TWI652484B - Probe card on line needle tuning repair system and method thereof - Google Patents
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- 239000000523 sample Substances 0.000 title claims abstract description 159
- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000004140 cleaning Methods 0.000 claims description 57
- 238000003825 pressing Methods 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 239000011148 porous material Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 4
- 238000012423 maintenance Methods 0.000 claims description 3
- 230000001464 adherent effect Effects 0.000 claims 1
- 230000001066 destructive effect Effects 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 230000002427 irreversible effect Effects 0.000 description 3
- 238000011109 contamination Methods 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- Measuring Leads Or Probes (AREA)
Abstract
一種探針卡線上調針維修方法,該探針卡係經一預定時間使用,該探針卡線上調針維修方法之步驟包含有:擷取第一影像資訊,一第一影像擷取單元擷取一探針卡之複數個探針的一第一影像資訊,並將該第一影像資訊提供給一控制單元;擷取第二影像資訊,一第二影像擷取單元擷取該些探針的一第二影像資訊,並將該第二影像資訊提供給該控制單元;找出變形量,該控制單元依據該第一影像資訊與該第二影像資訊,以找出各探針之變形量。A method for repairing a needle on a probe card line, wherein the probe card is used for a predetermined time, and the step of adjusting the needle on the probe card line includes: capturing the first image information, and first image capturing unit Taking a first image information of a plurality of probes of a probe card, and providing the first image information to a control unit; capturing the second image information, and capturing, by the second image capturing unit, the probes a second image information, and the second image information is provided to the control unit; the amount of deformation is determined, and the control unit determines the deformation amount of each probe according to the first image information and the second image information. .
Description
一種探針卡線上調針維修系統及其方法,尤指一種利用影像擷取單元擷取探針卡之探針於不同軸向的影像資訊,再藉由判讀該影像資訊,以即時找出探針之變形量。 A probe card line adjustment system and method thereof, in particular, an image capture unit is used to capture probe information of a probe card in different axial directions, and then the image information is interpreted to instantly find out The amount of deformation of the needle.
現行的探針量測機台係利用探針卡的探針接觸待測物,再藉由所回饋的導電性,而得知待測物是否異常。然於多次量測後,對同一位置產生有重複性錯誤時,此時才會反應探針之位置狀態可能有問題。 The current probe measuring machine uses the probe of the probe card to contact the object to be tested, and then the conductivity of the feedback is used to know whether the object to be tested is abnormal. However, when a repetitive error occurs in the same position after multiple measurements, the positional state of the reaction probe may be problematic at this time.
當探針之位置狀態可能有問題時,工作人員會將探針卡拆卸下來,以作位置檢測,其係耗時且費工。 When there is a problem with the position of the probe, the staff will remove the probe card for position detection, which is time consuming and labor intensive.
由於探針量測係藉由探針接觸待測物後,再進電性量測,其係屬破壞性量測,若探針位置有問題,而未能及時偵測預防,繼續以破壞性方式量測待測物,可能使位置狀態錯誤的探針扎錯位置,而對待測物造成不可回復之損壞。 Since the probe measurement is contacted by the probe and then measured by electrical input, it is a destructive measurement. If there is a problem with the position of the probe, it cannot be detected and prevented in time, and continues to be destructive. Measuring the object to be tested may cause the probe with the wrong position to be misplaced, and the object to be tested may cause irreversible damage.
有鑑於此,本發明之目的在於提供一種探針卡線上調針維修系統及其方法,其係利用影像擷取單元擷取探針卡之探針於不同軸向的影像資訊,再藉由判讀該影像資訊,以即時找出探針之變形量。 In view of the above, an object of the present invention is to provide a probe card line needle maintenance system and a method thereof, which use an image capturing unit to capture probe information of a probe card in different axial directions, and then interpret the image information. The image information is used to instantly find the amount of deformation of the probe.
本發明之技術手段為一種探針卡線上調針維修方法,該探針卡係經一預定時間使用,該探針卡線上調針維修方法之步驟包含有: 擷取第一影像資訊,一第一影像擷取單元擷取一探針卡之複數個探針的一第一影像資訊,並將該第一影像資訊提供給一控制單元;擷取第二影像資訊,一第二影像擷取單元擷取該些探針的一第二影像資訊,並將該第二影像資訊提供給該控制單元;找出變形量,該控制單元依據該第一影像資訊與該第二影像資訊,以找出各探針之變形量。 The technical means of the present invention is a method for repairing a needle on a probe card line. The probe card is used for a predetermined time. The steps of the method for adjusting the needle on the probe card line include: Taking a first image information, a first image capturing unit captures a first image information of a plurality of probes of a probe card, and provides the first image information to a control unit; capturing the second image Information, a second image capturing unit captures a second image information of the probes, and provides the second image information to the control unit; and finds a deformation amount, the control unit is configured according to the first image information The second image information is used to find the amount of deformation of each probe.
於一實施例,一判斷變形量是否超出一預定數值之步驟,若否,則該控制單元不動作;若是,則該控制單元發出一警示訊號,或者至一清潔程序。 In an embodiment, a step of determining whether the amount of deformation exceeds a predetermined value, if not, the control unit does not operate; if so, the control unit sends a warning signal or to a cleaning procedure.
於一實施例,該清潔程序之步驟包含有:啟動清針,該探針進行一按壓清潔模組或一檢測電性之步驟,並將該檢測電性之步驟所檢測之結果回饋給該控制單元,以供該控制單元作判斷;該按壓清潔模組,其係使該些探針按壓一清潔模組,以去除該些探針之沾黏物,或者該些探針按壓該清潔模組,以調整該些探針;該檢測電性係為該探針卡移動至一導電模組,該些探針係接觸該導電模組,以偵測該些探針的導電性;提供負壓給該清潔模組,以使該負壓吸附該沾黏物;判斷是否導電性正常,若為否,則再執行該按壓清潔模組之步驟;若為是,該些探針完成清潔,該探針卡則完成清針動作;若重覆多次該按壓清潔模組織步驟,該些探針仍未達到正常導電性時,該控制單元係產生一警示訊號,該重覆多次之次數為一設定值。 In one embodiment, the step of the cleaning process includes: starting a cleaning needle, the probe performing a step of pressing the cleaning module or detecting the electrical property, and feeding back the result detected by the step of detecting the electrical property to the control a unit for determining by the control unit; the pressing cleaning module is configured to press the cleaning module to remove the adhesive of the probes, or the probes press the cleaning module Adjusting the probes; the detecting electrical property is that the probe card is moved to a conductive module, the probes are in contact with the conductive module to detect the conductivity of the probes; and providing a negative pressure Giving the cleaning module to cause the negative pressure to adsorb the adhesive; determining whether the conductivity is normal; if not, performing the step of pressing the cleaning module; if yes, the probes are cleaned, The probe card completes the needle cleaning operation; if the cleaning mold tissue step is repeated a plurality of times, and the probes still fail to reach the normal conductivity, the control unit generates a warning signal, and the number of repetitions is A set value.
一種探針卡線上調針維修系統,該探針卡係經一預定時間使用,該探針卡線上調針維修系統包含有:一控制單元;一第一影像擷取單元,其係訊號連接該控制單元;以及 一第二影像擷取單元,其係訊號連接該控制單元;其中,該第一影像擷取單元擷取一探針卡之複數個探針的一第一影像資訊,並將該第一影像資訊提供給該控制單元;該第二影像擷取單元擷取該些探針的一第二影像資訊,並將該第二影像資訊提供給該控制單元;該控制單元依據該第一影像資訊與該第二影像資訊,以找出各探針之變形量。 A probe card line adjustment service system, the probe card is used for a predetermined time, the probe card line needle adjustment system comprises: a control unit; a first image capture unit, which is connected to the signal Control unit; a second image capturing unit is connected to the control unit; wherein the first image capturing unit captures a first image information of the plurality of probes of the probe card, and the first image information is obtained Provided to the control unit; the second image capturing unit captures a second image information of the probes, and provides the second image information to the control unit; the control unit is configured according to the first image information The second image information is used to find the amount of deformation of each probe.
於一實施例,該第一影像擷取單元與該第二影像擷取單元係設於一基座,該控制單元控制該基座以水平方式移動、垂直方式移動或擺動方式轉動,而使該第一影像擷取單元與該第二影像擷取單元移動至該影像擷取位置。 In an embodiment, the first image capturing unit and the second image capturing unit are disposed on a base, and the control unit controls the base to move in a horizontal manner, a vertical manner, or a swinging manner, so that the The first image capturing unit and the second image capturing unit move to the image capturing position.
於一實施例,一清潔模組、一負壓模組與一導電模組;該負壓模組係耦接該清潔模組;該導電模組係相鄰於該清潔模組;該些探針係按壓該清潔模組,以去除該些探針之沾黏物;該負壓模組係提供一負壓給該清潔模組,以吸附該沾黏物;該些探針係接觸該導電模組,以偵測該些探針的導電性;該清潔模組為一多孔性材質;該負壓模組係耦接該多孔性材質的孔;該導電模組為一導電材質。 In one embodiment, a cleaning module, a negative pressure module and a conductive module; the negative pressure module is coupled to the cleaning module; the conductive module is adjacent to the cleaning module; The needle system presses the cleaning module to remove the adhesive of the probes; the negative pressure module provides a negative pressure to the cleaning module to adsorb the adhesive; the probes contact the conductive The module is configured to detect the conductivity of the probes; the cleaning module is a porous material; the negative pressure module is coupled to the hole of the porous material; the conductive module is a conductive material.
綜合上述,本發明之一種探針卡線上調針維修系統及其方法,可即時利用第一影像擷取單元與第二影像擷取單元進行檢測,藉以縮短檢測時間且降低人工的消耗。再者,本發明可即時偵測預防探針變形造成針尖位置錯誤,以避免探針扎錯位置而破壞性待測物,同時,不會對待測物造成不可回復之損壞。 In summary, the probe card line adjustment system and method thereof of the present invention can immediately detect by using the first image capturing unit and the second image capturing unit, thereby shortening the detection time and reducing the manual consumption. Furthermore, the present invention can instantly detect the deformation of the probe to cause the needle tip position to be wrong, so as to prevent the probe from being misplaced and the destructive object to be tested, and at the same time, it does not cause irreversible damage to the object to be tested.
10‧‧‧基座 10‧‧‧ Pedestal
11‧‧‧第二影像擷取單元 11‧‧‧Second image capture unit
12‧‧‧第一影像擷取單元 12‧‧‧First image capture unit
13‧‧‧控制單元 13‧‧‧Control unit
20‧‧‧探針卡 20‧‧‧ Probe Card
21‧‧‧探針 21‧‧‧ probe
211‧‧‧針尖 211‧‧‧ needle tip
30‧‧‧清潔模組 30‧‧‧cleaning module
300‧‧‧孔 300‧‧‧ hole
31‧‧‧負壓模組 31‧‧‧Negative pressure module
32‧‧‧導電模組 32‧‧‧Electrical Module
S1~S9‧‧‧步驟 S1~S9‧‧‧Steps
A‧‧‧第一預定數值 A‧‧‧ first predetermined value
B‧‧‧第二預定數值 B‧‧‧second predetermined value
第1圖為本發明之一種探針卡線上調針維修系統之示意圖。 1 is a schematic view of a probe card line adjustment system according to the present invention.
第2圖為一清潔模組、一負壓模組與一導電模組之示意圖。 Figure 2 is a schematic diagram of a cleaning module, a negative pressure module and a conductive module.
第3圖為本發明之一種探針卡線上調針維修方法之流程示意圖。 FIG. 3 is a schematic flow chart of a method for repairing a needle on a probe card line according to the present invention.
第4圖為一第一影像資訊之示意圖。 Figure 4 is a schematic diagram of a first image information.
第5圖為一第二影像資訊之示意圖。 Figure 5 is a schematic diagram of a second image information.
第6圖為一清潔程序之流程示意圖。 Figure 6 is a schematic flow diagram of a cleaning procedure.
請配合第1圖所示,本發明係一種探針卡線上調針維修系統,其具有一基座10、一第一影像擷取單元12、一第二影像擷取單元11與一控制單元13。 As shown in FIG. 1 , the present invention is a probe card line needle maintenance system having a base 10 , a first image capturing unit 12 , a second image capturing unit 11 and a control unit 13 . .
第一影像擷取單元12與第二影像擷取單元11係設於基座10。基座10、第一影像擷取單元12與第二影像擷取單元11係訊號連接控制單元13。 The first image capturing unit 12 and the second image capturing unit 11 are connected to the susceptor 10 . The pedestal 10, the first image capturing unit 12 and the second image capturing unit 11 are connected to the signal control unit 13.
第一影像擷取單元12擷取一探針卡20之複數個探針21的一第一影像資訊,並將該第一影像資訊提供給控制單元13。第二影像擷取單元11擷取該些探針21的一第二影像資訊,並將第二影像資訊提供給控制單元13。控制單元13依據第一影像資訊與第二影像資訊,以找出各探針21之變形量。 The first image capturing unit 12 captures a first image information of the plurality of probes 21 of the probe card 20 and provides the first image information to the control unit 13 . The second image capturing unit 11 captures a second image information of the probes 21 and provides the second image information to the control unit 13 . The control unit 13 determines the amount of deformation of each probe 21 based on the first image information and the second image information.
請配合參考第2圖所示,本發明更具有一清潔模組30、一負壓模組31與一導電模組32。 Referring to FIG. 2 , the present invention further has a cleaning module 30 , a negative pressure module 31 and a conductive module 32 .
清潔模組30具有複數個孔300。清潔模組30為一多孔性材質。該多孔性材質為陶瓷。導電模組32係相鄰於清潔模組30。導電模組32為一導電材質,導電材質為鍍金塊。負壓模組31係耦接清潔模組30之孔300。 The cleaning module 30 has a plurality of holes 300. The cleaning module 30 is a porous material. The porous material is ceramic. The conductive module 32 is adjacent to the cleaning module 30. The conductive module 32 is a conductive material, and the conductive material is a gold plated block. The negative pressure module 31 is coupled to the hole 300 of the cleaning module 30.
探針21係按壓清潔模組30,以去除探針21之沾黏物。負壓模組31係提供一負壓給清潔模組30,以吸附該沾黏物,進而避免沾黏物在機台內揚飛而造成對待測物之污染。探針21係接觸導電模組32,以偵測探針的導電性。 The probe 21 presses the cleaning module 30 to remove the adherence of the probe 21. The negative pressure module 31 provides a negative pressure to the cleaning module 30 to adsorb the adhesive, thereby preventing the contamination from being sucked in the machine and causing contamination of the object to be tested. The probe 21 is in contact with the conductive module 32 to detect the conductivity of the probe.
請配合參考第3圖與第1圖所示,本發明係一種探針卡線上調針維修方法,其步驟包含有: Please refer to FIG. 3 and FIG. 1 together. The present invention is a method for repairing a needle on a probe card line, and the steps thereof include:
步驟S1,擷取第一影像資訊。一探針卡20係移動至一影像擷取位置,並等待一產品(待測物)退出影像擷取位置。探針卡20具有複數個探針21。控制單元13控制基座10以水平方式移動、垂直方式移動或擺動方式轉動,而使第一影像擷取單元12與第二影像擷取單元11移動至影像擷取位置。第一影像擷取單元12係以一第一軸向擷取探針卡20之探針21的針尖之第一影像資訊。第一影像資訊係提供給控制單元13。 In step S1, the first image information is captured. A probe card 20 is moved to an image capturing position and waits for a product (object to be tested) to exit the image capturing position. The probe card 20 has a plurality of probes 21. The control unit 13 controls the base 10 to move in a horizontal manner, a vertical manner, or a swinging manner, and moves the first image capturing unit 12 and the second image capturing unit 11 to the image capturing position. The first image capturing unit 12 captures the first image information of the tip of the probe 21 of the probe card 20 in a first axial direction. The first image information is supplied to the control unit 13.
步驟S2,擷取第二影像資訊。第二影像擷取單元11係以一第二軸向擷取探針卡20之探針21的針尖之第二影像資訊。第二影像資訊係提供給控制單元13。如前所述,第一影像擷取單元12與第二影像擷取單元11移動至影像擷取位置,而各自以不同軸向對探針21之針尖擷取第一影像資訊與第二影像資訊。 In step S2, the second image information is captured. The second image capturing unit 11 captures the second image information of the tip of the probe 21 of the probe card 20 in a second axial direction. The second image information is supplied to the control unit 13. As described above, the first image capturing unit 12 and the second image capturing unit 11 are moved to the image capturing position, and the first image information and the second image information are respectively captured on the tip of the probe 21 in different axial directions. .
於另一實施例中,第一影像擷取單元12與第二影像擷取單元11亦可同時對探針21的針尖進行影像擷取;或者由第二影像擷取單元11先進行影像擷取後,再由第一影像擷取單元12進行影像擷取。 In another embodiment, the first image capturing unit 12 and the second image capturing unit 11 can simultaneously perform image capturing on the tip of the probe 21; or the image capturing unit 11 first performs image capturing. Then, the first image capturing unit 12 performs image capturing.
步驟S3,找出變形量。請配合參考第4圖所示,控制單元13依據針尖211之第一影像資訊與第二影像資訊找出各探針21的變形量。若更進一步說明,第一影像資訊係顯示該些探針21之針尖211於第一軸向的位置狀態,若該些探針21之針尖211超出第一預定數值A,則表示針尖211於第一軸向具有變形量。假若,針尖211未超出第一預定數值A,則表示針尖211於第一軸向之位置尚在容許範圍內。 In step S3, the amount of deformation is found. Referring to FIG. 4, the control unit 13 finds the amount of deformation of each probe 21 based on the first image information and the second image information of the needle tip 211. If further explained, the first image information indicates the position of the tip 211 of the probe 21 in the first axial direction. If the tip 211 of the probe 21 exceeds the first predetermined value A, the tip 211 is indicated. One axial direction has a deformation amount. If the needle tip 211 does not exceed the first predetermined value A, it indicates that the position of the needle tip 211 in the first axial direction is within the allowable range.
請配合參考第5圖所示,第二影像資訊係顯示該些探針21之針尖211於第二軸向的位置狀態,若該些探針21之針尖211超出第二預定數值B,則 表示針尖211於第二軸向具有變形量。假若,針尖211未超出第二預定數值B,則表示針尖211於第二軸向之位置尚在容許範圍內。 Referring to FIG. 5, the second image information shows the position of the tip 211 of the probes 21 in the second axial direction. If the tips 211 of the probes 21 exceed the second predetermined value B, It is indicated that the needle tip 211 has a deformation amount in the second axial direction. If the needle tip 211 does not exceed the second predetermined value B, it indicates that the position of the needle tip 211 in the second axial direction is still within the allowable range.
步驟S4,判斷變形量是否超出一預定數值。若否,則控制單元13不動作;若是,則控制單元13發出一警示訊號,或者至一清潔程序。警示訊號可為聲音、光線、閃光、訊息或電信訊息,藉以通知操作者進行檢測或維修。 In step S4, it is judged whether the amount of deformation exceeds a predetermined value. If not, the control unit 13 does not operate; if so, the control unit 13 issues a warning signal or to a cleaning procedure. The alert signal can be a sound, light, flash, message or telecommunications message to inform the operator to perform a test or repair.
承上所述,請配合參考第6圖與第2圖所示,若至清潔程序,其步驟包含有: As mentioned above, please refer to the figures 6 and 2, if the cleaning procedure, the steps include:
步驟S5,啟動清針。探針21進行一按壓清潔模組(步驟S6)或一檢測電性(步驟S8)之步驟,並將該檢測電性(步驟S8)之步驟所檢測之結果回饋給該控制單元13,以供該控制單元13作判斷。 In step S5, the cleaning needle is activated. The probe 21 performs a step of pressing the cleaning module (step S6) or detecting the electrical property (step S8), and returns the result detected by the step of detecting the electrical property (step S8) to the control unit 13 for The control unit 13 makes a decision.
步驟S6,按壓清潔模組。探針卡20之探針21按壓清潔模組30,以去除探針21之沾黏物;或者探針21按壓清潔模組30,以調整探針21於第一軸向或第二軸向之位置。 In step S6, the cleaning module is pressed. The probe 21 of the probe card 20 presses the cleaning module 30 to remove the adhesive of the probe 21; or the probe 21 presses the cleaning module 30 to adjust the probe 21 in the first axial direction or the second axial direction. position.
步驟S7,負壓吸附沾黏物。負壓模組31係提供負壓給清潔模組30的孔300,以使清潔模組30的孔300吸附沾黏物。 In step S7, the negative pressure adsorbs the adherend. The negative pressure module 31 provides a negative pressure to the hole 300 of the cleaning module 30 to cause the hole 300 of the cleaning module 30 to adsorb the adherend.
步驟S8,檢測電性。探針卡20移動至導電模組32,探針21係接觸導電模組32,以偵測探針21的導電性,並將檢測電性之結果回饋給控制單元13。 In step S8, electrical properties are detected. The probe card 20 is moved to the conductive module 32, and the probe 21 is in contact with the conductive module 32 to detect the conductivity of the probe 21, and the result of detecting the electrical property is fed back to the control unit 13.
步驟S9,判斷是否導電性正常。若為否,則再執行步驟S6之按壓清潔模組的步驟;若為是,探針21完成清潔,探針卡20則完成清針動作;若重覆多次步驟S6之按壓清潔模組織的步驟,探針21仍未達到正常導電性時,控制單元13係產生一警示訊號,該重覆多次之次數為一設定值。警示訊號可為聲音、光線、閃光、訊息或電信訊息。 In step S9, it is judged whether or not the conductivity is normal. If not, the step of pressing the cleaning module in step S6 is performed; if yes, the probe 21 is cleaned, and the probe card 20 completes the needle cleaning operation; if the cleaning step is repeated a plurality of steps S6 In the step, when the probe 21 still fails to reach the normal conductivity, the control unit 13 generates an alert signal, and the number of times of repeating is a set value. The alert signal can be a sound, light, flash, message or telecommunications message.
前述之實施例中,如第4圖或第5圖所示,該控制單元13係判斷探尖211之位置是否有超出第一預定數值A或第二預定數值B。然而,在另一實施例中,由於該探針卡20在上線使用前,其上之各探針21之位置是已知,而各探針21之針尖211彼此相互之相對位置也是已知,因此,該控制單元13亦可判斷各針尖211彼此相互之相對位置是否有超出一預定數值。 In the foregoing embodiment, as shown in FIG. 4 or FIG. 5, the control unit 13 determines whether the position of the probe 211 exceeds the first predetermined value A or the second predetermined value B. However, in another embodiment, since the probe card 20 is known before the upper thread is used, the positions of the probes 21 thereon are known, and the relative positions of the probe tips 211 of the probes 21 relative to each other are also known. Therefore, the control unit 13 can also determine whether the relative positions of the respective needle tips 211 relative to each other exceed a predetermined value.
綜合上述,本發明之一種探針卡線上調針維修系統及其方法,其係為第一影像擷取單元12與第二影像擷取單元11移動至影像擷取位置,而各自以不同軸向對探針21之針尖擷取第一影像資訊與第二影像資訊。控制單元13再藉由第一影像資訊與第二影像資訊,以找出變形量或判斷變形量是否超出預定數值。 In the above, a probe card line adjustment system and method thereof are provided, wherein the first image capturing unit 12 and the second image capturing unit 11 are moved to an image capturing position, and each has a different axial direction. The first image information and the second image information are captured on the tip of the probe 21. The control unit 13 further uses the first image information and the second image information to find the amount of deformation or determine whether the amount of deformation exceeds a predetermined value.
若變形量超出預定數值,則可進一步利用清潔模組調整探針21,或者去除位於探針21之沾黏物。如此,當探針21之位置狀態有問題時,可即時利用第一影像擷取單元12與第二影像擷取單元11進行檢測,藉以縮短檢測時間且降低人工的消耗。再者,本發明可即時偵測預防,以避免破壞性方式量測待測物,同時,不會對待測物造成不可回復之損壞。 If the amount of deformation exceeds a predetermined value, the probe 21 can be further adjusted by the cleaning module, or the adhering matter located on the probe 21 can be removed. In this way, when there is a problem in the positional state of the probe 21, the first image capturing unit 12 and the second image capturing unit 11 can be used for detection, thereby shortening the detection time and reducing the labor consumption. Furthermore, the present invention can detect and prevent it in real time to avoid destructive measurement of the object to be tested, and at the same time, it does not cause irreversible damage to the object to be tested.
以上所述之具體實施例,僅係用於例釋本發明之特點及功效,而非用於限定本發明之可實施範疇,於未脫離本發明上揭之精神與技術範疇下,任何運用本發明所揭示內容而完成之等效改變及修飾,均仍應為下述之申請專利範圍所涵蓋。 The specific embodiments described above are only used to exemplify the features and functions of the present invention, and are not intended to limit the scope of the present invention, and may be used without departing from the spirit and scope of the invention. Equivalent changes and modifications made to the disclosure of the invention are still covered by the scope of the following claims.
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