8, 7, 6, or 5 [mu]m (eg, 0.5-5 [mu]m or 0.75-4 μm).

在一些實施例中,圖案元件為跡線,其可為筆直或彎曲的。在一些實施例中,圖案元件為跡線,其形成二維網(亦即,篩網)。篩網 包含界定開放單元之跡線。篩網可為例如方格、六邊形篩網或偽隨機篩網。偽隨機係指跡線排列缺乏平移對稱,但可來源於確定性製造製程(例如光微影或印刷),例如包括計算設計製程,該製程包括用隨機算法產生圖案幾何形狀。在一些實施例中,篩網具有介於90%與99.75%之間的開放區域分數(亦即,圖案元件之密度介於0.25%與10%之間)。在一些實施例中,篩網具有介於95%與99.5%之間的開放區域分數(亦即,圖案元件之密度介於0.5%與5%之間)。圖案元件可具有上述態樣之組合,例如其可為彎曲跡線,形成偽隨機篩網,具有介於0.5%與5%之間的密度,且具有介於0.5μm與5μm之間的寬度。 In some embodiments, the pattern elements are traces that can be straight or curved. In some embodiments, the pattern elements are traces that form a two-dimensional web (ie, a screen). Screen Contains traces that define open cells. The screen may be, for example, a checkered, hexagonal screen or pseudo-random screen. Pseudo-random means that the trace arrangement lacks translational symmetry, but may be derived from a deterministic manufacturing process (eg, photolithography or printing), including, for example, a computational design process that includes generating a pattern geometry using a random algorithm. In some embodiments, the screen has an open area fraction of between 90% and 99.75% (ie, the density of the pattern elements is between 0.25% and 10%). In some embodiments, the screen has an open area fraction of between 95% and 99.5% (ie, the density of the pattern elements is between 0.5% and 5%). The pattern elements can have a combination of the above, for example they can be curved traces, form a pseudo-random screen, have a density between 0.5% and 5%, and have a width between 0.5 μm and 5 μm.

在圖2中示意性地展示之印章10之一個實施例中,圖案元件14具有梯形橫截面形狀,該梯形橫截面形狀具有底部寬度r,底部表面12以上之高度h及垂直角θ。圖案元件14具有間距l及具有寬度w之壓印表面16。在圖2中所示之實施例中,壓印表面16沿實質上平行之線在印章10之底部表面12上延伸以形成方格狀排列。介於圖案元件14之線之間的區域因而形成通道18。許多不同的組態為可能的。舉例而言,在一些實施例中,壓印表面為由呈線形式之圖案元件所定義之六邊形,該等線定義類似二維篩網狀網之六邊形網(參見例如圖10)。圖2中所說明之實施例之圖案元件的縱橫比由h/w給出。 In one embodiment of the stamp 10 shown schematically in Figure 2, the pattern element 14 has a trapezoidal cross-sectional shape having a bottom width r , a height h above the bottom surface 12 and a vertical angle θ. The pattern element 14 has a spacing l and an embossed surface 16 having a width w . In the embodiment shown in FIG. 2, the embossed surface 16 extends along substantially parallel lines on the bottom surface 12 of the stamp 10 to form a checkered arrangement. The area between the lines of the pattern elements 14 thus forms a channel 18. Many different configurations are possible. For example, in some embodiments, the embossed surface is a hexagon defined by pattern elements in the form of lines that define a hexagonal mesh similar to a two-dimensional mesh network (see, eg, Figure 10). . The aspect ratio of the pattern elements of the embodiment illustrated in Figure 2 is given by h/w .

參考圖3,包括官能化分子之油墨20駐留在印章10之壓印表面16上。油墨20中之官能化分子包括經選擇以結合基板35之支撐層24上之所選表面材料22的官能基。定位印章10且使其與材料22之表面26接觸,且保持壓印表面16與材料22上之表面26之第一部分25相抵。保持油墨20中之官能化分子與表面26相抵以允許官能基與其結合(保持步驟未圖示於圖3中)。隨後,移除壓印表面16,且殘留於表面26上之油墨與該表面化學結合並且在表面26之部分25上形成自組裝單層(SAM)30,該自組裝單層對應於壓印表面16之形狀及尺寸。表面26之與第一 部分25連續之部分27保持不含SAM 30。 Referring to FIG. 3, ink 20 comprising functionalized molecules resides on stamping surface 16 of stamp 10. The functionalized molecules in ink 20 include functional groups selected to bind selected surface material 22 on support layer 24 of substrate 35. The stamp 10 is positioned and brought into contact with the surface 26 of the material 22, and the embossed surface 16 is held against the first portion 25 of the surface 26 on the material 22. The functionalized molecules in the ink 20 are maintained against the surface 26 to allow the functional groups to bind thereto (the retention step is not shown in Figure 3). Subsequently, the embossed surface 16 is removed and the ink remaining on the surface 26 chemically bonds to the surface and forms a self-assembled monolayer (SAM) 30 on the portion 25 of the surface 26, the self-assembled monolayer corresponding to the embossed surface 16 shape and size. Surface 26 and first Portion 25 of portion 25 remains free of SAM 30.

本文所述之方法、設備及印刷印章尤其有利於用於在卷對卷製程中在可撓性基板上印刷。可撓性基板通常為長度遠遠大於其寬度之細長材料幅。在一些實施例中,該可撓性基板能夠包繞在直徑小於約50公分(cm)之圓柱體周邊而不會使其扭曲或斷裂。所選基板更佳能夠包繞在直徑小於約25cm之圓柱體周邊而不會使該基板扭曲或斷裂。在一些實施例中,所選基板最佳能夠包繞在直徑小於約10cm或甚至直徑為約5cm之圓柱體周邊而不會使該基板扭曲或斷裂。用於將本發明之可撓性基板包繞在特定圓柱體周圍之力通常較低,諸如藉由無輔助之手,亦即,在無槓桿、機器、水力以及其類似物輔助的情況下。較佳可撓性基板自身可捲繞。 The methods, apparatus, and printing stamps described herein are particularly advantageous for printing on flexible substrates in a roll-to-roll process. The flexible substrate is typically an elongated web of material having a length that is much greater than its width. In some embodiments, the flexible substrate can wrap around a circumference of a cylinder having a diameter of less than about 50 centimeters (cm) without twisting or breaking it. The selected substrate is preferably capable of wrapping around the circumference of the cylinder having a diameter of less than about 25 cm without distorting or breaking the substrate. In some embodiments, the selected substrate is preferably capable of wrapping around a circumference of a cylinder having a diameter of less than about 10 cm or even a diameter of about 5 cm without distorting or breaking the substrate. The forces used to wrap the flexible substrate of the present invention around a particular cylinder are generally low, such as by unassisted hands, i.e., without the aid of levers, machinery, hydraulics, and the like. Preferably, the flexible substrate itself can be wound.

在一些實施例中,可撓性基板材料為聚合物「膜」,即呈平片或幅材形式之聚合物材料,其可撓性及強度足以用卷對卷方式進行加工。在一些實施例中,聚合物膜幅包括處於將塗覆來自印章之油墨的表面上之相對較薄之金屬塗層。金屬塗層可視預定應用而廣泛變化,但應足夠薄以使得幅材保持其可撓性,如上文所定義。 In some embodiments, the flexible substrate material is a polymeric "film", i.e., a polymeric material in the form of a flat sheet or web that is flexible and strong enough to be processed in a roll-to-roll manner. In some embodiments, the polymeric film web comprises a relatively thin metal coating on a surface that will be coated with ink from the stamp. The metal coating can vary widely depending on the intended application, but should be thin enough to maintain the web in its flexibility, as defined above.

此等材料厚度允許卷對卷加工,在一些實施例中該加工可為連續的,從而對一些平坦及/或剛性基板提供規模經濟及製造經濟。在本申請案中,卷對卷係指將材料捲繞於支撐物上或自支撐物退繞且可視情況在某種程度上進一步加工的製程。其他製程之實例包括塗佈、切割、遮沒及曝露於輻射或其類似製程。 The thickness of these materials allows for roll-to-roll processing, which in some embodiments can be continuous, providing economies of scale and manufacturing economy for some flat and/or rigid substrates. In the present application, roll-to-roll refers to a process in which a material is wound onto a support or unwound from a support and may be further processed to some extent, as appropriate. Examples of other processes include coating, cutting, masking, and exposure to radiation or the like.

適用於卷對卷加工之聚合物膜可製造為多種厚度,一般在約5μm至約1000μm範圍內。在許多實施例中,聚合物膜厚度在約25μm至約500μm範圍內,或在約50μm至約250μm範圍內,或在約75μm至約200μm範圍內。 Polymer films suitable for roll-to-roll processing can be manufactured in a variety of thicknesses, typically in the range of from about 5 [mu]m to about 1000 [mu]m. In many embodiments, the polymeric film thickness is in the range of from about 25 [mu]m to about 500 [mu]m, or in the range of from about 50 [mu]m to about 250 [mu]m, or in the range of from about 75 [mu]m to about 200 [mu]m.

若基板35相對於印章10相對運動,諸如若基板35為卷對卷製造 製程中之移動材料幅,則表面26上可出現油墨20之污跡。舉例而言,此種污跡可產生線寬比印刷表面16之尺寸長及/或寬的SAM 30(圖3),由此造成由圖案元件14之陣列表示之圖案與表面26上之所得印刷SAM 30之間的保真度不良。印章10與基板35之間的此種相對運動在表面26與印章之印刷表面16之間的切向(摩擦)應力超過預定值時開始。由於移動基板35之速度波動,故表面26與印章10之間始終存在一定量的錯配。表面26自壓印表面16脫離可受以下各項中之至少一者影響:(1)圖案元件14及/或視情況存在之印章支撐物11的彈性體性質,以及(2)圖案元件14之縱橫比。小心控制此等參數可降低基板表面26與壓印表面16之間的界面處的應力。 If the substrate 35 is relatively moved relative to the stamp 10, such as if the substrate 35 is a roll-to-roll manufacturing The smudge of the ink 20 may appear on the surface 26 as the moving material web in the process. For example, such smear can produce a SAM 30 (Fig. 3) having a line width that is longer and/or wider than the size of the printed surface 16, thereby resulting in a pattern represented by the array of pattern elements 14 and the resulting print on surface 26. Poor fidelity between SAMs 30. This relative movement between the stamp 10 and the substrate 35 begins when the tangential (frictional) stress between the surface 26 and the printed surface 16 of the stamp exceeds a predetermined value. Since the speed of the moving substrate 35 fluctuates, there is always a certain amount of mismatch between the surface 26 and the stamp 10. The detachment of the surface 26 from the embossed surface 16 can be affected by at least one of: (1) the elastomeric nature of the pattern element 14 and/or the stamp support 11 as the case may be, and (2) the pattern element 14 aspect ratio. Careful control of these parameters can reduce stress at the interface between the substrate surface 26 and the embossed surface 16.

如圖4A中示意性展示,若壓印元件14在基板表面26與壓印表面16之間出現錯配時變形,則可將油墨20之圖案自壓印表面16準確轉移至基板之表面26而不會使所得SAM 30中出現線加寬(換言之,印章10上之壓印表面16之線寬實質上與SAM 30中之線寬相同)。然而,如圖4B中所示,若印章元件14在出現基板/印章速度錯配時不變形,則基板/印章界面處發生滑動,且所得污化油墨圖案21相對於印章10上之壓印表面16之寬度w加寬距離δ,從而降低油墨20自印章10轉移至基板表面26之保真度。 As schematically shown in FIG. 4A, if the embossing element 14 is deformed when a mismatch occurs between the substrate surface 26 and the embossed surface 16, the pattern of the ink 20 can be accurately transferred from the embossed surface 16 to the surface 26 of the substrate. The line width in the resulting SAM 30 is not widened (in other words, the line width of the imprint surface 16 on the stamp 10 is substantially the same as the line width in the SAM 30). However, as shown in FIG. 4B, if the stamp member 14 does not deform when the substrate/seal speed mismatch occurs, slip occurs at the substrate/seal interface, and the resulting stained ink pattern 21 is opposed to the imprinted surface on the stamp 10. The width w of 16 widens the distance δ, thereby reducing the fidelity of the transfer of the ink 20 from the stamp 10 to the substrate surface 26.

在所選印章材料中,本發明所主張之方法至少部分係基於以下發現:當基板/印章界面處存在速度差異及相對位移時,縱橫比大於約1.5之圖案元件趨向於更有效地變形(彎曲)。此變形降低基板/印章界面處之應力,從而降低壓印表面16在基板26上滑動及加寬或者使油墨20及所得SAM 30污化的傾向性。因為桿狀物之硬度與其長度之立方成比例,故圖案元件14之縱橫比效應顯著。舉例而言,對於相同相對位移,高度為兩倍的圖案元件14在壓印表面16處的摩擦力將幾乎為十分之一。 Among the selected seal materials, the method claimed by the present invention is based, at least in part, on the discovery that when there is a speed difference and a relative displacement at the substrate/seal interface, the pattern elements having an aspect ratio greater than about 1.5 tend to deform more effectively (bending ). This deformation reduces the stress at the substrate/seal interface, thereby reducing the tendency of the embossed surface 16 to slide and widen on the substrate 26 or to stain the ink 20 and the resulting SAM 30. Since the hardness of the rod is proportional to the cube of its length, the aspect ratio effect of the pattern element 14 is significant. For example, for the same relative displacement, the frictional force of the pattern element 14 at the embossed surface 16 will be almost one tenth.

在基板表面26相對於印章10快速移動之卷對卷製程中,隨著印刷速度增加,更多空氣截留在印章10與基板35之表面26之間。當此截留空氣之厚度變得大於圖案元件14之近似高度h時(圖1),壓印表面16與基板表面26之間未建立接觸且表面26之在一定程度上不規則之較大區域將缺失印刷。因而增加圖案元件14之縱橫比及高度h可允許在較高速度下進行微接觸印刷,且印章10可在存在較厚夾帶空氣層的情況下操作而不產生印刷缺陷。 In the roll-to-roll process in which the substrate surface 26 moves rapidly relative to the stamp 10, as the printing speed increases, more air is trapped between the stamp 10 and the surface 26 of the substrate 35. When the thickness of the trapped air becomes greater than the approximate height h of the pattern element 14 (Fig. 1), no contact is established between the stamp surface 16 and the substrate surface 26 and a larger area of the surface 26 that is somewhat irregular will Missing printing. Thus increasing the aspect ratio and height h of the pattern element 14 allows for microcontact printing at higher speeds, and the stamp 10 can be operated without the presence of a thicker entrained air layer without producing print defects.

此外,若粉狀粒子截留在基板表面26與印章10之間,則壓印表面16可能與表面26失去接觸且在基板26上產生一個未形成印刷的區域。圖案元件14之縱橫比愈高,高度h愈大,由此允許較大粉狀粒子滯留而不會在基板表面26上產生未印刷之區域。 Moreover, if the powdered particles are trapped between the substrate surface 26 and the stamp 10, the stamping surface 16 may lose contact with the surface 26 and create an unprinted area on the substrate 26. The higher the aspect ratio of the pattern element 14, the greater the height h , thereby allowing larger powder particles to remain without creating unprinted areas on the substrate surface 26.

如上所述,印章10應為彈性的,以使得壓印表面16可非常緊密地符合材料22之表面26中的微小不規則性並且將油墨20完全轉移至其上。此彈性允許印章10將油墨20中之官能化分子準確地轉移至不平坦表面。然而,圖案元件14之彈性不應使得當稍微按壓壓印表面16與表面26相抵時引起圖案元件14之變形達到使基板表面26上之油墨20模糊化的程度。 As noted above, the stamp 10 should be resilient such that the stamping surface 16 can conform very closely to the slight irregularities in the surface 26 of the material 22 and completely transfer the ink 20 thereto. This elasticity allows the stamp 10 to accurately transfer the functionalized molecules in the ink 20 to the uneven surface. However, the elasticity of the pattern element 14 should not cause the pattern element 14 to deform to a degree that obscures the ink 20 on the substrate surface 26 when the embossed surface 16 is slightly pressed against the surface 26.

亦應形成印章10以使得壓印表面16包括經選擇以吸收油墨20之吸收材料,該油墨將轉移至表面26以便在該表面上形成SAM 30。壓印表面16較佳膨脹以吸收油墨20,該油墨可包括僅官能化分子或懸浮於諸如有機溶劑之載劑中之官能化分子。此種膨脹及吸收特性良好界定基板表面26上之隔離式SAM 30。舉例而言,若壓印表面16之尺寸特徵具有特定形狀,則表面16應將油墨20轉移至材料22之表面26以形成反映壓印表面16之特徵而不會模糊或污染的SAM 30。油墨被吸收至壓印表面16中,且當壓印表面16接觸材料表面26時,油墨20不分散,但官能化分子上之官能基化學結合於表面26,且自表面26移除壓 印表面16產生具有明確界定之特徵的SAM 30。 The stamp 10 should also be formed such that the stamping surface 16 includes an absorbent material selected to absorb the ink 20 which will be transferred to the surface 26 to form the SAM 30 on the surface. The embossed surface 16 is preferably expanded to absorb the ink 20, which may include functionalized molecules that are only functionalized molecules or suspended in a carrier such as an organic solvent. This expansion and absorption characteristics well define the isolated SAM 30 on the substrate surface 26. For example, if the sizing features of the embossed surface 16 have a particular shape, the surface 16 should transfer the ink 20 to the surface 26 of the material 22 to form a SAM 30 that reflects the features of the embossed surface 16 without blurring or contamination. The ink is absorbed into the embossed surface 16, and when the embossed surface 16 contacts the surface 26 of the material, the ink 20 does not disperse, but the functional groups on the functionalized molecule are chemically bonded to the surface 26 and the pressure is removed from the surface 26. The printed surface 16 produces a SAM 30 having well-defined features.

適用於形成印章10之彈性體包括聚合物,諸如矽酮、聚胺基甲酸酯、乙烯丙烯二烯M類(EPDM)橡膠以及市售柔版印刷版材料(例如可以商標名Cyrel購自E.I.du Pont de Nemours and Company,Wilmington,DE之材料)。印章可由複合材料製造,包括例如與編織或非編織纖維強化物11組合之壓印表面16上的彈性體材料(圖1)。 Elastomers suitable for forming stamp 10 include polymers such as anthrone, polyurethane, ethylene propylene diene (EPDM) rubber, and commercially available flexographic printing plate materials (for example, available under the trade name Cyrel from EI) Du Pont de Nemours and Company, Wilmington, DE). The stamp may be fabricated from a composite material including, for example, an elastomeric material on the embossed surface 16 in combination with a woven or non-woven fiber reinforcement 11 (Fig. 1).

聚二甲基矽氧烷(PDMS)尤其適用作印章材料,因為其為彈性體且具有低表面能(此性質使得易於自大部分基板上移除印章)。適用市售調配物可以商標名Sylgard 184 PDMS得自Dow Corning,Midland,MI。PDMS印章可例如藉由將非交聯PDMS聚合物分配於圖案化模具中或與其相抵,隨後進行固化來形成。用於模製彈性體印章之母板工具可使用此項技術中已知的光微影技術來形成。可藉由將未固化PDMS塗覆於母板工具而與母板工具相抵,且隨後進行固化來模製彈性體印章。 Polydimethyloxane (PDMS) is especially useful as a seal material because it is an elastomer and has a low surface energy (this property makes it easy to remove the stamp from most substrates). Commercially available formulations are available from Dow Corning, Midland, MI under the trade name Sylgard 184 PDMS. The PDMS stamp can be formed, for example, by dispensing or non-crosslinking the non-crosslinked PDMS polymer into a patterned mold, followed by curing. The master tool used to mold the elastomeric stamp can be formed using photolithography techniques known in the art. The elastomeric stamp can be molded by applying uncured PDMS to the master tool to the master tool and then curing.

選擇材料22及油墨20以使得其中之官能化分子包括可結合於材料22之表面26的官能基。該官能基可處於官能化分子之物理末端,以及可用於以分子物質可形成SAM 30的方式與表面26形成鍵的分子的任何部分,或當該分子涉及SAM形成時仍曝露的任何分子部分。在一些實施例中,可認為油墨20中之官能化分子具有由間隔部分隔開之第一末端及第二末端,該第一末端包括經選擇以鍵結於表面26之官能基,且該第二末端基團視情況包括經選擇以便在具有所要曝露官能度之材料表面26上提供SAM 30的官能基。該分子之間隔部分可經選擇以提供所得SAM 30之特定厚度以及促進SAM形成。雖然本發明之SAM可在厚度方面變化,但厚度小於約50Å之SAM一般較佳,更佳為厚度小於約30Å者,且更佳為厚度小於約15Å者。此等尺寸一般由分子物質20且尤其是其間隔部分之選擇加以支配。 Material 22 and ink 20 are selected such that the functionalized molecules therein include functional groups that can bind to surface 26 of material 22. The functional group can be at the physical end of the functionalized molecule, as well as any portion of the molecule that can be used to form a bond with the surface 26 in a manner that the molecular species can form the SAM 30, or any molecular moiety that is still exposed when the molecule is involved in SAM formation. In some embodiments, the functionalized molecule in ink 20 can be considered to have a first end and a second end separated by a spacer portion, the first end comprising a functional group selected to bond to surface 26, and the The two terminal groups optionally include a functional group selected to provide SAM 30 on the surface 26 of the material having the desired functionality to be exposed. The spacer portion of the molecule can be selected to provide a particular thickness of the resulting SAM 30 and to promote SAM formation. While the SAM of the present invention can vary in thickness, SAMs having a thickness of less than about 50 Å are generally preferred, more preferably less than about 30 Å thick, and more preferably less than about 15 Å thick. These dimensions are generally governed by the choice of molecular species 20 and, in particular, the spacing thereof.

另外,表面26上所形成之SAM 30可在此形成之後出於多種目的進行改質。舉例而言,油墨20中之官能化分子可沈積於表面26上之SAM中,該官能化分子具有曝露官能度,包括可移除以實現SAM 30之進一步改質之保護基。或者,可在油墨20中之官能化分子之曝露部分上提供反應性基團,該基團可藉由電子束微影、x射線微影或任何其他輻射進行活化或鈍化。該等保護及脫除保護可有助於現存表面結合SAM 30之化學或物理改質。 Additionally, the SAM 30 formed on the surface 26 can be modified for various purposes after it is formed. For example, a functionalized molecule in ink 20 can be deposited in a SAM on surface 26 having an exposed functionality, including a protecting group that can be removed to achieve further modification of SAM 30. Alternatively, a reactive group can be provided on the exposed portion of the functionalized molecule in ink 20, which group can be activated or passivated by electron beam lithography, x-ray lithography, or any other radiation. Such protection and removal protection can aid in the chemical or physical modification of the existing surface in combination with SAM 30.

由材料22製造之基板表面26為在上面形成SAM 30之表面。術語基板35亦可視情況包括處於表面材料22下方之物理支撐層24。在一些實施例中,基板表面26為實質上平坦的。適用基板材料22可包括於聚合物膜24上或於玻璃或矽晶圓24上之無機材料(例如金屬或金屬氧化物材料,包括多晶材料)塗層。無機材料塗層22可包括例如元素金屬、金屬合金、金屬間化合物、金屬氧化物、金屬硫化物、金屬碳化物、金屬氮化物及其組合。用於支撐SAM之例示性金屬表面22包括金、銀、鈀、鉑、銠、銅、鎳、鐵、銦、錫、鉭、鋁以及此等元素之混合物、合金及化合物。金為較佳金屬表面22。 The substrate surface 26 made of material 22 is the surface on which the SAM 30 is formed. The term substrate 35 also optionally includes a physical support layer 24 below the surface material 22. In some embodiments, the substrate surface 26 is substantially flat. Suitable substrate material 22 may include a coating of an inorganic material (e.g., a metal or metal oxide material, including a polycrystalline material) on polymer film 24 or on glass or tantalum wafer 24. The inorganic material coating 22 can include, for example, elemental metals, metal alloys, intermetallic compounds, metal oxides, metal sulfides, metal carbides, metal nitrides, and combinations thereof. Exemplary metal surfaces 22 for supporting SAM include gold, silver, palladium, platinum, rhodium, copper, nickel, iron, indium, tin, antimony, aluminum, and mixtures, alloys, and compounds of such elements. Gold is the preferred metal surface 22.

聚合物膜或者玻璃或矽晶圓基板24上之金屬塗層22可為任何厚度,諸如約10奈米(nm)至約1000nm。無機材料塗層可使用任何便利方法來沈積,例如濺鍍、蒸發、化學氣相沈積或化學溶液沈積(包括無電極電鍍)。 The metal coating 22 on the polymeric film or glass or tantalum wafer substrate 24 can be of any thickness, such as from about 10 nanometers (nm) to about 1000 nm. The inorganic material coating can be deposited using any convenient method, such as sputtering, evaporation, chemical vapor deposition, or chemical solution deposition (including electroless plating).

材料22與油墨20中之官能化分子之官能基之較佳組合包括但不限於:(1)金屬(諸如金、銀、銅、鎘、鋅、鈀、鉑、汞、鉛、鐵、鉻、錳、鎢及以上各物之任何合金)與含硫官能基(諸如硫醇、硫化物、二硫化物以及其類似物);(2)經摻雜或未經摻雜之矽與矽烷及氯矽烷;(3)金屬氧化物(諸如二氧化矽、氧化鋁、石英、玻璃以及其類似物)與羧酸;(4)鉑及鈀與腈及異腈;及(4)銅與異羥肟酸。油墨20中 之官能化分子上之其他適合官能基包括酸氯化物、酸酐、磺醯基、磷醯基、羥基及胺基酸基。其他表面材料22包括鍺、鎵、砷及砷化鎵。另外,環氧化合物、聚碸化合物、塑膠及其他聚合物可用作材料22。適用於本發明之其他材料及官能基可在美國專利第5,079,600號及第5,512,131號中獲得。 Preferred combinations of functional groups of material 22 and functionalized molecules in ink 20 include, but are not limited to: (1) metals such as gold, silver, copper, cadmium, zinc, palladium, platinum, mercury, lead, iron, chromium, Manganese, tungsten and any alloy of the above) and sulfur-containing functional groups (such as thiols, sulfides, disulfides and the like); (2) doped or undoped ruthenium and decane and chlorine矽 ;; (3) metal oxides (such as cerium oxide, aluminum oxide, quartz, glass, and the like) and carboxylic acids; (4) platinum and palladium with nitriles and isonitriles; and (4) copper and hydroxyindoles acid. Ink 20 Other suitable functional groups on the functionalized molecule include acid chlorides, acid anhydrides, sulfonyl groups, phosphonium groups, hydroxyl groups, and amino acid groups. Other surface materials 22 include germanium, gallium, arsenic, and gallium arsenide. In addition, epoxy compounds, polyfluorene compounds, plastics, and other polymers can be used as the material 22. Other materials and functional groups suitable for use in the present invention are available in U.S. Patent Nos. 5,079,600 and 5,512,131.

在一些實施例中,將本發明所描述之製程中用於形成SAM之官能化分子作為包括一或多種如美國專利申請公開案第2010/0258968號中所述之有機硫化合物之油墨溶液20遞送至印章10。各有機硫化合物較佳為能夠在材料22之所選表面26上形成SAM 30的硫醇(thiol)化合物。硫醇包括--SH官能基,且亦可以稱為硫醇(mercaptan)。硫醇基適用於在油墨20中之官能化化合物分子與金屬表面22之間形成化學鍵。適用硫醇包括(但不限於)烷基硫醇及芳基硫醇。其他適用有機硫化合物包括二烷基二硫化物、二烷基硫化物、烷基黃原酸酯、二硫代磷酸酯及二烷基硫代胺基甲酸酯。 In some embodiments, the functionalized molecules used to form the SAM in the process described in the present invention are delivered as an ink solution 20 comprising one or more organic sulfur compounds as described in US Patent Application Publication No. 2010/0258968 To the seal 10. Each organosulfur compound is preferably a thiol compound capable of forming SAM 30 on selected surfaces 26 of material 22. Mercaptans include the --SH functional group and may also be referred to as mercaptan. The thiol group is suitable for forming a chemical bond between the functionalized compound molecule in the ink 20 and the metal surface 22. Suitable mercaptans include, but are not limited to, alkyl mercaptans and aryl mercaptans. Other suitable organic sulfur compounds include dialkyl disulfides, dialkyl sulfides, alkyl xanthates, dithiophosphates, and dialkyl thiocarbamates.

油墨溶液20較佳包括烷基硫醇,諸如直鏈烷基硫醇:HS(CH2)nX,其中n為亞甲基單元數目且X為烷基鏈之末端基(例如X=--CH3、--OH、--COOH、--NH2或其類似基團)。較佳地,X=--CH3。其他適用官能基包括例如以下文獻中所描述之官能基:(1)Ulman,「Formation and Structure of Self-Assembled Monolayers」,Chemical Reviews第96卷,第1533-1554頁(1996);及(2)Love等人,「Self-Assembled Monolayers of Thiolates on Metals as a Form of Nanotechnology」,Chemical Reviews第105卷,第1103-1169頁(2005)。 The ink solution 20 preferably comprises an alkyl thiol such as a linear alkyl thiol: HS(CH 2 ) n X wherein n is the number of methylene units and X is the terminal group of the alkyl chain (eg X=-- CH 3 , ---OH, --COOH, --NH 2 or the like. Preferably, X = -CH 3 . Other suitable functional groups include, for example, the functional groups described in (1) Ulman, "Formation and Structure of Self-Assembled Monolayers", Chemical Reviews, Vol. 96, pp. 1533-1554 (1996); and (2) Love et al., "Self-Assembled Monolayers of Thiolates on Metals as a Form of Nanotechnology", Chemical Reviews, Vol. 105, pp. 1103-1169 (2005).

適用烷基硫醇可為直鏈(linear)烷基硫醇(亦即,直鏈(straight chain)烷基硫醇)或分支鏈,且可經取代或未經取代。視情況存在之取代基較佳不干擾SAM之形成。適用分支鏈烷基硫醇之實例包括甲基連 接於直鏈烷基鏈主鏈之每第三個或每第四個碳原子的烷基硫醇(例如植烷基硫醇)。適用烷基硫醇內之中鏈取代基之實例包括醚基及芳族環。適用硫醇亦可包括三維環狀化合物(例如1-金剛烷硫醇)。 Suitable alkyl mercaptans may be linear alkyl mercaptans (i.e., straight chain alkyl mercaptans) or branched chains, and may be substituted or unsubstituted. Substituents which are optionally present do not interfere with the formation of the SAM. Examples of suitable branched alkyl mercaptans include methyl groups An alkylthiol (e.g., phytoalkylthiol) attached to every third or every fourth carbon atom of the backbone of the linear alkyl chain. Examples of suitable intermediate chain substituents in the alkylthiol include ether groups and aromatic rings. Suitable thiols may also include three-dimensional cyclic compounds such as 1-adamantanethiol.

較佳直鏈烷基硫醇具有10至20個碳原子(更佳具有12至20個碳原子;最佳具有16個碳原子、18個碳原子或20個碳原子)。 Preferably, the linear alkyl thiol has 10 to 20 carbon atoms (more preferably 12 to 20 carbon atoms; most preferably 16 carbon atoms, 18 carbon atoms or 20 carbon atoms).

適合烷基硫醇包括市售烷基硫醇(Aldrich Chemical Company,Milwaukee,WI)。較佳地,油墨溶液20主要由溶劑及有機硫化合物組成,其中雜質包括小於約5重量%之油墨溶液;更佳小於約1%;甚至更佳小於約0.1%。適用油墨20可含有溶解於常用溶劑中之不同的有機硫化合物之混合物,例如烷基硫醇與二烷基二硫化物之混合物。 Suitable alkyl mercaptans include the commercially available alkyl mercaptans (Aldrich Chemical Company, Milwaukee, WI). Preferably, ink solution 20 consists essentially of a solvent and an organic sulfur compound, wherein the impurities comprise less than about 5% by weight of the ink solution; more preferably less than about 1%; even more preferably less than about 0.1%. Suitable ink 20 may contain a mixture of different organosulfur compounds dissolved in a conventional solvent, such as a mixture of an alkylthiol and a dialkyl disulfide.

包括連接於芳族環之硫醇基的芳基硫醇亦適用於油墨20。適用芳基硫醇之實例包括聯苯硫醇及聯三苯硫醇。聯苯及聯三苯硫醇可在多種位置中之任一者處經一或多個官能基取代。適用芳基硫醇之其他實例包括可能經官能基取代或可能未經官能基取代之稠苯硫醇。 An aryl thiol comprising a thiol group attached to an aromatic ring is also suitable for the ink 20. Examples of suitable aryl thiols include biphenyl thiol and terphenyl thiol. Biphenyl and terphenylthiol can be substituted with one or more functional groups at any of a variety of positions. Other examples of suitable aryl thiols include fused thiols which may or may not be substituted with a functional group.

適用硫醇可包括直鏈共軛碳-碳鍵,例如雙鍵或參鍵,且可部分或完全氟化。 Suitable thiols may include linear conjugated carbon-carbon bonds, such as double or para-bonds, and may be partially or fully fluorinated.

油墨溶液20可包括兩種或兩種以上化學上獨特之有機硫化合物。舉例而言,油墨可包括兩種直鏈烷基硫醇化合物,各化合物具有不同的鏈長。作為另一實例,油墨20可包括兩種具有不同的尾部基團的直鏈烷基硫醇化合物。 The ink solution 20 may include two or more chemically unique organic sulfur compounds. For example, the ink can include two linear alkyl thiol compounds, each having a different chain length. As another example, ink 20 can include two linear alkyl thiol compounds having different tail groups.

雖然已使用純有機硫化合物將印章上墨來進行微接觸印刷,但在直鏈烷基硫醇及PDMS印章的情況下,若由基於溶劑之油墨進行遞送,則可將有機硫化合物更均勻地遞送至印章,且具有較少印章膨脹。在一些實施例中,油墨包括超過一種溶劑,但大部分適用調配物需要僅包括單一溶劑。僅用一種溶劑調配之油墨可含有少量雜質或添加劑,例如穩定劑或乾燥劑。 Although the seal has been inked for microcontact printing using pure organic sulfur compounds, in the case of linear alkyl mercaptan and PDMS stamps, organic sulfur compounds can be more uniformly delivered by solvent-based inks. Delivered to the stamp with less stamp expansion. In some embodiments, the ink includes more than one solvent, but most suitable formulations need to include only a single solvent. The ink formulated with only one solvent may contain a small amount of impurities or additives such as a stabilizer or a desiccant.

適用溶劑較佳與PDMS相容(亦即,其不會使PDMS過度膨脹),PDMS為最常用於微接觸印刷之印章材料。在微接觸印刷中,PDMS印章之膨脹可造成圖案特徵失真及不良圖案保真度。視上墨方法而定,過度膨脹亦可在為印章提供機械支撐方面提出重大挑戰。 Suitable solvents are preferably compatible with PDMS (i.e., they do not overextend PDMS), and PDMS is the most commonly used stamp material for microcontact printing. In microcontact printing, the expansion of the PDMS stamp can cause pattern distortion and poor pattern fidelity. Depending on the ink method, excessive expansion can also present significant challenges in providing mechanical support for the seal.

酮可為適用於油墨溶液之溶劑。在一些實施例中,適合溶劑包括例如丙酮、甲基乙基酮、乙酸乙酯以及其類似物及其組合。丙酮為尤佳溶劑。該一或多種有機硫化合物(例如硫醇化合物)以至少約3毫莫耳(mM)之總濃度存在於溶劑中。如本文所使用,「總濃度」係指所有溶解之有機硫化合物之總莫耳濃度。該一或多種有機硫化合物(例如硫醇化合物)可以任何總濃度存在,其中油墨溶液基本上由單一相組成。該一或多種有機硫化合物(例如硫醇化合物)可以至少約5mM、至少約10mM、至少約20mM、至少50mM及甚至至少約100mM之總濃度存在。 The ketone can be a solvent suitable for use in an ink solution. In some embodiments, suitable solvents include, for example, acetone, methyl ethyl ketone, ethyl acetate, and the like, and combinations thereof. Acetone is a preferred solvent. The one or more organosulfur compounds (eg, thiol compounds) are present in the solvent at a total concentration of at least about 3 millimolar (mM). As used herein, "total concentration" refers to the total molar concentration of all dissolved organosulfur compounds. The one or more organosulfur compounds (e.g., thiol compounds) can be present in any total concentration, wherein the ink solution consists essentially of a single phase. The one or more organosulfur compounds (eg, thiol compounds) can be present in a total concentration of at least about 5 mM, at least about 10 mM, at least about 20 mM, at least 50 mM, and even at least about 100 mM.

印章10可使用此項技術中已知的方法用本發明之油墨溶液20「上墨」(例如,如Libioulle等人,「Contact-Inking Stamps for Microcontact Printing of Alkanethiols on Gold」,Langmuir第15卷,第300-304頁(1999)中所述)。在一種方法中,可用灌注油墨溶液20之塗覆器(例如拭棉或泡沫塗覆器)在印章10之壓印表面16上摩擦,隨後乾燥壓印表面16上之溶劑。在另一方法中,可按壓該壓印表面16與經油墨溶液灌注之「墨墊」相抵,該墨墊視情況為PDMS板片。在另一方法中,該印章可相對於印刷表面自其背側裝填油墨溶液。在後一種方法中,有機硫化合物擴散通過印章而達到浮雕圖案化面(該面包括平坦表面12及具有壓印表面16之圖案元件14)以供印刷。在另一實施例中,可將印章之浮雕圖案化印刷面浸於油墨溶液中,隨後取出並乾燥(「浸沒上墨」)。 The seal 10 can be "inked" using the ink solution 20 of the present invention using methods known in the art (e.g., as Libioulle et al., "Contact-Inking Stamps for Microcontact Printing of Alkanethiols on Gold", Langmuir, Vol. 15, As described in pages 300-304 (1999). In one method, an applicator (e.g., a cotton or foam applicator) that infuses the ink solution 20 can be used to rub the stamping surface 16 of the stamp 10, followed by drying of the solvent on the stamping surface 16. In another method, the embossed surface 16 can be pressed against an "ink pad" that is infused with an ink solution, which is optionally a PDMS plate. In another method, the stamp can be filled with an ink solution from its back side relative to the printing surface. In the latter method, the organosulfur compound diffuses through the stamp to the relief patterned surface (which includes the planar surface 12 and the patterned element 14 having the embossed surface 16) for printing. In another embodiment, the embossed patterned print surface of the stamp can be immersed in the ink solution, then removed and dried ("immersion in ink").

在另一實施例中,可將印章10安裝在印刷輥上且可使壓印表面 16與移動幅相抵以便在上面形成SAM。印刷輥較佳為圓柱形。一般熟習此項技術者應理解,圓柱形輥可與理想情況具有一定偏差,例如偏心率、偏心或楔形。較佳地,本發明之圓柱形印刷輥的半徑介於2cm與50cm之間,更佳介於5cm與25cm之間,最佳介於7.5cm與20cm之間。對於厚度及安裝構件之總尺寸相對於印刷輥半徑而言較小(例如總計小於1cm)的印章,安裝於印刷輥上之印章的曲率半徑較佳介於2cm與50cm之間,更佳介於5cm與25cm之間,最佳介於7.5cm與20cm之間。 In another embodiment, the stamp 10 can be mounted on a printing roll and the embossed surface can be made 16 is offset from the moving web to form a SAM thereon. The printing roll is preferably cylindrical. It will be understood by those skilled in the art that cylindrical rollers may deviate from the ideal, such as eccentricity, eccentricity or wedge shape. Preferably, the cylindrical printing roll of the present invention has a radius of between 2 cm and 50 cm, more preferably between 5 cm and 25 cm, most preferably between 7.5 cm and 20 cm. For stamps having a small thickness and a total dimension of the mounting member relative to the radius of the printing roll (e.g., less than 1 cm in total), the radius of curvature of the stamp mounted on the printing roll is preferably between 2 cm and 50 cm, more preferably between 5 cm and Between 25cm, preferably between 7.5cm and 20cm.

在一些實施例中,印刷輥旋轉與幅材移動同步進行。以下較詳細描述此類型之所選實施例之實例。此種旋轉及此種移動同步進行意謂對於移動幅而言,壓印表面與移動幅在其接觸時平移一致,從而避免滑動及相關圖案失真。換言之,當印刷輥旋轉與幅材移動同步進行時,幅材表面及壓印表面之速度及軌跡幾乎相同(亦即,當其接觸時)。 In some embodiments, the rotation of the printing roll is synchronized with the movement of the web. Examples of selected embodiments of this type are described in greater detail below. This rotation and the simultaneous movement of such movement means that for the moving web, the embossed surface and the moving web are translated in translation when they are in contact, thereby avoiding slippage and associated pattern distortion. In other words, when the rotation of the printing roll is synchronized with the movement of the web, the speed and trajectory of the surface of the web and the embossed surface are almost the same (i.e., when they are in contact).

圖5示意性說明非常適於在卷對卷製程中在沿方向A移動的幅材102上形成SAM的微接觸印刷製程線100之一部分的一個實施例。幅材102圍繞第一支撐物104(在此實例中為夾輥)且在至少一個由諸如PDMS之材料製造的彈性體印章106上移動。儘管幅材之支撐物在本文中一般將稱為輥,但此申請案中所示之設備中所利用之支撐物可包括(但不限於)固體輥、具有球軸承之輥、具有空氣軸承之輥、由空氣或氣體支撐之套管、諸如空氣線撚及空氣條之無觸點支撐物、空氣刮刀及其組合。 FIG. 5 schematically illustrates one embodiment of a portion of a microcontact printing process line 100 that is well suited for forming a SAM on a web 102 that moves in direction A in a roll-to-roll process. The web 102 is moved around a first support 104 (in this example a nip roll) and on at least one elastomeric stamp 106 made of a material such as PDMS. While the web support will generally be referred to herein as a roll, the supports utilized in the apparatus shown in this application may include, but are not limited to, solid rolls, rolls with ball bearings, and air bearings. Rollers, sleeves supported by air or gas, non-contact supports such as air rafts and air strips, air scrapers, and combinations thereof.

在一些實施例中,印章106包括上述高縱橫比壓印圖案元件(圖1),但可使用任何壓印圖案。在圖5之實施例中,將兩個印章106安裝在印刷輥108上以允許連續或逐步連續印刷操作。印章106可使用任何適合技術連接於印刷輥108,包括(但不限於)雙側黏著膠帶、泡沫膠 墊安裝膠帶、基於真空之連接、磁連接及機械連接。印刷輥可具有接近圓形之外固體表面且可選自但不限於具有固定軸之空轉輥、具有移動軸之空轉輥、具有低摩擦軸承之空轉輥、由浮在薄空氣層上之薄金屬殼製造之空氣套管、由浮在空氣層上之硬金屬殼製造之空氣套管、由馬達驅動之輥、由磁性材料製造之輥、由允許將該輥與印章之間的氣壓降至「真空」之材料製造之輥、允許機械連接印章之輥及套管。 In some embodiments, the stamp 106 includes the high aspect ratio embossed pattern elements described above (Fig. 1), although any embossed pattern can be used. In the embodiment of Figure 5, two stamps 106 are mounted on the printing roll 108 to allow for continuous or stepwise continuous printing operations. The stamp 106 can be attached to the printing roller 108 using any suitable technique, including but not limited to double-sided adhesive tape, foam adhesive Pad mounting tape, vacuum based connections, magnetic connections and mechanical connections. The printing roll may have a solid surface that is close to a circular shape and may be selected from, but not limited to, an idler roll having a fixed axis, an idler roll having a moving shaft, an idler roll having a low friction bearing, and a thin metal floating on a thin air layer. An air casing made of a shell, an air sleeve made of a hard metal shell floating on an air layer, a roller driven by a motor, a roller made of a magnetic material, and a pressure between the roller and the stamp is allowed to be lowered. Rolls made of vacuum material, rollers and sleeves that allow mechanical connection of the stamp.

在一些實施例中,印刷輥108之表面與印章106之間可包括視情況存在之彈性體層111。在幅材102接觸印章106之後,幅材102圍繞第二夾輥110移動且可隨後視情況在製程線100上進一步加工。 In some embodiments, the surface of the printing roll 108 and the stamp 106 may include an elastomer layer 111 as appropriate. After the web 102 contacts the stamp 106, the web 102 moves around the second nip roll 110 and can then be further processed on the process line 100 as appropriate.

圖6示意性說明適用於在卷對卷製程中在幅材202上形成SAM之微接觸印刷製程線200之一部分的另一實施例。幅材202圍繞第一拉伸輥204且在由諸如PDMS之材料製造之彈性體印章206之排列上移動。在一些實施例中,印章206包括上述高縱橫比壓印圖案元件(圖1),但可使用任何壓印圖案。將印章206安裝在印刷輥208上。在一些實施例中,印刷輥208之表面與印章206之間可包括視情況存在之彈性體層211。在幅材202接觸印章206之後,幅材202圍繞第二拉伸輥210移動且可視情況在製程線200上進一步加工。在此實施例中,幅材202在本文中描述為在輥204與輥210之間拉伸,且印章在本文中描述為接觸介於輥204與輥210之間的幅材。 FIG. 6 schematically illustrates another embodiment of a portion of a microcontact printing process line 200 suitable for forming a SAM on a web 202 in a roll-to-roll process. The web 202 is moved around the first stretching roll 204 and on an array of elastomeric stamps 206 made of a material such as PDMS. In some embodiments, the stamp 206 includes the high aspect ratio embossed pattern elements described above (Fig. 1), although any embossed pattern can be used. The stamp 206 is mounted on the printing roller 208. In some embodiments, the surface of the printing roll 208 and the stamp 206 may include an elastomer layer 211 as appropriate. After the web 202 contacts the stamp 206, the web 202 moves around the second stretching roll 210 and may be further processed on the process line 200 as appropriate. In this embodiment, the web 202 is described herein as being stretched between the roll 204 and the roll 210, and the stamp is described herein as contacting the web between the roll 204 and the roll 210.

圖7示意性說明用於在卷對卷製程中在幅材302上印刷SAM之微接觸印刷製程線300之一部分的另一實施例。幅材302圍繞單一夾輥304且在兩個由諸如PDMS之材料製造之彈性體印章306上移動。在一些實施例中,印章306包括上述高縱橫比壓印圖案元件(圖1),但可使用任何壓印圖案。在一些實施例中,印刷輥308之表面與印章306之間可包括視情況存在之彈性體層311。在幅材302接觸印章306之後,幅材302準備在製程線300上進一步加工。 FIG. 7 schematically illustrates another embodiment of a portion of a microcontact printing process line 300 for printing a SAM on a web 302 in a roll-to-roll process. The web 302 is moved around a single nip 304 and on two elastomeric stamps 306 made of a material such as PDMS. In some embodiments, the stamp 306 includes the high aspect ratio embossed pattern elements described above (Fig. 1), although any embossed pattern can be used. In some embodiments, the surface of the printing roll 308 and the stamp 306 may include an elastomer layer 311 as appropriate. After the web 302 contacts the stamp 306, the web 302 is ready for further processing on the process line 300.

圖8示意性說明用於在卷對卷製程中在幅材402上製造SAM之微接觸印刷製程線400之一部分的另一實施例。幅材402圍繞夾輥404且在由諸如PDMS之材料製造之彈性體印章406上移動。在一些實施例中,印章406包括上述高縱橫比壓印圖案元件(圖1),但可使用任何壓印圖案。在一些實施例中,印刷輥408之表面與印章406之間可包括視情況存在之彈性體層411。在幅材402接觸印章406之後,幅材402圍繞拉伸輥410移動且可視情況在製程線400上進一步加工。 FIG. 8 schematically illustrates another embodiment of a portion of a microcontact printing process line 400 for fabricating a SAM on a web 402 in a roll-to-roll process. The web 402 is wrapped around the nip roller 404 and on an elastomeric stamp 406 made of a material such as PDMS. In some embodiments, the stamp 406 includes the high aspect ratio embossed pattern elements described above (Fig. 1), although any embossed pattern can be used. In some embodiments, the surface of the printing roll 408 and the stamp 406 may include an elastomer layer 411 as appropriate. After the web 402 contacts the stamp 406, the web 402 moves around the stretching roll 410 and may be further processed on the process line 400 as appropriate.

在以上圖5至8之實施例中,為減少印刷缺陷,接觸印章之幅材部分上之張力應維持在小於約10磅/直線吋(pli)。在一些實施例中,幅材上之張力應維持在約0.1至約5pli,或約0.1至約2pli,或約0.1至約1pli。 In the embodiments of Figures 5 through 8 above, to reduce printing defects, the tension on the portion of the web that contacts the stamp should be maintained at less than about 10 pounds per line pli. In some embodiments, the tension on the web should be maintained from about 0.1 to about 5 pli, or from about 0.1 to about 2 pli, or from about 0.1 to about 1 pli.

在圖5至8之一些實施例中,幅材102以約0.1至約50呎/分鐘(fpm)之速度移動。 In some of the embodiments of Figures 5 through 8, the web 102 is moved at a speed of from about 0.1 to about 50 mph.

在圖5至8之設備中,可藉由多種技術將壓印表面上墨。舉例而言,可將上面安裝有印章之印刷輥置放於上墨槽中且裝填包括至少一種官能化分子之油墨組合物。在此程序中,油墨組合物自「前側」注入印章中,前側在本文中係指包括圖案元件及接觸幅材表面之壓印表面的印章側。隨後自上墨槽移除經上墨之套管,且將裝有油墨之印刷輥裝載於製程線上。在印刷預定長度之幅材之後,移除用盡之印刷輥(此時其包括不足以在幅材上形成適合圖案的油墨)且在上墨槽中再上墨以供稍後再使用。 In the apparatus of Figures 5 through 8, the embossed surface can be inked by a variety of techniques. For example, a printing roll on which a stamp is mounted can be placed in an inking tank and filled with an ink composition comprising at least one functionalized molecule. In this procedure, the ink composition is injected into the stamp from the "front side", and the front side herein refers to the stamp side including the pattern element and the embossed surface contacting the surface of the web. The inked sleeve is then removed from the inking tank and the ink loaded printing roll is loaded onto the process line. After printing a predetermined length of web, the spent printing roll is removed (when it includes insufficient ink to form a suitable pattern on the web) and re-inked in the inking tank for later reuse.

較佳地,上墨時間(油墨裝填過程中印章與油墨接觸的時間)應儘可能短,同時仍產生具有充分印刷效能之上墨印章。油墨裝填後之乾燥時間儘可能短亦為理想的。此後兩種因素使得需要在高濃度下穩定且可在印章表面上快速乾燥的油墨組合物。自印章表面上快速蒸發油墨溶劑有助於在最少時間及施加增壓空氣的情況下達成硫醇分子均勻 分佈於印章上或印章內。對於浸沒上墨,目前較佳的是上墨時間少於約60分鐘,更佳少於約45分鐘,更佳少於約30分鐘,且甚至更佳少於約15分鐘。在取出並乾燥之後,上墨印章隨後可經置放與基板接觸,以便與印章之浮雕圖案化表面之升高區域接觸。有機硫化合物自印章擴散至基板表面上,其中該等有機硫化合物可形成SAM。 Preferably, the inking time (the time the stamp is in contact with the ink during the ink filling process) should be as short as possible while still producing an ink stamp with sufficient printing performance. It is also desirable to have a drying time after the ink is filled as short as possible. Thereafter, two factors make it necessary to have an ink composition which is stable at a high concentration and which can be quickly dried on the surface of the stamp. Rapid evaporation of ink solvent from the surface of the stamp helps to achieve uniform thiol molecules with minimal time and application of pressurized air Distributed on the seal or in the seal. For immersion inking, it is presently preferred that the inking time is less than about 60 minutes, more preferably less than about 45 minutes, more preferably less than about 30 minutes, and even more preferably less than about 15 minutes. After removal and drying, the inking stamp can then be placed in contact with the substrate to contact the raised regions of the embossed patterned surface of the stamp. The organic sulfur compound diffuses from the stamp onto the surface of the substrate, wherein the organic sulfur compounds form a SAM.

再參考圖5,舉例而言,所有上述上墨方法使得印章106之圖案化表面107被上墨,從而產生「上墨表面」。 Referring again to Figure 5, for example, all of the above inking methods cause the patterned surface 107 of the stamp 106 to be inked to create an "inking surface."

在上墨後,印章106適用於將包括官能化分子之油墨(諸如有機硫化合物)之圖案轉移至基板102之表面120。當印章106之上墨表面107包括壓印圖案元件之陣列時,上墨表面可與幅材表面120接觸以便將油墨圖案轉移至表面120,該幅材表面為基本上平坦的。轉移至表面120之油墨圖案基本上與印章106之上墨表面107之壓印圖案中的升高特徵之圖案相同。在此種製程中,據稱油墨圖案將對應於印章106之上墨表面107之壓印圖案而轉移。當印章106之上墨表面107基本上平坦時,上墨表面107可接觸包括浮雕圖案之表面120以便將油墨圖案轉移至表面120,其中該油墨圖案基本上與基板表面120之壓印圖案中之升高特徵之圖案相同。在此種製程中,據稱油墨圖案將對應於幅材102之表面120之浮雕圖案而轉移。 After inking, the stamp 106 is adapted to transfer a pattern of an ink comprising a functionalized molecule, such as an organic sulfur compound, to the surface 120 of the substrate 102. When the ink surface 107 of the stamp 106 includes an array of embossed pattern elements, the inking surface can be in contact with the web surface 120 to transfer the ink pattern to the surface 120, which web surface is substantially flat. The ink pattern transferred to surface 120 is substantially the same as the pattern of raised features in the embossed pattern of ink surface 107 above stamp 106. In such a process, it is said that the ink pattern will be transferred corresponding to the embossed pattern of the ink surface 107 on the stamp 106. When the ink surface 107 above the stamp 106 is substantially flat, the inking surface 107 can contact the surface 120 including the embossed pattern to transfer the ink pattern to the surface 120, wherein the ink pattern is substantially in the embossed pattern of the substrate surface 120 The pattern of the raised features is the same. In such a process, it is said that the ink pattern will be transferred corresponding to the relief pattern of the surface 120 of the web 102.

當印章106之上墨表面107包括第一浮雕圖案時,上墨表面可接觸幅材102之包括第二浮雕圖案之表面120以便轉移由第一浮雕圖案之升高特徵與第二浮雕圖案之升高特徵之間的接觸區域界定的油墨圖案(亦即,浮雕圖案之交互部分)。在此種製程中,據稱油墨圖案對應於兩種浮雕圖案而轉移。 When the ink surface 107 of the stamp 106 includes the first embossed pattern, the inking surface may contact the surface 120 of the web 102 including the second embossed pattern to transfer the raised features of the first embossed pattern and the second embossed pattern. The contact area between the high features defines an ink pattern (ie, an interactive portion of the embossed pattern). In such a process, the ink pattern is said to be transferred corresponding to the two relief patterns.

所需印刷時間(亦即,印章106與幅材102之表面120之間的接觸持續時間)將視各種因素而定,包括例如濃度或油墨溶液及施加於印章之壓力。在一些實施例中,印刷時間少於1分鐘(較佳少於約30秒;更 佳少於約10秒;最佳少於約5秒)。 The desired printing time (i.e., the duration of contact between the stamp 106 and the surface 120 of the web 102) will depend on various factors including, for example, the concentration or ink solution and the pressure applied to the stamp. In some embodiments, the printing time is less than 1 minute (preferably less than about 30 seconds; more Preferably less than about 10 seconds; optimally less than about 5 seconds).

參考圖9,為減少將印章再上墨所必需之製程及生產線停機時間,在以上圖5至8之實施例中之任一者中,印刷輥508可包括流體聯結器509以便將油墨連續擴散或者輸送至印章506之背側。在此實施例中,流體聯結器509可包括中空內部區域509A,該中空內部區域週期性地或連續地供應包括官能化分子之油墨組合物。該油墨組合物擴散至印刷輥508,印刷輥在此實施例中為由可滲透或高度多孔材料製造之轉鼓。輥508上之視情況存在之彈性體層511亦可滲透油墨組合物,該油墨組合物擴散至印章506之「背側」中。 Referring to Figure 9, in order to reduce the process and line downtime necessary to re-seal the stamp, in any of the above embodiments of Figures 5 through 8, the printing roller 508 can include a fluid coupler 509 for continuously diffusing the ink. Or delivered to the back side of the stamp 506. In this embodiment, the fluid coupler 509 can include a hollow interior region 509A that periodically or continuously supplies an ink composition comprising functionalized molecules. The ink composition diffuses to a printing roll 508, which in this embodiment is a drum made of a permeable or highly porous material. The elastomer layer 511, optionally present on the roller 508, can also penetrate the ink composition, which diffuses into the "back side" of the stamp 506.

儘管微接觸印刷為使用本文所述之印章組態來製造圖案化SAM之較佳方法,但亦可使用其他圖案化方法。用於使SAM圖案化之其他已知方法包括例如噴墨印刷、使用形成官能基梯度及表面形貌定向組裝。 Although microcontact printing is the preferred method of fabricating a patterned SAM using the stamp configuration described herein, other patterning methods can be used. Other known methods for patterning SAM include, for example, ink jet printing, using functionalized radical gradients and surface topography oriented assembly.

由本文所述之印章組態形成之圖案化SAM可用作例如在隨後圖案化步驟期間保護下層基板表面區域之抗蝕劑。舉例而言,圖案化SAM可提供蝕刻遮罩。作為蝕刻遮罩,保護經SAM覆蓋之基板表面區域(例如聚合物膜基板上之金屬塗層之表面)免受蝕刻劑之化學作用影響,而不保護未經SAM覆蓋之基板表面區域,從而允許選擇性移除未受保護之區域中的材料(例如自聚合物膜基板移除金屬)。或者,圖案化SAM可提供電鍍遮罩。作為電鍍遮罩,使得經SAM覆蓋之基板表面區域(例如聚合物膜基板上之催化金屬塗層之表面)在自無電極電鍍浴液沈積金屬時不具催化性,而未經SAM覆蓋之基板表面區域仍曝露且因此保持其催化活性,從而允許在未受保護之區域中選擇性置放無電極沈積之金屬。在使其他材料圖案化時塗覆圖案化SAM作為遮罩的方法為此項技術中(例如,美國專利第5,512,131號中)已知的。 The patterned SAM formed by the stamp configuration described herein can be used, for example, as a resist that protects the underlying substrate surface area during subsequent patterning steps. For example, a patterned SAM can provide an etch mask. As an etch mask, the surface area of the substrate covered by the SAM (for example, the surface of the metal coating on the polymer film substrate) is protected from the chemical action of the etchant, and the surface area of the substrate not covered by the SAM is protected, thereby allowing The material in the unprotected area is selectively removed (eg, metal is removed from the polymer film substrate). Alternatively, the patterned SAM can provide a plating mask. As a plating mask, the surface area of the substrate covered by the SAM (for example, the surface of the catalytic metal coating on the polymer film substrate) is not catalytic when depositing metal from the electrodeless plating bath, and the surface of the substrate not covered by the SAM The region is still exposed and thus maintains its catalytic activity, allowing selective placement of the electrodeless metal in the unprotected region. A method of applying a patterned SAM as a mask when patterning other materials is known in the art (for example, in U.S. Patent No. 5,512,131).

將關於以下詳細實例進一步描述本發明之各種實施例之操作。 The operation of various embodiments of the present invention will be further described with respect to the following detailed examples.

實例Instance

以下實例僅用於說明性目的而非意在過度限制所附申請專利範圍之範疇。儘管闡述本發明之廣泛範疇的數值範圍及參數為近似值,但已儘可能精確地報導特定實例中所闡述之數值。然而,任何數值固有地含有由其各別測試量測值中所存在之標準差而必然產生的某些誤差。絲毫不打算限制均等論對於申請專利範圍之範疇的應用,各數值參數至少應根據所報導之有效數位的數目且藉由應用一般捨入技術解釋。 The following examples are for illustrative purposes only and are not intended to unduly limit the scope of the appended claims. Notwithstanding that the numerical ranges and parameters set forth in the broad scope of the present invention are approximations, the values set forth in the particular examples have been reported as much as possible. However, any numerical value inherently contains certain errors necessarily resulting from the standard deviations that are present in the respective test measurement. In no way is meant to limit the application of the theory of equalization to the scope of the patent application, the numerical parameters being interpreted at least in accordance with the number of significant digits reported and by applying the general rounding technique.

除非另外說明,否則實例及本說明書其餘部分中所提供之所有份數、百分比、比率以及其類似物均以重量計。所使用之溶劑及其他試劑可獲自Sigma-Aldrich Chemical Company(Milwaukee,WI)。 All parts, percentages, ratios, and analogs thereof, as provided by the examples and the remainder of the specification, are by weight unless otherwise indicated. The solvents and other reagents used are available from Sigma-Aldrich Chemical Company (Milwaukee, WI).

實例1Example 1

高縱橫比印章母板係獲自Infinite Graphics Inc.(IGI)(St.Paul,MN)。IGI藉由在玻璃上旋塗5微米光阻劑層且使用灰色微影術使具有梯形橫截面之圖案元件成像來建造母板。藉由標準製程來製造印章母板之環氧樹脂複本(副板),該標準製程包括製造印章母板之聚(二甲基矽氧烷)(PDMS)負版及與該負版相抵澆鑄環氧樹脂。藉由在環氧樹脂副板上澆鑄未固化PDMS並且固化來製造PDMS印章。 High aspect ratio stamp masters were obtained from Infinite Graphics Inc. (IGI) (St. Paul, MN). The IGI builds the master by spin coating a 5 micron photoresist layer on the glass and imaging the patterned elements having a trapezoidal cross section using gray lithography. The epoxy resin replica (sub-plate) of the stamp master is manufactured by a standard process including a poly(dimethyl methoxide) (PDMS) negative plate for manufacturing a stamp master and a casting ring opposite to the negative plate Oxygen resin. The PDMS stamp was fabricated by casting uncured PDMS on an epoxy sub-plate and curing.

PDMS印章上之圖案元件具有梯形橫截面形狀,其底部寬度為5.6至7.8μm,壁角為20°至30°,高度h為5μm,且壓印表面之寬度w為2μm,從而獲得約2.5之縱橫比(參見例如圖2)。此印章在下文中稱為高縱橫比印章。 The pattern element on the PDMS stamp has a trapezoidal cross-sectional shape with a bottom width of 5.6 to 7.8 μm, a wall angle of 20° to 30°, a height h of 5 μm, and a width w of the imprinted surface of 2 μm, thereby obtaining about 2.5. Aspect ratio (see for example Figure 2). This seal is hereinafter referred to as a high aspect ratio seal.

製備類似PDMS印章,其中壓印表面之寬度w為2μm且高度h為2μm,由此獲得約0.8之縱橫比。此印章在下文中將稱為低縱橫比印章。 A PDMS-like stamp was prepared in which the embossed surface had a width w of 2 μm and a height h of 2 μm, thereby obtaining an aspect ratio of about 0.8. This seal will hereinafter be referred to as a low aspect ratio seal.

藉由包括官能化分子之油墨組合物使低縱橫比及高縱橫比PDMS 印章飽和,且隨後轉移至半徑為9吋(約23cm)之備用印刷輥。如以下表1至2中所示,一些印章安裝在標準固體空轉輥上且一些安裝在空氣套管上,該空氣套管為浮在空氣層上之薄金屬殼。如以下表1至2中所示,在一些運作中,將印章直接安裝在備用輥上,而對於其他運作,在輥與印章之間置放泡沫層。泡沫為以商標名3M Cushion-Mount Plus Plate Mounting Tape,1120 Tan獲自3M,St.Paul,MN之彈性體材料。 Low aspect ratio and high aspect ratio PDMS by ink composition including functionalized molecules The stamp is saturated and then transferred to a spare printing roll having a radius of 9 吋 (about 23 cm). As shown in Tables 1 to 2 below, some of the stamps were mounted on standard solid idle rollers and some were mounted on air jackets, which were thin metal shells floating on the air layer. As shown in Tables 1 to 2 below, in some operations, the stamp is mounted directly on the backup roll, while for other operations, a foam layer is placed between the roll and the stamp. The foam was obtained from 3M Cushion-Mount Plus Plate Mounting Tape, 1120 Tan from 3M, St. Paul, MN.

用PDMS印章將油墨組合物塗覆於約100nm之經銀塗佈之PET(可以商標名ST504獲自E.I.DuPont de Nemours,Wilmington,DE)。如以下表1至2中所示,幅材基板相對於印章以15呎/分鐘(fpm)及25fpm之速度移動,且施加1或2磅/直線吋(pli)之不同幅材張力以便在基板表面上形成SAM。評估各壓印圖案以確定是觀察到線加寬(Y)、未觀察到線加寬(N)或是結果不確定(X)。 The ink composition was applied to a silver coated PET of about 100 nm using a PDMS stamp (available under the trade designation ST504 from E.I. DuPont de Nemours, Wilmington, DE). As shown in Tables 1 to 2 below, the web substrate was moved at a speed of 15 ft/min (fpm) and 25 fpm with respect to the stamp, and different web tensions of 1 or 2 lbs/pli were applied to the substrate. A SAM is formed on the surface. Each embossed pattern was evaluated to determine whether line broadening (Y), no line broadening (N), or uncertainty (X) was observed.

由各PDMS印章產生之所得SAM具有六邊形圖案。如表1至2中所示,可觀察到用高縱橫比印章印刷之圖案具有顯著減少之印刷線加寬、較少與截留粒子相關之缺陷數且能夠在較高速度下印刷而不產生具有缺失印刷之區域。 The resulting SAM produced by each PDMS stamp has a hexagonal pattern. As shown in Tables 1 through 2, it can be observed that the pattern printed with the high aspect ratio stamp has a significantly reduced print line broadening, less defect count associated with the entrapped particles, and can be printed at higher speeds without having Missing printed area.

與低縱橫比印章相比,高縱橫比印章亦允許較高印刷速度而無與空氣夾雜相關之缺陷。通常,高於臨界印刷速度時,印刷圖案之一部分消失,因為印章不再與基板接觸。 High aspect ratio stamps also allow for higher print speeds without the drawbacks associated with air inclusions than low aspect ratio seals. Typically, above the critical printing speed, one of the printed patterns partially disappears because the stamp is no longer in contact with the substrate.

以下表3展示低縱橫比PDMS印章(2μm高度h)與高縱橫比PDMS印章(5μm高度h)之間的許多空氣夾雜相關缺陷的比較。在15fpm印刷速度下,低縱橫比印章顯示14個缺陷,而高縱橫比印章具有4個或0個缺陷。 Table 3 below shows a comparison of many air inclusion related defects between a low aspect ratio PDMS stamp (2 μm height h ) and a high aspect ratio PDMS stamp (5 μm height h ). At 15 fpm printing speed, the low aspect ratio stamp shows 14 defects, while the high aspect ratio stamp has 4 or 0 defects.

高縱橫比印章亦減少與存在塵垢粒子相關之缺陷。以下表3展示當使用高縱橫比印章時,可能歸因於顆粒的重複缺陷數目自3降至1或2。 High aspect ratio seals also reduce defects associated with the presence of dirt particles. Table 3 below shows that when a high aspect ratio seal is used, the number of repeated defects that may be attributed to the particles is reduced from 3 to 1 or 2.

實例2Example 2

在卷對卷微接觸印刷製程期間,具有彈性體印章之輥與第二輥上之基板接觸。印章及基板未必正常接觸,因為兩個輥以不同的速度移動,造成基板相對於印章移動,由此在印章表面及其壓印元件上產生拖曳力。若超過臨限摩擦值,則印章會滑動,由此造成印刷解析度缺陷。開發有限元素模型(Finite Element model)以模擬該印刷製程並計算印章上之拖曳力之量值。模型化結果補充以上實例1中之結果, 且顯示較高浮雕印章在減輕滑動對缺陷形成之效應方面的優勢。 During the roll-to-roll microcontact printing process, the roll having the elastomeric stamp is in contact with the substrate on the second roll. The stamp and the substrate are not necessarily in normal contact because the two rollers move at different speeds, causing the substrate to move relative to the stamp, thereby creating drag on the stamp surface and its stamping elements. If the threshold friction value is exceeded, the stamp will slide, resulting in a defective print resolution. A Finite Element Model was developed to simulate the printing process and calculate the amount of drag on the stamp. The modeled results complement the results in Example 1 above. It also shows the advantage of the higher relief stamp in reducing the effect of sliding on defect formation.

使用ANSYS 12.1市售軟體(獲自ANSYS Inc.,Canonsburg,PA)製造2D印章橫截面模型。模型構造包括安裝於印刷輥之500微米泡沫黏著劑及5mm印章1"寬,其中壓印元件之間存在300微米間距。壓印元件具有楔形梯形橫截面形狀(圖2),垂直角θ為13.5°。底部寬度為1.3μm。吾等使用三種不同的高度h,即2.5、5及15μm來改變縱橫比。印章表面之示意性視圖示於圖10中。 A 2D seal cross-section model was fabricated using ANSYS 12.1 commercial software (available from ANSYS Inc., Canonsburg, PA). The model construction consisted of a 500 micron foam adhesive mounted on a printing roll and a 1 mm wide 5 mm stamp with 300 micron spacing between the embossed elements. The embossing element has a wedge shaped trapezoidal cross-sectional shape (Fig. 2) with a vertical angle θ of 13.5. The bottom width is 1.3 μm. We used three different heights h , namely 2.5, 5 and 15 μm to change the aspect ratio. A schematic view of the stamp surface is shown in Figure 10.

在另一實例中,該等特徵為具有矩形橫截面形狀而非楔形梯形形狀之圓柱體。將印刷基板模型化為施加負載之剛性表面。將兩種類型負載模型化:第一種具有0.25pli夾持壓(N.P.),而第二種包括N.P.及2μm平行於基板移動方向之相對位移。該模型假定在負載期間壓印元件不與幅材脫離(接觸元件之「標準接觸」行為)。 In another example, the features are cylinders having a rectangular cross-sectional shape rather than a wedge-shaped trapezoidal shape. The printed substrate is modeled as a rigid surface to which the load is applied. Two types of loads were modeled: the first with a 0.25 pli clamping pressure (N.P.) and the second with N.P. and 2 μm parallel to the relative displacement of the substrate. The model assumes that the imprinting element does not detach from the web during loading (the "standard contact" behavior of the contact element).

使用NeoHookean材料模型,其中印章之即時剪切模數G=896kPa及使用Blatz-Ko可壓縮泡沫模型,其中G=876kPa,使泡沫安裝及印章兩者均模型化為超彈性材料。 A NeoHookean material model was used in which the instant shear modulus of the stamp was G = 896 kPa and the Blatz-Ko compressible foam model, where G = 876 kPa, was used to model both the foam mount and the stamp as a superelastic material.

吾等發現h值愈小,負載產生之彎曲愈少,且壓印元件之總體橫向移動愈多。 We have found that the smaller the h value, the less bending the load produces and the more lateral movement of the imprinting element.

圖11為每吋寬度所產生之拖曳力相對於基板位移的圖。此圖顯示若拖曳力超過該等特徵與基板之間的最大乾摩擦力,則該等特徵可能滑動返回其原始位置,由此將產生較寬之印刷線。藉由使用較高縱橫比壓印元件來降低此可能性。 Figure 11 is a graph of the drag force produced per 吋 width relative to the substrate displacement. This figure shows that if the drag force exceeds the maximum dry friction between the features and the substrate, the features may slide back to their original position, thereby creating a wider printed line. This possibility is reduced by using higher aspect ratio imprinting elements.

模型化結果顯示微接觸印刷印章上之壓印元件經歷壓縮與彎曲兩者。高縱橫比元件經歷較小力而變形,由此降低其在基板上滑動從而造成不良印刷解析度之可能性。圓柱形桿在結構上高度不穩定且更可能與基板失去接觸,由此可能在印刷SAM圖案中跳過數列。 The modeling results show that the imprinting elements on the microcontact printing stamp undergo both compression and bending. The high aspect ratio component undergoes a small force to deform, thereby reducing its likelihood of sliding on the substrate resulting in poor print resolution. Cylindrical rods are structurally highly unstable and are more likely to lose contact with the substrate, thereby possibly skipping the series in the printed SAM pattern.

在本說明書中,提及「一個實施例」、「某些實施例」、「一或多 個實施例」或「一實施例」不管術語「實施例」之前是否包括術語「例示性」均意謂結合該實施例所描述之特定特徵、結構、材料或特性包括在本發明之至少一個實施例中。因而,在本說明書中不同位置出現之短語,諸如「在一或多個實施例中」、「在某些實施例中」、「在一個實施例中」或「在一實施例中」未必係指本發明之同一實施例。另外,在一或多個實施例中,該等特定特徵、結構、材料或特性可以任何適合之方式組合。 In this specification, reference is made to "one embodiment", "some embodiments", "one or more The use of the term "exemplary" before the term "embodiment" means that the specific features, structures, materials or characteristics described in connection with the embodiment are included in at least one implementation of the invention. In the example. Thus, phrases such as "in one embodiment", "in some embodiments", "in one embodiment" or "in an embodiment" Means the same embodiment of the invention. In addition, the particular features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments.

儘管本說明書已詳細描述某些例示性實施例,但應瞭解熟習此項技術者在理解前述內容後可容易地設想此等實施例之變更、改變及等效形式。因此,應理解本發明不應過度受限於上文所闡述之說明性實施例。此外,本文提及之所有公開案、公開專利申請案及頒予專利係以全文引用的方式併入本文中,引用程度就如同已特定且個別地指示將各個別公開案或專利以引用的方式併入一般。 Although the present invention has been described in detail with reference to the preferred embodiments of the present invention, it will be understood that Therefore, it should be understood that the invention is not to be construed as being limited to the illustrative embodiments set forth herein. In addition, all publications, published patent applications, and patents cited herein are hereby incorporated by reference in their entirety in their entirety in the extent of the extent Incorporate in general.

已描述了各種例示性實施例。此等及其他實施例處於以下申請專利範圍之範疇內。 Various illustrative embodiments have been described. These and other embodiments are within the scope of the following claims.

Claims (74)

一種微接觸印刷方法,其包含:自支撐物上退繞幅材;提供彈性體印章,其中該印章係安裝在具有由浮在空氣層上之金屬殼製造之空氣支撐套管的印刷輥上,進一步其中該印章包含底部表面及具有梯形橫截面形狀且遠離該底部表面延伸之圖案元件排列,其中各圖案元件包含橫向尺寸小於5微米之壓印表面及相對於該底部表面之高度,且其中該高度與該橫向尺寸之縱橫比為至少1.5;用包含官能化分子之油墨組合物將該等圖案元件之該等壓印表面上墨,其中該官能化分子包含經選擇以結合於該幅材之官能基;及使該等圖案元件之壓印表面與該幅材之主表面接觸,持續足以使該官能基與該幅材結合以便在該幅材之該主表面上形成該官能化分子之自組裝單層(SAM)的印刷時間,該自組裝單層對應於該壓印表面上之該圖案元件排列。 A microcontact printing method comprising: unwinding a web from a support; providing an elastomeric stamp, wherein the stamp is mounted on a printing roll having an air bearing sleeve made of a metal shell floating on the air layer, Further wherein the stamp comprises a bottom surface and a pattern element arrangement having a trapezoidal cross-sectional shape and extending away from the bottom surface, wherein each pattern element comprises an embossed surface having a lateral dimension of less than 5 microns and a height relative to the bottom surface, and wherein An aspect ratio of height to the transverse dimension of at least 1.5; inking the embossed surfaces of the pattern elements with an ink composition comprising functionalized molecules, wherein the functionalized molecules comprise a binder selected for binding to the web a functional group; and contacting the embossed surface of the pattern elements with the major surface of the web for a period of time sufficient to bond the functional group to the web to form the functionalized molecule on the major surface of the web The printing time of the assembled single layer (SAM) corresponding to the pattern element arrangement on the embossed surface. 如請求項1之方法,其進一步包含自該幅材之該主表面移除該壓印表面。 The method of claim 1, further comprising removing the embossed surface from the major surface of the web. 如請求項1之方法,其中該等圖案元件之該縱橫比為1.5至5.0。 The method of claim 1, wherein the aspect ratio of the pattern elements is from 1.5 to 5.0. 如請求項1之方法,其中該等圖案元件之該縱橫比為1.5至3.0。 The method of claim 1, wherein the aspect ratio of the pattern elements is from 1.5 to 3.0. 如請求項1之方法,其中該等圖案元件之該縱橫比為1.5至2.0。 The method of claim 1, wherein the aspect ratio of the pattern elements is from 1.5 to 2.0. 如請求項1之方法,其中該幅材以至少10呎/分鐘之速度移動。 The method of claim 1, wherein the web is moved at a speed of at least 10 呎/min. 如請求項1之方法,其中該幅材以10呎/分鐘至30呎/分鐘之速度移動。 The method of claim 1, wherein the web is moved at a speed of 10 呎/min to 30 呎/min. 如請求項1之方法,其中該幅材以10呎/分鐘至20呎/分鐘之速度 連續移動。 The method of claim 1, wherein the web is at a speed of from 10 呎/min to 20 呎/min. Move continuously. 如請求項1之方法,其中該等圖案元件具有橫向尺寸為1微米至5微米之壓印表面。 The method of claim 1, wherein the pattern elements have an embossed surface having a lateral dimension of from 1 micron to 5 microns. 如請求項1之方法,其中該等圖案元件具有橫向尺寸小於1微米之壓印表面。 The method of claim 1 wherein the pattern elements have an embossed surface having a lateral dimension of less than 1 micron. 如請求項1之方法,其中該壓印表面包含橫向尺寸為0.25微米至1微米之圖案元件。 The method of claim 1, wherein the embossed surface comprises a pattern element having a lateral dimension of from 0.25 micron to 1 micron. 如請求項1之方法,其中該印刷時間小於10秒。 The method of claim 1, wherein the printing time is less than 10 seconds. 如請求項1之方法,其中該幅材表面上之該SAM之厚度小於50Å。 The method of claim 1, wherein the thickness of the SAM on the surface of the web is less than 50 Å. 如請求項1之方法,其中該壓印表面包含聚(二甲基矽氧烷)。 The method of claim 1, wherein the embossed surface comprises poly(dimethyloxane). 如請求項1之方法,其中該官能化分子為有機硫化合物。 The method of claim 1, wherein the functionalized molecule is an organosulfur compound. 如請求項15之方法,其中該有機硫化合物係選自烷基硫醇及芳基硫醇中之至少一者。 The method of claim 15, wherein the organosulfur compound is selected from at least one of an alkylthiol and an arylthiol. 如請求項16之方法,其中該有機硫化合物為烷基硫醇。 The method of claim 16, wherein the organosulfur compound is an alkyl mercaptan. 如請求項1之方法,其中該官能化分子上之該官能基包含硫醇。 The method of claim 1, wherein the functional group on the functionalized molecule comprises a thiol. 如請求項1之方法,其中該幅材之該主表面為金屬。 The method of claim 1, wherein the major surface of the web is a metal. 如請求項19之方法,其中該金屬為銀。 The method of claim 19, wherein the metal is silver. 如請求項1之方法,其中該等圖案元件在該印章之該底部表面上形成連續陣列。 The method of claim 1, wherein the pattern elements form a continuous array on the bottom surface of the stamp. 如請求項1之方法,其中該等圖案元件在該印章之該底部表面上形成規則陣列。 The method of claim 1, wherein the pattern elements form a regular array on the bottom surface of the stamp. 如請求項1之方法,其中該等圖案元件形成篩網。 The method of claim 1, wherein the pattern elements form a screen. 如請求項23之方法,其中該篩網具有介於90%與99.75%之間的開放區域分數。 The method of claim 23, wherein the screen has an open area fraction of between 90% and 99.75%. 如請求項23之方法,其中該篩網具有介於95%與99.5%之間的開 放區域分數。 The method of claim 23, wherein the screen has an opening between 95% and 99.5% Put the area score. 如請求項23之方法,其中該篩網為方格。 The method of claim 23, wherein the screen is a square. 如請求項23之方法,其中該篩網為六邊形篩網。 The method of claim 23, wherein the screen is a hexagonal screen. 如請求項23之方法,其中該篩網具有偽隨機幾何形狀。 The method of claim 23, wherein the screen has a pseudo-random geometry. 如請求項23之方法,其中該等圖案元件為彎曲跡線。 The method of claim 23, wherein the pattern elements are curved traces. 如請求項23之方法,其中該等圖案元件為筆直跡線。 The method of claim 23, wherein the pattern elements are straight traces. 如請求項1之方法,其中該壓印表面為實質上平坦的且包含由凹槽隔開之圖案元件之規則陣列。 The method of claim 1 wherein the embossed surface is substantially planar and comprises a regular array of pattern elements separated by grooves. 如請求項1之方法,其中該幅材係在第一支撐物與第二支撐物之間拉伸,且其中介於該第一支撐物與該第二支撐物之間的該幅材中之張力為至少0.5磅/直線吋。 The method of claim 1, wherein the web is stretched between the first support and the second support, and wherein the web is between the first support and the second support The tension is at least 0.5 lbs/straight 吋. 如請求項1之方法,其中該幅材之該表面包含無SAM區域,且該方法進一步包含蝕刻該等無SAM區域。 The method of claim 1, wherein the surface of the web comprises a SAM free region, and the method further comprises etching the SAM free regions. 如請求項1之方法,其中該印章係安裝在印刷輥上。 The method of claim 1, wherein the stamp is mounted on a printing roll. 如請求項34之方法,其進一步包含介於該印刷輥與該印章之間的泡沫材料層。 The method of claim 34, further comprising a layer of foam material between the printing roll and the stamp. 如請求項34之方法,其中該印刷輥為圓柱形。 The method of claim 34, wherein the printing roller is cylindrical. 如請求項36之方法,其中該印章之曲率半徑介於2公分與50公分之間。 The method of claim 36, wherein the stamp has a radius of curvature between 2 cm and 50 cm. 如請求項36之方法,其中該印章之曲率半徑介於5公分與25公分之間。 The method of claim 36, wherein the stamp has a radius of curvature between 5 cm and 25 cm. 如請求項34之方法,其中該印刷輥旋轉與該幅材移動同步進行。 The method of claim 34, wherein the printing roller rotation is performed in synchronization with the web movement. 一種微接觸印刷方法,其包含:在第一輥與第二輥之間用至少0.1磅/直線吋之張力拉伸幅材,其中該幅材以大於10呎/分鐘之速度移動; 將彈性體聚合物印章安裝在具有由浮在空氣層上之金屬殼製造之空氣支撐套管的印刷輥上,進一步其中該印章包含底部表面及具有梯形橫截面形狀且在該底部表面以上延伸之圖案元件排列,其中該等圖案元件各自包含實質上平坦之橫向尺寸為0.25微米至5微米之壓印表面及相對於該底部表面之高度,且其中該高度與該橫向尺寸之縱橫比為1.5至5.0;用包含有機硫化合物之油墨組合物將該壓印表面上墨;使該壓印表面與介於該第一輥與該第二輥之間的該幅材之主表面接觸0.1秒至30秒之印刷時間,以使得該有機硫化合物上之官能基結合於該幅材之該主表面,以便在該主表面上提供該有機硫化合物之自組裝單層(SAM),該自組裝單層對應於該壓印表面上之該圖案元件排列;及自該幅材之該主表面移除該壓印表面。 A microcontact printing method comprising: stretching a web between a first roll and a second roll with a tension of at least 0.1 pounds per linear nip, wherein the web moves at a speed greater than 10 Å/min; Mounting an elastomeric polymer stamp on a printing roll having an air bearing sleeve made of a metal shell floating on an air layer, further wherein the stamp comprises a bottom surface and has a trapezoidal cross-sectional shape and extends above the bottom surface a pattern element arrangement, wherein the pattern elements each comprise a substantially flat embossed surface having a lateral dimension of from 0.25 micron to 5 microns and a height relative to the bottom surface, and wherein the aspect ratio of the height to the lateral dimension is 1.5 to 5.0; inking the imprinted surface with an ink composition comprising an organosulfur compound; contacting the imprinted surface with a major surface of the web between the first roll and the second roll for 0.1 second to 30 a printing time of seconds such that a functional group on the organosulfur compound is bonded to the major surface of the web to provide a self-assembled monolayer (SAM) of the organosulfur compound on the major surface, the self-assembled monolayer Corresponding to the arrangement of the pattern elements on the embossed surface; and removing the embossed surface from the major surface of the web. 如請求項40之方法,其進一步包含介於該印章與該印刷輥之間的彈性體材料層。 The method of claim 40, further comprising a layer of elastomeric material between the stamp and the printing roll. 如請求項40之方法,其中該等圖案元件之該縱橫比為1.5至3.0。 The method of claim 40, wherein the aspect ratio of the pattern elements is from 1.5 to 3.0. 如請求項40之方法,其中該幅材在該第一輥與該第二輥之間以10呎/分鐘至30呎/分鐘之速度移動。 The method of claim 40, wherein the web is moved between the first roll and the second roll at a speed of 10 Torr/min to 30 呎/min. 如請求項40之方法,其中該等圖案元件具有橫向尺寸為1微米至5微米之壓印表面。 The method of claim 40, wherein the pattern elements have an embossed surface having a lateral dimension of from 1 micron to 5 microns. 如請求項40之方法,其中該等圖案元件具有橫向尺寸小於1微米之壓印表面。 The method of claim 40, wherein the pattern elements have an embossed surface having a lateral dimension of less than 1 micron. 如請求項40之方法,其中該等圖案元件具有橫向尺寸為0.25微米至1微米之壓印表面。 The method of claim 40, wherein the pattern elements have an embossed surface having a lateral dimension of from 0.25 micron to 1 micron. 如請求項40之方法,其中該印刷時間小於10秒。 The method of claim 40, wherein the printing time is less than 10 seconds. 如請求項40之方法,其中該壓印表面包含聚(二甲基矽氧烷)。 The method of claim 40, wherein the embossed surface comprises poly(dimethyloxane). 如請求項40之方法,其中該油墨組合物包含烷基硫醇化合物。 The method of claim 40, wherein the ink composition comprises an alkyl thiol compound. 如請求項40之方法,其中該油墨組合物進一步包含有機溶劑。 The method of claim 40, wherein the ink composition further comprises an organic solvent. 如請求項40之方法,其中該幅材之該主表面為金屬。 The method of claim 40, wherein the major surface of the web is metal. 如請求項40之方法,其中該幅材之該主表面包含無SAM區域,且該方法進一步包含蝕刻該等無SAM區域。 The method of claim 40, wherein the major surface of the web comprises a SAM free region, and the method further comprises etching the SAM free regions. 如請求項40之方法,其中該等圖案元件形成篩網。 The method of claim 40, wherein the pattern elements form a screen. 如請求項53之方法,其中該篩網具有介於90%與99.75%之間的開放區域分數。 The method of claim 53, wherein the screen has an open area fraction of between 90% and 99.75%. 如請求項53之方法,其中該篩網具有介於95%與99.5%之間的開放區域分數。 The method of claim 53, wherein the screen has an open area fraction of between 95% and 99.5%. 如請求項53之方法,其中該篩網為方格。 The method of claim 53, wherein the screen is a square. 如請求項53之方法,其中該篩網為六邊形篩網。 The method of claim 53, wherein the screen is a hexagonal screen. 如請求項53之方法,其中該篩網具有偽隨機幾何形狀。 The method of claim 53, wherein the screen has a pseudo-random geometry. 如請求項53之方法,其中該等圖案元件為彎曲跡線。 The method of claim 53, wherein the pattern elements are curved traces. 如請求項53之方法,其中該等圖案元件為筆直跡線。 The method of claim 53, wherein the pattern elements are straight traces. 一種微接觸印刷方法,其包含:自支撐輥上退繞幅材,其中該幅材以大於10呎/分鐘之速度移動;將聚(二甲基矽氧烷)印章安裝在具有由浮在空氣層上之金屬殼製造之空氣支撐套管的印刷輥上,其中該印章包含實質上平坦之底部表面及具有梯形橫截面形狀且在該底部表面以上延伸之圖案元件之連續規則陣列,其中該等圖案元件各自具有實質上平坦之橫向尺寸為0.25微米至5微米之壓印表面及相對於該底部表面之高度,且其中該高度與該橫向尺寸之縱橫比為1.5至5.0;用包含有機硫化合物及有機溶劑之油墨組合物將該壓印表面上墨; 使該壓印表面與該幅材之主表面接觸0.1秒至30秒之印刷時間,以使得該有機硫化合物上之硫醇官能基結合於該幅材之該主表面,以便在該主表面上提供該有機硫化合物之自組裝單層(SAM),該自組裝單層對應於該壓印表面上之圖案元件之該陣列,其中與由包含具有梯形橫截面形狀及小於1.5之縱橫比之圖案元件的聚(二甲基矽氧烷)印章產生之SAM相比,該SAM包含以下各項中之任一者之經降低之發生率:(1)重複缺陷;及(2)空氣夾雜缺陷;及自該幅材之該主表面移除該壓印表面。 A microcontact printing method comprising: unwinding a web from a self-supporting roll, wherein the web moves at a speed greater than 10 Å/min; mounting the poly(dimethyl methoxy oxyalkylene) stamp on having a floating air a printing roll of an air bearing sleeve made of a metal shell on a layer, wherein the stamp comprises a substantially flat bottom surface and a continuous regular array of pattern elements having a trapezoidal cross-sectional shape and extending above the bottom surface, wherein The pattern elements each have a substantially flat embossed surface having a lateral dimension of from 0.25 micron to 5 microns and a height relative to the bottom surface, and wherein the aspect ratio of the height to the lateral dimension is from 1.5 to 5.0; comprising an organic sulfur compound And an ink composition of an organic solvent for inking the embossed surface; Contacting the embossed surface with the major surface of the web for a printing time of from 0.1 second to 30 seconds such that a thiol functional group on the organosulfur compound is bonded to the major surface of the web to be on the major surface Providing a self-assembled monolayer (SAM) of the organosulfur compound corresponding to the array of pattern elements on the embossed surface, wherein the pattern comprises an aspect ratio having a trapezoidal cross-sectional shape and an aspect ratio of less than 1.5 The SAM comprises a reduced incidence of any of the following: a (1) repeating defect; and (2) an air inclusion defect compared to a SAM produced by a poly(dimethyloxane) seal of the component; And removing the embossed surface from the major surface of the web. 一種微接觸印刷系統,其包含:第一輥及第二輥,及在該第一輥與該第二輥之間拉伸的移動幅材;彈性體印章,其係安裝在具有由浮在空氣層上之金屬殼製造之空氣支撐套管的輥上且與介於該第一輥與該第二輥之間的該幅材接觸,其中該印章包含底部表面及具有梯形橫截面形狀且在該底部表面以上延伸之圖案元件排列,其中該等圖案元件各自包含實質上平坦之橫向尺寸為0.25微米至5微米之壓印表面及相對於該底部表面之高度,且其中該高度與該橫向尺寸之縱橫比為1.5至5.0;及設備,其係用於利用具有經選擇以結合於該幅材之主表面之硫醇官能基的有機硫化合物將該壓印表面上墨,以便在該主表面上形成自組裝單層(SAM),該自組裝單層對應於該壓印表面上之該圖案元件排列。 A microcontact printing system comprising: a first roller and a second roller, and a moving web stretched between the first roller and the second roller; an elastomeric stamp mounted on the air having a float a roll of an air bearing sleeve made of a metal shell on the layer and in contact with the web between the first roll and the second roll, wherein the stamp comprises a bottom surface and has a trapezoidal cross-sectional shape and a pattern element extending above the bottom surface, wherein the pattern elements each comprise a substantially flat embossed surface having a lateral dimension of 0.25 micron to 5 microns and a height relative to the bottom surface, and wherein the height and the lateral dimension An aspect ratio of 1.5 to 5.0; and apparatus for inking the embossed surface with an organosulfur compound having a thiol functional group selected to bind to a major surface of the web to be on the major surface A self-assembled monolayer (SAM) is formed that corresponds to the pattern element arrangement on the embossed surface. 如請求項62之系統,其進一步包含介於該輥與該印章之間的黏著層。 The system of claim 62, further comprising an adhesive layer between the roller and the stamp. 如請求項63之系統,其進一步包含介於該黏著層與該印章之間 的彈性體材料層。 The system of claim 63, further comprising between the adhesive layer and the seal Layer of elastomeric material. 如請求項62之系統,其中該印章係安裝在空氣支撐套管上。 The system of claim 62, wherein the stamp is mounted on an air bearing sleeve. 如請求項62之系統,其中該輥連續裝填該油墨組合物。 The system of claim 62, wherein the roller continuously fills the ink composition. 如請求項62之系統,其中該印章包含聚(二甲基矽氧烷)。 The system of claim 62, wherein the seal comprises poly(dimethyloxane). 如請求項62之系統,其中該等圖案元件形成篩網。 The system of claim 62, wherein the pattern elements form a screen. 如請求項68之系統,其中該篩網具有介於90%與99.75%之間的開放區域分數。 The system of claim 68, wherein the screen has an open area score between 90% and 99.75%. 如請求項68之系統,其中該篩網具有介於95%與99.5%之間的開放區域分數。 The system of claim 68, wherein the screen has an open area score between 95% and 99.5%. 如請求項68之系統,其中該篩網為方格。 The system of claim 68, wherein the screen is a square. 如請求項68之系統,其中該篩網為六邊形篩網。 The system of claim 68, wherein the screen is a hexagonal screen. 如請求項68之系統,其中該篩網具有偽隨機幾何形狀。 The system of claim 68, wherein the screen has a pseudo-random geometry. 如請求項68之系統,其中該等圖案元件為彎曲跡線。 The system of claim 68, wherein the pattern elements are curved traces.
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